EFM32TG842_技术文档

...the world's most energy friendly microcontrollers

EFM32TG842 DATASHEET

F32/F16/F8

• ARM Cortex-M3 CPU platform

• Communication interfaces

• High Performance 32-bit processor @ up to 32 MHz

• Wake-up Interrupt Controller

• 2× Universal Synchronous/Asynchronous Receiv-

er/Transmitter

• UART/SPI/SmartCard (ISO 7816)/IrDA/I2S

• Triple buffered full/half-duplex operation

• Low Energy UART

• Autonomous operation with DMA in Deep Sleep

Mode

• Flexible Energy Management System

• 20 nA @ 3 V Shutoff Mode

• 0.6 µA @ 3 V Stop Mode, including Power-on Reset, Brown-out

Detector, RAM and CPU retention

• 1.0 µA @ 3 V Deep Sleep Mode, including RTC with 32.768 kHz

oscillator, Power-on Reset, Brown-out Detector, RAM and CPU

retention

• 51 µA/MHz @ 3 V Sleep Mode

• 150 µA/MHz @ 3 V Run Mode, with code executed from flash

• 32/16/8 KB Flash

• I²C Interface with SMBus support

• Address recognition in Stop Mode

• Ultra low power precision analog peripherals

• 12-bit 1 Msamples/s Analog to Digital Converter

• 8 single ended channels/4 differential channels

• On-chip temperature sensor

• 4/4/2 KB RAM

• 53 General Purpose I/O pins

• Configurable push-pull, open-drain, pull-up/down, input filter, drive

strength

• Configurable peripheral I/O locations

• 16 asynchronous external interrupts

• Output state retention and wake-up from Shutoff Mode

• 8 Channel DMA Controller

• 8 Channel Peripheral Reflex System (PRS) for autonomous in-

ter-peripheral signaling

• 12-bit 500 ksamples/s Digital to Analog Converter

• 2× Analog Comparator

• Capacitive sensing with up to 8 inputs

• 3× Operational Amplifier

• 6.1 MHz GBW, Rail-to-rail, Programmable Gain

• Supply Voltage Comparator

• Low Energy Sensor Interface (LESENSE)

• Autonomous sensor monitoring in Deep Sleep Mode

• Wide range of sensors supported, including LC sen-

sors and capacitive buttons

• Hardware AES with 128/256-bit keys in 54/75 cycles

• Timers/Counters

• 2× 16-bit Timer/Counter

• Ultra efficient Power-on Reset and Brown-Out Detec-

tor

• 2×3 Compare/Capture/PWM channels

• 16-bit Low Energy Timer

• 2-pin Serial Wire Debug interface

• 1-pin Serial Wire Viewer

• 1× 24-bit Real-Time Counter

• 1× 16-bit Pulse Counter

• Watchdog Timer with dedicated RC oscillator @ 50 nA

• Integrated LCD Controller for up to 8×18 segments

• Voltage boost, adjustable contrast and autonomous animation

• Pre-Programmed UART Bootloader

• Temperature range -40 to 85 ºC

• Single power supply 1.98 to 3.8 V

• TQFP64 package

32-bit ARM Cortex-M0+, Cortex-M3 and Cortex-M4 microcontrollers for:

• Energy, gas, water and smart metering

• Health and fitness applications

• Smart accessories

• Alarm and security systems

• Industrial and home automation

...the world's most energy friendly microcontrollers

1 Ordering Information

Table 1.1 (p. 2) shows the available EFM32TG842 devices.

Table 1.1. Ordering Information

Ordering Code

Flash (kB) RAM (kB)

Max

Speed

(MHz)

Supply

Voltage

(V)

Temperature

(ºC)

Package

EFM32TG842F8-QFP64

EFM32TG842F16-QFP64

EFM32TG842F32-QFP64

8

2

4

32

1.98 - 3.8

-40 - 85

TQFP64

16

32

Visit www.silabs.com for information on global distributors and representatives.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

2

...the world's most energy friendly microcontrollers

2 System Summary

2.1 System Introduction

The EFM32 MCUs are the world’s most energy friendly microcontrollers. With a unique combination of

the powerful 32-bit ARM Cortex-M3, innovative low energy techniques, short wake-up time from ener-

gy saving modes, and a wide selection of peripherals, the EFM32TG microcontroller is well suited for

any battery operated application as well as other systems requiring high performance and low-energy

consumption. This section gives a short introduction to each of the modules in general terms and also

shows a summary of the configuration for the EFM32TG842 devices. For a complete feature set and in-

depth information on the modules, the reader is referred to the EFM32TG Reference Manual.

A block diagram of the EFM32TG842 is shown in Figure 2.1 (p. 3) .

Figure 2.1. Block Diagram

TG842F8/ 16/ 32

Core andMemory

Clock Management

Energy Management

High Frequency

Crystal

High Frequency

RC

Voltage

Oscillator

ARM Cortex- M3 processor

Regulator

Comparator

Low Frequency

RC

Aux High Freq

RC

Oscillator

Flash

Memory

[KB]

RAM

Memory

[KB]

Debug

Interface

DMA

Controller

Power-on

Reset

Brown-out

Detector

Low Frequency

Crystal

Oscillator

Watchdog

Oscillator

8/ 16/ 32

2/ 4/ 4

32-bit bus

Peripheral Reflex System

Serial Interfaces

I/O Ports

Timers and Triggers

Analog Interfaces

Security

Timer/

Counter

Low

Energy

Sensor

General

Purpose

I/ O

ADC

DAC

External

Interrupts

USART

2x

AES

2x

53 pins

Operational

Amplifier

Low Energy Real Time

Timer™

Counter

Low

Energy

UART™

Reset

I²C

Pulse

Counter

Watchdog

Timer

LCD

Controller

2.1.1 ARM Cortex-M3 Core

The ARM Cortex-M3 includes a 32-bit RISC processor which can achieve as much as 1.25 Dhrystone

MIPS/MHz. A Wake-up Interrupt Controller handling interrupts triggered while the CPU is asleep is in-

cluded as well. The EFM32 implementation of the Cortex-M3 is described in detail in EFM32 Cortex-M3

Reference Manual.

2.1.2 Debug Interface (DBG)

This device includes hardware debug support through a 2-pin serial-wire debug interface . In addition

there is also a 1-wire Serial Wire Viewer pin which can be used to output profiling information, data trace

and software-generated messages.

2.1.3 Memory System Controller (MSC)

The Memory System Controller (MSC) is the program memory unit of the EFM32TG microcontroller.

The flash memory is readable and writable from both the Cortex-M3 and DMA. The flash memory is

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

3

...the world's most energy friendly microcontrollers

divided into two blocks; the main block and the information block. Program code is normally written to

the main block. Additionally, the information block is available for special user data and flash lock bits.

There is also a read-only page in the information block containing system and device calibration data.

Read and write operations are supported in the energy modes EM0 and EM1.

2.1.4 Direct Memory Access Controller (DMA)

The Direct Memory Access (DMA) controller performs memory operations independently of the CPU.

This has the benefit of reducing the energy consumption and the workload of the CPU, and enables

the system to stay in low energy modes when moving for instance data from the USART to RAM or

from the External Bus Interface to a PWM-generating timer. The DMA controller uses the PL230 µDMA

controller licensed from ARM.

2.1.5 Reset Management Unit (RMU)

The RMU is responsible for handling the reset functionality of the EFM32TG.

2.1.6 Energy Management Unit (EMU)

The Energy Management Unit (EMU) manage all the low energy modes (EM) in EFM32TG microcon-

trollers. Each energy mode manages if the CPU and the various peripherals are available. The EMU

can also be used to turn off the power to unused SRAM blocks.

2.1.7 Clock Management Unit (CMU)

The Clock Management Unit (CMU) is responsible for controlling the oscillators and clocks on-board

the EFM32TG. The CMU provides the capability to turn on and off the clock on an individual basis to all

peripheral modules in addition to enable/disable and configure the available oscillators. The high degree

of flexibility enables software to minimize energy consumption in any specific application by not wasting

power on peripherals and oscillators that are inactive.

2.1.8 Watchdog (WDOG)

The purpose of the watchdog timer is to generate a reset in case of a system failure, to increase appli-

cation reliability. The failure may e.g. be caused by an external event, such as an ESD pulse, or by a

software failure.

2.1.9 Peripheral Reflex System (PRS)

The Peripheral Reflex System (PRS) system is a network which lets the different peripheral module

communicate directly with each other without involving the CPU. Peripheral modules which send out

Reflex signals are called producers. The PRS routes these reflex signals to consumer peripherals which

apply actions depending on the data received. The format for the Reflex signals is not given, but edge

triggers and other functionality can be applied by the PRS.

2.1.10 Inter-Integrated Circuit Interface (I2C)

The I²C module provides an interface between the MCU and a serial I²C-bus. It is capable of acting as

both a master and a slave, and supports multi-master buses. Both standard-mode, fast-mode and fast-

mode plus speeds are supported, allowing transmission rates all the way from 10 kbit/s up to 1 Mbit/s.

Slave arbitration and timeouts are also provided to allow implementation of an SMBus compliant system.

The interface provided to software by the I²C module, allows both fine-grained control of the transmission

process and close to automatic transfers. Automatic recognition of slave addresses is provided in all

energy modes.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

4

...the world's most energy friendly microcontrollers

2.1.11 Universal Synchronous/Asynchronous Receiver/Transmitter (US-

ART)

The Universal Synchronous Asynchronous serial Receiver and Transmitter (USART) is a very flexible

serial I/O module. It supports full duplex asynchronous UART communication as well as RS-485, SPI,

MicroWire and 3-wire. It can also interface with ISO7816 SmartCards, IrDA and I2S devices.

2.1.12 Pre-Programmed UART Bootloader

The bootloader presented in application note AN0003 is pre-programmed in the device at factory. Auto-

baud and destructive write are supported. The autobaud feature, interface and commands are described

further in the application note.

2.1.13 Low Energy Universal Asynchronous Receiver/Transmitter

(LEUART)

The unique LEUART^TM, the Low Energy UART, is a UART that allows two-way UART communication on

a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud/

s. The LEUART includes all necessary hardware support to make asynchronous serial communication

possible with minimum of software intervention and energy consumption.

2.1.14 Timer/Counter (TIMER)

The 16-bit general purpose Timer has 3 compare/capture channels for input capture and compare/Pulse-

Width Modulation (PWM) output.

2.1.15 Real Time Counter (RTC)

The Real Time Counter (RTC) contains a 24-bit counter and is clocked either by a 32.768 kHz crystal

oscillator, or a 32.768 kHz RC oscillator. In addition to energy modes EM0 and EM1, the RTC is also

available in EM2. This makes it ideal for keeping track of time since the RTC is enabled in EM2 where

most of the device is powered down.

2.1.16 Low Energy Timer (LETIMER)

The unique LETIMER^TM, the Low Energy Timer, is a 16-bit timer that is available in energy mode EM2

in addition to EM1 and EM0. Because of this, it can be used for timing and output generation when most

of the device is powered down, allowing simple tasks to be performed while the power consumption of

the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms

with minimal software intervention. It is also connected to the Real Time Counter (RTC), and can be

configured to start counting on compare matches from the RTC.

2.1.17 Pulse Counter (PCNT)

The Pulse Counter (PCNT) can be used for counting pulses on a single input or to decode quadrature

encoded inputs. It runs off either the internal LFACLK or the PCNTn_S0IN pin as external clock source.

The module may operate in energy mode EM0 - EM3.

2.1.18 Analog Comparator (ACMP)

The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indi-

cating which input voltage is higher. Inputs can either be one of the selectable internal references or from

external pins. Response time and thereby also the current consumption can be configured by altering

the current supply to the comparator.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

5

...the world's most energy friendly microcontrollers

2.1.19 Voltage Comparator (VCMP)

The Voltage Supply Comparator is used to monitor the supply voltage from software. An interrupt can

be generated when the supply falls below or rises above a programmable threshold. Response time and

thereby also the current consumption can be configured by altering the current supply to the comparator.

2.1.20 Analog to Digital Converter (ADC)

The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits

at up to one million samples per second. The integrated input mux can select inputs from 8 external

pins and 6 internal signals.

2.1.21 Digital to Analog Converter (DAC)

The Digital to Analog Converter (DAC) can convert a digital value to an analog output voltage. The DAC

is fully differential rail-to-rail, with 12-bit resolution. It has one single ended output buffer connected to

channel 0. The DAC may be used for a number of different applications such as sensor interfaces or

sound output.

2.1.22 Operational Amplifier (OPAMP)

The EFM32TG842 features 3 Operational Amplifiers. The Operational Amplifier is a versatile general

purpose amplifier with rail-to-rail differential input and rail-to-rail single ended output. The input can be set

to pin, DAC or OPAMP, whereas the output can be pin, OPAMP or ADC. The current is programmable

and the OPAMP has various internal configurations such as unity gain, programmable gain using internal

resistors etc.

2.1.23 Low Energy Sensor Interface (LESENSE)

The Low Energy Sensor Interface (LESENSE^TM), is a highly configurable sensor interface with support

for up to 8 individually configurable sensors. By controlling the analog comparators and DAC, LESENSE

is capable of supporting a wide range of sensors and measurement schemes, and can for instance mea-

sure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a programmable

FSM which enables simple processing of measurement results without CPU intervention. LESENSE is

available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in

applications with a strict energy budget.

