SST49LF004C-33-4C-WH [SILICON]
Flash, 512KX8, 11ns, PDSO32, 8 X 14 MM, MO-142BA, TSOP1-32;型号: | SST49LF004C-33-4C-WH |
厂家: | SILICON |
描述: | Flash, 512KX8, 11ns, PDSO32, 8 X 14 MM, MO-142BA, TSOP1-32 光电二极管 |
文件: | 总36页 (文件大小:509K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
004C/008C4 Mb/8 Mb LPC Firmware Flash
Advance Information
FEATURES:
•
•
Organized as 512K x8 / 1M x8
•
Protected Data Area
– 12-KByte Protected Data Area space
– Three 4-KByte User-Programmable flash mem-
ory sectors
– Read-lock, write-lock and lock-down protection
for each sector
Conforms to Intel® LPC Interface Specification v1.1
– Support Multi-Byte Firmware Memory Read/
Write Cycles
Single 3.0-3.6V Read and Write Operations
LPC Mode
– 5-signal LPC bus interface for both in-system
and factory programming using programmer
equipment
– Multi-Byte Read capability allowing 15.6 MB/s
data transfer rate @ 33 MHz PCI clock
- Firmware Memory Read cycle supporting
1, 2, 4, 16, and 128 Byte Read
•
•
•
•
Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
Uniform 4 KByte sectors
– SST49LF004C: 11 Overlay Blocks:
- one 16-KByte Boot Block
- two 8-KByte Parameter Blocks
- one 32-Kbyte Parameter Block
- seven 64-KByte Main Blocks
– SST49LF008C: 19 Overlay Blocks:
- one 16-KByte Boot Block
- Firmware Memory Write cycle supporting
1, 2, and 4 Byte Write
– 33 MHz clock frequency operation
– WP#/AAI and TBL# pins provide hardware Write
protect for entire chip and/or top Boot Block
– Block Locking Registers for individual block Read-
Lock, Write-Lock, and Lock-Down protection
– 5 GPI pins for system design flexibility
– 4 ID pins for multi-chip selection
– Multi-Byte capability registers
(read-only registers)
– Status register for End-of-Write detection
– Program-/Erase-Suspend
Read or Write to other blocks during
Program-/Erase-Suspend
Two-cycle Command Set
Security ID Feature
- two 8-KByte Parameter Blocks
- one 32-Kbyte Parameter Block
- 15 64-KByte Main Blocks
•
•
Fast Sector-Erase/Program Operation
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Program Time: 7 µs (typical)
Auto Address Increment (AAI) for Rapid Factory
Programming (High Voltage Enabled)
– RY/BY# pin for End-of-Write detection
– Multi-Byte Program
– Chip Rewrite Time: (typical)
- SST49LF004C: 1 seconds
- SST49LF008C: 2 seconds
Packages Available
– 32-lead PLCC
– 32-lead TSOP (8mm x 14mm)
All non-Pb (lead-free) devices are RoHS compliant
•
•
– 256-bit Secure ID space
- 64-bit Unique Factory Pre-programmed
Device Identifier
- 192-bit User-Programmable OTP
•
•
•
Low Power Consumption
– Active Read Current: 12 mA (typical)
- Standby Current: 10 µA (typical)
PRODUCT DESCRIPTION
The SST49LF00xC flash memory devices are designed to
interface with host controllers (chipsets) that support a low-
pin-count (LPC) interface for system firmware applications.
The SST49LF00xC device complies with Intel’s LPC Inter-
face Specification 1.1, supporting a Burst-Read (up to 128
bytes in a single operation) which enables a 15.6 MByte
per second data transfer. The LPC interface operates with
5 signal pins versus 28 pins of a 8-bit parallel flash memory.
This frees up pins on the ASIC host controller resulting in
lower ASIC costs and a reduction in overall system costs
due to simplified signal routing.
The SST49LF00xC use a 5-signal LPC interface to support
both in-system and rapid factory programming using pro-
grammer equipment. A high voltage pin (WP#/AAI) is used
to enable Auto Address Increment (AAI) mode. The
SST49LF00xC offers hardware block protection in addition
to individual block protection via software registers for criti-
cal system code and data. A 256-bit Security ID space with
a 64-bit factory pre-programmed unique number and a
192-bit user programmable OTP area as well as 12-KByte
Protected Data Area (PDA) enhances the user’s ability to
implement new security techniques and data protection
©200 Silicon Storage Technology, Inc.
The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc.
Intel is a registered trademark of Intel Corporation.
S71292-00-000
1
1/06
These specifications are subject to change without notice.
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
scheme. The PDA can be also used to store system con-
the cumulative number of erase cycles as is necessary with
alternative flash memory technologies, whose Erase and
Program time increase with accumulated Erase/Program
cycles. To protect against inadvertent write, the
SST49LF00xC device has on-chip hardware and software
write protection schemes. It is offered with a typical endur-
ance of 100,000 cycles. Data retention is rated at greater
than 100 years.
figuration
data
(EEPROM
replacement).
The
SST49LF00xC also provides general purpose inputs (GPI)
for system design flexibility.
The SST49LF00xC flash memory device is manufactured
with SST’s proprietary, high-performance SuperFlash tech-
nology. The split-gate cell design and thick-oxide tunneling
injector attain greater reliability and manufacturability com-
pared with alternative technology approaches. The
SST49LF00xC device significantly improves performance
and reliability, while lowering power consumption. The
SST49LF00xC device writes (Program or Erase) in-system
with a single 3.0-3.6V power supply. It uses less energy
during Erase and Program than alternative flash memory
technologies.
The SST49LF00xC product provides a maximum program
time of 10 µs per byte with a single-byte Program opera-
tion; effectively 5 µs per byte with a dual-byte Program
operation and 2.5 µs per byte with a quad-byte Program
operation. End-of-Write can be detected by the RY/BY# pin
output in AAI mode and by reading the software status reg-
ister during an in-system Program or Erase operation.
The total energy consumed is a function of the applied volt-
age, current and time of application. Since for any given
voltage range, the SuperFlash technology uses less cur-
rent to program and has a shorter erase time, the total
energy consumed during any Erase or Program operation
is less than alternative flash memory technologies.
The SST49LF00xC is offered in 32-PLCC, and 32-TSOP
packages. In addition, the SST49LF00xC devices are
offered in lead-free (non-Pb) package options to address
the growing need for non-Pb solutions in electronic compo-
nents. Non-Pb package versions can be obtained by order-
ing products with a package code suffix of “E” as the
environmental attribute in the product part number. See
Figures 3 and 4 for pin assignments and Table 1 for pin
descriptions.
The SuperFlash technology provides fixed Erase and Pro-
gram time, independent of the number of Erase/Program
cycles that have performed. Therefore the system software
or hardware does not have to be calibrated or correlated to
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
2
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
TABLE OF CONTENTS
PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
LIST OF FIGURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
LIST OF TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
FUNCTIONAL BLOCKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
DEVICE MEMORY MAPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PIN DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Input/Output Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Input Communication Frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Identification Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
General Purpose Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write Protect / Top Block Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
AAI Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Ready/Busy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Load Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
No Connection (NC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DESIGN CONSIDERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
MODE SELECTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
LPC MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
FIRMWARE MEMORY CYCLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Firmware Memory Read Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Firmware Memory Write Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Abort Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Response to Invalid Fields for
Firmware Memory Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Multiple Device Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
3
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
DEVICE COMMANDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Read-Array Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Read-Software-ID Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Read-Status-Register Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Clear-Status-Register Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Sector-/Block-Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Program-/Erase-Suspend or Program-/Erase-Resume Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Erase-Suspend/Erase-Resume Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Program-Suspend/Program-Resume Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Security ID Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Multi-Byte Read/Write Configuration Registers (Firmware Memory Cycle) . . . . . . . . . . . . . . . . . . . . . . . . . 21
General Purpose Inputs Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Block and PDA Sector Locking Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Security ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
JEDEC ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
AUTO-ADDRESS INCREMENT (AAI) MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
AAI Mode with Multi-byte Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
AAI Data Load Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
ELECTRICAL SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PRODUCT ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
PACKAGING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
4
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
LIST OF FIGURES
FIGURE 1: Device Memory Map for SST49LF004C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
FIGURE 2: Device Memory Map for SST49LF008C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
FIGURE 3: Pin Assignments for 32-lead PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
FIGURE 4: Pin Assignments for 32-lead TSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
FIGURE 5: Firmware Memory Read Cycle Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
FIGURE 6: Firmware Memory Write Cycle Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
FIGURE 7: Erase-Suspend Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
FIGURE 8: AAI Load Protocol Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
FIGURE 9: LCLK Waveform (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
FIGURE 10: Reset Timing Diagram (LPC MODE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
