SI3010-X-FSR [SILICON]

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SI3010-X-FSR
型号: SI3010-X-FSR
厂家: SILICON    SILICON
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Si3056  
Si3018/19/10  
GLOBAL SERIAL INTERFACE DIRECT ACCESS ARRANGEMENT  
Features  
Complete DAA includes the following:  
Programmable line interface  
Pulse dialing support  
Overload detection  
AC termination  
DC termination  
3.3 V power supply  
Ring detect threshold  
Ringer impedance  
Direct interface to DSPs  
Serial interface control for up to eight  
devices  
80 dB dynamic range TX/RX paths  
Integrated codec and 2- to 4-wire >5000 V isolation  
hybrid  
Proprietary isolation technology  
Parallel handset detection  
+3.2 dBm TX/RX level mode  
Programmable digital hybrid for near-  
end echo reduction  
Low-profile SOIC packages  
Lead-free/RoHS-compliant packages  
available  
Integrated ring detector  
Type I and II caller ID support  
Line voltage monitor  
Loop current monitor  
Polarity reversal detection  
Programmable digital gain  
Clock generation  
Ordering Information  
See page 88.  
Pin Assignments  
Si3056  
Applications  
MCLK  
FSYNC  
SCLK  
VD  
SDO  
SDI  
FC/RGDT  
RESET  
1
16  
OFHK  
RGDT/FSD/M1  
M0  
VA  
GND  
AOUT/INT  
C1A  
C2A  
2
3
4
5
6
15  
14  
13  
12  
11  
10  
9
V.92 modems  
Set-top boxes  
Internet appliances  
Personal digital  
assistants  
Voice mail systems Fax machines  
Multi-function printers  
Description  
7
8
The Si3056 is an integrated direct access arrangement (DAA) with a  
programmable line interface to meet global telephone line requirements. Available  
in two 16-pin small outline packages, it eliminates the need for an analog front end  
(AFE), isolation transformer, relays, opto-isolators, and a 2- to 4-wire hybrid. The  
Si3056 dramatically reduces the number of discrete components and cost  
required to achieve compliance with global regulatory requirements. The Si3056  
interfaces directly to standard modem DSPs.  
Si3018/19/10  
1
16  
15  
14  
13  
12  
11  
10  
9
DCT2  
IGND  
DCT3  
QB  
QE2  
SC  
QE  
DCT  
RX  
2
3
4
5
6
7
8
IB  
Functional Block Diagram  
C1B  
C2B  
VREG  
Si3056  
Si3018/19/10  
VREG2  
RNG2  
RNG1  
MCLK  
SCLK  
RX  
IB  
FSYNC  
Digital  
SC  
Interface  
SDI  
US Patent # 5,870,046  
US Patent # 6,061,009  
Other Patents Pending  
Hybrid and  
SDO  
FC/RGDT  
dc  
DCT  
Termination  
VREG  
VREG2  
DCT2  
DCT3  
Isolation  
Interface  
Isolation  
Interface  
RGDT/FSD/M1  
RNG1  
RNG2  
OFHK  
M0  
RESET  
Control  
Interface  
Ring Detect  
Off-Hook  
QB  
QE  
QE2  
AOUT/INT  
Rev. 1.05 6/05  
Copyright © 2005 by Silicon Laboratories  
Si3056  
Si3056  
Si3018/19/10  
2
Rev. 1.05  
Si3056  
Si3018/19/10  
TABLE OF CONTENTS  
Section  
Page  
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5  
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
4. AOUT PWM Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20  
5. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
5.1. Upgrading from the Si3034/35/44 to Si3056 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
5.2. Line-Side Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
5.3. Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
5.4. Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
5.5. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
5.6. Transmit/Receive Full Scale Level (Si3019 Line-Side Only) . . . . . . . . . . . . . . . . . . .25  
5.7. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
5.8. Line Voltage/Loop Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
5.9. Off-Hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
5.10. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
5.11. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
5.12. AC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
5.13. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
5.14. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
5.15. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
5.16. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
5.17. Pulse Dialing and Spark Quenching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
5.18. Billing Tone Protection and Receive Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
5.19. Billing Tone Filter (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
5.20. On-Hook Line Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
5.21. Caller ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
5.22. Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
5.23. Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
5.24. Filter Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36  
5.25. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36  
5.26. Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
5.27. Multiple Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
5.28. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
5.29. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
5.30. In-Circuit Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
5.31. Exception Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
5.32. Revision Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48  
Appendix—UL1950 3rd Edition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83  
7. Pin Descriptions: Si3056 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84  
8. Pin Descriptions: Si3018/19/10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86  
Rev. 1.05  
3
Si3056  
Si3018/19/10  
9. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88  
10. Evaluation Board Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89  
11. Package Outline: 16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90  
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91  
Silicon Laboratories Si3056 Support Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . .93  
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94  
4
Rev. 1.05  
Si3056  
Si3018/19/10  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions  
1
2
2
Parameter  
Symbol  
Test Condition  
Min  
Typ  
25  
Max  
70  
Unit  
°C  
Ambient Temperature  
Si3056 Supply Voltage, Digital  
Notes:  
T
F and K-Grade  
0
A
3
V
3.0  
3.3  
3.6  
V
D
1. The Si3056 specifications are guaranteed when the typical application circuit (including component tolerance) and the  
Si3056 and any Si3018 or Si3019 are used. See Figure 17 on page 18 for typical application schematic.  
2. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.  
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated.  
3. 3.3 V applies to both the digital and serial interface and the digital signals RGDT/FSD, OFHK, RESET, M0, and M.  
Rev. 1.05  
5
Si3056  
Si3018/19/10  
Table 2. Loop Characteristics  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C, see Figure 1)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DC Termination Voltage  
V
V
V
V
V
V
V
I = 20 mA, MINI = 11,  
6.0  
V
TR  
TR  
TR  
TR  
TR  
TR  
TR  
L
ILIM = 0, DCV = 00, DCR = 0  
DC Termination Voltage  
DC Termination Voltage  
DC Termination Voltage  
DC Termination Voltage  
DC Termination Voltage  
DC Termination Voltage  
I = 120 mA, MINI = 11,  
9
7.5  
V
V
V
V
V
V
L
ILIM = 0, DCV = 00, DCR = 0  
I = 20 mA, MINI = 00,  
9
L
ILIM = 0, DCV = 11, DCR = 0  
I = 120 mA, MINI = 00,  
L
ILIM = 0, DCV = 11, DCR = 0  
I = 20 mA, MINI = 00,  
40  
7.5  
L
ILIM = 1, DCV = 11, DCR = 0  
I = 60 mA, MINI = 00,  
L
ILIM = 1, DCV = 11, DCR = 0  
I = 50 mA, MINI = 00,  
40  
L
ILIM = 1, DCV = 11, DCR = 0  
On Hook Leakage Current  
Operating Loop Current  
Operating Loop Current  
DC Ring Current  
I
I
I
V
= –48 V  
TR  
10  
10  
5
120  
60  
3
µA  
mA  
mA  
µA  
LK  
LP  
LP  
MINI = 00, ILIM = 0  
MINI = 00, ILIM = 1  
1.5  
DC current flowing through ring  
detection circuitry  
Ring Detect Voltage*  
Ring Detect Voltage*  
Ring Frequency  
V
V
F
RT = 0  
RT = 1  
13.5  
19.35  
13  
15  
21.5  
16.5  
23.65  
68  
V
V
Hz  
RD  
RD  
rms  
rms  
R
Ringer Equivalence Number  
REN  
0.2  
*Note: The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected  
above the maximum.  
TIP  
+
600 Ω  
IL  
VTR  
Si3018  
10 µF  
RING  
Figure 1. Test Circuit for Loop Characteristics  
6
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 3. DC Characteristics, VD = 3.3 V  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C)  
Parameter  
Symbol  
Test Condition  
Min  
2.4  
Typ  
15  
9
Max  
Unit  
V
High Level Input Voltage  
Low Level Input Voltage  
High Level Output Voltage  
Low Level Output Voltage  
Input Leakage Current  
Power Supply Current, Digital  
V
IH  
V
0.8  
V
IL  
V
I = –2 mA  
2.4  
V
OH  
O
V
I = 2 mA  
0.35  
10  
V
OL  
O
I
–10  
µA  
mA  
mA  
mA  
L
D
D
D
1
I
I
I
V pin  
D
1
Total Supply Current, Sleep Mode  
PDN = 1, PDL = 0  
PDN = 1, PDL = 1  
1,2  
Total Supply Current, Deep Sleep  
1
Notes:  
1. All inputs at 0.4 or VD – 0.4 (CMOS levels). All inputs are held static except clock and all outputs unloaded  
(Static IOUT = 0 mA).  
2. RGDT is not functional in this state.  
Rev. 1.05  
7
Si3056  
Si3018/19/10  
Table 4. AC Characteristics  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C; see Figure 17 on page 18)  
Parameter  
Symbol  
Test Condition  
Fs = F /5120  
Min  
7.2  
Typ  
Max  
16  
Unit  
kHz  
MHz  
Hz  
1
Sample Rate  
Fs  
PLL2  
1
PLL Output Clock Frequency  
F
F
= (F x M)/N  
MCLK  
98.304  
PLL1  
PLL1  
Transmit Frequency Response  
Receive Frequency Response  
Low –3 dBFS Corner  
0
5
Low –3 dBFS Corner,  
FILT = 0  
Hz  
Receive Frequency Response  
Low –3 dBFS Corner,  
200  
Hz  
11  
FILT = 1  
2,3  
Transmit Full Scale Level  
V
FULL = 0 (0 dBm)  
1.1  
1.58  
2.16  
1.1  
V
FS  
FS  
PEAK  
PEAK  
PEAK  
PEAK  
PEAK  
11  
FULL = 1 (3.2 dBm)  
V
V
V
V
V
FULL2 = 1 (6.0 dBm)  
FULL = 0 (0 dBm)  
2,4  
Receive Full Scale Level  
V
11  
FULL = 1 (3.2 dBm)  
1.58  
2.16  
80  
FULL2 = 1 (6.0 dBm)  
PEAK  
5,6,7  
Dynamic Range  
DR  
DR  
ILIM = 0, DCV = 11, DCR = 0,  
dB  
I = 100 mA, MINI = 00  
L
5,6,7  
Dynamic Range  
ILIM = 0, DCV = 00, DCR = 0,  
80  
80  
dB  
dB  
dB  
dB  
I = 20 mA, MINI = 11  
L
5,6,7  
Dynamic Range  
DR  
ILIM = 1, DCV = 11, DCR = 0,  
I = 50 mA, MINI = 00  
L
Transmit Total Harmonic  
THD  
THD  
ILIM = 0, DCV = 11, DCR = 0,  
–72  
–78  
8,9  
Distortion  
I = 100 mA, MINI = 00  
L
Transmit Total Harmonic  
ILIM = 0, DCV = 00, DCR = 0,  
8,9  
Distortion  
I = 20 mA, MINI = 11  
L
Notes:  
1. See Figure 26 on page 37.  
2. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1.  
3. With FULL = 1, the transmit and receive full scale level of +3.2 dBm can be achieved with a 600 ac termination, while  
the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all  
reference impedances in “FULL” mode. With FULL2 = 1, the transmit and receive full scale level of +6.0 dBm can be  
achieved with a 600 ac termination. In “FULL2” mode, the DAA will transmit and receive +1.5 dBV into all reference  
impedances.  
4. Receive full scale level produces –0.9 dBFS at SDO.  
5. DR = 20 x log (RMS VFS/RMS VIN).+ 20 x log (RMS VIN/RMS noise). The RMS noise measurement excludes  
harmonics. VFS is the 0 dBm full-scale level.  
6. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz.  
7. When using the Si3010 line-side, the typical DR values will be approximately 10 dB lower.  
8. THD = 20 x log (RMS distortion/RMS signal). VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz.  
9. When using the Si3010 line-side, the typical THD values will be approximately 10 dB higher.  
10. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log(RMS VIN/RMS noise). VCID is the 6 V full-scale level for the typical  
application circuit in Figure 17. With the enhanced CID circuit, the VCID full-scale level is 1.5 V peak, and DRCID  
increases to 62 dB.  
11. Available on the Si3019 line-side device only.  
8
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 4. AC Characteristics (Continued)  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C; see Figure 17 on page 18)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Receive Total Harmonic  
THD  
ILIM = 0, DCV = 00, DCR = 0,  
–78  
dB  
8,9  
Distortion  
I = 20 mA, MINI = 11  
L
Receive Total Harmonic  
THD  
ILIM = 1, DCV = 11, DCR = 0,  
–78  
50  
dB  
dB  
8,9  
Distortion  
I = 50 mA, MINI = 00  
L
Dynamic Range (caller ID  
DR  
VIN = 1 kHz, –13 dBFS  
CID  
10,7  
mode)  
10  
Caller ID Full Scale Level  
AOUT Low Level Current  
AOUT High Level Current  
V
6
10  
10  
V
PEAK  
CID  
mA  
mA  
Notes:  
1. See Figure 26 on page 37.  
2. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1.  
3. With FULL = 1, the transmit and receive full scale level of +3.2 dBm can be achieved with a 600 ac termination, while  
the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all  
reference impedances in “FULL” mode. With FULL2 = 1, the transmit and receive full scale level of +6.0 dBm can be  
achieved with a 600 ac termination. In “FULL2” mode, the DAA will transmit and receive +1.5 dBV into all reference  
impedances.  
4. Receive full scale level produces –0.9 dBFS at SDO.  
5. DR = 20 x log (RMS VFS/RMS VIN).+ 20 x log (RMS VIN/RMS noise). The RMS noise measurement excludes  
harmonics. VFS is the 0 dBm full-scale level.  
6. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz.  
7. When using the Si3010 line-side, the typical DR values will be approximately 10 dB lower.  
8. THD = 20 x log (RMS distortion/RMS signal). VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz.  
9. When using the Si3010 line-side, the typical THD values will be approximately 10 dB higher.  
10. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log(RMS VIN/RMS noise). VCID is the 6 V full-scale level for the typical  
application circuit in Figure 17. With the enhanced CID circuit, the VCID full-scale level is 1.5 V peak, and DRCID  
increases to 62 dB.  
11. Available on the Si3019 line-side device only.  
Rev. 1.05  
9
Si3056  
Si3018/19/10  
Table 5. Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
–0.5 to 3.6  
±10  
Unit  
V
DC Supply Voltage  
V
D
Input Current, Si3056 Digital Input Pins  
Digital Input Voltage  
I
mA  
V
IN  
V
–0.3 to (V + 0.3)  
IND  
D
Operating Temperature Range  
Storage Temperature Range  
T
–40 to 100  
–65 to 150  
°C  
°C  
A
T
STG  
Note: Permanent device damage can occur if the above absolute maximum ratings are exceeded. Restrict functional  
operation to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum  
rating conditions for extended periods might affect device reliability.  
Table 6. Switching Characteristics—General Inputs  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF)  
1
Symbol  
Min  
Typ  
Max  
Unit  
Parameter  
Cycle Time, MCLK  
MCLK Duty Cycle  
MCLK Jitter Tolerance  
Rise Time, MCLK  
Fall Time, MCLK  
MCLK Before RESET ↑  
t
t
16.67  
40  
50  
1000  
60  
±2  
5
ns  
%
mc  
dty  
t
ns  
jitter  
t
ns  
r
t
5
ns  
f
t
10  
cycles  
ns  
mr  
2
RESET Pulse Width  
t
250  
20  
rl  
3
M0, M Before RESET↑  
t
ns  
mxr  
Notes:  
1. All timing (except Rise and Fall time) is referenced to the 50% level of the waveform. Input test levels are  
VIH = VD – 0.4 V, VIL = 0.4 V. Rise and fall times are referenced to the 20% and 80% levels of the waveform.  
2. The minimum RESET pulse width is the greater of 250 ns or 10 MCLK cycle times.  
3. M0 and M are typically connected to VD or GND and should not be changed during normal operation.  
tmc  
tr  
tf  
VIH  
VIL  
MCLK  
tmr  
RESET  
trl  
M0, M1  
tmxr  
Figure 2. General Inputs Timing Diagram  
10  
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 7. Switching Characteristics—Serial Interface (Master Mode, DCE = 0)  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF)  
Parameter  
Symbol  
Min  
244  
Typ  
Max  
Unit  
ns  
%
Cycle time, SCLK  
t
1/256 Fs  
c
SCLK Duty Cycle  
t
50  
dty  
Delay Time, SCLKto FSYNC↓  
Delay Time, SCLKto SDO Valid  
Delay Time, SCLKto FSYNC↑  
Setup Time, SDI Before SCLK ↓  
Hold Time, SDI After SCLK ↓  
Setup Time, FCBefore SCLK↑  
Hold time, FCAfter SCLK↑  
t
20  
20  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
d1  
d2  
d3  
t
t
t
25  
20  
40  
40  
su  
t
h
t
sfc  
hfc  
t
Note: All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V.  
tc  
VOH  
VOL  
SCLK  
td1  
td3  
FSYNC  
(mode 0)  
td3  
FSYNC  
(mode 1)  
td2  
16-Bit  
SDO  
D15  
D14  
D14  
D1  
D1  
D0
D0  
tsu  
th  
16-Bit  
SDI  
D15  
tsfc  
thfc  
FC  
Figure 3. Serial Interface Timing Diagram (DCE = 0)  
Rev. 1.05  
11  
Si3056  
Si3018/19/10  
Table 8. Switching Characteristics—Serial Interface (Master Mode, DCE = 1, FSD = 0)  
(VA = Charge Pump, VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF)  
1,2  
Symbol  
Min  
Typ  
Max  
Unit  
Parameter  
Cycle Time, SCLK  
SCLK Duty Cycle  
t
244  
25  
20  
1/256 Fs  
20  
20  
20  
20  
20  
20  
ns  
%
c
t
50  
dty  
Delay Time, SCLKto FSYNC↑  
Delay Time, SCLKto FSYNC↓  
Delay Time, SCLKto SDO valid  
Delay Time, SCLKto SDO Hi-Z  
Delay Time, SCLKto FSD↓  
Delay Time, SCLKto FSD↑  
Setup Time, SDO Before SCLK↓  
Hold Time, SDO After SCLK↓  
Notes:  
t
t
t
t
t
t
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
d1  
d2  
d3  
d4  
d5  
d6  
t
su  
t
h
1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V.  
2. See "5.27.Multiple Device Support" on page 38 for functional details.  
32 SCLKs  
16 SCLKs  
16 SCLKs  
tc  
SCLK  
td1  
td2  
td2  
FSYNC  
(mode 1)  
td2  
td6  
td2  
FSYNC  
(mode 0)  
td3  
tsu  
D15  
th  
td4  
SDO  
(master)  
D14  
D13  
D0  
td3  
SDO  
D15  
(slave 1)  
td5  
FSYNC  
(Mode 0)  
td5  
FSYNC  
(Mode 1)  
tsu  
th  
D14  
SDI  
D15  
D13  
D0  
Figure 4. Serial Interface Timing Diagram (DCE = 1, FSD = 0)  
12  
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 9. Switching Characteristics—Serial Interface (Master Mode, DCE = 1, FSD = 1)  
(VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF)  
1, 2  
Symbol  
Min  
Typ  
Max  
Unit  
Parameter  
Cycle Time, SCLK  
t
244  
1/256 Fs  
20  
20  
20  
20  
20  
ns  
%
c
SCLK Duty Cycle  
t
50  
dty  
Delay Time, SCLKto FSYNC↑  
Delay Time, SCLKto FSYNC↓  
Delay Time, SCLKto SDO Valid  
Delay Time, SCLKto SDO Hi-Z  
Delay Time, SCLKto FSD↓  
Setup Time, SDO Before SCLK↓  
Hold Time, SDO After SCLK↓  
Notes:  
t
ns  
ns  
ns  
ns  
ns  
ns  
ns  
d1  
d2  
d3  
d4  
d5  
t
t
t
t
t
25  
20  
su  
t
h
1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V.  
2. See "5.27.Multiple Device Support" on page 38 for functional details.  
tc  
SCLK  
td1  
td2  
FSYNC  
(mode 1)  
td3  
tsu  
th  
td4  
SDO  
D15  
D14  
D13  
D0  
(master)  
td3  
SDO  
D15  
td5  
(slave 1)  
FSD  
SDI  
tsu  
th  
D14  
D15  
D1  
D0  
Figure 5. Serial Interface Timing Diagram (DCE = 1, FSD = 1)  
Rev. 1.05  
13  
Si3056  
Si3018/19/10  
Table 10. Switching Characteristics—Serial Interface (Slave Mode, DCE = 1, FSD = 1)  
(VA = Charge Pump, VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF)  
Symbol  
Min  
Typ  
Max  
Unit  
Parameter  
Cycle Time, MCLK  
t
244  
1/256 Fs  
20  
20  
20  
20  
20  
20  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
c
Setup Time, FSYNCbefore MCLK*  
Delay Time, FSYNCafter MCLK*  
Setup Time, SDI before MCLK↓  
Hold Time, SDI After MCLK↓  
Delay Time, MCLKto SDO  
Delay Time, MCLKto FSYNC↑  
Delay Time, MCLKto FSYNC↓  
t
t
su1  
t
d1  
su3  
t
h2  
d3  
d1  
d2  
t
t
t
*Note: Tsu1 and Th1 are listed for applications where the controller drives the MCLK and FSYNC instead of a master DAA.  
tC  
MCLK  
tSU1  
td1  
td1  
th1  
FSYNC  
(mode 1)  
td2  
FSYNC  
(mode 0)  
th2  
tsu3  
D15  
D15  
D14  
D0  
D0  
SDI  
td3  
SDO  
D14  
Figure 6. Serial Interface Timing Diagram (Slave Mode, DCE = 1, FSD = 1)  
14  
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 11. Digital FIR Filter Characteristics—Transmit and Receive  
(VD = 3.0 to 3.6 V, Sample Rate = 8 kHz, TA = 0 to 70 °C)  
Parameter  
Symbol  
Min  
0
Typ  
Max  
3.3  
3.6  
0.1  
Unit  
kHz  
kHz  
dB  
Passband (0.1 dB)  
Passband (3 dB)  
Passband Ripple Peak-to-Peak  
Stopband  
F
(0.1 dB)  
F
0
(3 dB)  
–0.1  
4.4  
kHz  
dB  
Stopband Attenuation  
Group Delay  
–74  
t
12/Fs  
s
gd  
Note: Typical FIR filter characteristics for Fs = 8000 Hz are shown in Figures 7, 8, 9, and 10.  
