MB9DF566MGE [SPANSION]
This document states the current technical specifications regarding;
| 型号： | MB9DF566MGE |
| 厂家： | 
SPANSION |
| 描述： | This document states the current technical specifications regarding |
| 文件： | 总109页 (文件大小：2003K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The following document contains information on Cypress products. Although the document is marked
with the name “Spansion”, the company that originally developed the specification, Cypress will
continue to offer these products to new and existing customers.
Continuity of Specifications
There is no change to this document as a result of offering the device as a Cypress product. Any
changes that have been made are the result of normal document improvements and are noted in the
document history page, where supported. Future revisions will occur when appropriate, and changes
will be noted in a document history page.
Continuity of Ordering Part Numbers
Cypress continues to support existing part numbers. To order these products, please use only the
Ordering Part Numbers listed in this document.
For More Information
Please contact your local sales office for additional information about Cypress products and solutions.
About Cypress
Cypress (NASDAQ: CY) delivers high-performance, high-quality solutions at the heart of today’s most
advanced embedded systems, from automotive, industrial and networking platforms to highly
interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes
NOR flash memories, F-RAM™ and SRAM, Traveo™ microcontrollers, the industry’s only PSoC®
programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense®
capacitive touch-sensing controllers, and Wireless BLE Bluetooth® Low-Energy and USB connectivity
solutions, Cypress is committed to providing its customers worldwide with consistent innovation, best-
in-class support and exceptional system value.
MB9D560 Series
32-bit Microcontroller
Spansion® TraveoTM Family
MB9DF564MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE
MB9DF565MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE
MB9DF566MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE
Data Sheet (Full Production)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number MB9D560_DS708-00001
Revision 3.0
Issue Date May 15, 2015
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion
data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this
proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has
been completed, and that initial production has begun. Due to the phases of the manufacturing
process that require maintaining efficiency and quality, this document may be revised by subsequent
versions or modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered may
occur.”
Questions regarding these document designations may be directed to your local sales office.
2
MB9D560_DS708-00001-3v0-E, May 15, 2015
MB9D560 Series
32-bit Microcontroller
Spansion® TraveoTM Family
MB9DF564MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE
MB9DF565MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE
MB9DF566MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE
Data Sheet (Full Production)
1. Description
MB9D560 series has SPANSION 32-bit microcontrollers for automobile motor control. They use the
ARM® Cortex-R5 MPCoreTM CPU that is compatible with the ARM family.
Notes:
−
−
ARM, Cortex, Thumb are the registered trademarks of ARM Limited in the EU and other countries.
MPCore, CoreSight are the trademarks of ARM Limited in the EU and other countries.
Publication Number MB9D560_DS708-00001
Revision 3.0
Issue Date May 15, 2015
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the
valid combinations offered may occur.
D a t a S h e e t
Table of Contents
1. Description............................................................................................................................................... 3
2. Features.................................................................................................................................................... 5
3. Product Lineup ...................................................................................................................................... 11
4. Pin Assignment...................................................................................................................................... 12
5. Pin Description ...................................................................................................................................... 16
6. I/O Circuit Type ...................................................................................................................................... 34
7. Handling Precautions............................................................................................................................ 37
7.1 Precautions for Product Design.................................................................................................... 37
7.2 Precautions for Package Mounting............................................................................................... 38
7.3 Precautions for Use Environment................................................................................................. 40
8. Handling Devices................................................................................................................................... 41
9. Block Diagram........................................................................................................................................ 44
10. Memory Map........................................................................................................................................... 46
11. I/O Map.................................................................................................................................................... 49
12. Pin Statuses in CPU Status................................................................................................................... 54
13. Electrical Characteristics...................................................................................................................... 56
13.1 Absolute Maximum Ratings.......................................................................................................... 56
13.2 Recommended Operating Conditions........................................................................................... 58
13.3 DC Characteristics........................................................................................................................ 60
13.4 AC Characteristics........................................................................................................................ 69
13.5 A/D Converter............................................................................................................................... 96
13.6 4 Channels Same Time Sampling A/D Converter......................................................................... 97
13.7 Flash Memory............................................................................................................................. 100
13.8 R/D Converter............................................................................................................................. 101
14. Ordering Information........................................................................................................................... 102
15. Part Number Option............................................................................................................................. 102
16. Package Dimensions........................................................................................................................... 103
17. Major Changes..................................................................................................................................... 105
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
2. Features
Function
Description
−
−
−
−
−
−
−
CMOS 90nm technology
ARM Cortex®-R5F
Technology
32-bit ARM architecture
2-instruction issuance super scalar
8-stage pipeline
ARMv7 / Thumb®-2 instruction set
Floating-Point Unit (FPU)
Double precision
−
−
−
Memory protection Unit (MPU)
16 area
ECC support for the TCM port
1-bit error correction, 2-bit error detection ECC (SEC-DED)
TCM port
2 TCM ports
−
−
−
ATCM port
CPU
BTCM 2 ports (B0TCM, B1TCM)
VIC port
Low latency interrupt
−
AXI master interface
64-bit AXI interface (instruction / data access)
32-bit AXI interface (I/O access)
AXI slave interface
−
−
−
64-bit AXI interface (accessible to TCM port)
CPU configuration
2 CPUs (AMP operation)
Operating frequency
Maximum 200 MHz
−
−
Trace with ETM-R5
ARM CoreSightTM Technology
Each CPU embedded Embedded Trace Macro (ETM), trace support of CPU operation
Debugging interface
−
−
JTAG (5 pin )
Debugging
Support clock : maximum 20 MHz
Debugging security support
128-bit security key (Device security key)
Wakeup function on JTAG
−
−
User mode
Normal mode (internal memory activation)
Serial writer mode
Operation mode
−
−
Internal clock source
Fast-CR oscillation (8 MHz)
Slow-CR oscillation (100 kHz)
External oscillation input
−
−
−
Main clock input
Clock control
Embedded PLL
Main PLL (Multiplying clock of main oscillation )
Oscillator stabilized timer
Support oscillator stabilized timer for all clock source independently
After a lapse of oscillator stabilized time, it is able to use source clock timer (Except PLL for FlexRay/RDC)
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
Description
Function
−
−
Reset level
Hardware reset (system initialization)
Software reset (programing initialization)
Reset factor (Hardware reset )
Power-on reset (PONR), external reset input (RSTX, NMIX+RSTX), clock stop waiting with time-out reset,
Reset control
low-voltage detection reset (internal low-voltage detection reset, 5V external low-voltage detection reset ),
watchdog reset (hardware watchdog reset, software watchdog reset ), clock supervisor reset (main clock
monitor, PLL clock monitor), software trigger hardware reset , profile error reset
Reset factor (software reset )
−
−
Software reset
Device state
RUN (Run State, CPU is operation status)
PSS (Power Saving State, CPU wait event from WFI)
Setting parameter of each devise state
Clock (clock source enable, clock source selection, clock divider, clock domain enable)
Clock monitor
−
Low power consumption control
Low-voltage detection
−
−
Memory protection as master except processor
Target master
DMA controller
Memory protection unit (MPU)
−
−
−
−
−
−
−
8 area
NMI generation when violation detection
TPU 1 unit as CPU 1 unit
24-bit timer x 8 channels per unit
Support execution time protection, locking time protection, inter-arrival time protection, deadline protection
Support normal mode and over flow mode
Prescaler of each channels
Timing protection unit (TPU)
Timer clock divider (1/1 to 1/64)
−
−
−
−
−
Independent prescaler of each channels
Timer clock divider (1/1, 1/2, 1/4, 1/16)
Monitor target clock
Main oscillation input , main PLL output
Monitor method
Clock supervisor (CSV)
Monitor of frequency range
Operation after error detection
Reset or NMI
Watchdog timer embedded
Hardware watchdog timer
Software watchdog timer
−
Hardware watchdog timer
1 unit per system
32-bit watchdog timer with window function
Clock source: fast-CR or slow-CR
Set by boot program (BootROM maker)
Not set by user program
Watchdog timer (WDT)
−
Software watchdog timer
1 unit per CPU
32-bit watchdog timer with window function
Clock source: fast-CR, slow-CR, main clock
One time set on user program (not set again)
6
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Function
Description
−
Select voltage monitor
External low-voltage detection (5V power line monitor): 3.9V, 4.1V, 4.3V
Internal low-voltage detection (1.2V power line monitor): 0.9V
Internal low-voltage detection: always valid
External low-voltage detection: valid/invalid set
External low-voltage detection: set threshold voltage independently on RUN / PSS
Output when low-voltage detection
External low-voltage detection: reset or NMI
Internal low-voltage detection: reset
Cortex-R5F ATCM connection
1 Main Flash memory as CPU 1 unit
HPM connection with 64-bit AXI
Flash memory configuration
−
−
−
−
Low-voltage detection (LVD)
−
−
−
Interleave with 64-bit Flash 2 units
2 address areas
Main Flash memory
(TCFLASH)
−
TCM (read only)
AXI (read / write)
−
−
−
−
ECC support (SEC-DED)
Parallel programming support
Flash security
2 Work Flash memories
1 Work Flash memory as CPU 1 unit
ECC support (SEC-DED)
Work Flash memory
(WorkFLASH)
−
−
−
−
Parallel programming support
Flash security
BTCM connection of Cortex-R5F
1 main SRAM as CPU 1 unit
Main SRAM (TCRAM)
BootROM
Interleave with 2 ports of B0TCM and B1TCM
ECC support (SEC-DED)
−
−
−
−
−
−
Size: 16K byte
Boot operation support
Serial writer program support
16 channels
Transfer mode
Block transfer, Burst transfer
−
−
Addressing mode
DMA controller (DMAC)
Fixed, increment
Priority between channels
Fixed, Dynamic, Round robin
Support normal interrupt (IRQ) and non-maskable interrupt (NMI)
Normal interrupt (IRQ)
−
−
Use Interrupt Request (IRQ) of Cortex-R5F
512 channels
32 level for priority
−
−
Support low latency interrupt response from VIC port of Cortex-R5F
Non-maskable interrupt (NMI)
Use fast interrupt request (FIQ) of Cortex-R5F
32 channels
Interrupt control (IRC)
16 level for priority
−
Support software interrupt generation
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
Description
Function
−
Input
Normal interrupt (IRQ): 8 input
Non-maskable interrupt (NMI): 1 input
Detection method
External interrupt (EXT-IRQ)
−
−
H level , L level , rise edge, fall edge, both edge
Mailbox function
Inter-processor communications unit
(IPCU)
Data communication for CPU core communication by 8 Mailbox
Support of interrupt between CPU core
−
−
−
−
Small size memory to support exclusion control on exclusion access instruction
Use for semaphore
Exclusion access memory (EAM)
Size: 48 byte
The bit operation of specified register bit on Bit band area, it is mapping 1 bit of bit band area to support bit
band alias area for 1 byte. The target of bit band access is specified register bit on I/O area
Output to register of CRC code according real time writing to input register
16-bit timer
Bit-band unit (BBU)
CRC
−
−
Any of four PWM/PPG/reload/PWC timer functions can be selected and used.
A 32-bit timer can be used in 2 channels of cascade mode as reload/PWC timer.
16 bit up/down counter (2 channels for motor control only)
32 bit up/down counter
Base timer
−
−
−
16-bit free-run timer (FRT)
32-bit free-run timer
Input capture
16-bit capture register that detects rise edge, Fall edge, both edge
Generate interrupt request after latch of counter number of 16 bit
Free-run timer with edge detection of pin input
16-bit input capture (ICU)
−
−
Input capture
32-bit capture register that detects rise edge, fall edge, both edge
Generate interrupt request after latch of counter number of 32 bit
Free-run timer with edge detection of pin input
LIN sync break/sync field relation is following.
