AM29F200BB-90DTH1 [SPANSION]
Flash, 256KX8, 90ns;
| 型号： | AM29F200BB-90DTH1 |
| 厂家： | 
SPANSION |
| 描述： | Flash, 256KX8, 90ns |
| 文件： | 总10页 (文件大小：237K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SUPPLEMENT
Am29F200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit)
CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
■ 5.0 V ± 10% for read and write operations
■ Embedded Algorithms
— Minimizes system level power requirements
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
■ Manufactured on 0.32 µm process technology
— Compatible with 0.5 µm Am29F200A device
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■ High performance
— 70, 90, or 120 ns access time
■ Minimum 1,000,000 write/erase cycles
guaranteed
■ Low power consumption
■ Compatible with JEDEC standards
— 20 mA typical active read current (byte mode)
— Pinout and software compatible with
single-power-supply flash
— 28 mA typical active read current for
(word mode)
— Superior inadvertent write protection
— 30 mA typical program/erase current
— 1 µA typical standby current
■ Data# Polling and Toggle Bit
— Detects program or erase cycle completion
■ Ready/Busy# output (RY/BY#)
■ Sector erase architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors (byte mode)
— Hardware method for detection of program or
erase cycle completion
— One 8 Kword, two 4 Kword, one 16 Kword, and
three 32 Kword sectors (word mode)
■ Erase Suspend/Resume
— Supports full chip erase
— Supports reading data from a sector not being
erased
— Sector Protection features:
A hardware method of locking a sector to prevent
any program or erase operations within that
sector
■ Hardware RESET# pin
— Resets internal state machine to the reading
array data
Sectors can be locked via programming
equipment
■ 20-year data retention at 125°C
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■ Tested to datasheet specifications at
temperature
■ Top or bottom boot block configurations
— High temperature range (–55°C to +140°C)
available
available
■ Quality and reliability levels equivalent to
standard packaged components
Publication# 21257 Rev: D Amendment/+2
Issue Date: July 12, 1999
S U P P L E M E N T
GENERAL DESCRIPTION
The Am29F200B in Known Good Die (KGD) form is a
2 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD
as standard product in die form, tested for functionality
and speed. AMD KGD products have the same reli-
ability and quality as AMD products in packaged form.
before executing the erase operation. During erase,
the device automatically times the erase pulse widths
and verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6/
DQ2 (toggle) status bits. After a program or erase
cycle has been completed, the device is ready to read
array data or accept another command.
Am29F200B Features
The Am29F200B is organized as 262,144 bytes of 8
bits each or 131,072 words of 16 bits each. The 8-bit
data appears on DQ0-DQ7; the 16-bit data appears on
DQ0-DQ15. This device is designed to be programmed
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
in-system with the standard system 5.0 Volt V
CC
supply. A 12.0 volt V
erase operations.
is not required for program or
PP
The standard Am29F200B in KGD form offers an
access time of 70, 90, or 120 ns, allowing high-speed
microprocessors to operate without wait states. To
eliminate bus contention the device has separate chip
enable (CE#), write enable (WE#), and output enable
(OE#) controls.
Hardware data protection measures include a low
detector that automatically inhibits write opera-
VCC
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved via programming equipment.
The device requires only a single 5.0 volt power sup-
ply for both read and write functions. Internally gener-
ated and regulated voltages are provided for the
program and erase operations.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state-machine that con-
trols the erase and programming circuitry. Write cycles
also internally latch addresses and data needed for the
programming and erase operations. Reading data out
of the device is similar to reading from other Flash or
EPROM devices.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The system can place the device into the standby mode.
Power consumption is greatly reduced in this mode.
AMD’s Flash technology combines years of Flash mem-
ory manufacturing experience to produce the highest lev-
els of quality, reliability and cost effectiveness. The device
electrically erases all bits within a sector simulta-
neously via Fowler-Nordheim tunneling. The data is
programmed using hot electron injection.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin.
