SI3216-FTR [SILICON]
Programmable Codec, A/MU-Law, 1-Func, CMOS, PDSO38, ROHS COMPLIANT, TSSOP-38;型号: | SI3216-FTR |
厂家: | SILICON |
描述: | Programmable Codec, A/MU-Law, 1-Func, CMOS, PDSO38, ROHS COMPLIANT, TSSOP-38 电池 电信 光电二极管 电信集成电路 |
文件: | 总122页 (文件大小:731K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Si3216
PROSLIC® PROGRAMMABLE WIDEBAND SLIC/CODEC
WITH RINGING/BATTERY VOLTAGE GENERATION
Features
Dual-mode wideband (50 Hz to 7 kHz)/
narrowband (200 Hz to 3.4 kHz) codec with
16-bit 16 kHz sampling for enhanced audio
quality
Software-programmable features and
parameters:
Ringing frequency, amplitude, cadence,
and waveshape
Performs all BORSCHT functions
Ideal for customer premise equipment
applications
Software-programmable internal ringing up
to 90 VPK
2-wire ac impedance and hybrid
Constant current feed (20 to 41 mA)
Loop closure and ring trip thresholds
Software programmable signal
generation and audio processing:
µ-law/A-law companding
FSK (caller ID) generation
Dual audio tone generators
Smooth and abrupt polarity reversal
100% software-configurable global
solution
Ordering Information
Integrated battery supply with dynamic
voltage output
On-chip dc-dc converter continuously
minimizes power in all operating modes
Entire solution can be powered from a
single 3.3 V or 5 V supply
See page 114.
Pin Assignments
3.3 V to 35 V dc input range
Si3216
QFN
Audio loopback, dc, and GR-909
subscriber line diagnostic capabilities
Lead-free and RoHS-compliant packages
available
Dynamic 0 V to –94.5 V output
Low-cost inductor and high-efficiency
transformer versions supported
Applications
38 37 36 35 34 33 32
1
DTX
FSYNC
RESET
SDCH
SDCL
VDDA1
IREF
CAPP
QGND
CAPM
STIPDC
SRINGDC
31 SDITHRU
2
3
4
30
Voice-over-broadband systems:
DSL, cable, wireless
PBX/IP-PBX/key telephone systems
Terminal adapters: ISDN, Ethernet, USB
DCDRV
29 DCFF
28
27
26
25
24
23
22
21
20
TEST
GNDD
VDDD
ITIPN
ITIPP
VDDA2
IRINGP
IRINGN
IGMP
Description
5
6
7
The Si3216 ProSLIC® is a low-voltage CMOS device that provides a complete analog
telephone interface supporting both wideband (50 Hz to 7.0 kHz) and narrowband
(200 Hz to 3.4 kHz) audio codec modes for enhanced voice quality in Voice-over-IP
(VoIP) applications. The ProSLIC integrates subscriber line interface circuit (SLIC),
wideband voice codec, and battery generation functionality into a single fully-
programmable device for global operation using only one hardware solution. The
Si3216’s wideband codec provides expanded audio band (50 Hz to 7 kHz), 16 kHz
sampling rate, and increased dynamic range for improved audio quality over traditional
telephony codecs. The integrated battery supply continuously adapts its output voltage
to minimize power and enables the entire solution to be powered from a single 3.3 V
(Si3216M only) or 5 V supply. Si3216 features include software-configurable 5 REN
internal ringing up to 90 VPK, DTMF and caller ID generation, and a comprehensive set
of telephony signaling capabilities including expanded support of Japan and China
country requirements. The ProSLIC is packaged in a 38-pin QFN and TSSOP, and the
Si3201 high-voltage line interface device is packaged in a thermally-enhanced 16-pin
SOIC.
8
9
10
11
12
13 14 15 16 17 18 19
U.S. Patent #6,567,521
U.S. Patent #6,812,744
Other patents pending
Functional Block Diagram
INT RESET
Si3216
Line
Status
CS
Control
Interface
SCLK
SDO
SDI
TIP
DTX
Dual-Mode
Wideband/
Narrowband
Codec
Linefeed
Control
Linefeed
Interface
Tone
Generation
Prog.
Hybrid
PCM
Interface
DRX
RING
ZS
FSYNC
PCLK
Discrete
Components
DC-DC Converter Controller
PLL
Rev. 1.0 12/08
Copyright © 2008 by Silicon Laboratories
Si3216
Si3216
2
Rev. 1.0
Si3216
TABLE OF CONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
2.1. Linefeed Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
2.2. Battery Voltage Generation and Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
2.3. Tone Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.4. Ringing Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
2.5. Audio Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
2.6. Two-Wire Impedance Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
2.7. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
2.8. Interrupt Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
2.9. Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
2.10. PCM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
3. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
4. Indirect Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
4.1. Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
4.2. Digital Programmable Gain/Attenuation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
4.3. SLIC Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
4.4. FSK Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109
5. Pin Descriptions: Si3216 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
6. Pin Descriptions: Si3201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
7. Ordering Guides . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114
8. Package Outline: 38-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
9. Package Outline: 38-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
10. Package Outline: 16-Pin ESOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
11. Silicon Labs Si3216 Support Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
Rev. 1.0
3
Si3216
1. Electrical Specifications
Table 1. Absolute Maximum Ratings and Thermal Information
1
Parameter
Symbol
Si3216
Value
Unit
DC Supply Voltage
V
, V
, V
DDA2
–0.5 to 6.0
±10
V
mA
V
DDD
DDA1
Input Current, Digital Input Pins
Digital Input Voltage
I
IN
V
–0.3 to (V
+ 0.3)
DDD
IND
2
Operating Temperature Range
T
–40 to 100
C
A
Storage Temperature Range
T
–40 to 150
C
STG
TSSOP-38 Thermal Resistance, Typical
QFN-38 Thermal Resistance, Typical
70
35
C/W
C/W
W
JA
JA
2
Continuous Power Dissipation
P
0.7
D
Si3201
DC Supply Voltage
V
–0.5 to 6.0
–104
V
V
DD
Battery Supply Voltage
V
BAT
Input Voltage: TIP, RING, SRINGE, STIPE pins
Input Voltage: ITIPP, ITIPN, IRINGP, IRINGN pins
V
(V
– 0.3) to (V + 0.3)
V
INHV
BAT
DD
V
–0.3 to (V + 0.3)
V
IN
DD
2
Operating Temperature Range
T
–40 to 100
–40 to 150
55
C
A
Storage Temperature Range
T
C
STG
3
SOIC-16 Thermal Resistance, Typical
C/W
W
JA
2
Continuous Power Dissipation
P
0.8 at 70 ºC
0.6 at 85 ºC
D
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Operation above 125 ºC junction temperature may degrade device reliability.
3. Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.
4
Rev. 1.0
Si3216
Table 2. Recommended Operating Conditions
Parameter
Symbol
Test Condition
Min*
Typ
Max*
Unit
o
Ambient Temperature
Ambient Temperature
Si3216 Supply Voltage
T
K-grade
B-grade
0
25
25
70
85
C
A
o
T
–40
3.13
C
A
V
,V
,
3.3/5.0
5.25
V
DDD DDA1
V
DDA2
Si3201 Supply Voltage
Si3201 Battery Voltage
V
3.13
–96
3.3/5.0
—
5.25
–10
V
V
DD
V
V
= V
BATH BAT
BAT
*Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 ºC unless otherwise stated.
Product specifications are only guaranteed when the typical application circuit (including component tolerances) is
used.
Rev. 1.0
5
Si3216
Table 3. AC Characteristics—Wideband Audio Mode: Si3216
(VDDA, VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Test Condition
Min
Typ
Max
Unit
TX/RX Performance—Wideband Audio Mode
Overload Level
THD = 1.5%
2.5
—
—
—
—
V
PK
1
Single Frequency Distortion
2-wire – PCM or
PCM – 2-wire:
50 Hz–7.0 kHz
–45
dB
2
Signal-to-(Noise + Distortion) Ratio
50 Hz–7.0 kHz
D/A or A/D 16-bit
Active off-hook and OHT,
Zac = 600
TBD
45
—
—
Audio Tone Generator
0 dBm0, Active off-hook and
—
—
dB
2
Signal-to-Distortion Ratio
OHT, Zac = 600
Intermodulation Distortion
—
—
0
–41
0.5
dB
dB
2
Gain Accuracy
2-wire to PCM, 1014 Hz
–0.5
Zac = 600
PCM to 2-wire, 1014 Hz
–0.5
0
0.5
dB
Zac = 600
Gain Accuracy Over Frequency
Group Delay Over Frequency
Gain Tracking
Zac = 600
Figure 1,2
—
—
—
—
—
—
1014 Hz sine wave, refer-
ence level –10 dBm
signal level:
3 dB to –37 dB
–37 dB to –50 dB
–50 dB to –60 dB
at 1000 Hz
–0.25
–0.5
–1.0
—
—
—
0.25
0.5
dB
dB
dB
s
—
1.0
Round-Trip Group Delay
Gain Step Accuracy
1100
—
—
–6 dB to 6 dB
–0.017
–0.25
–0.1
20
0.017
0.25
0.1
dB
dB
dB
dB
Gain Variation with Temperature
Gain Variation with Supply
2-Wire Return Loss
All gain settings
—
V
= V
= 3.3/5 V ±5%
DDA
—
DDA
50 Hz–7.0 kHz
25
—
Zac = 600
Transhybrid Balance
50 Hz–7.0 kHz
20
—
—
dB
Zac = 600
Notes:
1. The input signal level should be 0 dBm0 for frequencies greater than 100 Hz. For 100 Hz and below, the level should be
–10 dBm0. The output signal magnitude at any other frequency will be smaller than the maximum value specified.
2. Analog signal measured as V
– V
. Assumes ideal line impedance matching.
TIP
RING
3. The level of any unwanted tones within the bandwidth of 0 to 8 kHz does not exceed –55 dBm.
4. Assumes normal distribution of betas.
6
Rev. 1.0
Si3216
Table 3. AC Characteristics—Wideband Audio Mode: Si3216 (Continued)
(VDDA, VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Test Condition
Min
Typ
Max
Unit
Noise Performance—Wideband Audio Mode
3
Idle Channel Noise
7 kHz flat
—
40
40
40
—
—
—
—
23
—
—
—
dBrn
dB
PSRR from V
PSRR from V
PSRR from V
RX and TX, DC to 7 kHz
RX and TX, DC to 7 kHz
RX and TX, DC to 7 kHz
DDA
DDD
BAT
dB
dB
Longitudinal Performance—Wideband Audio Mode
Longitudinal to Metallic or PCM
Balance
50 Hz–7.0 kHz,
—
60
—
dB
Q1,Q2
150, 1% mismatch
4
60 to 240
—
—
40
60
60
—
—
dB
dB
Q1,Q2
4
300 to 800
Q1,Q2
Metallic to Longitudinal Balance
Longitudinal Impedance
50 Hz–7.0 kHz
—
—
dB
50 Hz–7.0 kHz at TIP or
RING
Register selectable
ETBO/ETBA
00
01
10
—
—
—
33
17
17
—
—
—
Longitudinal Current per Pin
Active off-hook
50 Hz–7.0 kHz
Register selectable
ETBO/ETBA
—
—
—
4
8
8
—
—
—
mA
mA
mA
00
01
10
Notes:
1. The input signal level should be 0 dBm0 for frequencies greater than 100 Hz. For 100 Hz and below, the level should be
–10 dBm0. The output signal magnitude at any other frequency will be smaller than the maximum value specified.
2. Analog signal measured as V
– V
. Assumes ideal line impedance matching.
TIP
RING
3. The level of any unwanted tones within the bandwidth of 0 to 8 kHz does not exceed –55 dBm.
4. Assumes normal distribution of betas.
Rev. 1.0
7
Si3216
(dB)
+1
(Hz)
50
100
6.4k 7k
8k
9k
–1
–4.5
–25
–45
Figure 1. Transmit and Receive Path Attenuation Distortion—Wideband Mode
(ms)
4
2
1
0.25
(Hz)
50
100
300
4k
6.4k
7k
Figure 2. Transmit and Receive Path Group Delay Distortion—Wideband Mode
8
Rev. 1.0
Si3216
Table 4. AC Characteristics—Narrowband Audio Mode
(VDDA, VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Test Condition
Min
Typ
Max
Unit
TX/RX Performance—Narrowband Audio Mode
Overload Level
THD = 1.5%
2.5
—
—
—
—
V
PK
1
Single Frequency Distortion
2-wire – PCM or
PCM – 2-wire:
200 Hz–3.4 kHz
–45
dB
2
Signal-to-(Noise + Distortion) Ratio
200 Hz–3.4 kHz
D/A or A/D 16-bit
Active off-hook and OHT,
any Zac
Figure 3
45
—
—
Audio Tone Generator
0 dBm0, Active off-hook and
OHT, any Zac
—
—
dB
2
Signal-to-Distortion Ratio
Intermodulation Distortion
—
—
0
–41
0.5
0.5
—
dB
dB
dB
2
Gain Accuracy
2-wire to PCM, 1014 Hz
PCM to 2-wire, 1014 Hz
–0.5
–0.5
0
Gain Accuracy Over Frequency
Group Delay Over Frequency
Figure 5,6
Figure 7,8
—
—
—
3
Gain Tracking
1014 Hz sine wave, refer-
ence level –10 dBm
signal level:
3 dB to –37 dB
–37 dB to –50 dB
–50 dB to –60 dB
at 1000 Hz
–0.25
–0.5
–1.0
—
—
—
0.25
0.5
dB
dB
dB
µs
—
1.0
Round-Trip Group Delay
Gain Step Accuracy
Gain Variation with Temperature
Gain Variation with Supply
2-Wire Return Loss
Transhybrid Balance
Notes:
1100
—
—
–6 dB to 6 dB
–0.017
–0.25
–0.1
30
0.017
0.25
0.1
dB
dB
dB
dB
dB
All gain settings
—
V
= V
= 3.3/5 V ±5%
DDA
—
DDA
200 Hz–3.4 kHz
200 Hz–3.4 kHz
35
—
—
30
—
1. The input signal level should be 0 dBm0 for frequencies greater than 100 Hz. For 100 Hz and below, the level should be
–10 dBm0. The output signal magnitude at any other frequency will be smaller than the maximum value specified.
2. Analog signal measured as V
– V
. Assumes ideal line impedance matching.
TIP
RING
3. The quantization errors inherent in the µ/A-law companding process can generate slightly worse gain tracking performance
in the signal range of 3 dB to –37 dB for signal frequencies that are integer divisors of the 8 kHz PCM sampling rate.
4. The level of any unwanted tones within the bandwidth of 0 to 4 kHz does not exceed –55 dBm.
5. Assumes normal distribution of betas.
Rev. 1.0
9
Si3216
Table 4. AC Characteristics—Narrowband Audio Mode (Continued)
(VDDA, VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Test Condition
Min
Typ
Max
Unit
Noise Performance—Narrowband Audio Mode
4
Idle Channel Noise
C-Message Weighted
Psophometric Weighted
3 kHz flat
—
—
—
40
40
40
—
—
—
—
—
—
15
–75
18
—
dBrnC
dBmP
dBrn
dB
PSRR from VDDA
RX and TX, DC to 3.4 kHz
RX and TX, DC to 3.4 kHz
RX and TX, DC to 3.4 kHz
PSRR from V
PSRR from V
—
dB
DDD
BAT
—
dB
Longitudinal Performance—Narrowband Audio Mode
Longitudinal to Metallic or PCM
Balance
200 Hz–3.4 kHz,
—
60
—
dB
Q1,Q2
150, 1% mismatch
5
60 to 240
—
—
—
40
60
60
60
—
—
—
—
—
dB
dB
dB
dB
Q1,Q2
5
300 to 800
Q1,Q2
Using Si3201
Metallic to Longitudinal Balance
Longitudinal Impedance
200 Hz–3.4 kHz
200 Hz–3.4 kHz
at TIP or RING
Register selectable
ETBO/ETBA
00
01
10
—
—
—
33
17
17
—
—
—
Longitudinal Current per Pin
Active off-hook
200 Hz–3.4 kHz
Register selectable
ETBO/ETBA
—
—
—
4
8
8
—
—
—
mA
mA
mA
00
01
10
Notes:
1. The input signal level should be 0 dBm0 for frequencies greater than 100 Hz. For 100 Hz and below, the level should be
–10 dBm0. The output signal magnitude at any other frequency will be smaller than the maximum value specified.
2. Analog signal measured as V
– V
. Assumes ideal line impedance matching.
TIP
RING
3. The quantization errors inherent in the µ/A-law companding process can generate slightly worse gain tracking performance
in the signal range of 3 dB to –37 dB for signal frequencies that are integer divisors of the 8 kHz PCM sampling rate.
4. The level of any unwanted tones within the bandwidth of 0 to 4 kHz does not exceed –55 dBm.
5. Assumes normal distribution of betas.
10
Rev. 1.0
Si3216
Figure 3. Transmit and Receive Path SNDR—Narrowband Mode
9
8
7
6
Fundamental
Acceptable
5
Output Power
Region
(dBm0)
4
3
2.6
2
1
0
1
2
3
4
5
6
7
8
9
Fundamental Input Power (dBm0)
Figure 4. Overload Compression Performance
Rev. 1.0
11
Si3216
Typical Response
Typical Response
Figure 5. Transmit Path Frequency Response—Narrowband Mode
12
Rev. 1.0
Si3216
Figure 6. Receive Path Frequency Response—Narrowband Mode
Rev. 1.0
13
Si3216
Figure 7. Transmit Group Delay Distortion—Narrowband Mode
Figure 8. Receive Group Delay Distortion—Narrowband Mode
14
Rev. 1.0
Si3216
Table 5. Linefeed Characteristics
(VDDA, VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Loop Resistance Range
R
See Note
0
—
—
—
160
10
4
%
V
LOOP
DC Loop Current Accuracy
I
= 29 mA, ETBA = 4 mA
–10
–4
LIM
DC Open Circuit Voltage
Accuracy
Active Mode; V = 48 V,
OC
V
– V
TIP
RING
DC Differential Output
Resistance
R
I
< I
LIM
—
–4
160
—
—
4
V
DO
LOOP
DC Open Circuit Voltage—
Ground Start
V
R
I
<I ; V
wrt ground
RING
= 48 V
OCTO
ROTO
RING LIM
V
OC
DC Output Resistance—
Ground Start
I
<I ; RING to ground
—
160
—
—
RING LIM
DC Output Resistance—
Ground Start
R
TIP to ground
150
–20
–20
—
—
k
%
%
TOTO
Loop Closure/Ring Ground
Detect Threshold Accuracy
I
= 11.43 mA
—
20
20
—
THR
Ring Trip Threshold
Accuracy
R
= 1100
—
THR
Ring Trip Response Time
User Programmable Register 70
and Indirect Register 23
—
Ring Amplitude
V
R
5 REN load; sine wave;
44
—
—
V
rms
TR
R
= 160 V
= –75 V
LOOP
BAT
Ring DC Offset
Programmable in Indirect
Register 6
0
—
—
V
OS
Trapezoidal Ring Crest
Factor Accuracy
Crest factor = 1.3
–.05
1.35
—
.05
1.45
Sinusoidal Ring Crest
Factor
R
—
CF
Ringing Frequency Accuracy
Ringing Cadence Accuracy
Calibration Time
f = 20 Hz
–1
–50
—
—
—
—
—
1
%
ms
ms
%
Accuracy of ON/OFF Times
CAL to CAL Bit
50
600
25
Power Alarm Threshold
Accuracy
At Power Threshold = 300 mW
–25
Note: DC resistance round trip; 160 corresponds to 2 kft 26 gauge AWG.
Rev. 1.0
15
Si3216
Table 6. Monitor ADC Characteristics
(VDDA, VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Differential Nonlinearity
(6-bit resolution)
DNLE
–1/2
—
1/2
LSB
Integral Nonlinearity
(6-bit resolution)
INLE
–1
—
1
LSB
Gain Error (voltage)
Gain Error (current)
—
—
—
—
10
20
%
%
Table 7. Si321x DC Characteristics, VDDA = VDDD = 5.0 V
(VDDA, VDDD = 4.75 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
V
0.7 x V
—
—
—
—
—
0.3 x V
—
V
V
V
IH
DDD
V
IL
DDD
DIO1,DIO2,SDITHRU:IO = –4 mA
SDO, DTX:IO = –8 mA
V
V
– 0.6
OH
DDD
DOUT: IO = –40 mA
V
– 0.8
—
—
—
V
V
DDD
DIO1,DIO2,DOUT,SDITHRU:
IO = 4 mA
Low Level Output Voltage
Input Leakage Current
V
—
0.4
OL
SDO,INT,DTX:IO = 8 mA
I
–10
—
10
µA
L
Table 8. Si321x DC Characteristics, VDDA = VDDD = 3.3 V
(VDDA, VDDD = 3.13 to 3.47 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Symbol
Test Condition
Min
Typ
—
Max
Unit
V
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
V
0.7 x V
—
—
IH
DDD
V
—
0.3 x V
—
V
IL
DDD
DIO1,DIO2,SDITHRU:IO = –2 mA
SDO, DTX:IO = –4 mA
V
V
– 0.6
—
V
OH
DDD
DOUT: IO = –40 mA
V
– 0.8
—
—
—
V
V
DDD
DIO1,DIO2,DOUT,SDITHRU:
IO = 2 mA
Low Level Output Voltage
Input Leakage Current
V
—
0.4
OL
SDO,INT,DTX:IO = 4 mA
I
–10
—
10
A
L
16
Rev. 1.0
Si3216
Table 9. Power Supply Characteristics
(VDDA,VDDD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
1
2
Parameter
Symbol
I + I
Test Condition
Max
Unit
Typ
Typ
Power Supply Current,
Analog and Digital
Sleep (RESET = 0)
Open
0.1
33
37
0.13
42.8
53
0.3
49
68
mA
mA
mA
A
D
Active on-hook
ETBO = 4 mA, codec and Gm
amplifier powered down
Active OHT
ETBO = 4 mA
Active off-hook
ETBA = 4 mA, I
57
72
83
mA
mA
= 20 mA
73
36
88
47
99
55
LIM
Ground-start
mA
Ringing
mA
µA
µA
µA
mA
Sinewave, REN = 1, V = 56 V
45
—
55
65
—
PK
V
Supply Current (Si3201)
I
Sleep mode, RESET = 0
Open (high impedance)
100
DD
VDD
—
—
—
100
110
1
—
—
—
Active on-hook standby
Forward/reverse active off-hook, no
I
, ETBO = 4 mA, V
= –24 V
LOOP
BAT
Forward/reverse OHT, ETBO = 4 mA,
= –70 V
—
1
—
mA
V
BAT
3
V
Supply Current
I
Sleep (RESET = 0)
Open (DCOF = 1)
Active on-hook
—
—
0
0
—
—
mA
mA
BAT
BAT
mA
mA
V
= 48 V, ETBO = 4 mA
—
—
3
—
—
OC
Active OHT
ETBO = 4 mA
11
Active off-hook
ETBA = 4 mA, I
mA
mA
= 20 mA
—
—
30
2
—
—
LIM
Ground-start
Ringing
V
mA
= 56 V
,
PK
—
—
5.5
—
—
PK_RING
sinewave ringing, REN = 1
V
Supply Slew Rate
When using Si3201
10
V/µs
BAT
Notes:
1. VDDD, VDDA = 3.3 V.
2. VDDD, VDDA = 5.25 V.
3. IBAT = current from VBAT (the large negative supply). For a switched-mode power supply regulator efficiency of 71%,
the user can calculate the regulator current consumption as IBAT x VBAT/(0.71 x VDC).
