BGM13S32F512GA-V3R [SILICON]
Blue Gecko Bluetooth ® SiP Module;型号: | BGM13S32F512GA-V3R |
厂家: | SILICON |
描述: | Blue Gecko Bluetooth ® SiP Module |
文件: | 总142页 (文件大小:3362K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
BGM13S Blue Gecko Bluetooth SiP
Module Data Sheet
The BGM13S is Silicon Labs’ first SiP module solution for Bluetooth 5 connectivity. It
supports 2 Mbps, 1 Mbps and coded LE Bluetooth PHYs. Also, with 512 kB of flash and
KEY FEATURES
64 kB of RAM, the BGM13S is suited to meet Bluetooth Mesh networking memory re-
quirements effectively.
• Bluetooth 5 compliant
• Fit for Bluetooth Mesh
Based on the EFR32BG13 Blue Gecko SoC, the BGM13S delivers robust RF perform-
ance, low energy consumption, a wide selection of MCU peripherals, regulatory test cer-
tificates for various regions and countries, and a simplified development experience, all
in a 6.5 × 6.5 mm package. Together with the certified software stacks and powerful
tools also offered by Silicon Labs, the BGM13S minimizes the area requirements, engi-
neering efforts and development costs associated with adding Bluetooth 5.0 or Bluetooth
Mesh connectivity to any product, accelerating its time-to-market.
• Antenna or RF Pin variants
• Up to +19 dBm TX power
• -94.1 dBm RX sensitivity at 1 Mbps
• 32-bit ARM® Cortex®-M4 core at 38.4
MHz
• 512/64 kB of flash/RAM memory
• Precision Low Frequency Oscillator meets
Bluetooth Low Energy Sleep Clock
accuracy requirements
The BGM13S is intended for a broad range of applications, including:
• Wearables
• Autonomous Hardware Crypto
Accelerators
• IoT end-node devices and gateways
• Health, sports, and wellness
• Industrial, home, and building automation
• Beacons
• Integrated DC-DC converter
• 32 GPIO pins
• 6.5 mm × 6.5 mm × 1.4 mm
• Smart phone, tablet, and PC accessories
Core / Memory
Crystal
Clock Management
Energy Management
Other
H-F Crystal
Oscillator
H-F
RC Oscillator
Voltage
38.4 MHz
CRYPTO
CRC
Voltage Monitor
Regulator
ARM CortexTM M4 processor
with DSP extensions, FPU and MPU
Flash Program
Memory
Precision L-F RC
Oscillator
Auxiliary H-F RC
Oscillator
DC-DC
Power-On Reset
Converter
L-F Crystal
Oscillator
L-F
True Random
Number Generator
RC Oscillator
Brown-Out
Detector
LDMA
Controller
Ultra L-F RC
Oscillator
ETM
Debug Interface
RAM Memory
SMU
32-bit bus
Peripheral Reflex System
Antenna
Radio Transceiver
Serial
I/O Ports
Timers and Triggers
Analog I/F
Interfaces
DEMOD
IFADC
AGC
ADC
External
Interrupts
USART
Timer/Counter
Protocol Timer
Chip Antenna
Matching
Analog
Comparator
PGA
I
Low Energy
UARTTM
General
Purpose I/O
Low Energy
Timer
Low Energy
Sensor Interface
LNA
IDAC
RF Frontend
PA
Capacitive
Touch
I2C
Pin Reset
Pulse Counter
Watchdog Timer
Cryotimer
Frequency
Synthesizer
Q
VDAC
MOD
Real Time
Counter and
Calendar
Pin Wakeup
Op-Amp
Lowest power mode with peripheral operational:
EM0—Active EM1—Sleep
EM2—Deep Sleep
EM3—Stop
EM4—Hibernate
EM4—Shutoff
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Feature List
1. Feature List
• Supported Protocols
• Bluetooth 5
• Support for Internet Security
• General Purpose CRC
• Bluetooth Mesh
• True Random Number Generator (TRNG)
• Wireless System-on-Chip
• 2.4 GHz radio
• 2 × Hardware Cryptographic Accelerators (CRYPTO) for
AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and
ECC
• TX power up to +19 dBm
• Wide Selection of MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
High Performance 32-bit 38.4 MHz ARM Cortex®-M4 with
DSP instruction and floating-point unit for efficient signal
processing
•
• 2 × Digital to Analog Converter (VDAC)
• 3 × Operational Amplifier (Opamp)
• 512 kB flash program memory
• 64 kB RAM data memory
• Digital to Analog Current Converter (IDAC)
• Low-Energy Sensor Interface (LESENSE)
• Multi-channel Capacitive Sense Interface (CSEN)
• Embedded Trace Macrocell (ETM) for advanced debugging
• Integrated DC-DC converter
• High Receiver Performance
• 32 pins connected to analog channels (APORT) shared be-
tween analog peripherals
• -102.1 dBm sensitivity at 125 kbit/s GFSK
• -97.9 dBm sensitivity at 500 kbit/s GFSK
• -94.1 dBm sensitivity at 1 Mbit/s GFSK
• -90.2 dBm sensitivity at 2 Mbit/s GFSK
• Low Energy Consumption
• 32 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 ×16-bit Timer/Counter
• 9.7 mA RX current at 1 Mbps, GFSK
• 8.9 mA TX current at 0 dBm output power
• 87 μA/MHz in Active Mode (EM0)
• 3 or 4 Compare/Capture/PWM channels
• 1 × 32-bit Timer/Counter
• 1.4 μA EM2 DeepSleep current (full RAM retention and
RTCC running from LFXO)
• 3 Compare/Capture/PWM channels
• Precision Low Frequency RC Oscillator (PLFRCO)
• 32-bit Real Time Counter and Calendar
• 16-bit Low Energy Timer for waveform generation
• 1.14 μA EM3 Stop current (State/RAM retention)
• Wake on Radio with signal strength detection, preamble
pattern detection, frame detection and timeout
• 32-bit Ultra Low Energy Timer/Counter for periodic wake-up
from any Energy Mode
• Regulatory Certifications
• FCC
• 16-bit Pulse Counter with asynchronous operation
• 2 × Watchdog Timer
• CE
• IC / ISEDC
• 3 × Universal Synchronous/Asynchronous Receiver/Trans-
mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
• MIC / Telec
• Wide Operating Range
• 1.8 V to 3.8 V single power supply
• -40 °C to +85 °C
• Dimensions
Low Energy UART (LEUART™)
2 × I2C interface with SMBus support and address recogni-
tion in EM3 Stop
•
•
• 6.5 mm × 6.5 mm × 1.4 mm
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®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Flash
(kB)
RAM
(kB)
Ordering Code
Protocol Stack
Max TX Power
19 dBm
19 dBm
19 dBm
19 dBm
8 dBm
Antenna
GPIO
32
Packaging
Cut Tape
Reel
BGM13S32F512GA-V3
BGM13S32F512GA-V3R
BGM13S32F512GN-V3
BGM13S32F512GN-V3R
BGM13S22F512GA-V3
BGM13S22F512GA-V3R
BGM13S22F512GN-V3
BGM13S22F512GN-V3R
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Built-in
Built-in
RF pin
RF pin
Built-in
Built-in
RF pin
RF pin
512
512
512
512
512
512
512
512
64
64
64
64
64
64
64
64
32
32
Cut Tape
Reel
32
32
Cut Tape
Reel
8 dBm
32
8 dBm
32
Cut Tape
Reel
8 dBm
32
Radio board development hardware is also available:
• SLWRB4305A for BGM13S32 Blue Gecko Module Radio Board
• SLWRB4305C for BGM13S22 Blue Gecko Module Radio Board
End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the
formal certification test reports.
Devices ship with the Gecko UART DFU bootloader 1.4.1 + NCP application from Bluetooth SDK 2.8.1.0. The firmware settings con-
form to the diagram shown in .
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Rev. 1.1 | 3
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2.1 Antenna Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2.2 RFSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2.3 Packet and State Trace . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2.4 Random Number Generator . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3.1 Energy Management Unit (EMU) . . . . . . . . . . . . . . . . . . . . . .10
3.3.2 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.3.3 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.4 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . .10
3.5 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.5.1 Clock Management Unit (CMU) . . . . . . . . . . . . . . . . . . . . . . .10
3.5.2 Internal Oscillators and Crystal . . . . . . . . . . . . . . . . . . . . . . .11
3.6 Counters/Timers and PWM . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.6.1 Timer/Counter (TIMER) . . . . . . . . . . . . . . . . . . . . . . . . .11
3.6.2 Wide Timer/Counter (WTIMER) . . . . . . . . . . . . . . . . . . . . . . .11
3.6.3 Real Time Counter and Calendar (RTCC) . . . . . . . . . . . . . . . . . . .11
3.6.4 Low Energy Timer (LETIMER) . . . . . . . . . . . . . . . . . . . . . . .11
3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER) . . . . . . . . . . . . . . . . .11
3.6.6 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.6.7 Watchdog Timer (WDOG). . . . . . . . . . . . . . . . . . . . . . . . .12
3.7 Communications and Other Digital Peripherals . . . . . . . . . . . . . . . . . . .12
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) . . . . . . . . . .12
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) . . . . . . . . . .12
2
3.7.3 Inter-Integrated Circuit Interface (I C) . . . . . . . . . . . . . . . . . . . . .12
3.7.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . . . . . . . . . . .12
3.7.5 Low Energy Sensor Interface (LESENSE) . . . . . . . . . . . . . . . . . . .12
3.8 Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.8.1 General Purpose Cyclic Redundancy Check (GPCRC) . . . . . . . . . . . . . . .12
3.8.2 Crypto Accelerator (CRYPTO) . . . . . . . . . . . . . . . . . . . . . . .13
3.8.3 True Random Number Generator (TRNG) . . . . . . . . . . . . . . . . . . .13
3.8.4 Security Management Unit (SMU) . . . . . . . . . . . . . . . . . . . . . .13
3.9 Analog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.9.1 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.9.2 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . . .13
3.9.3 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . . .13
3.9.4 Capacitive Sense (CSEN). . . . . . . . . . . . . . . . . . . . . . . . .13
3.9.5 Digital to Analog Current Converter (IDAC) . . . . . . . . . . . . . . . . . . .14
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3.9.6 Digital to Analog Converter (VDAC) . . . . . . . . . . . . . . . . . . . . .14
3.9.7 Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . .14
3.10 Reset Management Unit (RMU) . . . . . . . . . . . . . . . . . . . . . . . .14
3.11 Core and Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
3.11.1 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
3.11.2 Memory System Controller (MSC) . . . . . . . . . . . . . . . . . . . . .14
3.11.3 Linked Direct Memory Access Controller (LDMA) . . . . . . . . . . . . . . . .14
3.12 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
3.13 Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . .16
4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .17
4.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . .18
4.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . .19
4.1.3 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . .20
4.1.4 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . .22
4.1.5 Wake Up Times . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
4.1.6 Brown Out Detector (BOD) . . . . . . . . . . . . . . . . . . . . . . . .28
4.1.7 Frequency Synthesizer. . . . . . . . . . . . . . . . . . . . . . . . . .29
4.1.8 2.4 GHz RF Transceiver Characteristics . . . . . . . . . . . . . . . . . . . .30
4.1.9 Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.1.10 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . . . . . .42
4.1.11 General-Purpose I/O (GPIO) . . . . . . . . . . . . . . . . . . . . . . .43
4.1.12 Voltage Monitor (VMON). . . . . . . . . . . . . . . . . . . . . . . . .45
4.1.13 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . .46
4.1.14 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . .48
4.1.15 Digital to Analog Converter (VDAC) . . . . . . . . . . . . . . . . . . . . .51
4.1.16 Current Digital to Analog Converter (IDAC) . . . . . . . . . . . . . . . . . .54
4.1.17 Capacitive Sense (CSEN) . . . . . . . . . . . . . . . . . . . . . . . .56
4.1.18 Operational Amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . .58
4.1.19 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . . .61
4.1.20 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . .61
4.1.21 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
4.1.22 USART SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
5. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 67
5.1 Typical BGM13S Connections . . . . . . . . . . . . . . . . . . . . . . . . .67
6. Layout Guidelines
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
6.1 Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
6.2 Effect of PCB Width . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
6.3 Effect of Plastic and Metal Materials . . . . . . . . . . . . . . . . . . . . . . .70
6.4 Effects of Human Body . . . . . . . . . . . . . . . . . . . . . . . . . . .71
6.5 2D Radiation Pattern Plots . . . . . . . . . . . . . . . . . . . . . . . . . .71
7. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
7.1 BGM13S Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . .73
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7.2 GPIO Functionality Table . . . . . . . . . . . . . . . . . . . . . . . . . .75
7.3 Alternate Functionality Overview . . . . . . . . . . . . . . . . . . . . . . . 103
7.4 Analog Port (APORT) Client Maps
8. Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 1.24
8.1 BGM13S Package Dimensions . . . . . . . . . . . . . . . . . . . . . . 1. 24
8.2 BGM13S Recommeded PCB Land Pattern . . . . . . . . . . . . . . . . . . .127
. . . . . . . . . . . . . . . . . . . . . .115
8.3 BGM13S Package Marking
. . . . . . . . . . . . . . . . . . . . . . . 1.31
9. Tape and Reel Specifications
. . . . . . . . . . . . . . . . . . . . . . . .132
9.1 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . .132
9.2 Reel and Tape Specifications . . . . . . . . . . . . . . . . . . . . . . . . 132
9.3 Orientation and Tape Feed . . . . . . . . . . . . . . . . . . . . . . . . . 133
9.4 Tape and Reel Box Dimensions . . . . . . . . . . . . . . . . . . . . . . .134
9.5 Moisture Sensitivity Level
. . . . . . . . . . . . . . . . . . . . . . . . .134
10. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 135
10.1 Soldering Recommendations. . . . . . . . . . . . . . . . . . . . . . . . 135
11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
11.1 Qualified Antenna Types . . . . . . . . . . . . . . . . . . . . . . . . .136
11.2 Bluetooth
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136
11.3 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.36
11.4 FCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
11.5 ISED Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
11.6 Japan
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1. 40
11.7 KC South Korea . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
System Overview
3. System Overview
3.1 Introduction
The BGM13S product family combines an energy-friendly MCU with a highly integrated radio transceiver and a high performance, ultra
robust antenna. The devices are well suited for any battery operated application, as well as other system where ultra-small size, reliable
high performance RF, low-power consumption and easy application development are key requirements. This section gives a short intro-
duction to the full radio and MCU system.
A detailed block diagram of the BGM13S module is shown in the figure below.
Antenna
Radio Transciever
Port I/O Configuration
Digital Peripherals
IOVDD
DEMOD
IFADC
AGC
Chip
Antenna
RF Frontend
LETIMER
PGA
I
Port A
Drivers
LNA
PAn
TIMER
CRYOTIMER
PCNT
Matching
PA
Frequency
Synthesizer
Q
Port B
Drivers
PBn
PCn
PDn
PFn
MOD
RTC / RTCC
USART
Port
Mapper
Reset
Management
Unit
Port C
Drivers
ARM Cortex-M4 Core
RESETn
LEUART
I2C
Serial Wire
and ETM
Debug /
512 KB ISP Flash
Program Memory
Debug Signals
(shared w/GPIO)
Brown Out /
Power-On
Reset
Port D
Drivers
CRYPTO
CRC
64 KB RAM
Memory Protection Unit
Floating Point Unit
DMA Controller
Programming
A
H
B
A
P
B
Port F
Drivers
LESENSE
Energy Management
IOVDD
1V8
Analog Peripherals
PAVDD / RFVDD / DVDD
bypass
Voltage
Monitor
IDAC
Watchdog
Timer
-
VDAC
+
DC-DC
Converter
VBATT
Voltage
Regulator
Op-Amp
VDD
Internal
Reference
Clock Management
VREGVDD / AVDD
ULFRCO
LFXO
LFXTAL_P
LFXTAL_N
12-bit ADC
Temp
Sense
AUXHFRCO
LFRCO
Internal Crystal
38.4 MHz Crystal
Capacitive
Touch
HFRCO
HFXO
+
-
PLFRCO
Analog Comparator
Figure 3.1. BGM13S Block Diagram
3.2 Radio
The BGM13S features a radio transceiver supporting Bluetooth® low energy protocol. It features a memory buffer and a low-voltage
circuit that can withstand extremely high data rates.
3.2.1 Antenna Interface
The BGM13S has two antenna solution variants. One of them is a high-performance integrated chip antenna (BGM13SxxFxxxxA) and
the other is a 50 Ohm matched RF pin to attach an external antenna to the module (BGM13SxxFxxxxN).
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
System Overview
Table 3.1. Antenna Efficiency and Peak Gain
Parameter
Efficiency
Peak gain
With optimal layout Note
-1 to -2 dB
1 dBi
Antenna efficiency, gain and radiation pattern are highly depend-
ent on the application PCB layout and mechanical design. Refer
to for PCB layout and antenna integration guidelines for optimal
performance.
3.2.2 RFSENSE
The RFSENSE block generates a system wakeup interrupt upon detection of wideband RF energy at the antenna interface, providing
true RF wakeup capabilities from low energy modes including EM2, EM3 and EM4.
RFSENSE triggers on a relatively strong RF signal and is available in the lowest energy modes, allowing exceptionally low energy con-
sumption. RFSENSE does not demodulate or otherwise qualify the received signal, but software may respond to the wakeup event by
enabling normal RF reception.
Various strategies for optimizing power consumption and system response time in presence of false alarms may be employed using
available timer peripherals.
3.2.3 Packet and State Trace
The BGM13S Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It
features:
• Non-intrusive trace of transmit data, receive data and state information
• Data observability on a single-pin UART data output, or on a two-pin SPI data output
• Configurable data output bitrate / baudrate
• Multiplexed transmitted data, received data and state / meta information in a single serial data stream
3.2.4 Random Number Generator
The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain.
The data is suitable for use in cryptographic applications.
Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num-
ber generator algorithms such as Fortuna.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
System Overview
3.3 Power
The BGM13S has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a
single external supply voltage is required, from which all internal voltages are created. An integrated DC-DC buck regulator is utilized to
further reduce the current consumption. Figure 3.2 Power Supply Configuration for BGM13S22xxx Devices on page 9 and Figure
3.3 Power Supply Configuration for BGM13S32xxx Devices on page 9 show how the external and internal supplies of the module
are connected for different part numbers.
BGM13S22 Module
EFR32BG13 SoC
IOVDD
IOVDD
I/O Interfaces
RF
220nF
RFVDD
PAVDD
DVDD
RF PA
1V8
Digital
10nF
4.7µF
VREGSW
DC-DC
DECOUPLE
4.7µH
2.2µF
VREGVDD
VBATT
4.9µF
AVDD
Analog
Figure 3.2. Power Supply Configuration for BGM13S22xxx Devices
BGM13S32 Module
EFR32BG13 SoC
IOVDD
IOVDD
1V8
I/O Interfaces
RF
220nF
RFVDD
DVDD
Digital
10nF
4.7µF
VREGSW
DC-DC
DECOUPLE
4.7µH
2.2µF
VREGVDD
VBATT
4.9µF
AVDD
Analog
RF PA
PAVDD
Figure 3.3. Power Supply Configuration for BGM13S32xxx Devices
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System Overview
3.3.1 Energy Management Unit (EMU)
The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and
features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM
blocks, and it contains control registers for the dc-dc regulator and the Voltage Monitor (VMON). The VMON is used to monitor multiple
supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen
below a chosen threshold.
3.3.2 DC-DC Converter
The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2
and EM3. Patented RF noise mitigation allows operation of the DC-DC converter without degrading sensitivity of radio components.
Protection features include programmable current limiting, short-circuit protection, and dead-time protection. The DC-DC converter may
also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the DC-DC input supply is internally
connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input
supply voltage droops due to excessive output current transients.
3.3.3 Power Domains
The BGM13S has two peripheral power domains for operation in EM2 and EM3. If all of the peripherals in a peripheral power domain
are configured as unused, the power domain for that group will be powered off in the low-power mode, reducing the overall current
consumption of the device.
Table 3.2. Peripheral Power Subdomains
Peripheral Power Domain 1
Peripheral Power Domain 2
ACMP0
PCNT0
ADC0
ACMP1
CSEN
VDAC0
LEUART0
I2C0
LETIMER0
LESENSE
APORT
-
I2C1
IDAC
3.4 General Purpose Input/Output (GPIO)
BGM13S has up to 32 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input.
More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin.
The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to sev-
eral GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals.
The GPIO subsystem supports asynchronous external pin interrupts.
3.5 Clocking
3.5.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the BGM13S. Individual enabling and disabling of clocks to all peripher-
als is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows
software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscilla-
tors.
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3.5.2 Internal Oscillators and Crystal
The BGM13S fully integrates two crystal oscillators, four RC oscillators, and a 38.4 MHz crystal.
• The high-frequency crystal oscillator (HFXO) and integrated 38.4 MHz crystal provide a precise timing reference for the MCU and
radio.
• The low-frequency crystal oscillator (LFXO) provides an accurate timing reference for low energy modes and the real-time-clock cir-
cuits.
• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The
HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.
• An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial
Wire Viewer port with a wide frequency range.
• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation where high accuracy is not required.
• An integrated low frequency precision 32.768 kHz RC oscillator (PLFRCO) can be used as a timing reference in low energy modes,
with 500 ppm accuracy.
• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con-
sumption in low energy modes.
3.6 Counters/Timers and PWM
3.6.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the
PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one
of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output
reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width
modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional
dead-time insertion available in timer unit TIMER_0 only.
3.6.2 Wide Timer/Counter (WTIMER)
WTIMER peripherals function just as TIMER peripherals, but are 32 bits wide. They keep track of timing, count events, generate PWM
outputs and trigger timed actions in other peripherals through the PRS system. The core of each WTIMER is a 32-bit counter with up to
4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a
buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed thresh-
old value. In PWM mode, the WTIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by
the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit WTIMER_0 only.
3.6.3 Real Time Counter and Calendar (RTCC)
The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a
Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla-
tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving
frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy
and convenient data storage in all energy modes down to EM4H.
A secondary RTC is used by the RF protocol stack for event scheduling, leaving the primary RTCC block available exclusively for appli-
cation software.
3.6.4 Low Energy Timer (LETIMER)
The unique LETIMER is a 16-bit timer that is available in energy mode EM2 Deep Sleep in addition to EM1 Sleep and EM0 Active. This
allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed
while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave-
forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con-
figured to start counting on compare matches from the RTCC.
3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)
The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal
oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events
and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-
rupt periods, facilitating flexible ultra-low energy operation.
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3.6.6 Pulse Counter (PCNT)
The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The
clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from
among any of the internal oscillators, except the AUXHFRCO. The peripheral may operate in energy mode EM0 Active, EM1 Sleep,
EM2 Deep Sleep, and EM3 Stop.
3.6.7 Watchdog Timer (WDOG)
The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed
monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can
also monitor autonomous systems driven by PRS.
3.7 Communications and Other Digital Peripherals
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O interface. It supports full duplex asynchronous
UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup-
porting:
• ISO7816 SmartCards
• IrDA
I2S
•
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)
The unique LEUARTTM provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow
UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication
possible with a minimum of software intervention and energy consumption.
3.7.3 Inter-Integrated Circuit Interface (I2C)
The I2C interface enables communication between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave
and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates
from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system.
The interface provided to software by the I2C peripheral allows precise timing control of the transmission process and highly automated
transfers. Automatic recognition of slave addresses is provided in active and low energy modes.
3.7.4 Peripheral Reflex System (PRS)
The Peripheral Reflex System provides a communication network between different peripherals without software involvement. Peripher-
als producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals, which in
turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied
by the PRS to the signals. The PRS allows peripheral to act autonomously without waking the MCU core, saving power.
3.7.5 Low Energy Sensor Interface (LESENSE)
The Low Energy Sensor Interface LESENSETM is a highly configurable sensor interface with support for up to 16 individually configura-
ble sensors. By controlling the analog comparators, ADC, and DAC, LESENSE is capable of supporting a wide range of sensors and
measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a
programmable finite state machine which enables simple processing of measurement results without CPU intervention. LESENSE is
available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy
budget.
3.8 Security Features
3.8.1 General Purpose Cyclic Redundancy Check (GPCRC)
The GPCRC block implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The suppor-
ted 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the
needs of the application.
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3.8.2 Crypto Accelerator (CRYPTO)
The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. EFR32 devices sup-
port AES encryption and decryption with 128- or 256-bit keys, ECC over both GF(P) and GF(2m), SHA-1 and SHA-2 (SHA-224 and
SHA-256).
Supported block cipher modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, GCM, CBC-MAC, GMAC and CCM.
Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.
The CRYPTO1 block is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on
data buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention.
CRYPTO also provides trigger signals for DMA read and write operations.
3.8.3 True Random Number Generator (TRNG)
The TRNG is a non-deterministic random number generator based on a full hardware solution. The TRNG is validated with NIST800-22
and AIS-31 test suites as well as being suitable for FIPS 140-2 certification (for the purposes of cryptographic key generation).
3.8.4 Security Management Unit (SMU)
The Security Management Unit (SMU) allows software to set up fine-grained security for peripheral access, which is not possible in the
Memory Protection Unit (MPU). Peripherals may be secured by hardware on an individual basis, such that only priveleged accesses to
the peripheral's register interface will be allowed. When an access fault occurs, the SMU reports the specific peripheral involved and
can optionally generate an interrupt.
3.9 Analog
3.9.1 Analog Port (APORT)
The Analog Port (APORT) is an analog interconnect matrix allowing access to many analog peripherals on a flexible selection of pins.
Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differentially, buses are
grouped by X/Y pairs.
3.9.2 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-
er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption
is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The
ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the
programmable threshold.
3.9.3 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 Msps. The output
sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples.
