ZM5304AE-CME3R [SILICON]

FULLY INTEGRATED Z-WAVEÂ® WIRELESS MODEM WITH ON-BOARD ANTENNA;


型号：	ZM5304AE-CME3R
厂家：	SILICON
描述：	FULLY INTEGRATED Z-WAVEÂ® WIRELESS MODEM WITH ON-BOARD ANTENNA
文件：	总39页 (文件大小：3451K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATASHEET: ZM5304

Features

FULLY INTEGRATED Z-WAVE® WIRELESS MODEM WITH

ON-BOARD ANTENNA

•

Complete Z-Wave stack available over

UART or USB

•

Firmware upgradeable via UART or USB

32kB of byte addressable NVM memory

Fully Integrated crystal, EEPROM, SAW

filter, matching circuit, and antenna

No external components required

FCC modular transmitter approval

ITU G.9959 compliant

•

Modem

•

UART speed up to 230.4kbps

USB 2.0 full speed

Z-Wave serial API accessed over UART or

USB

•

ADC for internal battery monitoring

Hardware AES-128 security engine

Power-On-Reset / Brown-out Detector

Supply voltage range from 2.3V to 3.6V for

optional battery operation

TX mode current typ. 36mA @ 0dBm

RX mode current typ. 33mA

Normal mode current typ. 15mA

Sleep mode current typ. 2µA

Less than 1ms cold start-up time

The Silicon Labs ZM5304 Modem is a fully integrated Z-Wave modem

module in a small 27mm x 15.2mm x 5.5mm form factor. It is an ideal

solution for home control applications such as access control, appliance

control, AV control, building automation, energy management, lighting,

security, and sensor networks in the “Internet of Things”.

•

A baseband controller, sub-1 GHz radio transceiver, crystal, decoupling,

SAW filter, matching, and the antenna is included to provide a complete

Z-Wave solution to an application executing in an external host

microcontroller. The ZM5304 Modem is certified with the FCC modular

transmitter approval, ready to be used in any product without additional

testing and license costs.

Radio Transceiver

•

Receiver sensitivity with SAW filter down

to -103dBm @ 9.6kbps

Transmit power with SAW filter up to

+4dBm

Z-Wave 9.6/40/100kbps data rates

Supports all Z-Wave sub-1 GHz frequency

bands (865.2MHz to 926.3MHz)

Supports multi-channel frequency agility

and listen before talk

The ZM5304 Modem is based on an 8-bit 8051 CPU core, which is

optimized to handle the data and link management requirements of a

Z-Wave node. The UART0 or USB interface can be used to access the

Z-Wave stack available in the on-chip Flash memory, or to easily upgrade

the modem firmware.

•

FCC ID

IC ID

D87-ZM5304-U

11263A-ZM5304

Regulatory Compliance

ACMA: AS/NZS 4268

CE: EN 300 220/489

FCC: CFR 47 Part 15

IC: RSS-GEN/210

MIC: ARIB STD-T108

DSH12461-14 | 3/2018

Datasheet: ZM5304

CONTENT

OVERVIEW.......................................................................................................................................................................... 4

2.1

PERIPHERALS........................................................................................................................................................................... 4

Advanced Encryption Standard Security Processor..................................................................................................... 4

Analog-to-Digital Converter ........................................................................................................................................ 5

Brown-Out Detector / Power-On-Reset....................................................................................................................... 5

Crystal Driver and System Clock.................................................................................................................................. 5

Universal Asynchronous Receiver / Transmitter ......................................................................................................... 5

Universal Serial Bus..................................................................................................................................................... 5

Watchdog.................................................................................................................................................................... 6

Wireless Transceiver.................................................................................................................................................... 6

MEMORY MAP........................................................................................................................................................................ 6

MODULE PROGRAMMING.......................................................................................................................................................... 7

Entering In-System Programming Mode..................................................................................................................... 7

Entering Auto Programming Mode............................................................................................................................. 7

POWER SUPPLY REGULATOR ...................................................................................................................................................... 7

2.1.1

2.1.2

2.1.3

2.1.4

2.1.5

2.1.6

2.1.7

2.1.8

2.2

2.3

2.3.1

2.3.2

2.4

TYPICAL APPLICATION ........................................................................................................................................................ 8

PIN CONFIGURATION.......................................................................................................................................................... 9

4.1

PIN FUNCTIONALITY.................................................................................................................................................................. 9

ELECTRICAL CHARACTERISTICS.......................................................................................................................................... 11

5.1

TEST CONDITIONS .................................................................................................................................................................. 11

Typical Values............................................................................................................................................................ 11

Minimum and Maximum Values............................................................................................................................... 11

ABSOLUTE MAXIMUM RATINGS................................................................................................................................................ 12

GENERAL OPERATING RATINGS................................................................................................................................................. 12

CURRENT CONSUMPTION ........................................................................................................................................................ 12

SYSTEM TIMING..................................................................................................................................................................... 13

NON-VOLATILE MEMORY RELIABILITY........................................................................................................................................ 14

ANALOG-TO-DIGITAL CONVERTER ............................................................................................................................................. 14

DC CHARACTERISTICS ............................................................................................................................................................. 15

RF CHARACTERISTICS.............................................................................................................................................................. 16

Transceiver ................................................................................................................................................................ 16

Antenna..................................................................................................................................................................... 16

Regulatory Compliance ............................................................................................................................................. 23

5.1.1

5.1.2

5.2

5.3

5.4

5.5

5.6

5.7

5.8

5.9

5.9.1

5.9.2

5.9.3

Z-WAVE FREQUENCIES...................................................................................................................................................... 24

MODULE INFORMATION................................................................................................................................................... 25

7.1

7.2

MODULE MARKING................................................................................................................................................................ 25

MODULE DIMENSIONS............................................................................................................................................................ 25

PROCESS SPECIFICATION................................................................................................................................................... 26

