TSSOPSP3220EBEY/TR [SIPEX]
+3.0V to +5.5V RS-232 Driver/Receiver Pair; + 3.0V至+ 5.5V的RS - 232驱动器/接收器对
| 型号： | TSSOPSP3220EBEY/TR |
| 厂家： | 
SIPEX CORPORATION |
| 描述： | +3.0V to +5.5V RS-232 Driver/Receiver Pair |
| 文件： | 总21页 (文件大小：486K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
SP3220E/EB/EU
+3.0V to +5.5V RS-232 Driver/Receiver Pair
■ MeetsAllEIA-232andITUV.28Specifications
fromawide+3.0Vto+5.5Vpowersupply
EN
1
2
3
4
5
6
16
15
14
13
12
11
SHDN
● InteroperablewithRS232andV.28at2.7V
C1+
V+
V
CC
■ SupportsHighSerialDataRates:
● 120kbps SP3220E
GND
● 250kbps SP3220EB
● 1Mbps SP3220EU
C1-
SP3220
T1OUT
E/EB/EU
■ 1µALowPowerShutdownMode
■ FootprintCompatiblewithMAX3221E,ISL3221
■ 4x0.1µFExternalChargePumpCapacitors
■ Tri–State/ReceiverEnable
C2+
C2-
V-
NoConnect
T1IN
7
8
10
9
NoConnect
R1OUT
■ ImprovedESDSpecifications:
● +15kVHumanBodyModel
R1IN
● +15kVIEC1000-4-2AirDischarge
● +8kVIEC1000-4-2ContactDischarge
Available in Lead Free Packaging
DESCRIPTION
TheSP3220E devicesareRS-232driver/receiversolutionsintendedforportableorhand-held
applications such as palmtop computers, instrumentation and consumer products. These
devices incorporate a high-efficiency charge-pump power supply that allows theSP3220E
devicestodelivertrueRS-232performancefromasinglepowersupplyrangingfrom+3.0V
to +5.0V. This charge pump requires only 0.1µF capacitors in 3.3V operation. The ESD
toleranceofthesedevicesisover±15kVforbothHumanModelandIEC1000-4-2Airdischarge
test methods. All devices have a low-power shutdown mode where the driver outputs and
chargepumpsaredisabled.Duringshutdown,thesupplycurrentfallstolessthan1µA.
V
CC
+
15
0.1µF
C5
V
CC
3
7
2
C1+
V+
V-
+
+
C1 0.1µF
0.1µF
*C3
4
C1-
5
C2+
SP3220
+
E/EB/EU
C4 0.1µF
C2
0.1µF
+
6
C2-
T1OUT
LOGIC
13
R1IN 8
11
T1IN
RS-232
INPUTS
OUTPUTS
R1OUT
9
LOGIC
RS-232
OUTPUTS
INPUTS
5k1
16
1
SHDN
EN
GND
14
*canbereturnedto
eitherVCC orGND
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀ
Input Voltages
ABSOLUTE MAXIMUM RATINGS
Thesearestressratingsonlyandfunctionaloperation
ofthedeviceattheseratingsoranyotherabovethose
indicatedintheoperationsectionsofthespecifications
belowisnotimplied. Exposuretoabsolutemaximum
rating conditions for extended periods of time may
affectreliabilityandcausepermanentdamagetothe
device.
TxIN,EN,SHUTDOWN................ -0.3VtoVCC+0.3V
RxIN ...................................................................+25V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT .........................................-0.3Vto(V +0.3V)
CC
Short-Circuit Duration
TxOUT...................................................... Continuous
StorageTemperature.......................-65°Cto+150°C
Power Dissipation Per Package
V .............................................................-0.3Vto+6.0V
CC
V+(NOTE1)..............................................-0.3Vto+7.0V
V-(NOTE1).............................................+0.3Vto-7.0V
V++|V-|(NOTE1)...................................................+13V
o
o
16-pinSSOP(derate9.69mW/Cabove+70C) ........ 775mW
o
o
16-pinTSSOP(derate10.5mW/Cabove+70C)..... 840mW
o
o
16-pinWideSOIC(derate11.2mW/Cabove+70C) 900mW
I C (DCV orGNDcurrent)..........................+100mA
C
CC
NOTE 1: V+andV-canhavemaximummagnitudesof7V,buttheirabsolutedifferencecannotexceed13V.
SPECIFICATIONS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX
.
Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1µF.
PARAMETER
MIN.
TYP.
