BGM113 [SILICON]
Commercial and Retail;型号: | BGM113 |
厂家: | SILICON |
描述: | Commercial and Retail |
文件: | 总84页 (文件大小:1729K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
BGM113 Blue Gecko Bluetooth Module
Data Sheet
The Blue Gecko BGM113 is a Bluetooth® Module targeted for Bluetooth low energy ap-
plications where small size, reliable RF, low-power consumption, and easy application
KEY FEATURES
development are key requirements. At +3 dBm TX power, BGM113 is ideal for applica-
tions requiring short and medium range Bluetooth connectivity.
• Bluetooth 4.2 compliant
• Integrated antenna
The BGM113 integrates all of the necessary elements required for a Bluetooth applica-
tion: Bluetooth radio, a software stack, and GATT-based profiles, and it can also host
end user applications, which means no external microcontroller is required in size, price
or power constrained devices. The BGM113 Bluetooth Module also has highly flexible
hardware interfaces to connect to different peripherals or sensors.
• TX power: up to +3 dBm
• RX sensitivity: down to -92 dBm
• Range: up to 50 meters
®
®
•
32-bit ARM Cortex -M4 core at 38.4 MHz
• Flash memory: 256kB
• RAM: 32 kB
BGM113 can be used in a wide variety of applications:
• Autonomous hardware crypto accelerator
and random number generator
• IoT Sensors and End Devices
• Commercial and Retail
• Integrated DC-DC Converter
• Onboard Bluetooth stack
• Health and Wellness
• Industrial, Home and Building Automation
• Smart Phone, Tablet and PC Accessories
Crystals
Core / Memory
Clock Management
Energy Management
Other
High Frequency
RC Oscillator
Voltage
High Frequency
Crystal Oscillator
38.4MHz
Voltage Monitor
Regulator
CRYPTO
ARM Cortex M4 processor
Memory
with DSP extensions and FPU
Protection Unit
Auxiliary
High Frequency
RC Oscillator
Low Frequency
RC Oscillator
DC-DC
32.768kHz
Power-On Reset
Converter
CRC
Ultra Low
Frequency
RC Oscillator
Low Frequency
Crystal Oscillator
Flash Program
RAM Memory
Memory
Brown-Out
Detector
Debug Interface
DMA Controller
32-bit bus
Peripheral Reflex System
Radio Transceiver
I/O Ports
Timers and Triggers
Analog I/F
Antenna
Serial Interfaces
External
Interrupts
Chip antenna
RFSENSE
DEMOD
IFADC
AGC
USART
Timer/Counter
Low energy timer
Pulse Counter
Protocol Timer
ADC
Low Energy
UART
General Purpose
I/O
Analog
Comparator
PGA
I
Watchdog Timer
RTCC
Matching
LNA
RF Frontend
BALUN
I2C
Pin Reset
IDAC
PA
Frequency
Synthesizer
Q
MOD
Pin Wakeup
Cryotimer
Lowest power mode with peripheral operational:
EM0—Active EM1—Sleep
EM2—Deep Sleep
EM3—Stop
EM4—Hibernate
EM4—Shutoff
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Feature List
1. Feature List
The BGM113 highlighted features are listed below.
• Low Power Wireless System-on-Chip.
• Wide Selection of MCU peripherals
High Performance 32-bit 38.4 MHz ARM Cortex®-M4 with
DSP instruction and floating-point unit for efficient signal
processing
•
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• Digital to Analog Current Converter (IDAC)
• 256 kB flash program memory
• 32 kB RAM data memory
• 14 pins connected to analog channels (APORT) shared be-
tween Analog Comparators, ADC, and IDAC
• 2.4 GHz radio operation
• 14 General Purpose I/O pins with output state retention and
asynchronous interrupts
• TX power up to +3 dBm
• 8 Channel DMA Controller
• Low Energy Consumption
• 12 Channel Peripheral Reflex System (PRS)
• 2×16-bit Timer/Counter
• 8.7 mA RX current at 2.4 GHz
• 8.2 mA TX current @ 0 dBm output power at 2.4 GHz
• 63 μA/MHz in Active Mode (EM0)
• 3 + 4 Compare/Capture/PWM channels
• 32-bit Real Time Counter and Calendar
• 16-bit Low Energy Timer for waveform generation
• 2.5 μA EM2 DeepSleep current (full RAM retention and
RTCC running from LFXO)
• 2.1 μA EM3 Stop current (State/RAM retention)
• 32-bit Ultra Low Energy Timer/Counter for periodic wake-up
from any Energy Mode
• Wake on Radio with signal strength detection, preamble
pattern detection, frame detection and timeout
• 16-bit Pulse Counter with asynchronous operation
• Watchdog Timer with dedicated RC oscillator @ 50nA
• 2×Universal Synchronous/Asynchronous Receiver/Trans-
mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
• High Receiver Performance
• -92 dBm sensitivity @ 1 Mbit/s GFSK (2.4 GHz)
• Supported Protocols
Bluetooth®
Low Energy UART (LEUART™)
I2C interface with SMBus support and address recognition
in EM3 Stop
•
•
•
• Support for Internet Security
• General Purpose CRC
• Wide Operating Range
• 1.85 V to 3.8 V single power supply
• 2.4 V to 3.8 V when using DC-DC
• Integrated DC-DC
• Random Number Generator
• Hardware Cryptographic Acceleration for AES 128/256,
SHA-1, SHA-2 (SHA-224 and SHA-256) and ECC
• -40 °C to +85 °C
• Dimensions
• 9.15 x 15.73 x 1.9 mm
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Ordering Information
2. Ordering Information
Ordering Code
Protocol Stack
Frequency Max TX Encryption
Flash
(KB)
RAM
(KB)
GPIO Package
Band
Power
(dBm)
BGM113A256V2
BGM113A256V2R
Bluetooth Smart
Bluetooth Smart
2.4 GHz
2.4 GHz
3
Full
Full
256
256
32
32
14
14
100 pcs
cut reel
3
1000 pcs
tape and
reel
SLWRB4301A1
Note:
1. BGM113 Bluetooth module radio board. Requires also SLWSTK6101C (or SLWSTK6101A or SLWSTK6101B).
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BGM113 Blue Gecko Bluetooth Module Data Sheet
System Overview
3. System Overview
3.1 Introduction
The BGM113 product family combines an energy-friendly MCU with a highly integrated radio transceiver. The devices are well suited
for any battery operated application, as well as other system requiring high performance and low-energy consumption. This section
gives a short introduction to the full radio and MCU system. A detailed functional description can be found in the EFR32BG1 Blue
Gecko Bluetooth® Smart SoC Family Data Sheet (see general sections and QFN48 2.4 GHz SoC related sections).
A detailed block diagram of the EFR32BG SoC is shown in the figure below which is used in the BGM113 Bluetooth Smart module.
Port I/O Configuration
Radio Transciever
DEMOD
Digital Peripherals
RFSENSE
BALUN
RF Frontend
PGA
IFADC
AGC
LETIMER
I
IOVDD
LNA
TIMER
2G4RF_IOP
2G4RF_ION
PA
Frequency
Synthesizer
Q
CRYOTIMER
PCNT
MOD
Port A
Drivers
PAn
RTC / RTCC
USART
Port
Mapper
Energy Management
ARM Cortex-M4 Core
Port B
PAVDD
RFVDD
PBn
PCn
PDn
PFn
Drivers
Up to 256 KB ISP Flash
Program Memory
LEUART
I2C
IOVDD
AVDD
Up to 32 KB RAM
Memory Protection Unit
Floating Point Unit
DMA Controller
Voltage
Monitor
CRYPTO
CRC
Port C
Drivers
A
H
B
A
P
B
DVDD
bypass
Port D
Drivers
VREGVDD
VREGSW
Analog Peripherals
DC-DC
Converter
Voltage
Regulator
Serial Wire Debug /
Programming
Internal
Reference
IDAC
DECOUPLE
Watchdog
Timer
Port F
Drivers
VDD
VREF
VSS
VREGVSS
RFVSS
Brown Out /
Power-On
Reset
Clock Management
VDD
12-bit ADC
PAVSS
ULFRCO
AUXHFRCO
LFRCO
Reset
Management
Unit
RESETn
Temp
Sensor
HFRCO
LFXO
LFXTAL_P / N
+
-
HFXTAL_P
HFXTAL_N
HFXO
Analog Comparator
Figure 3.1. Detailed EFR32BG1 Block Diagram
3.2 Radio
The BGM113 features a radio transceiver supporting Bluetooth® low energy protocol.
3.2.1 Antenna Interface
The BGM113 module includes an integrated chip-antenna. The table below includes performance specifications for the integrated chip-
antenna.
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System Overview
Table 3.1. Antenna Efficiency and Peak Gain
Parameter
Efficiency
Peak gain
With optimal layout Note
-3 to -4 dB
0.5 dBi
Efficiency and peak gain depend on the application PCB layout
and mechanical design
3.2.2 Wake on Radio
The Wake on Radio feature allows flexible, autonomous RF sensing, qualification, and demodulation without required MCU activity, us-
ing a subsystem of the BGM113 including the Radio Controller (RAC), Peripheral Reflex System (PRS), and Low Energy peripherals.
3.2.3 RFSENSE
The RFSENSE module generates a system wakeup interrupt upon detection of wideband RF energy at the antenna interface, providing
true RF wakeup capabilities from low energy modes including EM2, EM3 and EM4.
RFSENSE triggers on a relatively strong RF signal and is available in the lowest energy modes, allowing exceptionally low energy con-
sumption. RFSENSE does not demodulate or otherwise qualify the received signal, but software may respond to the wakeup event by
enabling normal RF reception.
Various strategies for optimizing power consumption and system response time in presence of false alarms may be employed using
available timer peripherals.
3.2.4 Packet and State Trace
The BGM113 Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It
features:
• Non-intrusive trace of transmit data, receive data and state information
• Data observability on a single-pin UART data output, or on a two-pin SPI data output
• Configurable data output bitrate / baudrate
• Multiplexed transmitted data, received data and state / meta information in a single serial data stream
3.2.5 Random Number Generator
The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain.
The data is suitable for use in cryptographic applications.
Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num-
ber generator algorithms such as Fortuna.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
System Overview
3.3 Power
The BGM113 has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a
single external supply voltage is required, from which all internal voltages are created. An integrated DC-DC buck regulator is utilized to
further reduce the current consumption.
Figure 3.2. Power Supply Configuration
3.3.1 Energy Management Unit (EMU)
The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and
features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM
blocks, and it contains control registers for the dc-dc regulator and the Voltage Monitor (VMON). The VMON is used to monitor multiple
supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen
below a chosen threshold.
3.3.2 DC-DC Converter
The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2
and EM3. Patented RF noise mitigation allows operation of the DC-DC converter without degrading sensitivity of radio components.
Protection features include programmable current limiting, short-circuit protection, and dead-time protection. The DC-DC converter may
also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the DC-DC input supply is internally
connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input
supply voltage droops due to excessive output current transients.
3.4 General Purpose Input/Output (GPIO)
BGM113 has up to 14 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input.
More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin.
The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to sev-
eral GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals.
The GPIO subsystem supports asynchronous external pin interrupts.
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System Overview
3.5 Clocking
3.5.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the BGM113. Individual enabling and disabling of clocks to all peripheral
modules is perfomed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility al-
lows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and
oscillators.
3.5.2 Internal Oscillators
The BGM113 fully integrates two crystal oscillators and four RC oscillators, listed below.
• A 38.4MHz high frequency crystal oscillator (HFXO) provides a precise timing reference for the MCU and radio.
• A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes.
• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The
HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.
• An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial
Wire debug port with a wide frequency range.
• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) can be used as a timing reference in low energy modes, when crys-
tal accuracy is not required.
• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con-
sumption in low energy modes.
3.6 Counters/Timers and PWM
3.6.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the
PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one
of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output
reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width
modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional
dead-time insertion available in timer unit TIMER_0 only.
3.6.2 Real Time Counter and Calendar (RTCC)
The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a
Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla-
tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving
frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy
and convenient data storage in all energy modes.
3.6.3 Low Energy Timer (LETIMER)
The unique LETIMER is a 16-bit timer that is available in energy mode EM2 Deep Sleep in addition to EM1 Sleep and EM0 Active. This
allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed
while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave-
forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con-
figured to start counting on compare matches from the RTCC.
3.6.4 Ultra Low Power Wake-up Timer (CRYOTIMER)
The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal
oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events
and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-
rupt periods, facilitating flexible ultra-low energy operation.
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System Overview
3.6.5 Pulse Counter (PCNT)
The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The
clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from
among any of the internal oscillators, except the AUXHFRCO. The module may operate in energy mode EM0 Active, EM1 Sleep, EM2
Deep Sleep, and EM3 Stop.
3.6.6 Watchdog Timer (WDOG)
The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed
monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can
also monitor autonomous systems driven by PRS.
3.7 Communications and Other Digital Peripherals
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous
UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup-
porting:
• ISO7816 SmartCards
• IrDA
I2S
•
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)
The unique LEUARTTM provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow
UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication
possible with a minimum of software intervention and energy consumption.
3.7.3 Inter-Integrated Circuit Interface (I2C)
The I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave and
supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10
kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system. The
interface provided to software by the I2C module allows precise timing control of the transmission process and highly automated trans-
fers. Automatic recognition of slave addresses is provided in active and low energy modes.
3.7.4 Peripheral Reflex System (PRS)
The Peripheral Reflex System provides a communication network between different peripheral modules without software involvement.
Peripheral modules producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer periph-
erals which in turn perform actions in response. Edge triggers and other functionality can be applied by the PRS. The PRS allows pe-
ripheral to act autonomously without waking the MCU core, saving power.
3.8 Security Features
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check)
The GPCRC module implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The sup-
ported 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the
needs of the application.
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System Overview
3.8.2 Crypto Accelerator (CRYPTO)
The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. It supports AES en-
cryption and decryption with 128- or 256-bit keys and ECC over both GF(P) and GF(2m), SHA-1 and SHA-2 (SHA-224 and SHA-256).
Supported modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, CBC-MAC, GMAC and CCM.
Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.
The CRYPTO is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on data
buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention. CRYPTO also provides trigger sig-
nals for DMA read and write operations.
3.9 Analog
3.9.1 Analog Port (APORT)
The Analog Port (APORT) is an analog interconnect matrix allowing access to analog modules ADC, ACMP, and IDAC on a flexible
selection of pins. Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differen-
tially, buses are grouped by X/Y pairs.
3.9.2 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-
er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption
is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The
ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the
programmable threshold.
3.9.3 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 MSamples/s. The
output sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple
samples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide
range of sources, including pins configurable as either single-ended or differential.
3.9.4 Digital to Analog Current Converter (IDAC)
The Digital to Analog Current Converter can source or sink a configurable constant current. This current can be driven on an output pin
or routed to the selected ADC input pin for capacitive sensing. The current is programmable between 0.05 µA and 64 µA with several
ranges with various step sizes.
3.10 Reset Management Unit (RMU)
The RMU is responsible for handling reset of the BGM113. A wide range of reset sources are available, including several power supply
monitors, pin reset, software controlled reset, core lockup reset and watchdog reset.
