536AB125M000DG [SILICON]

LVPECL Output Clock Oscillator, 125MHz Nom,;
536AB125M000DG
型号: 536AB125M000DG
厂家: SILICON    SILICON
描述:

LVPECL Output Clock Oscillator, 125MHz Nom,

机械 输出元件 振荡器
文件: 总12页 (文件大小:479K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si535/536  
REVISION D  
ULTRA LOW JITTER CRYSTAL OSCILLATOR (XO)  
Features  
Si5602  
Available with select frequencies from Available with LVPECL and  
100 MHz to 312.5 MHz  
LVDS outputs  
rd  
®
3.3 and 2.5 V supply options  
Industry-standard 5 x 7 mm  
package and pinout  
3
generation DSPLL with superior  
jitter performance and high-power  
supply noise rejection  
Pb-free/RoHS-compliant  
3x better frequency stability than  
SAW-based oscillators  
Ordering Information:  
Applications  
See page 7.  
10/40/100G data centers  
10G Ethernet switches/routers  
Fibre channel/SAS/storage  
Enterprise servers  
Networking  
Telecommunications  
Pin Assignments:  
See page 6.  
Description  
®
The Si535/536 XO utilizes Silicon Labs’ advanced DSPLL circuitry to  
provide an ultra low jitter clock at high-speed differential frequencies. Unlike a  
traditional XO, where a different crystal is required for each output frequency,  
the Si535/536 uses one fixed crystal to provide a wide range of output  
frequencies. This IC based approach allows the crystal resonator to provide  
exceptional frequency stability and reliability. In addition, DSPLL clock  
synthesis provides superior supply noise rejection, simplifying the task of  
generating low jitter clocks in noisy environments typically found in  
communication systems. The Si535/536 IC based XO is factory programmed  
at time of shipment, thereby eliminating long lead times associated with  
custom oscillators.  
(Top View)  
VDD  
1
2
3
6
5
4
NC  
OE  
CLK–  
CLK+  
GND  
Si535  
Functional Block Diagram  
VDD  
1
2
3
6
5
4
OE  
NC  
VDD  
CLK– CLK+  
CLK–  
CLK+  
GND  
Si536  
Fixed  
Frequency  
XO  
100–312.5 MHz  
DSPLL®  
Clock Synthesis  
OE  
GND  
Rev. 1.2 5/16  
Copyright © 2016 by Silicon Laboratories  
Si535/536  
Si535/536  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions  
Parameter  
Symbol  
Test Condition  
3.3 V option  
2.5 V option  
Min  
2.97  
2.25  
Typ  
3.3  
2.5  
Max  
3.63  
2.75  
Unit  
V
1
V
Supply Voltage  
DD  
V
Supply Current  
I
Output enabled  
LVPECL  
DD  
111  
90  
121  
98  
mA  
LVDS  
60  
mA  
V
Tristate mode  
0.75 x V  
75  
Output Enable (OE)2  
V
IH  
DD  
V
V
0.5  
85  
IL  
Operating Temperature Range  
T
–40  
°C  
A
Notes:  
1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 7 for further details.  
2. OE pin includes a 17 kpullup resistor to VDD  
.
Table 2. CLK± Output Frequency Characteristics  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Nominal Frequency1  
Initial Accuracy  
O
f
LVPECL/LVDS  
100  
312.5  
MHz  
Measured at +25 °C at time of  
shipping  
fi  
±1.5  
ppm  
Temperature Stability1,2  
Aging  
–7  
–20  
+7  
+20  
ppm  
ppm  
ppm  
Frequency drift over first year  
±3  
fa  
Frequency drift over 20 year  
life  
±10  
Total Stability2  
Temp stability = ±20 ppm  
Temp stability = ±7 ppm  
TA = –40°C — +85°C  
±31.5  
20  
ppm  
ms  
Powerup Time3  
tOSC  
10  
Notes:  
1. See Section 3. "Ordering Information" on page 7 for the list of available frequencies.  
2. Selectable parameter specified by part number.  
3. Time from powerup or tristate mode to fO.  
2
Rev. 1.2  
 
 
 
 
 