MAX. UNITS
CONDITIONS
DCCHARACTERISTICS
SupplyCurrent
o
noload,T MB =+25C,V =3.3V,TxIN=
A
CC
0.3
1.0
1.0
10
mA
GNDorV
C
C
_____
o
SHDN=GND, T MB =+25C,V =+3.3V,
µA
ShutdownSupplyCurrent
A
CC
TxIN=GNDorV
C
C
LOGICINPUTSANDRECEIVEROUTPUTS
InputLogicThresholdLOW GND
___ _______
0.8
V
TxIN,EN,SHDN,Note2
V = 3.3V,Note2
2.0
InputLogicThresholdHIGH
2.4
V
CC
V
V = 5.0V,Note2
C
C
__ _____
TxIN,EN,SHDN,
µA
InputLeakageCurrent
±0.01 ±1.0
±0.05 ±10
o
T MB =+25CV =GNDtoV
A
IN
CC
µA
OutputLeakageCurrent
OutputVoltageLOW
OutputVoltageHIGH
DRIVEROUTPUTS
ReceiversDisabledV UT =GNDtoV
O
CC
0.4
V
I UT =1.6mA
O
V -0.6 V -0.1
V
I UT =-1.0mA
C
C
C
C
O
3kΩ loadtogroundatalldriveroutputs,
OutputVoltageSwing
±5.0
300
±5.4
±35
V
o
T
MB =+25C
A
Ω
OutputResistance
V =V+=V-=GND,T UT =+2V
CC
O
OutputShort-CircuitCurrent
±60
±25
mA V UT =GND
O
µA
OutputLeakageCurrent
V UT=+12V,V =GNDto5.5V,driversdisabled
O
CC
NOTE 2: Driver input hysteresis is typically 250mV.
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
2
SPECIFICATIONS (continued)
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX
Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1µF.
.
PARAMETER
MIN. TYP. MAX. UNITS
CONDITIONS
RECEIVERINPUTS
InputVoltageRange
-25
+25
V
InputThresholdLOW
0.6 1.2
0.8 1.5
V V =3.3V
CC
V =5.0V
CC
InputThresholdHIGH
1.5 2.4
1.8 2.4
V V =3.3V
CC
V =5.0V
CC
InputHysteresis
0.3
V
InputResistance
3
5
7
kΩ
TIMINGCHARACTERISTICS
DataRateSP3220E
DataRateSP3220EB
DataRateSP3220EU
ReceiverPropagationDelay
120 235
250
Kbps R=3kΩ,C=1000pF,onedriverswitching
L
L
Kbps R=3kΩ,C=1000pF
L
L
1000
Kbps R=3kΩ,C=250pF
L
0.15
0.15
t L ,RxINtoRxOUT,C =150pF
µs
PHL
L
µs
ns
ns
t ,RxINtoRxOUT,C =150pF
PHL
L
ReceiverOutputEnableTime
ReceiverOutputDisableTime
DriverSkew
200
200
100
50
o
ns |t -t |,T =25C
PHL PLH
AMB
ReceiverSkew
ns |t -t |
PHL PLH
o
Transition-RegionSlewRate
30
V/µs V =3.3V,R =3KΩ,T =25C,
CC
L
AMB
measurementstakenfrom-3.0Vto+3.0V
or+3.0Vto-3.0V(SP3220EandEB)
90
V/µs (SP3220EU)
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers
loaded with 3k1, 0.1µF charge pump capacitors, and TAMB = +25°C.
6
4
2
30
25
20
15
10
5
T
1atFullDataRate
1
2
5
Kbps
T
2at1/16FullDataRate
TxOUT+
TxOUT-
T
1
+
T
2L
o
a
d
e
dwith3k/C
L
o
a
d
T1at2
5
0
Kbps
60
Kbps
0
2
0
Kbps
-2
-4
-6
0
0
1000 2000 3000 4000
5000
0
1000 2000 3000 4000 5000
LoadCapacitance(pF)
LoadCapacitance(pF)
Figure 2. Transmitter Output Voltage vs Load Capaci-
tance for the SP3220EB.
Figure 1. ICC vs Load Capacitance for the SP3220EB.
12
10
8
6
4
6
TxOUT+
4
2
0
-2
-4
2
TxOUT-
-6
T1L
o
a
d
e
dwith3K//1
0
0
0
pf@2
5
0
Kbps
0
2.7
3
3.5
4
4.5
5
2.7
3
3.5
4
4.5
5
Supply Voltage (V)
SupplyVoltage(V)
Figure 4. Supply Current vs Supply Voltage for the
SP3220EB.
Figure 3. Transmitter Output Voltage vs Supply Voltage
for the SP3220EB.
40
25
1
Mbps
-Sle
w
+Sle
w
20
15
10
5
30
20
10
0
2Mbps
5
0
0
Kbps
0
0
500 1000 2000 3000 4000 5000
0
250 500 1000 2000 3000 4000
LoadCapacitance(pF)
LoadCapacitance(pF)
Figure 4. Supply Current vs Supply Voltage for the
SP3220EU.
Figure 5. Slew Rate vs Load Capacitance for the
SP3220EB.
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢁ
TYPICAL PERFORMANCE CHARACTERISTICS: Continued
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers
loaded with 3k1, 0.1µF charge pump capacitors, and TAMB = +25°C.
6
6
1.5Mbps
TxOUT+
2Mbps
1Mbps
4
2
4
2
0
0
-2
-4
-6
-2
-4
1.5Mbps
1000
2Mbps
1Mbps
TxOUT-
2.5
2.7
3
3.5
4
4.5
5
-6
0
250
500
1500 2000
Supply Voltage (V)
Load Capacitance (pF)
Figure 8. Transmitter Output Voltage vs Supply Voltage
for the SP3220EU.
Figure 7. Transmitter Output Voltage vs Load Capaci-
tance for the SP3220EU.