3.11 Core and Memory
3.11.1 Processor Core
The ARM Cortex-M4F processor includes a 32-bit RISC processor integrating the following features and tasks in the system:
• ARM Cortex-M4F RISC processor achieving 1.25 Dhrystone MIPS/MHz
• Memory Protection Unit (MPU) supporting up to 8 memory segments
• 256 KB flash program memory
• 32 KB RAM data memory
• Configuration and event handling of all modules
• 2-pin Serial-Wire debug interface
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System Overview
3.11.2 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable
from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code
is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a
read-only page in the information block containing system and device calibration data. Read and write operations are supported in en-
ergy modes EM0 Active and EM1 Sleep.
3.11.3 Linked Direct Memory Access Controller (LDMA)
The Linked Direct Memory Access (LDMA) controller features 8 channels capable of performing memory operations independently of
software. This reduces both energy consumption and software workload. The LDMA allows operations to be linked together and stag-
ed, enabling sophisticated operations to be implemented.
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System Overview
3.12 Memory Map
The BGM113 memory map is shown in the figures below.
Figure 3.3. BGM113 Memory Map — Core Peripherals and Code Space
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System Overview
Figure 3.4. BGM113 Memory Map — Peripherals
3.13 Configuration Summary
The features of the BGM113 are a subset of the feature set described in the device reference manual. The table below describes de-
vice specific implementation of the features. Remaining modules support full configuration.
Table 3.2. Configuration Summary
Module
USART0
USART1
Configuration
Pin Connections
IrDA SmartCard
US0_TX, US0_RX, US0_CLK, US0_CS
US1_TX, US1_RX, US1_CLK, US1_CS
IrDA I2S SmartCard
with DTI
TIMER0
TIMER1
TIM0_CC[2:0], TIM0_CDTI[2:0]
TIM1_CC[3:0]
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4. Electrical Specifications
4.1 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
Refer to Table 4.2 General Operating Conditions on page 13 for more details about operational supply and temperature limits.
4.1.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-
bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
-40
0
Typ
—
Max
+85
3.8
1
Unit
°C
Storage temperature range
TSTG
External main supply voltage VDDMAX
—
V
External main supply voltage VDDRAMPMAX
ramp rate
—
—
V / μs
External main supply voltage
with DC-DC in bypass mode
1.85
-0.3
3.8
V
V
Voltage on any 5V tolerant
GPIO pin1
VDIGPIN
—
—
Min of 5.25
and IOVDD
+2
Voltage on non-5V tolerant
GPIO pins
-0.3
IOVDD+0.3
V
Max RF level at input
PRFMAX2G4
—
—
—
—
10
dBm
mA
Total current into VDD power IVDDMAX
lines (source)
200
Total current into VSS
ground lines (sink)
IVSSMAX
—
—
200
mA
Current per I/O pin (sink)
IIOMAX
—
—
—
—
—
—
—
—
50
50
mA
mA
mA
mA
Current per I/O pin (source)
Current for all I/O pins (sink) IIOALLMAX
200
200
Current for all I/O pins
(source)
Voltage difference between
AVDD and VREGVDD
ΔVDD
—
—
0.3
V
Note:
1. When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = IOVDD.
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Electrical Specifications
4.1.2 Operating Conditions
The following subsections define the operating conditions for the module.
4.1.2.1 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating temperature
range
TOP
Ambient temperature range
-40
25
85
°C
VDD Operating supply volt- VVDD
age 1
DCDC in regulation
2.4
1.85
—
3.3
3.3
—
3.8
3.8
200
26
V
V
DCDC in bypass, 50mA load
DCDC in bypass
VDD Current
IVDD
mA
MHz
0 wait-states (MODE = WS0) 2
1 wait-states (MODE = WS1) 2
HFCLK frequency
fCORE
—
—
—
38.4
40
MHz
Note:
1. The minimum voltage required in bypass mode is calculated using RBYP from the DC-DC specification table. Requirements for
other loads can be calculated as VVDD_min+ILOAD * RBYP_max
2. In MSC_READCTRL register
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4.1.3 DC-DC Converter
Test conditions: VDCDC_I=3.3 V, VDCDC_O=1.8 V, IDCDC_LOAD=50 mA, Heavy Drive configuration, FDCDC_LN=7 MHz, unless otherwise
indicated.
Table 4.3. DC-DC Converter
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input voltage range
VDCDC_I
Bypass mode, IDCDC_LOAD = 50
mA
1.85
—
VVREGVDD_
V
MAX
Low noise (LN) mode, 1.8 V out-
put, IDCDC_LOAD = 100 mA, or
Low power (LP) mode, 1.8 V out-
put, IDCDC_LOAD = 10 mA
2.4
—
VVREGVDD_
V
MAX
Low noise (LN) mode, 1.8 V out-
put, IDCDC_LOAD = 200 mA
2.6
1.8
—
—
VVREGVDD_
V
V
MAX
Output voltage programma- VDCDC_O
ble range1
VVREGVDD
Regulation DC Accuracy
ACCDC
Low noise (LN) mode, 1.8 V target
output
1.7
—
—
1.9
2.2
V
V
Regulation Window2
WINREG
Low power (LP) mode,
LPCMPBIAS3 = 0, 1.8 V target
output, IDCDC_LOAD ≤ 75 μA
1.63
Low power (LP) mode,
1.63
—
2.1
V
LPCMPBIAS3 = 3, 1.8 V target
output, IDCDC_LOAD ≤ 10 mA
Steady-state output ripple
VR
Radio disabled.
—
—
3
—
mVpp
mV
CCM Mode (LNFORCECCM3 =
1), Load changes between 0 mA
and 100 mA
Output voltage under/over-
shoot
VOV
—
150
DCM Mode (LNFORCECCM3 =
0), Load changes between 0 mA
and 10 mA
—
—
150
mV
Overshoot during LP to LN
CCM/DCM mode transitions com-
pared to DC level in LN mode
—
—
200
50
—
—
mV
mV
Undershoot during BYP/LP to LN
CCM (LNFORCECCM3 = 1) mode
transitions compared to DC level
in LN mode
Undershoot during BYP/LP to LN
—
125
—
mV
DCM (LNFORCECCM3 = 0) mode
transitions compared to DC level
in LN mode
DC line regulation
DC load regulation
VREG
Input changes between
VVREGVDD_MAX and 2.4 V
—
—
0.1
0.1
—
—
%
%
IREG
Load changes between 0 mA and
100 mA in CCM mode
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Parameter
Note:
Symbol
Test Condition
Min
Typ
Max
Unit
1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, VVREGVDD
2. LP mode controller is a hysteretic controller that maintains the output voltage within the specified limits
3. In EMU_DCDCMISCCTRL register
4. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi-
um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.
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4.1.4 Current Consumption
4.1.4.1 Current Consumption 3.3 V (DC-DC in Bypass Mode)
Unless otherwise indicated, typical conditions are: VDD
=
3.3 V. TOP
=
25 °C. EMU_PWRCFG_PWRCG=NODCDC.
EMU_DCDCCTRL_DCDCMODE=BYPASS. Minimum and maximum values in this table represent the worst conditions across supply
voltage and process variation at TOP = 25 °C.
Table 4.4. Current Consumption 3.3V without DC/DC
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM0 IACTIVE
Active mode with all periph-
erals disabled
38.4 MHz crystal, CPU running
while loop from flash1
—
130
—
μA/MHz
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
—
88
100
112
102
222
65
—
105
—
μA/MHz
μA/MHz
μA/MHz
μA/MHz
μA/MHz
μA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
26 MHz HFRCO, CPU running
while loop from flash
106
350
—
1 MHz HFRCO, CPU running
while loop from flash
38.4 MHz crystal1
38 MHz HFRCO
26 MHz HFRCO
1 MHz HFRCO
Current consumption in EM1 IEM1
Sleep mode with all peripher-
als disabled
—
—
—
—
35
37
38
41
μA/MHz
μA/MHz
μA/MHz
μA
157
3.3
275
—
Current consumption in EM2 IEM2
Deep Sleep mode.
Full RAM retention and RTCC
running from LFXO
4 kB RAM retention and RTCC
running from LFRCO
—
—
—
—
3
6.3
6
μA
μA
μA
μA
Current consumption in EM3 IEM3
Stop mode
Full RAM retention and CRYO-
TIMER running from ULFRCO
2.8
1.1
0.65
Current consumption in
EM4H Hibernate mode
IEM4
128 byte RAM retention, RTCC
running from LFXO
—
—
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
128 byte RAM retention, no RTCC
no RAM retention, no RTCC
—
—
0.65
0.04
1.3
μA
μA
Current consumption in
EM4S Shutoff mode
IEM4S
0.11
Note:
1. CMU_HFXOCTRL_LOWPOWER=0
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4.1.4.2 Current Consumption 3.3 V using DC-DC Converter
Unless otherwise indicated, typical conditions are: VDD = 3.3V. TOP = 25 °C. Minimum and maximum values in this table represent the
worst conditions across supply voltage and process variation at TOP = 25 °C.
Table 4.5. Current Consumption 3.3V with DC-DC
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM0 IACTIVE
Active mode with all periph-
erals disabled, DCDC in Low
Noise DCM mode1.
38.4 MHz crystal, CPU running
while loop from flash2
—
88
—
μA/MHz
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
63
71
78
76
98
—
—
—
—
—
μA/MHz
μA/MHz
μA/MHz
μA/MHz
μA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
26 MHz HFRCO, CPU running
while loop from flash
Current consumption in EM0
Active mode with all periph-
erals disabled, DCDC in Low
Noise CCM mode3.
38.4 MHz crystal, CPU running
while loop from flash2
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
75
81
88
94
49
—
—
—
—
—
μA/MHz
μA/MHz
μA/MHz
μA/MHz
μA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
26 MHz HFRCO, CPU running
while loop from flash
38.4 MHz crystal2
38 MHz HFRCO
26 MHz HFRCO
Current consumption in EM1 IEM1
Sleep mode with all peripher-
als disabled, DCDC in Low
Noise DCM mode1.
—
—
—
32
38
61
—
—
—
μA/MHz
μA/MHz
μA/MHz
38.4 MHz crystal2
38 MHz HFRCO
26 MHz HFRCO
Current consumption in EM1
Sleep mode with all peripher-
als disabled, DCDC in Low
Noise CCM mode3.
—
—
—
45
58
—
—
—
μA/MHz
μA/MHz
μA
Current consumption in EM2 IEM2
Deep Sleep mode. DCDC in
Low Power mode4.
Full RAM retention and RTCC
running from LFXO
2.5
4 kB RAM retention and RTCC
running from LFRCO
—
—
—
—
2.2
2.1
—
—
—
—
μA
μA
μA
μA
Current consumption in EM3 IEM3
Stop mode
Full RAM retention and CRYO-
TIMER running from ULFRCO
Current consumption in
EM4H Hibernate mode
IEM4
128 byte RAM retention, RTCC
running from LFXO
0.86
0.58
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
128 byte RAM retention, no RTCC
no RAM retention, no RTCC
—
—
0.58
0.04
—
—
μA
μA
Current consumption in
EM4S Shutoff mode
IEM4S
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Parameter
Note:
Symbol
Test Condition
Min
Typ
Max
Unit
1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD
2. CMU_HFXOCTRL_LOWPOWER=0
3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD
4. DCDC Low Power Mode = Medium Drive (PFETCNT=NFETCNT=7), LPOSCDIV=1, LPBIAS=3, LPCILIMSEL=1, ANASW=DVDD
4.1.4.3 Current Consumption 1.85 V (DC-DC in Bypass Mode)
Unless otherwise indicated, typical conditions are: VDD = 1.85 V. TOP = 25 °C. DC-DC in bypass mode. Minimum and maximum values
in this table represent the worst conditions across supply voltage and process variation at TOP = 25 °C.
Table 4.6. Current Consumption 1.85V without DC/DC
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM0 IACTIVE
Active mode with all periph-
erals disabled
38.4 MHz crystal, CPU running
while loop from flash1
—
131
—
μA/MHz
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
—
88
100
112
102
220
65
—
—
—
—
—
—
μA/MHz
μA/MHz
μA/MHz
μA/MHz
μA/MHz
μA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
26 MHz HFRCO, CPU running
while loop from flash
1 MHz HFRCO, CPU running
while loop from flash
38.4 MHz crystal1
38 MHz HFRCO
26 MHz HFRCO
1 MHz HFRCO
Current consumption in EM1 IEM1
Sleep mode with all peripher-
als disabled
—
—
—
—
35
37
—
—
—
—
μA/MHz
μA/MHz
μA/MHz
μA
154
3.2
Current consumption in EM2 IEM2
Deep Sleep mode
Full RAM retention and RTCC
running from LFXO
4 kB RAM retention and RTCC
running from LFRCO
—
—
—
—
2.8
2.7
1
—
—
—
—
μA
μA
μA
μA
Current consumption in EM3 IEM3
Stop mode
Full RAM retention and CRYO-
TIMER running from ULFRCO
Current consumption in
EM4H Hibernate mode
IEM4
128 byte RAM retention, RTCC
running from LFXO
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
0.62
128 byte RAM retention, no RTCC
No RAM retention, no RTCC
—
—
0.62
0.02
—
—
μA
μA
Current consumption in
EM4S Shutoff mode
IEM4S
Note:
1. CMU_HFXOCTRL_LOWPOWER=0
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4.1.4.4 Current Consumption Using Radio
Unless otherwise indicated, typical conditions are: VDD = 3.3 V. TOP = 25 °C. DC-DC on. Minimum and maximum values in this table
represent the worst conditions across supply voltage and process variation at TOP = 25 °C.
Table 4.7. Current Consumption Using Radio 3.3 V with DC-DC
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in re-
ceive mode, active packet
reception (MCU in EM1 @
38.4 MHz, peripheral clocks
disabled)
IRX
1 Mbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
—
8.7
—
mA
Current consumption in
transmit mode (MCU in EM1
@ 38.4 MHz, peripheral
clocks disabled)
ITX
F = 2.4 GHz, CW, 0 dBm output
power, Radio clock prescaled by 3
—
—
—
8.2
16.5
51
—
—
—
mA
mA
nA
F = 2.4 GHz, CW, 3 dBm output
power
RFSENSE current consump- IRFSENSE
tion
4.1.5 Wake up times
Table 4.8. Wake up times
Parameter
Symbol
Test Condition
Min
—
Typ
10.7
3
Max
—
Unit
μs
Wake up from EM2 Deep
Sleep
tEM2_WU
Code execution from flash
Code execution from RAM
Executing from flash
—
—
μs
Wakeup time from EM1
Sleep
tEM1_WU
—
3
—
AHB
Clocks
Executing from RAM
—
3
—
AHB
Clocks
Wake up from EM3 Stop
tEM3_WU
Executing from flash
Executing from RAM
Executing from flash
—
—
—
10.7
3
—
—
—
μs
μs
μs
Wake up from EM4H Hiber- tEM4H_WU
nate1
60
Wake up from EM4S Shut-
off1
tEM4S_WU
—
290
—
μs
Note:
1. Time from wakeup request until first instruction is executed. Wakeup results in device reset.
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4.1.6 Brown Out Detector
For the table below, see Figure 3.2 Power Supply Configuration on page 5 on page 5 to see the relation between the modules external
VDD pin and internal voltage supplies. The module itself has only one external power supply input (VDD).