FIGURE 11: Output Timing parameters (LPC Mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
FIGURE 12: Input Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
FIGURE 13: Input Timing Parameters (AAI Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
FIGURE 14: A Test Load Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
5
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
LIST OF TABLES
TABLE 1: Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
TABLE 2: Transfer Size Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
TABLE 3: Firmware Memory Cycles START Field Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
TABLE 4: Firmware Memory Read Cycle Field Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TABLE 5: Firmware Memory Write Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
TABLE 6: Valid MSIZE field Values for Firmware Memory Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
TABLE 7: Firmware Memory Multiple Device Selection Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
TABLE 8: Software Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
TABLE 9: Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
TABLE 10: Software Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
TABLE 11: Security ID Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TABLE 12: General Purpose Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
TABLE 13: Multi-byte Read/Write Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
TABLE 14: Block Locking Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
TABLE 15: Protected Data Area Sector Locking Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
TABLE 16: Block/PDA Sector Locking Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
TABLE 17: Security ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TABLE 18: JEDEC ID Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TABLE 19: LD# Input and RY/BY# Status inAAI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
TABLE 20: AAI Programming Cycle (initiated with WP#/AAI at VH ONLY) . . . . . . . . . . . . . . . . . . . . . . . . 26
TABLE 21: DC Operating Characteristics (All Interfaces) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TABLE 22: Recommended System Power-up Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TABLE 23: Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
TABLE 25: Clock Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
TABLE 24: Reliability Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
TABLE 26: Reset Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
TABLE 27: Read/Write Cycle Timing Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
TABLE 28: AC Input/Output Specifications (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
TABLE 29: Interface Measurement Condition Parameters (LPC Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TABLE 30: Input Cycle Timing Parameters (AAI Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
TABLE 31: Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
6
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
FUNCTIONAL BLOCKS
FUNCTIONAL BLOCK DIAGRAM
PDA
X-Decoder
SuperFlash
Memory
TBL#
WP#
INIT#
LAD[3:0]
LCLK
LPC
Address Buffers & Latches
LFRAME#
ID[3:0]
Interface
Y-Decoder
GPI[4:0]
I/O Buffers and Data Latches
Control Logic
AAI
AAI
Interface
RY/BY#
LD#
RST#
1292 B1.1
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
7
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
DEVICE MEMORY MAPS
0FFFFFH
Boot Block
TBL#
Block 18
Block 17
Block 16
Block 15
7FFFFH
Boot Block
0FC000H
0FBFFFH
TBL#
Block 10
Block 9
Block 8
Block 7
Block 6
Block 5
Block 4
Block 3
Block 2
Block 1
7C000H
7BFFFH
0FA000H
0F9FFFH
7A000H
79FFFH
0F8000H
0F7FFFH
78000H
77FFFH
0F0000H
0EFFFFH
70000H
6FFFFH
Block 14
Block 13
Block 12
Block 11
Block 10
Block 9
Block 8
Block 7
Block 6
Block 5
Block 4
Block 3
Block 2
Block 1
0E0000H
0DFFFFH
60000H
5FFFFH
0D0000H
0CFFFFH
WP# for
Block 0–9
50000H
4FFFFH
0C0000H
0BFFFFH
40000H
3FFFFH
0B0000H
0AFFFFH
30000H
2FFFFH
WP# for
Block 0–18
0A0000H
09FFFFH
20000H
1FFFFH
090000H
08FFFFH
10000H
0F000H
080000H
07FFFFH
Block 0
(64 KByte)
070000H
06FFFFH
4 KByte Sector 2
4 KByte Sector 1
4 KByte Sector 0
02000H
01000H
00000H
060000H
05FFFFH
1292 F01.1
FIGURE 1: DEVICE MEMORY MAP FOR
SST49LF004C
050000H
04FFFFH
040000H
03FFFFH
030000H
02FFFFH
020000H
01FFFFH
010000H
00FFFFH
4 KByte Sector 15
Block 0
(64 KByte) 002000H
4 KByte Sector 2
4 KByte Sector 1
4 KByte Sector 0
001000H
000000H
1292 F02.1
FIGURE 2: DEVICE MEMORY MAP FOR
SST49LF008C
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
8
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
PIN ASSIGNMENTS
4
3
2
1
32 31 30
29
5
GPI1 (LD#)
GPI0 (RY/BY#)
WP#/AAI
TBL#
NC
NC
NC
NC
6
28
27
26
25
24
23
22
21
7
8
32-lead PLCC
Top View
9
ID3
V
DD
INIT#
10
11
12
13
ID2
ID1
LFRAME#
NC
ID0
NC
LAD0
14 15 16 17 18 19 20
1292 32-plcc P2.0
( ) Designates AAI Mode
FIGURE 3: PIN ASSIGNMENTS FOR 32-LEAD PLCC
NC
NC
NC
NC
NC
GPI4
LCLK
NC
NC
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
INIT#
LFRAME#
V
NC
(V )
DD DD
NC
NC
NC
LAD3
32-lead TSOP
Top View
9
V
(V )
SS SS
RST#
GPI3
GPI2
10
11
12
13
14
15
16
LAD2
LAD1
LAD0
ID0
ID1
ID2
GPI1 (LD#)
GPI0 (RY/BY#)
WP#/AAI
TBL#
ID3
1292 32-tsop P1.0
( ) Designates AAI Mode
FIGURE 4: PIN ASSIGNMENTS FOR 32-LEAD TSOP
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
9
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
PIN DESCRIPTIONS
TABLE 1: PIN DESCRIPTION
Interface
Symbol
Pin Name
Type1 AAI LPC Functions
LCLK
Clock
I
X
X
X
X
To accept a clock input from the control unit
LAD[3:0] Address
and Data
I/O
To provide LPC bus information,
such as addresses and command Inputs/Outputs data.
LFRAME# Frame
I
X
X
To indicate the start of a data transfer operation;
also used to abort an LPC cycle in progress.
RST#
INIT#
Reset
I
I
X
X
X
X
To reset the operation of the device
Initialize
This is the second reset pin for in-system use.
This pin is internally combined with the RST# pin.
If this pin or RST# pin is driven low, identical operation is exhibited.
ID[3:0]
GPI[4:0]
TBL#
Identification
Inputs
I
I
I
X
X
These four pins are part of the mechanism that allows multiple parts to be
attached to the same bus. The strapping of these pins is used to identify
the component. The boot device must have ID[3:0]=0000, all subsequent
devices should use sequential up-count strapping. These pins are inter-
nally pulled-down with a resistor between 20-100 KΩ. When in AAI mode,
these pins operate identically as in Firmware Memory cycles.
General
Purpose
Inputs
X
These individual inputs can be used for additional board flexibility.
The state of these pins can be read through LPC registers. These inputs
should be at their desired state before the start of the LPC clock cycle dur-
ing which the read is attempted, and should remain in place until the end
of the Read cycle. Unused GPI pins must not be floated.
GPI[2:4] are ignored when in AAI mode.
Top Block Lock
X
X
When low, prevents programming to the boot block sectors at top of device
memory. When TBL# is high it disables hardware write protection for the
top block sectors. This pin cannot be left unconnected.
TBL# setting is ignored when in AAI mode.
WP#/AAI Write Protect
WP#/AAI AAI Enable
I
I
When low, prevents programming to all but the highest addressable block
(Boot Block). When WP# is high it disables hardware write protection for
these blocks. This pin cannot be left unconnected.
X
X
X
When set to the Supervoltage VH = 9V, configures the device to program
multiple bytes in AAI mode. When brought to VIL/VIH, returns device to
LPC mode.
RY/BY#
LD#
Ready/Busy#
Load-Enable#
O
I
Open drain output that indicates the device is ready to accept data in an
AAI mode, or that the internal cycle is complete.
Used in conjunction with LD# pin to switch between these two flag states.
Input pin which when low, indicates the host is loading data in an AAI pro-
gramming cycle. If LD# is high, the host signals the AAI interface that it is
terminating a command. LD# low/high switches the RY/BY# output from a
“buffer free” flag to a “programming complete” flag.
VDD
VSS
NC
Power Supply
Ground
PWR
PWR
X
X
X
X
To provide power supply (3.0-3.6V)
Circuit ground (0V reference)
No Connection
N/A N/A Unconnected pins.
T1.0 1292
1. I=Input, O=Output
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
10
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Clock
Write Protect / Top Block Lock
The LCLK pin accepts a clock input from the host controller.
The Top Boot Lock (TBL#) and Write Protect (WP#/AAI)
pins are provided for hardware write protection of device
memory in the SST49LF00xC. The TBL# pin is used to
write protect 16 KByte at the highest memory address
range for the SST49LF00xC. WP#/AAI pin write protects
the remaining sectors in the flash memory. An active low
signal at the TBL# pin prevents Program and Erase opera-
tions of the top Boot Block. When TBL# pin is held high,
write protection of the top Boot Block is then determined by
the Boot Block Locking registers. The WP#/AAI pin serves
the same function for the remaining sectors of the device
memory. The TBL# and WP#/AAI pins write protection
functions operate independently of one another. Both TBL#
and WP#/AAI pins must be set to their required protection
states prior to starting a Program or Erase operation. A
logic level change occurring at the TBL# or WP#/AAI pin
during a Program or Erase operation could cause unpre-
dictable results. TBL# and WP#/AAI pins cannot be left
unconnected.
Input/Output Communications
The LAD[3:0] pins are used to serially communicate cycle
information such as cycle type, cycle direction, ID selection,
address, data, and sync fields.
Input Communication Frame
The LFRAME# pin is used to indicate start of a LPC bus
cycle. The pin is also used to abort an LPC bus cycle in
progress.
Reset
A VIL on INIT# or RST# pin initiates a device reset. INIT#
and RST# pins have the same function internally. It is
required to drive INIT# or RST# pins low during a system
reset to ensure proper CPU initialization. During a Read
operation, driving INIT# or RST# pins low deselects the
device and places the output drivers, LAD[3:0], in a high
impedance state. The reset signal must be held low for a
minimum of time TRSTP. A reset latency occurs if a reset pro-
cedure is performed during a Program or Erase operation.
See Table 26, Reset Timing Parameters, for more informa-
tion. A device reset during an active Program or Erase oper-
ation will abort the operation and memory contents may
become invalid due to data being altered or corrupted from
an incomplete Erase or Program operation.
TBL# is internally OR’ed with the top Boot Block Locking
register. When TBL# is low, the top Boot Block is hardware
write protected regardless of the state of the Write-Lock bit
for the Boot Block Locking register. Clearing the Write-Pro-
tect bit in the register when TBL# is low will have no func-
tional effect, even though the register may indicate that the
block is no longer locked.
