RF25F-12 [SKYWORKS]

RF and Baseband Circuit, 5 X 5 MM, LGA-32;
RF25F-12
型号: RF25F-12
厂家: SKYWORKS SOLUTIONS INC.    SKYWORKS SOLUTIONS INC.
描述:

RF and Baseband Circuit, 5 X 5 MM, LGA-32

电信 电信集成电路
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RF25F  
Tx ASIC for CDMA/AMPS and PCS Applications  
The RF25F Transmit Application-Specific Integrated Circuit (ASIC) is a tri-mode,  
dual-band upconverter and driver amplifier in a 5x5 mm LGA package designed for  
transmitter application in portable phones. The RF25F can be used in both cellular  
and Personal Communications System (PCS) bands and, in dual-mode, can be  
used in both Code Division Multiple Access (CDMA) mode and Advanced Mobile  
Phone System (AMPS) mode.  
Features  
Supports tri-mode, dual-band applications  
Optional 14 dB mixer RF adjustable gain  
Low DC power dissipation  
Dual drivers for cellular and PCS bands  
32-pin Land Grid Array (LGA) 5x5 mm package  
The RF25F device includes the following functional blocks:  
Applications  
Cellular and PCS upconverters with RF gain control.  
Cellular and PCS power amplifier drivers.  
Cellular and PCS band phones  
CDMA and AMPS modes in the cellular band  
including:  
The device package and pin-outs are shown in Figure 1. A block diagram of the  
RF25F is shown in Figure 2.  
CDMA-US  
CDMA-J  
CDMA mode in the PCS band including:  
US-PCS  
K-PCS  
1
25  
24  
VCC_DRV_BIAS  
NC  
2
IDLE  
RF_GC  
3
23  
22  
VCC_LAST_DRV_PCS  
VCC_DIFF_DRV_BIAS  
MIX_CELL_OUT  
4
POT_CELL  
5
21  
20  
DRV_ON  
NC  
6
NC  
VCC_DIFF_DRV  
7
19  
18  
RF_PCS_OUT  
NC  
8
NC  
MIX_PCS_OUT  
NC  
9
17  
RF_CELL_OUT  
C872  
Figure 1. RF25F Pinout – 32-Pin LGA  
(Top View)  
Data Sheet  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
Doc. No. 101118B  
October 29, 2001  
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
Cell SAW  
AMPS/CDMA  
29  
DRIVER_ON  
14  
IF+ IF-  
26 27  
LO_CELL_IN  
31  
21  
5
Lo Buf  
9
RF_CELL_OUT  
7
RF_PCS_OUT  
Power  
Management  
Lo Buf  
2
10  
30  
LO_PCS_IN  
24  
17  
16  
Idle  
Cell/PCS  
RF Gain  
Control  
C429  
PCS SAW  
Figure 2. RF25F Tx ASIC Block Diagram  
Each driver takes its input from the upconverter after passing  
through an image reject filter. The drivers amplify the signal and  
send it to an external power amplifier.  
Technical Description  
The RF25F is an upconverter and driver amplifier used by the  
CDMA transmitter section in the cellular and PCS bands. Its  
function can also be used in AMPS mode. A band select  
command chooses between the cellular and the PCS band. A  
mode select command chooses between CDMA and AMPS  
mode in the cellular band. The ASIC consists of two variable  
gain upconverters and two power amplifier drivers for the  
cellular and PCS bands.  
The DRIVER_ON command is used during gated output power  
mode to deactivate the drivers in periods of no transmission. A  
Surface Acoustic Wave (SAW) filter for noise and image  
rejection should be placed between the driver and the external  
power amplifier.  
Electrical and Mechanical Specifications  
Upconverters. The cellular and PCS variable gain upconverters  
receive the IF signal. Each upconverter uses an external Local  
Oscillator (LO) controlled by an external Phase Locked Loop  
(PLL). Upconverter conversion gain control can be used to  
calibrate out part-to-part and temperature gain variations in the  
transmit path. A band select command switches between the  
cellular and PCS bands. The DRIVER_ON command  
deactivates the driver during no transmission status. The output  
RF signal is sent to an output pin to be filtered before driver  
amplification.  