Rev. 1.0
17
Si3216
Table 10. Switching Characteristics—General Inputs
VDDA = VDDA = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade, CL = 20 pF)
Parameter
Symbol
Min
—
Typ
—
Max
20
Unit
ns
Rise Time, RESET
RESET Pulse Width
t
r
t
100
—
—
ns
rl
Note: All timing (except Rise and Fall time) is referenced to the 50% level of the waveform. Input test levels are
IH = VD – 0.4 V, VIL = 0.4 V. Rise and Fall times are referenced to the 20% and 80% levels of the waveform.
V
Table 11. Switching Characteristics—SPI
VDDA = VDDA = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade, CL = 20 pF
Parameter
Test
Conditions
Symbol
Min
Typ
Max
Unit
Cycle Time SCLK
t
0.062
—
—
—
—
—
—
—
25
25
20
20
s
ns
ns
ns
ns
c
Rise Time, SCLK
t
r
Fall Time, SCLK
t
—
f
Delay Time, SCLK Fall to SDO Active
t
t
—
d1
d2
Delay Time, SCLK Fall to SDO
Transition
—
Delay Time, CS Rise to SDO Tri-state
Setup Time, CS to SCLK Fall
Hold Time, CS to SCLK Rise
Setup Time, SDI to SCLK Rise
Hold Time, SDI to SCLK Rise
t
—
25
—
—
—
—
—
—
20
—
—
—
—
—
ns
ns
ns
ns
ns
ns
d3
t
su1
t
20
h1
t
25
su2
t
20
h2
Delay Time between Chip Selects
(Continuous SCLK)
t
440
cs
cs
d4
Delay Time between Chip Selects
(Non-continuous SCLK)
t
220
—
—
ns
ns
SDI to SDITHRU Propagation Delay
t
—
4
10
Note: All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VDDD –0.4 V, VIL = 0.4 V
18
Rev. 1.0
Si3216
tthru
tc
tr
tr
SCLK
CS
tsu1
th1
tcs
tsu2
th2
SDI
td1
td3
td2
SDO
Figure 9. SPI Timing Diagram
Table 12. Switching Characteristics—PCM Highway Serial Interface
VD = 3.13 to 5.25 V, TA = 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade, CL = 20 pF
Parameter
Test
Conditions
1
1
1
Symbol
Units
Min
Typ
Max
PCLK Frequency
1/t
—
—
—
—
—
—
—
—
0.256
0.512
0.768
1.024
1.536
2.048
4.096
8.192
—
—
—
—
—
—
—
—
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
c
PCLK Duty Cycle Tolerance
PCLK Period Jitter Tolerance
Rise Time, PCLK
t
40
50
—
—
—
—
—
60
120
25
%
ns
ns
ns
ns
ns
dty
t
–120
—
jitter
t
r
Fall Time, PCLK
t
—
25
f
Delay Time, PCLK Rise to DTX Active
t
t
—
20
d1
d2
Delay Time, PCLK Rise to DTX
Transition
—
20
2
Delay Time, PCLK Rise to DTX Tri-state
Setup Time, FSYNC to PCLK Fall
Hold Time, FSYNC to PCLK Fall
Setup Time, DRX to PCLK Fall
Hold Time, DRX to PCLK Fall
Notes:
t
—
25
20
25
20
—
—
—
—
—
20
—
—
—
—
ns
ns
ns
ns
ns
d3
t
su1
t
h1
t
su2
t
h2
1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH – VI/O –0.4 V, VIL = 0.4 V.
2. Spec applies to PCLK fall to DTX tri-state when that mode is selected (TRI = 0).
Rev. 1.0
19
Si3216
tr
tf
tc
PCLK
th1
tsu1
FSYNC
tsu2
th2
DRX
DTX
td2
td1
td3
Figure 10. PCM Highway Interface Timing Diagram
VCC
R1
200k
15
20
38
37
STIPDC
STIPAC
SCLK
SDI
C24
0.1 F
C3
220 nF
SPI Bus
PCM
VCC
R8
4.7K
36
1
SDO
CS
6
3
4
C18
4.7 F
C19
4.7 F
FSYNC
PCLK
DRX
15
29
ITIPN
IRINGN
ITIPP
ITIPN
Bus
VCC
13
16
14
11
10
25
28
26
17
19
5
IRINGN
ITIPP
DTX
1
3
TIP
R322
10k
TIP
C5
22nF
IRINGP
STIPE
IRINGP
STIPE
SRINGE
Protection
Circuit
2
7
R2
196k
INT
Note 2
C6
22nF
RESET
R4
196k
R262
40.2k
RING
RING
SRINGE
24
22
IGMP
IGMN
R15
243
R7
4.02k
R6
4.02k
18
SVBAT
11
12
14
R5
200k
IREF
CAPP
CAPM
C4
220 nF
R9
4.7K
R14
40.2k
C2
10 F
C1
10 F
21
16
SRINGAC
SRINGDC
13
QGND
R3
Notes:
200k
L2
1. Values and configurations for these
components can be derived from Table 18
or from App Note 45.
2. Only one component per system needed.
3. All circuit ground should have a single-point
connection to the ground plane.
4. Si3201 bottom-side exposed pad should be
electrically and thermally connected to bulk
ground plane.
C26
0.1 F
VDDA1 VDDA2
47 H
VDDD
GND
C31
10 F
10 V
Q9
R21
15
C15
C16
C17
C30
10 F
2N2222
0.1 F
0.1 F 0.1 F
VCC
R291
R281
VDC
Note 1
VBAT
DC-DC Converter
Circuit
VDC
Figure 11. Si3216(M) Application Circuit Using Si3201
20
Rev. 1.0
Si3216
Table 13. Si3216(M) + Si3201 External Component Values
Value
Component (s)
Supplier
C1,C2
10 µF, 6 V Ceramic or 16 V Low Leakage Electrolytic,
±20%
Murata, Nichicon URL1C100MD
C3,C4
C5,C6
220 nF, 100 V, X7R, ±20%
22 nF, 100 V, X7R, ±20%
0.1 µF, 6 V, Y5V, ±20%
4.7 µF Ceramic, 6 V, X7R, ±20%
0.1 µF, 100 V, X7R, ±20%
10 µF, 6 V, Electrolytic, ±20%
47 µH, 150 A
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Panasonic
C15,C16,C17,C24
C18,C19
C26
C30, C31
L2
Coilcraft
R1,R3,R5
R2,R4
200 k, 1/10 W, ±1%
196 k, 1/10 W, ±1%
4.02 k, 1/10 W, ±1%
4.7 k, 1/10 W, ±1%
R6,R7
R8,R9
R14,R26*
R15
40.2 k, 1/10 W, ±1%
243 , 1/10 W, ±1%
R21
15 , 1/4 W, ±5%
R28,R29
1/10 W, 1% (See “AN45: Design Guide for The Si3210
DC-DC Converter” or Table 18 for value selection)
R32*
Q9
10 k, 1/10 W, ±5%
60 V, General Purpose Switching NPN
ON Semi MMBT2222ALT1; Central
Semi CMPT2222A; Zetex
FMMT2222
*Note: Only one component is necessary on each signal in the system.
Rev. 1.0
21
Si3216
VCC
GND
R1
200k
38
37
SCLK
SDI
15
20
GND
STIPDC
STIPAC
SPI Bus
36
1
SDO
CS
R8
4.7k
C3
220nF
6
3
4
FSYNC
PCLK
DRX
Q4
5401
28
29
17
Q1
5401
ITIPP
ITIPN
STIPE
R10
10
PCM Bus
C324
0.1 µF
Q6
5551
TIP
5
VCC
DTX
C8
220nF
R102 (100k)
R13
5.1k
C5
22nF
R2
100k
2
R32
Protection
Circuit
10k
R6
80.6
26
25
19
C6
22nF
2
7
IRINGP
IRINGN
SRINGE
INT
Note 2
Q2
5401
Q3
5401
RESET
RING
C344
0.1 µF
R4
100k
R11
10
R262
40.2k
24
22
Q5
5551
R104 (100k)
IGMP
IGMN
R15
243
C7
220nF
R12
5.1k
R5
100k
C334
0.1 µF
18
R104 (100k)
SVBAT
11
12
14
IREF
CAPP
CAPM
R7
80.6
C4
220nF
R9
4.7k
C2
10uF
C1
10uF
R14
40.2k
21
16
SRINGAC
SRINGDC
Notes:
13
1. Values and configurations for these
components can be derived from Table 18
or from “AN45: Design Guide for the
Si3210/15/16 DC-DC Converter”.
2. Only one component per system needed.
3. All circuit grounds should have a single-
point connection to the ground plane.
4. Optional components to improve idle
channel noise.
QGND
R3
200k
C26
0.1uF
GND
L2
47 H
R21
15
VDDA1 VDDA2
VDDD
Q9
2N2222
C31
10 F
10 V
VCC
C15
0.1 F
C16
C17
C30
10 F
VDC
1
1
R29
R28
0.1 F 0.1 F
Note 1
DC-DC Converter
Circuit
VBAT
VDC
Figure 12. Si3216(M) Typical Application Circuit Using Discrete Line Interface Circuit
Table 14. Si3216(M) External Component Values
Component
Value
Supplier/Part Number
C1,C2
10 µF, 6 V Ceramic/Tantalum or 16 V Low Leakage
Murata, Panasonic, Nichicon
URL1C100MD
Electrolytic, 20%
C3,C4
C5,C6
220 nF, 100 V, X7R, 20%
22 nF, 100 V, X7R, 20%
220 nF, 50 V, X7R, 20%
0.1 µF, 6 V, Y5V, 20%
0.1 µF, 100 V, X7R, 20%
10 µF, 16 V, Electrolytic, 20%
47 µH, 150 A
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Panasonic
C7,C8
C15,C16,C17
C26
C30, C31
L2
Coilcraft
Q1,Q2,Q3,Q4
120 V, PNP, BJT
Central Semi CMPT5401; ON Semi
MMBT5401LT1, 2N5401; Zetex
FMMT5401;
Fairchild 2N5401; Samsung 2N5401
Q5,Q6
Q9
120 V, NPN, BJT
Central Semi CZT5551, ON Semi
2N5551;
Fairchild 2N5551; Phillips 2N5551
NPN General Purpose BJT
ON Semi MMBT2222ALT1; Central Semi
CMPT2222A; Zetex FMMT2222
22
Rev. 1.0
Si3216
Table 14. Si3216(M) External Component Values (Continued)
R1,R3
200 k, 1/10 W, 1%
100 k, 1/10 W, 1%
R2,R4,R5,
R102,R104,R105
R6,R7
R8,R9
80.6 , 1/4 W, 1%
4.7 k, 1/10 W, 1%
10 , 1/10 W, 5%
5.1 k, 1/10 W, 5%
40.2 k, 1/10 W, 1%
243 , 1/10 W, 1%
15 , 1/4 W, 1%
R10,R11
R12,R13
R14,R26*
R15
R21
R28,R29
1/10 W, 1% (See “AN45: Design Guide for The
Si3210 DC-DC Converter” or Table 18 for value
selection)
R32*
10 k, 1/10 W, 5%
*Note: Only one component is necessary on each signal in the system.
VDC
F1
SDCH
SDCL
R191
C252
10 µF
C142
0.1 µF
R181
Note 1
R201
C10
0.1 µF
R16
200
Q7
FZT953
DCFF
Q8
2N2222
D1
ES1D
VBAT
C9
10 µF
R17
L1
DCDRV
Note 1
GND
Notes:
1. Values and configurations for these components can be derived
from Table 20 or from “AN45: Design Guide for the Si3210/15/16
DC-DC Converter”.
2. Voltage rating for C14 and C25 must be greater than VDC.
Figure 13. Si321x BJT/Inductor DC-DC Converter Circuit
Rev. 1.0
23
Si3216
Table 15. Si321x BJT/Inductor DC-DC Converter Component Values
Component(s)
Value
Supplier
C9
10 µF, 100 V, Electrolytic, ±20%
0.1 µF, X7R, ±20%
Panasonic
C10*
C14*
C25*
R16
R17
Murata, Johanson, Novacap, Venkel
Murata, Johanson, Novacap, Venkel
Panasonic
0.1 µF, X7R, ±20%
10 F, Electrolytic, ±20%
200 , 1/10 W, ±5%
1/10 W, ±5% (See “AN45: Design Guide for The Si3210 DC-
DC Converter” or Table 20 for value selection)
R18
R19,R20
F1
1/4 W, ±5% (See AN45 or Table 20 for value selection)
1/10 W, ±1% (See AN45 or Table 20 for value selection)
Fuse
Belfuse SSQ Series
D1
Ultra Fast Recovery 200 V, 1 A Rectifier
General Semi ES1D; Central Semi
CMR1U-02
L1
1A, Shielded Inductor (See AN45 or
Table 20 for value selection)
API Delevan SPD127 series, Sumida
CDRH127 series, Datatronics DR340-1
series, Coilcraft DS5022
Q7
Q8
120 V, High Current Switching PNP
60 V, General Purpose Switching NPN
Zetex FZT953, FZT955, ZTX953,
ZTX955; Sanyo 2SA1552
ON Semi MMBT2222ALT1; Central
Semi CMPT2222A; Zetex FMMT2222
*Note: Voltage rating of this device must be greater than VDC
.
VDC
F1
SDCH
R191
C252
10 µF
C142
0.1 µF
R181
Note 1
R201
SDCL
1
2
3
4
R22
22
C27
470 pF
D1
ES1D
VBAT
6
DCFF
M1
IRLL014N
C9
10 µF
10
1
T1
Note 1
R17
200 k
DCDRV
NC
GND
Notes:
1. Values and configurations for these components can be derived
from Table 19 or from “AN45: Design Guide for the Si3210/15/16
DC-DC Converter”.
2. Voltage rating for C14 and C25 must be greater than VDC.
Figure 14. Si321xM MOSFET/Transformer DC-DC Converter Circuit
24
Rev. 1.0
Si3216
Table 16. Si321xM MOSFET/Transformer DC-DC Converter Component Values
Component (s)
Value
Supplier
C9
10 µF, 100 V, Electrolytic, ±20%
0.1 µF, X7R, ±20%
Panasonic
C14*
C25*
C27
R17
R18
Murata, Johanson, Novacap, Venkel
Panasonic
10 µF, Electrolytic, ±20%
470 pF, 100 V, X7R, ±20%
200 k, 1/10 W, ±5%
Murata, Johanson, Novacap, Venkel
1/4 W, ±5% (See “AN45: Design Guide for the Si3210 DC-
DC Converter” or Table 19 for value selection)
R19,R20
1/10 W, ±1% (See AN45 or Table 19
for value selection)
R22
F1
22 , 1/10 W, ±5%
Fuse
Belfuse SSQ Series
D1
Ultra Fast Recovery 200 V, 1A Rectifier
General Semi ES1D; Central Semi
CMR1U-02
T1
Power Transformer
Coiltronic CTX01-15275;
Datatronics SM76315;
Midcom 31353R-02
M1
100 V, Logic Level Input MOSFET
Intl Rect. IRLL014N; Intersil
HUF76609D3S; ST Micro
STD5NE10L, STN2NE10L
*Note: Voltage rating of this device must be greater than VDC
.
QRDN
QTDN
Q3
Q4
5401
5401
R23
RRBN0
3.0k
R24
RTBN0
3.0k
QRP
Q5
QTN
5551
Q6
C8
CTBN
100 nF
5551
C7
CRBN
100 nF
R7
RRE
80.6
R12
RRBN
5.1k
R6
RTE
80.6
R13
RTBN
5.1k
Figure 15. Si321x Optional Equivalent Q5, Q6 Bias Circuit
Rev. 1.0
25
Si3216
Table 17. Si321x Optional Bias Component Values
Component
C7,C8
Value
Supplier/Part Number
Murata, Johanson, Venkel
100 nF, 100 V, X7R, 20%
3.0 k, 1/10 W, 5%
R23,R24
The subcircuit above can be substituted into any of the ProSLIC solutions as an optional bias circuit for Q5, Q6. For
this optional subcircuit, C7 and C8 are different in voltage and capacitance to the standard circuit. R23 and R24 are
additional components.
Table 18. Component Value Selection for Si321x/Si321xM
Component
Value
Comments
R28 = (V + V )/148 µA
R28
1/10 W, 1% resistor
DD
BE
For V = 3.3 V: 26.1 k
where V is the nominal VBE for Q9
BE
DD
For V = 5.0 V: 37.4 k
DD
R29
1/10 W, 1% resistor
R29 = V
/148 µA
CLAMP
For V
For V
For V
= 80 V: 541 k
= 85 V: 574 k
= 100 V: 676 k
where V
is the clamping voltage for V
CLAMP BAT
CLAMP
CLAMP
CLAMP
Table 19. Component Value Selection Examples for Si321xM MOSFET/Transformer DC-DC Converter
VDC
3.3 V
5.0 V
12 V
24 V
Ringing Load/Loop Resistance
3 REN/117
Transformer Ratio
R18
R19, R20
7.15 k
16.5 k
56.2 k
121 k
1:2
1:2
1:3
1:4
0.06
0.10
0.68
2.20
5 REN/117
5 REN/117
5 REN/117
Note: There are other system and software conditions that influence component value selection; so, please refer to “AN45:
Design Guide for the Si3210 DC-DC Converter” for detailed guidance.
Table 20. Component Value Selection Examples for Si321x BJT/Inductor DC-DC Converter
VDC
5 V
Ringing Load/Loop Length
3 REN/117
L1
R17
R18
R19, R20
16.5 k
56.2k
33 µH
150 µH
560 µH
100
162
274
0.12
0.56
2.2
12 V
24 V
5 REN/117
5 REN/117
121 k
Note: There are other system and software conditions that influence component value selection, so please refer to “AN45:
Design Guide for the Si3210 DC-DC Converter” for detailed guidance.
26
Rev. 1.0
Si3216
2.1.1. DC Feed Characteristics
2. Functional Description
The ProSLIC has programmable constant voltage and
constant current zones as depicted in Figure 16. Open
The ProSLIC is a single, low-voltage CMOS device that
provides all SLIC, codec, DTMF detection, and signal
generation functions needed for a complete analog
telephone interface. The ProSLIC performs all battery,
overvoltage, ringing, supervision, codec, hybrid, and
test (BORSCHT) functions. The Si3216 supports
wideband (50 Hz–7 kHz) and narrowband (200 Hz–
3.4 kHz) audio codec modes to provide an expanded
audio band at a 16 kHz sample rate for enhanced audio
quality as well as standard telephony audio
compatibility. The Si3216 is ideal for Customer Premise
Equipment (CPE) where enhanced audio quality is
required.
circuit TIP-to-RING voltage (V ) defines the constant
OC
voltage zone and is programmable from 0 V to 94.5 V in
1.5 V steps. The loop current limit (I ) defines the
constant current zone and is programmable from 20 mA
to 41 mA in 3 mA steps. The ProSLIC has an inherent
LIM
dc output resistance (R ) of 160 .
O
V(TIP-RING) (V)
Constant
Voltage
Zone
VOC
Unlike most monolithic SLICs, the ProSLIC does not
require externally-supplied, high-voltage battery
supplies. Instead, it generates all necessary battery
voltages from a positive dc supply using its own dc-dc
converter controller. Two fully-programmable tone
generators can produce DTMF tones, phase continuous
FSK (caller ID) signaling, and call progress tones. Pulse
metering signal generation is also integrated. The
Si3201 linefeed interface IC performs all high-voltage
functions. As an option, the Si3201 can be replaced with
low-cost discrete components.
RO=160
Constant Current
Zone
ILIM
ILOOP(mA)
Figure 16. Simplified DC Current/Voltage
Linefeed Characteristic
The TIP-to-RING voltage (V ) is offset from ground by
OC
a programmable voltage (V ) to provide voltage
CM
The linefeed provides programmable on-hook voltage,
programmable off-hook loop current, reverse battery
operation, loop or ground start operation, and on-hook
transmission ringing voltage. Loop current and voltage
are continuously monitored using an integrated A/D
converter. Balanced 5 REN ringing with or without a
programmable dc offset is integrated. The available
offset, frequency, waveshape, and cadence options are
designed to ring the widest variety of terminal devices
and to reduce external controller requirements.
headroom to the positive-most terminal (TIP in forward
polarity states and RING in reverse polarity states) for
carrying audio signals. Table 21 summarizes the
parameters to be initialized before entering an Active
state.
Table 21. Programmable Ranges of DC
Linefeed Characteristics
Parameter Programmable Default
Register
Bits
Location*
Range
Value
A complete audio transmit and receive path is
integrated, including ac impedance and hybrid gain.
These features are software-programmable, allowing
ILIM
VOC
VCM
20 to 41 mA
20 mA
ILIM[2:0]
VOC[5:0]
VCM[5:0]
Direct
Register 71
for
a
single hardware design to meet global
0 to 94.5 V
0 to 94.5 V
48 V
3 V
Direct
Register 72
requirements. Digital voice data transfer occurs over a
standard PCM bus. Control data is transferred using a
standard SPI. The device is available in a 38-pin QFN or
TSSOP.
Direct
Register 73
*Note: The ProSLIC uses registers that are both directly
and indirectly mapped. A “direct” register is one that
is mapped directly.
2.1. Linefeed Interface
The ProSLIC’s linefeed interface offers a rich set of
features and programmable flexibility to meet the
broadest application requirements. The dc linefeed
characteristics are software programmable; key current,
voltage, and power measurements are acquired in real
time and provided in software registers.
Rev. 1.0
27
Si3216
2.1.2. Linefeed Architecture
registers. An internal A/D converter samples the
measured voltages and currents from the analog sense
circuitry and translates them into the digital domain. The
A/D updates the samples at an 800 Hz rate. Two
derived values are also reported—loop voltage and loop
The ProSLIC is a low-voltage CMOS device that uses
either an Si3201 linefeed interface IC or low-cost
external components to control the high voltages
required for subscriber line interfaces. Figure 17 is a
simplified illustration of the linefeed control loop circuit
for TIP or RING and the external components used.
current. The loop voltage, V – V
, is reported as a
TIP
RING
1-bit sign, 6-bit magnitude format. For ground start
operation, the reported value is the RING voltage. The
The ProSLIC uses both voltage and current sensing to
control TIP and RING. DC and ac line voltages on TIP
and RING are measured through sense resistors R
loop current, (I – I + I –I )/2, is reported in a 1-
Q1
Q2
Q5 Q6
bit sign, 6-bit magnitude format. In RING open and TIP
Open states, the loop current is reported as (I – I ) +
DC
Q1
Q2
and R , respectively. The ProSLIC uses linefeed
AC
(I –I ).
Q5 Q6
transistors Q and Q to drive TIP and RING. Q
P
N
DN
isolates the high-voltage base of Q from the ProSLIC.
N
The ProSLIC measures voltage at various nodes in
order to monitor the linefeed current. R , R , and
DC
SE
R
provide access to these measuring points. The
BAT
sense circuitry is calibrated on-chip to guarantee
measurement accuracy with standard external
component tolerances. See 2.1.9."Linefeed Calibration"
on page 33 for details.
2.1.3. Linefeed Operation States
The ProSLIC linefeed has eight states of operation as
shown in Table 22. The state of operation is controlled
using the Linefeed Control register (direct Register 64).