The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of
sources, including pins configurable as either single-ended or differential.
3.9.4 Capacitive Sense (CSEN)
The CSEN peripheral is a dedicated Capacitive Sensing block for implementing touch-sensitive user interface elements such a
switches and sliders. The CSEN peripheral uses a charge ramping measurement technique, which provides robust sensing even in
adverse conditions including radiated noise and moisture. The peripheral can be configured to take measurements on a single port pin
or scan through multiple pins and store results to memory through DMA. Several channels can also be shorted together to measure the
combined capacitance or implement wake-on-touch from very low energy modes. Hardware includes a digital accumulator and an aver-
aging filter, as well as digital threshold comparators to reduce software overhead.
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3.9.5 Digital to Analog Current Converter (IDAC)
The IDAC can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC
input pin for capacitive sensing. The full-scale current is programmable between 0.05 µA and 64 µA with several ranges consisting of
various step sizes.
3.9.6 Digital to Analog Converter (VDAC)
The Digital to Analog Converter (VDAC) can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500
ksps, 12-bit converter. The opamps are used in conjunction with the VDAC, to provide output buffering. One opamp is used per single-
ended channel, or two opamps are used to provide differential outputs. The VDAC may be used for a number of different applications
such as sensor interfaces or sound output. The VDAC can generate high-resolution analog signals while the MCU is operating at low
frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any
CPU intervention. The VDAC is available in all energy modes down to and including EM3.
3.9.7 Operational Amplifiers
The opamps are low power amplifiers with a high degree of flexibility targeting a wide variety of standard opamp application areas, and
are available down to EM3. With flexible built-in programming for gain and interconnection they can be configured to support multiple
common opamp functions. All pins are also available externally for filter configurations. Each opamp has a rail to rail input and a rail to
rail output. They can be used in conjunction with the VDAC peripheral or in stand-alone configurations. The opamps save energy, PCB
space, and cost as compared with standalone opamps because they are integrated on-chip.
3.10 Reset Management Unit (RMU)
The RMU is responsible for handling reset of the BGM13S. A wide range of reset sources are available, including several power supply
monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.
3.11 Core and Memory
3.11.1 Processor Core
The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:
• ARM Cortex-M4 RISC processor achieving 1.25 Dhrystone MIPS/MHz
• Memory Protection Unit (MPU) supporting up to 8 memory segments
• Up to 512 kB flash program memory
• Up to 64 kB RAM data memory
• Configuration and event handling of all peripherals
• 2-pin Serial-Wire debug interface
3.11.2 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable
from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code
is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a
read-only page in the information block containing system and device calibration data. Read and write operations are supported in en-
ergy modes EM0 Active and EM1 Sleep.
3.11.3 Linked Direct Memory Access Controller (LDMA)
The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This
reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling so-
phisticated operations to be implemented.
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3.12 Memory Map
The BGM13S memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration.
Figure 3.4. BGM13S Memory Map — Core Peripherals and Code Space
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Figure 3.5. BGM13S Memory Map — Peripherals
3.13 Configuration Summary
Many peripherals on the BGM13S are available in multiple instances. However, certain USART, TIMER and WTIMER instances imple-
ment only a subset of the full features for that peripheral type. The table below describes the specific features available on these periph-
eral instances. All remaining peripherals support full configuration.
Table 3.3. Configuration Summary
Peripheral
USART0
USART1
Configuration
Pin Connections
IrDA SmartCard
US0_TX, US0_RX, US0_CLK, US0_CS
US1_TX, US1_RX, US1_CLK, US1_CS
IrDA I2S SmartCard
IrDA SmartCard
with DTI
USART2
TIMER0
TIMER1
WTIMER0
US2_TX, US2_RX, US2_CLK, US2_CS
TIM0_CC[2:0], TIM0_CDTI[2:0]
TIM1_CC[3:0]
-
with DTI
WTIM0_CC[2:0], WTIM0_CDTI[2:0]
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4. Electrical Specifications
4.1 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
The BGM13S module is powered primarily from the VBATT supply pin. GPIO are powered from the IOVDD supply pin. There are also
several internal supply rails mentioned in the electrical specifications, whose connections vary based on transmit power configuration.
Refer to 3.3 Power for the relationship between the module's external supply pins and the internal voltage supply rails.
Refer to Table 4.2 General Operating Conditions on page 19 for more details about operational supply and temperature limits.
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Electrical Specifications
4.1.1 Absolute Maximum Ratings
Stress levels beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional opera-
tion of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality
and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
TSTG
Test Condition
Min
-40
-0.3
—
Typ
—
Max
85
Unit
°C
Storage temperature range
Voltage on any supply pin
VDDMAX
VDDRAMPMAX
—
3.8
1
V
Voltage ramp rate on any
supply pin
—
V / µs
5V tolerant GPIO pins1 2 3
Standard GPIO pins
DC voltage on any GPIO pin VDIGPIN
-0.3
—
Min of 5.25
and IOVDD
+2
V
-0.3
—
—
—
—
—
IOVDD+0.3
V
Maximum RF level at input
PRFMAX2G4
10
dBm
mA
mA
Total current into supply pins IVDDMAX
Source
Sink
—
200
200
Total current into VSS
ground lines
IVSSMAX
—
Current per I/O pin
IIOMAX
Sink
—
—
—
—
—
—
—
50
50
mA
mA
mA
mA
°C
Source
Sink
Current for all I/O pins
IIOALLMAX
—
200
200
105
Source
—
Junction temperature
TJ
-40
Note:
1. When a GPIO pin is routed to the analog block through the APORT, the maximum voltage = IOVDD.
2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source
below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the
maximum IO current specifications.
3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register.
Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.
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Electrical Specifications
4.1.2 Operating Conditions
The following subsections define the operating conditions for the module.
4.1.2.1 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating ambient tempera- TA
ture range
-G temperature grade
-40
25
85
°C
VBATT operating supply
voltage1
VVBATT
DCDC in regulation
2.4
1.8
—
3.3
3.3
—
3.8
3.8
V
V
DCDC in bypass 50mA load
DCDC in bypass, T ≤ 85 °C
VBATT current
IVBATT
200
mA
V
IOVDD operating supply volt- VIOVDD
age
1.62
—
VVBATT
HFCORECLK frequency
HFCLK frequency
Note:
fCORE
VSCALE2, MODE = WS1
VSCALE0, MODE = WS2
VSCALE2
—
—
—
—
—
—
—
—
40
20
40
20
MHz
MHz
MHz
MHz
fHFCLK
VSCALE0
1. The minimum voltage required in bypass mode is calculated using RBYP from the DCDC specification table. Requirements for
other loads can be calculated as VVBATT_min+ILOAD * RBYP_max
.
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Electrical Specifications
4.1.3 DC-DC Converter
Test conditions: V_DCDC_I=3.3 V, V_DCDC_O=1.8 V, I_DCDC_LOAD=50 mA, Heavy Drive configuration, F_DCDC_LN=7 MHz, un-
less otherwise indicated.
Table 4.3. DC-DC Converter
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input voltage range
VDCDC_I
Bypass mode, IDCDC_LOAD = 50
mA
1.8
—
VVREGVDD_
V
MAX
Low noise (LN) mode, 1.8 V out-
put, IDCDC_LOAD = 100 mA, or
Low power (LP) mode, 1.8 V out-
put, IDCDC_LOAD = 10 mA
2.4
—
VVREGVDD_
V
MAX
Output voltage programma- VDCDC_O
ble range1
1.8
—
VVREGVDD
V
Regulation DC accuracy
ACCDC
Low Noise (LN) mode, 1.8 V tar-
get output
1.7
—
—
1.9
2.2
V
V
Regulation window2
WINREG
Low Power (LP) mode,
LPCMPBIASEMxx3 = 0, 1.8 V tar-
get output, IDCDC_LOAD ≤ 75 µA
1.63
Low Power (LP) mode,
1.63
—
2.1
V
LPCMPBIASEMxx3 = 3, 1.8 V tar-
get output, IDCDC_LOAD ≤ 10 mA
Steady-state output ripple
VR
Radio disabled
—
—
3
—
mVpp
mV
CCM Mode (LNFORCECCM3 =
1), Load changes between 0 mA
and 100 mA
Output voltage under/over-
shoot
VOV
25
60
DCM Mode (LNFORCECCM3 =
0), Load changes between 0 mA
and 10 mA
—
45
90
mV
Overshoot during LP to LN
CCM/DCM mode transitions com-
pared to DC level in LN mode
—
—
200
40
—
—
mV
mV
Undershoot during BYP/LP to LN
CCM (LNFORCECCM3 = 1) mode
transitions compared to DC level
in LN mode
Undershoot during BYP/LP to LN
—
100
—
mV
DCM (LNFORCECCM3 = 0) mode
transitions compared to DC level
in LN mode
DC line regulation
DC load regulation
VREG
Input changes between
VVREGVDD_MAX and 2.4 V
—
—
0.1
0.1
—
—
%
%
IREG
Load changes between 0 mA and
100 mA in CCM mode
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Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max load current
ILOAD_MAX
Low noise (LN) mode, Medium or
Heavy Drive4
—
—
80
mA
Low noise (LN) mode, Light
Drive4
—
—
—
—
—
—
50
75
10
mA
µA
Low power (LP) mode,
LPCMPBIASEMxx3 = 0
Low power (LP) mode,
LPCMPBIASEMxx3 = 3
mA
Note:
1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, VVREGVDD
.
2. LP mode controller is a hysteretic controller that maintains the output voltage within the specified limits.
3. LPCMPBIASEMxx refers to either LPCMPBIASEM234H in the EMU_DCDCMISCCTRL register or LPCMPBIASEM01 in the
EMU_DCDCLOEM01CFG register, depending on the energy mode.
4. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi-
um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.4 Current Consumption
4.1.4.1 Current Consumption 3.3 V using DC-DC Converter
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at T = 25 °C.
Table 4.4. Current Consumption 3.3 V using DC-DC Converter
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM0 IACTIVE_DCM
mode with all peripherals dis-
abled, DCDC in Low Noise
DCM mode1
38.4 MHz crystal, CPU running
while loop from flash2
—
87
—
µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
—
69
70
—
—
—
—
—
—
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
82
26 MHz HFRCO, CPU running
while loop from flash
76
1 MHz HFRCO, CPU running
while loop from flash
615
97
Current consumption in EM0 IACTIVE_CCM
mode with all peripherals dis-
abled, DCDC in Low Noise
CCM mode3
38.4 MHz crystal, CPU running
while loop from flash2
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
—
—
80
81
—
—
—
—
—
—
—
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
92
26 MHz HFRCO, CPU running
while loop from flash
94
1 MHz HFRCO, CPU running
while loop from flash
1145
101
1124
Current consumption in EM0 IACTIVE_CCM_VS 19 MHz HFRCO, CPU running
mode with all peripherals dis-
abled and voltage scaling
enabled, DCDC in Low
Noise CCM mode3
while loop from flash
1 MHz HFRCO, CPU running
while loop from flash
38.4 MHz crystal2
38 MHz HFRCO
26 MHz HFRCO
1 MHz HFRCO
19 MHz HFRCO
1 MHz HFRCO
Current consumption in EM1 IEM1_DCM
mode with all peripherals dis-
abled, DCDC in Low Noise
—
56
—
µA/MHz
—
—
—
—
—
39
46
—
—
—
—
—
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
DCM mode1
588
50
Current consumption in EM1 IEM1_DCM_VS
mode with all peripherals dis-
abled and voltage scaling
572
enabled, DCDC in Low
Noise DCM mode1
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM2 IEM2_VS
mode, with voltage scaling
enabled, DCDC in LP mode4
Full 64 kB RAM retention and
RTCC running from LFXO
—
1.4
—
µA
Full 64 kB RAM retention and
RTCC running from LFRCO
—
—
—
—
1.5
2.0
1.9
1.3
—
—
—
—
µA
µA
µA
µA
Full 64 kB RAM retention and
PRORTCC running from PLFRCO
1 bank RAM retention and
PRORTCC running from PLFRCO
1 bank RAM retention and RTCC
running from LFRCO5
Current consumption in EM3 IEM3_VS
mode, with voltage scaling
enabled
Full 64 kB RAM retention and
CRYOTIMER running from ULFR-
CO
—
1.14
—
µA
Current consumption in
EM4H mode, with voltage
scaling enabled
IEM4H_VS
128 byte RAM retention, RTCC
running from LFXO
—
—
0.75
0.44
—
—
µA
µA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
128 byte RAM retention, no RTCC
No RAM retention, no RTCC
—
—
0.42
0.07
—
—
µA
µA
Current consumption in
EM4S mode
IEM4S
Note:
1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD.
2. CMU_HFXOCTRL_LOWPOWER=0.
3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD.
4. DCDC Low Power Mode = Medium Drive, LPOSCDIV=1, LPCMPBIASEM234H=0, LPCLIMILIMSEL=1, ANASW=DVDD.
5. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.4.2 Current Consumption 1.8 V (DC-DC Converter in Bypass Mode)
Unless otherwise indicated, typical conditions are: VBATT = 1.8 V. T = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at T = 25 °C.
Table 4.5. Current Consumption 1.8 V (DC-DC Converter in Bypass Mode)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM0 IACTIVE
mode with all peripherals dis-
abled
38.4 MHz crystal, CPU running
while loop from flash1
—
128
—
µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
—
—
—
97
98
—
—
—
—
—
—
—
—
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
119
100
243
86
26 MHz HFRCO, CPU running
while loop from flash
1 MHz HFRCO, CPU running
while loop from flash
Current consumption in EM0 IACTIVE_VS
mode with all peripherals dis-
abled and voltage scaling
enabled
19 MHz HFRCO, CPU running
while loop from flash
1 MHz HFRCO, CPU running
while loop from flash
206
76
38.4 MHz crystal1
38 MHz HFRCO
26 MHz HFRCO
1 MHz HFRCO
19 MHz HFRCO
1 MHz HFRCO
Current consumption in EM1 IEM1
mode with all peripherals dis-
abled
—
—
—
—
—
47
48
—
—
—
—
—
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
191
43
Current consumption in EM1 IEM1_VS
mode with all peripherals dis-
abled and voltage scaling
enabled
163
Current consumption in EM2 IEM2_VS
mode, with voltage scaling
enabled
Full 64 kB RAM retention and
RTCC running from LFXO
—
—
—
—
—
1.8
2.0
2.7
2.5
1.6
—
—
—
—
—
µA
µA
µA
µA
µA
Full 64 kB RAM retention and
RTCC running from LFRCO
Full 64 kB RAM retention and
PRORTCC running from PLFRCO
1 bank (16 kB) RAM retention and
PRORTCC running from PLFRCO
1 bank (16 kB) RAM retention and
RTCC running from LFRCO2
Current consumption in EM3 IEM3_VS
mode, with voltage scaling
enabled
Full 64 kB RAM retention and
CRYOTIMER running from ULFR-
CO
—
1.43
—
µA
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in
EM4H mode, with voltage
scaling enabled
IEM4H_VS
128 byte RAM retention, RTCC
running from LFXO
—
0.83
—
µA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
—
0.37
—
µA
128 byte RAM retention, no RTCC
no RAM retention, no RTCC
—
—
0.36
0.05
—
—
µA
µA
Current consumption in
EM4S mode
IEM4S
Note:
1. CMU_HFXOCTRL_LOWPOWER=0.
2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.4.3 Current Consumption 3.3 V (DC-DC Converter in Bypass Mode)
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at T = 25 °C.
Table 4.6. Current Consumption 3.3 V (DC-DC Converter in Bypass Mode)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in EM0 IACTIVE
mode with all peripherals dis-
abled
38.4 MHz crystal, CPU running
while loop from flash1
—
128
—
µA/MHz
38 MHz HFRCO, CPU running
Prime from flash
—
—
—
—
—
—
—
—
97
98
—
107
—
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
38 MHz HFRCO, CPU running
CoreMark from flash
119
100
246
86
26 MHz HFRCO, CPU running
while loop from flash
109
430
—
1 MHz HFRCO, CPU running
while loop from flash
Current consumption in EM0 IACTIVE_VS
mode with all peripherals dis-
abled and voltage scaling
enabled
19 MHz HFRCO, CPU running
while loop from flash
1 MHz HFRCO, CPU running
while loop from flash
209
76
—
38.4 MHz crystal1
38 MHz HFRCO
26 MHz HFRCO
1 MHz HFRCO
19 MHz HFRCO
1 MHz HFRCO
Current consumption in EM1 IEM1
mode with all peripherals dis-
abled
—
—
—
—
—
—
47
49
51
55
µA/MHz
µA/MHz
µA/MHz
µA/MHz
µA/MHz
195
43
374
—
Current consumption in EM1 IEM1_VS
mode with all peripherals dis-
abled and voltage scaling
enabled
167
—
Current consumption in EM2 IEM2_VS
mode, with voltage scaling
enabled
Full 64 kB RAM retention and
RTCC running from LFXO
—
—
—
—
—
1.9
2.2
2.6
2.8
1.9
—
—
µA
µA
µA
µA
µA
Full 64 kB RAM retention and
RTCC running from LFRCO
1 bank (16 kB) RAM retention and
PRORTCC running from PLFRCO
—
Full 64 kB RAM retention and
PRORTCC running from PLFRCO
—
1 bank (16 kB) RAM retention and
RTCC running from LFRCO2
3.3
Current consumption in EM3 IEM3_VS
mode, with voltage scaling
enabled
Full 64 kB RAM retention and
CRYOTIMER running from ULFR-
CO
—
1.53
3.0
µA
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in
EM4H mode, with voltage
scaling enabled
IEM4H_VS
128 byte RAM retention, RTCC
running from LFXO
—
0.93
—
µA
128 byte RAM retention, CRYO-
TIMER running from ULFRCO
—
0.45
—
µA
128 byte RAM retention, no RTCC
No RAM retention, no RTCC
—
—
0.44
0.04
0.9
µA
µA
Current consumption in
EM4S mode
IEM4S
0.18
Note:
1. CMU_HFXOCTRL_LOWPOWER=0.
2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1
4.1.4.4 Current Consumption Using Radio
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. DC-DC on. Minimum and maximum values in this table
represent the worst conditions across process variation at T = 25 °C.
Table 4.7. Current Consumption Using Radio
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Current consumption in re-
ceive mode, active packet
reception (MCU in EM1 @
38.4 MHz, peripheral clocks
disabled), T ≤ 85 °C
IRX_ACTIVE
125 kbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
—
9.4
—
mA
500 kbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
—
—
—
—
—
—
—
—
—
—
9.4
9.7
—
—
—
—
—
—
—
—
—
—
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
1 Mbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
2 Mbit/s, 2GFSK, F = 2.4 GHz,
Radio clock prescaled by 4
10.5
10.4
10.4
10.7
11.5
8.9
Current consumption in re-
ceive mode, listening for
packet (MCU in EM1 @ 38.4
MHz, peripheral clocks disa-
bled), T ≤ 85 °C
IRX_LISTEN
125 kbit/s, 2GFSK, F = 2.4 GHz,
No radio clock prescaling
500 kbit/s, 2GFSK, F = 2.4 GHz,
No radio clock prescaling
1 Mbit/s, 2GFSK, F = 2.4 GHz, No
radio clock prescaling
2 Mbit/s, 2GFSK, F = 2.4 GHz, No
radio clock prescaling
Current consumption in
transmit mode (MCU in EM1
@ 38.4 MHz, peripheral
clocks disabled), T ≤ 85 °C
ITX
F = 2.4 GHz, CW, 0 dBm output
power, Radio clock prescaled by 3
F = 2.4 GHz, CW, 0 dBm output
power, Radio clock prescaled by 1
9.7
F = 2.4 GHz, CW, 8 dBm output
power
27.4
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.5 Wake Up Times
Table 4.8. Wake Up Times
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
Wake up time from EM1
tEM1_WU
—
3
—
AHB
Clocks
Wake up from EM2
Wake up from EM3
tEM2_WU
Code execution from flash
Code execution from RAM
Code execution from flash
Code execution from RAM
Executing from flash
—
—
—
—
—
10.9
3.8
—
—
—
—
—
µs
µs
µs
µs
µs
tEM3_WU
10.9
3.8
Wake up from EM4H1
Wake up from EM4S1
tEM4H_WU
tEM4S_WU
tRESET
90
Executing from flash
—
300
—
µs
Time from release of reset
source to first instruction ex-
ecution
Soft Pin Reset released
Any other reset released
—
—
51
—
—
µs
µs
358
Power mode scaling time
tSCALE
VSCALE0 to VSCALE2, HFCLK =
19 MHz2 3
—
—
31.8
4.3
—
—
µs
µs
VSCALE2 to VSCALE0, HFCLK =
19 MHz4
Note:
1. Time from wake up request until first instruction is executed. Wakeup results in device reset.
2. Scaling up from VSCALE0 to VSCALE2 requires approximately 30.3 µs + 28 HFCLKs.
3. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV/µs for approximately 20 µs. During this transition,
peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA
(with a 2.7 µF capacitor).
4. Scaling down from VSCALE2 to VSCALE0 requires approximately 2.8 µs + 29 HFCLKs.
4.1.6 Brown Out Detector (BOD)
Table 4.9. Brown Out Detector (BOD)
Parameter
Symbol
Test Condition
Min
—
Typ
—
Max
1.8
—
Unit
V
AVDD BOD threshold
VAVDDBOD
AVDD rising
AVDD falling (EM0/EM1)
AVDD falling (EM2/EM3)
1.62
1.53
—
—
V
—
—
V
AVDD BOD hysteresis
AVDD BOD response time
EM4 BOD threshold
VAVDDBOD_HYST
20
2.4
—
—
mV
µs
V
tAVDDBOD_DELAY Supply drops at 0.1V/µs rate
—
—
VEM4DBOD
AVDD rising
AVDD falling
—
1.7
—
1.45
—
—
V
EM4 BOD hysteresis
VEM4BOD_HYST
25
300
—
mV
µs
EM4 BOD response time
tEM4BOD_DELAY Supply drops at 0.1V/µs rate
—
—
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.7 Frequency Synthesizer
Table 4.10. Frequency Synthesizer
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
RF synthesizer frequency
range
fRANGE
2400 - 2483.5 MHz
2400
—
2483.5
MHz
LO tuning frequency resolu- fRES
tion with 38.4 MHz crystal
2400 - 2483.5 MHz
2400 - 2483.5 MHz
2400 - 2483.5 MHz
—
—
—
—
—
—
73
73
Hz
Hz
Frequency deviation resolu- dfRES
tion with 38.4 MHz crystal
Maximum frequency devia-
tion with 38.4 MHz crystal
dfMAX
1677
kHz
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8 2.4 GHz RF Transceiver Characteristics
4.1.8.1 RF Transmitter General Characteristics for 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.11. RF Transmitter General Characteristics for 2.4 GHz Band
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Maximum TX power1
POUTMAX
19 dBm-rated part numbers.
PAVDD connected directly to ex-
ternal 3.3V supply
—
18.9
—
dBm
8 dBm-rated part numbers
CW
—
7.8
-30
1
—
—
—
—
dBm
dBm
dB
Minimum active TX Power
Output power step size
POUTMIN
POUTSTEP
-5 dBm< Output power < 0 dBm
—
—
0 dBm < output power <
POUTMAX
0.5
dB
Output power variation vs
supply at POUTMAX
POUTVAR_V
1.8 V < VVREGVDD < 3.3 V,
PAVDD connected directly to ex-
ternal supply, for output power >
10 dBm.
—
4.5
—
dB
1.8 V < VVREGVDD < 3.3 V using
DC-DC converter
—
—
—
—
2.1
1.7
1.7
0.3
—
—
—
—
dB
dB
dB
dB
Output power variation vs
temperature at POUTMAX
POUTVAR_T
From -40 to +85 °C, PAVDD con-
nected to DC-DC output
From -40 to +85 °C, PAVDD con-
nected to external supply
Output power variation vs RF POUTVAR_F
frequency at POUTMAX
Over RF tuning frequency range,
PAVDD connected to external
supply
RF tuning frequency range
FRANGE
2400
—
2483.5
MHz
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-
ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.2 RF Receiver General Characteristics for 2.4 GHz Band
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.12. RF Receiver General Characteristics for 2.4 GHz Band
Parameter
Symbol
FRANGE
SPURRX
Test Condition
Min
2400
—
Typ
—
Max
2483.5
—
Unit
MHz
dBm
dBm
dBm
RF tuning frequency range
Receive mode maximum
spurious emission
30 MHz to 1 GHz
1 GHz to 12 GHz
-57
—
-47
—
Max spurious emissions dur- SPURRX_FCC
ing active receive mode, per
FCC Part 15.109(a)
216 MHz to 960 MHz, Conducted
Measurement
—
-55.2
—
Above 960 MHz, Conducted
Measurement
—
—
-47.2
-24
—
—
dBm
dBm
Level above which
RFSENSE will trigger1
RFSENSETRIG
CW at 2.45 GHz
Level below which
RFSENSE will not trigger1
RFSENSETHRES CW at 2.45 GHz
—
-50
—
dBm
Note:
1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
4.1.8.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.13. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Power spectral density limit
PSDLIMIT
Per FCC part 15.247 at 10 dBm
—
—
8
dBm/
3kHz
Per FCC part 15.247 at 20 dBm1
—
—
—
8
dBm/
3kHz
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC
Emissions taken at
SPUROOB_FCC
Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3
-47
—
dBm
.
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
Note:
1. Output power limited to 14 dBm to ensure compliance with FCC specifications.
2. For 2476 MHz, 1.2 dB of power backoff is used to achieve this value.
3. For 2478 MHz, 5.8 dB of power backoff is used to achieve this value.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.14. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal is reference signal1. Packet
length is 20 bytes.
Max usable receiver input
level, 0.1% BER
SAT
—
10
—
dBm
Signal is reference signal1. Using
DC-DC converter.