32-bit input capture
Input capture ch.0 → Multi-function serial interface ch.0
Input capture ch.1 → Multi-function serial interface ch.1
Input capture ch.2 → Multi-function serial interface ch.2
Input capture ch.3 → Multi-function serial interface ch.3
Input capture ch.4 → Multi-function serial interface ch.4
Output interrupt signal when compare with 16-bit free-run timer
−
16-bit output compare (OCU)
8
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Function
Description
−
Generate variable output
Real time output
16-bit PPG waveform output
PPG uses 16-bit PPG timer of base timer
The relation is following
WFG(ch.0 to ch.5)
Base timer ch.0 → PPG0
Base timer ch.2 → PPG2
Base timer ch.4 → PPG4
WFG(ch.6 to ch.11)
Waveform generator (WFG)
Base timer ch.6 → PPG6
Base timer ch.8 → PPG8
Base timer ch.10 → PPG10
Non overlap three-phase waveform output (inverter control)
DC chopper waveform output
−
−
−
−
−
−
−
−
−
−
−
−
Dead time timer function
GATE function
DTTI function
12-bit resolution A/D converter: 1 unit (32 channels)
Sampling analog value from input port of 32 channels
Conversion time: 1 µs
A/D converter (ADC)
External trigger activation (ADTG)
Activation from internal timer (base timer)
12 bit resolution A/D converter: 2 units (8 channels )
UART / CSIO / LIN interface (v2.1) communication available by selecting the function
Transmission FIFO: 64 Byte, reception FIFO: 64 Byte
Reception interrupt factor (3 types)
4ch sample-hold A/D converter
Reception error detection (parity, over run, frame error)
Reception to FIFO for data of setting value
Reception data under setting value in FIFO, idle term detection of over 8 clocks with baud rate clock
Transmission interrupt factor (2 types)
Multi-function serial interface (MFS)
−
No transmission operation
Transmission FIFO empty (contain transmission operation)
SPI (serial peripheral interface) support
LIN protocol revision 2.1 support
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
8/16-bit up/down counter (2 channels uses for R/D converter)
The CAN is based on the CAN protocol ver. 2.0A/B
64 message buffers x 3 channels
Up/Down counter (UDC)
CAN interface
An identification mask is applied to each message object
Up to 1Mbps support
Clock support CAN prescaler
CAN wakeup functions
Supports FlexRay protocol specification v2.1
Maximum 128 message buffers
8K Byte message RAM
Variable length of message buffers
FlexRay controller
Each message buffer can be allocated as a part of reception buffer, transmission buffer or reception FIFO
Host access to the message buffer via input and output buffers
Filtering for slot counter, cycle counter and channels
Maskable interrupts are supported
Connect to resolver interface
R/D converter (RDC)
D/A converter (DAC)
10-bit resolution
May 15, 2015, MB9D560_DS708-00001-3v0-E
9
D a t a S h e e t
Description
Function
−
Assist for three-phase current normalizing, three-phase to two-phase DC conversion / two-phase to three-
phase AC conversion, angler calculation, PID control calculation.
Error detection in processing (overflow/under flow/non normalizing error of FLOP)
Amplitude diagnosis /angle diagnosis function of R/D converter
Error current diagnosis function
Motor vector operation accelerator
(MVA)
−
−
−
−
Key code supports
A part of General-purpose I/O (GPIO) register
Port pin configuration (PPC) register
Key code
Analog input control register (ADER)
4ch ADC analog input control register (ADER4CH_1, ADER4CH_0)
Analog output control register (DAC00_DAER, DAC01_DAER)
10
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
3. Product Lineup
Memory Size
Parameter
MB9DF564
(512KB+128KB)2
64KB2
MB9DF565
(768KB+128KB)2
64KB2
MB9DF566
(1024KB+128KB)2
64KB2
FLASH size (program)
FLASH size (Work)
RAM size
64KB2
96KB2
128KB2
Functions
Pin number
208 pin
176 pin
On-chip PLL clock multiplication system
System clock
Minimum instruction execution time :5 ns (200 MHz)
CR oscillator (fast/slow)
DMAC
Yes
16 channels
Base timer
12 channels (0 to 11)
6 channels (0 to 3, 6, 7)
32-bit free-run timer
32-bit input capture
16-bit free-run timer
5 channels
3 units (6 channels)
20 channels*1
8 units (0 to 7)
7 units (0 to 6)
(13 channels (0 to 12))
9 units (0 to 5, 9 to 11)
(18 channels (0 to 11, 18 to 23))
3 units (0, 1, 3)
16-bit input capture
16-bit output compare
Waveform generator
(15 channels (0 to 14))
12 units (0 to 11)
(24 channels (0 to 23))
4 units (0 to 3)
(24 channels (0 to 23))
8 channels (0 to 7)
(18 channels (0 to 11, 18 to 23))
6 channels (0 to 4, 7)
External interrupt
A/D converter
1 unit (32 channels)
4ch sample-hold A/D converter
R/D converter
2 units (8 channels)
2 units*2
D/A converter
2 channels*2
4 channels
2 units
Up/Down counter
Motor vector operation accelerator
Multi-function serial interface
CAN
5 channels (0 to 4)
3 channels (0, 1, 4)
3 channels
FlexRay
128 msb x 1 unit (ch.A / ch.B)*2
Inter-processor communications unit
Exclusive access memory
Software watchdog timer
Hardware watchdog timer
CRC
Yes
Yes
Yes
Yes
2 channels
Internal power supply low-voltage
detection
Yes
External power supply low-voltage
detection
Yes
Key code
Yes*2
Package
LER208
LEP176
Debugging interface
JTAG interface
*1: 2 channels for motor control
*2: The function is different according to the part number. See "15. Part Number Option".
May 15, 2015, MB9D560_DS708-00001-3v0-E
11
D a t a S h e e t
4. Pin Assignment
208 Pin Part Number with RDC
VSS
1
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
VSS
VCC12
P305
2
VCC12
P423
FRCK0
FRCK1
DTTI0
RTO0
RTO1
RTO2
RTO3
RTO4
RTO5
3
SCK3
SOT3
SIN3
ꢀ
FRCK10 IN14
P306
4
P422
ꢀ
FRCK9
FRCK8
IN13
4ADTG0
P000
5
P421
INT6
ꢀ
P001
6
P100
DTTI1 4ADTG1
RTO6
P002
7
P101
P003
8
P102
RTO7
P004
9
P103
RTO8
P005
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
P104
RTO9
P006
P105
RTO10
VCC5
P106
RTO11
VSS
VCC5
4AN0
4AN1
4AN2
4AN3
P007
VSS
P008
P107
4AN4
4AN5
4AN6
4AN7
P009
P108
P010
P109
AVRH0
AVRL0
AVR0
P110
AVRH1
AVRL1
AVR1
ꢀ
AVSS0
AVCC0
P011
AVSS1
AVCC1
P111
ZIN0
BIN0
AIN0
ZIN1
BIN1
AIN1
ꢀ
RDC_W0
RDC_V0
RDC_U0
RDC_Z0
RDC_B0
RDC_A0
P012
RDC_W1 ZIN2
RDC_V1 BIN2
RDC_U1 AIN2
RDC_Z1 ZIN3
RDC_B1 BIN3
RDC_A1 AIN3
TOP VIEW
LER208
P013
P112
P014
P113
P015
P114
P016
P115
AREF20
SIN_IN0
COS_IN0
SIN_OUT0
SIN_MINUS0
SIN_PLUS0
COS_PLUS0
COS_MINUS0
COS_OUT0
RVRH0
RVRL0
RVR0
P116
ꢀ
AREF21
SIN_IN1
COS_IN1
SIN_OUT1
SIN_MINUS1
SIN_PLUS1
COS_PLUS1
COS_MINUS1
COS_OUT1
ＲＶＲＨ1
RVRL1
RVR1
ꢀ
RVSS0
RVCC0
RDC_ACT0
MAG_MINUS0
MAG_PLUS0
MAG_OUT0
P430
RVSS1
RVCC1
RDC_ACT1
MAG_MINUS1
MAG_PLUS1
MAG_OUT1
P431
P026
P126
ꢀ
FRCK12
FRCK13
FRCK14
FRCK15
ERDS0
DTTI2
RTO12
RTO13
RTO14
P030
ERDS1
SCK2
SOT2
P031
P131
P309
P420
P310
P419
SIN2
INT5
VCC5
VCC5
12
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
208 Pin Part Number without RDC
VSS
VCC12
P305
P306
P000
P001
P002
P003
P004
P005
P006
VCC5
VSS
1
2
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
VSS
VCC12
P423
P422
P421
P100
P101
P102
P103
P104
P105
P106
VCC5
VSS
FRCK0
FRCK1
DTTI0
RTO0
RTO1
RTO2
RTO3
RTO4
RTO5
3
SCK3
SOT3
SIN3
ꢀ
FRCK10 IN14
4
ꢀ
FRCK9
FRCK8
IN13
4ADTG0
5
INT6
4ADTG1
ꢀ
6
DTTI1
RTO6
RTO7
RTO8
RTO9
RTO10
RTO11
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
4AN0
4AN1
4AN2
4AN3
P007
P008
P009
P010
AVRH0
AVRL0
AVR0
AVSS0
AVCC0
P011
P012
P013
P014
P015
P016
P017
P018
P019
P020
P021
P022
P023
P024
P025
RVRH0
RVRL0
RVR0
RVSS0
RVCC0
P026
P027
P028
P029
P430
P030
P031
P309
P310
VCC5
P107
P108
P109
P110
AVRH1
AVRL1
AVR1
AVSS1
AVCC1
P111
P112
P113
P114
P115
P116
P117
P118
P119
P120
P121
P122
P123
P124
P125
RVRH1
RVRL1
RVR1
RVSS1
RVCC1
P126
P127
P128
P129
P431
P131
P420
P419
VCC5
4AN4
4AN5
4AN6
4AN7
ꢀ
ZIN0
BIN0
AIN0
ZIN1
BIN1
AIN1
ZIN2
BIN2
AIN2
ZIN3
BIN3
AIN3
TOP VIEW
LER208
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
ꢀ
ꢀ
ꢀ
DAOUT0
ERDS0
DTTI2
ꢀ
FRCK12
FRCK13
FRCK14
FRCK15
DAOUT1
ERDS1
SCK2
RTO12
RTO13
RTO14
SOT2
SIN2
INT5
May 15, 2015, MB9D560_DS708-00001-3v0-E
13
D a t a S h e e t
176 Pin Part Number with RDC
ꢀ
VSS
VCC12
P000
1
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
VSS
2
VCC12
P100
P101
4ADTG0
DTTI0
RTO0
RTO1
RTO2
RTO3
RTO4
RTO5
4AN0
4AN1
4AN2
4AN3
3
DTTI1
RTO6
RTO7
RTO8
RTO9
RTO10
RTO11
4AN4
4AN5
4AN6
4AN7
4ADTG1
P001
P002
4
5
P102
P103
P003
P004
6
7
P104
P105
P005
P006
8
9
P106
P107
P007
P008
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
P108
P109
P110
P009
P010
AVRH0
AVRL0
AVR0
AVRH1
AVRL1
AVR1
ꢀ
ꢀ
ꢀ
AVSS0
AVCC0
P011
AVSS1
AVCC1
P111
ZIN0
BIN0
AIN0
ZIN1
BIN1
AIN1
RDC_W0
RDC_V0
RDC_U0
RDC_Z0
RDC_B0
RDC_A0
RDC_W1
RDC_V1
RDC_U1
RDC_Z1
RDC_B1
RDC_A1
ZIN2
BIN2
AIN2
ZIN3
BIN3
AIN3
P012
P013
P112
P113
TOP VIEW
LEP176
P014
P015
P016
P114
P115
P116
AREF20
SIN_IN0
COS_IN0
SIN_OUT0
SIN_MINUS0
SIN_PLUS0
COS_PLUS0
COS_MINUS0
COS_OUT0
RVRH0
RVRL0
AREF21
SIN_IN1
COS_IN1
SIN_OUT1
SIN_MINUS1
SIN_PLUS1
COS_PLUS1
COS_MINUS1
COS_OUT1
RVRH1
RVRL1
RVR1
ꢀ
98
97
RVR0
RVSS0
RVCC0
RDC_ACT0
MAG_MINUS0
MAG_PLUS0
MAG_OUT0
P430
96
95
RVSS1
RVCC1
RDC_ACT1
MAG_MINUS1
MAG_PLUS1
MAG_OUT1
P431
P026
94
93
P126
92
91
ꢀ
ERDS0
90
89
ERDS1
VCC5
VCC5
ꢀ
ꢀ
14
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
176 Pin Part Number without RDC
ꢀ
VSS
VCC12
P000
P001
P002
P003
P004
P005
P006
P007
P008
P009
P010
AVRH0
AVRL0
AVR0
AVSS0
AVCC0
P011
P012
P013
P014
P015
P016
P017
P018
P019
P020
P021
P022
P023
P024
P025
RVRH0
RVRL0
RVR0
RVSS0
RVCC0
P026
P027
P028
P029
P430
VCC5
1
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
VSS
2
VCC12
P100
P101
P102
P103
P104
P105
P106
P107
P108
P109
P110
AVRH1
AVRL1
AVR1
AVSS1
AVCC1
P111
P112
P113
P114
P115
P116
P117
P118
P119
P120
P121
P122
P123
P124
P125
RVRH1
RVRL1
RVR1
RVSS1
RVCC1
P126
P127
P128
P129
P431
VCC5
4ADTG0
DTTI0
RTO0
RTO1
RTO2
RTO3
RTO4
RTO5
4AN0
4AN1
4AN2
4AN3
3
DTTI1
RTO6
RTO7
RTO8
RTO9
RTO10
RTO11
4AN4
4AN5
4AN6
4AN7
4ADTG1
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
ꢀ
ꢀ
ꢀ
ZIN0
BIN0
AIN0
ZIN1
BIN1
AIN1
ZIN2
BIN2
AIN2
ZIN3
BIN3
AIN3
TOP VIEW
LEP176
ꢀ
98
97
96
95
94
93
92
DAOUT0
ERDS0
91
DAOUT1
ERDS1
ꢀ
90
89
ꢀ
ꢀ
May 15, 2015, MB9D560_DS708-00001-3v0-E
15
D a t a S h e e t
5. Pin Description
Part Number with RDC
Pin Number
I/O Circuit
Type
Pin Name
Functions
208 pin 176 pin
P305
General-purpose I/O port
3
4
-
-
E
E
FRCK0
P306
16-bit free-run timer ch.0 external clock input pin
General-purpose I/O port
FRCK1
P000
16-bit free-run timer ch.1 external clock input pin
General-purpose I/O port
5
3
DTTI0
4ADTG0
P001
E
Waveform generator output stop signal input pin 0
4ch sample-hold A/D converter unit0 external trigger input pin
General-purpose I/O port
6
7
4
5
E
E
E
E
E
E
F
F
F
F
RTO0
P002
Waveform generator ch.0 output pin
General-purpose I/O port
RTO1
P003
Waveform generator ch.1 output pin
General-purpose I/O port
8
6
RTO2
P004
Waveform generator ch.2 output pin
General-purpose I/O port
9
7
RTO3
P005
Waveform generator ch.3 output pin
General-purpose I/O port
10
11
14
15
16
17
8
RTO4
P006
Waveform generator ch.4 output pin
General-purpose I/O port
9
RTO5
P007
Waveform generator ch.5 output pin
General-purpose I/O port
10
11
12
13
4AN0
P008
4ch sample-hold A/D converter unit0 analog 0 input pin
General-purpose I/O port
4AN1
P009
4ch sample-hold A/D converter unit0 analog 1 input pin
General-purpose I/O port
4AN2
P010
4ch sample-hold A/D converter unit0 analog 2 input pin
General-purpose I/O port
4AN3
P011
4ch sample-hold A/D converter unit0 analog 3 input pin
General-purpose I/O port
23
24
25
26
27
19
20
21
22
23
RDC_W0
ZIN0
E
E
E
E
E
R/D converter unit0 W-phase output pin
Up/Down counter ch.0 ZIN input pin
General-purpose I/O port
P012
RDC_V0
BIN0
R/D converter unit0 V-phase output pin
Up/Down counter ch.0 BIN input pin
General-purpose I/O port
P013
RDC_U0
AIN0