PCB MOUNTING AND SOLDERING..................................................................................................................................... 26

9.1

9.2

9.3

PCB MOUNTING PATTERN ...................................................................................................................................................... 26

RECOMMENDED PLACEMENT ON PCB ....................................................................................................................................... 27

SOLDERING INFORMATION....................................................................................................................................................... 27

DSH12461-14 | 3/2018

Datasheet: ZM5304

9.4

VISUAL INFORMATION........................................................................................................................................................... 28

ORDERING INFORMATION ............................................................................................................................................ 29

10.1 TAPE AND REEL INFORMATION ................................................................................................................................................. 30

10.2 CANADA IC STATEMENT .......................................................................................................................................................... 32

ABBREVIATIONS............................................................................................................................................................ 34

REVISION HISTORY........................................................................................................................................................ 36

REFERENCES.................................................................................................................................................................. 38

DSH12461-14 | 3/2018

Datasheet: ZM5304

OVERVIEW

The ZM5304 Modem is a fully integrated module with an on-board antenna that allows the establishment of a Z-Wave network

with minimum risk. The SD3503 modem chip is used with an external NVM (EEPROM), 32MHz crystal, power supply decoupling,

SAW filter, matching circuit, and a helical antenna. Figure 2.1 shows the main blocks of the ZM5304 Modem, while Figure 2.2

illustrates the firmware stack of an example application.

ZM5304

EEPROM

Memory

SPI

SD3503

Voltage

Regulator

VDD

Decoupling

ADC

AES

Helical

Antenna

RESET_N

POR / BOD

Sub-1 GHz

Radio

SAW Filter &

Matching

UART0 RX

UART0 TX

Transceiver

UART

USB

8051 CPU

USB_DP

USB_DM

Flash

Memory

32MHz

XTAL

Figure 2.1: Functional block diagram

HOST

Application

UART0 / USB

ZM5304

Z-Wave Serial API

Z-Wave Protocol Stack

Network Layer

MAC Layer

ITU G.9959

PHY Layer

Figure 2.2: Firmware stack

2.1 PERIPHERALS

2.1.1 ADVANCED ENCRYPTION STANDARD SECURITY PROCESSOR

The Z-Wave protocol specifies the use of Advanced Encryption Standard (AES) 128-bit block encryption for secure applications.

The built-in Security Processor is a hardware accelerator that encrypts and decrypts data at a rate of 1 byte per 1.5µs. It encodes

DSH12461-14 | 3/2018

Datasheet: ZM5304

the frame payload and the message authentication code to ensure privacy and authenticity of messages. The processor supports

Output FeedBack (OFB), Cipher-Block Chaining (CBC), and Electronic CodeBook (ECB) modes to target variable length messages.

Payload data is streamed in OFB mode, and authentication data is processed in CBC mode as required by the Z-Wave protocol.

The processor implements two efficient access methods: Direct Memory Access (DMA) and streaming through Special Function

2.1.2 ANALOG-TO-DIGITAL CONVERTER

The Analog-to-Digital Converter (ADC) is capable of sampling an input voltage source and returns an 8- or 12-bit unsigned

representation of the input scaled relative to the selected reference voltage. It can be configured to implement a battery

monitor, as described by the formula below.

ꢆ_ꢇꢈ

ꢀꢁꢂ_ꢃꢄꢅ

× 2^{ꢊꢋꢌꢍꢎꢏ ꢐꢑ ꢍꢒꢓꢔ}

ꢆ_ꢉꢉ

The ADC is capable of operating rail to rail, where the built-in Band-gap V_BG= 1.25V and V_DDis the supply voltage. When the

supply voltage crosses a predefined lower or upper voltage threshold, an interrupt can be triggered.

2.1.3 BROWN-OUT DETECTOR / POWER-ON-RESET

When a cold start-up occurs, an internal Power-On-Reset (POR) circuit ensures that code execution does not begin unless the

supply voltage is sufficient. After which, an internal Brown-Out Detector (BOD) circuit guarantees that faulty code execution

does not occur by entering the reset state, if the supply voltage drops below the minimum operating level. These guarantees

apply equally in both the active and sleep modes.

2.1.4 CRYSTAL DRIVER AND SYSTEM CLOCK

The system clock and RF frequencies are derived from the module mounted 32MHz crystal (XTAL), which internal system

performance is factory trimmed to guarantee initial RF frequency precision.

2.1.5 UNIVERSAL ASYNCHRONOUS RECEIVER / TRANSMITTER

The Universal Asynchronous Receiver / Transmitter (UART) is a hardware block operating independently of the 8051 CPU. It

offers full-duplex data exchange, up to 230.4kbps, with an external host microcontroller requiring an industry standard NRZ

asynchronous serial data format. The UART0 interface is available over pin 4 and pin 5 (refer section 4). A data byte is shifted as

a start bit, 8 data bits (lsb first), and a stop bit, respectively, with no parity and hardware handshaking. Figure 2.3 shows the

waveform of a single serial byte. UART0 is compliant with RS-232 when an external level converter is used.

START

BIT

STOP

BIT

Figure 2.3: UART0 waveform

2.1.6 UNIVERSAL SERIAL BUS

A Universal Serial Bus (USB) 2.0 full speed interface is available over pin 6 and pin 7 (refer section 4). The Communication Device

Class / Abstract Control Mode (CDC/ACM) provides an emulated virtual COM port to a host. This makes it easy to migrate from

legacy RS-232 communication to USB communication. Figure 2.4 shows the two termination resistors necessary to maintain

signal integrity of the differential pair and a single pull-up resistor on USB_DP, which indicates a full speed device to the host.

DSH12461-14 | 3/2018

Datasheet: ZM5304

ZM5304

1.5kΩ

22Ω

USB_DP

USB_DM

Host

Figure 2.4: USB interface

The controller supports USB suspend mode and remote wake-up. During suspend mode, except for the crystal oscillator clocking

at a slower rate and the active USB controller, the entire CPU is powered off. The USB controller uses the DMA for fast data

transfer and automatic data retransmissions/CRC to maintain data integrity.