Sensitivity, 0.1% BER
SENS
—
—
-102.1
-101.8
—
—
dBm
dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
N+1 adjacent channel selec- C/I1+
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at +1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
—
—
-14.0
-13.6
—
—
dB
dB
reference signal at -79 dBm
N-1 adjacent channel selec- C/I1-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at -1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
reference signal at -79 dBm
Selectivity to image frequen- C/IIM
cy, 0.1% BER. Desired is ref-
erence signal at -79 dBm
Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
—
—
-51.6
-55.5
—
—
dB
dB
Selectivity to image frequen- C/IIM+1
cy ± 1 MHz, 0.1% BER. De-
sired is reference signal at
-79 dBm
Interferer is reference signal at im-
age frequency ± 1 MHz with 1
MHz precision
Note:
1. Reference signal is defined 2GFSK at -79 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 125 kbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.15. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Power spectral density limit
PSDLIMIT
Per FCC part 15.247 at 10 dBm
—
-9.8
—
dBm/
3kHz
Per FCC part 15.247 at 20 dBm1
—
—
—
8
dBm/
3kHz
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC
Emissions taken at
SPUROOB_FCC
Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3
-47
—
dBm
.
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
Note:
1. Output power limited to 14 dBm to ensure compliance with FCC specifications.
2. For 2476 MHz, 1.2 dB of power backoff is used to achieve this value.
3. For 2478 MHz, 5.8 dB of power backoff is used to achieve this value.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.16. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal is reference signal1. Packet
length is 20 bytes.
Max usable receiver input
level, 0.1% BER
SAT
—
10
—
dBm
Signal is reference signal1. Using
DC-DC converter.
Sensitivity, 0.1% BER
SENS
—
—
-97.9
-97.0
—
—
dBm
dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
N+1 adjacent channel selec- C/I1+
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at +1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
—
—
—
-9.2
-9.0
—
—
—
dB
dB
dB
reference signal at -72 dBm
N-1 adjacent channel selec- C/I1-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at -1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
reference signal at -72 dBm
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -72 dBm
C/I2
Interferer is reference signal at ± 2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
-46.5
Selectivity to image frequen- C/IIM
cy, 0.1% BER. Desired is ref-
erence signal at -72 dBm
Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
—
—
-46.5
-50.7
—
—
dB
dB
Selectivity to image frequen- C/IIM+1
cy ± 1 MHz, 0.1% BER. De-
sired is reference signal at
-72 dBm
Interferer is reference signal at im-
age frequency ± 1 MHz with 1
MHz precision
Note:
1. Reference signal is defined 2GFSK at -72 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 500 kbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.7 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.17. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
—
Typ
-39.7
-43.6
—
Max
—
Unit
dBm
dBm
dBm
dBm
dBm
In-band spurious emissions, SPURINB
with allowed exceptions1
At ± 2 MHz, 10 dBm
At ± 3 MHz, 10 dBm
At ± 2 MHz, 20 dBm
At ± 3 MHz, 20 dBm
—
—
—
-20
-30
—
—
—
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC
Emissions taken at
SPUROOB_FCC
Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3
—
-47
.
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
Note:
1. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a
frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.
2. For 2476 MHz, 1.5 dB of power backoff is used to achieve this value.
3. For 2478 MHz, 4.2 dB of power backoff is used to achieve this value.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.18. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal is reference signal1. Packet
length is 20 bytes.
Max usable receiver input
level, 0.1% BER
SAT
—
10
—
dBm
Signal is reference signal1. Using
DC-DC converter.
Sensitivity, 0.1% BER
SENS
—
—
-94.1
-93.8
—
—
dBm
dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
Signal to co-channel interfer- C/ICC
er, 0.1% BER
Desired signal 3 dB above refer-
ence sensitivity.
—
—
9.0
—
—
dB
dB
N+1 adjacent channel selec- C/I1+
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at +1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
-3.3
reference signal at -67 dBm
N-1 adjacent channel selec- C/I1-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at -1
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
—
—
—
-1.6
-42.0
-46.4
—
—
—
dB
dB
dB
reference signal at -67 dBm
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I2
Interferer is reference signal at ± 2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I3
Interferer is reference signal at ± 3
MHz offset. Desired frequency
2404 MHz ≤ Fc ≤ 2480 MHz
Selectivity to image frequen- C/IIM
cy, 0.1% BER. Desired is ref-
erence signal at -67 dBm
Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
—
—
-42.0
-47.1
—
—
dB
dB
Selectivity to image frequen- C/IIM+1
cy ± 1 MHz, 0.1% BER. De-
sired is reference signal at
-67 dBm
Interferer is reference signal at im-
age frequency ± 1 MHz with 1
MHz precision
Intermodulation performance IM
Per Core_4.1, Vol 6, Part A, Sec-
tion 4.4 with n = 3
—
-18.4
—
dBm
Note:
1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.9 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.19. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
—
Typ
-38.2
-41.1
-30.1
-31.4
-47
Max
—
Unit
dBm
dBm
dBm
dBm
dBm
In-band spurious emissions, SPURINB
with allowed exceptions1
At ± 4 MHz, 10 dBm
At ± 6 MHz, 10 dBm
At ± 4 MHz, 20 dBm
At ± 6 MHz, 20 dBm
—
—
—
—
—
—
Spurious emissions out-of-
band, excluding harmonics
captured in SPURHARM,FCC
Emissions taken at
SPUROOB_FCC
Per FCC part 15.205/15.209,
Above 2.483 GHz or below 2.4
GHz; continuous transmission of
CW carrier, Restricted Bands2 3 4
5
—
—
.
POUTMAX, PAVDD connec-
ted to external 3.3 V supply
Note:
1. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a
frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.
2. For 2472 MHz, 1.3 dB of power backoff is used to achieve this value.
3. For 2474 MHz, 3.8 dB of power backoff is used to achieve this value.
4. For 2476 MHz, 7 dB of power backoff is used to achieve this value.
5. For 2478 MHz, 11.2 dB of power backoff is used to achieve this value.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.8.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center
frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
Table 4.20. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal is reference signal1. Packet
length is 20 bytes.
Max usable receiver input
level, 0.1% BER
SAT
—
10
—
dBm
Signal is reference signal1. Using
DC-DC converter.
Sensitivity, 0.1% BER
SENS
—
—
-90.2
-89.9
—
—
dBm
dBm
With non-ideal signals as speci-
fied in RF-PHY.TS.4.2.2, section
4.6.1.
Signal to co-channel interfer- C/ICC
er, 0.1% BER
Desired signal 3 dB above refer-
ence sensitivity.
—
—
8.6
—
—
dB
dB
N+1 adjacent channel selec- C/I1+
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at +2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
-7.6
reference signal at -67 dBm
N-1 adjacent channel selec- C/I1-
tivity, 0.1% BER, with allowa-
ble exceptions. Desired is
Interferer is reference signal at -2
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
—
—
—
-11.4
-40.3
-45.1
—
—
—
dB
dB
dB
reference signal at -67 dBm
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I2
Interferer is reference signal at ± 4
MHz offset. Desired frequency
2402 MHz ≤ Fc ≤ 2480 MHz
Alternate selectivity, 0.1%
BER, with allowable excep-
tions. Desired is reference
signal at -67 dBm
C/I3
Interferer is reference signal at ± 6
MHz offset. Desired frequency
2404 MHz ≤ Fc ≤ 2480 MHz
Selectivity to image frequen- C/IIM
cy, 0.1% BER. Desired is ref-
erence signal at -67 dBm
Interferer is reference signal at im-
age frequency with 1 MHz preci-
sion
—
—
-7.6
—
—
dB
dB
Selectivity to image frequen- C/IIM+1
cy ± 2 MHz, 0.1% BER. De-
sired is reference signal at
-67 dBm
Interferer is reference signal at im-
age frequency ± 2 MHz with 2
MHz precision
-40.30
Intermodulation performance IM
Per Core_4.1, Vol 6, Part A, Sec-
tion 4.4 with n = 3
—
-18.4
—
dBm
Note:
1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;
interferer data = PRBS15; frequency accuracy better than 1 ppm.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.9 Oscillators
4.1.9.1 Low-Frequency Crystal Oscillator (LFXO)
Table 4.21. Low-Frequency Crystal Oscillator (LFXO)
Parameter
Symbol
Test Condition
Min
—
Typ
32.768
—
Max
—
Unit
kHz
kΩ
Crystal frequency
fLFXO
Supported crystal equivalent ESRLFXO
series resistance (ESR)
—
70
Supported range of crystal
load capacitance 1
CLFXO_CL
6
8
—
—
18
40
pF
pF
On-chip tuning cap range 2
CLFXO_T
On each of LFXTAL_N and
LFXTAL_P pins
On-chip tuning cap step size SSLFXO
—
—
0.25
273
—
—
pF
nA
Current consumption after
startup 3
ILFXO
ESR = 70 kOhm, CL = 7 pF,
GAIN4 = 2, AGC4 = 1
Start- up time
tLFXO
ESR = 70 kOhm, CL = 7 pF,
GAIN4 = 2
—
308
—
ms
Note:
1. Total load capacitance as seen by the crystal.
2. The effective load capacitance seen by the crystal will be CLFXO_T /2. This is because each XTAL pin has a tuning cap and the
two caps will be seen in series by the crystal.
3. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.
4. In CMU_LFXOCTRL register.
4.1.9.2 High-Frequency Crystal Oscillator (HFXO)
Table 4.22. High-Frequency Crystal Oscillator (HFXO)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Crystal frequency
fHFXO
38.4 MHz required for radio trans-
ciever operation
—
38.4
—
MHz
Frequency tolerance for the FTHFXO
crystal
-40
—
40
ppm
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.9.3 Low-Frequency RC Oscillator (LFRCO)
Table 4.23. Low-Frequency RC Oscillator (LFRCO)
Parameter
Symbol
Test Condition
ENVREF1 = 1
ENVREF1 = 0
Min
Typ
Max
Unit
Oscillation frequency
fLFRCO
31.3
32.768
33.6
kHz
31.3
—
32.768
500
33.4
—
kHz
µs
Startup time
tLFRCO
ILFRCO
Current consumption 2
ENVREF = 1 in
CMU_LFRCOCTRL
—
342
—
nA
ENVREF = 0 in
—
494
—
nA
CMU_LFRCOCTRL
Note:
1. In CMU_LFRCOCTRL register.
2. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.
4.1.9.4 Precision Low-Frequency RC Oscillator (PLFRCO)
Table 4.24. Precision Low-Frequency RC Oscillator (PLFRCO)
Parameter
Symbol
Test Condition
Min
—
Typ
32.768
—
Max
—
Unit
kHz
ppm
Oscillation frequency
fPLFRCO
Frequency accuracy1 2
fPLFRCO_ACC
Across operating temperature
range
-500
500
Startup time
tPLFRCO
—
64.2
—
ms
Note:
1. The Frequency accuracy limits, calculated with 3-sigma standard deviation, apply for temperatures -20 °C to 85 °C for G temp-
grade and -20 °C to 125 °C for I temp-grade.
2. 99.953% (3.5 sigma) of the overall device population comply to the Max. and Min. limits.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.9.5 High-Frequency RC Oscillator (HFRCO)
Table 4.25. High-Frequency RC Oscillator (HFRCO)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Frequency accuracy
fHFRCO_ACC
At production calibrated frequen-
cies, across supply voltage and
temperature
-2.5
—
2.5
%
Start-up time
tHFRCO
fHFRCO ≥ 19 MHz
4 < fHFRCO < 19 MHz
fHFRCO ≤ 4 MHz
fHFRCO = 38 MHz
fHFRCO = 32 MHz
fHFRCO = 26 MHz
fHFRCO = 19 MHz
fHFRCO = 16 MHz
fHFRCO = 13 MHz
fHFRCO = 7 MHz
fHFRCO = 4 MHz
fHFRCO = 2 MHz
fHFRCO = 1 MHz
—
—
—
—
—
—
—
—
—
—
—
—
—
—
300
1
—
—
ns
µs
2.5
267
224
189
154
133
118
89
—
µs
Current consumption on all
supplies
IHFRCO
299
248
211
172
148
135
100
44
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
%
34
29
40
26
36
Coarse trim step size (% of
period)
SSHFRCO_COARS
0.8
—
E
Fine trim step size (% of pe- SSHFRCO_FINE
riod)
—
0.1
—
%
Period jitter
PJHFRCO
—
0.2
—
—
% RMS
MHz
Frequency limits
fHFRCO_BAND
FREQRANGE = 0, FINETUNIN-
GEN = 0
3.47
6.15
FREQRANGE = 3, FINETUNIN-
GEN = 0
6.24
11.3
—
—
—
—
—
—
—
11.45
19.8
22.8
29.0
40.63
48
MHz
MHz
MHz
MHz
MHz
MHz
MHz
FREQRANGE = 6, FINETUNIN-
GEN = 0
FREQRANGE = 7, FINETUNIN-
GEN = 0
13.45
16.5
FREQRANGE = 8, FINETUNIN-
GEN = 0
FREQRANGE = 10, FINETUNIN-
GEN = 0
23.11
27.27
33.33
FREQRANGE = 11, FINETUNIN-
GEN = 0
FREQRANGE = 12, FINETUNIN-
GEN = 0
54
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.9.6 Ultra-low Frequency RC Oscillator (ULFRCO)
Table 4.26. Ultra-low Frequency RC Oscillator (ULFRCO)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Oscillation frequency
fULFRCO
0.95
1
1.07
kHz
4.1.10 Flash Memory Characteristics1
Table 4.27. Flash Memory Characteristics1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Flash erase cycles before
failure
ECFLASH
10000
—
—
cycles
Flash data retention
RETFLASH
tW_PROG
10
20
—
—
years
µs
Word (32-bit) programming
time
Burst write, 128 words, average
time per word
26.3
30
Single word
62
20
68.9
29.5
80
40
µs
Page erase time2
Mass erase time3
Device erase time4 5
Erase current6
tPERASE
tMERASE
tDERASE
IERASE
ms
20
—
30
56.2
—
40
70
ms
ms
mA
mA
V
Page Erase
—
2.0
3.5
3.6
Write current6
IWRITE
—
—
Supply voltage during flash
erase and write
VFLASH
1.62
—
Note:
1. Flash data retention information is published in the Quarterly Quality and Reliability Report.
2. From setting the ERASEPAGE bit in MSC_WRITECMD to 1 until the BUSY bit in MSC_STATUS is cleared to 0. Internal setup
and hold times for flash control signals are included.
3. Mass erase is issued by the CPU and erases all flash.
4. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock
Word (ULW).
5. From setting the DEVICEERASE bit in AAP_CMD to 1 until the ERASEBUSY bit in AAP_STATUS is cleared to 0. Internal setup
and hold times for flash control signals are included.
6. Measured at 25 °C.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.11 General-Purpose I/O (GPIO)
Table 4.28. General-Purpose I/O (GPIO)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input low voltage1
Input high voltage1
VIL
VIH
GPIO pins
—
—
IOVDD*0.3
V
GPIO pins
IOVDD*0.7
IOVDD*0.8
—
—
—
—
V
V
Output high voltage relative VOH
to IOVDD
Sourcing 3 mA, IOVDD ≥ 3 V,
DRIVESTRENGTH2 = WEAK
Sourcing 1.2 mA, IOVDD ≥ 1.62
V,
IOVDD*0.6
—
—
V
DRIVESTRENGTH2 = WEAK
Sourcing 20 mA, IOVDD ≥ 3 V,
IOVDD*0.8
—
—
—
—
—
—
0.1
—
V
V
DRIVESTRENGTH2 = STRONG
Sourcing 8 mA, IOVDD ≥ 1.62 V,
IOVDD*0.6
—
DRIVESTRENGTH2 = STRONG
Sinking 3 mA, IOVDD ≥ 3 V,
Output low voltage relative to VOL
IOVDD
—
—
—
—
—
IOVDD*0.2
IOVDD*0.4
IOVDD*0.2
IOVDD*0.4
30
V
DRIVESTRENGTH2 = WEAK
Sinking 1.2 mA, IOVDD ≥ 1.62 V,
V
DRIVESTRENGTH2 = WEAK
Sinking 20 mA, IOVDD ≥ 3 V,
V
DRIVESTRENGTH2 = STRONG
Sinking 8 mA, IOVDD ≥ 1.62 V,
V
DRIVESTRENGTH2 = STRONG
Input leakage current
IIOLEAK
All GPIO except LFXO pins, GPIO
≤ IOVDD
nA
LFXO Pins, GPIO ≤ IOVDD
—
—
0.1
3.3
50
15
nA
µA
Input leakage current on
I5VTOLLEAK
IOVDD < GPIO ≤ IOVDD + 2 V
5VTOL pads above IOVDD
I/O pin pull-up/pull-down re- RPUD
sistor3
30
15
40
25
65
45
kΩ
ns
Pulse width of pulses re-
moved by the glitch suppres-
sion filter
tIOGLITCH
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Output fall time, From 70%
to 30% of VIO
tIOOF
CL = 50 pF,
—
1.8
—
ns
DRIVESTRENGTH2 = STRONG,
SLEWRATE2 = 0x6
CL = 50 pF,
—
—
—
4.5
2.2
7.4
—
—
—
ns
ns
ns
DRIVESTRENGTH2 = WEAK,
SLEWRATE2 = 0x6
CL = 50 pF,
Output rise time, From 30% tIOOR
to 70% of VIO
DRIVESTRENGTH2 = STRONG,
SLEWRATE = 0x62
CL = 50 pF,
DRIVESTRENGTH2 = WEAK,
SLEWRATE2 = 0x6
Note:
1. GPIO input threshold are proportional to the IOVDD supply, except for RESETn which is proportional to AVDD.
2. In GPIO_Pn_CTRL register.
3. GPIO pull-ups are referenced to the IOVDD supply, except for RESETn, which connects to AVDD.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.12 Voltage Monitor (VMON)
Table 4.29. Voltage Monitor (VMON)
Parameter
Symbol
IVMON
Test Condition
Min
—
Typ
6.3
Max
8
Unit
µA
Supply current (including
I_SENSE)
In EM0 or EM1, 1 active channel
In EM0 or EM1, All channels ac-
tive
—
12.5
15
µA
In EM2, EM3 or EM4, 1 channel
active and above threshold
—
—
—
—
62
62
99
99
—
—
—
—
nA
nA
nA
nA
In EM2, EM3 or EM4, 1 channel
active and below threshold
In EM2, EM3 or EM4, All channels
active and above threshold
In EM2, EM3 or EM4, All channels
active and below threshold
Loading of monitored supply ISENSE
In EM0 or EM1
—
—
2
2
—
—
3.4
—
—
—
—
µA
nA
V
In EM2, EM3 or EM4
Threshold range
VVMON_RANGE
1.62
—
—
Threshold step size
NVMON_STESP
Coarse
200
20
460
26
mV
mV
ns
Fine
—
Response time
Hysteresis
tVMON_RES
Supply drops at 1V/µs rate
—
VVMON_HYST
—
mV
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.13 Analog to Digital Converter (ADC)
Specified at 1 Msps, ADCCLK = 16 MHz, BIASPROG = 0, GPBIASACC = 0, unless otherwise indicated.
Table 4.30. Analog to Digital Converter (ADC)
Parameter
Symbol
Test Condition
Min
Typ
—
Max
12
Unit
Bits
V
Resolution
VRESOLUTION
VADCIN
6
—
Input voltage range1
Single ended
Differential
—
VFS
-VFS/2
1
—
VFS/2
VAVDD
V
Input range of external refer- VADCREFIN_P
ence voltage, single ended
and differential
—
V
Power supply rejection2
PSRRADC
At DC
At DC
—
—
80
80
—
—
dB
dB
Analog input common mode CMRRADC
rejection ratio
Current from all supplies, us- IADC_CONTINU-
1 Msps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
—
—
—
—
—
—
—
270
125
80
290
—
—
—
—
—
—
µA
µA
µA
µA
µA
µA
µA
ing internal reference buffer.
OUS_LP
Continuous operation. WAR-
MUPMODE3 = KEEPADC-
WARM
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 1 4
62.5 ksps / 1 MHz ADCCLK, BIA-
SPROG = 15, GPBIASACC = 1 4
Current from all supplies, us- IADC_NORMAL_LP 35 ksps / 16 MHz ADCCLK, BIA-
45
SPROG = 0, GPBIASACC = 1 4
ing internal reference buffer.
Duty-cycled operation. WAR-
MUPMODE3 = NORMAL
5 ksps / 16 MHz ADCCLK BIA-
SPROG = 0, GPBIASACC = 1 4
8
Current from all supplies, us- IADC_STAND-
125 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
105
70
ing internal reference buffer.
BY_LP
Duty-cycled operation.
35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 1 4
AWARMUPMODE3 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
Current from all supplies, us- IADC_CONTINU-
1 Msps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
—
—
—
—
—
—
—
325
175
125
85
—
—
—
—
—
—
—
µA
µA
µA
µA
µA
µA
µA
ing internal reference buffer.
OUS_HP
Continuous operation. WAR-
MUPMODE3 = KEEPADC-
WARM
250 ksps / 4 MHz ADCCLK, BIA-
SPROG = 6, GPBIASACC = 0 4
62.5 ksps / 1 MHz ADCCLK, BIA-
SPROG = 15, GPBIASACC = 0 4
Current from all supplies, us- IADC_NORMAL_HP 35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
ing internal reference buffer.
Duty-cycled operation. WAR-
MUPMODE3 = NORMAL
5 ksps / 16 MHz ADCCLK BIA-
SPROG = 0, GPBIASACC = 0 4
16
Current from all supplies, us- IADC_STAND-
125 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
160
125
ing internal reference buffer.
BY_HP
Duty-cycled operation.
35 ksps / 16 MHz ADCCLK, BIA-
SPROG = 0, GPBIASACC = 0 4
AWARMUPMODE3 = KEEP-
INSTANDBY or KEEPIN-
SLOWACC
Current from HFPERCLK
IADC_CLK
HFPERCLK = 16 MHz
—
140
—
µA
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
fADCCLK
Test Condition
Min
—
Typ
—
—
7
Max
16
1
Unit
MHz
ADC clock frequency
Throughput rate
fADCRATE
tADCCONV
—
Msps
cycles
cycles
cycles
µs
Conversion time5
6 bit
8 bit
12 bit
—
—
—
—
5
—
9
—
13
—
WARMUPMODE3 = NORMAL
Startup time of reference
generator and ADC core
tADCSTART
—
WARMUPMODE3 = KEEPIN-
STANDBY
—
—
58
—
—
—
67
68
2
µs
µs
dB
dB
WARMUPMODE3 = KEEPINSLO-
WACC
1
Internal reference6, differential
measurement
SNDR at 1Msps and fIN
10kHz
=
SNDRADC
—
—
External reference7, differential
measurement
Spurious-free dynamic range SFDRADC
(SFDR)
1 MSamples/s, 10 kHz full-scale
sine wave
—
-1
-6
75
—
—
—
2
dB
Differential non-linearity
(DNL)
DNLADC
12 bit resolution, No missing co-
des
LSB
LSB
Integral non-linearity (INL),
End point method
INLADC
12 bit resolution
6
Offset error
VADCOFFSETERR
VADCGAIN
-3
—
—
—
0
3
LSB
%
Gain error in ADC
Using internal reference
Using external reference
-0.2
-1
3.5
—
—
%
Temperature sensor slope
VTS_SLOPE
-1.84
mV/°C
Note:
1. The absolute voltage allowed at any ADC input is dictated by the power rail supplied to on-chip circuitry, and may be lower than
the effective full scale voltage. All ADC inputs are limited to the ADC supply (AVDD or DVDD depending on
EMU_PWRCTRL_ANASW). Any ADC input routed through the APORT will further be limited by the IOVDD supply to the pin.
2. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL.
3. In ADCn_CTRL register.
4. In ADCn_BIASPROG register.
5. Derived from ADCCLK.
6. Internal reference option used corresponds to selection 2V5 in the SINGLECTRL_REF or SCANCTRL_REF register field. The
differential input range with this configuration is ± 1.25 V. Typical value is characterized using full-scale sine wave input. Minimum
value is production-tested using sine wave input at 1.5 dB lower than full scale.