Electrical Specifications
Device erasure occurs by executing the erase com-
mand sequence. This initiates the Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
Refer to the Am29F200B data sheet, publication number
21526, for full electrical specifications on the Am29F200B.
PRODUCT SELECTOR GUIDE
Family Part Number
Am29F200B KGD
Speed Option (V
= 5.0 V ± 10%)
-75 (V
CC
= 5.0 V ± 5%)
-90
90
90
35
-120
120
120
50
CC
Max access time, ns (t
)
70
70
30
ACC
Max CE# access time, ns (t
)
CE
Max OE# access time, ns (t
)
OE
2
Am29F200B Known Good Die
S U P P L E M E N T
DIE PHOTOGRAPH
DIE PAD LOCATIONS
9 8 7 6 5 4 3 2 1 42 41 40 3938
35 34
37 36
33
32
10
11
31
12
AMD logo location
131415 16 1718 1920 21 22 23
24 25 262728 2930
Am29F200B Known Good Die
3
S U P P L E M E N T
Pad Center (mils)
PAD DESCRIPTION
Pad Center (millimeters)
Pad
Signal
X
Y
0.00
X
Y
1
V
0.00
0.0000
–0.1727
–0.3251
–0.4724
–0.6223
–0.7696
–0.9220
–1.0693
–1.2192
–1.4148
–1.4605
–1.4605
–1.4503
–1.3030
–1.1659
–1.0160
–0.8788
–0.7315
–0.5918
–0.4420
–0.3048
–0.0610
0.2413
0.7696
0.9093
1.0566
1.1938
1.3437
1.4808
1.6281
1.6383
1.6383
1.6383
1.3970
1.2040
1.0541
0.9042
0.7544
0.6071
0.4572
0.3073
0.1575
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0356
–0.1651
–0.4572
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1648
–3.1725
–3.1725
–3.2664
–3.2664
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–0.4572
–0.1651
0.0965
0.0584
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
CC
2
DQ4
DQ12
DQ5
–6.80
–12.80
–18.60
–24.50
–30.30
–36.30
–42.10
–48.00
–55.70
–57.50
–57.50
–57.10
–51.30
–45.90
–40.00
–34.60
–28.80
–23.30
–17.40
–12.00
–2.40
9.50
0.00
3
0.00
4
0.00
5
DQ13
DQ6
0.00
6
0.00
7
DQ14
DQ7
0.00
8
0.00
9
DQ15/A-1
0.00
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
V
1.40
SS
BYTE#
A16
A15
A14
A13
A12
A11
A10
A9
–6.50
–18.00
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–124.60
–124.90
–124.90
–128.60
–128.60
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–18.00
–6.50
3.80
A8
WE#
RESET#
RY/BY#
A7
30.30
35.80
41.60
47.00
52.90
58.30
64.10
64.50
64.50
64.50
55.00
47.40
41.50
35.60
29.70
23.90
18.00
12.10
6.20
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
2.30
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
4
Am29F200B Known Good Die
S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29F200B
T
-75
DP
C
1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
C
I
=
=
=
=
Commercial (0°C to +70°C)
Industrial (–40°C to +85°C)
Extended (–55°C to +125°C)
High (–55°C to +140°C)
E
H
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP
DG
DT
DW
=
=
=
=
Waffle Pack
245 die per 5 tray stack
Gel-Pak® Die Tray
486 die per 6 tray stack
Surftape™ (Tape and Reel)
2500 per 7-inch reel
Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order quantity
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
=
=
Top sector
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29F200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory—Die Revision 1
5.0 Volt-only Program and Erase
Valid Combinations
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
AM29F200BT-75,
AM29F200BB-75
(70 ns, V = 5.0 V ±5%)
DPC 1, DPI 1, DPE 1, DPH 1,
DGC 1, DGI 1, DGE 1, DGH 1,
DTC 1, DTI 1, DTE 1, DTH 1,
DWC 1, DWI 1, DWE 1, DWH 1
CC
AM29F200BT-90,
AM29F200BB-90
AM29F200BT-120,
AM29F200BB-120
Am29F200B Known Good Die
5
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
AMD logo location
Direction of Feed
Orientation relative to
leading edge of tape
and reel
Gel-Pak and Waffle Pack Packaging
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
6
Am29F200B Known Good Die
S U P P L E M E N T
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29F200B product qualification database supple-
ment for KGD. AMD implements quality assurance pro-
cedures throughout the product test flow. In addition,
an off-line quality monitoring program (QMP) further
guarantees AMD quality standards are met on Known
Good Die products. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in.