2.1.24 Advanced Encryption Standard Accelerator (AES)

The AES accelerator performs AES encryption and decryption with 128-bit or 256-bit keys. Encrypting or

decrypting one 128-bit data block takes 52 HFCORECLK cycles with 128-bit keys and 75 HFCORECLK

cycles with 256-bit keys. The AES module is an AHB slave which enables efficient access to the data

and key registers. All write accesses to the AES module must be 32-bit operations, i.e. 8- or 16-bit

operations are not supported.

2.1.25 General Purpose Input/Output (GPIO)

In the EFM32TG842, there are 53 General Purpose Input/Output (GPIO) pins, which are divided into

ports with up to 16 pins each. These pins can individually be configured as either an output or input. More

advanced configurations like open-drain, filtering and drive strength can also be configured individually

for the pins. The GPIO pins can also be overridden by peripheral pin connections, like Timer PWM

outputs or USART communication, which can be routed to several locations on the device. The GPIO

supports up to 16 asynchronous external pin interrupts, which enables interrupts from any pin on the

device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other

peripherals.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

6

...the world's most energy friendly microcontrollers

2.1.26 Liquid Crystal Display Driver (LCD)

The LCD driver is capable of driving a segmented LCD display with up to 8x18 segments. A voltage

boost function enables it to provide the LCD display with higher voltage than the supply voltage for the

device. In addition, an animation feature can run custom animations on the LCD display without any

CPU intervention. The LCD driver can also remain active even in Energy Mode 2 and provides a Frame

Counter interrupt that can wake-up the device on a regular basis for updating data.

2.2 Configuration Summary

The features of the EFM32TG842 is a subset of the feature set described in the EFM32TG Reference

Manual. Table 2.1 (p. 7) describes device specific implementation of the features.

Table 2.1. Configuration Summary

Module

Cortex-M3

DBG

Configuration

Pin Connections

Full configuration

NA

DBG_SWCLK, DBG_SWDIO,

DBG_SWO

MSC

Full configuration

Full configuration with IrDA

Full configuration with I2S

Full configuration

NA

DMA

NA

RMU

NA

EMU

NA

CMU

CMU_OUT0, CMU_OUT1

WDOG

PRS

NA

I2C0

I2C0_SDA, I2C0_SCL

US0_TX, US0_RX. US0_CLK, US0_CS

US1_TX, US1_RX, US1_CLK, US1_CS

LEU0_TX, LEU0_RX

TIM0_CC[2:0]

USART0

USART1

LEUART0

TIMER0

TIMER1

RTC

TIM1_CC[2:0]

NA

LETIMER0

PCNT0

ACMP0

ACMP1

VCMP

ADC0

LET0_O[1:0]

Full configuration, 16-bit count register PCNT0_S[1:0]

Full configuration

ACMP0_CH[7:4], ACMP0_O

ACMP1_CH[7:4], ACMP1_O

NA

ADC0_CH[7:0]

DAC0

DAC0_OUT[0], DAC0_OUTxALT

OPAMP

AES

Full configuration

53 pins

NA

GPIO

Available pins are shown in

Table 4.3 (p. 53)

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

7

...the world's most energy friendly microcontrollers

Module

Configuration

Full configuration

Pin Connections

LCD

LCD_SEG[17:0], LCD_COM[7:0],

LCD_BCAP_P, LCD_BCAP_N,

LCD_BEXT

2.3 Memory Map

The EFM32TG842 memory map is shown in Figure 2.2 (p. 8), with RAM and Flash sizes for the

largest memory configuration.

Figure 2.2. EFM32TG842 Memory Map with largest RAM and Flash sizes

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

8

...the world's most energy friendly microcontrollers

3 Electrical Characteristics

3.1 Test Conditions

3.1.1 Typical Values

The typical data are based on T_AMB=25°C and V_DD=3.0 V, as defined in Table 3.2 (p. 9), by simu-

lation and/or technology characterisation unless otherwise specified.

3.1.2 Minimum and Maximum Values

The minimum and maximum values represent the worst conditions of ambient temperature, supply volt-

age and frequencies, as defined in Table 3.2 (p. 9), by simulation and/or technology characterisa-

tion unless otherwise specified.

3.2 Absolute Maximum Ratings

The absolute maximum ratings are stress ratings, and functional operation under such conditions are

not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 9) may affect the device reliability

or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.

9) .

Table 3.1. Absolute Maximum Ratings

Symbol

Parameter

Condition

Min

Typ

Max

Unit

150¹°C

T_STG

Storage tempera-

ture range

-40

T_S

Maximum soldering Latest IPC/JEDEC J-STD-020

260 °C

temperature

Standard

V_DDMAX

External main sup-

ply voltage

0

3.8

V

V_IOPIN

Voltage on any I/O

-0.3

V_DD+0.3

¹Based on programmed devices tested for 10000 hours at 150°C. Storage temperature affects retention of preprogrammed cal-

ibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data re-

tention for different temperatures.

3.3 General Operating Conditions

3.3.1 General Operating Conditions

Table 3.2. General Operating Conditions

Symbol

T_AMB

V_DDOP

f_APB

Parameter

Min

Typ

Max

Unit

85 °C

3.8

Ambient temperature range

Operating supply voltage

Internal APB clock frequency

Internal AHB clock frequency

-40

1.98

V

32 MHz

f_AHB

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

9

...the world's most energy friendly microcontrollers

3.4 Current Consumption

Table 3.3. Current Consumption

Symbol

Parameter

Condition

Min

Typ

Max

Unit

32 MHz HFXO, all peripheral

clocks disabled, V_DD= 3.0 V

157

150

153

155

157

162

200

53

µA/

MHz

28 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

170 µA/

MHz

21 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

172 µA/

MHz

EM0 current. No

prescaling. Running

prime number cal-

culation code from

Flash. (Production

test condition = 14

MHz)

14 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

175 µA/

MHz

I_EM0

11 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

178 µA/

MHz

6.6 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

183 µA/

MHz

1.2 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

240 µA/

MHz

32 MHz HFXO, all peripheral

clocks disabled, V_DD= 3.0 V

µA/

MHz

28 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

51

57 µA/

MHz

21 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

55

59 µA/

MHz

EM1 current (Pro-

duction test condi-

tion = 14 MHz)

14 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

56

61 µA/

MHz

I_EM1

11 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

58

63 µA/

MHz

6.6 MHz HFRCO, all peripheral

clocks disabled, V_DD= 3.0 V

63

68 µA/

MHz

1.2 MHz HFRCO. all peripheral

clocks disabled, V_DD= 3.0 V

100

1.0

122 µA/

MHz

EM2 current with RTC

prescaled to 1 Hz, 32.768

kHz LFRCO, V_DD= 3.0 V,

T_AMB=25°C

1.2 µA

I_EM2

EM2 current

EM2 current with RTC

prescaled to 1 Hz, 32.768

kHz LFRCO, V_DD= 3.0 V,

T_AMB=85°C

2.4

5.0 µA

V_DD= 3.0 V, T_AMB=25°C

V_DD= 3.0 V, T_AMB=85°C

V_DD= 3.0 V, T_AMB=25°C

V_DD= 3.0 V, T_AMB=85°C

0.59

2.0

1.0 µA

4.5 µA

I_EM3

EM3 current

EM4 current

0.02

0.25

0.055 µA

0.70 µA

I_EM4

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

10

...the world's most energy friendly microcontrollers

Figure 3.1. EM2 current consumption. RTC prescaled to 1kHz, 32.768 kHz LFRCO.

Figure 3.2. EM3 current consumption.

Figure 3.3. EM4 current consumption.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

11

...the world's most energy friendly microcontrollers

3.5 Transition between Energy Modes

The transition times are measured from the trigger to the first clock edge in the CPU.

Table 3.4. Energy Modes Transitions

Symbol

Parameter

Min

Typ

Max

Unit

t_EM10

Transition time from EM1 to EM0

0

HF-

CORE-

CLK

cycles

t_EM20

t_EM30

t_EM40

Transition time from EM2 to EM0

Transition time from EM3 to EM0

Transition time from EM4 to EM0

2

µs

163

3.6 Power Management

The EFM32TG requires the AVDD_x, VDD_DREG and IOVDD_x pins to be connected together (with

optional filter) at the PCB level. For practical schematic recommendations, please see the application

note, "AN0002 EFM32 Hardware Design Considerations".

Table 3.5. Power Management

Symbol

Parameter

Condition

Min

Typ

Max

Unit

V_BODextthr-

BOD threshold on

falling external sup-

ply voltage

1.74

1.96

1.98

V

V_BODextthr+

BOD threshold on

rising external sup-

ply voltage

1.85

V

V_PORthr+

Power-on Reset

(POR) threshold on

rising external sup-

ply voltage

t_RESET

Delay from reset

is released until

program execution

starts

Applies to Power-on Reset,

Brown-out Reset and pin reset.

163

1

µs

C_DECOUPLE

Voltage regulator

decoupling capaci-

tor.

X5R capacitor recommended.

Apply between DECOUPLE pin

and GROUND

µF

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

12

...the world's most energy friendly microcontrollers

3.7 Flash

Table 3.6. Flash

Symbol

Parameter

Condition

Min

Typ

Max

Unit

EC_FLASH

Flash erase cycles

before failure

20000

cycles

T_AMB<150°C

10000

10

h

RET_FLASH

Flash data retention T_AMB<85°C

T_AMB<70°C

years

µs

20

t_{W_PROG}

Word (32-bit) pro-

gramming time

20

t_{P_ERASE}

t_{D_ERASE}

I_ERASE

Page erase time

Device erase time

Erase current

20

40

20.4

40.8

20.8 ms

41.6 ms

7¹mA

I_WRITE

Write current

V_FLASH

Supply voltage dur-

ing flash erase and

write

1.98

3.8

V

¹Measured at 25°C

3.8 General Purpose Input Output

Table 3.7. GPIO

Symbol

V_IOIL

Parameter

Condition

Min

Typ

Max

0.30V_DD

Unit

V

Input low voltage

Input high voltage

V_IOIH

0.70V_DD

V

Sourcing 0.1 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= LOWEST

0.80V_DD

0.90V_DD

0.85V_DD

0.90V_DD

V

Sourcing 0.1 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= LOWEST

V

Sourcing 1 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= LOW

Output high volt-

age (Production test

condition = 3.0V,

DRIVEMODE =

STANDARD)

Sourcing 1 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= LOW

V_IOOH

Sourcing 6 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= STANDARD

0.75V_DD

0.85V_DD

0.60V_DD

Sourcing 6 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= STANDARD

Sourcing 20 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

13

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

0.80V_DD

Typ

Max

Unit

Sourcing 20 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= HIGH

V

Sinking 0.1 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= LOWEST

0.20V_DD

0.10V_DD

0.05V_DD

V

Sinking 0.1 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= LOWEST

Sinking 1 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= LOW

Sinking 1 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= LOW

Output low voltage

(Production test

condition = 3.0V,

DRIVEMODE =

STANDARD)

V_IOOL

Sinking 6 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= STANDARD

0.30V_DD

Sinking 6 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= STANDARD

0.20V_DD

0.35V_DD

0.20V_DD

Sinking 20 mA, V_DD=1.98 V,

GPIO_Px_CTRL DRIVEMODE

= HIGH

Sinking 20 mA, V_DD=3.0 V,

GPIO_Px_CTRL DRIVEMODE

= HIGH

I_IOLEAK

Input leakage cur-

rent

High Impedance IO connected

to GROUND or V_DD

±0.1

40

±100 nA

R_PU

I/O pin pull-up resis-

tor

kOhm

Ohm

R_PD

I/O pin pull-down re-

sistor

40

R_IOESD

Internal ESD series

resistor

200

t_IOGLITCH

Pulse width of puls-

es to be removed

by the glitch sup-

pression filter

10

50 ns

GPIO_Px_CTRL DRIVEMODE

= LOWEST and load capaci-

tance C_L=12.5-25pF.