7. External reference is 1.25 V applied externally to ADCnEXTREFP, with the selection CONF in the SINGLECTRL_REF or
SCANCTRL_REF register field and VREFP in the SINGLECTRLX_VREFSEL or SCANCTRLX_VREFSEL field. The differential
input range with this configuration is ± 1.25 V.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.14 Analog Comparator (ACMP)
Table 4.31. Analog Comparator (ACMP)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input voltage range
VACMPIN
ACMPVDD =
ACMPn_CTRL_PWRSEL 1
—
—
VACMPVDD
V
BIASPROG2 ≤ 0x10 or FULL-
BIAS2 = 0
Supply voltage
VACMPVDD
1.8
2.1
—
—
VVREGVDD_
V
V
MAX
0x10 < BIASPROG2 ≤ 0x20 and
FULLBIAS2 = 1
VVREGVDD_
MAX
BIASPROG2 = 1, FULLBIAS2 = 0
Active current not including
voltage reference3
IACMP
—
—
50
—
—
nA
nA
BIASPROG2 = 0x10, FULLBIAS2
= 0
306
BIASPROG2 = 0x02, FULLBIAS2
= 1
—
—
—
6.1
74
50
11
92
—
µA
µA
nA
BIASPROG2 = 0x20, FULLBIAS2
= 1
Current consumption of inter- IACMPREF
nal voltage reference3
VLP selected as input using 2.5 V
Reference / 4 (0.625 V)
VLP selected as input using VDD
—
—
20
—
—
nA
µA
VBDIV selected as input using
1.25 V reference / 1
4.1
VADIV selected as input using
VDD/1
—
2.4
—
µA
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
HYSTSEL4 = HYST0
HYSTSEL4 = HYST1
HYSTSEL4 = HYST2
HYSTSEL4 = HYST3
HYSTSEL4 = HYST4
HYSTSEL4 = HYST5
HYSTSEL4 = HYST6
HYSTSEL4 = HYST7
HYSTSEL4 = HYST8
HYSTSEL4 = HYST9
HYSTSEL4 = HYST10
HYSTSEL4 = HYST11
HYSTSEL4 = HYST12
HYSTSEL4 = HYST13
HYSTSEL4 = HYST14
HYSTSEL4 = HYST15
BIASPROG2 = 1, FULLBIAS2 = 0
Hysteresis (VCM = 1.25 V,
BIASPROG2 = 0x10, FULL-
BIAS2 = 1)
VACMPHYST
-3
0
3
mV
5
12
18
33
27
50
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
µs
17
46
67
23
57
86
26
68
104
130
155
3
30
79
34
90
-3
0
-27
-50
-67
-86
-104
-130
-155
—
-18
-33
-45
-57
-67
-78
-88
30
-5
-12
-17
-23
-26
-30
-34
95
Comparator delay5
tACMPDELAY
BIASPROG2 = 0x10, FULLBIAS2
= 0
—
3.7
10
µs
BIASPROG2 = 0x02, FULLBIAS2
= 1
—
—
360
35
1000
—
ns
ns
BIASPROG2 = 0x20, FULLBIAS2
= 1
BIASPROG2 =0x10, FULLBIAS2
= 1
Offset voltage
VACMPOFFSET
-35
—
35
mV
Reference voltage
VACMPREF
Internal 1.25 V reference
Internal 2.5 V reference
1
1.25
2.5
1.47
2.8
—
V
V
1.98
—
CSRESSEL6 = 0
CSRESSEL6 = 1
CSRESSEL6 = 2
CSRESSEL6 = 3
CSRESSEL6 = 4
CSRESSEL6 = 5
CSRESSEL6 = 6
CSRESSEL6 = 7
Capacitive sense internal re- RCSRES
sistance
infinite
kΩ
—
—
—
—
—
—
—
15
27
—
—
—
—
—
—
—
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
kΩ
39
51
102
164
239
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Note:
Symbol
Test Condition
Min
Typ
Max
Unit
1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD.
2. In ACMPn_CTRL register.
3. The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference. IACMPTOTAL = IACMP
IACMPREF
+
.
4. In ACMPn_HYSTERESIS registers.
5. ± 100 mV differential drive.
6. In ACMPn_INPUTSEL register.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.15 Digital to Analog Converter (VDAC)
DRIVESTRENGTH = 2 unless otherwise specified. Primary VDAC output.
Table 4.32. Digital to Analog Converter (VDAC)
Parameter
Symbol
Test Condition
Single-Ended
Min
Typ
—
Max
Unit
V
Output voltage
VDACOUT
0
VVREF
VVREF
Differential1
-VVREF
—
—
V
Current consumption includ- IDAC
ing references (2 channels)2
500 ksps, 12-bit, DRIVES-
TRENGTH = 2, REFSEL = 4
396
72
—
—
—
µA
µA
µA
44.1 ksps, 12-bit, DRIVES-
TRENGTH = 1, REFSEL = 4
—
—
200 Hz refresh rate, 12-bit Sam-
ple-Off mode in EM2, DRIVES-
TRENGTH = 2, REFSEL = 4,
SETTLETIME = 0x02, WARMUP-
TIME = 0x0A
1.2
Current from HFPERCLK3
Sample rate
IDAC_CLK
—
—
—
2
5.8
—
—
500
1
µA/MHz
ksps
MHz
µs
SRDAC
DAC clock frequency
Conversion time
Settling time
fDAC
—
tDACCONV
tDACSETTLE
tDACSTARTUP
fDAC = 1MHz
—
—
50% fs step settling to 5 LSB
—
—
2.5
—
—
µs
Startup time
Enable to 90% fs output, settling
to 10 LSB
12
µs
Output impedance
ROUT
DRIVESTRENGTH = 2, 0.4 V ≤
VOUT ≤ VOPA - 0.4 V, -8 mA <
IOUT < 8 mA, Full supply range
—
—
—
—
—
2
2
—
—
—
—
—
Ω
Ω
DRIVESTRENGTH = 0 or 1, 0.4 V
≤ VOUT ≤ VOPA - 0.4 V, -400 µA <
IOUT < 400 µA, Full supply range
DRIVESTRENGTH = 2, 0.1 V ≤
VOUT ≤ VOPA - 0.1 V, -2 mA <
IOUT < 2 mA, Full supply range
2
Ω
DRIVESTRENGTH = 0 or 1, 0.1 V
≤ VOUT ≤ VOPA - 0.1 V, -100 µA <
IOUT < 100 µA, Full supply range
2
Ω
Power supply rejection ratio4
PSRR
Vout = 50% fs. DC
65.5
dB
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal to noise and distortion SNDRDAC
ratio (1 kHz sine wave),
Noise band limited to 250
kHz
500 ksps, single-ended, internal
1.25V reference
—
60.4
—
dB
500 ksps, single-ended, internal
2.5V reference
—
—
—
—
—
—
—
—
—
—
—
61.6
64.0
63.3
64.4
65.8
65.3
66.7
70.0
67.8
69.0
68.5
—
—
—
—
—
—
—
—
—
—
—
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
500 ksps, single-ended, 3.3V
VDD reference
500 ksps, differential, internal
1.25V reference
500 ksps, differential, internal
2.5V reference
500 ksps, differential, 3.3V VDD
reference
Signal to noise and distortion SNDRDAC_BAND 500 ksps, single-ended, internal
ratio (1 kHz sine wave),
Noise band limited to 22 kHz
1.25V reference
500 ksps, single-ended, internal
2.5V reference
500 ksps, single-ended, 3.3V
VDD reference
500 ksps, differential, internal
1.25V reference
500 ksps, differential, internal
2.5V reference
500 ksps, differential, 3.3V VDD
reference
Total harmonic distortion
THD
—
70.2
—
—
1
dB
Differential non-linearity5
Intergral non-linearity
DNLDAC
-0.99
LSB
INLDAC
-4
-8
—
—
—
4
8
LSB
mV
mV
Offset error6
VOFFSET
T = 25 °C
Across operating temperature
range
-25
25
Gain error6
VGAIN
T = 25 °C, Low-noise internal ref-
erence (REFSEL = 1V25LN or
2V5LN)
-2.5
—
2.5
%
T = 25 °C, Internal reference (RE-
FSEL = 1V25 or 2V5)
-5
—
—
—
5
%
%
%
T = 25 °C, External reference
(REFSEL = VDD or EXT)
-1.8
-3.5
1.8
3.5
Across operating temperature
range, Low-noise internal refer-
ence (REFSEL = 1V25LN or
2V5LN)
Across operating temperature
range, Internal reference (RE-
FSEL = 1V25 or 2V5)
-7.5
-2.0
—
—
7.5
2.0
%
%
Across operating temperature
range, External reference (RE-
FSEL = VDD or EXT)
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
External load capactiance,
OUTSCALE=0
CLOAD
—
—
75
pF
Note:
1. In differential mode, the output is defined as the difference between two single-ended outputs. Absolute voltage on each output is
limited to the single-ended range.
2. Supply current specifications are for VDAC circuitry operating with static output only and do not include current required to drive
the load.
3. Current from HFPERCLK is dependent on HFPERCLK frequency. This current contributes to the total supply current used when
the clock to the DAC peripheral is enabled in the CMU.
4. PSRR calculated as 20 * log10(ΔVDD / ΔVOUT), VDAC output at 90% of full scale
5. Entire range is monotonic and has no missing codes.
6. Gain is calculated by measuring the slope from 10% to 90% of full scale. Offset is calculated by comparing actual VDAC output at
10% of full scale to ideal VDAC output at 10% of full scale with the measured gain.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.16 Current Digital to Analog Converter (IDAC)
Table 4.33. Current Digital to Analog Converter (IDAC)
Parameter
Symbol
Test Condition
Min
—
Typ
4
Max
—
Unit
ranges
µA
Number of ranges
Output current
NIDAC_RANGES
IIDAC_OUT
RANGESEL1 = RANGE0
RANGESEL1 = RANGE1
RANGESEL1 = RANGE2
RANGESEL1 = RANGE3
0.05
—
1.6
1.6
0.5
2
—
—
—
32
4.7
16
64
—
µA
µA
µA
Linear steps within each
range
NIDAC_STEPS
—
steps
RANGESEL1 = RANGE0
RANGESEL1 = RANGE1
RANGESEL1 = RANGE2
RANGESEL1 = RANGE3
Step size
SSIDAC
—
—
—
—
-3
50
100
500
2
—
—
—
—
3
nA
nA
nA
µA
%
Total accuracy, STEPSEL1 =
0x10
ACCIDAC
EM0 or EM1, AVDD=3.3 V, T = 25
°C
—
EM0 or EM1, Across operating
temperature range
-18
—
—
-2
22
—
%
%
EM2 or EM3, Source mode, RAN-
GESEL1 = RANGE0, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Source mode, RAN-
GESEL1 = RANGE1, AVDD=3.3
V, T = 25 °C
—
—
—
—
—
—
—
-1.7
-0.8
-0.5
-0.7
-0.6
-0.5
-0.5
—
—
—
—
—
—
—
%
%
%
%
%
%
%
EM2 or EM3, Source mode, RAN-
GESEL1 = RANGE2, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Source mode, RAN-
GESEL1 = RANGE3, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN-
GESEL1 = RANGE0, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN-
GESEL1 = RANGE1, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN-
GESEL1 = RANGE2, AVDD=3.3
V, T = 25 °C
EM2 or EM3, Sink mode, RAN-
GESEL1 = RANGE3, AVDD=3.3
V, T = 25 °C
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Start up time
tIDAC_SU
Output within 1% of steady state
value
—
5
—
µs
Settling time, (output settled tIDAC_SETTLE
within 1% of steady state val-
ue),
Range setting is changed
Step value is changed
—
—
5
1
—
—
µs
µs
Current consumption2
IIDAC
EM0 or EM1 Source mode, ex-
cluding output current, Across op-
erating temperature range
—
11
15
µA
EM0 or EM1 Sink mode, exclud-
ing output current, Across operat-
ing temperature range
—
13
18
µA
EM2 or EM3 Source mode, ex-
cluding output current, T = 25 °C
—
—
—
—
—
0.023
0.041
11
—
—
—
—
—
µA
µA
µA
µA
%
EM2 or EM3 Sink mode, exclud-
ing output current, T = 25 °C
EM2 or EM3 Source mode, ex-
cluding output current, T ≥ 85 °C
EM2 or EM3 Sink mode, exclud-
ing output current, T ≥ 85 °C
13
RANGESEL1 = RANGE0, output
Output voltage compliance in ICOMP_SRC
source mode, source current
change relative to current
sourced at 0 V
0.11
voltage = min(VIOVDD
VAVDD2-100 mV)
,
RANGESEL1 = RANGE1, output
—
—
—
0.06
0.04
0.03
—
—
—
%
%
%
voltage = min(VIOVDD
,
VAVDD2-100 mV)
RANGESEL1 = RANGE2, output
voltage = min(VIOVDD
,
VAVDD2-150 mV)
RANGESEL1 = RANGE3, output
voltage = min(VIOVDD
,
VAVDD2-250 mV)
RANGESEL1 = RANGE0, output
voltage = 100 mV
Output voltage compliance in ICOMP_SINK
sink mode, sink current
change relative to current
sunk at IOVDD
—
—
—
—
0.12
0.05
0.04
0.03
—
—
—
—
%
%
%
%
RANGESEL1 = RANGE1, output
voltage = 100 mV
RANGESEL1 = RANGE2, output
voltage = 150 mV
RANGESEL1 = RANGE3, output
voltage = 250 mV
Note:
1. In IDAC_CURPROG register.
2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and
PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be-
tween AVDD (0) and DVDD (1).
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Electrical Specifications
4.1.17 Capacitive Sense (CSEN)
Table 4.34. Capacitive Sense (CSEN)
Parameter
Symbol
tCNV
Test Condition
Min
—
Typ
20.2
26.4
1.55
Max
—
Unit
µs
Single conversion time (1x
accumulation)
12-bit SAR Conversions
16-bit SAR Conversions
—
—
µs
Delta Modulation Conversion (sin-
gle comparison)
—
—
µs
Maximum external capacitive CEXTMAX
load
IREFPROG=7 (Gain = 1x), includ-
ing routing parasitics
—
—
—
—
68
680
1
—
—
—
—
pF
pF
kΩ
nA
IREFPROG=0 (Gain = 10x), in-
cluding routing parasitics
Maximum external series im- REXTMAX
pedance
Supply current, EM2 bonded ICSEN_BOND
conversions, WARMUP-
MODE=NORMAL, WAR-
MUPCNT=0
12-bit SAR conversions, 20 ms
conversion rate, IREFPROG=7
(Gain = 1x), 10 channels bonded
(total capacitance of 330 pF)1
326
Delta Modulation conversions, 20
ms conversion rate, IRE-
—
226
—
nA
FPROG=7 (Gain = 1x), 10 chan-
nels bonded (total capacitance of
330 pF)1
12-bit SAR conversions, 200 ms
conversion rate, IREFPROG=7
(Gain = 1x), 10 channels bonded
—
—
33
25
—
—
nA
nA
(total capacitance of 330 pF)1
Delta Modulation conversions,
200 ms conversion rate, IRE-
FPROG=7 (Gain = 1x), 10 chan-
nels bonded (total capacitance of
330 pF)1
Supply current, EM2 scan
conversions, WARMUP-
MODE=NORMAL, WAR-
MUPCNT=0
ICSEN_EM2
12-bit SAR conversions, 20 ms
scan rate, IREFPROG=0 (Gain =
—
—
690
515
—
—
nA
nA
10x), 8 samples per scan1
Delta Modulation conversions, 20
ms scan rate, 8 comparisons per
sample (DMCR = 1, DMR = 2),
IREFPROG=0 (Gain = 10x), 8
samples per scan1
12-bit SAR conversions, 200 ms
scan rate, IREFPROG=0 (Gain =
—
—
79
57
—
—
nA
nA
10x), 8 samples per scan1
Delta Modulation conversions,
200 ms scan rate, 8 comparisons
per sample (DMCR = 1, DMR =
2), IREFPROG=0 (Gain = 10x), 8
samples per scan1
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Supply current, continuous
conversions, WARMUP-
MODE=KEEPCSENWARM
ICSEN_ACTIVE
SAR or Delta Modulation conver-
sions of 33 pF capacitor, IRE-
FPROG=0 (Gain = 10x), always
on
—
90.5
—
µA
HFPERCLK supply current
ICSEN_HFPERCLK Current contribution from
HFPERCLK when clock to CSEN
block is enabled.
—
2.25
—
µA/MHz
Note:
1. Current is specified with a total external capacitance of 33 pF per channel. Average current is dependent on how long the periph-
eral is actively sampling channels within the scan period, and scales with the number of samples acquired. Supply current for a
specific application can be estimated by multiplying the current per sample by the total number of samples per period (total_cur-
rent = single_sample_current * (number_of_channels * accumulation)).
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.18 Operational Amplifier (OPAMP)
Unless otherwise indicated, specified conditions are: Non-inverting input configuration, VDD = 3.3 V, DRIVESTRENGTH = 2, MAIN-
OUTEN = 1, CLOAD = 75 pF with OUTSCALE = 0, or CLOAD = 37.5 pF with OUTSCALE = 1. Unit gain buffer and 3X-gain connection as
specified in table footnotes1 2
.
Table 4.35. Operational Amplifier (OPAMP)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Supply voltage (from AVDD) VOPA
HCMDIS = 0, Rail-to-rail input
range
2
—
3.8
V
HCMDIS = 1
1.62
—
—
3.8
V
V
Input voltage
VIN
HCMDIS = 0, Rail-to-rail input
range
VVSS
VOPA
HCMDIS = 1
VVSS
100
VVSS
—
—
—
VOPA-1.2
—
V
MΩ
V
Input impedance
Output voltage
RIN
VOUT
CLOAD
—
VOPA
75
Load capacitance3
OUTSCALE = 0
OUTSCALE = 1
—
pF
pF
Ω
—
—
37.5
—
Output impedance
ROUT
DRIVESTRENGTH = 2 or 3, 0.4 V
≤ VOUT ≤ VOPA - 0.4 V, -8 mA <
IOUT < 8 mA, Buffer connection,
Full supply range
—
0.25
DRIVESTRENGTH = 0 or 1, 0.4 V
≤ VOUT ≤ VOPA - 0.4 V, -400 µA <
IOUT < 400 µA, Buffer connection,
Full supply range
—
—
—
0.6
0.4
1
—
—
—
Ω
Ω
Ω
DRIVESTRENGTH = 2 or 3, 0.1 V
≤ VOUT ≤ VOPA - 0.1 V, -2 mA <
IOUT < 2 mA, Buffer connection,
Full supply range
DRIVESTRENGTH = 0 or 1, 0.1 V
≤ VOUT ≤ VOPA - 0.1 V, -100 µA <
IOUT < 100 µA, Buffer connection,
Full supply range
Internal closed-loop gain
Active current4
GCL
Buffer connection
3x Gain connection
16x Gain connection
0.99
2.93
15.07
—
1
1.01
3.05
16.33
—
-
-
2.99
15.7
580
-
IOPA
DRIVESTRENGTH = 3, OUT-
SCALE = 0
µA
DRIVESTRENGTH = 2, OUT-
SCALE = 0
—
—
—
176
13
—
—
—
µA
µA
µA
DRIVESTRENGTH = 1, OUT-
SCALE = 0
DRIVESTRENGTH = 0, OUT-
SCALE = 0
4.7
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
—
Typ
135
137
121
109
3.38
Max
—
Unit
dB
Open-loop gain
GOL
DRIVESTRENGTH = 3
DRIVESTRENGTH = 2
DRIVESTRENGTH = 1
DRIVESTRENGTH = 0
—
—
dB
—
—
dB
—
—
dB
Loop unit-gain frequency5
UGF
DRIVESTRENGTH = 3, Buffer
connection
—
—
MHz
DRIVESTRENGTH = 2, Buffer
connection
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.9
132
34
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
MHz
kHz
DRIVESTRENGTH = 1, Buffer
connection
DRIVESTRENGTH = 0, Buffer
connection
kHz
DRIVESTRENGTH = 3, 3x Gain
connection
2.57
0.71
113
28
MHz
MHz
kHz
DRIVESTRENGTH = 2, 3x Gain
connection
DRIVESTRENGTH = 1, 3x Gain
connection
DRIVESTRENGTH = 0, 3x Gain
connection
kHz
Phase margin
PM
DRIVESTRENGTH = 3, Buffer
connection
67
°
DRIVESTRENGTH = 2, Buffer
connection
69
°
DRIVESTRENGTH = 1, Buffer
connection
63
°
DRIVESTRENGTH = 0, Buffer
connection
68
°
Output voltage noise
NOUT
DRIVESTRENGTH = 3, Buffer
connection, 10 Hz - 10 MHz
146
163
170
176
313
271
247
245
µVrms
µVrms
µVrms
µVrms
µVrms
µVrms
µVrms
µVrms
DRIVESTRENGTH = 2, Buffer
connection, 10 Hz - 10 MHz
DRIVESTRENGTH = 1, Buffer
connection, 10 Hz - 1 MHz
DRIVESTRENGTH = 0, Buffer
connection, 10 Hz - 1 MHz
DRIVESTRENGTH = 3, 3x Gain
connection, 10 Hz - 10 MHz
DRIVESTRENGTH = 2, 3x Gain
connection, 10 Hz - 10 MHz
DRIVESTRENGTH = 1, 3x Gain
connection, 10 Hz - 1 MHz
DRIVESTRENGTH = 0, 3x Gain
connection, 10 Hz - 1 MHz
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Slew rate6
SR
DRIVESTRENGTH = 3,
INCBW=17
—
4.7
—
V/µs
DRIVESTRENGTH = 3,
INCBW=0
—
—
1.5
—
—
V/µs
V/µs
DRIVESTRENGTH = 2,
INCBW=17
1.27
DRIVESTRENGTH = 2,
INCBW=0
—
—
0.42
0.17
—
—
V/µs
V/µs
DRIVESTRENGTH = 1,
INCBW=17
DRIVESTRENGTH = 1,
INCBW=0
—
—
0.058
0.044
—
—
V/µs
V/µs
DRIVESTRENGTH = 0,
INCBW=17
DRIVESTRENGTH = 0,
INCBW=0
—
0.015
—
V/µs
Startup time8
TSTART
VOSI
DRIVESTRENGTH = 2
—
-2
—
—
12
2
µs
Input offset voltage
DRIVESTRENGTH = 2 or 3, T =
25 °C
mV
DRIVESTRENGTH = 1 or 0, T =
25 °C
-2
—
—
2
mV
mV
DRIVESTRENGTH = 2 or 3,
across operating temperature
range
-12
12
DRIVESTRENGTH = 1 or 0,
across operating temperature
range
-30
—
30
mV
DC power supply rejection
ratio9
PSRRDC
Input referred
—
—
—
70
70
90
—
—
—
dB
dB
dB
DC common-mode rejection CMRRDC
ratio9
Input referred
Total harmonic distortion
THDOPA
DRIVESTRENGTH = 2, 3x Gain
connection, 1 kHz, VOUT = 0.1 V
to VOPA - 0.1 V
DRIVESTRENGTH = 0, 3x Gain
connection, 0.1 kHz, VOUT = 0.1 V
to VOPA - 0.1 V
—
90
—
dB
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
Parameter
Note:
Symbol
Test Condition
Min
Typ
Max
Unit
1. Specified configuration for Unit gain buffer configuration is: INCBW = 0, HCMDIS = 0, RESINSEL = DISABLE. VINPUT = 0.5 V,
VOUTPUT = 0.5 V.
2. Specified configuration for 3X-Gain configuration is: INCBW = 1, HCMDIS = 1, RESINSEL = VSS, VINPUT = 0.5 V, VOUTPUT = 1.5
V. Nominal voltage gain is 3.
3. If the maximum CLOAD is exceeded, an isolation resistor is required for stability. See AN0038 for more information.
4. Current into the load resistor is excluded. When the OPAMP is connected with closed-loop gain > 1, there will be extra current to
drive the resistor feedback network. The internal resistor feedback network has total resistance of 143.5 kOhm, which will cause
another ~10 µA current when the OPAMP drives 1.5 V between output and ground.
5. In unit gain connection, UGF is the gain-bandwidth product of the OPAMP. In 3x Gain connection, UGF is the gain-bandwidth
product of the OPAMP and 1/3 attenuation of the feedback network.
6. Step between 0.2V and VOPA-0.2V, 10%-90% rising/falling range.
7. When INCBW is set to 1 the OPAMP bandwidth is increased. This is allowed only when the non-inverting close-loop gain is ≥ 3,
or the OPAMP may not be stable.
8. From enable to output settled. In sample-and-off mode, RC network after OPAMP will contribute extra delay. Settling error < 1mV.
9. When HCMDIS=1 and input common mode transitions the region from VOPA-1.4V to VOPA-1V, input offset will change. PSRR
and CMRR specifications do not apply to this transition region.
4.1.19 Pulse Counter (PCNT)
Table 4.36. Pulse Counter (PCNT)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input frequency
FIN
Asynchronous Single and Quad-
rature Modes
—
—
10
MHz
Sampled Modes with Debounce
filter set to 0.
—
—
8
kHz
4.1.20 Analog Port (APORT)
Table 4.37. Analog Port (APORT)
Parameter
Symbol
Test Condition
Min
—
Typ
7
Max
—
Unit
µA
Supply current1 2
IAPORT
Operation in EM0/EM1
Operation in EM2/EM3
—
63
—
nA
Note:
1. Supply current increase that occurs when an analog peripheral requests access to APORT. This current is not included in repor-
ted peripheral currents. Additional peripherals requesting access to APORT do not incur further current.
2. Specified current is for continuous APORT operation. In applications where the APORT is not requested continuously (e.g. peri-
odic ACMP requests from LESENSE in EM2), the average current requirements can be estimated by mutiplying the duty cycle of
the requests by the specified continuous current number.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.21 I2C
4.1.21.1 I2C Standard-mode (Sm)1
Table 4.38. I2C Standard-mode (Sm)1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
SCL clock frequency2
SCL clock low time
SCL clock high time
SDA set-up time
fSCL
0
—
100
kHz
tLOW
4.7
4
—
—
—
—
—
—
—
µs
µs
ns
ns
µs
tHIGH
tSU_DAT
tHD_DAT
250
100
4.7
—
SDA hold time3
3450
—
Repeated START condition tSU_STA
set-up time
(Repeated) START condition tHD_STA
hold time
4
—
—
µs
STOP condition set-up time tSU_STO
4
—
—
—
—
µs
µs
Bus free time between a
tBUF
4.7
STOP and START condition
Note:
1. For CLHR set to 0 in the I2Cn_CTRL register.
2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual.
3. The maximum SDA hold time (tHD_DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW).
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.21.2 I2C Fast-mode (Fm)1
Table 4.39. I2C Fast-mode (Fm)1
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
SCL clock frequency2
SCL clock low time
SCL clock high time
SDA set-up time
fSCL
0
—
400
kHz
tLOW
1.3
0.6
—
—
—
—
—
—
—
µs
µs
ns
ns
µs
tHIGH
tSU_DAT
tHD_DAT
100
100
0.6
—
SDA hold time3
900
—
Repeated START condition tSU_STA
set-up time
(Repeated) START condition tHD_STA
hold time
0.6
—
—
µs
STOP condition set-up time tSU_STO
0.6
1.3
—
—
—
—
µs
µs
Bus free time between a
tBUF
STOP and START condition
Note:
1. For CLHR set to 1 in the I2Cn_CTRL register.
2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual.
