CXP83120A [SONY]

CMOS 8-bit Single Chip Microcomputer; CMOS 8位单片机
CXP83120A
型号: CXP83120A
厂家: SONY CORPORATION    SONY CORPORATION
描述:

CMOS 8-bit Single Chip Microcomputer
CMOS 8位单片机

微控制器和处理器 外围集成电路 ISM频段 时钟
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CXP83120A/83124A  
CMOS 8-bit Single Chip Microcomputer  
Description  
100 pin QFP (Plastic)  
100 pin LQFP (Plastic)  
The CXP83120A/83124A is a CMOS 8-bit single  
chip microcomputer integrating on a single chip an  
A/D converter, serial interface, timer/counter, time  
base timer, 32kHz timer/counter, capture timer  
counter, LCD controller/driver, remote control  
reception circuit and 14-bit PWM output besides the  
basic configurations of 8-bit CPU, ROM, RAM, and  
I/O port.  
The CXP83120A/83124A also provides a sleep/stop  
function that enables lower power consumption.  
Features  
Wide-range instruction system (213 instructions) to cover various types of data.  
— 16-bit arithmetic/multiplication and division/boolean bit operation instructions  
Minimum instruction cycle  
Incorporated ROM capacity  
400ns at 10MHz operation  
8µs at 500kHz  
122µs at 32kHz operation  
20Kbytes (CXP83120A)  
24Kbytes (CXP83124A)  
644bytes (includes LCD display data area)  
Incorporated RAM capacity  
Peripheral functions  
— A/D converter  
8-bit, 8-channel, successive approximation method  
(Conversion time of 32µs/10MHz)  
— Serial interface  
8-bit, 8-stage FIFO incorporated  
(Auto transfer for 1 to 8 bytes), 1 channel  
8-bit clock synchronized type, 1 channel  
8-bit timer, 8-bit timer/counter, 19-bit time base timer,  
16-bit capture timer/counter, 32kHz timer/counter  
Maximum 160 segment display possible (during 1/4 duty)  
4 common output, 40 segment output  
Display method static, 1/2, 1/3, 1/4 duty  
Bias method 1/2, 1/3 bias  
— Timer  
— LCD controller/driver  
— Remote control reception circuit  
— PWM output circuit  
Interruption  
8-bit pulse measuring counter, 6-stage FIFO  
14 bits, 1 channel  
15 factors, 15 vectors, multi-interruption possible  
SLEEP/STOP  
Standby mode  
Package  
100-pin plastic QFP/LQFP  
Piggyback/evaluation chip  
CXP83200A 100-pin ceramic QFP/LQFP  
Structure  
Silicon gate CMOS IC  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E94843-PK  
CXP83120A/83124A  
A T R P O B T R P O C T R P O D T R P O E T R P O F T R P O G T R P O H T R P O  
S S V  
D D V  
R S  
T
1 A L X T  
1 A L E X T  
2 A L X T  
2 A L E X T  
T X  
X T E  
3 T I / I N M N  
2 T I N  
1 T I N  
0 T I N  
R E L L R O N T C T O  
R E R T U N P I  
F
R E A V  
S S A V  
– 2 –  
CXP83120A/83124A  
Pin Assignment (Top View) (QFP package)  
99 98  
96 95 94 93 92 91  
90 89 88 87 86 85 84 83 82 81  
100  
97  
1
2
PE3/INT2  
PE3/INT3/NMI  
PE4/RMC  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
SEG26/PF2  
SEG25/PF1  
SEG24/PF0  
SEG23/PD7  
SEG22/PD6  
SEG21/PD5  
SEG20/PD4  
SEG19/PD3  
SEG18/PD2  
SEG17/PD1  
SEG16/PD0  
SEG15  
3
4
PE5/PWM  
PE6/TO/ADJ  
PB0/CINT  
5
6
7
PB1/CS0  
PB2/SCK0  
PB3/SI0  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
PB4/SO0  
PB5/SCK1  
PB6/SI1  
PB7/SO1  
PC0  
SEG14  
SEG13  
PC1  
SEG12  
PC2  
SEG11  
PC3  
SEG10  
PC4  
SEG9  
PC5  
SEG8  
PC6  
SEG7  
PC7  
SEG6  
PH0  
SEG5  
PH1  
SEG4  
PH2  
SEG3  
PH3  
SEG2  
PH4  
SEG1  
PH5  
SEG0  
PH6  
COM3  
PH7  
COM2  
PA0/AN0  
COM1  
31  
32 33  
34  
35  
36 37 38 39 40 41 42  
43 44 45 46  
47  
48 49 50  
Note) 1. NC (Pin 90) is always connected to VDD.  
