AM27C010-45DC5 [SPANSION]

UVPROM, 128KX8, 45ns, CMOS, CDIP32, CERAMIC, DIP-32;
AM27C010-45DC5
型号: AM27C010-45DC5
厂家: SPANSION    SPANSION
描述:

UVPROM, 128KX8, 45ns, CMOS, CDIP32, CERAMIC, DIP-32

可编程只读存储器 电动程控只读存储器 CD 内存集成电路
文件: 总12页 (文件大小:178K)
中文:  中文翻译
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FINAL  
Am27C010  
1 Megabit (128 K x 8-Bit) CMOS EPROM  
DISTINCTIVE CHARACTERISTICS  
Fast access time  
100% Flashrite™ programming  
— Speed options as fast as 45 ns  
Low power consumption  
Typical programming time of 16 seconds  
Latch-up protected to 100 mA from –1 V to  
V
+ 1 V  
CC  
— 20 µA typical CMOS standby current  
JEDEC-approved pinout  
High noise immunity  
Versatile features for simple interfacing  
— Both CMOS and TTL input/output compatibility  
Two line control functions  
Single +5 V power supply  
±10% power supply tolerance standard  
Standard 32-pin DIP, PDIP, and PLCC packages  
GENERAL DESCRIPTION  
The Am27C010 is a 1 Megabit, ultraviolet erasable pro-  
grammable read-only memory. It is organized as 128K  
words by 8 bits per word, operates from a single +5 V  
supply, has a static standby mode, and features fast  
single address location programming. Products are  
available in windowed ceramic DIP packages, as well  
as plastic one time programmable (OTP) PDIP and  
PLCC packages.  
thus eliminating bus contention in a multiple bus micro-  
processor system.  
AMD’s CMOS process technology provides high  
speed, low power, and high noise immunity. Typical  
power consumption is only 100 mW in active mode,  
and 100 µW in standby mode.  
All signals are TTL levels, including programming sig-  
nals. Bit locations may be programmed singly, in  
blocks, or at random. The device supports AMD’s  
Flashrite programming algorithm (100 µs pulses), re-  
sulting in a typical programming time of 16 seconds.  
Data can be typically accessed in less than 45 ns, al-  
lowing high-performance microprocessors to operate  
without any WAIT states. The device offers separate  
Output Enable (OE#) and Chip Enable (CE#) controls,  
BLOCK DIAGRAM  
V
Data Outputs  
DQ0–DQ7  
CC  
V
V
SS  
PP  
Output Enable  
Chip Enable  
and  
OE#  
CE#  
Output  
Buffers  
Prog Logic  
PGM#  
Y
Y
Gating  
Decoder  
A0–A16  
Address  
Inputs  
1,048,576  
Bit Cell  
Matrix  
X
Decoder  
10205J-1  
Publication# 10205 Rev: J Amendment/0  
Issue Date: July 2, 1999  
PRODUCT SELECTOR GUIDE  
Family Part Number  
Am27C010  
V
V
= 5.0 V ± 5%  
= 5.0 V ± 10%  
-45  
-45  
45  
-255  
CC  
CC  
Speed Options  
-55  
55  
55  
35  
-70  
70  
70  
35  
-90  
-120  
120  
120  
50  
-150  
150  
150  
65  
-200  
200  
200  
75  
Max Access Time (ns)  
CE# (E#) Access (ns)  
OE# (G#) Access (ns)  
90  
90  
40  
250  
250  
75  
45  
25  
CONNECTION DIAGRAMS  
Top View  
DIP  
PLCC  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
VCC  
VPP  
A16  
A15  
A12  
A7  
2
PGM# (P#)  
NC  
3
4
3 2 1 32 31 30  
4
A14  
A7  
5
6
A14  
29  
28  
5
A13  
A6  
A13  
A6  
6
A8  
A5  
A4  
7
A8  
27  
26  
25  
24  
23  
22  
21  
A5  
7
A9  
8
A9  
A4  
8
A11  
A3  
9
A11  
A3  
9
OE# (G#)  
A10  
A2  
10  
11  
12  
13  
OE# (G#)  
A10  
A2  
10  
11  
12  
13  
14  
15  
16  
A1  
A1  
CE# (E#)  
DQ7  
A0  
CE# (E#)  
DQ7  
A0  
DQ0  
DQ0  
DQ6  
16 17  
19 20  
18  
15  
14  
DQ1  
DQ2  
VSS  
DQ5  
DQ4  
DQ3  
10205J-3  
10205J-2  
Notes:  