R/D converter unit0 U-phase output pin
Up/Down counter ch.0 AIN input pin
General-purpose I/O port
P014
RDC_Z0
ZIN1
R/D converter unit0 Z-phase output pin
Up/Down counter ch.1 ZIN input pin
General-purpose I/O port
P015
RDC_B0
BIN1
R/D converter unit0 B-phase output pin
Up/Down counter ch.1 BIN input pin
General-purpose I/O port
P016
28
29
24
25
RDC_A0
AIN1
E
L
R/D converter unit0 A-phase output pin
Up/Down counter ch.1 AIN input pin
R/D converter unit0 Aref output pin(RVCC0/2)
AREF20
16
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
Functions
Type
208 pin 176 pin
30
31
32
33
34
35
36
37
26
27
28
29
30
31
32
33
SIN_IN0
COS_IN0
SIN_OUT0
SIN_MINUS0
SIN_PLUS0
COS_PLUS0
COS_MINUS0
COS_OUT0
RDC_ACT0
P026
K
K
L
R/D converter unit0 SIN coil earth leakage detection input pin
R/D converter unit0 COS coil earth leakage detection input pin
R/D converter unit0 SIN output pin
R/D converter unit0 SIN input pin-
R/D converter unit0 SIN input pin+
R/D converter unit0 COS input pin+
R/D converter unit0 COS input pin-
R/D converter unit0 COS output pin
R/D converter unit0 operation status output pin
General-purpose I/O port
K
K
K
K
L
43
39
E
44
45
46
40
41
42
MAG_MINUS0
MAG_PLUS0
MAG_OUT0
P430
K
K
L
R/D converter unit0 excitation external input pin-
R/D converter unit0 excitation external input pin+
R/D converter unit0 excitation signal output pin
General-purpose I/O port
47
43
E
ERDS0
P030
Error detection output pin ch.0
General-purpose I/O port
48
-
DTTI2
E
Waveform generator output stop signal input pin 2
16-bit free-run timer ch.12 external clock input pin
General-purpose I/O port
FRCK12
P031
49
50
51
55
-
-
-
-
RTO12
E
E
E
E
Waveform generator ch.12 output pin
16-bit free-run timer ch.13 external clock input pin
General-purpose I/O port
FRCK13
P309
RTO13
Waveform generator ch.13 output pin
16-bit free-run timer ch.14 external clock input pin
General-purpose I/O port
FRCK14
P310
RTO14
Waveform generator ch.14 output pin
16-bit free-run timer ch.15 external clock input pin
General-purpose I/O port
FRCK15
P311
RTO15
Waveform generator ch.15 output pin
16-bit free-run timer ch.16 external clock input pin
General-purpose I/O port
FRCK16
P312
56
57
58
-
-
RTO16
E
E
E
Waveform generator ch.16 output pin
16-bit free-run timer ch.17 external clock input pin
General-purpose I/O port
FRCK17
P313
RTO17
Waveform generator ch.17 output pin
General-purpose I/O port
P314
46
DTTI3
Waveform generator output stop signal input pin 3
Base timer ch.0 TIOA output pin
TIOA0
P315
General-purpose I/O port
59
60
61
62
47
48
49
50
RTO18
E
E
E
E
Waveform generator ch.18 output pin
Base timer ch.0 TIOB input pin
TIOB0
P316
General-purpose I/O port
RTO19
Waveform generator ch.19 output pin
Base timer ch.1 TIOA I/O pin
TIOA1
P317
General-purpose I/O port
RTO20
Waveform generator ch.20 output pin
Base timer ch.1 TIOB input pin
TIOB1
P318
General-purpose I/O port
RTO21
Waveform generator ch.21 output pin
Base timer ch.2 TIOA output pin
TIOA2
May 15, 2015, MB9D560_DS708-00001-3v0-E
17
D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
P319
Functions
208 pin 176 pin
General-purpose I/O port
63
64
51
52
RTO22
TIOB2
P320
RTO23
TIOA3
P321
SIN0
INT3
TIOB3
P322
SOT0
P323
SCK0
P324
STOPWT
IN6
E
E
Waveform generator ch.22 output pin
Base timer ch.2 TIOB input pin
General-purpose I/O port
Waveform generator ch.23 output pin
Base timer ch.3 TIOA I/O pin
General-purpose I/O port
Multi-function serial interface ch.0 serial data input pin
INT3 external interrupt input pin
65
53
E
Base timer ch.3 TIOB input pin
General-purpose I/O port
66
67
54
55
E
E
Multi-function serial interface ch.0 serial data output pin
General-purpose I/O port
Multi-function serial interface ch.0 clock I/O pin
General-purpose I/O port
FlexRay stop watch input pin
70
71
72
73
74
58
59
60
61
62
E
H
H
H
H
16-bit input capture ch.6 external pulse input pin
32-bit input capture ch.0 external pulse input pin
General-purpose I/O port
IN16
P325
RXDA
IN7
FlexRay ch.A data input pin
16-bit input capture ch.7 external pulse input pin
32-bit input capture ch.1 external pulse input pin
General-purpose I/O port
IN17
P326
TXDA
IN8
FlexRay ch.A data output pin
16-bit input capture ch.8 external pulse input pin
32-bit input capture ch.2 external pulse input pin
General-purpose I/O port
IN18
P327
TXENA
IN9
FlexRay ch.A operation enable output pin
16-bit input capture ch.9 external pulse input pin
32-bit input capture ch.3 external pulse input pin
General-purpose I/O port
IN19
P328
RXDB
IN10
FlexRay ch.B data input pin
16-bit input capture ch.10 external pulse input pin
32-bit input capture ch.4 external pulse input pin
General-purpose I/O port
IN20
P329
TXDB
IN11
FlexRay ch.B data output pin
75
76
63
64
H
H
16-bit input capture ch.11 external pulse input pin
32-bit input capture ch.5 external pulse input pin
General-purpose I/O port
IN21
P330
TXENB
IN12
FlexRay ch.B operation enable output pin
16-bit input capture ch.12 external pulse input pin
Non-maskable interrupt input pin
External reset input pin
77
78
79
80
81
82
84
85
86
65
66
67
68
69
70
72
73
74
NMIX
RSTX
MD1
B
B
C
C
Mode pin 1 (with high-voltage control)
Mode pin 0 (with high-voltage control)
Main clock oscillation input pin
MD0
X0
A
X1
Main clock oscillation output pin
TRSTX
TCK
J
J
I
JTAG test reset input
JTAG test clock input
TDO
JTAG test data output
18
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
TDI
Functions
Type
208 pin 176 pin
87
88
89
75
76
77
J
J
J
JTAG test data input
TMS
JTAG test mode status input
System reset input for debugger
General-purpose I/O port
nSRST
P406
90
78
SIN1
E
Multi-function serial interface ch.1 serial data input pin
INT4 external interrupt input pin
General-purpose I/O port
INT4
P407
91
92
79
80
E
E
SOT1
P408
Multi-function serial interface ch.1 serial data output pin
General-purpose I/O port
SCK1
P409
Multi-function serial interface ch.1 clock I/O pin
General-purpose I/O port
93
94
95
96
97
81
82
83
84
85
RX0
E
E
E
E
E
CAN ch.0 reception data input pin
INT0 external interrupt input pin
General-purpose I/O port
INT0
P410
TX0
CAN ch.0 transmission data output pin
General-purpose I/O port
P411
RX1
CAN ch.1 reception data input pin
INT1 external interrupt input pin
General-purpose I/O port
INT1
P412
TX1
CAN ch.1 transmission data output pin
General-purpose I/O port
P413
RX2
CAN ch.2 reception data input pin
INT2 external interrupt input pin
General-purpose I/O port
INT2
P414
98
99
86
-
E
E
E
E
E
TX2
CAN ch.2 transmission data output pin
General-purpose I/O port
P415
TIOA4
P416
Base timer ch.4 TIOA output pin
General-purpose I/O port
100
101
102
-
TIOB4
P417
Base timer ch.4 TIOB input pin
General-purpose I/O port
-
TIOA5
P418
Base timer ch.5 TIOA I/O pin
General-purpose I/O port
-
TIOB5
P419
Base timer ch.5 TIOB input pin
General-purpose I/O port
106
-
SIN2
E
Multi-function serial interface ch.2 serial data input pin
INT5 external interrupt input pin
General-purpose I/O port
INT5
P420
107
108
109
-
-
E
E
E
SOT2
P131
Multi-function serial interface ch.2 serial data output pin
General-purpose I/O port
SCK2
P431
Multi-function serial interface ch.2 clock I/O pin
General-purpose I/O port
90
ERDS1
MAG_OUT1
MAG_PLUS1
MAG_MINUS1
RDC_ACT1
P126
Error detection output pin ch.1
110
111
112
91
92
93
L
K
K
R/D converter unit1excitation signal output pin
R/D converter unit1excitation external input pin+
R/D converter unit1excitation external input pin-
R/D converter unit1 operation status output pin
General-purpose I/O port
113
94
E
119
120
121
100
101
102
COS_OUT1
COS_MINUS1
COS_PLUS1
L
K
K
R/D converter unit1 COS output pin
R/D converter unit1 COS input pin-
R/D converter unit1 COS input pin+
May 15, 2015, MB9D560_DS708-00001-3v0-E
19
D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
Functions
208 pin 176 pin
122
123
124
125
126
127
103
104
105
106
107
108
SIN_PLUS1
SIN_MINUS1
SIN_OUT1
COS_IN1
SIN_IN1
AREF21
P116
K
K
L
R/D converter unit1 SIN input pin+
R/D converter unit1 SIN input pin-
R/D converter unit1 SIN output pin
K
K
L
R/D converter unit1 COS coil earth leakage detection input pin
R/D converter unit1 SIN coil earth leakage detection input pin
R/D converter unit1 Aref output pin(RVCC1/2)
General-purpose I/O port
128
129
130
131
132
133
109
110
111
112
113
114
RDC_A1
AIN3
E
E
E
E
E
E
R/D converter unit1 A phase output pin
Up/Down counter ch.3 AIN input pin
General-purpose I/O port
P115
RDC_B1
BIN3
R/D converter unit1 B phase output pin
Up/Down counter ch.3 BIN input pin
General-purpose I/O port
P114
RDC_Z1
ZIN3
R/D converter unit1 Z phase output pin
Up/Down counter ch.3 ZIN input pin
General-purpose I/O port
P113
RDC_U1
AIN2
R/D converter unit1 U phase output pin
Up/Down counter ch.2 AIN input pin
General-purpose I/O port
P112
RDC_V1
BIN2
R/D converter unit1 V phase output pin
Up/Down counter ch.2 BIN input pin
General-purpose I/O port
P111
RDC_W1
ZIN2
R/D converter unit1 W phase output pin
Up/Down counter ch.2 ZIN input pin
General-purpose I/O port
P110
139
140
141
142
145
146
147
148
149
150
120
121
122
123
124
125
126
127
128
129
F
F
F
F
E
E
E
E
E
E
4AN7
4ch sample-hold A/D converter unit1 analog 7 input pin
General-purpose I/O port
P109
4AN6
4ch sample-hold A/D converter unit1 analog 6 input pin
General-purpose I/O port
P108
4AN5
4ch sample-hold A/D converter unit1 analog 5 input pin
General-purpose I/O port
P107
4AN4
4ch sample-hold A/D converter unit1 analog 4 input pin
General-purpose I/O port
P106
RTO11
P105
Waveform generator ch.11 output pin
General-purpose I/O port
RTO10
P104
Waveform generator ch.10 output pin
General-purpose I/O port
RTO9
Waveform generator ch.9 output pin
General-purpose I/O port
P103
RTO8
Waveform generator ch.8 output pin
General-purpose I/O port
P102
RTO7
Waveform generator ch.7 output pin
General-purpose I/O port
P101
RTO6
Waveform generator ch.6 output pin
General-purpose I/O port
P100
151
130
DTTI1
4ADTG1
E
Waveform generator output stop signal input pin1
4ch sample-hold A/D converter unit1 external trigger input pin
20
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
P421
Functions
Type
208 pin 176 pin
General-purpose I/O port
SIN3
INT6
Multi-function serial interface ch.3 serial data input pin
INT6 external interrupt input pin
16-bit free-run timer ch.8 external clock input pin
General-purpose I/O port
152
153
154
-
-
-
E
FRCK8
P422
SOT3
FRCK9
IN13
Multi -function serial interface ch.3 serial data output pin
16-bit free-run timer ch.9 external clock input pin
16-bit input capture ch.13 external pulse input pin
General-purpose I/O port
E
E
P423
SCK3
FRCK10
IN14
Multi-function serial interface ch.3 clock I/O pin
16-bit free-run timer ch.10 external clock input pin
16-bit input capture ch.14 external pulse input pin
General-purpose I/O port
P425
TIOA8
P426
TIOB8
P427
TIOA9
P428
TIOB9
P429
MONCLK
MM
158
159
160
161
-
-
-
-
E
E
E
E
Base timer ch.8 TIOA output pin
General-purpose I/O port
Base timer ch.8 TIOB input pin
General-purpose I/O port
Base timer ch.9 TIOA I/O pin
General-purpose I/O port
Base timer ch.9 TIOB input pin
General-purpose I/O port
162
134
E
Clock monitor output pin
Clock supervisor main clock error detection output pin
General-purpose I/O port
P200
AN0
163
164
165
166
167
168
169
170
173
174
175
176
177
135
136
137
138
139
140
141
142
145
146
147
148
149
F
F
F
F
F
F
F
F
F
F
F
F
F
A/D converter analog 0 input pin
General-purpose I/O port
P201
AN1
A/D converter analog 1 input pin
General-purpose I/O port
P202
AN2
A/D converter analog 2 input pin
General-purpose I/O port
P203
AN3
A/D converter analog 3 input pin
General-purpose I/O port
P204
AN4
A/D converter analog 4 input pin
General-purpose I/O port
