S-5840BAG-M5T1U [SII]

TEMPERATURE SWITCH IC;
S-5840BAG-M5T1U
型号: S-5840BAG-M5T1U
厂家: SEIKO INSTRUMENTS INC    SEIKO INSTRUMENTS INC
描述:

TEMPERATURE SWITCH IC

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中文:  中文翻译
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S-5840B Series  
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
www.sii-ic.com  
© SII Semiconductor Corporation, 2007-2012  
Rev.2.1_01  
The S-5840B Series is a temperature switch IC (thermostat IC) with a latch function which detects the temperature with a  
temperature accuracy of 2.5°C. When the temperature reaches the detection temperature, the output signal is inverted and  
being latched until the S-5840B Series detects decrease in a power supply voltage.  
The S-5840B Series operates at the lower power supply voltage of 1.0 V and its current consumption is 12 μA typ. due to  
CMOS configuration.  
The S-5840B Series has a temperature sensor using negative temperature coefficient, a reference voltage generation  
circuit, comparator, voltage detection circuit and noise suppression circuit on a chip, and they are enclosed in package  
SOT-23-5.  
Features  
Detection temperature:  
Wide voltage operation:  
Release voltage:  
TDET = +55 to +95°C, +1°C step, detection accuracy: 2.5°C  
V
DD = 1.0 V to 10.0 V  
V
RET = 2.2 V to 3.4 V, 0.1 V step  
Low current consumption:  
IDD = 12 μA typ. (Ta = +25°C).  
Built-in noise suppression circuit for preventing temperature detection malfunction  
Output logic level is fixed by the latch after temperature detection.  
Selectable output logic in active "H" or "L"  
Selectable output form in CMOS or Nch open drain  
Operation temperature range:  
Lead-free, Sn 100%, halogen-free*1  
Ta = 40°C to +100°C  
*1. Refer to "Product Name Structure" for details.  
Applications  
Game console  
Electronic device  
Package  
SOT-23-5  
1
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Block Diagrams  
1. CMOS output product  
VDD  
Temperature  
sensor  
+
CD  
VREF  
Reference voltage  
DET  
Q
D
generation circuit  
D-F/F  
CK  
R
Voltage  
detector  
RT  
VSS  
Figure 1  
2. Nch open drain output product  
VDD  
Temperature  
sensor  
+
CD  
VREF  
Reference voltage  
generation circuit  
DET  
Q
D
D-F/F  
CK  
R
Voltage  
detector  
RT  
VSS  
Figure 2  
2
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Product Name Structure  
Users are able to select the option for detection temperature, output form and logic, release voltage for the S-5840B Series.  
1. Product name  
S-5840B xx  
-
M5T1  
x
Environmental code  
U:  
G:  
Lead-free (Sn 100%), halogen-free  
Lead-free (for details, please contact our sales office)  
Package abbreviation and IC packing specifications*1  
M5T1: SOT-23-5, tape  
Option*2  
*1. Refer to the tape drawing.  
*2. Option list  
The detection temperature (TDET) can be set in the range of +55°C to +95° at 1°C step.  
The DET pin output can be selected the output logic in active "H" or "L".  
The DET pin output can be selected the output form in CMOS or Nch open drain.  
The release voltage (VRET) can be set in the range of 2.2 V to 3.4 V at 0.1 V step.  
2. Package  
Table 1 Package Drawing Codes  
Package Name  
Dimension  
Tape  
Reel  
SOT-23-5  
MP005-A-P-SD  
MP005-A-C-SD  
MP005-A-R-SD  
3. Product name list  
Table 2  
DET Pin Output Form DET Pin Output Logic  
Detection Temperature  
Release Voltage  
(VRET  
Product Name  
(TDET  
)
)
S-5840BAG-M5T1x  
S-5840BAH-M5T1x  
S-5840BAJ-M5T1x  
+60°C  
+90°C  
+80°C  
CMOS  
Active "L"  
Active "H"  
Active "L"  
2.9 V  
2.9 V  
2.2 V  
CMOS  
Nch open drain  
Remark1. Please contact our sales office for options other than that specified above.  