1. JEDEC nomenclature is in parenthesis.  
2. The 32-pin DIP to 32-pin PLCC configuration varies from the JEDEC 28-pin DIP to 32-pin PLCC configuration.  
PIN DESIGNATIONS  
LOGIC SYMBOL  
A0–A16  
= Address Inputs  
CE# (E#)  
= Chip Enable Input  
17  
DQ0–DQ7 = Data Input/Outputs  
OE# (G#) = Output Enable Input  
PGM# (P#) = Program Enable Input  
8
A0–A16  
DQ0–DQ7  
CE# (E#)  
PGM# (P#)  
OE# (G#)  
V
V
V
= V Supply Voltage  
CC  
PP  
SS  
CC  
= Program Voltage Input  
= Ground  
10205J-4  
2
Am27C010  
ORDERING INFORMATION  
UV EPROM Products  
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed  
by a combination of the following:  
5
AM27C010  
-45  
D
C
B
OPTIONAL PROCESSING  
Blank = Standard Processing  
B
= Burn-In  
VOLTAGE TOLERANCE  
= V ± 5%, 45 ns only  
5
CC  
See Product Selector Guide and Valid Combinations  
TEMPERATURE RANGE  
C
I
E
= Commercial (0°C to +70°C)  
= Industrial (–40°C to +85°C)  
= Extended (–55°C to +125°C)  
PACKAGE TYPE  
= 32-Pin Ceramic DIP (CDV032)  
D
SPEED OPTION  
See Product Selector Guide and Valid Combinations  
DEVICE NUMBER/DESCRIPTION  
Am27C010  
1 Megabit (128 K x 8-Bit) CMOS UV EPROM  
Valid Combinations  
Valid Combinations list configurations planned to be sup-  
ported in volume for this device. Consult the local AMD sales  
office to confirm availability of specific valid combinations and  
to check on newly released combinations.  
Valid Combinations  
AM27C010-45  
= 5.0 V ± 5%  
DC5, DC5B, DI5, DI5B  
V
CC  
AM27C010-45  
= 5.0 V ± 10%  
V
CC  
AM27C010-55  
AM27C010-70  
AM27C010-90  
DC, DCB, DI, DIB  
AM27C010-120  
AM27C010-150  
AM27C010-200  
AM27C010-255  
DC, DCB, DI, DIB, DE, DEB  
DC, DCB, DI, DIB  
V
= 5.0 V ± 5%  
CC  
Am27C010  
3
ORDERING INFORMATION  
OTP EPROM Products  
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed  
by a combination of the following:  
5
AM27C010  
-45  
J
C
OPTIONAL PROCESSING  
Blank = Standard Processing  
VOLTAGE TOLERANCE  
5
= V ± 5%, 45 ns only  
CC  
See Product Selector Guide and Valid Combinations  
TEMPERATURE RANGE  
C
I
= Commercial (0°C to +70°C)  
= Industrial (–40°C to +85°C)  
PACKAGE TYPE  
P
J
= 32-Pin Plastic DIP (PD 032)  
= 32-Pin Plastic Leaded Chip Carrier (PL 032)  
SPEED OPTION  
See Product Selector Guide and Valid Combinations  
DEVICE NUMBER/DESCRIPTION  
Am27C010  
1 Megabit (128 K x 8-Bit) CMOS OTP EPROM  
Valid Combinations  
Valid Combinations  
AM27C010-45  
Valid Combinations list configurations planned to be sup-  
ported in volume for this device. Consult the local AMD sales  
office to confirm availability of specific valid combinations and  
to check on newly released combinations.  