P205
AN5
A/D converter analog 5 input pin
General-purpose I/O port
P206
AN6
A/D converter analog 6 input pin
General-purpose I/O port
P207
AN7
A/D converter analog 7 input pin
General-purpose I/O port
P208
AN8
A/D converter analog 8 input pin
General-purpose I/O port
P209
AN9
A/D converter analog 9 input pin
General-purpose I/O port
P210
AN10
P211
AN11
P212
AN12
A/D converter analog 10 input pin
General-purpose I/O port
A/D converter analog 11 input pin
General-purpose I/O port
A/D converter analog 12 input pin
May 15, 2015, MB9D560_DS708-00001-3v0-E
21
D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
P213
Functions
208 pin 176 pin
General-purpose I/O port
178
179
180
185
186
187
188
150
151
152
157
158
159
160
F
F
F
F
F
F
F
AN13
P214
AN14
P215
AN15
P216
AN16
P217
AN17
P218
AN18
P219
AN19
P220
AN20
TIOA6
P221
AN21
TIOB6
P222
AN22
TIOA7
P223
AN23
TIOB7
P224
AN24
P225
AN25
SIN4
INT7
A/D converter analog 13 input pin
General-purpose I/O port
A/D converter analog 14 input pin
General-purpose I/O port
A/D converter analog 15 input pin
General-purpose I/O port
A/D converter analog 16 input pin
General-purpose I/O port
A/D converter analog 17 input pin
General-purpose I/O port
A/D converter analog 18 input pin
General-purpose I/O port
A/D converter analog 19 input pin
General-purpose I/O port
189
190
191
161
162
163
F
F
F
A/D converter analog 20 input pin
Base timer ch.6 TIOA output pin
General-purpose I/O port
A/D converter analog 21 input pin
Base timer ch.6 TIOB input pin
General-purpose I/O port
A/D converter analog 22 input pin
Base timer ch.7 TIOA I/O pin
General-purpose I/O port
192
195
164
167
F
F
A/D converter analog 23 input pin
Base timer ch.7 TIOB input pin
General-purpose I/O port
A/D converter Analog 24 input pin
General-purpose I/O port
A/D converter analog 25 input pin
196
197
198
199
200
168
169
170
171
172
F
F
F
F
F
Multi-function serial interface ch.4 serial data input pin
INT7 external interrupt input pin
P226
AN26
SOT4
IN0
General-purpose I/O port
A/D converter analog 26 input pin
Multi-function serial interface ch.4 serial data output pin
16-bit input capture ch.0 external pulse input pin
General-purpose I/O port
P227
AN27
SCK4
IN1
A/D converter analog 27 input pin
Multi-function serial interface ch.4 clock I/O pin
16-bit input capture ch.1 external pulse input pin
General-purpose I/O port
P228
AN28
SCS40
IN2
A/D converter analog 28 input pin
Multi-function serial interface ch.4 serial chip select 0 I/O pin
16-bit input capture ch.2 external pulse input pin
General-purpose I/O port
P229
AN29
SCS41
IN3
A/D converter analog 29 input pin
Multi-function serial interface ch.4 serial chip select 1 I/O pin
16-bit input capture ch.3 external pulse input pin
22
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
P230
Functions
Type
208 pin 176 pin
General-purpose I/O port
AN30
A/D converter analog 30 input pin
201
202
173
174
F
SCS42
IN4
Multi-function serial interface ch.4 serial chip select 2 I/O pin
16-bit input capture ch.4 external pulse input pin
General-purpose I/O port
P231
AN31
A/D converter analog 31 input pin
F
SCS43
IN5
Multi-function serial interface ch.4 serial chip select 3 I/O pin
16-bit input capture ch.5 external pulse input pin
General-purpose I/O port
P300
203
204
175
-
E
E
ADTG0
P301
A/D converter external trigger input pin
General-purpose I/O port
TIOA10
FRCK4
P302
Base timer ch.10 TIOA output pin
16-bit free-run timer ch.4 external clock input pin
General-purpose I/O port
205
206
207
-
-
-
TIOB10
FRCK5
P303
E
E
E
Base timer ch.10 TIOB input pin
16-bit free-run timer ch.5 external clock input pin
General-purpose I/O port
TIOA11
FRCK6
P304
Base timer ch.11 TIOA I/O pin
16-bit free-run timer ch.6 external clock input pin
General-purpose I/O port
TIOB11
FRCK7
AVRH0
AVRL0
AVR0
Base timer ch.11 TIOB input pin
16-bit free-run timer ch.7 external clock input pin
4ch sample-hold A/D converter unit0 upper limit reference voltage
4ch sample-hold A/D converter unit0 lower limit reference voltage
4ch sample-hold A/D converter unit0 reference voltage
4ch sample-hold A/D converter unit0 analog GND
4ch sample-hold A/D converter unit0 analog power supply
4ch sample-hold A/D converter unit1 analog power supply
4ch sample-hold A/D converter unit1 analog GND
4ch sample-hold A/D converter unit1 reference voltage
4ch sample-hold A/D converter unit1 lower limit reference voltage
4ch sample-hold A/D converter unit1 upper limit reference voltage
R/D converter unit0 upper limit reference voltage
R/D converter unit0 lower limit reference voltage
R/D converter unit0 reference voltage
18
19
14
15
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
20
16
21
17
AVSS0
AVCC0
AVCC1
AVSS1
AVR1
22
18
134
135
136
137
138
38
115
116
117
118
119
34
AVRL1
AVRH1
RVRH0
RVRL0
RVR0
39
35
40
36
41
37
RVSS0
RVCC0
RVCC1
RVSS1
RVR1
R/D converter unit0 analog GND
42
38
R/D converter unit0 analog power supply
R/D converter unit1 analog power supply
R/D converter unit1 analog GND
114
115
116
117
118
181
182
183
184
95
96
97
R/D converter unit1 reference voltage
98
RVRL1
RVRH1
AVCC2
AVSS2
AVRL2
AVRH2
R/D converter unit1 lower limit reference voltage
R/D converter unit1 upper limit reference voltage
A/D converter analog power supply
99
153
154
155
156
A/D converter analog GND
A/D converter lower limit reference voltage
A/D converter upper limit reference voltage
May 15, 2015, MB9D560_DS708-00001-3v0-E
23
D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
Functions
208 pin 176 pin
2
2
54
56
68
87
103
131
155
144
172
165
193
VCC12
-
1.2V power supply
12
52
105
144
157
208
1
44
89
VCC5
-
5.0V power supply
133
176
13
1
53
45
69
57
83
71
VSS
-
GND
104
143
156
171
194
88
132
143
166
24
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Part Number without RDC
Pin Number
I/O Circuit
Type
Pin Name
Functions
208pin 176pin
P305
General-purpose I/O port
3
4
-
-
E
E
FRCK0
P306
FRCK1
P000
DTTI0
4ADTG0
P001
RTO0
P002
RTO1
P003
RTO2
P004
RTO3
P005
RTO4
P006
RTO5
P007
4AN0
P008
4AN1
P009
4AN2
P010
4AN3
P011
ZIN0
16-bit free-run timer ch.0 external clock input pin
General-purpose I/O port
16-bit free-run timer ch.1 external clock input pin
General-purpose I/O port
5
3
E
Waveform generator output stop signal input pin 0
4ch sample-hold A/D converter unit0 external trigger input pin
General-purpose I/O port
6
4
5
E
E
E
E
E
E
F
F
F
F
E
E
E
E
E
E
Waveform generator ch.0 output pin
General-purpose I/O port
7
Waveform generator ch.1 output pin
General-purpose I/O port
8
6
Waveform generator ch.2 output pin
General-purpose I/O port
9
7
Waveform generator ch.3 output pin
General-purpose I/O port
10
11
14
15
16
17
23
24
25
26
27
28
8
Waveform generator ch.4 output pin
General-purpose I/O port
9
Waveform generator ch.5 output pin
General-purpose I/O port
10
11
12
13
19
20
21
22
23
24
4ch sample-hold A/D converter unit0 analog 0 input pin
General-purpose I/O port
4ch sample-hold A/D converter unit0 analog 1 input pin
General-purpose I/O port
4ch sample-hold A/D converter unit0 analog 2 input pin
General-purpose I/O port
4ch sample-hold A/D converter unit0 analog 3 input pin
General-purpose I/O port
Up/Down counter ch.0 ZIN input pin
General-purpose I/O port
P012
BIN0
P013
AIN0
P014
ZIN1
Up/Down counter ch.0 BIN input pin
General-purpose I/O port
Up/Down counter ch.0 AIN input pin
General-purpose I/O port
Up/Down counter ch.1 ZIN input pin
General-purpose I/O port
P015
BIN1
P016
AIN1
P017
P018
P019
P020
P021
P022
P023
P024
P025
P026
Up/Down counter ch.1 BIN input pin
General-purpose I/O port
Up/Down counter ch.1 AIN input pin
General-purpose I/O port
29
30
31
32
33
34
35
36
37
43
25
26
27
28
29
30
31
32
33
39
E
E
E
E
E
E
E
E
E
E
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
May 15, 2015, MB9D560_DS708-00001-3v0-E
25
D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
P027
Functions
208pin 176pin
44
45
40
41
E
E
General-purpose I/O port
P028
General-purpose I/O port
General-purpose I/O port
P029
46
47
42
43
G
E
DAOUT0
P430
D/A converter ch.0 analog output pin
General-purpose I/O port
ERDS0
P030
Error detection output pin ch.0
General-purpose I/O port
48
49
50
51
55
-
-
-
-
-
DTTI2
FRCK12
P031
E
E
E
E
E
Waveform generator output stop signal input pin 2
16-bit free-run timer ch.12 external clock input pin
General-purpose I/O port
RTO12
FRCK13
P309
Waveform generator ch.12 output pin
16-bit free-run timer ch.13 external clock input pin
General-purpose I/O port
RTO13
FRCK14
P310
Waveform generator ch.13 output pin
16-bit free-run timer ch.14 external clock input pin
General-purpose I/O port
RTO14
FRCK15
P311
Waveform generator ch.14 output pin
16-bit free-run timer ch.15 external clock input pin
General-purpose I/O port
RTO15
FRCK16
P312
Waveform generator ch.15 output pin
16-bit free-run timer ch.16 external clock input pin
General-purpose I/O port
56
57
58
-
-
RTO16
FRCK17
P313
E
E
E
Waveform generator ch.16 output pin
16-bit free-run timer ch.17 external clock input pin
General-purpose I/O port
RTO17
P314
Waveform generator ch.17 output pin
General-purpose I/O port
46
DTTI3
TIOA0
P315
Waveform generator output stop signal input pin 3
Base timer ch.0 TIOA output pin
General-purpose I/O port
59
60
61
62
63
64
47
48
49
50
51
52
RTO18
TIOB0
P316
E
E
E
E
E
E
Waveform generator ch.18 output pin
Base timer ch.0 TIOB input pin
General-purpose I/O port
RTO19
TIOA1
P317
Waveform generator ch.19 output pin
Base timer ch.1 TIOA I/O pin
General-purpose I/O port
RTO20
TIOB1
P318
Waveform generator ch.20 output pin
Base timer ch.1 TIOB input pin
General-purpose I/O port
RTO21
TIOA2
P319
Waveform generator ch.21 output pin
Base timer ch.2 TIOA output pin
General-purpose I/O port
RTO22
TIOB2
P320
Waveform generator ch.22 output pin
Base timer ch.2 TIOB input pin
General-purpose I/O port
RTO23
TIOA3
Waveform generator ch.23 output pin
Base timer ch.3 TIOA I/O pin
26
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
P321
Functions
Type
208pin 176pin
General-purpose I/O port
SIN0
INT3
TIOB3
P322
SOT0
P323
SCK0
P324
STOPWT
IN6
Multi-function serial interface ch.0 serial data input pin
INT3 external interrupt input pin
65
53
E
Base timer ch.3 TIOB input pin
General-purpose I/O port
66
67
54
55
E
E
Multi-function serial interface ch.0 serial data output pin
General-purpose I/O port
Multi-function serial interface ch.0 clock I/O pin
General-purpose I/O port
FlexRay stop watch input pin
70
71
72
73
74
58
59
60
61
62
E
H
H
H
H
16-bit input capture ch.6 external pulse input pin
32-bit input capture ch.0 external pulse input pin
General-purpose I/O port
IN16
P325
RXDA
IN7
FlexRay ch.A data input pin
16-bit input capture ch.7 external pulse input pin
32-bit input capture ch.1 external pulse input pin
General-purpose I/O port
IN17
P326
TXDA
IN8
FlexRay ch.A data output pin
16-bit input capture ch.8 external pulse input pin
32-bit input capture ch.2 external pulse input pin
General-purpose I/O port
IN18
P327
TXENA
IN9
FlexRay ch.A operation enable output pin
16-bit input capture ch.9 external pulse input pin
32-bit input capture ch.3 external pulse input pin
General-purpose I/O port
IN19
P328
RXDB
IN10
IN20
P329
TXDB
IN11
FlexRay ch.B data input pin
16-bit input capture ch.10 external pulse input pin
32-bit input capture ch.4 external pulse input pin
General-purpose I/O port
FlexRay ch.B data output pin
75
76
63
64
H
H
16-bit input capture ch.11 external pulse input pin
32-bit input capture ch.5 external pulse input pin
General-purpose I/O port
IN21
P330
TXENB
IN12
NMIX
RSTX
MD1
FlexRay ch.B operation enable output pin
16-bit input capture ch.12 external pulse input pin
Non-maskable interrupt input pin