Table 12. Digital IIR Filter Characteristics—Transmit and Receive  
(VD = 3.0 to 3.6 V, Sample Rate = 8 kHz, TA = 0 to 70 °C)  
Parameter  
Symbol  
Min  
0
Typ  
Max  
3.6  
0.2  
Unit  
kHz  
dB  
Passband (3 dB)  
Passband Ripple Peak-to-Peak  
Stopband  
F
(3 dB)  
–0.2  
4.4  
kHz  
dB  
Stopband Attenuation  
Group Delay  
–40  
t
1.6/Fs  
s
gd  
Note: Typical IIR filter characteristics for Fs = 8000 Hz are shown in Figures 11, 12, 13, and 14. Figures 15 and 16 show  
group delay versus input frequency.  
Rev. 1.05  
15  
Si3056  
Si3018/19/10  
Figure 7. FIR Receive Filter Response  
Figure 9. FIR Transmit Filter Response  
Figure 8. FIR Receive Filter Passband Ripple  
Figure 10. FIR Transmit Filter Passband Ripple  
For Figures 7–10, all filter plots apply to a sample rate of Fs = 8 kHz.  
16  
Rev. 1.05  
Si3056  
Si3018/19/10  
Figure 11. IIR Receive Filter Response  
Figure 12. IIR Receive Filter Passband Ripple  
Figure 13. IIR Transmit Filter Response  
Figure 14. IIR Transmit Filter Passband Ripple  
Figure 15. IIR Receive Group Delay  
Figure 16. IIR Transmit Group Delay  
Rev. 1.05  
17  
Si3056  
Si3018/19/10  
2. Typical Application Schematic  
18  
Rev. 1.05  
Si3056  
Si3018/19/10  
3. Bill of Materials  
Component(s)  
Value  
Supplier(s)  
33 pF, Y2, X7R, ±20%  
Panasonic, Murata, Vishay  
C1, C2  
C31  
C4  
10 nF, 250 V, X7R, ±10%  
1.0 uF, 50 V, Elec/Tant, ±20%  
0.1 uF, 16V, X7R, ±20%  
Venkel, SMEC  
Panasonic  
C5, C6, C50, C51  
C7  
Venkel, SMEC  
2.7 nF, 50V, X7R, 20%  
680 pF, Y2, X7R, ±10%  
Venkel, SMEC  
C8, C9  
C10  
Panasonic, Murata, Vishay  
0.01 uF, 16 V, X7R, ±20%  
Not installed, 120 pF, 250V, X7R, ±10%  
Venkel, SMEC  
C30, C313  
D1, D22  
FB1, FB2  
Q1, Q3  
Q2  
Venkel, SMEC  
Dual Diode, 225 mA, 300 V, CMPD2004S  
Ferrite Bead, BLM18AG601SN1B  
NPN, 300 V, MMBTA42  
Central Semiconductor  
Murata  
OnSemi, Fairchild  
PNP, 300 V, MMBTA92  
OnSemi, Fairchild  
Q4, Q5  
RV1  
NPN, 80 V, 330 mW, MMBT2484  
Sidactor, 275 V, 100 A  
OnSemi, Fairchild  
Teccor, Protek, ST Micro  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
1.07 kohm, 1/2 W, 1%  
R1  
150 ohm, 1/16 W, 5%  
R2  
R3  
3.65 kohm, 1/2 W, 1%  
R4  
2.49 kohm, 1/2 W, 1%  
R5, R6  
R7, R83  
R9  
100 kohm, 1/16 W, 5%  
20 Mohm, 1/16 W, 5%  
1 Mohm, 1/16 W, 1%  
536 ohm, 1/4 W, 1%  
73.2 ohm, 1/2 W, 1%  
56.2 ohm, 1/16 W, 1%  
R10  
R11  
R12, R13  
R15, R164  
R30, R323  
0 ohm, 1/16 W  
Not installed, 15 Mohm,, 1/8 W, 5%  
Not installed, 5.1 Mohm,, 1/8 W, 5%  
4.7 kohm,, 1/10 W, 5%  
Si3056  
Si3018/19/10  
Zener Diode, 43 V, 1/2 W, ZMM43  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Venkel, SMEC, Panasonic  
Silicon Labs  
Silicon Labs  
General Semiconductor  
R31, R333  
R51, R52  
U1  
U2  
Z1  
1. Value for C3 above is recommended for use with the Si3018. In voice appliations, a C3 value of 3.9 nF (250 V,  
X7R, 20%) is recommended to improve return loss performance  
2. Several diode bridge configurations are acceptable, parts such as a single DF-04S or four 1N4004 diodes may be  
used (suppliers include General Semiconductor, Diodes Inc., etc.)  
3. C30-31 and R30-33 can be substitued for R7-8 to implent the enhanced caller ID circuit.  
4. Murata BLM18AG601SN1B may be substituted for R15-R16 (0 ohm) to decrease emissions.  
Rev. 1.05  
19  
Si3056  
Si3018/19/10  
4. AOUT PWM Output  
Figure 18 illustrates an optional circuit to support the pulse width modulation (PWM) output capability of the Si3056  
for call progress monitoring purposes. Set the PWME bit (Register 1, bit 3) to enable this mode.  
+5 VA  
LS1  
Q6  
NPN  
R41  
AOUT  
C41  
Figure 18. AOUT PWM Circuit for Call Progress  
Table 13. Component Values—AOUT PWM  
Component  
LS1  
Value  
Supplier  
Intervox  
Speaker BRT1209PF-06  
NPN KSP13  
Q6  
Fairchild  
C41  
0.1 µF, 16 V, X7R, ±20%  
150 Ω, 1/16 W, ±5%  
Venkel, SMEC  
Venkel, SMEC, Panasonic  
R41  
Registers 20 and 21 allow the receive and transmit paths to be attenuated linearly. When these registers are set to  
all 0s, the receive and transmit paths are muted. These registers affect the call progress output only and do not  
affect transmit and receive operations on the telephone line.  
The PWMM[1:0] bits (Register 1, bits 5:4) select one of the three different PWM output modes for the AOUT signal,  
including a delta-sigma data stream, a conventional 32 kHz return to zero PWM output, and balanced 32 kHz PWM  
output.  
20  
Rev. 1.05  
Si3056  
Si3018/19/10  
New features have been added to the Si3056  
including more ac terminations, a programmable  
hybrid, finer gain/attenuation step resolution, finer  
resolution loop current monitoring capability, ring  
validation, more HW interrupts, a 200 Hz low  
frequency filter pole. (See the appropriate functional  
descriptions.)  
5. Functional Description  
The Si3056 is an integrated direct access arrangement  
(DAA) that provides a programmable line interface to  
meet global telephone line interface requirements. The  
®
Si3056 implements Silicon Laboratories patented  
isolation technology and offers the highest level of  
integration by replacing an analog front end (AFE), an  
isolation transformer, relays, opto-isolators, and a 2- to  
4-wire hybrid with two 16-pin packages.  
The secondary communication data format (see  
"5.26.Digital Interface" on page 37).  
The low-power sleep mode, and system  
requirements to support wake-on-ring. (See  
"5.28.Power Management" on page 39.)  
The Si3056 DAA is software programmable to meet  
global requirements and is compliant with FCC, TBR21,  
JATE, and other country-specific PTT specifications as  
shown in Table 16 on page 26. In addition, the Si3056  
meets the most stringent worldwide requirements for  
out-of-band energy, emissions, immunity, high-voltage  
surges, and safety, including FCC Part 15 and 68,  
EN55022, EN55024, and many other standards.  
5.2. Line-Side Device Support  
Three different line-side devices can be used with the  
Si3056 system-side device:  
Globally-compliant line-side device—Targets global  
DAA requirements. Use the Si3018 global line-side  
device for this configuration. This line-side device  
supports both FCC-compliant countries and non-  
FCC-compliant countries.  
Globally-compliant, enhanced features line-side  
device—Targets embedded and voice applications  
with global DAA requirements. Use the Si3019 line-  
side device for this configuration. The Si3019  
contains all the features available on the Si3018,  
plus the following additional features/enhancements:  
5.1. Upgrading from the Si3034/35/44 to  
Si3056  
The Si3056 offers Silicon Laboratories customers  
®
currently using Si3034/35/44 standard serial interface  
DAA chipsets with an upgrade path for use in new  
designs. The Si3056 digital interface is similar to the  
Si3034/35/44 DAAs, thus the Si3056 retains the ability  
to connect to many widely available DSPs. This also  
allows customers to leverage software developed for  
existing Si3034/35/44 designs. More importantly, the  
Si3056 also offers a number of new features not  
provided in the Si3034/35/44 DAAs. An overview of the  
feature differences between the Si3044 and the Si3056  
is presented in Table 14. Finally, the globally-compliant  
Si3056 can be implemented with roughly half the  
external components required in the already highly  
integrated Si3034/35/44 DAA application circuits. The  
following items have changed in the Si3056 as  
compared to the Si3034/35/44 DAAs:  
Sixteen selectable ac terminations to increase return  
loss and trans-hybrid loss performance.  
Higher transmit and receive level mode.  
Selectable 200 Hz low frequency pole.  
16 to 13.5 dB digital gain/attenuation adjustment in  
0.1 dB increments for the transmit and receive paths.  
Programmable line current/voltage threshold interrupt.  
Globally-compliant, low-speed only line-side  
device—Targets embedded 2400 bps soft modem  
applications. Use the Si3010 line-side device for this  
configuration. The Si3010 contains all the features  
available on the Si3018, except the transmit and  
receive paths are optimized and tested only for  
modem connect rates up to 2400 bps.  
The pinout, the application circuit, and the bill of  
materials. The Si3056 is not pin compatible with  
Si3034/35/44 DAA chipsets.  
Rev. 1.05  
21  
Si3056  
Si3018/19/10  
Table 14. New Si3056 Features  
Chipset  
Si3044  
Si3021  
Si3056  
System-Side Part #  
Line-Side Part #  
Si3015  
Yes  
Si3010  
Yes  
Si3018  
Yes  
Si3019  
Yes  
Global DAA  
Digital Interface  
SSI  
SSI  
SSI  
SSI  
Power Supply  
3.3 V or 5 V  
56 kbps  
16-bit  
3.3 V  
3.3 V  
3.3 V  
Max Modem Connect Rate  
Data Bus Width  
2400 bps  
16-bit  
56 kbps  
16-bit  
56 kbps  
16-bit  
Control Register Addressing  
Max Sampling Frequency  
AC Terminations  
6-bit  
8-bit  
8-bit  
8-bit  
11.025 kHz  
2
16 kHz  
4
16 kHz  
4
16 kHz  
16  
Programmable Gain  
Loop Current Monitoring  
Line Voltage Monitoring  
Polarity Reversal Detection  
Line I/V Threshold Detection  
Ring Qualification  
Wake-on-Ring Support  
HW Interrupts  
3 dB steps  
3 mA/bit  
2.75 V per bit  
3 dB steps  
1.1 mA/bit  
1 V per bit  
3 dB steps  
1.1 mA/bit  
1 V per bit  
0.1 dB steps  
1.1 mA/bit  
1 V per bit  
Yes (SW polling) Yes (HW interrupt) Yes (HW interrupt) Yes (HW interrupt)  
No  
No  
No  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
Yes (MCLK active) Yes (MCLK active) Yes (MCLK active)  
Ring detect only  
Yes  
7 HW interrupts  
Yes  
7 HW interrupts  
Yes  
8 HW interrupts  
Yes  
Integrated Fixed Analog  
Hybrid  
Programmable Digital Hybrid  
No  
Yes  
Yes  
Yes  
Full Scale Transmit/Receive  
Level  
+3.2 dBm  
0 dBm  
0 dBm  
+3.2 dBm  
22  
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 15. Country Specific Register Settings  
2
3
Register  
Country  
16  
OHS  
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
31  
OHS2  
0
0
1
1
1
0
1
0
0
0
0
1
1
1
1
0
1
0
1
1
1
1
0
0
1
1
0
0
1
1
1
16  
RZ  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
16  
RT  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
26  
ILIM  
0
0
1
1
1
0
1
0
0
0
0
1
1
1
1
0
1
0
1
1
1
1
0
0
1
1
0
0
1
1
1
26  
26  
30  
16  
DCV[1:0] MINI[1:0] ACIM[3:0]  
ACT  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
ACT2  
0
1
1
1
1
0
1
0
0
0
0
1
1
1
1
0
1
0
1
1
1
1
0
0
1
1
0
0
1
1
1
0
0
0
0
1
Argentina  
11  
01  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
01  
01  
11  
11  
11  
00  
01  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
01  
01  
00  
00  
00  
0000  
0011  
0010  
0010  
0010  
0000  
0011  
0000  
0000  
0000/1010  
0000  
0010  
0010  
0010  
0010  
0000  
0010  
0000  
0010  
0010  
0010  
0010  
0000  
0000  
0010  
0010  
0000  
0000  
0010  
0010  
0010  
0000  
0000  
0000  
0000  
0010  
4
Australia  
Austria  
Bahrain  
Belgium  
Brazil  
Bulgaria  
Canada  
Chile  
5
China  
Colombia  
Croatia  
Cyprus  
Czech Republic  
Denmark  
Ecuador  
Egypt  
El Salvador  
Finland  
France  
Germany  
Greece  
Guam  
Hong Kong  
Hungary  
Iceland  
India  
Indonesia  
Ireland  
Israel  
Italy  
Japan  
Jordan  
Kazakhstan  
Kuwait  
Latvia  
Note:  
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1. Supported for loop current 20 mA.  
2. Available with Si3019 line-side only.  
3. Available with Si3018 and Si3010 line-sides only.  
4. See "5.11.DC Termination" on page 27 for DCV and MINI settings.  
5. ACIM is 0000 for data applications and 1010 for voice applications.  
6. For South Korea, set the TB3 bit in conjunction with the RZ bit. (See Register 59 description.)  
Rev. 1.05  
23  
Si3056  
Si3018/19/10  
Table 15. Country Specific Register Settings (Continued)  
2
3
Register  
Country  
16  
OHS  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
31  
OHS2  
1
1
0
0
1
0
1
1
0
1
1
0
0
0
0
1
1
1
0
0
0
1
1
0
0
1
1
1
0
0
0
16  
RZ  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
16  
RT  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
26  
ILIM  
1
1
0
0
1
0
1
1
0
1
1
0
0
0
0
1
1
1
0
0
0
1
1
0
0
1
1
1
0
1
0
26  
26  
30  
16  
DCV[1:0] MINI[1:0] ACIM[3:0]  
ACT  
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
ACT2  
1
1
0
0
1
0
1
1
1
1
1
0
0
0
0
1
1
1
0
0
0
1
1
0
0
1
1
1
0
1
0
0
1
0
0
Lebanon  
11  
11  
11  
01  
11  
11  
11  
11  
11  
11  
11  
01  
01  
11  
01  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
01  
11  
11  
11  
11  
00  
00  
00  
01  
00  
00  
00  
00  
00  
00  
00  
01  
01  
00  
01  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
01  
00  
00  
00  
00  
0010  
0010  
0000  
0000  
0010  
0000  
0010  
0010  
0100  
0010  
0010  
0000  
0000  
0000  
0000  
0010  
0010  
0010  
0000  
0000  
0000  
0010  
0010  
0011  
0000  
0010  
0010  
0010  
0000  
0010  
0000  
0000  
0101  
0000  
0000  
Luxembourg  
Macao  
1
Malaysia  
Malta  
Mexico  
Morocco  
Netherlands  
New Zealand  
Nigeria  
Norway  
Oman  
Pakistan  
Peru  
Philippines  
Poland  
Portugal  
Romania  
Russia  
Saudi Arabia  
Singapore  
Slovakia  
Slovenia  
South Africa  
6
South Korea  
Spain  
Sweden  
Switzerland  
Taiwan  
TBR21  
Thailand  
UAE  
United Kingdom  
USA  
Yemen  
Note:  
0
0
0
0
0
1
0
0
0
1
0
0
1. Supported for loop current 20 mA.  
2. Available with Si3019 line-side only.  
3. Available with Si3018 and Si3010 line-sides only.  
4. See "5.11.DC Termination" on page 27 for DCV and MINI settings.  
5. ACIM is 0000 for data applications and 1010 for voice applications.  
6. For South Korea, set the TB3 bit in conjunction with the RZ bit. (See Register 59 description.)  
24  
Rev. 1.05  
Si3056  
Si3018/19/10  
The capacitive communications link is disabled by  
default. To enable it, the PDL bit (Register 6, bit 4) must  
be cleared. No communication between the system-  
side and line-side can occur until this bit is cleared. The  
clock generator must be programmed to an acceptable  
sample rate before clearing the PDL bit.  
5.3. Power Supplies  
The Si3056 system-side device operates from a 3.0–  
3.6 V power supply. The Si3056 input pins are 5 V  
tolerant. The Si3056 output pins only drive 3.3 V. The  
line-side device derives its power from two sources: The  
Si3056 and the telephone line. The Si3056 supplies  
power over the patented isolation link between the two  
devices, allowing the line-side device to communicate  
with the Si3056 while on-hook and perform other on-  
hook functions such as line voltage monitoring. When  
off-hook, the line-side device also derives power from  
the line current supplied from the telephone line. This  
5.6. Transmit/Receive Full Scale Level  
(Si3019 Line-Side Only)  
The Si3056 supports programmable maximum transmit  
and receive levels. The default signal level supported by  
the Si3056 is 0 dBm into a 600 load. Two additional  
modes of operation offer increased transmit and receive  
level capability to enable use of the DAA in applications  
that require higher signal levels. The full scale mode is  
enabled by setting the FULL bit in Register 31. With  
FULL = 1, the full scale signal level increases to  
+3.2 dBm into a 600 load, or 1 dBV into all reference  
impedances. The enhanced full scale mode (or 2X full  
scale) is enabled by setting the FULL2 bit in Register  
30. Will FULL2 = 1, the full scale signal level increases  
to +6.0 dBm into a 600 load, or 1.5 dBV into all  
reference impedances. The full scale and enhanced full  
scale modes provide the ability to trade off TX power  
and TX distortion for a peak signal. By using the  
programmable digital gain registers in conjunction with  
the enhanced full scale signal level mode, a specific  
power level (+3.2 dBm for example) could be achieved  
across all ACT settings.  
®
feature is exclusive to DAAs from Silicon Laboratories  
and allows the most cost-effective implementation for a  
DAA while still maintaining robust performance over all  
line conditions.  
5.4. Initialization  
When the Si3056 is powered up, assert the RESET pin.  
When the RESET pin is deasserted, the registers have  
default values. This reset condition guarantees the line-  
side device is powered down without the possibility of  
loading the line (i.e., off-hook). An example initialization  
procedure is outlined in the following list:  
1. Program the PLL with registers 8 and 9 (N[7:0],  
M[7:0]) to the appropriate divider ratios for the  
supplied MCLK frequency and the sample rate in  
register 7 (SRC), as defined in "5.25.Clock  
Generation" on page 36.  
5.7. Parallel Handset Detection  
2. Wait 1 ms until the PLL is locked.  
The Si3056 can detect a parallel handset going off-  
hook. When the Si3056 is off-hook, the loop current can  
be monitored with the LCS bits. A significant drop in  
loop current signals that a parallel handset is going off-  
hook. If a parallel handset causes the LCS bits to read  
all 0s, the Drop-Out Detect (DOD) bit can be checked to  
verify a valid line exists.  
3. Write a 00H into Register 6 to power up the line-side  
device.  
4. Set the required line interface parameters (i.e.,  
DCV[1:0], MINI[1:0], ILIM, DCR, ACT and ACT2 or  
ACIM[3:0], OHS, RT, RZ, ATX[2:0] or TGA2 and  
TXG2) as defined by “Country Specific Register  
Settings” shown in Table 15.  
The LVS bits can be read to determine the line voltage  
when on-hook and off-hook. Significant drops in line  
voltage can signal a parallel handset. For the Si3056 to  
operate in parallel with another handset, the parallel  
handset must have a sufficiently high dc termination to  
support two off-hook DAAs on the same line. Improved  
parallel handset operation can be achieved by changing  
the dc impedance from 50 to 800 and reducing the  
DCT pin voltage with the DVC[1:0] bits.  
When this procedure is complete, the Si3056 is ready  
for ring detection and off-hook.  
5.5. Isolation Barrier  
The Si3056 achieves an isolation barrier through low-  
cost, high-voltage capacitors in conjunction with Silicon  
®
Laboratories proprietary signal processing techniques.  
These techniques eliminate signal degradation from  
capacitor mismatches, common mode interference, or  
noise coupling. As shown in Figure 17 on page 18, the  
C1, C2, C8, and C9 capacitors isolate the Si3056  
(system-side) from the line-side device. Transmit,  
receive, control, ring detect, and caller ID data are  
passed across this barrier. Y2 class capacitors can be  
used to achieve surge performance of 5 kV or greater.  
5.8. Line Voltage/Loop Current Sensing  
The Si3056 can measure loop current and line voltage  
with the Si3010, Si3018, and the Si3019 line-side  
devices. The 8-bit LCS2[7:0] and LCS[4:0] registers  
report loop current. The 8-bit LVS[7:0] register reports  
line voltage.  
Rev. 1.05  
25  
Si3056  
Si3018/19/10  
These registers can help determine the following:  
detection of another phone going off-hook by monitoring  
the dc loop current. The LCS bits are decoded from  
LCS2; so, both are available at the same time. The line  
current sense transfer function is shown in Figure 19  
and detailed in Table 16. The LCS and LCS2 bits report  
loop current down to the minimum operating loop  
current for the DAA. Below this threshold, the reported  
value of loop current is unpredictable.  
When on-hook, detect if a line is connected.  
When on-hook, detect if a parallel phone is off-hook.  
When off-hook, detect if a parallel phone goes on or  
off-hook.  
Detect if enough loop current is available to operate.  
When used in conjunction with the OPD bit, detect if  
an overcurrent condition exists. (See "5.22.Overload  
Detection" on page 35.)  