WP#/AAI is internally OR’ed with the Block Locking regis-
ter. When WP#/AAI is low, the blocks are hardware write
protected regardless of the state of the Write-Lock bit for
the corresponding Block Locking registers. Clearing the
Write-Protect bit in any register when WP#/AAI is low will
have no functional effect, even though the register may indi-
cate that the block is no longer locked.
Identification Inputs
These pins are part of a mechanism that allows multiple
devices to be attached to the same bus. The strapping of
these pins is used to identify the component. The boot
device must have ID[3:0] = 0; all subsequent devices
should use sequential count-up strapping. These pins are
internally pulled-down with a resistor between 20-100 KΩ.
The TBL# pin and WP# pin do not affect the protection of
the Protected Data Area. The PDA protection status is only
determined by the value of the PDA Sector Locking Regis-
ters. (See “Block and PDA Sector Locking Registers” on
page 22.)
General Purpose Inputs
The General Purpose Inputs (GPI[4:0]) can be used as dig-
ital inputs for the CPU to read. The GPI register holds the
values on these pins. The data on the GPI pins must be
stable before the start of a GPI register Read and remain
stable until the Read cycle is complete. The pins must be
driven low, VIL, or high, VIH but not left unconnected (float).
AAI Enable
The AAI Enable pin (WP#/AAI) is used to enable the Auto
Address Increment (AAI) mode. When the WP#/AAI pin is
set to the Supervoltage VH (9 0.5V), the device is in AAI
mode with Multi-Byte programming. When the WP#/AAI
pin is brought to VIL/VIH levels, the device returns to LPC
mode.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
11
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Ready/Busy
LPC MODE
The Ready/Busy pin (RY/BY#), is an open drain output
which indicates the device is ready to accept data in an AAI
mode, or that the internal programming cycle is complete.
The pin is used in conjunction with the LD# pin to switch
between these two flag states (see Table 19).
Device Operation
The SST49LF00xC supports Multi-Byte Firmware Memory
Read and Write cycle types as defined in Intel Low Pin
Count Interface Specification, Revision 1.1. Table 2 shows
the size of transfer supported by the SST49LF00xC.
Load Enable
TABLE 2: TRANSFER SIZE SUPPORTED
The Load Enable pin (LD#), is an input pin which when low,
indicates the host is loading data in an AAI programming
cycle. Data is loaded in the SST49LF00xC at the rising
edge of the clock. If LD# is high, it signals the AAI interface
that the host is terminating the command. LD# low/high
switches the RY/BY# output from buffer free flag to pro-
gramming complete flag (see Table 19).
Cycle Type
Size of Transfer
1, 2, 4, 16, 128 Bytes
1, 2, 4 Bytes
Firmware Memory Read
Firmware Memory Write
T2.0 1292
The LPC mode uses a 5-signal communication interface:
one control line, LFRAME#, which is driven by the host to
start or abort a bus cycle, a 4-bit data bus, LAD[3:0], used
to communicate cycle type, cycle direction, ID selection,
address, data and sync fields. The device enters standby
mode when LFRAME# is taken high and no internal opera-
tion is in progress.
No Connection (NC)
These pins are not connected internally.
DESIGN CONSIDERATIONS
SST recommends a high frequency 0.1 µF ceramic capac-
itor to be placed as close as possible between VDD and
The host drives LFRAME# signal from low-to-high to cap-
ture the start field of a LPC cycle. On the cycle in which
LFRAME# goes inactive, the last latched value is taken as
the START value. The START value determines whether
the SST49LF00xC will respond to a Firmware Memory
Read/Write cycle type as defined in Table 3.
VSS less than 1 cm away from the VDD pin of the device.
Additionally, a low frequency 4.7 µF electrolytic capacitor
from VDD to VSS should be placed within 1 cm of the VDD
pin. If you use a socket for programming purposes add an
additional 1-10 µF next to each socket. The RST# pin must
remain stable at VIH for the entire duration of an Erase
operation. WP#/AAI must remain stable at VIH for the entire
duration of the Erase and Program operations for non-Boot
Block sectors. To write data to the top Boot Block sectors,
the TBL# pin must also remain stable at VIH for the entire
duration of the Erase and Program operations.
TABLE 3: FIRMWARE MEMORY CYCLES START
FIELD DEFINITION
START
Value Definition
1101
1110
Start of a Firmware Memory Read cycle
Start of a Firmware Memory Write cycle
T3.0 1292
MODE SELECTION
See following sections on details of Firmware Memory
cycle types (Tables 4 and 5). Two-cycle Program and
Erase command sequences are used to initiate Firmware
Memory Program and Erase operations. See Table 8 for a
listing of Program and Erase commands.
The SST49LF00xC flash memory device operates in two
distinct interface modes: the LPC mode and the Auto
Address Increment (AAI) mode. The WP#/AAI pin is used
to set the interface mode selection. The device is in AAI
mode when the WP#/AAI pin is set to the Supervoltage VH
(9 0.5V), and in the LPC mode when the WP#/AAI is set to
VIL/VIH. The mode selection must be configured prior to
device operation.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
12
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
FIRMWARE MEMORY CYCLES
Firmware Memory Read Cycle
TABLE 4: FIRMWARE MEMORY READ CYCLE FIELD DEFINITIONS
Clock
Cycle
Field
Name
LAD[3:0]
Direction
Field Contents
LAD[3:0]1
Comments
1
START
1101
IN
LFRAME# must be active (low) for the part to respond.
Only the last start field (before LFRAME# transitions high)
will be recognized. The START field contents (1101b) indi-
cate a Firmware Memory Read cycle.
2
IDSEL
0000 to 1111
IN
Indicates which SST49LF00xC device should respond.
If the IDSEL (ID select) field matches the value of ID[3:0],
then that particular device will respond to the LPC bus
cycle.
3-9
10
MADDR
MSIZE
YYYY
KKKK
IN
IN
These seven clock cycles make up the 28-bit memory
address. YYYY is one nibble of the entire address.
Addresses are transferred most-significant nibble first.
The MSIZE field indicates how many bytes will be trans-
ferred during multi-byte operations.
Device will execute multi-byte read of 2MSIZE bytes.
SST49LF00xC supports only MSIZE = 0, 1, 2, 4, 7 (1, 2, 4,
16, 128 Bytes), with KKKK=0000b, 0001b, 0010b, 0100b, or
0111b.
11
TAR0
1111
IN,
then Float
In this clock cycle, the master (Intel ICH) has driven the bus
to all ‘1’s and then floats the bus, prior to the next clock
cycle. This is the first part of the bus “turnaround cycle.”
12
13
TAR1
1111 (float)
Float,
then OUT
The SST49LF00xC takes control of the bus during this
cycle.
RSYNC
0000 (READY)
OUT
During this clock cycle, the device generates a “ready sync”
(RSYNC) indicating that the device has received the input
data. The least-significant nibble of the least-significant byte
will be available during the next clock cycle.
14-A
DATA
TAR0
ZZZZ
1111
OUT
A=(13+2n+1); n = MSIZE
Least significant nibbles outputs first.
(A+1)
OUT,
then Float
In this clock cycle, the SST49LF00xC drives the bus to all
ones and then floats the bus prior to the next clock cycle.
This is the first part of the bus “turnaround cycle.”
A=(13+2n+1); n = MSIZE
(A+2)
TAR1
1111 (float)
Float,
then IN
The host resumes control of the bus during this cycle.
A=(13+2n+1); n = MSIZE
T4.0 1292
1. Field contents are valid on the rising edge of the present clock cycle.
LCLK
LFRAME#
DATA
Start
IDSEL
MADDR
MSIZE TAR0 TAR1 RSYNC
KKKKb 1111b Tri-State 0000b
1101b 0000b A[27:24] A[23:20] A[19:16] A[15:12] A[11:8]
A[7:4]
A[3:0]
D
[3:0]
D
[7:4]
D
[3:0]
D [7:4]
n
TAR
0
0
n
LAD[3:0]
1292 F03.0
FIGURE 5: FIRMWARE MEMORY READ CYCLE WAVEFORM
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
13
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Firmware Memory Write Cycle
TABLE 5: FIRMWARE MEMORY WRITE CYCLE
Clock
Cycle
Field
Name
Field Contents
LAD[3:0]1
LAD[3:0]
Direction
Comments
1
START
1110
IN
LFRAME# must be active (low) for the part to respond.
Only the last start field (before LFRAME# transitions
high) will be recognized. The START field contents
(1110b) indicate a Firmware Memory Write cycle.
2
IDSEL
0000 to 1111
IN
Indicates which SST49LF00xC device should
respond. If the IDSEL (ID select) field matches the
value of ID[3:0], then that particular device will respond
to the whole bus cycle.
3-9
10
MADDR
MSIZE
YYYY
KKKK
IN
IN
These seven clock cycles make up the 28-bit memory
address. YYYY is one nibble of the entire address.
Addresses are transferred most-significant nibble first.
The MSIZE field indicates how many bytes will be
transferred during multi-byte operations.
Device supports 1, 2, and 4 Bytes write with MSIZE =
0, 1, or 2, and KKKK=0000b, 0001b, or 0010b.
11-A
DATA
TAR0
ZZZZ
1111
IN
A=(10+2n+1); n = MSIZE
Least significant nibble entered first.
(A+1)
IN then Float
In this clock cycle, the master (Intel ICH) has driven the
bus to all ‘1’s and then floats the bus prior to the next
clock cycle. This is the first part of the bus “turnaround
cycle.” A=(10+2n+1); n = MSIZE
(A+2)
(A+3)
TAR1
1111 (float)
0000
Float then OUT The SST49LF00xC takes control of the bus during this
cycle.