3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW).
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.21.3 I2C Fast-mode Plus (Fm+)1
Table 4.40. I2C Fast-mode Plus (Fm+)1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
SCL clock frequency2
SCL clock low time
SCL clock high time
SDA set-up time
fSCL
0
—
1000
kHz
tLOW
0.5
0.26
50
—
—
—
—
—
—
—
—
—
—
µs
µs
ns
ns
µs
tHIGH
tSU_DAT
tHD_DAT
SDA hold time
100
0.26
Repeated START condition tSU_STA
set-up time
(Repeated) START condition tHD_STA
hold time
0.26
—
—
µs
STOP condition set-up time tSU_STO
0.26
0.5
—
—
—
—
µs
µs
Bus free time between a
tBUF
STOP and START condition
Note:
1. For CLHR set to 0 or 1 in the I2Cn_CTRL register.
2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
4.1.22 USART SPI
SPI Master Timing
Table 4.41. SPI Master Timing
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
SCLK period 1 2 3
tSCLK
2 *
tHFPERCLK
—
—
ns
CS to MOSI 1 2
tCS_MO
tSCLK_MO
tSU_MI
-12.5
-8.5
—
—
14
ns
ns
SCLK to MOSI 1 2
MISO setup time 1 2
10.5
IOVDD = 1.62 V
IOVDD = 3.0 V
90
42
-9
—
—
—
—
—
—
ns
ns
ns
MISO hold time 1 2
tH_MI
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD).
3. tHFPERCLK is one period of the selected HFPERCLK.
tCS_MO
CS
tSCKL_MO
SCLK
CLKPOL = 0
tSCLK
SCLK
CLKPOL = 1
MOSI
MISO
tSU_MI
tH_MI
Figure 4.1. SPI Master Timing Diagram
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Electrical Specifications
SPI Slave Timing
Table 4.42. SPI Slave Timing
Test Condition
Parameter
Symbol
Min
Typ
Max
Unit
SCLK period 1 2 3
tSCLK
6 *
tHFPERCLK
—
—
ns
SCLK high time1 2 3
SCLK low time1 2 3
tSCLK_HI
2.5 *
tHFPERCLK
—
—
—
—
ns
ns
tSCLK_LO
2.5 *
tHFPERCLK
CS active to MISO 1 2
CS disable to MISO 1 2
MOSI setup time 1 2
MOSI hold time 1 2 3
SCLK to MISO 1 2 3
tCS_ACT_MI
tCS_DIS_MI
tSU_MO
4
4
—
—
—
—
—
70
50
—
—
ns
ns
ns
ns
ns
12.5
13
tH_MO
tSCLK_MI
6 + 1.5 *
tHFPERCLK
45 + 2.5 *
tHFPERCLK
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD).
3. tHFPERCLK is one period of the selected HFPERCLK.
tCS_ACT_MI
CS
tCS_DIS_MI
SCLK
CLKPOL = 0
tSCLK_HI
tSCLK_LO
SCLK
tSU_MO
CLKPOL = 1
tSCLK
tH_MO
MOSI
MISO
tSCLK_MI
Figure 4.2. SPI Slave Timing Diagram
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Typical Connection Diagrams
5. Typical Connection Diagrams
5.1 Typical BGM13S Connections
Typical connections for the BGM13S module are shown in Figure 5.1 Typical Connections for BGM13S with UART Network Co-Pro-
cessor on page 67. This diagram shows connections for:
• Power supplies
Note: The 1V8 pin is the 1.8V output of the internal DC-DC converer. This pin should be left unconnected. Do not add external de-
coupling or power external circuits from this pin.
• Antenna loop for internal antenna usage or external antenna connection - The RF and ANTENNA pins should be tied together for
correct operation of the module. An optional 0R resistor can be added between RF and ANTENNA, making it possible to measure
the signal between these pins.
• Reset line
Note:
It is recommended to connect the RESETn line to an open-drain IO pin on the host CPU when NCP mode is used.
RESETn includes an internal pull-up to the VBATT supply and input logic levels on RESETn are referenced to VBATT. In systems
where IOVDD is not equal to VBATT, additional considerations may need to be taken.
• UART connection to an external host for Network Co-Processor (NCP) usage (optional)
• 32.768 kHz crystal - Required in applications that must meet 500 ppm Bluetooth Sleep Clock accuracy requirement. More accurate
crystals can be used to reduce the listening window and thereby reduce overall current consumption. Recommended crystal is KDS
part number 1TJG125DP1A0012 or equivalent.
Battery or Regulator
Battery / Supply Voltage
Inductor or capacitor
for antenna fine tuning
RESETn
GPIO
ANTENNA
RF
Use 0R to connect the
antenna to the RF output
PA0 / UART_TX
RX
TX
Host CPU
PA1 / UART_RX
PA2 / UART_CTS
PA3 / UART_RTS
RTS
CTS
Wireless
Module
TCK / SWCLK
(optional)
PF0 / TCK / SWCLK
PF1 / TMS / SWDIO
PF2 / TDO / SWO
PF3 / TDI
PB15 / LFXTAL_P
PB14 / LFXTAL_N
TMS / SWDIO
TDO / SWO
TDI
32.768 kHz XTAL
PTI_FRAME
PTI_DATA
PB13 / PTI_FRAME
PB12 / PTI_DATA
Figure 5.1. Typical Connections for BGM13S with UART Network Co-Processor
Note: It is possible to power the IOVDD pin at 1.8 V from the DC-DC output (1V8). However, the 1V8 output is off by default, and
IOVDD must be powered when programming the device. Any system that powers IOVDD directly from 1V8 must power IOVDD exter-
nally during initial programming.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Typical Connection Diagrams
Two common debug interface options are shown in Figure 5.2 Common Debug Connections on page 68. Refer to AN958 for more
information and additional options.
3 V
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
TMS / SWDIO / PF1
TCK / SWCLK / PF0
TDO / SWO / PF2
TDI / PF3
3 V
RESETn
1
3
5
7
9
2
4
6
8
RESETn
UART_TX / PA0
TMS / SWDIO / PF1
PTI_FRAME / PB13
UART_RX / PA1
TDO / SWO / PF2
TCK / SWCLK / PF0
PTI_DATA / PB12
10
Standard ARM Cortex Debug Connector
Mini Simplicity Debug Connector
Figure 5.2. Common Debug Connections
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Layout Guidelines
6. Layout Guidelines
For optimal performance of the BGM13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this
section.
6.1 Layout Guidelines
This section contains generic PCB layout and design guidelines for the BGM13S module. For optimal performance:
• Place the module at the edge of the PCB, as shown in the figures in this chapter.
• Do not place any metal (traces, components, etc.) in the antenna clearance area.
• Connect all ground pads directly to a solid ground plane.
• Place the ground vias as close to the ground pads as possible.
Figure 6.1. BGM13S PCB Top Layer Design
The following rules are recommended for the PCB design:
• Trace to copper clearance 150um
• PTH drill size 300um
• PTH annular ring 150um
Important:
The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions.
Figure 6.2. BGM13S PCB Middle and Bottom Layer Design
Figure 6.3. Practical Installation of BGM13S on Application PCB
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Layout Guidelines
Figure 6.4. Poor Layout Designs for the BGM13S
Layout checklist for BGM13S:
1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern.
2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines.
3. The antenna loop is implemented on the top layer as shown in the layoyt guidelines.
4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern.
5. The module is placed near the edge of the PCB with max 1mm indentation.
6. The module is not placed in the corner of the PCB.
6.2 Effect of PCB Width
The BGM13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency
and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure
6.5 BGM13S PCB Top Layer Design on page 70 gives an indcation of ground plane size vs. maximum achievable range.
Figure 6.5. BGM13S PCB Top Layer Design
The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique fea-
ture of the BGM13S. For the BGM13S the depth of the board is not important and does not impact the radiated performance.
6.3 Effect of Plastic and Metal Materials
The antenna on the BGM13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separa-
tion between the BGM13S and plastic or other materials is needed. The board thickness has an impact on the module and the addition-
al inductor/capacitor will help to tune the antenna to any board thickness.
In some cases, it may be necessary to fine tune the antenna to optimize for any specific application layout or mechanical design. A
capacitor or an inductor in parallel with the antenna input can be used for optimizing the antenna for any PCB layouts. A capacitor
moves the antenna frequency lower and an inductor moves the antenna frequency higher. Capacitor values between 0.1 pF-10 pF and
inductor values 3.6 nH-10 nH can be used.
The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is recommended not
to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the antenna area is
detuning the antenna.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Layout Guidelines
6.4 Effects of Human Body
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.
6.5 2D Radiation Pattern Plots
Figure 6.6. Typical 2D Radiation Pattern – Front View
Figure 6.7. Typical 2D Radiation Pattern – Side View
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Layout Guidelines
Figure 6.8. Typical 2D Radiation Pattern – Top View
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
7. Pin Definitions
7.1 BGM13S Device Pinout
Figure 7.1. BGM13S Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-
ported features for each GPIO pin, see 7.2 GPIO Functionality Table or 7.3 Alternate Functionality Overview.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Table 7.1. BGM13S Device Pinout
Pin Name
Pin Name
Pin(s) Description
Pin(s) Description
1
4
5
20
31
VSS
45
46
48
49
50
51
Ground
ANTENNA
2
50 Ohm input pin for internal antenna.
50 Ohm I/O for external antenna con-
nection.
RF
3
PD9
6
GPIO (5V)
PD10
PD12
PD14
PA0
7
GPIO (5V)
GPIO (5V)
GPIO
PD11
PD13
PD15
PA1
8
GPIO (5V)
GPIO
9
10
12
14
16
18
21
11
13
15
17
19
GPIO
GPIO
GPIO
PA2
GPIO
PA3
GPIO
PA4
GPIO
PA5
GPIO (5V)
GPIO
PB15
GPIO
PB14
1.8V output of the internal DC-DC con-
verter. Internally decoupled - do not add
external decoupling.
Battery supply voltage input to the inter-
nal DC-DC and analog supply.
VBATT
22
1V8
23
IOVDD
PC6
24
26
28
30
33
35
37
39
41
Digital IO power supply.
GPIO (5V)
GPIO (5V)
GPIO (5V)
GPIO (5V)
GPIO (5V)
GPIO
NC
PC7
PF2
25
27
29
32
34
36
38
40
42
No Connect.
GPIO (5V)
GPIO (5V)
GPIO (5V)
GPIO (5V)
GPIO
PC8
PC9
PC10
PF0
PC11
PF1
PB13
PB11
PF4
PB12
PF3
GPIO
GPIO (5V)
GPIO (5V)
GPIO (5V)
GPIO (5V)
PF5
PF6
Reset input, active low. This pin is inter-
nally pulled up to AVDD. To apply an
external reset source to this pin, it is re-
quired to only drive this pin low during
reset, and let the internal pull-up ensure
that reset is released.
PF7
43
47
GPIO (5V)
RESETn
44
ANT_GND
Antenna ground.
Note:
1. GPIO with 5V tolerance are indicated by (5V).
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
7.2 GPIO Functionality Table
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO
pin, followed by the functionality available on that pin. Refer to 7.3 Alternate Functionality Overview for a list of GPIO locations available
for each function.
Table 7.2. GPIO Functionality Table
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #0
Radio
Other
TIM0_CC0 #0
TIM0_CC1 #31
TIM0_CC2 #30
TIM0_CDTI0 #29
TIM0_CDTI1 #28
TIM0_CDTI2 #27
TIM1_CC0 #0
US0_RX #31
US0_CLK #30
US0_CS #29
US0_CTS #28
US0_RTS #27
US1_TX #0
CMU_CLK1 #0
PRS_CH6 #0
PRS_CH7 #10
PRS_CH8 #9
PRS_CH9 #8
ACMP0_O #0
ACMP1_O #0
LES_CH8
FRC_DCLK #0
FRC_DOUT #31
BUSDY
BUSCX
US1_RX #31
US1_CLK #30
US1_CS #29
US1_CTS #28
US1_RTS #27
LEU0_TX #0
LEU0_RX #31
I2C0_SDA #0
I2C0_SCL #31
FRC_DFRAME #30
MODEM_DCLK #0
MODEM_DIN #31
MODEM_DOUT #30
PA0
TIM1_CC1 #31
TIM1_CC2 #30
TIM1_CC3 #29
WTIM0_CC0 #0
LETIM0_OUT0 #0
LETIM0_OUT1 #31
PCNT0_S0IN #0
PCNT0_S1IN #31
ADC0_EXTN
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #1
Radio
Other
TIM0_CC0 #1
TIM0_CC1 #0
US0_RX #0
US0_CLK #31
US0_CS #30
US0_CTS #29
US0_RTS #28
US1_TX #1
TIM0_CC2 #31
TIM0_CDTI0 #30
TIM0_CDTI1 #29
TIM0_CDTI2 #28
TIM1_CC0 #1
CMU_CLK0 #0
PRS_CH6 #1
PRS_CH7 #0
PRS_CH8 #10
PRS_CH9 #9
ACMP0_O #1
ACMP1_O #1
LES_CH9
FRC_DCLK #1
FRC_DOUT #0
BUSCY
BUSDX
US1_RX #0
FRC_DFRAME #31
MODEM_DCLK #1
MODEM_DIN #0
MODEM_DOUT #31
PA1
TIM1_CC1 #0
ADC0_EXTP
VDAC0_EXT
US1_CLK #31
US1_CS #30
US1_CTS #29
US1_RTS #28
LEU0_TX #1
LEU0_RX #0
I2C0_SDA #1
I2C0_SCL #0
US0_TX #2
TIM1_CC2 #31
TIM1_CC3 #30
WTIM0_CC0 #1
LETIM0_OUT0 #1
LETIM0_OUT1 #0
PCNT0_S0IN #1
PCNT0_S1IN #0
TIM0_CC0 #2
TIM0_CC1 #1
US0_RX #1
TIM0_CC2 #0
US0_CLK #0
US0_CS #31
US0_CTS #30
US0_RTS #29
US1_TX #2
TIM0_CDTI0 #31
TIM0_CDTI1 #30
TIM0_CDTI2 #29
TIM1_CC0 #2
PRS_CH6 #2
PRS_CH7 #1
PRS_CH8 #0
PRS_CH9 #10
ACMP0_O #2
ACMP1_O #2
LES_CH10
FRC_DCLK #2
FRC_DOUT #1
VDAC0_OUT1ALT /
OPA1_OUTALT #1
TIM1_CC1 #1
US1_RX #1
FRC_DFRAME #0
MODEM_DCLK #2
MODEM_DIN #1
MODEM_DOUT #0
BUSDY
BUSCX
OPA0_P
PA2
TIM1_CC2 #0
US1_CLK #0
US1_CS #31
US1_CTS #30
US1_RTS #29
LEU0_TX #2
LEU0_RX #1
I2C0_SDA #2
I2C0_SCL #1
TIM1_CC3 #31
WTIM0_CC0 #2
WTIM0_CC1 #0
LETIM0_OUT0 #2
LETIM0_OUT1 #1
PCNT0_S0IN #2
PCNT0_S1IN #1
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #3
Radio
Other
TIM0_CC0 #3
TIM0_CC1 #2
US0_RX #2
TIM0_CC2 #1
US0_CLK #1
US0_CS #0
TIM0_CDTI0 #0
TIM0_CDTI1 #31
TIM0_CDTI2 #30
TIM1_CC0 #3
US0_CTS #31
US0_RTS #30
US1_TX #3
PRS_CH6 #3
PRS_CH7 #2
PRS_CH8 #1
PRS_CH9 #0
ACMP0_O #3
ACMP1_O #3
LES_CH11
FRC_DCLK #3
FRC_DOUT #2
BUSCY
BUSDX
TIM1_CC1 #2
US1_RX #2
FRC_DFRAME #1
MODEM_DCLK #3
MODEM_DIN #2
MODEM_DOUT #1
PA3
TIM1_CC2 #1
US1_CLK #1
US1_CS #0
VDAC0_OUT0 /
OPA0_OUT
TIM1_CC3 #0
WTIM0_CC0 #3
WTIM0_CC1 #1
LETIM0_OUT0 #3
LETIM0_OUT1 #2
PCNT0_S0IN #3
PCNT0_S1IN #2
TIM0_CC0 #4
US1_CTS #31
US1_RTS #30
LEU0_TX #3
LEU0_RX #2
I2C0_SDA #3
I2C0_SCL #2
GPIO_EM4WU8
US0_TX #4
US0_RX #3
US0_CLK #2
US0_CS #1
US0_CTS #0
US0_RTS #31
US1_TX #4
TIM0_CC1 #3
TIM0_CC2 #2
TIM0_CDTI0 #1
TIM0_CDTI1 #0
TIM0_CDTI2 #31
TIM1_CC0 #4
PRS_CH6 #4
PRS_CH7 #3
PRS_CH8 #2
PRS_CH9 #1
ACMP0_O #4
ACMP1_O #4
LES_CH12
FRC_DCLK #4
FRC_DOUT #3
VDAC0_OUT1ALT /
OPA1_OUTALT #2
TIM1_CC1 #3
US1_RX #3
US1_CLK #2
US1_CS #1
US1_CTS #0
US1_RTS #31
LEU0_TX #4
LEU0_RX #3
I2C0_SDA #4
I2C0_SCL #3
FRC_DFRAME #2
MODEM_DCLK #4
MODEM_DIN #3
MODEM_DOUT #2
BUSDY
BUSCX
OPA0_N
PA4
TIM1_CC2 #2
TIM1_CC3 #1
WTIM0_CC0 #4
WTIM0_CC1 #2
WTIM0_CC2 #0
LETIM0_OUT0 #4
LETIM0_OUT1 #3
PCNT0_S0IN #4
PCNT0_S1IN #3
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #5
Radio
Other
US0_RX #4
US0_CLK #3
US0_CS #2
TIM0_CC0 #5
TIM0_CC1 #4
US0_CTS #1
US0_RTS #0
US1_TX #5
TIM0_CC2 #3
TIM0_CDTI0 #2
TIM0_CDTI1 #1
TIM0_CDTI2 #0
TIM1_CC0 #5
CMU_CLKI0 #4
PRS_CH6 #5
PRS_CH7 #4
PRS_CH8 #3
PRS_CH9 #2
ACMP0_O #5
ACMP1_O #5
LES_CH13
US1_RX #4
US1_CLK #3
US1_CS #2
FRC_DCLK #5
FRC_DOUT #4
VDAC0_OUT0ALT /
OPA0_OUTALT #0
TIM1_CC1 #4
US1_CTS #1
US1_RTS #0
US2_TX #0
FRC_DFRAME #3
MODEM_DCLK #5
MODEM_DIN #4
MODEM_DOUT #3
PA5
TIM1_CC2 #3
BUSCY
BUSDX
TIM1_CC3 #2
WTIM0_CC0 #5
WTIM0_CC1 #3
WTIM0_CC2 #1
LETIM0_OUT0 #5
LETIM0_OUT1 #4
PCNT0_S0IN #5
PCNT0_S1IN #4
US2_RX #31
US2_CLK #30
US2_CS #29
US2_CTS #28
US2_RTS #27
LEU0_TX #5
LEU0_RX #4
I2C0_SDA #5
I2C0_SCL #4
ETM_TCLK #1
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #6
TIM0_CC1 #5
TIM0_CC2 #4
US0_TX #6
US0_RX #5
US0_CLK #4
US0_CS #3
US0_CTS #2
US0_RTS #1
US1_TX #6
US1_RX #5
US1_CLK #4
US1_CS #3
US1_CTS #2
US1_RTS #1
LEU0_TX #6
LEU0_RX #5
I2C0_SDA #6
I2C0_SCL #5
TIM0_CDTI0 #3
TIM0_CDTI1 #2
TIM0_CDTI2 #1
TIM1_CC0 #6
TIM1_CC1 #5
FRC_DCLK #6
FRC_DOUT #5
PRS_CH6 #6
PRS_CH7 #5
PRS_CH8 #4
PRS_CH9 #3
ACMP0_O #6
ACMP1_O #6
TIM1_CC2 #4
BUSCY
BUSDX
OPA2_P
TIM1_CC3 #3
FRC_DFRAME #4
MODEM_DCLK #6
MODEM_DIN #5
MODEM_DOUT #4
PB11
WTIM0_CC0 #15
WTIM0_CC1 #13
WTIM0_CC2 #11
WTIM0_CDTI0 #7
WTIM0_CDTI1 #5
WTIM0_CDTI2 #3
LETIM0_OUT0 #6
LETIM0_OUT1 #5
PCNT0_S0IN #6
PCNT0_S1IN #5
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #7
TIM0_CC1 #6
TIM0_CC2 #5
US0_TX #7
US0_RX #6
US0_CLK #5
US0_CS #4
US0_CTS #3
US0_RTS #2
US1_TX #7
US1_RX #6
US1_CLK #5
US1_CS #4
US1_CTS #3
US1_RTS #2
LEU0_TX #7
LEU0_RX #6
I2C0_SDA #7
I2C0_SCL #6
TIM0_CDTI0 #4
TIM0_CDTI1 #3
TIM0_CDTI2 #2
TIM1_CC0 #7
TIM1_CC1 #6
FRC_DCLK #7
FRC_DOUT #6
PRS_CH6 #7
PRS_CH7 #6
PRS_CH8 #5
PRS_CH9 #4
ACMP0_O #7
ACMP1_O #7
TIM1_CC2 #5
BUSDY
BUSCX
TIM1_CC3 #4
FRC_DFRAME #5
MODEM_DCLK #7
MODEM_DIN #6
MODEM_DOUT #5
PB12
WTIM0_CC0 #16
WTIM0_CC1 #14
WTIM0_CC2 #12
WTIM0_CDTI0 #8
WTIM0_CDTI1 #6
WTIM0_CDTI2 #4
LETIM0_OUT0 #7
LETIM0_OUT1 #6
PCNT0_S0IN #7
PCNT0_S1IN #6
OPA2_OUT
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #8
TIM0_CC1 #7
TIM0_CC2 #6
US0_TX #8
US0_RX #7
US0_CLK #6
US0_CS #5
US0_CTS #4
US0_RTS #3
US1_TX #8
US1_RX #7
US1_CLK #6
US1_CS #5
US1_CTS #4
US1_RTS #3
LEU0_TX #8
LEU0_RX #7
I2C0_SDA #8
I2C0_SCL #7
TIM0_CDTI0 #5
TIM0_CDTI1 #4
TIM0_CDTI2 #3
TIM1_CC0 #8
CMU_CLKI0 #0
PRS_CH6 #8
PRS_CH7 #7
PRS_CH8 #6
PRS_CH9 #5
ACMP0_O #8
ACMP1_O #8
DBG_SWO #1
GPIO_EM4WU9
TIM1_CC1 #7
FRC_DCLK #8
FRC_DOUT #7
TIM1_CC2 #6
BUSCY
BUSDX
OPA2_N
TIM1_CC3 #5
FRC_DFRAME #6
MODEM_DCLK #8
MODEM_DIN #7
MODEM_DOUT #6
PB13
WTIM0_CC0 #17
WTIM0_CC1 #15
WTIM0_CC2 #13
WTIM0_CDTI0 #9
WTIM0_CDTI1 #7
WTIM0_CDTI2 #5
LETIM0_OUT0 #8
LETIM0_OUT1 #7
PCNT0_S0IN #8
PCNT0_S1IN #7
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #9
TIM0_CC1 #8
TIM0_CC2 #7
US0_TX #9
US0_RX #8
US0_CLK #7
US0_CS #6
US0_CTS #5
US0_RTS #4
US1_TX #9
US1_RX #8
US1_CLK #7
US1_CS #6
US1_CTS #5
US1_RTS #4
LEU0_TX #9
LEU0_RX #8
I2C0_SDA #9
I2C0_SCL #8
TIM0_CDTI0 #6
TIM0_CDTI1 #5
TIM0_CDTI2 #4
TIM1_CC0 #9
CMU_CLK1 #1
PRS_CH6 #9
PRS_CH7 #8
PRS_CH8 #7
PRS_CH9 #6
ACMP0_O #9
ACMP1_O #9
TIM1_CC1 #8
FRC_DCLK #9
FRC_DOUT #8
TIM1_CC2 #7
BUSDY
BUSCX
TIM1_CC3 #6
FRC_DFRAME #7
MODEM_DCLK #9
MODEM_DIN #8
MODEM_DOUT #7
PB14
WTIM0_CC0 #18
WTIM0_CC1 #16
WTIM0_CC2 #14
WTIM0_CDTI0 #10
WTIM0_CDTI1 #8
WTIM0_CDTI2 #6
LETIM0_OUT0 #9
LETIM0_OUT1 #8
PCNT0_S0IN #9
PCNT0_S1IN #8
LFXTAL_N
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Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #10
TIM0_CC1 #9
TIM0_CC2 #8
US0_TX #10
US0_RX #9
TIM0_CDTI0 #7
TIM0_CDTI1 #6
TIM0_CDTI2 #5
TIM1_CC0 #10
TIM1_CC1 #9
US0_CLK #8
US0_CS #7
US0_CTS #6
US0_RTS #5
US1_TX #10
US1_RX #9
CMU_CLK0 #1
PRS_CH6 #10
PRS_CH7 #9
PRS_CH8 #8
PRS_CH9 #7
ACMP0_O #10
ACMP1_O #10
FRC_DCLK #10
FRC_DOUT #9
TIM1_CC2 #8
BUSCY
BUSDX
TIM1_CC3 #7
FRC_DFRAME #8
MODEM_DCLK #10
MODEM_DIN #9
MODEM_DOUT #8
PB15
WTIM0_CC0 #19
WTIM0_CC1 #17
WTIM0_CC2 #15
WTIM0_CDTI0 #11
WTIM0_CDTI1 #9
WTIM0_CDTI2 #7
LETIM0_OUT0 #10
LETIM0_OUT1 #9
PCNT0_S0IN #10
PCNT0_S1IN #9
US1_CLK #8
US1_CS #7
LFXTAL_P
US1_CTS #6
US1_RTS #5
LEU0_TX #10
LEU0_RX #9
I2C0_SDA #10
I2C0_SCL #9
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Rev. 1.1 | 83
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #11
TIM0_CC1 #10
TIM0_CC2 #9
US0_TX #11
US0_RX #10
US0_CLK #9
US0_CS #8
TIM0_CDTI0 #8
TIM0_CDTI1 #7
TIM0_CDTI2 #6
TIM1_CC0 #11
TIM1_CC1 #10
TIM1_CC2 #9
CMU_CLK0 #2
CMU_CLKI0 #2
PRS_CH0 #8
US0_CTS #7
US0_RTS #6
US1_TX #11
US1_RX #10
US1_CLK #9
US1_CS #8
FRC_DCLK #11
FRC_DOUT #10
PRS_CH9 #11
PRS_CH10 #0
PRS_CH11 #5
ACMP0_O #11
ACMP1_O #11
ETM_TCLK #3
BUSBY
BUSAX
TIM1_CC3 #8
FRC_DFRAME #9
MODEM_DCLK #11
MODEM_DIN #10
MODEM_DOUT #9
PC6
WTIM0_CC0 #26
WTIM0_CC1 #24
WTIM0_CC2 #22
WTIM0_CDTI0 #18
WTIM0_CDTI1 #16
WTIM0_CDTI2 #14
LETIM0_OUT0 #11
LETIM0_OUT1 #10
PCNT0_S0IN #11
PCNT0_S1IN #10
US1_CTS #7
US1_RTS #6
LEU0_TX #11
LEU0_RX #10
I2C0_SDA #11
I2C0_SCL #10
silabs.com | Building a more connected world.