PC5, PI5, JC5, JI5  
V
= 5.0 V ± 5%  
CC  
AM27C010-45  
= 5.0 V ± 10%  
JC, PC  
V
CC  
AM27C010-55  
AM27C010-70  
AM27C010-90  
AM27C010-120  
AM27C010-150  
AM27C010-200  
AM27C010-255  
JC, PC, JI, PI  
V
= 5.0 V ± 5%  
CC  
4
Am27C010  
FUNCTIONAL DESCRIPTION  
Device Erasure  
V
= 12.75 V ± 0.25 V and PGM# LOW and OE#  
PP  
HIGH will program that particular device. A high-level  
CE# input inhibits the other devices from being pro-  
grammed.  
In order to clear all locations of their programmed con-  
tents, the device must be exposed to an ultraviolet light  
source. A dosage of 15 W seconds/cm is required to  
2
completely erase the device. This dosage can be ob-  
Program Verify  
tained by exposure to an ultraviolet lamp—wavelength  
A verification should be performed on the programmed  
bits to determine that they were correctly programmed.  
The verify should be performed with OE# and CE#, at  
2
of 2537 Å—with intensity of 12,000 µW/cm for 15 to 20  
minutes. The device should be directly under and about  
one inch from the source, and all filters should be re-  
moved from the UV light source prior to erasure.  
V , PGM# at V , and V between 12.5 V and 13.0 V.  
IL  
IH  
PP  
Autoselect Mode  
Note that all UV erasable devices will erase with light  
sources having wavelengths shorter than 4000 Å, such  
as fluorescent light and sunlight. Although the erasure  
process happens over a much longer time period, ex-  
posure to any light source should be prevented for  
maximum system reliability. Simply cover the package  
window with an opaque label or substance.  
The autoselect mode provides manufacturer and de-  
vice identification through identifier codes on DQ0–  
DQ7. This mode is primarily intended for programming  
equipment to automatically match a device to be pro-  
grammed with its corresponding programming algo-  
rithm. This mode is functional in the 25°C ± 5°C  
ambient temperature range that is required when pro-  
gramming the device.  
Device Programming  
Upon delivery, or after each erasure, the device has  
all of its bits in the “ONE”, or HIGH state. “ZEROs” are  
loaded into the device through the programming pro-  
cedure.  
To activate this mode, the programming equipment  
must force V on address line A9. Two identifier bytes  
H
may then be sequenced from the device outputs by tog-  
gling address line A0 from V to V (that is, changing  
IL  
IH  
The device enters the programming mode when 12.75  
the address from 00h to 01h). All other address lines  
must be held at V during the autoselect mode.  
V ± 0.25 V is applied to the V  
pin, and CE# and  
PP  
IL  
PGM# are at V and OE# is at V .  
IL  
IH  
Byte 0 (A0 = V ) represents the manufacturer code,  
IL  
For programming, the data to be programmed is ap-  
plied 8 bits in parallel to the data pins.  
and Byte 1 (A0 = V ), the device identifier code. Both  
codes have odd parity, with DQ7 as the parity bit.  
IH  
The flowchart in the Programming section of the  
EPROM Products Data Book (Section 5, Figure 5-1)  
shows AMD’s Flashrite algorithm. The Flashrite algo-  
rithm reduces programming time by using a 100 µs pro-  
gramming pulse and by giving each address only as  
many pulses to reliably program the data. After each  
pulse is applied to a given address, the data in that ad-  
dress is verified. If the data does not verify, additional  
pulses are given until it verifies or the maximum pulses  
allowed is reached. This process is repeated while se-  
quencing through each address of the device. This part  
Read Mode  
To obtain data at the device outputs, Chip Enable (CE#)  
and Output Enable (OE#) must be driven low. CE# con-  
trols the power to the device and is typically used to se-  
lect the device. OE# enables the device to output data,  
independent of device selection. Addresses must be  
stable for at least t  
Waveforms section for the timing diagram.  