Table 16. Loop Current Transfer Function  
5.8.1. Line Voltage Measurement  
LCS[4:0]  
Condition  
The Si3056 device reports line voltage with the LVS[7:0]  
bits (Register 29) in both on- and off-hook states with a  
resolution of 1 V per bit. The accuracy of these bits is  
approximately ±10%. Bits 0 through 6 of this register  
indicate the value of the line voltage in 2s compliment  
format. Bit 7 of this register indicates the polarity of the  
tip/ring voltage.  
If the INTE bit (Register 2) and the POLM bit (Register  
3) are set, a hardware interrupt is generated on the  
AOUT/INT pin when bit 7 of the LVS register changes  
00000  
Insufficient line current for normal  
operation. Use the DOD bit (Register 19,  
bit 1) to determine if a line is connected.  
00100  
11111  
Minimum line current for normal operation.  
Loop current is greater than 127 mA. An  
overcurrent situation may exist.  
5.9. Off-Hook  
state. The edge-triggered interrupt is cleared by writing The communication system generates an off-hook  
0 to the POLI bit (Register 4). The POLI bit is set each command by applying a logic 0 to the OFHK pin or by  
time bit 7 of the LVS register changes state and must be setting the OH bit (Register 5, bit 0).The OFHK pin must  
written to 0 to clear it.  
be enabled by setting the OHE bit (Register 5, bit 1).  
The polarity of the OFHK pin is selected by the OPOL  
bit (Register 5, bit 4). With OFHK asserted, the system  
is in an off-hook state.  
The default state of the LVS register forces the LVS bits  
to 0 when the line voltage is 3 V or less. The LVFD bit  
(Register 31, bit 0) disables the force-to-zero function  
and allows the LVS register to display non-zero values The off-hook state seizes the line for incoming/outgoing  
of 3 V and below. This register might display calls and also can be used for pulse dialing. With OFHK  
unpredictable values at line voltages between 0 to 2 V. deasserted, negligible dc current flows through the  
At 0 V, the LVS register displays all 0s.  
5.8.2. Loop Current Measurement  
When the Si3056 is off-hook, the LCS2[7:0] and  
LCS[4:0] bits measure loop current in 1.1 mA/bit and  
3.3 mA/bit resolution respectively. These bits enable  
hookswitch. When the OFHK pin is asserted, the  
hookswitch transistor pair, Q1 and Q2, turn on. This  
applies a termination impedance across TIP and RING  
and causes dc loop current to flow. The termination  
impedance has an ac and dc component.  
Possible Overload  
30  
25  
20  
LCS  
BITS  
15  
10  
5
0
0
3.3 6.6 9.9 13.2 16.5 19.8 23.1 26.4 29.7 33 36.3 39.6 42.9 46.2 49.5 52.8  
59.1 62.7  
69.3 72.6 75.9  
79.2 82.5 85.8 89.1 92.4 95.7 99 102.3  
Loop 5C6.u1 rrent (m6A6)  
127  
Figure 19. Typical Loop Current LCS Transfer Function  
26  
Rev. 1.05  
Si3056  
Si3018/19/10  
Several events occur in the DAA when the OFHK pin is Registers 43 and 44 contain the line current/voltage  
asserted or the OH bit is set. There is a 250 µs latency threshold interrupt. This interrupt will trigger when either  
to allow the off-hook command to be communicated to the measured line voltage or current in the LVS or LCS2  
the line-side device. Once the line-side device goes off- registers, as selected by the CVS bit (Register 44, bit 2),  
hook, an off-hook counter forces a delay for line crosses the threshold programmed into the CVT[7:0]  
transients to settle before transmission or reception bits. An interrupt can be programmed to occur when the  
occurs. This off-hook counter time is controlled by the measured value rises above or falls below the  
FOH[1:0] bits (Register 31, bits 6:5). The default setting threshold. Only the magnitude of the measured value is  
for the off-hook counter time is 128 ms, but can be used to compare to the threshold programmed into the  
adjusted up to 512 ms or down to either 64 or 8 ms.  
CVT[7:0] bits, and thus only positive numbers should be  
used as a threshold. This line current/voltage threshold  
interrupt is only available with the Si3019 line-side  
device.  
After the off-hook counter has expired, a resistor  
calibration is performed for 17 ms. This allows circuitry  
internal to the DAA to adjust to the exact conditions  
present at the time of going off-hook. This resistor  
calibration can be disabled by setting the RCALD bit  
(Register 25, bit 5).  
5.11. DC Termination  
The DAA has programmable settings for dc impedance,  
minimum operational loop current, and TIP/RING  
voltage. The dc impedance of the DAA is normally  
represented with a 50 slope as shown in Figure 20,  
but can be changed to an 800 slope by setting the  
DCR bit. This higher dc termination presents a higher  
resistance to the line as loop current increases.  
.
After the resistor calibration is performed, an ADC  
calibration is performed for 256 ms. This calibration  
helps to remove offset in the A/D sampling the  
telephone line. This ADC calibration can be disabled by  
setting the CALD bit (Register 17, bit 5). See  
“5.29.Calibration” on page 39. for more information on  
automatic and manual calibration.  
®
FCC DCT Mode  
12  
Silicon Laboratories recommends that the resistor and  
the ADC calibrations not be disabled except when a fast  
response is needed after going off-hook, such as when  
responding to a Type II caller-ID signal. See “5.21.Caller  
ID” on page 32.  
11  
10  
9
To calculate the total time required to go off-hook and  
start transmission or reception, the digital filter delay  
(typically 1.5 ms with the FIR filter) should be included  
in the calculation.  
8
7
5.10. Interrupts  
6
The AOUT/INT pin can be used as a hardware interrupt  
pin by setting the INTE bit (Register 2, bit 7). When this  
bit is set, the call progress output function (AOUT) is not  
available. The default state of this interrupt output pin is  
active low, but active high operation can be enabled by  
setting the INTP bit (Register 2, bit 6). This pin is an  
open-drain output when the INTE bit is set, and requires  
a 4.7 kpullup or pulldown for correct operation. If  
multiple INT pins are connected to a single input, the  
combined pullup or pulldown resistance should equal  
4.7 k. Bits 7–2, and 0 in Register 3 and bit 1 in  
Register 44 can be set to enable hardware interrupt  
sources. When one or more of these bits are set, the  
AOUT/INT pin becomes active and stays active until the  
interrupts are serviced. If more than one hardware  
interrupt is enabled in Register 3, software polling  
determines the cause of the interrupts. Register 4 and  
bit 3 of Register 44 contain sticky interrupt flag bits.  
Clear these bits after being set to service the interrupt.  
.01 .02 .03 .04 .05 .06 .07 .08 .09 .1 .11  
Loop Current (A)  
Figure 20. FCC Mode I/V Characteristics,  
DCV[1:0] = 11, MINI[1:0] = 00, ILIM = 0  
For applications that require current limiting per the  
TBR21 standard, the ILIM bit can be set to select this  
mode. In the current limiting mode, the dc I/V curve is  
changed to a 2000 slope above 40 mA, as shown in  
Figure 21. The DAA operates with a 50 V, 230 feed,  
which is the maximum line feed specified in the TBR21  
standard.  
Rev. 1.05  
27  
Si3056  
Si3018/19/10  
Table 17. AC Termination Settings for the Si3010  
and Si3018 Line-Side Devices  
TBR21 DCT Mode  
45  
40  
35  
30  
25  
20  
15  
10  
5
ACT ACT2  
AC Termination  
0
0
Real, nominal 600 termination that sat-  
isfies the impedance requirements of  
FCC part 68, JATE, and other countries.  
1
0
0
1
Complex impedance that satisfies global  
impedance requirements.  
Complex impedance that satisfies global  
impedance requirements EXCEPT New  
Zealand. Achieves higher return loss for  
countries requiring complex ac termina-  
tion. [220 + (820 || 120 nF) and  
220 + (820 || 115 nF)]  
.015 .02 .025 .03 .035 .04 .045 .05 .055 .06  
Loop Current (A)  
Figure 21. TBR21 Mode I/V Characteristics,  
DCV[1:0] = 11, MINI[1:0] = 00, ILIM = 1  
The MINI[1:0] bits select the minimum operational loop  
current for the DAA, and the DCV[1:0] bits adjust the  
DCT pin voltage, which affects the TIP/RING voltage of  
the DAA. These bits permit important trade-offs for the  
system designer. Increasing the TIP/RING voltage  
provides more signal headroom, while decreasing the  
TIP/RING voltage allows compliance to PTT standards  
in low-voltage countries such as Japan. Increasing the  
minimum operational loop current above 10 mA also  
increases signal headroom and prevents degradation of  
the signal level in low-voltage countries.  
Finally, Australia has separate dc termination  
requirements for line seizure versus line hold. Japan  
mode may be used to satisfy both requirements.  
However, if a higher transmit level for modem operation  
is desired, switch to FCC mode 500 ms after the initial  
off-hook. This satisfies the Australian dc termination  
requirements.  
1
1
Complex impedance for use in New  
Zealand. [370 + (620 || 310 nF)]  
Table 18. AC Termination Settings for the  
Si3019 Line-Side Device  
ACIM[3:0]  
0000  
AC Termination  
600 Ω  
900 Ω  
0001  
0010  
270 + (750 || 150 nF) and 275 Ω  
+ (780 || 150 nF)  
0011  
220 + (820 || 120 nF) and  
220 + (820 || 115 nF)  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
370 + (620 || 310 nF)  
320 + (1050 || 230 nF)  
370 + (820 || 110 nF)  
275 + (780 || 115 nF)  
120 + (820 || 110 nF)  
350 + (1000 || 210 nF)  
200 + (680 || 100 nF)  
600 + 2.16 µF  
5.12. AC Termination  
The Si3056 has four ac termination impedances with  
the Si3018 line-side device and sixteen ac termination  
impedances with the Si3019 line-side device. The ACT  
and ACT2 bits select the ac impedance on the Si3018  
line-side device. The ACIM[3:0] bits select the ac  
impedance on the Si3019. The available ac termination  
settings are listed for the line-side devices in Tables 17  
and 18.  
The most widely used ac terminations are available as  
register options to satisfy various global PTT  
requirements. The real 600 impedance satisfies the  
requirements of FCC part 68, JATE, and many other  
countries. The 270 + (750 || 150 nF) satisfies the  
requirements of TBR21 (ACT = 0, ACT = 1, or ACIM  
[3:0] = 0010).  
900 + 1 µF  
900 + 2.16 µF  
600 + 1 µF  
Global complex impedance  
28  
Rev. 1.05  
Si3056  
Si3018/19/10  
There are two selections that are useful for satisfying setting the RPOL bit (Register 14, bit 1). This pin is a  
non-standard ac termination requirements. The 350 + standard CMOS output. If multiple RGDT pins are  
(1000 || 210 nF) impedance selection is the ANSI/ connected to a single input, the combined pullup or  
EIA/TIA 464 compromise impedance network for trunks. pulldown resistance should equal 4.7 kΩ.  
The last ac termination selection, ACIM[3:0] = 1111, is  
designed to satisfy minimum return loss requirements  
for every country in the world that requires a complex  
termination. For any of the ac termination settings, the  
programmable hybrid can be used to further reduce  
near-end echo. See “5.13.Transhybrid Balance” for  
more details.  
When the RFWE bit is 0, the RGDT pin is asserted  
when the ring signal is positive, which results in an  
output signal frequency equal to the actual ring  
frequency. When the RFWE bit is 1, the RGDT pin is  
asserted when the ring signal is positive or negative.  
The output then appears to be twice the frequency of  
the ring waveform.  
The second method to monitor ring detection uses the  
ring detect bits (RDTP, RDTN, and RDT). The RDTP  
and RDTN behavior is based on the RNG1-RNG2  
voltage. When the signal on RNG1-RNG2 is above the  
positive ring threshold, the RDTP bit is set. When the  
signal on RNG1-RNG2 is below the negative ring  
threshold, the RDTN bit is set. When the signal on  
RNG1-RNG2 is between these thresholds, neither bit is  
set.  
The RDT behavior is also based on the RNG1-RNG2  
voltage. When the RFWE bit is 0, a positive ring signal  
sets the RDT bit for a period of time. When the RFWE  
bit is 1, a positive or negative ring signal sets the RDT  
bit.  
5.13. Transhybrid Balance  
The Si3056 contains an on-chip analog hybrid that  
performs the 2- to 4-wire conversion and near-end echo  
cancellation. This hybrid circuit is adjusted for each ac  
termination setting selected.  
The Si3056 also offers a digital filter stage for additional  
near-end echo cancellation. For each ac termination  
setting selected, the eight programmable hybrid  
registers (Registers 45-52) can be programmed with  
coefficients to provide increased cancellation of real-  
world line anomalies. This digital filter can produce  
10 dB or greater of near-end echo cancellation in  
addition to the echo cancellation provided by the analog  
hybrid circuitry.  
The RDT bit acts like a one shot. When a new ring  
signal is detected, the one shot is reset. If no new ring  
signals are detected prior to the one shot counter  
reaching 0, then the RDT bit clears. The length of this  
count is approximately 5 seconds. The RDT bit is reset  
5.14. Ring Detection  
The ring signal is resistively coupled from TIP and RING  
to the RNG1 and RNG2 pins. The Si3056 supports  
either full- or half-wave ring detection. With full-wave  
ring detection, the designer can detect a polarity  
reversal of the ring signal. See “5.21.Caller ID” on  
page 32. The ring detection threshold is programmable  
with the RT bit (Register 16, bit 0). The ring detector  
output can be monitored in three ways. The first method  
uses the RGDT pin. The second method uses the  
register bits, RDTP, RDTN, and RDT (Register 5). The  
final method uses the DTX output.  
to  
0 by an off-hook event. If the RDTM bit  
(Register 3, bit 7) is set, a hardware interrupt occurs on  
the AOUT/INT pin when RDT is triggered. This interrupt  
can be cleared by writing to the RDTI bit  
(Register 4, bit 7). When the RDI bit (Register 2, bit 2) is  
set, an interrupt occurs on both the beginning and end  
of the ring pulse. Ring validation may be enabled when  
using the RDI bit.  
The third method to monitor detection uses the DTX  
data samples to transmit ring data. If the  
communications link is active (PDL = 0) and the device  
is not off-hook or in on-hook line monitor mode, the ring  
data is presented on DTX. The waveform on DTX  
depends on the state of the RFWE bit.  
The ring detector mode is controlled by the RFWE bit  
(Register 18, bit 1). When the RFWE bit is 0 (default  
mode), the ring detector operates in half-wave rectifier  
mode. In this mode, only positive ring signals are  
detected. A positive ring signal is defined as a voltage  
greater than the ring threshold across RNG1-RNG2.  
Conversely, a negative ring signal is defined as a When RFWE is 0, DTX is –32768 (0x8000) while the  
voltage less than the negative ring threshold across RNG1-RNG2 voltage is between the thresholds. When  
RNG1-RNG2. When the RFWE bit is 1, the ring detector a ring is detected, DTX transitions to +32767 when the  
operates in full-wave rectifier mode. In this mode, both ring signal is positive, then goes back to –32768 when  
positive and negative ring signals are detected.  
the ring is near 0 and negative. Thus a near square  
wave is presented on DTX that swings from –32768 to  
+32767 in cadence with the ring signal.  
The first method to monitor ring detection output uses  
the RGDT pin. When the RGDT pin is used, it defaults  
to active low, but can be changed to active high by When RFWE is 1, DTX sits at approximately +1228  
Rev. 1.05  
29  
Si3056  
Si3018/19/10  
while the RNG1-RNG2 voltage is between the Delay period between when the ring signal is  
thresholds. When the ring becomes positive, DTX  
transitions to +32767. When the ring signal goes near 0,  
DTX remains near 1228. As the ring becomes negative,  
the DTX transitions to –32768. This repeats in cadence  
with the ring signal.  
validated and when a valid ring signal is indicated to  
accommodate distinctive ringing.  
The RNGV bit (Register 24, bit 7) enables or disables  
the ring validation feature in normal operating mode and  
low-power sleep mode.  
To observe the ring signal on DTX, watch the MSB of  
the data. The MSB toggles at the same frequency as  
the ring signal independent of the ring detector mode.  
This method is adequate for determining the ring  
frequency.  
Ring validation affects the behavior of the RDT status  
bit, the RDTI interrupt, the INT pin, and the RGDT pin.  
1. When ring validation is enabled, the status bit seen  
in the RDT read-only bit (r5.2), represents the  
detected envelope of the ring. The ring validation  
parameters are configurable so that this envelope  
may remain high throughout a distinctive-ring  
sequence.  
2. The RDTI interrupt fires when a validated ring  
occurs. If RDI is zero (default), the interrupt occurs  
on the rising edge of RDT. If RDI is set, the interrupt  
occurs on both rising and falling edges of RDT.  
5.15. Ring Validation  
This feature prevents false triggering of a ring detection  
by validating the ring frequency. Invalid signals, such as  
a line voltage change when a parallel handset goes off-  
hook, pulse dialing, or a high-voltage line test are  
ignored. Ring validation can be enabled during normal  
operation and in low power sleep mode. The external  
MCLK signal is required in low power sleep mode for  
ring validation.  
3. The INT pin follows the RDTI bit with configurable  
polarity.  
The RGDT pin can be configured to follow the ringing  
signal envelope detected by the ring validation circuit by  
setting RFWE to 0. If RFWE is set to 1, the RGDT pin  
follows an unqualified ring detect one-shot signal  
initiated by a ring-threshold crossing and terminated by  
a fixed counter timeout of approximately 5 seconds.  
(This information is shown in Register 18).  
The ring validation circuit operates by calculating the  
time between alternating crossings of positive and  
negative ring thresholds to validate that the ring  
frequency is within tolerance. High and low frequency  
tolerances are programmable in the RAS[5:0] and  
RMX[5:0] fields. The RCC[2:0] bits define how long the  
ring signal must be within tolerance.  
Once the duration of the ring frequency is validated by  
the RCC bits, the circuitry stops checking for frequency  
tolerance and begins checking for the end of the ring  
signal, which is defined by a lack of additional threshold  
crossings for a period of time configured by the  
RTO[3:0] bits. When the ring frequency is first validated,  
a timer defined by the RDLY[2:0] bits is started. If the  
RDLY[2:0] timer expires before the ring timeout, then  
the ring is validated and a valid ring is indicated. If the  
ring timeout expires before the RDLY[2:0] timer, a valid  
ring is not indicated.  
5.16. Ringer Impedance and Threshold  
The ring detector in many DAAs is ac coupled to the line  
with a large 1 µF, 250 V decoupling capacitor. The ring  
detector on the Si3056 is resistively coupled to the line.  
This produces a high ringer impedance to the line of  
approximately 20 Mto meet the majority of country  
PTT specifications, including FCC and TBR21.  
Several countries including Poland, and South Africa,  
may require a maximum ringer impedance that can be  
met with an internally synthesized impedance by setting  
the RZ bit (Register 16, bit 1).  
Ring validation requires five parameters:  
Some countries also specify ringer thresholds  
differently. The RT bit (Register 16, bit 0) selects  
between two different ringer thresholds: 15 V ±10% and  
21.5 V ±10%. These two settings satisfy ringer  
threshold requirements worldwide. The thresholds are  
set so that a ring signal is guaranteed to not be detected  
below the minimum, and a ring signal is guaranteed to  
be detected above the maximum.  
Timeout parameter to place a lower limit on the  
frequency of the ring signal on the RAS[5:0] bits  
(Register 24). This is measured by calculating the  
time between crossings of positive and negative ring  
thresholds.  
Minimum count to place an upper limit on the  
frequency on the RMX[5:0] bits (Register 22).  
Time interval over which the ring signal must be the  
correct frequency on the RCC[2:0] bits (Register 23).  
Timeout period that defines when the ring pulse has  
ended based on the most recent ring threshold  
crossing.  
30  
Rev. 1.05  
Si3056  
Si3018/19/10  
enough to excessively reduce the line-derived power  
5.17. Pulse Dialing and Spark Quenching  
supply of the line-side device.  
Pulse dialing results from going off- and on-hook to  
generate make and break pulses. The nominal rate is  
10 pulses per second. Some countries have strict  
specifications for pulse fidelity that include make and  
break times, make resistance, and rise and fall times. In  
a traditional solid-state dc holding circuit, there are  
many problems in meeting these requirements.  
The OVL bit (Register 19) can be polled following a  
billing tone detection. The OVL bit indicates that the  
billing tone has passed when it returns to 0. The BTD  
and ROV bits are sticky, and must be written to 0 to be  
reset. After the billing tone passes, the DAA initiates an  
auto-calibration sequence that must complete before  
data can be transmitted or received.  
Certain line events, such as an off-hook event on a  
parallel phone or a polarity reversal, can trigger the ROV  
or the BTD bits. Look for multiple events before  
qualifying if billing tones are present. After the billing  
tone passes, the DAA initiates an auto-calibration  
sequence that must complete before data can be  
transmitted or received.  
Although the DAA remains off-hook during a billing tone  
event, the received data from the line is corrupted when  
a large billing tone occurs. If the user wishes to receive  
data through a billing tone, an external LC filter must be  
added. A manufacturer can provide this filter to users in  
the form of a dongle that connects on the phone line  
before the DAA. This prevents the manufacturer from  
having to include a costly LC filter to support multiple  
countries and customers.  
The Si3056 dc holding circuit actively controls the on-  
hook and off-hook transients to maintain pulse dialing  
fidelity.  
Spark quenching requirements in countries such as  
Italy, the Netherlands, South Africa, and Australia deal  
with the on-hook transition during pulse dialing. These  
tests provide an inductive dc feed resulting in a large  
voltage spike. This spike is caused by the line  
inductance and the sudden decrease in current through  
the loop when going on-hook. The traditional solution to  
the problem is to put a parallel resistive capacitor (RC)  
shunt across the hookswitch relay. However, the  
capacitor required is large (~1 µF, 250 V) and relatively  
expensive. In the Si3056, loop current can be controlled  
to achieve three distinct on-hook speeds to pass spark  
quenching tests without additional BOM components.  
Through settings of four bits in three registers, OHS  
(Register 16), OHS2 (Register 31), SQ1 and SQ0 Alternatively, when a billing tone is detected, the system  
(Register 59), a slow ramp down of loop current can be software notifies the user that a billing tone has  
achieved which induces a delay between the time OH occurred. Notification prompts the user to contact the  
bit is cleared and the time the DAA actually goes on- telephone company to disable billing tones or to  
hook.  
purchase an external LC filter.  
