SM3119NAUC-TRG [SINOPWER]

N-Channel Enhancement Mode MOSFET;
SM3119NAUC-TRG
型号: SM3119NAUC-TRG
厂家: Sinopower Semiconductor Inc    Sinopower Semiconductor Inc
描述:

N-Channel Enhancement Mode MOSFET

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SM3119NAU  
®
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
30V/50A,  
D
RDS(ON)=10.5m(max.) @ VGS=10V  
RDS(ON)=14.5m(max.) @ VGS=4.5V  
S
G
100% UIS + Rg Tested  
Reliable and Rugged  
Top View of TO-252-2  
Lead Free and GreenDevices Available  
(RoHSCompliant)  
D
Applications  
G
Power Management in Desktop Computer or  
DC/DC Converters.  
S
N-ChannelMOSFET  
Ordering and Marking Information  
Package Code  
SM3119NA  
U : TO-252-2  
Assembly Material  
Handling Code  
Operating Junction Temperature Range  
C : -55 to 150 oC  
Handling Code  
TR : Tape & Reel  
Assembly Material  
Temperature Range  
Package Code  
G : Halogen and Lead Free Device  
SM3119NA U :  
XXXXX - Lot Code  
SM3119NA  
XXXXX  
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-  
free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER  
defines Greento mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight  
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
1
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Absolute Maximum Ratings (TA = 25°C Unless Otherwise Noted)  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings  
30  
±20  
150  
-55 to 150  
30  
VDSS  
VGSS  
TJ  
Drain-Source Voltage  
Gate-Source Voltage  
V
°C  
°C  
A
Maximum Junction Temperature  
Storage Temperature Range  
TSTG  
IS  
Diode Continuous Forward Current  
TC=25°C  
120  
80  
IDP  
Pulse Drain Current Tested  
Continuous Drain Current  
A
A
TC=100°C  
TC=25°C  
50*  
35  
a
ID  
TC=100°C  
TC=25°C  
50  
PD  
Maximum Power Dissipation  
W
TC=100°C  
Steady State  
t 10s  
20  
RθJC  
RθJA  
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
2.5  
°C/W  
°C/W  
20  
Steady State  
L=0.1mH  
L=0.1mH  
50  
b
IAS  
Avalanche Current, Single pulse  
Avalanche Energy, Single pulse  
23  
A
b
EAS  
26.45  
mJ  
Note a* Current limited by bond wire.  
Note bUIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature Tj=25oC).  
2
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Unit  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
30  
34  
-
-
-
-
V
V
VGS=0V, IDS=250µA  
Drain-Source Breakdown Voltage  
VGS=0V, ID(aval)=14A  
Tcase=25°C, ttransient=100ns  
BVDSSt  
(transient)  
VDS=24V, VGS=0V  
TJ=85°C  
-
-
-
1
30  
IDSS  
Zero Gate Voltage Drain Current  
µA  
-
VGS(th) Gate Threshold Voltage  
IGSS Gate Leakage Current  
1.5  
1.9  
-
2.5  
±100  
10.5  
-
V
VDS=VGS, IDS=250µA  
VGS=±20V, VDS=0V  
VGS=10V, IDS=30A  
TJ=125°C  
-
-
-
-
-
nA  
8.5  
12.7  
12  
40  
c
RDS(ON) Drain-Source On-state Resistance  
mΩ  
S
VGS=4.5V, IDS=15A  
VDS=5V, IDS=15A  
14.5  
-
Gfs  
Forward Transconductance  
Diode Characteristics  
c
VSD  
trr  
Diode Forward Voltage  
ISD=30A, VGS=0V  
-
-
-
-
-
0.9  
20  
12  
8
1.1  
V
Reverse Recovery Time  
Charge Time  
-
-
-
-
ta  
ns  
nC  
IDS=30A, dlSD/dt=100A/µs  
tb  
Discharge Time  
Qrr  
Reverse Recovery Charge  
11  
Dynamic Characteristics d  
RG  
Ciss  
Coss  
Crss  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
2.0  
3
760  
128  
72  
8
4.5  
910  
155  
95  
Input Capacitance  
630  
VGS=0V,  
VDS=15V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
105  
pF  
55  
-
td(ON) Turn-on Delay Time  
tr Turn-on Rise Time  
td(OFF) Turn-off Delay Time  
tf Turn-off Fall Time  
Gate Charge Characteristics d  
16  
VDD=15V, RL=15,  
IDS=1A, VGEN=10V,  
RG=6Ω  
-
10  
24  
4.6  
19  
ns  
-
43  
-
8.8  
VDS=15V, VGS=4.5V,  
IDS=30A  
Qg  
Total Gate Charge  
-
7
9
Qg  
Qgth  
Qgs  
Qgd  
Total Gate Charge  
-
-
-
-
14  
1.4  
2.8  
3
17  
1.9  
3.3  
3.5  
nC  
Threshold Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDS=15V, VGS=10V,  
IDS=30A  
Note cPulse test ; pulse width300µs, duty cycle2%.  
Note dGuaranteed by design, not subject to production testing.  
3
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Typical Operating Characteristics  
Drain Current  
Power Dissipation  
60  
60  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
TC=25oC  
0
TC=25oC,VG=10V  
0
20 40 60 80 100 120 140 160  
0
20 40 60 80 100 120 140 160  
Tj - Junction Temperature (°C)  
Tj - Junction Temperature (°C)  
Safe Operation Area  
Thermal Transient Impedance  
5
1
400  
100  
1ms  
Duty = 0.5  
10ms  
0.2  
0.1  
10  
1
100ms  
1s  
0.05  
0.02  
0.1  
DC  
0.01  
Single Pulse  
Mounted on 1in2 pad  
TC=25OC  
R
θJA :20oC/W  
0.1  
0.01  
0.01  
0.1  
1
10  
100  
1E-4 1E-3 0.01  
0.1  
1
10  
100  
Square Wave PulseDuration (sec)  
VDS - Drain - Source Voltage (V)  
4
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Output Characteristics  
20  
18  
16  
14  
12  
10  
8
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VGS= 6,7,8,9,10V  
5V  
VGS=4.5V  
4.5V  
4V  
VGS=10V  
6
3.5V  
3V  
4
2