–t . Refer to the Switching  
ACC OE  
Standby Mode  
The device enters the CMOS standby mode when CE#  
of the algorithm is done at V = 6.25 V to assure that  
CC  
is at V ± 0.3 V. Maximum V current is reduced to  
CC  
CC  
each EPROM bit is programmed to a sufficiently high  
threshold voltage. After the final address is completed,  
100 µA. The device enters the TTL-standby mode  
when CE# is at V . Maximum V current is reduced  
to 1.0 mA. When in either standby mode, the device  
places its outputs in a high-impedance state, indepen-  
dent of the OE# input.  
IH  
CC  
the entire EPROM memory is verified at V  
5.25 V.  
= V  
=
CC  
PP  
Please refer to Section 5 of the EPROM Products Data  
Book for additional programming information and spec-  
ifications.  
Output OR-Tieing  
To accommodate multiple memory connections, a  
two-line control function provides:  
Program Inhibit  
Programming different data to multiple devices in par-  
allel is easily accomplished. Except for CE#, all like in-  
puts of the devices may be common. A TTL low-level  
program pulse applied to one device’s CE# input with  
Low memory power dissipation, and  
Assurance that output bus contention will not occur.  
Am27C010  
5
CE# should be decoded and used as the primary de-  
vice-selecting function, while OE# be made a common  
connection to all devices in the array and connected to  
the READ line from the system control bus. This as-  
sures that all deselected memory devices are in their  
low-power standby mode and that the output pins are  
only active when data is desired from a particular mem-  
ory device.  
ing and falling edges of Chip Enable. The magnitude of  
these transient current peaks is dependent on the out-  
put capacitance loading of the device. At a minimum, a  
0.1 µF ceramic capacitor (high frequency, low inherent  
inductance) should be used on each device between  
V
and V to minimize transient effects. In addition,  
CC  
SS  
to overcome the voltage drop caused by the inductive  
effects of the printed circuit board traces on EPROM ar-  
rays, a 4.7 µF bulk electrolytic capacitor should be used  
System Applications  
between V and V for each eight devices. The loca-  
CC  
SS  
During the switch between active and standby condi-  
tions, transient current peaks are produced on the ris-  
tion of the capacitor should be close to where the  
power supply is connected to the array.  
MODE SELECT TABLE  
Mode  
CE#  
OE#  
PGM#  
A0  
X
A9  
X
V
Outputs  
PP  
Read  
V
V
X
X
X
X
X
X
X
X
D
OUT  
IL  
IL  
Output Disable  
Standby (TTL)  
Standby (CMOS)  
Program  
X
V
X
X
High Z  
High Z  
High Z  
IH  
V
X
X
X
IH  
V
± 0.3 V  
X
X
X
CC  
V
V
V
V
X
X
V
D
IN  
IL  
IL  
IH  
IH  
IL  
PP  
PP  
PP  
Program Verify  
Program Inhibit  
V
V
X
X
V
V
D
OUT  
IL  
IH  
V
X
X
X
X
High Z  
01h  
Manufacturer Code  
Device Code  
V
V
X
X
V
V
V
X
X
IL  
IL  
IL  
IL  
IL  
H
H
Autoselect  
(Note 3)  
V
V
V
0Eh  
IH  
Notes:  
