SI4012-C1001ATR_技术文档

Si4012

Si4012 CRYSTAL-LESS FSK/OOK RF TRANSMITTER

Features



Frequency range

27–960 MHz

Output power range

–13 to +10 dBm

Low Power Consumption

OOK



Programmable ramp rate

Crystal-less operation

±150 ppm: 0 to 70° C

±250 ppm: –40 to 85° C

Optional crystal input for

applications requiring tighter

tolerances

14.2 mA @ +10 dBm



Ultra low standby current <10 nA

Integrated voltage regulator

255 byte FIFO

Low battery detector

SMBus Interface

–40 to +85 °C temperature range

10-Pin MSOP Package,

RoHs compliant

FSK

19.8 mA @ +10 dBm

Ordering Information:



Data rate:

Up to 100 kbaud FSK

Up to 50 kbaud OOK

FSK and OOK modulation

Power supply = 1.8 to 3.6 V

Automatic antenna tuning

See page 43.



Pin Assignments

Si4012



Low BOM

Applications

XTAL

GND

TXM

TXP

1

2

3

4

5

10 SDA

9

8

7

6

SCL

SDN

nIRQ

LED



Wireless MBus T1-mode

Remote control

Home security & alarm

Personal data logging

Toy control



Remote meter reading

Remote keyless entry

Home automation

Industrial control

Sensor networks

Health monitors



Si4012

VDD

Wireless PC peripherals

Description

Patents pending

Silicon Laboratories’ Si4012 is a fully-integrated crystalless CMOS high-data-rate

RF transmitter designed for the sub-GHz ISM band. This chip is optimized for

battery powered applications requiring low standby currents and high output

transmit power.

The device offers advanced radio features including continuous frequency

coverage from 27–960 MHz, adjustable output power of up to +10 dBm, and data

rates up to 100 kbaud in FSK mode. The Si4012’s high level of integration offers

reduced BOM cost while simplifying overall system design.

Functional Block Diagram

Si4012

Digital Logic

Antenna Tune

RF Analog Core

OOK

SMBus

Interface

Host

MCU

TXP

TXM

Auto

Tune

Divider

LPOSC

PA

FSK

Modulator

LCOSC

TX

255 Byte

Data FIFO

LDO

POR

BANDGAP

VDD

GND

VA

VD

Digital

Controller

LED

XTAL

Register

Bank

XTAL

OSC

Battery

Monitor

Rev 1.1 3/13

Si4012

2

Rev 1.1

Si4012

TABLE OF CONTENTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

4. Host MCU Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

4.1. SMBus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

4.2. SMBus Flow Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

4.3. Host Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

4.4. Operating Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

5. Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

5.1. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

5.2. Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

5.3. Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

6. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

9. Land Pattern: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

10. Top Marking: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

Rev 1.1

3

Si4012

1. Electrical Specifications

Table 1. Recommended Operating Conditions¹

Parameter

Supply Voltage

Symbol

Test Condition

Min

Typ

Max

Unit

V

1.8

—

3.6

V

DD

Supply Voltage Slew Rate

mV/

us

2

Initial Battery Insertion

Digital Input Signals

20

—

650

Input Voltage

V

+

DD

–0.3

V

0.3

Notes:

1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are

listed in "1.1. Definition of Test Conditions" on page 7.

2. Recommend bypass capacitor = 1 µF; slew rate measured 1 V < V_DD,< 1.7 V.

Table 2. DC Characteristics*

Parameter

Symbol

Conditions

Min

Typ

Max Units

Power Saving Modes

I

Lowest current mode

—

10

—

nA

µA

Shutdown

Register values retained,

lowest current consumption idle mode

I

—

600

Idle

TX Mode Current @ 10 dBm

I

OOK, Manchester encoded

FSK

—

14.2

19.8

—

mA

TX_OOK

I

TX_FSK

*Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are

listed in "1.1. Definition of Test Conditions" on page 7.

4

Rev 1.1

Si4012

Table 3. Si4012 RF Transmitter Characteristics¹

(TA = 25 °C, VDD = 3.3 V, RL = 550 , unless otherwise noted)

Parameter

Test Condition

Min

Typ

Max

Unit

2

Frequency Range (F

)

27

—

960

—

MHz

RF

3

Frequency Noise (rms)

Allen deviation, measured across

1 ms interval

—

0.3

ppm

Phase Noise @ 915 MHz

10 kHz offset

100 kHz offset

1 MHz offset

—

–70

–100

–105

5

—

dBc/Hz

ms

—

Frequency Tuning Time

—

Carrier Frequency Accuracy

0 °C ≤ T ≤ 70 °C

–150

–250

+150

+250

ppm

A

–40 °C ≤ T ≤ 85 °C

ppm

A

Frequency Error Contribution

with External Crystal

Transmit Power

–10

—

+10

ppm

4

Maximum programmed Tx power,

with optimum differential load, V

> 2.2 V

—

10

—

dBm

DD

Minimum programmed TX power,

with optimum differential load,

—

–13

—

dBm

dB

V

> 2.2 V

DD

Power variation vs temp and supply,

with optimum differential load,

–1.0

–2.5

0.5

V

> 2.2 V

DD

Power variation vs temp and supply,

with optimum differential load,

—

dB

V

> 1.8 V

DD

Transmit power step size

from –13 to 6.5 dBm

—

0.25

—

dB

us

PA Edge Ramp Rate

Programmable Range

Data Rate

OOK mode

0.34

10.7

OOK

0.1

—

50

100

—

kbaud

ppm

FSK

FSK Deviation

Max frequency deviation

Deviation resolution

Deviation accuracy

275

2

—

ppm

±(4 ppm + 2% pk-pk target FSK

deviation in ppm)

ppm

OOK Modulation Depth

60

—

dB

pF

Antenna Tuning Capacitive

Range (Differential)

315 MHz

2.4

—

12.5

Notes:

1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are

listed in "1.1. Definition of Test Conditions" on page 7.

2. The frequency range is continuous over the specified range.

3. The frequency step size is limited by the frequency noise.

4. Optimum differential load is equal to 4 V/(11.5 mA/2 x 4/PI) = 550 Therefore the antenna load resistance in parallel

with the Si4012 differential output resistance should equal 600 

Rev 1.1

5

Si4012

Table 4. Low Battery Detector Characteristics*

(TA = 25° C, VDD = 3.3 V, RL = 550 , unless otherwise noted)

Parameter

Test Condition

Min

Typ

Max

Unit

Battery Voltage Measurement Accuracy

—

2

—

%

*Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are

listed in "1.1. Definition of Test Conditions" on page 7.