2. x: G or U  
3. Please select products of environmental code = U for Sn 100%, halogen-free products.  
3
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Pin Configuration  
1. SOT-23-5  
Top view  
Table 3  
5
4
Pin No.  
Symbol  
RT*1  
Description  
1
2
Test pin  
GND pin  
VSS  
Capacitor connection pin for setting  
malfunction prevention time  
Output pin  
3
CD  
1
2
3
4
5
DET  
VDD  
Figure 3  
Power supply pin  
*1. Set the RT pin open in use.  
4
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Absolute Maximum Ratings  
Table 4  
(Ta = +25°C unless otherwise specified)  
Item  
Power supply voltage (VSS = 0 V)  
Pin voltage  
Symbol  
Absolute Maximum Rating  
Unit  
V
VDD  
VSS + 12  
VRT, VCD  
VSS 0.3 to VDD + 0.3  
VSS 0.3 to VDD + 0.3  
VSS 0.3 to VSS + 12.0  
300 (when not mounted on board)  
600*1  
V
CMOS output  
Output voltage  
V
VDET  
Nch open drain output  
V
mW  
mW  
°C  
°C  
Power dissipation  
PD  
Operating temperature  
Storage temperature  
Topr  
Tstg  
40 to +100  
55 to +125  
*1. When mounted on board  
[Mounted board]  
(1) Board size:  
114.3 mm × 76.2 mm × t1.6 mm  
(2) Board name:  
JEDEC STANDARD51-7  
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical  
damage. These values must therefore not be exceeded under any conditions.  
Recommended Values for External Parts  
Table 5  
Item  
Symbol  
Value  
4.7  
Unit  
nF  
CD capacitance  
CD  
5
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
DC Electrical Characteristics  
1. CMOS output product  
Table 6  
(Ta = +25°C, unless otherwise specified)  
Test  
Circuit  
Item  
Symbol  
VDD  
Condition  
Min.  
Typ.  
Max.  
Unit  
Power supply voltage  
Detection temperature  
1.0  
TDET 2.5  
2
TDET  
10.0  
TDET + 2.5  
V
1
1
2
+TD  
°C  
VDD = 3.5 V,  
IDETH  
V
DET = 2.7 V  
9.4  
mA  
Output current  
Apply to DET  
pin  
IDETL  
VDET = 0.4 V  
0.5  
2.8  
mA  
V
2
Release voltage for built-in  
voltage detector  
VR  
VRET × 0.98  
VRET  
VRET × 1.02  
Hysteresis width for built-in  
voltage detector  
VHYS  
VRET  
×
0.05  
V
1
ΔVRET  
ΔTaVRET  
Temperature coefficient  
for built-in voltage detector  
Current consumption  
during operation  
Ta = 40°C to +100°C  
100  
12  
ppm/°C  
μA  
IDD  
VDD = 3.5 V  
24  
2. Nch open drain output product  
Table 7  
(Ta = +25°C, unless otherwise specified)  
Test  
Circuit  
Item  
Symbol  
VDD  
Condition  
Min.  
Typ.  
Max.  
Unit  
Power supply voltage  
Detection temperature  
1.0  
TDET 2.5  
0.5  
TDET  
10.0  
TDET + 2.5  
V
1
1
2
+TD  
°C  
IDETL  
VDET = 0.4 V, VDD = 3.5 V  
2.8  
mA  
Output current  
ILEAK  
VDET = 10.0 V, VDD = 3.5 V  
100  
nA  
V
2
Release voltage for built-in  
voltage detector  
VR  
VRET × 0.98  
VRET  
VRET × 1.02  
Hysteresis width for built-in  
voltage detector  
VHYS  
VRET  
×
0.05  
V
ΔVRET  
ΔTaVRET  
Temperature coefficient for  
built-in voltage detector  
Ta = 40°C to +100°C  
100  
ppm/°C  
Current consumption  
during operation  
IDD  
VDD = 3.5 V  
12  
24  
μA  
1
AC Electrical Characteristics  
Table 8  
Test  
Circuit  
Item  
Symbol  
tnoise  
Condition  
Min.  
10  
Typ.  
30  
Max.  