1. V = 12.0 V ± 0.5 V.  
H
2. X = Either V or V .  
IH  
IL  
3. A1–A8 and A10–16 = V  
IL  
4. See DC Programming Characteristics for V voltage during programming.  
PP  
6
Am27C010  
ABSOLUTE MAXIMUM RATINGS  
OPERATING RANGES  
Storage Temperature  
Commercial (C) Devices  
OTP Products. . . . . . . . . . . . . . . . . . –65°C to +125°C  
All Other Products . . . . . . . . . . . . . . –65°C to +150°C  
Ambient Temperature (T ) . . . . . . . . . . .0°C to +70°C  
A
Industrial (I) Devices  
Ambient Temperature  
with Power Applied. . . . . . . . . . . . . . 55°C to +125°C  
Ambient Temperature (T ) . . . . . . . . .–40°C to +85°C  
A
Extended (E) Devices  
Voltage with Respect to V  
SS  
All pins except A9, V , V  
. . –0.6 V to V + 0.6 V  
Ambient Temperature (T ) . . . . . . . .–55°C to +125°C  
PP CC  
CC  
A
A9 and V (Note 2) . . . . . . . . . . . . .0.6 V to 13.5 V  
Supply Read Voltages  
PP  
V
(Note 1). . . . . . . . . . . . . . . . . . . . .0.6 V to 7.0 V  
V
V
for ± 5% devices . . . . . . . . . . +4.75 V to +5.25 V  
for ± 10% devices . . . . . . . . . +4.50 V to +5.50 V  
CC  
CC  
CC  
Notes:  
Operating ranges define those limits between which the func-  
tionality of the device is guaranteed.  
1. Minimum DC voltage on input or I/O pins –0.5 V. During  
voltage transitions, the input may overshoot V to –2.0 V  
SS  
for periods of up to 20 ns. Maximum DC voltage on input  
and I/O pins is V + 5 V. During voltage transitions, input  
CC  
and I/O pins may overshoot to V + 2.0 V for periods up  
CC  
to 20 ns.  
2. Minimum DC input voltage on A9 is –0.5 V. During voltage  
transitions, A9 and V may overshoot V to –2.0 V for  
PP  
SS  
periods of up to 20 ns. A9 and V must not exceed +13.5  
PP  
V at any time.  
Stresses above those listed under “Absolute Maximum Rat-  
ings” may cause permanent damage to the device. This is a  
stress rating only; functional operation of the device at these  
or any other conditions above those indicated in the opera-  
tional sections of this specification is not implied. Exposure of  
the device to absolute maximum ratings for extended periods  
may affect device reliability.  
Am27C010  
7
DC CHARACTERISTICS over operating range (unless otherwise specified)  
Parameter  
Symbol  
Parameter Description  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Test Conditions  
Min  
Max  
Unit  
V
V
I
= –400 µA  
= 2.1 mA  
2.4  
OH  
OH  
V
I
0.45  
V
OL  
OL  
V
2.0  
V
+ 0.5  
CC  
V
IH  
V
Input LOW Voltage  
–0.5  
+0.8  
1.0  
5.0  
30  
V
IL  
I
Input Load Current  
V
V
= 0 V to V  
CC  
LI  
IN  
I
Output Leakage Current  
= 0 V to V  
CC  
µA  
LO  
OUT  
I
V
Active Current (Note 2)  
C/I Devices  
E Devices  
CC1  
CC  
CE# = V , f = 10 MHz,  
IL  
mA  
I
= 0 mA  
OUT  
60  
I
I
V
V
V
TTL Standby Current  
CMOS Standby Current  
Supply Current (Read)  
CE# = V  
IH  
1.0  
100  
100  
mA  
µA  
µA  
CC2  
CC  
CC  
PP  
CE# = V ± 0.3 V  
CC3  
CC  
I
CE# = OE# = V , V = V  
IL PP CC  
PP1  
Caution: The device must not be removed from (or inserted into) a socket when V or V is applied.  
CC  
PP  
Notes:  
1. V must be applied simultaneously or before V , and removed simultaneously or after V ..  
CC  
PP  
PP  
2. I  
is tested with OE# = V to simulate open outputs.  
IH  
CC1  
3. Minimum DC Input Voltage is –0.5 V. During transitions, the inputs may overshoot to –2.0 V for periods less than 20 ns.  