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
20  
40  
60  
80  
100  
VDS - Drain - Source Voltage (V)  
ID -Drain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
28  
24  
20  
16  
12  
8
IDS=30A  
IDS =250µA  
4
-50 -25  
0
25 50 75 100 125 150  
2
3
4
5
6
7
8
9
10  
Tj - Junction Temperature (°C)  
VGS - Gate - Source Voltage (V)  
5
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
100  
10  
1
VGS = 10V  
IDS = 30A  
Tj=150oC  
Tj=25oC  
RON@Tj=25oC: 8.5mΩ  
0.1  
-50 -25  
0
25 50 75 100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
Tj - Junction Temperature (°C)  
VSD - Source - Drain Voltage (V)  
Capacitance  
Gate Charge  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
10  
Frequency=1MHz  
VDS= 15V  
IDS= 30A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
5
10  
15  
20  
25  
30  
0
2
4
6
8
10  
12  
14  
QG -Gate Charge (nC)  
VDS - Drain - Source Voltage (V)  
6
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Avalanche Test Circuit and Waveforms  
VDS  
L
VDSX(SUS)  
tp  
DUT  
VDS  
IAS  
RG  
VDD  
VDD  
IL  
tp  
EAS  
0.01  
tAV  
Switching Time Test Circuit and Waveforms  
VDS  
RD  
VDS  
90%  
DUT  
VGS  
RG  
VDD  
10%  
VGS  
tp  
td(on) tr  
td(off) tf  
7
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Disclaimer  
Sinopower Semiconductor, Inc. (hereinafter Sinopower) has been making  
great efforts to development high quality and better performance products to  
satisfy all customersneeds. However, a product may fail to meet customers  
expectation or malfunction for various situations.  
All information which is shown in the datasheet is based on Sinopowers  
research and development result, therefore, Sinopower shall reserve the right  
to adjust the content and monitor the production.  
In order to unify the quality and performance, Sinopower has been following  
JEDEC while defines assembly rule. Notwithstanding all the suppliers  
basically follow the rule for each product, different processes may cause  
slightly different results.  
The technical information specified herein is intended only to show the typical  
functions of and examples of application circuits for the products. Sinopower  
does not grant customers explicitly or implicitly, any license to use or exercise  
intellectual property or other rights held by Sinopower and other parties.  
Sinopower shall bear no responsible whatsoever for any dispute arising from  
the use of such technical information.  
The products are not designed or manufactured to be used with any  
equipment, device or system which requires an extremely high level of  
reliability, such as the failure or malfunction of which any may result in a direct  
threat to human life or a risk of human injury. Sinopower shall bear no  
responsibility in any way for use of any of the products for the above special  
purposes. If a product is intended to use for any such special purpose, such  
as vehicle, military, or medical controller relevant applications, please contact  
Sinopower sales representative before purchasing.  
8
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Classification Profile  
9
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  
SM3119NAU  
®
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
150 C  
100 C  
°
°
Temperature min (Tsmin  
)
Temperature max (Tsmax  
Time (Tsmin to Tsmax) (ts)  
150 C  
200 C  
°
°
)
60-120 seconds  
60-120 seconds  
Average ramp-up rate  
(Tsmax to TP)  
3 C/second max.  
°
3 C/second max.  
°
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
°
°
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
See Classification Temp in table 2  
30** seconds  
Time (t )** within 5 C of the specified  
°
P
20** seconds  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 C/second max.  
°
6 C/second max.  
°
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
°
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process Classification Temperatures (Tc)  
Volume mm3  
Package  
Volume mm3  
Thickness  
<350  
350  
<2.5 mm  
235 °C  
220 °C  
220 °C  
220 °C  
2.5 mm  
Table 2. Pb-free Process Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
Volume mm3  
350-2000  
260 °C  
Volume mm3  
<350  
>2000  
260 °C  
245 °C  
245 °C  
260 °C  
1.6 mm 2.5 mm  
2.5 mm  
260 °C  
250 °C  
250 °C  
245 °C  
Reliability Test Program  
Test item  
Method  
JESD-22, B102  
JESD-22, A108  
Description  
SOLDERABILITY  
HTRB  
5 Sec, 245°C  
1000 Hrs, 80% of VDS max @ Tjmax  
1000 Hrs, 100% of VGS max @ Tjmax  
168 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -65°C~150°C  
HTGB  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
PCT  
TCT  
Customer Service  
Sinopower Semiconductor, Inc.  
5F, No. 6, Dusing 1St Rd., Hsinchu Science Park,  
Hsinchu, 30078, Taiwan  
TEL: 886-3-5635818 Fax: 886-3-5635080  
10  
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.8 - February, 2017  

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