50  
Unit  
ms  
CD = 4.7 nF, VDD = 3.5 V,  
Noise suppression time  
Ta = detection temperature  
6
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Test Circuits  
Open  
A
R *1  
100 kΩ  
VDD  
RT  
V
C
IN  
S-5840B Series  
VSS  
DET  
CD  
V
L
C
C
D
*1.  
Resistor (R) is unnecessary for the CMOS output product.  
Figure 4 Test Circuit 1  
Open  
VDD  
RT  
V
CIN  
S-5840B Series  
DET  
A
CD  
VSS  
V
CD  
CL  
Figure 5 Test Circuit 2  
7
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Operation  
1. Basic operation  
The S-5840B Series is a temperature switch IC (thermostat IC) which detects the temperature and sends a signal to an  
external device. The users can select a combination of the parameters such as detection temperature and release  
voltage.  
Following is about the operation when the DET pin output logic is active "H".  
When the power supply voltage is turned on, the DET pin voltage goes to "L" since the flip-flop circuit in the detection  
circuit is cleared by the voltage detection circuit. Temperature detection then starts and the DET pin is held "L" as long  
as the temperature is lower than the detection temperature. When the temperature rises and when the temperature  
exceeds the detection temperature; longer than the time defined by the capacitor connected to the CD pin, the DET pin  
goes to "H". Once the over-temperature is detected and the DET pin goes to "H", the state is held by the flip-flop circuit.  
In order to release the state, the power supply voltage should be set under the detection voltage (VR VHYS) of the built-  
in voltage detector circuit to reset the internal circuit.  
Using the internal reference voltage and built-in temperature sensor, a detection temperature accuracy of 2.5°C is  
achieved in the S-5840B Series.  
2. Noise suppression circuit  
The noise suppression circuit prevents malfunction of the temperature switch caused by noise.  
The noise suppression circuit starts charging the capacitor connected to the CD pin when the output of the internal  
comparator enters the active state due to an external noise or a rapid change in the power supply voltage. In the normal  
operation, the flip-flop circuit is set when the capacitor is charged to a certain voltage. But in the noise triggered  
operation, the comparator output goes back to the inactive state and the CD pin voltage is held "L" since the charging of  
the external capacitor (CD) is insufficient. As a result, the DET pin is held "L" and malfunction does not occur.  
Noise suppression time (tnoise) is determined by the time constant consisting of internal constant current and the  
capacitance of the CD, and calculated by the following equation.  
t
noise (ms) = Noise suppression time coefficient × CD (nF)  
Noise suppression time coefficient (Ta = +25°C): 6.4 typ.  
The CD has no limitation as long as its leak current is negligible compared to the internal constant current. The difference  
occurs in delay time if the capacitor has a leak current.  
8
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Standard Circuit  
R*1  
Open  
100 kΩ  
VDD  
RT  
S-5840B Series  
DET  
CIN  
CD  
VSS  
CL  
CD  
*1. Resistor (R) is unnecessary for the CMOS output product.  
Figure 6  
Caution The above connection diagram will not guarantee successful operation. Perform thorough evaluation  
using actual application to set the constant.  
Precautions  
Set a capacitor (CIN) of 0.1 μF or more between VDD and VSS pin for stabilization.  
A capacitor (CL) of about 1 μF should be connected to the DET pin to prevent malfunction caused by noise due to the  
power being on.  
Do not connect a capacitor to the RT pin (leave the RT pin open). Otherwise, this IC may oscillate.  
Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic  
protection circuit.  
SII Semiconductor Corporation claims no responsibility for any disputes arising out of or in connection with any  
infringement by products, including this IC, of patents owned by a third party.  