The Open state turns off all currents into the external
bipolar transistors and can be used in the presence of
fault conditions on the line and to generate Open Switch
Intervals (OSIs). TIP and RING are tri-stated with a dc
output impedance of about 150 k. The ProSLIC can
also automatically enter the Open state if it detects
excessive power being consumed in the external bipolar
transistors. See 2.1.5."Power Monitoring and Line Fault
Detection" on page 30 for more details.
In the Forward Active and Reverse Active states,
linefeed circuitry is on, and the audio signal paths are
disabled. In the forward and reverse on-hook
transmission states, audio signal paths are enabled to
provide data transmission during an on-hook loop
condition.
The TIP Open state turns off all control currents to the
external bipolar devices connected to TIP and provides
an active linefeed on RING for ground start operation.
The RING Open state provides similar operation with
the RING drivers off and TIP active.
The Ringing state drives programmable ringing
waveforms onto the line.
2.1.4. Loop Voltage and Current Monitoring
The ProSLIC continuously monitors the TIP and RING
voltages and external BJT currents. These values are
available in registers 78–89. Table 23 on page 30 lists
the values that are measured and their associated
28
Rev. 1.0
Si3216
Audio
Codec
Monitor A/D
A/D
A/D
D/A
DSP
D/A
SLIC DAC
Battery Sense
Emitter Sense
AC
Control
DC
Control
AC Sense
DC Sense
RAC
AC
Control
Loop
QDN
DC
Control
Loop
QP
CAC
RBP
RDC
RSE
RBAT
TIP or
RING
QN
RE
VBAT
Figure 17. Simplified ProSLIC Linefeed Architecture for TIP and RING Leads (One Shown)
Table 22. ProSLIC Linefeed Operations
LF[2:0]*
000
Linefeed State
Open
Description
TIP and RING tri-stated
001
Forward Active
V
V
> V
> V
TIP
TIP
RING
RING
010
Forward On-Hook Transmission
TIP Open
; audio signal paths enabled
011
TIP tri-stated, RING active; used for ground start
Ringing waveform applied to TIP and RING
100
Ringing
101
Reverse Active
V
V
> V
TIP
RING
RING
110
Reverse On-Hook Transmission
Ring Open
> V ; audio signal paths enabled
TIP
111
RING tri-stated, TIP active
*Note: The Linefeed register (LF) is located in direct Register 64.
Rev. 1.0
29
Si3216
Table 23. Measured Real Time Linefeed Interface Characteristics
Parameter
Measurement
Range
Resolution
Register
Bits
Location*
Loop Voltage Sense (V
– V
)
RING
–94.5 to +94.5 V
1.5 V
LVSP,
Direct Register 78
TIP
LVS[6:0]
Loop Current Sense
–80 to +80 mA
1.27 mA
LCSP,
Direct Register 79
LCS[5:0]
TIP Voltage Sense
RING Voltage Sense
0 to –95.88 V
0 to –95.88 V
0 to –95.88 V
0 to –95.88 V
0 to 81.35 mA
0 to 81.35 mA
0 to 9.59 mA
0 to 9.59 mA
0 to 80.58 mA
0 to 80.58 mA
0.376 V
0.376 V
VTIP[7:0]
Direct Register 80
Direct Register 81
VRING[7:0]
Battery Voltage Sense 1 (V
Battery Voltage Sense 2 (V
)
)
0.376 V
VBATS1[7:0] Direct Register 82
VBATS2[7:0] Direct Register 83
BAT
BAT
0.376 V
Transistor 1 Current Sense
Transistor 2 Current Sense
Transistor 3 Current Sense
Transistor 4 Current Sense
Transistor 5 Current Sense
Transistor 6 Current Sense
0.319 mA
0.319 mA
37.6 µA
IQ1[7:0]
IQ2[7:0]
IQ3[7:0]
IQ4[7:0]
IQ5[7:0]
IQ6[7:0]
Direct Register 84
Direct Register 85
Direct Register 86
Direct Register 87
Direct Register 88
Direct Register 89
37.6 µA
0.316 mA
0.316 mA
*Note: The ProSLIC uses registers that are both directly and indirectly mapped. A direct register is one that is mapped
directly.
2.1.5. Power Monitoring and Line Fault Detection
the type of fault condition present on the line.
In addition to reporting voltages and currents, the The value of each thermal low-pass filter pole is set
ProSLIC continuously monitors the power dissipated in according to the following equation:
each external bipolar transistor. Real time output power
4096
800
3
of any one of the six linefeed transistors can be read by
setting the Power Monitor Pointer (direct Register 76) to
point to the desired transistor and then reading the Line
Power Output Monitor (direct Register 77).
------------------
thermal LPF register =
2
where is the thermal time constant of the transistor
package; 4096 is the full range of the 12-bit register, and
800 is the sample rate in Hertz. Generally = 3 seconds
for SOT223 packages and 0.16 seconds for SOT23, but
check with the manufacturer for the thermal time
constant of a specific device. For example, the power
alarm threshold and low-pass filter values for Q5 and
Q6 using an SOT223 package transistor are computed
as follows:
The real time power measurements are low-pass
filtered and compared to a maximum power threshold.
Maximum power thresholds and filter time constants are
software-programmable and should be set for each
transistor pair based on the characteristics of the
transistors used. Table 24 describes the registers
associated with this function. If the power in any
external transistor exceeds the programmed threshold,
a power alarm event is triggered. The ProSLIC sets the
Power Alarm register bit, generates an interrupt (if
enabled), and automatically enters the Open state (if
AOPN = 1). This feature protects the external
transistors from fault conditions and, combined with the
loop voltage and current monitors, allows diagnosis of
PMAX
7
1.28
7
------------------------------
-----------------
PPT56 =
2
=
2 = 5389 = 150Dh
Resolution
0.0304
Thus, indirect Register 34 should be set to 150Dh.
Note: The power monitor resolution for Q3 and Q4 is different
from that of Q1, Q2, Q5, and Q6.
30
Rev. 1.0
Si3216
Table 24. Associated Power Monitoring and Power Fault Registers
Parameter
Description/
Range
Resolution
Register
Bits
Location*
0 to 5 points to Q1
to Q6, respectively
N/A
Power Monitor Pointer
PWRMP[2:0]
PWROM[7:0]
Direct Register 76
0 to 7.8 W for Q1,
Q2, Q5, Q6
0 to 0.9 W for Q3,
Q4
30.4 mW
3.62 mW
Line Power Monitor Output
Direct Register 77
Power Alarm Threshold, Q1 & Q2
Power Alarm Threshold, Q3 & Q4
Power Alarm Threshold, Q5 & Q6
0 to 7.8 W
0 to 0.9 W
0 to 7.8 W
30.4 mW
3.62 mW
30.4 mW
PPT12[7:0]
PPT34[7:0]
PPT56[7:0]
Indirect Register 19
Indirect Register 20
Indirect Register 21
See equation in “2.1.5. Power
Monitoring and Line Fault Detec-
tion”
Thermal LPF Pole, Q1 & Q2
Thermal LPF Pole, Q3 & Q4
Thermal LPF Pole, Q5 & Q6
Power Alarm Interrupt Pending
NQ12[7:0]
NQ34[7:0]
NQ56[7:0]
Indirect Register 24
Indirect Register 25
Indirect Register 26
Direct Register 19
See equation in “2.1.5. Power
Monitoring and Line Fault Detec-
tion”
See equation in “2.1.5. Power
Monitoring and Line Fault Detec-
tion”
Bits 2 to 7 corre-
QnAP[n+1],
where n = 1 to 6
spond to Q1 to Q6,
respectively
N/A
N/A
Bits 2 to 7 corre-
spond to Q1 to Q6,
respectively
QnAE[n+1],
where n = 1 to 6
Power Alarm Interrupt Enable
Direct Register 22
Direct Register 67
0 = manual mode
1 = enter Open
state upon power
alarm
Power Alarm
Automatic/Manual Detect
N/A
AOPN
*Note: The ProSLIC device uses registers that are both directly and indirectly mapped. A “direct” register is one that is
mapped directly. An “indirect” register is one that is accessed using the indirect access registers (direct registers 28
through 31).
Rev. 1.0
31
Si3216
LCS
LVS
Input
Signal
Processor
ISP_OUT
Digital
LPF
+
–
LCIP
LCR
Debounce
Filter
Interrupt
Logic
NCLR
LCDI
LCIE
LFS LCVE
HYSTEN
Loop Closure
Threshold
LCRT LCRTL
Figure 18. Loop Closure Detection
2.1.6. Loop Closure Detection
2.1.8. Voltage-Based Loop Closure Detection
A loop closure event signals that the terminal equipment An optional voltage-based loop closure detection mode
has gone off-hook during On-Hook Transmission or On- is enabled by setting LCVE = 1 (direct Register 108,
Hook Active states. The ProSLIC performs loop closure bit 2). In this mode, the loop voltage is compared to the
detection digitally using its on-chip monitor A/D loop closure threshold register (LCRT), which
converter. The functional blocks required to implement represents a minimum voltage threshold instead of a
loop closure detection are shown in Figure 18. The maximum current threshold. If hysteresis is also
primary input to the system is the Loop Current Sense enabled, then LCRT represents the upper voltage
value provided in the LCS register (direct Register 79). boundary and LCRTL represents the lower voltage
The LCS value is processed in the Input Signal boundary for hysteresis. Although voltage-based loop
Processor when the ProSLIC is in the On-Hook closure detection is an option, the default current-based
Transmission or On-Hook Active Linefeed state, as loop closure detection is recommended.
indicated by the Linefeed Shadow register, LFS[2:0]
Table 25. Register Set for Loop
Closure Detection
(direct Register 64). The data then feeds into a
programmable digital low-pass filter, which removes
unwanted ac signal components before threshold
detection.
Parameter
Register
Location
The output of the low-pass filter is compared to a
programmable threshold, LCRT (indirect Register 15).
The threshold comparator output feeds a programmable
debouncing filter. The output of the debouncing filter
remains in its present state unless the input remains in
the opposite state for the entire period of time
programmed by the loop closure debounce interval,
LCDI (direct Register 69). If the debounce interval has
been satisfied, the LCR bit will be set to indicate that a
valid loop closure has occurred. A loop closure interrupt
is generated if enabled by the LCIE bit (direct
Register 22). Table 25 lists the registers that must be
written or monitored to correctly detect a loop closure
condition.
Loop Closure
Interrupt Pending
LCIP
Direct Reg.19
Loop Closure
Interrupt Enable
LCIE
Direct Reg. 22
Loop Closure Threshold LCRT[5:0] Indirect Reg.15
Loop Closure
Threshold—Lower
LCRTL[5:0] Indirect Reg. 66
Loop Closure Filter
Coefficient
NCLR[12:0] Indirect Reg. 22
Loop Closure Detect
Status (monitor only)
LCR
Direct Reg. 68
Direct Reg. 69
Loop Closure Detect
Debounce Interval
LCDI[6:0]
2.1.7. Loop Closure Threshold Hysteresis
Programmable hysteresis to the loop closure threshold
can be enabled by setting HYSTEN = 1 (direct
Register 108, bit 0). The hysteresis is defined by LCRT
(indirect Register 15) and LCRTL (indirect Register 66),
which set the upper and lower bounds, respectively.
Hysteresis Enable
HYSTEN
LCVE
Direct Reg. 108
Direct Reg. 108
Voltage-Based Loop
Closure
32
Rev. 1.0
Si3216
2.1.9. Linefeed Calibration
only difference between the two versions is the polarity
of the DCFF pin with respect to the DCDRV pin. For the
Si321x, DCDRV and DCFF are opposite polarity. For
the Si321xM, DCDRV and DCFF are the same polarity.
Table 26 summarizes these differences.
An internal calibration algorithm corrects for internal and
external component errors. The calibration is initiated by
setting the CAL bit in direct Register 96. Upon
completion of the calibration cycle, this bit is
automatically reset.
Table 26. Si321x and Si321xM Differences
It is recommended that a calibration be executed
following system powerup. Upon release of the chip
reset, the ProSLIC is in the Open state. After powering
up the dc-dc converter and allowing it to settle for time
Device
DCFF Signal
Polarity
DCPOL
Si321x
0
1
= DCDRV
= DCDRV
(T
) the calibration can be initiated. Additional
SETTLE
Si321xM
calibrations may be performed, but only one calibration
should be necessary as long as the system remains
powered up.
Notes:
1. DCFF signal polarity with respect to DCDRV signal.
2. Direct Register 93, bit 5; This is a read-only bit.
During calibration, V , V , and V voltages are
RING
BAT
TIP
Extensive design guidance on each of these circuits can
be obtained from “AN45: Design Guide for the Si3210
DC-DC Converter” and from an interactive dc-dc
converter design spreadsheet. Both of these documents
are available on the Silicon Laboratories website
(www.silabs.com).
controlled by the calibration engine to provide the
correct external voltage conditions for the algorithm.
Calibration should be performed in the On-Hook state.
RING or TIP must not be connected to ground during
the calibration.
When using the Si3201, automatic calibration routines
for RING gain mismatch and TIP gain mismatch should
2.2.2. BJT/Inductor Circuit Option Using Si321x
not be performed. Instead of running these two The BJT/Inductor circuit option, as defined in Figure 13
calibrations automatically, consult “AN35: Si321x User’s on page 23, offers a flexible, low-cost solution.
Quick Reference Guide”, and follow the instructions for Depending on selected L1 inductance value and the
manual calibration.
switching frequency, the input voltage (V ) can range
DC
from 5 V to 30 V. By nature of a dc-dc converter’s
operation, peak and average input currents can become
large with small input voltages. Consider this when
selecting the appropriate input voltage and power rating
2.2. Battery Voltage Generation and
Switching
The ProSLIC integrates a dc-dc converter controller that
dynamically regulates a single output voltage. This
mode eliminates the need to supply large external
battery voltages. Instead, it converts a single positive
input voltage into the real-time battery voltage needed
for any given state according to programmed linefeed
parameters.
for the V power supply.
DC
For this solution, a PNP power BJT (Q7) switches the
current flow through low ESR inductor L1. The Si3216
uses the DCDRV and DCFF pins to switch Q7 on and
off. DCDRV controls Q7 through NPN BJT Q8. DCFF is
ac-coupled to Q7 through capacitor C10 to assist R16 in
turning off Q7. Therefore, DCFF must have opposite
polarity to DCDRV, and the Si321x (not Si321xM) must
be used.
2.2.1. DC-DC Converter General Description
The dc-dc converter dynamically generates the large
negative voltages required to operate the linefeed
interface. The ProSLIC acts as the controller for a buck-
boost dc-dc converter that converts a positive dc
voltage into the desired negative battery voltage. In
addition to eliminating external power supplies, this
allows the ProSLIC to dynamically control the battery
voltage to the minimum required for any given mode of
operation.
2.2.3. MOSFET/Transformer Circuit Option Using
Si321xM
The MOSFET/transformer circuit option, as defined in
Figure 14 on page 24, offers higher power efficiencies
across a larger input voltage range. Depending on the
transformer’s primary inductor value and the switching
frequency, the input voltage (V ) can range from 3.3 V
DC
to 35 V. Therefore, it is possible to power the entire
ProSLIC solution from a single 3.3 V or 5 V power
supply. By nature of a dc-dc converter’s operation, peak
and average input currents can become large with small
input voltages. Consider this when selecting the
Two different dc-dc circuit options are offered: a BJT/
inductor version and a MOSFET/transformer version.
Due to the differences on the driving circuits, there are
two different versions of the ProSLIC. The Si321x
supports the BJT/inductor circuit option, and the
Si321xM version supports the MOSFET solution. The
appropriate input voltage and power rating for the V
DC
Rev. 1.0
33
Si3216
power supply (number of REN supported).
the register settings to prevent component damage.
These inputs should be calibrated by writing the DCCAL
bit (bit 7) of the dc-dc Converter Switching Delay
register, direct Register 93, after the dc-dc converter
has been turned on.
For this solution, an n-channel power MOSFET (M1)
switches the current flow through a power transformer
T1. T1 is specified in “AN45: Design Guide for the
Si3210/15/16 DC-DC Converter” and includes several
taps on the primary side to facilitate a wide range of Because the ProSLIC dynamically regulates its own
input voltages. The “M” version of the ProSLIC must be battery supply voltage using the dc-dc converter
used for the application circuit depicted in Figure 14 on controller, the battery voltage (V
) is offset from the
BAT
page 24 because the DCFF pin is used to drive M1 negative-most terminal by a programmable voltage
directly and, therefore, must be the same polarity as (V ) to allow voltage headroom for carrying audio
OV
DCDRV. DCDRV is not used in this circuit option; signals.
connecting DCFF and DCDRV together is not
recommended.
As mentioned previously, the ProSLIC dynamically
adjusts V
to suit the particular circuit requirement. To
BAT
2.2.4. DC-DC Converter Architecture
illustrate this, the behavior of V
in the Active state is
BAT
shown in Figure 19. In the Active state, the TIP-to-RING
open circuit voltage is kept at V in the constant
The control logic for a pulse-width modulated (PWM)
dc-dc converter is incorporated in the ProSLIC. Output
pins DCDRV and DCFF are used to switch a bipolar
transistor or MOSFET. The polarity of DCFF is opposite
that of DCDRV.
OC
voltage region while the regulator output voltage,
= V + V + V
V
.
OV
BAT
CM
OC
When the loop current attempts to exceed I , the dc
LIM
line driver circuit enters constant current mode allowing
The dc-dc converter circuit is powered on when the
DCOF bit in the powerdown register (direct Register 14,
bit 4) is cleared to 0. The switching regulator circuit
within the ProSLIC is a high-performance, pulse-width
modulation controller. The control pins are driven by the
PWM controller logic in the ProSLIC. The regulated
the TIP to RING voltage to track R
. As the TIP
LOOP
terminal is kept at a constant voltage, it is the RING
terminal voltage that tracks R and, as a result, the
LOOP
|V
|V
| voltage will also track R
. In this state,
+ V . As R
BAT
LOOP
| = I
x R
+ V
BAT
LIM
LOOP
CM OV LOOP
decreases below the VOC/I
mark, the regulator
LIM
output voltage (V ) is sensed by the SVBAT pin and
BAT
output voltage can continue to track
R
LOOP
used to detect whether the output voltage is above or
below an internal reference for the desired battery
voltage. The dc monitor pins SDCH and SDCL monitor
input current and voltage to the dc-dc converter external
circuitry. If an overload condition is detected, the PWM
controller will turn off the switching transistor for the
remainder of a PWM period to prevent damage to
(TRACK = 1), or the R tracking mechanism is
LOOP
stopped when |V
| = |V
|
(TRACK = 0). The
BAT
BATL
former case is the more common application and
provides the maximum power dissipation savings. In
principle, the regulator output voltage can go as low as
|V
| = V + V , offering significant power savings.
BAT
CM OV
external components. It is important that the proper When TRACK = 0, |V
| does not decrease below
BAT
value of R18 be selected to ensure safe operation.
V
. The RING terminal voltage, however, continues
BATL
Guidance is given in “AN45: Design Guide for the to decrease with decreasing R
. The power
LOOP
Si3210/15/16 DC-DC Converter”.
dissipation on the NPN bipolar transistor driving the
RING terminal can become large and may require a
higher power rating device. The non-tracking mode of
operation is required by specific terminal equipment
which, in order to initiate certain data transmission
modes, goes briefly on-hook to measure the line voltage
to determine whether there is any other off-hook
terminal equipment on the same line. TRACK = 0 mode
is desired since the regulator output voltage has long
settling time constants (tens of milliseconds) and cannot
change rapidly for TRACK = 1 mode. Therefore, the
brief on-hook voltage measurement would yield
approximately the same voltage as the off-hook line
voltage and would cause the terminal equipment to
incorrectly sense another off-hook terminal.
The PWM controller operates at a frequency set by the
dc-dc Converter PWM register (direct Register 92).
During a PWM period the outputs of the control pins
DCDRV and DCFF are asserted for a time given by the
read-only PWM Pulse Width register (direct
Register 94).
The dc-dc converter must be off for some time in each
cycle to allow the inductor or transformer to transfer its
stored energy to the output capacitor, C9. This minimum
off time can be set through the dc-dc Converter
Switching Delay register, (direct Register 93). The
number of 16.384 MHz clock cycles that the controller is
off is equal to DCTOF (bits 0 through 4) plus 4. If the dc
monitor pins detect an overload condition, the dc-dc
converter interrupts its conversion cycles regardless of
34
Rev. 1.0
Si3216
VOC
ILIM
RLOOP
Constant I Region
Constant V Region
VCM
VTIP
VOC
|VTIP - VRING
|
VBATL
TRACK=0
VOV
VRING
VBAT
VOV
V
Figure 19. VTIP, VRING, and VBAT in the Forward Active State
Table 27. Associated Relevant DC-DC Converter Registers
Parameter
Range
Resolution Register Bit
Location
DC-DC Converter Power-Off
Control
N/A
N/A
DCOF
Direct Register 14
DC-DC Converter Calibration
Enable/Status
N/A
N/A
DCCAL
Direct Register 93
DC-DC Converter PWM Period
DC-DC Converter Min. Off Time
0 to 15.564 µs
61.035 ns
61.035 ns
DCN[7:0]
Direct Register 92
Direct Register 93
(0 to 1.892 µs) +
4 ns
DCTOF[4:0]
High Battery Voltage—V
Low Battery Voltage—V
0 to –94.5 V
0 to –94.5 V
1.5 V
1.5 V
1.5 V
VBATH[5:0]
VBATL[5:0]
Direct Register 74
Direct Register 75
BATH
BATL
V
0 to –9 V or
0 to –13.5 V
VMIND[3:0]
VOV
Indirect Register 64
Direct Register 66
OV
Note: The ProSLIC uses registers that are both directly and indirectly mapped. A “direct” register is one that is mapped
directly. An “indirect” register is one that is accessed using the indirect access registers (direct registers 28 through 31).
Rev. 1.0
35
Si3216
2.2.5. DC-DC Converter Enhancements
described above.
The ProSLIC supports two selectable enhancements to
the dc-dc converter. The first is a multi-threshold error
control algorithm that enables the dc-dc converter to
adjust more quickly to voltage changes. This option is
enabled by setting DCSU = 1 (direct Register 108,
bit 5). The second enhancement is an audio band filter
that removes audio band noise from the dc-dc converter
control loop. This option is enabled by setting DCFIL = 1
(direct Register 108, bit 1).
2.3. Tone Generation
Two digital tone generators are provided in the ProSLIC.
They allow the generation of a wide variety of single or
dual tone frequency and amplitude combinations and
spare the user the effort of generating the required
POTS signaling tones on the PCM highway. DTMF, FSK
(caller ID), call progress, and other tones can all be
generated on-chip. The tones can be sent to either the
receive or transmit paths. (See Figure 24 on page 44.)
