533PB000398DG [SILICON]

Oscillator;
533PB000398DG
型号: 533PB000398DG
厂家: SILICON    SILICON
描述:

Oscillator

文件: 总12页 (文件大小:101K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si533  
REVISION D  
DUAL FREQUENCY CRYSTAL OSCILLATOR (XO)  
(10 MHZ TO 1.4 GHZ)  
Features  
Available with any-frequency output  
frequencies from 10 MHz to 945 MHz  
and select frequencies to 1.4 GHz  
2 selectable output frequencies  
Internal fixed crystal frequency  
ensures high reliability and low  
aging  
Available CMOS, LVPECL,  
LVDS, and CML outputs  
3.3, 2.5, and 1.8 V supply options  
Industry-standard 5 x 7 mm  
package and pinout  
®
3rd generation DSPLL with superior  
jitter performance  
3x better frequency stability than  
SAW-based oscillators  
Pin 1 output enable (OE)  
Pb-free/RoHS-compliant  
Applications  
Ordering Information:  
See page 7.  
SONET/SDH  
Networking  
SD/HD video  
Clock and data recovery  
FPGA/ASIC clock generation  
Pin Assignments:  
See page 6.  
Description  
The Si533 dual frequency XO utilizes Silicon Laboratories’ advanced  
DSPLL circuitry to provide a low jitter clock at high frequencies. The Si533  
(Top View)  
®
is available with any-frequency output frequency from 10 to 945 MHz and  
select frequencies to 1400 MHz. Unlike a traditional XO, where a different  
crystal is required for each output frequency, the Si533 uses one fixed crystal  
to provide a wide range of output frequencies. This IC based approach allows  
the crystal resonator to provide exceptional frequency stability and reliability.  
In addition, DSPLL clock synthesis provides superior supply noise rejection,  
simplifying the task of generating low jitter clocks in noisy environments  
typically found in communication systems. The Si533 IC based XO is factory  
configurable for a wide variety of user specifications including frequency,  
supply voltage, output format, and temperature stability. Specific  
configurations are factory programmed at time of shipment, thereby  
eliminating long lead times associated with custom oscillators.  
VDD  
1
2
3
6
5
4
OE  
FS  
CLK–  
CLK+  
GND  
LVDS/LVPECL/CML  
Functional Block Diagram  
VDD  
1
2
3
6
5
4
OE  
FS  
VDD  
CLK– CLK+  
NC  
Any-frequency  
10–1400 MHz  
DSPLL®  
Clock  
Synthesis  
GND  
CLK+  
Fixed  
Frequency  
XO  
CMOS  
OE  
FS  
GND  
Rev. 1.2 5/11  
Copyright © 2011 by Silicon Laboratories  
Si533  
Si533  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions  
Parameter  
Symbol  
Test Condition  
3.3 V option  
2.5 V option  
1.8 V option  
Min  
2.97  
2.25  
1.71  
Typ  
3.3  
2.5  
1.8  
Max  
3.63  
2.75  
1.89  
Units  
1
V
V
V
V
DD  
Supply Voltage  
Supply Current  
I
Output enabled  
LVPECL  
CML  
DD  
121  
108  
98  
111  
99  
90  
81  
mA  
LVDS  
CMOS  
88  
Tristate mode  
0.75 x V  
60  
75  
mA  
V
Output Enable (OE)  
and Frequency Select (FS)  
V
IH  
DD  
2
V
0.5  
85  
V
IL  
Operating Temperature Range  
T
–40  
ºC  
A
Notes:  
1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 7 for further details.  
2. OE and FS pins include a 17 kpullup resistor to VDD  
.
