SST49LF004C-33-4C-WH [SILICON]

Flash, 512KX8, 11ns, PDSO32, 8 X 14 MM, MO-142BA, TSOP1-32;
SST49LF004C-33-4C-WH
型号: SST49LF004C-33-4C-WH
厂家: SILICON    SILICON
描述:

Flash, 512KX8, 11ns, PDSO32, 8 X 14 MM, MO-142BA, TSOP1-32

光电二极管
文件: 总36页 (文件大小:509K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
004C/008C4 Mb/8 Mb LPC Firmware Flash  
Advance Information  
FEATURES:  
Organized as 512K x8 / 1M x8  
Protected Data Area  
– 12-KByte Protected Data Area space  
– Three 4-KByte User-Programmable flash mem-  
ory sectors  
– Read-lock, write-lock and lock-down protection  
for each sector  
Conforms to Intel® LPC Interface Specification v1.1  
– Support Multi-Byte Firmware Memory Read/  
Write Cycles  
Single 3.0-3.6V Read and Write Operations  
LPC Mode  
– 5-signal LPC bus interface for both in-system  
and factory programming using programmer  
equipment  
– Multi-Byte Read capability allowing 15.6 MB/s  
data transfer rate @ 33 MHz PCI clock  
- Firmware Memory Read cycle supporting  
1, 2, 4, 16, and 128 Byte Read  
Superior Reliability  
– Endurance: 100,000 Cycles (typical)  
– Greater than 100 years Data Retention  
Uniform 4 KByte sectors  
– SST49LF004C: 11 Overlay Blocks:  
- one 16-KByte Boot Block  
- two 8-KByte Parameter Blocks  
- one 32-Kbyte Parameter Block  
- seven 64-KByte Main Blocks  
– SST49LF008C: 19 Overlay Blocks:  
- one 16-KByte Boot Block  
- Firmware Memory Write cycle supporting  
1, 2, and 4 Byte Write  
– 33 MHz clock frequency operation  
– WP#/AAI and TBL# pins provide hardware Write  
protect for entire chip and/or top Boot Block  
– Block Locking Registers for individual block Read-  
Lock, Write-Lock, and Lock-Down protection  
– 5 GPI pins for system design flexibility  
– 4 ID pins for multi-chip selection  
– Multi-Byte capability registers  
(read-only registers)  
– Status register for End-of-Write detection  
– Program-/Erase-Suspend  
Read or Write to other blocks during  
Program-/Erase-Suspend  
Two-cycle Command Set  
Security ID Feature  
- two 8-KByte Parameter Blocks  
- one 32-Kbyte Parameter Block  
- 15 64-KByte Main Blocks  
Fast Sector-Erase/Program Operation  
– Sector-Erase Time: 18 ms (typical)  
– Block-Erase Time: 18 ms (typical)  
– Program Time: 7 µs (typical)  
Auto Address Increment (AAI) for Rapid Factory  
Programming (High Voltage Enabled)  
– RY/BY# pin for End-of-Write detection  
– Multi-Byte Program  
– Chip Rewrite Time: (typical)  
- SST49LF004C: 1 seconds  
- SST49LF008C: 2 seconds  
Packages Available  
– 32-lead PLCC  
– 32-lead TSOP (8mm x 14mm)  
All non-Pb (lead-free) devices are RoHS compliant  
– 256-bit Secure ID space  
- 64-bit Unique Factory Pre-programmed  
Device Identifier  
- 192-bit User-Programmable OTP  
Low Power Consumption  
– Active Read Current: 12 mA (typical)  
- Standby Current: 10 µA (typical)  
PRODUCT DESCRIPTION  
The SST49LF00xC flash memory devices are designed to  
interface with host controllers (chipsets) that support a low-  
pin-count (LPC) interface for system firmware applications.  
The SST49LF00xC device complies with Intel’s LPC Inter-  
face Specification 1.1, supporting a Burst-Read (up to 128  
bytes in a single operation) which enables a 15.6 MByte  
per second data transfer. The LPC interface operates with  
5 signal pins versus 28 pins of a 8-bit parallel flash memory.  
This frees up pins on the ASIC host controller resulting in  
lower ASIC costs and a reduction in overall system costs  
due to simplified signal routing.  
The SST49LF00xC use a 5-signal LPC interface to support  
both in-system and rapid factory programming using pro-  
grammer equipment. A high voltage pin (WP#/AAI) is used  
to enable Auto Address Increment (AAI) mode. The  
SST49LF00xC offers hardware block protection in addition  
to individual block protection via software registers for criti-  
cal system code and data. A 256-bit Security ID space with  
a 64-bit factory pre-programmed unique number and a  
192-bit user programmable OTP area as well as 12-KByte  
Protected Data Area (PDA) enhances the user’s ability to  
implement new security techniques and data protection  
©200 Silicon Storage Technology, Inc.  
The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc.  
Intel is a registered trademark of Intel Corporation.  
S71292-00-000  
1
1/06  
These specifications are subject to change without notice.  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
scheme. The PDA can be also used to store system con-  
the cumulative number of erase cycles as is necessary with  
alternative flash memory technologies, whose Erase and  
Program time increase with accumulated Erase/Program  
cycles. To protect against inadvertent write, the  
SST49LF00xC device has on-chip hardware and software  
write protection schemes. It is offered with a typical endur-  
ance of 100,000 cycles. Data retention is rated at greater  
than 100 years.  
figuration  
data  
(EEPROM  
replacement).  
The  
SST49LF00xC also provides general purpose inputs (GPI)  
for system design flexibility.  
The SST49LF00xC flash memory device is manufactured  
with SST’s proprietary, high-performance SuperFlash tech-  
nology. The split-gate cell design and thick-oxide tunneling  
injector attain greater reliability and manufacturability com-  
pared with alternative technology approaches. The  
SST49LF00xC device significantly improves performance  
and reliability, while lowering power consumption. The  
SST49LF00xC device writes (Program or Erase) in-system  
with a single 3.0-3.6V power supply. It uses less energy  
during Erase and Program than alternative flash memory  
technologies.  
The SST49LF00xC product provides a maximum program  
time of 10 µs per byte with a single-byte Program opera-  
tion; effectively 5 µs per byte with a dual-byte Program  
operation and 2.5 µs per byte with a quad-byte Program  
operation. End-of-Write can be detected by the RY/BY# pin  
output in AAI mode and by reading the software status reg-  
ister during an in-system Program or Erase operation.  
The total energy consumed is a function of the applied volt-  
age, current and time of application. Since for any given  
voltage range, the SuperFlash technology uses less cur-  
rent to program and has a shorter erase time, the total  
energy consumed during any Erase or Program operation  
is less than alternative flash memory technologies.  
The SST49LF00xC is offered in 32-PLCC, and 32-TSOP  
packages. In addition, the SST49LF00xC devices are  
offered in lead-free (non-Pb) package options to address  
the growing need for non-Pb solutions in electronic compo-  
nents. Non-Pb package versions can be obtained by order-  
ing products with a package code suffix of “E” as the  
environmental attribute in the product part number. See  
Figures 3 and 4 for pin assignments and Table 1 for pin  
descriptions.  
The SuperFlash technology provides fixed Erase and Pro-  
gram time, independent of the number of Erase/Program  
cycles that have performed. Therefore the system software  
or hardware does not have to be calibrated or correlated to  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
2
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
TABLE OF CONTENTS  
PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
LIST OF FIGURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
LIST OF TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
FUNCTIONAL BLOCKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
DEVICE MEMORY MAPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
PIN DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Input/Output Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Input Communication Frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Identification Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
General Purpose Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Write Protect / Top Block Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
AAI Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Ready/Busy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Load Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
No Connection (NC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
DESIGN CONSIDERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
MODE SELECTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
LPC MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
FIRMWARE MEMORY CYCLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Firmware Memory Read Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Firmware Memory Write Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Abort Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Response to Invalid Fields for  
Firmware Memory Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Multiple Device Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
3
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
DEVICE COMMANDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Read-Array Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Read-Software-ID Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Read-Status-Register Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Clear-Status-Register Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Sector-/Block-Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Program-/Erase-Suspend or Program-/Erase-Resume Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Erase-Suspend/Erase-Resume Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Program-Suspend/Program-Resume Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Security ID Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Multi-Byte Read/Write Configuration Registers (Firmware Memory Cycle) . . . . . . . . . . . . . . . . . . . . . . . . . 21  
General Purpose Inputs Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Block and PDA Sector Locking Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Security ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
JEDEC ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
AUTO-ADDRESS INCREMENT (AAI) MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
AAI Mode with Multi-byte Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
AAI Data Load Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
ELECTRICAL SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
PRODUCT ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
PACKAGING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
4
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
LIST OF FIGURES  
FIGURE 1: Device Memory Map for SST49LF004C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
FIGURE 2: Device Memory Map for SST49LF008C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
FIGURE 3: Pin Assignments for 32-lead PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
FIGURE 4: Pin Assignments for 32-lead TSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
FIGURE 5: Firmware Memory Read Cycle Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
FIGURE 6: Firmware Memory Write Cycle Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
FIGURE 7: Erase-Suspend Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
FIGURE 8: AAI Load Protocol Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
FIGURE 9: LCLK Waveform (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
FIGURE 10: Reset Timing Diagram (LPC MODE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
FIGURE 11: Output Timing parameters (LPC Mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
FIGURE 12: Input Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
FIGURE 13: Input Timing Parameters (AAI Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
FIGURE 14: A Test Load Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
5
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