2.2.6. DC-DC Converter During Ringing
2.3.1. Tone Generator Architecture
When the ProSLIC enters the Ringing state, it requires
voltages well above those used in the active mode. The
voltage to be generated and regulated by the dc-dc
A simplified diagram of the tone generator architecture
is shown in Figure 20. The oscillator, active/inactive
timers, interrupt block, and signal routing block are
connected to give the user flexibility in creating audio
signals. Control and status register bits are placed in the
figure to indicate their association with the tone
generator architecture. These registers are described in
more detail in Table 28 on page 38.
converter during a ringing burst is set using the V
BATH
register (direct Register 74). V
can be set between
BATH
0 and –94.5 V in 1.5 V steps. To avoid clipping the
ringing signal, V must be set larger than the ringing
BATH
amplitude. At the end of each ringing burst the dc-dc
converter adjusts back to active state regulation as
16 kHz
Clock
8 kHz
Clock
OZn
Zero Cross
OnE
OSSn
to TX Path
Enable
Zero
Cross
Logic
Two-Pole
Resonance
Oscillator
16-Bit
Modulo
Counter
OAT
Expire
Signal
Routing
Register
Load
Load
Logic
OIT
Expire
to RX Path
OSCn
OATn
OITn
OnIP REL*
INT
Logic
OATnE
OnSO
OSCnX
OSCnY
OnIE
OITnE
OnAP
INT
Logic
OnAE
*Tone Generator 1 Only
n = "1" or "2" for Tone Generator 1 and 2, respectively
Figure 20. Simplified Tone Generator Diagram
36
Rev. 1.0
Si3216
2.3.2. Oscillator Frequency and Amplitude
Each of the two-tone generators contains a two-pole Each of the two-tone generators contains two timers,
resonant oscillator circuit with programmable one for setting the active period and one for setting the
2.3.3. Tone Generator Cadence Programming
a
frequency and amplitude. These two-tone generators inactive period. The oscillator signal is generated during
are programmed via indirect registers OSC1, OSC1X, the active period and suspended during the inactive
OSC1Y, OSC2, OSC2X, and OSC2Y. The sample rate period. Both the active and inactive periods can be
for the two oscillators is 16 kHz. The equations are as programmed from 0 to 8 seconds in 125 µs steps. The
follows:
active period time interval is set using OAT1 (direct
registers 36 and 37) for tone generator 1 and OAT2
(direct registers 40 and 41) for tone generator 2.
coeff = cos(2f /16 kHz),
n
n
where f is the frequency to be generated;
n
To enable automatic cadence for tone generator 1,
define the OAT1 and OIT1 registers and then set the
O1TAE bit (direct Register 32, bit 4) and O1TIE bit
(direct Register 32, bit 3). This enables each of the
timers to control the state of the Oscillator Enable bit,
O1E (direct Register 32, bit 2). The 16-bit counter
begins counting until the active timer expires, at which
time the 16-bit counter resets to zero and begins
counting until the inactive timer expires. The cadence
continues until the user clears the O1TAE and O1TIE
control bits. The zero crossing detect feature can be
implemented by setting the OZ1 bit (direct Register 32,
bit 5). This ensures that each oscillator pulse ends
without a dc component. The timing diagram in
Figure 21 is an example of an output cadence using the
zero crossing feature.
15
OSCn = coeff x (2 );
n
Desired Vrms
-------------------------------------
1
4
15
1 – coeff
1 + coeff
--
OSCnX =
----------------------- 2 – 1
1.11 Vrms
where desired V
is the amplitude to be generated;
OSCnY = 0,
rms
n = 1 or 2 for oscillator 1 or oscillator 2, respectively.
For example, to generate a DTMF digit of 8, the two
required tones are 852 Hz and 1336 Hz. Assuming the
generation of half-scale values (ignoring twist) is
desired, the following values are calculated:
2852
16000
----------------
coeff1 = cos
= 0.94455
One-shot oscillation can be achieved by enabling O1E
and O1TAE. Direct control over the cadence can be
achieved by controlling the O1E bit (direct Register 32,
bit 2) directly if O1TAE and O1TIE are disabled.
OSC1 = 0.94455215 = 30951 = 78E6h
--------------------- 215 – 1 0.5 = 692 = 2B3h
.05545
1
--
OSC1X =
4
1.94455
The operation of tone generator 2 is identical to that of
tone generator 1 using its respective control registers.
OSC1Y = 0
Note: Tone Generator 2 should not be enabled simultane-
ously with the ringing oscillator due to resource sharing
within the hardware.
21336
16000
--------------------
coeff2 = cos
= 0.86550
15
OSC2 = 0.86550 (2 ) = 28361 = 6EC8h
Continuous phase frequency-shift keying (FSK)
waveforms may be created using tone generator 1 (not
available on tone generator 2) by setting the REL bit
(direct Register 32, bit 6), which enables reloading of
the OSC1, OSC1X, and OSC1Y registers at the
expiration of the active timer (OAT1).
1
0.13450
--
OSC2X =
--------------------- 215 – 1 0.5 = 1098 = 44Bh
4
1.86550
OSC2Y = 0
The above computed values are written to the
corresponding registers to initialize the oscillators. Once
the oscillators are initialized, the oscillator control
registers can be accessed to enable the oscillators and
direct their outputs.
Rev. 1.0
37
Si3216
Table 28. Associated Tone Generator Registers
Tone Generator 1
Parameter
Description/Range
Sets oscillator frequency
Sets oscillator amplitude
Sets initial phase
0 to 8 s
Register Bits
OSC1[15:0]
OSC1X[15:0]
OSC1Y[15:0]
OAT1[15:0]
OIT1[15:0]
Location
Oscillator 1 Frequency Coefficient
Oscillator 1 Amplitude Coefficient
Oscillator 1 initial phase coefficient
Oscillator 1 Active Timer
Indirect Register 0
Indirect Register 1
Indirect Register 2
Direct Registers 36 & 37
Direct Registers 38 & 39
Direct Register 32
Oscillator 1 Inactive Timer
Oscillator 1 Control
0 to 8 s
Status and control
registers
OSS1, REL, OZ1,
O1TAE, O1TIE,
O1E, O1SO[1:0]
Tone Generator 2
Description/Range
Sets oscillator frequency
Sets oscillator amplitude
Sets initial phase
0 to 8 s
Parameter
Register
OSC2[15:0]
OSC2X[15:0]
OSC2Y[15:0]
OAT2[15:0]
OIT2[15:0]
Location
Oscillator 2 Frequency Coefficient
Oscillator 2 Amplitude Coefficient
Oscillator 2 initial phase coefficient
Oscillator 2 Active Timer
Indirect Register 3
Indirect Register 4
Indirect Register 5
Direct Registers 40 & 41
Direct Registers 42 & 43
Direct Register 33
Oscillator 2 Inactive Timer
Oscillator 2 Control
0 to 8 s
Status and control
registers
OSS2, OZ2,
O2TAE, O2TIE,
O2E, O2SO[1:0]
O1E
0,1 ...
..., OAT1 0,1 ...
..., OIT1 0,1 ...
..., OAT1 0,1 ...
...
...
OSS1
Tone
Gen. 1
Signal
Output
Figure 21. Tone Generator Timing Diagram
38
Rev. 1.0
Si3216
2.3.4. Enhanced FSK Waveform Generation
2.4.1. Ringing Architecture
Enhanced FSK generation capabilities can be enabled The ringing generator architecture is nearly identical to
by setting FSKEN = 1 (direct Register 108, bit 6) and that of the tone generator. The sinusoid ringing
REN = 1 (direct Register 32, bit 6). In this mode, the waveform is generated using an internal two-pole
user can define mark (1) and space (0) attributes once resonance oscillator circuit with programmable
during initialization by defining indirect Registers 69–74. frequency and amplitude. However, since ringing
The user need only indicate 0-to-1 and 1-to-0 transitions frequencies are very low compared to the audio band
in the information stream. By writing to FSKDAT (direct signaling frequencies, the ringing waveform is
Register 52), this mode applies a 24 kHz sample rate to generated at a 1 kHz rate instead of 8 kHz.
tone generator 1 to give additional resolution to timers
The ringing generator has two timers that function the
and frequency generation. “AN32: Si321x Frequency
same as for the tone generator timers. They allow on/off
Shift Keying (FSK) Modulation” gives detailed
cadence settings up to 8 seconds on/ 8 seconds off. In
instructions on how to implement FSK in this mode.
addition to controlling ringing cadence, these timers
Additionally, sample source code is available from
control the transition into and out of the Ringing state.
Silicon Laboratories upon request.
Table 29 summarizes the list of registers used for
2.3.5. Tone Generator Interrupts
ringing generation.
Note: Tone generator 2 should not be enabled concurrently
with the ringing generator due to resource sharing
within the hardware.
Both the active and inactive timers can generate their
own interrupt to signal “on/off” transitions to the
software. The timer interrupts for tone generator 1 can
be individually enabled by setting the O1AE and O1IE When the Ringing state is invoked by writing
bits (direct Register 21, bits 0 and 1, respectively). LF[2:0] = 100 (direct Register 64), the ProSLIC goes
Timer interrupts for tone generator 2 are O2AE and into the Ringing state and starts the first ring. At the
O2IE (direct Register 21, bits 2 and 3, respectively). A expiration of RAT, the ProSLIC turns off the ringing
pending interrupt for each of the timers is determined by waveform and goes to the on-hook transmission state.
reading the O1AP, O1IP, O2AP, and O2IP bits in the Upon expiration of RIT, ringing again initiates. This
Interrupt Status 1 register (direct Register 18, bits 0 process continues as long as the two timers are
through 3, respectively).
enabled and the Linefeed Control register is set to the
Ringing state.
2.4. Ringing Generation
The ProSLIC provides fully-programmable internal
balanced ringing with or without a dc offset to ring a
wide variety of terminal devices. All parameters
associated with ringing are software-programmable:
ringing frequency, waveform, amplitude, dc offset, and
ringing cadence. Both sinusoidal and trapezoidal ringing
waveforms are supported, and the trapezoidal crest
factor is programmable. Ringing signals of up to 90 V
peak or more can be generated, enabling the ProSLIC
to drive a 5 REN (1380 + 40 µF) ringer load across
loop lengths of 2000 feet (160 ) or more.
Rev. 1.0
39
Si3216
Table 29. Registers for Ringing Generation
Parameter
Range/ Description
Register
Bits
Location
Ringing Waveform
Ringing Voltage Offset Enable
Sine/Trapezoid
Enabled/
Disabled
Enabled/
Disabled
Enabled/
Disabled
Enabled/
Disabled
0 to 8 s
TSWS
RVO
Direct Register 34
Direct Register 34
Ringing Active Timer Enable
Ringing Inactive Timer Enable
Ringing Oscillator Enable
RTAE
RTIE
Direct Register 34
Direct Register 34
Direct Register 34
ROE
Ringing Oscillator Active Timer
Ringing Oscillator Inactive Timer
Linefeed Control (Initiates Ringing State)
RAT[15:0]
RIT[15:0]
LF[2:0]
Direct Registers 48 and
49
Direct Registers 50 and
51
0 to 8 s
Direct Register 64
Ringing State = 100b
High Battery Voltage
Ringing dc voltage offset
Ringing frequency
Ringing amplitude
Ringing initial phase
0 to –94.5 V
0 to 94.5 V
15 to 100 Hz
VBATH[5:0]
ROFF[15:0]
RCO[15:0]
RNGX[15:0]
RNGY[15:0]
Direct Register 74
Indirect Register 6
Indirect Register 7
Indirect Register 8
Indirect Register 9
0 to 94.5 V
Sets initial phase for
sinewave and period
for trapezoid
Common Mode Bias Adjust During Ringing
0 to 22.5 V
VCMR[3:0]
Indirect Register 27
Note: The ProSLIC uses registers that are both directly and indirectly mapped. A “direct” register is one that is mapped
directly. An “indirect” register is one that is accessed using the indirect access registers (direct registers 28 through
31).
2.4.2. Sinusoidal Ringing
equations are as follows:
To configure the ProSLIC for sinusoidal ringing, the
frequency and amplitude are initialized by writing to the
following indirect registers: RCO, RNGX, and RNGY.
The equations for RCO, RNGX, RNGY are as follows:
2 20
1000 Hz
coeff = cos
= 0.99211
----------------------
RCO = 0.99211 215 = 32509 = 7EFDh
RCO = coeff 215
1
4
15 70
0.00789
1.99211
--
------
= 376 = 0177h
RNGX =
--------------------- 2
96
where
RNGY = 0
2f
1000 Hz
----------------------
coeff = cos
In addition, the user must select the sinusoidal ringing
waveform by writing TSWS = 0 (direct Register 34,
bit 0).
and f = desired ringing frequency in hertz.
Desired VPK0 to 94.5 V
-----------------------------------------------------------------------
96 V
1
4
15
1 – coeff
1 + coeff
2.4.3. Trapezoidal Ringing
--
RNGX =
----------------------- 2
In addition to the sinusoidal ringing waveform, the
ProSLIC supports trapezoidal ringing. Figure 22
illustrates a trapezoidal ringing waveform with offset
RNGY = 0
In selecting a ringing amplitude, the peak TIP-to-RING
ringing voltage must be greater than the selected on-
hook line voltage setting (VOC, direct Register 72). For
V
.
ROFF
example, to generate a 70 V 20 Hz ringing signal, the
PK
40
Rev. 1.0
Si3216
In addition, the user must select the trapezoidal ringing
waveform by writing TSWS = 1 in direct Register 34.
VTIP-RING
2.4.4. Ringing DC Voltage Offset
A dc offset can be added to the ac ringing waveform by
defining the offset voltage in ROFF (indirect Register 6).
The offset, V
, is added to the ringing signal when
ROFF
RVO is set to 1 (direct Register 34, bit 1). The value of
ROFF is calculated as follows:
VROFF
T=1/freq
VROFF
15
-----------------
ROFF =
2
96
tRISE
time
2.4.5. Linefeed Considerations During Ringing
Care must be taken to keep the generated ringing signal
within the ringing voltage rails (GNDA and V
maintains proper biasing of the external bipolar
) to
BAT
Figure 22. Trapezoidal Ringing Waveform
To configure the ProSLIC for trapezoidal ringing, the transistors. If the ringing signal nears the rails, a
user should follow the same basic procedure as in the distorted ringing signal and excessive power dissipation
Sinusoidal Ringing section, but using the following in the external transistors will result.
equations:
To prevent this invalid operation, set the V
value
BATH
(direct Register 74) to a value higher than the maximum
peak ringing voltage. The discussion below outlines the
considerations and equations that govern the selection
1
2
--
RNGY = Period 8000
of the V
voltage.
setting for a particular desired peak ringing
Desired VPK
BATH
215
-----------------------------------
RNGX =
96 V
First, the required amount of ringing overhead voltage,
, is calculated based on the maximum value of
V
OVR
2 RNGX
RCO = --------------------------------
tRISE 8000
current through the load, I
, the minimum current
LOAD,PK
gain of Q5 and Q6, and a reasonable voltage required
to keep Q5 and Q6 out of saturation. For ringing signals
RCO is a value which is added or subtracted from the
waveform to ramp the signal up or down in a linear
fashion. This value is a function of rise time, period, and
amplitude, where rise time and period are related
through the following equation for the crest factor of a
trapezoidal waveform.
up to V = 87 V, V
= 7.5 V is a safe value.
PK
OVR
However, to determine V
equations below.
for a specific case, use the
OVR
VAC,PK
NREN
ILOAD,PK = ------------------ + IOS = VAC,PK ----------------- + IOS
RLOAD
6.9 k
3
4
1
--
tRISE
=
T 1 – ----------
2
where:
is the ringing REN load (max value = 5),
CF
N
REN
where T = ringing period, and CF = desired crest factor.
I
is the offset current flowing in the line driver circuit
OS
For example, to generate a 71 V , 20 Hz ringing
PK
(max value = 2 mA), and
signal, the equations are as follows:
V
= amplitude of the ac ringing waveform.
AC,PK
1
2
1
It is good practice to provide a buffer of a few more
milliamperes for I to account for possible line
-- ---------------
8000 = 200 = C8h
RNGY20 Hz =
20 Hz
LOAD,PK
leakages, etc. The total I
smaller than 80 mA.
current should be
LOAD,PK
71
96
215= 24235 = 5EABh
------
RNGX71 VPK =
For a crest factor of 1.3 and a period of 0.05 s (20 Hz),
the rise time requirement is 0.0153 s.
+ 1
------------
80.6 + 1 V
VOVR = ILOAD,PK
where is the minimum expected current gain of
transistors Q5 and Q6.
RCO20 Hz, 1.3 crest factor
2 24235
The minimum value for V
following equation:
is, therefore, given by the
BATH
-------------------------------------
=
= 396= 018Ch
0.0153 8000
Rev. 1.0
41
Si3216
The primary input to the system is the Loop Current
Sense (LCS) value provided by the current monitoring
circuitry and reported in direct Register 79. LCS data is
processed by the input signal processor when the
ProSLIC is in the Ringing state as indicated by the
Linefeed Shadow register (direct Register 64). The data
then feeds into a programmable digital low pass filter,
which removes unwanted ac signal components before
threshold detection.
VBATH = VAC,PK + VROFF + VOVR
The ProSLIC is designed to create a fully-balanced
ringing waveform, meaning that the TIP and RING
common mode voltage, (V
+ V
)/2, is fixed. This
TIP
RING
voltage is referred to as V
set to the following:
and is automatically
CM_RING
V
BATH – VCMR
VCM_RING = --------------------------------------
The output of the low-pass filter is compared to a
programmable threshold, RPTP (indirect Register 16).
The threshold comparator output feeds a programmable
debouncing filter. The output of the debouncing filter
remains in its present state unless the input remains in
the opposite state for the entire period of time
programmed by the ring trip debounce interval,
RTDI[6:0] (direct Register 70). If the debounce interval
has been satisfied, the RTP bit of direct Register 68 will
be set to indicate that a valid ring trip has occurred. A
ring trip interrupt is generated if enabled by the RTIE bit
(direct Register 22). Table 30 lists the registers that
must be written or monitored to correctly detect a ring
trip condition.
2
V
is an indirect register, which provides the
headroom by the ringing waveform with respect to the
rail. The value is set as a 4-bit setting in indirect
Register 27 with an LSB voltage of 1.5 V/LSB.
Register 27 should be set with the calculated V
provide voltage headroom during ringing.
CMR
V
BATH
to
OVR
The ProSLIC has a mode to briefly increase the
maximum differential current limit between the voltage
transition of TIP and RING from ringing to a dc linefeed
state. This mode is enabled by setting I
Register 108, bit 7).
= 1 (direct
LIMEN
2.4.6. Ring Trip Detection
The recommended values for RPTP, NRTP, and RTDI
vary according to the programmed ringing frequency.
Register values for various ringing frequencies are
given in Table 31.
A ring trip event signals that the terminal equipment has
gone off-hook during the Ringing state. The ProSLIC
performs ring trip detection digitally using its on-chip A/
D
converter. The functional blocks required to
implement ring trip detection are shown in Figure 23.
Input
Signal
Processor
LCS
ISP_OUT
Digital
LPF
+
–
DBIRAW
RTIP
RTP
Debounce
Filter
Interrupt
Logic
NRTP
RTDI
RTIE
LFS
Ring Trip
Threshold
RPTP
Figure 23. Ring Trip Detector
42
Rev. 1.0
Si3216
Table 30. Associated Registers for Ring Trip Detection
Register
Parameter
Location
Ring Trip Interrupt Pending
Ring Trip Interrupt Enable
RTIP
RTIE
Direct Register 19
Direct Register 22
Direct Register 70
Indirect Register 16
Indirect Register 23
Direct Register 68
Ring Trip Detect Debounce Interval
Ring Trip Threshold
RTDI[6:0]
RPTP[5:0]
NRTP[12:0]
RTP
Ring Trip Filter Coefficient
Ring Trip Detect Status (monitor only)
Note: The ProSLIC uses registers that are both directly and indirectly mapped. A “direct” register is one that is mapped
directly. An “indirect” register is one that is accessed using the indirect access registers (direct registers 28 through
31).
Table 31. Recommended Ring Trip Values for Ringing
Ringing
NRTP
RPTP
RTDI
Frequency
Hz
16.667
20
decimal
64
hex
decimal
34 mA
34 mA
34 mA
34 mA
34 mA
34 mA
hex
decimal
15.4 ms
12.3 ms
8.96 ms
7.5 ms
5 ms
hex
0F
0B
09
07
05
05
0200
0320
0380
0400
06A8
0800
3600
3600
3600
3600
3600
3600
100
112
30
40
128
213
256
50
60
4.8 ms
noise ratio of the transmit path. After passing through an
anti-aliasing filter, the analog signal is processed by the
A/D converter, producing a 16-bit wide, linear PCM data
stream. The standard requirements for transmit path
attenuation for signal frequencies above the audio band
are implemented as part of the combined decimation
filter characteristic of the A/D converter. An additional
filter, THPF, implements the high-pass attenuation
requirements for signals below 50 Hz. The linear PCM
data stream output from THPF is amplified by the
2.5. Audio Path
Unlike traditional SLICs, the codec function is integrated
into the ProSLIC. The 16-bit codec offers software-
selectable 200 Hz to 3.4 kHz narrowband and 50 Hz to
7 kHz (Si3216 only) wideband audio modes,
programmable gain/attenuation blocks, and several
loop-back modes. The signal path block diagram is
shown in Figure 24.
2.5.1. Transmit Path
In the transmit path, the analog signal fed by the external transmit-path programmable gain amplifier, ADCG,
ac coupling capacitors is amplified by the analog which can be programmed from – dB to 6 dB. The final
transmit amplifier, ATX, prior to the A/D converter. ATX step in the transmit path signal processing is the user-
has the following gain options: mute, –3.5, 0, and selectable A-law or µ-law compression block. In
3.5 dB. The main role of ATX is to coarsely adjust the narrowband mode, µ-law or A-law compression can be
signal swing to be as close as possible to the full-scale selected to reduce the data stream word width to 8 bits.
input of the A/D converter to maximize the signal-to-
Rev. 1.0
43
Si3216
44
Rev. 1.0
Si3216
2.5.2. Receive Path
2.5.5. Loopback Testing
In the receive path, digital voice is expanded from µ/A- Four loopback test options are available in the ProSLIC:
law if enabled. DACG is the receive path programmable
The full analog loopback (ALM2) tests almost all the
circuitry of both the transmit and receive paths. The
transmit data stream is fed back serially to the input
of the receive path expander. (See Figure 24.) The
signal path starts with the analog signal at the input
of the transmit path and ends with an analog signal
at the output of the receive path.
gain amplifier which can be programmed from – dB to
6 dB. A 16-bit signal is then provided to a D/A converter.
The resulting analog signal is amplified by the analog
receive amplifier, ARX, which has the following gain
options: mute, –3.5, 0, and 3.5 dB. It is then applied at
the input of the transconductance amplifier (Gm), which
drives the off-chip current buffer (I
).
BUF
An additional analog loopback (ALM1) takes the
digital stream at the output of the A/D converter and
feeds it back to the D/A converter. (See Figure 24.)
The signal path starts with the analog signal at the
input of the transmit path and ends with an analog
signal at the output of the receive path. This
loopback option allows testing of the analog signal
processing circuitry of the ProSLIC completely
independently of any activity in the DSP.
2.5.3. Companding
The ProSLIC supports both µ-255 law and A-law
companding formats when narrowband mode is
selected. µ-255 law is more commonly used in North
America and Japan, while A-law is used primarily in
Europe. Data format is selected using the PCMF
register. Tables 32 and 33 define µ-law and A-law
formats, respectively.
The full digital loopback tests almost all the circuitry
of both the transmit and receive paths. The analog
signal at the output of the receive path is fed back to
the input of the transmit path by way of the hybrid
filter path. (See Figure 24.) The signal path starts
with PCM data input to the receive path and ends
with PCM data at the output of the transmit path.