External reset input pin
77
78
79
80
81
82
84
85
86
87
88
89
65
66
67
68
69
70
72
73
74
75
76
77
B
B
C
C
Mode pin 1 (with high-voltage control)
Mode pin 0 (with high-voltage control)
Main clock oscillation input pin
MD0
X0
A
X1
Main clock oscillation output pin
TRSTX
TCK
J
J
I
JTAG test reset input
JTAG test clock input
TDO
TDI
JTAG test data output
J
J
J
JTAG test data input
TMS
nSRST
P406
SIN1
INT4
JTAG test mode status input
System reset input for debugger
General-purpose I/O port
90
78
E
Multi-function serial interface ch.1 serial data input pin
INT4 external interrupt input pin
May 15, 2015, MB9D560_DS708-00001-3v0-E
27
D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
P407
Functions
208pin 176pin
General-purpose I/O port
91
92
79
80
E
E
SOT1
P408
SCK1
P409
RX0
Multi-function serial interface ch.1 serial data output pin
General-purpose I/O port
Multi-function serial interface ch.1 clock I/O pin
General-purpose I/O port
93
94
95
96
97
81
82
83
84
85
E
E
E
E
E
CAN ch.0 reception data input pin
INT0 external interrupt input pin
General-purpose I/O port
INT0
P410
TX0
CAN ch.0 transmission data output pin
General-purpose I/O port
P411
RX1
CAN ch.1 reception data input pin
INT1 external interrupt input pin
General-purpose I/O port
INT1
P412
TX1
CAN ch.1 transmission data output pin
General-purpose I/O port
P413
RX2
CAN ch.2 reception data input pin
INT2 external interrupt input pin
General-purpose I/O port
INT2
P414
TX2
98
99
86
-
E
E
E
E
E
CAN ch.2 transmission data output pin
General-purpose I/O port
P415
TIOA4
P416
TIOB4
P417
TIOA5
P418
TIOB5
P419
SIN2
INT5
P420
SOT2
P131
SCK2
P431
ERDS1
P129
DAOUT1
P128
P127
P126
P125
P124
P123
P122
P121
P120
P119
P118
P117
Base timer ch.4 TIOA output pin
General-purpose I/O port
100
101
102
-
Base timer ch.4 TIOB input pin
General-purpose I/O port
-
Base timer ch.5 TIOA I/O pin
General-purpose I/O port
-
Base timer ch.5 TIOB input pin
General-purpose I/O port
106
-
E
Multi-function serial interface ch.2 serial data input pin
INT5 external interrupt input pin
General-purpose I/O port
107
108
109
110
-
E
E
E
G
Multi-function serial interface ch.2 serial data output pin
General-purpose I/O port
-
Multi-function serial interface ch.2 clock I/O pin
General-purpose I/O port
90
91
Error detection output pin ch.1
General-purpose I/O port
D/A converter ch.1 analog output pin
General-purpose I/O port
111
112
113
119
120
121
122
123
124
125
126
127
92
E
E
E
E
E
E
E
E
E
E
E
E
93
General-purpose I/O port
94
General-purpose I/O port
100
101
102
103
104
105
106
107
108
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
General-purpose I/O port
28
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
P116
Functions
Type
208pin 176pin
General-purpose I/O port
128
129
130
131
132
133
139
140
141
142
145
146
147
148
149
150
109
110
111
112
113
114
120
121
122
123
124
125
126
127
128
129
E
AIN3
Up/Down counter ch.3 AIN input pin
General-purpose I/O port
P115
E
E
E
E
E
F
F
F
F
E
E
E
E
E
E
BIN3
Up/Down counter ch.3 BIN input pin
General-purpose I/O port
P114
ZIN3
Up/Down counter ch.3 ZIN input pin
General-purpose I/O port
P113
AIN2
Up/Down counter ch.2 AIN input pin
General-purpose I/O port
P112
BIN2
Up/Down counter ch.2 BIN input pin
General-purpose I/O port
P111
ZIN2
Up/Down counter ch.2 ZIN input pin
General-purpose I/O port
P110
4AN7
P109
4AN6
P108
4AN5
P107
4AN4
P106
RTO11
P105
RTO10
P104
RTO9
P103
RTO8
P102
RTO7
P101
RTO6
P100
DTTI1
4ADTG1
P421
SIN3
4ch sample-hold A/D converter unit1 analog 7 input pin
General-purpose I/O port
4ch sample-hold A/D converter unit1 analog 6 input pin
General-purpose I/O port
4ch sample-hold A/D converter unit1 analog 5 input pin
General-purpose I/O port
4ch sample-hold A/D converter unit1 analog 4 input pin
General-purpose I/O port
Waveform generator ch.11 output pin
General-purpose I/O port
Waveform generator ch.10 output pin
General-purpose I/O port
Waveform generator ch.9 output pin
General-purpose I/O port
Waveform generator ch.8 output pin
General-purpose I/O port
Waveform generator ch.7 output pin
General-purpose I/O port
Waveform generator ch.6 output pin
General-purpose I/O port
151
152
130
E
E
Waveform generator output stop signal input pin 1
4ch sample-hold A/D converter unit1 external trigger input pin
General-purpose I/O port
Multi-function serial interface ch.3 serial data input pin
INT6 external interrupt input pin
-
INT6
FRCK8
P422
SOT3
FRCK9
IN13
16-bit free-run timer ch.8 external clock input pin
General-purpose I/O port
Multi -function serial interface ch.3 serial data output pin
16-bit free-run timer ch.9 external clock input pin
16-bit input capture ch.13 external pulse input pin
General-purpose I/O port
153
-
E
P423
SCK3
FRCK10
IN14
Multi-function serial interface ch.3 clock I/O pin
16-bit free-run timer ch.10 external clock input pin
16-bit input capture ch.14 external pulse input pin
General-purpose I/O port
154
158
-
-
E
E
P425
TIOA8
Base timer ch.8 TIOA output pin
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
P426
Functions
208pin 176pin
General-purpose I/O port
159
160
161
-
-
-
E
E
E
TIOB8
P427
TIOA9
P428
TIOB9
P429
MONCLK
MM
Base timer ch.8 TIOB input pin
General-purpose I/O port
Base timer ch.9 TIOA I/O pin
General-purpose I/O port
Base timer ch.9 TIOB input pin
General-purpose I/O port
Clock monitor output pin
162
134
E
Clock supervisor main clock error detection output pin
General-purpose I/O port
P200
AN0
163
164
165
166
167
168
169
170
173
174
175
176
177
178
179
180
185
186
187
188
135
136
137
138
139
140
141
142
145
146
147
148
149
150
151
152
157
158
159
160
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
A/D converter analog 0 input pin
General-purpose I/O port
P201
AN1
A/D converter analog 1 input pin
General-purpose I/O port
P202
AN2
A/D converter analog 2 input pin
General-purpose I/O port
P203
AN3
A/D converter analog 3 input pin
General-purpose I/O port
P204
AN4
A/D converter analog 4 input pin
General-purpose I/O port
P205
AN5
A/D converter analog 5 input pin
General-purpose I/O port
P206
AN6
A/D converter analog 6 input pin
General-purpose I/O port
P207
AN7
A/D converter analog 7 input pin
General-purpose I/O port
P208
AN8
A/D converter analog 8 input pin
General-purpose I/O port
P209
AN9
A/D converter analog 9 input pin
General-purpose I/O port
P210
AN10
P211
AN11
P212
AN12
P213
AN13
P214
AN14
P215
AN15
P216
AN16
P217
AN17
P218
AN18
P219
AN19
A/D converter analog 10 input pin
General-purpose I/O port
A/D converter analog 11 input pin
General-purpose I/O port
A/D converter analog 12 input pin
General-purpose I/O port
A/D converter analog 13 input pin
General-purpose I/O port
A/D converter analog 14 input pin
General-purpose I/O port
A/D converter analog 15 input pin
General-purpose I/O port
A/D converter analog 16 input pin
General-purpose I/O port
A/D converter analog 17 input pin
General-purpose I/O port
A/D converter analog 18 input pin
General-purpose I/O port
A/D converter analog 19 input pin
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
Pin Name
P220
Functions
Type
208pin 176pin
General-purpose I/O port
189
190
191
161
162
163
AN20
TIOA6
P221
AN21
TIOB6
P222
AN22
TIOA7
P223
AN23
TIOB7
P224
AN24
P225
AN25
SIN4
F
A/D converter analog 20 input pin
Base timer ch.6 TIOA output pin
General-purpose I/O port
F
F
A/D converter analog 21 input pin
Base timer ch.6 TIOB input pin
General-purpose I/O port
A/D converter analog 22 input pin
Base timer ch.7 TIOA I/O pin
General-purpose I/O port
192
195
164
167
F
F
A/D converter analog 23 input pin
Base timer ch.7 TIOB input pin
General-purpose I/O port
A/D converter analog 24 input pin
General-purpose I/O port
A/D converter analog 25 input pin
196
197
198
199
200
201
202
168
169
170
171
172
173
174
F
F
F
F
F
F
F
Multi-function serial interface ch.4 serial data input pin
INT7 external interrupt input pin
INT7
P226
AN26
SOT4
IN0
General-purpose I/O port
A/D converter analog 26 input pin
Multi-function serial interface ch.4 serial data output pin
16-bit input capture ch.0 external pulse input pin
General-purpose I/O port
P227
AN27
SCK4
IN1
A/D converter analog 27 input pin
Multi-function serial interface ch.4 clock I/O pin
16-bit input capture ch.1 external pulse input pin
General-purpose I/O port
P228
AN28
SCS40
IN2
A/D converter analog 28 input pin
Multi-function serial interface ch.4 serial chip select 0 I/O pin
16-bit input capture ch.2 external pulse input pin
General-purpose I/O port
P229
AN29
SCS41
IN3
A/D converter analog 29 input pin
Multi-function serial interface ch.4 serial chip select 1 I/O pin
16-bit input capture ch.3 external pulse input pin
General-purpose I/O port
P230
AN30
SCS42
IN4
A/D converter analog 30 input pin
Multi-function serial interface ch.4 serial chip select 2 I/O pin
16-bit input capture ch.4 external pulse input pin
General-purpose I/O port
P231
AN31
SCS43
IN5
A/D converter analog 31 input pin
Multi-function serial interface ch.4 serial chip select 3 I/O pin
16-bit input capture ch.5 external pulse input pin
General-purpose I/O port
P300
ADTG0
P301
TIOA10
FRCK4
P302
TIOB10
FRCK5
203
204
175
-
E
E
A/D converter external trigger input pin
General-purpose I/O port
Base timer ch.10 TIOA output pin
16-bit free-run timer ch.4 external clock input pin
General-purpose I/O port
205
-
E
Base timer ch.10 TIOB input pin
16-bit free-run timer ch.5 external clock input pin
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D a t a S h e e t
Pin Number
I/O Circuit
Type
Pin Name
P303
Functions
208pin 176pin
General-purpose I/O port
Base timer ch.11 TIOA I/O pin
206
207
-
-
TIOA11
FRCK6
P304
E
E
16-bit free-run timer ch.6 external clock input pin
General-purpose I/O port
TIOB11
FRCK7
AVRH0
AVRL0
AVR0
Base timer ch.11 TIOB input pin
16-bit free-run timer ch.7 external clock input pin
18
19
14
15
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
4ch sample-hold A/D converter unit0 upper limit reference voltage
4ch sample-hold A/D converter unit0 lower limit reference voltage
20
16
4ch sample-hold A/D converter unit0 reference voltage
21
17
AVSS0
AVCC0
AVCC1
AVSS1
AVR1
4ch sample-hold A/D converter unit0 analog GND
22
18
4ch sample-hold A/D converter unit0 analog power supply
134
135
136
137
138
38
115
116
117
118
119
34
4ch sample-hold A/D converter unit1 analog power supply
4ch sample-hold A/D converter unit1 analog GND
4ch sample-hold A/D converter unit1 reference voltage
AVRL1
AVRH1
RVRH0
RVRL0
RVR0
4ch sample-hold A/D converter unit1 lower limit reference voltage
4ch sample-hold A/D converter unit1 upper limit reference voltage
*1
39
35
*2
40
36
*2
41
37
RVSS0
RVCC0
RVCC1
RVSS1
RVR1
*2
42
38
*1
114
115
116
117
118
181
182
183
184
2
95
*1
96
*2
97
*2
98
RVRL1
RVRH1
AVCC2
AVSS2
AVRL2
AVRH2
*2
99
*1
153
154
155
156
A/D converter analog power supply
A/D converter analog GND
A/D converter lower limit reference voltage
A/D converter upper limit reference voltage
2
54
56
68
87
103
155
172
193
12
VCC12
-
1.2V power supply
131
144
165
52
44
89
105
144
157
208
VCC5
-
5.0V power supply
133
176
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Circuit
Pin Number
208pin 176pin
1
Pin Name
Functions
Type
13
53
1
45
69
57
83
71
VSS
-
GND
104
143
156
171
194
88
132
143
166
*1: The part number without RDC does not use this pin. Connect it with the VCC5 pin.
*2: The part number without RDC does not use this pin. Connect it with the VSS pin.
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
6. I/O Circuit Type
Type
Circuit
Remarks
X1
Clock input
A
−
Oscillation feedback resistor: Approx. 1 MΩ
X0
Standby control signal
Pull-up resistor
−
−
CMOS hysteresis input
B