Rev. 1.1 | 84
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #12
TIM0_CC1 #11
TIM0_CC2 #10
TIM0_CDTI0 #9
TIM0_CDTI1 #8
TIM0_CDTI2 #7
TIM1_CC0 #12
TIM1_CC1 #11
TIM1_CC2 #10
TIM1_CC3 #9
US0_TX #12
US0_RX #11
US0_CLK #10
US0_CS #9
US0_CTS #8
US0_RTS #7
US1_TX #12
US1_RX #11
US1_CLK #10
US1_CS #9
CMU_CLK1 #2
PRS_CH0 #9
PRS_CH9 #12
PRS_CH10 #1
PRS_CH11 #0
ACMP0_O #12
ACMP1_O #12
ETM_TD0
FRC_DCLK #12
FRC_DOUT #11
BUSAY
BUSBX
FRC_DFRAME #10
MODEM_DCLK #12
MODEM_DIN #11
MODEM_DOUT #10
PC7
WTIM0_CC0 #27
WTIM0_CC1 #25
WTIM0_CC2 #23
WTIM0_CDTI0 #19
WTIM0_CDTI1 #17
WTIM0_CDTI2 #15
LETIM0_OUT0 #12
LETIM0_OUT1 #11
PCNT0_S0IN #12
PCNT0_S1IN #11
US1_CTS #8
US1_RTS #7
LEU0_TX #12
LEU0_RX #11
I2C0_SDA #12
I2C0_SCL #11
silabs.com | Building a more connected world.
Rev. 1.1 | 85
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #13
TIM0_CC1 #12
TIM0_CC2 #11
US0_TX #13
US0_RX #12
US0_CLK #11
US0_CS #10
US0_CTS #9
US0_RTS #8
US1_TX #13
US1_RX #12
US1_CLK #11
US1_CS #10
US1_CTS #9
US1_RTS #8
LEU0_TX #13
LEU0_RX #12
I2C0_SDA #13
I2C0_SCL #12
TIM0_CDTI0 #10
TIM0_CDTI1 #9
TIM0_CDTI2 #8
TIM1_CC0 #13
PRS_CH0 #10
PRS_CH9 #13
PRS_CH10 #2
PRS_CH11 #1
ACMP0_O #13
ACMP1_O #13
ETM_TD1
TIM1_CC1 #12
FRC_DCLK #13
FRC_DOUT #12
TIM1_CC2 #11
BUSBY
BUSAX
TIM1_CC3 #10
FRC_DFRAME #11
MODEM_DCLK #13
MODEM_DIN #12
MODEM_DOUT #11
PC8
WTIM0_CC0 #28
WTIM0_CC1 #26
WTIM0_CC2 #24
WTIM0_CDTI0 #20
WTIM0_CDTI1 #18
WTIM0_CDTI2 #16
LETIM0_OUT0 #13
LETIM0_OUT1 #12
PCNT0_S0IN #13
PCNT0_S1IN #12
silabs.com | Building a more connected world.
Rev. 1.1 | 86
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #14
TIM0_CC1 #13
TIM0_CC2 #12
US0_TX #14
US0_RX #13
US0_CLK #12
US0_CS #11
US0_CTS #10
US0_RTS #9
US1_TX #14
US1_RX #13
US1_CLK #12
US1_CS #11
US1_CTS #10
US1_RTS #9
LEU0_TX #14
LEU0_RX #13
I2C0_SDA #14
I2C0_SCL #13
TIM0_CDTI0 #11
TIM0_CDTI1 #10
TIM0_CDTI2 #9
TIM1_CC0 #14
PRS_CH0 #11
PRS_CH9 #14
PRS_CH10 #3
PRS_CH11 #2
ACMP0_O #14
ACMP1_O #14
ETM_TD2
TIM1_CC1 #13
FRC_DCLK #14
FRC_DOUT #13
TIM1_CC2 #12
BUSAY
BUSBX
TIM1_CC3 #11
FRC_DFRAME #12
MODEM_DCLK #14
MODEM_DIN #13
MODEM_DOUT #12
PC9
WTIM0_CC0 #29
WTIM0_CC1 #27
WTIM0_CC2 #25
WTIM0_CDTI0 #21
WTIM0_CDTI1 #19
WTIM0_CDTI2 #17
LETIM0_OUT0 #14
LETIM0_OUT1 #13
PCNT0_S0IN #14
PCNT0_S1IN #13
silabs.com | Building a more connected world.
Rev. 1.1 | 87
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #15
TIM0_CC1 #14
US0_TX #15
US0_RX #14
US0_CLK #13
US0_CS #12
US0_CTS #11
US0_RTS #10
US1_TX #15
US1_RX #14
US1_CLK #13
US1_CS #12
US1_CTS #11
US1_RTS #10
LEU0_TX #15
LEU0_RX #14
I2C0_SDA #15
I2C0_SCL #14
I2C1_SDA #19
I2C1_SCL #18
TIM0_CC2 #13
TIM0_CDTI0 #12
TIM0_CDTI1 #11
TIM0_CDTI2 #10
TIM1_CC0 #15
CMU_CLK1 #3
PRS_CH0 #12
PRS_CH9 #15
PRS_CH10 #4
PRS_CH11 #3
ACMP0_O #15
ACMP1_O #15
ETM_TD3
TIM1_CC1 #14
FRC_DCLK #15
FRC_DOUT #14
TIM1_CC2 #13
BUSBY
BUSAX
TIM1_CC3 #12
FRC_DFRAME #13
MODEM_DCLK #15
MODEM_DIN #14
MODEM_DOUT #13
PC10
WTIM0_CC0 #30
WTIM0_CC1 #28
WTIM0_CC2 #26
WTIM0_CDTI0 #22
WTIM0_CDTI1 #20
WTIM0_CDTI2 #18
LETIM0_OUT0 #15
LETIM0_OUT1 #14
PCNT0_S0IN #15
PCNT0_S1IN #14
GPIO_EM4WU12
silabs.com | Building a more connected world.
Rev. 1.1 | 88
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #16
TIM0_CC1 #15
US0_TX #16
US0_RX #15
US0_CLK #14
US0_CS #13
US0_CTS #12
US0_RTS #11
US1_TX #16
US1_RX #15
US1_CLK #14
US1_CS #13
US1_CTS #12
US1_RTS #11
LEU0_TX #16
LEU0_RX #15
I2C0_SDA #16
I2C0_SCL #15
I2C1_SDA #20
I2C1_SCL #19
TIM0_CC2 #14
TIM0_CDTI0 #13
TIM0_CDTI1 #12
TIM0_CDTI2 #11
TIM1_CC0 #16
CMU_CLK0 #3
PRS_CH0 #13
PRS_CH9 #16
PRS_CH10 #5
PRS_CH11 #4
ACMP0_O #16
ACMP1_O #16
DBG_SWO #3
TIM1_CC1 #15
FRC_DCLK #16
FRC_DOUT #15
TIM1_CC2 #14
BUSAY
BUSBX
TIM1_CC3 #13
FRC_DFRAME #14
MODEM_DCLK #16
MODEM_DIN #15
MODEM_DOUT #14
PC11
WTIM0_CC0 #31
WTIM0_CC1 #29
WTIM0_CC2 #27
WTIM0_CDTI0 #23
WTIM0_CDTI1 #21
WTIM0_CDTI2 #19
LETIM0_OUT0 #16
LETIM0_OUT1 #15
PCNT0_S0IN #16
PCNT0_S1IN #15
silabs.com | Building a more connected world.
Rev. 1.1 | 89
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #17
TIM0_CC1 #16
US0_TX #17
US0_RX #16
US0_CLK #15
US0_CS #14
US0_CTS #13
US0_RTS #12
US1_TX #17
US1_RX #16
US1_CLK #15
US1_CS #14
US1_CTS #13
US1_RTS #12
LEU0_TX #17
LEU0_RX #16
I2C0_SDA #17
I2C0_SCL #16
TIM0_CC2 #15
TIM0_CDTI0 #14
TIM0_CDTI1 #13
TIM0_CDTI2 #12
TIM1_CC0 #17
CMU_CLK0 #4
PRS_CH3 #8
PRS_CH4 #0
PRS_CH5 #6
PRS_CH6 #11
ACMP0_O #17
ACMP1_O #17
LES_CH1
FRC_DCLK #17
FRC_DOUT #16
TIM1_CC1 #16
TIM1_CC2 #15
BUSCY
BUSDX
FRC_DFRAME #15
MODEM_DCLK #17
MODEM_DIN #16
MODEM_DOUT #15
PD9
TIM1_CC3 #14
WTIM0_CC1 #31
WTIM0_CC2 #29
WTIM0_CDTI0 #25
WTIM0_CDTI1 #23
WTIM0_CDTI2 #21
LETIM0_OUT0 #17
LETIM0_OUT1 #16
PCNT0_S0IN #17
PCNT0_S1IN #16
silabs.com | Building a more connected world.
Rev. 1.1 | 90
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #18
TIM0_CC1 #17
US0_TX #18
US0_RX #17
US0_CLK #16
US0_CS #15
US0_CTS #14
US0_RTS #13
US1_TX #18
US1_RX #17
US1_CLK #16
US1_CS #15
US1_CTS #14
US1_RTS #13
LEU0_TX #18
LEU0_RX #17
I2C0_SDA #18
I2C0_SCL #17
TIM0_CC2 #16
TIM0_CDTI0 #15
TIM0_CDTI1 #14
TIM0_CDTI2 #13
TIM1_CC0 #18
CMU_CLK1 #4
PRS_CH3 #9
PRS_CH4 #1
PRS_CH5 #0
PRS_CH6 #12
ACMP0_O #18
ACMP1_O #18
LES_CH2
FRC_DCLK #18
FRC_DOUT #17
TIM1_CC1 #17
BUSDY
BUSCX
TIM1_CC2 #16
FRC_DFRAME #16
MODEM_DCLK #18
MODEM_DIN #17
MODEM_DOUT #16
PD10
TIM1_CC3 #15
WTIM0_CC2 #30
WTIM0_CDTI0 #26
WTIM0_CDTI1 #24
WTIM0_CDTI2 #22
LETIM0_OUT0 #18
LETIM0_OUT1 #17
PCNT0_S0IN #18
PCNT0_S1IN #17
silabs.com | Building a more connected world.
Rev. 1.1 | 91
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #19
TIM0_CC1 #18
US0_TX #19
US0_RX #18
US0_CLK #17
US0_CS #16
US0_CTS #15
US0_RTS #14
US1_TX #19
US1_RX #18
US1_CLK #17
US1_CS #16
US1_CTS #15
US1_RTS #14
LEU0_TX #19
LEU0_RX #18
I2C0_SDA #19
I2C0_SCL #18
TIM0_CC2 #17
TIM0_CDTI0 #16
TIM0_CDTI1 #15
TIM0_CDTI2 #14
TIM1_CC0 #19
PRS_CH3 #10
PRS_CH4 #2
PRS_CH5 #1
PRS_CH6 #13
ACMP0_O #19
ACMP1_O #19
LES_CH3
FRC_DCLK #19
FRC_DOUT #18
TIM1_CC1 #18
BUSCY
BUSDX
TIM1_CC2 #17
FRC_DFRAME #17
MODEM_DCLK #19
MODEM_DIN #18
MODEM_DOUT #17
PD11
TIM1_CC3 #16
WTIM0_CC2 #31
WTIM0_CDTI0 #27
WTIM0_CDTI1 #25
WTIM0_CDTI2 #23
LETIM0_OUT0 #19
LETIM0_OUT1 #18
PCNT0_S0IN #19
PCNT0_S1IN #18
TIM0_CC0 #20
US0_TX #20
US0_RX #19
US0_CLK #18
US0_CS #17
US0_CTS #16
US0_RTS #15
US1_TX #20
US1_RX #19
US1_CLK #18
US1_CS #17
US1_CTS #16
US1_RTS #15
LEU0_TX #20
LEU0_RX #19
I2C0_SDA #20
I2C0_SCL #19
TIM0_CC1 #19
TIM0_CC2 #18
TIM0_CDTI0 #17
TIM0_CDTI1 #16
TIM0_CDTI2 #15
TIM1_CC0 #20
PRS_CH3 #11
PRS_CH4 #3
PRS_CH5 #2
PRS_CH6 #14
ACMP0_O #20
ACMP1_O #20
LES_CH4
FRC_DCLK #20
FRC_DOUT #19
VDAC0_OUT1ALT /
OPA1_OUTALT #0
TIM1_CC1 #19
FRC_DFRAME #18
MODEM_DCLK #20
MODEM_DIN #19
MODEM_DOUT #18
PD12
TIM1_CC2 #18
BUSDY
BUSCX
TIM1_CC3 #17
WTIM0_CDTI0 #28
WTIM0_CDTI1 #26
WTIM0_CDTI2 #24
LETIM0_OUT0 #20
LETIM0_OUT1 #19
PCNT0_S0IN #20
PCNT0_S1IN #19
silabs.com | Building a more connected world.
Rev. 1.1 | 92
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #21
US0_TX #21
US0_RX #20
US0_CLK #19
US0_CS #18
US0_CTS #17
US0_RTS #16
US1_TX #21
US1_RX #20
US1_CLK #19
US1_CS #18
US1_CTS #17
US1_RTS #16
LEU0_TX #21
LEU0_RX #20
I2C0_SDA #21
I2C0_SCL #20
TIM0_CC1 #20
TIM0_CC2 #19
TIM0_CDTI0 #18
TIM0_CDTI1 #17
TIM0_CDTI2 #16
TIM1_CC0 #21
PRS_CH3 #12
PRS_CH4 #4
PRS_CH5 #3
PRS_CH6 #15
ACMP0_O #21
ACMP1_O #21
LES_CH5
FRC_DCLK #21
FRC_DOUT #20
VDAC0_OUT0ALT /
OPA0_OUTALT #1
TIM1_CC1 #20
FRC_DFRAME #19
MODEM_DCLK #21
MODEM_DIN #20
MODEM_DOUT #19
BUSCY
BUSDX
OPA1_P
PD13
TIM1_CC2 #19
TIM1_CC3 #18
WTIM0_CDTI0 #29
WTIM0_CDTI1 #27
WTIM0_CDTI2 #25
LETIM0_OUT0 #21
LETIM0_OUT1 #20
PCNT0_S0IN #21
PCNT0_S1IN #20
TIM0_CC0 #22
US0_TX #22
US0_RX #21
US0_CLK #20
US0_CS #19
US0_CTS #18
US0_RTS #17
US1_TX #22
US1_RX #21
US1_CLK #20
US1_CS #19
US1_CTS #18
US1_RTS #17
LEU0_TX #22
LEU0_RX #21
I2C0_SDA #22
I2C0_SCL #21
TIM0_CC1 #21
TIM0_CC2 #20
TIM0_CDTI0 #19
TIM0_CDTI1 #18
TIM0_CDTI2 #17
TIM1_CC0 #22
CMU_CLK0 #5
PRS_CH3 #13
PRS_CH4 #5
PRS_CH5 #4
PRS_CH6 #16
ACMP0_O #22
ACMP1_O #22
LES_CH6
FRC_DCLK #22
FRC_DOUT #21
BUSDY
BUSCX
TIM1_CC1 #21
FRC_DFRAME #20
MODEM_DCLK #22
MODEM_DIN #21
MODEM_DOUT #20
PD14
TIM1_CC2 #20
VDAC0_OUT1 /
OPA1_OUT
TIM1_CC3 #19
WTIM0_CDTI0 #30
WTIM0_CDTI1 #28
WTIM0_CDTI2 #26
LETIM0_OUT0 #22
LETIM0_OUT1 #21
PCNT0_S0IN #22
PCNT0_S1IN #21
GPIO_EM4WU4
silabs.com | Building a more connected world.
Rev. 1.1 | 93
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
Radio
Other
TIM0_CC0 #23
US0_TX #23
US0_RX #22
US0_CLK #21
US0_CS #20
US0_CTS #19
US0_RTS #18
US1_TX #23
US1_RX #22
US1_CLK #21
US1_CS #20
US1_CTS #19
US1_RTS #18
LEU0_TX #23
LEU0_RX #22
I2C0_SDA #23
I2C0_SCL #22
TIM0_CC1 #22
TIM0_CC2 #21
TIM0_CDTI0 #20
TIM0_CDTI1 #19
TIM0_CDTI2 #18
TIM1_CC0 #23
CMU_CLK1 #5
PRS_CH3 #14
PRS_CH4 #6
PRS_CH5 #5
PRS_CH6 #17
ACMP0_O #23
ACMP1_O #23
LES_CH7
FRC_DCLK #23
FRC_DOUT #22
VDAC0_OUT0ALT /
OPA0_OUTALT #2
TIM1_CC1 #22
FRC_DFRAME #21
MODEM_DCLK #23
MODEM_DIN #22
MODEM_DOUT #21
BUSCY
BUSDX
OPA1_N
PD15
TIM1_CC2 #21
TIM1_CC3 #20
WTIM0_CDTI0 #31
WTIM0_CDTI1 #29
WTIM0_CDTI2 #27
LETIM0_OUT0 #23
LETIM0_OUT1 #22
PCNT0_S0IN #23
PCNT0_S1IN #22
DBG_SWO #2
silabs.com | Building a more connected world.
Rev. 1.1 | 94
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #24
US0_RX #23
US0_CLK #22
US0_CS #21
US0_CTS #20
US0_RTS #19
US1_TX #24
US1_RX #23
US1_CLK #22
US1_CS #21
US1_CTS #20
US1_RTS #19
US2_TX #14
US2_RX #13
US2_CLK #12
US2_CS #11
US2_CTS #10
US2_RTS #9
LEU0_TX #24
LEU0_RX #23
I2C0_SDA #24
I2C0_SCL #23
Radio
Other
TIM0_CC0 #24
TIM0_CC1 #23
TIM0_CC2 #22
TIM0_CDTI0 #21
TIM0_CDTI1 #20
TIM0_CDTI2 #19
TIM1_CC0 #24
PRS_CH0 #0
PRS_CH1 #7
PRS_CH2 #6
PRS_CH3 #5
ACMP0_O #24
ACMP1_O #24
DBG_SWCLKTCK
BOOT_TX
FRC_DCLK #24
FRC_DOUT #23
BUSBY
BUSAX
TIM1_CC1 #23
FRC_DFRAME #22
MODEM_DCLK #24
MODEM_DIN #23
MODEM_DOUT #22
PF0
TIM1_CC2 #22
TIM1_CC3 #21
WTIM0_CDTI1 #30
WTIM0_CDTI2 #28
LETIM0_OUT0 #24
LETIM0_OUT1 #23
PCNT0_S0IN #24
PCNT0_S1IN #23
silabs.com | Building a more connected world.
Rev. 1.1 | 95
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #25
US0_RX #24
US0_CLK #23
US0_CS #22
US0_CTS #21
US0_RTS #20
US1_TX #25
US1_RX #24
US1_CLK #23
US1_CS #22
US1_CTS #21
US1_RTS #20
US2_TX #15
US2_RX #14
US2_CLK #13
US2_CS #12
US2_CTS #11
US2_RTS #10
LEU0_TX #25
LEU0_RX #24
I2C0_SDA #25
I2C0_SCL #24
Radio
Other
TIM0_CC0 #25
TIM0_CC1 #24
TIM0_CC2 #23
TIM0_CDTI0 #22
TIM0_CDTI1 #21
TIM0_CDTI2 #20
TIM1_CC0 #25
PRS_CH0 #1
PRS_CH1 #0
PRS_CH2 #7
PRS_CH3 #6
ACMP0_O #25
ACMP1_O #25
DBG_SWDIOTMS
BOOT_RX
FRC_DCLK #25
FRC_DOUT #24
BUSAY
BUSBX
TIM1_CC1 #24
FRC_DFRAME #23
MODEM_DCLK #25
MODEM_DIN #24
MODEM_DOUT #23
PF1
TIM1_CC2 #23
TIM1_CC3 #22
WTIM0_CDTI1 #31
WTIM0_CDTI2 #29
LETIM0_OUT0 #25
LETIM0_OUT1 #24
PCNT0_S0IN #25
PCNT0_S1IN #24
silabs.com | Building a more connected world.