20+0.1C_L

0.1V_DD

250 ns

V

t_IOOF

Output fall time

GPIO_Px_CTRL DRIVEMODE

= LOW and load capacitance

C_L=350-600pF

V_IOHYST

I/O pin hysteresis

V_DD= 1.98 - 3.8 V

(V_IOTHR+- V_IOTHR-

)

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

14

...the world's most energy friendly microcontrollers

Figure 3.4. Typical Low-Level Output Current, 2V Supply Voltage

0.20

0.15

0.10

0.05

0.00

5

4

3

2

1

- 40°C

25°C

85°C

- 40°C

25°C

85°C

0

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

Low- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = LOWEST

GPIO_Px_CTRL DRIVEMODE = LOW

20

45

40

35

30

25

20

15

10

5

15

10

5

- 40°C

25°C

- 40°C

25°C

85°C

0

0.0

0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

Low- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = STANDARD

GPIO_Px_CTRL DRIVEMODE = HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

15

...the world's most energy friendly microcontrollers

Figure 3.5. Typical High-Level Output Current, 2V Supply Voltage

0.00

–0.05

–0.10

–0.15

–0.20

0.0

–0.5

–1.0

–1.5

–2.0

–2.5

- 40°C

25°C

85°C

- 40°C

25°C

85°C

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

High- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = LOWEST

GPIO_Px_CTRL DRIVEMODE = LOW

0

- 40°C

25°C

85°C

25°C

85°C

–10

–20

–30

–40

–50

–5

–10

–15

–20

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

High- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = STANDARD

GPIO_Px_CTRL DRIVEMODE = HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

16

...the world's most energy friendly microcontrollers

Figure 3.6. Typical Low-Level Output Current, 3V Supply Voltage

0.5

0.4

0.3

0.2

0.1

0.0

10

8

6

4

2

- 40°C

25°C

85°C

- 40°C

25°C

85°C

0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Low- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = LOWEST

GPIO_Px_CTRL DRIVEMODE = LOW

40

35

30

25

20

15

10

50

40

30

20

10

0

5

- 40°C

25°C

85°C

25°C

85°C

0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Low- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = STANDARD

GPIO_Px_CTRL DRIVEMODE = HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

17

...the world's most energy friendly microcontrollers

Figure 3.7. Typical High-Level Output Current, 3V Supply Voltage

0.0

–0.1

–0.2

–0.3

–0.4

–0.5

0

- 40°C

25°C

85°C

- 40°C

25°C

85°C

–1

–2

–3

–4

–5

–6

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

High- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = LOWEST

GPIO_Px_CTRL DRIVEMODE = LOW

0

- 40°C

25°C

85°C

25°C

85°C

–10

–20

–30

–40

–50

–10

–20

–30

–40

–50

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

High- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = STANDARD

GPIO_Px_CTRL DRIVEMODE = HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

18

...the world's most energy friendly microcontrollers

Figure 3.8. Typical Low-Level Output Current, 3.8V Supply Voltage

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

14

12

10

8

6

4

2

- 40°C

25°C

85°C

- 40°C

25°C

85°C

0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

Low- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = LOWEST

GPIO_Px_CTRL DRIVEMODE = LOW

50

40

30

20

10

50

40

30

20

10

0

- 40°C

25°C

- 40°C

25°C

85°C

0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

Low- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = STANDARD

GPIO_Px_CTRL DRIVEMODE = HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

19

...the world's most energy friendly microcontrollers

Figure 3.9. Typical High-Level Output Current, 3.8V Supply Voltage

0.0

–0.1

–0.2

–0.3

–0.4

–0.5

–0.6

–0.7

–0.8

0

- 40°C

25°C

85°C

- 40°C

25°C

85°C

–1

–2

–3

–4

–5

–6

–7

–8

–9

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

High- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = LOWEST

GPIO_Px_CTRL DRIVEMODE = LOW

0

- 40°C

25°C

85°C

25°C

85°C

–10

–20

–30

–40

–50

–10

–20

–30

–40

–50

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

High- Level Output Voltage [V]

GPIO_Px_CTRL DRIVEMODE = STANDARD

GPIO_Px_CTRL DRIVEMODE = HIGH

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

20

...the world's most energy friendly microcontrollers

3.9 Oscillators

3.9.1 LFXO

Table 3.8. LFXO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f_LFXO

Supported nominal

crystal frequency

32.768

30

kHz

ESR_LFXO

Supported crystal

equivalent series re-

sistance (ESR)

120 kOhm

C_LFXOL

Supported crystal

external load range

X¹

25 pF

nA

I_LFXO

Current consump-

tion for core and

buffer after startup.

ESR=30 kOhm, C_L=10 pF,

LFXOBOOST in CMU_CTRL is

1

190

400

t_LFXO

Start- up time.

ESR=30 kOhm, C_L=10 pF,

40% - 60% duty cycle has

been reached, LFXOBOOST in

CMU_CTRL is 1

ms

¹See Minimum Load Capacitance (C_LFXOL) Requirement For Safe Crystal Startup in energyAware Designer in Simplicity Studio

For safe startup of a given crystal, the energyAware Designer in Simplicity Studio contains a tool to help

users configure both load capacitance and software settings for using the LFXO. For details regarding

the crystal configuration, the reader is referred to application note "AN0016 EFM32 Oscillator Design

Consideration".

3.9.2 HFXO

Table 3.9. HFXO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f_HFXO

Supported nominal

crystal Frequency

4

32 MHz

Supported crystal

equivalent series re-

sistance (ESR)

Crystal frequency 32 MHz

Crystal frequency 4 MHz

30

60 Ohm

ESR_HFXO

400

1500 Ohm

g_mHFXO

The transconduc-

tance of the HFXO

input transistor at

crystal startup

HFXOBOOST in CMU_CTRL

equals 0b11

20

5

mS

C_HFXOL

Supported crystal

external load range

25 pF

µA

4 MHz: ESR=400 Ohm,

C_L=20 pF, HFXOBOOST in

CMU_CTRL equals 0b11

85

165

400

Current consump-

tion for HFXO after

startup

I_HFXO

32 MHz: ESR=30 Ohm,

C_L=10 pF, HFXOBOOST in

CMU_CTRL equals 0b11

µA

µs

t_HFXO

Startup time

32 MHz: ESR=30 Ohm,

C_L=10 pF, HFXOBOOST in

CMU_CTRL equals 0b11

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

21

...the world's most energy friendly microcontrollers

3.9.3 LFRCO

Table 3.10. LFRCO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f_LFRCO

Oscillation frequen-

cy , V_DD= 3.0 V,

T_AMB=25°C

31.29

32.768

150

34.24 kHz

t_LFRCO

Startup time not in-

cluding software

calibration

µs

I_LFRCO

Current consump-

tion

210

1.5

380 nA

%

TUNESTEP_L-Frequency step

for LSB change in

FRCO

TUNING value

Figure 3.10. Calibrated LFRCO Frequency vs Temperature and Supply Voltage

42

40

38

36

34

32

30

42

40

38

36

34

32

30

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

3.9.4 HFRCO

Table 3.11. HFRCO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

28 MHz frequency band

21 MHz frequency band

14 MHz frequency band

11 MHz frequency band

7 MHz frequency band

1 MHz frequency band

f_HFRCO= 14 MHz

27.16

20.37

13.58

10.67

6.40¹

1.16²

28.0

21.0

14.0

11.0

6.60¹

1.20²

0.6

28.84 MHz

21.63 MHz

14.42 MHz

11.33 MHz

6.80¹MHz

1.24²MHz

Oscillation frequen-

cy, V_DD= 3.0 V,

T_AMB=25°C

f_HFRCO

t_{HFRCO_settling}Settling time after

start-up

Cycles

f_HFRCO= 28 MHz

f_HFRCO= 21 MHz

160

125

190 µA

155 µA

Current consump-

tion (Production test

condition = 14 MHz)

I_HFRCO

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

22

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

120 µA

f_HFRCO= 14 MHz

f_HFRCO= 11 MHz

f_HFRCO= 6.6 MHz

f_HFRCO= 1.2 MHz

104

94

110 µA

90 µA

32 µA

%

63

22

TUNESTEP_H-Frequency step

0.3³

for LSB change in

FRCO

TUNING value

¹For devices with prod. rev. < 19, Typ = 7MHz and Min/Max values not applicable.

²For devices with prod. rev. < 19, Typ = 1MHz and Min/Max values not applicable.

³The TUNING field in the CMU_HFRCOCTRL register may be used to adjust the HFRCO frequency. There is enough adjustment

range to ensure that the frequency bands above 7 MHz will always have some overlap across supply voltage and temperature. By

using a stable frequency reference such as the LFXO or HFXO, a firmware calibration routine can vary the TUNING bits and the

frequency band to maintain the HFRCO frequency at any arbitrary value between 7 MHz and 28 MHz across operating conditions.

Figure 3.11. Calibrated HFRCO 1 MHz Band Frequency vs Supply Voltage and Temperature

1.45

1.40

1.35

1.30

1.25

1.20

1.15

1.10

1.05

1.45

1.40

1.35

1.30

1.25

1.20

1.15

1.10

1.05

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

Figure 3.12. Calibrated HFRCO 7 MHz Band Frequency vs Supply Voltage and Temperature

6.70

6.65

6.60

6.55

6.50

6.45

6.40

6.35

6.30

6.70

6.65

6.60

6.55

6.50

6.45

6.40

6.35

6.30

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

23

...the world's most energy friendly microcontrollers

Figure 3.13. Calibrated HFRCO 11 MHz Band Frequency vs Supply Voltage and Temperature

11.2

11.1

11.0

10.9

10.8

10.7

10.6

11.2

11.1

11.0

10.9

10.8

10.7

10.6

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

Figure 3.14. Calibrated HFRCO 14 MHz Band Frequency vs Supply Voltage and Temperature

14.2

14.1

14.0

13.9

13.8

13.7

13.6

13.5

13.4

14.2

14.1

14.0

13.9

13.8

13.7

13.6

13.5

13.4

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

Figure 3.15. Calibrated HFRCO 21 MHz Band Frequency vs Supply Voltage and Temperature

21.2

21.0

20.8

20.6

20.4

20.2

21.2

21.0

20.8

20.6

20.4

20.2

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

24

...the world's most energy friendly microcontrollers

Figure 3.16. Calibrated HFRCO 28 MHz Band Frequency vs Supply Voltage and Temperature

28.2

28.0

27.8

27.6

27.4

27.2

27.0

26.8

28.4

28.2

28.0

27.8

27.6

27.4

27.2

27.0

26.8

- 40°C

25°C

85°C

2.0 V

3.0 V

3.8 V

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd [V]

Temperature [°C]

3.9.5 AUXHFRCO

Table 3.12. AUXHFRCO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

28 MHz frequency band

21 MHz frequency band

14 MHz frequency band

11 MHz frequency band

7 MHz frequency band

1 MHz frequency band

f_AUXHFRCO= 14 MHz

27.16

20.37

13.58

10.67

6.40¹

1.16²

28.0

21.0

14.0

11.0

6.60¹

1.20²

0.6

28.84 MHz

21.63 MHz

14.42 MHz

11.33 MHz

6.80¹MHz

1.24²MHz

Oscillation frequen-

cy, V_DD= 3.0 V,

T_AMB=25°C

f_AUXHFRCO

t_{AUXHFRCO_settling}Settling time after

start-up

Cycles

TUNESTEP_AUX-Frequency step

0.3³

%

for LSB change in

HFRCO

TUNING value

¹For devices with prod. rev. < 19, Typ = 7MHz and Min/Max values not applicable.

²For devices with prod. rev. < 19, Typ = 1MHz and Min/Max values not applicable.

³The TUNING field in the CMU_AUXHFRCOCTRL register may be used to adjust the AUXHFRCO frequency. There is enough

adjustment range to ensure that the frequency bands above 7 MHz will always have some overlap across supply voltage and

temperature. By using a stable frequency reference such as the LFXO or HFXO, a firmware calibration routine can vary the

TUNING bits and the frequency band to maintain the AUXHFRCO frequency at any arbitrary value between 7 MHz and 28 MHz

across operating conditions.

3.9.6 ULFRCO

Table 3.13. ULFRCO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f_ULFRCO

Oscillation frequen- 25°C, 3V

cy

0.70

1.75 kHz

TC_ULFRCO

Temperature coeffi-

cient

0.05

%/°C

%/V

VC_ULFRCO

Supply voltage co-

efficient

-18.2

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

25

...the world's most energy friendly microcontrollers

3.10 Analog Digital Converter (ADC)

Table 3.14. ADC

Symbol

V_ADCIN

Parameter

Condition

Single ended

Differential

Min

Typ

Max

Unit

V

0

-V_REF/2

1.25

V_REF

V_REF/2

V_DD

Input voltage range

V

V_ADCREFIN

Input range of exter-

nal reference volt-

age, single ended

and differential

V

V_{ADCREFIN_CH7}Input range of ex-

ternal negative ref-

erence voltage on

See V_ADCREFIN

0

0.625

0

V_DD- 1.1

V

channel 7

V_{ADCREFIN_CH6}Input range of ex-

ternal positive ref-

See V_ADCREFIN

V_DD

erence voltage on

channel 6

V_ADCCMIN

Common mode in-

put range

V_DD

I_ADCIN

Input current

2pF sampling capacitors

<100

65

nA

dB

CMRR_ADC

Analog input com-

mon mode rejection

ratio

1 MSamples/s, 12 bit, external

reference

377

67

µA

10 kSamples/s 12 bit, internal

1.25 V reference, WARMUP-

MODE in ADCn_CTRL set to

0b00

10 kSamples/s 12 bit, internal

1.25 V reference, WARMUP-

Average active cur- MODE in ADCn_CTRL set to

68

71

µA

I_ADC

rent

0b01

10 kSamples/s 12 bit, internal

1.25 V reference, WARMUP-

MODE in ADCn_CTRL set to

0b10

10 kSamples/s 12 bit, internal

1.25 V reference, WARMUP-

MODE in ADCn_CTRL set to

0b11

244

I_ADCREF

Current consump-

tion of internal volt-

age reference

Internal voltage reference

65

2

C_ADCIN

R_ADCIN

R_ADCFILT

Input capacitance

pF

Input ON resistance

1

MOhm

kOhm

Input RC filter resis-

tance

10

C_ADCFILT

Input RC filter/de-

coupling capaci-

tance

250

fF

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

26

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

f_ADCCLK

ADC Clock Fre-

quency

13 MHz

6 bit

7

11

13

1

ADC-

CLK

Cycles

8 bit

ADC-

CLK

Cycles

t_ADCCONV

Conversion time

Acquisition time

12 bit

ADC-

CLK

Cycles

t_ADCACQ

Programmable

256 ADC-

CLK

Cycles

t_ADCACQVDD3

Required acquisi-

tion time for VDD/3

reference

2

µs

Startup time of ref-

erence generator

and ADC core in

NORMAL mode

5

1

µs

t_ADCSTART

Startup time of ref-

erence generator

and ADC core in

KEEPADCWARM

mode

µs

1 MSamples/s, 12 bit, single

ended, internal 1.25V refer-

ence

59

dB

1 MSamples/s, 12 bit, single

ended, internal 2.5V reference

63

65

60

65

54

67

69

62

dB

1 MSamples/s, 12 bit, single

ended, V_DDreference

1 MSamples/s, 12 bit, differen-

tial, internal 1.25V reference

1 MSamples/s, 12 bit, differen-

tial, internal 2.5V reference

1 MSamples/s, 12 bit, differen-

tial, 5V reference

Signal to Noise Ra-

tio (SNR)