Table 5. Optional Crystal Oscillator Characteristics*

(TA = 25° C, VDD = 3.3 V, RL = 600 , unless otherwise noted)

Parameter

Test Condition

Min

10

Typ

—

3

Max

13

Unit

Crystal Frequency Range

Input Capacitance (GPIO0)

MHz

GPIO0 configured as a crystal oscillator;

XO_LOWCAP=1

—

pF



GPIO0 configured as a crystal oscillator;

XO_LOWCAP=0

—

5.5

—

120

80

Crystal ESR

GPIO0 configured as a crystal oscillator;

XO_LOWCAP=1

GPIO0 configured as a crystal oscillator;

XO_LOWCAP=0

—



Start-Up Time

Crystal oscillator only,

60 mH motional arm inductance

—

9

50

ms

*Note: All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are

listed in "1.1. Definition of Test Conditions" on page 7.

Table 6. Thermal Conditions

Parameter

Ambient Temperature

Junction Temperature

Storage Temperature

Symbol

Value

Unit

C

T

–40 to 85

–40 to 90

–55 to 125

A

T

C

OP

T

C

STG

Table 7. Absolute Maximum Ratings^1,2

Parameter

Supply Voltage

Symbol

Value

Unit

V

I

–0.5 to 3.9

10

V

mA

V

DD

3

Input Current

Input Voltage

Notes:

IN

4

V

–0.3 to (V + 0.3)

DD

IN

1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be

restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond recommended

operating conditions for extended periods may affect device reliability.

2. Handling and assembly of these devices should only be done at ESD-protected workstations.

3. All input pins besides V_DD

.

4. For GPIO pins configured as inputs.

6

Rev 1.1

Si4012

1.1. Definition of Test Conditions

Production Test Conditions:

 T = +25 °C.

A

 V

= +3.3 VDC.

DD

 TX output power measured at 100 MHz.

 All RF output levels referred to the pins of the Si4012 (not the RF module).

Qualification Test Conditions:

 T = –40 to +85 °C.

A

 V

= +1.8 to +3.6 VDC.

DD

 All RF output levels referred to the pins of the Si4012 (not the RF module).

Rev 1.1

7

Si4012

2. Typical Application Schematic

See Note 1

Optional

CR2032

Coin Cell

1.8 to 3.6 V

D1

10

X1

See Note 2

C3

1

2

R2

XTAL

GND

TXM

TXP

SDA

SCL

SDN

nIRQ

LED

R1

9

Host MCU

3

4

5

8

7

6

C2

Si4012

VDD

C1

1 µF

Loop Antenna

Notes:

1. The Si4012 has internal 50 k pull-up resistors. Additional optional external pull-up resistors may be added should the

board design required it.

2. See note about how to choose the value of C3 in "5.2.10. PROPERTY: XO_CONFIG" on page 39.

8

Rev 1.1

Si4012

3. Functional Description

Si4012

Digital Logic

RF Analog Core

Antenna Tune

OOK

SMBus

Interface

Host

MCU

TXP

TXM

Auto

Tune

Divider

PA

FSK

Modulator

LCOSC

TX

255 Byte

Data FIFO

LDO

POR

BANDGAP

VDD

GND

VA

VD

LPOSC

Digital

Controller

LED

XTAL

Register

Bank

Battery

Monitor

XTAL

OSC

Figure 1. Si4012 Functional Block Diagram

The Si4012 is a fully-integrated, crystal-less, sub-GHz CMOS RF transmitter offering industry-leading RF

performance, high integration, flexibility, low BOM, small board area, and ease of design.

The device is designed to operate with any host MCU via a serial interface while optimized for battery-powered

applications. The Si4012 operates from voltages ranging from 1.8 to 3.6 V and offers an ultra-low standby current

consumption of less than 10 nA.

The embedded power amplifier can be programmed to supply from –13 dBm up to +10 dBm, while the patented

automatic antenna tuning circuit ensures that the resonant frequency and impedance matching between the PA

output and the connected antenna are configured for optimum transmit efficiency and low harmonic content.

Users may configure the device for either FSK or OOK modulation with supported symbol rates of up to 100 kbps.

To ensure the lowest system cost, the Si4012 can be used without an external crystal or frequency reference by

leveraging Silicon Labs' patented and proven crystal-less oscillator technology. This technology offers better than

±150 ppm carrier frequency stability over the temperature range of 0 to +70 °C and ±250 ppm carrier frequency

stability over the industrial temperature range of –40 to + 85 °C. No production alignments are necessary since all

RF functions are integrated into the device.

Rev 1.1

9

Si4012

4. Host MCU Interface

4.1. SMBus Interface

The SMBus interface is implemented as a bidirectional 2-wire interface (SCL, SDA) with the host configured as

master and the Si4012 configured as slave. Both standard (100 kbps) and fast (400 kbps) modes are supported

with 7-bit addressing. The default device address is 1110000x, where x is the R/W bit.

4.1.1. Design Recommendation

In designs with multiple SMBus devices, it is recommended to use separate SMBus buses where possible since all

attached SMBus devices will wake on bus traffic to confirm address. This process can lead to better battery life

compared to systems with single-bus designs.

4.2. SMBus Flow Control

The SCL and SDA pins are configured as open drain requiring external pull-up resistors. Flow control is

implemented using the open drain configuration as shown below.

Figure 2. WRITE Operation from Master to Slave

The data (SDA) pin never changes when SCL = 1 during bit data transfers. If it changes, it indicates a START or

STOP condition generated by the master/host. After the START condition, a 7-bit address is sent to the

Si4012/slave by the host/master, followed by a single bit determining what is going to drive SDA (i.e., a write or

read operation). For a WRITE operation, the master drives the following SDA bits, and the slave sends ACK/NAK

bits. For a READ operation, the slave drives the data bits, and the master responds with ACK/NACK.

Figure 2 shows a write operation from MASTER to SLAVE. Shortly after the R/W bit is received, the SLAVE device

holds the SCL line low (blue line), thus stalling the master. The master will detect when SCL is released by the

slave and will clock in the ACK/NACK bit from the slave (ACK shown above). By this, the slave (Si4012) can

service each incoming byte and manage flow control to the host.

4.3. Host Interrupts

An nIRQ line from the Si4012 to the host is used to issue interrupts to the host. The host can then read the interrupt

status and clear interrupts from the Si4012 via the SMBus interface.

10

Rev 1.1

Si4012

4.4. Operating Mode Control

NOTE1, 2

TUNE with XO

5

TX_START

NOTE1

Yes

CHANGE_STATE /

Tx_START

No

SHUTDOWN

SDN=1?

1

STANDBY

TX

6

XO in CHIP_CONFIG?

2

SMBus or

SDN

(NOTE 4)

No

CHANGE_STATE

NOTE1, 3

TX_START

TUNE without

SENSOR

3

XO

4

NOTE1

Figure 3. State Machine Diagram

Transition Notes

1. Transition to any state (including SHUTDOWN) using the CHANGE_STATE command. Alternatively, transition to

SHUTDOWN using the SDN pin.