2.1.7 WATCHDOG

The watchdog helps prevents the CPU from entering a deadlock state. A timer that is enabled by default achieves this by

triggering a reset event in case it overflows. The timer overflows in 1 second, therefore it is essential that the software clear the

timer periodically. The watchdog is disabled when the chip is in power down mode, and automatically restarts with a cleared

timer when waking up to the active mode.

2.1.8 WIRELESS TRANSCEIVER

The wireless transceiver is a sub-1 GHz ISM narrowband FSK radio, a modem, and a baseband controller. This architecture

provides an all-digital direct synthesis transmitter and a low IF digital receiver. The Z-Wave protocol currently utilizes 2-key

FSK/GFSK modulation schemes at 9.6/40/100 kbps data rates throughout a span of carrier frequencies from 865.2MHz to

926.3MHz.

The output power of the transmitter is configurable in the range -26dBm to +4dBm (V_DD= +2.3V to +3.6V, T_A= -10°C to +85°C).

2.2 MEMORY MAP

An application executing on an external host microcontroller can access the higher address space of the integrated EEPROM via

the serial API. As shown in Figure 2.5, the protocol data is stored in the lower address space. A serial API function returns the

size of the application data space. [1][2]

EEPROM Memory

(Byte addressable)

0x7FFF

Application Data

(Available to Host)

Offset

Protocol Data

(Reserved for Modem)

0x0000

Figure 2.5: EEPROM memory map

DSH12461-14 | 3/2018

Datasheet: ZM5304

2.3 MODULE PROGRAMMING

The firmware of the ZM5304 Modem can be upgraded either via UART0 or USB interface. [3] In-System Programming is the

default mode delivered from the factory.

2.3.1 ENTERING IN-SYSTEM PROGRAMMING MODE

The module can be placed into the UART0 In-System Programming (ISP) mode by asserting the active low RESET_N signal for

5.2ms. The programming unit of the module then waits for the “Interface Enable” serial command before activating the ISP

mode over UART0.

2.3.2 ENTERING AUTO PROGRAMMING MODE

Alternatively, the module can be placed into the Auto Programming Mode (APM) by calling a serial API function. The

programming unit of the module will enter APM immediately after a hardware or software reset. Once the module is in APM,

the firmware can be written to the internal flash using either the UART0 or USB interface.

2.4 POWER SUPPLY REGULATOR

While the supply to the digital I/O circuits is unregulated, on-chip low-dropout regulators derive all the 1.5 V and 2.5 V internal

supplies required by the Micro-Controller Unit (MCU) core logic, non-volatile data registers, flash, and the analogue circuitry.

DSH12461-14 | 3/2018

Datasheet: ZM5304

TYPICAL APPLICATION

An illustration of two application examples using the ZM5304 Modem implementation follows. The host application located on

an external microcontroller accesses the Z-Wave stack via the serial API. Figure 3.1 depicts the scenario when UART0 is used as

the primary interface to the ZM5304 Modem, while Figure 3.2 shows the scenario when the USB¹is used. In the latter scenario,

UART0 must be routed out to test points in order to program the initial firmware during production. It is strongly recommended

that the power supply is decoupled sufficiently.

3V3

VDD

GPIO

TXD

RESET_N

UART0 RX

UART0 TX

Host

ZM5304

RXD

GND

Figure 3.1: Example of a host microcontroller based application using UART0

3V3

VDD

RESET_N

UART0 RX

UART0 TX

TP1

TP2

TP3

1.5kΩ±5%

22Ω±5%

USB_DP

USB_DM

USB_DP

USB_DM

Host

ZM5304

GND

Figure 3.2: Example of a host microcontroller based application using the USB

¹Firmware upgrades can be performed only when the ZM5304 Modem is placed in APM.

DSH12461-14 | 3/2018

Datasheet: ZM5304

PIN CONFIGURATION

The layout of the pins on the ZM5304 Modem is shown in Figure 4.1.

14.50

GND

RESET_N

GND

12.10

11.10

10.10

9.10

8.10

7.10

6.10

5.10

4.10

3.10

UART0 TX

UART0 RX

USB_DM

USB_DP

GND

Copper

Free

Ground Plane

(Top View)

GND

VDD

GND

0.70

0.6

* All dimensions are in millimeters (mm)

Figure 4.1: Pin layout (top view)

4.1 PIN FUNCTIONALITY

Table 4.1: Power, ground, and no connect signals

Pin Name

V_DD

GND

Pin Location

Type²

Function

Module power supply.

Ground. Must be connected to the ground

1, 8, 10, 11, 24, 25, 28, 30, 34, 35, 48

plane.

3, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 26, 27, 29,

31, 32, 33, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47

Placement pins for mechanical stability.

Leave unconnected.

²I = Input, O = Output, D+ = Differential Plus, D- = Differential Minus, S = Supply

DSH12461-14 | 3/2018

Datasheet: ZM5304

Table 4.2: Module control signals

Pin Name

RESET_N

Pin Location

Type

Function

Active low signal that places the module in

a reset state.

Table 4.3: UART0 interface signals

Pin Name Pin Location

Type

Function in Reset State

Waits for the “Interface Enable” serial

command after 5.2ms. Enters UART0 ISP

mode after command is received from the

host.

Function in Active State

Receive data from host serial port.

UART0 RX

UART0 TX

Serial data transmit when in UART0 ISP

mode, high impedance with internal pull-

up otherwise.

Transmit data to host serial port.

Table 4.4: USB interface signals

Pin Name Pin Location

Type

D+

Function in Reset State

ISP when in APM mode, high impedance

with internal pull-up otherwise.

Function in Active State

USB 2.0 full-speed positive differential

signal.

USB_DP

USB_DM

D-

ISP when in APM mode, high impedance

with internal pull-up otherwise.