The dominant source of distortion and noise in both the
transmit and receive paths is the quantization noise
introduced by the µ-law or the A-law compression
process. Figure 3 on page 11 specifies the minimum
signal-to-noise and distortion ratio for either path for a
sine wave input of 200 Hz to 3400 Hz.
Both µ-law and A-law speech encoding allow the audio
codec to transfer and process audio signals larger than
0 dBm0 without clipping. The maximum PCM code is
generated for a µ-law encoded sine wave of 3.17 dBm0
or an A-law encoded sine wave of 3.14 dBm0. The
ProSLIC overload clipping limits are driven by the PCM
encoding process. Figure 4 on page 11 shows the
acceptable limits for the analog-to-analog fundamental
power transfer function, which bounds the behavior of
ProSLIC.
An additional digital loopback (DLM) takes the digital
stream at the input of the D/A converter in the
receive path and feeds it back to the transmit A/D
digital filter. The signal path starts with PCM data
input to the receive path and ends with PCM data at
the output of the transmit path. This loopback option
allows testing of the ProSLIC digital signal
processing circuitry completely independently of any
analog signal processing activity.
2.5.4. Transhybrid Balance
2.6. Two-Wire Impedance Matching
The ProSLIC provides programmable transhybrid
balance with gain block H. (See Figure 24.) In the ideal
case where the synthesized SLIC impedance exactly
matches the subscriber loop impedance, the
transhybrid balance should be set to subtract a –6 dB
level from the transmit path signal. The transhybrid
balance gain can be adjusted from –2.77 dB to
+4.08 dB around the ideal setting of –6 dB by
programming the HYBA[2:0] bits of the Hybrid Control
register (direct Register 11). Adjusting any of the analog
or digital gain blocks does not require any modification
of the transhybrid balance gain block, as the transhybrid
gain is subtracted from the transmit path signal prior to
any gain adjustment stages. The transhybrid balance
can also be disabled, if desired, using the appropriate
register setting.
The ProSLIC provides on-chip programmable two-wire
impedance settings to meet a wide variety of worldwide
two-wire return loss requirements. The two-wire
impedance is programmed by loading one of the eight
available impedance values into the TISS[2:0] bits of the
Two-Wire Impedance Synthesis Control register (direct
Register 10). If direct Register 10 is not user-defined,
the default setting of 600 will be loaded into the TISS
register.
Real and complex two-wire impedances are realized by
internal feedback of a programmable amplifier (RAC), a
switched
capacitor
network
(XAC),
and
a
transconductance amplifier (G ) (See Figure 24.) RAC
m
creates the real portion, and XAC creates the imaginary
portion of the ac impedance. G then creates a current
m
that models the desired impedance value to the
subscriber loop. The differential ac current is fed to the
Rev. 1.0
45
Si3216
subscriber loop via the ITIPP and IRINGP pins through
2.8. Interrupt Logic
an off-chip current buffer (I
), which is implemented
BUF
The ProSLIC is capable of generating interrupts for the
following events:
using transistors Q1 and Q2 (see Figure on page 22).
is referenced to an off-chip resistor (R ).
G
m
15
Loop current/ring ground detected
Ring trip detected
The ProSLIC also provides a means of compensating
for degraded subscriber loop conditions involving
excessive line capacitance (leakage). The CLC[1:0] bits
of direct Register 10 increase the ac signal magnitude
to compensate for the additional loss at the high end of
the audio frequency range. The default setting of
CLC[2:0] assumes no line capacitance.
Power alarm
Active timer 1 expired
Inactive timer 1 expired
Active timer 2 expired
Inactive timer 2 expired
Ringing active timer expired
Ringing inactive timer expired
Indirect register access complete
When 600 + 1 µF or 900 + 2.16 µF impedances are
selected, an internal reference resistor is removed from
the impedance synthesis circuit to accommodate an
external resistor, R
, inserted into the application
ZREF
The interface to the interrupt logic consists of six
registers. Three interrupt status registers contain 1 bit
for each of the above interrupt functions. These bits are
set when an interrupt is pending for the associated
resource. Three interrupt enable registers also contain 1
bit for each interrupt function. In the case of the interrupt
enable registers, the bits are active high. Refer to the
circuit as shown in Figure 25.
C3
R8
to TIP
STIPAC
Si3216
RZREF
appropriate
operational details of the interrupt functions.
functional
description
section
for
SRINGAC
R9
to RING
C4
When a resource reaches an interrupt condition, it
signals an interrupt to the interrupt control block. The
interrupt control block then sets the associated bit in the
interrupt status register if the enable bit for that interrupt
is set. The INT pin is an open-drain output and a NOR
of the bits of the interrupt status registers. Therefore, if a
bit in the interrupt status registers is asserted, IRQ
asserts low. Upon receiving the interrupt, the interrupt
handler should read interrupt status registers to
determine which resource is requesting service. To
clear a pending interrupt, write the desired bit in the
appropriate interrupt status register to 1. Writing a 0 has
no effect. This provides a mechanism for clearing
individual bits when multiple interrupts occur
simultaneously. While the interrupt status registers are
non-zero, the INT pin will remain asserted.
For 600 + 1 F, RZREF = 12 k and C3, C4 = 100 nF
For 900 + 2.16 F, RZREF = 18 k and C3, C4 = 220 nF
Figure 25. RZREF External Resistor Placement
2.7. Clock Generation
The ProSLIC generates the necessary internal clock
frequencies from the PCLK input. PCLK must be
synchronous to the 8 kHz FSYNC clock and run at one
of the following rates: 256 kHz, 512 kHz, 768 kHz,
1.024 MHz, 1.536 MHz, 2.048 MHz, 4.096 MHz, or
8.192 MHz. The ratio of the PCLK rate to the FSYNC
rate is determined via a counter clocked by PCLK. The
three-bit ratio information is automatically transferred
into an internal register, PLL_MULT, following a reset of
the ProSLIC. The internal PLL_MULT register is used to
control the internal PLL, which multiplies PCLK as
needed to generate the 16.384 MHz rate needed to run
the internal filters and other circuitry.
2.9. Serial Peripheral Interface
The control interface to the ProSLIC is a 4-wire interface
modeled after commonly-available microcontroller and
serial peripheral devices. The interface consists of a
clock (SCLK), chip select (CS), serial data input (SDI),
and serial data output (SDO). Data is transferred a byte
at a time with each register access consisting of a pair
of byte transfers. Figures 26 and 27 illustrate read and
write operation in the SPI bus.
The PLL clock synthesizer settles very quickly following
powerup. However, the settling time depends on the
PCLK frequency and it can be approximately predicted
by the following equation:
The first byte of the pair is the command/address byte.
The MSB of this byte indicates a register read when 1
and a register write when 0. The remaining seven bits of
64
FPCLK
TSETTLE = ----------------
46
Rev. 1.0
Si3216
the command/address byte indicate the address of the
register to be accessed. The second byte of the pair is
the data byte. During a read operation, the SDO
becomes active, and the 8-bit contents of the register
are driven out MSB first. The SDO will be high
impedence on either the falling edge of SCLK following
the LSB or the rising edge of CS, whichever comes first.
SDI is a “don’t care” during the data portion of read
operations. During write operations, data is driven into
the ProSLIC via the SDI pin MSB first. The SDO pin
remains high-impedance during write operations. Data
always transitions with the falling edge of the clock and
is latched on the rising edge. The clock should return to
a logic high when no transfer is in progress.
the 8 bit transfer (command/address or data).
SDI/SDO wired operation. Independent of the
clocking options described, SDI and SDO can be
treated as two separate lines or wired together if the
master is capable of tristating its output during the
data byte transfer of a read operation.
Daisy chain mode. This mode allows
communication with banks of up to eight ProSLIC
devices using one chip select signal. When the
SPIDC bit in the SPI Mode Select register is set,
data transfer mode changes to a 3-byte operation: a
chip select byte, an address/control byte, and a data
byte. Using the circuit shown in Figure 28, a single
device may select from the bank of devices by
setting the appropriate chip select bit to “1”. Each
device uses the LSB of the chip select byte, shifts
the data right by one bit, and passes the chip select
byte using the SDITHRU pin to the next device in the
chain. Address/control and data bytes are unaltered.
There are a number of variations of usage on this four-
wire interface:
Continuous clocking. During continuous clocking,
the data transfers are controlled by the assertion of
the CS pin. CS must assert before the falling edge of
SCLK on which the first bit of data is expected during
a read cycle and must remain low for the duration of
Don't Care
SCLK
CS
SDI
a6 a5 a4 a3 a2 a1 a0
d7 d6 d5 d4 d3 d2 d1 d0
0
SDO
High Impedance
Figure 26. Serial Write 8-Bit Mode
Don't Care
SCLK
CS
SDI
Don't Care
a6 a5 a4 a3 a2 a1 a0
1
SDO
d7 d6 d5 d4 d3 d2 d1 d0
High Impedance
Figure 27. Serial Read 8-Bit Mode
Rev. 1.0
47
Si3216
SDI0
SDO
CS
SDI
CS
CPU
SDO
SDI
SDITHRU
SDI1
SDI2
SDI3
SDI
CS
SDO
SDITHRU
SDI
CS
SDO
SDITHRU
SDI
CS
SDO
SDITHRU
Chip Select Byte
Address Byte
Data Byte
SCLK
C7 C6 C5 C4 C3 C2 C1 C0
– C7 C6 C5 C4 C3 C2 C1
R/W A6 A5 A4 A3 A2 A1 A0
R/W A6 A5 A4 A3 A2 A1 A0
R/W A6 A5 A4 A3 A2 A1 A0
R/W A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
SDI0
SDI1
SDI2
SDI3
–
–
–
–
C7 C6 C5 C4 C3 C2
–
C7 C6 C5 C4 C3
Note: During chip select byte, SDITHRU = SDI delayed by one SCLK. Each device daisy-chained looks at the
LSB of the chip select byte for its chip select.
Figure 28. SPI Daisy Chain Mode
48
Rev. 1.0
Si3216
2.10. PCM Interface
The ProSLIC contains a flexible programmable interface Figure 29 illustrates the use of the PCM in wideband
for the transmission and reception of digital PCM mode. DTX data is high-impedance except for the
samples. PCM data transfer is controlled via the PCLK duration of the 16-bit PCM transmit. DTX returns to
and FSYNC inputs as well as the PCM Mode Select high-impedance either on the negative edge of PCLK
(direct Register 1), PCM Transmit Start Count (direct during the LSB or on the positive edge of PCLK
registers 2 and 3), and PCM Receive Start Count (direct following the LSB. This is based on the setting of the
registers 4 and 5) registers. The interface can be TRI bit of the PCM Mode Select register. Tristating on
configured to support from 2 to 64 16-bit timeslots in the negative edge allows the transmission of data by
each frame. This corresponds to PCLK frequencies of multiple sources in adjacent timeslots without the risk of
256 kHz to 8.192 MHz in power-of-2 increments. driver contention. GCI timing is also supported in which
(768 kHz and 1.536 MHz are also available.) Timeslots the duration of a data bit is two PCLK cycles. This mode
for data transmission and reception are independently is also activated via the PCM Mode Select register.
configured using the TXS and RXS registers. For the Setting the TXS or RXS register greater than the
Si3216 in wideband mode (WBE = 1, PCMF = 11, and number of PCLK cycles in a sample period stops data
PCMT = 1), TXS and RXS set the correct starting point transmission because TXS or RXS never equals the
of the data for the first timeslot within the 8 kHz frame, PCLK count.
and the second timeslot is set to follow 62.5 µs later.
PCLK
FSYNC
63
0
1
0
1
2
3
16 17 18
33 34 35
48
49
PCLK_CNT
DRX
Bit Bit
15 14
Bit Bit
Bit Bit
15 14
Bit Bit
1
1
0
0
MSB
LSB
Bit Bit
15 14
Bit Bit
Bit Bit
15 14
Bit Bit
DTX
1
0
1
0
HI-Z
HI-Z
MSB
LSB
MSB
LSB
Figure 29. Wideband PCM Operation Example, Short FSYNC, PCLK = 512 kHz (TXS/RXS = 1)
Rev. 1.0
49
Si3216
Table 32. µ-Law Encode-Decode Characteristics1,2
Segment #Intervals X Interval Size
Number
Value at Segment Endpoints Digital Code
Decode Level
8159
10000000
8031
b
.
.
.
8
16 X 256
4319
4063
10001111
4191
2079
1023
495
231
99
b
.
.
.
7
6
5
4
3
2
16 X 128
16 X 64
16 X 32
16 X 16
16 X 8
2143
2015
10011111
b
.
.
.
1055
991
10101111
b
.
.
.
511
479
10111111
b
.
.
.
239
223
11001111
b
b
b
.
.
.
103
95
11011111
11101111
11111110
.
.
.
16 X 4
15 X 2
35
31
33
.
.
.
3
1
0
1
2
0
__________________
1 X 1
b
b
11111111
Notes:
1. Characteristics are symmetrical about analog zero with sign bit = 0 for negative analog values.
2. Digital code includes inversion of all magnitude bits.
50
Rev. 1.0
Si3216
Table 33. A-Law Encode-Decode Characteristics1,2
Segment
Number
#intervals X interval size Value at segment endpoints Digital Code
Decode Level
4096
3968
.
.
2176
2048
10101010b
10100101b
4032
2112
7
16 X 128
.
.
6
5
4
3
2
16 X 64
16 X 32
16 X 16
16 X 8
16 X 4
32 X 2
.
1088
1024
10110101b
10000101b
10010101b
11100101b
11110101b
11010101b
1056
528
264
132
66
.
.
.
544
512
.
.
.
272
256
.
.
.
136
128
.
.
.
68
64
.
.
.
2
0
1
1
Notes:
1. Characteristics are symmetrical about analog zero with sign bit = 0 for negative values.
2. Digital code includes inversion of all even numbered bits.
Rev. 1.0
51
Si3216
3. Control Registers
Note: Any register not listed here is reserved and must not be written.
Table 34. Direct Register Summary
Register Name
Bit 7
Bit 6
Bit 5
Setup
PNI[1:0]
PCME
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
1
2
SPI Mode Select
SPIDC
PNI2
SPIM
WBE
RNI[3:0]
PCM Mode Select
PCMF[1:0]
PCMT
GCI
TRI
PCM Transmit Start
Count—Low Byte
TXS[7:0]
3
4
5
6
PCM Transmit Start
Count—High Byte
TXS[9:8]
PCM Receive Start
Count—Low Byte
RXS[7:0]
PCM Receive Start
Count—High Byte
RXS[9:8]
Part Number
Identification
PNI[2:0]
TXHP
Audio
8
Audio Path Loopback
Control
ALM2
DLM
ALM1
9
Audio Gain Control
RXHP
TXM
RXM
ATX[1:0]
TISE
ARX[1:0]
TISS[2:0]
10
Two-Wire Impedance
Synthesis Control
CLC[1:0]
11
Hybrid Control
HYBP[2:0]
Powerdown
HYBA[2:0]
14
15
Powerdown Control 1
Powerdown Control 2
DCOF
ADCM ADCON DACM DACON
Interrupts
RGIP
PFR
BIASOF SLICOF
GMM
GMON
18
19
20
21
22
23
Interrupt Status 1
Interrupt Status 2
Interrupt Status 3
Interrupt Enable 1
Interrupt Enable 2
Interrupt Enable 3
RGAP
Q3AP
O2IP
O2AP
Q1AP
O1IP
LCIP
INDP
O1IE
LCIE
INDE
O1AP
RTIP
Q6AP
Q6AE
Q5AP
Q4AP
Q2AP
RGIE
Q4AE
RGAE
Q3AE
O2IE
O2AE
Q1AE
O1AE
RTIE
Q5AE
Q2AE
Indirect Register Access
28
29
30
Indirect Data Access—
Low Byte
IDA[7:0]
Indirect Data Access—
High Byte
IDA[15:8]
IAA[7:0]
Indirect Address
52
Rev. 1.0
Si3216
Table 34. Direct Register Summary (Continued)
Register Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
31
Indirect Address Status
IAS
Oscillators
32
33
34
Oscillator 1 Control
Oscillator 2 Control
OSS1
OSS2
RSS
REL
OZ1
OZ2
O1TAE O1TIE
O2TAE O2TIE
O1E
O2E
ROE
O1SO[1:0]
O2SO[1:0]
Ringing Oscillator
Control
RDAC
RTAE
RTIE
RVO
TSWS
36
37
38
39
40
41
42
43
48
49
50
51
52
Oscillator 1 Active
Timer—Low Byte
OAT1[7:0]
OAT1[15:8]
OIT1[7:0]
OIT1[15:8]
OAT2[7:0]
OAT2[15:8]
OIT2[7:0]
OIT2[15:8]
RAT[7:0]
Oscillator 1 Active
Timer—High Byte
Oscillator 1 Inactive
Timer—Low Byte
Oscillator 1 Inactive
Timer—High Byte
Oscillator 2 Active
Timer—Low Byte
Oscillator 2 Active
Timer—High Byte
Oscillator 2 Inactive
Timer—Low Byte
Oscillator 2 Inactive
Timer—High Byte
Ringing Oscillator
Active Timer—Low Byte
Ringing Oscillator
Active Timer—High Byte
RAT[15:8]
RIT[7:0]
Ringing Oscillator Inac-
tive Timer—Low Byte
Ringing Oscillator Inac-
tive Timer—High Byte
RIT[15:8]
FSK Data
FSKDAT
SLIC
63
Loop Closure Debounce
Interval
LCD[7:0]
64
65
Linefeed Control
LFS[2:0]
CBY
LF[2:0]
AOLD
External Bipolar
Transistor Control
SQH
ETBE
VOV
ETBO[1:0]
FVBAT
ETBA[1:0]
66
67
Battery Feed Control
TRACK
AOPN
Automatic/Manual
Control
MNCM MNDIF SPDS
AORD
Rev. 1.0
53
Si3216
Table 34. Direct Register Summary (Continued)
Register Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
68
69
70
Loop Closure/Ring Trip
Detect Status
DBIRAW
RTP
LCR
Loop Closure Debounce
Interval
LCDI[6:0]
RTDI[6:0]
Ring Trip Detect
Debounce Interval
71
72
73
74
75
76
77
Loop Current Limit
ILIM[2:0]
On-Hook Line Voltage
Common Mode Voltage
High Battery Voltage
Low Battery Voltage
Power Monitor Pointer
VSGN
VOC[5:0]
VCM[5:0]
VBATH[5:0]
VBATL[5:0]
PWRMP[2:0]
Line Power Output
Monitor
PWROM[7:0]
78
79
80
81
82
83
84
Loop Voltage Sense
Loop Current Sense
TIP Voltage Sense
LVSP
LCSP
LVS[5:0]
LCS[5:0]
VTIP[7:0]
VRING[7:0]
RING Voltage Sense
Battery Voltage Sense 1
Battery Voltage Sense 2
VBATS1[7:0]
VBATS2[7:0]
IQ1[7:0]
Transistor 1 Current
Sense
85
86
87
88
89
92
93
94
95
Transistor 2 Current
Sense
IQ2[7:0]
IQ3[7:0]
IQ4[7:0]
IQ5[7:0]
IQ6[7:0]
DCN[7:0]
Transistor 3 Current
Sense
Transistor 4 Current
Sense
Transistor 5 Current
Sense
Transistor 6 Current
Sense
DC-DC Converter PWM
Period
DC-DC Converter
Switching Delay
DCCAL
DCPOL
DCTOF[4:0]
DC-DC Converter PWM
Pulse Width
DCPW[7:0]
Reserved
54
Rev. 1.0
Si3216
Table 34. Direct Register Summary (Continued)
Register Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
96
Calibration Control/
CAL
CALSP CALR
CALT
CALD
CALC
CALIL
Status Register 1
CALM1 CALM2 CALDAC CALADC
CALGMR[4:0]
97
Calibration Control/
Status Register 2
98
RING Gain Mismatch
Calibration Result
99
TIP Gain Mismatch
Calibration Result
CALGMT[4:0]
100
Differential Loop
Current Gain
CALGD[4:0]
Calibration Result
101
Common Mode Loop
Current Gain
CALGC[4:0]
Calibration Result
102
103
Current Limit
Calibration Result
CALGIL[3:0]
Monitor ADC Offset
Calibration Result
CALMG1[3:0]
CALMG2[3:0]
104
105
Analog DAC/ADC Offset
DACP
DACN
ADCP
ADCN
DAC Offset Calibration
Result
DACOF[7:0]
107
108
DC Peak Current Moni-
tor Calibration Result
CMDCPK[3:0]
Enhancement Enable
ILIMEN FSKEN DCSU
LCVE
DCFIL HYSTEN
Rev. 1.0
55
Si3216
Register 0. SPI Mode Select
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
SPIDC
R/W
SPIM
R/W
PNI[1:0]
R
RNI[3:0]
R
Reset settings = 00xx_xxxx
Bit
Name
Function
7
SPIDC
SPI Daisy Chain Mode Enable.
0 = Disable SPI daisy chain mode.
1 = Enable SPI daisy chain mode.
6
SPIM
SPI Mode.
0 = Causes SDO to tri-state on rising edge of SCLK of LSB.
1 = Normal operation; SDO tri-states on rising edge of CS.
5:4
PNI[1:0]
Part Number Identification.
Note: PNI[2:0] can be read in direct register 6.
00 = Si3216
01 = Reserved
10 = Reserved
11 = Si3216M
3:0
RNI[3:0]
Revision Number Identification.
0001 = Revision A, 0010 = Revision B, 0011 = Revision C, etc.
56
Rev. 1.0
Si3216
Register 1. PCM Mode Select
Bit
D7
PNI2
R
D6
D5
D4
PCMF[1:0]
R/W
D3
D2
D1
D0
TRI
R/W
Name
Type
WBE
R/W
PCME
R/W
PCMT
R/W
GCI
R/W
Reset settings = 1000_1000
Bit
Name
Function
7
PNI2
Part Number Identification 2.
Note: PNI[2:0] can be read in direct Register 6.
0 = Si3210, Si3211 family.
1 = Si3216 family.
6
WBE
Wideband Enable.
0 = Narrowband (200 Hz–3.4 kHz) audio filtering at 8 kHz sample rate.
1 = Wideband (50 Hz–7 kHz) audio filtering at 16 kHz sample rate when PCMF = 11 and
PCMT = 1.
5
PCME
PCM Enable.
0 = Disable PCM transfers.
1 = Enable PCM transfers.
4:3
PCMF[1:0]
PCM Format.
00 = A-Law
01 = µ-Law
10 = Reserved
11 = Linear
2
1
0
PCMT
GCI
PCM Transfer Size.
0 = 8-bit transfer.
1 = 16-bit transfer.
GCI Clock Format.
0 = 1 PCLK per data bit.
1 = 2 PCLKs per data bit.
TRI
Tri-state Bit 0.
0 = Tri-state bit 0 on positive edge of PCLK.
1 = Tri-state bit 0 on negative edge of PCLK.
Rev. 1.0
57
Si3216
Register 2. PCM Transmit Start Count—Low Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
TXS[7:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
TXS[7:0]
PCM Transmit Start Count.
PCM transmit start count equals the number of PCLKs following FSYNC before data trans-
mission begins. See Figure 29 on page 49.
Register 3. PCM Transmit Start Count—High Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
TXS[9:8]
R/W
Reset settings = 0000_0000
Bit
7:2
1:0
Name
Function
Reserved
TXS[9:8]
Read returns zero.