Signal pin assignments and functional pin descriptions are  
described in Table 1. The absolute maximum ratings of the  
RF25F are provided in Table 2. The recommended operating  
conditions are specified in Table 3 and electrical specifications  
are provided in Table 4.  
Typical performance characteristics of the RF25F are illustrated  
in Figures 3 through 26. Figure 27 provides a typical application  
schematic diagram. Figure 28 shows the package dimensions  
for the 32-pin LGA and Figure 29 provides the tape and reel  
dimensions.  
Power Amplifier Drivers. Two power amplifier drivers are  
included, the cellular driver and the PCS driver.  
2
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
RF25F  
Electrostatic Discharge (ESD) Sensitivity  
The HBM ESD withstand threshold value, with respect to  
ground, is ±2.5 kV. The HBM ESD withstand threshold value,  
with respect to VDD (the positive power supply terminal) is also  
±2.5 kV.  
The RF25F is a Class 1 device. The following extreme  
Electrostatic Discharge (ESD) precautions are required  
according to the Human Body Model (HBM):  
Protective outer garments.  
Handle device in ESD safeguarded work area.  
Transport device in ESD shielded containers.  
Monitor and test all ESD protection equipment.  
Table 1. RF25F Signal Descriptions (1 of 2)  
Description  
Pin #  
Name  
1
2
VCC_DRV_BIAS  
IDLE  
Supply voltage for bias circuit of cellular driver and last stage of PCS driver.  
Upconverter enable signal. When the input is low, the chip is disabled. When the input is  
high, the chip is enabled.  
3
4
VCC_LAST_DRV_PCS  
POT_CELL  
Supply voltage for the PCS driver amplifier. This pin can be used to turn the last driver  
on and off for a 24 dB gain step.  
This pin is connected to an external resistor. The value of the resistor sets the bias  
current of the cellular driver, which affects gain and Adjacent Channel Power  
Rejection(ACPR).  
5
DRV_ON  
This is the driver control signal. When the pin is low, the driver is deactivated during no  
transmission. During transmission the pin should be high to enable the driver.  
6
7
NC  
No connection.  
Vcc  
RF_PCS_OUT  
This is the output pin for the PCS RF signal. The pin is connected to the output of the  
PCS driver amplifier. Impedance matching is required.  
8
9
NC  
No connection.  
Vcc  
RF_CELL_OUT  
This is the output pin for the cellular RF signal. The pin is connected to the output of the  
cellular driver amplifier. Impedance matching is required.  
10  
CELL/PCS  
This is a control signal input pin that selects between the cellular band and PCS band.  
When the input is low, the cellular band is chosen. When the input is high, the PCS  
band is chosen.  
11  
12  
VCC_DRV_800  
POT_PCS  
Supply voltage for the driver of the cellular band.  
This pin is connected to an external resistor. The value of the resistor sets the bias  
current of the PCS driver, which affects gain and ACPR.  
13  
14  
VCC_1ST_DRV_PCS  
DRV_CELL_IN  
Supply voltage for the first amplifier in the PCS driver block.  
Vcc  
The cellular driver input pin connected to the RF input of the cellular band driver. The  
input signal should pass through a SAW filter before being connected to the driver.  
Impedance matching is required.  
15  
16  
DRV_PCS_IN  
NC  
The PCS driver input pin connected to the RF input of the PCS band driver. The input  
signal should pass through a SAW filter before being connected to the driver.  
Impedance matching is required.  
+
No connection.  
101118B  
October 29, 2001  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
3
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
Table 1. RF25F Pin Assignments and Signal Descriptions (2 of 2)  
Description  
Pin #  
Name  
17  
18  
NC  
No connection.  