Disturbance on the line other than billing tones can also  
cause a receive overload. Some conditions may result in  
a loop current collapse to a level below the minimum  
required operating current of the DAA. When this occurs,  
the dropout detect bit (DOD) is set, and an interrupt will  
be generated if the dropout detect interrupt mask bit  
(DODM) is set.  
To ensure proper operation of the DAA during pulse  
dialing, disable the automatic resistor calibration that is  
performed each time the DAA enters the off-hook state  
by setting the RCALD bit (Register 25, bit 5).  
5.18. Billing Tone Protection and Receive  
Overload  
“Billing tones” or “metering pulses” generated by the  
Central Office can cause modem connection difficulties.  
The billing tone is typically either a 12 or 16 kHz signal  
and is sometimes used in Germany, Switzerland, and  
South Africa. Depending on line conditions, the billing  
tone might be large enough to cause major errors in the  
line data. The Si3056 chipset can provide feedback  
indicating the beginning and end of a billing tone.  
5.19. Billing Tone Filter (Optional)  
To operate without degradation during billing tones in  
Germany, Switzerland, and South Africa, requires an  
external LC notch filter. The Si3056 can remain off-hook  
during a billing tone event, but line data is lost in the  
presence of large billing tone signals. The notch filter  
design requires two notches, one at 12 kHz and one at  
16 kHz. Because these components are expensive and  
few countries utilize billing tones, this filter is typically  
placed in an external dongle or added as a population  
option for these countries. Figure 22 shows an example  
billing tone filter.  
Billing tone detection is enabled with the BTE bit  
(Register 17, bit 2). Billing tones less than 1.1 V  
on  
PK  
the line are filtered out by the low pass digital filter on  
the Si3056. The ROV bit is set when a line signal is  
greater than 1.1 V , indicating a receive overload  
PK  
condition. The BTD bit is set when a billing tone is large  
Rev. 1.05  
31  
Si3056  
Si3018/19/10  
5.21. Caller ID  
C1  
C2  
The Si3056 can pass caller ID data from the phone line  
to a caller ID decoder connected to the serial port.  
5.21.1. Type I Caller ID  
Type I Caller ID sends the CID data while the phone is  
L1  
on-hook.  
TIP  
In systems where the caller ID data is passed on the  
phone line between the first and second rings, utilize the  
following method to capture the caller ID data:  
1. After identifying a ring signal using one of the  
methods described in "5.14.Ring Detection" on page  
29, determine when the first ring is complete.  
To  
From  
Line  
L2  
C3  
DAA  
RING  
2. Assert the ONHM bit (Register 5, bit 3) to enable  
caller ID data detection. The caller ID data passed  
across the RNG 1/2 pins is presented to the host via  
the SDO pin.  
Figure 22. Billing Tone Filter  
L1 must carry the entire loop current. The series  
resistance of the inductors is important to achieve a  
narrow and deep notch. This design has more than  
25 dB of attenuation at both 12 kHz and 16 kHz.  
3. Clear the ONHM bit after the caller ID data is  
received.  
In systems where the caller ID data is preceded by a  
line polarity (battery) reversal, use the following method  
to capture the caller ID data:  
Table 19. Component Values—Optional Billing  
Tone Filters  
1. Enable full wave rectified ring detection (RFWE,  
Symbol  
C1,C2  
C3  
Value  
Register 18, bit 1).  
0.027 µF, 50 V, ±10%  
2. Monitor the RDTP and RDTN register bits (or the  
POLI bit) to identify whether a polarity reversal or  
ring signal has occurred. A polarity reversal trips  
either the RDTP or RDTN ring detection bits, and  
thus the full-wave ring detector must be used to  
distinguish a polarity reversal from a ring. The lowest  
specified ring frequency is 15 Hz; therefore, if a  
battery reversal occurs, the DSP should wait a  
minimum of 40 ms to verify that the event observed  
is a battery reversal and not a ring signal. This time  
is greater than half the period of the longest ring  
signal. If another edge is detected during this 40 ms  
pause, this event is characterized as a ring signal  
and not a battery reversal.  
0.01 µF, 250 V, ±10%  
L1  
3.3 mH, >120 mA, <10 , ±10%  
10 mH, >40 mA, <10 , ±10%  
L2  
The billing tone filter affects the ac termination and  
return loss. The global complex ac termination  
(ACIM = 1111) passes global return loss specifications  
with and without the billing tone filter by at least 3 dB.  
5.20. On-Hook Line Monitor  
The on-hook line monitor mode allows the Si3056 to  
receive line activity when in an on-hook state. A low-  
power ADC located on the line-side device digitizes the  
signal passed across the RNG1/2 pins and then sends  
the signal digitally across the communications link to the  
host. This mode is typically used to detect caller ID data  
and is enabled by setting the ONHM bit (Register 5,  
bit 3). Caller ID data can be gained up or attenuated  
using the receive gain control bits in registers 39 and  
41.  
3. Assert the ONHM bit (Register 5, bit 3) to enable the  
caller ID data detection. The caller ID data passed  
across the RNG 1/2 pins is presented to the host via  
the SDO pin.  
4. Clear the ONHM bit after the caller ID data is  
received.  
5.21.2. Type II Caller ID  
Type II Caller ID sends the CID data while the phone is  
off-hook and is often referred to as caller ID/call waiting  
(CID/CW). To receive the CID data while off-hook, use  
the following procedure (see Figure 23):  
1. The Caller Alert Signal (CAS) tone is sent from the  
Central Office (CO) and is digitized along with the  
32  
Rev. 1.05  
Si3056  
Si3018/19/10  
line data. The host processor must detect the  
presence of this tone.  
2. The DAA must then check for another parallel device  
on the same line. This is accomplished by briefly  
going on-hook, measuring the line voltage, and then  
returning to an off-hook state.  
f. Set the OH bit to 1 (or drive the OFHK pin to the  
active state) to return to an off-hook state. After  
returning to an off-hook state and waiting 8 ms  
for the off-hook counter, normal data  
transmission and reception can proceed. If a  
non-compliant parallel device is present, then a  
reply tone is not sent by the host tone generator  
and the CO does not proceed with sending the  
CID data. If all devices on the line are Type II CID  
compliant, then the host must mute its upstream  
data output to avoid propagation of its reply tone  
and the subsequent CID data. After muting its  
upstream data output, the host processor should  
then return an acknowledgement (ACK) tone to  
the CO to request the transmission of the CID  
data.  
a. Set the CALD bit (Register 17, bit 5) to disable  
the calibration that automatically occurs when  
going off-hook.  
b. Set the RCALD bit (Register 25, bit 5) to disable  
the resistor calibration from occurring when  
going off-hook.  
c. Set the FOH[1:0] bits (Register 31, bits 6:5) to 11  
to reduce the off-hook counter time to 8 ms.  
d. Clear the OH bit (or drive the OFHK pin to the  
inactive state) to put the DAA in an on-hook  
state. The RXM bit (Register 19, bit 3) may also  
be set to mute the receive path.  
3. The CO then responds with the CID data and the  
host processor unmutes the upstream data output  
and continues with normal operation.  
e. Read the LVS bits to determine the state of the  
4. The muting of the upstream data path by the host  
processor mutes the handset in a telephone  
application so the user cannot hear the  
line.  
If the LVS bits read the typical on-hook line  
voltage, then no parallel devices are active on  
the line and CID data reception can be  
continued.  
acknowledgement tone and CID data being sent.  
5. The CALD and RCALD bits can be cleared to re-  
enable the automatic calibration when going off-  
hook. The FOH[1:0] bits also can be programmed to  
01 to restore the default off-hook counter time.  
Because of the nature of the low-power ADC, the data  
presented on SDO could have up to a 10% dc offset.  
The caller ID decoder must either use a high pass or a  
band pass filter to accurately retrieve the caller ID data.  
If the LVS bits read well below the typical on-  
hook line voltage, then one or more devices are  
present and active on the same line that are not  
compliant with Type II CID. Do not continue CID  
data reception.  
Rev. 1.05  
33  
Si3056  
Si3018/19/10  
2
3
4
1
Off-Hook Counter  
and Calibration  
(402.75 ms nominally)  
CAS Tone  
Received  
LINE  
Off-Hook Counter  
(8 ms)  
On-Hook  
Off-Hook  
On-Hook  
Off-Hook  
Ack  
FOH[1] Bit  
FOH[0] Bit  
RCALD Bit  
CALD Bit  
OH Bit6  
Notes:  
1. The off-hook counter and calibrations prevent transmission or reception of data for 402.75 ms (default) for the line  
voltage to settle.  
2. The caller alert signal (CAS) tone transmits from the CO to signal an incoming call.  
3. The device is taken on-hook to read the line voltage in the LVS bits to detect parallel handsets. In this mode, no data  
is transmitted on the SDO pin.  
4. When the device returns off-hook, the normal off-hook counter is reduced to 8 ms. If the CALD and RCALD bits are  
set, then the automatic calibrations are not performed.  
5. After allowing the off-hook counter to expire (8 ms), normal transmission and reception can continue. If CID data  
reception is required, send the appropriate signal to the CO at this time.  
6. This example uses the OH bit to put the Si3056 into an off-hook state. The OFHK pin can also be used to accomplish  
this. To use the OFHK pin instead of the OH bit, simply enable the OHE bit (Register 5, bit 1) and drive the OFHK pin  
low during the preceding sequence. This has the same effect as setting the OH bit.  
Figure 23. Implementing Type II Caller ID on the Si3056  
34  
Rev. 1.05  
Si3056  
Si3018/19/10  
5.22. Overload Detection  
5.23. Gain Control  
The Si3056 can be programmed to detect an overload The Si3056 supports different gain and attenuation  
condition that exceeds the normal operating power settings depending on the line-side device being used.  
range of the DAA circuit. To use the overload detection For both devices, gains of 0, 3, 6, 9, and 12 dB can be  
feature, the following steps should be followed:  
selected for the receive path with the ARX[2:0] bits. The  
receive path can also be muted with the RXM bit.  
Attenuations of 0, 3, 6, 9, and 12 dB can also be  
selected for the transmit path with the ATX[2:0] bits. The  
transmit path also can be muted with the TXM bit  
(Register 15).  
When using the Si3019 line-side device, the Si3056  
provides even more flexible gain and attenuation  
settings. The TXG2 and RXG2 bits (registers 38–39)  
enable gain or attenuation in 1 dB increments up to  
15 dB for the transmit and receive paths. The TGA2 and  
RGA2 bits select either gain or attenuation for these  
registers. The TXG3 and RXG3 bits (registers 40–41)  
enable gain or attenuation in 0.1 dB increments up to  
1.5 dB for the transmit and receive paths. The TGA3  
and RGA3 bits select either gain or attenuation for these  
registers. These additional gain/attenuation registers  
are active only when the ARX[2:0] and ATX[2:0] bits are  
set to all 0s.  
1. Set the OH bit (Register 5, bit 0) to go off-hook, and  
wait 25 ms to allow line transients to settle.  
2. Enable overload detection by then setting the OPE  
bit high (Register 17, bit 3).  
If the DAA then senses an overload situation, it  
automatically presents an 800 impedance to the line  
to reduce the hookswitch current. At this time, the DAA  
also sets the OPD bit (Register 19, bit 0) to indicate that  
an overload condition exists. The line current detector  
within the DAA has a threshold that is dependant upon  
the ILIM bit (Register 26). When ILIM = 0, the overload  
detection threshold equals 160 mA. When ILIM = 1, the  
overload detection threshold equals 60 mA. The OPE  
bit should always be cleared before going off-hook.  
DAC  
ACT  
TX  
Analog  
Hybrid  
To  
Link  
CO  
Si3056  
ADC  
Figure 24. Line-Side Device Signal Flow Diagram  
IIRE  
TXG3  
TXG2  
Digital  
TXA2  
SDI  
TXA3  
Filter  
1 dB  
Attenuation  
Steps  
1 dB  
Gain  
0.1 dB  
Gain/ATT  
Steps  
Steps  
To  
Digital  
Hybrid  
Line-side  
Device  
Link  
0.1 dB  
1 dB  
1 dB  
Gain  
Gain/ATT  
Steps  
Attenuation  
Steps  
Steps  
IIRE  
Digital  
Filter  
RXG3  
RXA3  
RXG2  
RXA2  
SDO  
Figure 25. Si3056 Signal Flow Diagram  
Rev. 1.05  
35  
Si3056  
Si3018/19/10  
N (Register 8) and M (Register 9) are 8-bit unsigned  
values. F is the frequency of the clock provided to  
5.24. Filter Selection  
MCLK  
the MCLK pin.  
The Si3056 supports additional filter selections for the  
receive and transmit signals as defined in Table 11 and  
Table 12 on page 15. The IIRE bit (Register 16, bit 4)  
selects between the IIR and FIR filters. The IIR filter  
Table 20 lists several standard crystal oscillator rates  
that can be supplied to MCLK. This list represents a  
sample of MCLK frequency choices. Many others are  
possible.  
provides  
a
shorter, but non-linear, group delay  
alternative to the default FIR filter and only operates  
with an 8 kHz sample rate. Also, on the Si3019 line-side After PLL1 is programmed, the SRC[3:0] bits can  
device, the FILT bit (Register 31, bit 1) selects a –3 dB achieve the standard modem sampling rates with a  
low frequency pole of 5 Hz when cleared and 200 Hz single write to Register 7. See "Register 7.Sample Rate  
when set. The FILT bit affects the receive path only.  
Control" on page 54.  
When programming the registers of the clock generator,  
the order of register writes is important. For PLL1  
updates, N (Register 8, bits 7:0) must be written first,  
then immediately followed by a write to M (Register 9,  
bits 7:0).  
The values shown in Table 20 satisfy the preceding  
equation. However, when programming the registers for  
N and M, the value placed in these registers must be  
one less than the value calculated from the equations.  
For example, with an MCLK of 46.08 MHz, the values  
placed in the N and M registers are 0x0Dh and 0x1Fh,  
respectively.  
5.25. Clock Generation  
The Si3056 has an on-chip clock generator. Using a  
single MCLK input frequency, the Si3056 generates all  
the desired standard modem sample rates.  
The clock generator consists of two phase-locked loops  
(PLL1 and PLL2) that achieve the desired sample  
frequencies. Figure 26 illustrates the clock generator.  
The architecture of the dual PLL scheme provides fast  
lock time on initial start-up, fast lock time when  
changing modem sample rates, high noise immunity,  
and can change modem sample rates with a single  
register write. Many MCLK frequencies between  
1 and 60 MHz are supported. MCLK should be from a  
clean source, preferably directly from a crystal with a  
constant frequency and no dropped pulses.  
In serial mode 2 (refer to the “5.26.Digital Interface”  
section), the Si3056 operates as a slave device. The  
clock generator is configured based on the SRC register  
to generate the required internal clock frequencies. In  
this mode, PLL2 is powered-down. For further details of  
slave mode operation, see "5.27.Multiple Device  
Support" on page 38.  
Table 20. MCLK Examples  
MCLK (MHz)  
1.8432  
N
3
1
M
160  
24  
16  
12  
32  
256  
80  
8
4.0960  
6.1440  
8.1920  
9.2160  
1
1
3
10.3680  
11.0592  
12.288  
27  
9
5.25.1. Programming the Clock Generator  
As shown in Figure 26, PLL1 must output a clock equal  
to 98.304 MHz (F  
). The F  
is determined by  
BASE  
BASE  
1
programming the following registers:  
14.7456  
18.4320  
24.5760  
25.8048  
44.2368  
46.0800  
47.9232  
56.0000  
3
3
20  
16  
4
80  
20  
32  
80  
36  
Register 8: PLL1 N[7:0] divider.  
Register 9: PLL1 M[7:0] divider.  
The main design consideration is the generation of a  
base frequency, defined as follows:  
1
21  
9
F
MCLK × M  
----------------------------  
F
=
= 98.304 MHz  
BASE  
N
15  
39  
35  
36  
Rev. 1.05  
Si3056  
Si3018/19/10  
5.25.2. PLL Lock Times  
for the required initial sample rate, typically 7200 Hz.  
Rate changes are made by writing to SRC[3:0]  
(Register 7, bits 3:0).  
The Si3056 changes sample rates quickly. However,  
lock time varies based on the programming of the clock  
generator. The following relationships describe the The final design consideration for the clock generator is  
boundaries on PLL locking time:  
the update rate of PLL1. The following criteria must be  
satisfied for the PLLs to remain stable:  
PLL1 lock time < 1 ms  
PLL2 lock time 100 µs to 1 ms  
®
F
For  
modem  
designs,  
Silicon  
Laboratories  
MCLK  
-------------------  
F
=
144 kHz  
UP1  
recommends that PLL1 be programmed during  
initialization. No further programming of PLL1 is  
necessary. The SRC[3:0] register can be programmed  
N
where F  
is shown in Figure 26.  
UP1  
1
0
SCLK  
FUP1  
98.304 MHz  
MCLK  
DIV  
PLL1  
DIV  
3
32.768 MHz  
DIV  
N2  
PLL2  
DIV  
16  
8-bit  
DIV  
M2  
DIV  
8-bit  
Slave  
0
1
0
1
N1  
M1  
Decoder  
Decoder  
SRATE  
Figure 26. Update Rate of PLL1  
In serial mode 0 or 1, the Si3056 operates as a master,  
where the master clock (MCLK) is an input, the serial  
data clock (SCLK) is an output, and the frame sync  
signal (FSYNC) is an output. The MCLK frequency and  
the value of the sample rate control registers 7, 8, and 9  
determine the sample rate (Fs). The serial port clock,  
SCLK, runs at 256 bits per frame, where the frame rate  
is equivalent to the sample rate. See "5.25.Clock  
Generation" on page 36 for details on programming  
sample rates.  
5.26. Digital Interface  
The Si3056 has two serial interface modes that support  
most standard modem DSPs. The M0 and M1 mode  
pins select the interface mode. The key difference  
between these two serial modes is the operation of the  
FSYNC signal. Table 21 summarizes the serial mode  
definitions.  
Table 21. Serial Modes  
The Si3056 transfers 16- or 15-bit telephony data in the  
primary timeslot and 16-bit control data in the secondary  
timeslot. Figures 27 and 28 show the relative timing of  
the serial frames. Primary frames occur at the frame  
rate and are always present. To minimize overhead in  
the external DSP, secondary frames are present only  
when requested.  
Mode M1 M0  
Description  
FSYNC frames data  
0
1
2
3
0 0  
0 1  
1 0  
1 1  
FSYNC pulse starts data frame  
Slave mode  
Reserved  
Two methods exist for requesting a secondary frame to  
transfer control information. The default powerup mode  
The digital interface consists of a single, synchronous uses the LSB of the 16-bit transmit (TX) data word as a  
serial link that communicates both telephony and flag to request a secondary transfer. Only 15-bit TX data  
control data.  
is transferred, which results in a small loss of SNR but  
Rev. 1.05  
37  
Si3056  
Si3018/19/10  
provides software control of the secondary frames. As frame communication must be requested via software in  
an alternative method, the FC pin can serve as a the LSB of the transmit (TX) data word.  
hardware flag for requesting a secondary frame. The  
external DSP can turn on the 16-bit TX mode by setting  
the SB bit (Register 1, bit 0). In the 16-bit TX mode, the  
hardware FC pin must be used to request secondary  
transfers.  
Bits 7:5 (NSLV2:NSLV0) set the number of slaves to be  
supported on the serial bus. For each slave, the Si3056  
generates an FSYNC to the DSP. In daisy-chain mode,  
the polarity of the ring signal can be controlled by bit 1  
(RPOL). When RPOL = 1, the ring detect signal (now an  
Figures 29 and 30 illustrate the secondary frame read output on the FC/RGDT pin) is active high.  
cycle and write cycle, respectively. During a read cycle,  
the R/W bit is high and the 7-bit address field contains  
the address of the register to be read. The contents of  
the 8-bit control register are placed on the SDO signal.  
During a write cycle, the R/W bit is low and the 7-bit  
address field contains the address of the register to be  
written. The 8-bit data to be written immediately follows  
the address on SDI. Only one register can be read or  
written during each secondary frame. See "6.Control  
Registers" on page 48 for the register addresses and  
functions.  
The Si3056 supports a variety of codecs and additional  
Si3056s. The type of slave codec(s) used is set by the  
SSEL[1:0] bits (Register 14, bits 4:3) and determines  
the type of signalling used in the LSB of SDO. This  
assists the host in isolating which data stream is the  
master and which is the slave. If the LSB is used for  
signalling, the master device has a unique setting  
relative to the slave devices. The DSP can use this  
information to determine which FSYNC marks the  
beginning of a sequence of data transfers.  
The delayed frame sync (FSD) of each device is  
supplied as the FSYNC of each subsequent slave  
device in the daisy chain. The master Si3056 generates  
an FSYNC signal for each device every 16 or 32 SLCK  
periods. The delay period is set by FSD (Register 14,  
bit 2). Figure 31 on page 43 and Figure 34 on page 46  
show the relative timing for daisy chaining operation.  
Primary communication frames occur in sequence,  
followed by secondary communication frames, if  
requested. When writing/reading the master device via  
a secondary frame, all secondary frames of the slave  
devices also must be written. When writing/reading a  
slave device via a secondary frame, the secondary  
frames of the master and all other slaves must be  
written also. “No operation” writes/reads to secondary  
In serial mode 2, the Si3056 operates as a slave device,  
where MCLK is an input, SCLK is a no connect, and  
FSYNC is an input. In addition, the RGDT/FSD/M1 pin  
operates as a delayed frame sync (FSD) and the FC/  
RGDT pin operates as ring detect (RGDT). In this  
mode, FC operation is not supported. For details on  
operating the Si3056 as  
a
slave device, see  
“5.27.Multiple Device Support” .  
5.27. Multiple Device Support  
The Si3056 supports the operation of up to seven  
additional devices on a single serial interface. Figure 35  
shows the typical connection of the Si3056 and one  
additional serial voice codec (Si3000).  