LIST OF TABLES  
TABLE 1: Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
TABLE 2: Transfer Size Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
TABLE 3: Firmware Memory Cycles START Field Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
TABLE 4: Firmware Memory Read Cycle Field Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
TABLE 5: Firmware Memory Write Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
TABLE 6: Valid MSIZE field Values for Firmware Memory Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
TABLE 7: Firmware Memory Multiple Device Selection Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
TABLE 8: Software Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
TABLE 9: Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
TABLE 10: Software Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
TABLE 11: Security ID Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
TABLE 12: General Purpose Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
TABLE 13: Multi-byte Read/Write Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
TABLE 14: Block Locking Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
TABLE 15: Protected Data Area Sector Locking Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
TABLE 16: Block/PDA Sector Locking Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
TABLE 17: Security ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
TABLE 18: JEDEC ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
TABLE 19: LD# Input and RY/BY# Status inAAI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
TABLE 20: AAI Programming Cycle (initiated with WP#/AAI at VH ONLY) . . . . . . . . . . . . . . . . . . . . . . . . 26  
TABLE 21: DC Operating Characteristics (All Interfaces) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
TABLE 22: Recommended System Power-up Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
TABLE 23: Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
TABLE 25: Clock Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
TABLE 24: Reliability Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
TABLE 26: Reset Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
TABLE 27: Read/Write Cycle Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
TABLE 28: AC Input/Output Specifications (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
TABLE 29: Interface Measurement Condition Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
TABLE 30: Input Cycle Timing Parameters (AAI Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
TABLE 31: Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
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6
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
FUNCTIONAL BLOCKS  
FUNCTIONAL BLOCK DIAGRAM  
PDA  
X-Decoder  
SuperFlash  
Memory  
TBL#  
WP#  
INIT#  
LAD[3:0]  
LCLK  
LPC  
Address Buffers & Latches  
LFRAME#  
ID[3:0]  
Interface  
Y-Decoder  
GPI[4:0]  
I/O Buffers and Data Latches  
Control Logic  
AAI  
AAI  
Interface  
RY/BY#  
LD#  
RST#  
1292 B1.1  
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4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
DEVICE MEMORY MAPS  
0FFFFFH  
Boot Block  
TBL#  
Block 18  
Block 17  
Block 16  
Block 15  
7FFFFH  
Boot Block  
0FC000H  
0FBFFFH  
TBL#  
Block 10  
Block 9  
Block 8  
Block 7  
Block 6  
Block 5  
Block 4  
Block 3  
Block 2  
Block 1  
7C000H  
7BFFFH  
0FA000H  
0F9FFFH  
7A000H  
79FFFH  
0F8000H  
0F7FFFH  
78000H  
77FFFH  
0F0000H  
0EFFFFH  
70000H  
6FFFFH  
Block 14  
Block 13  
Block 12  
Block 11  
Block 10  
Block 9  
Block 8  
Block 7  
Block 6  
Block 5  
Block 4  
Block 3  
Block 2  
Block 1  
0E0000H  
0DFFFFH  
60000H  
5FFFFH  
0D0000H  
0CFFFFH  
WP# for  
Block 0–9  
50000H  
4FFFFH  
0C0000H  
0BFFFFH  
40000H  
3FFFFH  
0B0000H  
0AFFFFH  
30000H  
2FFFFH  
WP# for  
Block 0–18  
0A0000H  
09FFFFH  
20000H  
1FFFFH  
090000H  
08FFFFH  
10000H  
0F000H  
080000H  
07FFFFH  
Block 0  
(64 KByte)  
070000H  
06FFFFH  
4 KByte Sector 2  
4 KByte Sector 1  
4 KByte Sector 0  
02000H  
01000H  
00000H  
060000H  
05FFFFH  
1292 F01.1  
FIGURE 1: DEVICE MEMORY MAP FOR  
SST49LF004C  
050000H  
04FFFFH  
040000H  
03FFFFH  
030000H  
02FFFFH  
020000H  
01FFFFH  
010000H  
00FFFFH  
4 KByte Sector 15  
Block 0  
(64 KByte) 002000H  
4 KByte Sector 2  
4 KByte Sector 1  
4 KByte Sector 0  
001000H  
000000H  
1292 F02.1  
FIGURE 2: DEVICE MEMORY MAP FOR  
SST49LF008C  
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4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
PIN ASSIGNMENTS  
4
3
2
1
32 31 30  
29  
5
GPI1 (LD#)  
GPI0 (RY/BY#)  
WP#/AAI  
TBL#  
NC  
NC  
NC  
NC  
6
28  
27  
26  
25  
24  
23  
22  
21  
7
8
32-lead PLCC  
Top View  
9
ID3  
V
DD  
INIT#  
10  
11  
12  
13  
ID2  
ID1  
LFRAME#  
NC  
ID0  
NC  
LAD0  
14 15 16 17 18 19 20  
1292 32-plcc P2.0  
( ) Designates AAI Mode  
FIGURE 3: PIN ASSIGNMENTS FOR 32-LEAD PLCC  
NC  
NC  
NC  
NC  
NC  
GPI4  
LCLK  
NC  
NC  
1
2
3
4
5
6
7
8
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
INIT#  
LFRAME#  
V
NC  
(V )  
DD DD  
NC  
NC  
NC  
LAD3  
32-lead TSOP  
Top View  
9
V
(V )  
SS SS  
RST#  
GPI3  
GPI2  
10  
11  
12  
13  
14  
15  
16  
LAD2  
LAD1  
LAD0  
ID0  
ID1  
ID2  
GPI1 (LD#)  
GPI0 (RY/BY#)  
WP#/AAI  
TBL#  
ID3  
1292 32-tsop P1.0  
( ) Designates AAI Mode  
FIGURE 4: PIN ASSIGNMENTS FOR 32-LEAD TSOP  
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4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
PIN DESCRIPTIONS  
TABLE 1: PIN DESCRIPTION  
Interface  
Symbol  
Pin Name  
Type1 AAI LPC Functions  
LCLK  
Clock  
I
X
X
X
X
To accept a clock input from the control unit  
LAD[3:0] Address  
and Data  
I/O  
To provide LPC bus information,  
such as addresses and command Inputs/Outputs data.  
LFRAME# Frame  
I
X
X
To indicate the start of a data transfer operation;  
also used to abort an LPC cycle in progress.  
RST#  
INIT#  
Reset  
I
I
X
X
X
X
To reset the operation of the device  
Initialize  
This is the second reset pin for in-system use.  
This pin is internally combined with the RST# pin.  
If this pin or RST# pin is driven low, identical operation is exhibited.  
ID[3:0]  
GPI[4:0]  
TBL#  
Identification  
Inputs  
I
I
I
X
X
These four pins are part of the mechanism that allows multiple parts to be  
attached to the same bus. The strapping of these pins is used to identify  
the component. The boot device must have ID[3:0]=0000, all subsequent  
devices should use sequential up-count strapping. These pins are inter-  
nally pulled-down with a resistor between 20-100 KΩ. When in AAI mode,  
these pins operate identically as in Firmware Memory cycles.  
General  
Purpose  
Inputs  
X
These individual inputs can be used for additional board flexibility.  
The state of these pins can be read through LPC registers. These inputs  
should be at their desired state before the start of the LPC clock cycle dur-  
ing which the read is attempted, and should remain in place until the end  
of the Read cycle. Unused GPI pins must not be floated.  
GPI[2:4] are ignored when in AAI mode.  
Top Block Lock  
X
X
When low, prevents programming to the boot block sectors at top of device  
memory. When TBL# is high it disables hardware write protection for the  
top block sectors. This pin cannot be left unconnected.  
TBL# setting is ignored when in AAI mode.  
WP#/AAI Write Protect  
WP#/AAI AAI Enable  
I
I
When low, prevents programming to all but the highest addressable block  
(Boot Block). When WP# is high it disables hardware write protection for  
these blocks. This pin cannot be left unconnected.  
X
X
X
When set to the Supervoltage VH = 9V, configures the device to program  
multiple bytes in AAI mode. When brought to VIL/VIH, returns device to  
LPC mode.  
RY/BY#  
LD#  
Ready/Busy#  
Load-Enable#  
O
I
Open drain output that indicates the device is ready to accept data in an  
AAI mode, or that the internal cycle is complete.  
Used in conjunction with LD# pin to switch between these two flag states.  
Input pin which when low, indicates the host is loading data in an AAI pro-  
gramming cycle. If LD# is high, the host signals the AAI interface that it is  
terminating a command. LD# low/high switches the RY/BY# output from a  
“buffer free” flag to a “programming complete” flag.  
VDD  
VSS  
NC  
Power Supply  
Ground  
PWR  
PWR  
X
X
X
X
To provide power supply (3.0-3.6V)  
Circuit ground (0V reference)  
No Connection  
N/A N/A Unconnected pins.  
T1.0 1292  
1. I=Input, O=Output  
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4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Clock  
Write Protect / Top Block Lock  
The LCLK pin accepts a clock input from the host controller.  
The Top Boot Lock (TBL#) and Write Protect (WP#/AAI)  
pins are provided for hardware write protection of device  
memory in the SST49LF00xC. The TBL# pin is used to  
write protect 16 KByte at the highest memory address  
range for the SST49LF00xC. WP#/AAI pin write protects  
the remaining sectors in the flash memory. An active low  
signal at the TBL# pin prevents Program and Erase opera-  
tions of the top Boot Block. When TBL# pin is held high,  
write protection of the top Boot Block is then determined by  
the Boot Block Locking registers. The WP#/AAI pin serves  
the same function for the remaining sectors of the device  
memory. The TBL# and WP#/AAI pins write protection  
functions operate independently of one another. Both TBL#  
and WP#/AAI pins must be set to their required protection  
states prior to starting a Program or Erase operation. A  
logic level change occurring at the TBL# or WP#/AAI pin  
during a Program or Erase operation could cause unpre-  
dictable results. TBL# and WP#/AAI pins cannot be left  
unconnected.  
Input/Output Communications  
The LAD[3:0] pins are used to serially communicate cycle  
information such as cycle type, cycle direction, ID selection,  
address, data, and sync fields.  
Input Communication Frame  
The LFRAME# pin is used to indicate start of a LPC bus  
cycle. The pin is also used to abort an LPC bus cycle in  
progress.  
Reset  
A VIL on INIT# or RST# pin initiates a device reset. INIT#  
and RST# pins have the same function internally. It is  
required to drive INIT# or RST# pins low during a system  
reset to ensure proper CPU initialization. During a Read  
operation, driving INIT# or RST# pins low deselects the  
device and places the output drivers, LAD[3:0], in a high  
impedance state. The reset signal must be held low for a  
minimum of time TRSTP. A reset latency occurs if a reset pro-  
cedure is performed during a Program or Erase operation.  
See Table 26, Reset Timing Parameters, for more informa-  
tion. A device reset during an active Program or Erase oper-  
ation will abort the operation and memory contents may  
become invalid due to data being altered or corrupted from  
an incomplete Erase or Program operation.  
TBL# is internally OR’ed with the top Boot Block Locking  
register. When TBL# is low, the top Boot Block is hardware  
write protected regardless of the state of the Write-Lock bit  
for the Boot Block Locking register. Clearing the Write-Pro-  
tect bit in the register when TBL# is low will have no func-  
tional effect, even though the register may indicate that the  
block is no longer locked.  
WP#/AAI is internally OR’ed with the Block Locking regis-  
ter. When WP#/AAI is low, the blocks are hardware write  
protected regardless of the state of the Write-Lock bit for  
the corresponding Block Locking registers. Clearing the  
Write-Protect bit in any register when WP#/AAI is low will  
have no functional effect, even though the register may indi-  
cate that the block is no longer locked.  