Table 4.9. Brown Out Detector
Parameter
Symbol
Test Condition
AVDD rising
Min
—
Typ
—
Max
1.85
—
Unit
V
AVDD BOD threshold
VAVDDBOD
AVDD falling
1.62
—
—
V
AVDD BOD hysteresis
AVDD response time
EM4 BOD threshold
VAVDDBOD_HYST
21
—
mV
μs
V
tAVDDBOD_DELAY Supply drops at 0.1V/μs rate
—
2.4
—
—
VEM4DBOD
AVDD rising
AVDD falling
—
1.7
—
1.45
—
—
V
EM4 BOD hysteresis
EM4 response time
VEM4BOD_HYST
46
—
mV
μs
tEM4BOD_DELAY Supply drops at 0.1V/μs rate
—
300
—
4.1.7 Frequency Synthesizer Characteristics
Table 4.10. Frequency Synthesizer Characteristics
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
RF Synthesizer Frequency
range
FRANGE_2400
2.4 GHz frequency range
2400
—
2483.5
MHz
LO tuning frequency resolu- FRES_2400
tion with 38.4 MHz crystal
2400 - 2483.5 MHz
—
—
—
—
73
Hz
Maximum frequency devia-
tion with 38.4 MHz crystal
ΔFMAX_2400
1677
kHz
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4.1.8 2.4 GHz RF Transceiver Characteristics
4.1.8.1 RF Transmitter General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TOP = 25 °C,VDD = 3.3 V, DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.11. RF Transmitter General Characteristics for 2.4 GHz Band
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
POUTMAX
—
+3
—
dBm
Maximum TX power
Minimum active TX Power
Output power step size
POUTMIN
CW
-26
1
—
—
—
dBm
dB
POUTSTEP
-5 dBm < Output power < 0 dBm
—
—
0 dBm < output power <
POUTMAX
0.5
dB
Output power variation vs
supply at POUTMAX
POUTVAR_V
1.85 V < VVREGVDD < 3.3 V,
PAVDD connected directly to ex-
ternal supply, for output power = 8
dBm.
—
3.8
—
dB
1.85 V < VVREGVDD < 3.3 V using
DC-DC converter
—
—
2.2
1.5
0.4
—
—
—
dB
dB
Output power variation vs
temperature at POUTMAX
POUTVAR_T
From -40 to +85 °C, PAVDD con-
nected to DC-DC output
Output power variation vs RF POUTVAR_F
frequency at POUTMAX
Over RF tuning frequency range
—
—
dB
RF tuning frequency range
FRANGE
2400
2483.5
MHz
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4.1.8.2 RF Receiver General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TOP = 25 °C,VDD = 3.3 V, DC-DC on. Crystal frequency =38.4 MHz. RF center fre-
quency 2.440 GHz. Conducted measurement from the antenna feedpoint.
Table 4.12. RF Receiver General Characteristics for 2.4 GHz Band
Parameter
Symbol
FRANGE
SPURRX
Test Condition
Min
2400
—
Typ
—
Max
2483.5
—
Unit
MHz
dBm
dBm
dBm
RF tuning frequency range
Receive mode maximum
spurious emission
30 MHz to 1 GHz
1 GHz to 12 GHz
-57
—
-47
—
Max spurious emissions dur- SPURRX_FCC
ing active receive mode, per
FCC Part 15.109(a)
216 MHz to 960 MHz, Conducted
Measurement
—
-55.2
—
Above 960 MHz, Conducted
Measurement
—
—
-47.2
-24
—
—
dBm
dBm
Level above which
RFSENSE will trigger1
RFSENSETRIG
CW at 2.45 GHz
Level below which
RFSENSE will not trigger1
RFSENSETHRES
—
-50
—
dBm
Note:
1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
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4.1.8.3 RF Receiver Characteristics for Bluetooth Smart in the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TOP = 25 °C,VDD = 3.3 V. Crystal frequency = 38.4 MHz. RF center frequency 2.440
GHz. DC-DC on. Conducted measurement from the antenna feedpoint.
Table 4.13. RF Receiver Characteristics for Bluetooth Smart in the 2.4GHz Band
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal is reference signal1. Packet
length is 20 bytes.
Max usable receiver input
level, 0.1% BER
SAT
—
10
—
dBm
30.8% Packet Error Rate2
SENS
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1
—
-92
—
dBm
Signal to co-channel interfer- C/ICC
er, 0.1% BER
Desired signal 3 dB above refer-
ence sensitivity
—
—
—
—
—
—
4
8.3
-27
-32
-32
-27
-25.8
—
—
—
—
—
—
—
—
dB
Blocking, 0.1% BER, Desired BLOCKOOB
is reference signal at -67
dBm. Interferer is CW in
OOB range.
Interferer frequency 30 MHz ≤ f ≤
2000 MHz
dBm
dBm
dBm
dBm
dBm
dBm
Interferer frequency 2003 MHz ≤ f
≤ 2399 MHz
Interferer frequency 2484 MHz ≤ f
≤ 2997 MHz
Interferer frequency 3 GHz ≤ f ≤
12.75 GHz
Intermodulation performance IM
Per Core_4.1, Vol 6, Part A, Sec-
tion 4.4 with n = 3
Upper limit of input power
range over which RSSI reso-
lution is maintained
RSSIMAX
RSSIMIN
RSSIRES
Lower limit of input power
range over which RSSI reso-
lution is maintained
—
—
—
—
-101
0.5
dBm
dB
RSSI resolution
Over RSSIMIN to RSSIMAX
Note:
1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm
2. Receive sensitivity on Bluetooth Smart channel 26 is -86 dBm
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4.1.9 Oscillators
4.1.9.1 LFXO
Table 4.14. LFXO
Parameter
Symbol
Test Condition
Min
—
Typ
Max
—
Unit
kHz
ppm
Crystal frequency
fLFXO
32.768
Overall frequency tolerance
in all conditions1
-100
100
Note:
1. XTAL nominal frequency tolerance = +/- 20 ppm
4.1.9.2 HFXO
Table 4.15. HFXO
Parameter
Symbol
Test Condition
Min
-
Typ
Max
-
Unit
MHz
ppm
Crystal frequency
Crystal frequency tolerance
fHFXO
38.4
-40
40
4.1.9.3 LFRCO
Table 4.16. LFRCO
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Oscillation frequency
fLFRCO
ENVREF = 1 in
30.474
32.768
34.243
kHz
CMU_LFRCOCTRL
ENVREF = 0 in
30.474
32.768
33.915
kHz
CMU_LFRCOCTRL
Startup time
tLFRCO
ILFRCO
—
—
500
342
—
—
μs
Current consumption 1
ENVREF = 1 in
CMU_LFRCOCTRL
nA
ENVREF = 0 in
—
494
—
nA
CMU_LFRCOCTRL
Note:
1. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register
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4.1.9.4 HFRCO and AUXHFRCO
Table 4.17. HFRCO and AUXHFRCO
Test Condition
Parameter
Symbol
fHFRCO
Min
Typ
Max
Unit
Frequency Accuracy
Any frequency band, across sup-
ply voltage and temperature
-2.5
—
2.5
%
Start-up time
tHFRCO
fHFRCO ≥ 19 MHz
4 < fHFRCO < 19 MHz
fHFRCO ≤ 4 MHz
fHFRCO = 38 MHz
fHFRCO = 32 MHz
fHFRCO = 26 MHz
fHFRCO = 19 MHz
fHFRCO = 16 MHz
fHFRCO = 13 MHz
fHFRCO = 7 MHz
fHFRCO = 4 MHz
fHFRCO = 2 MHz
fHFRCO = 1 MHz
Coarse (% of period)
Fine (% of period)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
300
1
—
—
ns
μs
2.5
204
171
147
126
110
100
81
—
μs
Current consumption on all
supplies
IHFRCO
228
190
164
138
120
110
91
μA
μA
μA
μA
μA
μA
μA
33
35
μA
31
35
μA
30
35
μA
Step size
SSHFRCO
0.8
0.1
0.2
—
%
—
%
Period Jitter
PJHFRCO
—
% RMS
4.1.9.5 ULFRCO
Table 4.18. ULFRCO
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
Oscillation frequency
fULFRCO
0.95
1
1.07
kHz
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4.1.10 Flash Memory Characteristics
Table 4.19. Flash Memory Characteristics1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Flash erase cycles before
failure
ECFLASH
10000
—
—
cycles
Flash data retention
RETFLASH
tW_PROG
10
20
—
—
years
μs
Word (32-bit) programming
time
26
40
Page erase time
Mass erase time
tPERASE
tMERASE
tDERASE
IERASE
20
20
—
—
—
27
27
60
—
—
40
40
74
3
ms
ms
ms
mA
mA
Device erase time2
Page erase current3
Mass or Device erase cur-
rent3
5
Write current3
IWRITE
—
—
3
mA
Note:
1. Flash data retention information is published in the Quarterly Quality and Reliability Report.
2. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock
Word (ULW)
3. Measured at 25°C
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4.1.11 GPIO
For the table below, see Figure 3.2 Power Supply Configuration on page 5 on page 5 to see the relation between the modules external
VDD pin and internal voltage supplies. The module itself has only one external power supply input (VDD).
Table 4.20. GPIO
Parameter
Symbol
VIOIL
Test Condition
Min
—
Typ
—
Max
IOVDD*0.3
—
Unit
V
Input low voltage
Input high voltage
VIOIH
IOVDD*0.7
IOVDD*0.8
—
V
Output high voltage relative VIOOH
to IOVDD
Sourcing 3 mA, IOVDD ≥ 3 V,
DRIVESTRENGTH1 = WEAK
—
—
V
Sourcing 1.2 mA, IOVDD ≥ 1.62
V,
IOVDD*0.6
—
—
V
DRIVESTRENGTH1 = WEAK
Sourcing 20 mA, IOVDD ≥ 3 V,
IOVDD*0.8
—
—
—
—
—
—
0.1
—
V
V
DRIVESTRENGTH1 = STRONG
Sourcing 8 mA, IOVDD ≥ 1.62 V,
IOVDD*0.6
—
DRIVESTRENGTH1 = STRONG
Sinking 3 mA, IOVDD ≥ 3 V,
Output low voltage relative to VIOOL
IOVDD
—
—
—
—
—
IOVDD*0.2
IOVDD*0.4
IOVDD*0.2
IOVDD*0.4
30
V
DRIVESTRENGTH1 = WEAK
Sinking 1.2 mA, IOVDD ≥ 1.62 V,
V
DRIVESTRENGTH1 = WEAK
Sinking 20 mA, IOVDD ≥ 3 V,
V
DRIVESTRENGTH1 = STRONG
Sinking 8 mA, IOVDD ≥ 1.62 V,
V
DRIVESTRENGTH1 = STRONG
Input leakage current
IIOLEAK
All GPIO except LFXO pins, GPIO
≤ IOVDD
nA
LFXO Pins, GPIO ≤ IOVDD
—
—
0.1
3.3
50
15
nA
μA
Input leakage current on
I5VTOLLEAK
IOVDD < GPIO ≤ IOVDD + 2 V
5VTOL pads above IOVDD
I/O pin pull-up resistor
RPU
30
30
20
43
43
25
65
65
35
kΩ
kΩ
ns
I/O pin pull-down resistor
RPD
Pulse width of pulses re-
moved by the glitch suppres-
sion filter
tIOGLITCH
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BGM113 Blue Gecko Bluetooth Module Data Sheet
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Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Output fall time, From 70%
to 30% of VIO
tIOOF
CL = 50 pF,
—
1.8
—
ns
DRIVESTRENGTH1 = STRONG,
SLEWRATE1 = 0x6
CL = 50 pF,
—
—
—
4.5
2.2
7.4
—
—
—
ns
ns
ns
DRIVESTRENGTH1 = WEAK,
SLEWRATE1 = 0x6
CL = 50 pF,
Output rise time, From 30% tIOOR
to 70% of VIO
DRIVESTRENGTH1 = STRONG,
SLEWRATE = 0x61
CL = 50 pF,
DRIVESTRENGTH1 = WEAK,
SLEWRATE1 = 0x6
Note:
1. In GPIO_Pn_CTRL register
4.1.12 VMON
Table 4.21. VMON
Test Condition
Parameter
Symbol
IVMON
Min
Typ
Max
Unit
VMON Supply Current
In EM0 or EM1, 1 supply moni-
tored
—
5.8
8.26
μA
In EM0 or EM1, 4 supplies moni-
tored
—
—
—
11.8
62
16.8
—
μA
nA
nA
In EM2, EM3 or EM4, 1 supply
monitored
In EM2, EM3 or EM4, 4 supplies
monitored
99
—
VMON Loading of Monitored ISENSE
Supply
In EM0 or EM1
—
—
2
2
—
—
3.4
—
—
—
—
μA
nA
V
In EM2, EM3 or EM4
Threshold range
VVMON_RANGE
1.62
—
—
Threshold step size
NVMON_STESP
Coarse
200
20
460
26
mV
mV
ns
Fine
—
Response time
Hysteresis
tVMON_RES
Supply drops at 1V/μs rate
—
VVMON_HYST
—
mV
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4.1.13 ADC
For the table below, see Figure 3.2 Power Supply Configuration on page 5 on page 5 to see the relation between the modules external
VDD pin and internal voltage supplies. The module itself has only one external power supply input (VDD).
Table 4.22. ADC
Parameter
Symbol
Test Condition
Min
Typ
—
Max
12
Unit
Bits
V
Resolution
VRESOLUTION
VADCIN
6
0
Input voltage range
Single ended
Differential
—
2*VREF
VREF
VAVDD
-VREF
1
—
V
Input range of external refer- VADCREFIN_P
ence voltage, single ended
and differential
—
V
Power supply rejection1
PSRRADC
At DC
At DC
—
—
80
80
—
—
dB
dB
Analog input common mode CMRRADC
rejection ratio
Current from all supplies, us- IADC_CONTI-
1 Msps / 16 MHz ADCCLK,
—
301
350
μA
ing internal reference buffer.
Continous operation. WAR-
MUPMODE2 = KEEPADC-
WARM
NOUS_LP
BIASPROG = 0, GPBIASACC = 1
3
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 1 3
—
—
149
91
—
—
μA
μA
62.5 ksps / 1 MHz ADCCLK,
BIASPROG = 15, GPBIASACC =
1 3
Current from all supplies, us- IADC_NORMAL_LP 35 ksps / 16 MHz ADCCLK,
ing internal reference buffer.
—
—
—
—
—
51
9
—
—
—
—
—
μA
μA
μA
μA
μA
BIASPROG = 0, GPBIASACC = 1
Duty-cycled operation. WAR-
MUPMODE2 = NORMAL
3
5 ksps / 16 MHz ADCCLK
BIASPROG = 0, GPBIASACC = 1
3
Current from all supplies, us- IADC_STAND-
125 ksps / 16 MHz ADCCLK,
117
79
ing internal reference buffer.
Duty-cycled operation.
AWARMUPMODE2 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
BY_LP
BIASPROG = 0, GPBIASACC = 1
3
35 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 1
3
Current from all supplies, us- IADC_CONTI-
1 Msps / 16 MHz ADCCLK,
345
ing internal reference buffer.
Continous operation. WAR-
MUPMODE2 = KEEPADC-
WARM
NOUS_HP
BIASPROG = 0, GPBIASACC = 0
3
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 0 3
—
—
191
132
—
—
μA
μA
62.5 ksps / 1 MHz ADCCLK,
BIASPROG = 15, GPBIASACC =
0 3
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Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current from all supplies, us- IADC_NORMAL_HP 35 ksps / 16 MHz ADCCLK,
ing internal reference buffer.
—
102
—
μA
BIASPROG = 0, GPBIASACC = 0
Duty-cycled operation. WAR-
3
MUPMODE2 = NORMAL
5 ksps / 16 MHz ADCCLK
—
—
—
17
—
—
—
μA
μA
μA
BIASPROG = 0, GPBIASACC = 0
3
Current from all supplies, us- IADC_STAND-
125 ksps / 16 MHz ADCCLK,
162
123
ing internal reference buffer.