SNR_ADC

1 MSamples/s, 12 bit, differen-

tial, V_DDreference

1 MSamples/s, 12 bit, differen-

tial, 2xV_DDreference

200 kSamples/s, 12 bit, sin-

gle ended, internal 1.25V refer-

ence

200 kSamples/s, 12 bit, single

ended, internal 2.5V reference

63

67

dB

200 kSamples/s, 12 bit, single

ended, V_DDreference

63

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

27

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

200 kSamples/s, 12 bit, differ-

ential, internal 1.25V reference

63

66

69

70

58

dB

200 kSamples/s, 12 bit, differ-

ential, internal 2.5V reference

dB

200 kSamples/s, 12 bit, differ-

ential, 5V reference

200 kSamples/s, 12 bit, differ-

ential, V_DDreference

200 kSamples/s, 12 bit, differ-

ential, 2xV_DDreference

1 MSamples/s, 12 bit, single

ended, internal 1.25V refer-

ence

1 MSamples/s, 12 bit, single

ended, internal 2.5V reference

62

64

60

64

54

66

68

61

dB

1 MSamples/s, 12 bit, single

ended, V_DDreference

1 MSamples/s, 12 bit, differen-

tial, internal 1.25V reference

1 MSamples/s, 12 bit, differen-

tial, internal 2.5V reference

1 MSamples/s, 12 bit, differen-

tial, 5V reference

1 MSamples/s, 12 bit, differen-

tial, V_DDreference

1 MSamples/s, 12 bit, differen-

tial, 2xV_DDreference

SIgnal-to-Noise

And Distortion-ratio

(SINAD)

SINAD_ADC

200 kSamples/s, 12 bit, sin-

gle ended, internal 1.25V refer-

ence

200 kSamples/s, 12 bit, single

ended, internal 2.5V reference

65

66

63

66

68

69

64

dB

dBc

200 kSamples/s, 12 bit, single

ended, V_DDreference

200 kSamples/s, 12 bit, differ-

ential, internal 1.25V reference

200 kSamples/s, 12 bit, differ-

ential, internal 2.5V reference

200 kSamples/s, 12 bit, differ-

ential, 5V reference

200 kSamples/s, 12 bit, differ-

ential, V_DDreference

62

200 kSamples/s, 12 bit, differ-

ential, 2xV_DDreference

1 MSamples/s, 12 bit, single

ended, internal 1.25V refer-

ence

Spurious-Free Dy-

namic Range (SF-

DR)

SFDR_ADC

1 MSamples/s, 12 bit, single

ended, internal 2.5V reference

76

dBc

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

28

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

1 MSamples/s, 12 bit, single

ended, V_DDreference

73

66

77

76

75

69

75

dBc

1 MSamples/s, 12 bit, differen-

tial, internal 1.25V reference

dBc

1 MSamples/s, 12 bit, differen-

tial, internal 2.5V reference

1 MSamples/s, 12 bit, differen-

tial, V_DDreference

1 MSamples/s, 12 bit, differen-

tial, 2xV_DDreference

1 MSamples/s, 12 bit, differen-

tial, 5V reference

200 kSamples/s, 12 bit, sin-

gle ended, internal 1.25V refer-

ence

200 kSamples/s, 12 bit, single

ended, internal 2.5V reference

75

76

79

78

79

dBc

200 kSamples/s, 12 bit, single

ended, V_DDreference

68

200 kSamples/s, 12 bit, differ-

ential, internal 1.25V reference

200 kSamples/s, 12 bit, differ-

ential, internal 2.5V reference

200 kSamples/s, 12 bit, differ-

ential, 5V reference

200 kSamples/s, 12 bit, differ-

ential, V_DDreference

200 kSamples/s, 12 bit, differ-

ential, 2xV_DDreference

After calibration, single ended

After calibration, differential

-4

0.3

4

mV

V_ADCOFFSET

Offset voltage

mV

-1.92

-6.3

mV/°C

Thermometer out-

put gradient

ADC

Codes/

°C

TGRAD_ADCTH

DNL_ADC

INL_ADC

Differential non-lin-

earity (DNL)

V_DD= 3.0 V, external 2.5V ref-

erence

-1

±0.7

±1.2

4

LSB

Integral non-linear-

ity (INL), End point

method

V_DD= 3.0 V, external 2.5V ref-

erence

±3 LSB

MC_ADC

No missing codes

11.999¹

12

0.01²

0.2²

bits

1.25V reference

2.5V reference

1.25V reference

2.5V reference

0.033³%/°C

0.03³%/°C

0.7³LSB/°C

0.62³LSB/°C

GAIN_ED

Gain error drift

OFFSET_ED

Offset error drift

0.2²

¹On the average every ADC will have one missing code, most likely to appear around 2048 ± n*512 where n can be a value in

the set {-3, -2, -1, 1, 2, 3}. There will be no missing code around 2048, and in spite of the missing code the ADC will be monotonic

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

29

...the world's most energy friendly microcontrollers

at all times so that a response to a slowly increasing input will always be a slowly increasing output. Around the one code that is

missing, the neighbour codes will look wider in the DNL plot. The spectra will show spurs on the level of -78dBc for a full scale

input for chips that have the missing code issue.

²Typical numbers given by abs(Mean) / (85 - 25).

³Max number given by (abs(Mean) + 3x stddev) / (85 - 25).

The integral non-linearity (INL) and differential non-linearity parameters are explained in Figure 3.17 (p.

30) and Figure 3.18 (p. 30) , respectively.

Figure 3.17. Integral Non-Linearity (INL)

Digital ouput code

INL= |[(V_D- V_SS)/ V_LSBIDEAL] - D| where 0 < D < 2^N- 1

4095

4094

Actual ADC

tranfer function

before offset and

4093

Actual ADC

gain correction

4092

tranfer function

after offset and

gain correction

INL Error

(End Point INL)

Ideal transfer

curve

3

2

1

0

V_OFFSET

Analog Input

Figure 3.18. Differential Non-Linearity (DNL)

Digital

ouput

DNL= |[(V_{D+ 1}- V_D)/ V_LSBIDEAL] - 1| where 0 < D < 2^N- 2

code

4095

4094

4093

4092

Full Scale Range

Example: Adjacent

input value V_{D+ 1}

corrresponds to digital

output code D+ 1

Actual transfer

function with one

missing code.

Example: Input value

V_Dcorrresponds to

digital output code D

Code width = 2 LSB

DNL= 1 LSB

Ideal transfer

curve

0.5

LSB

Ideal spacing

between two

adjacent codes

V_LSBIDEAL= 1 LSB

5

4

3

2

1

0

Ideal 50%

Transition Point

Ideal Code Center

Analog Input

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

30

...the world's most energy friendly microcontrollers

3.10.1 Typical performance

Figure 3.19. ADC Frequency Spectrum, Vdd = 3V, Temp = 25°C

1.25V Reference

2XVDDVSS Reference

VDD Reference

2.5V Reference

5VDIFF Reference

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

31

...the world's most energy friendly microcontrollers

Figure 3.20. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25°C

1.25V Reference

2.5V Reference

2XVDDVSS Reference

5VDIFF Reference

VDD Reference

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

32

...the world's most energy friendly microcontrollers

Figure 3.21. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25°C

1.25V Reference

2.5V Reference

2XVDDVSS Reference

5VDIFF Reference

VDD Reference

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

33

...the world's most energy friendly microcontrollers

Figure 3.22. ADC Absolute Offset, Common Mode = Vdd /2

5

4

3

2

1

0

2.0

1.5

Vref= 1V25

VRef= 1V25

Vref= 2V5

VRef= 2V5

Vref= 2XVDDVSS

Vref= 5VDIFF

Vref= VDD

VRef= 2XVDDVSS

VRef= 5VDIFF

VRef= VDD

1.0

0.5

–1

0.0

–2

–3

–4

–0.5

–1.0

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

–40

–15

5

25

45

65

85

Vdd (V)

Temp (C)

Offset vs Supply Voltage, Temp = 25°C

Offset vs Temperature, Vdd = 3V

Figure 3.23. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V

71

70

69

68

67

66

65

64

63

79.4

79.2

79.0

78.8

78.6

78.4

78.2

78.0

2XVDDV

Vdd

1V25

Vdd

2V5

5VDIFF

2V5

2XVDDV

5VDIFF

1V25

–40

–15

5

25

45

65

85

–40

–15

5

25

45

65

85

Temperature [°C]

Signal to Noise Ratio (SNR)

Spurious-Free Dynamic Range (SFDR)

3.11 Digital Analog Converter (DAC)

Table 3.15. DAC

Symbol

Parameter

Condition

Min

Typ

Max

Unit

V_DACOUT

Output voltage

range

VDD voltage reference, single

ended

0

V_DD

V

V_DACCM

Output common

V_DD

V

mode voltage range

500 kSamples/s, 12bit

400

200

17

650 µA

250 µA

25 µA

Active current in-

cluding references

for 2 channels

I_DAC

100 kSamples/s, 12 bit

1 kSamples/s 12 bit NORMAL

SR_DAC

Sample rate

500 ksam-

ples/s

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

34

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

1000 kHz

250 kHz

Continuous Mode

Sample/Hold Mode

Sample/Off Mode

DAC clock frequen-

cy

f_DAC

CYC_DACCONVClock cyckles per

conversion

2

t_DACCONV

Conversion time

Settling time

2

µs

dB

t_DACSETTLE

5

500 kSamples/s, 12 bit, sin-

gle ended, internal 1.25V refer-

ence

58

Signal to Noise Ra-

tio (SNR)

SNR_DAC

500 kSamples/s, 12 bit, single

ended, internal 2.5V reference

59

57

dB

500 kSamples/s, 12 bit, sin-

gle ended, internal 1.25V refer-

ence

Signal to Noise-

pulse Distortion Ra-

tio (SNDR)

SNDR_DAC

500 kSamples/s, 12 bit, single

ended, internal 2.5V reference

54

62

dB

500 kSamples/s, 12 bit, sin-

gle ended, internal 1.25V refer-

ence

dBc

Spurious-Free

Dynamic

SFDR_DAC

Range(SFDR)

500 kSamples/s, 12 bit, single

ended, internal 2.5V reference

56

dBc

V_DACOFFSET

DNL_DAC

Offset voltage

After calibration, single ended

V_DD= 3.0 V, V_DDreference

2

mV

Differential non-lin-

earity

±1

LSB

INL_DAC

MC_DAC

Integral non-lineari- V_DD= 3.0 V, V_DDreference

ty

±5

12

LSB

bits

No missing codes

3.12 Operational Amplifier (OPAMP)

The electrical characteristics for the Operational Amplifiers are based on simulations.