Table 2. CLK± Output Frequency Characteristics  
Parameter  
Symbol  
Test Condition  
LVPECL/LVDS/CML  
CMOS  
Min  
10  
Typ  
Max  
945  
160  
Units  
MHz  
MHz  
Nominal Frequency1,2  
O
f
10  
Initial Accuracy  
Measured at +25 °C at time of  
shipping  
fi  
±1.5  
ppm  
ppm  
–7  
–20  
–50  
+7  
+20  
+50  
Temperature Stability1,3  
Frequency drift over first year  
Frequency drift over 20 year life  
±3  
ppm  
ppm  
Aging  
fa  
±10  
Notes:  
1. See Section 3. "Ordering Information" on page 7 for further details.  
2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.  
3. Selectable parameter specified by part number.  
4. Time from powerup or tristate mode to fO.  
2
Rev. 1.2  
Si533  
Table 2. CLK± Output Frequency Characteristics (Continued)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Units  
ppm  
ppm  
ppm  
ms  
Temp stability = ±7 ppm  
Temp stability = ±20 ppm  
Temp stability = ±50 ppm  
±20  
±31.5  
±61.5  
10  
Total Stability  
Powerup Time4  
tOSC  
tFRQ  
Settling Time After FS Change  
Notes:  
10  
ms  
1. See Section 3. "Ordering Information" on page 7 for further details.  
2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.  
3. Selectable parameter specified by part number.  
4. Time from powerup or tristate mode to fO.  
Table 3. CLK± Output Levels and Symmetry  
Parameter  
Symbol  
Test Condition  
mid-level  
Min  
VDD – 1.42  
1.1  
Typ  
Max  
VDD – 1.25  
1.9  
Units  
V
V
O
1
VOD  
VSE  
swing (diff)  
VPP  
VPP  
V
LVPECL Output Option  
swing (single-ended)  
mid-level  
0.55  
1.125  
0.5  
0.95  
1.275  
0.9  
V
1.20  
0.7  
O
2
LVDS Output Option  
swing (diff)  
VOD  
VPP  
V
2.5/3.3 V option mid-level  
1.8 V option mid-level  
2.5/3.3 V option swing (diff)  
1.8 V option swing (diff)  
V
V
– 1.30  
DD  
DD  
VO  
– 0.36  
V
2
CML Output Option  
1.10  
0.35  
0.8 x VDD  
1.50  
1.90  
0.50  
VDD  
0.4  
VPP  
VPP  
V
VOD  
0.425  
VOH  
VOL  
I
= 32 mA  
OH  
3
CMOS Output Option  
IOL = 32 mA  
V
tR, F  
t
LVPECL/LVDS/CML  
350  
ps  
Rise/Fall time (20/80%)  
Symmetry (duty cycle)  
CMOS with C = 15 pF  
1
ns  
L
SYM  
LVPECL:  
LVDS:  
V
– 1.3 V (diff)  
DD  
45  
55  
%
1.25 V (diff)  
/2  
CMOS:  
V
DD  
Notes:  
1. 50 to VDD – 2.0 V.  
2. Rterm = 100 (differential).  
3. CL = 15 pF  
Rev. 1.2  
3
Si533  
Table 4. CLK± Output Phase Jitter  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
0.25  
0.26  
0.36  
0.34  
0.62  
0.61  
Max  
0.40  
0.37  
0.50  
0.42  
Units  
ps  
1
Phase Jitter (RMS)  
J  
J  
J  
12 kHz to 20 MHz (OC-48)  
50 kHz to 80 MHz (OC-192)  
12 kHz to 20 MHz (OC-48)  
for F  
> 500 MHz  
OUT  
ps  
1
Phase Jitter (RMS)  
for F  
ps  
of 125 to 500 MHz  
OUT  
2
50 kHz to 80 MHz (OC-192)  
ps  
2
Phase Jitter (RMS)  
for F of 10 to 160 MHz  
CMOS Output Only  
12 kHz to 20 MHz (OC-48)  
ps  
OUT  
2
50 kHz to 20 MHz  
ps  
Notes:  
1. Refer to AN256 for further information.  
2. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz,  
2 MHz for 10 MHz < FOUT <50 MHz.  
Table 5. CLK± Output Period Jitter  
Parameter  
Period Jitter*  
Symbol  
Test Condition  
RMS  
Min  
Typ  
2
Max  
Units  
ps  
J
PER  
Peak-to-Peak  
14  
ps  
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.  