Rev. 1.1 | 96
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #26
US0_RX #25
US0_CLK #24
US0_CS #23
US0_CTS #22
US0_RTS #21
US1_TX #26
US1_RX #25
US1_CLK #24
US1_CS #23
US1_CTS #22
US1_RTS #21
LEU0_TX #26
LEU0_RX #25
I2C0_SDA #26
I2C0_SCL #25
Radio
Other
TIM0_CC0 #26
TIM0_CC1 #25
TIM0_CC2 #24
CMU_CLK0 #6
PRS_CH0 #2
PRS_CH1 #1
PRS_CH2 #0
PRS_CH3 #7
ACMP0_O #26
ACMP1_O #26
DBG_TDO
TIM0_CDTI0 #23
TIM0_CDTI1 #22
TIM0_CDTI2 #21
TIM1_CC0 #26
FRC_DCLK #26
FRC_DOUT #25
BUSBY
BUSAX
FRC_DFRAME #24
MODEM_DCLK #26
MODEM_DIN #25
MODEM_DOUT #24
PF2
TIM1_CC1 #25
TIM1_CC2 #24
TIM1_CC3 #23
WTIM0_CDTI2 #30
LETIM0_OUT0 #26
LETIM0_OUT1 #25
PCNT0_S0IN #26
PCNT0_S1IN #25
DBG_SWO #0
GPIO_EM4WU0
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Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #27
US0_RX #26
US0_CLK #25
US0_CS #24
US0_CTS #23
US0_RTS #22
US1_TX #27
US1_RX #26
US1_CLK #25
US1_CS #24
US1_CTS #23
US1_RTS #22
US2_TX #16
US2_RX #15
US2_CLK #14
US2_CS #13
US2_CTS #12
US2_RTS #11
LEU0_TX #27
LEU0_RX #26
I2C0_SDA #27
I2C0_SCL #26
Radio
Other
TIM0_CC0 #27
TIM0_CC1 #26
TIM0_CC2 #25
TIM0_CDTI0 #24
TIM0_CDTI1 #23
TIM0_CDTI2 #22
TIM1_CC0 #27
CMU_CLK1 #6
PRS_CH0 #3
PRS_CH1 #2
PRS_CH2 #1
PRS_CH3 #0
ACMP0_O #27
ACMP1_O #27
DBG_TDI
FRC_DCLK #27
FRC_DOUT #26
BUSAY
BUSBX
FRC_DFRAME #25
MODEM_DCLK #27
MODEM_DIN #26
MODEM_DOUT #25
PF3
TIM1_CC1 #26
TIM1_CC2 #25
TIM1_CC3 #24
WTIM0_CDTI2 #31
LETIM0_OUT0 #27
LETIM0_OUT1 #26
PCNT0_S0IN #27
PCNT0_S1IN #26
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Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #28
US0_RX #27
US0_CLK #26
US0_CS #25
US0_CTS #24
US0_RTS #23
US1_TX #28
US1_RX #27
US1_CLK #26
US1_CS #25
US1_CTS #24
US1_RTS #23
US2_TX #17
US2_RX #16
US2_CLK #15
US2_CS #14
US2_CTS #13
US2_RTS #12
LEU0_TX #28
LEU0_RX #27
I2C0_SDA #28
I2C0_SCL #27
Radio
Other
TIM0_CC0 #28
TIM0_CC1 #27
TIM0_CC2 #26
TIM0_CDTI0 #25
TIM0_CDTI1 #24
TIM0_CDTI2 #23
TIM1_CC0 #28
FRC_DCLK #28
FRC_DOUT #27
PRS_CH0 #4
PRS_CH1 #3
PRS_CH2 #2
PRS_CH3 #1
ACMP0_O #28
ACMP1_O #28
BUSBY
BUSAX
FRC_DFRAME #26
MODEM_DCLK #28
MODEM_DIN #27
MODEM_DOUT #26
PF4
TIM1_CC1 #27
TIM1_CC2 #26
TIM1_CC3 #25
LETIM0_OUT0 #28
LETIM0_OUT1 #27
PCNT0_S0IN #28
PCNT0_S1IN #27
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #29
US0_RX #28
US0_CLK #27
US0_CS #26
US0_CTS #25
US0_RTS #24
US1_TX #29
US1_RX #28
US1_CLK #27
US1_CS #26
US1_CTS #25
US1_RTS #24
US2_TX #18
US2_RX #17
US2_CLK #16
US2_CS #15
US2_CTS #14
US2_RTS #13
LEU0_TX #29
LEU0_RX #28
I2C0_SDA #29
I2C0_SCL #28
Radio
Other
TIM0_CC0 #29
TIM0_CC1 #28
TIM0_CC2 #27
TIM0_CDTI0 #26
TIM0_CDTI1 #25
TIM0_CDTI2 #24
TIM1_CC0 #29
FRC_DCLK #29
FRC_DOUT #28
PRS_CH0 #5
PRS_CH1 #4
PRS_CH2 #3
PRS_CH3 #2
ACMP0_O #29
ACMP1_O #29
BUSAY
BUSBX
FRC_DFRAME #27
MODEM_DCLK #29
MODEM_DIN #28
MODEM_DOUT #27
PF5
TIM1_CC1 #28
TIM1_CC2 #27
TIM1_CC3 #26
LETIM0_OUT0 #29
LETIM0_OUT1 #28
PCNT0_S0IN #29
PCNT0_S1IN #28
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #30
US0_RX #29
US0_CLK #28
US0_CS #27
US0_CTS #26
US0_RTS #25
US1_TX #30
US1_RX #29
US1_CLK #28
US1_CS #27
US1_CTS #26
US1_RTS #25
US2_TX #19
US2_RX #18
US2_CLK #17
US2_CS #16
US2_CTS #15
US2_RTS #14
LEU0_TX #30
LEU0_RX #29
I2C0_SDA #30
I2C0_SCL #29
Radio
Other
TIM0_CC0 #30
TIM0_CC1 #29
TIM0_CC2 #28
TIM0_CDTI0 #27
TIM0_CDTI1 #26
TIM0_CDTI2 #25
TIM1_CC0 #30
CMU_CLK1 #7
PRS_CH0 #6
PRS_CH1 #5
PRS_CH2 #4
PRS_CH3 #3
ACMP0_O #30
ACMP1_O #30
FRC_DCLK #30
FRC_DOUT #29
BUSBY
BUSAX
FRC_DFRAME #28
MODEM_DCLK #30
MODEM_DIN #29
MODEM_DOUT #28
PF6
TIM1_CC1 #29
TIM1_CC2 #28
TIM1_CC3 #27
LETIM0_OUT0 #30
LETIM0_OUT1 #29
PCNT0_S0IN #30
PCNT0_S1IN #29
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Pin Definitions
GPIO Name
Pin Alternate Functionality / Description
Analog
Timers
Communication
US0_TX #31
US0_RX #30
US0_CLK #29
US0_CS #28
US0_CTS #27
US0_RTS #26
US1_TX #31
US1_RX #30
US1_CLK #29
US1_CS #28
US1_CTS #27
US1_RTS #26
US2_TX #20
US2_RX #19
US2_CLK #18
US2_CS #17
US2_CTS #16
US2_RTS #15
LEU0_TX #31
LEU0_RX #30
I2C0_SDA #31
I2C0_SCL #30
Radio
Other
TIM0_CC0 #31
TIM0_CC1 #30
TIM0_CC2 #29
CMU_CLKI0 #1
CMU_CLK0 #7
PRS_CH0 #7
PRS_CH1 #6
PRS_CH2 #5
PRS_CH3 #4
ACMP0_O #31
ACMP1_O #31
GPIO_EM4WU1
TIM0_CDTI0 #28
TIM0_CDTI1 #27
TIM0_CDTI2 #26
TIM1_CC0 #31
FRC_DCLK #31
FRC_DOUT #30
BUSAY
BUSBX
FRC_DFRAME #29
MODEM_DCLK #31
MODEM_DIN #30
MODEM_DOUT #29
PF7
TIM1_CC1 #30
TIM1_CC2 #29
TIM1_CC3 #28
LETIM0_OUT0 #31
LETIM0_OUT1 #30
PCNT0_S0IN #31
PCNT0_S1IN #30
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
7.3 Alternate Functionality Overview
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-
nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO
pin. Refer to 7.2 GPIO Functionality Table for a list of functions available on each GPIO pin.
Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout
is shown in the column corresponding to LOCATION 0.
Table 7.3. Alternate Functionality Overview
Alternate
LOCATION
12 - 15 16 - 19
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
Functionality
0 - 3
0: PA0
1: PA1
2: PA2
3: PA3
0: PA0
1: PA1
2: PA2
3: PA3
0: PA0
4 - 7
4: PA4
5: PA5
6: PB11
7: PB12
4: PA4
5: PA5
6: PB11
7: PB12
8 - 11
8: PB13
9: PB14
20 - 23
24 - 27
28 - 31
28: PF4
29: PF5
30: PF6
31: PF7
28: PF4
29: PF5
30: PF6
31: PF7
Description
12: PC7
13: PC8
Analog comparator
ACMP0, digital out-
put.
ACMP0_O
ACMP1_O
10: PB15 14: PC9
11: PC6
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
Analog comparator
ACMP1, digital out-
put.
13: PC8
10: PB15 14: PC9
11: PC6
Analog to digital
converter ADC0 ex-
ternal reference in-
put negative pin.
ADC0_EXTN
ADC0_EXTP
0: PA1
Analog to digital
converter ADC0 ex-
ternal reference in-
put positive pin.
BOOT_RX
BOOT_TX
0: PF1
0: PF0
0: PA1
1: PB15
2: PC6
3: PC11
0: PA0
1: PB14
2: PC7
3: PC10
0: PB13
1: PF7
2: PC6
Bootloader RX.
Bootloader TX.
4: PD9
5: PD14
6: PF2
7: PF7
4: PD10
5: PD15
6: PF3
7: PF6
4: PA5
Clock Management
Unit, clock output
number 0.
CMU_CLK0
Clock Management
Unit, clock output
number 1.
CMU_CLK1
CMU_CLKI0
Clock Management
Unit, clock input
number 0.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
0: PF0
Debug-interface
Serial Wire clock
input and JTAG
Test Clock.
DBG_SWCLKTCK
DBG_SWDIOTMS
DBG_SWO
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull down.
0: PF1
Debug-interface
Serial Wire data in-
put / output and
JTAG Test Mode
Select.
Note that this func-
tion is enabled to
the pin out of reset,
and has a built-in
pull up.
0: PF2
Debug-interface
Serial Wire viewer
Output.
1: PB13
2: PD15
3: PC11
Note that this func-
tion is not enabled
after reset, and
must be enabled by
software to be
used.
0: PF3
Debug-interface
JTAG Test Data In.
Note that this func-
tion becomes avail-
able after the first
valid JTAG com-
mand is received,
and has a built-in
pull up when JTAG
is active.
DBG_TDI
0: PF2
Debug-interface
JTAG Test Data
Out.
Note that this func-
tion becomes avail-
able after the first
valid JTAG com-
mand is received.
DBG_TDO
1: PA5
3: PC6
3: PC7
Embedded Trace
Module ETM clock .
ETM_TCLK
ETM_TD0
Embedded Trace
Module ETM data
0.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
3: PC8
Embedded Trace
Module ETM data
1.
ETM_TD1
ETM_TD2
ETM_TD3
3: PC9
Embedded Trace
Module ETM data
2.
3: PC10
Embedded Trace
Module ETM data
3.
0: PA0
1: PA1
2: PA2
3: PA3
0: PA2
1: PA3
2: PA4
3: PA5
0: PA1
1: PA2
2: PA3
3: PA4
0: PF2
4: PA4
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
12: PC9 16: PD10 20: PD14 24: PF2
13: PC10 17: PD11 21: PD15 25: PF3
28: PF4
29: PF5
30: PF6
31: PF7
28: PF6
29: PF7
30: PA0
31: PA1
28: PF5
29: PF6
30: PF7
31: PA0
5: PA5
13: PC8
Frame Controller,
Data Sniffer Clock.
FRC_DCLK
6: PB11
7: PB12
4: PB11
5: PB12
6: PB13
7: PB14
4: PA5
10: PB15 14: PC9
11: PC6
8: PB15
9: PC6
Frame Controller,
Data Sniffer Frame
active
FRC_DFRAME
FRC_DOUT
10: PC7
11: PC8
8: PB14
9: PB15
10: PC6
11: PC7
14: PC11 18: PD12 22: PF0
26: PF4
27: PF5
15: PD9
12: PC8
13: PC9
19: PD13 23: PF1
16: PD9
17: PD10 21: PD14 25: PF2
20: PD13 24: PF1
Frame Controller,
Data Sniffer Out-
put.
5: PB11
6: PB12
7: PB13
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
Pin can be used to
wake the system
up from EM4
GPIO_EM4WU0
GPIO_EM4WU1
GPIO_EM4WU4
GPIO_EM4WU8
GPIO_EM4WU9
GPIO_EM4WU12
0: PF7
Pin can be used to
wake the system
up from EM4
0: PD14
0: PA3
Pin can be used to
wake the system
up from EM4
Pin can be used to
wake the system
up from EM4
0: PB13
0: PC10
Pin can be used to
wake the system
up from EM4
Pin can be used to
wake the system
up from EM4
0: PA1
1: PA2
2: PA3
3: PA4
4: PA5
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
28: PF5
29: PF6
30: PF7
31: PA0
5: PB11
6: PB12
7: PB13
17: PD10 21: PD14 25: PF2
I2C0 Serial Clock
Line input / output.
I2C0_SCL
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
Functionality
0 - 3
0: PA0
1: PA1
2: PA2
3: PA3
4 - 7
4: PA4
5: PA5
6: PB11
7: PB12
8 - 11
8: PB13
9: PB14
20 - 23
24 - 27
28 - 31
28: PF4
29: PF5
30: PF6
31: PF7
Description
12: PC7
13: PC8
I2C0 Serial Data in-
put / output.
I2C0_SDA
I2C1_SCL
10: PB15 14: PC9
11: PC6
15: PC10 19: PD11 23: PD15 27: PF3
18: PC10
I2C1 Serial Clock
Line input / output.
19: PC11
19: PC10 20: PC11
I2C1 Serial Data in-
put / output.
I2C1_SDA
LES_CH1
LES_CH2
LES_CH3
LES_CH4
LES_CH5
LES_CH6
LES_CH7
LES_CH8
LES_CH9
LES_CH10
LES_CH11
LES_CH12
LES_CH13
0: PD9
0: PD10
0: PD11
0: PD12
0: PD13
0: PD14
0: PD15
0: PA0
0: PA1
0: PA2
0: PA3
0: PA4
0: PA5
LESENSE channel
1.
LESENSE channel
2.
LESENSE channel
3.
LESENSE channel
4.
LESENSE channel
5.
LESENSE channel
6.
LESENSE channel
7.
LESENSE channel
8.
LESENSE channel
9.
LESENSE channel
10.
LESENSE channel
11.
LESENSE channel
12.
LESENSE channel
13.
0: PA0
1: PA1
2: PA2
3: PA3
0: PA1
1: PA2
2: PA3
3: PA4
4: PA4
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
28: PF5
29: PF6
30: PF7
31: PA0
Low Energy Timer
LETIM0, output
channel 0.
5: PA5
13: PC8
LETIM0_OUT0
LETIM0_OUT1
6: PB11
7: PB12
4: PA5
10: PB15 14: PC9
11: PC6
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
Low Energy Timer
LETIM0, output
channel 1.
5: PB11
6: PB12
7: PB13
17: PD10 21: PD14 25: PF2
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
Functionality
0 - 3
0: PA1
1: PA2
2: PA3
3: PA4
0: PA0
1: PA1
2: PA2
3: PA3
0: PB14
4 - 7
4: PA5
8 - 11
8: PB14
9: PB15
10: PC6
11: PC7
8: PB13
9: PB14
12 - 15
16 - 19
20 - 23
24 - 27
28 - 31
28: PF5
29: PF6
30: PF7
31: PA0
28: PF4
29: PF5
30: PF6
31: PF7
Description
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
5: PB11
6: PB12
7: PB13
4: PA4
17: PD10 21: PD14 25: PF2
LEUART0 Receive
input.
LEU0_RX
LEU0_TX
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
12: PC7
13: PC8
LEUART0 Transmit
output. Also used
as receive input in
half duplex commu-
nication.
5: PA5
6: PB11
7: PB12
10: PB15 14: PC9
11: PC6
Low Frequency
Crystal (typically
32.768 kHz) nega-
tive pin. Also used
as an optional ex-
ternal clock input
pin.
LFXTAL_N
0: PB15
Low Frequency
Crystal (typically
32.768 kHz) posi-
tive pin.
LFXTAL_P
0: PA0
1: PA1
2: PA2
3: PA3
0: PA1
1: PA2
2: PA3
3: PA4
0: PA2
1: PA3
2: PA4
3: PA5
0: PA4
4: PA4
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
28: PF5
29: PF6
30: PF7
31: PA0
28: PF6
29: PF7
30: PA0
31: PA1
5: PA5
13: PC8
MODEM data clock
out.
MODEM_DCLK
6: PB11
7: PB12
4: PA5
10: PB15 14: PC9
11: PC6
8: PB14
9: PB15
10: PC6
11: PC7
8: PB15
9: PC6
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
5: PB11
6: PB12
7: PB13
4: PB11
5: PB12
6: PB13
7: PB14
17: PD10 21: PD14 25: PF2
MODEM_DIN
MODEM data in.
MODEM data out.
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
12: PC9 16: PD10 20: PD14 24: PF2
13: PC10 17: PD11 21: PD15 25: PF3
MODEM_DOUT
10: PC7
11: PC8
14: PC11 18: PD12 22: PF0
15: PD9 19: PD13 23: PF1
26: PF4
27: PF5
Operational Amplifi-
er 0 external nega-
tive input.
OPA0_N
OPA0_P
OPA1_N
OPA1_P
0: PA2
Operational Amplifi-
er 0 external posi-
tive input.
0: PD15
0: PD13
Operational Amplifi-
er 1 external nega-
tive input.
Operational Amplifi-
er 1 external posi-
tive input.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
4 - 7
8 - 11
20 - 23
24 - 27
28 - 31
Description
0: PB13
Operational Amplifi-
er 2 external nega-
tive input.
OPA2_N
0: PB12
0: PB11
Operational Amplifi-
er 2 output.
OPA2_OUT
OPA2_P
Operational Amplifi-
er 2 external posi-
tive input.
0: PA0
1: PA1
2: PA2
3: PA3
0: PA1
1: PA2
2: PA3
3: PA4
0: PF0
1: PF1
2: PF2
3: PF3
0: PF1
1: PF2
2: PF3
3: PF4
0: PF2
1: PF3
2: PF4
3: PF5
0: PF3
1: PF4
2: PF5
3: PF6
0: PD9
1: PD10
2: PD11
3: PD12
4: PA4
5: PA5
6: PB11
7: PB12
4: PA5
5: PB11
6: PB12
7: PB13
4: PF4
5: PF5
6: PF6
7: PF7
4: PF5
5: PF6
6: PF7
7: PF0
4: PF6
5: PF7
6: PF0
7: PF1
4: PF7
5: PF0
6: PF1
7: PF2
4: PD13
5: PD14
6: PD15
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
28: PF5
29: PF6
30: PF7
31: PA0
Pulse Counter
PCNT0 input num-
ber 0.
13: PC8
PCNT0_S0IN
PCNT0_S1IN
PRS_CH0
PRS_CH1
PRS_CH2
PRS_CH3
PRS_CH4
10: PB15 14: PC9
11: PC6
8: PB14
9: PB15
10: PC6
11: PC7
8: PC6
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
Pulse Counter
PCNT0 input num-
ber 1.
17: PD10 21: PD14 25: PF2
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0
12: PC10
27: PF4
Peripheral Reflex
System PRS, chan-
nel 0.
9: PC7
13: PC11
10: PC8
11: PC9
Peripheral Reflex
System PRS, chan-
nel 1.
Peripheral Reflex
System PRS, chan-
nel 2.
8: PD9
12: PD13
13: PD14
Peripheral Reflex
System PRS, chan-
nel 3.
9: PD10
10: PD11 14: PD15
11: PD12
Peripheral Reflex
System PRS, chan-
nel 4.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
Functionality
0 - 3
0: PD10
1: PD11
2: PD12
3: PD13
0: PA0
1: PA1
2: PA2
3: PA3
0: PA1
1: PA2
2: PA3
3: PA4
0: PA2
1: PA3
2: PA4
3: PA5
0: PA3
1: PA4
2: PA5
3: PB11
0: PC6
1: PC7
2: PC8
3: PC9
0: PC7
1: PC8
2: PC9
3: PC10
0: PA0
1: PA1
2: PA2
3: PA3
0: PA1
1: PA2
2: PA3
3: PA4
4 - 7
4: PD14
5: PD15
6: PD9
8 - 11
20 - 23
24 - 27
28 - 31
Description
Peripheral Reflex
System PRS, chan-
nel 5.
PRS_CH5
PRS_CH6
PRS_CH7
PRS_CH8
PRS_CH9
PRS_CH10
PRS_CH11
TIM0_CC0
TIM0_CC1
4: PA4
8: PB13
9: PB14
12: PD10 16: PD14
13: PD11 17: PD15
Peripheral Reflex
System PRS, chan-
nel 6.
5: PA5
6: PB11
7: PB12
4: PA5
10: PB15 14: PD12
11: PD9
8: PB14
9: PB15
10: PA0
15: PD13
Peripheral Reflex
System PRS, chan-
nel 7.
5: PB11
6: PB12
7: PB13
4: PB11
5: PB12
6: PB13
7: PB14
4: PB12
5: PB13
6: PB14
7: PB15
4: PC10
5: PC11
8: PB15
9: PA0
Peripheral Reflex
System PRS, chan-
nel 8.
10: PA1
8: PA0
9: PA1
10: PA2
11: PC6
12: PC7
13: PC8
14: PC9
15: PC10
16: PC11
Peripheral Reflex
System PRS, chan-
nel 9.
Peripheral Reflex
System PRS, chan-
nel 10.
4: PC11
5: PC6
Peripheral Reflex
System PRS, chan-
nel 11.
4: PA4
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
28: PF5
29: PF6
30: PF7
31: PA0
Timer 0 Capture
Compare input /
output channel 0.
5: PA5
13: PC8
6: PB11
7: PB12
4: PA5
10: PB15 14: PC9
11: PC6
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
Timer 0 Capture
Compare input /
output channel 1.
5: PB11
6: PB12
7: PB13
17: PD10 21: PD14 25: PF2
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
12: PC9 16: PD10 20: PD14 24: PF2
13: PC10 17: PD11 21: PD15 25: PF3
Functionality
0 - 3
0: PA2
1: PA3
2: PA4
3: PA5
0: PA3
1: PA4
2: PA5
3: PB11
0: PA4
1: PA5
2: PB11
3: PB12
0: PA5
1: PB11
2: PB12
3: PB13
0: PA0
1: PA1
2: PA2
3: PA3
0: PA1
1: PA2
2: PA3
3: PA4
0: PA2
1: PA3
2: PA4
3: PA5
0: PA3
1: PA4
2: PA5
3: PB11
0: PA2
1: PA3
2: PA4
3: PA5
4 - 7
4: PB11
5: PB12
6: PB13
7: PB14
4: PB12
5: PB13
6: PB14
7: PB15
4: PB13
5: PB14
6: PB15
7: PC6
8 - 11
8: PB15
9: PC6
20 - 23
24 - 27
28 - 31
28: PF6
29: PF7
30: PA0
31: PA1
28: PF7
29: PA0
30: PA1
31: PA2
28: PA0
29: PA1
30: PA2
31: PA3
28: PA1
29: PA2
30: PA3
31: PA4
28: PF4
29: PF5
30: PF6
31: PF7
28: PF5
29: PF6
30: PF7
31: PA0
28: PF6
29: PF7
30: PA0
31: PA1
28: PF7
29: PA0
30: PA1
31: PA2
28: PF6
29: PF7
30: PA0
31: PA1
Description
Timer 0 Capture
Compare input /
output channel 2.
TIM0_CC2
TIM0_CDTI0
TIM0_CDTI1
TIM0_CDTI2
TIM1_CC0
TIM1_CC1
TIM1_CC2
TIM1_CC3
US0_CLK
10: PC7
11: PC8
8: PC6
14: PC11 18: PD12 22: PF0
15: PD9 19: PD13 23: PF1
26: PF4
27: PF5
12: PC10 16: PD11 20: PD15 24: PF3
Timer 0 Compli-
mentary Dead Time
Insertion channel 0.
9: PC7
13: PC11 17: PD12 21: PF0
14: PD9 18: PD13 22: PF1
25: PF4
26: PF5
27: PF6
24: PF4
25: PF5
26: PF6
27: PF7
24: PF5
25: PF6
26: PF7
27: PA0
10: PC8
11: PC9
8: PC7
15: PD10 19: PD14 23: PF2
12: PC11 16: PD12 20: PF0
Timer 0 Compli-
mentary Dead Time
Insertion channel 1.
9: PC8
13: PD9
17: PD13 21: PF1
10: PC9
14: PD10 18: PD14 22: PF2
11: PC10 15: PD11 19: PD15 23: PF3
4: PB14
5: PB15
6: PC6
8: PC8
9: PC9
12: PD9
16: PD13 20: PF1
Timer 0 Compli-
mentary Dead Time
Insertion channel 2.
13: PD10 17: PD14 21: PF2
10: PC10 14: PD11 18: PD15 22: PF3
11: PC11 15: PD12 19: PF0 23: PF4
7: PC7
4: PA4
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
Timer 1 Capture
Compare input /
output channel 0.
5: PA5
13: PC8
6: PB11
7: PB12
4: PA5
10: PB15 14: PC9
11: PC6
8: PB14
9: PB15
10: PC6
11: PC7
8: PB15
9: PC6
12: PC8
13: PC9
16: PD9
20: PD13 24: PF1
Timer 1 Capture
Compare input /
output channel 1.
5: PB11
6: PB12
7: PB13
4: PB11
5: PB12
6: PB13
7: PB14
4: PB12
5: PB13
6: PB14
7: PB15
4: PB11
5: PB12
6: PB13
7: PB14
17: PD10 21: PD14 25: PF2
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
12: PC9 16: PD10 20: PD14 24: PF2
13: PC10 17: PD11 21: PD15 25: PF3
Timer 1 Capture
Compare input /
output channel 2.
10: PC7
11: PC8
8: PC6
14: PC11 18: PD12 22: PF0
15: PD9 19: PD13 23: PF1
26: PF4
27: PF5
12: PC10 16: PD11 20: PD15 24: PF3
Timer 1 Capture
Compare input /
output channel 3.
9: PC7
13: PC11 17: PD12 21: PF0
14: PD9 18: PD13 22: PF1
15: PD10 19: PD14 23: PF2
12: PC9
13: PC10 17: PD11 21: PD15 25: PF3
25: PF4
26: PF5
27: PF6
10: PC8
11: PC9
8: PB15
9: PC6
16: PD10 20: PD14 24: PF2
USART0 clock in-
put / output.
10: PC7
11: PC8
14: PC11 18: PD12 22: PF0
15: PD9 19: PD13 23: PF1
26: PF4
27: PF5
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
12: PC10 16: PD11 20: PD15 24: PF3
Functionality
0 - 3
0: PA3
1: PA4
2: PA5
3: PB11
0: PA4
1: PA5
2: PB11
3: PB12
0: PA5
1: PB11
2: PB12
3: PB13
0: PA1
1: PA2
2: PA3
3: PA4
4 - 7
4: PB12
5: PB13
6: PB14
7: PB15
4: PB13
5: PB14
6: PB15
7: PC6
8 - 11
8: PC6
9: PC7
10: PC8
11: PC9
8: PC7
9: PC8
10: PC9
20 - 23
24 - 27
28 - 31
28: PF7
29: PA0
30: PA1
31: PA2
28: PA0
29: PA1
30: PA2
31: PA3
28: PA1
29: PA2
30: PA3
31: PA4
28: PF5
29: PF6
30: PF7
31: PA0
Description
13: PC11 17: PD12 21: PF0
14: PD9 18: PD13 22: PF1
25: PF4
26: PF5
27: PF6
24: PF4
25: PF5
26: PF6
27: PF7
24: PF5
25: PF6
26: PF7
27: PA0
USART0 chip se-
lect input / output.
US0_CS
15: PD10 19: PD14 23: PF2
12: PC11 16: PD12 20: PF0
USART0 Clear To
Send hardware
flow control input.
13: PD9
17: PD13 21: PF1
US0_CTS
US0_RTS
14: PD10 18: PD14 22: PF2
11: PC10 15: PD11 19: PD15 23: PF3
4: PB14
5: PB15
6: PC6
8: PC8
9: PC9
12: PD9
16: PD13 20: PF1
USART0 Request
To Send hardware
flow control output.
13: PD10 17: PD14 21: PF2
10: PC10 14: PD11 18: PD15 22: PF3
11: PC11 15: PD12 19: PF0 23: PF4
7: PC7
4: PA5
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
16: PD9
17: PD10 21: PD14 25: PF2
20: PD13 24: PF1
USART0 Asynchro-
nous Receive.