16
14
12
10
8
6
4
T1Loadedwith3K//1000pf@1Mbps
2
0
2.7
3
3.5
4
4.5
5
SupplyVoltage(V)
Figure 9. Supply Current vs Supply Voltage for the
SP3220EU.
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
5
NAME
FUNCTION
PIN NUMBER
ReceiverEnableControl. DriveLOWfornormaloperation. DriveHIGHtoTri-
Statethereceiveroutputs(high-Zstate).
EN
1
C1+
V+
C1-
C2+
C2-
V-
Positiveterminalofthevoltagedoublercharge-pumpcapacitor.
+5.5Vgeneratedbythechargepump.
2
3
Negativeterminalofthevoltagedoublercharge-pumpcapacitor.
Positiveterminaloftheinvertingcharge-pumpcapacitor.
Negativeterminaloftheinvertingcharge-pumpcapacitor.
-5.5Vgeneratedbythechargepump.
4
5
6
7
R1IN RS-232receiverinput.
8
R1OUT TTL/CMOSrecieveroutput.
9
N.C.
NoConnect.
10,12
11
13
14
15
T1IN TTL/CMOSdriverinput.
T1OUT RS-232driveroutput.
GND Ground.
V
+3.0Vto+5.5Vsupplyvoltage
C
C
ShutdownControlInput. DriveHIGHfornormaldeviceoperation. DriveLOWto
SHDN shutdownthedrivers(high-Zoutput)andtheon-boardchargepumppower
supply.
16
Table 1. Device Pin Description
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢂ
EN
16
15
14
13
12
11
1
2
3
4
5
6
7
SHDN
C1+
V+
V
CC
GND
C1-
SP3220
T1OUT
E/EB/EU
C2+
C2-
V-
NoConnect
T1IN
10
9
NoConnect
R1OUT
R1IN
8
Figure 10. Pinout Configurations for the SP3220E/EB/
EU
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢃ
V
CC
+
15
0.1µF
C5
C1
V
CC
3
7
2
C1+
V+
V-
+
+
0.1µF
0.1µF
*C3
4
C1-
5
C2+
SP3220
+
E/EB/EU
C4 0.1µF
C2
0.1µF
+
6
C2-
T1OUT
R1IN
13
8
LOGIC
11
T1IN
RS-232
RS-232
INPUTS
INPUTS
OUTPUTS
R1OUT
9
LOGIC
OUTPUTS
5k1
16
1
SHDN
EN
GND
14
*canbereturnedto
eitherVCC orGND
Figure 11. SP3220E/EB/EU Typical Operating Circuits
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
8
DESCRIPTION
TheSP3220E/EB/EUdevicesmeettheEIA/TIA-
232andV.28/V.24communicationprotocolsand
canbeimplementedinbattery-powered,portable,
or hand-held applications such as notebook or
palmtop computers. The SP3220E/EB/EU de-
vicesfeatureSipex'sproprietaryon-boardcharge
pumpcircuitrythatgenerates2xV forRS-232
PC-to-PC communication software. The
SP3220EU driver can guarantee a data rate of
1000Kbps fully loaded with 31 in parallel with
250pF.
The slew rate of the SP3220E and SP3220EB
outputsareinternallylimitedtoamaximumof30V/
µsinordertomeettheEIAstandards(EIARS-
232D2.1.7, Paragraph5). Thetransitionofthe
loadedoutputfromHIGHtoLOWalsomeetsthe
monotonicityrequirementsofthestandard. The
slewrateoftheSP3220EUisnotinternallylimited.
Thisallowsittotransmitatmuchfasterdatarates.
Figure12showsaloopbackcircuitusedtotestthe
RS-232driver.Figure13showsthetestresultsof
the loopback circuit with the SP3220EB driver
activeat250KbpswithanRS-232loadinparallel
witha1000pFcapacitor.Figure14showsthetest
resultswheretheSP3220EUdriverwasactiveat
1000KbpsandloadedwithanRS-232receiverin
parallel with a 250pF capacitor. A solid RS-232
datatransmissionrateof250Kbpsprovidescom-
patibilitywithmanydesignsinpersonalcomputer
peripheralsandLANapplications.
C
C
voltagelevelsfromasingle+3.0Vto+5.5Vpower
supply.Thisseriesisidealfor+3.3V-onlysystems,
mixed +3.0V to +5.5V systems, or +5.0V-only
systems that require true RS-232 performance.
TheSP3220EBdevicehasadriverthatcanoper-
ate at a data rate of 250Kbps fully loaded. The
SP3220EUcanoperateat1000Kbps;theSP3220E
operates at a typical data rate of 235Kbps fully
loaded.
TheSP3220E/EB/EUisa1-driver/1-receiverde-
viceidealforportableorhand-held applications.
The SP3220E/EB/EU features a 1µA shutdown
mode that reduces power consumption and ex-
tendsbatterylifeinportablesystems.Itsreceivers
remainsactiveinshutdownmode,allowing exter-
naldevicestobemonitoredusingonly1µAsupply
current.
THEORY OF OPERATION
TheSP3220E/EB/EUdriver'soutputstageisturned
off(high-Z)whenthedeviceisinshutdownmode.
Whenthepowerisoff,theSP3220E/EB/EU de-
vicepermitstheoutputstobedrivenupto+12V.