BY_HP
BIASPROG = 0, GPBIASACC = 0
3
Duty-cycled operation.
AWARMUPMODE2 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
35 ksps / 16 MHz ADCCLK,
BIASPROG = 0, GPBIASACC = 0
3
Current from HFPERCLK
ADC Clock Frequency
Throughput rate
IADC_CLK
fADCCLK
fADCRATE
tADCCONV
HFPERCLK = 16 MHz
—
—
—
—
—
—
—
140
—
—
7
—
16
1
μA
MHz
Msps
cycles
cycles
cycles
μs
Conversion time4
6 bit
8 bit
12 bit
—
—
—
5
9
13
—
WARMUPMODE2 = NORMAL
Startup time of reference
generator and ADC core
tADCSTART
WARMUPMODE2 = KEEPIN-
STANDBY
—
—
2
μs
WARMUPMODE2 = KEEPINSLO-
WACC
—
—
1
μs
SNDR at 1Msps and fin
10kHz
=
SNDRADC
Internal reference, 2.5 V full-scale,
differential (-1.25, 1.25)
58
—
—
—
67
68
—
—
—
—
dB
dB
dB
μV
vrefp_in = 1.25 V direct mode with
2.5 V full-scale, differential
Spurious-Free Dynamic
Range (SFDR)
SFDRADC
1 MSamples/s, 10 kHz full-scale
sine wave
75
Input referred ADC noise,
rms
VREF_NOISE
Including quantization noise and
distortion
380
Offset Error
VADCOFFSETERR
VADC_GAIN
-3
—
—
-1
0.25
-0.2
-1
3
5
LSB
%
Gain error in ADC
Using internal reference
Using external reference
12 bit resolution
—
2
%
Differential non-linearity
(DNL)
DNLADC
INLADC
—
LSB
Integral non-linearity (INL),
End point method
12 bit resolution
-6
—
6
LSB
Temperature Sensor Slope
VTS_SLOPE
—
-1.84
—
mV/°C
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Parameter
Note:
Symbol
Test Condition
Min
Typ
Max
Unit
1. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL
2. In ADCn_CNTL register
3. In ADCn_BIASPROG register
4. Derived from ADCCLK
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4.1.14 IDAC
For the table below, see Figure 3.2 Power Supply Configuration on page 5 on page 5 to see the relation between the modules external
VDD pin and internal voltage supplies. The module itself has only one external power supply input (VDD).
Table 4.23. IDAC
Parameter
Symbol
Test Condition
Min
—
Typ
4
Max
—
Unit
-
Number of Ranges
Output Current
NIDAC_RANGES
IIDAC_OUT
RANGSEL1 = RANGE0
RANGSEL1 = RANGE1
RANGSEL1 = RANGE2
RANGSEL1 = RANGE3
0.05
—
1.6
μA
1.6
0.5
2
—
—
—
32
4.7
16
64
—
μA
μA
μA
Linear steps within each
range
NIDAC_STEPS
—
RANGSEL1 = RANGE0
RANGSEL1 = RANGE1
RANGSEL1 = RANGE2
RANGSEL1 = RANGE3
Step size
SSIDAC
—
—
—
—
-2
50
100
500
2
—
—
—
—
2
nA
nA
nA
μA
%
Total Accuracy, STEPSEL1 =
0x10
ACCIDAC
EM0 or EM1, AVDD=3.3 V, T = 25
°C
—
EM0 or EM1
-18
—
—
-2
22
—
%
%
EM2 or EM3, Source mode,
RANGSEL1 = RANGE0,
AVDD=3.3 V, T = 25 °C
EM2 or EM3, Source mode,
RANGSEL1 = RANGE1,
AVDD=3.3 V, T = 25 °C
—
—
—
—
—
—
—
-1.7
-0.8
-0.5
-0.7
-0.6
-0.5
-0.5
—
—
—
—
—
—
—
%
%
%
%
%
%
%
EM2 or EM3, Source mode,
RANGSEL1 = RANGE2,
AVDD=3.3 V, T = 25 °C
EM2 or EM3, Source mode,
RANGSEL1 = RANGE3,
AVDD=3.3 V, T = 25 °C
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE0, AVDD=3.3 V, T
= 25 °C
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE1, AVDD=3.3 V, T
= 25 °C
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE2, AVDD=3.3 V, T
= 25 °C
EM2 or EM3, Sink mode, RANG-
SEL1 = RANGE3, AVDD=3.3 V, T
= 25 °C
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Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Start up time
tIDAC_SU
Output within 1% of steady state
value
—
5
—
μs
Settling time, (output settled tIDAC_SETTLE
within 1% of steady state val-
ue)
Range setting is changed
Step value is changed
—
—
5
1
—
—
μs
μs
Current consumption in EM0 IIDAC
or EM1 2
Source mode, excluding output
current
—
—
—
8.9
12
13
16
—
μA
μA
μA
Sink mode, excluding output cur-
rent
Current consumption in EM2
or EM32
Source mode, excluding output
current, duty cycle mode, T = 25
°C
1.04
Sink mode, excluding output cur-
rent, duty cycle mode, T = 25 °C
—
—
1.08
8.9
—
—
μA
μA
Source mode, excluding output
current, duty cycle mode, T ≥ 85
°C
Sink mode, excluding output cur-
rent, duty cycle mode, T ≥ 85 °C
—
—
12
—
—
μA
%
Output voltage compliance in ICOMP_SRC
source mode, source current
change relative to current
sourced at 0 V
RANGESEL1=0, output voltage =
min(VIOVDD, VAVDD2-100 mv)
0.04
RANGESEL1=1, output voltage =
min(VIOVDD, VAVDD2-100 mV)
—
—
—
0.02
0.02
0.02
—
—
—
%
%
%
RANGESEL1=2, output voltage =
min(VIOVDD, VAVDD2-150 mV)
RANGESEL1=3, output voltage =
min(VIOVDD, VAVDD2-250 mV)
Output voltage compliance in ICOMP_SINK
sink mode, sink current
change relative to current
sunk at IOVDD
RANGESEL1=0, output voltage =
100 mV
—
—
—
—
0.18
0.12
0.08
0.02
—
—
—
—
%
%
%
%
RANGESEL1=1, output voltage =
100 mV
RANGESEL1=2, output voltage =
150 mV
RANGESEL1=3, output voltage =
250 mV
Note:
1. In IDAC_CURPROG register
2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and
PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be-
tween AVDD (0) and DVDD (1).
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4.1.15 Analog Comparator (ACMP)
Table 4.24. ACMP
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input voltage range
VACMPIN
ACMPVDD =
ACMPn_CTRL_PWRSEL 1
0
—
VACMPVDD
V
BIASPROG2 ≤ 0x10 or FULL-
BIAS2 = 0
Supply Voltage
VACMPVDD
1.85
2.1
—
—
VVREGVDD_
V
V
MAX
0x10 < BIASPROG2 ≤ 0x20 and
FULLBIAS2 = 1
VVREGVDD_
MAX
BIASPROG2 = 1, FULLBIAS2 = 0
Active current not including
voltage reference
IACMP
—
—
50
—
—
nA
nA
BIASPROG2 = 0x10, FULLBIAS2
= 0
306
BIASPROG2 = 0x20, FULLBIAS2
= 1
—
—
74
50
95
—
μA
nA
Current consumption of inter- IACMPREF
nal voltage reference
VLP selected as input using 2.5 V
Reference / 4 (0.625 V)
VLP selected as input using VDD
—
—
20
—
—
nA
μA
VBDIV selected as input using
1.25 V reference / 1
4.1
VADIV selected as input using
VDD/1
—
2.4
—
μA
HYSTSEL3 = HYST0
HYSTSEL3 = HYST1
HYSTSEL3 = HYST2
HYSTSEL3 = HYST3
HYSTSEL3 = HYST4
HYSTSEL3 = HYST5
HYSTSEL3 = HYST6
HYSTSEL3 = HYST7
HYSTSEL3 = HYST8
HYSTSEL3 = HYST9
HYSTSEL3 = HYST10
HYSTSEL3 = HYST11
HYSTSEL3 = HYST12
HYSTSEL3 = HYST13
HYSTSEL3 = HYST14
HYSTSEL3 = HYST15
Hysteresis (VCM = 1.25 V,
BIASPROG2 = 0x10, FULL-
BIAS2 = 1)
VACMPHYST
-1.75
10
0
1.75
26
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
18
32
44
55
65
77
86
0
21
46
27
63
32
80
38
100
121
148
4
43
47
-4
-27
-47
-64
-78
-93
-113
-135
-18
-32
-43
-54
-64
-74
-85
-10
-18
-27
-32
-37
-42
-47
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Comparator delay4
BIASPROG2 = 1, FULLBIAS2 = 0
tACMPDELAY
—
30
—
μs
BIASPROG2 = 0x10, FULLBIAS2
= 0
—
3.7
35
—
—
—
35
μs
BIASPROG2 = 0x20, FULLBIAS2
= 1
—
ns
BIASPROG2 =0x10, FULLBIAS2
= 1
Offset voltage
VACMPOFFSET
-35
mV
Reference Voltage
VACMPREF
Internal 1.25 V reference
Internal 2.5 V reference
1
2
1.25
2.5
inf
1.47
2.8
—
V
V
CSRESSEL5 = 0
CSRESSEL5 = 1
CSRESSEL5 = 2
CSRESSEL5 = 3
CSRESSEL5 = 4
CSRESSEL5 = 5
CSRESSEL5 = 6
CSRESSEL5 = 7
Capacitive Sense Internal
Resistance
RCSRES
—
kΩ
—
—
—
—
—
—
—
15
27
—
—
—
—
—
—
—
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
39
51
102
164
239
Note:
1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD
2. In ACMPn_CTRL register
3. In ACMPn_HYSTERESIS register
4. ±100 mV differential drive
5. In ACMPn_INPUTSEL register
The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference as given as:
IACMPTOTAL = IACMP + IACMPREF
IACMPREF is zero if an external voltage reference is used.
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4.1.16 I2C
I2C Standard-mode (Sm)
Table 4.25. I2C Standard-mode (Sm)1
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
SCL clock frequency2
SCL clock low time
SCL clock high time
SDA set-up time
fSCL
0
—
100
kHz
tLOW
4.7
4
—
—
—
—
—
—
—
μs
μs
ns
ns
μs
tHIGH
tSU,DAT
tHD,DAT
250
100
4.7
—
SDA hold time3
3450
—
Repeated START condition tSU,STA
set-up time
(Repeated) START condition tHD,STA
hold time
4
—
—
μs
STOP condition set-up time tSU,STO
4
—
—
—
—
μs
μs
Bus free time between a
tBUF
4.7
STOP and START condition
Note:
1. For CLHR set to 0 in the I2Cn_CTRL register
2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual
3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW
)
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I2C Fast-mode (Fm)
Parameter
Table 4.26. I2C Fast-mode (Fm)1
Test Condition
Symbol
Min
Typ
Max
Unit
SCL clock frequency2
SCL clock low time
SCL clock high time
SDA set-up time
fSCL
0
—
400
kHz
tLOW
1.3
0.6
—
—
—
—
—
—
—
μs
μs
ns
ns
μs
tHIGH
tSU,DAT
tHD,DAT
100
100
0.6
—
SDA hold time3
900
—
Repeated START condition tSU,STA
set-up time
(Repeated) START condition tHD,STA
hold time
0.6
—
—
μs
STOP condition set-up time tSU,STO
0.6
1.3
—
—
—
—
μs
μs
Bus free time between a
tBUF
STOP and START condition
Note:
1. For CLHR set to 1 in the I2Cn_CTRL register
2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual
3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW
)
I2C Fast-mode Plus (Fm+)
Table 4.27. I2C Fast-mode Plus (Fm+)1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
SCL clock frequency2
SCL clock low time
SCL clock high time
SDA set-up time
fSCL
0
—
1000
kHz
tLOW
0.5
0.26
50
—
—
—
—
—
—
—
—
—
—
μs
μs
ns
ns
μs
tHIGH
tSU,DAT
tHD,DAT
SDA hold time
100
0.26
Repeated START condition tSU,STA
set-up time
(Repeated) START condition tHD,STA
hold time
0.26
—
—
μs
STOP condition set-up time tSU,STO
0.26
0.5
—
—
—
—
μs
μs
Bus free time between a
tBUF
STOP and START condition
Note:
1. For CLHR set to 0 or 1 in the I2Cn_CTRL register
2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.1.17 USART SPI
SPI Master Timing
Table 4.28. SPI Master Timing
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
SCLK period 1 2
tSCLK
2 *
tHFPERCLK
—
—
ns
CS to MOSI 1 2
tCS_MO
tSCLK_MO
tSU_MI
0
3
—
—
8
ns
ns
SCLK to MOSI 1 2
MISO setup time 1 2
20
IOVDD = 1.62 V
IOVDD = 3.0 V
56
37
6
—
—
—
—
—
—
ns
ns
ns
MISO hold time 1 2
tH_MI
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0)
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD
)
tCS_MO
CS
tSCKL_MO
SCLK
CLKPOL = 0
tSCLK
SCLK
CLKPOL = 1
MOSI
MISO
tSU_MI
tH_MI
Figure 4.1. SPI Master Timing Diagram
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
SPI Slave Timing
Table 4.29. SPI Slave Timing
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
SCKL period 1 2
tSCLK_sl
2 *
tHFPERCLK
—
—
ns
SCLK high period1 2
SCLK low period 1 2
tSCLK_hi
3 *
tHFPERCLK
—
—
—
—
ns
ns
tSCLK_lo
3 *
tHFPERCLK
CS active to MISO 1 2
CS disable to MISO 1 2
MOSI setup time 1 2
MOSI hold time 1 2
tCS_ACT_MI
tCS_DIS_MI
tSU_MO
4
4
4
—
—
—
—
50
50
—
—
ns
ns
ns
ns
tH_MO
3 + 2 *
tHFPERCLK
SCLK to MISO 1 2
tSCLK_MI
16 +
tHFPERCLK
—
66 + 2 *
tHFPERCLK
ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0)
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD
)
tCS_ACT_MI
CS
tCS_DIS_MI
SCLK
CLKPOL = 0
tSCLK_HI
tSCLK_LO
SCLK
tSU_MO
CLKPOL = 1
tSCLK
tH_MO
MOSI
MISO
tSCLK_MI
Figure 4.2. SPI Slave Timing Diagram
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Typical Connection Diagrams
5. Typical Connection Diagrams
5.1 Power, Ground, Debug and Host UART
Typical power supply, ground and MCU debug and host (NCP) UART connections are shown in the figure below.
Note: The Module Reset signal is recommended to be connected to a GPIO line on the Host CPU.
Figure 5.1. BGM113 Connected to a Host CPU with Typical Power Supply, Ground and Debug connections
5.2 SPI Peripheral Connection
The figure below shows how to connect a SPI peripheral device
Figure 5.2. SPI Peripheral Connections
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Typical Connection Diagrams
5.3 I2C Peripheral Connection
The figure below shows how to connect an I2C peripheral.
Figure 5.3. BGM113 Module Connected with I2C Device
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Layout Guidelines
6. Layout Guidelines
For optimal performance of the BGM113, please follow the PCB layout guidelines and ground plane recommendations indicated in this
section.
6.1 Recommended Placement on the Application PCB
For optimal performance of the BGM113 Module, please follow these guidelines:
• Place the module at the edge of the PCB, as shown in the figure below.
• Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna (shown in the figure below).
• Connect all ground pads directly to a solid ground plane.
• Place the ground vias as close to the ground pads as possible.
• Do not place plastic or any other dielectric material in touch with the antenna.
Figure 6.1. Recommended Application PCB Layout for the BGM113 Module
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Layout Guidelines
The layouts in the next figure will result in severely degraded RF-performance.
Figure 6.2. Non-optimal Application PCB Layouts for the BGM113 Module
Figure 6.3. Effect of Ground Plane on Antenna Efficiency for the BGM113
6.2 Effect of Plastic and Metal Materials
Do not place plastic or any other dielectric material in closs proximity to the antenna.
Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-
tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB
ground planes.
6.3 Locating the Module Close to Human Body
Placing the module in touch or very close to the human body will negatively impact antenna efficiency and reduce range.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Layout Guidelines
6.4 2D Radiation Pattern Plots
Figure 6.4. Typical 2D Radiation Pattern – Front View
Figure 6.5. Typical 2D Radiation Pattern – Side View
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Layout Guidelines
Figure 6.6. Typical 2D Radiation Pattern – Top View
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
7. Pin Definitions
7.1 BGM113 Definition
Figure 7.1. BGM113 Pinout
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Table 7.1. Device Pinout
Pin# and Name
Pin Alternate Functionality / Description
Pin
#
Pin Name
Analog
Timers
Communication
Radio
Other
1-7,
18,
25,
36
GND
Ground
US0_TX #24
US0_RX #23
US0_CLK #22
US0_CS #21
US0_CTS #20
US0_RTS #19
US1_TX #24
US1_RX #23
US1_CLK #22
US1_CS #21
US1_CTS #20
US1_RTS #19
LEU0_TX #24
LEU0_RX #23
I2C0_SDA #24
I2C0_SCL #23
TIM0_CC0 #24
TIM0_CC1 #23
TIM0_CC2 #22
TIM0_CDTI0 #21
TIM0_CDTI1 #20
TIM0_CDTI2 #19
TIM1_CC0 #24
BUSAX [ADC0:
APORT1XCH16
ACMP0:
APORT1XCH16
ACMP1:
FRC_DCLK #24
FRC_DOUT #23
FRC_DFRAME #22
MODEM_DCLK #24
MODEM_DIN #23
MODEM_DOUT #22
PRS_CH0 #0
PRS_CH1 #7
PRS_CH2 #6
PRS_CH3 #5
ACMP0_O #24
ACMP1_O #24
APORT1XCH16]
10
PF0
PF1
PF2
TIM1_CC1 #23
TIM1_CC2 #22
BUSBY [ADC0:
APORT2YCH16
ACMP0:
APORT2YCH16
ACMP1:
TIM1_CC3 #21 LE-
TIM0_OUT0 #24
LETIM0_OUT1 #23
PCNT0_S0IN #24
PCNT0_S1IN #23
MODEM_ANT0 #21 DBG_SWCLKTCK
MODEM_ANT1 #20
#0
APORT2YCH16]
US0_TX #25
US0_RX #24
US0_CLK #23
US0_CS #22
US0_CTS #21
US0_RTS #20
US1_TX #25
US1_RX #24
US1_CLK #23
US1_CS #22
US1_CTS #21
US1_RTS #20
LEU0_TX #25
LEU0_RX #24
I2C0_SDA #25
I2C0_SCL #24
TIM0_CC0 #25
TIM0_CC1 #24
TIM0_CC2 #23
TIM0_CDTI0 #22
TIM0_CDTI1 #21
TIM0_CDTI2 #20
TIM1_CC0 #25
BUSAY [ADC0:
APORT1YCH17
ACMP0:
APORT1YCH17
ACMP1:
FRC_DCLK #25
FRC_DOUT #24
FRC_DFRAME #23
MODEM_DCLK #25
MODEM_DIN #24
MODEM_DOUT #23
PRS_CH0 #1
PRS_CH1 #0
PRS_CH2 #7
PRS_CH3 #6
ACMP0_O #25
ACMP1_O #25
APORT1YCH17]
9
TIM1_CC1 #24
TIM1_CC2 #23
BUSBX [ADC0:
APORT2XCH17
ACMP0:
APORT2XCH17
ACMP1:
TIM1_CC3 #22 LE-
TIM0_OUT0 #25
LETIM0_OUT1 #24
PCNT0_S0IN #25
PCNT0_S1IN #24
MODEM_ANT0 #22 DBG_SWDIOTMS
MODEM_ANT1 #21
#0
APORT2XCH17]
US0_TX #26
US0_RX #25
US0_CLK #24
US0_CS #23
US0_CTS #22
US0_RTS #21
US1_TX #26
US1_RX #25
US1_CLK #24
US1_CS #23
US1_CTS #22
US1_RTS #21
LEU0_TX #26
LEU0_RX #25
I2C0_SDA #26
I2C0_SCL #25
TIM0_CC0 #26
TIM0_CC1 #25
TIM0_CC2 #24
TIM0_CDTI0 #23
TIM0_CDTI1 #22
TIM0_CDTI2 #21
TIM1_CC0 #26
BUSAX [ADC0:
APORT1XCH18
ACMP0:
APORT1XCH18
ACMP1:
CMU_CLK0 #6
PRS_CH0 #2
PRS_CH1 #1
PRS_CH2 #0
PRS_CH3 #7
ACMP0_O #26
ACMP1_O #26
DBG_TDO #0
DBG_SWO #0
GPIO_EM4WU0
FRC_DCLK #26
FRC_DOUT #25
FRC_DFRAME #24
MODEM_DCLK #26
MODEM_DIN #25
MODEM_DOUT #24
MODEM_ANT0 #23
MODEM_ANT1 #22
APORT1XCH18]
19,
30
TIM1_CC1 #25
TIM1_CC2 #24
BUSBY [ADC0:
APORT2YCH18
ACMP0:
APORT2YCH18
ACMP1:
TIM1_CC3 #23 LE-
TIM0_OUT0 #26
LETIM0_OUT1 #25
PCNT0_S0IN #26
PCNT0_S1IN #25
APORT2YCH18]
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin# and Name
Pin Alternate Functionality / Description
Pin
#
Pin Name
Analog
Timers
Communication
Radio
Other
US0_TX #27
US0_RX #26
US0_CLK #25
US0_CS #24
US0_CTS #23
US0_RTS #22
US1_TX #27
US1_RX #26
US1_CLK #25
US1_CS #24
US1_CTS #23
US1_RTS #22
LEU0_TX #27
LEU0_RX #26
I2C0_SDA #27
I2C0_SCL #26
TIM0_CC0 #27
TIM0_CC1 #26
TIM0_CC2 #25
TIM0_CDTI0 #24
TIM0_CDTI1 #23
TIM0_CDTI2 #22
TIM1_CC0 #27
BUSAY [ADC0:
APORT1YCH19
ACMP0:
APORT1YCH19
ACMP1:
FRC_DCLK #27
FRC_DOUT #26
CMU_CLK1 #6
PRS_CH0 #3
PRS_CH1 #2
PRS_CH2 #1
PRS_CH3 #0
ACMP0_O #27
ACMP1_O #27
DBG_TDI #0
FRC_DFRAME #25
MODEM_DCLK #27
MODEM_DIN #26
MODEM_DOUT #25
MODEM_ANT0 #24
MODEM_ANT1 #23
APORT1YCH19]
20,
31
PF3
TIM1_CC1 #26
TIM1_CC2 #25
BUSBX [ADC0:
APORT2XCH19
ACMP0:
APORT2XCH19
ACMP1:
TIM1_CC3 #24 LE-
TIM0_OUT0 #27
LETIM0_OUT1 #26
PCNT0_S0IN #27
PCNT0_S1IN #26
APORT2XCH19]
8,
17
VDD
Radio power supply
Reset input, active low.To apply an external reset source to this pin, it is required to only drive this pin low
during reset, and let the internal pull-up ensure that reset is released.
34
RESETn
US0_TX #21
BUSCY [ADC0:
APORT3YCH5
ACMP0:
APORT3YCH5
ACMP1:
APORT3YCH5
IDAC0:
TIM0_CC0 #21
TIM0_CC1 #20
TIM0_CC2 #19
TIM0_CDTI0 #18
TIM0_CDTI1 #17
TIM0_CDTI2 #16
TIM1_CC0 #21
US0_RX #20
US0_CLK #19
US0_CS #18
US0_CTS #17
US0_RTS #16
US1_TX #21
US1_RX #20
US1_CLK #19
US1_CS #18
US1_CTS #17
US1_RTS #16
LEU0_TX #21
LEU0_RX #20
I2C0_SDA #21
I2C0_SCL #20
FRC_DCLK #21
FRC_DOUT #20
PRS_CH3 #12
PRS_CH4 #4
PRS_CH5 #3
PRS_CH6 #15
ACMP0_O #21
ACMP1_O #21
FRC_DFRAME #19
MODEM_DCLK #21
MODEM_DIN #20
MODEM_DOUT #19
MODEM_ANT0 #18
MODEM_ANT1 #17
11,
33
PD13
APORT1YCH5]
TIM1_CC1 #20
TIM1_CC2 #19
BUSDX [ADC0:
APORT4XCH5
ACMP0:
APORT4XCH5
ACMP1:
TIM1_CC3 #18 LE-
TIM0_OUT0 #21
LETIM0_OUT1 #20
PCNT0_S0IN #21
PCNT0_S1IN #20
APORT4XCH5]
US0_TX #22
US0_RX #21
US0_CLK #20
US0_CS #19
US0_CTS #18
US0_RTS #17
US1_TX #22
US1_RX #21
US1_CLK #20
US1_CS #19
US1_CTS #18
US1_RTS #17
LEU0_TX #22
LEU0_RX #21
I2C0_SDA #22
I2C0_SCL #21
BUSCX [ADC0:
APORT3XCH6
ACMP0:
APORT3XCH6
ACMP1:
APORT3XCH6
IDAC0:
APORT1XCH6]
TIM0_CC0 #22
TIM0_CC1 #21
TIM0_CC2 #20
TIM0_CDTI0 #19
TIM0_CDTI1 #18
TIM0_CDTI2 #17
TIM1_CC0 #22
FRC_DCLK #22
FRC_DOUT #21
CMU_CLK0 #5
PRS_CH3 #13
PRS_CH4 #5
FRC_DFRAME #20
MODEM_DCLK #22
MODEM_DIN #21
MODEM_DOUT #20
MODEM_ANT0 #19
MODEM_ANT1 #18
PRS_CH5 #4
32
PD14
TIM1_CC1 #21
TIM1_CC2 #20
PRS_CH6 #16
ACMP0_O #22
ACMP1_O #22
GPIO_EM4WU4
BUSDY [ADC0:
APORT4YCH6
ACMP0:
APORT4YCH6
ACMP1:
TIM1_CC3 #19 LE-
TIM0_OUT0 #22
LETIM0_OUT1 #21
PCNT0_S0IN #22
PCNT0_S1IN #21
APORT4YCH6]
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin# and Name
Pin Alternate Functionality / Description
Pin
#
Pin Name
Analog
Timers
Communication
Radio
Other
US0_TX #23
US0_RX #22
US0_CLK #21
US0_CS #20
US0_CTS #19
US0_RTS #18
US1_TX #23
US1_RX #22
US1_CLK #21
US1_CS #20
US1_CTS #19
US1_RTS #18
LEU0_TX #23
LEU0_RX #22
I2C0_SDA #23
I2C0_SCL #22
BUSCY [ADC0:
APORT3YCH7
ACMP0:
APORT3YCH7
ACMP1:
APORT3YCH7
IDAC0:
APORT1YCH7]
TIM0_CC0 #23
TIM0_CC1 #22
TIM0_CC2 #21
TIM0_CDTI0 #20
TIM0_CDTI1 #19
TIM0_CDTI2 #18
TIM1_CC0 #23
FRC_DCLK #23
FRC_DOUT #22
CMU_CLK1 #5
PRS_CH3 #14
PRS_CH4 #6
PRS_CH5 #5
PRS_CH6 #17
ACMP0_O #23
ACMP1_O #23
DBG_SWO #2
FRC_DFRAME #21
MODEM_DCLK #23
MODEM_DIN #22
MODEM_DOUT #21
MODEM_ANT0 #20
MODEM_ANT1 #19
24,
26
PD15
TIM1_CC1 #22
TIM1_CC2 #21
BUSDX [ADC0:
APORT4XCH7
ACMP0:
APORT4XCH7
ACMP1:
TIM1_CC3 #20 LE-
TIM0_OUT0 #23
LETIM0_OUT1 #22
PCNT0_S0IN #23
PCNT0_S1IN #22
APORT4XCH7]
ADC0_EXTN
US0_TX #0
US0_RX #31
US0_CLK #30
US0_CS #29
US0_CTS #28
US0_RTS #27
US1_TX #0
US1_RX #31
US1_CLK #30
US1_CS #29
US1_CTS #28
US1_RTS #27
LEU0_TX #0
LEU0_RX #31
I2C0_SDA #0
I2C0_SCL #31
TIM0_CC0 #0
TIM0_CC1 #31
TIM0_CC2 #30
TIM0_CDTI0 #29
TIM0_CDTI1 #28
TIM0_CDTI2 #27
TIM1_CC0 #0
TIM1_CC1 #31
TIM1_CC2 #30
TIM1_CC3 #29 LE-
TIM0_OUT0 #0 LE-
TIM0_OUT1 #31
PCNT0_S0IN #0
PCNT0_S1IN #31
BUSCX [ADC0:
APORT3XCH8
ACMP0:
APORT3XCH8
ACMP1:
APORT3XCH8
IDAC0:
APORT1XCH8]
FRC_DCLK #0
FRC_DOUT #31
CMU_CLK1 #0
PRS_CH6 #0
PRS_CH7 #10
PRS_CH8 #9
PRS_CH9 #8
ACMP0_O #0
ACMP1_O #0
FRC_DFRAME #30
MODEM_DCLK #0
MODEM_DIN #31
MODEM_DOUT #30
MODEM_ANT0 #29
MODEM_ANT1 #28
23,
27
PA0
BUSDY [ADC0:
APORT4YCH8
ACMP0:
APORT4YCH8
ACMP1:
APORT4YCH8]
ADC0_EXTP
US0_TX #1
US0_RX #0
TIM0_CC0 #1
TIM0_CC1 #0
BUSCY [ADC0:
APORT3YCH9
ACMP0:
APORT3YCH9
ACMP1:
APORT3YCH9
IDAC0:
APORT1YCH9]
US0_CLK #31
US0_CS #30
US0_CTS #29
US0_RTS #28
US1_TX #1
TIM0_CC2 #31
TIM0_CDTI0 #30
TIM0_CDTI1 #29
TIM0_CDTI2 #28
TIM1_CC0 #1
FRC_DCLK #1
FRC_DOUT #0
FRC_DFRAME #31
MODEM_DCLK #1
MODEM_DIN #0
MODEM_DOUT #31
MODEM_ANT0 #30
MODEM_ANT1 #29
CMU_CLK0 #0
PRS_CH6 #1
PRS_CH7 #0
PRS_CH8 #10
PRS_CH9 #9
ACMP0_O #1
ACMP1_O #1
US1_RX #0
12
PA1
TIM1_CC1 #0
US1_CLK #31
US1_CS #30
US1_CTS #29
US1_RTS #28
LEU0_TX #1
LEU0_RX #0
I2C0_SDA #1
I2C0_SCL #0
TIM1_CC2 #31
TIM1_CC3 #30 LE-
TIM0_OUT0 #1 LE-
TIM0_OUT1 #0
PCNT0_S0IN #1
PCNT0_S1IN #0
BUSDX [ADC0:
APORT4XCH9
ACMP0:
APORT4XCH9
ACMP1:
APORT4XCH9]
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin# and Name
Pin Alternate Functionality / Description
Pin
#
Pin Name
Analog
Timers
Communication
Radio
Other
US0_TX #6
US0_RX #5
US0_CLK #4
US0_CS #3
US0_CTS #2