9
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Characteristics (Typical Data)  
1. Current consumption vs. Power supply voltage characteristics  
VSS = 0 V  
13  
12  
100C  
25C  
40C  
11  
10  
9
0
1 2 3 4 5 6 7 8 9 10 11 12  
V
DD [V]  
2. DET pin current "H" vs. Power supply voltage characteristics (CMOS output product only)  
V
DET = VDD 0.8 V  
25  
20  
15  
10  
5
25C  
40C  
100C  
0
0
1 2 3 4 5 6 7 8 9 10 11 12  
V
DD [V]  
3. DET pin current "L" vs. Power supply voltage characteristics  
V
DET = 0.4 V  
10  
8
25C  
40C  
6
4
100C  
2
0
0
1
2
3
4
5
6
7
8
9 10 11 12  
V
DD [V]  
4. Noise suppression time vs. Power supply voltage characteristics  
CD = 4.7 nF  
50  
45  
40  
35  
30  
25  
20  
15  
10  
40C  
25C  
100C  
0
1 2 3 4 5 6 7 8 9 10 11 12  
V
DD [V]  
10  
TEMPERATURE SWITCH IC (THERMOSTAT IC) WITH LATCH  
S-5840B Series  
Rev.2.1_01  
Marking Specification  
1. SOT-23-5  
Top view  
(1) to (3):  
(4):  
Product code (refer to Product name vs. Product code)  
Lot number  
5
4
(1) (2) (3) (4)  
1
2
3
Product name vs. Product code  
Product Code  
Product Name  
(1)  
H
(2)  
8
(3)  
S-5840BAG-M5T1x  
S-5840BAH-M5T1x  
S-5840BAJ-M5T1x  
Remark 1. x: G or U  
M
N
O
H
8
H
8
2. Please select products of environmental code = U for Sn 100%, halogen-free products.  
11  
2.9±0.2  
1.9±0.2  
4
5
+0.1  
-0.06  
1
2
3
0.16  
0.95±0.1  
0.4±0.1  
No. MP005-A-P-SD-1.2  
TITLE  
SOT235-A-PKG Dimensions  
MP005-A-P-SD-1.2  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
4.0±0.1(10 pitches:40.0±0.2)  
+0.1  
-0  
2.0±0.05  
0.25±0.1  
ø1.5  
+0.2  
-0  
4.0±0.1  
ø1.0  
1.4±0.2  
3.2±0.2  
3
4
2 1  
5
Feed direction  
No. MP005-A-C-SD-2.1  
TITLE  
SOT235-A-Carrier Tape  
MP005-A-C-SD-2.1  
No.  
SCALE  
UNIT  
mm  
SII Semiconductor Corporation  
12.5max.  
9.0±0.3  
Enlarged drawing in the central part  
ø13±0.2  
(60°)  
(60°)  
No. MP005-A-R-SD-1.1  
TITLE  
SOT235-A-Reel  
MP005-A-R-SD-1.1  
No.  
SCALE  
UNIT  
QTY.  
3,000  
mm  
SII Semiconductor Corporation  
Disclaimers (Handling Precautions)  
1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and  
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without  
notice.  
2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of  
any specific mass-production design.  
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or  
infringement of third-party intellectual property rights and any other rights due to the use of the information described  
herein.  
3. SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.  
4. Take care to use the products described herein within their specified ranges. Pay special attention to the absolute  
maximum ratings, operation voltage range and electrical characteristics, etc.  
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur  
due to the use of products outside their specified ranges.  
5. When using the products described herein, confirm their applications, and the laws and regulations of the region or  
country where they are used and verify suitability, safety and other factors for the intended use.  
6. When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all  
other export-related laws, and follow the required procedures.  
7. The products described herein must not be used or provided (exported) for the purposes of the development of  
weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision  
(export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons,  
missiles, or other military use.  
8. The products described herein are not designed to be used as part of any device or equipment that may affect the  
human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems,  
combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment,  
aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle  
use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation.  
Especially, the products described herein cannot be used for life support devices, devices implanted in the human  
body and devices that directly affect human life, etc.  
Prior consultation with our sales office is required when considering the above uses.  
SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our  
products.  
9. Semiconductor products may fail or malfunction with some probability.  
The user of these products should therefore take responsibility to give thorough consideration to safety design  
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing  
injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction.  
The entire system must be sufficiently evaluated and applied on customer's own responsibility.  
10. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be  
taken in the product design by the customer depending on the intended use.  
11. The products described herein do not affect human health under normal use. However, they contain chemical  
substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips  
may be sharp. Take care when handling these with the bare hands to prevent injuries, etc.  
12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where  
they are used.  
13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation.  
The information described herein does not convey any license under any intellectual property rights or any other  
rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information  
described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor  
Corporation is strictly prohibited.  
14. For more details on the information described herein, contact our sales office.  
1.0-2016.01  
www.sii-ic.com  

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