The Si3056 must be the master in this configuration. frames are accomplished by writing/reading a 0 value to  
Configure the secondary codec as a slave device with address 0.  
the master’s SCLK used as the MCLK input to the  
codec, and the master’s frame sync delay signal (FSD)  
used as the codec’s FSYNC input. On powerup, the  
Si3056 master does not detect the additional codec on  
the serial bus. The FC/RGDT pin is an input, operating  
as the hardware control for secondary frames, and the  
RGDT/FSD/M1 pin is an output, operating as the active  
low ring detection signal. Program the master device for  
master/slave mode before enabling the isolation link,  
because a ring signal causes a false transition to the  
slave device’s FSYNC.  
Register 14 provides the necessary control bits to  
configure the Si3056 for master/slave operation. Bit 0  
(DCE) sets the Si3056 in master/slave mode, also  
referred to as daisy-chain mode. When the DCE bit is  
set, the FC/RGDT pin becomes the ring detect output  
and the RGDT/FSD/M1 pin becomes the frame sync  
delay output. When using multiple devices, secondary  
If FSD is set for 16 SCLK periods between FSYNCs,  
only serial mode 1 can be used. In addition, the slave  
devices must delay the tri-state to active transition of  
their SDO sufficiently from the rising edge of SCLK to  
avoid bus contention.  
The Si3056 supports the operation of up to eight Si3056  
devices on a single serial bus. The master Si3056 must  
be configured in serial mode 1. Configure the slave(s)  
Si3056 in serial mode 2. Figure 36 on page 47 shows a  
typical master/slave connection using three Si3056  
devices.  
When in serial mode 2, FSYNC becomes an input,  
RGDT/FSD/M1 becomes the delay frame sync output,  
and FC/RGDT becomes the ring detection output. The  
serial interface runs at the MCLK input frequency fed  
from a master device (such as a master Si3056's SCLK  
output). To achieve the proper sampling frequency, the  
38  
Rev. 1.05  
Si3056  
Si3018/19/10  
SRC[3:0] bits (Register 7, bits 3:0) must be The Si3056 also supports an additional powerdown  
programmed with the proper sample rate value before mode. When both the PDN (Register 6, bit 3) and PDL  
the sampled line data is valid. The SCLK pin of the (Register 6, bit 4) bits are set, the chipset enters a  
slave is a no connect in this configuration.  
complete powerdown mode and draws negligible  
current (deep sleep mode). Turn off the PLL2 before  
entering deep sleep mode (i.e., set Register 9 to 0 and  
then Register 6 to 0x18). In this mode, the Si3056 is  
non-functional. Normal operation is restored by the  
same process for taking the DAA out of sleep mode.  
The delay between FSYNC input and delayed frame  
sync output (RGDT/FSD/M1) is 16 SCLK periods. The  
RGDT/FSD/M1 output has a waveform identical to the  
FSYNC signal in serial mode 0. In addition, the LSB of  
SDO is set to 0 by default for all devices in serial  
mode 2.  
5.29. Calibration  
5.28. Power Management  
The Si3056 initiates two auto-calibrations by default  
when the device goes off-hook or experiences a loss in  
line power. A 17 ms resistor calibration is performed to  
allow circuitry internal to the DAA to adjust to the exact  
line conditions present at that time. This resistor  
calibration can be disabled by setting the RCALD bit  
(Register 25, bit 5). A 256 ms ADC calibration is also  
performed to remove offsets that might be present in the  
on-chip A/D converter which could affect the A/D  
dynamic range. The ADC auto-calibration is initiated  
after the DAA dc termination stabilizes, and the resistor  
calibration completes. Because large variations in line  
conditions and line card behavior exist, it could be  
beneficial to use manual calibration instead of auto-  
calibration.  
The Si3056 supports four basic power management  
operation modes. The modes are normal operation,  
reset operation, sleep mode, and full powerdown mode.  
PDN and PDL bits (Register 6) control the power  
management modes.  
On powerup, or following a reset, the Si3056 is in reset  
operation. The PDL bit is set, and the PDN bit is  
cleared. The Si3056 is operational, except for the  
isolation link. No communication between the Si3056  
and line-side device can occur during reset operation.  
Bits associated with the line-side device are not valid in  
this mode.  
In typical applications, the DAA will predominantly be  
operated in normal mode. In this mode, the PDL and  
PDN bits are cleared. The Si3056 is operational and the  
isolation link is passing information between the Si3056  
and the line-side device.  
Execute manual ADC calibration as close as possible to  
256 ms before valid transmit/receive data is expected.  
Take the following steps to implement manual ADC  
calibration:  
The Si3056 supports a low-power sleep mode to  
support ring validation and wake-on-ring features. The  
clock generator registers 7, 8, and 9 must be  
1. The CALD (auto-calibration disable—Register 17) bit  
must be set to 1.  
programmed with valid, non-zero values and the PDL 2. The MCAL (manual calibration) bit must be toggled  
bit must be clear before enabling sleep mode. The PDN  
bit must then be set. When the Si3056 is in sleep mode  
the MCLK signal must remain active. In low-power  
sleep mode with MCLK active, the Si3056 is non-  
functional except for the isolation link and the RGDT  
signal. To take the Si3056 out of sleep mode, pulse the  
reset pin (RESET) low.  
to 1 and then 0 to begin and complete the  
calibration.  
3. The calibration is completed in 256 ms.  
5.30. In-Circuit Testing  
With the Si3056’s advanced design the designer can  
determine system functionality during production line  
In summary, the powerdown/up sequence for sleep tests, and during support for end-user diagnostics. Four  
mode is as follows:  
loopback modes allow thorough coverage of system  
components. Four of the test modes require a line-side  
power source. Although a standard phone line can be  
used, the test circuit in Figure 1 on page 6 is adequate.  
In addition, an off-hook sequence must be performed to  
connect the power source to the line-side device.  
For the start-up loopback test mode, line-side power is  
not necessary and no off-hook sequence is required.  
The start-up test mode is enabled by default. When the  
PDL bit (Register 6, bit 4) is set (the default case), the  
line-side is in a powerdown mode and the DSP-side is  
in a digital loop-back mode. Data received on SDI  
1. Ensure that Registers 7, 8, and 9 have valid non-  
zero values, and ensure the PDL bit (Register 6, bit  
4) is cleared.  
2. Set the PDN bit (Register 6, bit 3).  
3. The device is now in sleep mode. MCLK must stay  
active.  
4. To exit sleep mode, reset the Si3056 by pulsing the  
RESET pin.  
5. Program registers to desired settings.  
Rev. 1.05  
39  
Si3056  
Si3018/19/10  
passes through the internal filters and transmitted on When the HBE bit is cleared, this causes a dc offset that  
SDO which introduces approximately 0.9 dB of affects the signal swing of the transmit signal. Silicon  
®
attenuation on the SDI signal received. The group delay Laboratories recommends that the transmit signal be  
of both transmit and receive filters exists between SDI 12 dB lower than normal transmit levels. A lower level  
and SDO. Clearing the PDL bit disables this mode and eliminates clipping from the dc offset that results from  
the SDO data is switched to the receive data from the disabling the hybrid. It is assumed in this test that the  
line-side. When the PDL bit is cleared, the FDT bit line ac impedance is nominally 600 Ω.  
(Register 12, bit 6) becomes active, indicating the  
successful communication between the line-side and  
DSP-side. This can be used to verify that the isolation  
link is operational.  
The digital data loop-back mode offers a way to input  
data on the SDI pin and have the identical data be  
output on the SDO pin by bypassing the transmit and  
receive filters. Setting the DDL bit (Register 10, bit 0)  
enables this mode. No line-side power or off-hook  
Note: All test modes are mutually exclusive. If more than one  
test mode is enabled concurrently, the results are  
unpredictable.  
5.31. Exception Handling  
The Si3056 provides several mechanisms to determine  
if an error occurs during operation. Through the  
secondary frames of the serial link, the controlling  
systems can read several status bits.  
sequence is required for this mode. The digital data The bit of highest importance is the frame detect bit  
loopback mode is useful to verify communication (FDT, Register 12, bit 6), which indicates that the  
between the host processor/DSP and the DAA.  
system-side (Si3056) and line-side devices are  
communicating.  
The remaining test modes require an off-hook sequence  
to operate. The following sequence describes the off- During normal operation, the FDT bit can be checked  
hook procedure required for the following test modes:  
1. Powerup or reset.  
before reading bits for information about the line-side. If  
FDT is not set, the following bits related to the line-side  
are invalid—RDT, RDTN, RDTP, LCS[4:0], LSID[1:0],  
REVB[3:0], LCS2[7:0], LVS[7:0], ROV, BTD, DOD, and  
OVL; the RGDT operation is also non-functional.  
2. Program the clock generator to the chosen sample  
rate.  
3. Enable line-side by clearing the PDL bit.  
4. Issue an off-hook command.  
5. Delay 402.75 ms to allow calibration to occur.  
6. Set the desired test mode.  
In the communications link loopback mode, the host  
sends a digital input test pattern on SDI and receives  
that digital test pattern back on SDO. To enable this  
mode, set the IDL bit (Register 1, bit 1). In this mode,  
the communication link is tested. The digital stream is  
delivered across the isolation capacitors, C1 and C2 of  
Figure 16 on page 17, to the line-side device and  
returned across the same interface. In this mode, the  
0.9 dB attenuation and filter group delays also exist.  
Following Powerup and reset, the FDT bit is not set  
because the PDL bit (Register 6 bit 4) defaults to 1. The  
communications link does not operate and no  
information about the line-side can be determined. The  
user must program the clock generator to a valid  
configuration for the system and clear the PDL bit to  
activate the communications link. As the system- and  
line-side devices are establishing communication, the  
system-side device does not generate FSYNC signals.  
Establishing communication takes less than 10 ms.  
Therefore, if the controlling DSP serial interface is  
interrupt driven based on the FSYNC signal, the  
controlling DSP does not require a special delay loop to  
wait for this event to complete.  
The final testing mode, internal analog loopback, allows  
the system to test the operation of the transmit and  
receive paths through the line-side device and the  
external components shown in Figure 16 on page 17. In  
this test mode, the host provides a digital test waveform  
on SDI. This data passes across the communications  
link, is transmitted to and received from the line, passes  
back across the communications link, and is presented  
to the host on SDO. To enable this mode, clear the HBE  
bit (Register 2, bit 1).  
The FDT bit also can indicate if the line-side device  
executes an off-hook request successfully. If the line-  
side device is not connected to a phone line, the FDT bit  
remains cleared. The controlling DSP must provide  
sufficient time for the line-side to execute the off-hook  
request. The maximum time for FDT to be valid  
following an off-hook request is 10 ms. If the FDT bit is  
high, the LCS[4:0] bits indicate the amount of loop  
current flowing. If the FDT fails to be set following an off-  
hook request, the PDL bit (Register 6) must be set high  
for at least 1 ms to reset the line-side.  
40  
Rev. 1.05  
Si3056  
Si3018/19/10  
5.32. Revision Identification  
With the Si3056 the system designer can determine the revision of the Si3056 and/or the line-side device. The  
REVA[3:0] bits (Register 11, bits 3:0) identify the revision of the Si3056. The REVB[3:0] bits (Register 13, bits 3:0)  
identify the revision of the line-side device. Table 22 lists revision values for all devices and might contain future  
revisions not yet in existence.  
Table 22. Revision Values  
Revision  
Si3056  
0001  
0010  
0011  
0100  
0101  
0110  
Si3018  
0001  
0010  
0011  
0100  
0101  
0110  
Si3019  
0001  
0010  
0011  
0100  
0101  
0110  
Si3010  
0001  
0010  
0011  
0100  
0101  
0110  
A
B
C
D
E
F
Communications Frame 1 (CF1)  
Secondary  
(CF2)  
Primary  
Primary  
FSYNC  
FC  
0
D15 –D1 D0 = 1 (Software FC Bit)  
D15 –D1 D0 = 0 (Software FC Bit)  
XMT Data  
Secondary  
XMT Data  
SDI  
Data  
Secondary  
Data  
RCV Data  
RCV Data  
SDO  
16 SCLKS  
128 SCLKS  
256 SCLKS  
Figure 27. Software FC/RGDT Secondary Request  
Rev. 1.05  
41  
Si3056  
Si3018/19/10  
Communications Frame 1 (CF1)  
(CF2)  
Primary  
Secondary  
Primary  
FSYNC  
FC  
0
D15–D0  
Secondary  
Data  
XMT Data  
XMT Data  
RCV Data  
SDI  
Secondary  
Data  
RCV Data  
SDO  
16 SCLKS  
128 SCLKS  
256 SCLKS  
Figure 28. Hardware FC/RGDT Secondary Request  
FSYNC  
(mode 0)  
FSYNC  
(mode 1)  
D15 D14 D13 D12 D11 D10 D9 D8 D7  
D0  
1
A
A
A
A
A
A
A
SDI  
R/W  
D7 D6 D5 D4 D3 D2 D1 D0  
D
D
D
D
D
D
D
D
SDO  
Figure 29. Secondary Communication Data Format—Read Cycle  
42  
Rev. 1.05  
Si3056  
Si3018/19/10  
FSYNC  
(mode 0)  
FSYNC  
(mode 1)  
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0  
0
A
A
A
A
A
A
A
D
D
D
D
D
D
D
D
SDI  
R/W  
SDO  
Figure 30. Secondary Communication Data Format—Write Cycle  
Master  
Slave 1  
Serial Mode 1  
Reg 14: NSLV = 1, SSEL = 2, FSD = 0, DCE = 1  
Serial Mode 2  
Reg 14 Reset values: NSLV = 1, SSEL = 3, FSD = 1, DCE = 1  
Primary Frame (Data)  
Secondary Frame (Control)  
128 SCLKs  
128 SCLKs  
Master FSYNC  
32 SCLKs  
32 SCLKs  
Master FSD/  
Slave1 FSYNC  
SDI [0]  
SDI [15..1]  
1
1
Master  
Master  
Slave1  
Slave1  
Master  
Slave1  
SDO [0]  
SDO[15..1]  
1
0
Master  
Master  
Slave1  
Slave1  
Master  
Slave1  
Comments  
Primary frames with secondary frame requested via SDI[0] = 1  
Figure 31. Daisy Chaining of a Single Slave (Pulse FSD)  
Rev. 1.05  
43  
Si3056  
Si3018/19/10  
Master  
Slave 1  
Serial Mode 1  
Reg 14: NSLV = 1, SSEL = 2, FSD = 1, DCE = 1  
Serial Mode 2  
Reg 14 Reset values: NSLV = 1, SSEL = 3, FSD = 1, DCE = 1  
Primary Frame (Data)  
Secondary Frame (Control)  
128 SCLKs  
128 SCLKs  
Master FSYNC  
Master FSD/  
Slave1 FSYNC  
16 SCLKs  
16 SCLKs  
16 SCLKs  
16 SCLKs  
SDI [0]  
SDI [15..1]  
1
1
Master  
Master  
Slave1  
Slave1  
Master  
Slave1  
SDO [0]  
SDO[15..1]  
1
0
Master  
Master  
Slave1  
Slave1  
Master  
Slave1  
Comments  
Primary frames with secondary frame requested via SDI[0] = 1  
Figure 32. Daisy Chaining of a Single Slave (Frame FSD)  
44  
Rev. 1.05  
Si3056  
Si3018/19/10  
Rev. 1.05  
45  
Si3056  
Si3018/19/10  
Master  
Serial Mode 0  
Reg 14: NSLV = 1, SSEL = 2, FSD = 0, DCE = 1  
Slave 1  
Serial Mode 2  
Reg 14 Reset values: NSLV = 1, SSEL = 3, FSD = 1, DCE = 1  
Primary Frame (Data)  
Secondary Frame (Control)  
128 SCLKs  
128 SCLKs  
16 SCLKs  
Master FSYNC  
Master FSD/  
Slave1 FSYNC  
SDI [0]  
SDI [15..1]  
1
1
Master  
Master  
Slave1  
Slave1  
Master  
Slave1  
SD0 [0]  
SD0 [15..1]  
1
0
Master  
Master  
Slave1  
Slave1  
Master  
Slave1  
Comments  
Primary frames with secondary frame requested via SDI[0] = 1  
Figure 34. Daisy Chaining with Framed FSYNC and Framed FSD  
MCLK  
Host  
SCLK  
Si3056  
MCLK  
SCLK  
SDI  
SDO  
SDO  
SDI  
FSYNC  
FSYNC  
INT0  
FC/RGDT  
RGDT/FSD/M1  
VCC  
M0  
47 kΩ  
47 kΩ  
47 kΩ  
+5 V  
47 kΩ  
Si3000  
SCLK  
MCLK  
FSYNC  
SDI  
SDO  
Voice  
Codec  
Figure 35. Typical Connection for Master/Slave Operation (e.g., Data/Fax/Voice Modem)  
46  
Rev. 1.05  
Si3056  
Si3018/19/10  
MCLK  
Host  
SCLK  
Si3056—Master  
MCLK  
SCLK  
SDI  
SDO  
SDI  
SDO  
FSYNC  
FSYNC  
INTO  
FC/RGDT  
RGDT/FSD/M1  
VCC  
NC  
M0  
47 kΩ  
47 kΩ  
47 kΩ  
Si3056—Slave 1  
MCLK  
SCLK  
FSYNC  
SDI  
SDO  
VCC  
47 kΩ  
RGDT/FSD/M1  
M0  
Si3056—Slave 2  
MCLK  
NC SCLK  
FSYNC  
SDI  
SDO  
VCC  
47 kΩ  
RGDT/FSD/M1  
M0  
Figure 36. Typical Connection for Multiple DAAS  
Rev. 1.05  
47  
Si3056  
Si3018/19/10  
6. Control Registers  
Table 23. Register Summary  
Register  
1
Name  
Bit 7  
SR  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
PWME  
Bit 2  
Bit 1  
IDL  
Bit 0  
SB  
Control 1  
PWMM[1:0]  
2
3
4
5
Control 2  
Interrupt Mask  
Interrupt Source  
DAA Control 1  
INTE  
RDTM  
RDTI  
INTP  
ROVM  
ROVI  
WDTEN  
BTDM  
BTDI  
OPOL  
PDL  
RDI  
LCSOM  
LCSOI  
RDT  
HBE  
RXE  
POLM  
POLI  
OH  
FDTM  
FDTI  
RDTP  
DODM  
DODI  
ONHM  
PDN  
DLCSM  
DLCSI  
OHE  
RDTN  
6
DAA Control 2  
7
8
Sample Rate Control  
PLL Divide N  
SRC[3:0]  
N[7:0]  
9
PLL Divide M  
M[7:0]  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32–37  
38  
39  
40  
41  
42  
43  
DAA Control 3  
DDL  
DCE  
System-Side and Line-Side Revision  
Line-Side Device Status  
Line-Side Device Revision  
Serial Interface Control  
TX/RX Gain Control 1  
International Control 1  
International Control 2  
International Control 3  
International Control 4  
Call Progress Rx Attenuation  
Call Progress Tx Attenuation  
Ring Validation Control 1  
Ring Validation Control 2  
Ring Validation Control 3  
Resistor Calibration  
DC Termination Control  
Reserved  
Loop Current Status  
Line Voltage Status  
AC Termination Control  
DAA Control 4  
Reserved  
TX Gain Control 2  
RX Gain Control 2  
TX Gain Control 3  
RX Gain Control 3  
Reserved  
Line Current/Voltage Threshold  
Interrupt  
LSID[3:0]  
FDT  
0
REVA[3:0]  
LCS[4:0]  
REVB[3:0]  
SSEL[1:0]  
NSLV[2:0]  
FSD  
RPOL  
ARX[2:0]  
RZ  
TXM  
ACT22  
CALZ  
ATX[2:0]  
ACT2  
RXM  
OHS  
IIRE  
RT  
BTD  
MCAL  
CALD  
OPE  
BTE  
OVL  
ROV  
RFWE  
DOD  
OPD  
ARM[7:0]  
ATM[7:0]  
RDLY[1:0]  
RDLY[2]  
RNGV  
RMX[5:0]  
RAS[5:0]  
RTO[3:0]  
RCC[2:0]  
RCALS  
RCALM  
RCALD  
MINI[1:0]  
RCAL[3:0]  
ILIM  
DCV[1:0]  
DCR  
LCS2[7:0]  
LVS[7:0]  
FULL21  
ACIM[3:0]1  
FILT1  
FULL1  
FOH[1:0]  
OHS2  
LVFD1  
TGA21  
RGA21  
TGA31  
RGA31  
TXG2[3:0]1  
RXG2[3:0]1  
TXG3[3:0]1  
RXG3[3:0]1  
CVT[7:0]1  
CVI1  
HYB1–8[7:0]  
44  
Line Current/Voltage Threshold  
Interrupt Control  
Programmable Hybrid Register 1–8  
Reserved  
CVS1  
CVM1  
GCE  
CVP1  
45–52  
53–58  
59  
TB3  
SQ1  
SQ0  
Spark Quenching Control  
RG1  
Notes:  
1. Bit is available for Si3019 line-side device only.  
2. Bit is available for Si3010 and Si3018 line-side device only.  
48  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 1. Control 1  
Bit  
D7  
SR  
D6  
D5  
D4  
D3  
D2  
D1  
IDL  
R/W  
D0  
SB  
Name  
Type  
PWMM[1:0]  
R/W  
PWME  
R/W  
R/W  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7
SR  
Software Reset.  
0 = Enables the DAA for normal operation.  
1 = Sets all registers to their reset value.  
Note: Bit automatically clears after being set.  
6
Reserved Read returns zero.  
5:4 PWMM[1:0] Pulse Width Modulation Mode.  
Used to select the type of signal output on the call progress AOUT pin.  
00 = PWM output is clocked at 16.384 MHz as a delta-sigma data stream. A local density of  
1s and 0s tracks the combined transmit and receive signals.  
01 = Balanced conventional PWM output signal has high and low portions of the modulated  
pulse that are centered on the 16 kHz sample clock.  
10 = Conventional PWM output signal returns to logic 0 at regular 32 kHz intervals and rises  
at a time in the 32 kHz period proportional to its instantaneous amplitude.  
11 = Reserved.  
3
PWME  
Pulse Width Modulation Enable.  
Sums the transmit and receive audio paths and presents it as a CMOS digital-level output of  
PWM data. Use the circuit in “Figure 18. AOUT PWM Circuit for Call Progress” .  