2. If a CHANGE_STATE command to the XO TUNE state is issued (even if already in the XO TUNE state), then an XO

TUNE operation is carried out immediately. This enables close control of timing (fastest execution) for a subsequent

TX_START command. In the TUNE state, a tune operation is carried out in the interval specified in TUNE_INTERVAL.

3. Transition to end state specified in the TX_START command or TX_STOP command.

4. If coming out of the SHUTDOWN via SMBus, an SMBus “wake-up” byte is required. This byte is discarded, and normal

SMBus communication can proceed after the power on reset (ipor) is asserted to the host.

State Descriptions

The Si4012 has six power modes, which are summarized below. Further details on the IC configuration in these

modes can be found in "5.1.5. COMMAND: CHANGE_STATE" on page 22.

 SHUTDOWN—Lowest current consumption; the majority of hardware blocks are powered down.

 STANDBY—Low power state with fast SMBus response.

 SENSOR—Same as STANDBY, but the battery is measured periodically.

 TUNE—Periodic tuning state. A tune is performed on any CHANGE_STATE to TUNE command and then

periodically based on the interval defined in TUNE_INTERVAL. This provides faster transition to TX. If XO is

enabled, XO will be used during tune operation.

 TX—Transmission state.

Rev 1.1

11

Si4012

Table 8. Power Modes

Circuit Blocks

Response Time

to TX

Response

Time to TX

I

Mode

VDD

Digital

LDO

SYS

CLK

(with XO Early

Enable)

SMBUS

LBD LC XTAL DIV PA

(without XO)

Shut-

down

OFF

OFF OFF OFF OFF OFF OFF 10 nA

22.2 ms

3

4

Standby

Sensor

ON

SLOW OFF OFF OFF OFF OFF 600 µA

FAST ON OFF OFF OFF OFF 610 µA

6.6 ms

4

6.6 ms

Tune

without

XO

1

2

ON

FAST OFF ON OFF ON ON

Note

370 µs

—

Tune

with XO

1

2

FAST OFF ON

ON ON ON

370 µs

Notes:

1. The LC, DIV, and PA are turned on as needed during the Tune operation.

2. See the tune section from Tune Start to PA Tune in the charts below for current consumption in Tune with XO and Tune

without XO.

3. The current consumption at Standby and Sensor does not include the power consumed by the internal XO circuitry. XO

should be turned off with SET_PROPERTY/CHIP_CONFIG to save power if external XO is not used or if tuning is not

happening soon when external XO is present.

4. The response time assumes external XO stays enabled prior to TX.

12

Rev 1.1

Si4012

Figure 4. Current Consumption with XO

Figure 5. Current Consumption with XO (Upscaled between 30 and 80 ms)

Rev 1.1

13

Si4012

Figure 6. Current Consumption without XO

Figure 7. Current Consumption without XO (Upscaled between 30 and 80 ms)

14

Rev 1.1

Si4012

5. Command Structure

The Si4012 has been designed to complete commands in the shortest time possible and to support both polled or

event driven (interrupt based) modes. For longer operations, commands are implemented as launch commands.

When the result of the launched command is completed, status is returned to the host via host polling or as an

interrupt (if enabled). The status is obtained over the SMBus.

For example, when a TX_START command is launched, the Si4012 will parse the command, check it for errors,

and return the status to the host immediately; it will also start the TX process. The host can then either poll for an

error or “packet sent” or receive an interrupt on nIRQ.

All host commands consist of a 1-byte opcode followed by 0 or more arguments. All responses from the Si4012

consist of a 1-byte top level status followed by 0 or more data values.

Command Structure:

Bit

7

6

5

4

3

2

1

0

CMD

ARG1

ARG2

…

ARGn

Response Structure:

Bit

7

6

5

4

3

2

1

0

STATUS

DATA1

DATA2

…

CTS

Err[6:0]

DATAn

A CTS (Clear to Send) indicates that the Si4012 has received the command and that the host can send another

command. The CTS does not necessarily mean the command has been processed. The host should poll interrupt

status or use interrupts (nIRQ) to get execution status for deferred operations.

Err[6:0] indicates an error has occurred if it is non-zero. See the “error codes” section for a full list of available error

codes.

Rev 1.1

15

Si4012

GET_INT_STATUS Command

CMD A P S SLA R A STATUS

S

SLA

W A

A

DATA1 N P

TX_STOP Command

S

SLA

W A

CMD

A

ARG1

A

ARG2

A P S

SLA

R A STATUS N P

S = Start

SLA = Slave Address (7 bits)

CMD = Command opcode (8bit)

ARG = Command Argument (8bit)

DATA = Data Value (8bit)

Underlined items are sent from the Si4012 (slave)

W = Write (1bit)

R = Read (1bit)

A = Acknowledge

N = Not-Acknowledge

P = Stop

STATUS = Top Level Status (8bit)

Figure 8. SMBus Sequence Example

Figure 8 above demonstrates two examples using the SMBus command sequence.

16

Rev 1.1

Si4012

5.1. Commands

Table 9 lists the commands available via the SMBus and described in the following sections.

Table 9. Commands Available via SMBus

Section

Command

Description

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

5.1.9

5.1.10

5.1.11

5.1.12

5.1.13

Get_Rev

Set_Property

Get_Property

LED_CTRL

Change_State

Get_State

Device revision information

Sets device properties

Gets device properties

LED Control

Configures device mode

Get device mode

TX_Start

Start data transmission

Enable interrupts

Set_Int

Get_Int_Status

Init_FIFO

Read & clear interrupts

Clears Tx FIFO

Set_FIFO

Stores data in FIFO for Tx

Stops transmission

Gets battery status

TX_Stop

Get_Bat_Status

Rev 1.1

17

Si4012

5.1.1. COMMAND: GET_REV

Purpose:

ARG:

Return product and revision information for the device.

None

DATA:

Product ID, Revision ID.

Command:

GET_REV

Command

7

6

5

4

3

2

1

0

CMD

0x10

Response:

GET_REV

Reply

7

6

5

4

3

2

1

0

STATUS

DATA1

DATA2

DATA3

DATA4

DATA5

DATA6

DATA7

DATA8

DATA9

DATA10

CTS

Err

ProdId[31:24]

ProdId[23:16]

ProdId[15:8]

ProdId[7:0]

RevisionID_RMIDU[47:40]

RevisionID_RMIDU[39:32]

RevisionID_RMIDL[31:24]

RevisionID_RVID[23:16]

RevisionID_FWIDU[15:8]

RevisionID_FWIDL[7:0]

18

Rev 1.1

Si4012

5.1.2. COMMAND: SET_PROPERTY

Purpose:

Set a property common to one or more commands. These are similar to parameters for a

command but are not expected to change frequently and may be controlled by the higher

software layers. Setting properties may not cause the device to take immediate action,

however the property will take effect once a command which uses it is issued. See the

“Properties” section of this document for details on properties.

