CXM3540XR [SONY]

High Linearity DP4T Antenna Switch for GSM/UMTS/CDMA; 高线性度DP4T天线开关,用于GSM / UMTS / CDMA
CXM3540XR
型号: CXM3540XR
厂家: SONY CORPORATION    SONY CORPORATION
描述:

High Linearity DP4T Antenna Switch for GSM/UMTS/CDMA
高线性度DP4T天线开关,用于GSM / UMTS / CDMA

射频和微波 开关 射频开关 微波开关 CD GSM
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High Linearity DP4T Antenna Switch for GSM/UMTS/CDMA  
CXM3540XR  
Description  
The CXM3540XR is a high power and high linearity DP4T antenna switch for GSM/UMTS/CDMA applications.  
The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a  
lower output level.  
The Integrated logic decoder reduces component count and simplifies PCB layout by allowing direct connection  
of the switch to digital base band control lines with the CMOS logic levels.  
Sony GaAs JPHEMT MMIC Process is used.  
(Applications: GSM/UMTS GSM/CDMA dual mode handsets, CDMA handsets, UMTS handsets)  
Features  
‹ Low insertion loss: 0.30dB (typ.) @34dBm (Cellular Band)  
0.35dB (typ.) @32dBm (PCS Band)  
‹ High linearity: IIP3 = 70dBm  
‹ Low voltage operation VDD = 2.5V  
‹ No DC blocking capacitors  
‹ Lead-Free and RoHS compliant  
Package  
Small package 22-pin XQFN (2.4mm × 3.3mm × 0.35mm) (Typ.)  
Structure  
GaAs JPHEMT MMIC  
This IC is ESD sensitive device. Special handling precautions are required.  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license  
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating  
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
E08653  
- 1 -  
CXM3540XR  
Absolute Maximum Ratings  
Š Bias voltage  
VDD  
Vctl  
4
V
V
(Ta = 25°C)  
(Ta = 25°C)  
Š Control voltage  
Š Input power Max.  
4
35.5  
dBm (824 to 915MHz, Ta = 25°C) [Duty cycle = 12.5% to 50%]  
34  
dBm (1710 to 1910MHz, Ta = 25°C) [Duty cycle = 12.5% to 50%]  
32  
dBm (1920 to 1980MHz, Ta = 25°C)  
Š Operating temperature  
–35 to +85  
–65 to +150  
500  
°C  
°C  
Š
Š
Storage temperature  
Maximum power dissipation PD  
*1  
mW  
*1  
25mm × 25mm × t: 0.8mm Mounted on standard board (FR-4)  
- 2 -  
CXM3540XR  
Block Diagram  
RF5  
RF1  
F1  
F5  
F2  
F9  
RF2  
RF3  
F10  
F11  
F6  
F3  
F7  
F4  
F8  
RF4  
F12  
RF6  
Pin Configuration  
11  
10  
9
8
GND  
12  
13  
14  
15  
16  
17  
18  
7
6
5
4
3
2
1
GND  
RF6  
GND  
GND  
RF5  
RF3  
GND  
RF4  
XQFN-22P PKG  
(2.4mm × 3.3mm × 0.4mm Max.)  
Top View  
GND  
GND  
CTLD  
GND  
GND  
19  
20  
21  
22  
- 3 -  
CXM3540XR  
Pin Description  
Pin No.  
Symbol  
CTLD  
Pin No.  
12  
Symbol  
1
2
GND  
RF6  
GND  
GND  
RF4  
13  
3
14  
GND  
GND  
RF5  
4
15  
5
GND  
RF3  
16  
6
17  
GND  
GND  
VDD  
7
GND  
RF2  
18  
8
19  
9
GND  
RF1  
20  
CTLA  
CTLB  
CTLC  
10  
11  
21  
GND  
22  
Truth Table  
Active  
path  
State CTLA CTLB CTLC CTLD  
F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14  
1
2
3
4
5
6
7
8
L
L
L
H
L
L
L
H
L
L
H
L
L
L
H
L
H
H
H
H
L
L
H
L
L
L
H
L
L
RF5-RF1 ON OFF OFF OFF OFF OFF OFF OFF OFF ON ON ON OFF ON  
RF5-RF2 OFF ON OFF OFF OFF OFF OFF OFF ON OFF ON ON OFF ON  
RF5-RF3 OFF OFF ON OFF OFF OFF OFF OFF ON ON OFF ON OFF ON  