A=(10+2n+1); n = MSIZE
RSYNC
OUT
During this clock cycle, the SST49LF00xC generates
a “ready sync” (RSYNC) and outputs the values 0000,
indicating that it has received data or a flash command.
A=(10+2n+1); n = MSIZE
(A+4)
(A+5)
TAR0
TAR1
1111
OUT then Float In this clock cycle, the SST49LF00xC drives the bus to
all ‘1’s and then floats the bus prior to the next clock
cycle. This is the first part of the bus “turnaround
cycle”. A=(10+2n+1); n = MSIZE
1111 (float)
Float then IN
The host resumes control of the bus during this cycle.
A=(10+2n+1); n = MSIZE
T5.0 1292
1. Field contents are valid on the rising edge of the present clock cycle.
LCLK
LFRAME#
DATA
Start
IDSEL
MADDR
MSIZE
KKKKb
TAR0 TAR1 RSYNC
1111b Tri-State 0000b
1110b 0000b A[27:24] A[23:20] A[19:16] A[15:12] A[11:8]
A[7:4]
A[3:0]
D
[3:0]
D
[7:4]
Dn[3:0] Dn[7:4]
TAR
0
0
LAD[3:0]
1292 F04.0
FIGURE 6: FIRMWARE MEMORY WRITE CYCLE WAVEFORM
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
14
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Invalid MSIZE field: If the SST49LF00xC receives an
invalid size field during a Firmware Memory Read or Write
operation, the device will reset and no operation will be
attempted. The device will not generate any kind of
response in this situation. The SST49LF00xC will only
respond to values listed in Table 6.
Abort Mechanism
If LFRAME# is driven low for one or more clock cycles after
the start of a bus cycle, the cycle will be terminated. The
host may drive the LAD[3:0] with ‘1111b’ (ABORT nibble) to
return the interface to ready mode. The ABORT only
affects the current bus cycle. For a multi-cycle command
sequence, such as the Erase or Program commands,
ABORT doesn’t interrupt the entire command sequence,
only the current bus cycle of the command sequence. The
host can re-send the bus cycle for the aborted command
and continue the command sequence after the device is
ready again.
TABLE 6: VALID MSIZE FIELD VALUES FOR
FIRMWARE MEMORY CYCLES
MSIZE
0000
0001
0010
0100
0111
Direction
R/W
R/W
R/W
R
Size of Transfer
1 Byte
2 Byte
4 Byte
Response to Invalid Fields for
Firmware Memory Cycle
16 Byte
R
128 Byte
During an on-going Firmware Memory bus cycle, the
SST49LF00xC will not explicitly indicate that it has received
invalid field sequences. The response to specific invalid
fields or sequences is described as follows:
T6.0 1292
Once valid START, IDSEL, and MSIZE are received, the
SST49LF00xC will always complete the bus cycle. How-
ever, if the device is busy performing a flash Erase or Pro-
gram operation, no new internal memory Write will be
executed. As long as the states of LAD[3:0] and LFRAME#
are known, the response of the ST49LF00xC to signals
received during the cycle is predictable.
ID mismatch: If the IDSEL field does not match ID[3:0],
the device will ignore the cycle. See “Multiple Device Selec-
tion for Firmware Memory Cycle” on page 16 for details.
Address out of range: The address sequence is 7
fields long (28 bits) with Firmware Memory bus cycles.
Only some of the address fields bits are decoded by the
SST49LF00xC devices. SST49LF004c decodes A0
through A18 and A22, and SST49LF008C decodes A0
through A19 and A22. Address A22 has the special function
of directing reads and writes to the flash core (A22=1) or to
the register space (A22=0).
Non-boundary-aligned address: The SST49LF00xC
accepts multi-byte transfers for both Read and Write opera-
tions. The device address space is divided into uniform
page sizes 2, 4, 16, or 128 bytes wide, according to the
MSIZE value (see Table 6). The host issues only one
address in the MADDR field of the Firmware Memory
Cycle, but multiple bytes are read from or written to the
device. For this reason the MADDR address should be
page boundary-aligned. This means the address should be
aligned to a Word boundary (A0 = 0) for a 2-byte transfer, a
double Word boundary (e.g. A0 = 0, A1 = 0) for a 4-byte
transfer, and so on. If the address supplied by the host is
not page boundary-aligned, the SST49LF00xC will force a
boundary alignment, starting the multi-byte Read or Write
operation from the lower byte of the addressed page.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
15
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
TABLE 7: FIRMWARE MEMORY MULTIPLE DEVICE
SELECTION CONFIGURATION
Multiple Device Selection
Multiple LPC firmware flash devices may be strapped to
increase memory densities in a system. The four ID pins,
ID[3:0], allow up to 16 devices to be attached to the same
bus by using different ID strapping in a system. BIOS sup-
port, bus loading, or the attaching bridge may limit this num-
ber. The boot device must have an ID of 0000b (determined
by ID[3:0]); subsequent devices use incremental number-
ing. Equal density must be used with multiple devices.
Device #
ID[3:0]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
IDSEL
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0 (Boot device)
1
2
3
4
5
Multiple Device Selection for
Firmware Memory Cycle
6
7
For Firmware Memory Read/Write cycles, hardware strap-
ping values on ID[3:0] must match the values in IDSEL
field. The SST49LF00xC will compare these bits with
ID[3:0]’s strapping values. If there is a mismatch, the device
will ignore the remainder of the cycle. See Table 7 for Multi-
ple Device Selection Configuration.
8
9
10
11
12
13
14
15
T7.0 1292
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
16
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
DEVICE COMMANDS
Device operation is controlled by commands written to the
Command User Interface (CUI). Execution of a specific
command is handled by internal functions after a CUI
receives and processes the command. After power-up or a
Reset operation the device enters Read mode. Commands
consist of one or two sequential Bus-Write operations. The
commands are summarized in Table 8, “Software Com-
mand Sequence”.
TABLE 8: SOFTWARE COMMAND SEQUENCE
Bus Cycles
First Bus Cycle
Second Bus Cycle
Command
Required
Oper
Write
Write
Addr1
Data
FFH
90H
Oper
Addr1
Data
Read-Array/Reset
1
X
X
Read-Software-ID/
≥ 2
Read
Read
IA5
X
ID6
Read-Security-ID2,3,4
Read-Status-Register3,4
Clear-Status-Register
Sector-Erase8
Block-Erase8
Program8,10
2
1
2
2
2
Write
Write
Write
Write
Write
X
X
X
X
X
70H
50H
30H
20H
SRD7
Write
Write
Write
SAx9
BAx
WA11
D0H
D0H
WD12
40H
or
10H
Program-/Erase-Suspend
Program-/Erase-Resume
User-Security-ID-Program13
User-Security-ID-Program-Lockout
Protected-Area-Sector-Erase8,14
Program-Protected-Area8,14
Open-Protected-Area15
1
1
2
2
2
2
1
1
Write
Write
Write
Write
Write
Write
Write
Write
X
X
X
X
X
X
X
X
B0H
D0H
A5H
85H
32H
42H
62H
6DH
Write
Write
Write
Write
WA11
X
Data
00H
SA
D0H
Data
WA
Hide-Protected-Area15
T8.0 1292
1. This value must be a valid address within the device Memory Address Space. X can be VIH or VIL, but no other value.
2. SST Manufacturer’s ID = BFH, is read with A19-A0 = 0.
SST49LF004C/008C Device ID = 54H/59H, is read with A19-A1 = 0, A0 = 1.
Following the Read-Software-ID/Read-Security-ID command,
Read operations access Manufacturer’s ID and Device ID or Security ID.
3. Read-Software-ID/Read Security ID and Read Status Register will return ID/Register data until another valid command is written.
4. Following the Read-Software-ID/Read-Security-ID command, Read operations access manufacturer’s ID and Device ID or Security
ID. Read-Software-ID/Read-Security-ID and Read-Status-Register will return register data until another valid command is written.
5. IA = Device Identification Address/Security ID Address.
6. ID = Data read from identifier codes/Data read from Security ID
7. SRD = Data read from Status register
8. The sector or block must not be write-locked when attempting Erase or Program operations.
Attempts to issue an Erase or Program command to a write-locked sector/block will fail.
9. SAX for Sector-Erase Address
BAX for Block-Erase Address
10. The Program Command can operate on multiple bytes.
11. WA = Address of memory location to be written
12. WD = Data to be written at location WA
13. Valid addresses for the User Security ID space are from FFFC 0188H to FFFC 019FH.
14. Valid address WA of Protected Data Area location is from FFFC 8000H to FFFC AFFFH. For Sector Erase Command any address
within the sector in the Protected Data Area being erased can be used: PDA Sector 0 - SA+ FFC 8000H to FFFC 8FFFH. PDA Sec-
tor 1 - SA = FFFC 9000H to FFFC 9FFFH. PDA Sector 2 - SA = FFFC A000H to FFFC AFFFH.
15. After Open Protected Area command is executed the contents of the area can be read at addresses FFBC 8000H to FFBC AFFFH if
it is not read-locked. After Hide Protected Area command is executed the contents of the area is not accessible regardless of read-
lock status. By default (after Power On or reset) Protected Data Area is hidden.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
17
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
TABLE 9: PRODUCT IDENTIFICATION
Address1
Read-Array Command
Data
Upon initial device power-up and after exit from reset, the
device defaults to the Read Array mode. This operation can
also be initiated by writing the Read-Array command. (See
Table 8.) The device remains available for array reads until
another command is written. Once an internal Program/
Erase operation starts, the device will not recognize the
Read-Array command until the operation is completed,
unless the operation is suspended via a Program-/Erase-
Suspend command.