5: PB11
6: PB12
7: PB13
USART0 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US0_RX
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
USART0 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
13: PC8
10: PB15 14: PC9
US0_TX
11: PC6
USART0 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
0: PA2
1: PA3
2: PA4
3: PA5
0: PA3
1: PA4
2: PA5
3: PB11
0: PA4
1: PA5
2: PB11
3: PB12
4: PB11
5: PB12
6: PB13
7: PB14
4: PB12
5: PB13
6: PB14
7: PB15
4: PB13
5: PB14
6: PB15
7: PC6
8: PB15
9: PC6
10: PC7
11: PC8
8: PC6
9: PC7
10: PC8
11: PC9
8: PC7
9: PC8
10: PC9
12: PC9
16: PD10 20: PD14 24: PF2
28: PF6
29: PF7
30: PA0
31: PA1
28: PF7
29: PA0
30: PA1
31: PA2
28: PA0
29: PA1
30: PA2
31: PA3
13: PC10 17: PD11 21: PD15 25: PF3
USART1 clock in-
put / output.
US1_CLK
US1_CS
14: PC11 18: PD12 22: PF0
15: PD9 19: PD13 23: PF1
26: PF4
27: PF5
12: PC10 16: PD11 20: PD15 24: PF3
13: PC11 17: PD12 21: PF0
14: PD9 18: PD13 22: PF1
25: PF4
26: PF5
27: PF6
24: PF4
25: PF5
26: PF6
27: PF7
USART1 chip se-
lect input / output.
15: PD10 19: PD14 23: PF2
12: PC11 16: PD12 20: PF0
USART1 Clear To
Send hardware
flow control input.
13: PD9
17: PD13 21: PF1
US1_CTS
14: PD10 18: PD14 22: PF2
11: PC10 15: PD11 19: PD15 23: PF3
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
12 - 15 16 - 19
12: PD9 16: PD13 20: PF1
13: PD10 17: PD14 21: PF2
Functionality
0 - 3
0: PA5
1: PB11
2: PB12
3: PB13
0: PA1
1: PA2
2: PA3
3: PA4
4 - 7
4: PB14
5: PB15
6: PC6
7: PC7
4: PA5
8 - 11
8: PC8
9: PC9
20 - 23
24 - 27
24: PF5
25: PF6
26: PF7
27: PA0
28 - 31
28: PA1
29: PA2
30: PA3
31: PA4
28: PF5
29: PF6
30: PF7
31: PA0
Description
USART1 Request
To Send hardware
flow control output.
US1_RTS
US1_RX
10: PC10 14: PD11 18: PD15 22: PF3
11: PC11 15: PD12 19: PF0 23: PF4
8: PB14
9: PB15
10: PC6
11: PC7
12: PC8
13: PC9
16: PD9
17: PD10 21: PD14 25: PF2
20: PD13 24: PF1
USART1 Asynchro-
nous Receive.
5: PB11
6: PB12
7: PB13
USART1 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
14: PC10 18: PD11 22: PD15 26: PF3
15: PC11 19: PD12 23: PF0 27: PF4
0: PA0
1: PA1
2: PA2
3: PA3
4: PA4
5: PA5
6: PB11
7: PB12
8: PB13
9: PB14
12: PC7
16: PC11 20: PD12 24: PF0
17: PD9 21: PD13 25: PF1
18: PD10 22: PD14 26: PF2
15: PC10 19: PD11 23: PD15 27: PF3
28: PF4
29: PF5
30: PF6
31: PF7
USART1 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
13: PC8
10: PB15 14: PC9
11: PC6
US1_TX
USART1 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
12: PF0
13: PF1
14: PF3
15: PF4
12: PF1
13: PF3
14: PF4
15: PF5
12: PF3
13: PF4
14: PF5
15: PF6
12: PF4
13: PF5
14: PF6
15: PF7
13: PF0
14: PF1
15: PF3
16: PF5
17: PF6
18: PF7
30: PA5
29: PA5
28: PA5
USART2 clock in-
put / output.
US2_CLK
US2_CS
11: PF0
16: PF6
17: PF7
USART2 chip se-
lect input / output.
10: PF0
11: PF1
16: PF7
USART2 Clear To
Send hardware
flow control input.
US2_CTS
US2_RTS
9: PF0
27: PA5
USART2 Request
To Send hardware
flow control output.
10: PF1
11: PF3
16: PF4
17: PF5
18: PF6
19: PF7
31: PA5
USART2 Asynchro-
nous Receive.
USART2 Synchro-
nous mode Master
Input / Slave Out-
put (MISO).
US2_RX
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
Functionality
0 - 3
4 - 7
8 - 11
12 - 15
16 - 19
16: PF3
17: PF4
18: PF5
19: PF6
20 - 23
24 - 27
28 - 31
Description
0: PA5
14: PF0
15: PF1
20: PF7
USART2 Asynchro-
nous Transmit. Al-
so used as receive
input in half duplex
communication.
US2_TX
USART2 Synchro-
nous mode Master
Output / Slave In-
put (MOSI).
0: PA1
0: PA3
Digital to analog
converter VDAC0
external reference
input pin.
VDAC0_EXT
Digital to Analog
Converter DAC0
output channel
number 0.
VDAC0_OUT0 /
OPA0_OUT
0: PA5
Digital to Analog
Converter DAC0 al-
ternative output for
channel 0.
VDAC0_OUT0AL
T / OPA0_OUT-
ALT
1: PD13
2: PD15
0: PD14
Digital to Analog
Converter DAC0
output channel
number 1.
VDAC0_OUT1 /
OPA1_OUT
0: PD12
1: PA2
2: PA4
0: PA0
1: PA1
2: PA2
3: PA3
0: PA2
1: PA3
2: PA4
3: PA5
0: PA4
1: PA5
Digital to Analog
Converter DAC0 al-
ternative output for
channel 1.
VDAC0_OUT1AL
T / OPA1_OUT-
ALT
4: PA4
5: PA5
15: PB11 16: PB12
17: PB13
26: PC6
27: PC7
28: PC8
29: PC9
30: PC10
31: PC11
28: PC10
29: PC11
31: PD9
Wide timer 0 Cap-
ture Compare in-
put / output channel
0.
WTIM0_CC0
WTIM0_CC1
WTIM0_CC2
18: PB14
19: PB15
13: PB11 16: PB14
14: PB12 17: PB15
15: PB13
24: PC6
25: PC7
26: PC8
27: PC9
24: PC8
25: PC9
Wide timer 0 Cap-
ture Compare in-
put / output channel
1.
11: PB11 12: PB12
13: PB13
22: PC6
23: PC7
29: PD9
Wide timer 0 Cap-
ture Compare in-
put / output channel
2.
30: PD10
14: PB14
26: PC10 31: PD11
27: PC11
15: PB15
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
Alternate
LOCATION
Functionality
0 - 3
4 - 7
8 - 11
8: PB12
9: PB13
10: PB14
11: PB15
8: PB14
9: PB15
12 - 15
16 - 19
20 - 23
20: PC8
21: PC9
24 - 27
28 - 31
Description
7: PB11
18: PC6
19: PC7
25: PD9
28: PD12
Wide timer 0 Com-
plimentary Dead
Time Insertion
channel 0.
26: PD10 29: PD13
WTIM0_CDTI0
WTIM0_CDTI1
WTIM0_CDTI2
22: PC10 27: PD11 30: PD14
23: PC11 31: PD15
5: PB11
6: PB12
7: PB13
16: PC6
17: PC7
18: PC8
19: PC9
16: PC8
17: PC9
20: PC10 24: PD10 28: PD14
21: PC11 25: PD11 29: PD15
Wide timer 0 Com-
plimentary Dead
Time Insertion
channel 1.
23: PD9
26: PD12 30: PF0
27: PD13 31: PF1
24: PD12 28: PF0
3: PB11
4: PB12
5: PB13
6: PB14
7: PB15
14: PC6
15: PC7
21: PD9
Wide timer 0 Com-
plimentary Dead
Time Insertion
channel 2.
22: PD10 25: PD13 29: PF1
18: PC10 23: PD11 26: PD14 30: PF2
19: PC11 27: PD15 31: PF3
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Pin Definitions
7.4 Analog Port (APORT) Client Maps
The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs,
DACs, etc. The APORT consists of a set of shared buses, switches, and control logic needed to configurably implement the signal rout-
ing. Figure 7.2 APORT Connection Diagram on page 115 shows the APORT routing for this device family (note that available features
may vary by part number). A complete description of APORT functionality can be found in the Reference Manual.
1X
2X
3X
4X
NEXT1
NEXT0
1X
2X
3X
4X
NEXT1
NEXT0
POS
NEG
POS
NEG
PB15
PF0
ACMP1
PB14
PB13
PF1
PF2
1Y
2Y
3Y
4Y
NEXT1
NEXT0
ACMP0
1Y
2Y
3Y
4Y
NEXT1
NEXT0
OPA2_N
OUT2
PF3
PF4
1X
2X
3X
4X
NEXT0
NEXT2
PB12
PB11
PF5
PF6
PF7
POS
NEG
OPA2_P
1Y
2Y
3Y
4Y
ADC0
1X
1Y
IDAC0
NEXT1
EXTP
EXTN
OPA1_P
1X
PA5
PA4
VDAC0_OUT0ALT
VDAC0_OUT1ALT
POS
NEG
OPA0_P
1X
2X
3X
4X
2X
3X
4X
OUT0ALT
OPA0_N
POS
NEG
OPA1_N
1Y
OUT1ALT
OUT0
OPA0_N
1Y
2Y
3Y
4Y
2Y
3Y
4Y
OPA1
PA3
PA2
OPA0
OPA0_P
OUT1
OUT1ALT
OUT1
VDAC0_OUT1ALT
OUT0
OUT0ALT
OUT1
OUT2
OUT3
OUT1ALT
ADC_EXTP
OUT
OUT2
OUT3
OUT4
OUT
PA1
PA0
NEXT1
ADC_EXTN
OUT4
NEXT0
OPA2_P
1X
2X
3X
4X
OPA1_N
PD15
POS
NEG
VDAC0_OUT0ALT
OUT0ALT
OPA2_N
1Y
2Y
OPA2
3Y
4Y
OUT2
OUT2ALT
OUT1
OUT2
OUT
OUT3
OUT4
NEXT2
1X
1Y
3X
3Y
CEXT
CSEN
2X
2Y
CEXT_SENSE
4X
4Y
nX, nY
APORTnX, APORTnY
AX, BY, …
BUSAX, BUSBY, ...
Figure 7.2. APORT Connection Diagram
Client maps for each analog circuit using the APORT are shown in the following tables. The maps are organized by bus, and show the
peripheral's port connection, the shared bus, and the connection from specific bus channel numbers to GPIO pins.
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Pin Definitions
In general, enumerations for the pin selection field in an analog peripheral's register can be determined by finding the desired pin con-
nection in the table and then combining the value in the Port column (APORT__), and the channel identifier (CH__). For example, if pin
PF7 is available on port APORT2X as CH23, the register field enumeration to connect to PF7 would be APORT2XCH23. The shared
bus used by this connection is indicated in the Bus column.
Table 7.4. ACMP0 Bus and Pin Mapping
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Pin Definitions
Table 7.5. ACMP1 Bus and Pin Mapping
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Pin Definitions
Table 7.6. ADC0 Bus and Pin Mapping
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Pin Definitions
Table 7.7. CSEN Bus and Pin Mapping
CEXT
CEXT_SENSE
Table 7.8. IDAC0 Bus and Pin Mapping
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Pin Definitions
Table 7.9. VDAC0 / OPA Bus and Pin Mapping
OPA0_N
OPA0_P
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Pin Definitions
OPA1_N
OPA1_P
OPA2_N
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Pin Definitions
OPA2_OUT
OPA2_P
VDAC0_OUT0 / OPA0_OUT
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Pin Definitions
VDAC0_OUT1 / OPA1_OUT
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Package Specifications
8. Package Specifications
8.1 BGM13S Package Dimensions
Figure 8.1. BGM13S Package Dimensions
Dimension
MIN
1.20
0.26
0.95
0.27
NOM
1.30
0.30
1.00
0.32
MAX
1.40
0.34
1.05
0.37
A
A1
A2
b
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Package Specifications
Dimension
D
MIN
NOM
MAX
6.50 BSC
2.92 BSC
4.50 BSC
0.68 BSC
0.60 BSC
0.50 BSC
6.50 BSC
1.00 BSC
5.50 BSC
4.00 BSC
0.60 BSC
0.48
D2
D3
D4
D5
e
E
E2
E3
E4
E5
L
0.43
0.11
0.34
0.24
0.14
0.62
0.53
0.21
0.44
0.34
0.24
0.72
L1
0.16
L2
0.39
L3
0.29
L4
0.19
L5
0.67
eD1
eD2
eD3
eD4
eE1
eE2
eE3
eE4
eE5
aaa
bbb
ccc
ddd
eee
1.20 BSC
2.40 BSC
0.07 BSC
1.50 BSC
0.30 BSC
0.20 BSC
1.60 BSC
1.65 BSC
0.80 BSC
0.10
0.10
0.10
0.10
0.10
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Package Specifications
Dimension
MIN
NOM
MAX
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Tolerances are:
a. Decimal:
X.X = ±0.1
X.XX = ±0.05
X.XXX = ±0.03
b. Angular:
±0.1 Degrees
3. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
4. This drawing conforms to the JEDEC Solid State Outline MO-220.
5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
6. Hatching lines means package shielding area.
7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and
not-shielding area could not be defined clearly like top side.
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Package Specifications
8.2 BGM13S Recommeded PCB Land Pattern
This section describes the recommended PCB land pattern for the BGM13S. The antenna copper clearance area is shown in Figure
8.2 BGM13S Recommended Antenna Clearance on page 127, while the X-Y cordinates of pads relative to the origin are shown in
Table 8.1 BGM13S Pad Coordinates and Sizing on page 128. The origin is the center point of pin number 47. It is very important to
align the antenna area relative to the module pads precisely.
Figure 8.2. BGM13S Recommended Antenna Clearance
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Package Specifications
Table 8.1. BGM13S Pad Coordinates and Sizing
Pad No.
47
1
Pad coordinates (X,Y)
Pad Center, Origin (0,0)
(0,-1.60)
Pad size (mm)
0.32 x 0.48
2
(0,-2.10)
9
(0,-5.60)
10
19
20
31
32
36
45
49
46
50
51
(0.60,-5.75)
(5.10,-5.75)
(5.70,-5.60)
(5.70,-0.10)
(5.10,-0.05)
(5.10,-1.65)
(0.60,-1.65)
(0,-1.00)
(2.92,0)
1.65,-3.70)
0.67 x 0.67
4.05,-3.70)
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Package Specifications
Figure 8.3. BGM13S Recommended PCB Land Pattern
Table 8.2. BGM13S Recommended PCB Land Pattern
Symbol
b
NOM (mm)
0.32 BSC
5.50 BSC
3.70 BSC
4.00 BSC
0.05 BSC
1.65 BSC
1.00 BSC
0.60 BSC
0.15 BSC
0.50 BSC
5.70 BSC
5.10 BSC
3.60 BSC
2.92 BSC
1.65 BSC
4.50 BSC
4.50 BSC
0.48 BSC
D1
D2
D3
D4
D5
eD1
eD2
eD3
e
E1
E2
E3
E4
E5
E6
E7
L
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Package Specifications
Symbol
L1
NOM (mm)
0.67 BSC
0.60 BSC
0.60 BSC
2.40 BSC
eE1
eE2
eE3
Notes:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100mm (4 mils).
5. The stencil aperture to land pad size recommendation is 70% paste coverage.
6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
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Package Specifications
8.3 BGM13S Package Marking
The figure below shows the package markings printed on the module.
Figure 8.4. BGM13S Package Marking
Explanations:
Marking
Explanation
BGM13Sxxx
FCCIDQOQ13
IC5123A-13
Model Number
FCC Certification ID
IC5123A-13
R-CRM-BGT-13
YWWTTTT
KC (Korea) Certification ID
1. Y = Manufacturing Year
2. WW = Manufacturing Work Week
3. TTTT = Trace Code
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Tape and Reel Specifications
9. Tape and Reel Specifications
9.1 Tape and Reel Packaging
This section contains information regarding the tape and reel packaging for the BGM13S Blue Gecko Module.
9.2 Reel and Tape Specifications
• Reel material: Polystyrene (PS)
• Reel diameter: 13 inches (330 mm)
• Number of modules per reel: 1000 pcs
• Disk deformation, folding whitening and mold imperfections: Not allowed
• Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm)
• Antistatic treatment: Required
Surface resistivity: 104 - 109 Ω/sq.
•
Figure 9.1. Reel Dimensions - Side View
Symbol
W0
Dimensions [mm]
32.5 ± 0.3
W1
37.1 ± 1.0
Figure 9.2. Cover tape information
Symbol
Thickness (T)
Width (W)
Dimensions [mm]
0.061
25.5 + 0.2
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Tape and Reel Specifications
Figure 9.3. Tape information
9.3 Orientation and Tape Feed
The user direction of feed, start and end of tape on reel and orientation of the modules on the tape are shown in the figure below.
Figure 9.4. Module Orientation and Feed Direction
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Tape and Reel Specifications
9.4 Tape and Reel Box Dimensions
Figure 9.5. Tape and Reel Box Dimensions
Symbol
W2
Dimensions [mm]
368
338
72
W3
W4
9.5 Moisture Sensitivity Level
Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.
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Soldering Recommendations
10. Soldering Recommendations
10.1 Soldering Recommendations
The BGM13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-
mal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid using more than two reflow cycles.
• A no-clean, type-3 solder paste is recommended.
• A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
• Recommended stencil thickness is 0.100mm (4 mils).
• Refer to the recommended PCB land pattern for an example stencil aperture size.
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
• Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Certifications
11. Certifications
11.1 Qualified Antenna Types
The BGM13S variants supporting an external antenna have been designed to operate with a standard 2.14 dBi dipole antenna. Any
antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a differ-
ent type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 Ω.
Table 11.1. Qualified Antennas for BGM13S
Antenna Type
Maximum Gain
Dipole
2.14 dBi
11.2 Bluetooth
The BGM13S is pre-qualified as a Low Energy RF-PHY tested component, having Declaration ID of D039577 and QDID of 119769. For
the qualification of an end product embedding the BGM13S, the above should be combined with the most up to date Wireless Gecko
Link Layer and Host components.
11.3 CE
The BGM13S22 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-
tive (RED) (2014/53/EU). Please note that every application using the BGM13S22 will need to perform the radio EMC tests on the end
product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product.
The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF
radiated testing with the end-product assembly. A formal DoC is available via www.silabs.com
The BGM13S32 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-
tive(RED) at up to 10 dBm RF transmit power when not using Adaptive Frequency Hopping (AFH). With early module firmware versions
that do not support AFH and that do not have built-in functionality to limit the max RF transmit power to 10 dBm automatically, it is
responsibility of the end-product's manufacturer to limit output power accordingly. With newer firmware versions supporting AFH, the
end-product’s manufacturer has the option to enable AFH and transmit at full output power while the module remains compliant or, al-
ternatively, to disable AFH in which case the max RF transmit power will be automatically limited to 10 dBm, making the module compli-
ant in all cases. Please refer to the firmware change log to verify which version introduced AFH.
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Certifications
11.4 FCC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-
ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated
in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter
except in accordance with FCC multi-transmitter product procedures.
OEM Responsibilities to comply with FCC Regulations:
OEM integrator is responsible for testing their end-product for any additional compliance requirements required with this module instal-
led (for example, digital device emissions, PC peripheral requirements, etc.).
• With BGM13S32 the antenna(s) must be installed such that a minimum separation distance of 50.5 mm is maintained between the
radiator (antenna) and all persons at all times.
• With BGM13S22 the antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radi-
ator (antenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-
ance with FCC multi-transmitter product procedures.
Important Note:
In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM inte-
grator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
The variants of BGM13S Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside
another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed
module. In that case, the final end product must be labeled in a visible area with the following:
"Contains Transmitter Module FCC ID: QOQ13"
Or
"Contains FCC ID: QOQ13"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
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Certifications
11.5 ISED Canada
ISEDC
This radio transmitter (IC: 5123A-13) has been approved by Industry Canada to operate with the antenna types listed above, with the
maximum permissible gain indicared. Antenna types not included in this list, having a gain greater than the maximum gain indicated for
that type, are strictly prohibited for use with this device.
This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.
The models BGM13S32A and BGM13S32N meet the given requirements when the minimum separation distance to human body is 40
mm.
The models BGM13S22A and BGM13S22N meet the given requirements when the minimum separation distance to human body is 15
mm.
RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation dis-
tance is less than stated above the OEM integrator is responsible for evaluating the SAR.
OEM Responsibilities to comply with IC Regulations
The BGM13S modules have been certified for integration into products only by OEM integrators under the following conditions:
• The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an-
tenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-
sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE
In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC
authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-
tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization.
End Product Labeling
The BGM13S module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final
end product must be labeled in a visible area with the following:
“Contains Transmitter Module IC: 5123A-13 ”
or
“Contains IC: 5123A-13”
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
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Certifications
ISEDC (Français)
Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-13) en conjonction avec des antennes de type dipolaire à
2.14dBi ou des antennes embarquées, intégrée au produit. L’utilisation de tout autre type d’antenne avec ce composant est proscrite.
Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux
deux conditions suivantes:
1. Ce composant ne doit pas générer d’interférences.
2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.
Déclaration d'exposition RF
L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.
Les modules BGM13S32A and BGM13S32N répondent aux exigences requises lorsque la distance minimale de séparation avec le
corps humain est de 40 mm.
Les modules BGM13S22A and BGM13S22N répondent aux exigences requises lorsque la distance minimale de séparation avec le
corps humain est de 15 mm.
La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à
celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de
procédé à une évaluation SAR.
Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré
Le module BGM13S a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions
suivantes:
• L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur
(antenne) et toutes les personnes avoisinante, ce à tout moment.
• Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée
plus haut.
Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Ce-
pendant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pour-
rait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de pé-
riphériques PC, etc.).
REMARQUE IMPORTANTE
ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'au-
torisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final.
Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'ob-
tention d'une autorisation ISEDC distincte.
Étiquetage des produits finis
Les modules BGM13S sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre
produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module inté-
gré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:
“Contient le module transmetteur: 5123A-13 ”
or
“Contient le circuit: 5123A-13”
L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer
ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.
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Certifications
11.6 Japan
The BGM13S22A and BGM13S22N are certified in Japan with certification number 209-J00306.
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host
equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio
module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the
Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination
of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.
Certification Text to be Placed on the Outside Surface of the Host Equipment:
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under
the Radio Law.”
The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. Note
that additional information may be required if the device is also subject to a telecom approval.
Figure 11.1. GITEKI Mark and ID
Figure 11.2. GITEKI Mark
11.7 KC South Korea
The BGM13S22A and BGM13S22N have certification in South-Korea.
Certification number: R-C-BGT-13
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Rev. 1.1 | 140
®
BGM13S Blue Gecko Bluetooth SiP Module Data Sheet
Revision History
12. Revision History
Revision 1.1
August 2019
• Updated OPNs in 2. Ordering Information.
• Added 11.7 KC South Korea with updated certification ID number.
• Updated certification ID number in 11.6 Japan.
• Updated RF Exposure Statement to 15 mm distance for BGM13S22A and BGM13S22N in 11.5 ISED Canada.
• Added PLFRCO block and associated specifications.
• Added PLFRCO block in Figure 3.1 BGM13S Block Diagram on page 7.
• Added PLFRCO current consumption value in Table 4.4 Current Consumption 3.3 V using DC-DC Converter on page 22, Table
4.5 Current Consumption 1.8 V (DC-DC Converter in Bypass Mode) on page 24, and Table 4.6 Current Consumption 3.3 V (DC-DC
Converter in Bypass Mode) on page 26.
• Added 4.1.9.4 Precision Low-Frequency RC Oscillator (PLFRCO) section.
• Added 9. Tape and Reel Specifications.
• Updated Figure 5.1 Typical Connections for BGM13S with UART Network Co-Processor on page 67 with the new layout guidelines.
• Updated 6.3 Effect of Plastic and Metal Materials with the new layout guidelines.
• Removed the Antenna Tuning image from 6.3 Effect of Plastic and Metal Materials.
• Updated Figure 8.2 BGM13S Recommended Antenna Clearance on page 127 in 8.2 BGM13S Recommeded PCB Land Pattern.
• Updated Figure 6.1 BGM13S PCB Top Layer Design on page 69 and Figure 6.2 BGM13S PCB Middle and Bottom Layer Design on
page 69.
• Added Figure 6.3 Practical Installation of BGM13S on Application PCB on page 69.
• Changed "BLE" to "Bluetooth Low Energy" throughout.
• Changed "Bluetooth 5.0 LE" to "Bluetooth 5" throughout.
Revision 1.0
October 2018
• Added Electrical Specifications Tables for VDAC, CSEN, OPAMP, PCNT and APORT.
• 5.1 Typical BGM13S Connections: Updated diagram to show IOVDD connection to Host CPU supply.
• Table 7.2 GPIO Functionality Table on page 75: Sorted by GPIO name.
• Removed unbonded I/O from APORT mapping tables.
• Packaging figures updated with latest annotations.
• Removed tape and reel specifications section.
• Added package marking specifications in 8.3 BGM13S Package Marking.
• Added certification chapter .
Revision 0.5
April 2018
• Removed PLFRCO content.
• Added V2 part numbers to Table 2.1 Ordering Information on page 3.
• Updated 4.1 Electrical Characteristics with latest characterization data and test limits.
• : Added optional 32.768 kHz crystal connection.
• : Corrected RTS/CTS naming on Host CPU for UART connection.
• : Corrected TCK/TMS order on standard ARM Cortex debug connector.
• 7.1 BGM13S Device Pinout: Changed pin 47 name from VSS to ANT_GND.
• 7.1 BGM13S Device Pinout: Corrected numbering of pins 50 and 51.
• Updated 8.2 BGM13S Recommeded PCB Land Pattern with latest drawings and dimension recommendations.
Revision 0.1
July 10, 2017
• Initial Release.
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