Table 6. CLK± Output Phase Noise (Typical)  
Offset Frequency (f)  
120.00 MHz  
LVDS  
156.25 MHz  
LVPECL  
622.08 MHz  
LVPECL  
Units  
100 Hz  
1 kHz  
10 kHz  
100 kHz  
1 MHz  
–112  
–122  
–132  
–137  
–144  
–150  
n/a  
–105  
–122  
–128  
–135  
–144  
–147  
n/a  
–97  
–107  
–116  
–121  
–134  
–146  
–148  
dBc/Hz  
10 MHz  
100 MHz  
4
Rev. 1.2  
Si533  
Table 7. Absolute Maximum Ratings1  
Parameter  
Maximum Operating Temperature  
Supply Voltage, 1.8 V Option  
Supply Voltage, 2.5/3.3 V Option  
Input Voltage (any input pin)  
Symbol  
Rating  
85  
Units  
T
ºC  
AMAX  
V
V
–0.5 to +1.9  
–0.5 to +3.8  
V
DD  
DD  
V
V
–0.5 to V + 0.3  
V
ºC  
I
DD  
Storage Temperature  
T
–55 to +125  
2500  
S
ESD Sensitivity (HBM, per JESD22-A114)  
ESD  
V
2
Soldering Temperature (Pb-free profile)  
T
260  
ºC  
PEAK  
2
Soldering Temperature Time @ T  
(Pb-free profile)  
t
20–40  
seconds  
PEAK  
P
Notes:  
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional  
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for  
extended periods may affect device reliability.  
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at  
www.silabs.com/VCXO for further information, including soldering profiles.  
Table 8. Environmental Compliance  
The Si533 meets the following qualification test requirements.  
Parameter  
Conditions/Test Method  
MIL-STD-883, Method 2002  
MIL-STD-883, Method 2007  
MIL-STD-883, Method 2003  
MIL-STD-883, Method 1014  
MIL-STD-883, Method 2036  
J-STD_020, MSL1  
Mechanical Shock  
Mechanical Vibration  
Solderability  
Gross & Fine Leak  
Resistance to Solder Heat  
Moisture Sensitivity Level  
Contact Pads  
Gold over Nickel  
Rev. 1.2  
5
Si533  
2. Pin Descriptions  
(Top View)  
VDD  
VDD  
1
6
5
4
1
2
3
6
5
4
OE  
OE  
FS  
FS  
2
3
CLK–  
CLK+  
NC  
GND  
GND  
CLK  
CMOS  
LVDS/LVPECL/CML  
Pin #  
Symbol  
LVDS/LVPECL/CML Function  
CMOS Function  
Output Enable*  
Output Enable*  
1
OE*  
0 = clock output disabled (outputs tristated) 0 = clock output disabled (outputs tristated)  
1 = clock output enabled  
1 = clock output enabled  
Frequency Select*  
Frequency Select*  
2
FS*  
0 = First frequency selected  
1 = Second frequency selected  
0 = First frequency selected  
1 = Second frequency selected  
3
4
5
6
GND  
CLK+  
CLK–  
Electrical and Case Ground  
Oscillator Output  
Electrical and Case Ground  
Oscillator Output  
Complementary Output  
Power Supply Voltage  
No Connection  
V
Power Supply Voltage  
DD  
*Note: FS and OE include a 17 kpullup resistor to VDD. See Section 3. "Ordering Information" on page 7 for details on  
frequency value ordering.  
6
Rev. 1.2  
Si533  
3. Ordering Information  
The Si533 XO supports a variety of options including frequency, temperature stability, output format, and V  
.