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 1
Data Retention
Bake
24 hours at 250°C
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 2
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 3
Hot Temperature
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Packaging for Shipment
Shipment
Figure 1. AMD KGD Product Test Flow
Am29F200B Known Good Die
7
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
MANUFACTURING INFORMATION
Die dimensions . . . . . . . . . . . . . . 135 mils x 150 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . .3.43 mm x 3.81 mm
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC
Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . 19.7 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 µm
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98480AK
(Bottom Boot) . . . . . . . .98480ABK
Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils
. . . . . . . . . . . . . . . . . . . . . . . . . .115.9 µm x 115.9 µm
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pad Area Free of Passivation . . . . . . . . . .13.99 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
SPECIAL HANDLING INSTRUCTIONS
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias:
Commerical, Industrial, and
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
Extended Temperature Range . . . . .TJ (max) = 130°C
Junction Temperature Under Bias:
High Tempeature Range . . . . . . . . .TJ (max) = 145°C
Operating Temperature
Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
High . . . . . . . . . . . . . . . . . . . . . . –55°C to +140°C
8
Am29F200B Known Good Die
S U P P L E M E N T
WITHOUT LIMITING THE FOREGOING, EXCEPT TO
TERMS AND CONDITIONS OF SALE FOR
AMD NON-VOLATILE MEMORY DIE
THE EXTENT THAT AMD EXPRESSLY WARRANTS
TO BUYER IN A SEPARATE AGREEMENT SIGNED
BY AMD, AMD MAKES NO WARRANTY WITH
RESPECT TO THE DIE’S PROCESSING OF DATE
DATA, AND SHALL HAVE NO LIABILITY FOR
DAMAGES OF ANY KIND, UNDER EQUITY, LAW, OR
ANY OTHER THEORY, DUE TO THE FAILURE OF
SUCH KNOWN GOOD DIE TO PROCESS ANY PAR-
TICULAR DATA CONTAINING DATES, INCLUDING
DATES IN AND AFTER THE YEAR 2000, WHETHER
OR NOT AMD RECEIVED NOTICE OF THE POSSI-
BILITY OF SUCH DAMAGES.
All transactions relating to unpackaged die under this
agreement shall be subject to AMD’s standard terms
and conditions of sale, or any revisions thereof, which
revisions AMD reserves the right to make at any time
and from time to time. In the event of conflict between
the provisions of AMD’s standard terms and conditions
of sale and this agreement, the terms of this agreement
shall be controlling.
AMD warrants unpackaged die of its manufacture
(“Known Good Die” or “Die”) against defective mate-
rials or workmanship for a period of one (1) year from
date of shipment. This warranty does not extend
beyond the first purchaser of said Die. Buyer assumes
full responsibility to ensure compliance with the
appropriate handling, assembly and processing of
Known Good Die (including but not limited to proper
Die preparation, Die attach, wire bonding and related
assembly and test activities), and compliance with all
guidelines set forth in AMD’s specifications for Known
Good Die, and AMD assumes no responsibility for envi-
ronmental effects on Known Good Die or for any
activity of Buyer or a third party that damages the Die
due to improper use, abuse, negligence, improper
installation, accident, loss, damage in transit, or unau-
thorized repair or alteration by a person or entity other
than AMD (“Warranty Exclusions”).