US0_RTS #1
US1_TX #6
US1_RX #5
US1_CLK #4
US1_CS #3
US1_CTS #2
US1_RTS #1
LEU0_TX #6
LEU0_RX #5
I2C0_SDA #6
I2C0_SCL #5
BUSCY [ADC0:
APORT3YCH27
ACMP0:
APORT3YCH27
ACMP1:
APORT3YCH27
IDAC0:
APORT1YCH27]
TIM0_CC0 #6
TIM0_CC1 #5
TIM0_CC2 #4
TIM0_CDTI0 #3
TIM0_CDTI1 #2
TIM0_CDTI2 #1
TIM1_CC0 #6
FRC_DCLK #6
FRC_DOUT #5
PRS_CH6 #6
PRS_CH7 #5
PRS_CH8 #4
PRS_CH9 #3
ACMP0_O #6
ACMP1_O #6
FRC_DFRAME #4
MODEM_DCLK #6
MODEM_DIN #5
MODEM_DOUT #4
MODEM_ANT0 #3
MODEM_ANT1 #2
15
PB11
TIM1_CC1 #5
TIM1_CC2 #4
BUSDX [ADC0:
APORT4XCH27
ACMP0:
APORT4XCH27
ACMP1:
TIM1_CC3 #3 LE-
TIM0_OUT0 #6 LE-
TIM0_OUT1 #5
PCNT0_S0IN #6
PCNT0_S1IN #5
APORT4XCH27]
US0_TX #7
US0_RX #6
US0_CLK #5
US0_CS #4
US0_CTS #3
US0_RTS #2
US1_TX #7
US1_RX #6
US1_CLK #5
US1_CS #4
US1_CTS #3
US1_RTS #2
LEU0_TX #7
LEU0_RX #6
I2C0_SDA #7
I2C0_SCL #6
BUSCX [ADC0:
APORT3XCH28
ACMP0:
APORT3XCH28
ACMP1:
APORT3XCH28
IDAC0:
APORT1XCH28]
TIM0_CC0 #7
TIM0_CC1 #6
TIM0_CC2 #5
TIM0_CDTI0 #4
TIM0_CDTI1 #3
TIM0_CDTI2 #2
TIM1_CC0 #7
FRC_DCLK #7
FRC_DOUT #6
PRS_CH6 #7
PRS_CH7 #6
PRS_CH8 #5
PRS_CH9 #4
ACMP0_O #7
ACMP1_O #7
FRC_DFRAME #5
MODEM_DCLK #7
MODEM_DIN #6
MODEM_DOUT #5
MODEM_ANT0 #4
MODEM_ANT1 #3
14
PB12
TIM1_CC1 #6
TIM1_CC2 #5
BUSDY [ADC0:
APORT4YCH28
ACMP0:
APORT4YCH28
ACMP1:
TIM1_CC3 #4 LE-
TIM0_OUT0 #7 LE-
TIM0_OUT1 #6
PCNT0_S0IN #7
PCNT0_S1IN #6
APORT4YCH28]
US0_TX #8
US0_RX #7
US0_CLK #6
US0_CS #5
US0_CTS #4
US0_RTS #3
US1_TX #8
US1_RX #7
US1_CLK #6
US1_CS #5
US1_CTS #4
US1_RTS #3
LEU0_TX #8
LEU0_RX #7
I2C0_SDA #8
I2C0_SCL #7
BUSCY [ADC0:
APORT3YCH29
ACMP0:
APORT3YCH29
ACMP1:
APORT3YCH29
IDAC0:
APORT1YCH29]
TIM0_CC0 #8
TIM0_CC1 #7
TIM0_CC2 #6
TIM0_CDTI0 #5
TIM0_CDTI1 #4
TIM0_CDTI2 #3
TIM1_CC0 #8
FRC_DCLK #8
FRC_DOUT #7
PRS_CH6 #8
PRS_CH7 #7
PRS_CH8 #6
PRS_CH9 #5
ACMP0_O #8
ACMP1_O #8
DBG_SWO #1
GPIO_EM4WU9
FRC_DFRAME #6
MODEM_DCLK #8
MODEM_DIN #7
MODEM_DOUT #6
MODEM_ANT0 #5
MODEM_ANT1 #4
13
PB13
TIM1_CC1 #7
TIM1_CC2 #6
BUSDX [ADC0:
APORT4XCH29
ACMP0:
APORT4XCH29
ACMP1:
TIM1_CC3 #5 LE-
TIM0_OUT0 #8 LE-
TIM0_OUT1 #7
PCNT0_S0IN #8
PCNT0_S1IN #7
APORT4XCH29]
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Pin# and Name
Pin Alternate Functionality / Description
Pin
#
Pin Name
Analog
Timers
Communication
Radio
Other
US0_TX #15
US0_RX #14
US0_CLK #13
US0_CS #12
US0_CTS #11
US0_RTS #10
US1_TX #15
US1_RX #14
US1_CLK #13
US1_CS #12
US1_CTS #11
US1_RTS #10
LEU0_TX #15
LEU0_RX #14
I2C0_SDA #15
I2C0_SCL #14
TIM0_CC0 #15
TIM0_CC1 #14
TIM0_CC2 #13
TIM0_CDTI0 #12
TIM0_CDTI1 #11
TIM0_CDTI2 #10
TIM1_CC0 #15
BUSAX [ADC0:
APORT1XCH10
ACMP0:
APORT1XCH10
ACMP1:
FRC_DCLK #15
FRC_DOUT #14
CMU_CLK1 #3
PRS_CH0 #12
PRS_CH9 #15
PRS_CH10 #4
PRS_CH11 #3
ACMP0_O #15
ACMP1_O #15
GPIO_EM4WU12
FRC_DFRAME #13
MODEM_DCLK #15
MODEM_DIN #14
MODEM_DOUT #13
MODEM_ANT0 #12
MODEM_ANT1 #11
APORT1XCH10]
22,
29
PC10
TIM1_CC1 #14
TIM1_CC2 #13
BUSBY [ADC0:
APORT2YCH10
ACMP0:
APORT2YCH10
ACMP1:
TIM1_CC3 #12 LE-
TIM0_OUT0 #15
LETIM0_OUT1 #14
PCNT0_S0IN #15
PCNT0_S1IN #14
APORT2YCH10]
US0_TX #16
US0_RX #15
US0_CLK #14
US0_CS #13
US0_CTS #12
US0_RTS #11
US1_TX #16
US1_RX #15
US1_CLK #14
US1_CS #13
US1_CTS #12
US1_RTS #11
LEU0_TX #16
LEU0_RX #15
I2C0_SDA #16
I2C0_SCL #15
TIM0_CC0 #16
TIM0_CC1 #15
TIM0_CC2 #14
TIM0_CDTI0 #13
TIM0_CDTI1 #12
TIM0_CDTI2 #11
TIM1_CC0 #16
BUSAY [ADC0:
APORT1YCH11
ACMP0:
APORT1YCH11
ACMP1:
FRC_DCLK #16
FRC_DOUT #15
CMU_CLK0 #3
PRS_CH0 #13
PRS_CH9 #16
PRS_CH10 #5
PRS_CH11 #4
ACMP0_O #16
ACMP1_O #16
DBG_SWO #3
FRC_DFRAME #14
MODEM_DCLK #16
MODEM_DIN #15
MODEM_DOUT #14
MODEM_ANT0 #13
MODEM_ANT1 #12
APORT1YCH11]
21,
28
PC11
TIM1_CC1 #15
TIM1_CC2 #14
BUSBX [ADC0:
APORT2XCH11
ACMP0:
APORT2XCH11
ACMP1:
TIM1_CC3 #13 LE-
TIM0_OUT0 #16
LETIM0_OUT1 #15
PCNT0_S0IN #16
PCNT0_S1IN #15
APORT2XCH11]
16,
35
NC
7.1.1 BGM113 GPIO Overview
The GPIO pins are organized as 16-bit ports indicated by letters A through F, and the individual pins on each port are indicated by a
number from 15 down to 0.
Table 7.2. GPIO Pinout
Port
Pin
15
Pin
14
Pin
13
Pin
12
Pin
11
Pin Pin 9 Pin 8 Pin 7 Pin 6 Pin 5 Pin 4 Pin 3 Pin 2 Pin 1 Pin 0
10
Port A
Port B
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PA1 PA0
PB13 PB12 PB11
(5V) (5V) (5V)
-
-
-
-
PC11 PC10
(5V) (5V)
Port C
-
-
-
-
-
-
-
-
-
-
-
-
PD15 PD14 PD13
(5V) (5V) (5V)
Port D
Port E
Port F
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PF3 PF2 PF1 PF0
(5V) (5V) (5V) (5V)
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Note: GPIO with 5V tolerance are indicated by (5V).
Note: The pins PB13, PB11, PD15, PD14 and PD13 will not be 5V tolerant on all future devices. In order to preserve upgrade options
with full hardware compatibility, do not use these pins on 5V domains.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
7.2 Alternate Functionality Pinout
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-
nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings.
Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout
is shown in the column corresponding to LOCATION 0.
Table 7.3. Alternate functionality overview
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
24: PF0
25: PF1
26: PF2
27: PF3
21: PD13
15: PC10 16: PC11 22: PD14
23: PD15
Analog comparator
ACMP0, digital out-
put.
0: PA0
1: PA1
6: PB11
7: PB12
ACMP0_O
8: PB13
24: PF0
25: PF1
26: PF2
27: PF3
21: PD13
15: PC10 16: PC11 22: PD14
23: PD15
Analog comparator
ACMP1, digital out-
put.
0: PA0
1: PA1
ACMP1_O
6: PB11 8: PB13
7: PB12
0: PA0
Analog to digital
converter ADC0 ex-
ternal reference in-
put negative pin
ADC0_EXTN
ADC0_EXTP
CMU_CLK0
CMU_CLK1
0: PA1
Analog to digital
converter ADC0 ex-
ternal reference in-
put positive pin
Clock Management
Unit, clock output
number 0.
0: PA1
3: PC11
5: PD14
6: PF2
Clock Management
Unit, clock output
number 1.
0: PA0
3: PC10
5: PD15
6: PF3
Debug-interface
Serial Wire clock
input and JTAG
Test Clock.
0: PF0
DBG_SWCLKTCK
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull down.
Debug-interface
Serial Wire data in-
put / output and
JTAG Test Mode
Select.
0: PF1
DBG_SWDIOTMS
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull up.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
Debug-interface
Serial Wire viewer
Output.
0: PF2
Note that this func-
tion is not enabled
after reset, and
must be enabled by
software to be
used.
1: PB13
2: PD15
3: PC11
DBG_SWO
Debug-interface
JTAG Test Data In.
0: PF3
Note that this func-
tion is enabled to
pin out of reset,
and has a built-in
pull up.
DBG_TDI
Debug-interface
JTAG Test Data
Out.
0: PF2
DBG_TDO
Note that this func-
tion is enabled to
pin out of reset.
24: PF0
25: PF1
26: PF2
27: PF3
21: PD13
15: PC10 16: PC11 22: PD14
23: PD15
0: PA0
1: PA1
Frame Controller,
Data Sniffer Clock.
FRC_DCLK
6: PB11 8: PB13
7: PB12
20: PD14
21: PD15 24: PF2
22: PF0
23: PF1
4: PB11
5: PB12
6: PB13
Frame Controller,
Data Sniffer Frame
active
13: PC10
14: PC11
30: PA0
31: PA1
FRC_DFRAME
FRC_DOUT
19: PD13
25: PF3
20: PD13
21: PD14
22: PD15
23: PF0
5: PB11
6: PB12
7: PB13
24: PF1
25: PF2
26: PF3
Frame Controller,
Data Sniffer Out-
put.
14: PC10
15: PC11
0: PA1
0: PF2
31: PA0
Pin can be used to
wake the system
up from EM4
GPIO_EM4WU0
GPIO_EM4WU1
GPIO_EM4WU4
GPIO_EM4WU8
Pin can be used to
wake the system
up from EM4
0: PD14
Pin can be used to
wake the system
up from EM4
Pin can be used to
wake the system
up from EM4
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
0: PB13
Pin can be used to
wake the system
up from EM4
GPIO_EM4WU9
GPIO_EM4WU12
I2C0_SCL
0: PC10
0: PA1
Pin can be used to
wake the system
up from EM4
20: PD13
21: PD14
22: PD15
23: PF0
5: PB11
6: PB12
7: PB13
24: PF1
25: PF2
26: PF3
14: PC10
15: PC11
I2C0 Serial Clock
Line input / output.
31: PA0
24: PF0
0: PA0
1: PA1
6: PB11
7: PB12
21: PD13 25: PF1
22: PD14 26: PF2
23: PD15 27: PF3
I2C0 Serial Data in-
put / output.
I2C0_SDA
8: PB13
15: PC10 16: PC11
24: PF0
21: PD13
Low Energy Timer
LETIM0, output
channel 0.
0: PA0
1: PA1
25: PF1
LETIM0_OUT0
LETIM0_OUT1
LEU0_RX
6: PB11 8: PB13
7: PB12
15: PC10 16: PC11 22: PD14
23: PD15
26: PF2
27: PF3
0: PA1
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
Low Energy Timer
LETIM0, output
channel 1.
5: PB11
6: PB12
7: PB13
14: PC10
15: PC11
31: PA0
31: PA0
0: PA1
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
5: PB11
6: PB12
7: PB13
LEUART0 Receive
input.
14: PC10
15: PC11
LEUART0 Transmit
output. Also used
as receive input in
half duplex commu-
nication.
0: PA0
1: PA1
24: PF0
21: PD13 25: PF1
22: PD14 26: PF2
23: PD15 27: PF3
LEU0_TX
8: PB13
6: PB11
7: PB12
16: PC11
15: PC10
4: PB12
5: PB13
20: PD15
MODEM antenna
control output 0,
used for antenna
diversity.
12: PC10
13: PC11
18: PD13 21: PF0
19: PD14 22: PF1
23: PF2
24: PF3
29: PA0
30: PA1
MODEM_ANT0
MODEM_ANT1
MODEM_DCLK
MODEM_DIN
3: PB11
4: PB13
20: PF0
17: PD13
MODEM antenna
control output 1,
used for antenna
diversity.
21: PF1
28: PA0
29: PA1
11: PC10 12: PC11 18: PD14
19: PD15
2: PB11
3: PB12
22: PF2
23: PF3
0: PA0
1: PA1
24: PF0
25: PF1
26: PF2
27: PF3
21: PD13
22: PD14
23: PD15
8: PB13
16: PC11
MODEM data clock
out.
6: PB11
7: PB12
15: PC10
0: PA1
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
5: PB11
6: PB12
7: PB13
14: PC10
15: PC11
31: PA0
MODEM data in.
MODEM data out.
