SM4042DSKC-TRG [SINOPWER]

Dual N-Channel Enhancement Mode MOSFET;
SM4042DSKC-TRG
型号: SM4042DSKC-TRG
厂家: Sinopower Semiconductor Inc    Sinopower Semiconductor Inc
描述:

Dual N-Channel Enhancement Mode MOSFET

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中文:  中文翻译
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SM4042DSK  
®
Dual N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
D1  
D1  
D2  
Channel 1  
D2  
40V/6.5A,  
RDS(ON) = 18m(max.) @ VGS = 10V  
RDS(ON) = 25m(max.) @ VGS = 4.5V  
Channel 2 (ESD Protection)  
40V/7.4A,  
S1  
G1  
S2  
G2  
Top View of SOP-8  
RDS(ON) = 14m(max.) @ VGS =10V  
RDS(ON) = 18m(max.) @ VGS =4.5V  
100% UIS + Rg Tested  
(6) (5)  
D2 D2  
(8) (7)  
D1 D1  
Reliable and Rugged  
Lead FreeAvailable (RoHS Compliant)  
(4)  
G2  
(2)  
G1  
Applications  
S2  
(3)  
S1  
(1)  
Power Management in Note book.  
Battery Powered System.  
DC/DC Converter.  
N-ChannelMOSFET  
Ordering and Marking Information  
Package Code  
SM4042DS  
K : SOP-8  
Operating Junction Temperature Range  
Assembly Material  
Handling Code  
C : -55 to 150 oC  
Handling Code  
Temperature Range  
TR : Tape & Reel  
Assembly Material  
Package Code  
G : Halogen and Lead Free Device  
SM4042DS K :  
XXXXX - Lot Code  
4042DS  
XXXXX  
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-  
free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER  
defines Greento mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight  
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
1
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Channel 1 Channel 2  
Unit  
Common Ratings  
VDSS Drain-Source Voltage  
VGSS Gate-Source Voltage  
40  
V
V
±20  
±20  
TJ  
Maximum Junction Temperature  
150  
-55 to 150  
°C  
°C  
A
TSTG Storage Temperature Range  
IS  
ID  
Diode Continuous Forward Current  
Continuous Drain Current  
Pulse Drain Current  
1
1
7.4  
5.9  
29  
TA=25°C  
TA=70°C  
TA=25°C  
TA=25°C  
TA=70°C  
t 10s  
6.5  
5.2  
26  
A
A
a
IDM  
1.31  
0.84  
56  
1.31  
0.84  
54  
PD  
Maximum Power Dissipation  
W
b
Thermal Resistance-Junction to Ambient  
°C/W  
RθJA  
Steady State  
L=0.1mH  
L=0.1mH  
95  
95  
c
IAS  
Avalanche Current, Single pulse  
Avalanche Energy, Single pulse  
19  
20  
A
c
EAS  
18  
20  
mJ  
Note aPulse width is limited by max. junction temperature.  
Note bSurface mounted on 1in2 pad area, steady state t=999s.  
Note cUIS tested and pulse width are limited by maximum junction temperature 150oC (initial temperature Tj=25oC).  