With 50 kΩ pull-up resistor
CMOS hysteresis input
Mode input
N-ch
High withstand voltage mode input
High withstand voltage control
N-ch
−
−
Schmitt input
C
With high withstand voltage control
N-ch
N-ch
P-ch
N-ch
−
CMOS level output
Digital output
D
IOH=-1/-2 mA, IOL=1/2 mA
Pull-up control
P-ch
P-ch
N-ch
Digital output
−
−
General-purpose I/O port
CMOS level output
I
OH=-1/-2 mA, IOL=1/2 mA
E
−
−
−
With 50 kΩ pull-up resistor
CMOS hysteresis input (0.7Vcc/0.3Vcc)
Automotive input (0.8Vcc/0.5Vcc)
R
CMOS hysteresis input
Automotive input
Standby control
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Type
Circuit
Remarks
Pull-up control
P-ch
P-ch
N-ch
−
−
With Analog input, General-purpose I/O port
CMOS level output
Digital output
IOH=-1/-2 mA, IOL=1/2 mA
−
−
With 50 kΩ pull-up resistor
CMOS hysteresis input (0.7Vcc/0.3Vcc)
During standby, the input value retains the
previous value.
F
R
CMOS hysteresis input
−
Automotive input (0.8Vcc/0.5Vcc)
During standby, the input value retains the
previous value.
Automotive input
Standby control
Analog input
Pull-up control
P-ch
P-ch
N-ch
−
−
With Analog output , General-purpose I/O
Digital output
port
CMOS level output
IOH=-1/-2 mA, IOL=1/2 mA
−
−
With 50 kΩ pull-up resistor
CMOS hysteresis input (0.7Vcc/0.3Vcc)
During standby, the input value retains the
previous value.
G
R
CMOS hysteresis input
Automotive input
−
Automotive input (0.8Vcc/0.5Vcc)
During standby, the input value retains the
previous value.
Standby control
Analog output
Pull-up control
−
−
General-purpose I/O port
CMOS level output
P-ch
P-ch
N-ch
Digital output
IOH=-1/-2/-4 mA, IOL=1/2/4 mA
−
−
With 50 kΩ pull-up resistor
FlexRay input (0.7Vcc/0.3Vcc)
During standby, the input value retains the
previous value.
H
R
−
Automotive input (0.8Vcc/0.5Vcc)
During standby, the input value retains the
previous value.
FlexRay input
Automotive input
Standby control
May 15, 2015, MB9D560_DS708-00001-3v0-E
35
D a t a S h e e t
Type
Circuit
Remarks
P-ch
N-ch
−
CMOS level output
OH=-5 mA, IOL=5 mA
Digital output
I
I
TTL hysteresis input
Analog input
−
−
TTL hysteresis input (2V/0.8V)
Analog input
J
K
Analog output
−
Analog output
L
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
7. Handling Precautions
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your Spansion semiconductor devices.
7.1 Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature,
etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.
Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the
device's electrical characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these
ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data
sheet. Users considering application outside the listed conditions are advised to contact their sales
representative beforehand.
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power
supply and input/output functions.
(1) Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause
deterioration within the device, and in extreme cases leads to permanent damage of the device.
Try to prevent such overvoltage or over-current conditions at the design stage.
(2) Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can
cause large current flows. Such conditions if present for extended periods of time can damage
the device.
Therefore, avoid this type of connection.
(3) Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of
operation. Such pins should be connected through an appropriate resistance to a power supply
pin or ground pin.
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When
subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be
formed, causing large current levels in excess of several hundred mA to flow continuously at the power
supply pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the
following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should
include attention to abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards
in the design of products.
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage
or loss from such failures by incorporating safety design measures into your facility and equipment such as
redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
Precautions Related to Usage of Devices
Spansion semiconductor devices are intended for use in standard applications (computers, office
automation and other office equipment, industrial, communications, and measurement equipment, personal
or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal
operation may directly affect human lives or cause physical injury or property damage, or where extremely
high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor
repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with
sales representatives before such use. The company will not be responsible for damages arising from such
use without prior approval.
7.2 Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat
resistance during soldering, you should only mount under Spansion’s recommended conditions. For detailed
information about mount conditions, contact your sales representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board
and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering
process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage
temperature. Mounting processes should conform to Spansion recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can
lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment
of socket contacts and IC leads be verified before mounting.
38
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads
are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results
in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has
established a ranking of mounting conditions for each product. Users are advised to mount packages in
accordance with Spansion ranking of recommended conditions.
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions
will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed
moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To
prevent, do the following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the
product.
Store products in locations where temperature changes are slight.
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and
at temperatures between 5 ˚C and 30 ˚C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
(3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant
aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum
laminate bags for storage.
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion
recommended conditions for baking.
Condition: 125 ˚C/24 h
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take
the following precautions:
(1) Maintain relative humidity in the working environment between 40% and 70%.
Use of an apparatus for ion generation may be needed to remove electricity.
(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high
resistance (on the level of 1 MΩ).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to
minimize shock loads is recommended.
(4) Ground all fixtures and instruments, or protect with anti-static measures.
(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
assemblies.
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
7.3 Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
(1) Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If
high humidity levels are anticipated, consider anti-humidity processing.
(2) Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause
abnormal operation. In such cases, use anti-static measures or processing to prevent
discharges.
(3) Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will
adversely affect the device. If you use devices in such conditions, consider ways to prevent such
exposure or to protect the devices.
(4) Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic
radiation. Users should provide shielding as appropriate.
(5) Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be used near
combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic
gases.
Customers considering the use of Spansion products in other special environmental conditions should
consult with sales representatives.
Please check the latest handling precautions at the following URL.
http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
8. Handling Devices
For Latch-up Prevention
If a voltage higher than VCC5 or VCC12, or a voltage lower than VSS is applied to an I/O pin, or if a voltage
exceeding the ratings is applied between VCC5 to VSS and VCC12 to VSS pins, a latch-up may occur in
CMOS IC. If the latch-up occurs, the power supply current increases excessively and device elements may
be damaged by heat. Take care to prevent any voltage from exceeding the maximum ratings in device
application.
Also, the analog power supplies (AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, RVCC0, RVCC1,
RVRH0, RVEH1) and analog input must not exceed the digital power supply (VCC5) when the power supply
to the analog system is turned on or off.
In the correct power-on sequence, turn on the digital power supply voltage (VCC5, VCC12) and analog
power supply voltages (AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, RVCC0, RVCC1, RVRH0,
RVRH1) simultaneously. Alternatively, turn on the digital power supply voltage (VCC5) first, and then turn on
the analog power supplies (AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, RVCC0, RVCC1,
RVRH0, RVRH1).
Treatment of Unused Pins
If unused input pins are left open, they may cause a permanent damage to the device due to device
malfunction or latch-up. Connect a 2 kΩ or higher resistor to each of unused input pins for pull-up or
pull-down processing.
Also, if I/O pins are not used, they must be set to the output state for releasing or they must be set to the
input state and treated in the same way as for the input pins.
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
Power Supply Pins
The device is designed to ensure that if the device contains multiple VCC5, VCC12 and VSS pins, the pins
that should be at the same potential are interconnected to prevent latch-up or other malfunctions.
Further, connect these pins to an external power supply or ground to reduce unwanted radiation, prevent
strobe signals from malfunctioning due to a raised ground level, and fulfill the total output current standard,
etc. As shown below, all VSS power supply pins must be treated in the similar way. If multiple VCC5 or
VCC12 or VSS systems are connected, the device cannot operate correctly even within the guaranteed
operating range.
Power Supply Input Pin
VCC
VDD
VSS
VSS
VCC5
VCC5
VCC12
VSS
VCC12
The power supply pins should be connected to VCC5, VCC12 and VSS of this device at the low impedance
from the power supply source.
In the area close to this device, a ceramic capacitor having the capacitance larger than the capacitor of C pin
is recommended to use as a bypass capacitor between VCC5, VCC12 and VSS pins
Crystal Oscillation Circuit
An external noise to the X0 or X1 pin may cause a device malfunction. The printed circuit board must be
designed to lay out X0 and X1 pins, crystal oscillator (or ceramic resonator), and the bypass capacitor to be
grounded to the close position to the device.
The printed circuit board artwork is recommended to surround the X0 and X1 pins by ground circuits.
Mode Pin (MD1, MD0)
Connect the MD1, MD0 mode pin to the VCC5 or VSS pin directly. To prevent an erroneous selection of test
mode caused by the noise, reduce the pattern length between each mode pin and VCC5 or VSS pin on the
printed circuit board. Also, use the low-impedance pin connection.