PROP_ID[7:0]— Selects the property to set.

ARG:

DATA[n:0]—Value of the property. The length varies depending on the PROP_ID, up to 6-byte

in big Endian can be specified.

DATA:

None

Command:

SET_PROPERTY

7

6

5

4

3

2

1

0

Command

CMD

ARG1

ARG2

ARG3

ARG4

ARG5

ARG6

ARG7

0x11

PROP_ID[7:0]

PROP_DATA1, MSB of Property 's value

PROP_DATA 2

PROP_DATA 3

PROP_DATA 4

PROP_DATA5

PROP_DATA6

Response:

SET_PROPERTY

Reply

7

6

5

4

3

2

1

0

STATUS

CTS

Err

Rev 1.1

19

Si4012

5.1.3. COMMAND: GET_PROPERTY

Purpose:

Return the value of a specified property. See "5.2. Properties" on page 32 for details on

properties.

ARG:

PROP_ID[7:0]—Selects the property to retrieve.

DATA:

DATA[n:0] —Value of the specified property, the length varies depending on the PROP_ID, up

to 6 bytes

Command:

GET_PROPERTY

7

6

5

4

3

2

1

0

Command

CMD

0x12

PROP_ID[7:0]

ARG1

Response:

GET_PROPERTY

Reply

7

6

5

4

3

2

1

0

STATUS

DATA1

DATA2

DATA3

DATA4

DATA5

DATA6

CTS

Err

PROP_DATA1, MSB of Property's value

PROP_DATA 2

PROP_DATA 3

PROP_DATA 4

PROP_DATA5

PROP_DATA6

20

Rev 1.1

Si4012

5.1.4. COMMAND: LED_CTRL

Purpose:Turn on/off LED if LED driver is enabled.

ARG:

LedOn—If LED driver is enabled, turn LED on if set, otherwise, turn LED off. If LED driver is

not enabled, LedOn is ignored if set.

DATA:

None

Command:

LED_CTRL

7

6

5

4

3

2

1

0

LedOn

0

Command

CMD

0x13

ARG1

Response:

LED_CTRL

Reply

7

6

5

4

3

2

1

STATUS

CTS

Err

Notes: If LEDOn is set, the Si4012 checks the LedIntensity setting set by the host in SET_PROPERTY/LED_INTENSITY. If the

LedIntensity is 0, LED driver will be disabled. Err is set to 0x0A to report this condition.

Rev 1.1

21

Si4012

5.1.5. COMMAND: CHANGE_STATE

Purpose:

Change state to IDLE or SHUTDOWN. The device will change to the specified state at the

earliest time possible. If changing into IDLE state, ARG2 specifies the idle mode.

Table 10.

Circuit Blocks

Response Time

Response

Time to TX

to TX

I

Mode

VDD

Digital

LDO

SYS

CLK

(with XO Early

Enable)

SMBUS

LBD LC XTAL DIV PA

(without XO)

Shut-

down

OFF

OFF OFF OFF OFF OFF OFF 15 nA

22.2 ms

3

4

Standby

Sensor

ON

SLOW OFF OFF OFF OFF OFF 600 µA

FAST ON OFF OFF OFF OFF 610 µA

6.6 ms

4

6.6 ms

Tune

without

XO

1

2

ON

FAST OFF ON OFF ON ON

Note

370 µs

—

Tune

with XO

1

2

FAST OFF ON

ON ON ON

370 µs

Notes:

1. The LC, DIV and PA are turned on as needed during the Tune operation.

2. See the tune section from Tune Start to PA Tune in the charts below for current consumption in Tune with XO and Tune

without XO.

3. The current consumption at Standby and Sensor does not include the power consumed by the internal XO circuitry. XO

should be turned off with SET_PROPERTY/CHIP_CONFIG to save power if external XO is not used or if tuning is not

happening soon when external XO is present.

4. The response time assumes external XO stays enabled prior to TX.

ARG:



State[1:0]—state to transition to.

00 IDLE

– Go to idle mode state using the idle mode specified.

– Go to shutdown state.

01 SHUTDOWN

10–11

– Reserved.

IdleMode[2:0]—IDLE mode if changing to idle state.

000 Standby – Low Power State

001 Sensor

010 Tune

011–111

– Enable Low Battery Detector

– Periodic tuning

– Reserved

DATA:

None

22

Rev 1.1

Si4012

Command:

CHANGE_STATE

7

6

5

4

3

2

1

0

Command

CMD

ARG1

ARG2

0x60

State[1:0]

IdleMode[2:0]

Response:: None if changing to SHUTDOWN, otherwise

CHANGE_STATE

Reply

7

6

5

4

3

2

1

0

STATUS

CTS

Err

Notes:

1. Changing state among different idle modes is allowed.

2. State can also be changed via TX_START/TX_STOP.

3. An alternative way to transition to SHUTDOWN is by setting SDN pin to high.

4. SMBus activity or setting SDN pin to low will take the device out of shut down state.

Rev 1.1

23

Si4012

5.1.6. COMMAND: GET_STATE

Purpose:

ARG:

Get chip state and status.

None

DATA:



State[1:0]—current state

00 Idle

01 Reserved

10 TX



AutoTX—current AutoTX setting

IdleMode[2:0]. If State is Idle

000 Standby

– Low power state

001 Sensor

– Enable Low Battery Detector

– Periodic tuning

010 Tune



DTMod[1:0] if State is TX

00

01

10

11

– FIFO Mode

– CW Mode

– PN9-0 Mode

– PN9-1 Mode



ActTxPktSize—actual packet sent in the last transmission

PrevError —error code if error occurred in the previous operation

Command:

GET_STATE

Command

7

6

5

4

3

2

1

0

CMD

0x61

Response:

GET_STATE

7

6

5

4

3

2

1

0

STATUS

DATA1

DATA2

DATA3

DATA4

DATA5

CTS

Err

AutoTX

IdleMode[2:0]/DTMod[1:0]

State[1:0]

ActTxPktSize[15:8]

ActTxPktSize[7:0]

PrevError

24

Rev 1.1

Si4012

5.1.7. COMMAND: TX_START

Purpose:

Start transmission and go to a designated state after the packet is transmitted. This is an

asynchronous operation. Transmission may not have been started when response is sent

back the host.

ARG:



Packet Size[15:0] to be transmitted

State to transition to when transmission is completed.

AutoTX—Enable/Disable FIFO Auto-TX

1: Auto-Transmit Enabled.