2. VSS (Pin 41 and 91) are both connected to GND.  
– 3 –  
CXP83120A/83124A  
Pin Assignment (Top View) (LQFP package)  
99 98  
96 95 94 93 92 91  
90 89 88 87 86 85 84 83 82 81 80 79  
100  
97  
78 77 76  
SEG23/PD7  
SEG22/PD6  
SEG21/PD5  
SEG20/PD4  
SEG19/PD3  
SEG18/PD2  
SEG17/PD1  
SEG16/PD0  
SEG15  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
1
2
PE4/RMC  
PE5/PWM  
3
PE6/TO/ADJ  
PB0/CINT  
PB1/CS0  
4
5
6
PB2/SCK0  
7
PB3/SI0  
PB4/SO0  
8
9
PB5/SCK1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
SEG14  
PB6/SI1  
PB7/SO1  
SEG13  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
SEG12  
SEG11  
SEG10  
SEG9  
SEG8  
SEG7  
PC6  
PC7  
PH0  
PH1  
PH2  
PH3  
PH4  
PH5  
SEG6  
SEG5  
SEG4  
SEG3  
SEG2  
SEG1  
SEG0  
COM3  
26 27 28 29 30  
31  
32 33  
34  
35  
36 37  
38 39 40  
41  
42  
43 44 45 46  
47  
48 49 50  
Note) 1. NC (Pin 88) is always connected to VDD.  
2. VSS (Pin 39 and 89) are both connected to GND.  
– 4 –  
CXP83120A/83124A  
Pin Description  
Symbol  
I/O  
Functions  
(Port A)  
8-bit I/O port. I/O can  
be set in a single bit  
unit.  
Incorporation of pull-up  
resistor can be set  
through the software in  
a unit of 4 bits. (8 pins)  
PA0/AN0  
to  
PA7/AN7  
Analog inputs to A/D converter.  
(8 pins)  
I/O/Analog input  
I/O/Input  
I/O/Input  
I/O/I/O  
External capture input to 16-bit timer/counter.  
Chip select input for serial interface (CH0).  
Serial clock I/O (CH0).  
PB0/CINT  
PB1/CS0  
PB2/SCK0  
PB3/SI0  
(Port B)  
8-bit I/O port. I/O can  
be set in a single bit  
unit.  
Incorporation of pull-up  
resistor can be set  
through the software in  
a unit of 4 bits.  
(8 pins)  
I/O/Input  
I/O/Output  
I/O/I/O  
Serial data input (CH0).  
Serial data output (CH0).  
PB4/SO0  
PB5/SCK1  
PB6/SI1  
Serial clock I/O (CH1).  
I/O/input  
I/O/Output  
Serial data input (CH1).  
Serial data output (CH1).  
PB7/SO1  
(Port C)  
8-bit I/O port. I/O can be set in a single bit unit. Capable of driving 12mA  
sync current. Incorporation of pull-up resistor can be set through the  
software in a unit of 4 bits.  
I/O  
PC0 to PC7  
(8 pins)  
PE0/INT0/  
EC0  
Input/Input/Input  
External event inputs for  
timer/counter.  
(2 pins)  
PE1/INT1/  
EC1  
Input/Input/Input  
Input/Input  
External interruption request inputs.  
(Port E)  
PE2/INT2  
(4 pins)  
7-bit port. lower 5 bits  
are for inputs; upper 2  
bits are for outputs.  
(7 pins)  
Non-maskable interruption request  
input.  
PE3/INT3/  
NMI  
Input/Input/Input  
Remote control reception circuit input.  
14-bit PWM output.  
Input/Input  
PE4/RMC  
PE5/PWM  
Output/Output  
Rectangular wave output  
for 16-bit timer/counter  
(duty output 50%).  
Output for 32kHz  
oscillation  
frequency division.  
Output/Output/  
Output  
PE6/TO/  
ADJ  
(Port H)  
8-bit I/O port. I/O can be set in a single bit unit. Incorporation of pull-up  
resistor can be set through the software in a unit of 4 bits.  
(8 pins)  
I/O  
PH0 to PH7  
– 5 –  
CXP83120A/83124A  
Symbol  
I/O  
Functions  
PD0/SEG16  
to  
PD7/SEG23  
(Port D)  
8-bit output port.  
(8 pins)  
Output/Output  
PF0/SEG24  
to  
PF7/SEG31  
(Port F)  
8-bit output port.  
(8 pins)  
LCD segment signal output.  
Output/Output  
Output/Output  
PG0/SEG32  
to  
PG7/SEG39  
(port G)  
8-bit output port.  
(8 pins)  
SEG0 to SEG15 Output  
COM0 to COM3 Output  
VLC1 to VLC3  
LCD segment signal output.  