Thedriver'sinputdoesnothavepull-upresistors.
DesignersshouldconnectanunusedinputtoV
The SP3220E/EB/EU devices are made up of
threebasiccircuitblocks:1.Driver,2. Receiver,
and3. theSipexproprietarychargepump.
CC
Driver
orGND.
The driver is an inverting level transmitter that
convertsTTLorCMOSlogiclevelsto+5.0VEIA/
TIA-232levels, invertedrelativetotheinputlogic
levels.Typically,theRS-232outputvoltageswing
is+5.5Vwithnoloadandatleast+5Vminimum
fullyloaded.Thedriveroutputsareprotectedagainst
infinite short-circuits to ground without degrada-
tioninreliability. DriveroutputswillmeetEIA/TIA-
562levelsof+3.7Vwithsupplyvoltagesaslowas
2.7V.
Intheshutdownmode,thesupplycurrentfallsto
lessthan1µA,whereSHDN=LOW. Whenthe
SP3220E/EB/EUdeviceisshutdown,thedevice's
driveroutputisdisabled(high-Z)andthecharge
pumpisturnedoffwithV+pulleddowntoV and
CC
V- pulled to GND. The time required to exit
shutdown is typically 100ms. Connect SHDN to
V iftheshutdownmodeisnotused. SHDN has
CC
noeffectonRxOUT.Notethatthedriverisenabled
onlywhenthemagnitudeofV-exceedsapproxi-
mately3V.
TheSP3220EBdrivertypicallycanoperateata
data rate of 250Kbps fully loaded with 3K1 in
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢄ
V
C
C
+
0.1µF
C5
V
C
C
C1+
V+
V-
+
+
C1 0.1µF
C3 0.1µF
C1-
SP3220
C2+
+
E/EB/EU
C4 0.1µF
C2
0.1µF
+
C2-
TxOUT
RxIN
TxIN
LOGIC
INPUTS
RxOUT
EN
LOGIC
OUTPUTS
5k1
V
C
C
*SHDN
GND
(SP3220EU250pF)
(SP3220E/EB1000pF)
Figure 12. SP3220E/EB/EU Driver Loopback Test Circuit
Figure 13. SP3220EB Driver Loopback Test Results at
250Kbps
Figure 14. SP3220EU Driver Loopback Test Results at
1Mbps
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀ0
Receivers
In most circumstances, decoupling the power
supplycanbeachievedadequatelyusinga0.1µF
bypass capacitor at C5 (refer to Figure 11).
In applications that are sensitive to power-
supplynoise,decoupleV togroundwithaca-
ThereceiverconvertsEIA/TIA-232levelstoTTLor
CMOSlogicoutputlevels. Thereceiverhasan
inverting high-impedance output. This receiver
output (RxOUT) is at high-impedance when the
enablecontrolEN=HIGH.Intheshutdownmode,
thereceivercanbeactiveorinactive. ENhasno
effect on TxOUT. The truth table logic of the
SP3220E/EB/EU driverandreceiveroutputscan
befoundinTable2.
CC
pacitorofthesamevalueascharge-pumpcapaci-
torC1.Physicallyconnectbypass capacitorsas
closetotheICaspossible.
The charge pumps operate in a discontinuous
mode using an internal oscillator. If the output
voltagesarelessthanamagnitudeof5.5V, the
chargepumpsareenabled;iftheoutputvoltages
exceedamagnitudeof5.5V,thechargepumps
are disabled. This oscillator controls the four
phases of the voltage shifting. A description of
eachphasefollows.
Sincereceiverinputisusuallyfromatransmission
line where long cable lengths and system
interference can degrade the signal, the inputs
have a typical hysteresis margin of 300mV.
This ensures that the receiver is virtually
immune to noisy transmission lines. Should an
input be left unconnected, a 5k1 pulldown
resistor to ground will commit the output of the
receivertoaHIGH state.
Phase 1
—V chargestorage—Duringthisphaseofthe
S
S
clockcycle,thepositivesideofcapacitorsC and
1
+
CHARGE PUMP
C areinitiallychargedtoV . C isthenswitched
2
CC
l
–
The charge pump is a Sipex–patented design
(U.S. 5,306,954) and uses a unique approach
compared to older less–efficient designs. The
charge pump still requires four external
capacitors,butusesafour–phasevoltageshifting
techniquetoattainsymmetrical5.5Vpowersup-
plies. The internal power supply consists of a
regulateddualchargepumpthatprovidesoutput
voltages5.5Vregardlessoftheinputvoltage(V )
to GND and the charge in C is
1
–
+
transferredtoC . SinceC isconnectedtoV ,
2
2
CC
thevoltagepotentialacrosscapacitorC isnow2
2
timesV .
CC
Phase 2
— V transfer — Phase two of the clock
S
S
connects the negative terminal of C to the V
2
SS
storagecapacitorandthepositiveterminalofC to
C
C
2
overthe+3.0Vto+5.5Vrange.
GND.Thistransfersanegativegeneratedvoltage
to C . This generated voltage is
3
regulated to a minimum voltage of -5.5V.
SimultaneouswiththetransferofthevoltagetoC,
3
thepositivesideofcapacitorC isswitchedtoV
1
C
C
andthenegativesideisconnectedtoGND.