2
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 1 Electrical Characteristics (TA = 25°C unless otherwise noted)  
Channel 1  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
40  
-
-
-
1
V
VGS=0V, IDS=250µA  
VDS=32V, VGS=0V  
-
IDSS Zero Gate Voltage Drain Current  
µA  
TJ=85°C  
-
-
30  
2.5  
±100  
18  
-
VGS(th) Gate Threshold Voltage  
IGSS Gate Leakage Current  
1.4  
1.8  
-
V
VDS=VGS, IDS=250µA  
VGS=±20V, VDS=0V  
VGS=10V, IDS=10A  
-
-
-
-
-
nA  
15  
24.8  
18.5  
22  
d
RDS(ON) Drain-Source On-state Resistance  
TJ=125°C  
mΩ  
S
VGS=4.5V, IDS=8A  
VDS=5V, IDS=8A  
25  
-
Gfs  
Forward Transconductance  
Diode Characteristics  
d
VSD  
trr  
Diode Forward Voltage  
ISD=1A, VGS=0V  
-
-
-
-
-
0.75  
14.6  
10  
1.1  
V
Reverse Recovery Time  
Charge Time  
-
-
-
-
ta  
ns  
nC  
IDS=10A, dlSD/dt=100A/µs  
VDD=20V  
tb  
Discharge Time  
4.6  
Qrr  
Reverse Recovery Charge  
9.4  
Dynamic Characteristics e  
RG  
Ciss  
Coss  
Crss  
td(ON)  
tr  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
-
-
-
-
-
-
-
-
2.5  
820  
100  
60  
5
-
-
-
-
-
-
-
Input Capacitance  
VGS=0V,  
VDS=20V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
pF  
10.6  
8
VDD=20V, RL=20,  
IDS=1A, VGEN=10V,  
RG=1Ω  
ns  
td(OFF) Turn-off Delay Time  
tf Turn-off Fall Time  
Gate Charge Characteristics e  
20.3  
4.6  
VDS=20V, VGS=4.5V,  
IDS=10A  
Qg  
Total Gate Charge  
-
7.7  
-
Qg  
Qgth  
Qgs  
Qgd  
Total Gate Charge  
-
-
-
-
15.7  
1.1  
-
-
-
-
nC  
Threshold Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDS=20V, VGS=10V,  
IDS=10A  
1.9  
3.6  
Note dPulse test ; pulse width300µs, duty cycle2%.  
Note eGuaranteed by design, not subject to production testing.  
3
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 2 Electrical Characteristics (TA = 25°C unless otherwise noted)  
Channel 2  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
40  
-
-
-
1
V
VGS=0V, IDS=250µA  
VDS=32V, VGS=0V  
-
IDSS Zero Gate Voltage Drain Current  
µA  
TJ=85°C  
-
-
30  
2.5  
±10  
14  
-
VGS(th) Gate Threshold Voltage  
IGSS Gate Leakage Current  
1.4  
1.8  
-
V
VDS=VGS, IDS=250µA  
VGS=±20V, VDS=0V  
VGS=10V, IDS=10A  
-
-
-
-
-
µA  
11  
15.5  
14  
18  
d
RDS(ON) Drain-Source On-state Resistance  
TJ=125°C  
mΩ  
S
VGS=4.5V, IDS=8A  
VDS=5V, IDS=8A  
18  
-
Gfs  
Forward Transconductance  
Diode Characteristics  
d
VSD  
trr  
Diode Forward Voltage  
ISD=1A, VGS=0V  
-
-
-
-
-
0.7  
20.1  
10.4  
9.7  
1.1  
V
Reverse Recovery Time  
Charge Time  
-
-
-
-
ta  
ns  
nC  
IDS=10A, dlSD/dt=100A/µs  
VDD=20V  
tb  
Discharge Time  
Qrr  
Reverse Recovery Charge  
10.7  
Dynamic Characteristics e  
RG  
Ciss  
Coss  
Crss  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
-
-
-
-
-
-
-
-
2
4
-
-
-
-
-
-
-
Input Capacitance  
700  
200  
30  
VGS=0V,  
VDS=20V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
pF  
td(ON) Turn-on Delay Time  
tr Turn-on Rise Time  
td(OFF) Turn-off Delay Time  
tf Turn-off Fall Time  
Gate Charge Characteristics e  
8.9  
VDD=20V, RL=20,  
IDS=1A, VGEN=10V,  
RG=1Ω  
7.6  
ns  
17.4  
13.5  
VDS=20V, VGS=4.5V,  
IDS=10A  
Qg  
Total Gate Charge  
-
5.6  
-
Qg  
Qgth  
Qgs  
Qgd  
Total Gate Charge  
-
-
-
-
11.4  
1.3  
-
-
-
-
nC  
Threshold Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDS=20V, VGS=10V,  
IDS=10A  
1.9  
1.7  
Note dPulse test ; pulse width300µs, duty cycle2%.  
Note eGuaranteed by design, not subject to production testing.  