Table 3.16. OPAMP

Symbol

Parameter

Condition

Min

Typ

Max

Unit

OPA2 BIASPROG=0xF,

HALFBIAS=0x0, Unity Gain

350

95

405 µA

OPA2 BIASPROG=0x7,

HALFBIAS=0x1, Unity Gain

115 µA

17 µA

dB

I_OPAMP

Active Current

OPA2 BIASPROG=0x0,

HALFBIAS=0x1, Unity Gain

13

OPA2 BIASPROG=0xF,

HALFBIAS=0x0

101

98

OPA2 BIASPROG=0x7,

HALFBIAS=0x1

dB

G_OL

Open Loop Gain

OPA2 BIASPROG=0x0,

HALFBIAS=0x1

91

dB

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

35

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

OPA0/OPA1 BIASPROG=0xF,

HALFBIAS=0x0

16.36

0.81

0.11

2.11

0.72

0.09

64

MHz

OPA0/OPA1 BIASPROG=0x7,

HALFBIAS=0x1

MHz

°

OPA0/OPA1 BIASPROG=0x0,

HALFBIAS=0x1

Gain Bandwidth

Product

GBW_OPAMP

OPA2 BIASPROG=0xF,

HALFBIAS=0x0

OPA2 BIASPROG=0x7,

HALFBIAS=0x1

OPA2 BIASPROG=0x0,

HALFBIAS=0x1

BIASPROG=0xF,

HALFBIAS=0x0, C_L=75 pF

BIASPROG=0x7,

HALFBIAS=0x1, C_L=75 pF

58

°

PM_OPAMP

Phase Margin

BIASPROG=0x0,

58

°

HALFBIAS=0x1, C_L=75 pF

R_INPUT

Input Resistance

Load Resistance

100

Mohm

Ohm

OPA0/OPA1

OPA2

200

R_LOAD

2000

OPA0/OPA1

OPA2

11 mA

1.5 mA

I_{LOAD_DC}

Load Current

OPAxHCMDIS=0

OPAxHCMDIS=1

V_SS

V_DD

V

V_INPUT

Input Voltage

V_DD-1.2

V_DD

V

V_OUTPUT

Output Voltage

V

Unity Gain, V_SS<V_in<V_DD

OPAxHCMDIS=0

,

6

1

mV

V_OFFSET

Input Offset Voltage

Unity Gain, V_SS<V_in<V_DD-1.2,

OPAxHCMDIS=1

mV

V_{OFFSET_DRIFT}Input Offset Voltage

Drift

0.02 mV/°C

V/µs

OPA0/OPA1 BIASPROG=0xF,

HALFBIAS=0x0

46.11

1.21

0.16

4.43

1.30

0.16

OPA0/OPA1 BIASPROG=0x7,

HALFBIAS=0x1

V/µs

OPA0/OPA1 BIASPROG=0x0,

HALFBIAS=0x1

V/µs

SR_OPAMP

Slew Rate

OPA2 BIASPROG=0xF,

HALFBIAS=0x0

V/µs

OPA2 BIASPROG=0x7,

HALFBIAS=0x1

V/µs

OPA2 BIASPROG=0x0,

HALFBIAS=0x1

V/µs

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

36

...the world's most energy friendly microcontrollers

Symbol

Parameter

Condition

Min

Typ

Max

Unit

OPA0/OPA1 BIASPROG=0xF,

HALFBIAS=0x0

0.09

1.52

12.74

0.09

0.13

0.17

101

µs

OPA0/OPA1 BIASPROG=0x7,

HALFBIAS=0x1

µs

OPA0/OPA1 BIASPROG=0x0,

HALFBIAS=0x1

µs

PU_OPAMP

Power-up Time

OPA2 BIASPROG=0xF,

HALFBIAS=0x0

µs

OPA2 BIASPROG=0x7,

HALFBIAS=0x1

µs

OPA2 BIASPROG=0x0,

HALFBIAS=0x1

µs

V_out=1V, RESSEL=0,

0.1 Hz<f<10 kHz, OPAx-

HCMDIS=0

µV_RMS

V_out=1V, RESSEL=0,

0.1 Hz<f<10 kHz, OPAx-

HCMDIS=1

141

µV_RMS

V_out=1V, RESSEL=0, 0.1

Hz<f<1 MHz, OPAxHCMDIS=0

196

229

µV_RMS

V_out=1V, RESSEL=0, 0.1

Hz<f<1 MHz, OPAxHCMDIS=1

N_OPAMP

Voltage Noise

RESSEL=7, 0.1 Hz<f<10 kHz,

OPAxHCMDIS=0

1230

2130

1630

2590

RESSEL=7, 0.1 Hz<f<10 kHz,

OPAxHCMDIS=1

RESSEL=7, 0.1 Hz<f<1 MHz,

OPAxHCMDIS=0

RESSEL=7, 0.1 Hz<f<1 MHz,

OPAxHCMDIS=1

Figure 3.24. OPAMP Common Mode Rejection Ratio

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

37

...the world's most energy friendly microcontrollers

Figure 3.25. OPAMP Positive Power Supply Rejection Ratio

Figure 3.26. OPAMP Negative Power Supply Rejection Ratio

Figure 3.27. OPAMP Voltage Noise Spectral Density (Unity Gain) V_out=1V

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

38

...the world's most energy friendly microcontrollers

Figure 3.28. OPAMP Voltage Noise Spectral Density (Non-Unity Gain)

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

39

...the world's most energy friendly microcontrollers

3.13 Analog Comparator (ACMP)

Table 3.17. ACMP

Symbol

V_ACMPIN

V_ACMPCM

Parameter

Condition

Min

Typ

Max

Unit

V

Input voltage range

0

V_DD

ACMP Common

V

Mode voltage range

BIASPROG=0b0000, FULL-

BIAS=0 and HALFBIAS=1 in

ACMPn_CTRL register

0.1

2.87

195

0.0

0.6 µA

12 µA

BIASPROG=0b1111, FULL-

BIAS=0 and HALFBIAS=0 in

ACMPn_CTRL register

I_ACMP

Active current

BIASPROG=0b1111, FULL-

BIAS=1 and HALFBIAS=0 in

ACMPn_CTRL register

520 µA

0.5 µA

Internal voltage reference off.

Using external voltage refer-

ence

Current consump-

tion of internal volt-

age reference

I_ACMPREF

Internal voltage reference

2.15

0

3.00 µA

12 mV

V_ACMPOFFSETOffset voltage

BIASPROG= 0b1010, FULL-

BIAS=0 and HALFBIAS=0 in

ACMPn_CTRL register

-12

V_ACMPHYST

ACMP hysteresis

Programmable

17

39

mV

CSRESSEL=0b00 in

ACMPn_INPUTSEL

kOhm

CSRESSEL=0b01 in

ACMPn_INPUTSEL

71

104

136

kOhm

Capacitive Sense

Internal Resistance

R_CSRES

CSRESSEL=0b10 in

ACMPn_INPUTSEL

CSRESSEL=0b11 in

ACMPn_INPUTSEL

t_ACMPSTART

Startup time

10 µs

The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference

as given in Equation 3.1 (p. 40) . I_ACMPREFis zero if an external voltage reference is used.

Total ACMP Active Current

I_ACMPTOTAL= I_ACMP+ I_ACMPREF

(3.1)

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

40

...the world's most energy friendly microcontrollers

Figure 3.29. ACMP Characteristics, Vdd = 3V, Temp = 25°C, FULLBIAS = 0, HALFBIAS = 1

2.5

2.0

1.5

1.0

0.5

0.0

20

15

10

5

HYSTSEL= 0

HYSTSEL= 2

HYSTSEL= 4

HYSTSEL= 6

0

4

8

12

0

2

4

6

8

10

12

14

ACMP_CTRL_BIASPROG

Current consumption, HYSTSEL = 4

Response time , V_cm

=

1.25V, CP+ to CP- = 100mV

100

80

60

40

20

0

BIASPROG= 0.0

BIASPROG= 4.0

BIASPROG= 8.0

BIASPROG= 12.0

0

1

2

3

4

5

6

7

ACMP_CTRL_HYSTSEL

Hysteresis

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

41

...the world's most energy friendly microcontrollers

3.14 Voltage Comparator (VCMP)

Table 3.18. VCMP

Symbol

V_VCMPIN

V_VCMPCM

Parameter

Condition

Min

Typ

Max

Unit

V

Input voltage range

V_DD

VCMP Common

V

Mode voltage range

BIASPROG=0b0000 and

HALFBIAS=1 in VCMPn_CTRL

register

0.3

22

10

0.6 µA

I_VCMP

Active current

BIASPROG=0b1111 and

HALFBIAS=0 in VCMPn_CTRL

register. LPREF=0.

30 µA

µs

t_VCMPREF

Startup time refer-

ence generator

NORMAL

Single ended

Differential

10

17

mV

V_VCMPOFFSETOffset voltage

V_VCMPHYST

t_VCMPSTART

VCMP hysteresis

Startup time

mV

10 µs

The V_DDtrigger level can be configured by setting the TRIGLEVEL field of the VCMP_CTRL register in

accordance with the following equation:

VCMP Trigger Level as a Function of Level Setting

V_{DD Trigger Level}=1.667V+0.034 ×TRIGLEVEL

(3.2)

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

42

...the world's most energy friendly microcontrollers

3.15 LCD

Table 3.19. LCD

Symbol

f_LCDFR

Parameter

Condition

Min

Typ

Max

Unit

200 Hz

Frame rate

30

NUM_SEG

Number of seg-

ments supported

18×8

seg

V_LCD

LCD supply voltage Internal boost circuit enabled

range

2.0

3.8

V

Display disconnected, stat-

ic mode, framerate 32 Hz, all

segments on.

250

550

nA

Steady state current

consumption.

Display disconnected, quadru-

nA

I_LCD

plex mode, framerate 32

Hz, all segments on, bias

mode to ONETHIRD in

LCD_DISPCTRL register.

Internal voltage boost off

Steady state Cur-

0

µA

I_LCDBOOST

rent contribution of

internal boost.

Internal voltage boost on,

8.4

boosting from 2.2 V to 3.0 V.

VBLEV of LCD_DISPCTRL

register to LEVEL0

3.0

3.08

3.17

3.26

3.34

3.43

3.52

3.6

V

VBLEV of LCD_DISPCTRL

register to LEVEL1

VBLEV of LCD_DISPCTRL

register to LEVEL2

VBLEV of LCD_DISPCTRL

register to LEVEL3

V_BOOST

Boost Voltage

VBLEV of LCD_DISPCTRL

register to LEVEL4

VBLEV of LCD_DISPCTRL

register to LEVEL5

VBLEV of LCD_DISPCTRL

register to LEVEL6

VBLEV of LCD_DISPCTRL

register to LEVEL7

The total LCD current is given by Equation 3.3 (p. 43) . I_LCDBOOSTis zero if internal boost is off.

Total LCD Current Based on Operational Mode and Internal Boost

I_LCDTOTAL= I_LCD+ I_LCDBOOST

(3.3)

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

43

...the world's most energy friendly microcontrollers

3.16 I2C

Table 3.20. I2C Standard-mode (Sm)

Symbol

f_SCL

Parameter

Min

Typ

Max

Unit

SCL clock frequency

0

4.7

4.0

250

8

100¹kHz

t_LOW

SCL clock low time

µs

t_HIGH

SCL clock high time

µs

t_SU,DAT

t_HD,DAT

t_SU,STA

t_HD,STA

t_SU,STO

t_BUF

SDA set-up time

ns

SDA hold time

3450^2,3ns

Repeated START condition set-up time

(Repeated) START condition hold time

STOP condition set-up time

Bus free time between a STOP and START condition

4.7

4.0

4.7

µs

¹For the minimum HFPERCLK frequency required in Standard-mode, see the I2C chapter in the EFM32TG Reference Manual.

²The maximum SDA hold time (t_HD,DAT) needs to be met only when the device does not stretch the low time of SCL (t_LOW).

³When transmitting data, this number is guaranteed only when I2Cn_CLKDIV < ((3450*10^-9[s] * f_HFPERCLK[Hz]) - 4).

Table 3.21. I2C Fast-mode (Fm)

Symbol

f_SCL

Parameter

Min

Typ

Max

Unit

SCL clock frequency

0

1.3

0.6

100

8

400¹kHz

t_LOW

SCL clock low time

µs

t_HIGH

SCL clock high time

µs

t_SU,DAT

t_HD,DAT

t_SU,STA

t_HD,STA

t_SU,STO

t_BUF

SDA set-up time

ns

SDA hold time

900^2,3ns

Repeated START condition set-up time

(Repeated) START condition hold time

STOP condition set-up time

Bus free time between a STOP and START condition

0.6

1.3

µs

¹For the minimum HFPERCLK frequency required in Fast-mode, see the I2C chapter in the EFM32TG Reference Manual.

²The maximum SDA hold time (t_HD,DAT) needs to be met only when the device does not stretch the low time of SCL (t_LOW).

³When transmitting data, this number is guaranteed only when I2Cn_CLKDIV < ((900*10^-9[s] * f_HFPERCLK[Hz]) - 4).

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

44

...the world's most energy friendly microcontrollers

Table 3.22. I2C Fast-mode Plus (Fm+)

Symbol

f_SCL

Parameter

Min

Typ

Max

Unit

SCL clock frequency

0

0.5

1000¹kHz

t_LOW

SCL clock low time

µs

ns

µs

t_HIGH

SCL clock high time

0.26

50

t_SU,DAT

t_HD,DAT

t_SU,STA

t_HD,STA

t_SU,STO

t_BUF

SDA set-up time

SDA hold time

8

Repeated START condition set-up time

(Repeated) START condition hold time

STOP condition set-up time

Bus free time between a STOP and START condition

0.26

0.5

¹For the minimum HFPERCLK frequency required in Fast-mode Plus, see the I2C chapter in the EFM32TG Reference Manual.

3.17 Digital Peripherals

Table 3.23. Digital Peripherals

Symbol

Parameter

Condition

Min

Typ

Max

Unit

I_USART

USART current

USART idle current, clock en-

abled

7.5

150

6.25

8.75

75

µA/

MHz

I_LEUART

LEUART current

I2C current

LEUART idle current, clock en-

abled

nA

I_I2C

I2C idle current, clock enabled

µA/

MHz

I_TIMER

I_LETIMER

I_PCNT

TIMER current

LETIMER current

PCNT current

TIMER_0 idle current, clock

enabled

µA/

MHz

LETIMER idle current, clock

enabled

nA

PCNT idle current, clock en-

abled

60

I_RTC

I_LCD

I_AES

RTC current

LCD current

AES current

RTC idle current, clock enabled

LCD idle current, clock enabled

AES idle current, clock enabled

40

50

nA

2.5

µA/

MHz

I_GPIO

I_PRS

I_DMA

GPIO current

PRS current

DMA current

GPIO idle current, clock en-

abled

5.31

2.81

8.12

µA/

MHz

PRS idle current

µA/

MHz

Clock enable

µA/

MHz

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

45

...the world's most energy friendly microcontrollers

4 Pinout and Package

Note

Please refer to the application note "AN0002 EFM32 Hardware Design Considerations" for

guidelines on designing Printed Circuit Boards (PCB's) for the EFM32TG842.

