SKY77762-11 [SKYWORKS]
RF and Baseband Circuit, GREEN, PACKAGE-10;型号: | SKY77762-11 |
厂家: | SKYWORKS SOLUTIONS INC. |
描述: | RF and Baseband Circuit, GREEN, PACKAGE-10 电信 电信集成电路 |
文件: | 总12页 (文件大小:2150K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
SKY77762 Power Amplifier Module for CDMA/ WCDMA/
HSDPA/ HSUPA/ HSPA+/ LTE – Band II (1850–1910 MHz)
Applications
• WCDMA handsets
• HSDPA
Description
The SKY77762 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module
developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient
module packs full 1850-1910 MHz bandwidth coverage into a single compact package. Because of
high efficiencies attained throughout the entire power range, the SKY77762 delivers unsurpassed
talk-time advantages. The SKY77762 meets the stringent spectral linearity requirements of High
Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term
Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler
eliminates the need for any external coupler.
• HSUPA
• HSPA+
• LTE
- Band 25
(1850 MHz–1915 MHz)
- Band 39
(1850 MHz–1920 MHz)
The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier
active circuitry, including input and interstage matching circuits. The silicon CMOS support die,
providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output
match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and
power performance.
• CDMA2000
• EVDO
The SKY77762 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT)
process which provides for all positive voltage DC supply operation and maintains high efficiency and
good linearity. While primary bias to the SKY77762 can be supplied directly from any suitable battery
with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DC-DC
power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down
executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off"
leakage is a few microamperes with full primary voltage supplied from the battery.
Features
• Low voltage positive bias
supply 3.0 V to 4.5 V
• Good linearity
• High efficiency
- 46% at 28.6 dBm
• Large dynamic range
• Small, low profile package
- 3 mm x 3 mm x 0.9 mm
- 10-pad configuration
• Power down control
• InGaP
• Supports low collector
voltage operation
• Digital Enable
• No VREF required
• CMOS compatible control
signals
• Integrated Directional
Coupler
Figure 1. SKY77762 Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201707F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • September 20, 2012
1
DATA SHEET
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
Electrical Specifications
The following tables list the electrical characteristics of the
SKY77762 Power Amplifier. Table 1 lists the absolute maximum
ratings and Table 2 shows the recommended operating
conditions. Electrical specifications for nominal operating
conditions are listed in Table 4. Table 3 presents a truth table for
the power settings. Tables 5 through 8 provide the standard test
configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA
(STC3, STC4) respectively.
Table 1. Absolute Maximum Operating Conditions
No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
RF Input Power
Supply Voltage
PIN
—
—
0
10
6.0
dBm
No RF
VCC1
VCC2
3.4
—
1.8
1.8
1.8
25
Volts
With RF
—
4.6
Enable Control Voltage
Mode Control Voltage
VEN
—
4.2
Volts
Volts
VMODE0
VMODE1
TCASE
—
4.2
—
4.2
1
Case Temperature
Operating
Storage
–30
–40
+110
+150
°C
TSTG
—
1
Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
1
RF Output Power
WCDMA
HSDPA
HSUPA
LTE
POUT_MAX
28.60
27.60
25.00
27.60
28.25
1850
3.0
—
—
—
—
dBm
—
—
—
—
CDMA2000
—
—
Operating Frequency
ƒO
1880
3.4
—
1910
4.5
3.6
0.50
3.10
0.5
0.5
3.1
3.1
+85
MHz
2
Supply Voltage
VCC1
Volts
VCC2
0.5
Enable Control Voltage
Mode Control Voltage
Low
High
Low
VEN_L
VEN_H
VMODE0
VMODE1
VMODE0
VMODE1
TCASE
0.00
1.35
0.0
0.00
1.80
0.0
0.0
1.8
1.8
+25
Volts
Volts
0.0
High
1.35
1.35
–20
Case Operating Temperature3
°C
1
For VCC < 3.4 V, output power back-off = 0.5 dB.
2
Specifications in Table 4 are specified at VCC1 = 3.2 V to 4.2 V.
Equivalent to –30 °C to +75 °C Ambient Operating Temperature.