 
Si535/536  
Table 3. CLK± Output Levels and Symmetry  
Parameter  
Symbol  
Test Condition  
Mid-level  
Min  
VDD – 1.42  
1.1  
Typ  
Max  
VDD – 1.25  
1.9  
Unit  
V
LVPECL Output Option1  
V
O
VOD  
VSE  
Swing (diff)  
VPP  
VPP  
Swing (Single-ended)  
Mid-level  
0.55  
0.95  
LVDS Output Option2  
V
1.125  
1.20  
1.275  
V
O
Swing (diff)  
VOD  
0.5  
0.7  
0.9  
350  
55  
VPP  
ps  
Rise/Fall time (20/80%)  
Symmetry (duty cycle)  
tR, F  
t
SYM  
Differential  
45  
%
Notes:  
1. 50 to VDD – 2.0 V.  
2. Rterm = 100 (differential).  
Rev. 1.2  
3
 
 
 
Si535/536  
Table 4. CLK± Output Phase Jitter  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
0.19  
0.25  
Max  
0.35  
0.40  
Unit  
ps  
LVPECL/LVDS Phase Jitter*  
(RMS)  
J  
10 kHz to 1 MHz (data center)  
12 kHz to 20 MHz brickwall  
ps  
*Note: Applies to output frequencies: 156.25 MHz.  
Table 5. CLK± Output Period Jitter  
Parameter  
Symbol  
Test Condition  
RMS  
Min  
Typ  
2
Max  
Unit  
ps  
LVPECL/LVDS Period Jitter*  
J
PER  
Peak-to-Peak  
14  
ps  
*Note: N = 1000 cycles.  
Figure 1. Si535/536 Typical Phase Noise at 156.25 MHz  
4
Rev. 1.2  
 
 
Si535/536  
Table 6. Environmental Compliance  
The Si535/536 meets the following qualification test requirements.  
Parameter  
Mechanical Shock  
Conditions/Test Method  
MIL-STD-883, Method 2002  
MIL-STD-883, Method 2007  
MIL-STD-883, Method 2003  
MIL-STD-883, Method 1014  
MIL-STD-883, Method 2036  
J-STD-020, MSL1  
Mechanical Vibration  
Solderability  
Gross & Fine Leak  
Resistance to Solder Heat  
Moisture Sensitivity Level  
Contact Pads  
Gold over Nickel  
Table 7. Thermal Characteristics  
(Typical values TA = 25 ºC, VDD = 3.3 V)  
Parameter  
Symbol  
Test Condition  
Still Air  
Min  
Typ  
84.6  
38.8  
Max  
Unit  
°C/W  
°C/W  
°C  
Thermal Resistance Junction to Ambient  
Thermal Resistance Junction to Case  
Ambient Temperature  
JA  
Still Air  
JC  
T
–40  
85  
A
Junction Temperature  
T
125  
°C  
J
Table 8. Absolute Maximum Ratings1  
Parameter  
Maximum Operating Temperature  
Supply Voltage, 2.5/3.3 V Option  
Input Voltage (any input pin)  
Symbol  
Rating  
85  
–0.5 to +3.8  
Unit  
T
°C  
V
AMAX  
V
DD  
V
–0.5 to V + 0.3  
V
I
DD  
Storage Temperature  
T
–55 to +125  
2500  
°C  
V
S
ESD Sensitivity (HBM, per JESD22-A114)  
Soldering Temperature (Pb-free profile)2  
ESD  
T
260  
°C  
PEAK  
Soldering Temperature Time @ TPEAK (Pb-free profile)2  
t
20–40  
seconds  
P
Notes:  
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional  
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for  
extended periods may affect device reliability.  
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at  
www.silabs.com/VCXO for further information, including soldering profiles.  
Rev. 1.2  
5
 
 
 