SHDN
0
EN
0
1
0
1
TxOUT
RxOUT
Phase 3
Tri-state
Active
—V chargestorage—Thethirdphaseofthe
DD
0
Tri-state Tri-state
clockisidenticaltothefirstphase—thecharge
transferred in C produces –V in the negative
1
C
C
1
Active
Active
Active
terminalofC,whichisappliedtothenegativeside
1
+
1
Tri-state
ofcapacitorC. SinceC isatV , thevoltage
potentialacrossC is2timesV .CC
2
2
2
CC
Table 2. Truth Table Logic for Shutdown and
Enable Control
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀꢀ
Phase 4
—V transfer—Thefourthphaseoftheclock
Thechargepumposcillatortypicallyoperates
atgreaterthan250kHzallowingthepumpto
run efficiently with small 0.1µF capacitors.
Efficientoperationdependsonrapidlycharg-
ing and discharging C and C, therefore
DD
connectsthenegativeterminalofC toGND,and
2
transfersthispositivegeneratedvoltageacrossC
2
to C, the V storage capacitor. This voltage is
4
D
regulated toD+5.5V. At this voltage, the internal
1
2
oscillatorisdisabled. Simultaneouswiththetrans-
capacitorsshouldbemountedclosetotheIC
andhavelowESR(equivalentseriesresis-
tance).
ferofthevoltagetoC,thepositivesideofcapaci-
4
torC isswitchedtoV andthenegativesideis
1
C
connected to GND, allCowing the charge pump
cycletobeginagain.Thechargepumpcyclewill
continueaslongastheoperationalconditionsfor
theinternaloscillatorarepresent.
Lowcostsurfacemountceramiccapacitors
(such as are widely used for power-supply
decoupling)areidealforuseonthecharge
pump. Howeverthechargepumpsarede-
signedtobeabletofunctionproperlywitha
widerangeofcapacitorstylesandvalues. If
polarizedcapacitorsareusedthepositiveand
negative terminals should be connected as
shownintheTypicalOperatingCircuit.
+
–
Inano–loadconditionV andV willbesymmetri-
+
–
cal,sincebothV andV areseparatelygenerated
fromV . Olderchargepumpapproachesthat
CC
–
+
generateV fromV willshowadecreaseinthe
–
+
magnitude of V compared to V due to the
inherentinefficienciesinthedesign.
Voltagepotentialacrossanyofthecapacitors
willneverexceed2xV . Thereforecapaci-
CC
CHARGE PUMP DESIGN GUIDELINES
tors with working voltages as low as 6.3V
ratingmaybeusedwitha3.0V V supply.
CC
The reference terminal of the V+ capacitor
maybeconnectedeithertoV orground,but
The charge pump operates with 0.1µF ca-
pacitorsfor3.3Voperation. Forothersupply
voltages,seethetableforrequiredcapacitor
values.Donotusevaluessmallerthanthose
listed.Increasingthecapacitorvalues(e.g.,
by doubling in value) reduces ripple on the
transmitteroutputsandmayslightlyreduce
powerconsumption.C2,C3,andC4maybe
CC
ifconnectedtogroundaminimum10Vwork-
ingvoltageisrequired. Higherworkingvolt-
agesand/orcapacitancevaluesmaybead-
visedifoperatingathigherV ortoprovide
CC
greaterstabilityasthecapacitorsage.
Underlightlyloadedconditionstheintelligent
increasedwithoutchangingC1’svalue.
pumposcillatormaximizesefficiencybyrun-
-
ningonlyasneededtomaintainV+andV.
Sinceinterfacetransceiversoftenspendmuch
oftheirtimeatidle,thispower-efficientinno-
vation can greatly reduce total power con-
sumption. This improvement is made pos-
siblebytheindependentphasesequenceof
Minimum recommended
charge pump capacitor value
ChargepumpCapacitor
Input
theSipex charge-pumpdesign.
valueforSP3220E/EB/EU
VoltageVcc
3.0Vto3.6V
3.0Vto5.5V
C1– C4=0.1uF
C1– C4=0.22uF
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀ2
V
=+5V
C
C
C
4
+5V
+
+
–
–
V
SS
StorageCapacitor
D
V
D
+
C
C
1
2
–
–
+
StorageCapacitor
C
–5V
–5V
3
Figure 15. Charge Pump — Phase 1
V
=+5V
C
C
C
4
+
–
–
V
SS
StorageCapacitor
D
V
D
+
+
C
C
1
2
–
–
+
StorageCapacitor
C
3
–10V
Figure 16. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
1
2
GND
b) C -
2
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V
Figure 17. Charge Pump Waveforms
V
=+5V
C
C
C
4
+5V
+
+
–
–
V
SS
StorageCapacitor
D
V
D
+
C
C
1
2
–
–
+
StorageCapacitor
C
–5V
–5V
3
Figure 18. Charge Pump — Phase 3
V
=+5V
C
C
C
+10V
+
4
+
–
–
V
SS
StorageCapacitor
D
V
D
+
C
C
1
2
–
–
+
StorageCapacitor
C
3
Figure 19. Charge Pump — Phase 4
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀ3
ESD TOLERANCE
TheSP3220E/EB/EU deviceincorporatesrugge-
dizedESDcellsonalldriveroutputandreceiver
inputpins.TheESDstructureisimprovedoverour
previousfamilyformoreruggedapplicationsand
environments sensitive to electro-static
discharges and associated transients. The im-
proved ESD tolerance is at least ±15kV without
damagenorlatch-up.