Transmission will start when the FIFO level reaches the auto transmit threshold

specified in ffautotxthr in FIFO_THRESHOLD. If ffautotxthr=0, transmission will start

immediately.

0:Auto-Transmit Disabled.

Transmit will start immediately until the data specified in the PacketSize is

transmitted, or all the data in the FIFO is exhausted, whichever occurs first. If the

FIFO becomes empty before the specified packet length is transmitted a FIFO

underflow error will occur.



State[1:0]—State to transition to when transmission is completed.

00: IDLE—Go to idle state when the packet transmission completes based on the idle

mode.

01: SHUTDOWN—Go to shutdown state when the packet transmission completes.

10–11: Reserved.



IdleMode[2:0] if State is Idle; DTmod[1:0] if State is TX.

Idle Mode

000 Standby

001 Sensor

010 Tune

– Low power state

– Enable Low Battery Detector

– Periodic tuning

– FIFO Mode

DTMod[1:0] 00

01

10

11

– CW Mode

– PN9-0 Mode

– PN9-1 Mode

DATA:

Current data size in the FIFO when TX_START is received.

Command:

TX_START

7

6

5

4

3

2

1

0

Command

CMD

0x62

ARG1

ARG2

ARG3

ARG4

ARG5

PacketSize[15:8]

PacketSize[7:0]

AutoTX

State[1:0]

IdleMode[2:0]

DTMod[1:0]

Rev 1.1

25

Si4012

Response:

TX_START

Reply

STATUS

DATA1

7

6

5

4

3

2

1

0

CTS

Err

ActualDataSize[7:0]

Notes:

Si4012 allows larger packet sizes than the FIFO. It also allows the packet size to be greater than the data

available in the FIFO.



If the packet size is less than the data stored in the FIFO, the data specified in packet size will be

transmitted in one transmission leaving leftover data in the FIFO. The size to be transmitted will be

specified in the DATA field.



If the packet size is larger than the data stored in the FIFO size, when TX_START is received, all

the data in the FIFO will be transmitted. The size of the data currently available in the FIFO will be

specified in the DATA field. If auto transmit is enabled, the Si4012 will automatically transmit data

when the TX FIFO level reaches the auto transmit level dictated by ffautotxthr without another

explicit TX_START until the data specified in PacketSize is all transmitted. An interrupt is triggered

with pksent set in the interrupt status. AutoTX state will be cleared when packet is successfully

transmitted or FIFO underflow has happened. If auto transmit is not enabled, the Si4012 will start

transmitting what’s available in the FIFO until FIFO becomes empty. The host is responsible for

keeping FIFO from underflow by supplying the balance of the data needed for the packet size.



If the packet size equals to the data stored in the FIFO size, all the data in the FIFO will be

transmitted, ActualDataSize will be equal to the packet size.

The host should poll ipksent using GET_INT_STATUS to check when the packet has been sent, or

monitor the pksent interrupt.

26

Rev 1.1

Si4012

5.1.8. COMMAND: SET_INT

Purpose:

Enable interrupts.

ARG:



enffunder—Enable FIFO Underflow

entxffafull—Enable TX FIFO Almost Full

entxffaem—Enable TX FIFO Almost Empty

enffover—Enable FIFO Overflow

enpksent—Enable Packet Sent

enlbd—Enable Low Battery Detect

None



DATA:

Command:

SET_INT

7

6

entxffafull

6

5

4

3

2

1

0

Command

CMD

0x63

ARG1

enffunder

entxffaem enffover enpksent enlbd

entune reserved

Response:

SET_INT

Reply

7

5

4

3

2

1

0

STATUS

CTS

Err

Rev 1.1

27

Si4012

5.1.9. COMMAND: GET_INT_STATUS

Purpose:

Read the interrupt status and clear interrupts.

ARG:

None

DATA:



iffunder—FIFO Underflow



itxffafull—TX FIFO Almost Full

itxffaem—TX FIFO Almost Empty



iffover—FIFO Overflow

ipksent—Packet Sent

ilbd—Low Battery Detect

itune—tune complete

ipor—Power On Reset

Command:

GET_INT_STATUS

7

6

5

4

3

2

1

0

Command

CMD

0x64

Response:

GET_INT_STATUS

Reply

7

6

5

4

3

2

1

0

STATUS

DATA1

CTS

iffunder itxffafull

Err

itxf-

faem

iffover ipksent

ilbd

itune

ipor

Notes: Calling the GET_INT_STATUS command will clear all interrupts and reset the nIRQ pin. Therefore, the host must note

any interrupt bits that are set and take the necessary actions to service these interrupts.

TX FIFO Almost Full and TX FIFO Almost Empty Interrupts

These interrupts are triggered upon transition at the respective thresholds. Therefore, if an interrupt is generated for

FIFO Almost Empty and then cleared by a call to GET_INT_STATUS, another interrupt will NOT be generated if the FIFO

remains below the Almost Empty threshold. The FIFO must go above the threshold and then fall back to the threshold

before another Almost Empty threshold is generated and sent to the host.

Low Battery Detect (LBD) Interrupt

The LBD is cleared when the host calls GET_INT_STATUS. The Si4012 regenerates lbd interrupts periodically when the

LBD timer expires.

28

Rev 1.1

Si4012

5.1.10. COMMAND: INIT_FIFO

Purpose:

ARG:

DATA:

Clear the TX FIFO by clearing the FIFO with 0s and initializing the FIFO head and tail pointer

None

Command:

INIT_FIFO

7

6

5

4

3

2

1

0

Command

CMD

0x65

Response:

INIT_FIFO

Reply

7

6

5

4

3

2

1

0

STATUS

CTS

Err

5.1.11. COMMAND: SET_FIFO

Purpose:

ARG:

DATA:

Store data from the command interface into FIFO for transmission.

Up to 255 bytes

None

Command:

SET_FIFO

7

6

5

4

3

2

1

0

Command

CMD

ARG1

ARG2

…

0x66

FIFO_DATA1[7:0]

FIFO_DATA2[7:0]

ARGn

FIFO_DATAn[7:0]

Response:

SET_FIFO

Reply

7

6

5

4

3

2

1

0

STATUS

CTS

Err

If ARG exceeds the FIFO size of 255 bytes, Err is set to 0x08 (Too many arguments).

The Si4012 raises the ‘FIFO Almost Full’ or ‘FIFO Almost Empty’ interrupt when appropriate. If auto

transmit is enabled and the FIFO level is above the auto transmit threshold, the Si4012 will start transmit

automatically.

Rev 1.1

29

Si4012

5.1.12. COMMAND: TX_STOP

Purpose:

Stop transmission and go to designated state (this command can also be used to abort

existing transmissions)

ARG:



State[1:0]—State to transition to when transmission is stopped.