Notes during PLL Clock Operation
When the PLL clock is selected and if the oscillator is disconnected or if the input is stopped, this clock may
continue to operate at the free running frequency of the self oscillator circuit built in the PLL. This operation
is not guaranteed.
42
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Treatment of R/D Converter and A/D Converter Power Supply Pins
If unuse R/D converter and A/D converter, needs connection as follows.
−
−
AVCC0 = AVCC1= AVCC2 = AVRH0= AVRH1 = AVRH2 = RVCC0 = RVCC1 = RVRH0 =RVRH1 =
VCC5
AVSS0 = AVSS1 = AVSS2 = AVRL0 = AVRL1 = AVRL2 = AVR0 = AVR1 = RVSS0 = RVSS1 =
RVRL0 = RVRL1 = RVR0 = RVR1 = VSS
Note on Using External Clock
The external clock is unsupported.
External direct clock input cannot use.
Power-on Sequence of R/D Converter and A/D Converter Power Supply Analog Inputs
Be sure to turn on the digital power supply (VCC5, VCC12) first, and then turn on the R/D converter and A/D
converter power supplies*1 and analog inputs*2. Also, turn off the R/D converter and A/D converter power
supplies*1 and analog inputs*2 first, and then turn off the digital power supply (VCC5, VCC12).
When the AVRH0, AVRH1, AVRH2, RVRH0 and RVRH1 pin voltages are turned on or off, they must not
exceed AVCC0, AVCC1, AVCC2, RVCC0 and RVCC1. Even if a common analog input pin is used as an
input port, its input voltage must not exceed AVCC0, AVCC1 or AVCC2. (However, the analog power supply
voltage and digital power supply voltage can be turned on or off simultaneously.)
*1: AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, AVRL0, AVRL1, AVRL2, RVCC0, RVCC1, RVRH0,
RVRH1, RVRL0, RVRL1
*2: MAG_PLUS0, MAG_MINUS0, COS_PLUS0, COS_MINUS0, SIN_PLUS0, SIN_MINUS0, COS_IN0,
SIN_IN0, MAG_PLUS1, MAG_MINUS1, COS_PLUS1, COS_MINUS1, SIN_PLUS1, SIN_MINUS1,
COS_IN1, SIN_IN1, 4AN0 to 4AN7, AN0 to AN31
Notes When Writing Data in a Register Having the Status Flag
When writing data in the register that has a status flag (especially, an interrupt request flag) to control
function, take care not to clear its status flag erroneously. The program must be written not to clear the flag
to the status bit, and to set the control bits to have the desired value.
Especially, if multiple control bits are used, the bit instruction cannot be used. (The bit instruction can
access to a single bit only.) The Byte, Half-word, or Word access must be used to write data in the control
bits and status flag simultaneously. During this time, take care not to clear other bits (in this case, the bits of
status flag) erroneously.
Note:
−
These points can be ignored because the bit instructions already take the points into consideration
for registers that are supported by bit-band unit. These points must be considered when using the bit
instruction for registers that are not supported by bit-band unit.
May 15, 2015, MB9D560_DS708-00001-3v0-E
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9. Block Diagram
Debug I/F
(JTAG)
JTAG_SWCLKTCK
JTAG Wakeup
Debug Group
(CoreSightTM
)
DAP
APB-M
Security
A
PB-S
AHB-M
CLK_DBG
Debug APB
AHB2APB
(Priviledge
Protection)
APB-32
Trace Group
Security
Checker
ETB (Trace Buffer)
CLK_PERI0
AHB-32
CLK_ATB
CLK_ATB
Core Group (2-Core)
Debug APB
ETM
#1
ETM
#0
DMAC
(ch.0 to 15)
Processor
B0TCM
CLK_CPU1
CLK_CPU0
CPU #1
CortexTM-R5F
CPU #0
CortexTM-R5F
AHB-M
TCRAM #1
TCRAM #0
AHB-64
CLK_DMA
B0TCM
B1TCM
#1
B1TCM
#0
AHB-32
CLK_PERI0
MPU
#1
MPU
#0
MPU AHB
Exclusive
Access Memory
(EAM)
TCFLASH
TCFLASH
#0
Security
Security
#1
ATCM
#1
ATCM
#0
AXI-S
AXI2AHB
AHB2AXI
AHB2AXI
LLPP(AXI32-M) AXI-S AXI-M
AXI-M AXI-S LLPP(AXI32-M)
High Performance Matrix (HPM)
AXI-64
CLK_HPM
AXI2AHB
AXI2AHB
AXI2AHB
BBU
AXI2AHB
AXI2AHB
BBU
AHB-32
CLK_PERI5
AHB-32
CLK_PERI4
BBU
Application Specific
Peripheral Group B
Application Specific
Peripheral Group A
BBU
BBU
WorkFLASH
#0
CAN
(ch.0 to 2)
AHB-32
AHB-64
CLK_MEMC
FlexRay
(A+Bch)
Mode control
AHB-32
CLK_PERI0
Security
CLK_SYSC_PD1
RDC
(unit 0)
RDC
(unit 1)
RAM
WorkFLASH
#1
MPU AHB
(Config, Slave)
System Controller
(SYSC)
CAN
Prescaler
DAC
(ch.1)
DAC
(ch.0)
Security
RST manage
Clock
DMAC
(Config, Slave)
BootROM
WFG
(unit1, ch.6 to 11)
WFG
(unit0, ch.0 to 5)
CR
Calibration
Protection
TPU#0
PONR
16-bit OCU
(unit3 to 5, ch.6 to 11)
16-bit OCU
(unit0 to 2, ch.0 to 5)
Port Pin Config
(Config, Slave)
State
CRC
(ch.0 to 1)
4ch-SH ADC
(unit1, ch.4 to 7)
4ch-SH ADC
(unit0, ch.0 to 3)
SCT CSV
Resource Input Config
(Config, Slave)
MVA (unit 1)
MVA (unit 0)
TPU#1
IRC #0
Fast-CR
Slow-CR
GPIO
16-bit ICU
16-bit ICU
(unit2 to 3, ch.4 to 7)
(unit0 to 1, ch.0 to 3)
LVD
PLL
8/16bit UDC
(ch.2 to 3)
8/16bit UDC
(ch.0 to 1)
Wakeup
detect
AHB2APB
RAM
IRC #1
16-bit FRT for RDC
(ch.19)
16-bit FRT for RDC
(ch.18)
Clock output
APB-32
CLK_PERI1
MFS
(ch.0 to 4)
RAM
16-bit FRT
(ch.6 to 11)
16-bit FRT
(ch.0 to 5)
NMI
distribution
32-bit FRT
(ch.0 to 4)
HW-WDT
IPCU
AHB2RBus
AHB2APB
CLK_PERI6
CLK_PERI7
Wakeup
Request #0
16-bit FRT
(ch.12 to 17)
SW-WDT #0
SW-WDT #1
FlexRay/RDC
Clock Control
32-bit ICU
(unit0 to 2, ch.0 to 5)
Wakeup
Request #1
WFG
Clock Monitor
(unit2 to 3, ch.12 to 23)
16bit OCU
(unit6 to 11, ch.12 to 23)
TCFLASH #0
(Config, Slave)
EXT-IRQ
(NMI)
TCRAM #0
(Config, Slave)
16-bit ICU
(unit4 to 7, ch.8 to 14)
16-bit Base Timer
[PWM/PPG/RLT/PWC]
(ch.0 to 11)
TCFLASH #1
(Config, Slave)
12-bit A/D Converter
(ch.0 to 31)
TCRAM #1
(Config, Slave)
CommonPeripheral Group
ApplicationSpecific PeripheralGroup
MCU Config Group
Memory & Config Group
PORT MUX (Port Pin Config)
Resource Input
Configuration
I/O
Note:
−
In the block diagram, block name (Config, Slave) describe bus connection for register setting of
control block.
44
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Group
Group Name
Description
CPU and TCM connected memory group
CoreSight of Debugging group
−
−
−
−
−
−
Core Group
Debug Group
System control and supervision IP group
CPU related function and memory group
Common peripheral IP group for vehicle application
Product specified peripheral group
MCU Config Group
Memory & Config Group _
Common Peripheral Group
Application Specific Peripheral Group
Independent IP
Name
Description
Bus matrix of AXI
−
−
−
−
−
−
−
HPM
Bus bridge (AXI-to-AHB, AHB-to-AXI)
DMA controller
DMAC
Exclusive access memory
Input selection circuit of MCU peripheral
Port MUX circuit
EAM
Resource input configuration
Port MUX
I/O
I/O circuit
Note:
−
Each master connects to HPM. Each master has different transaction ID on AXI, Out-Of-Order for
transaction completion.
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D a t a S h e e t
10.Memory Map
Address
Block
Start
End
Overview
Function
64KB: 0x0000_FFFF
96KB: 0x0001_7FFF
128KB: 0x0001_FFFF
0x007F_FFFF
0x0000_0000
0x0002_0000
0x0080_0000
0x0090_0000
0x00FE_0000
TCRAM
Reserved
512KB: 0x0087_FFFF
TCFLASH
768KB: 0x008B_FFFF
1024KB: 0x008F_FFFF
0x00FD_FFFF
large sector area
(TCM connection)
Reserved
Memory
(Each CPU exclusive
space)
TCFLASH
0x00FF_FFFF
small sector area
(TCM connection)
TCFLASH
512KB: 0x0107_FFFF
768KB: 0x010B_FFFF
1024KB: 0x010F_FFFF
0x01FD_FFFF
0x0100_0000
0x0110_0000
0x01FE_0000
large sector area
(AXI connection)
Reserved
TCFLASH
0x01FF_FFFF
small sector area
(AXI connection)
Reserved
0x0200_0000
0x0280_0000
0x0280_1000
0x027F_FFFF
0x0280_0FFF
EAM
0x03FF_FFFF
Reserved
64KB: 0x0400_FFFF
96KB: 0x0401_7FFF
128KB: 0x0401_FFFF
0x047F_FFFF
0x0400_0000
0x0402_0000
0x0480_0000
0x0490_0000
0x04FE_0000
CPU0 space TCRAM
Reserved
512KB: 0x0487_FFFF
768KB: 0x048B_FFFF
1024KB: 0x048F_FFFF
0x04FD_FFFF
CPU0 space TCFLASH
large sector area
(TCM connection)
Reserved
CPU0 space TCFLASH
small sector area
(TCM connection)
CPU0 space TCFLASH
large sector area
(AXI connection)
Reserved
0x04FF_FFFF
Memory
512KB: 0x0507_FFFF
768KB: 0x050B_FFFF
1024KB: 0x050F_FFFF
0x05FD_FFFF
(Common space)
0x0500_0000
0x0510_0000
0x05FE_0000
CPU0 space TCFLASH
small sector area
(AXI connection)
0x05FF_FFFF
64KB: 0x0600_FFFF
96KB: 0x0601_7FFF
128KB: 0x0601_FFFF
0x067F_FFFF
0x0600_0000
0x0602_0000
0x0680_0000
0x0690_0000
CPU1 space TCRAM
Reserved
512KB: 0x0687_FFFF
768KB: 0x068B_FFFF
1024KB: 0x068F_FFFF
0x06FD_FFFF
CPU1 space TCFLASH
large sector area
(TCM connection)
Reserved
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Address
End
Block
Start
Overview
Function
CPU1 space TCFLASH
small sector area
(TCM connection)
CPU1 space TCFLASH
large sector area
(AXI connection)
Reserved
0x06FE_0000
0x06FF_FFFF
512KB: 0x0707_FFFF
768KB: 0x070B_FFFF
1024KB: 0x070F_FFFF
0x07FD_FFFF
0x0700_0000
0x0710_0000
0x07FE_0000
CPU1 space TCFLASH
small sector area
(AXI connection)
Reserved
0x07FF_FFFF
0x0800_0000
0x0E00_0000
0x0DFF_FFFF
0x0E00_FFFF
WorkFLASH0
mirror area 1
Memory
WorkFLASH1
(Common space)
0x0E01_0000
0x0E02_0000
0x0E10_0000
0x0E01_FFFF
0x0E0F_FFFF
0x0E10_FFFF
mirror area 1
Reserved
WorkFLASH0 Reserved
mirror area 2
WorkFLASH1 Reserved
mirror area 2
0x0E11_0000
0x0E12_0000
0x0E20_0000
0x0E11_FFFF
0x0E1F_FFFF
0x0E20_FFFF
Reserved
WorkFLASH0
mirror area 3
WorkFLASH1
0x0E21_0000
0x0E21_FFFF
mirror area 3
0x0E22_0000
0x1000_0000
0xA000_0000
0x0FFF_FFFF
0x9FFF_FFFF
0xA1FF_FFFF
Reserved
Reserved
Reserved
Reserved
Bit band alias area
(Memory & Config Group)
Reserved
0xA200_0000
0xA280_0000
0xA300_0000
0xA27F_FFFF
0xA2FF_FFFF
0xA37F_FFFF
Bit band alias area
(MCU Config Group)
Bit band alias area
(Common Peripheral
Group)
0xA380_0000
0xA480_0000
0xA800_0000
0xA47F_FFFF
0xA7FF_FFFF
0xA87F_FFFF
Bit band alias area
Reserved
Bit band alias area
(Application Specific
Peripheral Group A)
Bit band alias area
(Application Specific
Peripheral Group B)
Reserved
0xA880_0000
0xA8FF_FFFF
0xA900_0000
0xB000_0000
0xAFFF_FFFF
0xBFFF_FFFF
I/O area
(Bit band area)
Reserved
I/O
0xC000_0000
0xF000_0000
0xFFFE_E000
0xFFFF_0000
0xEFFF_FFFF
0xFFFE_DFFF
0xFFFE_FFFF
0xFFFF_FFFF
Reserved
Reserved
Error Config
BootROM
BootROM area
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D a t a S h e e t
Notes:
−
Each CPU exclusive space define memory space for each CPU specified. The other master cannot
access (Reserved area). If the other master access to each CPU exclusive space, access from
common space.