Si535/536  
2. Pin Descriptions  
(Top View)  
VDD  
VDD  
1
6
5
4
1
2
3
6
5
4
NC  
OE  
NC  
OE  
2
3
CLK–  
CLK+  
CLK–  
CLK+  
GND  
GND  
Si536  
Si535  
Table 9. Pinout for Si535 Series  
Pin  
Symbol  
Function  
1
NC  
No connection  
Output enable  
2
OE  
0 = clock output disabled (outputs tristated)  
1 = clock output enabled  
3
4
5
6
GND  
CLK+  
CLK–  
Electrical and Case Ground  
Oscillator Output  
Complementary Output  
Power Supply Voltage  
V
DD  
*Note: OE includes a 17 kpullup resistor to VDD  
.
Table 10. Pinout for Si536 Series  
Pin  
Symbol  
Function  
Output enable  
1
OE  
0 = clock output disabled (outputs tristated)  
1 = clock output enabled  
2
3
4
5
6
No connection  
GND  
No connection  
Electrical and Case Ground  
Oscillator Output  
CLK+  
CLK–  
Complementary output  
Power Supply Voltage  
V
DD  
*Note: OE includes a 17 kpullup resistor to VDD  
.
6
Rev. 1.2  
 
 
Si535/536  
3. Ordering Information  
The Si535/536 XO supports a variety of options including frequency, temperature stability, output format, and V  
.
DD  
The Si535 and Si536 XO series are supplied in an industry-standard, RoHS compliant, 6-pad, 5 x 7 mm package.  
The Si536 Series supports an alternate OE pinout (pin #1) for the LVPECL and LVDS output formats. See Tables 9  
and 10 for the pinout differences between the Si535 and Si536 series.  
X
53x  
XXXMXXX  
G
R
X
D
Tape & Reel Packaging  
Blank = Trays  
Device Output Enable  
535  
536  
pin 2  
pin 1  
Operating Temp Range (°C)  
G
-40 to +85 °C  
1st Option Code  
Part Revision Letter  
VDD Output Format Output Enable Polarity  
Frequency (e.g., 156M250 is 156.250 MHz)  
A
B
E
F
3.3 LVPECL  
3.3 LVDS  
High  
High  
High  
High  
Select frequencies available in the frequency range 100 to 312.5 MHz  
are listed below. Frequencies requiring greater than 6 digit resolution  
are assigned a six digit code.  
2.5 LVPECL  
2.5 LVDS  
Available Frequencies Frequency Order Code  
100.000 MHz  
100M000  
106M250  
125M000  
150M000  
155M520  
156M250  
000305  
000335  
000338  
159M375  
000292  
106.250 MHz  
125.000 MHz  
150.000 MHz  
155.520 MHz  
156.250 MHz  
156.2578 MHz  
156.2539 MHz  
156.26953 MHz  
159.375 MHz  
161.1328 MHz  
166.6286 MHz  
167.3316 MHz  
212.500 MHz  
312.500 MHz  
000172  
000175  
212M500  
312M500  
2nd Option Code  
Code Temperature Stability (ppm, max, ±) Total Stablility (ppm, max, ±)  
B
C
20  
7
31.5  
20  
Example P/N: 535AB156M250DGR is a 5 x 7 XO in a 6 pad package. The frequency is 156.250 MHz, with a 3.3 V supply, LVPECL output,  
and Output Enable active high polarity. Temperature stability is specifed as ±20 ppm. The part is specified for –40 to +85 °C ambient  
temperature range operation and is shipped in tape and reel format.  
Figure 2. Part Number Convention  
Rev. 1.2  
7
 
Si535/536  
4. Package Outline  
Figure 3 illustrates the package details for the Si535/536. Table 11 lists the values for the dimensions shown in the  
illustration.  
Figure 3. Si535/536 Outline Diagram  
Table 11. Package Diagram Dimensions (mm)  
Dimension  
Min  
1.50  
1.30  
0.50  
Nom  
1.65  
Max  
1.80  
1.50  
0.70  
A
b
1.40  
c
0.60  
D
5.00 BSC  
4.40  
D1  
e
4.30  
4.50  
2.54 BSC  
7.00 BSC  
6.20  
E
E1  
H
6.10  
0.55  
1.17  
1.80  
6.30  
0.75  
1.37  
2.60  
0.65  
L
1.27  
p
R
0.70 REF  
0.15  
aaa  
bbb  
ccc  
ddd  
eee  
0.15  
0.10  
0.10  
0.05  
8
Rev. 1.2  
 