0 = Pulse width modulation signal for AOUT disabled.  
1 = Pulse width modulation signal for call progress analog output (AOUT) enabled.  
2
1
Reserved Read returns zero.  
IDL  
Isolation Digital Loopback.  
0 = Digital loopback across the isolation barrier is disabled.  
1 = Enables digital loopback mode across the isolation barrier. The line-side device must be  
enabled and off hook before setting this mode. This data path includes the TX and RX filters.  
0
SB  
Serial Digital Interface Mode.  
0 = Operation is in 15-bit mode, and the LSB of the data field indicates that a secondary  
frame is required.  
1 = The serial port is operating in 16-bit mode and requires a secondary frame sync signal,  
FC, to initiate control data reads/writes.  
Rev. 1.05  
49  
Si3056  
Si3018/19/10  
Register 2. Control 2  
Bit  
D7  
D6  
D5  
D4  
WDTEN  
R/W  
D3  
D2  
RDI  
R/W  
D1  
D0  
Name  
Type  
INTE  
R/W  
INTP  
R/W  
HBE  
R/W  
RXE  
R/W  
Reset settings = 0000_0011  
Bit  
Name  
Function  
7
INTE  
Interrupt Pin Enable.  
0 = The AOUT/INT pin functions as an analog output for call progress monitoring purposes.  
1 = The AOUT/INT pin functions as a hardware interrupt pin.  
6
INTP  
Interrupt Polarity Select.  
0 = The AOUT/INT pin, when used in hardware interrupt mode, is active low.  
1 = The AOUT/INT pin, when used in hardware interrupt mode, is active high.  
5
4
Reserved Returns to zero.  
WDTEN Watchdog Timer Enable.  
When set, this bit can only be cleared by a hardware reset. The watchdog timer monitors  
register accesses. If no register accesses occur within a 4 second window, the DAA is put into  
an on-hook state. A write of a DAA register restarts the watchdog timer counter. If the  
watchdog timer times out, the OH and OHE bits are cleared, placing the DAA into an on-hook  
state. Setting the OH bit or setting the OHE bit and asserting the OFHK pin places the DAA  
back into an off-hook state.  
0 = Watchdog timer disabled.  
1 = Watchdog timer enabled.  
3
2
Reserved Returns to zero.  
RDI  
Ring Detect Interrupt Mode.  
This bit operates in conjunction with the RDTM and RDTI bits. This bit is selected if one or two  
interrupts are generated for every ring burst.  
0 = An interrupt is generated at the beginning of every ring burst.  
1 = An interrupt is generated at the beginning and end of every ring burst. The interrupt at the  
beginning of the ring burst must be serviced (by writing a 0 to the RDTI bit) before the end of  
the ring burst for both interrupts to occur.  
1
0
HBE  
RXE  
Hybrid Enable.  
0 = Disconnects hybrid in transmit path.  
1 = Connects hybrid in transmit path.  
Receive Enable.  
0 = Receive path disabled.  
1 = Enables receive path.  
50  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 3. Interrupt Mask  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name RDTM ROVM FDTM BTDM DODM LCSOM DLCSM POLM  
Type  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7
RDTM  
Ring Detect Mask.  
0 = A ring signal does not cause an interrupt on the AOUT/INT pin.  
1 = A ring signal causes an interrupt on the AOUT/INT pin.  
6
5
ROVM  
FDTM  
Receive Overload Mask.  
0 = A receive overload does not cause an interrupt on the AOUT/INT pin.  
1 = A receive overload causes an interrupt on the AOUT/INT pin.  
Frame Detect Mask.  
0 = The communications link achieving frame lock does not cause an interrupt on the AOUT/  
INT pin.  
1 = The communications link achieving frame lock causes an interrupt on the AOUT/INT pin.  
4
3
2
1
0
BTDM  
DODM  
Billing Tone Detect Mask.  
0 = A detected billing tone does not cause an interrupt on the AOUT/INT pin.  
1 = A detected billing tone causes an interrupt on the AOUT/INT pin.  
Drop Out Detect Mask.  
0 = A line supply dropout does not cause an interrupt on the AOUT/INT pin.  
1 = A line supply dropout causes an interrupt on the AOUT/INT pin.  
LCSOM Loop Current Sense Overload Mask.  
0 = An interrupt does not occur when the LCS bits are all 1s.  
1 = An interrupt occurs when the LCS bits are all 1s.  
DLCSM Delta Loop Current Sense Mask.  
0 = An interrupt does not occur when the LCS bits change.  
1 = An interrupt does occur when the LCS bits change.  
POLM  
Polarity Reversal Detect Mask.  
Generated from bit 7 of the LVS register. When this bit transitions, it indicates that the polarity  
of TIP and RING was switched.  
0 = A polarity change on TIP and RING does not cause an interrupt on the AOUT/INT pin.  
1 = A polarity change on TIP and RING causes an interrupt on the AOUT/INT pin.  
Rev. 1.05  
51  
Si3056  
Si3018/19/10  
Register 4. Interrupt Source  
Bit  
Name  
Type  
D7  
RDTI  
R/W  
D6  
ROVI  
R/W  
D5  
FDTI  
R/W  
D4  
BTDI  
R/W  
D3  
DODI LCSOI DLCSI  
R/W R/W R/W  
D2  
D1  
D0  
POLI  
R/W  
Reset settings = 0000_0000  
Bit Name  
Function  
7
RDTI Ring Detect Interrupt.  
0 = A ring signal is not occurring.  
1 = A ring signal is detected. If the RDTM (Register 3) and INTE (Register 2) bits are set a hard-  
ware interrupt occurs on the AOUT/INT pin. This bit must be written to a 0 to be cleared. The RDI  
bit (Register 2) determines if this bit is set only at the beginning of a ring pulse, or at the end of a  
ring pulse as well. This bit should be cleared after clearing the PDL bit (Register 6) because pow-  
ering up the line-side device may cause this interrupt to be triggered.  
6
5
ROVI Receive Overload Interrupt.  
0 = An excessive input level on the receive pin is not occurring.  
1 = An excessive input level on the receive pin is detected. If the ROVM and INTE bits are set a  
hardware interrupt occurs on the AOUT/INT pin. This bit must be written to 0 to clear it. This bit is  
identical in function to the ROV bit (Register 17). Clearing this bit also clears the ROV bit.  
FDTI  
BTDI  
Frame Detect Interrupt.  
0 = Frame detect is established on the communications link.  
1 = This bit is set when the communications link does not have frame lock. If the FDTM and INTE  
bits are set, a hardware interrupt occurs on the AOUT/INT pin. Once set, this bit must be written  
to a 0 to be cleared.  
4
3
Billing Tone Detect Interrupt.  
0 = A billing tone has not occurred.  
1 = A billing tone has been detected. If the BTDM and INTE bits are set, a hardware interrupt  
occurs on the AOUT/INT pin. This bit must be written to 0 to clear it.  
DODI Drop Out Detect Interrupt.  
0 = The line-side power supply has not collapsed.  
1 = The line-side power supply has collapsed (The DOD bit in Register 19 has fired). If the  
DODM and INTE bits are set, a hardware interrupt occurs on the AOUT/INT pin. This bit must be  
written to 0 to be cleared. This bit should be cleared after clearing the PDL bit (Register 6)  
because powering as the line-side device can cause this interrupt to be triggered.  
2
LCSOI Loop Current Sense Overload Interrupt.  
0 = The LCS bits have not reached max value (all ones).  
1 = The LCS bits have reached max value. If the LCSOM bit (Register 3) and the INTE bit are  
set, a hardware interrupt occurs on the AOUT/INT pin. This bit must be written to 0 to be cleared.  
LCSOI does not necessarily imply that an overcurrent situation has occurred. An overcurrent sit-  
uation in the DAA is determined by the status of the OPD bit (Register 19). After the LCSOI inter-  
rupt fires, the OPD bit should be checked to determine if an overcurrent situation exists.  
52  
Rev. 1.05  
Si3056  
Si3018/19/10  
Bit Name  
Function  
1
DLCSI Delta Loop Current Sense Interrupt  
0 = The LCS bits have not changed value.  
1 = The LCS bits have changed value; a hardware interrupt occurs on the AOUT/INT pin. This bit  
must be written to a 0 to be cleared.  
0
POLI  
Polarity Reversal Detect Interrupt.  
0 = Bit 7 of the LVS register does not change states.  
1 = Bit 7 of the LVS register changes from a 0 to a 1, or from a 1 to a 0, indicating the polarity of  
TIP and RING is switched. If the POLM and INTE bits are set, a hardware interrupt occurs on the  
AOUT/INT pin. To clear the interrupt, write this bit to 0.  
Register 5. DAA Control 1  
Bit  
Name  
Type  
D7  
D6  
RDTN RDTP OPOL ONHM  
R/W R/W  
D5  
D4  
D3  
D2  
RDT  
R
D1  
OHE  
R/W  
D0  
OH  
R/W  
R
R
Reset settings = 0000_0000  
Bit  
7
Name  
Reserved Read returns zero.  
Function  
6
RDTN  
RDTP  
OPOL  
ONHM  
Ring Detect Signal Negative.  
0 = No negative ring signal is occurring.  
1 = A negative ring signal is occurring.  
Ring Detect Signal Positive.  
0 = No positive ring signal is occurring.  
1 = A positive ring signal is occurring.  
Off-hook Polarity.  
0 = Off-hook pin is active low.  
1 = Off-hook pin is active high.  
On-Hook Line Monitor.  
0 = Normal on-hook mode.  
5
4
3
1 = Enables low-power on-hook monitoring mode allowing the host to receive line activity  
without going off-hook. This mode is used for caller-ID detection.  
2
RDT  
Ring Detect.  
0 = Reset either 5 seconds after last positive ring is detected or when the system executes an  
off-hook. Only a positive ring sets this bit when RFWE = 0. When RFWE = 1, either a positive  
or negative ring sets this bit.  
1 = Indicates a ring is occurring.  
1
0
OHE  
OH  
Off-hook Pin Enable.  
0 = Off-hook pin is ignored.  
1 = Enables operation of the off-hook pin.  
Off-Hook.  
0 = Line-side device on-hook.  
1 = Causes the line-side device to go off-hook. This bit operates independently of the OHE bit  
and is a logic OR with the off-hook pin when enabled.  
Rev. 1.05  
53  
Si3056  
Si3018/19/10  
Register 6. DAA Control 2  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
PDL  
R/W  
PDN  
R/W  
Reset settings = 0001_0000  
Bit  
7:5  
4
Name  
Reserved Read returns zero.  
Function  
PDL  
Powerdown Line-Side Device.  
0 = Normal operation. Program the clock generator before clearing this bit.  
1 = Places the line-side device in lower power mode.  
3
PDN  
Powerdown System-Side Device.  
0 = Normal operation.  
1 = Powers down the system-side device. A pulse on RESET is required to restore normal  
operation.  
2:0  
Reserved Read returns zero.  
Register 7. Sample Rate Control  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
SRC[3:0]  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:4 Reserved Read returns zero.  
3:0 SRC[3:0] Sample Rate Control.  
Function  
Sets the sample rate of the line-side device.  
0000 = 7200 Hz  
0001 = 8000 Hz  
0010 = 8229 Hz  
0011 = 8400 Hz  
0100 = 9000 Hz  
0101 = 9600 Hz  
0110 = 10286 Hz  
0111 = 12000 Hz  
1000 = 13714 Hz  
1001 = 16000 Hz  
1010–1111 = Reserved  
54  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 8. PLL Divide N  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
N[7:0]  
R/W  
Reset settings = 0000_0000 (serial mode 0, 1)  
Reset settings = 0001_0011 (serial mode 2)  
Bit  
Name  
Function  
7:0  
N[7:0]  
PLL N Divider.  
Contains the (value –1) for determining the output frequency on PLL1.  
Register 9. PLL Divide M  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
M[7:0]  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7:0  
M[7:0]  
PLL M Divider.  
Contains the (value –1) for determining the output frequency on PLL1.  
Register 10. DAA Control 3  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
DDL  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:1 Reserved Read returns zero.  
Function  
0
DDL  
Digital Data Loopback.  
0 = Normal operation.  
1 = Audio data received on SDI and loops it back out to SDO before the TX and RX filters.  
Outputted data is identical to inputted data.  
Rev. 1.05  
55  
Si3056  
Si3018/19/10  
Register 11. System-Side and Line-Side Device Revision  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
LSID[3:0]  
REVA[3:0]  
R
R
Reset settings = xxxx_xxxx  
Bit  
Name  
LSID[3:0] Line-Side ID Bits.  
Function  
7:4  
These four bits will always read one of the following values depending on which line-side  
device is used.  
Si3018  
Si3019  
Si3010  
LSID[3:0]  
0001  
0011  
0101  
3:0 REVA[3:0] System-Side Revision.  
Four-bit value indicating the revision of the system-side device.  
Register 12. Line-Side Device Status  
Bit  
D7  
D6  
FDT  
R
D5  
D4  
D3  
D2  
LCS[4:0]  
R
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit  
7
Name  
Reserved Read returns zero.  
FDT Frame Detect.  
Function  
6
0 = Indicates the communications link has not established frame lock.  
1 = Indicates the communications link frame lock is established.  
5
Reserved Read returns zero.  
4:0  
LCS[4:0] Loop Current Sense.  
5-bit value returning the loop current when the DAA is in an off-hook state.  
00000 = Loop current is less than required for normal operation.  
00100 = Minimum loop current for normal operation.  
11111 = Loop current is >127 mA, and a current overload condition may exist.  
56  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 13. Line-Side Device Revision  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
0
REVB[3:0]  
R
Reset settings = xxxx_xxxx  
Bit  
7
Name  
Reserved Read returns zero.  
This bit always reads a zero.  
Function  
6
0
5:2 REVB[3:0] Line-Side Device Revision.  
Four-bit value indicating the revision of the line-side device.  
1:0 Reserved Read returns zero.  
Rev. 1.05  
57  
Si3056  
Si3018/19/10  
Register 14. Serial Interface Control  
Bit  
D7  
D6  
NSLV[2:0]  
R/W  
D5  
D4  
SSEL[1:0]  
R/W  
D3  
D2  
D1  
D0  
Name  
Type  
FSD  
R/W  
RPOL  
R/W  
DCE  
R/W  
Reset settings = 0000_0000 (serial mode 0,1)  
Reset settings = 0011_1101 (serial mode 2)  
Bit  
Name  
Function  
7:5 NSLV[2:0] Number of Slaves devices.  
000 = 0 slaves. Redefines the FC/RGDT and RGDT/FSD pins.  
001 = 1 slave device  
010 = 2 slave devices  
011 = 3 slave devices  
100 = 4 slave devices (For four or more slave devices, the FSD bit MUST be set.)  
101 = 5 slave devices  
110 = 6 slave devices  
111 = 7 slave devices  
4:3 SSEL[1:0] Slave device select.  
00 = 16-bit SDO receive data  
01 = Reserved  
10 = 15-bit SDO receive data, LSB = 1  
11 = 15-bit SDO receive data, LSB = 0  
2
FSD  
Delayed Frame Sync Control.  
0 = Sets the number of SCLK periods between frame syncs to 32.  
1 = Sets the number of SCLK periods between frame syncs to 16. This bit MUST be set when  
Si3056 devices are slaves. For the master Si3056, only serial mode 1 is allowed when this bit  
is set.  
1
0
RPOL  
DCE  
Ring Detect Polarity.  
0 = The FC/RGDT pin (operating as ring detect) is active low.  
1 = The FC/RGDT pin (operating as ring detect) is active high.  
Daisy-Chain Enable.  
0 = Daisy-chaining disabled.  
1 = Enables the Si3056 to operate with slave devices on the same serial bus. The FC/RGDT  
signal (pin 7) becomes the ring detect output and the RDGT/FSD signal (pin 15) becomes the  
delayed frame sync signal. ALL other bits in this register are ignored if DCE = 0.  
58  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 15. TX/RX Gain Control 1  
Bit  
D7  
D6  
D5  
ATX[2:0]  
R/W  
D4  
D3  
D2  
D1  
ARX[2:0]  
R/W  
D0  
Name  
Type  
TXM  
R/W  
RXM  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7
TXM  
Transmit Mute.  
0 = Transmit signal is not muted.  
1 = Mutes the transmit signal.  
6:4  
ATX[2:0] Analog Transmit Attenuation.  
000 = 0 dB attenuation  
001 = 3 dB attenuation  
010 = 6 dB attenuation  
011 = 9 dB attenuation  
1xx = 12 dB attenuation  
Note: Write these bits to zero when using the finer resolution transmit and receive gain/attenuation  
registers 38–41 available only with the Si3019 line-side device.  
3
RXM  
Receive Mute.  
0 = Receive signal is not muted.  
1 = Mutes the receive signal.  
2:0  
ARX[2:0] Analog Receive Gain.  
000 = 0 dB gain  
001 = 3 dB gain  
010 = 6 dB gain  
011 = 9 dB gain  
1xx = 12 dB gain  
Note: Write these bits to zero when using the finer resolution transmit and receive gain/attenuation  
registers 38–41 available only with the Si3019 line-side device.  
Rev. 1.05  
59  
Si3056  
Si3018/19/10  
Register 16. International Control 1  
Bit  
D7  
ACT2  
RW  
D6  
D5  
D4  
D3  
D2  
D1  
RZ  
D0  
RT  
Name  
Type  
OHS  
R/W  
ACT  
R/W  
IIRE  
R/W  
R/W  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7
ACT2  
AC Termination Select 2 (Si3018 line-side device only).  
Works with the ACT bit to select one of four ac terminations:  
ACT2  
ACT  
AC Termination  
0
0
1
1
0
1
0
1
Real, 600 Ω  
Global complex impedance  
Global complex impedance, except New Zealand  
New Zealand complex impedance  
The global complex impedance meets minimum return loss requirements in countries that require  
a complex ac termination. For improved return loss performance, the other complex impedances  
can be used.  
6
OHS  
On-Hook Speed.  
This bit, in combination with the OHS2 bit (Register 31) and the SQ[1:0] bits (Register 59), sets the  
amount of time for the line-side device to go on-hook. The on-hook speeds specified are measured  
from the time the OH bit is cleared until loop current equals zero.  
OHS  
OHS2  
SQ[1:0]  
00  
Mean On-Hook Speed  
0
0
1
0
1
X
Less than 0.5 ms  
00  
3 ms ±10% (meets ETSI standard)  
26 ms ±10% (meets Australia spark quenching spec)  
11  
5
4
ACT  
IIRE  
AC Termination Select. (Si3018 line-side device only).  
When the ACT2 bit is cleared, the ACT bit selects the following:  
0 = Selects the real ac impedance (600 Ω)  
1 = Selects the global complex impedance.  
IIR Filter Enable.  
0 = FIR filter enabled for transmit and receive filters. See Figures 7–10 on page 16.  
1 = IIR filter enabled for transmit and receive filters. See Figures 11–16 on page 17.  
3:2  
1
Reserved Read returns zero.  
RZ  
Ringer Impedance.  
0 = Maximum (high) ringer impedance.  
1 = Synthesized ringer impedance enabled. See "5.16.Ringer Impedance and Threshold" on page  
30.  
0
RT  
Ringer Threshold Select.  
This bit is used to satisfy country requirements on ring detection. Signals below the lower level do  
not generate a ring detection; signals above the upper level are guaranteed to generate a ring  
detection.  
RT  
0
RT Lower level  
13.5 V  
RT Upper level  
16.5 V  
rms  
rms  
1
19.35 V  
23.65 V  
rms  
rms  
60  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 17. International Control 2  
Bit  
Name  
Type  
D7  
CALZ MCAL CALD  
R/W R/W R/W  
D6  
D5  
D4  
D3  
OPE  
R/W  
D2  
BTE  
R/W  
D1  
ROV  
R/W  
D0  
BTD  
R
Reset settings = 0000_0000  
Bit  
7
Name  
CALZ  
Function  
Clear ADC Calibration.  
0 = Normal operation.  
1 = Clears the existing calibration data. This bit must be written back to 0 after being set.  
Manual ADC Calibration.  
6
5
MCAL  
CALD  
0 = No calibration.  
1 = Initiate manual ADC calibration.  
ADC Auto-Calibration Disable.  
0 = Enable auto-calibration.  
1 = Disable auto-calibration.  
4
3
Reserved Read returns zero.  
OPE  
Overload Protect Enable.  
0 = Disabled.  
1 = Enabled.  
The OPE bit should always be cleared before going off-hook.  
Billing Tone Detect Enable.  
2
BTE  
When set, the DAA can detect a billing tone signal on the line and maintain on off-hook state  
through the billing tone. If a billing tone is detected, the BTD bit (Register 17) is set to indicate  
the event. Writing this bit to zero clears the BTD bit.  
0 = Billing tone detection disabled. The BDT bit is not function.  
1 = Billing tone detection enabled. The BDT is functional.  
Receive Overload.  
This bit is set when the receive input has an excessive input level (i.e., receive pin goes below  
ground). Writing a zero to this location clears this bit and the ROVI bit (Register 4, bit 6).  
0 = Normal receive input level.  
1 = Excessive receive input level.  
Billing Tone Detected.  
1
0
ROV  
BTD  
This bit is set if a billing tone is detected. Writing a zero to BTE clears this bit.  
0 = No billing tone detected.  
1 = Billing tone detected.  
Rev. 1.05  
61  
Si3056  
Si3018/19/10  
Register 18. International Control 3  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
RFWE  
R/W  
Reset settings = 0000_0000  
Bit  
7:2  
1
Name  
Reserved Read returns zero or one.  
RFWE  
Function  
Ring Detector Full-Wave Rectifier Enable.  
When RNGV (Register 24) is disabled, this bit controls the ring detector mode and the asser-  
tion of the RGDT pin. When RNGV is enabled, this bit configures the RGDT pin to either follow  
the ringing signal detected by the ring validation circuit, or to follow an unqualified ring detect  
one-shot signal initiated by a ring-threshold crossing and terminated by a fixed counter time-  
out of approximately five seconds.  
RNGV  
RFWE  
RGDT  
0
0
1
1
0
1
0
1
Half-Wave  
Full-Wave  
Validated Ring Envelope  
Ring Threshold Crossing One-Shot  
0
Reserved Read returns zero or one.  