Maximum DC Voltage on output pins is V + 0.5 V, which may overshoot to V + 2.0 V for periods less than 20 ns.  
CC  
CC  
30  
25  
20  
15  
10  
30  
25  
20  
15  
10  
–75 –50 –55  
0
25 50 75 100 125 150  
1
2
3
4
5
6
7
8
9
10  
Temperature in °C  
Frequency in MHz  
10205J-5  
10205J-6  
Figure 1. Typical Supply Current vs. Frequency  
= 5.5 V, T = 25°C  
Figure 2. Typical Supply Current vs. Temperature  
= 5.5 V, f = 10 MHz  
V
CC  
V
CC  
8
Am27C010  
TEST CONDITIONS  
5.0 V  
Table 1. Test Specifications  
-45,  
-55  
All  
others  
Test Condition  
Output Load  
Output Load Capacitance, C  
(including jig capacitance)  
Input Rise and Fall Times  
Input Pulse Levels  
Unit  
2.7 kΩ  
Device  
Under  
Test  
1 TTL gate  
L
30  
100  
pF  
C
L
6.2 kΩ  
20  
ns  
0.0–3.0 0.45–2.4  
V
Input timing measurement  
reference levels  
1.5  
1.5  
0.8, 2.0  
0.8, 2.0  
V
V
Note:  
Diodes are IN3064 or equivalents.  
Output timing measurement  
reference levels  
10205J-7  
Figure 3. Test Setup  
SWITCHING TEST WAVEFORM  
3 V  
2.4 V  
2.0 V  
0.8 V  
2.0 V  
Test Points  
1.5 V  
Test Points  
1.5 V  
0.8 V  
0 V  
0.45 V  
Input  
Input  
Output  
Output  
Note: For C = 30 pF.  
Note: For C = 100 pF.  
L
L
10205J-8  
KEY TO SWITCHING WAVEFORMS  
WAVEFORM  
INPUTS  
OUTPUTS  
Steady  
Changing from H to L  
Changing from L to H  
Don’t Care, Any Change Permitted  
Does Not Apply  
Changing, State Unknown  
Center Line is High Impedance State (High Z)  
KS000010-PAL  
Am27C010  
9
AC CHARACTERISTICS  
Parameter Symbols  
Am27C010  
JEDEC Standard  
Description  
Address to Output Delay  
Test Setup  
CE#,  
-45 -55 -70 -90 -120 -150 -200 -255 Unit  
t
t
Max 45  
55  
55  
35  
70  
70  
35  
90 120 150 200 250 ns  
90 120 150 200 250 ns  
AVQV  
ACC  
OE# = V  
IL  
t
t
Chip Enable to Output Delay OE# = V Max 45  
ELQV  
GLQV  
CE  
OE  
IL  
Output Enable to Output  
Delay  
t
t
CE# = V Max 25  
40  
25  
50  
35  
65  
35  
75  
40  
75  
40  
ns  
ns  
IL  
Chip Enable High or Output  
Enable High to Output High Z,  
Whichever Occurs First  
t
t
t
EHQZ  
GHQZ  
DF  
Max 25  
25  
0
25  
0
(Note 2)  
Output Hold Time from  
Addresses, CE# or OE#,  
Whichever Occurs First  
t
t
Min  
0
0
0
0
0
0
ns  
AXQX  
OH  
Caution: Do not remove the device from (or insert it into) a socket or board that has V or V applied.  
PP  
CC  
Notes:  
1. V must be applied simultaneously or before V , and removed simultaneously or after V .  
PP  
CC  
PP  
2. This parameter is sampled and not 100% tested.  
3. Switching characteristics are over operating range, unless otherwise specified.  
4. See Figure 3 and Table 1 for test specifications.  
SWITCHING WAVEFORMS  
2.4  
2.0  
0.8  
2.0  
0.8  
Addresses  
0.45  
Addresses Valid  
CE#  
t
CE  
OE#  
t
(Note 2)  
DF  
t
OE  
t
ACC  
t
OH  
(Note 1)  
High Z  
High Z  
Output  
Valid Output  
10205J-9  
Notes:  
1. OE# may be delayed up to t  
– t after the falling edge of the addresses without impact on t .  