USB 2.0 full-speed negative differential

signal.

DSH12461-14 | 3/2018

Datasheet: ZM5304

ELECTRICAL CHARACTERISTICS

This section describes the electrical parameters of the ZM5304 Modem module.

5.1 TEST CONDITIONS

Characterization in Lab

(T_A=-10°C to +85°C, V_DD=+2.3V to +3.6V)

Sorting criterion

specified with Min and

Max values

Statistics with Min,

Typ, and Max values

Manufactured

Modules

Tested

Modules

Final Test in Production

(T_A=+25°C, V_DD=+3.3V)

Figure 5.1: Testing flow

The following conditions apply for characterization in the lab, unless otherwise noted.

1. Ambient temperature T_A= -10°C to +85°C

2. Supply voltage V_DD= +2.3V to +3.6V

3. All tests are carried out on the ZDB5304 Z-Wave Development Board. [4]

4. Total radiated power is measured for 868.4, 908.4, and 921.4MHz

The following conditions apply for the final test in production, unless otherwise noted.

1. Ambient temperature T_A= +25°C

2. Supply voltage V_DD= +3.3V

3. Near-field radiated transmission power is measured for 868.4, 908.4, and 921.4MHz

4. Near-field radiated receiver sensitivity is measured for 868.4, 908.4, and 921.4MHz

5.1.1 TYPICAL VALUES

Unless otherwise specified, typical data refer to the mean of a data set measured at an ambient temperature of T_A=25°C and

supply voltage of V_DD=+3.3V.

5.1.2 MINIMUM AND MAXIMUM VALUES

Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature,

supply voltage and frequencies by a final test in production on 100% of the devices at an ambient temperature of T_A=25°C and

supply voltage of V_DD=+3.3V.

For data based on measurements, the minimum and maximum values represent the mean value plus or minus three times the

standard deviation (µ±3σ).

DSH12461-14 | 3/2018

Datasheet: ZM5304

5.2 ABSOLUTE MAXIMUM RATINGS

The absolute ratings specify the limits beyond which the module may not be functional. Exposure to absolute maximum

conditions for extended periods may cause permanent damage to the module.

Table 5.1: Voltage characteristics

Symbol

V_DD

Description

Min

Max

+3.6

Unit

Main supply voltage

-0.3

V_IN

I_IN

ESD_HBM

ESD_MM

ESD_CDM

Voltage applied on any I/O pin

-0.3

+3.6

+20.0

+2000.0

+200.0

+500.0

Current limit when over driving the input (V_IN> V_DD

JEDEC JESD22-A114F Human Body Model

JEDEC JESD22-A115C Machine Model

)

JEDEC JESD22-C101E Field-Induced Charged-Device Model

Table 5.2: Current characteristics

Symbol

I_VDD

I_GND

Description

Current into VDD power supply pin

Sum of the current out of all GND ground pins

Min

Max

+120

Unit

-120

Table 5.3: Thermal characteristics

Symbol

Description

Min

Max

Unit

T_J

Junction temperature

-55

+125

°C

5.3 GENERAL OPERATING RATINGS

The operating ratings indicate the conditions where the module is guaranteed to be functional.

Table 5.4: Recommended operating conditions

Symbol

V_DD

V_{DD_USB}

f_SYS

Description

Standard operating supply voltage

Standard operating supply voltage when USB PHY is used

Internal clock frequency

Ambient operating temperature

Min

+2.3

Typ

+3.3

32.0

+25.0

Max

Unit

MHz

°C

+3.6

+3.0

T_A

-10.0

+85.0

5.4 CURRENT CONSUMPTION

Measured at an ambient temperature of T_A=-10°C to +85°C and a supply voltage of V_DD=+2.3V to +3.6V.

DSH12461-14 | 3/2018

Datasheet: ZM5304

Table 5.5: Current consumption in active modes

Description Min

MCU running at 32MHz

MCU and radio receiver active

Symbol

Typ

14.8

32.7

27.7

42.7

Max

15.8

Unit

I_{DD_ACTIVE}

I_{DD_RX}

I_{DD_TX_01}

I_{DD_TX_63}

35.0

MCU and radio transmitter active, RFPOW=01

MCU and radio transmitter active, RFPOW=63

Table 5.6: Current consumption in power saving modes

Description Min

Symbol

I_{DD_SLEEP}

I_{USB_SLEEP}

Typ

Max

Unit

µA

Module in sleep state

USB suspend mode with state persistency, and system clock

1.7

2.0

3.7

2.3

Table 5.7: Current consumption during programming

Description Min

Symbol

I_{DD_PGM_UART0}

I_{DD_PGM_USB}

Typ

Max

Unit

Programming via UART0

Programming via USB

5.5 SYSTEM TIMING

Measured at an ambient temperature of T_A=-10°C to +85°C and a supply voltage of V_DD=+2.3V to +3.6V.

Table 5.8: Transition between operating modes

Symbol

t_{ACTIVE_SLEEP}

t_{SLEEP_ACTIVE}

Description

Min

Typ

Max

Unit

µs

Transition time from the active state to the sleep state

Transition time from the sleep state to the active state ready

to execute code

125

160

Table 5.9: System start-up time

Symbol

Description

Min

Typ

Max

+2.3

Unit

V_POR

Power-on-Reset (POR) threshold on rising supply voltage at

which the reset signal is deasserted

Transition time from the reset state to the active state ready

to execute code with a power rise time not exceeding 10µs

t_{RESET_ACTIVE}

1.0

Table 5.10: Reset timing requirements

Symbol

t_{RST_PULSE}

Description

Min

Typ

Max

Unit

Duration to assert RESET_N to guarantee a full system reset

DSH12461-14 | 3/2018

Datasheet: ZM5304

Table 5.11: Programming time

Description

Time taken to erase the entire flash memory

Time taken to program the entire flash memory over UART0

including a full erase

Symbol

t_{ERASE_FULL}

t_{PGM_FULL_UART0}

Min

Typ

Max

44.1

16.2

Unit

5.6 NON-VOLATILE MEMORY RELIABILITY

Qualified for an ambient temperature of TA=+25°C and a supply voltage of VDD=+3.3V. The on-chip memory is based on

SuperFlash® technology.