PCM Transmit Start Count.
PCM transmit start count equals the number of PCLKs following FSYNC before data
transmission begins. See Figure 29 on page 49.
Register 4. PCM Receive Start Count—Low Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RXS[7:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
RXS[7:0]
PCM Receive Start Count.
PCM receive start count equals the number of PCLKs following FSYNC before data
reception begins. See Figure 29 on page 49.
58
Rev. 1.0
Si3216
Register 5. PCM Receive Start Count—High Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RXS[9:8]
R/W
Reset settings = 0000_0000
Bit
7:2
1:0
Name
Function
Reserved
RXS[9:8]
Read returns zero.
PCM Receive Start Count.
PCM receive start count equals the number of PCLKs following FSYNC before data
reception begins. See Figure 29 on page 49.
Register 6. Part Number Identification
Bit
D7
D6
PNI[2:0]
R
D5
D4
D3
D2
D1
D0
Name
Type
Reset settings = 0xx0_0000
Bit
Name
Function
7:5
PNI[2:0]
Part Number Identification.
Note: PNI[2] can be read in direct Register 1. PNI[1:0] can be read in direct Register 0.
000 = Reserved
001 = Reserved
010 = Reserved
011 = Reserved
100 = Si3216
101 = Reserved
110 = Reserved
111 = Si3216M
4:0
Reserved
Read returns zero.
Rev. 1.0
59
Si3216
Register 8. Audio Path Loopback Control
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
ALM2
R/W
DLM
R/W
ALM1
R/W
Reset settings = 0000_0010
Bit
7:3
2
Name
Reserved
ALM2
Function
Read returns zero.
Analog Loopback Mode 2. (See Figure 24 on page 44.)
0 = Full analog loopback mode disabled.
1 = Full analog loopback mode enabled.
1
0
DLM
Digital Loopback Mode. (See Figure 24 on page 44.)
0 = Digital loopback disabled.
1 = Digital loopback enabled.
ALM1
Analog Loopback Mode 1. (See Figure 24 on page 44.)
0 = Analog loopback disabled.
1 = Analog loopback enabled.
60
Rev. 1.0
Si3216
Register 9. Audio Gain Control
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RXHP
R/W
TXHP
R/W
TXM
R/W
RXM
R/W
ATX[1:0]
R/W
ARX[1:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
RXHP
Receive Path High Pass Filter Disable.
0 = HPF enabled in receive path, RHDF.
1 = HPF bypassed in receive path, RHDF.
6
5
TXHP
TXM
Transmit Path High Pass Filter Disable.
0 = HPF enabled in transmit path, THPF.
1 = HPF bypassed in transmit path, THPF.
Transmit Path Mute.
Refer to position of digital mute in Figure 24 on page 44.
0 = Transmit signal passed.
1 = Transmit signal muted.
4
RXM
Receive Path Mute.
Refer to position of digital mute in Figure 24 on page 44.
0 = Receive signal passed.
1 = Receive signal muted.
3:2
ATX[1:0]
Analog Transmit Path Gain.
00 = 0 dB
01 = –3.5 dB
10 = 3.5 dB
11 = ATX gain = 0 dB; analog transmit path muted.
1:0
ARX[1:0]
Analog Receive Path Gain.
00 = 0 dB
01 = –3.5 dB
10 = 3.5 dB
11 = Analog receive path muted.
Rev. 1.0
61
Si3216
Register 10. Two-Wire Impedance Synthesis Control
Bit
D7
D6
D5
D4
D3
D2
D1
TISS[2:0]
R/W
D0
Name
Type
CLC[1:0]
R/W
TISE
R/W
Reset settings = 0000_1000
Bit
7:6
5:4
Name
Reserved Read returns zero.
Function
CLC[1:0]
Line Capacitance Compensation.
00 = Off
01 = 4.7 nF
10 = 10 nF
11 = Reserved
3
TISE
Two-Wire Impedance Synthesis Enable.
0 = Two-wire impedance synthesis disabled.
1 = Two-wire impedance synthesis enabled.
2:0
TISS[2:0]
Two-Wire Impedance Synthesis Selection.
000 = 600
001 = 900
010 = Japan (600 + 1 µF); requires external resistor R
= 12 k and C3, C4 = 100 nF.
ZREF
011 = 900 + 2.16 µF; requires external resistor R
= 18 k and C3, C4 = 220 nF.
ZREF
100 = CTR21 (270 + 750 || 150 nF).
101 = Australia/New Zealand #1 (220 + 820 || 120 nF).
110 = Slovakia/Slovenia/South Africa (220 + 820 || 115 nF).
111 = China (200 + 680 || 100 nF).
62
Rev. 1.0
Si3216
Register 11. Hybrid Control
Bit
D7
D6
D5
HYBP[2:0]
R/W
D4
D3
D2
D1
HYBA[2:0]
R/W
D0
Name
Type
Reset settings = 0011_0011
Bit
7
Name
Function
Reserved
HYBP[2:0]
Read returns zero.
6:4
Pulse Metering Hybrid Adjustment.
000 = 4.08 dB
001 = 2.5 dB
010 = 1.16 dB
011 = 0 dB
100 = –1.02 dB
101 = –1.94 dB
110 = –2.77 dB
111 = Off
3
Reserved
HYBA[2:0]
Read returns zero.
2:0
Audio Hybrid Adjustment.
000 = 4.08 dB
001 = 2.5 dB
010 = 1.16 dB
011 = 0 dB
100 = –1.02 dB
101 = –1.94 dB
110 = –2.77 dB
111 = Off
Rev. 1.0
63
Si3216
Register 14. Powerdown Control 1
Bit
D7
D6
D5
D4
D3
D2
D1
BIASOF
R/W
D0
SLICOF
R/W
Name
Type
DCOF
R/W
PFR
R/W
Reset settings = 0001_0000
Bit
7:5
4
Name
Reserved
DCOF
Function
Read returns zero.
DC-DC Converter Power-Off Control.
0 = Automatic power control.
1 = Override automatic control and force dc-dc circuitry off.
3
PFR
PLL Free-Run Control.
0 = Automatic free-run control.
1 = Override automatic control and force PLL into free-run state.
2
1
Reserved
BIASOF
Read returns zero.
DC Bias Power-Off Control.
0 = Automatic power control.
1 = Override automatic control and force dc bias circuitry off.
0
SLICOF
SLIC Power-Off Control.
0 = Automatic power control.
1 = Override automatic control and force SLIC circuitry off.
64
Rev. 1.0
Si3216
Register 15. Powerdown Control 2
Bit
D7
D6
D5
D4
ADCON
R/W
D3
D2
DACON
R/W
D1
D0
Name
Type
ADCM
R/W
DACM
R/W
GMM
R/W
GMON
R/W
Reset settings = 0000_0000
Bit
7:6
5
Name
Reserved
ADCM
Function
Read returns zero.
Analog to Digital Converter Manual/Automatic Power Control.
0 = Automatic power control.
1 = Manual power control; ADCON controls on/off state.
4
ADCON
Analog to Digital Converter On/Off Power Control.
When ADCM = 1:
0 = Analog to digital converter powered off.
1 = Analog to digital converter powered on.
ADCON has no effect when ADCM = 0.
3
2
DACM
Digital to Analog Converter Manual/Automatic Power Control.
0 = Automatic power control.
1 = Manual power control; DACON controls on/off state.
DACON
Digital to Analog Converter On/Off Power Control.
When DACM = 1:
0 = Digital to analog converter powered off.
1 = Digital to analog converter powered on.
DACON has no effect when DACM = 0.
1
0
GMM
Transconductance Amplifier Manual/Automatic Power Control.
0 = Automatic power control.
1 = Manual power control; GMON controls on/off state.
GMON
Transconductance Amplifier On/Off Power Control.
When GMM = 1:
0 = Analog to digital converter powered off.
1 = Analog to digital converter powered on.
GMON has no effect when GMM = 0.
Rev. 1.0
65
Si3216
Register 18. Interrupt Status 1
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RGIP
R/W
RGAP
R/W
O2IP
R/W
O2AP
R/W
O1IP
R/W
O1AP
R/W
Reset settings = 0000_0000
Bit
7:6
5
Name
Reserved
RGIP
Function
Read returns zero.
Ringing Inactive Timer Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
4
3
2
1
0
RGAP
O2IP
Ringing Active Timer Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Oscillator 2 Inactive Timer Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
O2AP
O1IP
Oscillator 2 Active Timer Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Oscillator 1 Inactive Timer Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
O1AP
Oscillator 1 Active Timer Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
66
Rev. 1.0
Si3216
Register 19. Interrupt Status 2
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
Q6AP
R/W
Q5AP
R/W
Q4AP
R/W
Q3AP
R/W
Q2AP
R/W
Q1AP
R/W
LCIP
R/W
RTIP
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
Q6AP
Power Alarm Q6 Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
6
5
4
3
2
1
0
Q5AP
Q4AP
Q3AP
Q2AP
Q1AP
LCIP
Power Alarm Q5 Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Power Alarm Q4 Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Power Alarm Q3 Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Power Alarm Q2 Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Power Alarm Q1 Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Loop Closure Transition Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
RTIP
Ring Trip Interrupt Pending.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
Rev. 1.0
67
Si3216
Register 20. Interrupt Status 3
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
INDP
R/W
Reset settings = 0000_0000
Bit
7:2
1
Name
Reserved
INDP
Function
Read returns zero.
Indirect Register Access Serviced Interrupt.
This bit is set once a pending indirect register service request has been completed.
Writing 1 to this bit clears a pending interrupt.
0 = No interrupt pending.
1 = Interrupt pending.
0
Reserved
Read returns zero.
68
Rev. 1.0
Si3216
Register 21. Interrupt Enable 1
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RGIE
R/W
RGAE
R/W
O2IE
R/W
O2AE
R/W
O1IE
R/W
O1AE
R/W
Reset settings = 0000_0000
Bit
7:6
5
Name
Reserved
RGIE
Function
Read/write bit with no function.
Ringing Inactive Timer Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
4
3
2
1
0
RGAE
O2IE
Ringing Active Timer Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Oscillator 2 Inactive Timer Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
O2AE
O1IE
Oscillator 2 Active Timer Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Oscillator 1 Inactive Timer Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
O1AE
Oscillator 1 Active Timer Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Rev. 1.0
69
Si3216
Register 22. Interrupt Enable 2
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
Q6AE
R/W
Q5AE
R/W
Q4AE
R/W
Q3AE
R/W
Q2AE
R/W
Q1AE
R/W
LCIE
R/W
RTIE
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
Q6AE
Power Alarm Q6 Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
6
5
4
3
2
1
0
Q5AE
Q4AE
Q3AE
Q2AE
Q1AE
LCIE
Power Alarm Q5 Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Power Alarm Q4 Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Power Alarm Q3 Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Power Alarm Q2 Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Power Alarm Q1 Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
Loop Closure Transition Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
RTIE
Ring Trip Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
70
Rev. 1.0
Si3216
Register 23. Interrupt Enable 3
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
INDE
R/W
Reset settings = 0000_0000
Bit
7:2
1
Name
Reserved
INDE
Function
Read returns zero.
Indirect Register Access Serviced Interrupt Enable.
0 = Interrupt masked.
1 = Interrupt enabled.
0
Reserved
Read/write bit with no function.
Rev. 1.0
71
Si3216
Register 28. Indirect Data Access—Low Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IDA[7:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
IDA[7:0]
Indirect Data Access—Low Byte.
A write to IDA followed by a write to IAA will place the contents of IDA into an indirect
register at the location referenced by IAA at the next indirect register update (16 kHz
update rate—a write operation). Writing IAA only will load IDA with the value stored at
IAA at the next indirect memory update (a read operation).
Register 29. Indirect Data Access—High Byte
Bit
D7
D6
D5
D4
IDA[15:8]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
IDA[15:8]
Indirect Data Access—High Byte.
A write to IDA followed by a write to IAA will place the contents of IDA into an indirect
register at the location referenced by IAA at the next indirect register update (16 kHz
update rate—a write operation). Writing IAA only will load IDA with the value stored at
IAA at the next indirect memory update (a read operation).
72
Rev. 1.0
Si3216
Register 30. Indirect Address
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IAA[7:0]
R/W
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IAA[7:0]
Indirect Address Access.
A write to IDA followed by a write to IAA will place the contents of IDA into an indirect
register at the location referenced by IAA at the next indirect register update (16 kHz
update rate—a write operation). Writing IAA only will load IDA with the value stored at
IAA at the next indirect memory update (a read operation).
Register 31. Indirect Address Status
Bit
D7
D6
D5
D4
D3
D2
D1
D0
IAS
R
Name
Type
Reset settings = 0000_0000
Bit
7:1
0
Name
Reserved
IAS
Function
Read returns zero.
Indirect Access Status.
0 = No indirect memory access pending.
1 = Indirect memory access pending.
Rev. 1.0
73
Si3216
Register 32. Oscillator 1 Control
Bit
D7
OSS1
R
D6
D5
D4
D3
D2
D1
O1SO[1:0]
R/W
D0
Name
Type
REL
R/W
OZ1
R/W
O1TAE
R/W
O1TIE
R/W
O1E
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
OSS1
Oscillator 1 Signal Status.
0 = Output signal inactive.
1 = Output signal active.
6
REL
Oscillator 1 Automatic Register Reload.
This bit should be set for FSK signaling.
0 = Oscillator 1 will stop signaling after inactive timer expires.
1 = Oscillator 1 will continue to read register parameters and output signals.
5
4
OZ1
O1TAE
O1TIE
Oscillator 1 Zero Cross Enable.
0 = Signal terminates after active timer expires.
1 = Signal terminates at zero crossing after active timer expires.
Oscillator 1 Active Timer Enable.
0 = Disable timer.
1 = Enable timer.
3
Oscillator 1 Inactive Timer Enable.
0 = Disable timer.
1 = Enable timer.
2
O1E
Oscillator 1 Enable.
0 = Disable oscillator.
1 = Enable oscillator.
1:0
O1SO[1:0]
Oscillator 1 Signal Output Routing.
00 = Unassigned path (output not connected).
01 = Assign to transmit path.
10 = Assign to receive path.
11 = Assign to both paths.
74
Rev. 1.0
Si3216
Register 33. Oscillator 2 Control
Bit
D7
OSS2
R
D6
D5
D4
O2TAE
R/W
D3
D2
D1
O2SO[1:0]
R/W
D0
Name
Type
OZ2
R/W
O2TIE
R/W
O2E
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
OSS2
Oscillator 2 Signal Status.
0 = Output signal inactive.
1 = Output signal active.
6
5
Reserved
OZ2
Read returns zero.
Oscillator 2 Zero Cross Enable.
0 = Signal terminates after active timer expires.
1 = Signal terminates at zero crossing.
4
3
O2TAE
O2TIE
Oscillator 2 Active Timer Enable.
0 = Disable timer.
1 = Enable timer.
Oscillator 2 Inactive Timer Enable.
0 = Disable timer.
1 = Enable timer.
2
O2E
Oscillator 2 Enable.
0 = Disable oscillator.
1 = Enable oscillator.
1:0
O2SO[1:0]
Oscillator 2 Signal Output Routing.
00 = Unassigned path (output not connected).
01 = Assign to transmit path.
10 = Assign to receive path.
11 = Assign to both paths.
Rev. 1.0
75
Si3216
Register 34. Ringing Oscillator Control
Bit
D7
RSS
R
D6
D5
RDAC
R
D4
D3
D2
ROE
R
D1
D0
Name
Type
RTAE
R/W
RTIE
R/W
RVO
R/W
TSWS
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
RSS
Ringing Signal Status.
0 = Ringing oscillator output signal inactive.
1 = Ringing oscillator output signal active.
6
5
Reserved
RDAC
Read returns zero.
Ringing Signal DAC/Linefeed Cross Indicator.
For ringing signal start and stop, output to TIP and RING is suspended to ensure conti-
nuity with dc linefeed voltages. RDAC indicates that ringing signal is actually present at
TIP and RING.
0 = Ringing signal not present at TIP and RING.
1 = Ringing signal present at TIP and RING.
4
3
2
1
0
RTAE
RTIE
ROE
Ringing Active Timer Enable.
0 = Disable timer.
1 = Enable timer.
Ringing Inactive Timer Enable.
0 = Disable timer.
1 = Enable timer.
Ringing Oscillator Enable.
0 = Ringing oscillator disabled.
1 = Ringing oscillator enabled.
RVO
Ringing Voltage Offset.
0 = No dc offset added to ringing signal.
1 = DC offset added to ringing signal.
TSWS
Trapezoid/Sinusoid Waveshape Select.
0 = Sinusoid.
1 = Trapezoid.
76
Rev. 1.0
Si3216
Register 36. Oscillator 1 Active Timer—Low Byte
Bit
D7
D6
D5
D4
OAT1[7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
OAT1[7:0]
Oscillator 1 Active Timer.
LSB = 125 µs
Register 37. Oscillator 1 Active Timer—High Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
OAT1[15:8]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
OAT1[15:8]
Oscillator 1 Active Timer.
Register 38. Oscillator 1 Inactive Timer—Low Byte
Bit
D7
D6
D5
D4
OIT1[7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
OIT1[7:0]
Oscillator 1 Inactive Timer.
LSB = 125 µs
Rev. 1.0
77
Si3216
Register 39. Oscillator 1 Inactive Timer—High Byte
Bit
D7
D6
D5
D4
OIT1[15:8]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
OIT1[15:8]
Oscillator 1 Inactive Timer.
Register 40. Oscillator 2 Active Timer—Low Byte
Bit
D7
D6
D5
D4
OAT2[7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
OAT2[7:0]
Oscillator 2 Active Timer.
LSB = 125 µs
Register 41. Oscillator 2 Active Timer—High Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
OAT2[15:8]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
OAT2[15:8]
Oscillator 2 Active Timer.
78
Rev. 1.0
Si3216
Register 42. Oscillator 2 Inactive Timer—Low Byte
Bit
D7
D6
D5
D4
OIT2[7:0]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
OIT2[7:0]
Oscillator 2 Inactive Timer.
LSB = 125 µs
Register 43. Oscillator 2 Inactive Timer—High Byte
Bit
D7
D6
D5
D4
OIT2[15:8]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
OIT2[15:8]
Oscillator 2 Inactive Timer.
Register 48. Ringing Oscillator Active Timer—Low Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RAT[7:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
RAT[7:0]
Ringing Active Timer.
LSB = 125 µs
Rev. 1.0
79
Si3216
Register 49. Ringing Oscillator Active Timer—High Byte
Bit
D7
D6
D5
D4
RAT[15:8]
R/W
D3
D2
D1
D0
Name
Type
Reset settings = 0000_0000
Bit
Name
Function
7:0
RAT[15:8]
Ringing Active Timer.
Register 50. Ringing Oscillator Inactive Timer—Low Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RIT[7:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
RIT[7:0]
Ringing Inactive Timer.
LSB = 125 µs
Register 51. Ringing Oscillator Inactive Timer—High Byte
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
RIT[15:8]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
RIT[15:8]
Ringing Inactive Timer.
80
Rev. 1.0
Si3216
Register 52. FSK Data
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
FSKDAT
R/W
Reset settings = 0000_0000
Bit
7:1
0
Name
Function
Reserved
FSKDAT
Read returns zero.
FSK Data.
When FSKEN = 1 (direct Register 108, bit 6) and REL = 1 (direct Register 32, bit 6), this
bit serves as the buffered input for FSK generation bit stream data.
Register 63. Loop Closure Debounce Interval
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
LCD[7:0]
Reset settings = 0101_0100
Bit
Name
Function
7:0
LCD[7:0]
Loop Closure Debounce Interval for Automatic Ringing.
This register sets the loop closure debounce interval for the ringing silent period when
using automatic ringing cadences. The value may be set between 0 ms (0x00) and
159 ms (0x7F) in 1.25 ms steps.
Rev. 1.0
81
Si3216
Register 64. Linefeed Control
Bit
D7
D6
D5
LFS[2:0]
R
D4
D3
D2
D1
D0
Name
Type
LF[2:0]
R/W
Reset settings = 0000_0000
Bit
7
Name
Reserved
LFS[2:0]
Function
Read returns zero.
6:4
Linefeed Shadow.
This register reflects the actual real time linefeed state. Automatic operations may cause
actual linefeed state to deviate from the state defined by linefeed register (e.g., when
linefeed equals Ringing state, LFS will equal on-hook transmission state during ringing
silent period and Ringing state during ring burst).
000 = Open
001 = Forward active
010 = Forward on-hook transmission
011 = TIP open
100 = Ringing
101 = Reverse active
110 = Reverse on-hook transmission
111 = RING open
3
Reserved
LF[2:0]
Read returns zero.
2:0
Linefeed.
Writing to this register sets the linefeed state.
000 = Open
001 = Forward active
010 = Forward on-hook transmission
011 = TIP open
100 = Ringing
101 = Reverse active
110 = Reverse on-hook transmission
111 = RING open
82
Rev. 1.0
Si3216
Register 65. External Bipolar Transistor Control
Bit
D7
D6
D5
D4
D3
D2
D1
ETBA[1:0]
R/W
D0
Name
Type
SQH
R/W
CBY
R/W
ETBE
R/W
ETBO[1:0]
R/W
Reset settings = 0110_0001
Bit
7
Name
Reserved
SQH
Function
Read returns zero.
6
Audio Squelch.
0 = No squelch.
1 = STIPAC and SRINGAC pins squelched.
5
4
CBY
ETBE
Capacitor Bypass.
0 = Capacitors CP (C1) and CM (C2) in circuit.
1 = Capacitors CP (C1) and CM (C2) bypassed.
External Transistor Bias Enable.
0 = Bias disabled.
1 = Bias enabled.
3:2
ETBO[1:0]
External Transistor Bias Levels—On-Hook Transmission State.
DC bias current which flows through external BJTs in the on-hook transmission state.
Increasing this value increases the compliance of the ac longitudinal balance circuit.
00 = 4 mA
01 = 8 mA
10 = 12 mA
11 = Reserved
1:0
ETBA[1:0]
External Transistor Bias Levels—Active Off-Hook State.
DC bias current which flows through external BJTs in the active off-hook state. Increasing
this value increases the compliance of the ac longitudinal balance circuit.
00 = 4 mA
01 = 8 mA
10 = 12 mA
11 = Reserved
Rev. 1.0
83
Si3216
Register 66. Battery Feed Control
Bit
D7
D6
D5
D4
D3
D2
D1
D0
TRACK
R/W
Name
Type
VOV
R/W
FVBAT
R/W
Reset settings = 0000_0011
Bit
7:5
4
Name
Reserved
VOV
Function
Read returns zero.
Overhead Voltage Range Increase. (See Figure 19 on page 35.)
This bit selects the programmable range for V , which is defined in indirect Register 41.
OV
0 = V = 0 V to 9 V
OV
1 = V = 0 V to 13.5 V
OV
3
FVBAT
V
Manual Setting.
BAT
0 = Normal operation.
1 = V tracks VBATH register.
BAT
2:1
0
Reserved
TRACK
Read returns zero.
DC-DC Converter Tracking Mode.
0 = |V
1 = V
| will not decrease below VBATL.
BAT
BAT
tracks V
.
RING
84
Rev. 1.0
Si3216
Register 67. Automatic/Manual Control
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
MNCM
R/W
MNDIF
R/W
SPDS
R/W
AORD
R/W
AOLD
R/W
AOPN
R/W
Reset settings = 0001_1111
Bit
7
Name
Reserved
MNCM
Function
Read returns zero.