4
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 1 Typical Operating Characteristics  
Drain Current  
Power Dissipation  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
7
6
5
4
3
2
1
0
TA=25oC  
TA=25oC,VG=10V  
0
20 40 60 80 100 120 140 160  
0
20 40 60 80 100 120 140 160  
Tj - Junction Temperature (°C)  
Tj - Junction Temperature (°C)  
Safe Operation Area  
Thermal Transient Impedance  
2
1
50  
10  
Duty = 0.5  
0.2  
0.1  
0.05  
300µs  
0.1  
0.01  
1E-3  
0.02  
0.01  
1ms  
1
0.1  
10ms  
Single Pulse  
100ms  
Mounted on 1in2 pad  
θJA :95 oC/W  
TA=25oC  
R
DC  
10  
1s  
0.01  
1E-4 1E-3 0.01 0.1  
1
10 100 1000  
0.01  
0.1  
1
100 300  
Square Wave PulseDuration (sec)  
VDS - Drain - Source Voltage (V)  
5
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 1 Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Output Characteristics  
24  
22  
20  
18  
16  
14  
12  
10  
30  
25  
20  
15  
10  
5
VGS=4,4.5,5,6,7,8,9,10V  
3.5V  
VGS=4.5V  
VGS=10V  
3V  
2.5V  
0
0.0  
0
5
10  
15  
20  
25  
30  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
VDS - Drain - Source Voltage (V)  
ID -Drain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
40  
35  
30  
25  
20  
15  
10  
1.6  
IDS=10A  
IDS=250µA  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
2
3
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75 100 125 150  
Tj - Junction Temperature (°C)  
VGS - Gate - Source Voltage (V)  
6
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 1 Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
30  
10  
VGS = 10V  
IDS = 10A  
Tj=150oC  
Tj=25oC  
1
RON@Tj=25oC: 15mΩ  
0.1  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
-50 -25  
0
25 50 75 100 125 150  
Tj - Junction Temperature (°C)  
VSD - Source - Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
1200  
1000  
800  
600  
400  
200  
0
Frequency=1MHz  
VDS= 20V  
IDS= 10A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
2
4
6
8
10 12 14 16  
0
5
10  
15  
20  
25  
30  
QG -Gate Charge (nC)  
VDS - Drain - Source Voltage (V)  
7
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 1 Typical Operating Characteristics (Cont.)  
Transfer Characteristics  
40  
35  
30  
25  
20  
Tj=25oC  
15  
10  
Tj=125oC  
5
0
0
1
2
3
4
5
6
VGS - Gate-Source Voltage (V)  
8
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 2 Typical Operating Characteristics  
Drain Current  
Power Dissipation  
8
7
6
5
4
3
2
1
0
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
TA=25oC,VG=10V  
TA=25oC  
0
20 40 60 80 100 120 140 160  
0
20 40 60 80 100 120 140 160  
Tj - Junction Temperature (°C)  
Tj - Junction Temperature (°C)  
Safe Operation Area  
Thermal Transient Impedance  
2
1
50  
10  
Duty = 0.5  
0.2  
0.1  
0.05  
300µs  
0.1  
0.01  
1E-3  
0.02  
0.01  
1
0.1  
1ms  
10ms  
Single Pulse  
Mounted on 1in2 pad  
1s  
100ms  
TA=25oC  
θJA :95 oC/W  
DC  
R
0.01  
1E-4 1E-3 0.01 0.1  
1
10 100 1000  
0.01  
0.1  
1
10  
100 300  
VDS - Drain - Source Voltage (V)  
Square Wave PulseDuration (sec)  
9
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 2 Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Output Characteristics  
20  
18  
16  
14  
12  
10  
8
30  
25  
20  
15  
10  
5
VGS=4,4.5,5,6,7,8,9,10V  
VGS=4.5V  
VGS=10V  
3.5V  
3V  
2.5V  
0
0.0  
6
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
5
10  
15  
20  
25  
30  
VDS - Drain - Source Voltage (V)  
ID -Drain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
35  
30  
25  
20  
15  
10  
5
IDS=10A  
IDS =250µA  
-50 -25  
0
25 50 75 100 125 150  
2
3
4
5
6
7
8
9
10  
Tj - Junction Temperature (°C)  
VGS - Gate - Source Voltage (V)  
10  
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 2 Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
30  
10  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
VGS = 10V  
IDS = 10A  
Tj=150oC  
Tj=25oC  
1
RON@Tj=25oC: 11mΩ  
0.1  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
-50 -25  
0
25 50 75 100 125 150  
Tj - Junction Temperature (°C)  
VSD - Source - Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
900  
750  
600  
450  
300  
150  
0
Frequency=1MHz  
VDS= 20V  
IDS= 10A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
2
4
6
8
10  
12  
0
5
10  
15  
20  
25  
30  
QG -Gate Charge (nC)  
VDS - Drain - Source Voltage (V)  
11  
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Channel 2 Typical Operating Characteristics (Cont.)  