exposedtotheoutsideenvironmentandhuman
presence. ThepremisewithIEC1000-4-2isthat
thesystemisrequiredtowithstandanamountof
staticelectricitywhenESDisappliedtopointsand
surfacesoftheequipmentthatareaccessibleto
personnelduringnormalusage. Thetransceiver
ICreceivesmostoftheESDcurrentwhentheESD
sourceisappliedtotheconnectorpins.Thetest
circuit for IEC-1000-4-2 is shown in Figure 21.
There are two methods within IEC-4-2: the Air
Discharge method and the Contact Discharge
method.
There are different methods of ESD testing ap-
plied:
a)MIL-STD-883,Method3015.7
b)IEC1000-4-2AirDischarge
c)IEC1000-4-2DirectContact
WiththeAirDischargeMethod,anESDvoltageis
appliedtotheequipmentundertest(EUT)through
air. Thissimulatesanelectricallychargedperson
ready to connect a cable onto the rear of the
systemonlytofindanunpleasantzapjustbefore
the person touches the back panel. The high
energypotentialonthepersondischargesthrough
anarcingpathtotherearpanelsystembeforehe
or she even touches the system. This energy,
whetherdischargeddirectlyorthroughair,ispre-
dominantly a function of the discharge current
ratherthanthedischargevoltage.
TheHumanBodyModelhasbeenthegenerally
acceptedESDtestingmethodforsemiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potential to store electro-static energy and
discharge it to an integrated circuit. The
simulationisperformedbyusingatestmodelas
showninFigure20.ThismethodwilltesttheIC’s
capability to withstand an ESD transient during
normalhandlingsuchasinmanufacturingareas
Variables with an air discharge -- such as ap-
proach speed of the object carrying the ESD
potentialtothesystemandhumidity--willtendto
change the discharge current. For example, the
risetimeofthedischargecurrentvarieswiththe
approachspeed.
wheretheICstendtobehandledfrequently.
The IEC-1000-4-2, formerly IEC801-2, is gener-
allyusedfortestingESDonequipmentandsystem
manufacturers; they must guarantee a certain
amountofESDprotectionsincethesystemitselfis
R
R
R
R
S
C
S
C
SW2
SW2
SW1
SW1
Device
Under
Test
DCPower
Source
C
C
S
S
Figure 20. ESD Test Circuit for Human Body Model
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀꢁ
The circuit models in Figure 20 and 21
TheContactDischargeMethodappliesthe
ESDcurrentdirectlytotheEUT.Thismethod
wasdevisedtoreducetheunpredictability
oftheESDarc.Thedischargecurrentrise
timeisconstantsincetheenergyisdirectly
transferedwithouttheair-gaparc.Insitua-
tionssuchashandheldsystems,theESD
charge can be directly discharged to the
equipmentfromapersonincontactwiththe
equipment.Thecurrentistransferredonto
thekeypadortheserialportoftheequip-
mentdirectlyandthentravelsthroughthe
PCBandfinallytotheIC.
represent the typical ESD testing circuits
usedforallthreemethods.TheC isinitially
S
charged with the DC power supply when
the first switch (SW1) is on. Now that the
capacitor is charged, the second switch
(SW2) is on while SW1 switches off. The
voltagestoredinthecapacitoristhenap-
pliedthroughR ,thecurrentlimitingresis-
S
tor, onto the device under test (DUT). In
ESDtests,theSW2switchispulsedsothat
thedeviceundertestrecivesadurationof
voltage.
Contact-DischargeModule
R
R
R
R
R
S
V
C
S
C
SW2
SW2
SW1
SW1
Device
Under
Test
DCPower
Source
C
C
S
S
R andR addupto3301 forIEC1000-4-2.
S
V
Figure 21. ESD Test Circuit for IEC1000-4-2
For the Human Body Model, the current
limitingresistor(R )andthesourcecapaci-
ForIEC-1000-4-2,thecurrentlimitingresis-
tor(RS)andthesourcecapacitor(CS)are
3301 and150pF,respectively.
ThehigherCSvalueandlowerRSvaluein
theIEC1000-4-2modelaremorestringent
than the Human Body Model. The larger
storagecapacitorinjectsahighervoltageto
thetestpointwhenSW2isswitchedon.The
lowercurrentlimitingresistorincreasesthe
currentchargeontothetestpoint.
30A
15A
0A
tor(C )are1.5k1 Sand100pF,respectively.