LCD common signal output.  
LCD bias power supply.  
Control pin to cut off the current flowing to external LCD bias resistor  
during standby.  
VL  
Output  
Input  
Crystal connectors for system clock oscillation. When the clock is supplied  
externally, input to EXTAL1; opposite phase clock should be input to XTAL1.  
System clock oscillation of EXTAL1 and XTAL1 is used for normal operation  
mode (Max. 10MHz).  
EXTAL1  
XTAL1  
EXTAL2  
XTAL2  
Crystal connectors for system clock oscillation. When the clock is supplied  
externally, input to EXTAL2; opposite phase clock should be input to XTAL2.  
System clock oscillation of EXTAL2 and XTAL2 is used for sub clock mode  
(Typ. 500kHz).  
Input  
Input  
Crystal connectors for 32kHz timer/counter clock generation circuit.  
Connect a 32.768kHz crystal oscillator between TEX and TX. For usage  
as event input, connect clock oscillation source to TEX, and leave TX  
open.  
TEX  
TX  
Output  
Input  
RST  
NC  
Low-level active system reset.  
NC. Under normal operating conditions, connect to VDD.  
Reference voltage input for A/D converter.  
A/D converter GND.  
AVREF  
AVSS  
VDD  
Input  
Positive power supply.  
VSS  
GND. Two VSS are connected to GND.  
– 6 –  
CXP83120A/83124A  
I/O Circuit Format for Pins  
Pin  
When reset  
Circuit format  
Port A  
Pull-up resistor  
"0" when reset  
Port A data  
PA0/AN0  
to  
PA7/AN7  
Port A direction  
"0" when reset  
IP Input protection  
circuit  
Hi-Z  
Data bus  
RD (Port A)  
Port A input selection  
"0" when reset  
Input multiplexer  
A/D converter  
Pull-up transistors  
approx. 100kΩ  
8 pins  
Port B  
Pull-up resistor  
"0" when reset  
Port B data  
PB0/CINT  
PB1/CS0  
PB3/SI0  
PB6/SI1  
Port B direction  
"0" when reset  
IP  
Hi-Z  
Schmitt input  
Data bus  
RD (Port B)  
CINT  
CS0  
SI0  
SI1  
Pull-up transistors  
approx. 100kΩ  
4 pins  
Port B  
Pull-up resistor  
"0" when reset  
SCK OUT  
Output enable  
Port B output selection  
"0" when reset  
Port B data  
PB2/SCK0  
PB5/SCK1  
Hi-Z  
IP  
Port B direction  
"0" when reset  
Data  
bus  
Schmitt input  
RD (Port B)  
Pull-up transistors  
approx. 100kΩ  
SCK in  
2 pins  
– 7 –  
CXP83120A/83124A  
Pin  
When reset  
Circuit format  
Port B  
Pull-up resistor  
"0" when reset  
SO  
Output enable  
Port B output selection  
"0" when reset  
Port B data  
PB4/SO0  
PB7/SO1  
Hi-Z  
IP  
Port B direction  
"0" when reset  
Data  
bus  
RD (Port B)  
Pull-up transistors  
approx. 100kΩ  
2 pins  
Port C  
2
Pull-up resistor  
"0" when reset  
Port C data  
PC0 to PC7  
1
Port C direction  
"0" when reset  
IP  
Hi-Z  
Data bus  
RD (Port C)  
1
2
High current drive  
of 12mA possible  
Pull-up transistors  
approx. 100kΩ  
8 pins  
Port E  
PE0/INT0/EC0  
PE1/INT1/EC1  
PE2/INT2  
PE3/INT3/NMI  
PE4/RMC  
INT0/EC0  
INT1/EC1  
INT2  
INT3/NMI  
RMC  
Schmitt input  
IP  
Hi-Z  
Data bus  
RD (Port E)  
5 pins  
– 8 –  
CXP83120A/83124A  
P in  
When reset  
Circuit format  
Port E  
PWM  
Port E output selection  
"0" when reset  
Reset E data  
PE5/PWM  
High level  
"1" when reset  
Data bus  
RD (Port E)  
1 pin  
Port E  
1
Internal reset signal  
Port E data  
"1" when reset  
TO  
MPX  
High level  
2
ADJ16K  
PE6/TO/ADJ  
(High level  
with 150k  
resistor when  
reset)  
ADJ2K  
Port E output selection  
Port E output selection  
1
"00" when reset  
Pull-up transistors approx. 150k.  
2
ADJ signals are frequency divider outputs  
for 32kHz oscillation frequency adjustment.  
ADJ2K provides usage as buzzer output.  