Table 5.12: On-chip flash

Symbol

END_FLASH

RET_FLASH-LT

RET_FLASH-HT

Description

Endurance, erase cycles before failure

Data retention

Data retention (Qualified for a junction temperature of

T_J=-10°C to +85°C)

Min

10000

100

Typ

Max

Unit

cycles

years

Table 5.13: On-chip high endurance NVM

Symbol

END_NVM

RET_NVM-LT

RET_NVM-HT

Description

Endurance, erase cycles before failure

Data retention

Data retention (Qualified for a junction temperature of

T_J=-10°C to +85°C)

Min

100000

100

Unit

cycles

years

Table 5.14: EEPROM

Symbol

END_EEPROM

RET_EEPROM

Description

Endurance, erase cycles before failure

Data retention

Min

1Mil

100

Unit

cycles

years

5.7 ANALOG-TO-DIGITAL CONVERTER

Measured at an ambient temperature of T_A=-10°C to +85°C and a supply voltage of V_DD=+2.3V to +3.6V.

DSH12461-14 | 3/2018

Datasheet: ZM5304

Table 5.15: 12-bit ADC characteristics

Description

Symbol

V_BG

DNL_ADC

ACC_8b

ACC_12b

f_S-8b

Min

+1.20

Max

+1.30

Unit

Internal reference voltage

Differential non-linearity

-1.00

-2.00

-5.00

+1.00 LSB

2.00 LSB

5.00 LSB

0.02 Msps

0.01 Msps

Accuracy when sampling 20ksps with 8-bit resolution

Accuracy when sampling 10ksps with 12-bit resolution

8-bit sampling rate

f_S-12b

12-bit sampling rate

5.8 DC CHARACTERISTICS

Measured at an ambient temperature of TA=-10°C to +85°C.

Table 5.16: Digital input characteristics, supply voltage of V_DD=+2.3V to +3.0V

Symbol

Description

Logical 1 input voltage high level

Logical 0 input voltage low level

Falling input trigger threshold

Rising edge trigger threshold

Min

+1.85

Max

Unit

V_IH

V_IL

V_IF

V_IR

+0.75

+1.05

+1.85

+0.85

+7.00

+90.00

30.00

15.00

+0.75

+1.35

+0.55

-7.00

+35.00

20.00

V_HYS

I_IH

I_IL-NPU

I_IL-PU

PU_IN

C_IN

Schmitt trigger voltage hysteresis

Logical 1 input high level current leakage

Logical 0 input low level current leakage (no internal pull-up resistor)

Logical 0 input low level current leakage (with internal pull-up resistor)

Internal pull-up resistance (T_A=+25°C)

Pin input capacitance

µA

kΩ

Table 5.17: Digital output characteristics, supply voltage of V_DD=+2.3V to +3.0V

Symbol

V_OH

V_OL

I_OH-LP

I_OL-LP

Description

Logical 1 output voltage high level

Logical 0 output voltage low level

Logical 1 output high level current sourcing

Logical 0 output low level current sinking

Min

Max

Unit

+1.9

+0.4

+6.0

-6.0

DSH12461-14 | 3/2018

Datasheet: ZM5304

Table 5.18: Digital input characteristics, supply voltage of V_DD=+3.0V to +3.6V

Symbol

Description

Logical 1 input voltage high level

Min

+2.10

Max

Unit

V_IH

V_IL

V_IF

V_IR

V_HYS

I_IH

I_IL-NPU

I_IL-PU

PU_IN

C_IN

Logical 0 input voltage low level

Falling input trigger threshold

Rising edge trigger threshold

Schmitt trigger voltage hysteresis

Logical 1 input high level current leakage

Logical 0 input low level current leakage (no internal pull-up resistor)

Logical 0 input low level current leakage (with internal pull-up resistor)

Internal pull-up resistance (T_A=+25°C)

Pin input capacitance

+0.90

+1.60

+0.65

-10.00

+40.00

15.00

+0.90

+1.30

+2.10

+0.95

+10.00

+120.00

20.00

15.00

µA

kΩ

Table 5.19: Digital output characteristics, supply voltage of V_DD=+3.0V to +3.6V

Symbol

V_OH

Description

Logical 1 output voltage high level

Min

Max

Unit

+2.4

V_OL

I_OH-LP

I_OL-LP

Logical 0 output voltage low level

Logical 1 output high level current sourcing

Logical 0 output low level current sinking

+0.4

+8.0

-8.0

5.9 RF CHARACTERISTICS

5.9.1 TRANSCEIVER

The radio transceiver of the ZM5304 is based on the SD3503 modem chip and an external SAW filter. Refer to [5] for

measurements on the conducted performance of the SD3503. Although the crystal is factory calibrated, it is mandatory to

calibrate the transmitter in production. Refer to [6] for more information.

5.9.2 ANTENNA

The radiation measurements for the ZM5304 were performed on the ZDP03A Z-Wave Development Platform. [7] The

orientation of the ZM5304 during the measurements is shown in Figure 5.2.