ACC  
ACC  
OE  
2.  
t
is specified from OE# or CE#, whichever occurs first.  
DF  
PACKAGE CAPACITANCE  
CDV032  
PL 032  
Typ Max  
PD 028  
Parameter  
Description  
Parameter Symbol  
Test Conditions  
Typ  
Max  
12  
Typ  
Max  
12  
Unit  
pF  
C
Input Capacitance  
Output Capacitance  
V
V
= 0  
9
8
12  
14  
8
IN  
IN  
C
= 0  
13  
15  
11  
11  
14  
pF  
OUT  
OUT  
Notes:  
1. This parameter is only sampled and not 100% tested.  
2. T = +25°C, f = 1 MHz.  
A
10  
Am27C010  
PHYSICAL DIMENSIONS*  
CDV032—32-Pin Ceramic Dual In-Line Package, UV Lens (measured in inches)  
DATUM D  
CENTER PLANE  
UV Lens  
.565  
.605  
1
INDEX AND  
TERMINAL NO. 1  
I.D. AREA  
TOP VIEW  
DATUM D  
CENTER PLANE  
.700  
MAX  
1.635  
1.680  
.160  
.220  
BASE PLANE  
SEATING PLANE  
94°  
105°  
.125  
.200  
.015  
.060  
.300 BSC  
.005 MIN  
.600  
BSC  
.045  
.065  
.008  
.018  
.100 BSC  
.014  
.026  
END VIEW  
SIDE VIEW  
16-000038H-3  
CDV032  
DF11  
3-30-95 ae  
* For reference only. BSC is an ANSI standard for Basic Space Centering.  
PD 032—32-Pin Plastic Dual In-Line Package (measured in inches)  
1.640  
1.670  
.600  
.625  
17  
16  
32  
.009  
.015  
.530  
.580  
Pin 1 I.D.  
.630  
.700  
.045  
.065  
0°  
10°  
.005 MIN  
.140  
.225  
16-038-S_AG  
PD 032  
EC75  
SEATING PLANE  
.090  
.110  
.015  
.060  
.016  
.022  
5-28-97 lv  
.120  
.160  
Am27C010  
11  
PHYSICAL DIMENSIONS  
PL 032—32-Pin Plastic Leaded Chip Carrier (measured in inches)  
.485  
.495  
.447  
.453  
.009  
.015  
.042  
.056  
.125  
.140  
.585  
.595  
Pin 1 I.D.  
.080  
.095  
.547  
.553  
SEATING  
PLANE  
.400  
REF.  
.490  
.530  
.013  
.021  
.050 REF.  
16-038FPO-5  
PL 032  
DA79  
.026  
.032  
TOP VIEW  
SIDE VIEW  
6-28-94 ae  
l
REVISION SUMMARY  
Revision G (May 1998)  
Global  
Revision I (April 26, 1999)  
Distinctive Characteristics  
Changed formatting to match current data sheets.  
Corrected description of packages to 32 pin.  
Ordering Information—OTP EPROM Products  
Physical Dimensions  
Valid Combinations: Removed the JI and PI package  
On CerDIP and PDIP package drawings, corrected pin  
count to 32.  
options for speed option AM27C010-45, V = 5.0 V ±  
CC  
10%.  
Revision J (July 2, 1999)  
Package Capacitance  
Revision H (January 1999)  
Ordering Information—UV EPROM Products  
Corrected package type to 32-pin CERDIP.  
Corrected table heading for CDV032.  
Trademarks  
Copyright © 1999 Advanced Micro Devices, Inc. All rights reserved.  
AMD, the AMD logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc.  
Flashrite is a trademark of Advanced Micro Devices, Inc.  
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.  
12  
Am27C010  

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