6
Common Mode Manual/Automatic Select.
0 = Automatic control.
1 = Manual control, in which TIP (forward) or RING (reverse) forces voltage to follow
VCM value.
5
4
MNDIF
SPDS
Differential Mode Manual/Automatic Select.
0 = Automatic control.
1 = Manual control (forces differential voltage to follow VOC value).
Speed-Up Mode Enable.
0 = Speed-up disabled.
1 = Automatic speed-up.
3
2
Reserved
AORD
Read returns zero.
Automatic/Manual Ring Trip Detect.
0 = Manual mode.
1 = Enter off-hook Active state automatically upon ring trip detect.
1
0
AOLD
AOPN
Automatic/Manual Loop Closure Detect.
0 = Manual mode.
1 = Enter off-hook Active state automatically upon loop closure detect.
Power Alarm Automatic/Manual Detect.
0 = Manual mode.
1 = Enter Open state automatically upon power alarm.
Rev. 1.0
85
Si3216
Register 68. Loop Closure/Ring Trip Detect Status
Bit
D7
D6
D5
D4
D3
D2
DBIRAW
R
D1
RTP
R
D0
LCR
R
Name
Type
Reset settings = 0000_0000
Bit
7:3
2
Name
Function
Reserved
DBIRAW
Read returns zero.
Ring Trip/Loop Closure Unfiltered Output.
The state of this bit reflects the real time output of ring trip and loop closure detect circuits
before debouncing.
0 = Ring trip/loop closure threshold exceeded.
1 = Ring trip/loop closure threshold not exceeded.
1
0
RTP
LCR
Ring Trip Detect Indicator (Filtered Output).
0 = Ring trip detect has not occurred.
1 = Ring trip detect occurred.
Loop Closure Detect Indicator (Filtered Output).
0 = Loop closure detect has not occurred.
1 = Loop closure detect has occurred.
Register 69. Loop Closure Debounce Interval
Bit
D7
D6
D5
D4
D3
LCDI[6:0]
R/W
D2
D1
D0
Name
Type
Reset settings = 0000_1010
Bit
7
Name
Function
Reserved
LCDI[6:0]
Read returns zero.
6:0
Loop Closure Debounce Interval.
The value written to this register defines the minimum steady state debounce time. Value
may be set between 0 ms (0x00) to 159 ms (0x7F) in 1.25 ms steps. Default
value = 12.5 ms.
86
Rev. 1.0
Si3216
Register 70. Ring Trip Detect Debounce Interval
Bit
D7
D6
D5
D4
D3
RTDI[6:0]
R/W
D2
D1
D0
Name
Type
Reset settings = 0000_1010
Bit
7
Name
Function
Reserved
RTDI[6:0]
Read returns zero.
6:0
Ring Trip Detect Debounce Interval.
The value written to this register defines the minimum steady state debounce time. The
value may be set between 0 ms (0x00) to 159 ms (0x7F) in 1.25 ms steps. Default
value = 12.5 ms.
Register 71. Loop Current Limit
Bit
D7
D6
D5
D4
D3
D2
D1
ILIM[2:0]
R/W
D0
Name
Type
Reset settings = 0000_0000
Bit
7:3
2:0
Name
Function
Reserved
ILIM[2:0]
Read returns zero.
Loop Current Limit.
The value written to this register sets the constant loop current. The value may be set
between 20 mA (0x00) and 41 mA (0x07) in 3 mA steps.
Rev. 1.0
87
Si3216
Register 72. On-Hook Line Voltage
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VSGN
R/W
VOC[5:0]
R/W
Reset settings = 0010_0000
Bit
7
Name
Reserved
VSGN
Function
Read returns zero.
6
On-Hook Line Voltage.
The value written to this bit sets the on-hook line voltage polarity (V –V
).
RING
TIP
0 = V –V
is positive.
is negative.
TIP
RING
RING
1 = V –V
TIP
5:0
VOC[5:0]
On-Hook Line Voltage.
The value written to this register sets the on-hook line voltage (V –V
). Value may
RING
TIP
be set between 0 V (0x00) and 94.5 V (0x3F) in 1.5 V steps. Default value = 48 V.
Register 73. Common Mode Voltage
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VCM[5:0]
R/W
Reset settings = 0000_0010
Bit
7:6
5:0
Name
Function
Reserved
VCM[5:0]
Read returns zero.
Common Mode Voltage.
The value written to this register sets V
for forward active and forward on-hook trans-
TIP
mission states and V
for reverse active and reverse on-hook transmission states.
RING
The value may be set between 0 V (0x00) and –94.5 V (0x3F) in 1.5 V steps. Default
value = –3 V.
88
Rev. 1.0
Si3216
Register 74. High Battery Voltage
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VBATH[5:0]
R/W
Reset settings = 0011_0010
Bit
7:6
5:0
Name
Function
Reserved
VBATH[5:0]
Read returns zero.
High Battery Voltage.
The value written to this register sets high battery voltage. V
must be greater than or
BATH
equal to V
. The value may be set between 0 V (0x00) and –94.5 V (0x3F) in 1.5 V
BATL
steps. Default value = –75 V.
Register 75. Low Battery Voltage
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VBATL[5:0]
R/W
Reset settings = 0001_0000
Bit
7:6
5:0
Name
Function
Reserved
VBATL[5:0]
Read returns zero.
Low Battery Voltage.
The value written to this register sets low battery voltage. V
must be greater than or
BATH
equal to V
. The value may be set between 0 V (0x00) and –94.5 V (0x3F) in 1.5 V
BATL
steps. Default value = –24 V.
Rev. 1.0
89
Si3216
Register 76. Power Monitor Pointer
Bit
D7
D6
D5
D4
D3
D2
D1
PWRMP[2:0]
R/W
D0
Name
Type
Reset settings = 0000_0000
Bit
7:3
2:0
Name
Function
Reserved
Read returns zero.
PWRMP[2:0] Power Monitor Pointer.
Selects the external transistor from which to read power output. The power of the
selected transistor is read in the PWROM register.
000 = Q1
001 = Q2
010 = Q3
011 = Q4
100 = Q5
101 = Q6
110 = Undefined
111 = Undefined
Register 77. Line Power Output Monitor
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
PWROM[7:0]
R
Reset settings = 0000_0000
Bit
Name
PWROM[7:0] Line Power Output Monitor.
Function
7:0
This register reports the real time power output of the transistor selected using PWRMP.
The range is 0 W (0x00) to 7.8 W (0xFF) in 30.4 mW steps for Q1, Q2, Q5, and Q6.
The range is 0 W (0x00) to 0.9 W (0xFF) in 3.62 mW steps for Q3 and Q4.
90
Rev. 1.0
Si3216
Register 78. Loop Voltage Sense
Bit
D7
D6
LVSP
R
D5
D4
D3
D2
D1
D0
Name
Type
LVS[5:0]
R
Reset settings = 0000_0000
Bit
7
Name
Reserved
LVSP
Function
Read returns zero.
6
Loop Voltage Sense Polarity.
This register reports the polarity of the differential loop voltage (V
– V
).
TIP
RING
0 = Positive loop voltage (V
> V
).
RING
TIP
1 = Negative loop voltage (V
< V
).
RING
TIP
5:0
LVS[5:0]
Loop Voltage Sense Magnitude.
This register reports the magnitude of the differential loop voltage (V – V
). The
TIP
RING
range is 0 V to 94.5 V in 1.5 V steps.
Register 79. Loop Current Sense
Bit
D7
D6
LCSP
R
D5
D4
D3
D2
D1
D0
Name
Type
LCS[5:0]
R
Reset settings = 0000_0000
Bit
7
Name
Reserved
LCSP
Function
Read returns zero.
6
Loop Current Sense Polarity.
This register reports the polarity of the loop current.
0 = Positive loop current (forward direction).
1 = Negative loop current (reverse direction).
5:0
LCS[5:0]
Loop Current Sense Magnitude.
This register reports the magnitude of the loop current. The range is 0 mA to 78.75 mA in
1.25 mA steps.
Rev. 1.0
91
Si3216
Register 80. TIP Voltage Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VTIP[7:0]
R
Reset settings = 0000_0000
Bit
Name
Function
7:0
VTIP[7:0]
TIP Voltage Sense.
This register reports the real time voltage at TIP with respect to ground. The range is 0 V
(0x00) to –95.88 V (0xFF) in. 376 V steps.
Register 81. RING Voltage Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VRING[7:0]
R
Reset settings = 0000_0000
Bit
Name
Function
7:0
VRING[7:0]
RING Voltage Sense.
This register reports the real time voltage at RING with respect to ground. The range is
0 V (0x00) to –95.88 V (0xFF) in .376 V steps.
Register 82. Battery Voltage Sense 1
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VBATS1[7:0]
R
Reset settings = 0000_0000
Bit
Name
VBATS1[7:0] Battery Voltage Sense 1.
Function
7:0
This register is one of two registers that reports the real time voltage at V
to ground. The range is 0 V (0x00) to –95.88 V (0xFF) in .376 V steps.
with respect
BAT
92
Rev. 1.0
Si3216
Register 83. Battery Voltage Sense 2
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
VBATS2[7:0]
R
Reset settings = 0000_0000
Bit
Name
VBATS2[7:0] Battery Voltage Sense 2.
Function
7:0
This register is one of two registers that reports the real time voltage at V
to ground. The range is 0 V (0x00) to –95.88 V (0xFF) in .376 V steps.
with respect
BAT
Register 84. Transistor 1 Current Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IQ1[7:0]
R
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IQ1[7:0]
Transistor 1 Current Sense.
This register reports the real time current through Q1. The range is 0 A (0x00) to
81.35 mA (0xFF) in .319 mA steps. If ETBE = 1, the reported value does not include the
additional ETBO/A current.
Register 85. Transistor 2 Current Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IQ2[7:0]
R
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IQ2[7:0]
Transistor 2 Current Sense.
This register reports the real time current through Q2. The range is 0 A (0x00) to
81.35 mA (0xFF) in .319 mA steps. If ETBE = 1, the reported value does not include the
additional ETBO/A current.
Rev. 1.0
93
Si3216
Register 86. Transistor 3 Current Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IQ3[7:0]
R
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IQ3[7:0]
Transistor 3 Current Sense.
This register reports the real time current through Q3. The range is 0 A (0x00) to
9.59 mA (0xFF) in 37.6 µA steps.
Register 87. Transistor 4 Current Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IQ4[7:0]
R
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IQ4[7:0]
Transistor 4 Current Sense.
This register reports the real time current through Q4. The range is 0 A (0x00) to
9.59 mA (0xFF) in 37.6 µA steps.
Register 88. Transistor 5 Current Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IQ5[7:0]
R
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IQ5[7:0]
Transistor 5 Current Sense.
This register reports the real time current through Q5. The range is 0 A (0x00) to
80.58 mA (0xFF) in .316 mA steps.
94
Rev. 1.0
Si3216
Register 89. Transistor 6 Current Sense
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
IQ6[7:0]
R
Reset settings = xxxx_xxxx
Bit
Name
Function
7:0
IQ6[7:0]
Transistor 6 Current Sense.
This register reports the real time current through Q6. The range is 0 A (0x00) to
80.58 mA (0xFF) in .316 mA steps.
Register 92. DC-DC Converter PWM Period
Bit
Name DCN[7]
Type R/W
D7
D6
1
D5
D4
D3
D2
D1
D0
DCN[5:0]
R
R/W
Reset settings = 1111_1111
Bit
Name
Function
7:0
DCN[7:0]
DC-DC Converter Period.
This register sets the PWM period for the dc-dc converter. The range is 3.906 µs (0x40)
to 15.564 µs (0xFF) in 61.035 ns steps.
Bit 6 is fixed to one and read-only, so there are two ranges of operation:
3.906–7.751 µs, used for MOSFET transistor switching (Si3216M).
11.719–15.564 µs, used for BJT transistor switching (Si3216).
Rev. 1.0
95
Si3216
Register 93. DC-DC Converter Switching Delay
Bit
Name DCCAL
Type R/W
D7
D6
D5
DCPOL
R
D4
D3
D2
DCTOF[4:0]
R/W
D1
D0
Reset settings = 0001_0100 (Si3216)
Reset settings = 0011_0100 (Si3216M)
Bit
Name
Function
7
DCCAL
DC-DC Converter Peak Current Monitor Calibration Status.
Writing a one to this bit starts the dc-dc converter peak current monitor calibration rou-
tine.
0 = Normal operation.
1 = Calibration being performed.
6
5
Reserved
DCPOL
Read returns zero.
DC-DC Converter Feed Forward Pin (DCFF) Polarity.
This read-only register bit indicates the polarity relationship of the DCFF pin to the
DCDRV pin. Two versions of the Si3216 are offered to support the two relationships.
0 = DCFF pin polarity is opposite of DCDRV pin (Si3216).
1 = DCFF pin polarity is same as DCDRV pin (Si3216M).
4:0
DCTOF[4:0]
DC-DC Converter Minimum Off Time.
This register sets the minimum off time for the pulse width modulated dc-dc
converter control. T
= (DCTOF + 4)x61.035 ns.
OFF
Register 94. DC-DC Converter PWM Pulse Width
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
DCPW[7:0]
R
Reset settings = 0000_0000
Bit
Name
Function
7:0
DCPW[7:0]
DC-DC Converter Pulse Width.
Pulse width of DCDRV is given by PW = (DCPW – DCTOF – 4) x 61.035 ns.
96
Rev. 1.0
Si3216
Register 96. Calibration Control/Status Register 1
Bit
D7
D6
D5
CALSP
R/W
D4
D3
D2
D1
D0
Name
Type
CAL
R/W
CALR
R/W
CALT
R/W
CALD
R/W
CALC
R/W
CALIL
R/W
Reset settings = 0001_1111
Bit
7
Name
Reserved
CAL
Function
Read returns zero.
6
Calibration Control/Status Bit.
Setting this bit begins calibration of the entire system.
0 = Normal operation or calibration complete.
1 = Calibration in progress.
5
4
3
CALSP
CALR
CALT
Calibration Speedup.
Setting this bit shortens the time allotted for V
calibration cycle.
0 = 300 ms
1 = 30 ms
settling at the beginning of the
BAT
RING Gain Mismatch Calibration.
For use with discrete solution only. When using the Si3201, consult “AN35: Si321x
User’s Quick Reference Guide” and follow the instructions for manual calibration.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
TIP Gain Mismatch Calibration.
For use with discrete solution only. When using the Si3201, consult “AN35: Si321x
User’s Quick Reference Guide” and follow the instructions for manual calibration.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
2
1
0
CALD
CALC
CALIL
Differential DAC Gain Calibration.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
Common Mode DAC Gain Calibration.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
I
Calibration.
LIM
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
Rev. 1.0
97
Si3216
Register 97. Calibration Control/Status Register 2
Bit
D7
D6
D5
D4
CALM1
R/W
D3
D2
D1
D0
Name
Type
CALM2 CALDAC CALADC
R/W
R/W
R/W
Reset settings = 0001_1110
Bit
7:5
4
Name
Reserved
CALM1
Function
Read returns zero.
Monitor ADC Calibration 1.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
3
2
CALM2
Monitor ADC Calibration 2.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
CALDAC
DAC Calibration.
Setting this bit begins calibration of the audio DAC offset.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
1
0
CALADC
Reserved
ADC Calibration.
Setting this bit begins calibration of the audio ADC offset.
0 = Normal operation or calibration complete.
1 = Calibration enabled or in progress.
Read returns zero.
98
Rev. 1.0
Si3216
Register 98. RING Gain Mismatch Calibration Result
Bit
D7
D6
D5
D4
D3
D2
CALGMR[4:0]
R/W
D1
D1
D1
D0
D0
D0
Name
Type
Reset settings = 0001_0000
Bit
7:5
4:0
Name
Function
Reserved
Read returns zero.
CALGMR[4:0] Gain Mismatch of IE Tracking Loop for RING Current.
Register 99. TIP Gain Mismatch Calibration Result
Bit
D7
D6
D5
D4
D3
D2
CALGMT[4:0]
R/W
Name
Type
Reset settings = 0001_0000
Bit
7:5
4:0
Name
Function
Reserved
Read returns zero.
CALGMT[4:0] Gain Mismatch of IE Tracking Loop for TIP Current.
Register 100. Differential Loop Current Gain Calibration Result
Bit
D7
D6
D5
D4
D3
D2
CALGD[4:0]
R/W
Name
Type
Reset settings = 0001_0001
Bit
7:5
4:0
Name
Function
Reserved
CALGD[4:0]
Read returns zero.
Differential DAC Gain Calibration Result.
Rev. 1.0
99
Si3216
Register 101. Common Mode Loop Current Gain Calibration Result
Bit
D7
D6
D5
D4
D3
D2
CALGC[4:0]
R/W
D1
D0
D0
D0
Name
Type
Reset settings = 0001_0001
Bit
7:5
4:0
Name
Function
Reserved
CALGC[4:0]
Read returns zero.
Common Mode DAC Gain Calibration Result.
Register 102. Current Limit Calibration Result
Bit
D7
D6
D5
D4
D3
D2
CALGIL[3:0]
R/W
D1
Name
Type
Reset settings = 0000_1000
Bit
7:4
3:0
Name
Function
Reserved
CALGIL[3:0]
Read returns zero.
Current Limit Calibration Result.
Register 103. Monitor ADC Offset Calibration Result
Bit
D7
D6
D5
D4
D3
D2
D1
Name
Type
CALMG1[3:0]
R/W
CALMG2[3:0]
R/W
Reset settings = 1000_1000
Bit
7:4
3:0
Name
Function
CALMG1[3:0] Monitor ADC Offset Calibration Result 1.
CALMG2[3:0] Monitor ADC Offset Calibration Result 2.
100
Rev. 1.0
Si3216
Register 104. Analog DAC/ADC Offset
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
DACP
R/W
DACN
R/W
ADCP
R/W
ADCN
R/W
Reset settings = 0000_0000
Bit
7:4
3
Name
Reserved
DACP
Function
Read returns zero.
Positive Analog DAC Offset.
Negative Analog DAC Offset.
Positive Analog ADC Offset.
Negative Analog ADC Offset.
2
DACN
1
ADCP
0
ADCN
Register 105. DAC Offset Calibration Result
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
DACOF[7:0]
R/W
Reset settings = 0000_0000
Bit
Name
Function
7:0
DACOF[7:0]
DAC Offset Calibration Result.
Register 107. DC Peak Current Monitor Calibration Result
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
Type
CMDCPK[3:0]
R/W
Reset settings = 0000_1000
Bit
7:4
3:0
Name
Function
Reserved
Read returns zero.
CMDCPK[3:0] DC Peak Current Monitor Calibration Result.
Rev. 1.0
101
Si3216
Register 108. Enhancement Enable
Bit
Name ILIMEN
Type R/W
D7
D6
FSKEN
R/W
D5
D4
D3
D2
D1
D0
HYSTEN
R/W
DCSU
R/W
LCVE
R/W
DCFIL
R/W
Reset settings = 0000_0000
Bit
Name
Function
7
ILIMEN
Current Limit Increase.
When enabled, this bit temporarily increases the maximum differential current limit at the
end of a ring burst to enable a faster settling time to a dc linefeed state.
0 = The value programmed in ILIM (direct Register 71) is used.
1 = The maximum differential loop current limit is temporarily increased to 41 mA.
6
FSKEN
FSK Generation Enhancement.
When enabled, this bit will increase the clocking rate of tone generator 1 to 24 kHz only
when the REL bit (direct Register 32, bit 6) is set. Also, dedicated oscillator registers are
used for FSK generation (indirect registers 99–104). Audio tones are generated using
this new higher frequency, and oscillator 1 active and inactive timers have a finer bit res-
olution of 41.67 µs. This provides greater resolution during FSK caller ID signal genera-
tion.
0 = Tone generator always clocked at 8 kHz; OSC1, OSC1X., and OSC1Y are always
used.
1 = Tone generator module clocked at 24 kHz and dedicated FSK registers used only
when REL = 1; otherwise clocked at 8 kHz.
5
DCSU
DC-DC Converter Control Speedup.
When enabled, this bit invokes a multi-threshold error control algorithm which allows the
dc-dc converter to adjust more quickly to voltage changes.
0 = Normal control algorithm used.
1 = Multi-threshold error control algorithm used.
4
3
2
Reserved
Reserved
LCVE
Write has no effect.
Read returns zero.
Voltage-Based Loop Closure.
Enables loop closure to be determined by the TIP-to-RING voltage rather than loop cur-
rent.
0 = Loop closure determined by loop current.
1 = Loop closure determined by TIP-to-RING voltage.
102
Rev. 1.0
Si3216
Bit
Name
Function
1
DCFIL
DC-DC Converter Squelch.
When enabled, this bit squelches noise in the audio band from the dc-dc converter con-
trol loop.
0 = Voice band squelch disabled.
1 = Voice band squelch enabled.
0
HYSTEN
Loop Closure Hysteresis Enable.
When enabled, this bit allows hysteresis to the loop closure calculation. The upper and
lower hysteresis thresholds are defined by Indirect Registers 28 and 43, respectively.
0 = Loop closure hysteresis disabled.
1 = Loop closure hysteresis enabled.
Rev. 1.0
103
Si3216
4. Indirect Registers
Indirect registers are not directly mapped into memory but are accessible through the IDA and IAA registers. A
write to IDA followed by a write to IAA is interpreted as a write request to an indirect register. In this case, the
contents of IDA are written to indirect memory at the location referenced by IAA at the next indirect register update.
A write to IAA without first writing to IDA is interpreted as a read request from an indirect register. In this case, the
value located at IAA is written to IDA at the next indirect register update. Indirect registers are updated at a rate of
16 kHz. For pending indirect register transfers, IAS (direct Register 31) will be one until serviced. In addition, an
interrupt, IND (Register 20), can be generated upon completion of the indirect transfer.
The indirect memory map is different from what is described in the data sheet. The indirect memory map is as
follows:
Table 35. Si3210 to Si3216 Indirect Register Cross Reference
Si3210
Indirect
Register
Si3216
Indirect
Register
Indirect
Register
Si3210
Indirect
Register
Si3216
Indirect
Register
Indirect
Register
Name
Si3210
Indirect
Register
Si3216
Indirect
Register
Indirect
Register
Name
Name
OSC1
OSC1X
OSC1Y
OSC2
OSC2X
OSC2Y
ROFF
RCO
13
14
15
16
17
18
19
20
21
22
26
0
1
27
28
29
30
31
32
33
34
35
36
37
14
15
16
17
18
19
20
21
22
23
24
ADCG
LCRT
RPTP
CML
38
39
25
26
27
64
66
69
70
71
72
73
74
NQ34
NQ56
2
40
VCMR
VMIND
LCRTL
FSK0X
FSK0
3
41
4
CMH
43
5
PPT12
PPT34
PPT56
NCLR
NRTP
NQ12
99
6
100
101
102
103
104
7
FSK1X
FSK1
8
RNGX
RNGY
DACG
9
FSK01
FSK10
13
4.1. Oscillators
See functional description sections of tone generation, ringing, and pulse metering for guidelines on computing
register values. All values are represented in 2s-complement format.
Note: The values of all indirect registers are undefined following the reset state. Shaded areas denote bits that can be read
and written but should be written to zeroes.