3
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
September 20, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201707F
2
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
DATA SHEET
VCC
Table 3. Modes of Operation
Power Setting
ENABLE
VMODE0
VMODE1
Power Down Mode
Standby Mode
Low
Low
High
High
High
Low
—
Low
—
On
On
On
On
On
High Power Mode (17.0 dBm ≤ POUT ≤ 28.6 dBm)
Medium Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm)
Low Power Mode (POUT ≤ 7.0 dBm)
Low
High
High
—
Low
High
Table 4. Electrical Specifications for Nominal Operating Conditions (1 of 2)
Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.
Characteristics
Symbol
Condition
Minimum Typical Maximum Unit
1
Gain
GLOW
POUT = 7.0 dBm
12.0
16.5
19.0
dB
VCC2 = 0.8 V
GMED
POUT = 17.0 dBm
VCC2 = 1.5 V
20.0
24.5
28.0
GHIGH
POUT = 28.6 dBm
POUT = 28.6 dBm
POUT = 28.6 dBm
POUT = 28.6 dBm
POUT = 7.0 dBm, VCC2 = 0.8 V
POUT = 17.0 dBm, VCC2 = 1.5 V
POUT = 28.6 dBm
POUT = 7.0 dBm, VCC2 = 0.8 V
POUT = 17.0 dBm, VCC2 = 1.5 V
POUT = 28.6 dBm
Low Power Mode
Medium Power Mode
—
25.0
—
—
—
11
22
43
—
—
—
—
—
—
—
—
—
28.6
—
—
—
13
26
46
46
126
458
24
35
20
20
20
1
32.0
–1
–2
–7
—
—
—
60
Rx Band Gain
RxG
dB
%
RxG_GPS
RxG_ISM
PAELOW
PAEMED
PAEHIGH
ICC_LOW
ICC_MED
ICC_HIGH
IQ_LOW
IQ_MED
IEN
Power Added Efficiency
Total Supply Current
Quiescent Current
mA
mA
150
500
35
45
Enable Control Current
Mode Control Current
40
µA
µA
IMODE0
IMODE1
IPD
—
40
—
40
Total Supply Current in Power Down Mode
VCC = 4.5 V
VEN = Low
10
µA
VMODE0 = Low
VMODE1 = Low
ICC1 Current
ICC1_HIGH
—
POUT = 7.0 dBm
POUT = 17.0 dBm
POUT = 28.6 dBm
POUT = 7.0 dBm
POUT = 17.0 dBm
POUT = 28.6
—
—
—
—
—
—
—
—
10
mA
2
Adjacent Channel Leakage power Ratio
5 MHz offset ACLR5
–43
–45
–41
–67
–63
–55
–39
–39
–39
–51
–51
–51
dBc
10 MHz offset ACLR10
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201707F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • September 20, 2012
3
DATA SHEET
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
Table 4. [continued] Electrical Specifications for Nominal Operating Conditions (2 of 2)
Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.