TO Output enable  
1 pin  
Port H  
Pull-up resistor  
"0" when reset  
Port H data  
PH0 to PH7  
Hi-Z  
Port H direction  
"0" when reset  
IP  
Data bus  
RD (Port H)  
Pull-up transistors approx. 100kΩ  
8 pins  
– 9 –  
CXP83120A/83124A  
Pin  
When reset  
Circuit format  
Port D  
Port F  
Port G  
Port data  
PD0 to PD7  
PF0 to PF7  
PG0 to PG7  
by a single bit unit  
by 4-bit unit  
PD7 to PD4  
Segment  
output  
(VDD level)  
Port/segment output  
selection  
PD3 to PD0  
PF7 to PF0  
PG7 to PG0  
by 8-bit unit  
"0" when reset  
Segment  
driver  
Segment data  
24 pins  
Segment  
VCH  
VCL  
SEG0 to  
SEG15  
VDD level  
16 pins  
Common  
VDD  
VLC1  
VLC2  
VLC3  
COM0 to  
COM3  
VDD level  
4 pins  
VL  
LCD control  
(DSP bit)  
Hi-Z  
"0" when reset  
1 pin  
– 10 –  
CXP83120A/83124A  
Pin  
When reset  
Circuit format  
Diagram shows circuit  
composition during  
oscillation.  
EXTAL1  
XTAL1  
EXTAL1  
XTAL1  
IP  
IP  
Oscillation  
Feedback resistor is  
removed during stop.  
XTAL1 becomes "High"  
level.  
2 pins  
Diagram shows circuit  
composition during  
oscillation.  
EXTAL2  
Hi-Z  
EXTAL2  
XTAL2  
IP  
EXTAL2  
XTAL2  
IP  
Feedback resistor is  
removed during stop.  
XTAL2 becomes "High"  
level.  
XTAL2  
High level  
2 pins  
Diagram shows circuit  
composition during  
oscillation.  
TEX  
TX  
TEX  
TX  
IP  
IP  
Oscillation  
When the operation of the oscillation  
circuit is stopped by the software, the  
feedback resistor is removed and TEX  
and TX become "Low" level and "High"  
level respectively.  
2 pins  
Pull-up resistor  
RST  
1 pin  
Low level  
Mask option  
IP  
OP  
Schmitt input  
– 11 –  
CXP83120A/83124A  
Absolute Maximum Ratings  
(Vss = 0V)  
Item  
Symbol  
Rating  
–0.3 to +7.0  
–0.3 to +0.3  
–0.3 to +7.0  
–0.3 to +7.0  
–0.3 to +7.0  
–5  
Unit  
V
Remarks  
VDD  
AVSS  
Supply voltage  
V
1
1
1
LCD bias voltage  
Input voltage  
VLC1, VLC2, VLC3  
V
VIN  
V
Output voltage  
VOUT  
IOH  
V
High level output current  
Output per pin  
mA  
mA  
mA  
mA  
mA  
°C  
°C  
High level total output current IOH  
–50  
Total for all output pins  
IOL  
Low level output current  
IOLC  
15  
Value per pin, excluding high current outputs  
Value per pin 2 for high current outputs  
Total for all output pins  
20  
Low level total output current IOL  
100  
Operating temperature  
Storage temperature  
Topr  
Tstg  
–20 to +75  
–55 to +150  
600  
QFP package  
LQFP package  
Allowable power dissipation PD  
mW  
380  
1
VIN and VOUT must not exceed VDD + 0.3V.  
2
The high current drive transistor is the N-ch transistor of Port C (PC)  
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should  
be conducted under the recommended operating conditions. Exceeding these conditions may adversely  
affect the reliability of the LSI.  
– 12 –  
CXP83120A/83124A  
Recommended Operating Conditions  
(Vss = 0V)  
Item  
Symbol  
Min.  
4.5  
Max.  
5.5  
Unit  
V
Remarks  
1
High-speed mode guaranteed operation range  
Low-speed mode guaranteed operation range  
1
3.5  
5.5  
Guaranteed operation range during  
EXTAL2 clock (sub clock mode)  
Supply voltage  
VDD  
3.0  
5.5  
2.7  
2.5  
5.5  
5.5  
Guaranteed operation range with TEX clock  
Guaranteed data hold range during STOP  
VLC1  
VLC2  
VLC3  
VIH  
5
V
LCD power supply range  
LCD bias voltage  
VDD  
Vss  
2
V
V
0.7VDD  
0.8VDD  
VDD  
VDD  
High level  
input voltage  
3
VIHS  
VIHEX  
VIL  
Hysteresis input  
4
V
EXTAL  
VDD – 0.4 VDD + 0.3  
2
V
0
0
0.3VDD  
0.2VDD  
0.4  
Low level  
input voltage  
3
VILS  
VILEX  
Topr  
V
Hysteresis input  
4
V
EXTAL  
–0.3  
–20  
°C  
Operating temperature  
+75  
1
During EXTAL1 clock (main clock mode), high-speed mode is 1/2 frequency division clock selection; low-  
speed mode is 1/16 frequency division clock selection.  