00 IDLE

– Go to idle state when the packet transmission is stopped based

on the idle mode.

01 SHUTDOWN – Go to shutdown state when the packet transmission is stopped.

10-11 – Reserved.



IdleMode[2:0] —IDLE mode if changing to idle state.

000 Standby – Low power state

001 Sensor

010 Tune

011–111

– Enable Low Battery Detector

– Periodic tuning

– Reserved

DATA:

None

Command:

TX_STOP

Command

7

6

5

4

3

2

1

0

CMD

ARG1

ARG2

0x67

State[1:0]

IdleMode[2:0]

Response: None if changing to SHUTDOWN, otherwise

TX_STOP

Reply

7

6

5

4

3

2

1

0

STATUS

CTS

Err

30

Rev 1.1

Si4012

5.1.13. COMMAND: GET_BAT_STATUS

Purpose:

Get the battery status such as current VDD voltage.

ARG: Load Option—0: Battery voltage is measured immediately without any load.

>0: battery voltage is measured after major power hungry parts of the device are temporarily

turned on. These parts are turned off when measurement is done after LoadWaitTime x 17 µs

of wait time.

DATA:

BTV[15:0]—Battery voltage in mV

Command:

GET_BAT_STATUS

7

6

5

4

3

2

1

0

Command

CMD

ARG

0x68

Load/Wait Time

Response:

GET_BAT_STATUS

Reply

7

6

5

4

3

2

1

0

STATUS

DATA1

DATA2

CTS

Err

BTV[15:8]

BTV[7:0]

Notes:

1. If tuning is in progress when this API is received, Err is set to 0x11 (Device busy).

2. In sensor mode, Si4012 reads battery voltage periodically with no load based on the interval set in

SET_PROPERTY/LBD_CONFIG.

Rev 1.1

31

Si4012

5.2. Properties

5.2.1. Properties Summary

Section

Property

Description

ID

5.2.2

5.2.3

5.2.4

5.2.5

0x10

0x11

0x20

0x21

CHIP_CONFIG

FSK Dev polarity, LSB first, XO

LED current drive strength

LED_INTENSITY

MODULATION_FSKDEV MOD type and FSK deviation if FSK

TUNE_INTERVAL

FIFO_THRESHOLD

BITRATE_CONFIG

TX_FREQ

Tuning interval in seconds

FIFO almost full, almost empty and auto

transmit threshold

5.2.6

5.2.7

5.2.8

0x30

0x31

0x40

Data rate and ramp rate if OOK

Carrier frequency for transmission if OOK,

upper frequency for transmission if FSK

Low battery voltage threshold that triggers

interrupt, battery voltage sampling interval

5.2.9

5.2.10

5.2.11

0x41

0x50

0x60

LBD_CONFIG

XO_CONFIG

PA_CONFIG

XO frequency and low capacitance control

PA maximum current driver, PA level, cap,

alpha and beta steps

The format table in this section applies to the ARG field of SET_PROPERTY after PROP_ID and DATA field of

GET_PROPERTY. I.e., PROP_ID corresponds to ARG1, PROP_DATA1 corresponds to ARG2 or DATA1,

PROP_DATA2 corresponds to ARG3 or DATA 2, etc.

Default is the value of a property the Si4012 defaults to if the host does not set the property via SET_PROPERTY.

Fields correspond to the PROP_DATA.

32

Rev 1.1

Si4012

5.2.2. PROPERTY: CHIP_CONFIG

Purpose:

Property:

Default:

Fields:

Select FSK deviation polarity, LSB first and external crystal.

0x10

0x08



FskDevPola—FSK deviation polarity.

0: +deviation when modulation data is 1 and –dev for Din = 0

1: +dev for Din = 0 and –dev for Din = 1



LsbFirst—When set, LSB is transmitted first. Otherwise, MSB is transmitted first.

UseXo—Use external crystal if set

Format:

CHIP_CONFIG

Property

7

6

5

4

3

2

1

0

PROP_ID

0x10

UseXo LsbFirst

PROP_DATA1

FskDevPola

Note: If the crystal is not populated on the board, there will still be a 1.4 mA current draw penalty for the XO circuitry on the

Si4012. The host should send SET_PROPERTY/CHIP_CONFIG with bit 3 cleared to turn off the XO circuitry.

Rev 1.1

33

Si4012

5.2.3. PROPERTY: LED_INTENSITY

Purpose:

Property:

Default:

Fields:

LED current drive strength

0x11

0x00

LedIntensity [1:0]—LED intensity

00: LED off



01: 0.37 mA

10: 0.60 mA



11: 0.97 mA.

Format:

LED_INTENSITY

Property

7

6

5

4

3

2

1

0

PROP_ID

0x11

PROP_DATA1

LedIntensity[1:0]

5.2.4. PROPERTY: MODULATION_FSKDEV

Purpose:

Property:

Default:

Fields:

Modulation type and FSK deviation.

0x20

0x013F



modutype—Modulation type, default 1.

0: OOK

1: FSK



biFskDev[6:0] –biFSKDev if FSK, default 63.

Format:

MODULATION_FSKDEV

Property

7

6

5

4

3

2

1

0

PROP_ID

0x20

PROP_DATA1

PROP_DATA2

ModuType

biFskDev[6:0]

Note: If SET_PROPERTY\DATA_RATE is sent and data rate is set to a value above 500, but modulation is set to OOK, Err will

be set in the response with ‘Data rate out of range’ error code. The biFSKDev parameter is attained either via the WDS

Chip Configurator utility or by using the Si4012 calculation spreadsheet.

34

Rev 1.1

Si4012

5.2.5. PROPERTY: TUNE_INTERVAL

Purpose:

Property:

Default:

Fields:

Tune interval used for periodic tuning.

0x21

0x000A



TuningItv[15:0]—tuning interval in seconds

Format:

TUNE_INTERVAL Property

7

6

5

4

3

2

1

0

PROP_ID

0x21

PROP_DATA1

PROP_DATA2

TuningItv[15:8]

TuningItv[7:0]

Note: The tuning interval specifies the frequency in which the device performs periodic tuning in tune state and in CW Mode.

In CW or PN9 mode, if TuningItv is 0, no tuning will be performed. In FIFO mode, if Si4012 is in tune state but TuningItv

is set to 0 by the host, tuning will be performed every 10 seconds.

5.2.6. PROPERTY: FIFO_THRESHOLD

Purpose:

Property:

Fields:

FIFO threshold settings—FIFO Almost Empty, FIFO Almost Full and auto transmit level.

0x30



ffafullthr[7:0]—FIFO Almost Full Threshold in bytes, default 0xF0



ffaemthr[7:0]—FIFO Almost Empty Threshold in bytes, default 0x10

ffautotxthr[7:0]—FIFO Threshold controlling when to start auto transmit, default 0x20 bytes.