DD  
Specific device configurations are programmed into the Si533 at time of shipment. Configurations can be specified  
using the Part Number Configuration chart below. Silicon Laboratories provides a web browser-based part number  
configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool and for  
further ordering instructions. The Si533 is supplied in an industry-standard, RoHS compliant, 6-pad, 5 x 7 mm  
package. The Si533 supports output enable (OE) on pin 1.  
X
X
D
G
R
533  
XXXXXX  
R = Tape & Reel  
Blank = Trays  
533 Dual XO  
Product Family  
1st Option Code  
VDD Output Format Output Enable Polarity  
Operating Temp Range (°C)  
–40 to +85 °C  
G
A
B
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
T
3.3 LVPECL  
3.3 LVDS  
3.3 CMOS  
3.3 CML  
2.5 LVPECL  
2.5 LVDS  
2.5 CMOS  
2.5 CML  
1.8 CMOS  
1.8 CML  
3.3 LVPECL  
3.3 LVDS  
3.3 CMOS  
3.3 CML  
2.5 LVPECL  
2.5 LVDS  
2.5 CMOS  
2.5 CML  
1.8 CMOS  
1.8 CML  
High  
High  
High  
High  
High  
High  
High  
High  
High  
High  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Device Revision Letter  
6-digit Frequency Designator Code  
Two unique frequencies can be specified within the following bands  
of frequencies: 10 to 945 MHz, 970 to 1134 MHz, and 1213 to 1417  
MHz. A six digit code will be assigned for the specified  
combination of frequencies. Codes > 000100 refer to dual XOs  
programmed with the lower frequency value selected when FS = 0,  
and the higher value when FS = 1. Six digit codes < 000100 refer to  
dual XOs programmed with the higher frequency value selected  
when FS = 0, and the lower value when FS = 1.  
2nd Option Code  
U
V
W
Code Temperature Stability (ppm, max, ±) Total Stablility (ppm, max, ±)  
A
B
C
50  
20  
7
61.5  
31.5  
20  
Note:  
CMOS available to 160 MHz.  
Example Part Number: 533AB000108DGR is a 5x7mm Dual XO in a 6 pad package. Since the six digit code (000108) is > 000100,  
f0 is 644.53125 MHz (lower frequency) and f1 is 693.48299 (higher frequency), with a 3.3V supply and LVPECL output. Temperature  
stability is specified as ± 20 ppm. The part is specified for a -40 to +85 C° ambient temperature range operation and is shipped in tape  
and reel format.  
Figure 1. Part Number Convention  
Rev. 1.2  
7
Si533  
4. Outline Diagram and Suggested Pad Layout  
Figure 2 illustrates the package details for the Si533. Table 9 lists the values for the dimensions shown in the  
illustration.  
Figure 2. Si533 Outline Diagram  
Table 9. Package Diagram Dimensions (mm)  
Dimension  
Min  
1.50  
1.30  
0.50  
Nom  
1.65  
Max  
1.80  
1.50  
0.70  
A
b
1.40  
c
0.60  
D
5.00 BSC  
4.40  
D1  
e
4.30  
4.50  
2.54 BSC  
7.00 BSC  
6.20  
E
E1  
H
6.10  
0.55  
1.17  
1.80  
6.30  
0.75  
1.37  
2.60  
0.65  
L
1.27  
p
R
0.70 REF  
0.15  
aaa  
bbb  
ccc  
ddd  
eee  
0.15  
0.10  
0.10  
0.05  
8
Rev. 1.2  
Si533  
5. Si533 Mark Specification  
Figure 3 illustrates the mark specification for the Si533. Table 10 lists the line information.  