2
3
Value for each pin of normal input ports (PA, PB4, PB7, PC and PH).  
Value of the following pins; RST, CINT CS0, SI0, SI1, SCK0, SCK1, EC0/INT0, EC1/INT1, INT2, NMI/INT3,  
and RMC.  
4
5
Specifies only during external clock input.  
Optimal values are determined by LCD used.  
– 13 –  
CXP83120A/83124A  
Electrical Characteristics  
DC Characteristics  
(Ta = –20 to +75°C, Vss = 0V)  
Item  
Symbol  
Pins  
Conditions  
VDD = 4.5V, IOH = –0.5mA  
VDD = 4.5V, IOH = –1.2mA  
VDD = 4.5V, IOL = 1.8mA  
VDD = 4.5V, IOL = 3.6mA  
VDD = 4.5V, IOL = 12.0mA  
VDD = 5.5V, VIH = 5.5V  
VDD = 5.5V, VIL = 0.4V  
VDD = 5.5V, VIH = 5.5V  
VDD = 5.5V, VIL = 0.4V  
VDD = 5.5V, VIH = 5.5V  
VDD = 5.5V, VIL = 0.4V  
VDD = 5.5V, VIL = 0.4V  
VDD = 4.5V, VIH = 4.0V  
VDD = 5.5V, VIL = 0.4V  
Min.  
4.0  
Typ.  
Max.  
Unit  
V
High level  
output voltage  
PA, PB, PC,  
VOH  
1
PD , PE5,  
3.5  
V
PE6  
PF to PG  
VL (only VOL)  
PC  
0.4  
0.6  
1.5  
40  
1
V
Low level  
output voltage  
VOL  
V
V
0.5  
–0.5  
0.3  
IIHE1  
IILE1  
IIHE2  
IILE2  
IIHT  
IILT  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
EXTAL1  
EXTAL2  
TEX  
–40  
30  
–0.3  
0.1  
–30  
10  
Input current  
–0.1  
–1.5  
–3.33  
–10  
–400  
2
IILR  
IIH  
RST  
3
PA to PC ,  
3
IIL  
–50  
±10  
PH  
PE0 to PE4,  
VDD = 5.5V,  
VI = 0, 5.5V  
I/O leakage  
current  
2
IIZ  
µA  
RST  
Common  
output  
impedance  
COM0 to  
COM3  
3
5
5
RCOM  
kΩ  
VDD = 5V,  
VLC1 = 3.75V  
VLC2 = 2.5V  
VLC3 = 1.25  
SEG0 to  
SEG15  
SEG16 to  
Segment  
output  
impedance  
15  
kΩ  
RSEG  
IDD1  
1
SEG39  
High-speed mode operation  
(1/2 frequency division clock)  
18  
40  
mA  
VDD = 5.5V, 10MHz crystal oscillation  
(C1 = C2 = 15pF)  
VDD = 3.5V, 500kHz crystal oscillation  
(C1 = C2 = 22pF)  
0.8  
35  
2
mA  
µA  
IDD2  
IDD3  
VDD = 3V, 32kHz crystal oscillation  
(C1 = C2 = 47pF)  
100  
SLEEP mode  
Supply  
current  
VDD  
1.1  
8
mA  
IDDS1  
4
VDD = 5.5V, 10MHz crystal oscillation  
(C1 = C2 = 15pF)  
VDD = 3.5V, 500kHz crystal oscillation  
(C1 = C2 = 22pF)  
400  
9
800  
30  
µA  
µA  
IDDS2  
VDD = 3V, 32kHz crystal oscillation  
(C1 = C2 = 47pF)  
IDDS3  
STOP mode  
VDD = 5.5V, 10MHz, 500kHz crystal  
oscillation and termination of 32kHz  
oscillation  
10  
µA  
IDDSS  
– 14 –  
CXP83120A/83124A  
Item  
Symbol  
Pins  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Pins other than  
PB7, PE5, PE6  
VLC1 to VLC3  
COM0 to COM3  
SEG0 to SEG15  
PD0/SEG16 to  
Clock 1MHz  
Input capacity  
CIN  
PD7/SEG23 0V for all pins excluding  
10  
20  
pF  
PF0/SEG24 to  
PF7/SEG31  
PG0/SEG32 to  
PG7/SEG39  
AVREF, AVSS,  
VDD, VSS  
measured pins  
1
Common pins of PD0/SEG16 to PD7/SEG23, PF0/SEG24 to PF7/SEG31, PG0/SEG32 to PG7/SEG39,  
PD, PF and PG is the case when the common pin is selected as port; SEG16 to SEG39 is when the  
common pin is selected as segment output.  