Manufacturer’s ID
Device ID
FFFC 0000H
BFH
SST49LF004C
SST49LF008C
FFFC 0001H
FFFC 0001H
54H
59H
T9.0 1292
1. Address shown in this column is for boot device only.
Address locations should appear elsewhere in the 4
GByte system memory map depending on ID strapping
values on ID[3:0] pins when multiple LPC memory
devices are used in a system.
Read-Software-ID Command
Read-Status-Register Command
The Read-Software-ID operation is initiated by writing the
Read-Software-ID command. Following the command, the
device will output the manufacturer’s ID and device ID from
the addresses shown in Table 9. Any other valid command
will terminate the Read-Software-ID operation.
The Status register may be read to determine when a Sec-
tor-/Block-Erase or Program completes, and whether the
operation completed successfully. The Status register may
be read at any time by writing the Read-Status-Register
command. After writing this command, all subsequent
Read operations will return data from the Status register
until another valid command is written.
The Read-Software-ID command is the same as the Read-
Security-ID command. See “Security ID Commands” on
page 20.
The default value of the Status register after device power-
up or reset is 80H.
Clear-Status-Register Command
The user can reset the Status register’s Block Protect Sta-
tus (BPS) bit to 0 by issuing a Clear-Status-Register com-
mand. Device power-up and hardware reset will also reset
BPS to 0.
TABLE 10: SOFTWARE STATUS REGISTER
Bit Name
Function
0
1
RES
BPS
Reserved for future use
Block Protect Status
The Block Write-Lock bit should be interrogated only after Erase or Program command is issued.
It informs the system whether or not the selected block is locked.
BPS does not provide a continuous indication of Write-Lock bit value.
0: Block Unlocked
1: Operation Aborted, Block Write-Lock bit set.
2:5 RES
Reserved for future use
6
ESS
Erase Suspend Status
0: Erase in progress/completed
1: Erase suspended
7
WSMS Write State Machine Status
Check WSMS to determine erase or program completion.
0: Busy
1: Ready
T10.0 1292
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
18
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Sector-/Block-Erase Command
Erase-Suspend/
Erase-Resume Commands
The Erase Command operates on one sector or block at a
time. This command requires an (arbitrary) address within
the sector or block to be erased. Note that a Sector/Block
Erase operation changes all Sector/Block byte data to FFh.
If a Read operation is performed after issuing the erase
command, the device will automatically output Status Reg-
ister data. The system can poll the Status Register in order
to verify the completion of the Sector/Block Erase operation
(please refer to Table 10, Status Register Definition). If a
Sector/Block Erase is attempted on a locked block, the
operation will fail and the data in the Sector/Block will not be
changed. In this case, the Status Register will report the
error (BPS=1).
The Erase Suspend command allows Sector-Erase or
Block-Erase interruption in order to read or program data
in another block of memory. Once the Erase-Suspend
command is executed, the device will suspend any on-
going Erase operation within time TES (10 µs). The device
outputs status register data when read after the Erase-
Suspend command is written. The system is able to deter-
mine when the Erase operation has been completed
(WSMS=1) by polling the status register. After an Erase-
Suspend, the device will set the status register ESS bit
(ESS=1) if the Erase has been successfully suspended
(refer to Table 10, “Software Status Register”). The Erase-
Resume command resumes the Erase operation that had
been previously suspended.
Program Command
The Program command operates on multiple bytes as
shown in Table 5. This command specifies the address and
data to be programmed. During the Program operation the
device automatically outputs the Status Register data when
read. The system can poll the Status Register in order to
verify the completion of the Program operation (refer to
Table 10, “Software Status Register”). If a Program opera-
tion is attempted on a locked block, the operation will fail
and the data in the addressed byte will not be changed. In
this case, the Status Register will report the error (BPS=1).
After a successful Erase-Suspend, a Read-Array com-
mand may be written to read data from a Sector/Block
other than the suspended Sector/Block. A Program com-
mand sequence may also be issued during Erase Sus-
pend to program data in memory locations other than the
Sector/Block currently in the Erase-Suspend mode. If a
Read-Array command is written to an address within the
suspended Sector/Block this may result in reading invalid
data. If a Program command is written to an address within
the suspended Sector/Block the command is acknowl-
edged but rejected. Other valid commands while erase is
suspended include Read-Status-Register, Read-Device-
ID, and Erase-Resume.
Program-/Erase-Suspend or
Program-/Erase-Resume Operations
The Erase-Resume command resumes the Erase process
in the suspended sector or block. After the Erase-Resume
command is written, the device will continue the Erase pro-
cess. Erase cannot resume until any Program operation ini-
tiated during Erase-Suspend has completed. Suspended
operations cannot be nested: the system needs to com-
plete or resume any previously suspended operation
before a new operation can be suspended. See Figure 7
for flowchart.
The Program-Suspend and Erase-Suspend operations
share the same software command sequence (B0H). The
Program-Resume and Erase-Resume operations share
the same software command sequence (D0H). See Table
8, “Software Command Sequence” on page 17.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
19
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Program-Suspend/
Program-Resume Command
Erase Sector/Block
The Program-Suspend and Program-Resume commands
have no influence on the device. Since the device requires
a maximum of TBP (10 µs) in order to program a byte (see
Table 27), when a Program-Suspend command is written,
the suspended Byte Program operation will always be suc-
cessfully completed within the suspend latency time (TES =
TBP = 10 µs).
Write B0H to any valid
device memory address
Erase-Suspend
Command
Write 70H to any valid
device memory address
Read-Status-Register
Command
Security ID Commands
Read Status Register
The SST49LF00xC device offers a 256-bit Security ID
space. The Security ID space is divided into two parts. One
64-bit segment is programmed at SST with a unique 64-bit
number: this number cannot be changed by the user. The
other segment is 192-bit wide and is left blank: this space is
available for customers and can be programmed as
desired.
No
WSMS = 1
Yes
The User-Security-ID-Program command is shown in
Table 8, “Software Command Sequence”. Use the memory
addresses specified in Table 11 for Security ID program-
ming. Once the customer segment is programmed, it can
be locked to prevent any alteration. The User-Security-ID-
Program-Lockout command is shown in Table 8, “Software
Command Sequence”.
Erase Completed
ESS = 1
Yes
No
Write the Read-Array
command to read from
another Sector/Block
or
In order to read the Security ID information, the user can
issue a Read Security ID Command (90H) to the device. At
this point the device enters the Read-Software-ID/Read-
Security-ID mode. The Security ID information can be read
at the memory addresses in Table 11.
Write the Program
command to program
another Sector/Block
No
Finished?
Yes
A Read-Array/Reset command (FFH) must then be issued
to the device in order to exit the Read-Software-ID/Read-
Security-ID mode and return to Read-Array mode.
Erase-Resume
Command
An alternate method to read the Security ID information is
to read the Security ID registers located into the register
space as described in the “Security ID Registers” section.
Write D0H to any valid
device memory address
Erase Resumed
1292 FC_Erase-Sus.0
FIGURE 7: ERASE-SUSPEND FLOW CHART
TABLE 11: SECURITY ID ADDRESSES
Address Range1
Security ID Segment
Size
FFFC 0180 to FFFC 0187
FFFC 0188 to FFFC 019F
Factory-Programmed
User-Programmed
8 bytes – 64 bit
24 bytes – 192 bit
T11.0 1292
1. Address shown is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory map depending
on ID strapping values on ID[3:0} pins according with multiple device selection mechanism.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
20
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
REGISTERS
There are five types of registers available on the
SST49LF00xC, the multi-byte Read/Write configuration
registers, General Purpose Inputs registers, Block Locking
registers, Security ID register, and the JEDEC ID registers.
These registers appear at their respective address location
in the 4 GByte system memory map. Unused register loca-
tions will read as 00H. Any attempt to read or write any reg-
ister during an internal Write operation will be ignored.
In case of multi-byte Firmware Memory register reads, the
device will return register data for the addressed register
until the command finishes, or is aborted.
General Purpose Inputs Register
The General Purpose Inputs register (GPI_REG) passes
the state of GPI[4:0] pins on the SST49LF00xC. It is rec-
ommended that the GPI[4:0] pins be in the desired state
before LFRAME# is brought low for the beginning of the
bus cycle, and remain in that state until the end of the cycle.
There is no default value since this is a pass-through regis-
ter. The GPI_REG register for the boot device appears at
FFBC0100H in the 4 GByte system memory map, and will
appear elsewhere if the device is not the boot device (see
Table 12). This register is not available to be read when the
device is in an Erase/Program operation. In case of multi-
byte Firmware Memory cycle register reads, the device will
return register data for the addressed register until the com-
mand finishes, or is aborted.
Read or write access to the register during an internal Pro-
gram/Erase operation will be completed as follows:
•
Multi-byte Read/Write Configuration registers,
General Purpose Inputs register, and Block Lock-
ing registers can be accessed normally
•
Security ID register and the JEDEC ID registers
can not be accessed (reading these registers will
return unused register data 00H).
Multi-Byte Read/Write Configuration Reg-
isters (Firmware Memory Cycle)
The multi-byte read/write configuration (MBR) registers are
four 8-bit read-only registers located at addresses
FFBC0005-FFBC0008 for boot configured device (see
Table 13). These registers are accessible using Firmware
Memory Read cycle only. These registers contain informa-
tion about multi-byte read and write access sizes that will
be accepted for Firmware Memory multi-byte Read com-
mands. The registers are not available in AAI mode.
TABLE 12: GENERAL PURPOSE REGISTER
Default
Register
Register Address1
Value
Access
GPI_REG
FFBC 0100H
N/A
R
T12.0 1292
1. Address shown in this column is for boot device only.
Address locations should appear elsewhere in the 4
GByte system memory map depending on ID strapping
values on ID[3:0] pins according with multiple device
selection mechanism.