Identification Inputs  
These pins are part of a mechanism that allows multiple  
devices to be attached to the same bus. The strapping of  
these pins is used to identify the component. The boot  
device must have ID[3:0] = 0; all subsequent devices  
should use sequential count-up strapping. These pins are  
internally pulled-down with a resistor between 20-100 KΩ.  
The TBL# pin and WP# pin do not affect the protection of  
the Protected Data Area. The PDA protection status is only  
determined by the value of the PDA Sector Locking Regis-  
ters. (See “Block and PDA Sector Locking Registers” on  
page 22.)  
General Purpose Inputs  
The General Purpose Inputs (GPI[4:0]) can be used as dig-  
ital inputs for the CPU to read. The GPI register holds the  
values on these pins. The data on the GPI pins must be  
stable before the start of a GPI register Read and remain  
stable until the Read cycle is complete. The pins must be  
driven low, VIL, or high, VIH but not left unconnected (float).  
AAI Enable  
The AAI Enable pin (WP#/AAI) is used to enable the Auto  
Address Increment (AAI) mode. When the WP#/AAI pin is  
set to the Supervoltage VH (9 0.5V), the device is in AAI  
mode with Multi-Byte programming. When the WP#/AAI  
pin is brought to VIL/VIH levels, the device returns to LPC  
mode.  
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11  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Ready/Busy  
LPC MODE  
The Ready/Busy pin (RY/BY#), is an open drain output  
which indicates the device is ready to accept data in an AAI  
mode, or that the internal programming cycle is complete.  
The pin is used in conjunction with the LD# pin to switch  
between these two flag states (see Table 19).  
Device Operation  
The SST49LF00xC supports Multi-Byte Firmware Memory  
Read and Write cycle types as defined in Intel Low Pin  
Count Interface Specification, Revision 1.1. Table 2 shows  
the size of transfer supported by the SST49LF00xC.  
Load Enable  
TABLE 2: TRANSFER SIZE SUPPORTED  
The Load Enable pin (LD#), is an input pin which when low,  
indicates the host is loading data in an AAI programming  
cycle. Data is loaded in the SST49LF00xC at the rising  
edge of the clock. If LD# is high, it signals the AAI interface  
that the host is terminating the command. LD# low/high  
switches the RY/BY# output from buffer free flag to pro-  
gramming complete flag (see Table 19).  
Cycle Type  
Size of Transfer  
1, 2, 4, 16, 128 Bytes  
1, 2, 4 Bytes  
Firmware Memory Read  
Firmware Memory Write  
T2.0 1292  
The LPC mode uses a 5-signal communication interface:  
one control line, LFRAME#, which is driven by the host to  
start or abort a bus cycle, a 4-bit data bus, LAD[3:0], used  
to communicate cycle type, cycle direction, ID selection,  
address, data and sync fields. The device enters standby  
mode when LFRAME# is taken high and no internal opera-  
tion is in progress.  
No Connection (NC)  
These pins are not connected internally.  
DESIGN CONSIDERATIONS  
SST recommends a high frequency 0.1 µF ceramic capac-  
itor to be placed as close as possible between VDD and  
The host drives LFRAME# signal from low-to-high to cap-  
ture the start field of a LPC cycle. On the cycle in which  
LFRAME# goes inactive, the last latched value is taken as  
the START value. The START value determines whether  
the SST49LF00xC will respond to a Firmware Memory  
Read/Write cycle type as defined in Table 3.  
VSS less than 1 cm away from the VDD pin of the device.  
Additionally, a low frequency 4.7 µF electrolytic capacitor  
from VDD to VSS should be placed within 1 cm of the VDD  
pin. If you use a socket for programming purposes add an  
additional 1-10 µF next to each socket. The RST# pin must  
remain stable at VIH for the entire duration of an Erase  
operation. WP#/AAI must remain stable at VIH for the entire  
duration of the Erase and Program operations for non-Boot  
Block sectors. To write data to the top Boot Block sectors,  
the TBL# pin must also remain stable at VIH for the entire  
duration of the Erase and Program operations.  
TABLE 3: FIRMWARE MEMORY CYCLES START  
FIELD DEFINITION  
START  
Value Definition  
1101  
1110  
Start of a Firmware Memory Read cycle  
Start of a Firmware Memory Write cycle  
T3.0 1292  
MODE SELECTION  
See following sections on details of Firmware Memory  
cycle types (Tables 4 and 5). Two-cycle Program and  
Erase command sequences are used to initiate Firmware  
Memory Program and Erase operations. See Table 8 for a  
listing of Program and Erase commands.  
The SST49LF00xC flash memory device operates in two  
distinct interface modes: the LPC mode and the Auto  
Address Increment (AAI) mode. The WP#/AAI pin is used  
to set the interface mode selection. The device is in AAI  
mode when the WP#/AAI pin is set to the Supervoltage VH  
(9 0.5V), and in the LPC mode when the WP#/AAI is set to  
VIL/VIH. The mode selection must be configured prior to  
device operation.  
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4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
FIRMWARE MEMORY CYCLES  
Firmware Memory Read Cycle  
TABLE 4: FIRMWARE MEMORY READ CYCLE FIELD DEFINITIONS  
Clock  
Cycle  
Field  
Name  
LAD[3:0]  
Direction  
Field Contents  
LAD[3:0]1  
Comments  
1
START  
1101  
IN  
LFRAME# must be active (low) for the part to respond.  
Only the last start field (before LFRAME# transitions high)  
will be recognized. The START field contents (1101b) indi-  
cate a Firmware Memory Read cycle.  
2
IDSEL  
0000 to 1111  
IN  
Indicates which SST49LF00xC device should respond.  
If the IDSEL (ID select) field matches the value of ID[3:0],  
then that particular device will respond to the LPC bus  
cycle.  
3-9  
10  
MADDR  
MSIZE  
YYYY  
KKKK  
IN  
IN  
These seven clock cycles make up the 28-bit memory  
address. YYYY is one nibble of the entire address.  
Addresses are transferred most-significant nibble first.  
The MSIZE field indicates how many bytes will be trans-  
ferred during multi-byte operations.  
Device will execute multi-byte read of 2MSIZE bytes.  
SST49LF00xC supports only MSIZE = 0, 1, 2, 4, 7 (1, 2, 4,  
16, 128 Bytes), with KKKK=0000b, 0001b, 0010b, 0100b, or  
0111b.  
11  
TAR0  
1111  
IN,  
then Float  
In this clock cycle, the master (Intel ICH) has driven the bus  
to all ‘1’s and then floats the bus, prior to the next clock  
cycle. This is the first part of the bus “turnaround cycle.”  
12  
13  
TAR1  
1111 (float)  
Float,  
then OUT  
The SST49LF00xC takes control of the bus during this  
cycle.  
RSYNC  
0000 (READY)  
OUT  
During this clock cycle, the device generates a “ready sync”  
(RSYNC) indicating that the device has received the input  
data. The least-significant nibble of the least-significant byte  
will be available during the next clock cycle.  
14-A  
DATA  
TAR0  
ZZZZ  
1111  
OUT  
A=(13+2n+1); n = MSIZE  
Least significant nibbles outputs first.  
(A+1)  
OUT,  
then Float  
In this clock cycle, the SST49LF00xC drives the bus to all  
ones and then floats the bus prior to the next clock cycle.  
This is the first part of the bus “turnaround cycle.”  
A=(13+2n+1); n = MSIZE  
(A+2)  
TAR1  
1111 (float)  
Float,  
then IN  
The host resumes control of the bus during this cycle.  
A=(13+2n+1); n = MSIZE  
T4.0 1292  
1. Field contents are valid on the rising edge of the present clock cycle.  
LCLK  
LFRAME#  
DATA  
Start  
IDSEL  
MADDR  
MSIZE TAR0 TAR1 RSYNC  
KKKKb 1111b Tri-State 0000b  
1101b 0000b A[27:24] A[23:20] A[19:16] A[15:12] A[11:8]  
A[7:4]  
A[3:0]  
D
[3:0]  
D
[7:4]  
D
[3:0]  
D [7:4]  
n
TAR  
0
0
n
LAD[3:0]  
1292 F03.0  
FIGURE 5: FIRMWARE MEMORY READ CYCLE WAVEFORM  
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S71292-00-000  
1/06  
13  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Firmware Memory Write Cycle  
TABLE 5: FIRMWARE MEMORY WRITE CYCLE  
Clock  
Cycle  
Field  
Name  
Field Contents  
LAD[3:0]1  
LAD[3:0]  
Direction  
Comments  
1
START  
1110  
IN  
LFRAME# must be active (low) for the part to respond.  
Only the last start field (before LFRAME# transitions  
high) will be recognized. The START field contents  
(1110b) indicate a Firmware Memory Write cycle.  
2
IDSEL  
0000 to 1111  
IN  
Indicates which SST49LF00xC device should  
respond. If the IDSEL (ID select) field matches the  
value of ID[3:0], then that particular device will respond  
to the whole bus cycle.  
3-9  
10  
MADDR  
MSIZE  
YYYY  
KKKK  
IN  
IN  
These seven clock cycles make up the 28-bit memory  
address. YYYY is one nibble of the entire address.  
Addresses are transferred most-significant nibble first.  
The MSIZE field indicates how many bytes will be  
transferred during multi-byte operations.  
Device supports 1, 2, and 4 Bytes write with MSIZE =  
0, 1, or 2, and KKKK=0000b, 0001b, or 0010b.  
11-A  
DATA  
TAR0  
ZZZZ  
1111  
IN  
A=(10+2n+1); n = MSIZE  
Least significant nibble entered first.  
(A+1)  
IN then Float  
In this clock cycle, the master (Intel ICH) has driven the  
bus to all ‘1’s and then floats the bus prior to the next  
clock cycle. This is the first part of the bus “turnaround  
cycle.A=(10+2n+1); n = MSIZE  
(A+2)  
(A+3)  
TAR1  
1111 (float)  
0000  
Float then OUT The SST49LF00xC takes control of the bus during this  
cycle.  
A=(10+2n+1); n = MSIZE  
RSYNC  
OUT  
During this clock cycle, the SST49LF00xC generates  
a “ready sync” (RSYNC) and outputs the values 0000,  
indicating that it has received data or a flash command.  