2
3
4
RST specifies the input current when pull-up resitor has been selected; leakage current when no resistor  
has been selected.  
Pins PA to PC, and PH specifies the input current when pull-up resistor has been selected; leakage current  
when no resistor has been selected. (PE0 to PE4 specifies the leakage current.)  
When all output pins are left open.  
– 15 –  
CXP83120A/83124A  
AC Characteristics  
(1) Clock timing  
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)  
Item  
Symbol  
Conditions  
Min.  
1
Typ.  
Max.  
10  
Unit  
Pin  
XTAL1  
EXTAL1  
System clock frequency  
Fig. 1, Fig. 2  
MHz  
fC  
System clock input  
pulse width  
Fig. 1, Fig. 2  
external clock drive  
t
XL,  
XH  
ns  
ns  
37.5  
EXTAL1  
EXTAL1  
t
System clock input rise and  
fall time  
Fig. 1, Fig. 2  
external clock drive  
t
CR,  
CF  
200  
0.7  
t
VDD = 3.0 to 5.5V  
Fig. 1, Fig. 2  
XTAL2  
EXTAL2  
System clock frequency  
MHz  
0.3  
0.5  
fC  
VDD = 3.0 to 5.5V  
Fig. 1, Fig. 2  
external clock drive  
t
XL,  
System clock input pulse width  
ns  
ns  
450  
EXTAL2  
EXTAL2  
tXH  
VDD = 3.0 to 5.5V  
Fig. 1, Fig. 2  
external clock drive  
System clock input rise and  
fall time  
t
CR,  
CF  
200  
20  
t
Event count input clock pulse  
width  
t
EH,  
EL  
EC0  
EC1  
Fig. 3  
Fig. 3  
ns  
tsys +50  
t
Event count input clock rise  
and fall time  
t
ER,  
EF  
EC0  
EC1  
ms  
t
VDD = 2.7 to 5.5V  
Fig. 2 (32kHz clock  
applied condition)  
TEX  
TX  
System clock frequency  
kHz  
32.768  
fC  
Event count input clock input  
pulse width  
t
TL,  
Fig. 3  
Fig. 3  
µs  
10  
TEX  
TEX  
tTH  
Event count input clock rise  
and fall time  
tTR,  
TF  
ms  
20  
t
tsys indicates the three values below according to the upper two bits (CPU clock selection) of the clock  
control register (address: 00FEH).  
tsys (ns) = 2000/fc (upper two bits = "00"), 4000/fc (upper two bits = "01"), 16000/fc (upper two bits = "11").  
Fig. 1. Clock timing  
1/fc  
VDD – 0.4V  
0.4V  
EXTAL1  
EXTAL2  
tXH  
tCF  
tXL  
tCR  
Fig. 2. Clock applied conditions  
Crystal oscillation  
Ceramic oscillation  
32kHz clock applied condition  
Crystal oscillation  
External clock  
EXTAL  
XTAL  
EXTAL  
XTAL  
TEX  
TX  
C1  
C2  
74HC04  
C1  
C2  
– 16 –  
CXP83120A/83124A  
Fig. 3. Event count clock timing  
0.8VDD  
0.2VDD  
TEX  
EC0  
EC1  
tEH  
tTH  
tEF  
tTF  
tEL  
tTL  
tER  
tTR  
(2) Serial transfer (CH0)  
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)  
Item  
CS0 ↓ → SCK0  
Symbol  
Pin  
Conditions  
Min.  
Max.  
Unit  
ns  
Chip select transfer mode  
(SCK0 = output mode)  
tsys + 200  
tDCSK  
tDCSKF  
t
DCSO  
SCK0  
delay time  
CS0 ↑ → SCK0  
float delay time  
Chip select transfer mode  
(SCK0 = output mode)  
tsys + 200  
tsys + 200  
tsys + 200  
ns  
ns  
ns  
SCK0  
SO0  
CS0 ↓ → SO0  
delay time  
Chip select transfer mode  
Chip select transfer mode  
CS0 ↑ → SO0  
float delay time  
t
DCSOF  
WHCS  
SO0  
CS0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
tsys + 200  
2tsys + 200  
16000/fc  
tsys + 100  
8000/fc – 50  
100  
CS0 high level width  
Chip select transfer mode  
Input mode  
tKCY  
SCK0  
SCK0  
SI0  
SCK0 cycle time  
Output mode  
Input mode  
t
KH  
KL  
SCK0 high and low level  
widths  
t
Output mode  
SCK0 input mode  
SCK0 output mode  
SCK0 input mode  
SCK0 output mode  
SCK0 input mode  
SCK0 output mode  
SI0 input setup time  
(for SCK0 )  
t
t
t
SIK  
200  
tsys + 200  
100  
SI0 input hold time  
(for SCK0 )  
KSI  
SI0  
tsys + 200  
100  
SCK0 ↓ → SO0  
delay time  
KSO  
SO0  
Note 1) tsys indicates the three values below according to the upper two bits (CPU clock selection) of the  
clock control register (address: 00FEH).  