Table 36. Oscillator Indirect Registers Summary
Addr. D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
1
2
3
4
5
OSC1[15:0]
OSC1X[15:0]
OSC1Y[15:0]
OSC2[15:0]
OSC2X[15:0]
OSC2Y[15:0]
6
ROFF[5:0]
104
Rev. 1.0
Si3216
Table 36. Oscillator Indirect Registers Summary (Continued)
Addr. D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
7
8
9
RCO[15:0]
RNGX[15:0]
RNGY[15:0]
Table 37. Oscillator Indirect Registers Description
Description
Addr.
Reference
Page
0
Oscillator 1 Frequency Coefficient.
37
37
37
37
37
37
39
Sets tone generator 1 frequency.
1
2
3
4
5
6
Oscillator 1 Amplitude Register.
Sets tone generator 1 signal amplitude.
Oscillator 1 Initial Phase Register.
Sets initial phase of tone generator 1 signal.
Oscillator 2 Frequency Coefficient.
Sets tone generator 2 frequency.
Oscillator 2 Amplitude Register.
Sets tone generator 2 signal amplitude.
Oscillator 2 Initial Phase Register.
Sets initial phase of tone generator 2 signal.
Ringing Oscillator DC Offset.
Sets dc offset component (V –V
) to ringing waveform. The range is 0 to 94.5 V in
RING
TIP
1.5 V increments.
7
8
9
Ringing Oscillator Frequency Coefficient.
39
39
39
Sets ringing generator frequency.
Ringing Oscillator Amplitude Register.
Sets ringing generator signal amplitude.
Ringing Oscillator Initial Phase Register.
Sets initial phase of ringing generator signal.
4.2. Digital Programmable Gain/Attenuation
See functional description sections of digital programmable gain/attenuation for guidelines on computing register
values. All values are represented in 2s-complement format.
Note: The values of all indirect registers are undefined following the reset state. Shaded areas denote bits that can be read
and written but should be written to zeros.
Table 38. Digital Programmable Gain/Attenuation Indirect Registers Summary
Addr. D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
13
14
DACG[11:0]
ADCG[11:0]
Rev. 1.0
105
Si3216
Table 39. Digital Programmable Gain/Attenuation Indirect Registers Description
Addr.
Description
Reference
Page
13 Receive Path Digital to Analog Converter Gain/Attenuation.
43
This register sets gain/attenuation for the receive path. The digitized signal is effectively mul-
tiplied by DACG to achieve gain/attenuation. A value of 0x00 corresponds to – dB gain
(mute). A value of 0x400 corresponds to unity gain. A value of 0x7FF corresponds to a gain
of 6 dB.
14 Transmit Path Analog to Digital Converter Gain/Attenuation.
43
This register sets gain/attenuation for the transmit path. The digitized signal is effectively
multiplied by ADCG to achieve gain/attenuation. A value of 0x00 corresponds to – dB gain
(mute). A value of 0x400 corresponds to unity gain. A value of 0x7FF corresponds to a gain
of 6 dB.
106
Rev. 1.0
Si3216
4.3. SLIC Control
See descriptions of linefeed interface and power monitoring for guidelines on computing register values. All values
are represented in 2s-complement format.
Note: The values of all indirect registers are undefined following the reset state. Shaded areas denote bits that can be read
and written but should be written to zeroes.
Table 40. SLIC Control Indirect Registers Summary
Addr. D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
15
16
17
18
19
20
21
22
23
24
25
26
27
LCRT[5:0]
RPTP[5:0]
CML[5:0]
CMH[5:0]
PPT12[7:0]
PPT34[7:0]
PPT56[7:0]
NCLR[12:0]
NRTP[12:0]
NQ12[12:0]
NQ34[12:0]
NQ56[12:0]
VCMR[3:0]
64
66
VMIND[3:0]
LCRTL[5:0]
Table 41. SLIC Control Indirect Registers Description
Description
Addr.
Reference Page
15 Loop Closure Threshold.
32
Loop closure detection threshold. This register defines the upper bounds threshold if hys-
teresis is enabled (direct Register 108, bit 0). The range is 0–80 mA in 1.27 mA steps.
16 Ring Trip Threshold.
42
Ring trip detection threshold during ringing.
17 Common Mode Minimum Threshold for Speed-Up.
This register defines the negative common mode voltage threshold. Exceeding this
threshold enables a wider bandwidth of dc linefeed control for faster settling times. The
range is 0–23.625 V in 0.375 V steps.
18 Common Mode Maximum Threshold for Speed-Up.
This register defines the positive common mode voltage threshold. Exceeding this
threshold enables a wider bandwidth of dc linefeed control for faster settling times. The
range is 0–23.625 V in 0.375 V steps.
Rev. 1.0
107
Si3216
Table 41. SLIC Control Indirect Registers Description (Continued)
Description
Addr.
Reference Page
19 Power Alarm Threshold for Transistors Q1 and Q2.
20 Power Alarm Threshold for Transistors Q3 and Q4.
21 Power Alarm Threshold for Transistors Q5 and Q6.
22 Loop Closure Filter Coefficient.
30
30
30
32
42
30
30
30
23 Ring Trip Filter Coefficient.
24 Thermal Low Pass Filter Pole for Transistors Q1 and Q2.
25 Thermal Low Pass Filter Pole for Transistors Q3 and Q4.
26 Thermal Low Pass Filter Pole for Transistors Q5 and Q6.
27 Common Mode Bias Adjust During Ringing.
39
Recommended value of 0 decimal.
DC-DC Converter V Voltage.
33
OV
This register sets the overhead voltage, V , to be supplied by the dc-dc converter.
OV
64
66
When the VOV bit = 0 (direct Register 66, bit 4), V should be set between 0 and 9 V
OV
(VMIND = 0 to 6h). When the VOV bit = 1, V should be set between 0 and 13.5 V
OV
(VMIND = 0 to 9h).
Loop Closure Threshold—Lower Bound.
This register defines the lower threshold for loop closure hysteresis, which is enabled in
bit 0 of direct Register 108. The range is 0–80 mA in 1.27 mA steps.
32
108
Rev. 1.0
Si3216
4.4. FSK Control
For detailed instructions on FSK signal generation, refer to “Application Note 32: FSK Generation” (AN32). These
registers support enhanced FSK generation mode, which is enabled by setting FSKEN = 1 (direct Register 108,
bit 6) and REL = 1 (direct Register 32, bit 6).
Table 42. FSK Control Indirect Registers Summary
Addr. D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
69
70
71
72
73
74
FSK0X[15:0]
FSK0[15:0]
FSK1X[15:0]
FSK1[15:0]
FSK01[15:0]
FSK10[15:0]
Table 43. FSK Control Indirect Registers Description
Description
Addr.
Reference Page
FSK Amplitude Coefficient for Space.
69
39 and AN32
When FSKEN = 1 and REL = 1, this register sets the amplitude to be used when gener-
ating a space or 0. When the active timer (OAT1) expires, the value of this register is
loaded into oscillator 1 instead of OSC1X.
FSK Frequency Coefficient for Space.
70
71
72
39 and AN32
39 and AN32
39 and AN32
When FSKEN = 1 and REL = 1, this register sets the frequency to be used when gener-
ating a space or 0. When the active timer (OAT1) expires, the value of this register is
loaded into oscillator 1 instead of OSC1.
FSK Amplitude Coefficient for Mark.
When FSKEN = 1 and REL = 1, this register sets the amplitude to be used when gener-
ating a mark or 1. When the active timer (OAT1) expires, the value of this register is
loaded into oscillator 1 instead of OSC1X.
FSK Frequency Coefficient for Mark.
When FSKEN = 1 and REL = 1, this register sets the frequency to be used when gener-
ating a mark or 1. When the active timer (OAT1) expires, the value of this register is
loaded into oscillator 1 instead of OSC1.
FSK Transition Parameter from 0 to 1.
73
74
39 and AN32
39 and AN32
When FSKEN = 1 and REL = 1, this register defines a gain correction factor that is
applied to signal amplitude when transitioning from a space (0) to a mark (1).
FSK Transition Parameter from 1 to 0.
When FSKEN = 1 and REL = 1, this register defines a gain correction factor that is
applied to signal amplitude when transitioning from a mark (1) to a space (0).
Rev. 1.0
109
Si3216
5. Pin Descriptions: Si3216
QFN
TSSOP
38
37
1
2
CS
INT
SCLK
SDI
PCLK
DRX
DTX
FSYNC
RESET
SDCH
SDCL
VDDA1
IREF
CAPP
QGND
CAPM
36 SDO
3
4
5
6
7
8
9
10
11
12
13
14
38 37 36 35 34 33 32
1
2
3
4
DTX
FSYNC
RESET
SDCH
SDCL
VDDA1
IREF
CAPP
QGND
CAPM
STIPDC
31 SDITHRU
35
34
33
32
31
30
SDITHRU
DCDRV
DCFF
TEST
GNDD
VDDD
30
DCDRV
29
DCFF
28
27
26
25
24
23
22
21
20
TEST
GNDD
VDDD
ITIPN
ITIPP
VDDA2
IRINGP
IRINGN
IGMP
5
6
7
29 ITIPN
8
28
27
ITIPP
VDDA2
9
10
11
26 IRINGP
25
24
23
22
21
20
IRINGN
IGMP
GNDA
IGMN
SRINGAC
STIPAC
SRINGDC 12
13 14 15 16 17 18 19
STIPDC 15
SRINGDC 16
STIPE
SVBAT 18
SRINGE
17
19
Pin #
QFN TSSOP
Pin #
Name
Description
35
1
CS
Chip Select.
Active low. When inactive, SCLK and SDI are ignored and SDO is high-impedance.
When active, the serial port is operational.
36
37
38
1
2
3
4
5
6
INT
PCLK
DRX
DTX
Interrupt.
Maskable interrupt output. Open drain output for wire-ORed operation.
PCM Bus Clock.
Clock input for PCM bus timing.
Receive PCM Data.
Input data from PCM bus.
Transmit PCM Data.
Output data to PCM bus.
2
FSYNC Frame Synch.
8 kHz frame synchronization signal for the PCM bus. May be short or long pulse for-
mat.
3
4
7
8
RESET Reset.
Active low input. Hardware reset used to place all control registers in the default
state.
SDCH
DC Monitor.
DC-DC converter monitor input used to detect overcurrent situations in the con-
verter.
110
Rev. 1.0
Si3216
Pin #
QFN TSSOP
Pin #
Name
Description
5
9
SDCL
DC Monitor.
DC-DC converter monitor input used to detect overcurrent situations in the con-
verter.
6
7
8
10
11
12
VDDA1 Analog Supply Voltage.
Analog power supply for internal analog circuitry.
Current Reference.
IREF
Connects to an external resistor used to provide a high accuracy reference current.
CAPP
SLIC Stabilization Capacitor.
Capacitor used in low pass filter to stabilize SLIC feedback loops.
9
13
14
QGND Component Reference Ground.
10
CAPM SLIC Stabilization Capacitor.
Capacitor used in low pass filter to stabilize SLIC feedback loops.
11
12
13
14
15
16
17
18
19
20
21
22
23
15
16
17
18
19
20
21
22
23
24
25
26
27
STIPDC TIP Sense.
Analog current input used to sense voltage on the TIP lead.
SRINGDC RING Sense.
Analog current input used to sense voltage on the RING lead.
STIPE TIP Emitter Sense.
Analog current input used to sense voltage on the Q6 emitter lead.
SVBAT VBAT Sense.
Analog current input used to sense voltage on dc-dc converter output voltage lead.
SRINGE RING Emitter Sense.
Analog current input used to sense voltage on the Q5 emitter lead.
STIPAC TIP Transmit Input.
Analog ac input used to detect voltage on the TIP lead.
SRINGAC RING Transmit Input.
Analog ac input used to detect voltage on the RING lead.
IGMN
Transconductance Amplifier External Resistor.
Negative connection for transconductance gain setting resistor.
GNDA Analog Ground.
Ground connection for internal analog circuitry.
IGMP
Transconductance Amplifier External Resistor.
Positive connection for transconductance gain setting resistor.
IRINGN Negative Ring Current Control.
Analog current output driving Q3.
IRINGP Positive Ring Current Control.
Analog current output driving Q2.
VDDA2 Analog Supply Voltage.
Analog power supply for internal analog circuitry.
Rev. 1.0
111
Si3216
Pin #
QFN TSSOP
Pin #
Name
Description
24
25
26
27
28
28
29
30
31
32
ITIPP
Positive TIP Current Control.
Analog current output driving Q1.
ITIPN
Negative TIP Current Control.
Analog current output driving Q4.
VDDD
Digital Supply Voltage.
Digital power supply for internal digital circuitry.
GNDD Digital Ground.
Ground connection for internal digital circuitry.
Test.
TEST
Enables test modes for Silicon Labs internal testing. This pin should always be tied
to ground for normal operation.
29
33
DCFF
DC Feed-Forward/High Current General Purpose Output.
Feed-forward drive of external bipolar transistors to improve dc-dc converter
efficiency.
30
31
32
33
34
34
35
36
37
38
DCDRV DC Drive/Battery Switch.
DC-DC converter control signal output which drives external bipolar transistor.
SDITHRU SDI Passthrough.
Cascaded SDI output signal for daisy-chain mode.
Serial Port Data Out.
SDO
SDI
Serial port control data output.
Serial Port Data In.
Serial port control data input.
SCLK
Serial Port Bit Clock Input.
Serial port clock input. Controls the serial data on SDO and latches the data on SDI.
112
Rev. 1.0
Si3216
6. Pin Descriptions: Si3201
TIP
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ITIPP
ITIPN
IRINGP
IRINGN
NC
RING
VBAT
VBATH
NC
STIPE
SRINGE
NC
GND
VDD
Pin #
Name
Input/
Description
Output
1
TIP
NC
I/O
I/O
TIP Output—Connect to the TIP lead of the subscriber loop.
2, 6, 9, 12
No Internal Connection—Do not connect to any electrical signal.
RING Output—Connect to the RING lead of the subscriber loop.
Operating Battery Voltage—Connect to the battery supply.
High Battery Voltage—This pin is internally connected to VBAT.
Ground—Connect to a low impedance ground plane.
3
4
5
7
8
RING
VBAT
VBATH
GND
VDD
Supply Voltage—Main power supply for all internal circuitry. Connect to a
3.3 V or 5 V supply. Decouple locally with a 0.1 F/6 V capacitor.
10
SRINGE
O
RING Emitter Sense Output—Connect to the SRINGE pin of the Si321x
pin.
11
13
STIPE
O
I
TIP Emitter Sense Output—Connect to the STIPE pin of the Si321x pin.
IRINGN
Negative RING Current Control—Connect to the IRINGN lead of the
Si321x.
14
15
16
IRINGP
ITIPN
I
I
I
Positive RING Current Drive—Connect to the IRINGP lead of the Si321x.
Negative TIP Current Control—Connect to the ITIPN lead of the Si321x.
Positive TIP Current Control—Connect to the ITIPP lead of the Si321x.
Exposed Thermal Pad—Connect to the bulk ground plane.
ITIPP
Bottom-Side
Exposed Pad
Rev. 1.0
113
Si3216
7. Ordering Guides
Table 44. Device Ordering Guide
Package
Device
Description Wideband DCFF Pin
Lead-Free and
Temperature
Codec
Output
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
DCDRV
N/A
RoHS-Compliant
Si3216-C-FM
Si3216-C-GM
Si3216M-C-FM
Si3216M-C-GM
Si3216-KT
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
ProSLIC
QFN-38
QFN-38
Yes
Yes
Yes
Yes
No
0 to 70 °C
–40 to 85 °C
0 to 70 °C
QFN-38
QFN-38
–40 to 85 °C
0 to 70 °C
TSSOP-38
TSSOP-38
TSSOP-38
TSSOP-38
TSSOP-38
TSSOP-38
TSSOP-38
TSSOP-38
SOIC-16
Si3216-BT
No
–40 to 85 °C
0 to 70 °C
Si3216-FT
Yes
Yes
No
Si3216-GT
–40 to 85 °C
0 to 70 °C
Si3216M-KT
Si3216M-BT
Si3216M-FT
Si3216M-GT
Si3201-KS
No
–40 to 85 °C
0 to 70 °C
Yes
Yes
No
–40 to 85 °C
0 to 70 °C
Linefeed
Interface
Si3201-BS
Si3201-FS
Si3201-GS
Linefeed
Interface
N/A
N/A
N/A
SOIC-16
SOIC-16
SOIC-16
No
Yes
Yes
–40 to 85 °C
0 to 70 °C
Linefeed
Interface
Linefeed
Interface
–40 to 85 °C
Note: Add an “R” at the end of the device to denote tape and reel option; 2500 quantity per reel.
114
Rev. 1.0
Si3216
Table 45. Evaluation Kit Ordering Guide
Item
Supported
ProSLIC
Description
Linefeed
Interface
Discrete
Si3201
Si3216PPQX-EVB
Si3216PPQ1-EVB
Si3216DCQX-EVB
Si3216DCQ1-EVB
Si3216MPPQX-EVB
Si3216MPPQ1-EVB
Si3216MDCQ1-EVB
Si3216MDCQX-EVB
Si3216PPTX-EVB
Si3216PPT1-EVB
Si3216DCX-EVB
Si3216-QFN
Si3216-QFN
Eval Board, Daughter Card
Eval Board, Daughter Card
Daughter Card Only
Si3216-QFN
Discrete
Si3201
Si3216-QFN
Daughter Card Only
Si3216M-QFN
Si3216M-QFN
Si3216M-QFN
Si3216M-QFN
Si3216-TSSOP
Si3216-TSSOP
Si3216-TSSOP
Si3216-TSSOP
Eval Board, Daughter Card
Eval Board, Daughter Card
Daughter Card Only
Discrete
Si3201
Si3201
Daughter Card Only
Discrete
Discrete
Si3201
Eval Board, Daughter Card
Eval Board, Daughter Card
Daughter Card Only
Discrete
Si3201
Si3216DC1-EVB
Daughter Card Only
Rev. 1.0
115
Si3216
8. Package Outline: 38-Pin QFN
Figure 30 illustrates the package details for the Si321x. Table 46 lists the values for the dimensions shown in the
illustration.
Figure 30. 38-Pin Quad Flat No-Lead Package (QFN)
Table 46. Package Diagram Dimensions1,2,3
Millimeters
Symbol
Min
0.75
0.00
0.18
Nom
0.85
Max
0.95
0.05
0.30
A
A1
b
0.01
0.23
D
5.00 BSC.
3.20
D2
e
3.10
3.30
0.50 BSC.
7.00 BSC.
5.20
E
E2
L
5.10
0.35
0.03
—
5.30
0.55
0.08
0.10
0.10
0.08
0.10
0.45
L1
0.05
aaa
bbb
ccc
ddd
Notes:
—
—
—
—
—
—
—
1. All dimensions shown are in millimeters (mm) unless
otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1982.
3. Recommended card reflow profile is per the JEDEC/IPC
J-STD-020C specification for Small Body Components.
116
Rev. 1.0
Si3216
9. Package Outline: 38-Pin TSSOP
Figure 31 illustrates the package details for the Si321x. Table 47 lists the values for the dimensions shown in the
illustration.
B
E/2
2x
E1
E
L
C
2x
B A
ddd
e
ccc
A
D
C
aaa
C
A
Seating Plane
b
A1
C
38x
M
bbb
C B A
Approximate device weight is 115.7 mg
Figure 31. 38-Pin Thin Shrink Small Outline Package (TSSOP)
Table 47. Package Diagram Dimensions
Millimeters
Symbol
Min
—
Nom
—
Max
1.20
0.15
0.27
0.20
9.80
A
A1
b
0.05
0.17
0.09
9.60
—
—
c
—
D
9.70
e
E
0.50 BSC
6.40 BSC
4.40
E1
L
4.30
0.45
0°
4.50
0.75
8°
0.60
—
aaa
bbb
ccc
ddd
0.10
0.08
0.05
0.20
Rev. 1.0
117
Si3216
10. Package Outline: 16-Pin ESOIC
Figure 32 illustrates the package details for the Si3201. Table 48 lists the values for the dimensions shown in the
illustration.
16
9
8
x45°
h
E
H
.25 M B M
–B–
1
L
B
Bottom Side
Exposed Pad
2.3 x 3.6 mm
.25 M C A M B S
Detail F
–A–
D
C
A
–C–
See Detail F
A1
e
Seating Plane
Weight: Approximate device weight is 0.15 grams.
Figure 32. 16-Pin Thermal Enhanced Small Outline Integrated Circuit (ESOIC) Package
Table 48. Package Diagram Dimensions
Millimeters
Symbol
Min
1.35
0
Max
1.75
0.15
.51
A
A1
B
C
D
E
e
.33
.19
.25
9.80
3.80
10.00
4.00
1.27 BSC
H
h
5.80
.25
.40
—
6.20
.50
L
1.27
0.10
8º
0º
118
Rev. 1.0
Si3216
11. Silicon Labs Si3216 Support Documentation
AN32: Si321x Frequency Shift Keying (FSK) Modulation
AN33: Si321x Neon Flashing
AN34: Si321x Hardware Reference Guide
AN35: Si321x User’s Quick Reference Guide
AN39: Connecting the ProSLIC to the W & G PCM-4
AN45: Design Guide for the Si321x DC-DC Converter
AN46: Demonstration Software Guide for the Si3210 DC-DC Converter
AN47: Si321x Linefeed Power Monitoring and Protection
Si321xPPT-EVB: Evaluation board data sheet
Note: Refer to www.silabs.com for a current list of support documents for this chipset.
Rev. 1.0
119
Si3216
DOCUMENT CHANGE LIST
Revision 0.61 to Revision 0.9
Separated the Si3216/15 document into two data
sheets.
Added Quad Flat No-Lead (QFN) package.
Removed references to Si3215.
Updated Figure 11 on page 20.
Changed C18, C19 from 1.0 µF to 4.7 µF.
Updated Figure 13 on page 23.
Changed C10 from 22 nF to 0.1 µF.
Updated Table 11 on page 18.
Changed delay time between chip selects, tcs, from 220 ns to
440 ns
Updated Table 41 on page 107.
Changed recommended values for Indirect Register 27 from 6 to
0.
Updated 7."Ordering Guides" on page 114.
Revision 0.9 to Revision 0.91
Figure 12 on page 22.
Added optional components to application schematic to improve
idle channel noise.
Table 14 on page 22.
Added TO-92 transistor suppliers to BOM.
Table 45, “Evaluation Kit Ordering Guide,” on
page 115.
Updated to include Si3216M-QFN daughter card.
Table 48, “Package Diagram Dimensions,” on
page 118.
Changed A1 from 0.10 to 0.15.
7."Ordering Guides" on page 114.
Updated table to include product revision designator.
Rev. C Si3216 Silicon:
Register 14. Powerdown Control 1 on page 64.
Changed Bit 3 from “Monitor ADC Power-Off Control” to “PLL
Free-Run Control”
Revision 0.91 to Revision 1.0
Added chamfered Pin 1 identifier option to Package
Outline: 38-Pin QFN.
Clarified Ordering Guide
Replaced "X" with revision letter "C" in all ordering codes
requiring a revision letter.
Removed Note 2 from Ordering Guide
120
Rev. 1.0
Si3216
NOTES:
Rev. 1.0
121
Si3216
CONTACT INFORMATION
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400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Email: ProSLICinfo@silabs.com
Internet: www.silabs.com
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-
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Silicon Laboratories, Silicon Labs, and ProSLIC are registered trademarks of Silicon Laboratories Inc.
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
122
Rev. 1.0
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