TABLE 13: MULTI-BYTE READ/WRITE CONFIGURATION REGISTERS
Register
Register Address1
FFBC 0005H
FFBC 0006H
FFBC 0007H
FFBC 0008H
Data
Access Description
MULTI_BYTE_READ_L
MULTI_BYTE_READ_H
MULTI_BYTE_WRITE_L
MULTI_BYTE_WRITE_H
0100 1011b
0000 0000b
0000 0011b
0000 0000b
R
R
R
R
Device supports 1,2,4, 16, 128 Byte reads
Future Expansion for Read
Device supports 1, 2, 4 Byte Write
Future Expansion for Write
T13.0 1292
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory
map depending on ID strapping values on ID[3:0] pins when multiple LPC memory devices are used in a system.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
21
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
SST49LF00xC also provides PDA Sector Locking Regis-
ters at addresses shown in Table 15. These locking regis-
ters can be accessed only after Open Protected Area
command is executed. After Hide Protected Area com-
mand, as well as after Power On and Reset, read from
addresses specified in Table 15 returns unused register
space data 00H, and write to these addresses is ignored.
Block and PDA Sector Locking Registers
SST49LF00xC provides software controlled lock protection
through a set of Block Locking registers. The Block Locking
registers are read/write registers and they are accessible
through standard addressable memory locations specified
in Table 14. Unused register locations will return 00H if
read.
In case of multi-byte read of any locking register, the device
will return register data for the addressed register until the
command finishes, or is aborted.
In case of multi-byte register reads with Firmware Memory
cycle, the device will return register data for the addressed
register until the command finishes, or is aborted.
TABLE 14: BLOCK LOCKING REGISTERS
Block
Protected Memory Address1 Range
Memory Map
Register
Size
16K
8K
SST49LF004C
SST49LF008C
Register Address1
T_BLOCK_LK
07FFFFH-07C000H
07BFFFH-07A000H
079FFFH-078000H
077FFFH-070000H
06FFFFH-060000H
05FFFFH-050000H
04FFFFH-040000H
03FFFFH-030000H
02FFFFH-020000H
01FFFFH-010000H
00FFFFH-000000H
0FFFFFH-0FC000H
0FBFFFH-0FA000H
0F9FFFH-0F8000H
0F7FFFH-0F0000H
0EFFFFH-0E0000H
0DFFFFH-0D0000H
0CFFFFH-0C0000H
0BFFFFH-0B0000H
0AFFFFH-0A0000H
09FFFFH-090000H
08FFFFH-080000H
07FFFFH-070000H
06FFFFH-060000H
05FFFFH-050000H
04FFFFH-040000H
03FFFFH-030000H
02FFFFH-020000H
01FFFFH-010000H
00FFFFH-000000H
FFBFC002H
FFBFA002H
FFBF8002H
FFBF0002H
FFBE0002H
FFBD0002H
FFBC0002H
FFBB0002H
FFBA0002H
FFB90002H
FFB80002H
FFB70002H
FFB60002H
FFB50002H
FFB40002H
FFB30002H
FFB20002H
FFB10002H
FFB00002H
T_MINUS01_LK
T_MINUS02_LK
T_MINUS03_LK
T_MINUS04_LK
T_MINUS05_LK
T_MINUS06_LK
T_MINUS07_LK
T_MINUS08_LK
T_MINUS09_LK
T_MINUS10_LK
T_MINUS11_LK
T_MINUS12_LK
T_MINUS13_LK
T_MINUS14_LK
T_MINUS15_LK
T_MINUS16_LK
T_MINUS17_LK
T_MINUS18_LK
8K
32K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
T14.0 1292
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory
map depending on ID strapping values on ID[3:0] pins when multiple LPC memory devices are used in a system.
TABLE 15: PROTECTED DATA AREA SECTOR LOCKING REGISTERS
SST49LF00xC PDA Protected Addresses1
Sector
Size
Memory Map
Register
For Write Access
For Read Access
Register Address1
T_PDA2_LK
T_PDA1_LK
T_PDA0_LK
4K
4K
4K
FFFC A000H–FFFC AFFFH
FFFC 9000H–FFFC 9FFFH
FFFC 8000H–FFFC 8FFFH
FFBC A000H–FFBC AFFFH
FFBC 9000H–FFBC 9FFFH
FFBC 8000H–FFBC 8FFFH
FFBC 2202H
FFBC 1202H
FFBC 0202H
T15.0 1292
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4 GByte system memory
map depending on ID strapping values on ID[3:0] pins when multiple LPC memory devices are used in a system.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
22
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
TABLE 16: BLOCK/PDA SECTOR LOCKING REGISTER BITS
Reserved Bit Read-Lock Bit Lock-Down Bit Write-Lock Bit
[7:3]
[2]
[1]
[0]
Lock Status
00000
00000
00000
00000
00000
00000
00000
00000
0
0
0
Full Access
0
0
1
Write Locked (Default State at Power-Up)
Locked Open (Full Access Locked Down)
Write Locked Down
0
1
0
0
1
1
1
0
0
Block Read Locked (Registers alterable)
Block Read & Write Lock (Registers alterable)
Block Read Locked Down (Registers not alterable)
1
0
1
1
1
0
1
1
1
Block Read & Write lock Down (Registers not alterable)
T16.0 1292
Write-Lock Bit
Lock-Down Bit
The Write-Lock bit, bit 0, controls the lock state described
in Table 16. The default Write status of all blocks after
power up is write locked. When bit 0 of the Block Locking
register is set, Program and Erase operations for the corre-
sponding block are prevented. Clearing the Write-Lock bit
will unprotect the block. The Write-Lock bit must be cleared
prior to starting a Program or Erase operation since it is
sampled at the beginning of the operation. The Write-Lock
bit functions in conjunction with the hardware Write Lock
pin TBL# for the top Boot Block. When TBL# is low, it over-
rides the software locking scheme. The top Boot Block
Locking register does not indicate the state of the TBL#
pin. The Write-Lock bit functions in conjunction with the
hardware WP#/AAI pin for the remaining blocks (Blocks 0
to 17 for 49LF008C and Blocks 0 to 9 for 49LF004C).
When WP#/AAI is low, it overrides the software locking
scheme. The Block Locking register does not indicate the
state of the WP#/AAI pin.
The Lock-Down bit, bit 1, controls the Block Locking regis-
ter as described in Table 16. When in LPC interface mode,
the default Lock Down status of all blocks upon power-up is
not locked down. Once the Lock-Down bit is set, any future
attempted changes to that Block Locking register will be
ignored. The Lock-Down bit is only cleared upon a device
reset with RST# or INIT# or power down. Current Lock
Down status of a particular block can be determined by
reading the corresponding Lock-Down bit. Once a block’s
Lock-Down bit is set, the Read-Lock and Write-Lock bits for
that block can no longer be modified: the block is locked
down in its current state of read/write accessibility.
Read-Lock Bit
The default read status of all blocks upon power-up is read-
unlocked. When a block’s read lock bit is set, data cannot
be read from that block. An attempted read from a read-
locked block will result in the data 00h. The read lock status
can be unlocked by clearing the read lock bit: this can only
be done provided that the block is not locked down. The
current read lock status of a particular block can be deter-
mined by reading the corresponding read-lock bit.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
23
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
Security ID Registers
The SST49LF0xxC devices offer a 256-bit Security ID reg-
ister space. The Security ID space is divided into two seg-
ments - one (64 bits) factory programmed segment and
one (192 bits) user programmed segment. The first seg-
ment is programmed and locked at SST with a unique 64-
bit number. The user segment (192-bits) is left blank (FFH)
for the customer to be programmed as desired. The user
can use standard Register read cycles to read the Security
ID space, or use the Security ID Program command to pro-
gram the space. Refer to Table 8, “Software Command
Sequence” for more details.
The Write Lock-out status of the Security ID space can be
read from the SEC_ID_WRITE_LOCK register (see Table
17). The SEC_ID_WRITE_LOCK register is a “read only”
register that is accessible at the address location specified
in Table 14. In the case of multi-byte register reads with
Firmware Memory cycle, for SEC_ID_WRITE_LOCK reg-
ister, the device will return register data for the addressed
register until the command finishes, or is aborted.
In the case of multi-byte register reads with Firmware Mem-
ory cycle, for the all the SEC_ID_BYTE registers, the
device will return page-aligned sequential register data with
wrap-around until the command finishes, or is aborted.
The Security ID Information and its Write Lock/Unlock sta-
tus can be Read in the Register Access Space for Execute-
In-Place (XIP) type of applications. (See Table 17.)
TABLE 17: SECURITY ID REGISTERS
Register
Register Address1
Value
Access
Description
SEC_ID__WRITE_LOCK
FFBC0102H
0000 0000b
0000 0001b
R
Write Unlocked
Write Locked
SEC_ID_BYTE_0
SEC_ID_BYTE_1
SEC_ID_BYTE_2
SEC_ID_BYTE_3
…
FFBC0180H
FFBC0181H
FFBC0182H
FFBC0183H
…
R
R
R
R
…
R
R
R
…
R
R
Factory Programmed
Factory Programmed
Factory Programmed
Factory Programmed
…
SEC_ID_BYTE_7
SEC_ID_BYTE_8
SEC_ID_BYTE_9
…
FFBC0187H
FFBC0188H
FFBC0189H
…
Factory Programmed
User Programmed
User Programmed
…
SEC_ID_BYTE_30
SEC_ID_BYTE_31
FFBC019EH
FFBC019FH
User Programmed
User Programmed
T17.0 1292
1. Address shown in this column is for boot device only. Address locations should appear elsewhere in the 4GByte system memory
map depending on ID strapping values on ID[3:0] pins according with multiple device selection mechanism.