4.1 Pinout

The EFM32TG842 pinout is shown in Figure 4.1 (p. 46) and Table 4.1 (p. 46). Alternate locations

are denoted by "#" followed by the location number (Multiple locations on the same pin are split with "/").

Alternate locations can be configured in the LOCATION bitfield in the *_ROUTE register in the module

in question.

Figure 4.1. EFM32TG842 Pinout (top view, not to scale)

Table 4.1. Device Pinout

QFP64 Pin#

and Name

Pin Alternate Functionality / Description

Pin Name

Analog

Timers

Communication

Other

LEU0_RX #4

I2C0_SDA #0

PRS_CH0 #0

GPIO_EM4WU0

1

2

PA0

PA1

LCD_SEG13

LCD_SEG14

TIM0_CC0 #0/1/4

TIM0_CC1 #0/1

CMU_CLK1 #0

PRS_CH1 #0

I2C0_SCL #0

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

46

...the world's most energy friendly microcontrollers

QFP64 Pin#

and Name

Pin Alternate Functionality / Description

Pin Name

Analog

Timers

Communication

Other

3

4

5

6

7

8

PA2

PA3

LCD_SEG15

LCD_SEG16

TIM0_CC2 #0/1

CMU_CLK0 #0

LES_ALTEX2 #0

LES_ALTEX3 #0

LES_ALTEX4 #0

PA4

LCD_SEG17

PA5

LCD_SEG18

IOVDD_0

VSS

Digital IO power supply 0.

Ground.

LCD_SEG20/

LCD_COM4

9

PB3

PB4

PB5

PB6

LCD_SEG21/

LCD_COM5

10

11

12

LCD_SEG22/

LCD_COM6

LCD_SEG23/

LCD_COM7

ACMP0_CH4

DAC0_P0 /

OPAMP_P0

13

14

PC4

PC5

LETIM0_OUT0 #3

LETIM0_OUT1 #3

LES_CH4 #0

LES_CH5 #0

ACMP0_CH5

DAC0_N0 /

OPAMP_N0

US0_TX #4

US1_CLK #0

15

16

PB7

PB8

LFXTAL_P

LFXTAL_N

TIM1_CC0 #3

TIM1_CC1 #3

US0_RX #4

US1_CS #0

17

18

19

PA12

PA13

PA14

LCD_BCAP_P

LCD_BCAP_N

LCD_BEXT

Reset input, active low.

20

21

RESETn

PB11

To apply an external reset source to this pin, it is required to only drive this pin low during reset, and let the internal pull-up

ensure that reset is released.

DAC0_OUT0 /

OPAMP_OUT0

TIM1_CC2 #3

LETIM0_OUT0 #1

22

23

VSS

Ground.

AVDD_1

Analog power supply 1.

HFXTAL_P

US0_CLK #4/5

LEU0_TX #1

24

25

PB13

PB14

US0_CS #4/5

LEU0_RX #1

HFXTAL_N

26

27

IOVDD_3

AVDD_0

Digital IO power supply 3.

Analog power supply 0.

ADC0_CH0

DAC0_OUT0ALT #4/

OPAMP_OUT0ALT

OPAMP_OUT2 #1

28

29

PD0

PD1

US1_TX #1

US1_RX #1

ADC0_CH1

DAC0_OUT1ALT #4/

OPAMP_OUT1ALT

TIM0_CC0 #3

30

31

PD2

PD3

ADC0_CH2

TIM0_CC1 #3

TIM0_CC2 #3

US1_CLK #1

US1_CS #1

ADC0_CH3

OPAMP_N2

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

47

...the world's most energy friendly microcontrollers

QFP64 Pin#

and Name

Pin Alternate Functionality / Description

Pin Name

Analog

Timers

Communication

Other

ADC0_CH4

OPAMP_P2

32

33

PD4

PD5

LEU0_TX #0

LEU0_RX #0

ADC0_CH5

OPAMP_OUT2 #0

ADC0_CH6

DAC0_P1 /

OPAMP_P1

TIM1_CC0 #4

LETIM0_OUT0 #0

PCNT0_S0IN #3

US1_RX #2

I2C0_SDA #1

LES_ALTEX0 #0

ACMP0_O #2

34

35

PD6

PD7

ADC0_CH7

DAC0_N1 /

OPAMP_N1

TIM1_CC1 #4

LETIM0_OUT1 #0

PCNT0_S1IN #3

CMU_CLK0 #2

LES_ALTEX1 #0

ACMP1_O #2

US1_TX #2

I2C0_SCL #1

36

37

38

39

40

41

42

43

44

PD8

PC6

CMU_CLK1 #1

LES_CH6 #0

LES_CH7 #0

ACMP0_CH6

ACMP0_CH7

I2C0_SDA #2

I2C0_SCL #2

PC7

VDD_DREG

DECOUPLE

PE4

Power supply for on-chip voltage regulator.

Decouple output for on-chip voltage regulator. An external capacitance of size C_DECOUPLEis required at this pin.

LCD_COM0

LCD_COM1

LCD_COM2

LCD_COM3

US0_CS #1

US0_CLK #1

US0_RX #1

US0_TX #1

PE5

PE6

PE7

ACMP1_CH4

DAC0_OUT1ALT #0/

OPAMP_OUT1ALT

CMU_CLK0 #1

LES_CH12 #0

45

46

47

48

49

50

51

PC12

PC13

PC14

PC15

PF0

ACMP1_CH5

DAC0_OUT1ALT #1/

OPAMP_OUT1ALT

TIM1_CC0 #0

TIM1_CC2 #4

PCNT0_S0IN #0

LES_CH13 #0

LES_CH14 #0

ACMP1_CH6

DAC0_OUT1ALT #2/

OPAMP_OUT1ALT

TIM1_CC1 #0

PCNT0_S1IN #0

US0_CS #3

ACMP1_CH7

DAC0_OUT1ALT #3/

OPAMP_OUT1ALT

LES_CH15 #0

DBG_SWO #1

TIM1_CC2 #0

US0_CLK #3

US1_CLK #2

LEU0_TX #3

I2C0_SDA #5

TIM0_CC0 #5

LETIM0_OUT0 #2

DBG_SWCLK #0/1

US1_CS #2

LEU0_RX #3

I2C0_SCL #5

TIM0_CC1 #5

LETIM0_OUT1 #2

DBG_SWDIO #0/1

GPIO_EM4WU3

PF1

ACMP1_O #0

DBG_SWO #0

GPIO_EM4WU4

PF2

LCD_SEG0

TIM0_CC2 #5

LEU0_TX #4

52

53

54

55

56

57

58

59

PF3

PF4

LCD_SEG1

LCD_SEG2

PRS_CH0 #1

PRS_CH1 #1

PRS_CH2 #1

PF5

LCD_SEG3

IOVDD_5

VSS

Digital IO power supply 5.

Ground.

PE8

LCD_SEG4

PRS_CH3 #1

BOOT_TX

PE9

LCD_SEG5

PE10

LCD_SEG6

TIM1_CC0 #1

TIM1_CC1 #1

US0_TX #0

US0_RX #0

LES_ALTEX5 #0

BOOT_RX

60

PE11

LCD_SEG7

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

48

...the world's most energy friendly microcontrollers

QFP64 Pin#

and Name

Pin Alternate Functionality / Description

Pin Name

Analog

Timers

Communication

Other

US0_RX #3

US0_CLK #0

I2C0_SDA #6

CMU_CLK1 #2

LES_ALTEX6 #0

61

62

PE12

PE13

LCD_SEG8

LCD_SEG9

TIM1_CC2 #1

US0_TX #3

US0_CS #0

I2C0_SCL #6

LES_ALTEX7 #0

ACMP0_O #0

GPIO_EM4WU5

63

64

PE14

PE15

LCD_SEG10

LCD_SEG11

LEU0_TX #2

LEU0_RX #2

4.2 Alternate Functionality Pinout

A wide selection of alternate functionality is available for multiplexing to various pins. This is shown in

Table 4.2 (p. 49). The table shows the name of the alternate functionality in the first column, followed

by columns showing the possible LOCATION bitfield settings.

Note

Some functionality, such as analog interfaces, do not have alternate settings or a LOCA-

TION bitfield. In these cases, the pinout is shown in the column corresponding to LOCA-

TION 0.

Table 4.2. Alternate functionality overview

Alternate

LOCATION

3

Functionality

ACMP0_CH4

ACMP0_CH5

ACMP0_CH6

ACMP0_CH7

ACMP0_O

0

1

2

PD6

PD7

4

5

6

Description

PC4

Analog comparator ACMP0, channel 4.

PC5

PC6

PC7

PE13

PC12

PC13

PC14

PC15

PF2

Analog comparator ACMP0, channel 5.

Analog comparator ACMP0, channel 6.

Analog comparator ACMP0, channel 7.

Analog comparator ACMP0, digital output.

Analog comparator ACMP1, channel 4.

ACMP1_CH4

ACMP1_CH5

ACMP1_CH6

ACMP1_CH7

ACMP1_O

Analog comparator ACMP1, channel 5.

Analog comparator ACMP1, channel 6.

Analog comparator ACMP1, channel 7.

Analog comparator ACMP1, digital output.

Analog to digital converter ADC0, input channel number 0.

Analog to digital converter ADC0, input channel number 1.

Analog to digital converter ADC0, input channel number 2.

Analog to digital converter ADC0, input channel number 3.

Analog to digital converter ADC0, input channel number 4.

Analog to digital converter ADC0, input channel number 5.

Analog to digital converter ADC0, input channel number 6.

Analog to digital converter ADC0, input channel number 7.

Bootloader RX.

ADC0_CH0

ADC0_CH1

ADC0_CH2

ADC0_CH3

ADC0_CH4

ADC0_CH5

ADC0_CH6

ADC0_CH7

BOOT_RX

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PE11

PE10

PA2

BOOT_TX

Bootloader TX.

CMU_CLK0

PC12

PD7

Clock Management Unit, clock output number 0.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

49

...the world's most energy friendly microcontrollers

Alternate

LOCATION

3

Functionality

0

1

2

4

5

6

Description

CMU_CLK1

PA1

PD8

PE12

Clock Management Unit, clock output number 1.

DAC0_N0 /

OPAMP_N0

PC5

Operational Amplifier 0 external negative input.

DAC0_N1 /

OPAMP_N1

PD7

PD3

PB11

Operational Amplifier 1 external negative input.

Operational Amplifier 2 external negative input.

OPAMP_N2

DAC0_OUT0 /

OPAMP_OUT0

Digital to Analog Converter DAC0_OUT0 /

OPAMP output channel number 0.

DAC0_OUT0ALT /

OPAMP_OUT0ALT

Digital to Analog Converter DAC0_OUT0ALT /

OPAMP alternative output for channel 0.

PD0

DAC0_OUT1ALT /

OPAMP_OUT1ALT

Digital to Analog Converter DAC0_OUT1ALT /

OPAMP alternative output for channel 1.

PC12

PD5

PC4

PC13

PD0

PC14

PC15

PD1

OPAMP_OUT2

Operational Amplifier 2 output.

DAC0_P0 /

OPAMP_P0

Operational Amplifier 0 external positive input.

DAC0_P1 /

OPAMP_P1

PD6

PD4

Operational Amplifier 1 external positive input.

OPAMP_P2

Operational Amplifier 2 external positive input.

Debug-interface Serial Wire clock input.

DBG_SWCLK

PF0

PF1

PF2

PF0

Note that this function is enabled to pin out of reset, and has

a built-in pull down.

Debug-interface Serial Wire data input / output.

DBG_SWDIO

DBG_SWO

PF1

Note that this function is enabled to pin out of reset, and has

a built-in pull up.

Debug-interface Serial Wire viewer Output.

PC15

Note that this function is not enabled after reset, and must be

enabled by software to be used.

GPIO_EM4WU0

GPIO_EM4WU3

GPIO_EM4WU4

GPIO_EM4WU5

PA0

PF1

PF2

PE13

Pin can be used to wake the system up from EM4

High Frequency Crystal negative pin. Also used as external

optional clock input pin.

HFXTAL_N

PB14

HFXTAL_P

I2C0_SCL

I2C0_SDA

PB13

PA1

PA0

High Frequency Crystal positive pin.

I2C0 Serial Clock Line input / output.

I2C0 Serial Data input / output.

PD7

PD6

PC7

PC6

PF1

PF0

PE13

PE12

LCD voltage booster (optional), boost capacitor, negative pin.

If using the LCD voltage booster, connect a 22 nF capacitor

between LCD_BCAP_N and LCD_BCAP_P.

LCD_BCAP_N

LCD_BCAP_P

PA13

PA12

LCD voltage booster (optional), boost capacitor, positive pin.

If using the LCD voltage booster, connect a 22 nF capacitor

between LCD_BCAP_N and LCD_BCAP_P.

LCD voltage booster (optional), boost output. If using the

LCD voltage booster, connect a 1 uF capacitor between this

pin and VSS.

LCD_BEXT

PA14

An external LCD voltage may also be applied to this pin if the

booster is not enabled.

If AVDD is used directly as the LCD supply voltage, this pin

may be left unconnected or used as a GPIO.

LCD_COM0

LCD_COM1

PE4

PE5

LCD driver common line number 0.