S
t=30nS
t
t=0nS
Figure 22. ESD Test Waveform for IEC1000-4-2
Device Pin
Tested
Human Body
Model
IEC1000-4-2
Air Discharge Direct Contact Level
DriverOuputs
±15kV
±15kV
±8kV
4
ReceiverInputs
±15kV
±15kV
±8kV
4
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀ5
PACKAGE: PLASTIC SHRINK�
SMALL OUTLINE�
(SSOP)
E H
A
D
Ø
L
A1
e
B
DIMENSIONS (Inches)�
Minimum/Maximum�
(mm)�
16–PIN�
�
24–PIN�
�
20–PIN�
�
28–PIN�
�
�
0.068/0.078�
(1.73/1.99)�
�
0.068/0.078�
(1.73/1.99)�
�
A�
0.068/0.078�
(1.73/1.99)�
�
0.068/0.078�
(1.73/1.99)�
�
�
�
0.002/0.008�
(0.05/0.21)�
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0.002/0.008�
(0.05/0.21)�
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A1�
�
0.002/0.008�
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0.002/0.008�
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�
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0.010/0.015�
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0.010/0.015�
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�
B�
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0.010/0.015�
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0.010/0.015�
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0.239/0.249�
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0.317/0.328�
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0.278/0.289�
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0.397/0.407�
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0.205/0.212�
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0.0256 BSC�
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e�
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0.0256 BSC�
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0.0256 BSC�
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0.301/0.311�
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0.022/0.037�
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L�
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0.022/0.037�
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0.022/0.037�
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�
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0°/8°�
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0°/8°�
0°/8°�
(0°/8°)
(0°/8°)
(0°/8°)
(0°/8°)
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀꢂ
PACKAGE: PLASTIC�
SMALL OUTLINE (SOIC)
E H
A
D
Ø
A1
L
e
B
DIMENSIONS (Inches)�
Minimum/Maximum�
(mm)�
16–PIN�
�
18–PIN�
�
�
A�
0.090/0.104� 0.090/0.104�
(2.29/2.649)� (2.29/2.649))�
�
�
�
�
A1�
�
0.004/0.012� 0.004/0.012�
(0.102/0.300)� (0.102/0.300)�
�
�
�
B�
�
0.013/0.020� 0.013/0.020�
(0.330/0.508)� (0.330/0.508)�
�
�
�
D�
�
0.398/0.413� 0.447/0.463�
(10.10/10.49)� (11.35/11.74)�
�
�
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�
0.291/0.299� 0.291/0.299�
(7.402/7.600)� (7.402/7.600)�
�
�
�
e�
�
0.050 BSC� 0.050 BSC�
(1.270 BSC)� (1.270 BSC)�
�
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�
H�
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0.394/0.419� 0.394/0.419�
(10.00/10.64)� (10.00/10.64)�
�
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0.016/0.050� 0.016/0.050�
(0.406/1.270)� (0.406/1.270)�
�
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0°/8°�
(0°/8°)
0°/8°�
(0°/8°)
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀꢃ
PACKAGE: PLASTIC THIN SMALL
OUTLINE
(TSSOP)
E2
E
D
B
A
Ø
L
A1
e
DIMENSIONS
in inches (mm)
16–PIN
20–PIN
Minimum/Maximum
- /0.043
(- /1.10)
- /0.043
(- /1.10)
A
0.002/0.006
(0.05/0.15)
0.002/0.006
(0.05/0.15)
A1
B
0.007/0.012
(0.19/0.30)
0.007/0.012
(0.19/0.30)
0.193/0.201
(4.90/5.10)
0.252/0.260
(6.40/6.60)
D
0.169/0.177
(4.30/4.50)
0.169/0.177
(4.30/4.50)
E
0.026 BSC
(0.65 BSC)
0.026 BSC
(0.65 BSC)
e
0.126 BSC
(3.20 BSC)
0.126 BSC
(3.20 BSC)
E2
L
0.020/0.030
(0.50/0.75)
0.020/0.030
(0.50/0.75)
0°/8°
0°/8°
Ø
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀ8
RECOMMENDED UPGRADES
Contactfactoryforavailabilityofthefollowinglegacypartnumbers.Forlongtermavail-
abilitySipexrecommendsupgradesaslistedbelow.Allupgradepartnumbersshownare
fullypinoutandfunctioncompatiblewithlegacypartnumbers.Upgradepartnumbers
maycontainfeatureand/orperformanceenhancementsorotherchangestodatasheet
parameters.