RF5-RF4 OFF OFF OFF ON OFF OFF OFF OFF ON ON ON OFF OFF ON  
RF6-RF1 OFF OFF OFF OFF ON OFF OFF OFF OFF ON ON ON ON OFF  
RF6-RF2 OFF OFF OFF OFF OFF ON OFF OFF ON OFF ON ON ON OFF  
RF6-RF3 OFF OFF OFF OFF OFF OFF ON OFF ON ON OFF ON ON OFF  
RF6-RF4 OFF OFF OFF OFF OFF OFF OFF ON ON ON ON OFF ON OFF  
L
L
L
DC Bias Condition  
(Ta = 25°C)  
Item  
Vctl (H)  
Vctl (L)  
VDD  
Min.  
1.5  
0
Typ.  
1.8  
Max.  
3.2  
Unit  
V
0.3  
2.5  
2.8  
3.2  
- 4 -  
CXM3540XR  
Electrical Characteristics  
(Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V)  
Item  
Symbol  
Path  
Condition  
Min.  
Typ.  
0.30  
0.30  
0.35  
0.40  
38  
Max.  
Unit  
dB  
*1  
0.45  
0.45  
0.50  
0.55  
1575.42MHz  
RF5 - RF1, 2, 3, 4  
RF6 - RF1, 2, 3, 4 *2  
Insertion loss  
IL  
*3  
*1  
25  
24  
22  
21  
1575.42MHz  
36  
RF5 - RF1, 2, 3, 4  
RF6 - RF1, 2, 3, 4 *2  
Isolation  
VSWR  
ISO.  
dB  
35  
*3  
30  
VSWR  
2fo  
824 to 2170MHz  
1.1  
–60  
–45  
–60  
–45  
–95  
–90  
–95  
–90  
–36  
–36  
–36  
–36  
–75  
–75  
–75  
–75  
*1  
*2  
*9  
3fo  
dBm  
2fo  
3fo  
RF5 - RF1, 2, 3, 4  
RF6 - RF1, 2, 3, 4  
Harmonics  
2fo  
3fo  
dBc  
2fo  
*10  
3fo  
P0.2dB  
compression  
input power  
824 to 930MHz  
35.5  
33.5  
RF5 - RF1, 2, 3, 4  
RF6 - RF1, 2, 3, 4  
P0.2dB  
dBm  
1710 to 1980MHz  
*4, *8  
–110  
–110  
70  
RF5 - RF1, 2, 3, 4  
IMD3  
IMD3  
IIP3  
dBm  
dBm  
RF6 - RF1, 2, 3, 4 *5, *8  
*6, *8  
65  
65  
RF5 - RF1, 2, 3, 4  
Input IP3  
RF6 - RF1, 2, 3, 4 *7, *8  
70  
Control current  
Supply current  
Ictl  
Idd  
Vctl = 1.8V  
0.005  
0.15  
10  
μA  
VDD = 2.8V  
0.3  
mA  
VDD = 2.8V,  
Vctl = 0V/1.8V  
Switching speed Swt  
2
5
μs  
Electrical characteristics are measured with all RF ports terminated in 50Ω.  
*1  
Pin = 34dBm, f = 824 to 960MHz  
*2  
Pin = 32dBm, f = 1710 to 1990MHz  
*3  
Pin = 10dBm, f = 2110 to 2170MHz  
*4  
Ptx = 21.5dBm, Pjam = –15dBm, ftx = 835MHz, fjam = 790MHz, fim = 880MHz  
*5  
Ptx = 21.5dBm, Pjam = –15dBm, ftx = 1950MHz, fjam = 1760MHz, fim = 2140MHz  
Pin = 27 + 27dBm, 835 + 836MHz, IIP3 = (3 × Pout – IM3)/2 + Loss  
Pin = 27 + 27dBm, 1950 + 1951MHz, IIP3 = (3 × Pout – IM3)/2 + Loss  
Measured with recommended circuit  
*6  
*7  
*8  
*9  
Pin = 25dBm, f = 890 to 930MHz  
*10  
Pin = 25dBm, f = 1920 to 1980MHz  
- 5 -  
CXM3540XR  
Recommended Circuit  
11  
10  
9
8
GND  
RF6  
GND  
RF3  
12  
13  
14  
15  
16  
17  
18  
7
6
5
4
3
2
1
C2  
C1  
L2  
L1  
GND  
GND  
RF5  
GND  
RF4  
XQFN-22P PKG  
(2.4mm × 3.3mm × 0.4mm Max.)  
Top View  
GND  
GND  
CTLD  
GND  
GND  
19  
20  
21  
22  
Note) 1. No DC blocking capacitors are required on all RF ports.  
2. DC levels of all RF ports are GND.  
3. L1, L2, C1 and C2 are recommended on Ant port for ESD protection.  
- 6 -  
CXM3540XR  
Package Outline  
(Unit: mm)  
LEAD PLATING SPECIFICATIONS  
ITEM  
SPEC.  
LEAD MATERIAL  
COPPER ALLOY  
Sn-Bi Bi:1-4wt%  
5-18µm  
SOLDER COMPOSITION  
PLATING THICKNESS  
Sony Corporation  
- 7 -  

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