LCD driver common line number 1.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

50

...the world's most energy friendly microcontrollers

Alternate

LOCATION

3

Functionality

LCD_COM2

0

1

2

4

5

6

Description

LCD driver common line number 2.

LCD driver common line number 3.

PE6

LCD_COM3

PE7

PF2

LCD segment line 0. Segments 0, 1, 2 and 3 are controlled

by SEGEN0.

LCD_SEG0

LCD_SEG1

LCD_SEG2

LCD_SEG3

LCD_SEG4

LCD_SEG5

LCD_SEG6

LCD_SEG7

LCD_SEG8

LCD_SEG9

LCD_SEG10

LCD_SEG11

LCD_SEG13

LCD_SEG14

LCD_SEG15

LCD_SEG16

LCD_SEG17

LCD_SEG18

LCD segment line 1. Segments 0, 1, 2 and 3 are controlled

by SEGEN0.

PF3

LCD segment line 2. Segments 0, 1, 2 and 3 are controlled

by SEGEN0.

PF4

LCD segment line 3. Segments 0, 1, 2 and 3 are controlled

by SEGEN0.

PF5

LCD segment line 4. Segments 4, 5, 6 and 7 are controlled

by SEGEN1.

PE8

PE9

PE10

PE11

PE12

PE13

PE14

PE15

PA0

PA1

PA2

PA3

PA4

PA5

LCD segment line 5. Segments 4, 5, 6 and 7 are controlled

by SEGEN1.

LCD segment line 6. Segments 4, 5, 6 and 7 are controlled

by SEGEN1.

LCD segment line 7. Segments 4, 5, 6 and 7 are controlled

by SEGEN1.

LCD segment line 8. Segments 8, 9, 10 and 11 are controlled

by SEGEN2.

LCD segment line 9. Segments 8, 9, 10 and 11 are controlled

by SEGEN2.

LCD segment line 10. Segments 8, 9, 10 and 11 are con-

trolled by SEGEN2.

LCD segment line 11. Segments 8, 9, 10 and 11 are con-

trolled by SEGEN2.

LCD segment line 13. Segments 12, 13, 14 and 15 are con-

trolled by SEGEN3.

LCD segment line 14. Segments 12, 13, 14 and 15 are con-

trolled by SEGEN3.

LCD segment line 15. Segments 12, 13, 14 and 15 are con-

trolled by SEGEN3.

LCD segment line 16. Segments 16, 17, 18 and 19 are con-

trolled by SEGEN4.

LCD segment line 17. Segments 16, 17, 18 and 19 are con-

trolled by SEGEN4.

LCD segment line 18. Segments 16, 17, 18 and 19 are con-

trolled by SEGEN4.

LCD segment line 20. Segments 20, 21, 22 and 23 are con-

trolled by SEGEN5. This pin may also be used as LCD COM

line 4

LCD_SEG20/

LCD_COM4

PB3

PB4

PB5

PB6

LCD segment line 21. Segments 20, 21, 22 and 23 are con-

trolled by SEGEN5. This pin may also be used as LCD COM

line 5

LCD_SEG21/

LCD_COM5

LCD segment line 22. Segments 20, 21, 22 and 23 are con-

trolled by SEGEN5. This pin may also be used as LCD COM

line 6

LCD_SEG22/

LCD_COM6

LCD segment line 23. Segments 20, 21, 22 and 23 are con-

trolled by SEGEN5. This pin may also be used as LCD COM

line 7

LCD_SEG23/

LCD_COM7

LES_ALTEX0

LES_ALTEX1

LES_ALTEX2

LES_ALTEX3

PD6

PD7

PA3

PA4

LESENSE alternate exite output 0.

LESENSE alternate exite output 1.

LESENSE alternate exite output 2.

LESENSE alternate exite output 3.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

51

...the world's most energy friendly microcontrollers

Alternate

LOCATION

3

Functionality

LES_ALTEX4

LES_ALTEX5

LES_ALTEX6

LES_ALTEX7

LES_CH4

0

1

2

4

5

6

Description

PA5

LESENSE alternate exite output 4.

PE11

PE12

PE13

PC4

LESENSE alternate exite output 5.

LESENSE alternate exite output 6.

LESENSE alternate exite output 7.

LESENSE channel 4.

LES_CH5

PC5

LESENSE channel 5.

LES_CH6

PC6

LESENSE channel 6.

LES_CH7

PC7

LESENSE channel 7.

LES_CH12

PC12

PC13

PC14

PC15

PD6

LESENSE channel 12.

LES_CH13

LESENSE channel 13.

LES_CH14

LESENSE channel 14.

LES_CH15

LESENSE channel 15.

LETIM0_OUT0

LETIM0_OUT1

LEU0_RX

PB11

PF0

PC4

PC5

Low Energy Timer LETIM0, output channel 0.

Low Energy Timer LETIM0, output channel 1.

LEUART0 Receive input.

PD7

PF1

PD5

PB14

PB13

PE15

PF1

PF0

PA0

PF2

LEUART0 Transmit output. Also used as receive input in half

duplex communication.

LEU0_TX

PD4

PB8

PE14

Low Frequency Crystal (typically 32.768 kHz) negative pin.

Also used as an optional external clock input pin.

LFXTAL_N

LFXTAL_P

PCNT0_S0IN

PCNT0_S1IN

PRS_CH0

PRS_CH1

PRS_CH2

PRS_CH3

TIM0_CC0

TIM0_CC1

TIM0_CC2

TIM1_CC0

TIM1_CC1

TIM1_CC2

US0_CLK

US0_CS

PB7

Low Frequency Crystal (typically 32.768 kHz) positive pin.

Pulse Counter PCNT0 input number 0.

PC13

PC14

PA0

PD6

PD7

Pulse Counter PCNT0 input number 1.

PF3

PF4

PF5

PE8

PA0

PA1

PA2

PE10

PE11

PE12

PE5

PE4

Peripheral Reflex System PRS, channel 0.

Peripheral Reflex System PRS, channel 1.

Peripheral Reflex System PRS, channel 2.

Peripheral Reflex System PRS, channel 3.

Timer 0 Capture Compare input / output channel 0.

Timer 0 Capture Compare input / output channel 1.

Timer 0 Capture Compare input / output channel 2.

Timer 1 Capture Compare input / output channel 0.

Timer 1 Capture Compare input / output channel 1.

Timer 1 Capture Compare input / output channel 2.

USART0 clock input / output.

PA1

PA0

PD1

PD2

PD3

PB7

PA0

PF0

PF1

PF2

PA1

PA2

PC13

PC14

PC15

PE12

PE13

PD6

PB8

PD7

PB11

PC15

PC14

PC13

PB13

PB14

PB13

PB14

USART0 chip select input / output.

USART0 Asynchronous Receive.

US0_RX

US0_TX

PE11

PE10

PE6

PE7

PE12

PE13

PB8

PB7

USART0 Synchronous mode Master Input / Slave Output

(MISO).

USART0 Asynchronous Transmit.Also used as receive input

in half duplex communication.

USART0 Synchronous mode Master Output / Slave Input

(MOSI).

US1_CLK

US1_CS

US1_RX

PB7

PB8

PD2

PD3

PD1

PF0

PF1

PD6

USART1 clock input / output.

USART1 chip select input / output.

USART1 Asynchronous Receive.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

52

...the world's most energy friendly microcontrollers

Alternate

LOCATION

3

Functionality

0

1

2

4

5

6

Description

USART1 Synchronous mode Master Input / Slave Output

(MISO).

USART1 Asynchronous Transmit.Also used as receive input

in half duplex communication.

US1_TX

PD0

PD7

USART1 Synchronous mode Master Output / Slave Input

(MOSI).

4.3 GPIO Pinout Overview

The specific GPIO pins available in EFM32TG842 is shown in Table 4.3 (p. 53). Each GPIO port is

organized as 16-bit ports indicated by letters A through F, and the individual pin on this port is indicated

by a number from 15 down to 0.

Table 4.3. GPIO Pinout

Port

Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin

0

15

14

13

12

11

10

9

8

7

6

5

4

3

PA3

PB3

-

2

PA2

-

1

PA1

-

Port A

Port B

Port C

Port D

Port E

Port F

-

PA14 PA13 PA12

PB14 PB13

-

PA5

PB5

PC5

PD5

PE5

PF5

PA4

PB4

PC4

PD4

PE4

PF4

PA0

-

PB11

-

PB8

-

PB7

PC7

PD7

PE7

-

PB6

PC6

PD6

PE6

-

PC15 PC14 PC13 PC12

-

PE9

-

PD8

PE8

-

PD3

-

PD2

-

PD1

-

PD0

-

PE15 PE14 PE13 PE12 PE11 PE10

-

PF3

PF2

PF1

PF0

4.4 Opamp Pinout Overview

The specific opamp terminals available in EFM32TG842 is shown in Figure 4.2 (p. 53) .

Figure 4.2. Opamp Pinout

PB11

OUT0ALT

OUT0

PC4

PC5

+

OPA0

-

+

PD4

PD3

PC12

PC13

PC14

PC15

PD0

OPA2

-

OUT2

PD6

PD7

OUT1ALT

OUT1

+

OPA1

-

PD1

PD5

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

53

...the world's most energy friendly microcontrollers

4.5 TQFP64 Package

Figure 4.3. TQFP64

Note:

1. All dimensions & tolerancing confirm to ASME Y14.5M-1994.

2. The top package body size may be smaller than the bottom package body size.

3. Datum 'A,B', and 'B' to be determined at datum plane 'H'.

4. To be determined at seating place 'C'.

5. Dimension 'D1' and 'E1' do not include mold protrusions. Allowable protrusion is 0.25mm per side.

'D1' and 'E1' are maximum plastic body size dimension including mold mismatch. Dimension 'D1' and

'E1' shall be determined at datum plane 'H'.

6. Detail of Pin 1 indicatifier are option all but must be located within the zone indicated.

7. Dimension 'b' does not include dambar protrusion. Allowable dambar protrusion shall not cause the

lead width to exceed the maximum 'b' dimension by more than 0.08 mm. Dambar can not be located

on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm

8. Exact shape of each corner is optional.

9. These dimension apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.

10.All dimensions are in millimeters.

Table 4.4. QFP64 (Dimensions in mm)

DIM

A

MIN

-

NOM

1.10

-

MAX

1.20

0.15

1.05

DIM

L1

MIN

NOM

MAX

-

A1

A2

0.05

0.95

R1

R2

0.08

-

1.00

0.20

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

54

...the world's most energy friendly microcontrollers

DIM

b

MIN

0.17

NOM

0.22

0.20

MAX

0.27

0.23

DIM

MIN

0.20

0°

NOM

-

MAX

S

-

b1

3.5°

7°

θ

c

C1

D

0.09

-

0.20

0.16

0°

-

θ1

θ2

θ3

-

11°

12°

13°

12.0 BSC

D1

e

10.0 BSC

0.50 BSC

12.0 BSC

10.0 BSC

0.60

E

E1

L

0.45

0.75

The TQFP64 Package is 10 by 10 mm in size and has a 0.5 mm pin pitch.

The TQFP64 Package uses Nickel-Palladium-Gold preplated leadframe.

All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).

For additional Quality and Environmental information, please see:

http://www.silabs.com/support/quality/pages/default.aspx

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

55

...the world's most energy friendly microcontrollers

5 PCB Layout and Soldering

5.1 Recommended PCB Layout

Figure 5.1. TQFP64 PCB Land Pattern

a

p8

p7

p6

p1

b

e

c

p2

p5

p3

p4

d

Table 5.1. QFP64 PCB Land Pattern Dimensions (Dimensions in mm)

Symbol

Dim. (mm)

1.60

Symbol

P1

Pin number

Symbol

Pin number

a

b

c

d

e

1

P6

P7

P8

-

48

49

64

-

0.30

P2

16

17

32

33

0.50

P3

11.50

P4

P5

-

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

56

...the world's most energy friendly microcontrollers

Figure 5.2. TQFP64 PCB Solder Mask

a

b

c

e

d

Table 5.2. QFP64 PCB Solder Mask Dimensions (Dimensions in mm)

Symbol

Dim. (mm)

a

b

c

d

e

1.72

0.42

0.50

11.50

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

57

...the world's most energy friendly microcontrollers

Figure 5.3. TQFP64 PCB Stencil Design

a

b

c

e

d

Table 5.3. QFP64 PCB Stencil Design Dimensions (Dimensions in mm)

Symbol

Dim. (mm)

a

b

c

d

e

1.50

0.20

0.50

11.50

1. The drawings are not to scale.

2. All dimensions are in millimeters.

3. All drawings are subject to change without notice.

4. The PCB Land Pattern drawing is in compliance with IPC-7351B.

5. Stencil thickness 0.125 mm.

6. For detailed pin-positioning, see Figure 4.3 (p. 54) .

5.2 Soldering Information

The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.

The packages have a Moisture Sensitivity Level rating of 3, please see the latest IPC/JEDEC J-STD-033

standard for MSL description and level 3 bake conditions.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

58

...the world's most energy friendly microcontrollers

6 Chip Marking, Revision and Errata

6.1 Chip Marking

In the illustration below package fields and position are shown.

Figure 6.1. Example Chip Marking (top view)

6.2 Revision

The revision of a chip can be determined from the "Revision" field in Figure 6.1 (p. 59) .