Figure 3. Mark Specification  
Table 10. Si53x Top Mark Description  
Line  
Position  
1–10  
Description  
1
2
3
“SiLabs 533”  
1–10  
Si533: Option1 + Option2 + ConfigNum(6) + Temp  
Trace Code  
Position 1  
Pin 1 orientation mark (dot)  
Product Revision (D)  
Position 2  
Tiny Trace Code (4 alphanumeric characters per assembly release instructions)  
Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7)  
Calendar Work Week number (1–53), to be assigned by assembly site  
“+” to indicate Pb-Free and RoHS-compliant  
Position 3–6  
Position 7  
Position 8–9  
Position 10  
Rev. 1.2  
9
Si533  
6. 6-Pin PCB Land Pattern  
Figure 4 illustrates the 6-pin PCB land pattern for the Si533. Table 11 lists the values for the dimensions shown in  
the illustration.  
Figure 4. Si533 PCB Land Pattern  
Table 11. PCB Land Pattern Dimensions (mm)  
Dimension  
Min  
Max  
D2  
e
5.08 REF  
2.54 BSC  
4.15 REF  
E2  
GD  
GE  
VD  
VE  
X
0.84  
2.00  
8.20 REF  
7.30 REF  
1.70 TYP  
2.15 REF  
Y
ZD  
ZE  
6.78  
6.30  
Notes:  
1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification.  
2. Land pattern design based on IPC-7351 guidelines.  
3. All dimensions shown are at maximum material condition (MMC).  
4. Controlling dimension is in millimeters (mm).  
10  
Rev. 1.2  
Si533  
DOCUMENT CHANGE LIST  
Revision 1.0 to Revision 1.1  
Updated Table 1, “Recommended Operating  
Conditions,” on page 2.  
Device maintains stable operation over –40 to +85 ºC  
operating temperature range.  
Supply current specifications updated for revision D.  
Updated Table 2, “CLK± Output Frequency  
Characteristics,” on page 2.  
Added specification for ±20 ppm lifetime stability  
(±7 ppm temperature stability) XO.  
Updated Table 3, “CLK± Output Levels and  
Symmetry,” on page 3.  
Updated LVDS differential peak-peak swing  
specifications.  
Updated Table 4, “CLK± Output Phase Jitter,” on  
page 4.  
Updated Table 5, “CLK± Output Period Jitter,” on  
page 4.  
Revised period jitter specifications.  
1
Updated Table 7, “Absolute Maximum Ratings ,” on  
page 5 to reflect the soldering temperature time at  
260 ºC is 20–40 sec per JEDEC J-STD-020C.  
Updated 3. "Ordering Information" on page 7.  
Changed ordering instructions to revision D.  
Added 5. "Si533 Mark Specification" on page 9.  
Revision 1.1 to Revision 1.2  
Updated 2.5 V/3.3 V and 1.8 V CML output level  
specifications for Table 3 on page 3.  
Added footnotes clarifying max offset frequency test  
conditions for Table 4 on page 4.  
Removed the words "Differential Modes:  
LVPECL/LVDS/CML" in the footnote referring to  
AN256 in Table 4 on page 4.  
Added CMOS phase jitter specs to Table 4 on  
page 4.  
Updated Table 8 on page 5 to include the "Moisture  
Sensitivity Level" and "Contact Pads" rows.  
Revised Figure 2 on page 8 to reflect current  
package outline diagram.  
Updated Figure 3 and Table 10 on page 9 to reflect  
specific marking information. Previously, Figure 3  
was generic.  
Updated contact information on page 12.  
Rev. 1.2  
11  
Si533  
CONTACT INFORMATION  
Silicon Laboratories Inc.  
400 West Cesar Chavez  
Austin, TX 78701  
Tel: 1+(512) 416-8500  
Fax: 1+(512) 416-9669  
Toll Free: 1+(877) 444-3032  
Please visit the Silicon Labs Technical Support web page:  
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx  
and register to submit a technical support request.  
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.  
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from  
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features  
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-  
resentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-  
quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to  
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-  
sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized ap-  
plication, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.  
Silicon Laboratories, Silicon Labs, and DSPLL are trademarks of Silicon Laboratories Inc.  
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.  
12  
Rev. 1.2  

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