A=(10+2n+1); n = MSIZE  
(A+4)  
(A+5)  
TAR0  
TAR1  
1111  
OUT then Float In this clock cycle, the SST49LF00xC drives the bus to  
all ‘1’s and then floats the bus prior to the next clock  
cycle. This is the first part of the bus “turnaround  
cycle”. A=(10+2n+1); n = MSIZE  
1111 (float)  
Float then IN  
The host resumes control of the bus during this cycle.  
A=(10+2n+1); n = MSIZE  
T5.0 1292  
1. Field contents are valid on the rising edge of the present clock cycle.  
LCLK  
LFRAME#  
DATA  
Start  
IDSEL  
MADDR  
MSIZE  
KKKKb  
TAR0 TAR1 RSYNC  
1111b Tri-State 0000b  
1110b 0000b A[27:24] A[23:20] A[19:16] A[15:12] A[11:8]  
A[7:4]  
A[3:0]  
D
[3:0]  
D
[7:4]  
Dn[3:0] Dn[7:4]  
TAR  
0
0
LAD[3:0]  
1292 F04.0  
FIGURE 6: FIRMWARE MEMORY WRITE CYCLE WAVEFORM  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
14  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Invalid MSIZE field: If the SST49LF00xC receives an  
invalid size field during a Firmware Memory Read or Write  
operation, the device will reset and no operation will be  
attempted. The device will not generate any kind of  
response in this situation. The SST49LF00xC will only  
respond to values listed in Table 6.  
Abort Mechanism  
If LFRAME# is driven low for one or more clock cycles after  
the start of a bus cycle, the cycle will be terminated. The  
host may drive the LAD[3:0] with ‘1111b’ (ABORT nibble) to  
return the interface to ready mode. The ABORT only  
affects the current bus cycle. For a multi-cycle command  
sequence, such as the Erase or Program commands,  
ABORT doesn’t interrupt the entire command sequence,  
only the current bus cycle of the command sequence. The  
host can re-send the bus cycle for the aborted command  
and continue the command sequence after the device is  
ready again.  
TABLE 6: VALID MSIZE FIELD VALUES FOR  
FIRMWARE MEMORY CYCLES  
MSIZE  
0000  
0001  
0010  
0100  
0111  
Direction  
R/W  
R/W  
R/W  
R
Size of Transfer  
1 Byte  
2 Byte  
4 Byte  
Response to Invalid Fields for  
Firmware Memory Cycle  
16 Byte  
R
128 Byte  
During an on-going Firmware Memory bus cycle, the  
SST49LF00xC will not explicitly indicate that it has received  
invalid field sequences. The response to specific invalid  
fields or sequences is described as follows:  
T6.0 1292  
Once valid START, IDSEL, and MSIZE are received, the  
SST49LF00xC will always complete the bus cycle. How-  
ever, if the device is busy performing a flash Erase or Pro-  
gram operation, no new internal memory Write will be  
executed. As long as the states of LAD[3:0] and LFRAME#  
are known, the response of the ST49LF00xC to signals  
received during the cycle is predictable.  
ID mismatch: If the IDSEL field does not match ID[3:0],  
the device will ignore the cycle. See “Multiple Device Selec-  
tion for Firmware Memory Cycle” on page 16 for details.  
Address out of range: The address sequence is 7  
fields long (28 bits) with Firmware Memory bus cycles.  
Only some of the address fields bits are decoded by the  
SST49LF00xC devices. SST49LF004c decodes A0  
through A18 and A22, and SST49LF008C decodes A0  
through A19 and A22. Address A22 has the special function  
of directing reads and writes to the flash core (A22=1) or to  
the register space (A22=0).  
Non-boundary-aligned address: The SST49LF00xC  
accepts multi-byte transfers for both Read and Write opera-  
tions. The device address space is divided into uniform  
page sizes 2, 4, 16, or 128 bytes wide, according to the  
MSIZE value (see Table 6). The host issues only one  
address in the MADDR field of the Firmware Memory  
Cycle, but multiple bytes are read from or written to the  
device. For this reason the MADDR address should be  
page boundary-aligned. This means the address should be  
aligned to a Word boundary (A0 = 0) for a 2-byte transfer, a  
double Word boundary (e.g. A0 = 0, A1 = 0) for a 4-byte  
transfer, and so on. If the address supplied by the host is  
not page boundary-aligned, the SST49LF00xC will force a  
boundary alignment, starting the multi-byte Read or Write  
operation from the lower byte of the addressed page.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
15  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
TABLE 7: FIRMWARE MEMORY MULTIPLE DEVICE  
SELECTION CONFIGURATION  
Multiple Device Selection  
Multiple LPC firmware flash devices may be strapped to  
increase memory densities in a system. The four ID pins,  
ID[3:0], allow up to 16 devices to be attached to the same  
bus by using different ID strapping in a system. BIOS sup-  
port, bus loading, or the attaching bridge may limit this num-  
ber. The boot device must have an ID of 0000b (determined  
by ID[3:0]); subsequent devices use incremental number-  
ing. Equal density must be used with multiple devices.  
Device #  
ID[3:0]  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
IDSEL  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
0 (Boot device)  
1
2
3
4
5
Multiple Device Selection for  
Firmware Memory Cycle  
6
7
For Firmware Memory Read/Write cycles, hardware strap-  
ping values on ID[3:0] must match the values in IDSEL  
field. The SST49LF00xC will compare these bits with  
ID[3:0]’s strapping values. If there is a mismatch, the device  
will ignore the remainder of the cycle. See Table 7 for Multi-  
ple Device Selection Configuration.  
8
9
10  
11  
12  
13  
14  
15  
T7.0 1292  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
16  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
DEVICE COMMANDS  
Device operation is controlled by commands written to the  
Command User Interface (CUI). Execution of a specific  
command is handled by internal functions after a CUI  
receives and processes the command. After power-up or a  
Reset operation the device enters Read mode. Commands  
consist of one or two sequential Bus-Write operations. The  
commands are summarized in Table 8, “Software Com-  
mand Sequence”.  
TABLE 8: SOFTWARE COMMAND SEQUENCE  
Bus Cycles  
First Bus Cycle  
Second Bus Cycle  
Command  
Required  
Oper  
Write  
Write  
Addr1  
Data  
FFH  
90H  
Oper  
Addr1  
Data  
Read-Array/Reset  
1
X
X
Read-Software-ID/  
2  
Read  
Read  
IA5  
X
ID6  
Read-Security-ID2,3,4  
Read-Status-Register3,4  
Clear-Status-Register  
Sector-Erase8  
Block-Erase8  
Program8,10  
2
1
2
2
2
Write  
Write  
Write  
Write  
Write  
X
X
X
X
X
70H  
50H  
30H  
20H  
SRD7  
Write  
Write  
Write  
SAx9  
BAx  
WA11  
D0H  
D0H  
WD12  
40H  
or  
10H  
Program-/Erase-Suspend  
Program-/Erase-Resume  
User-Security-ID-Program13  
User-Security-ID-Program-Lockout  
Protected-Area-Sector-Erase8,14  
Program-Protected-Area8,14  
Open-Protected-Area15  
1
1
2
2
2
2
1
1
Write  
Write  
Write  
Write  
Write  
Write  
Write  
Write  
X
X
X
X
X
X
X
X
B0H  
D0H  
A5H  
85H  
32H  
42H  
62H  
6DH  
Write  
Write  
Write  
Write  
WA11  
X
Data  
00H  
SA  
D0H  
Data  
WA  
Hide-Protected-Area15  
T8.0 1292  
1. This value must be a valid address within the device Memory Address Space. X can be VIH or VIL, but no other value.  
2. SST Manufacturer’s ID = BFH, is read with A19-A0 = 0.  
SST49LF004C/008C Device ID = 54H/59H, is read with A19-A1 = 0, A0 = 1.  
Following the Read-Software-ID/Read-Security-ID command,  
Read operations access Manufacturer’s ID and Device ID or Security ID.  
3. Read-Software-ID/Read Security ID and Read Status Register will return ID/Register data until another valid command is written.  
4. Following the Read-Software-ID/Read-Security-ID command, Read operations access manufacturer’s ID and Device ID or Security  
ID. Read-Software-ID/Read-Security-ID and Read-Status-Register will return register data until another valid command is written.  
5. IA = Device Identification Address/Security ID Address.  
6. ID = Data read from identifier codes/Data read from Security ID  
7. SRD = Data read from Status register  
8. The sector or block must not be write-locked when attempting Erase or Program operations.  
Attempts to issue an Erase or Program command to a write-locked sector/block will fail.  
9. SAX for Sector-Erase Address  
BAX for Block-Erase Address  
10. The Program Command can operate on multiple bytes.  
11. WA = Address of memory location to be written  
12. WD = Data to be written at location WA  
13. Valid addresses for the User Security ID space are from FFFC 0188H to FFFC 019FH.  
14. Valid address WA of Protected Data Area location is from FFFC 8000H to FFFC AFFFH. For Sector Erase Command any address  
within the sector in the Protected Data Area being erased can be used: PDA Sector 0 - SA+ FFC 8000H to FFFC 8FFFH. PDA Sec-  
tor 1 - SA = FFFC 9000H to FFFC 9FFFH. PDA Sector 2 - SA = FFFC A000H to FFFC AFFFH.  
15. After Open Protected Area command is executed the contents of the area can be read at addresses FFBC 8000H to FFBC AFFFH if  
it is not read-locked. After Hide Protected Area command is executed the contents of the area is not accessible regardless of read-  
lock status. By default (after Power On or reset) Protected Data Area is hidden.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
17  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
TABLE 9: PRODUCT IDENTIFICATION  
Address1  
Read-Array Command  
Data  
Upon initial device power-up and after exit from reset, the  
device defaults to the Read Array mode. This operation can  
also be initiated by writing the Read-Array command. (See  
Table 8.) The device remains available for array reads until  
another command is written. Once an internal Program/  
Erase operation starts, the device will not recognize the  
Read-Array command until the operation is completed,  
unless the operation is suspended via a Program-/Erase-  
Suspend command.  
Manufacturer’s ID  
Device ID  
FFFC 0000H  
BFH  
SST49LF004C  
SST49LF008C  
FFFC 0001H  
FFFC 0001H  
54H  
59H  
T9.0 1292  
1. Address shown in this column is for boot device only.  
Address locations should appear elsewhere in the 4  
GByte system memory map depending on ID strapping  
values on ID[3:0] pins when multiple LPC memory  
devices are used in a system.  