Figure 5.2: Measurement orientation

DSH12461-14 | 3/2018

Datasheet: ZM5304

5.9.2.1 REGION E

Table 5.20: Region E performance

Description

Symbol

Min

Typ

Max

Unit

MHz

dBm

dBi

f_C

Carrier frequency

868.40

-3.05

-7.05

3.47

TRP

ε_R

Total radiated power

Radiation efficiency

Directivity

Peak gain

-3.58

Figure 5.4: YZ plane (X back view)

Figure 5.3: YZ plane (X front view)

DSH12461-14 | 3/2018

Datasheet: ZM5304

Figure 5.5: XZ plane (Y front view)

Figure 5.6: XZ plane (Y back view)

Figure 5.7: XY plane, (Z front view)

Figure 5.8: XY plane, (Z back view)

DSH12461-14 | 3/2018

Datasheet: ZM5304

5.9.2.2 REGION U

Table 5.21: Region U performance

Description

Symbol

Min

Typ

Max

Unit

MHz

dBm

dBi

f_C

Carrier frequency

908.40

-3.95

-7.95

4.21

TRP

ε_R

Total radiated power

Radiation efficiency

Directivity

Peak gain

-3.74

Figure 5.10: YZ plane (X back view)

Figure 5.9: YZ plane (X front view)

DSH12461-14 | 3/2018

Datasheet: ZM5304

Figure 5.11: XZ plane (Y front view)

Figure 5.12: XZ plane (Y back view)

Figure 5.14: XY plane (Z back view)

Figure 5.13: XY plane (Z front view)

DSH12461-14 | 3/2018

Datasheet: ZM5304

5.9.2.3 REGION H

Table 5.22: Region H performance

Description

Symbol

Min

Typ

Max

Unit

MHz

dBm

dBi

f_C

Carrier frequency

921.40

-7.73

-11.73

4.26

TRP

ε_R

Total radiated power

Radiation efficiency

Directivity

Peak gain

-7.47

Figure 5.15: YZ plane (X front view)

Figure 5.16: YZ plane (X back view)

DSH12461-14 | 3/2018

Datasheet: ZM5304

Figure 5.17: XZ plane (Y front view)

Figure 5.18: XZ plane (Y back view)

Figure 5.19: XY plane (Z front view)

Figure 5.20: XY plane (Z back view)

DSH12461-14 | 3/2018

Datasheet: ZM5304

5.9.3 REGULATORY COMPLIANCE

The ZM5304 has been tested on the ZDP03A Z-Wave Development Platform to be compliant with the following regulatory

standards.

•

ACMA COMPLIANCE

AS/NZS 4268

CISPR 22

•

CE COMPLIANCE

EN 300 220-1/2

EN 301 489-1/3

EN 55022

EN 60950-1

EN 61000-4-2/3

EN 62479

•

FCC COMPLIANCE

FCC CFR 47 Part 15 Subpart C §15.212

IC COMPLIANCE³

RSS-GEN

RSS-210

ANSI C63.10

•

MIC COMPLIANCE

ARIB STD-T108

³This module complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including interference

that may cause undesired operation. This device is intended only for OEM integrators under the following conditions:

•

The antenna must be installed such that 20 cm is maintained between the antenna and users, and

The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module installed

DSH12461-14 | 3/2018

Datasheet: ZM5304

Z-WAVE FREQUENCIES

Table 6.1: Z-Wave RF specification

Data rate

Modulation

Frequency deviation

Coding

9.6kbps

40kbps

100kbps

Gaussian Frequency Shift Keying (GFSK)

f_C±29.3kHz

Frequency Shift Keying (FSK)

FSK

f_C±20kHz

Manchester encoded

Non-return to Zero (NRZ)

NRZ

United Arab Emirates

Australia

Brazil

868.42 MHz

868.40 MHz

869.85 MHz

919.80 MHz

916.00 MHz

869.85 MHz

919.80 MHz

921.42 MHz

921.40 MHz

921.42 MHz

921.40 MHz

Canada

908.42 MHz

908.40 MHz

Chile

908.42 MHz

908.40 MHz

China

868.42 MHz

868.40 MHz

European Union

Hong Kong

Israel

868.42 MHz

868.40 MHz

919.82 MHz

919.80 MHz

916.02 MHz

916.00 MHz

India

865.20 MHz

922.50 MHz

923.90 MHz

926.30 MHz

920.90 MHz

921.70 MHz

923.10 MHz

916.00 MHz

868.10 MHz

919.80 MHz

Japan

Korea

Mexico

908.42 MHz

868.12 MHz

921.42 MHz

869.02 MHz

868.42 MHz

908.40 MHz

868.10 MHz

921.40 MHz

869.00 MHz

868.40 MHz

Malaysia

New Zealand

Russia

Singapore

Taiwan

869.85 MHz

922.50 MHz

923.90 MHz

926.30 MHz

916.00 MHz

869.85 MHz

United States

South Africa

908.42 MHz

868.42 MHz

908.40 MHz

868.40 MHz

DSH12461-14 | 3/2018

Datasheet: ZM5304

MODULE INFORMATION

7.1 MODULE MARKING

Table 7.1: Marking description

REGION

Model: ZM5304-U

FCC ID: D87-ZM5304-U

IC: 11263A-ZM5304

Figure 7.1: Marking placement

NB: The shield is only mounted on the U regional module.

7.2 MODULE DIMENSIONS

15.20 +/- 0.3

Shield

* All dimensions are in millimeters (mm)

Figure 7.2: Top view of module

5.5 +/- 0.6

3.8 +/- 0.6

ANTENNA

Shield

GND Plane

Copper Free

* All dimensions are in millimeters (mm)

Figure 7.3: Side view of module

DSH12461-14 | 3/2018

Datasheet: ZM5304

PROCESS SPECIFICATION

Specification

Description

MSL 3

Moisture Sensitivity Level designed and manufactured according to JEDEC J-STD-020C

REACH

REACH is a European Community Regulation on chemicals and their safe use (EC 1907/2006).

It deals with the Registration, Evaluation, Authorisation and Restriction of Chemical

substances

RoHS

Designed in compliance with The Restriction of Hazardous Substances Directive (RoHS)

PCB MOUNTING AND SOLDERING

9.1 PCB MOUNTING PATTERN

The land pattern is required to include two drilled holes of diameter 1.8mm at the positions indicated, to ensure clearance to

antenna structures.