62  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 19. International Control 4  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
OVL  
R
D1  
DOD  
R
D0  
OPD  
R
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:3 Reserved Read returns zero.  
Function  
2
1
OVL  
Receive Overload Detect.  
This bit has the same function as ROV in Register 17, but clears itself after the overload is  
removed. See “5.18.Billing Tone Protection and Receive Overload” on page 31. This bit is  
only masked by the off-hook counter and is not affected by the BTE bit.  
0 = Normal receive input level.  
1 = Excessive receive input level.  
DOD  
Recal/Dropout Detect.  
When the line-side device is off-hook, it is powered from the line itself. This bit will read 1  
when loop current is not flowing. For example, if the line-derived power supply collapses, such  
as when the line is disconnected, this bit is set to 1. Additionally, when on-hook and the line-  
side device is enabled, this bit is set to 1.  
0 = Normal operation.  
1 = Line supply dropout detected when off-hook.  
0
OPD  
Overload Protection Detect.  
This bit is used to indicate that the DAA has detected a loop current overload. The detector fir-  
ing threshold depends on the setting of the ILIM bit (Register 26).  
OPD  
ILIM  
Overcurrent Threshold  
Overcurrent Status  
0
0
1
1
0
1
0
1
160 mA  
60 mA  
160 mA  
60 mA  
No overcurrent condition exists  
No overcurrent condition exists  
An overcurrent condition has been detected  
An overcurrent condition has been detected  
Rev. 1.05  
63  
Si3056  
Si3018/19/10  
Register 20. Call Progress Receive Attenuation  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
ARM[7:0]  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7:0  
ARM[7:0]  
AOUT Receive Path Attenuation.  
When decremented from the default setting, these bits linearly attenuate the AOUT  
receive path signal used for call progress monitoring. Setting the bits to all 0s mutes the  
AOUT receive path.  
Attenuation = 20 log(ARM[7:0]/64)  
1111_1111 = +12 dB (gain)  
0111_1111 = +6 dB (gain)  
0100_0000 = 0 dB  
0010_0000 = –6 dB (attenuation)  
0001_0000 = –12 dB  
.
.
.
0000_0000 = Mute  
Register 21. Call Progress Transmit Attenuation  
Bit  
Name  
Type  
D7  
D6  
D5  
D4  
ATM[7:0]  
R/W  
D3  
D2  
D1  
D0  
Reset settings = 0000_0000  
Bit  
7:0  
Name  
ATM[7:0]  
Function  
AOUT Transmit Path Attenuation.  
When decremented from the default settings, these bits linearly attenuate the AOUT trans-  
mit path signal used for call progress monitoring. Setting the bits to all 0s mutes the AOUT  
transmit path.  
Attenuation = 20 log(ATM[7:0]/64)  
1111_1111 = +12 dB (gain)  
0111_1111 = +6 dB (gain)  
0100_0000 = 0 dB  
0010_0000 = –6 dB (attenuation)  
0001_0000 = –12 dB  
.
.
.
0000_0000 = Mute  
64  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 22. Ring Validation Control 1  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
RMX[5:0]  
R/W  
D1  
D0  
Name  
Type  
RDLY[1:0]  
R/W  
Reset settings = 1001_0110  
Bit  
Name  
Function  
7:6  
RDLY[1:0]  
Ring Delay Bits 1 and 0.  
These bits, in combination with the RDLY[2] bit (Register 23), set the amount of time  
between when a ring signal is validated and when a valid ring signal is indicated.  
RDLY[2]  
RDLY[1:0]  
Delay  
0 ms  
0
0
0
.
.
.
00  
01  
10  
256 ms  
512 ms  
1
11  
1792 ms  
5:0  
RMX[5:0]  
Ring Assertion Maximum Count.  
These bits set the maximum ring frequency for a valid ring signal within a 10% margin of  
error. During ring qualification, a timer is loaded with the RAS[5:0] field upon a TIP/RING  
event and decrements at a regular rate. When a subsequent TIP/RING event occurs, the  
timer value is compared to the RMX[5:0] field and if it exceeds the value in RMX[5:0] then  
the frequency of the ring is too high and the ring is invalidated. The difference between  
RAS[5:0] and RMX[5:0] identifies the minimum duration between TIP/RING events to qual-  
ify as a ring, in binary-coded increments of 2.0 ms (nominal). A TIP/RING event typically  
occurs twice per ring tone period. At 20 Hz, TIP/RING events would occur every 1/  
(2 x 20 Hz) = 25 ms. To calculate the correct RMX[5:0] value for a frequency range [f_min,  
f_max], the following equation should be used:  
1
--------------------------------------------  
RMX[5:0] ≥ RAS[5:0] –  
, RMX RAS  
2 × f_max × 2 ms  
To compensate for error margin and ensure a sufficient ring detection window, it is recom-  
mended that the calculated value of RMX[5:0] be incremented by 1.  
Rev. 1.05  
65  
Si3056  
Si3018/19/10  
Register 23. Ring Validation Control 2  
Bit  
D7  
RDLY[2]  
R/W  
D6  
D5  
D4  
D3  
D2  
D1  
RCC[2:0]  
R/W  
D0  
Name  
Type  
RTO[3:0]  
R/W  
Reset settings = 0010_1101  
Bit  
Name  
Function  
7
RDLY[2]  
Ring Delay Bit 2.  
This bit, in combination with the RDLY[1:0] bits (Register 22), set the amount of time  
between when a ring signal is validated and when a valid ring signal is indicated.  
RDLY[2]  
RDLY[1:0]  
Delay  
0 ms  
256 ms  
512 ms  
0
0
0
.
00  
01  
10  
.
.
1
11  
1792 ms  
6:3  
RTO[3:0]  
Ring Timeout.  
These bits set when a ring signal is determined to be over after the most recent ring thresh-  
old crossing.  
RTO[3:0]  
Ring Timeout  
80 ms  
128 ms  
256 ms  
0000  
0001  
0010  
.
.
.
1111  
1920 ms  
2:0  
RCC[2:0]  
Ring Confirmation Count.  
These bits set the amount of time that the ring frequency must be within the tolerances set  
by the RAS[5:0] bits and the RMX[5:0] bits to be classified as a valid ring signal.  
RCC[2:0]  
000  
Ring Confirmation Count Time  
100 ms  
150 ms  
200 ms  
256 ms  
384 ms  
512 ms  
640 ms  
1024 ms  
001  
010  
011  
100  
101  
110  
111  
66  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 24. Ring Validation Control 3  
Bit  
D7  
D6  
D5  
D4  
D3  
RAS[5:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
RNGV  
R/W  
R
Reset settings = 0001_1001  
Bit  
Name  
Function  
7
RNGV  
Ring Validation Enable.  
0 = Ring validation feature is disabled.  
1 = Ring validation feature is enabled in both normal operating mode and low-power  
mode.  
6
Reserved  
RAS[5:0]  
Reserved and may read either a 1 or 0.  
5:0  
Ring Assertion Time.  
These bits set the minimum ring frequency for a valid ring signal within a 10% margin of  
error. During ring qualification, a timer is loaded with the RAS[5:0] field upon a TIP/RING  
event and decrements at a regular rate. When a subsequent TIP/RING event occurs, the  
timer value is compared to the RMX[5:0] field and if it exceeds the value in RMX[5:0] then  
the frequency of the ring is too high and the ring is invalidated. The difference between  
RAS[5:0] and RMX[5:0] identifies the minimum duration between TIP/RING events to qual-  
ify as a ring, in binary-coded increments of 2.0 ms (nominal). A TIP/RING event typically  
occurs twice per ring tone period. At 20 Hz, TIP/RING events would occur every 1/  
(2 x 20 Hz) = 25 ms. To calculate the correct RMX[5:0] value for a frequency range [f_min,  
f_max], the following equation should be used:  
1
-------------------------------------------  
RMX[5:0] ≥ RAS[5:0] –  
, RMX RAS  
2 × f_min × 2 ms  
To compensate for error margin and ensure a sufficient ring detection window, it is recom-  
mended that the calculated value of RMX[5:0] be incremented by 1.  
Rev. 1.05  
67  
Si3056  
Si3018/19/10  
Register 25. Resistor Calibration  
Bit  
Name RCALS RCALM RCALD  
Type R/W R/W  
Reset settings = xx0x_xxxx  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
RCAL[3:0]  
R
R
R/W  
Bit  
Name  
Function  
7
RCALS  
Resistor Auto Calibration.  
0 = Resistor calibration is not in progress.  
1 = Resistor calibration is in progress.  
6
5
RCALM  
Manual Resistor Calibration.  
0 = No calibration.  
1 = Initiate manual resistor calibration. (After a manual calibration has been initiated, this  
bit must be cleared within 1 ms.)  
RCALD  
Resistor Calibration Disable.  
0 = Internal resistor calibration enabled.  
1 = Internal resistor calibration disabled.  
4
Reserved  
Do not write to this register bit. This bit always reads a zero.  
3:0  
RCAL[3:0] Always write back the value read.  
68  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 26. DC Termination Control  
Bit  
D7  
DCV[1:0]  
R/W  
D6  
D5  
MINI[1:0]  
R/W  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
ILIM  
R/W  
DCR  
R/W  
Reset settings = 0000_0000  
Bit  
7:6  
Name  
DCV[1:0] TIP/RING Voltage Adjust.  
Function  
Adjust the voltage on the DCT pin of the line-side device, which affects the TIP/RING voltage  
on the line. Low voltage countries should use a lower TIP/RING voltage. Raising the TIP/  
RING voltage improves signal headroom.  
DCV[1:0] DCT Pin Voltage  
00  
01  
10  
11  
3.1 V  
3.2 V  
3.35 V  
3.5 V  
5:4  
MINI[1:0] Minimum Operational Loop Current.  
Adjusts the minimum loop current so the DAA can operate. Increasing the minimum opera-  
tional loop current improves signal headroom at a lower TIP/RING voltage.  
MINI[1:0] Min Loop Current  
00  
01  
10  
11  
10 mA  
12 mA  
14 mA  
16 mA  
3:2 Reserved Do not write to these register bits.  
1
ILIM  
Current Limiting Enable.  
0 = Current limiting mode disabled.  
1 = Current limiting mode enabled. Limits loop current to a maximum of 60 mA per the TBR21  
standard.  
DC Impedance Selection.  
0
DCR  
0 = 50 dc termination is selected. Use this mode for all standard applications.  
1 = 800 dc termination is selected.  
Rev. 1.05  
69  
Si3056  
Si3018/19/10  
Register 27. Reserved  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
Reset settings = xxxx_xxxx  
Bit Name  
Function  
7:0 Reserved Do not read or write.  
Register 28. Loop Current Status  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
LCS2[7:0]  
R
Reset settings = 0000_0000  
Bit Name  
7:0 LCS2[7:0] Loop Current Status.  
Function  
Eight-bit value returning the loop current. Each bit represents 1.1 mA of loop current.  
0000_0000 = Loop current is less than required for normal operation.  
Register 29. Line Voltage Status  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
LVS[7:0]  
R
Reset settings = 0000_0000  
Bit  
7:0  
Name  
LVS[7:0] Line Voltage Status.  
Function  
Eight-bit value returning the loop voltage. Each bit represents 1 V of loop voltage. This regis-  
ter operates in on-hook and off-hook modes. Bit seven of this register indicates the polarity of  
the TIP/RING voltage. When this bit changes state, it indicates that a polarity reversal has  
occurred. The value returned is represented in 2s compliment format.  
0000_0000 = No line is connected.  
70  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 30. AC Termination Control (Si3019 line-side device only)  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
FULL2  
R/W  
ACIM[3:0]  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:5 Reserved Read returns zero.  
Function  
4
FULL2  
Enhanced Full Scale (2X) Transmit and Receive Mode (Si3019 line-side Revision E or  
later).  
0 = Default  
1 = Transmit/Receive 2X Full Scale  
This bit changes the full scale of the ADC and DAC from 0 min to +6 dBm into 600 load (or  
1.5 dBV into all reference impedances). When this bit is set, the DCV[1:0] bits (Register 26)  
should be set to all 1s to avoid distortion at low loop currents.  
3:0 ACIM[3:0] AC Impedance Selection (Si3019 line-side device only).  
The off-hook ac termination is selected from the following:  
0000 = 600 Ω  
0001 = 900 Ω  
0010 = 270 + (750 || 150 nF) (TBR21) and 275 + (780 || 150 nF)  
0011 = 220 + (820 || 120 nF) (Australia/New Zealand) and 220 + (820 || 115 nF)  
(Slovakia/Slovenia/South Africa/Germany/Austria/Bulgaria)  
0100 = 370 + (620 || 310 nF) (New Zealand #2/India)  
0101 = 320 + (1050 || 230 nF) (England)  
0110 = 370 + (820 || 110 nF)  
0111 = 275 + (780 || 115 nF)  
1000 = 120 + (820 || 110 nF)  
1001 = 350 + (1000 || 210 nF)  
1010 = 0 + (900 || 30 nF) (line-side Revision C or earlier)  
1010 = 200 + (680 || 100 nF) (China) (line-side Revision E or later)  
1011 = 600 + 2.16 µF  
1100 = 900 + 1 µF  
1101 = 900 + 2.16 µF  
1110 = 600 + 1 µF  
1111 = Global impedance  
Rev. 1.05  
71  
Si3056  
Si3018/19/10  
Register 31. DAA Control 3  
Bit  
D7  
D6  
FOH[1:0]  
R/W  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
FULL  
R/W  
OHS2  
R/W  
FILT  
R/W  
LVFD  
R/W  
Reset settings = 0010_0000  
Bit  
Name  
Function  
7
FULL  
Full Scale Transmit and Receive Mode (Si3019 line-side device only).  
0 = Default.  
1 = Transmit/receive full scale.  
This bit changes the full scale of the ADC and DAC from 0 min to +3.2 dBm into a 600 load  
(or 1 dBV into all reference impedances). When this bit is set, the DCV[1:0] bits (Register 26)  
should be set to all 1s to avoid distortion at low loop currents.  
6:5  
FOH[1:0] Fast Off-Hook Selection.  
These bits determine the length of the off-hook counter. The default setting is 128 ms.  
00 = 512 ms.  
01 = 128 ms.  
10 = 64 ms.  
11 = 8 ms.  
4
3
Reserved Read returns zero.  
OHS2  
On-Hook Speed 2.  
This bit, in combination with the OHS bit (Register 16) and the SQ[1:0] bits on-hook speeds  
specified are measured from the time the OH bit is cleared until loop current equals zero.  
OHS  
OHS2  
SQ[1:0]  
00  
Mean On-Hook Speed  
0
0
1
0
1
X
Less than 0.5 ms  
00  
3 ms ±10% (meets ETSI standard)  
26 ms ±10% (meets Australia spark quenching spec)  
11  
2
1
Reserved Read returns zero.  
FILT  
Filter Pole Selection (Si3019 line-side device only).  
0 = The receive path has a low –3 dBFS corner at 5 Hz.  
1 = The receive path has a low –3 dBFS corner at 200 Hz.  
0
LVFD  
Line Voltage Force Disable (Si3019 line-side device only).  
0 = Normal operation.  
1 = The circuitry that forces the LVS register (Register 29) to all 0s at 3 V or less is disabled.  
The LVS register may display unpredictable values at voltages between 0 to 2 V. All 0s are  
displayed if the line voltage is 0 V.  
72  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 32-37. Reserved  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 Reserved Read returns zero.  
Function  
Register 38. TX Gain Control 2 (Si3019 Line-Side Device Only)  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
TGA2  
R/W  
TXG2[3:0]  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:5 Reserved Read returns zero.  
TGA2 Transmit Gain or Attenuation 2.  
Function  
4
0 = Incrementing the TXG2[3:0] bits results in gaining up the transmit path.  
1 = Incrementing the TXG2[3:0] bits results in attenuating the transmit path.  
3:0 TXG2[3:0] Transmit Gain 2.  
Each bit increment represents 1 dB of gain or attenuation, up to a maximum of +12 dB  
and –15 dB respectively.  
For example:  
TGA2  
TXG2[3:0]  
Result  
X
0
0
0
1
1
1
0000  
0001  
:
0 dB gain or attenuation is applied to the transmit path.  
1 dB gain is applied to the transmit path.  
11xx  
0001  
:
12 dB gain is applied to the transmit path.  
1 dB attenuation is applied to the transmit path.  
1111  
15 dB attenuation is applied to the transmit path.  
Rev. 1.05  
73  
Si3056  
Si3018/19/10  
Register 39. RX Gain Control 2 (Si3019 Line-Side Device Only)  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
RGA2  
R/W  
RXG2[3:0]  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:5 Reserved Read returns zero.  
RGA2 Receive Gain or Attenuation 2.  
Function  
4
0 = Incrementing the RXG2[3:0] bits results in gaining up the receive path.  
1 = Incrementing the RXG2[3:0] bits results in attenuating the receive path.  
3:0 RXG2[3:0] Receive Gain 2.  
Each bit increment represents 1 dB of gain or attenuation, up to a maximum of +12 dB and –  
15 dB respectively.  
For example:  
RGA2  
RXG2[3:0]  
Result  
X
0
0
0
1
1
1
0000  
0001  
:
0 dB gain or attenuation is applied to the receive path.  
1 dB gain is applied to the receive path.  
11xx  
0001  
:
12 dB gain is applied to the receive path.  
1 dB attenuation is applied to the receive path.  
1111  
15 dB attenuation is applied to the receive path.  
74  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 40. TX Gain Control 3 (Si3019 Line-Side Device Only)  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
TGA3  
R/W  
TXG3[3:0]  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:5 Reserved Read returns zero.  
TGA3 Transmit Gain or Attenuation 3.  
Function  
4
0 = Incrementing the TXG3[3:0] bits results in gaining up the transmit path.  
1 = Incrementing the TXG3[3:0] bits results in attenuating the transmit path.  
3:0 TXG3[3:0] Transmit Gain 3.  
Each bit increment represents 0.1 dB of gain or attenuation, up to a maximum of 1.5 dB.  
For example:  
TGA3  
TXG3[3:0]  
Result  
X
0
0
0
1
1
1
0000  
0001  
:
0 dB gain or attenuation is applied to the transmit path.  
0.1 dB gain is applied to the transmit path.  
1111  
0001  
:
1.5 dB gain is applied to the transmit path.  
0.1 dB attenuation is applied to the transmit path.  
1111  
1.5 dB attenuation is applied to the transmit path.  
Rev. 1.05  
75  
Si3056  
Si3018/19/10  
Register 41. RX Gain Control 3 (Si3019 Line-Side Device Only)  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
RGA3  
R/W  
RXG3[3:0]  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:5 Reserved Read returns zero.  
RGA3 Receive Gain or Attenuation 2.  
Function  
4
0 = Incrementing the RXG3[3:0] bits results in gaining up the receive path.  
1 = Incrementing the RXG3[3:0] bits results in attenuating the receive path.  
3:0 RXG3[3:0] Receive Gain 3.  
Each bit increment represents 0.1 dB of gain or attenuation, up to a maximum of 1.5 dB.  
For example:  
RGA3  
RXG3[3:0]  
Result  
X
0
0
0
1
1
1
0000  
0001  
:
0 dB gain or attenuation is applied to the receive path.  
0.1 dB gain is applied to the receive path.  
1111  
0001  
:
1.5 dB gain is applied to the receive path.  
0.1 dB attenuation is applied to the receive path.  
1111  
1.5 dB attenuation is applied to the receive path.  
Register 42. Reserved  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 Reserved Read returns zero.  
Function  
76  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 43. Line Current/Voltage Threshold Interrupt (Si3019 Line-Side Device Only)  
Bit  
D7  
D6  
D5  
D4  
D3  
CVT[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit  
7:0  
Name  
CVT[7:0] Current/Voltage Threshold.  
Function  
Determines the threshold at which an interrupt is generated from either the LCS or LVS regis-  
ter. Generate this interrupt to occur when the line current or line voltage rises above or drops  
below the value in the CVT[7:0] register.  
Register 44. Line Current/Voltage Threshold Interrupt Control (Si3019 Line-Side Device Only)  
Bit  
D7  
D6  
D5  
D4  
D3  
CVI  
R/W  
D2  
D1  
D0  
Name  
Type  
CVS  
R/W  
CVM  
R/W  
CVP  
R/W  
Reset settings = 0000_0000  
Bit Name  
7:4 Reserved Read returns zero.  
Function  
3
CVI  
Current/Voltage Interrupt.  
0 = The current / voltage threshold has not been crossed.  
1 = The current / voltage threshold is crossed. If the CVM and INTE bits are set, a hardware  
interrupt occurs on the AOUT/INT pin. Once set, this bit must be written to 0 to be cleared.  
2
1
CVS  
CVM  
Current/Voltage Select.  
0 = The line current shown in the LCS2 register generates an interrupt.  
1 = The line voltage shown in the LVS register generates an interrupt.  
Current/Voltage Interrupt Mask.  
0 = The current / voltage threshold being triggered does not cause a hardware interrupt on the  
AOUT/INT pin.  
1 = The current / voltage threshold being triggered causes a hardware interrupt on the AOUT/  
INT pin.  
0
CVP  
Current/Voltage Interrupt Polarity.  
0 = The current / voltage threshold is triggered by the absolute value of the number in either  
the LCS2 or LVS register falling below the value in the CVT[7:0] register.  
1 = The current / voltage threshold is triggered by the absolute value of the number in the  
either the LCS2 or LVS register rising above the value in the CVT[7:0] Register.  
Rev. 1.05  
77  
Si3056  
Si3018/19/10  
Register 45. Programmable Hybrid Register 1  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB1 [7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB1[7:0] Programmable Hybrid Register 1.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the first tap in the 8-tap filter. When this register is set  
to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid Bal-  
ance" on page 29 for more information on selecting coefficients for the programmable hybrid.  
Register 46. Programmable Hybrid Register 2  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB2[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB2[7:0] Programmable Hybrid Register 2.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the second tap in the 8-tap filter. When this register is  
set to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid  
Balance" on page 29 for more information on selecting coefficients for the programmable  
hybrid.  
78  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 47. Programmable Hybrid Register 3  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB3[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB3[7:0] Programmable Hybrid Register 3.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the third tap in the 8-tap filter. When this register is  
set to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid  
Balance" on page 29 for more information on selecting coefficients for the programmable  
hybrid.  