Vcc  
MIX_PCS_OUT  
This pin is connected to the RF output of the PCS upconverter. This pin needs  
impedance matching. The RF output signal should be routed through an image rejection  
filter before being connected to the driver input.  
19  
20  
21  
22  
NC  
No connection.  
VCC_DIFF_DRV  
NC  
Supply voltage for a differential amplifier in the upconverter block.  
No connection.  
Vcc  
MIX_CELL_OUT  
This pin is connected to the RF output of the cellular upconverter. The RF output signal  
should be routed through an image rejection filter before being connected to the cellular  
driver input.  
23  
24  
VCC_DIFF_DRV_BIAS  
RF_GC  
Supply voltage for the bias circuit of both upconverters’ differential drivers.  
The gain control pin for both RF upconverters.  
25  
26  
NC  
No connection.  
IF130_IN+  
The IF input pin for the upconverter block. DC bias is set internally.  
+
27  
IF130_IN–  
Same as pin 26, except a complementary input.  
Supply voltage for the IF mux and bias circuitry.  
28  
29  
VCC_IF  
AMPS/CDMA  
This is the cellular mode control signal input. When the input is low, the AMPS mode is  
selected. If the input is high, CDMA mode is selected.  
30  
LO_PCS_IN  
This is the input pin for the PCS band local oscillator. A typical –10 dBm LO power is  
needed.  
31  
32  
LO_CELL_IN  
VCC_MIX  
This is the input pin for the cellular band local oscillator. A typical –10 dBm LO power is  
needed.  
Supply voltage for the mixer and LO buffer of the upconverter block.  
4
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
RF25F  
Table 2. Absolute Maximum Ratings  
Parameter  
Minimum  
Maximum  
Units  
Supply voltage (VCC)  
Input voltage range  
Power dissipation  
–0.3  
–0.3  
+5.0  
VCC  
600  
V
V
mW  
°C  
°C  
Operating temperature  
Storage temperature  
–30  
–40  
+80  
+125  
Table 3. Recommended Operating Conditions  
Minimum  
Parameter  
Typical  
Maximum  
Units  
Supply voltage (Note 1)  
2.85  
3.0  
3.3  
V
V
Logic level high  
Vcc – 0.5  
Logic level low  
0.5  
71  
59  
85  
49  
84  
65  
48  
V
Supply current in 800 MHz CDMA @ 7 dBm  
Supply current in 800 MHz CDMA @ 0 dBm  
Supply current in 800 MHz AMPS @ 11 dBm  
Supply current in 800 MHz (driver on = off)  
Supply current in 1900 MHz CDMA @ 8 dBm  
Supply current in 1900 MHz CDMA @ 0 dBm  
Supply current in 1900 MHz CDMA (driver on = off)  
62  
52  
75  
43  
74  
57  
42  
20  
–10  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
µA  
dBm  
Supply current in sleep mode (chip enable = off, driver on = off)  
Required LO Level  
–12  
–8  
Note 1: The RF25F works at lower than 3.0 V VCC, but with some performance degradation.  