Format:

FIFO_THRESHOLD

Property

7

6

5

4

3

2

1

0

PROP_HI

0x30

PROP_DATA1

PROP_DATA2

PROP_DATA3

ffafullthr[7:0]

ffaemthr[7:0]

ffautotxthr[7:0]

Notes:Ffautotxthr applies only when auto transmit is enabled. If ffautotxthr is set to 0, the Si4012 transmits whenever data

becomes available in the FIFO. This field is ignored when auto transmit is disabled.

Rev 1.1

35

Si4012

5.2.7. PROPERTY: BITRATE_CONFIG

Purpose:

Property:

Fields:

Data rate and ramp rate if OOK.

0x31



DataRate[9:0]—Data rate in units of 100 bps, ranging from 1 to 1000 for FSK and 1 to 500 for

OOK. Default 0x60.



RampRate[3:0]—Ramp rate in µs. 1, 2, 4, or 8 is supported. Default 2.

Format:

DATA_RATE

Property

7

6

5

4

3

2

1

0

PROP_ID

0x31

PROP_DATA1

PROP_DATA2

PROP_DATA3

DataRate[9:8]

DataRate[7:0]

RampRate[3:0]

Notes:The data rate won’t take into effect until transmission time.

If SET_PROPERTY\MODULATION_CONFIG is sent and modulation is set to OOK by the host, but DataRate is set to

> 500, Err will be set in the response.

The default modulation type is FSK. If SET_PROPERTY \MODULATION_FSKDEV is not sent, any value above 1000

will result in Err being set in the response—0x0D (Data Rate out of Range).

RampRate is ignored if ModuType in MODULATION_FSKDEV is FSK.

In OOK mode, any value except 1, 2, 4, or 8 will result in Err 0x04—bad parameter in ARG4.

In FSK mode, the minimum data rate is 200 bps.

The ramp rate parameter dictates the minimum data rate. The Si4012 will set Err to 0x10 (data rate not supported) if the

value is smaller than the minimum data rate on the specified Ramp Rate.

Ramp Rate

1

2

4

8

Min Data Rate (bps)

300

200

100

36

Rev 1.1

Si4012

5.2.8. PROPERTY: TX_FREQ

Purpose:

Carrier frequency for transmission if OOK, upper frequency if FSK and center frequency in CW

mode.

Property:

Default:

Fields:

0x40

0x19ddc7c8 for 433.965 MHz (433.92 MHz+90 kHz/2)

TxFreq[31:0]—Ranging from 27 MHz to 960 MHz.

OOK: Carrier Frequency (Hz)

FSK: Upper Frequency (Hz)

CW Mode: Center Frequency (Hz)

Format:

TX_FREQ

Property

7

6

5

4

3

2

1

0

PROP_ID

0x40

PROP_DATA1

PROP_DATA2

PROP_DATA3

PROP_DATA4

TxFreq[31:24]

TxFreq[23:16]

TxFreq[15:8]

TxFreq[7:0]

Note: Frequency out of range in SET_PROPERTY will result in Err = 0x0E (Frequency out of Range) in the response.

Rev 1.1

37

Si4012

5.2.9. PROPERTY: LBD_CONFIG

Purpose:

Battery voltage threshold used to determine when to raise Low Battery Detector Interrupt,

battery voltage sampling interval.

Property:

Fields:

0x41

LbdThr[15:0]—Battery voltage threshold in mV. Default 0x09C4 or 2500 mV.

SampleInterval[15:0]—Battery voltage sampling interval in seconds.

0x3C or 60 seconds.

Default:

Format:

LBD_CONFIG Property

7

6

5

4

3

2

1

0

PROP_ID

0x41

PROP_DATA1

PROP_DATA2

PROP_DATA3

PROP_DATA4

LbdThr[15:8]

LbdThr[7:0]

SampleInterval[15:8]

SampleInterval[7:0]

38

Rev 1.1

Si4012

5.2.10. PROPERTY: XO_CONFIG

Purpose:

Property:

Fields:

Frequency of external crystal and low cap configuration if using external crystal.

0x50



XoFreq[31:0]—Crystal frequency, unit in Hz. Default 0x00989680 or 10 MHz.



XoLowCap —This bit should be set for crystal that require less than 14 pF of Cload

capacitance. Default 0. See note below.

Format:

XO_CONFIG

Property

7

6

5

4

3

2

1

0

PROP_ID

0x50

PROP_DATA1

PROP_DATA2

PROP_DATA3

PROP_DATA4

PROP_DATA5

XoFreq[31:24]

XoFreq[23:16]

XoFreq[15:8]

XoFreq[7:0]

XoLowCap

Note: For correct operation of the oscillator, the user must do the following:

Check the crystal data sheet for the “Cload” capacitor value that should be placed across the crystal’s terminals to

oscillate at the correct frequency

If Cload > 14 pF, XO_LOWCAP bit of the XO_CONFIG property has to be set to 0. In this case, the input capacitance

of the XTAL pin of the Si4012 is approximately 5.5 pF, so a (Cload – 5.5)pF capacitor should be placed externally

across the crystal terminals.

If Cload < 14 pF XO_LOWCAP bit of the XO_CONFIG property have to be set to 1. In this case, the input

capacitance of the XTAL pin of the Si4012 is approximately 3 pF, so the external capacitor placed across the crystal

has to be (Cload – 3)pF.

Rev 1.1

39

Si4012

5.2.11. PROPERTY: PA_CONFIG

Purpose:

Property:

Fields:

PA max current driver, PA level, PA cap, alpha steps and beta steps.

0x60



PaMaxDrv—Allows for maximum current drive, calculated from Spreadsheet. Default 1.

PaLevel[6:0]—PA level calculated from Spreadsheet. Default 70.

PaCap[8:0]—PA cap. Default 128.



fAlphaSteps[7:0]—PA Alpha steps, default 125

fBetaSteps[7:0]—PA Beta steps, default 127

Format:

PA_CONFIG

Property

7

6

5

4

3

2

1

0

PROP_ID

0x60

PROP_DATA1

PROP_DATA2

PROP_DATA3

PROP_DATA4

PROP_DATA5

PROP_DATA6

PaMaxDrv

PaCap[8]

PaLevel[6:0]

PaCap[7:0]

fAlphaSteps[7:0]

fBetaSteps[7:0]

Note: fAlphaSteps and fBetaSteps should be calculated by the Si4012 calculator spreadsheet. See AN564 for details. fAlpha-

Steps specifies the number of steps advancing from the minimum supported value –0.075 with 0.0006 per step. The

maximum fAlpha is +0.075. fAlpha is computed using the formula below:

Alpha + 0.075

------------------------------------------

=

f_ALPHASTEPS

0.0006

fBetaSteps specifies the number of steps advancing from the minimum supported value –0.254 with 0.002 per

step. The maximum fBeta is +0.254. fBeta is computed using the formula below:

Beta + 0.254

---------------------------------------

=

f_BETASTEPS

0.002

40

Rev 1.1

Si4012

5.3. Error Codes

If the Si4012 detects an error upon receipt of a command, such as a bad parameter, the error is reported in the

Response.