Transfer Characteristics  
80  
70  
60  
50  
Tj=125oC  
40  
30  
Tj=25oC  
20  
10  
0
1
2
3
4
5
6
VGS - Gate-Source Voltage (V)  
12  
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Avalanche Test Circuit and Waveforms  
VDS  
L
VDSX(SUS)  
tp  
DUT  
VDS  
IAS  
RG  
VDD  
VDD  
IL  
tp  
EAS  
0.01  
tAV  
Switching Time Test Circuit and Waveforms  
VDS  
RD  
VDS  
90%  
DUT  
VGS  
RG  
VDD  
10%  
VGS  
tp  
td(on) tr  
td(off) tf  
13  
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  
SM4042DSK  
®
Disclaimer  
Sinopower Semiconductor, Inc. (hereinafter Sinopower) has been making  
great efforts to development high quality and better performance products to  
satisfy all customersneeds. However, a product may fail to meet customers  
expectation or malfunction for various situations.  
All information which is shown in the datasheet is based on Sinopowers  
research and development result, therefore, Sinopower shall reserve the right  
to adjust the content and monitor the production.  
In order to unify the quality and performance, Sinopower has been following  
JEDEC while defines assembly rule. Notwithstanding all the suppliers  
basically follow the rule for each product, different processes may cause  
slightly different results.  
The technical information specified herein is intended only to show the typical  
functions of and examples of application circuits for the products. Sinopower  
does not grant customers explicitly or implicitly, any license to use or exercise  
intellectual property or other rights held by Sinopower and other parties.  
Sinopower shall bear no responsible whatsoever for any dispute arising from  
the use of such technical information.  
The products are not designed or manufactured to be used with any  
equipment, device or system which requires an extremely high level of  
reliability, such as the failure or malfunction of which any may result in a direct  
threat to human life or a risk of human injury. Sinopower shall bear no  
responsibility in any way for use of any of the products for the above special  
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as vehicle, military, or medical controller relevant applications, please contact  
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Copyright Sinopower Semiconductor, Inc.  
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SM4042DSK  
®
Classification Profile  
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Rev. A.1 - July, 2016  
SM4042DSK  
®
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
150 C  
100 C  
°
°
Temperature min (Tsmin  
)
Temperature max (Tsmax  
Time (Tsmin to Tsmax) (ts)  
150 C  
200 C  
°
°
)
60-120 seconds  
60-120 seconds  
Average ramp-up rate  
(Tsmax to TP)  
3 C/second max.  
°
3 C/second max.  
°
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
°
°
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
See Classification Temp in table 2  
30** seconds  
Time (t )** within 5 C of the specified  
°
P
20** seconds  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 C/second max.  
°
6 C/second max.  
°
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
°
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process Classification Temperatures (Tc)  
Volume mm3  
Package  
Volume mm3  
Thickness  
<350  
350  
<2.5 mm  
235 °C  
220 °C  
220 °C  
220 °C  
2.5 mm  
Table 2. Pb-free Process Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
Volume mm3  
350-2000  
260 °C  
Volume mm3  
<350  
>2000  
260 °C  
245 °C  
245 °C  
260 °C  
1.6 mm 2.5 mm  
2.5 mm  
260 °C  
250 °C  
250 °C  
245 °C  
Reliability Test Program  
Test item  
Method  
JESD-22, B102  
JESD-22, A108  
Description  
SOLDERABILITY  
HTRB  
5 Sec, 245°C  
1000 Hrs, 80% of VDS max @ Tjmax  
1000 Hrs, 100% of VGS max @ Tjmax  
168 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -65°C~150°C  
HTGB  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
PCT  
TCT  
Customer Service  
Sinopower Semiconductor, Inc.  
5F, No. 6, Dusing 1St Rd., Hsinchu Science Park,  
Hsinchu, 30078, Taiwan  
TEL: 886-3-5635818 Fax: 886-3-5635080  
16  
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - July, 2016  

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