101118B  
October 29, 2001  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
5
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
Table 4. RF25F Electrical Characteristics (1 of 2)  
(TA = 25° C, Vcc = 3.0 V, PLO = –10 dBm, input externally matched)  
Test  
Parameter  
Symbol  
Condition  
Minimum  
Typical  
Maximum  
Units  
Cellular Variable Gain Upconverter  
LO frequency range  
700  
1100  
MHz  
dB  
External match  
–15  
510  
LO input return loss (reference to 50 )  
Terminating resistor across IF inputs  
485  
824  
535  
925  
Output frequency  
MHz  
dB  
CDMA mode conversion gain, maximum  
CDMA mode conversion gain, minimum  
ACPR in 30 KHz at 885 KHz offset @ –4 dBm output  
ACPR in 30 KHz at 1.98 MHz offset @ –4 dBm output  
FM mode conversion gain, maximum  
FM mode conversion gain, minimum  
20  
–10  
–54  
dB  
–53  
–62  
dBc  
dBc  
dB  
22  
–6  
6
dB  
FM mode output P1dB  
5
dBm  
dB  
Noise figure @ 21 dB gain CDMA/21 dB gain FM  
Noise figure @ 12 dB gain CDMA/14 dB gain FM  
LO to RF leakage @ maximum gain, LO = –10 dBm  
8
9
16  
–35  
18  
dB  
dBm  
PCS Variable-Gain Upconverter  
LO frequency range  
1600  
2200  
MHz  
dB  
External match  
–15  
510  
LO input return loss (reference to 50 )  
Terminating resistor across IF inputs  
Output frequency  
485  
535  
1700  
1910  
MHz  
dB  
Maximum conversion gain  
19  
–6  
Minimum conversion gain  
dB  
Output power at maximum gain  
ACPR in 30 KHz at 1.25 MHz offset @ –6 dBm output  
ACPR in 1 MHz at 2.75 MHz offset @ –6 dBm output  
Noise figure at maximum gain  
–3  
dBm  
dBc  
dBc  
dB  
–56  
–56  
9
–54  
–54  
10  
Noise figure @ 13 dB gain  
13  
dB  
LO to RF leakage @ maximum gain, LO = –10 dBm  
–30  
dBm  
Cellular PA Driver  
External match  
–15  
dB  
MHz  
dB  
Input return loss (reference to 50 )  
Output frequency  
824  
925  
14  
8
Gain (@ POT_CELL = 330 )  
Output power level at maximum gain  
Saturated output power level (FM)  
7
dBm  
dBm  
dBc  
12  
14  
–54  
ACPR in 30 KHz band at 885 KHz offset @ 7 dBm  
output  
–53  
–66  
8
ACPR in 30 KHz band at 1.98 MHz offset @ 7 dBm  
output  
–67  
6
dBc  
dB  
Noise figure  
6
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
RF25F  
Table 4. RF25F Electrical Characteristics (2 of 2)  
(TA = 25° C, Vcc = 3.0 V, PLO = –10 dBm, input externally matched)  
Parameter  
Symbol  
Test  
Minimum  
Typical  
Maximum  
Units  
Condition  
PCS PA Driver  
External match  
–15  
dB  
MHz  
dB  
Input return loss (reference to 50 )  
Output frequency  
1700  
8
1910  
16  
9
Gain (@ POT_PCS = 100 )  
Output power level with 1800 MHz mixer @ maximum  
gain  
dBm  
ACPR in 30 KHz band at 1.25 MHz offset @ 8 dBm  
output  
–52  
–52  
9
–51  
–51  
10  
dBc  
dBc  
dB  
ACPR in 1 MHz band at 2.75 MHz offset @ 8 dBm  
output  
Noise figure  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
1.85MHz  
1.88MHz  
1.91MHz  
2.85V  
3.0V  
3.3V  
-1  
0
1
2
3
4
5
6
7
8
9
10  
11  
-1  
0
1
2
3
4
5
6
7
8
9
10  
11  
Pout (dBm)  
Pout (dBm)  
Figure 3. PCS Driver ACPR vs. Pout Over Vcc  