The recommended land pattern includes a layout of 48 pads of size 1.70 mm x 0.65 mm positioned as indicated in the figure.

All coordinates are relative to the centre of pad 11.

1.70mm

Ø1.8mm

24.40mm

13.3mm

-0.3mm

-0.98mm

13.00mm

19.60mm

Figure 9.1: Top view of land pattern

DSH12461-14 | 3/2018

Datasheet: ZM5304

9.2 RECOMMENDED PLACEMENT ON PCB

Recommended metal free space

> 55mm

recommended

> 5mm

recommended

> 50mm

recommended

> 55mm

recommended

> 50mm

recommended

PCB ground plane with components

Copper free PCB

Figure 9.2: Top view of recommended placement of module on PCB

9.3 SOLDERING INFORMATION

The soldering details to properly solder the ZM5304 module on standard PCBs are described below. The information provided is

intended only as a guideline and Silicon Labs is not liable if a selected profile does not work.

See IPC/JEDEC J-STD-020D.1 for more information.

Table 9.1: Soldering details

PCB solder mask expansion from landing pad edge

PCB paste mask expansion from landing pad edge

PCB process

PCB finish

Stencil aperture

Stencil thickness

Solder paste used

Flux cleaning process

0.1 mm

0.0 mm

Pb-free (Lead free for RoHS⁴compliance)

Defined by the manufacturing facility (EMS) or customer

⁴RoHS = Restriction of Hazardous Substances Directive, EU

DSH12461-14 | 3/2018

Datasheet: ZM5304

Figure 9.3: Typical reflow profile

9.4 VISUAL INFORMATION

The modules visual appearance can be different from the picture on the front page of this datasheet. I.e. colour of antenna and

PCB is allowed to vary. Other visual elements like batch numbers and revisions may vary too. Functional and electrical

performance will not be affected.

DSH12461-14 | 3/2018

Datasheet: ZM5304

10 ORDERING INFORMATION

Table 10.1: Ordering codes

Minimum Order

Package

Type

Orderable Device

Status

Pins

Description

Quantity

ZM5304AE-CME3R ACTIVE

ZM5304AU-CME3R ACTIVE

ZM5304AH-CME3R ACTIVE

SOM

500 pcs.

ZM5304 Modem Module, No Shield, RevA,

868MHz Band, Tape and Reel

ZM5304 Modem Module, With Shield, RevA,

908MHz Band, Tape and Reel

ZM5304 Modem Module, No Shield, RevA,

921MHz Band, Tape and Reel

SOM

500 pcs.

DSH12461-14 | 3/2018

Datasheet: ZM5304

10.1 TAPE AND REEL INFORMATION

Figure 10.1: Tape information

DSH12461-14 | 3/2018

Datasheet: ZM5304

Figure 10.2: Reel information

DSH12461-14 | 3/2018

Datasheet: ZM5304

Parameter

Value

Pin 1 Quadrant

Pocket Quadrant Q1

10.2 CANADA IC STATEMENT

This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including interference

that may cause undesired operation.

Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son

fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2)

ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.

THIS DEVICE IS INTENDED ONLY FOR OEM INTEGRATORS UNDER THE FOLLOWING CONDITIONS: (FOR

MODULE DEVICE USE)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module installed.

CET APPAREIL EST CONÇU UNIQUEMENT POUR LES INTÉGRATEURS OEM DANS LES CONDITIONS

SUIVANTES: (POUR UTILISATION DE DISPOSITIF MODULE)

1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et

2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires.

Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité

supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location with another

transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In

DSH12461-14 | 3/2018

Datasheet: ZM5304

these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and

obtaining a separate Canada authorization.

NOTE

IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de

certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut

pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris

l'émetteur) et l'obtention d'une autorisation distincte au Canada.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be

maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains

IC:

”.

Plaque signalétique du produit final

Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle

sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un

endroit visible avec l'inscription suivante: "Contient des IC:

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF

module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de

supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué

dans ce manuel.