Read-Software-ID Command  
Read-Status-Register Command  
The Read-Software-ID operation is initiated by writing the  
Read-Software-ID command. Following the command, the  
device will output the manufacturer’s ID and device ID from  
the addresses shown in Table 9. Any other valid command  
will terminate the Read-Software-ID operation.  
The Status register may be read to determine when a Sec-  
tor-/Block-Erase or Program completes, and whether the  
operation completed successfully. The Status register may  
be read at any time by writing the Read-Status-Register  
command. After writing this command, all subsequent  
Read operations will return data from the Status register  
until another valid command is written.  
The Read-Software-ID command is the same as the Read-  
Security-ID command. See “Security ID Commands” on  
page 20.  
The default value of the Status register after device power-  
up or reset is 80H.  
Clear-Status-Register Command  
The user can reset the Status register’s Block Protect Sta-  
tus (BPS) bit to 0 by issuing a Clear-Status-Register com-  
mand. Device power-up and hardware reset will also reset  
BPS to 0.  
TABLE 10: SOFTWARE STATUS REGISTER  
Bit Name  
Function  
0
1
RES  
BPS  
Reserved for future use  
Block Protect Status  
The Block Write-Lock bit should be interrogated only after Erase or Program command is issued.  
It informs the system whether or not the selected block is locked.  
BPS does not provide a continuous indication of Write-Lock bit value.  
0: Block Unlocked  
1: Operation Aborted, Block Write-Lock bit set.  
2:5 RES  
Reserved for future use  
6
ESS  
Erase Suspend Status  
0: Erase in progress/completed  
1: Erase suspended  
7
WSMS Write State Machine Status  
Check WSMS to determine erase or program completion.  
0: Busy  
1: Ready  
T10.0 1292  
©200 Silicon Storage Technology, Inc.  
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1/06  
18  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Sector-/Block-Erase Command  
Erase-Suspend/  
Erase-Resume Commands  
The Erase Command operates on one sector or block at a  
time. This command requires an (arbitrary) address within  
the sector or block to be erased. Note that a Sector/Block  
Erase operation changes all Sector/Block byte data to FFh.  
If a Read operation is performed after issuing the erase  
command, the device will automatically output Status Reg-  
ister data. The system can poll the Status Register in order  
to verify the completion of the Sector/Block Erase operation  
(please refer to Table 10, Status Register Definition). If a  
Sector/Block Erase is attempted on a locked block, the  
operation will fail and the data in the Sector/Block will not be  
changed. In this case, the Status Register will report the  
error (BPS=1).  
The Erase Suspend command allows Sector-Erase or  
Block-Erase interruption in order to read or program data  
in another block of memory. Once the Erase-Suspend  
command is executed, the device will suspend any on-  
going Erase operation within time TES (10 µs). The device  
outputs status register data when read after the Erase-  
Suspend command is written. The system is able to deter-  
mine when the Erase operation has been completed  
(WSMS=1) by polling the status register. After an Erase-  
Suspend, the device will set the status register ESS bit  
(ESS=1) if the Erase has been successfully suspended  
(refer to Table 10, “Software Status Register”). The Erase-  
Resume command resumes the Erase operation that had  
been previously suspended.  
Program Command  
The Program command operates on multiple bytes as  
shown in Table 5. This command specifies the address and  
data to be programmed. During the Program operation the  
device automatically outputs the Status Register data when  
read. The system can poll the Status Register in order to  
verify the completion of the Program operation (refer to  
Table 10, “Software Status Register”). If a Program opera-  
tion is attempted on a locked block, the operation will fail  
and the data in the addressed byte will not be changed. In  
this case, the Status Register will report the error (BPS=1).  
After a successful Erase-Suspend, a Read-Array com-  
mand may be written to read data from a Sector/Block  
other than the suspended Sector/Block. A Program com-  
mand sequence may also be issued during Erase Sus-  
pend to program data in memory locations other than the  
Sector/Block currently in the Erase-Suspend mode. If a  
Read-Array command is written to an address within the  
suspended Sector/Block this may result in reading invalid  
data. If a Program command is written to an address within  
the suspended Sector/Block the command is acknowl-  
edged but rejected. Other valid commands while erase is  
suspended include Read-Status-Register, Read-Device-  
ID, and Erase-Resume.  
Program-/Erase-Suspend or  
Program-/Erase-Resume Operations  
The Erase-Resume command resumes the Erase process  
in the suspended sector or block. After the Erase-Resume  
command is written, the device will continue the Erase pro-  
cess. Erase cannot resume until any Program operation ini-  
tiated during Erase-Suspend has completed. Suspended  
operations cannot be nested: the system needs to com-  
plete or resume any previously suspended operation  
before a new operation can be suspended. See Figure 7  
for flowchart.  
The Program-Suspend and Erase-Suspend operations  
share the same software command sequence (B0H). The  
Program-Resume and Erase-Resume operations share  
the same software command sequence (D0H). See Table  
8, “Software Command Sequence” on page 17.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
19  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Program-Suspend/  
Program-Resume Command  
Erase Sector/Block  
The Program-Suspend and Program-Resume commands  
have no influence on the device. Since the device requires  
a maximum of TBP (10 µs) in order to program a byte (see  
Table 27), when a Program-Suspend command is written,  
the suspended Byte Program operation will always be suc-  
cessfully completed within the suspend latency time (TES =  
TBP = 10 µs).  
Write B0H to any valid  
device memory address  
Erase-Suspend  
Command  
Write 70H to any valid  
device memory address  
Read-Status-Register  
Command  
Security ID Commands  
Read Status Register  
The SST49LF00xC device offers a 256-bit Security ID  
space. The Security ID space is divided into two parts. One  
64-bit segment is programmed at SST with a unique 64-bit  
number: this number cannot be changed by the user. The  
other segment is 192-bit wide and is left blank: this space is  
available for customers and can be programmed as  
desired.  
No  
WSMS = 1  
Yes  
The User-Security-ID-Program command is shown in  
Table 8, “Software Command Sequence”. Use the memory  
addresses specified in Table 11 for Security ID program-  
ming. Once the customer segment is programmed, it can  
be locked to prevent any alteration. The User-Security-ID-  
Program-Lockout command is shown in Table 8, “Software  
Command Sequence”.  
Erase Completed  
ESS = 1  
Yes  
No  
Write the Read-Array  
command to read from  
another Sector/Block  
or  
In order to read the Security ID information, the user can  
issue a Read Security ID Command (90H) to the device. At  
this point the device enters the Read-Software-ID/Read-  
Security-ID mode. The Security ID information can be read  
at the memory addresses in Table 11.  
Write the Program  
command to program  
another Sector/Block  
No  
Finished?  
Yes  
A Read-Array/Reset command (FFH) must then be issued  
to the device in order to exit the Read-Software-ID/Read-  
Security-ID mode and return to Read-Array mode.  
Erase-Resume  
Command  
An alternate method to read the Security ID information is  
to read the Security ID registers located into the register  
space as described in the “Security ID Registers” section.  
Write D0H to any valid  
device memory address  
Erase Resumed  
1292 FC_Erase-Sus.0  
FIGURE 7: ERASE-SUSPEND FLOW CHART  
TABLE 11: SECURITY ID ADDRESSES  
Address Range1  
Security ID Segment  
Size  
FFFC 0180 to FFFC 0187  
FFFC 0188 to FFFC 019F  
Factory-Programmed  
User-Programmed  
8 bytes – 64 bit  
24 bytes – 192 bit  
T11.0 1292  
1. Address shown is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory map depending  
on ID strapping values on ID[3:0} pins according with multiple device selection mechanism.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
20  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
REGISTERS  
There are five types of registers available on the  
SST49LF00xC, the multi-byte Read/Write configuration  
registers, General Purpose Inputs registers, Block Locking  
registers, Security ID register, and the JEDEC ID registers.  
These registers appear at their respective address location  
in the 4 GByte system memory map. Unused register loca-  
tions will read as 00H. Any attempt to read or write any reg-  
ister during an internal Write operation will be ignored.  
In case of multi-byte Firmware Memory register reads, the  
device will return register data for the addressed register  
until the command finishes, or is aborted.  
General Purpose Inputs Register  
The General Purpose Inputs register (GPI_REG) passes  
the state of GPI[4:0] pins on the SST49LF00xC. It is rec-  
ommended that the GPI[4:0] pins be in the desired state  
before LFRAME# is brought low for the beginning of the  
bus cycle, and remain in that state until the end of the cycle.  
There is no default value since this is a pass-through regis-  
ter. The GPI_REG register for the boot device appears at  
FFBC0100H in the 4 GByte system memory map, and will  
appear elsewhere if the device is not the boot device (see  
Table 12). This register is not available to be read when the  
device is in an Erase/Program operation. In case of multi-  
byte Firmware Memory cycle register reads, the device will  
return register data for the addressed register until the com-  
mand finishes, or is aborted.  
Read or write access to the register during an internal Pro-  
gram/Erase operation will be completed as follows:  
Multi-byte Read/Write Configuration registers,  
General Purpose Inputs register, and Block Lock-  
ing registers can be accessed normally  
Security ID register and the JEDEC ID registers  
can not be accessed (reading these registers will  
return unused register data 00H).  
Multi-Byte Read/Write Configuration Reg-  
isters (Firmware Memory Cycle)  
The multi-byte read/write configuration (MBR) registers are  
four 8-bit read-only registers located at addresses  
FFBC0005-FFBC0008 for boot configured device (see  
Table 13). These registers are accessible using Firmware  
Memory Read cycle only. These registers contain informa-  
tion about multi-byte read and write access sizes that will  
be accepted for Firmware Memory multi-byte Read com-  
mands. The registers are not available in AAI mode.  
TABLE 12: GENERAL PURPOSE REGISTER  
Default  
Register  
Register Address1  
Value  
Access  
GPI_REG  
FFBC 0100H  
N/A  
R
T12.0 1292  
1. Address shown in this column is for boot device only.  
Address locations should appear elsewhere in the 4  
GByte system memory map depending on ID strapping  
values on ID[3:0] pins according with multiple device  
selection mechanism.  