Characteristics
Symbol
Condition
Minimum Typical Maximum Unit
3
4
Adjacent Channel Leakage power Ratio
EUTRA offset ACLR_EUTRA
POUT ≤ (POUT_MAX – MPR )
—
—
—
—
—
—
—
—
—
—
—
—
—
—
–40
–42
—
—
—
—
—
—
—
—
—
—
—
—
–35
–43
dBc
dBc
dBc
UTRA offset
ACLR1_UTRA
ACLR2_UTRA
3
4
Adjacent Channel Leakage power Ratio
EUTRA offset ACLR_EUTRA
POUT ≤ (POUT_MAX – MPR )
–36.5
–41.0
–43.0
–37
–41
–43
–48
–55
–53
–50
—
Band 25 (1850–1915 MHz)
UTRA offset
ACLR1_UTRA
ACLR2_UTRA
4
EUTRA offset ACLR_EUTRA
POUT ≤ (POUT_MAX – MPR )
Band 39 (1850-1920 MHz)
5,6
UTRA offset
ACLR1_UTRA
ACLR2_UTRA
Adjacent Channel Power Ratio
1.25 MHz offset ACPR1
1.98 MHz offset ACPR2
Second f02
POUT = 28.25 dBm
POUT ≤ 28.6 dBm
dBc
dBc
Harmonic Suppression
Third
f03
1
Tx Noise in Rx Bands
Rx Band II
1930 MHz–1990 MHz
POUT = 28.6 dBm
–135.0 dBm/Hz
GPS Rx
ISM Rx
1574 MHz–1577 MHz
POUT = 28.6 dBm
—
—
—
—
–137.0
2400 MHz–2483.5 MHz
POUT = 28.6 dBm
–144.5
EVM
EVM1
POUT = POUT_MAX
—
—
—
—
—
—
–22
—
—
—
3.75
3.25
20
%
EVM2
POUT = POUT_MAX – 3
Rise / Fall Time
DC
RF
TON_DC
TOFF_DC
TON_RF
TOFF_RF
CPL
—
—
µs
—
—
20
—
—
—
6
—
6
Coupling Factor
POUT = POUT_MAX
–20
±0.30
–18
—
dB
dB
CPL_OUT / POUT Power Ratio Variation Over Output VSWR
2.5:1 VSWR at POUT
all VSWR phases
CPL_IN 50 Ω terminated
Daisy-chain
VSWR
CPL_IN and CPL_OUT ports
698 MHz to 2620 MHz
VEN = Low
—
—
1.6:1
Insertion Loss
—
—
—
1.6:1
—
0.25
1.85:1
–70
dB
—
Input Voltage Standing Wave Ratio
VSWR
S
—
6:1 VSWR All phases
POUT ≤ 28.6 dBm
1
Stability (Spurious output)
—
dBc
1,7
Ruggedness – no damage
Ru
10:1
—
—
VSWR
1
Over conditions
2
ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.
LTE: ACLR is measured with QPSK modulation with 20 MHz bandwidth and 18 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101.
MPR is the maximum power reduction as defined in 3GPP TS36.101
3
4
5
6
ACPR is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
For CDMA2000 test configured as [PCD @ –7.40 dB, DCCH–9600 bps @ –15.35 dB; SCHO–9600 bps @ –15.63 dB] and other test configurations that yield a peak-to-average up to 4.02 dB
for CCDF = 1%, up to 1 dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions.
7
All phases, time = 10 seconds.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
September 20, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201707F
4
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
DATA SHEET
Table 5. Standard Test Configuration – STC1 WCDMA Mode
Parameter
DPCCH
Level
Spread Code Spread Factor
I/Q
Q
βc
8/15
—
βd
—
βhs
—
βec
—
βed
—
Relative Power (dB)
–6.547
15 kbps
60 kbps
0
256
64
DPDCH
16
I
15/15
—
—
—
–1.087
Table 6. Standard Test Configuration – STC2 HSDPA Mode
Parameter
DPCCH
Level
Spread Code Spread Factor
I/Q
Q
βc
12/15
—
βd
—
βhs
—
βec
—
βed
—
Relative Power (dB)
–7.095
15 kbps
60 kbps
15 kbps
0
256
64
DPDCH
16
64
I
15/15
—
—
—
—
–5.157
HS-DPCCH
256
Q
—
24/15
—
—
–3.012
Table 7. Standard Test Configuration – STC3 HSUPA Mode
Parameter
DPCCH
Level
Spread Code Spread Factor
I/Q
βc
8/15
—
βd
—
βhs
—
βec
—
βed
—
Relative Power (dB)
–19.391
15 kbps
960 kbps
15 kbps
15 kbps
960 kbps
0
1
256
4
Q
I
DPDCH
15/15
—
—
—
—
–13.931
HS- DPCCH
E-DPCCH
E-DPDCH
64
1
256
256
4
Q
I
—
8/15
—
—
—
–19.391
—
—
10/15
—
—
–17.338
2
I
—
—
—
71.5/15
–0.371
Table 8. Standard Test Configuration – STC4 HSUPA Mode
Parameter
DPCCH
Level
Spread Code Spread Factor
I/Q
βc
6/15
—
βd
—
βhs
—
βec
—
βed
—
Relative Power (dB)
–12.499
15 kbps
960 kbps
15 kbps
15 kbps
960 kbps
0
1
256
4
Q
I
DPDCH
15/15
—
—
—
—
–4.540
HS- DPCCH
E-DPCCH
E-DPDCH
64
1
256
256
4
Q
I
—
2/15
—
—
—
–22.041
—
—
12/15
—
—
–6.478
2
I
—
—
—
15/15
–4.425
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201707F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • September 20, 2012
5
DATA SHEET
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77762, the evaluation board schematic and assembly
diagrams are included for analysis and design. Figure 2 shows
the basic schematic of the board for the 1850 MHz to 1910 MHz
range shown in Figure 3. Figure 4 is a schematic of the
recommended application shown in Figure 5.