If the Si4012 detects an error while executing a command after the response has sent back to the host, the error is

stored. The host can retrieve an actual error code via the GET_STATE command.

The table below provides the list of error codes.

Error Code

Description

Bad parameter in CMD

0x7f

0x01

0x02

0x03

0x04

0x05

0x06

0x07

0x08

0x09

0x0A

0x0B

0x0C

0x0D

0x0E

0x0F

0x10

0x11

0x12

0x13

Bad parameter in ARG1

Bad parameter in ARG2

Bad parameter in ARG3

Bad parameter in ARG4

Bad parameter in ARG5

Bad parameter in ARG6

Bad parameter in ARG7

Too many arguments

Too few arguments

LED on requested but LED driver is disabled

State change failed

LBD is disabled

Data rate is out of range

Frequency out of range

Internal error

Data rate not supported

Device busy

FIFO overflow

FIFO underflow

Rev 1.1

41

Si4012

6. Pin Descriptions

XTAL 1

GND 2

TXM 3

TXP 4

VDD 5

10 SDA

9 SCL

8 SDN

7 nIRQ

6 LED

Si4012

Pin Number

Name

XTAL

Description

1

2

Crystal input

Ground

GND

TXM, TXP

VDD

3,4

5

RF transmitter differential outputs

Supply input

9

LED

LED driver output

7

nIRQ

SDN

Interrupt status output, active low, open collector

Shutdown input pin, active high

SMB (SMBus) Clock input/output, open collector

SMB (SMBus) Data input/output, open collector

8

9

SCL

10

SDA

42

Rev 1.1

Si4012

7. Ordering Guide

Part

Number*

Description

Package

Type

Operating

Temperature

Si4012-C1001GT Crystal-less RF Transmitter

MSOP-10

–40 to 85 °C

Si4012-C1001AT Crystal-less RF Transmitter (Automotive Grade)

*Note: Add an “(R)” at the end of the device part number to denote tape and reel option.

Rev 1.1

43

Si4012

8. Package Outline

Figure 9 illustrates the package details for the Si4012. Table 11 lists the values for the dimensions shown in the

illustration.

Figure 9. 10-Pin MSOP Package

Table 11. Package Dimensions

Symbol

Millimeters

Nom

Symbol

Millimeters

Nom

Min

Max

Min

Max

A

—

1.10

0.15

0.95

0.33

0.23

e

0.50 BSC

A1

0.00

0.75

0.17

0.08

L

0.40

0.60

0.80

A2

0.85

L2

0.25 BSC

b

—

q

0°

—

8°

c

D

—

aaa

bbb

ccc

ddd

0.20

0.25

0.10

0.08

3.00 BSC

4.90 BSC

3.00 BSC

E

E1

Notes:

1. All dimensions are shown in millimeters (mm).

2. Dimensioning and tolerancing per ASME Y14.5M-1994.

3. This drawing conforms to JEDEC Outline MO-187, Variation “BA.”

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body

Components.

44

Rev 1.1

Si4012

9. Land Pattern: 10-Pin MSOP

Figure 10 shows the recommended land pattern details for the Si4012 in a 10-Pin MSOP package. Table 12 lists

the values for the dimensions shown in the illustration.

Figure 10. 10-Pin MSOP Land Pattern

Rev 1.1

45

Si4012

Table 12. 10-Pin MSOP Land Pattern Dimensions

Dimension

MIN

MAX

C1

E

4.40 REF

0.50 BSC

G1

X1

Y1

Z1

3.00

—

0.30

1.40 REF

—

5.80

Notes:

General

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ASME Y14.5M-1994.

3. This Land Pattern Design is based on the IPC-7351 guidelines.

4. All dimensions shown are at Maximum Material Condition (MMC).

Least Material Condition (LMC) is calculated based on a Fabrication

Allowance of 0.05 mm.

Solder Mask Design

1. All metal pads are to be non-solder mask defined (NSMD). Clearance

between the solder mask and the metal pad is to be 60 µm minimum,

all the way around the pad.

Stencil Design

1. A stainless steel, laser-cut and electro-polished stencil with

trapezoidal walls should be used to assure good solder paste release.

2. The stencil thickness should be 0.125 mm (5 mils).

3. The ratio of stencil aperture to land pad size should be 1:1.

Card Assembly

1. A No-Clean, Type-3 solder paste is recommended.

2. The recommended card reflow profile is per the JEDEC/IPC J-STD-

020 specification for Small Body Components.

46

Rev 1.1

Si4012

10. Top Marking: 10-Pin MSOP

Figure 11. 10-Pin MSOP Top Marking

Table 13. Top Marking Explanation

Base Part Number

12 = Si4012

Ordering Options

(See "7. Ordering Guide" on

page 43).

C1 = Revision

Line 1 Marking:

TTTT = Manufacturing Code

Manufacturing code from assembly house.

Line 2 Marking:

Line 3 Marking:

Y = Year

WW = Workweek

Assigned by assembly subcontractor. Corresponds to the

year and workweek of the mold date.

Rev 1.1

47

Si4012

DOCUMENT CHANGE LIST

Revision 0.1 to Revision 1.0



Added API.



Updated "1. Electrical Specifications" on page 4.

Revision 1.0 to Revision 1.1



Added automotive grade version to ordering guide.

48

Rev 1.1

Si4012

NOTES:

Rev 1.1

49

Si4012

CONTACT INFORMATION

Silicon Laboratories Inc.

400 West Cesar Chavez

Austin, TX 78701

Tel: 1+(512) 416-8500

Fax: 1+(512) 416-9669

Toll Free: 1+(877) 444-3032

Please visit the Silicon Labs Technical Support web page:

https://www.silabs.com/support/pages/contacttechnicalsupport.aspx

and register to submit a technical support request.

Patent Notice

Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analog-

intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team.

The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.

Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from

the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features

or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-

resentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-

quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to

support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-

sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized ap-

plication, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.

Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.

Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.

50

Rev 1.1


型号：	SI4012-C1001ATR
厂家：	SILICON
描述：	Telecom Circuit, 1-Func, CMOS, PDSO10, MSOP-10 电信光电二极管电信集成电路
文件：	总50页 (文件大小：460K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SI4012-C1001ATR [SILICON]

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