 
 
Si535/536  
5. 6-Pin PCB Land Pattern  
Figure 4 illustrates the 6-pin PCB land pattern for the Si535/536. Table 12 lists the values for the dimensions shown  
in the illustration.  
Figure 4. Si535/536 PCB Land Pattern  
Table 12. PCB Land Pattern Dimensions (mm)  
Dimension  
Min  
4.20  
2.54  
1.55  
1.95  
C1  
E
X1  
Y1  
Notes:  
General  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.  
3. This Land Pattern Design is based on the IPC-7351 guidelines.  
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based  
on a Fabrication Allowance of 0.05 mm.  
Solder Mask Design  
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to  
be 60 µm minimum, all the way around the pad.  
Stencil Design  
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder  
paste release.  
2. The stencil thickness should be 0.125 mm (5 mils).  
3. The ratio of stencil aperture to land pad size should be 1:1.  
Card Assembly  
1. A No-Clean, Type-3 solder paste is recommended.  
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.  
Rev. 1.2  
9
 
 
Si535/536  
6. Si535/Si536 Mark Specification  
Figure 5 illustrates the mark specification for the Si535/Si536. Table 13 lists the line information.  
Figure 5. Mark Specification  
Table 13. Si53x Top Mark Description  
Line  
Position  
Description  
1
1–10  
“SiLabs"+ Part Family Number, 53x (First 3 characters in part number where x = 5  
indicates a 535 device and x = 6 indicates a 536 device).  
2
3
1–10  
Si535, Si536: Option1 + Option2 + Freq(7) + Temp  
Si535/Si536 w/ 8-digit resolution: Option1 + Option2 + ConfigNum(6) + Temp  
Trace Code  
Position 1  
Pin 1 orientation mark (dot)  
Position 2  
Product Revision (D)  
Position 3–6  
Position 7  
Tiny Trace Code (4 alphanumeric characters per assembly release instructions)  
Year (least significant year digit), to be assigned by assembly site (ex: 2013 = 3)  
Calendar Work Week number (1–53), to be assigned by assembly site  
“+” to indicate Pb-Free and RoHS-compliant  
Position 8–9  
Position 10  
10  
Rev. 1.2  
 
 
Si535/536  
DOCUMENT CHANGE LIST  
Revision 0.2 to Revision 0.3  
Updated Table 7 on page 5.  
Revision 0.3 to Revision 0.5  
Updated Note 1 in Table 2 on page 2.  
Updated Symmetry Test Condition in Table 3 on  
page 3.  
Updated Table 4 on page 4.  
Updated Table 5 on page 4.  
Updated XXXMXXX text in Figure 2 on page 7.  
Updated 4. "Package Outline" on page 8.  
Revision 0.5 to Revision 0.6  
Updated Figure 2 on page 7.  
Updated Land Pattern information on page 10.  
Revision 0.6 to Revision 0.7  
Updated Powerup Time’s test condition in Table 2 on  
page 2.  
Added new frequency option to Figure 2 on page 7.  
Revision 0.7 to Revision 1.0  
Updated Table 4 Phase Jitter's test condition and  
maximum values.  
Revision 1.0 to Revision 1.1  
Added 100 MHz ordering option.  
Revision 1.1 to Revision 1.2  
May 13, 2016  
Updated Figure 2 for frequencies: 161.1328 MHz,  
166.6286 MHz, 167.3316 MHz.  
11  
Rev. 1.2  
ClockBuilder Pro  
One-click access to Timing tools,  
documentation, software, source  
code libraries & more. Available for  
Windows and iOS (CBGo only).  
www.silabs.com/CBPro  
Timing Portfolio  
www.silabs.com/timing  
SW/HW  
www.silabs.com/CBPro  
Quality  
www.silabs.com/quality  
Support and Community  
community.silabs.com  
Disclaimer  
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using  
or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and  
"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to  
make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the  
included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses  
granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent  
of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant  
personal injury or death. Silicon Laboratories products are not designed or authorized for military applications. Silicon Laboratories products shall under no circumstances be used in  
weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.  
Trademark Information  
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EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®,  
ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Laborato-  
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