THIS WARRANTY IS EXPRESSED IN LIEU OF ALL
OTHER WARRANTIES, EXPRESSED OR IMPLIED,
INCLUDING THE IMPLIED WARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE, THE IMPLIED
WARRANTY OF MERCHANTABILITY AND OF ALL
OTHER OBLIGATIONS OR LIABILITIES ON AMD’s
PART, AND IT NEITHER ASSUMES NOR AUTHO-
RIZES ANY OTHER PERSON TO ASSUME FOR
AMD ANY OTHER LIABILITIES. THE FOREGOING
CONSTITUTES THE BUYER’S SOLE AND EXCLU-
SIVE REMEDY FOR THE FURNISHING OF DEFEC-
TIVE OR NON CONFORMING KNOWN GOOD DIE
AND AMD SHALL NOT IN ANY EVENT BE LIABLE
FOR INCREASED MANUFACTURING COSTS,
DOWNTIME COSTS, DAMAGES RELATING TO
BUYER’S PROCUREMENT OF SUBSTITUTE DIE
(i.e., “COST OF COVER”), LOSS OF PROFITS, REV-
ENUES OR GOODWILL, LOSS OF USE OF OR
DAMAGE TO ANY ASSOCIATED EQUIPMENT, OR
ANY OTHER INDIRECT, INCIDENTAL, SPECIAL
OR CONSEQUENTIAL DAMAGES BY REASON OF
THE FACT THAT SUCH KNOWN GOOD DIE SHALL
HAVE BEEN DETERMINED TO BE DEFECTIVE OR
NON CONFORMING.
The liability of AMD under this warranty is limited, at
AMD’s option, solely to repair the Die, to send replace-
ment Die, or to make an appropriate credit adjustment
or refund in an amount not to exceed the original pur-
chase price actually paid for the Die returned to AMD,
provided that: (a) AMD is promptly notified by Buyer in
writing during the applicable warranty period of any
defect or nonconformity in the Known Good Die; (b)
Buyer obtains authorization from AMD to return the
defective Die; (c) the defective Die is returned to AMD
by Buyer in accordance with AMD’s shipping instruc-
tions set forth below; and (d) Buyer shows to AMD’s
satisfaction that such alleged defect or nonconformity
actually exists and was not caused by any of the above-
referenced Warranty Exclusions. Buyer shall ship such
defective Die to AMD via AMD’s carrier, collect. Risk of
loss will transfer to AMD when the defective Die is pro-
vided to AMD’s carrier. If Buyer fails to adhere to these
warranty returns guidelines, Buyer shall assume all risk
of loss and shall pay for all freight to AMD’s specified
location. The aforementioned provisions do not extend
the original warranty period of any Known Good Die
that has either been repaired or replaced by AMD.
Buyer agrees that it will make no warranty representa-
tions to its customers which exceed those given by
AMD to Buyer unless and until Buyer shall agree to
indemnify AMD in writing for any claims which exceed
AMD’s warranty.
Known Good Die are not designed or authorized for
use as components in life support appliances, devices
or systems where malfunction of the Die can reason-
ably be expected to result in a personal injury. Buyer’s
use of Known Good Die for use in life support applica-
tions is at Buyer’s own risk and Buyer agrees to fully
indemnify AMD for any damages resulting in such use
or sale.
Am29F200B Known Good Die
9
S U P P L E M E N T
REVISION SUMMARY
Revision C
Packaging Information
Added section. Moved orientation information from die
photograph section into this section.
Global
Formatted to match current template. Modified
Am29F200A data sheet for CS39S process technology.
Revision D+1 (June 14, 1999)
Terms and Conditions
Physical Specifications
Replaced warranty with new version.
Corrected bond pad dimensions and deleted Si from
the bond pad metalization specification.
Revision D (December 1998)
Revision D+2 (July 12, 1999)
Global
Global
Added -75 speed option.
The device is now available in the high temperature
range (–55°C to +140°C). TJ (max) for this range is
+145°C.
Ordering Information
Changed Gel-Pak quantity to 486. Corrected Surftape
reel size to 7 inches.
Trademarks
Copyright © 1999 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
10
Am29F200B Known Good Die
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