TABLE 13: MULTI-BYTE READ/WRITE CONFIGURATION REGISTERS  
Register  
Register Address1  
FFBC 0005H  
FFBC 0006H  
FFBC 0007H  
FFBC 0008H  
Data  
Access Description  
MULTI_BYTE_READ_L  
MULTI_BYTE_READ_H  
MULTI_BYTE_WRITE_L  
MULTI_BYTE_WRITE_H  
0100 1011b  
0000 0000b  
0000 0011b  
0000 0000b  
R
R
R
R
Device supports 1,2,4, 16, 128 Byte reads  
Future Expansion for Read  
Device supports 1, 2, 4 Byte Write  
Future Expansion for Write  
T13.0 1292  
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory  
map depending on ID strapping values on ID[3:0] pins when multiple LPC memory devices are used in a system.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
21  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
SST49LF00xC also provides PDA Sector Locking Regis-  
ters at addresses shown in Table 15. These locking regis-  
ters can be accessed only after Open Protected Area  
command is executed. After Hide Protected Area com-  
mand, as well as after Power On and Reset, read from  
addresses specified in Table 15 returns unused register  
space data 00H, and write to these addresses is ignored.  
Block and PDA Sector Locking Registers  
SST49LF00xC provides software controlled lock protection  
through a set of Block Locking registers. The Block Locking  
registers are read/write registers and they are accessible  
through standard addressable memory locations specified  
in Table 14. Unused register locations will return 00H if  
read.  
In case of multi-byte read of any locking register, the device  
will return register data for the addressed register until the  
command finishes, or is aborted.  
In case of multi-byte register reads with Firmware Memory  
cycle, the device will return register data for the addressed  
register until the command finishes, or is aborted.  
TABLE 14: BLOCK LOCKING REGISTERS  
Block  
Protected Memory Address1 Range  
Memory Map  
Register  
Size  
16K  
8K  
SST49LF004C  
SST49LF008C  
Register Address1  
T_BLOCK_LK  
07FFFFH-07C000H  
07BFFFH-07A000H  
079FFFH-078000H  
077FFFH-070000H  
06FFFFH-060000H  
05FFFFH-050000H  
04FFFFH-040000H  
03FFFFH-030000H  
02FFFFH-020000H  
01FFFFH-010000H  
00FFFFH-000000H  
0FFFFFH-0FC000H  
0FBFFFH-0FA000H  
0F9FFFH-0F8000H  
0F7FFFH-0F0000H  
0EFFFFH-0E0000H  
0DFFFFH-0D0000H  
0CFFFFH-0C0000H  
0BFFFFH-0B0000H  
0AFFFFH-0A0000H  
09FFFFH-090000H  
08FFFFH-080000H  
07FFFFH-070000H  
06FFFFH-060000H  
05FFFFH-050000H  
04FFFFH-040000H  
03FFFFH-030000H  
02FFFFH-020000H  
01FFFFH-010000H  
00FFFFH-000000H  
FFBFC002H  
FFBFA002H  
FFBF8002H  
FFBF0002H  
FFBE0002H  
FFBD0002H  
FFBC0002H  
FFBB0002H  
FFBA0002H  
FFB90002H  
FFB80002H  
FFB70002H  
FFB60002H  
FFB50002H  
FFB40002H  
FFB30002H  
FFB20002H  
FFB10002H  
FFB00002H  
T_MINUS01_LK  
T_MINUS02_LK  
T_MINUS03_LK  
T_MINUS04_LK  
T_MINUS05_LK  
T_MINUS06_LK  
T_MINUS07_LK  
T_MINUS08_LK  
T_MINUS09_LK  
T_MINUS10_LK  
T_MINUS11_LK  
T_MINUS12_LK  
T_MINUS13_LK  
T_MINUS14_LK  
T_MINUS15_LK  
T_MINUS16_LK  
T_MINUS17_LK  
T_MINUS18_LK  
8K  
32K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
64K  
T14.0 1292  
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory  
map depending on ID strapping values on ID[3:0] pins when multiple LPC memory devices are used in a system.  
TABLE 15: PROTECTED DATA AREA SECTOR LOCKING REGISTERS  
SST49LF00xC PDA Protected Addresses1  
Sector  
Size  
Memory Map  
Register  
For Write Access  
For Read Access  
Register Address1  
T_PDA2_LK  
T_PDA1_LK  
T_PDA0_LK  
4K  
4K  
4K  
FFFC A000H–FFFC AFFFH  
FFFC 9000H–FFFC 9FFFH  
FFFC 8000H–FFFC 8FFFH  
FFBC A000H–FFBC AFFFH  
FFBC 9000H–FFBC 9FFFH  
FFBC 8000H–FFBC 8FFFH  
FFBC 2202H  
FFBC 1202H  
FFBC 0202H  
T15.0 1292  
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory  
map depending on ID strapping values on ID[3:0] pins when multiple LPC memory devices are used in a system.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
22  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
TABLE 16: BLOCK/PDA SECTOR LOCKING REGISTER BITS  
Reserved Bit Read-Lock Bit Lock-Down Bit Write-Lock Bit  
[7:3]  
[2]  
[1]  
[0]  
Lock Status  
00000  
00000  
00000  
00000  
00000  
00000  
00000  
00000  
0
0
0
Full Access  
0
0
1
Write Locked (Default State at Power-Up)  
Locked Open (Full Access Locked Down)  
Write Locked Down  
0
1
0
0
1
1
1
0
0
Block Read Locked (Registers alterable)  
Block Read & Write Lock (Registers alterable)  
Block Read Locked Down (Registers not alterable)  
1
0
1
1
1
0
1
1
1
Block Read & Write lock Down (Registers not alterable)  
T16.0 1292  
Write-Lock Bit  
Lock-Down Bit  
The Write-Lock bit, bit 0, controls the lock state described  
in Table 16. The default Write status of all blocks after  
power up is write locked. When bit 0 of the Block Locking  
register is set, Program and Erase operations for the corre-  
sponding block are prevented. Clearing the Write-Lock bit  
will unprotect the block. The Write-Lock bit must be cleared  
prior to starting a Program or Erase operation since it is  
sampled at the beginning of the operation. The Write-Lock  
bit functions in conjunction with the hardware Write Lock  
pin TBL# for the top Boot Block. When TBL# is low, it over-  
rides the software locking scheme. The top Boot Block  
Locking register does not indicate the state of the TBL#  
pin. The Write-Lock bit functions in conjunction with the  
hardware WP#/AAI pin for the remaining blocks (Blocks 0  
to 17 for 49LF008C and Blocks 0 to 9 for 49LF004C).  
When WP#/AAI is low, it overrides the software locking  
scheme. The Block Locking register does not indicate the  
state of the WP#/AAI pin.  
The Lock-Down bit, bit 1, controls the Block Locking regis-  
ter as described in Table 16. When in LPC interface mode,  
the default Lock Down status of all blocks upon power-up is  
not locked down. Once the Lock-Down bit is set, any future  
attempted changes to that Block Locking register will be  
ignored. The Lock-Down bit is only cleared upon a device  
reset with RST# or INIT# or power down. Current Lock  
Down status of a particular block can be determined by  
reading the corresponding Lock-Down bit. Once a block’s  
Lock-Down bit is set, the Read-Lock and Write-Lock bits for  
that block can no longer be modified: the block is locked  
down in its current state of read/write accessibility.  
Read-Lock Bit  
The default read status of all blocks upon power-up is read-  
unlocked. When a block’s read lock bit is set, data cannot  
be read from that block. An attempted read from a read-  
locked block will result in the data 00h. The read lock status  
can be unlocked by clearing the read lock bit: this can only  
be done provided that the block is not locked down. The  
current read lock status of a particular block can be deter-  
mined by reading the corresponding read-lock bit.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
23  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
Security ID Registers  
The SST49LF0xxC devices offer a 256-bit Security ID reg-  
ister space. The Security ID space is divided into two seg-  
ments - one (64 bits) factory programmed segment and  
one (192 bits) user programmed segment. The first seg-  
ment is programmed and locked at SST with a unique 64-  
bit number. The user segment (192-bits) is left blank (FFH)  
for the customer to be programmed as desired. The user  
can use standard Register read cycles to read the Security  
ID space, or use the Security ID Program command to pro-  
gram the space. Refer to Table 8, “Software Command  
Sequence” for more details.  
The Write Lock-out status of the Security ID space can be  
read from the SEC_ID_WRITE_LOCK register (see Table  
17). The SEC_ID_WRITE_LOCK register is a “read only”  
register that is accessible at the address location specified  
in Table 14. In the case of multi-byte register reads with  
Firmware Memory cycle, for SEC_ID_WRITE_LOCK reg-  
ister, the device will return register data for the addressed  
register until the command finishes, or is aborted.  
In the case of multi-byte register reads with Firmware Mem-  
ory cycle, for the all the SEC_ID_BYTE registers, the  
device will return page-aligned sequential register data with  
wrap-around until the command finishes, or is aborted.  
The Security ID Information and its Write Lock/Unlock sta-  
tus can be Read in the Register Access Space for Execute-  
In-Place (XIP) type of applications. (See Table 17.)  
TABLE 17: SECURITY ID REGISTERS  
Register  
Register Address1  
Value  
Access  
Description  
SEC_ID__WRITE_LOCK  
FFBC0102H  
0000 0000b  
0000 0001b  
R
Write Unlocked  
Write Locked  
SEC_ID_BYTE_0  
SEC_ID_BYTE_1  
SEC_ID_BYTE_2  
SEC_ID_BYTE_3  
FFBC0180H  
FFBC0181H  
FFBC0182H  
FFBC0183H  
R
R
R
R
R
R
R
R
R
Factory Programmed  
Factory Programmed  
Factory Programmed  
Factory Programmed  
SEC_ID_BYTE_7  
SEC_ID_BYTE_8  
SEC_ID_BYTE_9  
FFBC0187H  
FFBC0188H  
FFBC0189H  
Factory Programmed  
User Programmed  
User Programmed  
SEC_ID_BYTE_30  
SEC_ID_BYTE_31  
FFBC019EH  
FFBC019FH  
User Programmed  
User Programmed  
T17.0 1292  
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4GByte system memory  
map depending on ID strapping values on ID[3:0] pins according with multiple device selection mechanism.  
TABLE 18: JEDEC ID REGISTERS  
JEDEC ID Registers  
Register  
Default  
Value  
The JEDEC ID registers for the boot device appear at  
FFBC0000H and FFBC0001H in the 4 GByte system  
memory map, and will appear elsewhere if the device is not  
the boot device. This register is not available to be read  
when the device is in Erase/Program operation. Unused  
register location will read as 00H. See Table 18 for the  
JEDEC device ID code. In case of multi-byte register reads  
with Firmware Memory cycle, the device will return register  
data for the addressed register until the command finishes,  
or is aborted.  