tsys ( ns) = 2000/fc (upper two bits = "00"), 4000/fc (upper two bits = "01"), 16000/fc (upper two bits = "11")  
Note 2) The load condition for the SCK0 output mode, SO0 output delay time is 50pF + 1TTL.  
– 17 –  
CXP83120A/83124A  
Fig. 4. Serial transfer CH0 timing  
tWHCS  
CS0  
0.8VDD  
0.2VDD  
tKCY  
tDCSK  
tDCSKF  
tKL  
tKH  
0.8VDD  
0.8VDD  
0.2VDD  
SCK0  
tSIK  
tKSI  
0.8VDD  
0.2VDD  
SI0  
Input data  
tDCSO  
tKSO  
tDCSOF  
0.8VDD  
SO0  
Output data  
0.2VDD  
– 18 –  
CXP83120A/83124A  
Serial Transfer (CH1)  
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)  
Item  
Symbol  
Pin  
Conditions  
Input mode  
Min.  
1000  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
SCK1 cycle time  
SCK1  
tKCY  
Output mode  
16000/fc  
400  
input mode  
SCK1 high and low level  
widths  
t
KH  
KL  
SCK1  
SI1  
t
Output mode  
8000/fc – 50  
100  
SCK1 input mode  
SCK1 output mode  
SCK1 input mode  
SCK1 output mode  
SCK1 input mode  
SCK1 output mode  
SI1 input setup time  
(for SCK1 )  
t
t
t
SIK  
200  
200  
SI1 input hold time  
(for SCK1 )  
SI1  
KSI  
100  
200  
100  
SCK1 ↓ → SO1 delay time  
SO1  
KSO  
Note) The load condition for the SCK1 output mode, SO1 output delay time is 50pF + 1TTL.  
Fig. 5. Serial transfer CH1 timing  
tKCY  
tKL  
tKH  
0.8VDD  
0.2VDD  
SCK1  
tSIK  
tKSI  
0.8VDD  
0.2VDD  
SI1  
Input data  
tKSO  
0.8VDD  
SO1  
Output data  
0.2VDD  
– 19 –  
CXP83120A/83124A  
(3) A/D converter characteristics  
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = AVSS = 0V)  
Item  
Resolution  
Symbol  
Pin  
Conditions  
Min.  
Typ.  
Max.  
8
Unit  
Bits  
LSB  
Linearity error  
±3  
70  
Ta = 25°C  
VDD = AVREF = 5.0V  
VSS = AVSS = 0V  
Zero transition  
voltage  
1
VZT  
–10  
10  
mV  
mV  
Full-scale transition  
voltage  
2
VFT  
4910  
4970  
5030  
3
160/fADC  
12/fADC  
µs  
µs  
V
Conversion time  
Sampling time  
t
CONV  
SAMP  
3
t
VDD – 0.5  
0
Reference input voltage  
Analog input voltage  
VREF  
VIAN  
IREF  
AVREF  
VDD  
AVREF  
1.0  
AN0 to AN7  
V
0.6  
mA  
Operation mode  
SLEEP mode  
STOP mode  
AVREF current  
AVREF  
IREFS  
10  
µA  
32kHz operation mode  
Fig. 6. Definition of A/D converter terms  
FFH  
FEH  
1
VZT: Value at which the digital conversion value changes  
from 00H to 01H and vice versa.  
2
3
VFT: Value at which the digital conversion value changes  
from FEH to FFH and vice versa.  
fADC indicates the below values due to the Bit 6 (CKS) of  
A/D control register (address: 00F9H )and the Bit 7 (PCK1)  
and Bit 6 (PCK0) of clock control register (address: 00FFH).  
Linearity error  
01H  
00H  
CKS  
VZT  
VFT  
0 (φ/2 selection)  
1 (φ selection)  
Analog input  
PCK1, PCK0  
fADC = fC/2  
fADC = fC/4  
fADC = fC/16  
00 (φ = fEX/2)  
fADC = fC  
01 (φ = fEX/4)  
11 (φ = fEX/16)  
fADC = fC/2  
fADC = fC/8  
– 20 –  
CXP83120A/83124A  
(4) Interruption, reset input  
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)  
Item  
Symbol  
Pin  
INT0  
INT1  
INT2  
Conditions Min.  