Figure 5. PCS Driver ACPR vs. Pout Over Frequency  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-30°C  
25°C  
60°C  
-30°C  
25°C  
60°C  
1.84  
1.85  
1.86  
1.87  
1.88  
1.89  
1.9  
1.91  
1.92  
-1  
0
1
2
3
4
5
6
7
8
9
10  
11  
Frequency (GHz)  
Pout (dBm)  
Figure 6. PCS Driver Gain vs. Frequency Over Temperature  
(Po = +8 dBm)  
Figure 4. PCS Driver ACPR vs. Pout Over Temperature  
Note: Unless otherwise specified, all graphs depict testing at the following parameters: For CDMA: Fc = 836.5 MHz, F = ±0.885 MHz,  
25 °C, 3.0 V; For PCS: Fc = 1.88 GHz, F = ±1.25 MHz, 25 °C, 3.0 V  
101118B  
October 29, 2001  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
7
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
2.85V  
3.0V  
3.3V  
-30°C  
25°C  
60°C  
10  
-16  
-15  
-14  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
2.8  
2.85  
2.9  
2.95  
3
3.05  
3.1  
3.15  
3.2  
3.25  
3.3  
3.35  
Pout (dBm)  
Vcc (Volts)  
Figure 8. PCS Mixer ACPR vs. Pout Over Vcc  
Figure 7. PCS Driver Gain vs. Vcc Over Temperature  
(Po = +8 dBm)  
-30  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-30°C  
25°C  
60°C  
1.85MHz  
1.88MHz  
1.91MHz  
-16  
-15  
-14  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-16  
-15  
-14  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
Pout (dBm)  
Pout (dBm)  
Figure 9. PCS Mixer ACPR vs. Pout Over Temperature  
Figure 10. PCS Mixer ACPR vs Pout Over Frequency  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
25  
20  
15  
10  
5
1.4V  
1.6V  
1.8V  
2.0V  
2.2V  
-30°C  
25°C  
60°C  
0
1.84  
1.85  
1.86  
1.87  
1.88  
1.89  
1.9  
1.91  
1.92  
-16  
-15  
-14  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
Frequency (GHz)  
Pout (dBm)  
Figure 12. PCS Mixer Gain vs. Frequency Over Temperature  
(Pout = -6 dBm)  
Figure 11. PCS Mixer ACPR vs. Pout Over RFGC Voltage  
(Pout = -6 dBm)  
Note: Unless otherwise specified, all graphs depict testing at the following parameters: For CDMA: Fc = 836.5 MHz, F = ±0.885 MHz,  
25 °C, 3.0 V; For PCS: Fc = 1.88 GHz, F = ±1.25 MHz, 25 °C, 3.0 V  
8
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
RF25F  
25  
20  
15  
10  
5
30  
20  
10  
0
-10  
-20  
-30  
-40  
-50  
2.85V  
3.0V  
3.3V  
-30°C  
25°C  
60°C  
0
2.8  
2.85  
2.9  
2.95  
3
3.05  
3.1  
3.15  
3.2  
3.25  
3.3  
3.35  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
2.2  
2.4  
2.6  
Vcc (Volts)  
RFGC Voltage (Volts)  
Figure 14. PCS Mixer Gain vs. RFGC Voltage Over Vcc  
Figure 13. PCS Mixer Gain vs. Vcc Over Temperature  
(Pout = -6 dBm)  
-30  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-30°C  
25°C  
60°C  
2.85V  
3.0V  
3.3V  
-1  
0
1
2
3
4
5
6
7
8
9
10  
11  
-1  
0
1
2
3
4
5
6
7
8
9
10  
11  
Pout (dBm)  
Pout (dBm)  
Figure 15. Cellular Driver ACPR vs. Pout Over Vcc  
Figure 16. Cellular Driver ACPR vs. Pout Over Temperature  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
20  
19  
18  
17  
16  
15  
14  
824MHz  
836.5MHz  
849MHz  
13  
-30°C  
25°C  
60°C  
12  
11  
10  
-1  
0
1
2
3
4
5
6
7
8
9
10  
11  
820  
825  
830  
835  
840  
845  
850  
855  
Pout (dBm)  