Register 48. Programmable Hybrid Register 4  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB4[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB4[7:0] Programmable Hybrid Register 4.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the fourth tap in the 8-tap filter. When this register is  
set to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid  
Balance" on page 29 for more information on selecting coefficients for the programmable  
hybrid.  
Rev. 1.05  
79  
Si3056  
Si3018/19/10  
Register 49. Programmable Hybrid Register 5  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB5[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB5[7:0] Programmable Hybrid Register 5.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the fifth tap in the 8-tap filter. When this register is set  
to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid Bal-  
ance" on page 29 for more information on selecting coefficients for the programmable hybrid.  
Register 50. Programmable Hybrid Register 6  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB6[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB6[7:0] Programmable Hybrid Register 6.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the sixth tap in the 8-tap filter. When this register is  
set to all 0s, this filter stage does not effect on the hybrid response. See"5.13.Transhybrid Bal-  
ance" on page 29 for more information on selecting coefficients for the programmable hybrid.  
80  
Rev. 1.05  
Si3056  
Si3018/19/10  
Register 51. Programmable Hybrid Register 7  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB7[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB7[7:0] Programmable Hybrid Register 7.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the seventh tap in the 8-tap filter. When this register is  
set to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid  
Balance" on page 29 for more information on selecting coefficients for the programmable  
hybrid.  
Register 52. Programmable Hybrid Register 8  
Bit  
D7  
D6  
D5  
D4  
D3  
HYB8[7:0]  
R/W  
D2  
D1  
D0  
Name  
Type  
Reset settings = 0000_0000  
Bit Name  
7:0 HYB8[7:0] Programmable Hybrid Register 8.  
Function  
These bits are programmed with a coefficient value to adjust the hybrid response to reduce  
near-end echo. This register represents the eighth tap in the 8-tap filter. When this register is  
set to all 0s, this filter stage does not effect on the hybrid response. See "5.13.Transhybrid  
Balance" on page 29 for more information on selecting coefficients for the programmable  
hybrid.  
Register 53-58 Reserved  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
Reset settings = xxxx_xxxx  
Bit  
Name  
Reserved Do not write to these register bits.  
Function  
7:0  
Rev. 1.05  
81  
Si3056  
Si3018/19/10  
Register 59. Spark Quenching Control  
Bit  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
TB3  
R/W  
SQ1  
R/W  
SQ0  
R/W  
RG1  
R/W  
GCE  
R/W  
Reset settings = 0000_0000  
Bit  
Name  
Function  
7
TB3  
For South Korea PTT compliance, set this bit, in addition to the RZ bit, to synthesize a ringer  
impedance to meet South Korea ringer impedance requirements. This bit should only be set  
to meet South Korea PTT requirements and should only be set in conjunction with the RZ bit.  
Spark Quenching.  
6
SQ1  
This bit, in combination with the OHS bit (Register 16), and the OHS2 bit (Register 31), sets  
the amount of time for the line-side device to go on-hook. The on-hook speeds specified are  
measured from the time the OH bit is cleared until loop current equals zero.  
OHS  
OHS2  
SQ[1:0]  
00  
Mean On-Hook Speed  
Less than 0.5 ms  
0
0
1
0
1
X
00  
3 ms ±10% (meets ETSI standard)  
26 ms ±10% (meets Australia spark quenching  
spec)  
11  
5
4
Reserved Always write this bit to zero.  
Spark Quenching.  
SQ0  
This bit, in combination with the OHS bit (Register 16), and the OHS2 bit (Register 31), sets  
the amount of time for the line-side device to go on-hook. The on-hook speeds specified are  
measured from the time the OH bit is cleared until loop current equals zero.  
OHS  
OHS2  
SQ[1:0]  
00  
Mean On-Hook Speed  
Less than 0.5 ms  
0
0
1
0
1
X
00  
3 ms ±10% (meets ETSI standard)  
26 ms ±10% (meets Australia spark quenching  
spec)  
11  
3
2
Reserved Always write this bit to zero.  
Receive Gain 1 (Line-side Revision E or later).  
RG1  
This bit enables receive path gain adjustment.  
0 = No gain applied to hybrid, full scale RX on line = 0 dBm.  
1 = 1 dB of gain applied to hybrid, full scale RX on line = –1 dBm.  
Guarded Clear Enable (Line-side Revision E or later).  
1
0
GCE  
This bit (in conjunction with the RZ bit set to 1), enables the Si3056 to meet BT’s Guarded  
Clear Spec (B5 6450, Part 1: 1993, Section 15.4.3.3). With these bits set, the DAA will draw  
approximately 2.5 mA of current from the line while on-hook.  
0 = default, DAA does not draw loop current.  
1 = Guarded Clear enabled, DAA draws 2.5 mA while on-hook to meet Guarded Clear  
requirement.  
Reserved Always write this bit to zero.  
82  
Rev. 1.05  
Si3056  
Si3018/19/10  
APPENDIX—UL1950 3RD EDITION  
Although designs using the Si3056 comply with the The bottom schematic of Figure 37 shows the  
UL1950 3rd edition and pass all overcurrent and configuration in which the ferrite beads (FB1 and FB2)  
overvoltage tests, there are still several issues to are on the protected side of the sidactor (RV1). For this  
consider.  
design, the ferrite beads can be rated at 200 mA.  
Figure 37 shows two designs that can pass the UL1950 In a cost-optimized design, compliance to UL1950 does  
overvoltage tests and electromagnetic emissions. The not always require overvoltage tests. Plan ahead to  
top schematic shows the configuration in which the know which overvoltage tests apply to the system.  
ferrite beads (FB1 and FB2) are on the unprotected side System-level elements in the construction, such as fire  
of the sidactor (RV1). For this configuration, the current enclosure and spacing requirements, need to be  
rating of the ferrite beads needs to be 6 A. However, the considered during the design stages. Consult with a  
higher current ferrite beads are less effective in professional testing agency during the design of the  
reducing electromagnetic emissions.  
product to determine which tests apply to the system.  
C8  
75 @ 100 MHz, 6 A  
1.25 A  
FB1  
TIP  
RV1  
75 @ 100 MHz, 6 A  
FB2  
RING  
C9  
C8  
600 at 100 MHz, 200 mA  
FB1  
1.25 A  
TIP  
RV1  
600 at 100 MHz, 200 mA  
FB2  
RING  
C9  
Figure 37. Circuits that Pass all UL1950 Overvoltage Tests  
Rev. 1.05  
83  
Si3056  
Si3018/19/10  
7. Pin Descriptions: Si3056  
MCLK  
1
16  
OFHK  
RGDT/FSD/M1  
M0  
VA  
GND  
AOUT/INT  
C1A  
C2A  
FSYNC  
SCLK  
VD  
SDO  
SDI  
2
3
4
5
6
15  
14  
13  
12  
11  
10  
9
FC/RGDT  
RESET  
7
8
Table 24. Si3056 Pin Descriptions  
Description  
Pin #  
Pin Name  
1
MCLK  
Master Clock Input.  
High speed master clock input. Generally supplied by the system crystal clock or  
modem/DSP.  
2
3
4
5
6
FSYNC  
SCLK  
Frame Sync Output.  
Data framing signal that indicates the start and stop of a communication/data frame.  
Serial Port Bit Clock Output.  
Controls the serial data on SDO and latches the data on SDI.  
V
Digital Supply Voltage.  
Provides the 3.3 V digital supply voltage to the Si3056.  
D
SDO  
SDI  
Serial Port Data Out.  
Serial communication data that is provided by the Si3056 to the modem/DSP.  
Serial Port Data In.  
Serial communication and control data that is generated by the modem/DSP and pre-  
sented as an input to the Si3056.  
7
FC/RGDT  
Secondary Transfer Request Input/Ring Detect.  
An optional signal to instruct the Si3056 that control data is being requested in a sec-  
ondary frame. When daisy chain is enabled, this pin becomes the ring detect output.  
Produces an active low rectified version of the ring signal.  
8
9
RESET  
C2A  
Reset Input.  
An active low input that resets all control registers to a defined, initialized state. Also  
used to bring the Si3056 out of sleep mode.  
Isolation Capacitor 2A.  
Connects to one side of the isolation capacitor C2. Used to communicate with the line-  
side device.  
10  
C1A  
Isolation Capacitor 1A.  
Connects to one side of the isolation capacitor C1. Used to communicate with the line-  
side device.  
84  
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 24. Si3056 Pin Descriptions (Continued)  
Pin #  
Pin Name  
Description  
11  
AOUT/INT  
Analog Speaker Out/Interrupt.  
Provides an analog output signal for driving a call progress speaker or a hardware  
interrupt for multiple sources of interrupts.  
12  
13  
14  
GND  
Ground.  
Connects to the system digital ground.  
V
Analog Supply Voltage.  
Provides the analog supply voltage for the Si3056.  
A
M0  
Mode Select 0.  
The first of two mode select pins that selects the operation of the serial port/DSP inter-  
face.  
15  
16  
RGDT/FSD/M1  
Ring Detect/Delayed Frame Sync/Mode Select 1.  
Output signal that indicates the status of a ring signal. Produces an active low rectified  
version of the ring signal. When daisy chain is enabled, this signal becomes a delayed  
frame sync to drive a slave device. It is also the second of two mode select pins that  
selects the operation of the serial port/DSP interface when RESET is deasserted.  
OFHK  
Off-Hook.  
An active low input control signal that provides a termination across TIP and RING for  
line seizing and pulse dialing,  
Rev. 1.05  
85  
Si3056  
Si3018/19/10  
8. Pin Descriptions: Si3018/19/10  
QE  
DCT  
RX  
DCT2  
IGND  
DCT3  
QB  
QE2  
SC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
IB  
C1B  
C2B  
VREG  
RNG1  
VREG2  
RNG2  
Table 25. Si3018/19/10 Pin Descriptions  
Description  
Pin #  
Pin Name  
1
QE  
Transistor Emitter.  
Connects to the emitter of Q3.  
2
3
4
DCT  
RX  
IB  
DC Termination.  
Provides dc termination to the telephone network.  
Receive Input.  
Serves as the receive side input from the telephone network.  
Isolation Capacitor 1B.  
Connects to one side of isolation capacitor C1. Used to communicate with the system-  
side device.  
5
6
C1B  
C2B  
Internal Bias.  
Provides internal bias.  
Isolation Capacitor 2B.  
Connects to one side of the isolation capacitor C2. Used to communicate with the  
system-side device.  
7
8
VREG  
RNG1  
Voltage Regulator.  
Connects to an external capacitor to provide bypassing for an internal power supply.  
Ring 1.  
Connects through a resistor to the RING lead of the telephone line. Provides the ring  
and caller ID signals to the system-side device.  
9
RNG2  
Ring 2.  
Connects through a resistor to the TIP lead of the telephone line. Provides the ring  
and caller ID signals to the system-side device.  
10  
11  
VREG2  
SC  
Voltage Regulator 2.  
Connects to an external capacitor to provide bypassing for an internal power supply.  
Circuit Enable.  
Enables transistor network. Should be tied through a 0 resistor to I  
.
GND  
12  
QE2  
Transistor Emitter 2.  
Connects to the emitter of transistor Q4.  
86  
Rev. 1.05  
Si3056  
Si3018/19/10  
Table 25. Si3018/19/10 Pin Descriptions (Continued)  
Pin #  
Pin Name  
Description  
13  
QB  
Transistor Base.  
Connects to the base of transistor Q4.  
14  
15  
16  
DCT3  
IGND  
DCT2  
DC Termination 3.  
Provides dc termination to the telephone network.  
Isolated Ground.  
Connects to ground on the line-side interface.  
DC Termination 2.  
Provides dc termination to the telephone network.  
Rev. 1.05  
87  
Si3056  
Si3018/19/10  
9. Ordering Guide1,2  
System Side  
Part Number  
Si3056-KS  
Package  
Lead Free  
No  
Temp Range  
0 to 70 °C  
SOIC-16  
SOIC-16  
Si3056-X-FS  
Yes  
0 to 70 °C  
Line Side  
Part Number  
Si3010-X-FS  
Si3018-X-FS  
Si3019-X-FS  
Notes:  
Package  
SOIC-16  
SOIC-16  
SOIC-16  
Lead Free  
Yes  
Temp Range  
0 to 70 °C  
0 to 70 °C  
0 to 70 °C  
Yes  
Yes  
1. "X" denotes product revision.  
2. Add an "R" at the end of the device to denote tape and reel option; 2500 quantity per reel.  
88  
Rev. 1.05  
Si3056  
Si3018/19/10  
10. Evaluation Board Ordering Guide  
Part Number  
Line-Side  
Device  
Platform  
Intended Use  
Includes Includes  
Platform  
DAA  
Board? Daughter  
Card?  
Si3056PPT-EVB Si3018  
Si3056PPT1-EVB Si3019  
Si3056PPT2-EVB Si3010  
Parallel Port  
Direct Connection to a PC to  
®
use with included Windows -  
Yes  
Yes  
Parallel Port  
Parallel Port  
based SW program.  
(PPT)  
Si3056SSI-EVB  
Si3018  
Serial Interface with Buffer Direct Connection to processor  
or DSP (in customer application  
Yes (SSI) Yes  
Si3056SSI1-EVB Si3019  
Si3056SSI2-EVB Si3010  
Serial Interface with Buffer  
Serial Interface with Buffer  
Daughtercard Only  
or to another EVB).  
Si3056DC-EVB  
Si3018  
Direct Connection to processor  
or DSP (in customer applica-  
tion).  
No  
Yes  
Si3056DC1-EVB Si3019  
Si3056DC2-EVB Si3010  
Daughtercard Only  
Daughtercard Only  
Rev. 1.05  
89  
Si3056  
Si3018/19/10  
11. Package Outline: 16-Pin SOIC  
Figure 38 illustrates the package details for the Si3056/18/19/10. Table 26 lists the values for the dimensions  
shown in the illustration.  
16  
1
9
h
bbb B  
E
H
-B-  
θ
8
L
B
aaa C A B  
Detail F  
-A-  
D
C
A
-C-  
A1  
e
See Detail F  
γ
Seating Plane  
Figure 38. 16-pin Small Outline Integrated Circuit (SOIC) Package  
Table 26. Package Diagram Dimensions  
Millimeters  
Symbol  
Min  
1.35  
.10  
Max  
1.75  
.25  
A
A1  
B
.33  
.51  
C
.19  
.25  
D
9.80  
3.80  
10.00  
4.00  
E
e
1.27 BSC  
H
5.80  
.25  
.40  
6.20  
.50  
1.27  
h
L
γ
0.10  
θ
0º  
8º  
aaa  
bbb  
0.25  
0.25  
90  
Rev. 1.05  
Si3056  
Si3018/19/10  
Updated the following bit descriptions:  
DOCUMENT CHANGE LIST  
Revision 0.2 to Revision 0.71  
R4.7  
R12.4–0  
R14.2  
Updated list of applications on cover page, including  
ability to support V.92 modems.  
R17.4  
R20-21  
Updated Transmit Full Scale Level test condition and  
note in Table 4 (AC Characteristics) for description of  
VCID and DRCID.  
R28  
R29  
R31.0,3,7  
Updated specifications in Table 7, Table 8, and  
Table 9 (Switching Characteristics) and Figure 3,  
Figure 4, and Figure 5.  
R38–41  
Updated “Ordering Guide.”  
Added list of support documentation.  
Updated “3.Bill of Materials” with revised values for  
C3, (10% to 20% tolerance relaxation on same value  
cap) Q4-5 (voltage rating was misstated at 60 V,  
changed to correct 80 V value), R51-52 power rating  
relaxed from 1/10 W to 1/16 W, and updated  
recommended ferrite bead part numbers.  
Fixed several grammatical errors in functional  
descriptions, and globally replaced all instances of  
CTR21 with TBR21.  
Added new functional description “5.1.Upgrading  
from the Si3034/35/44 to Si3056” to describe new  
features and changes to consider when migrating to  
the Si3056.  
Revision 0.71 to Revision 1.0  
Added Si3010 to data sheet title, and to Line-Side  
device support functional description, and  
application circuit.  
Updated Tables 2, 3, & 4 based on production test  
results.  
Updated Table 4 with footnotes to explain expected  
DR and THD when using the Si3056 with the Si3010  
low-speed line-side device.  
Updated BOM.  
Updated Country Specific Register Settings.  
Updated the following functional descriptions:  
Line Voltage/Loop Current Sensing  
Interrupts  
Updated “Power Supplies” functional description to  
reflect 5 V tolerance on Si3056 input pins.  
Updated “5.6.Transmit/Receive Full Scale Level  
(Si3019 Line-Side Only)” functional description.  
Updated“5.8.Line Voltage/Loop Current Sensing”  
functional description.  
DC Termination  
Ring Detection  
Ring Validation  
Ringer Impedance and Threshold  
Caller ID  
Updated “5.15.Ring Validation” functional  
description.  
Overload Detection  
Updated “5.21.2.Type II Caller ID” functional  
description.  
Updated “5.23.Gain Control” functional description.  
Updated “5.26.Digital Interface” functional  
description and Figure 29.  
Updated “Power Management” functional description  
to qualify description to qualify wake-on-ring support  
in low-power sleep mode.  
Updated “5.30.In-Circuit Testing” functional  
description.  
Updated “5.6.Transmit/Receive Full Scale Level  
(Si3019 Line-Side Only)” functional description.  
Updated “5.8.1.Line Voltage Measurement”  
functional description.  
Updated “5.10.Interrupts” functional description.  
Updated “5.11.DC Termination” functional  
description.  
Updated “6.Control Registers” to reflect LVFD bit  
available exclusively with the Si3019 line-side.  
Gain Control (added diagram)  
Power Management  
Revision Identification  
Updated Register Summary  
Updated the following Register Descriptions  
Register 1 bit 1  
Register 3 bit 1 (added bit description)  
Register 4 bit 1 (added bit description)  
Register 5 bit 2  
Register 12 bits 4:0  
Register 13 bit 6  
Register 16 bit 0  
Register 18 bit 1  
Register 19 bit 1  
Register 24 bits 5:0  
Register 31 bit 7  
Updated ordering guide  
Added Evaluation Board ordering guide  
Rev. 1.05  
91  
Si3056  
Si3018/19/10  
Updated "3.Bill of Materials" on page 19.  
Revision 1.0 to Revision 1.01  
Changed recommended case size of FB1, FB2.  
Removed “Confidential” watermark.  
Revision 1.03 to Revision 1.05  
Revision 1.01 to Revision 1.02  
Updated voltage rating from 60 to 80 V for Q4, Q5 in  
bill of materials. This is the actual rating of the  
specified component. This change only corrects the  
typo in the data sheet.  
Updated Figure 25 on page 35.  
Updated reset settings for R.59.  
Added support for TB3 bit to meet South Korea  
ringer impedance requirements.  
Updated Table 2, “Loop Characteristics,” on page 6.  
Updated Table 4, “AC Characteristics,” on page 8  
Updated "3.Bill of Materials" on page 19  
Added optional caller ID circuit components in  
footnotes.  
Removed R14.  
Updated Line Voltage/Loop Current Sensing  
functional description.  
Updated Ordering Guide on page 88.  
Removed product selection and product identification  
sections.  
1 2  
Updated "9.Ordering Guide , " on page 88.  
Updated "11.Package Outline: 16-Pin SOIC" on  
page 90.  
Updated Table 26, “Package Diagram Dimensions,”  
on page 90.  
Revision 1.02 to Revision 1.03  
Updated Table 4 on page 8.  
Updated Table 6 on page 10 to add MCLK jitter  
tolerance.  
Added Table 10 on page 14.  
Updated Table 13 on page 20.  
Updated Table 15 on page 23.  
Changed recommended country settings for Australia,  
Austria, Bahrain, Bulgaria, China, Croatia, Cyprus,  
Czech Republic, Egypt, Germany, Hungary, Israel,  
India, Japan, Jordan, Kazakhstan, Latvia, Lebanon,  
Malyasia, Malta, Morocco, Nigeria, Oman, Pakistan,  
Philippines, Poland, Romania, Russia, Slovakia,  
Slovenia, South Africa, South Korea, Syria, Taiwan,  
Thailand.  
Updated Table 18 on page 28 (changed act for ACIM  
= 1010).  
Added Figure 6 on page 14.  
Updated "5.25.Clock Generation" on page 36.  
Updated Table 23, “Register Summary,” on page 48.  
Updated Table 24, “Si3056 Pin Descriptions,” on  
page 84.  
Updated Figure 19 on page 26.  
Updated "5.6.Transmit/Receive Full Scale Level  
(Si3019 Line-Side Only)" on page 25 of Functional  
description to include new enhanced full scale mode.  
The following bits have been added, but will only be  
supported with Si3018/19/10 Revision E or later line-  
side devices.  
Added FULL2 bit on p. 73.  
Added RG1 and GCE bits on p. 89.  
Updated Table 24 on page 84.  
Updated "9.Ordering Guide , " on page 88.  
Update “12.Product Identification”.  
1 2  
92  
Rev. 1.05  
Si3056  
Si3018/19/10  
SILICON LABORATORIES Si3056 SUPPORT DOCUMENTATION  
Application Note 13: Silicon DAA Software Guidelines  
Application Note 16: Multiple Device Support  
Application Note 17: Designing for International Safety Compliance  
Application Note 67: Layout Guidelines  
Application Note 72: Ring Detection/Validation with the Si305x DAAs  
Application Note 84: Digital Hybrid with the Si305x DAAs  
Si30xxPPT-EVB Data Sheet  
Si30xxSSI-EVB Data Sheet  
Note: Refer to www.silabs.com for a current list of support documents for this chipset.  
Rev. 1.05  
93  
Si3056  
Si3018/19/10  
CONTACT INFORMATION  
Silicon Laboratories Inc.  
4635 Boston Lane  
Austin, TX 78735  
Tel: 1+(512) 416-8500  
Fax: 1+(512) 416-9669  
Toll Free: 1+(877) 444-3032  
Email: SiDAAinfo@silabs.com  
Internet: www.silabs.com  
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.  
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from  
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features  
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-  
resentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-  
quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to  
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-  
sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized ap-  
plication, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.  
Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.  
Other products or brand names mentioned herein are trademarks or registered trademarks of their respective holders.  
94  
Rev. 1.05  

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