Register  
Address1  
Access  
MANUF_REG  
DEV_REG  
FFBC 0000H  
BFH  
R
SST49LF004C  
SST49LF008C  
FFBC 0001H  
FFBC 0001H  
54H  
59H  
R
T18.0 1292  
1. Address shown in this column is for boot device only.  
Address locations should appear elsewhere in the 4  
GByte system memory map depending on ID strapping  
values on ID[3:0] pins when multiple LPC memory  
devices are used in a system.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
24  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
AUTO-ADDRESS INCREMENT (AAI) MODE  
AAI Mode with Multi-byte Programming  
AAI mode with multi-byte programming is provided for high-  
speed production programming. Auto-Address Increment  
mode requires only one address load for each 128-byte  
page of data. The Multi-Byte Programming feature allows  
simultaneous multi-byte programming. Note: The Security  
ID area and the Protected Data Area cannot be pro-  
grammed using AAI mode.  
Data will be accepted by the device as long as LD# is low  
and RY/BY# is high (until the last byte of the 128-byte page  
has been entered). For partial data-loads (i.e., less than  
128 Bytes), LD# may be taken high (VIH) to end the data  
loading. If LD# goes high before the full 128-byte page has  
been entered, the device will program the data which has  
been entered to that point, and then terminate the AAI  
page programming command. Any incompletely loaded  
data byte (nibble) will not be programmed. The device will  
signify completion of the command by driving RY/BY# high.  
Once RY/BY# goes high, LD# can be taken low to begin a  
new AAI programming operation at a different address  
location.  
Taking the WP#/AAI pin to the Supervoltage VH enables  
the AAI mode. The AAI command is started as a normal  
Firmware Memory cycle. LD# should be low (VIL) as long  
as data is being loaded into the device. In the MADDR field,  
the host may input any address within the 128-byte page to  
be programmed. The least significant seven bits of the  
address field will be ignored and the device will begin pro-  
gramming at the beginning of the 128-byte page (i.e., the  
address will be page-aligned). The device Ready/Busy sta-  
tus is output on the RY/BY# pin.  
The RY/BY# pin will stay low while internal programming  
completes. When the entire 128-byte page has been pro-  
grammed, the device will return to the idle mode and the  
RY/BY# pin will go high (VIH) to indicate the AAI command  
has been completed.  
Data is accepted until the internal buffer is full. At that point  
RY/BY# goes low (busy) to indicate that the internal buffer  
is full and cannot accept any more data. When the device  
is ready, RY/BY# pin goes high and indicates to the host  
that more data (the next group of bytes) can be accepted  
by the internal data buffer (see Table 19 and Figure 8).  
TABLE 19: LD# INPUT AND RY/BY# STATUS IN  
AAI MODE  
LD# RY/BY# RY/BY#  
state status  
Flag indication  
L
H
Device is Ready, can accept more data  
until the last (128th) byte.  
LD# is taken high by the host after loading the final byte(s)  
of the 128-byte page. the RY/BY# signal remains low until  
the completion of internal programming. After the comple-  
tion of programming, the part will go into idle mode and the  
RY/BY# will go high indicating that the AAI command has  
been completed (see Table 19). A subsequent AAI com-  
mand may be initiated to begin programming the next 128-  
byte page.  
L
L
L
Device is Busy, cannot accept more data  
H
Device is Ready for next operation if  
previous data is the last (128th) byte.  
H
H
H
L
Device is Ready for next operation  
Device is Busy programming  
T19.0 1292  
The user may terminate AAI programming by dropping the  
WP#/AAI pin to TTL levels (VIH/VIL) as long as LD# is high  
and RY/BY# returns to high indicating the completion of the  
AAI cycle. Software block-locking will be disabled in AAI  
mode (all blocks will be write-unlocked). If AAI drops below  
the Supervoltage VH before RY/BY# returns to high (and  
LD# high), the contents of the page may be indeterminate.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
25  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
AAI Data Load Protocol  
TABLE 20: AAI PROGRAMMING CYCLE (INITIATED WITH WP#/AAI AT VH ONLY)  
Clock Cycle Field Name  
Field Contents  
LAD[3:0]  
Comments  
1
2
START  
IDSEL  
1110  
IN  
LFRAME# must be active (low) for the part to respond.  
Only the last start field (before LFRAME# transitions  
high) should be recognized. The START field contents  
indicate a Firmware Memory Write cycle. (1110b)  
0000b to 1111b  
IN  
IN  
ID works identically to Firmware Memory cycle.  
This field indicates which SST49LF00xC device should  
respond. If the IDSEL (ID select) field matches the  
value of ID[3:0], then that particular device will  
respond to the whole bus cycle.  
3-9  
MADDR  
YYYY  
These seven clock cycles make up the 28-bit memory  
address. YYYY is one nibble of the entire address.  
Addresses are transferred most-significant nibble first.  
Only bits [19:7] for 8M, [18.7] for 4M of the total  
address [27:0] are used for AAI mode. The rest are  
“don’t care”.  
10  
MSIZE  
DATA  
KKKK  
ZZZZ  
IN  
IN  
MSIZE field is don’t care when in AAI mode  
11-266  
Data is transmitted to the device least significant nib-  
ble first, from byte 0 to byte 127 as long as the RY/BY#  
is high and LD# low. The host will pause the clock and  
data stream when RY/BY# goes low until it returns  
high, signifying that the chip is ready for more data  
T20.0 1292  
V
H
WP#/AAI  
1
2
3
4
5
6
7
8
9 10 11 12  
264 266  
LCLK  
(Data Strobe Input)  
LFRAME#  
Start  
MADDR  
DATA  
DATA  
Byte N  
DATA  
DATA  
DATA DATA  
Address  
LAD[3:0]  
LD#  
MSIZE  
Byte 0  
Byte  
N+1  
Byte  
2N  
Byte  
126  
Byte  
127  
IDSEL  
RY/BY#  
1292 F08.0  
FIGURE 8: AAI Load Protocol Waveform  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
26  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
ELECTRICAL SPECIFICATIONS  
The AC and DC specifications for the LPC interface signals (LAD[3:0], LFRAME#, LCLCK and RST#) as defined in Section  
4.2.2.4 of the PCI local Bus specification, Rev. 2.1. Refer to Table 21 for the DC voltage and current specifications. Refer to  
Table 25 through Table 27 for the AC timing specifications for Clock, Read, Write, and Reset operations.  
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum  
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation  
of the device at these conditions or conditions greater than those defined in the operational sections of this data  
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)  
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C  
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V  
Transient Voltage (<20 ns) on Any Pin (except WP#/AAI) to Ground Potential1 . . . . . . . . . . . . . . -2.0V to VDD+2.0V  
Voltage on WP#/AAI Pin to Ground Potential2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 11.0V  
Package Power Dissipation Capability (TA=25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W  
Surface Mount Solder Reflow Temperature3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds  
Output Short Circuit Current4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
1. Do not violate processor or chipset specification regarding INIT# voltage.  
2. The maximum DC voltage on WP#/AAI pin may reach 11V for periods <20ns.  
3. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions.  
Certain with-Pb 32-PLCC package types are capable of 240°C for 10 seconds; please consult the factory for the latest information.  
4. Outputs shorted for no more than one second. No more than one output shorted at a time.  
OPERATING RANGE  
Range  
Ambient Temp  
VDD  
Commercial  
0°C to +85°C  
3.0-3.6V  
AC CONDITIONS OF TEST  
Input Rise/Fall Time . . . . . . . . . . . . . . . 3 ns  
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF  
See Figure 14  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
27  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
DC Characteristics  
TABLE 21: DC OPERATING CHARACTERISTICS (ALL INTERFACES)  
Limits  
Symbol Parameter  
Min  
Max  
Units Test Conditions  
1
IDD  
Active VDD Current  
LCLK (LPC mode)=VILT/VIHT at f=33 MHz  
All other inputs=VIL or VIH  
Read  
18  
40  
mA All outputs = open, VDD=VDD Max  
mA f=33 MHz  
Single-/Dual-Byte Program, Erase  
Quad-Byte Program  
60  
mA f=33 MHz  
ISB  
Standby VDD Current  
(LPC Interface)  
100  
µA  
LCLK (LPC mode)=VILT/VIHT at f=33 MHz  
LFRAME#=.9VDD, f=33 MHz,  
VDD=VDD Max  
All other inputs 0.9 VDD or 0.1 VDD  
2
IRY  
Ready Mode VDD Current  
10  
mA  
LCLK (LPC mode)=VILT/VIHT at f=33 MHz  
LFRAME#=VIL, f=33 MHz, VDD=VDD Max  
All other inputs 0.9 VDD or 0.1 VDD  
II  
Input Leakage Current for ID[3:0] pins  
Input Leakage Current  
Output Leakage Current  
Supervoltage Current for WP#/AAI  
Supervoltage for WP#/AAI  
INIT# Input High Voltage  
INIT# Input Low Voltage  
Input Low Voltage  
200  
1
µA  
µA  
µA  
µA  
V
VIN=GND to VDD, VDD=VDD Max  
VIN=GND to VDD, VDD=VDD Max  
VOUT=GND to VDD, VDD=VDD Max  
ILI  
ILO  
IH  
1
200  
VH  
VIHI  
8.5  
1.1  
9.5  
3
VDD+0.5  
0.4  
V
VDD=VDD Max  
3
VILI  
VIL  
-0.5  
-0.5  
V
VDD=VDD Min  
0.3 VDD  
V
VDD=VDD Min  
VIH  
VOL  
Input High Voltage  
0.5 VDD VDD+0.5  
0.1 VDD  
V
VDD=VDD Max  
Output Low Voltage  
V
IOL=1500 µA, VDD=VDD Min  
IOH=-500 µA, VDD=VDD Min  
VOH  
Output High Voltage  
0.9 VDD  
V
T21.0 1292  
1. IDD active while a Read or Write (Program or Erase) operation is in progress.  
2. The device is in Ready mode when no activity is on the LPC bus.  
3. Do not violate processor or chipset specification regarding INIT# voltage.  
TABLE 22: RECOMMENDED SYSTEM POWER-UP TIMINGS  
Symbol  
Parameter  
Minimum  
100  
Units  
µs  
1
TPU-READ  
Power-up to Read Operation  
Power-up to Write Operation  
1
TPU-WRITE  
100  
µs  
T22.0 1292  
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter  
TABLE 23: PIN CAPACITANCE (VDD=3.3V, TA=25 °C, f=1 Mhz, other pins open)  
Parameter  
Description  
Test Condition  
VI/O=0V  
Maximum  
12 pF  
1
CI/O  
I/O Pin Capacitance  
Input Capacitance  
Pin Inductance  
1
CIN  
VIN=0V  
12 pF  
2
LPIN  
20 nH  
T23.0 1292  
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.  