Frequency (MHz)  
Figure 17. Cellular Driver ACPR vs. Pout Over Frequency  
Figure 18. Cellular Driver Gain vs. Frequency Over Temperature  
(Pout = +7 dBm)  
Note: Unless otherwise specified, all graphs depict testing at the following parameters: For CDMA: Fc = 836.5 MHz, F = ±0.885 MHz,  
25 °C, 3.0 V; For PCS: Fc = 1.88 GHz, F = ±1.25 MHz, 25 °C, 3.0 V  
101118B  
October 29, 2001  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
9
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
2.85V  
3.0V  
3.3V  
-30°C  
25°C  
60°C  
10  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
1
2
3
2.8  
2.85  
2.9  
2.95  
3
3.05  
3.1  
3.15  
3.2  
3.25  
3.3  
3.35  
Pout (dBm)  
Vcc (Volts)  
Figure 20. Cellular Mixer ACPR vs. Pout Over Vcc  
Figure 19. Cellular Driver Gain vs. Vcc Over Temperature  
(Pout = +7 dBm)  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-30  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-30°C  
25°C  
60°C  
824MHz  
836.5MHz  
849MHz  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
1
2
3
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
1
2
3
Pout (dBm)  
Pout (dBm)  
Figure 22. Cellular Mixer ACPR vs. Pout Over Frequency  
Figure 21. Cellular Mixer ACPR vs. Pout Over Temperature  
30  
-30  
-35  
25  
20  
15  
10  
5
1.4V  
-40  
-45  
-50  
-55  
-60  
-65  
1.6V  
1.8V  
2.0V  
2.2V  
-30°C  
25°C  
60°C  
820  
825  
830  
835  
840  
845  
850  
855  
-13  
-12  
-11  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
1
2
3
Frequency (MHz)  
Pout (dBm)  
Figure 24. Cellular Mixer Gain vs. Frequency Over Temperature  
(Pout = -6 dBm)  
Figure 23. Cellular Mixer ACPR vs. Pout Over RFGC Voltage  
Note: Unless otherwise specified, all graphs depict testing at the following parameters: For CDMA: Fc = 836.5 MHz, F = ±0.885 MHz,  
25 °C, 3.0 V; For PCS: Fc = 1.88 GHz, F = ±1.25 MHz, 25 °C, 3.0 V  
10  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
RF25F  
30  
20  
30  
25  
20  
15  
10  
5
10  
0
-10  
-20  
-30  
-40  
-50  
-30°C  
25°C  
60°C  
2.85V  
3.0V  
3.3V  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
2.2  
2.4  
2.6  
2.8  
2.85  
2.9  
2.95  
3
3.05  
3.1  
3.15  
3.2  
3.25  
3.3  
3.35  
RFGC Voltage (Volts)  
Vcc (Volts)  
Figure 26. Cellular Mixer Gain vs. RFGC Voltage Over Vcc  
Figure 25. Cellular Mixer Gain vs. Vcc Over Temperature  
(Pout = -6 dBm)  
Note: Unless otherwise specified, all graphs depict testing at the following parameters: For CDMA: Fc = 836.5 MHz, F = ±0.885 MHz,  
25 °C, 3.0 V; For PCS: Fc = 1.88 GHz, F = ±1.25 MHz, 25 °C, 3.0 V  
101118B  
October 29, 2001  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
11  
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
0
0
8.2 pF  
33 pF  
50 ohms  
50 ohms  
FM/CDMA  
VCC_IF  
DNI  
1 µF  
0.1 µF  
180 nH  
2200 pF  
2200 pF  
TC8-1  
VCC_MIX  
3
2
1
4
5
50 ohms  
33 pF  
33 pF  
8.2 pF  
8.2 pF  
IN –  
OUT–  
OUT+  
510  
4.7 pF  
180 nH  
180 nH  
IN +  
VCC_DRV_BIAS  
DNI  
VCC_3V  
RFGC  
IDLE  
.033 µF  
33 pF  
.033 µF  
DNI  
VCC_LASTDRV  
0.1 µF  
8.2 pF  
360  
8.2 pF  
1.8 pF  
See Note 3.  