6.3 Errata

Please see the errata document for EFM32TG842 for description and resolution of device erratas. This

document is available in Simplicity Studio and online at:

http://www.silabs.com/support/pages/document-library.aspx?p=MCUs--32-bit

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

59

...the world's most energy friendly microcontrollers

7 Revision History

7.1 Revision 1.40

March 6th, 2015

Updated Block Diagram.

Updated Energy Modes current consumption.

Updated Power Management section.

Updated LFRCO and HFRCO sections.

Added AUXHFRCO to block diagram and Electrical Characteristics.

Corrected unit to kHz on LFRCO plots y-axis.

Updated ADC section and added clarification on conditions for INL_ADCand DNL_ADCparameters.

Updated DAC section and added clarification on conditions for INL_DACand DNL_DACparameters.

Updated OPAMP section.

Updated ACMP section and the response time graph.

Updated VCMP section.

Updated Digital Peripherals section.

7.2 Revision 1.30

July 2nd, 2014

Corrected single power supply voltage minimum value from 1.85V to 1.98V.

Updated current consumption.

Updated transition between energy modes.

Updated power management data.

Updated GPIO data.

Updated LFXO, HFXO, HFRCO and ULFRCO data.

Updated LFRCO and HFRCO plots.

Updated ACMP data.

7.3 Revision 1.21

November 21st, 2013

Updated figures.

Updated errata-link.

Updated chip marking.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

60

...the world's most energy friendly microcontrollers

Added link to Environmental and Quality information.

Re-added missing DAC-data.

7.4 Revision 1.20

September 30th, 2013

Added I2C characterization data.

Corrected GPIO operating voltage from 1.8 V to 1.85 V.

Corrected the ADC gain and offset measurement reference voltage from 2.25 to 2.5V.

Corrected the ADC resolution from 12, 10 and 6 bit to 12, 8 and 6 bit.

Document changed status from "Preliminary".

Updated Environmental information.

Updated trademark, disclaimer and contact information.

Other minor corrections.

7.5 Revision 1.10

June 28th, 2013

Updated power requirements in the Power Management section.

Removed minimum load capacitance figure and table. Added reference to application note.

Other minor corrections.

7.6 Revision 1.00

September 11th, 2012

Updated the HFRCO 1 MHz band typical value to 1.2 MHz.

Updated the HFRCO 7 MHz band typical value to 6.6 MHz.

Added GPIO_EM4WU3, GPIO_EM4WU4 and GPIO_EM4WU5 pins and removed GPIO_EM4WU1 in

the Alternate functionality overview table.

Other minor corrections.

7.7 Revision 0.96

May 4th, 2012

Corrected PCB footprint figures and tables.

7.8 Revision 0.95

February 27th, 2012

Corrected operating voltage from 1.8 V to 1.85 V.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

61

...the world's most energy friendly microcontrollers

Added rising POR level and corrected Thermometer output gradient in Electrical Characteristics section.

Updated Minimum Load Capacitance (C_LFXOL) Requirement For Safe Crystal Startup.

Added Gain error drift and Offset error drift to ADC table.

Added reference to errata document.

7.9 Revision 0.92

July 22nd, 2011

Updated current consumption numbers from latest device characterization data.

Updated OPAMP electrical characteristics.

Made ADC plots render properly in Adobe Reader.

Corrected number of DAC channels available.

7.10 Revision 0.90

June 30th, 2011

Initial preliminary release.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

62

...the world's most energy friendly microcontrollers

A Disclaimer and Trademarks

A.1 Disclaimer

Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation

of all peripherals and modules available for system and software implementers using or intending to use

the Silicon Laboratories products. Characterization data, available modules and peripherals, memory

sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and

do vary in different applications. Application examples described herein are for illustrative purposes only.

Silicon Laboratories reserves the right to make changes without further notice and limitation to product

information, specifications, and descriptions herein, and does not give warranties as to the accuracy

or completeness of the included information. Silicon Laboratories shall have no liability for the conse-

quences of use of the information supplied herein. This document does not imply or express copyright

licenses granted hereunder to design or fabricate any integrated circuits. The products must not be

used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life

Support System" is any product or system intended to support or sustain life and/or health, which, if it

fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories

products are generally not intended for military applications. Silicon Laboratories products shall under no

circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological

or chemical weapons, or missiles capable of delivering such weapons.

A.2 Trademark Information

Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®,

EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most ener-

gy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISO-

modem®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered

trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or reg-

istered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products

or brand names mentioned herein are trademarks of their respective holders.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

63

...the world's most energy friendly microcontrollers

B Contact Information

Silicon Laboratories Inc.

400 West Cesar Chavez

Austin, TX 78701

Please visit the Silicon Labs Technical Support web page:

http://www.silabs.com/support/pages/contacttechnicalsupport.aspx

and register to submit a technical support request.

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

64

...the world's most energy friendly microcontrollers

Table of Contents

1. Ordering Information .................................................................................................................................. 2

2. System Summary ...................................................................................................................................... 3

2.1. System Introduction ......................................................................................................................... 3

2.2. Configuration Summary .................................................................................................................... 7

2.3. Memory Map ................................................................................................................................. 8

3. Electrical Characteristics ............................................................................................................................. 9

3.1. Test Conditions .............................................................................................................................. 9

3.2. Absolute Maximum Ratings .............................................................................................................. 9

3.3. General Operating Conditions ........................................................................................................... 9

3.4. Current Consumption ..................................................................................................................... 10

3.5. Transition between Energy Modes .................................................................................................... 12

3.6. Power Management ....................................................................................................................... 12

3.7. Flash .......................................................................................................................................... 13

3.8. General Purpose Input Output ......................................................................................................... 13

3.9. Oscillators .................................................................................................................................... 21

3.10. Analog Digital Converter (ADC) ...................................................................................................... 26

3.11. Digital Analog Converter (DAC) ...................................................................................................... 34

3.12. Operational Amplifier (OPAMP) ...................................................................................................... 35

3.13. Analog Comparator (ACMP) .......................................................................................................... 40

3.14. Voltage Comparator (VCMP) ......................................................................................................... 42

3.15. LCD .......................................................................................................................................... 43

3.16. I2C ........................................................................................................................................... 44

3.17. Digital Peripherals ....................................................................................................................... 45

4. Pinout and Package ................................................................................................................................. 46

4.1. Pinout ......................................................................................................................................... 46

4.2. Alternate Functionality Pinout .......................................................................................................... 49

4.3. GPIO Pinout Overview ................................................................................................................... 53

4.4. Opamp Pinout Overview ................................................................................................................. 53

4.5. TQFP64 Package .......................................................................................................................... 54

5. PCB Layout and Soldering ........................................................................................................................ 56

5.1. Recommended PCB Layout ............................................................................................................ 56

5.2. Soldering Information ..................................................................................................................... 58

6. Chip Marking, Revision and Errata .............................................................................................................. 59

6.1. Chip Marking ................................................................................................................................ 59

6.2. Revision ...................................................................................................................................... 59

6.3. Errata ......................................................................................................................................... 59

7. Revision History ...................................................................................................................................... 60

7.1. Revision 1.40 ............................................................................................................................... 60

7.2. Revision 1.30 ............................................................................................................................... 60

7.3. Revision 1.21 ............................................................................................................................... 60

7.4. Revision 1.20 ............................................................................................................................... 61

7.5. Revision 1.10 ............................................................................................................................... 61

7.6. Revision 1.00 ............................................................................................................................... 61

7.7. Revision 0.96 ............................................................................................................................... 61

7.8. Revision 0.95 ............................................................................................................................... 61

7.9. Revision 0.92 ............................................................................................................................... 62

7.10. Revision 0.90 .............................................................................................................................. 62

A. Disclaimer and Trademarks ....................................................................................................................... 63

A.1. Disclaimer ................................................................................................................................... 63

A.2. Trademark Information ................................................................................................................... 63

B. Contact Information ................................................................................................................................. 64

B.1. ................................................................................................................................................. 64

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

65

...the world's most energy friendly microcontrollers

List of Figures

2.1. Block Diagram ....................................................................................................................................... 3

2.2. EFM32TG842 Memory Map with largest RAM and Flash sizes ........................................................................ 8

3.1. EM2 current consumption. RTC prescaled to 1kHz, 32.768 kHz LFRCO. ......................................................... 11

3.2. EM3 current consumption. ..................................................................................................................... 11

3.3. EM4 current consumption. ..................................................................................................................... 11

3.4. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 15

3.5. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 16

3.6. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 17

3.7. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 18

3.8. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 19

3.9. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 20

3.10. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 22

3.11. Calibrated HFRCO 1 MHz Band Frequency vs Supply Voltage and Temperature ............................................ 23

3.12. Calibrated HFRCO 7 MHz Band Frequency vs Supply Voltage and Temperature ............................................ 23

3.13. Calibrated HFRCO 11 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 24

3.14. Calibrated HFRCO 14 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 24

3.15. Calibrated HFRCO 21 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 24

3.16. Calibrated HFRCO 28 MHz Band Frequency vs Supply Voltage and Temperature ........................................... 25

3.17. Integral Non-Linearity (INL) ................................................................................................................... 30

3.18. Differential Non-Linearity (DNL) .............................................................................................................. 30

3.19. ADC Frequency Spectrum, Vdd = 3V, Temp = 25°C ................................................................................. 31

3.20. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25°C ................................................................... 32

3.21. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25°C ............................................................... 33

3.22. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 34

3.23. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 34

3.24. OPAMP Common Mode Rejection Ratio ................................................................................................. 37

3.25. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 38

3.26. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 38

3.27. OPAMP Voltage Noise Spectral Density (Unity Gain) V_out=1V ..................................................................... 38

3.28. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 39

3.29. ACMP Characteristics, Vdd = 3V, Temp = 25°C, FULLBIAS = 0, HALFBIAS = 1 ............................................. 41

4.1. EFM32TG842 Pinout (top view, not to scale) .............................................................................................. 46

4.2. Opamp Pinout ...................................................................................................................................... 53

4.3. TQFP64 .............................................................................................................................................. 54

5.1. TQFP64 PCB Land Pattern ..................................................................................................................... 56

5.2. TQFP64 PCB Solder Mask ..................................................................................................................... 57

5.3. TQFP64 PCB Stencil Design ................................................................................................................... 58

6.1. Example Chip Marking (top view) ............................................................................................................. 59

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

66

...the world's most energy friendly microcontrollers

List of Tables

1.1. Ordering Information ................................................................................................................................ 2

2.1. Configuration Summary ............................................................................................................................ 7

3.1. Absolute Maximum Ratings ...................................................................................................................... 9

3.2. General Operating Conditions ................................................................................................................... 9

3.3. Current Consumption ............................................................................................................................. 10

3.4. Energy Modes Transitions ...................................................................................................................... 12

3.5. Power Management ............................................................................................................................... 12

3.6. Flash .................................................................................................................................................. 13

3.7. GPIO .................................................................................................................................................. 13

3.8. LFXO .................................................................................................................................................. 21

3.9. HFXO ................................................................................................................................................. 21

3.10. LFRCO .............................................................................................................................................. 22

3.11. HFRCO ............................................................................................................................................. 22

3.12. AUXHFRCO ....................................................................................................................................... 25

3.13. ULFRCO ............................................................................................................................................ 25

3.14. ADC .................................................................................................................................................. 26

3.15. DAC .................................................................................................................................................. 34

3.16. OPAMP ............................................................................................................................................. 35

3.17. ACMP ............................................................................................................................................... 40

3.18. VCMP ............................................................................................................................................... 42

3.19. LCD .................................................................................................................................................. 43

3.20. I2C Standard-mode (Sm) ...................................................................................................................... 44

3.21. I2C Fast-mode (Fm) ............................................................................................................................ 44

3.22. I2C Fast-mode Plus (Fm+) .................................................................................................................... 45

3.23. Digital Peripherals ............................................................................................................................... 45

4.1. Device Pinout ....................................................................................................................................... 46

4.2. Alternate functionality overview ................................................................................................................ 49

4.3. GPIO Pinout ........................................................................................................................................ 53

4.4. QFP64 (Dimensions in mm) .................................................................................................................... 54

5.1. QFP64 PCB Land Pattern Dimensions (Dimensions in mm) .......................................................................... 56

5.2. QFP64 PCB Solder Mask Dimensions (Dimensions in mm) ........................................................................... 57

5.3. QFP64 PCB Stencil Design Dimensions (Dimensions in mm) ........................................................................ 58

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

67

...the world's most energy friendly microcontrollers

List of Equations

3.1. Total ACMP Active Current ..................................................................................................................... 40

3.2. VCMP Trigger Level as a Function of Level Setting ..................................................................................... 42

3.3. Total LCD Current Based on Operational Mode and Internal Boost ................................................................. 43

www.silabs.com

2015-03-06 - EFM32TG842FXX - d0072_Rev1.40

68


型号：	EFM32TG842
厂家：	SILICON
描述：	Configurable peripheral I/O locations
文件：	总69页 (文件大小：2263K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EFM32TG842 [SILICON]

相关型号：

EFM32TG842F16-QFP64

EFM32TG842F16-QFP64T

EFM32TG842F32-D-QFP64

EFM32TG842F32-QFP64

EFM32TG842F32-QFP64T

EFM32TG842F8-QFP64

EFM32TG842F8-QFP64T

EFM32WG

EFM32WG230

EFM32WG230F128-QFN64

EFM32WG230F256-QFN64

EFM32WG230F64-QFN64