TABLE 18: JEDEC ID REGISTERS
JEDEC ID Registers
Register
Default
Value
The JEDEC ID registers for the boot device appear at
FFBC0000H and FFBC0001H in the 4 GByte system
memory map, and will appear elsewhere if the device is not
the boot device. This register is not available to be read
when the device is in Erase/Program operation. Unused
register location will read as 00H. See Table 18 for the
JEDEC device ID code. In case of multi-byte register reads
with Firmware Memory cycle, the device will return register
data for the addressed register until the command finishes,
or is aborted.
Register
Address1
Access
MANUF_REG
DEV_REG
FFBC 0000H
BFH
R
SST49LF004C
SST49LF008C
FFBC 0001H
FFBC 0001H
54H
59H
R
T18.0 1292
1. Address shown in this column is for boot device only.
Address locations should appear elsewhere in the 4
GByte system memory map depending on ID strapping
values on ID[3:0] pins when multiple LPC memory
devices are used in a system.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
24
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
AUTO-ADDRESS INCREMENT (AAI) MODE
AAI Mode with Multi-byte Programming
AAI mode with multi-byte programming is provided for high-
speed production programming. Auto-Address Increment
mode requires only one address load for each 128-byte
page of data. The Multi-Byte Programming feature allows
simultaneous multi-byte programming. Note: The Security
ID area and the Protected Data Area cannot be pro-
grammed using AAI mode.
Data will be accepted by the device as long as LD# is low
and RY/BY# is high (until the last byte of the 128-byte page
has been entered). For partial data-loads (i.e., less than
128 Bytes), LD# may be taken high (VIH) to end the data
loading. If LD# goes high before the full 128-byte page has
been entered, the device will program the data which has
been entered to that point, and then terminate the AAI
page programming command. Any incompletely loaded
data byte (nibble) will not be programmed. The device will
signify completion of the command by driving RY/BY# high.
Once RY/BY# goes high, LD# can be taken low to begin a
new AAI programming operation at a different address
location.
Taking the WP#/AAI pin to the Supervoltage VH enables
the AAI mode. The AAI command is started as a normal
Firmware Memory cycle. LD# should be low (VIL) as long
as data is being loaded into the device. In the MADDR field,
the host may input any address within the 128-byte page to
be programmed. The least significant seven bits of the
address field will be ignored and the device will begin pro-
gramming at the beginning of the 128-byte page (i.e., the
address will be page-aligned). The device Ready/Busy sta-
tus is output on the RY/BY# pin.
The RY/BY# pin will stay low while internal programming
completes. When the entire 128-byte page has been pro-
grammed, the device will return to the idle mode and the
RY/BY# pin will go high (VIH) to indicate the AAI command
has been completed.
Data is accepted until the internal buffer is full. At that point
RY/BY# goes low (busy) to indicate that the internal buffer
is full and cannot accept any more data. When the device
is ready, RY/BY# pin goes high and indicates to the host
that more data (the next group of bytes) can be accepted
by the internal data buffer (see Table 19 and Figure 8).
TABLE 19: LD# INPUT AND RY/BY# STATUS IN
AAI MODE
LD# RY/BY# RY/BY#
state status
Flag indication
L
H
Device is Ready, can accept more data
until the last (128th) byte.
LD# is taken high by the host after loading the final byte(s)
of the 128-byte page. the RY/BY# signal remains low until
the completion of internal programming. After the comple-
tion of programming, the part will go into idle mode and the
RY/BY# will go high indicating that the AAI command has
been completed (see Table 19). A subsequent AAI com-
mand may be initiated to begin programming the next 128-
byte page.
L
L
L
Device is Busy, cannot accept more data
H
Device is Ready for next operation if
previous data is the last (128th) byte.
H
H
H
L
Device is Ready for next operation
Device is Busy programming
T19.0 1292
The user may terminate AAI programming by dropping the
WP#/AAI pin to TTL levels (VIH/VIL) as long as LD# is high
and RY/BY# returns to high indicating the completion of the
AAI cycle. Software block-locking will be disabled in AAI
mode (all blocks will be write-unlocked). If AAI drops below
the Supervoltage VH before RY/BY# returns to high (and
LD# high), the contents of the page may be indeterminate.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
25
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
AAI Data Load Protocol
TABLE 20: AAI PROGRAMMING CYCLE (INITIATED WITH WP#/AAI AT VH ONLY)
Clock Cycle Field Name
Field Contents
LAD[3:0]
Comments
1
2
START
IDSEL
1110
IN
LFRAME# must be active (low) for the part to respond.
Only the last start field (before LFRAME# transitions
high) should be recognized. The START field contents
indicate a Firmware Memory Write cycle. (1110b)
0000b to 1111b
IN
IN
ID works identically to Firmware Memory cycle.
This field indicates which SST49LF00xC device should
respond. If the IDSEL (ID select) field matches the
value of ID[3:0], then that particular device will
respond to the whole bus cycle.
3-9
MADDR
YYYY
These seven clock cycles make up the 28-bit memory
address. YYYY is one nibble of the entire address.
Addresses are transferred most-significant nibble first.
Only bits [19:7] for 8M, [18.7] for 4M of the total
address [27:0] are used for AAI mode. The rest are
“don’t care”.
10
MSIZE
DATA
KKKK
ZZZZ
IN
IN
MSIZE field is don’t care when in AAI mode
11-266
Data is transmitted to the device least significant nib-
ble first, from byte 0 to byte 127 as long as the RY/BY#
is high and LD# low. The host will pause the clock and
data stream when RY/BY# goes low until it returns
high, signifying that the chip is ready for more data
T20.0 1292
V
H
WP#/AAI
1
2
3
4
5
6
7
8
9 10 11 12
264 266
LCLK
(Data Strobe Input)
LFRAME#
Start
MADDR
DATA
DATA
Byte N
DATA
DATA
DATA DATA
Address
LAD[3:0]
LD#
MSIZE
Byte 0
Byte
N+1
Byte
2N
Byte
126
Byte
127
IDSEL
RY/BY#
1292 F08.0
FIGURE 8: AAI Load Protocol Waveform
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
26
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
ELECTRICAL SPECIFICATIONS
The AC and DC specifications for the LPC interface signals (LAD[3:0], LFRAME#, LCLCK and RST#) as defined in Section
4.2.2.4 of the PCI local Bus specification, Rev. 2.1. Refer to Table 21 for the DC voltage and current specifications. Refer to
Table 25 through Table 27 for the AC timing specifications for Clock, Read, Write, and Reset operations.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin (except WP#/AAI) to Ground Potential1 . . . . . . . . . . . . . . -2.0V to VDD+2.0V
Voltage on WP#/AAI Pin to Ground Potential2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 11.0V
Package Power Dissipation Capability (TA=25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Solder Reflow Temperature3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
Output Short Circuit Current4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Do not violate processor or chipset specification regarding INIT# voltage.
2. The maximum DC voltage on WP#/AAI pin may reach 11V for periods <20ns.
3. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240°C for 10 seconds; please consult the factory for the latest information.
4. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE
Range
Ambient Temp
VDD
Commercial
0°C to +85°C
3.0-3.6V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . . 3 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF
See Figure 14
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
27
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
DC Characteristics
TABLE 21: DC OPERATING CHARACTERISTICS (ALL INTERFACES)
Limits
Symbol Parameter
Min
Max
Units Test Conditions
1
IDD
Active VDD Current
LCLK (LPC mode)=VILT/VIHT at f=33 MHz
All other inputs=VIL or VIH
Read
18
40
mA All outputs = open, VDD=VDD Max
mA f=33 MHz
Single-/Dual-Byte Program, Erase
Quad-Byte Program
60
mA f=33 MHz
ISB
Standby VDD Current
(LPC Interface)