1 K  
12 nH  
33 pF  
PA_R0  
TO RF 800  
IMAGE REJECT  
INPUT  
VCC_DRV_BIAS  
IDLE  
NC  
50 ohms  
1
2
3
4
5
6
7
8
9
25  
24  
23  
22  
21  
20  
19  
18  
17  
103  
RFGC  
VCC_LAST_DRV_PCS  
POT_CELL  
VCC_DIFF_BIAS  
MIX_CELL_OUT  
NC  
3.9 K  
DRV_ON  
NC  
RF25F  
VCC_DIFF_DRV  
NC  
VCC_DIFF_DRV  
DRV_ON  
RF_PCS_OUT  
NC  
8.2 pF  
33 pF  
0
0
MIX_PCS_OUT  
NC  
8.2 pF  
RF_CELL_OUT  
1 pF  
0
8.2 pF  
8.2 pF  
33 pF  
TO RF 1800  
IMAGE REJECT  
INPUT  
50 ohms  
33 pF  
PCS/CELL  
2.2 nH  
8.2 nH  
FROM RF 1800  
IMAGE REJECT  
OUTPUT  
VCC_DRV_CELL  
1 pF  
0.1 µF  
33 pF  
100  
See Note 3.  
1 K  
PA_R0  
FROM RF 800  
IMAGE REJECT  
OUTPUT  
103  
3.3 pF  
2.2 K  
VCC_1STDRV_PCS  
0.1 µF  
8.2 pF  
NOTES:  
1. COMPONENT VALUES MAY CHANGE  
2. DNI = DO NOT INSTALL  
3. GENERAL PURPOSE DIGITAL SWITCH, e.g. DTC114WUA  
4. A PULL-UP IS REQUIRED FOR THE PA_R0 AT THE MSM CHIP  
Figure 27. RF25F Schematic Diagram  
12  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
RF25F  
2.480  
2.350  
5.04 ± 0.05  
To Metal Pad Edge  
Solder Mask  
0.300  
0.150 Pin #1 mark  
Exposed Metal  
Pin #1  
Pin #1  
0.500  
Solder Mask  
Exposed Metal  
0.38 ± 0.05  
0.040 Ref.  
0.300 ± 0.02  
0.400 ± 0.05  
Package Edge  
0.500  
Detail A  
2.000  
Mold  
Substrate  
0.30 ± 0.05  
All measurements are in millimeters  
C1285  
Figure 28. RF25F 32-Pin LGA Package Dimensions  
8.00 ± 0.10  
4.00 ± 0.10  
1.50 ± 0.10  
1.75 ± 0.10  
Notes:  
1.50 ± 0.25  
1. Carrier tape material: black conductive polycarbonate  
2. Cover tape material: transparent conductive PSA  
3. Cover tape size: 9.3 mm width  
0.292 ± 0.02  
o
4. Tolerance: .XX = ±0.10  
5. All measurements are in millimeters  
o
8
maximum  
5
maximum  
C1327  
1.78 ± 0.10  
5.49 ± 0.10  
5.51 ± 0.10  
Figure 29. 32-pin LGA Tape and Reel Dimensions  
101118B  
October 29, 2001  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
13  
RF25F  
Tx ASIC for CDMA/AMPS/ and PCS Applications  
Ordering Information  
Model Name  
Tx ASIC  
Manufacturing Part  
Number  
Product Revision  
RF25F-12  
© 2001, Skyworks Solutions, Inc. All Rights Reserved.  
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its  
customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to  
its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility  
whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks’ Terms and  
Conditions of Sale for such products, Skyworks assumes no liability whatsoever.  
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF  
SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY  
OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE  
ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL  
NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST  
PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS.  
Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks’ customers using or selling Skyworks™ products for use in such  
applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.  
The following are trademarks of Skyworks Solutions, Inc.: Skyworks™, the Skyworks symbol, and “Breakthrough Simplicity”™. Product names or services listed in this  
publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners.  
Additional information, posted at www.skyworksinc.com, is incorporated by reference.  
14  
Skyworks – Preliminary  
Proprietary Information and Specifications Are Subject to Change  
101118B  
October 29, 2001  
General Inform ation:  
Skyworks Solutions, Inc.  
4311 J am boree Rd.  
Newport Beach, CA 92660-3007  
w w w .s k yw o rk s in c .c o m  

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