Rev. 1.00 | 55
20: PD14
24: PF2
21: PD15
25: PF3
22: PF0
4: PB11
5: PB12
6: PB13
13: PC10
14: PC11
30: PA0
31: PA1
MODEM_DOUT
19: PD13
23: PF1
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®
BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Alternate
LOCATION
Functionality
0 - 3
4 - 7
8 - 11
12 - 15
16 - 19
20 - 23
24 - 27
28 - 31
Description
0: PA0
1: PA1
2
24: PF0
Pulse Counter
PCNT0 input num-
ber 0.
21: PD13 25: PF1
22: PD14 26: PF2
23: PD15 27: PF3
PCNT0_S0IN
PCNT0_S1IN
PRS_CH0
PRS_CH1
PRS_CH2
PRS_CH3
PRS_CH4
PRS_CH5
PRS_CH6
PRS_CH7
PRS_CH8
PRS_CH9
PRS_CH10
8: PB13
16: PC11
6: PB11
7: PB12
15: PC10
0: PA1
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
Pulse Counter
PCNT0 input num-
ber 1.
5: PB11
6: PB12
7: PB13
14: PC10
15: PC11
31: PA0
0: PF0
1: PF1
2: PF2
3: PF3
12: PC10
13: PC11
Peripheral Reflex
System PRS, chan-
nel 0.
0: PF1
1: PF2
2: PF3
Peripheral Reflex
System PRS, chan-
nel 1.
7: PF0
0: PF2
1: PF3
Peripheral Reflex
System PRS, chan-
nel 2.
6: PF0
7: PF1
0: PF3
12: PD13
13: PD14
14: PD15
Peripheral Reflex
System PRS, chan-
nel 3.
5: PF0
6: PF1
7: PF2
4: PD13
5: PD14
6: PD15
Peripheral Reflex
System PRS, chan-
nel 4.
4: PD14
5: PD15
Peripheral Reflex
System PRS, chan-
nel 5.
3: PD13
0: PA0
1: PA1
16: PD14
17: PD15
Peripheral Reflex
System PRS, chan-
nel 6.
8: PB13
15: PD13
6: PB11
7: PB12
0: PA1
Peripheral Reflex
System PRS, chan-
nel 7.
5: PB11
6: PB12 10: PA0
7: PB13
4: PB11
Peripheral Reflex
System PRS, chan-
nel 8.
5: PB12 9: PA0
6: PB13 10: PA1
Peripheral Reflex
System PRS, chan-
nel 9.
4: PB12 8: PA0
5: PB13 9: PA1
3: PB11
15: PC10 16: PC11
Peripheral Reflex
System PRS, chan-
nel 10.
4: PC10
5: PC11
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Alternate
LOCATION
Functionality
0 - 3
4 - 7
8 - 11
12 - 15
16 - 19
20 - 23
24 - 27
28 - 31
Description
Peripheral Reflex
System PRS, chan-
nel 11.
PRS_CH11
TIM0_CC0
TIM0_CC1
TIM0_CC2
TIM0_CDTI0
TIM0_CDTI1
TIM0_CDTI2
TIM1_CC0
TIM1_CC1
TIM1_CC2
TIM1_CC3
US0_CLK
3: PC10
4: PC11
24: PF0
25: PF1
26: PF2
27: PF3
21: PD13
16: PC11 22: PD14
23: PD15
Timer 0 Capture
Compare input /
output channel 0.
0: PA0
1: PA1
8: PB13
6: PB11
7: PB12
15: PC10
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
Timer 0 Capture
Compare input /
output channel 1.
5: PB11
6: PB12
7: PB13
0: PA1
14: PC10
15: PC11
31: PA0
4: PB11
5: PB12
6: PB13
20: PD14
Timer 0 Capture
Compare input /
output channel 2.
13: PC10
21: PD15 24: PF2
30: PA0
31: PA1
14: PC11 19: PD13 22: PF0
23: PF1
25: PF3
24: PF3
20: PD15
12: PC10 18: PD13 21: PF0
13: PC11 19: PD14 22: PF1
23: PF2
Timer 0 Compli-
mentary Dead Time
Insertion channel 0.
4: PB12
5: PB13
29: PA0
30: PA1
3: PB11
4: PB13
20: PF0
17: PD13 21: PF1
18: PD14 22: PF2
19: PD15 23: PF3
Timer 0 Compli-
mentary Dead Time
Insertion channel 1.
28: PA0
29: PA1
11: PC10 12: PC11
2: PB11
3: PB12
16: PD13 20: PF1
17: PD14 21: PF2
18: PD15 22: PF3
Timer 0 Compli-
mentary Dead Time
Insertion channel 2.
1: PB11
2: PB12
3: PB13
28: PA1
10: PC10
11: PC11
27: PA0
24: PF0
21: PD13 25: PF1
22: PD14 26: PF2
23: PD15 27: PF3
19: PF0
2
16: PC11
2
Timer 1 Capture
Compare input /
output channel 0.
0: PA0
1: PA1
8: PB13
6: PB11
7: PB12
15: PC10
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
Timer 1 Capture
Compare input /
output channel 1.
5: PB11
6: PB12
7: PB13
0: PA1
31: PA0
14: PC10
15: PC11
4: PB11
5: PB12
6: PB13
20: PD14
Timer 1 Capture
Compare input /
output channel 2.
13: PC10
14: PC11
21: PD15 24: PF2
30: PA0
31: PA1
22: PF0
19: PD13 23: PF1
25: PF3
4: PB12
5: PB13
20: PD15
Timer 1 Capture
Compare input /
output channel 3.
12: PC10 18: PD13 21: PF0
13: PC11 19: PD14 22: PF1
23: PF2
29: PA0
30: PA1
3: PB11
24: PF3
4: PB11
5: PB12
6: PB13
20: PD14
13: PC10
21: PD15 24: PF2
USART0 clock in-
put / output.
30: PA0
31: PA1
14: PC11 19: PD13 22: PF0
23: PF1
25: PF3
20: PD15
12: PC10 18: PD13 21: PF0
13: PC11 19: PD14 22: PF1
23: PF2
4: PB12
5: PB13
29: PA0
30: PA1
USART0 chip se-
lect input / output.
US0_CS
3: PB11
24: PF3
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
20: PF0
21: PF1
22: PF2
23: PF3
17: PD13
12: PC11 18: PD14
19: PD15
USART0 Clear To
Send hardware
flow control input.
28: PA0
29: PA1
US0_CTS
US0_RTS
4: PB13
2: PB11
3: PB12
11: PC10
16: PD13 20: PF1
17: PD14 21: PF2
18: PD15 22: PF3
USART0 Request
To Send hardware
flow control output.
1: PB11
2: PB12
3: PB13
27: PA0
28: PA1
31: PA0
10: PC10
11: PC11
19: PF0
2
USART0 Asynchro-
nous Receive.
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
5: PB11
6: PB12
7: PB13
USART0 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US0_RX
0: PA1
14: PC10
15: PC11
USART0 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
0: PA0
1: PA1
24: PF0
21: PD13
25: PF1
US0_TX
8: PB13
15: PC10 16: PC11 22: PD14
23: PD15
6: PB11
7: PB12
26: PF2
27: PF3
USART0 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
4: PB11
5: PB12
6: PB13
20: PD14
21: PD15 24: PF2
22: PF0
23: PF1
13: PC10
14: PC11
USART1 clock in-
put / output.
US1_CLK
US1_CS
19: PD13
30: PA0
31: PA1
25: PF3
20: PD15
4: PB12
5: PB13
12: PC10 18: PD13 21: PF0
13: PC11 19: PD14 22: PF1
23: PF2
29: PA0
30: PA1
USART1 chip se-
lect input / output.
3: PB11
24: PF3
20: PF0
17: PD13
USART1 Clear To
Send hardware
flow control input.
21: PF1
28: PA0
29: PA1
US1_CTS
US1_RTS
4: PB13 11: PC10 12: PC11 18: PD14
19: PD15
2: PB11
3: PB12
22: PF2
23: PF3
16: PD13
17: PD14
18: PD15
19: PF0
20: PF1
21: PF2
22: PF3
USART1 Request
To Send hardware
flow control output.
1: PB11
2: PB12
3: PB13
28: PA1
31: PA0
10: PC10
11: PC11
27: PA0
USART1 Asynchro-
nous Receive.
0: PA1
20: PD13 24: PF1
21: PD14 25: PF2
22: PD15 26: PF3
23: PF0
5: PB11
6: PB12
7: PB13
14: PC10
15: PC11
USART1 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US1_RX
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
USART1 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
24: PF0
25: PF1
26: PF2
27: PF3
21: PD13
15: PC10 16: PC11 22: PD14
23: PD15
0: PA0
1: PA1
6: PB11
7: PB12
US1_TX
8: PB13
USART1 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
7.3 Analog Port (APORT)
The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs,
and DACs. The APORT consists of wires, switches, and control needed to configurably implement the routes. Please see the device
Reference Manual for a complete description.
PC10
BUSAX
PF0
PF2
BUSBY
PC11
BUSAY
PF1
PF3
BUSBX
PD14
BUSCX
PA0
BUSDY
PD13
PD15
BUSCY
PA1
PB11
PB12
PB13
BUSDX
1X1Y2X2Y3X3Y4X4Y
ACMP0
1X1Y2X2Y3X3Y4X4Y
ACMP1
1X1Y2X2Y3X3Y4X4Y
ADC0
1X1Y
IDAC0
Figure 7.2. BGM113 APORT
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Table 7.4. APORT Client Map
Analog Module
Analog Module Channel
Shared Bus
Pin
ACMP0
ACMP0
ACMP0
ACMP0
APORT1XCH6
APORT1XCH8
APORT1XCH10
APORT1XCH16
APORT1XCH18
APORT1XCH20
APORT1XCH22
APORT1YCH7
APORT1YCH9
APORT1YCH11
APORT1YCH17
APORT1YCH19
APORT1YCH21
APORT1YCH23
APORT2XCH7
APORT2XCH9
APORT2XCH11
APORT2XCH17
APORT2XCH19
APORT2XCH21
APORT2XCH23
APORT2YCH6
APORT2YCH8
APORT2YCH10
APORT2YCH16
APORT2YCH18
APORT2YCH20
APORT2YCH22
BUSAX
BUSAY
BUSBX
BUSBY
PC10
PF0
PF2
PC11
PF1
PF3
PC11
PF1
PF3
PC10
PF0
PF2
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Analog Module
Analog Module Channel
APORT3XCH2
APORT3XCH4
APORT3XCH6
APORT3XCH8
APORT3XCH10
APORT3XCH12
APORT3XCH28
APORT3XCH30
APORT3YCH3
APORT3YCH5
APORT3YCH7
APORT3YCH9
APORT3YCH11
APORT3YCH13
APORT3YCH27
APORT3YCH29
APORT3YCH31
APORT4XCH3
APORT4XCH5
APORT4XCH7
APORT4XCH9
APORT4XCH11
APORT4XCH13
APORT4XCH27
APORT4XCH29
APORT4XCH31
APORT4YCH2
APORT4YCH4
APORT4YCH6
APORT4YCH8
APORT4YCH10
APORT4YCH12
APORT4YCH28
APORT4YCH30
Shared Bus
Pin
ACMP0
BUSCX
PD14
PA0
PB12
ACMP0
BUSCY
PD13
PD15
PA1
PB11
PB13
ACMP0
BUSDX
PD13
PD15
PA1
PB11
PB13
ACMP0
BUSDY
PD14
PA0
PA4
PB12
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Analog Module
Analog Module Channel
APORT1XCH6
APORT1XCH8
APORT1XCH10
APORT1XCH16
APORT1XCH18
APORT1XCH20
APORT1XCH22
APORT1YCH7
APORT1YCH9
APORT1YCH11
APORT1YCH17
APORT1YCH19
APORT1YCH21
APORT1YCH23
APORT2XCH7
APORT2XCH9
APORT2XCH11
APORT2XCH17
APORT2XCH19
APORT2XCH21
APORT2XCH23
APORT2YCH6
APORT2YCH8
APORT2YCH10
APORT2YCH16
APORT2YCH18
APORT2YCH20
APORT2YCH22
APORT3XCH2
APORT3XCH4
APORT3XCH6
APORT3XCH8
APORT3XCH10
APORT3XCH12
APORT3XCH28
APORT3XCH30
Shared Bus
Pin
ACMP1
ACMP1
ACMP1
ACMP1
ACMP1
BUSAX
BUSAY
BUSBX
BUSBY
BUSCX
PC10
PF0
PF2
PC11
PF1
PF3
PC11
PF1
PF3
PC10
PF0
PF2
PD14
PA0
PB12
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Analog Module
Analog Module Channel
APORT3YCH3
APORT3YCH5
APORT3YCH7
APORT3YCH9
APORT3YCH11
APORT3YCH13
APORT3YCH27
APORT3YCH29
APORT3YCH31
APORT4XCH3
APORT4XCH5
APORT4XCH7
APORT4XCH9
APORT4XCH11
APORT4XCH13
APORT4XCH27
APORT4XCH29
APORT4XCH31
APORT4YCH2
APORT4YCH4
APORT4YCH6
APORT4YCH8
APORT4YCH10
APORT4YCH12
APORT4YCH28
APORT4YCH30
APORT1XCH6
APORT1XCH8
APORT1XCH10
APORT1XCH16
APORT1XCH18
APORT1XCH20
APORT1XCH22
Shared Bus
Pin
ACMP1
BUSCY
PD13
PD15
PA1
PB11
PB13
ACMP1
BUSDX
PD13
PD15
PA1
PB11
PB13
ACMP1
BUSDY
PD14
PA0
PB12
ADC0
BUSAX
PC10
PF0
PF2
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Analog Module
Analog Module Channel
APORT1YCH7
APORT1YCH9
APORT1YCH11
APORT1YCH17
APORT1YCH19
APORT1YCH21
APORT1YCH23
APORT2XCH7
APORT2XCH9
APORT2XCH11
APORT2XCH17
APORT2XCH19
APORT2XCH21
APORT2XCH23
APORT2YCH6
APORT2YCH8
APORT2YCH10
APORT2YCH16
APORT2YCH18
APORT2YCH20
APORT2YCH22
APORT3XCH2
APORT3XCH4
APORT3XCH6
APORT3XCH8
APORT3XCH10
APORT3XCH12
APORT3XCH28
APORT3XCH30
Shared Bus
Pin
ADC0
ADC0
ADC0
ADC0
BUSAY
BUSBX
BUSBY
BUSCX
PC11
PF1
PF3
PC11
PF1
PF3
PC10
PF0
PF2
PD14
PA0
PB12
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Analog Module
Analog Module Channel
APORT3YCH3
APORT3YCH5
APORT3YCH7
APORT3YCH9
APORT3YCH11
APORT3YCH13
APORT3YCH27
APORT3YCH29
APORT3YCH31
APORT4XCH3
APORT4XCH5
APORT4XCH7
APORT4XCH9
APORT4XCH11
APORT4XCH13
APORT4XCH27
APORT4XCH29
APORT4XCH31
APORT4YCH2
APORT4YCH4
APORT4YCH6
APORT4YCH8
APORT4YCH10
APORT4YCH12
APORT4YCH28
APORT4YCH30
APORT1XCH2
APORT1XCH4
APORT1XCH6
APORT1XCH8
APORT1XCH10
APORT1XCH12
APORT1XCH28
APORT1XCH30
Shared Bus
Pin
ADC0
BUSCY
PD13
PD15
PA1
PB11
PB13
ADC0
BUSDX
PD13
PD15
PA1
PB11
PB13
ADC0
BUSDY
PD14
PA0
PB12
IDAC0
BUSCX
PD14
PA0
PB12
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Pin Definitions
Analog Module
Analog Module Channel
APORT1YCH3
Shared Bus
Pin
IDAC0
BUSCY
APORT1YCH5
PD13
PD15
PA1
APORT1YCH7
APORT1YCH9
APORT1YCH11
APORT1YCH13
APORT1YCH27
APORT1YCH29
APORT1YCH31
PB11
PB13
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BGM113 Blue Gecko Bluetooth Module Data Sheet
BGM113 Package Specifications
8. BGM113 Package Specifications
8.1 BGM113 Dimensions
Figure 8.1. BGM113 Package Dimensions
8.2 BGM113 Module Dimensions and Footprint
The figure below shows the Module dimensions and footprint.