100
µA
LCLK (LPC mode)=VILT/VIHT at f=33 MHz
LFRAME#=.9VDD, f=33 MHz,
VDD=VDD Max
All other inputs ≥ 0.9 VDD or ≤ 0.1 VDD
2
IRY
Ready Mode VDD Current
10
mA
LCLK (LPC mode)=VILT/VIHT at f=33 MHz
LFRAME#=VIL, f=33 MHz, VDD=VDD Max
All other inputs ≥ 0.9 VDD or ≤ 0.1 VDD
II
Input Leakage Current for ID[3:0] pins
Input Leakage Current
Output Leakage Current
Supervoltage Current for WP#/AAI
Supervoltage for WP#/AAI
INIT# Input High Voltage
INIT# Input Low Voltage
Input Low Voltage
200
1
µA
µA
µA
µA
V
VIN=GND to VDD, VDD=VDD Max
VIN=GND to VDD, VDD=VDD Max
VOUT=GND to VDD, VDD=VDD Max
ILI
ILO
IH
1
200
VH
VIHI
8.5
1.1
9.5
3
VDD+0.5
0.4
V
VDD=VDD Max
3
VILI
VIL
-0.5
-0.5
V
VDD=VDD Min
0.3 VDD
V
VDD=VDD Min
VIH
VOL
Input High Voltage
0.5 VDD VDD+0.5
0.1 VDD
V
VDD=VDD Max
Output Low Voltage
V
IOL=1500 µA, VDD=VDD Min
IOH=-500 µA, VDD=VDD Min
VOH
Output High Voltage
0.9 VDD
V
T21.0 1292
1. IDD active while a Read or Write (Program or Erase) operation is in progress.
2. The device is in Ready mode when no activity is on the LPC bus.
3. Do not violate processor or chipset specification regarding INIT# voltage.
TABLE 22: RECOMMENDED SYSTEM POWER-UP TIMINGS
Symbol
Parameter
Minimum
100
Units
µs
1
TPU-READ
Power-up to Read Operation
Power-up to Write Operation
1
TPU-WRITE
100
µs
T22.0 1292
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter
TABLE 23: PIN CAPACITANCE (VDD=3.3V, TA=25 °C, f=1 Mhz, other pins open)
Parameter
Description
Test Condition
VI/O=0V
Maximum
12 pF
1
CI/O
I/O Pin Capacitance
Input Capacitance
Pin Inductance
1
CIN
VIN=0V
12 pF
2
LPIN
20 nH
T23.0 1292
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
2. Refer to PCI spec.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
28
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
TABLE 24: RELIABILITY CHARACTERISTICS
Minimum
Symbol
Parameter
Endurance
Data Retention
Latch Up
Specification
Units
Cycles
Years
mA
Test Method
1
NEND
10,000
100
JEDEC Standard A117
JEDEC Standard A103
JEDEC Standard 78
1
TDR
1
ILTH
100 + IDD
T24.0 1292
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 25: CLOCK TIMING PARAMETERS (LPC MODE)
Symbol
TCYC
THIGH
TLOW
-
Parameter
Min
30
11
11
1
Max
Units
ns
Cycle Time
LCLK High Time
ns
LCLK Low Time
ns
LCLK Slew Rate (peak-to-peak)
RST# or INIT# Slew Rate
4
V/ns
-
50
mV/ns
T25.0 1292
T
CYC
T
HIGH
0.6 V
DD
T
LOW
0.5 V
DD
0.4 V
(minimum)
p-to-p
DD
0.4 V
DD
0.3 V
DD
0.2 V
DD
1292 F09.0
FIGURE 9: LCLK WAVEFORM (LPC MODE)
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
29
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
TABLE 26: RESET TIMING PARAMETERS, VDD=3.0-3.6V (LPC MODE)
Symbol
TPRST
TRSTP
TRSTF
Parameter
Min
100
100
Max
Units
VDD stable to Reset High
µs
RST# Pulse Width
ns
ns
RST# Low to Output Float
RST# High to LFRAME# Low
RST# Low to reset during Sector-/Block-Erase or Program
48
10
1
TRST
5
LCLK cycles
TRSTE
µs
T26.0 1292
1. There will be a latency due to TRSTE if a reset procedure is performed during a Program or Erase operation,
V
DD
T
PRST
T
RSTP
RST#/INIT#
Sector-/Block-Erase
T
RSTE
or Program operation
aborted
T
RST
T
RSTF
LAD[3:0]
LFRAME#
1292 F10.0
FIGURE 10: RESET TIMING DIAGRAM (LPC MODE)
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
30
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
AC Characteristics
TABLE 27: READ/WRITE CYCLE TIMING PARAMETERS, VDD=3.0-3.6V (LPC MODE)
Symbol
TCYC
TSU
Parameter
Min
30
7
Max
Units
ns
Clock Cycle Time
Data Set Up Time to Clock Rising
Clock Rising to Data Hold Time
Clock Rising to Data Valid
Byte Programming Time
ns
TDH
0
ns
1
TVAL
2
11
10
25
25
10
ns
TBP
TSE
TBE
TES
TON
TOFF
µs
Sector-Erase Time
ms
ms
µs
Block-Erase Time
Program/Erase-Suspend Latency
Clock Rising to Active (Float to Active Delay)
Clock Rising to Inactive (Active to Float Delay)
2
ns
28
ns
T27.0 1292
1. Minimum and maximum times have different loads. See PCI spec
TABLE 28: AC INPUT/OUTPUT SPECIFICATIONS (LPC MODE)
Symbol
IOH(AC)
Parameter
Min
Max
Units
mA
Conditions
Switching Current High
-12 VDD
0 < VOUT ≤ 0.3VDD
0.3VDD < VOUT < 0.9VDD
0.7VDD < VOUT < VDD
VOUT = 0.7VDD
-17.1(VDD-VOUT
)
mA
Equation C1
-32 VDD
(Test Point)
mA
IOL(AC)
Switching Current Low
16 VDD
26.7 VOUT
Equation D1
mA
mA
VDD >VOUT ≥ 0.6VDD
0.6VDD > VOUT > 0.1VDD
0.18VDD > VOUT > 0
(Test Point)
38 VDD
mA
mA
VOUT = 0.18VDD
ICL
Low Clamp Current
High Clamp Current
Output Rise Slew Rate
Output Fall Slew Rate
-25+(VIN+1)/0.015
-3 < VIN ≤-1
ICH
25+(VIN-VDD-1)/0.015
mA
VDD+4 > VIN ≥ VDD+1
0.2VDD-0.6VDD load
0.6VDD-0.2VDD load
slewr2
slewf2
1
1
4
4
V/ns
V/ns
T28.0 1292
1. See PCI spec.
2. PCI specification output load is used.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
31
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
V
V
TH
TL
V
TEST
LCLK
T
VAL
LAD [3:0]
(Valid Output Data)
LAD [3:0]
(Float Output Data)
T
ON
T
OFF
1292 F11.0
FIGURE 11: OUTPUT TIMING PARAMETERS (LPC MODE)
V
V
TH
TL
V
LCLK
TEST
T
SU
T
DH
LAD [3:0]
(Valid Input Data)
Inputs
Valid
V
MAX
1292 F12.0
FIGURE 12: INPUT TIMING PARAMETERS (LPC MODE)
TABLE 29: INTERFACE MEASUREMENT CONDITION PARAMETERS (LPC MODE)
Symbol
Value
0.6 VDD
0.2 VDD
0.4 VDD
0.4 VDD
1
Units
1,2
VTH
V
V
1,2
VTL
VTEST
V
1,2
VMAX
V
Input Signal Edge Rate
V/ns
T29.0 1292
1. The input test environment is done with 0.1 VDD of overdrive over VIH and VIL. Timing parameters must be met with no more over-
drive than this. VMAX specifies the maximum peak-to-peak waveform allowed for measuring input timing. Production testing may use
different voltage values, but must correlate results back to these parameters.
2. In the case of multi-byte read, VTL = 0.1 VDD and VTH = 0.9VDD
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
32
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
V
H
WP#/AAI
T
ACYC
V
V
TH
TL
V
TEST
LCLK
T
ASU
T
ADH
LAD [3:0]
(Valid Input Data)
V
Inputs Valid
MAX
T
LDSU
T
LDDH
LD#
T
RB
RY/BY#
1292 F13.0
FIGURE 13: INPUT TIMING PARAMETERS (AAI MODE)
TABLE 30: INPUT CYCLE TIMING PARAMETERS, VDD=3.0-3.6V (AAI MODE)
Symbol
TACYC
TASU
Parameter
Min
135
25
Max
Units
ns
Clock Cycle Time
Data Set Up Time to Clock Rising
Clock Rising to Data Hold Time
RY/BY# LD# Falling
LD# Set Up Time
ns
TADH
25
ns
TRB
25
ns
TLDSU
TLDDH
25
ns
LD# Hold Time
25
ns
T30.0 1292
TO TESTER
TO DUT
C
L
1292 F15.0
FIGURE 14: A TEST LOAD EXAMPLE
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
33
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
PRODUCT ORDERING INFORMATION
SST49LF 008C
-
33
-
4C
-
WH E
SST49LF xxxC
-
XXX
-
XX
-
XX X
Environmental Attribute
E1 = non-Pb
Package Modifier
H = 32 leads
Package Type
N = PLCC
W = TSOP (type 1, die up, 8mm x 14mm)
Temperature Range
C = Commercial = 0°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Operating Frequency
33 = 33 MHz
Device Density
008 = 8 Mbit
004 = 4 Mbit
Voltage
L = 3.0-3.6V
Product Series
49 = LPC Serial Flash
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.
Valid combinations for SST49LF004C
SST49LF004C-33-4C-NHE SST49LF004C-33-4C-WHE
Valid combinations for SST49LF008C
SST49LF008C-33-4C-NHE SST49LF008C-33-4C-WHE
Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales
representative to confirm availability of valid combinations and to determine availability of new combinations.
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
34
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
BOTTOM VIEW
PACKAGING DIAGRAMS
TOP VIEW
SIDE VIEW
.495
.485
.112
.106
.453
.447
Optional
Pin #1
Identifier
.048
.042
.029
.023
.040
.030
.020 R.
MAX.
x 30˚
R.
2
1
32
.042
.048
.021
.013
.400
BSC
.530
.490
.595 .553
.585 .547
.032
.026
.050
BSC
.015 Min.
.095
.075
.050
BSC
.032
.026
.140
.125
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32-plcc-NH-3
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
35
4 Mbit / 8 Mbit LPC Serial Flash
SST49LF004C / SST49LF008C
Advance Information
1.05
0.95
Pin # 1 Identifier
0.50
BSC
8.10
7.90
0.27
0.17
0.15
0.05
12.50
12.30
DETAIL
1.20
max.
0.70
0.50
14.20
13.80
0˚- 5˚
0.70
0.50
Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
32-tsop-WH-7
1mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
TABLE 31: REVISION HISTORY
Revision
Description
Date
00
Jan 2006
•
Initial release of data sheet
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©200 Silicon Storage Technology, Inc.
S71292-00-000
1/06
36
相关型号:
SST49LF008A-33-4C-EIE
1M X 8 FLASH 3V PROM, 120 ns, PDSO40, 10 X 20 MM, ROHS COMPLIANT, MO-142CD, TSOP1-40
MICROCHIP
SST49LF008A-33-4C-NHE
1M X 8 FLASH 3V PROM, 120 ns, PQCC32, ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32
MICROCHIP
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