Figure 2. Evaluation Board Schematic
Figure 3. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
September 20, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201707F
6
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
DATA SHEET
Figure 4. SKY77762 Schematic for Recommended Application Diagram
Figure 5. SKY77762 Recommended Application Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201707F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • September 20, 2012
7
DATA SHEET
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
Package Dimensions
The SKY77762 is a multi-layer laminate base, overmold
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50-ohm
terminals.
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 6 is a mechanical
drawing of the pad layout for this package. Figure 7 provides a
Figure 6. Dimensional Diagram for 3 mm x 3 mm x 0.9 mm Package – SKY77762 Specific
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
September 20, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201707F
8
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
DATA SHEET
Figure 7. Phone PCB Layout Diagram – 3 mm x 3 mm, 10-Pad Package – SKY77762
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201707F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • September 20, 2012
9
DATA SHEET
SKY77762 POWER AMPLIFIER MODULE for CDMA / WCDMA /
HSDPA / HSUPA /HSPA+ / LTE – BAND II (1850–1910 MHz)
Package Description
Figure 8 shows the pad functions and the pad numbering
convention, which starts with pad 1 in the upper left and
increments counter-clockwise around the package. Typical case
markings are illustrated in Figure 9.
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77762 is capable of withstanding an MSL3/260 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 260 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 260 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format (Figure 10).
Electrostatic Discharge (ESD) Sensitivity
The SKY77762 meets class 1C JESD22-A114 Human Body Model
(HBM), class IV JESD22-C101 Charged-Device Model (CDM), and
class A JESD22-A115 Machine Model (MM) electrostatic
discharge (ESD) sensitivity classification.
Figure 8. SKY77762 Pad Names and Configuration (Top View)
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the ESD handling
precautions listed below.
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 1,000 MΩ to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
Figure 9. Typical Case Markings
Package Handling Information
- Grounded Carts
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
- Protective Work Order Holders
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
September 20, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201707F
10
SKY77762 POWER AMPLIFIER MODULE for CDMA/ WCDMA/
HSDPA/ HSUPA/HSPA+/ LTE – BAND II (1850–1910 MHz)
DATA SHEET
Figure 10. Dimensional Diagram for Carrier Tape Body Size 3 mm x 3 mm x 0.75 / 0.90 mm – MCM
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201707F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • September 20, 2012
11
Ordering Information
Product Name
Manufacturing Part Number
Evaluation Board Part Number
SKY77762 Power Amplifier Module
SKY77762-11
EN20-D957-001 REV A
Revision History
Revision
Date
Description
A
December 27, 2011
March 9, 2012
Initial Release – Information
B
Revise: Figure 1–3, 6, 7; Table 4 and footnotes 4, 5
Add: Figures 4, 5
C
May 5, 2012
Revise: Data Sheet status from ADVANCE to PRELIMINARY; Features list (p1); Description (p1); Tables 2, 4;
Figures 4, 5
D
E
F
August 1, 2012
Revise: Add footnote 3 to Table 2
August 3, 2012
Revise: Change Data Sheet status from PRELIMINARY to FINAL; Table 4; Order Information Table (last page)
Revise: Features list (p1); Tables 2, 4
September 20, 2012
References
Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM)
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM)
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-C101 Charged Device Model (CDM).
Copyright © 2011, 2012, Skyworks Solutions, Inc. All Rights Reserved.
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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