Max.  
Unit  
External interruption  
high and low level widths  
t
IH  
1
µs  
t
IL  
NMI/INT3  
µs  
Reset input low level width  
RST  
32/fc  
tRSL  
Fig. 7. Interruption input timing  
tIH  
tIL  
0.8VDD  
INT0  
0.2VDD  
INT1  
INT2  
tIL  
tIH  
NMI / INT3  
(NMI specifies only  
for the falling edge)  
Fig. 8. RST input timing  
tRSL  
RST  
0.2VDD  
– 21 –  
CXP83120A/83124A  
Appendix  
Fig. 9. SPC700 series recommended oscillation circuit  
(iii) 32kHz sub clock  
(i) Main clock  
(ii) Main clock  
500kHz sub clock  
500kHz sub clock  
EXTAL  
XTAL  
Rd  
EXTAL  
XTAL  
Rd  
TEX
TX
Rd  
C1  
C2  
C1  
C2  
C1 C2  
Circuit  
example  
Manufacturer  
Model  
fc (MHz)  
C1 (pF)  
C2 (pF)  
Rd ()  
CSA4.19MG  
CSA8.00MG  
CSA10.0MT  
4.19  
8.00  
(i)  
10.00  
MURATA MFG  
CO., LTD.  
30  
30  
0
CST4.19MGW  
CST8.00MTW  
CST10.00MTW  
4.19  
8.00  
(ii)  
(i)  
10.00  
4.19  
RIVER  
ELETEC  
CO., LTD.  
2.2k  
HC-49/U03  
15  
15  
8.00  
470  
560  
10.00  
4.19  
22  
18  
22  
18  
HC-49/U (-S)  
8.00  
KINSEKI LTD.  
0
10.00  
Those marked with an asterisk ( ) signify types with built-in ground capacitance (C1, C2).  
Mask Option Table  
Item  
Content  
Reset pin pull-up resistor  
Non-existent  
Existent  
– 22 –  
CXP83120A/83124A  
Characteristics Curves  
IDD vs. fc  
(VDD = 5V, Ta = 25°C, typical)  
IDD vs. VDD  
(fc = 10MHz main clock, Ta = 25°C, typical)  
1/2 frequency dividing  
mode  
20.0  
10.0  
5.0  
20  
15  
10  
5
Main clock  
1/2 frequency  
dividing mode  
fc = 500kHz sub clock  
1/2 frequency dividing mode  
fc = 10MHz main clock  
SLEEP mode  
1.0  
0.5  
fc = 500kHz sub clock  
SLEEP mode  
32kHz mode  
(Instruction)  
0.1  
(100µA)  
0.05  
(50µA)  
32kHz  
SLEEP mode  
Main clock  
SLEEP mode  
0.01  
(10µA)  
2
3
4
5
6
7
0
5
10  
15  
VDD – Supply voltage [ V ]  
fc – System clock [MHz]  
– 23 –  
CXP83120A/83124A  
Package Outline  
Unit: mm  
100PIN QFP (PLASTIC)  
+ 0.1  
0.15 – 0.05  
23.9 ± 0.4  
+ 0.4  
20.0 – 0.1  
A
0.65  
+ 0.35  
2.75 – 0.15  
±0.12  
M
0.15  
0° to 15°  
DETAIL  
A
PACKAGE STRUCTURE  
PACKAGE MATERIAL  
LEAD TREATMENT  
EPOXY RESIN  
SOLDER PLATING  
QFP-100P-L01  
SONY CODE  
EIAJ CODE  
QFP100-P-1420-A  
LEAD MATERIAL  
COPPER / 42 ALLOY  
1.4g  
PACKAGE WEIGHT  
JEDEC CODE  
100PIN LQFP (PLASTIC)  
16.0 ± 0.2  
14.0 ± 0.1  
75  
51  
76  
50  
A
26  
100  
(0.22)  
1
25  
+ 0.08  
0.18 – 0.03  
+ 0.05  
0.127 – 0.02  
0.5 ± 0.08  
+ 0.2  
1.5 – 0.1  
0.1  
0.1 ± 0.1  
NOTE: Dimension “ ” does not include mold protrusion.  
0° to 10°  
DETAIL A  
PACKAGE STRUCTURE  
PACKAGE MATERIAL  
EPOXY/PHENOL RESIN  
SOLDER PLATING  
LQFP-100P-L01  
LEAD TREATMENT  
LEAD MATERIAL  
SONY CODE  
EIAJ CODE  
QFP100-P-1414-A  
42 ALLOY  
JEDEC CODE  
PACKAGE WEIGHT  
– 24 –  

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