2. Refer to PCI spec.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
28  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
TABLE 24: RELIABILITY CHARACTERISTICS  
Minimum  
Symbol  
Parameter  
Endurance  
Data Retention  
Latch Up  
Specification  
Units  
Cycles  
Years  
mA  
Test Method  
1
NEND  
10,000  
100  
JEDEC Standard A117  
JEDEC Standard A103  
JEDEC Standard 78  
1
TDR  
1
ILTH  
100 + IDD  
T24.0 1292  
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.  
TABLE 25: CLOCK TIMING PARAMETERS (LPC MODE)  
Symbol  
TCYC  
THIGH  
TLOW  
-
Parameter  
Min  
30  
11  
11  
1
Max  
Units  
ns  
Cycle Time  
LCLK High Time  
ns  
LCLK Low Time  
ns  
LCLK Slew Rate (peak-to-peak)  
RST# or INIT# Slew Rate  
4
V/ns  
-
50  
mV/ns  
T25.0 1292  
T
CYC  
T
HIGH  
0.6 V  
DD  
T
LOW  
0.5 V  
DD  
0.4 V  
(minimum)  
p-to-p  
DD  
0.4 V  
DD  
0.3 V  
DD  
0.2 V  
DD  
1292 F09.0  
FIGURE 9: LCLK WAVEFORM (LPC MODE)  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
29  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
TABLE 26: RESET TIMING PARAMETERS, VDD=3.0-3.6V (LPC MODE)  
Symbol  
TPRST  
TRSTP  
TRSTF  
Parameter  
Min  
100  
100  
Max  
Units  
VDD stable to Reset High  
µs  
RST# Pulse Width  
ns  
ns  
RST# Low to Output Float  
RST# High to LFRAME# Low  
RST# Low to reset during Sector-/Block-Erase or Program  
48  
10  
1
TRST  
5
LCLK cycles  
TRSTE  
µs  
T26.0 1292  
1. There will be a latency due to TRSTE if a reset procedure is performed during a Program or Erase operation,  
V
DD  
T
PRST  
T
RSTP  
RST#/INIT#  
Sector-/Block-Erase  
T
RSTE  
or Program operation  
aborted  
T
RST  
T
RSTF  
LAD[3:0]  
LFRAME#  
1292 F10.0  
FIGURE 10: RESET TIMING DIAGRAM (LPC MODE)  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
30  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
AC Characteristics  
TABLE 27: READ/WRITE CYCLE TIMING PARAMETERS, VDD=3.0-3.6V (LPC MODE)  
Symbol  
TCYC  
TSU  
Parameter  
Min  
30  
7
Max  
Units  
ns  
Clock Cycle Time  
Data Set Up Time to Clock Rising  
Clock Rising to Data Hold Time  
Clock Rising to Data Valid  
Byte Programming Time  
ns  
TDH  
0
ns  
1
TVAL  
2
11  
10  
25  
25  
10  
ns  
TBP  
TSE  
TBE  
TES  
TON  
TOFF  
µs  
Sector-Erase Time  
ms  
ms  
µs  
Block-Erase Time  
Program/Erase-Suspend Latency  
Clock Rising to Active (Float to Active Delay)  
Clock Rising to Inactive (Active to Float Delay)  
2
ns  
28  
ns  
T27.0 1292  
1. Minimum and maximum times have different loads. See PCI spec  
TABLE 28: AC INPUT/OUTPUT SPECIFICATIONS (LPC MODE)  
Symbol  
IOH(AC)  
Parameter  
Min  
Max  
Units  
mA  
Conditions  
Switching Current High  
-12 VDD  
0 < VOUT 0.3VDD  
0.3VDD < VOUT < 0.9VDD  
0.7VDD < VOUT < VDD  
VOUT = 0.7VDD  
-17.1(VDD-VOUT  
)
mA  
Equation C1  
-32 VDD  
(Test Point)  
mA  
IOL(AC)  
Switching Current Low  
16 VDD  
26.7 VOUT  
Equation D1  
mA  
mA  
VDD >VOUT 0.6VDD  
0.6VDD > VOUT > 0.1VDD  
0.18VDD > VOUT > 0  
(Test Point)  
38 VDD  
mA  
mA  
VOUT = 0.18VDD  
ICL  
Low Clamp Current  
High Clamp Current  
Output Rise Slew Rate  
Output Fall Slew Rate  
-25+(VIN+1)/0.015  
-3 < VIN -1  
ICH  
25+(VIN-VDD-1)/0.015  
mA  
VDD+4 > VIN VDD+1  
0.2VDD-0.6VDD load  
0.6VDD-0.2VDD load  
slewr2  
slewf2  
1
1
4
4
V/ns  
V/ns  
T28.0 1292  
1. See PCI spec.  
2. PCI specification output load is used.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
31  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
V
V
TH  
TL  
V
TEST  
LCLK  
T
VAL  
LAD [3:0]  
(Valid Output Data)  
LAD [3:0]  
(Float Output Data)  
T
ON  
T
OFF  
1292 F11.0  
FIGURE 11: OUTPUT TIMING PARAMETERS (LPC MODE)  
V
V
TH  
TL  
V
LCLK  
TEST  
T
SU  
T
DH  
LAD [3:0]  
(Valid Input Data)  
Inputs  
Valid  
V
MAX  
1292 F12.0  
FIGURE 12: INPUT TIMING PARAMETERS (LPC MODE)  
TABLE 29: INTERFACE MEASUREMENT CONDITION PARAMETERS (LPC MODE)  
Symbol  
Value  
0.6 VDD  
0.2 VDD  
0.4 VDD  
0.4 VDD  
1
Units  
1,2  
VTH  
V
V
1,2  
VTL  
VTEST  
V
1,2  
VMAX  
V
Input Signal Edge Rate  
V/ns  
T29.0 1292  
1. The input test environment is done with 0.1 VDD of overdrive over VIH and VIL. Timing parameters must be met with no more over-  
drive than this. VMAX specifies the maximum peak-to-peak waveform allowed for measuring input timing. Production testing may use  
different voltage values, but must correlate results back to these parameters.  
2. In the case of multi-byte read, VTL = 0.1 VDD and VTH = 0.9VDD  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
32  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
V
H
WP#/AAI  
T
ACYC  
V
V
TH  
TL  
V
TEST  
LCLK  
T
ASU  
T
ADH  
LAD [3:0]  
(Valid Input Data)  
V
Inputs Valid  
MAX  
T
LDSU  
T
LDDH  
LD#  
T
RB  
RY/BY#  
1292 F13.0  
FIGURE 13: INPUT TIMING PARAMETERS (AAI MODE)  
TABLE 30: INPUT CYCLE TIMING PARAMETERS, VDD=3.0-3.6V (AAI MODE)  
Symbol  
TACYC  
TASU  
Parameter  
Min  
135  
25  
Max  
Units  
ns  
Clock Cycle Time  
Data Set Up Time to Clock Rising  
Clock Rising to Data Hold Time  
RY/BY# LD# Falling  
LD# Set Up Time  
ns  
TADH  
25  
ns  
TRB  
25  
ns  
TLDSU  
TLDDH  
25  
ns  
LD# Hold Time  
25  
ns  
T30.0 1292  
TO TESTER  
TO DUT  
C
L
1292 F15.0  
FIGURE 14: A TEST LOAD EXAMPLE  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
33  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
PRODUCT ORDERING INFORMATION  
SST49LF 008C  
-
33  
-
4C  
-
WH E  
SST49LF xxxC  
-
XXX  
-
XX  
-
XX X  
Environmental Attribute  
E1 = non-Pb  
Package Modifier  
H = 32 leads  
Package Type  
N = PLCC  
W = TSOP (type 1, die up, 8mm x 14mm)  
Temperature Range  
C = Commercial = 0°C to +85°C  
Minimum Endurance  
4 = 10,000 cycles  
Operating Frequency  
33 = 33 MHz  
Device Density  
008 = 8 Mbit  
004 = 4 Mbit  
Voltage  
L = 3.0-3.6V  
Product Series  
49 = LPC Serial Flash  
1. Environmental suffix “E” denotes non-Pb solder.  
SST non-Pb solder devices are “RoHS Compliant”.  
Valid combinations for SST49LF004C  
SST49LF004C-33-4C-NHE SST49LF004C-33-4C-WHE  
Valid combinations for SST49LF008C  
SST49LF008C-33-4C-NHE SST49LF008C-33-4C-WHE  
Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales  
representative to confirm availability of valid combinations and to determine availability of new combinations.  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
34  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
BOTTOM VIEW  
PACKAGING DIAGRAMS  
TOP VIEW  
SIDE VIEW  
.495  
.485  
.112  
.106  
.453  
.447  
Optional  
Pin #1  
Identifier  
.048  
.042  
.029  
.023  
.040  
.030  
.020 R.  
MAX.  
x 30˚  
R.  
2
1
32  
.042  
.048  
.021  
.013  
.400  
BSC  
.530  
.490  
.595 .553  
.585 .547  
.032  
.026  
.050  
BSC  
.015 Min.  
.095  
.075  
.050  
BSC  
.032  
.026  
.140  
.125  
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.  
2. All linear dimensions are in inches (max/min).  
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.  
4. Coplanarity: 4 mils.  
32-plcc-NH-3  
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)  
SST PACKAGE CODE: NH  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
35  
4 Mbit / 8 Mbit LPC Serial Flash  
SST49LF004C / SST49LF008C  
Advance Information  
1.05  
0.95  
Pin # 1 Identifier  
0.50  
BSC  
8.10  
7.90  
0.27  
0.17  
0.15  
0.05  
12.50  
12.30  
DETAIL  
1.20  
max.  
0.70  
0.50  
14.20  
13.80  
0˚- 5˚  
0.70  
0.50  
Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions,  
although some dimensions may be more stringent.  
2. All linear dimensions are in millimeters (max/min).  
3. Coplanarity: 0.1 mm  
32-tsop-WH-7  
1mm  
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.  
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM  
SST PACKAGE CODE: WH  
TABLE 31: REVISION HISTORY  
Revision  
Description  
Date  
00  
Jan 2006  
Initial release of data sheet  
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036  
www.SuperFlash.com or www.sst.com  
©200 Silicon Storage Technology, Inc.  
S71292-00-000  
1/06  
36  

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