Legacy Part
Number
Recommended
Upgrade
SP3220CA..................SP3220ECA
SP3220CA-L...............SP3220ECA-L
SP3220CT ..................SP3220ECT
SP3220CY..................SP3220ECY
SP3220EA ..................SP3220EEA
SP3220ET...................SP3220EET
SP3220EY ..................SP3220EEY
SP3220BCA................SP3220EBCA
SP3220BCT................SP3220EBCT
SP3220BCY................SP3220EBCY
SP3220BEA................SP3220EBEA
SP3220BET................SP3220EBET
SP3220BEY................SP3220EBEY
SP3220UCA................SP3220EUCA
SP3220UCT................SP3220EUCT
SP3220UCY................SP3220EUCY
SP3220UEA................SP3220EUEA
SP3220UET................SP3220EUET
SP3220UEY................SP3220EUEY
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
ꢀꢄ
ORDERING INFORMATION
Temperature Range
Model
Package Type
SP3220EBCA .......................................... 0˚Cto+70˚C..........................................16-PinSSOP
SP3220EBCA/TR..................................... 0˚Cto+70˚C..........................................16-PinSSOP
SP3220EBCT........................................... 0˚Cto+70˚C..................................16-PinWideSOIC
SP3220EBCT/TR..................................... 0˚Cto+70˚C..................................16-PinWideSOIC
SP3220EBCY .......................................... 0˚Cto+70˚C........................................16-PinTSSOP
SP3220EBCY/TR..................................... 0˚Cto+70˚C........................................16-PinTSSOP
SP3220EBEA..........................................-40˚Cto+85˚C ........................................16-PinSSOP
SP3220EBEA/TR....................................-40˚Cto+85˚C ........................................16-PinSSOP
SP3220EBET..........................................-40˚Cto+85˚C ................................16-PinWideSOIC
SP3220EBET/TR....................................-40˚Cto+85˚C ................................16-PinWideSOIC
SP3220EBEY..........................................-40˚Cto+85˚C ......................................16-PinTSSOP
SP3220EBEY/TR....................................-40˚Cto+85˚C ......................................16-PinTSSOP
SP3220ECA............................................. 0˚Cto+70˚C..........................................16-PinSSOP
SP3220ECA/TR....................................... 0˚Cto+70˚C..........................................16-PinSSOP
SP3220ECT............................................. 0˚Cto+70˚C........................................16-PinWSOIC
SP3220ECT/TR....................................... 0˚Cto+70˚C........................................16-PinWSOIC
SP3220ECY............................................. 0˚Cto+70˚C........................................16-PinTSSOP
SP3220ECY/TR....................................... 0˚Cto+70˚C........................................16-PinTSSOP
Availableinleadfreepackaging. Toorderadd“-L”suffixtopartnumber.
Example:SP3220ECA/TR=standard;SP3220ECA-L/TR=LeadFree
/TR=TapeandReel
Packquantityis1,500forWSOIC,orSSOP; packquantityis2,500for16-pinTSSOP.
SipexCorporationreservestherighttomakechangestoanyproductsdescribedherein.Sipexdoesnotassumeanyliabilityarisingoutofthe
applicationoruseofanyproductorcircuitdescribedhereing;neitherdoesitconveyanylicenseunderitspatentrightsnortherightsofothers.
C
orporatio
n
ANALOGEXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
233SouthHillviewDrive
Milpitas,CA95035
TEL:(408)934-7500
FAX:(408)935-7600
Sales Office
22LinnellCircle
Billerica,MA 01821
TEL:(978)667-8700
FAX:(978)670-9001
e-mail:sales@sipex.com
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
20
ORDERING INFORMATION
Temperature Range
Model
Package Type
SP3220EEA............................................-40˚Cto+85˚C ........................................16-PinSSOP
SP3220EEA/TR......................................-40˚Cto+85˚C ........................................16-PinSSOP
SP3220EET............................................-40˚Cto+85˚C ......................................16-PinWSOIC
SP3220EET/TR ......................................-40˚Cto+85˚C ......................................16-PinWSOIC
SP3220EEY............................................-40˚Cto+85˚C ......................................16-PinTSSOP
SP3220EEY/TR......................................-40˚Cto+85˚C ......................................16-PinTSSOP
SP3220EUCA.......................................... 0˚Cto+70˚C..........................................16-PinSSOP
SP3220EUCA/TR .................................... 0˚Cto+70˚C..........................................16-PinSSOP
SP3220EUCT .......................................... 0˚Cto+70˚C..................................16-PinWideSOIC
SP3220EUCT/TR..................................... 0˚Cto+70˚C..................................16-PinWideSOIC
SP3220EUCY/TR .................................... 0˚Cto+70˚C........................................16-PinTSSOP
SP3220EUCY.......................................... 0˚Cto+70˚C........................................16-PinTSSOP
SP3220EUEA .........................................-40˚Cto+85˚C ........................................16-PinSSOP
SP3220EUEA/TR....................................-40˚Cto+85˚C ........................................16-PinSSOP
SP3220EUET..........................................-40˚Cto+85˚C ................................16-PinWideSOIC
SP3220EUET/TR....................................-40˚Cto+85˚C ................................16-PinWideSOIC
SP3220EUEY .........................................-40˚Cto+85˚C ......................................16-PinTSSOP
SP3220EUEY/TR....................................-40˚Cto+85˚C ......................................16-PinTSSOP
Availableinleadfreepackaging. Toorderadd“-L”suffixtopartnumber.
Example:SP3220ECA/TR=standard;SP3220ECA-L/TR=LeadFree
/TR=TapeandReel
Packquantityis1,500forWSOIC,orSSOP; packquantityis2,500for16-pinTSSOP.
SipexCorporationreservestherighttomakechangestoanyproductsdescribedherein.Sipexdoesnotassumeanyliabilityarisingoutofthe
applicationoruseofanyproductorcircuitdescribedhereing;neitherdoesitconveyanylicenseunderitspatentrightsnortherightsofothers.
C
orporatio
n
ANALOGEXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
233SouthHillviewDrive
Milpitas,CA95035
TEL:(408)934-7500
FAX:(408)935-7600
Sales Office
22LinnellCircle
Billerica,MA 01821
TEL:(978)667-8700
FAX:(978)670-9001
e-mail:sales@sipex.com
Date: 8/30/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
2ꢀ
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