Figure 8.2. BGM113 Dimensions and Footprint
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BGM113 Blue Gecko Bluetooth Module Data Sheet
BGM113 Package Specifications
8.3 BGM113 Land Pattern
The figure below shows the recommended land pattern.
Figure 8.3. BGM113 Land Pattern
8.4 BGM113 Package Marking
The figure below shows the Module markings printed on the RF-shield.
Figure 8.4. BGM113 Package Marking
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Tape and Reel Specifications
9. Tape and Reel Specifications
9.1 Tape and Reel Packaging
This section contains information regarding the tape and reel packaging for the BGM113 Blue Gecko Module.
9.2 Reel and Tape Specifications
• Reel material: Polystyrene (PS)
• Reel diameter: 13 inches (330 mm)
• Number of modules per reel: 1000 pcs
• Disk deformation, folding whitening and mold imperfections: Not allowed
• Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm)
• Antistatic treatment: Required
Surface resistivity: 104 - 109 Ω/sq.
•
Figure 9.1. Reel Dimensions - Side View
Symbol
W0
Dimensions [mm]
32.5 ± 0.3
W1
37.1 ± 1.0
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Tape and Reel Specifications
Figure 9.2. Cover tape information
Symbol
Thickness (T)
Width (W)
Dimensions [mm]
0.061
25.5 + 0.2
Figure 9.3. Tape information
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Tape and Reel Specifications
9.3 Orientation and Tape Feed
The user direction of feed, start and end of tape on reel and orientation of the Modules on the tape are shown in the figures below.
Figure 9.4. Module Orientation and Feed Direction
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Tape and Reel Specifications
9.4 Tape and Reel Box Dimensions
Figure 9.5. Tape and Reel Box Dimensions
Symbol
W2
Dimensions [mm]
368
338
72
W3
W4
9.5 Moisture Sensitivity Level
Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Soldering Recommendations
10. Soldering Recommendations
10.1 Soldering Recommendations
This section describes the soldering recommendations regarding BGM113 Module.
BGM113 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal
mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid usining more than two reflow cycles.
• Aperture size of the stencil should be 1:1 with the pad size.
• A no-clean, type-3 solder paste is recommended.
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Certifications
11. Certifications
11.1 Bluetooth
The BGM113 is Bluetooth qualified and the declaration ID is 81875 (RF), 81105 (Link Layer) and 82817 (Host).
11.2 CE
The BGM113 module is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/
EC). This device is compliant with the following standards:
• Safety: EN 60950
• EMC: EN 301 489-1 v.1.9.2, EN 301 489-17 v.2.2.1
• Spectrum: EN 300 328 v.1.9.1
A formal DoC is available from www.silabs.com.
11.3 FCC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-
ic operating instructions for satisfying RF exposure compliance. This transmittermeets both portable and mobile limits as demonstrated
in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter
except in accordance with FCC multi-transmitter product procedures. As long as the condition above is met, further transmitter testing
will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance require-
ments required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
OEM Responsibilities to comply with FCC Regulations
The BGM113 Module has been certified for integration into products only by OEM integrators under the following condition:
• The antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radiator (antenna)
and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-
ance with FCC multi-transmitter product procedures.
As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible
for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
Note: In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM inte-
grator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
The BGM113 Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case,
the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQBGM113"
or
"Contains FCC ID: QOQBGM113"
The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RF
related parameters in the user manual of the end product.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Certifications
11.4 IC
IC (English)
This radio transmitter has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types are
strictly prohibited for use with this device.
This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device.
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. BGM113 meets the given requirements when the minimum
separation distance to human body 0 mm. RF exposure or SAR evaluation is not required when the separation distance is 0 mm or
more. If the separation distance is less than 0 mm the OEM integrator is responsible for evaluating the SAR.
OEM Responsibilities to comply with IC Regulations
The BGM113 Module has been certified for integration into products only by OEM integrators under the following conditions:
• The antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radiator (antenna)
and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-
sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC
authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-
tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization.
End Product Labeling
The BGM113 module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final
end product must be labeled in a visible area with the following:
"Contains Transmitter Module IC: 5123A-BGM113"
or
"Contains IC: 5123A-BGM113"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
IC (Français)
Cet émetteur radio (IC : 5123A-BGM113) a reçu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorporée.
Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est
autorisée aux deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage; et
2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible de provoquer un fonctionnement
non désiré de l’appareil.
Déclaration relative à l'exposition aux radiofréquences (RF)
Les limites applicables à l’exemption de l’évaluation courante du DAS sont énoncées dans le CNR 102, 5e édition. Le module Blue-
tooth BGM113 répond aux exigences données quand la distance de séparation minimum par rapport au corps humain est de 0 mm.
L'évaluation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de séparation est de 0 mm ou plus. Si la distance de
séparation est inférieure à 0 mm, il incombe à l'intégrateur FEO d'évaluer le DAS.
Responsabilités du FEO ayant trait à la conformité avec les règlements IC
Le Module Bluetooth BGM113 a été certifié pour une intégration dans des produits uniquement par les intégrateurs FEO dans les con-
ditions suivantes:
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Certifications
• La ou les antennes doivent être installées de telle façon qu'une distance de séparation minimum de 0 mm soit maintenue entre le
radiateur (antenne) et toute personne à tout moment.
• Le module émetteur ne doit pas être installé au même endroit ou fonctionner conjointement avec toute autre antenne ou émetteur.
Dès lors que les deux conditions ci-dessus sont respectées, aucun test supplémentaire de l’émetteur n’est obligatoire. Cependant, il
incombe toujours à l'intégrateur FEO de tester la conformité de son produit final vis-à-vis de toute exigence supplémentaire requise
avec ce module installé (par exemple, émissions de dispositifs numériques, exigences relatives aux matériels périphériques PC, etc).
Note: S'il s'avère que ces conditions ne peuvent être respectées (pour certaines configurations ou la colocation avec un autre émet-
teur), alors l'autorisation IC n'est plus considérée comme valide et l'identifiant IC ne peut plus être employé sur le produit final. Dans
ces circonstances, l'intégrateur FEO aura la responsabilité de réévaluer le produit final (y compris l'émetteur) et d'obtenir une autorisa-
tion IC distincte.
Étiquetage du produit final
L'étiquette du Module BGM113 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est installé à l'intér-
ieur d'un autre appareil, alors l'extérieur de l'appareil dans lequel le module est installé doit aussi porter une étiquette faisant référence
au module qu'il contient. Dans ce cas, une étiquette comportant les informations suivantes doit être apposée sur une partie visible du
produit final.
"Contient le module émetteur IC: 5123A-BGM113"
ou
"Contient IC : 5123A-BGM113"
L'intégrateur FEO doit être conscient de ne pas fournir d'informations à l'utilisateur final permettant d'installer ou de retirer ce module
RF ou de changer les paramètres liés aux RF dans le mode d'emploi du produit final.
11.5 Japan
The BGM113 module in certified for Japan.
Certification number: 209-J00204
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host
equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio
module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the
Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination
of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.
Figure 11.1. Text to be Placed on the Housing of the End-user Device
Translation of the text in the figure above:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under
the Radio Law.”
11.6 KC (South-Korea)
BGM113 Blue Gecko Bluetooth ® Module has certification in South-Korea.
Certification number: MSIP-CRM-BGT-BGM113
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Revision History
12. Revision History
12.1 Revision 1.00
• Full Production Release
• Soldering recommendations added
• Tape and Reel specifications updated
12.2 Revision 0.98
• Tape and reel specifications added
12.3 Revision 0.97
• Layout instructions improved
• LFXO specifications description updated
12.4 Revision 0.96
• PCB size vs. antenna efficiency updated
12.5 Revision 0.95
• Bluetooth and South-Korea certifications updated
12.6 Revision 0.94
• Electrical characteristics updated
• Tape and reel specifications added
• Certifications updated
12.7 Revision 0.93
2016-03-16
Minor changes.
12.8 Revision 0.92
2016-03-15
Ordering information updated.
12.9 Revision 0.91
2016-03-15
Pinout update. Antenna characteristics and layout guidelines added.
12.10 Revision 0.9
2016-03-14
Updated version for initial product release.
12.11 Revision 0.8
2016-03-04
Ready for initial product release.
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BGM113 Blue Gecko Bluetooth Module Data Sheet
Revision History
12.12 Revision 0.7
2016-03-02
Initial version
silabs.com | Smart. Connected. Energy-friendly.
Rev. 1.00 | 79
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2 Radio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.1 Antenna Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.2 Wake on Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2.3 RFSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2.4 Packet and State Trace . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2.5 Random Number Generator . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3.1 Energy Management Unit (EMU) . . . . . . . . . . . . . . . . . . . . . . . 5
3.3.2 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.4 General Purpose Input/Output (GPIO). . . . . . . . . . . . . . . . . . . . . . 5
3.5 Clocking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.5.1 Clock Management Unit (CMU) . . . . . . . . . . . . . . . . . . . . . . . 6
3.5.2 Internal Oscillators. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.6 Counters/Timers and PWM . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.6.1 Timer/Counter (TIMER) . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.6.2 Real Time Counter and Calendar (RTCC) . . . . . . . . . . . . . . . . . . . . 6
3.6.3 Low Energy Timer (LETIMER). . . . . . . . . . . . . . . . . . . . . . . . 6
3.6.4 Ultra Low Power Wake-up Timer (CRYOTIMER) . . . . . . . . . . . . . . . . . 6
3.6.5 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.6.6 Watchdog Timer (WDOG) . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.7 Communications and Other Digital Peripherals . . . . . . . . . . . . . . . . . . . 7
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) . . . . . . . . . . 7
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) . . . . . . . . . . 7
2
3.7.3 Inter-Integrated Circuit Interface (I C) . . . . . . . . . . . . . . . . . . . . . 7
3.7.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . . . . . . . . . . . . 7
3.8 Security Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check) . . . . . . . . . . . . . . . 7
3.8.2 Crypto Accelerator (CRYPTO). . . . . . . . . . . . . . . . . . . . . . . . 8
3.9 Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.9.1 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.9.2 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . . . 8
3.9.3 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . . . 8
3.9.4 Digital to Analog Current Converter (IDAC) . . . . . . . . . . . . . . . . . . . 8
3.10 Reset Management Unit (RMU) . . . . . . . . . . . . . . . . . . . . . . . 8
3.11 Core and Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.11.1 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.11.2 Memory System Controller (MSC) . . . . . . . . . . . . . . . . . . . . . . 9
3.11.3 Linked Direct Memory Access Controller (LDMA) . . . . . . . . . . . . . . . . . 9
Table of Contents 80
3.12 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.13 Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . .11
4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .12
4.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . .12
4.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4.1.2.1 General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . .13
4.1.3 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.1.4 Current Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.1.4.1 Current Consumption 3.3 V (DC-DC in Bypass Mode) . . . . . . . . . . . . . . .16
4.1.4.2 Current Consumption 3.3 V using DC-DC Converter . . . . . . . . . . . . . . .17
4.1.4.3 Current Consumption 1.85 V (DC-DC in Bypass Mode) . . . . . . . . . . . . . .18
4.1.4.4 Current Consumption Using Radio . . . . . . . . . . . . . . . . . . . . .19
4.1.5 Wake up times . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
4.1.6 Brown Out Detector . . . . . . . . . . . . . . . . . . . . . . . . . . .20
4.1.7 Frequency Synthesizer Characteristics . . . . . . . . . . . . . . . . . . . . .20
4.1.8 2.4 GHz RF Transceiver Characteristics . . . . . . . . . . . . . . . . . . . .21
4.1.8.1 RF Transmitter General Characteristics for the 2.4 GHz Band . . . . . . . . . . . .21
4.1.8.2 RF Receiver General Characteristics for the 2.4 GHz Band . . . . . . . . . . . . .22
4.1.8.3 RF Receiver Characteristics for Bluetooth Smart in the 2.4 GHz Band. . . . . . . . . .23
4.1.9 Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.1.9.1 LFXO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.1.9.2 HFXO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.1.9.3 LFRCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
4.1.9.4 HFRCO and AUXHFRCO . . . . . . . . . . . . . . . . . . . . . . . .25
4.1.9.5 ULFRCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
4.1.10 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . . . . . .26
4.1.11 GPIO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
4.1.12 VMON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
4.1.13 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
4.1.14 IDAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
4.1.15 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . . .34
4.1.16 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
4.1.17 USART SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
5. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 40
5.1 Power, Ground, Debug and Host UART . . . . . . . . . . . . . . . . . . . . .40
5.2 SPI Peripheral Connection . . . . . . . . . . . . . . . . . . . . . . . . .40
2
5.3 I C Peripheral Connection. . . . . . . . . . . . . . . . . . . . . . . . . .41
6. Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.1 Recommended Placement on the Application PCB . . . . . . . . . . . . . . . . .42
6.2 Effect of Plastic and Metal Materials . . . . . . . . . . . . . . . . . . . . . .43
6.3 Locating the Module Close to Human Body . . . . . . . . . . . . . . . . . . . .43
6.4 2D Radiation Pattern Plots . . . . . . . . . . . . . . . . . . . . . . . . .44
7. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.1 BGM113 Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Table of Contents 81
7.1.1 BGM113 GPIO Overview . . . . . . . . . . . . . . . . . . . . . . . . .51
7.2 Alternate Functionality Pinout . . . . . . . . . . . . . . . . . . . . . . . .53
7.3 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . . .60
8. BGM113 Package Specifications . . . . . . . . . . . . . . . . . . . . . . . 68
8.1 BGM113 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . .68
8.2 BGM113 Module Dimensions and Footprint . . . . . . . . . . . . . . . . . . .68
8.3 BGM113 Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . .69
8.4 BGM113 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . .69
9. Tape and Reel Specifications . . . . . . . . . . . . . . . . . . . . . . . . 70
9.1 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . .70
9.2 Reel and Tape Specifications . . . . . . . . . . . . . . . . . . . . . . . .70
9.3 Orientation and Tape Feed . . . . . . . . . . . . . . . . . . . . . . . . .72
9.4 Tape and Reel Box Dimensions . . . . . . . . . . . . . . . . . . . . . . . .73
9.5 Moisture Sensitivity Level . . . . . . . . . . . . . . . . . . . . . . . . . .73
10. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 74
10.1 Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . .74
11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
11.1 Bluetooth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
11.2 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
11.3 FCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
11.4 IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
11.5 Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
11.6 KC (South-Korea) . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
12.1 Revision 1.00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.2 Revision 0.98 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.3 Revision 0.97 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.4 Revision 0.96 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.5 Revision 0.95 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.6 Revision 0.94 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.7 Revision 0.93 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.8 Revision 0.92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.9 Revision 0.91 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.10 Revision 0.9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.11 Revision 0.8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
12.12 Revision 0.7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table of Contents 82
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Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes
without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included
information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted
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