DSH12461-14 | 3/2018

Datasheet: ZM5304

11 ABBREVIATIONS

Abbreviation

2FSK

2GFSK

ACM

ACMA

ADC

AES

API

APM

Description

2-key Frequency Shift Keying

2-key Gaussian Frequency Shift Keying

Abstract Control Model

Australian Communications and Media Authority

Analog-to-Digital Converter

Advanced Encryption Standard

Application Programming Interface

Auto Programming Mode

Audio Video

BOD

CBC

CDC

COM

CPU

CRC

Brown-Out Detector

Cipher-Block Chaining

Communications Device Class

Conformité Européenne

Communication

Central Processing Unit

Cyclic Redundancy Check

Differential

D-

Differential Minus

D+

Differential Plus

Direct Current

Direct Memory Access

Electronic CodeBook

Electronic Manufacturing Services

Federal Communications Commission

Frame Error Rate

DMA

ECB

EMS

FCC

FER

FLiRS

FSK

GFSK

GPIO

Frequently Listening Routing Slave

Frequency Shift Keying

Gaussian Frequency Shift Keying

General Purpose Input Output

Input

I/O

Input / Output

Integrated Circuit

IPC

IRAM

ISM

ISP

ITU

JEDEC

Lsb

Intermediate Frequency

Interconnecting and Packaging Circuits

Indirectly addressable Random Access Memory

Industrial, Scientific, and Medical

In-System Programming

International Telecommunications Union

Joint Electron Device Engineering Council

Least Significant Bit

LSB

Least Significant Byte

MCU

MIC

Msb

MSB

NRZ

NVM

NVR

Micro-Controller Unit

Ministry of Internal affairs and Communications, Japan

Most Significant Bit

Most Significant Byte

Non-Return-to-Zero

Non-Volatile Memory

Non-Volatile Registers

Output

OEM

Original Equipment Manufacturer

OFB

Output FeedBack

DSH12461-14 | 3/2018

Datasheet: ZM5304

Abbreviation

Description

Lead

PCB

POR

RAM

RoHS

ROM

RS-232

Printed Circuit Board

Power-On Reset

Random Access Memory

Radio Frequency

Restriction of Hazardous Substances

Read Only Memory

Recommended Standard 232

Receive

Supply

SAW

SFR

SOM

SRAM

Surface Acoustic Wave

Special Function Register

System-in-Module

Static Random Access Memory

Transmit

UART

USB

XRAM

XTAL

Universal Asynchronous Receiver Transmitter

Universal Serial Bus

External Random Access Memory

Crystal

DSH12461-14 | 3/2018

Datasheet: ZM5304

12 REVISION HISTORY

Date

Version

Affected

§6, Table 6.1

§5.9.3

Table 5.5

Table 5.11

$2.1.4

Revision

2018/02/19

2017/05/02

2016/12/21

Updated Korea frequency

Added Giteki mark

Cleaned up “TBD” values

Removed “t_{PGM_FULL_USB}

”

2016/04/29

2015/11/25

Updated wording in section 2.1.4 Crystal driver and system

clock

Figure 9.1

Footprint updated to Landing Solder Pad Toe and Heel

0.4mm. All pads on footprint are now aligned to center of

pads on module. Drill hole diameter only stated in mm.

Updated to align with SD3503 recommendation.

Removed – information included in updated Figure 9.1

Added section Process Specification

Added orientation of component in tape

Updated picture on cover

Figure 9.3

Table 9.2

§8

§10.1

§Cover

2015/02/17

§8.4

§7.2

Added section “VISUAL INFORMATION”

Added tolerances

2014/12/19

2014/12/14

2014/04/11

§9.2

§Cover, §7,1

§2.3.1

Adding full Canada IC statement

Updated with Canada IC number

Mandatory mounting holes added to the PCB mounting

pattern. Drawing and text is updated.

Increased RESET_N low period

Updated with measurement values

Changed to a battery monitor implementation

Added resistor values

Removed size of application area

Added UART0 and RESET_N as test points

Updated test conditions

2013/12/12

2013/11/13

§2.3.1

§Cover,

§2.1.2,

Figure 2.4,

Figure 2.5,

Figure 3.2,

§5.1,

§5.4,

Table 5.13,

Removed graph and updated current consumption values

Added NVM performance data

§5.9.1,

§5.9.2,

§5.9.3

Replaced transmitter and receiver with a reference to SD3503

Added radiated measurements of the antennas

Updated the standards list

2013/08/28

2013/08/26

§5.9, §12

Added transmitter and receiver bandwidth to Tables 5.19 and

5.21

Updated 4A revision description

Clarified cover page summary to reflect controller based

applications

§Cover, §2, §3, §4, §5.2, §5.8,

§6, §7, §11

Added FCC ID to cover page

Changed TXD and RXD to UART0 TX and UART0 RX in Figure

2.1, Figure 3.1, and Figure 4.1

Renamed ‘pad’ to ‘pin’ throughout document except §9.3

Added pin dimensions to Figure 4.1

Fixed Korea Z-Wave frequency

Changed the location of the FCC ID label in Figure 7.1 and

Figure 7.2

Updated Figure 7.3 to thru-hole antenna

Added table of abbreviations

2013/07/02

§1, §2, §5

§2.1.8, §11

Removed remnants of WUT

Removed invalid references to the WUT and added the date

to the references

Added dimensions of shield

2013/07/01

§2.1, §2.3, §7.2, §6

DSH12461-14 | 3/2018

Datasheet: ZM5304

Date

Version

Affected

Revision

Changed the low operating voltage from 2.5V to 2.3V

Added AES, ADC, XTAL driver, BOD, RST controller, WUT,

Watchdog, and RF transceiver sections to the peripheral

descriptions

Changed “Firmware Upgrade” to “Module Programming” and

added default programming mode

Changed the module width to 15.05mm

Removed the frequency from the module marking and added

region data to the frequency table

2013/06/03

2013/05/31

§5.5

§All

Added transition time values

Removed empty page

Updated IO characteristics and added USB termination

resistor values

2013/05/30

2013/05/27

§All

Added missing receiver graphs and proposed changes

Updated layout with feedback from the technical writer, and

data from the latest corner tests

2013/02/22

2013/02/18

§All

Preliminary draft released

Initial draft

DSH12461-14 | 3/2018

Datasheet: ZM5304

13 REFERENCES

[1]

[2]

[3]

[4]

[5]

[6]

[7]

INS12350, Instruction, “Serial API Host Application Programming Guide”

INS12308, Instruction, “Z-Wave 500 Series Application Programmers Guide”

INS11681, Instruction, “500 Series Z-Wave Single Chip Programming Mode”

DSH12468, Datasheet, “ZDB5304 Z-Wave Development Board”

DSH12469, Datasheet, “SD3503”

INS12213, Instruction, “500 Series Hardware Integration Guide”

DSH11243, Datasheet, “ZDP03A, Z-Wave Development Platform”

DSH12461-14 | 3/2018

Smart.

Connected.

Energy-Friendly.

Products

www.silabs.com/products

Quality

www.silabs.com/quality

Support and Community

community.silabs.com

Disclaimer

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included

information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted

hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of

Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant

personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass

destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.

Trademark Information

Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®,

EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,

Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, Z-Wave and others are trademarks or

registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited.

All other products or brand names mentioned herein are trademarks of their respective holders.

Silicon Laboratories Inc.

400 West Cesar Chavez

Austin, TX 78701

USA

http://www.silabs.com

ZM5304AE-CME3R [SILICON]

相关型号：

ZM5304AH-CME3R

ZM5304AU-CME3R

ZM56B

ZM5V1B

ZM5V6B

ZM62B

ZM68B

ZM6V2B

ZM6V8B

ZM7108-T2

ZM7108-T2G

ZM7108-T3