−
−
Reserved area access cause bus error.
However, following access of reserved area will be not bus error.
0x0090_0000 to 0x00FD_FFFF
0x0110_0000 to 0x01FD_FFFF
0x0490_0000 to 0x04FD_FFFF
0x0510_0000 to 0x05FD_FFFF
0x0690_0000 to 0x06FD_FFFF
0x0710_0000 to 0x07FD_FFFF
0x1000_0000 to 0x1FFF_FFFF
0x2000_0000 to 0x2FFF_FFFF
−
The following area should be set device attribution or strongly ordered attribution as core access.
1. I/O area
2. Bit band alias area
3. Error Config (BootROM area)
4. WorkFLASH (when program)
5. TCFLASH (when program)
About device attribute and Strongly Ordered attribute, see "ARM®Architecture Reference Manual
ARM®v7-A and ARM®v7-R edition (ARM DDI 0406B)".
TCFLASH has a TCM-connected region and an AXI-connected region. AXI-connected region is
dedicated for flash memory programming/erasing. When read operation in user mode, use
TCM-connected region.
−
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MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
11.I/O Map
I/O Address Map (HPM, etc.)
Address
Area
Start
End
Overview
Function
Function
0xB000_0000
0xB03F_FFFF
Reserved
Reserved
I/O Address Map (Memory & Config Group)
Address
Area
Start
End
Overview
0xB040_0000
0xB040_1000
0xB040_2000
0xB040_7000
0xB040_7400
0xB040_8000
0xB040_8400
0xB040_9000
0xB040_9400
0xB041_0000
0xB041_0400
0xB041_0800
0xB041_1000
0xB041_1400
0xB041_1800
0xB041_2000
0xB041_2400
0xB041_2800
0xB041_5000
0xB041_6000
0xB040_0FFF
0xB040_1FFF
0xB040_6FFF
0xB040_73FF
0xB040_7FFF
0xB040_83FF
0xB040_8FFF
0xB040_93FF
0xB040_FFFF
0xB041_03FF
0xB041_07FF
0xB041_0FFF
0xB041_13FF
0xB041_17FF
0xB041_1FFF
0xB041_23FF
0xB041_27FF
0xB041_4FFF
0xB041_5FFF
0xB04F_FFFF
IRC0
IRC1
Reserved
NMI distributor
Reserved
TPU0
Reserved
TPU1
Reserved
TCRAM0 IF
TCRAM1 IF
Reserved
Memory & Config Group
TCFLASH0 IF
TCFLASH1 IF
Reserved
WorkFLASH0 IF
WorkFLASH1 IF
Reserved
IPCU
Reserved
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
I/O Address Map (Debug Group)
Address
Area
Start
End
Overview
Function
DAPROM
0xB050_0000
0xB050_1000
0xB050_2000
0xB050_3000
0xB050_4000
0xB050_5000
0xB058_0000
0xB058_1000
0xB059_0000
0xB059_1000
0xB059_2000
0xB059_3000
0xB059_8000
0xB059_9000
0xB059_A000
0xB059_C000
0xB059_D000
0xB059_E000
0xB050_0FFF
0xB050_1FFF
0xB050_2FFF
0xB050_3FFF
0xB050_4FFF
0xB057_FFFF
0xB058_0FFF
0xB058_FFFF
0xB059_0FFF
0xB059_1FFF
0xB059_2FFF
0xB059_7FFF
0xB059_8FFF
0xB059_9FFF
0xB059_BFFF
0xB059_CFFF
0xB059_DFFF
0xB05F_FFFF
ETB
CTI4
TPIU
TRACE_FUNNEL
Reserved
CORTEXROM0
Reserved
CORE0
Reserved
CORE1
Reserved
CTI0
Debug Group
CTI1
Reserved
ETM0
ETM1
Reserved
50
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
I/O Address Map (MCU Config Group)
Address
Area
Start
End
Overview
Function
0xB060_0000
0xB060_0800
0xB060_1000
0xB060_8000
0xB060_8400
0xB060_9000
0xB060_9400
0xB060_C000
0xB060_C400
0xB062_0000
0xB062_0400
0xB060_07FF
0xB060_0FFF
0xB060_7FFF
0xB060_83FF
0xB060_8FFF
0xB060_93FF
0xB060_BFFF
0xB060_C3FF
0xB061_FFFF
0xB062_03FF
0xB06F_FFFF
SYSC
MODEC
Reserved
SW-WDT0
Reserved
SW-WDT1
Reserved
HW-WDT
Reserved
EXT-IRQ
Reserved
MCU Config Group
I/O Address Map (Common Peripheral Group)
Address
Area
Start
End
Overview
Function
0xB070_0000
0xB070_4000
0xB071_0000
0xB071_1000
0xB071_8000
0xB071_8800
0xB072_0000
0xB072_0C00
0xB072_8000
0xB072_8400
0xB073_0000
0xB073_0400
0xB073_8000
0xB073_9000
0xB074_0000
0xB074_4000
0xB074_8000
0xB074_9000
0xB080_0000
0xB080_1400
0xB080_8000
0xB080_B000
0xB082_0000
0xB082_1400
0xB082_8000
0xB082_8C00
0xB070_3FFF
0xB070_FFFF
0xB071_0FFF
0xB071_7FFF
0xB071_87FF
0xB071_FFFF
0xB072_0BFF
0xB072_7FFF
0xB072_83FF
0xB072_FFFF
0xB073_03FF
0xB073_7FFF
0xB073_8FFF
0xB073_FFFF
0xB074_3FFF
0xB074_7FFF
0xB074_8FFF
0xB07F_FFFF
0xB080_13FF
0xB080_7FFF
0xB080_AFFF
0xB081_FFFF
0xB082_13FF
0xB082_7FFF
0xB080_8BFF
0xB08F_FFFF
DMAC
Reserved
MPU AHB
Reserved
CRC (ch.0 to 1)
Reserved
CAN (ch.0 to 2)
Reserved
CAN prescaler
Reserved
Common Peripheral Group
(AHB32)
CR calibration
Reserved
GPIO
Reserved
PPC
Reserved
RIC
Reserved
MFS (ch.0 to 4)
Reserved
Base timer (ch.0 to 11)
Reserved
Common Peripheral Group
(APB)
32-bit FRT (ch.0 to 4)
Reserved
32-bit ICU (ch.0 to 5)
Reserved
May 15, 2015, MB9D560_DS708-00001-3v0-E
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I/O Address Map (Product Specified Peripheral Bus)
Address
Area
Start
End
Overview
Function
Reserved
0xB090_0000
0xB100_0000
0xB100_0100
0xB100_0200
0xB100_0300
0xB100_0400
0xB100_0500
0xB100_0600
0xB100_0800
0xB100_0A00
0xB100_0C00
0xB100_0D00
0xB100_0E00
0xB101_0000
0xB101_0100
0xB101_0200
0xB101_0300
0xB101_0400
0xB101_0600
0xB101_0700
0xB101_1000
0xB101_3000
0xB101_4000
0xB200_0000
0xB200_0100
0xB200_0200
0xB200_0300
0xB200_0400
0xB200_0500
0xB200_0600
0xB200_0800
0xB200_0A00
0xB200_0C00
0xB200_0D00
0xB200_0E00
0xB200_0F00
0xB200_1000
0xB200_1800
0xB201_0000
0xB0FF_FFFF
0xB100_00FF
0xB100_01FF
0xB100_02FF
0xB100_03FF
0xB100_04FF
0xB100_05FF
0xB100_07FF
0xB100_09FF
0xB100_0BFF
0xB100_0CFF
0xB100_0DFF
0xB100_0FFF
0xB101_00FF
0xB101_01FF
0xB101_02FF
0xB101_03FF
0xB101_05FF
0xB101_06FF
0xB101_0FFF
0xB101_2FFF
0xB101_3FFF
0xB1FF_FFFF
0xB200_00FF
0xB200_01FF
0xB200_02FF
0xB200_03FF
0xB200_04FF
0xB200_05FF
0xB200_07FF
0xB200_09FF
0xB200_0BFF
0xB200_0CFF
0xB200_0DFF
0xB200_0EFF
0xB200_0FFF
0xB200_17FF
0xB200_FFFF
0xB201_00FF
Reserved
16-bit FRT (ch.6 to 11)
16-bit OCU (ch.6 to 11)
16-bit ICU (ch.4 to 7)
4ch-SH ADC (unit1)
WFG (ch.6 to 11)
UDC (ch.2 to 3)
Reserved
Application Specific
Peripheral Group A
(AHB-32)
MVA (unit1)
Reserved
RDC (unit1)
DAC (ch.1)
Reserved
16-bit FRT (ch.12 to 17)
16-bit OCU (ch.12 to 23)
16-bit ICU (ch.8 to 14)
Reserved
Application Specific
Peripheral Group A
(APB)
12-bit ADC (ch.0 to 31)
WFG(ch.12 to 23)
Reserved
Other (WFG)
Other (ADC, CSV)
Reserved
Reserved
16-bit FRT (ch.0 to 5)
16-bit OCU (ch.0 to 5)
16-bit ICU (ch.0 to 3)
4ch-SH ADC (unit0)
WFG (ch.0 to 5)
UDC (ch.0 to 1)
Reserved
Application Specific
Peripheral Group B
(AHB-32)
MVA (unit0)
Reserved
RDC (unit0)
DAC (ch.0)
Reserved
Reserved
FlexRay (ch.A/ch.B)
Reserved
Application Specific
Peripheral Group B
(R-Bus)
FlexRay/RDC clock control
0xB201_0100
0xB201_0200
0xB201_01FF
0xBFFF_FFFF
Clock monitor
Reserved
Reserved
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I/O address Map (Error Config)
Address
Area
Start
End
Overview
Function
0xFFFE_E000
0xFFFE_E400
0xFFFE_E800
0xFFFE_F800
0xFFFE_FC00
0xFFFE_E3FF
0xFFFE_E7FF
0xFFFE_F7FF
0xFFFE_FBFF
0xFFFE_FFFF
IRC0 (NMIVASBR)
IRC1 (NMIVASBR)
Reserved
Error Config
IRC (NMIVASBR) mirror*
BootROM IF
*: CPU0 is IRC0, CPU1 is IRC1 able to access this area. The master of excepted CPU is reserved area.
Notes:
−
I/O address map shows maximum area for possibility. It depends on functions. The detail
information, see each address map.
−
It causes bus error to access to reserved area. However, following reserved area access is not
generation of bus error.
0xB018_0000 to 0xB018_03FF
0xB05C_0000 to 0xB05C_0FFF
0xB05E_0000 to 0xB05E_03FF
0xB05E_0400 to 0xB05E_07FF
0xB05E_0800 to 0xB05E_0BFF
0xB05E_0C00 to 0xB05E_0FFF
May 15, 2015, MB9D560_DS708-00001-3v0-E
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D a t a S h e e t
12.Pin Statuses in CPU Status
Pin Statuses (1/2)
External reset
factor*1
External reset
factor*2
Internal reset
factor*3
External
factor
generation
in progress
After
external
factor
Pin No.
Sleep mode
Stop mode
Watch mode
External factor
generation
in progress
After external
factor
releasing
releasing
Pin Name
208
pin
176
pin
3
4
5
6
-
-
3
4
P305/FRCK0
P306/FRCK1
P000/DTTI0/4ADTG0
P001/RTO0
7
5
6
7
8
9
P002/RTO1
P003/RTO2
P004/RTO3
P005/RTO4
P006/RTO5
8
9
10
11
14
15
16
17
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
43
44
Hi-Z/
Last status
retained
Hi-Z/
Input
blocked
Last status
retained*6
Hi-Z/
Input blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
10 P007/4AN0
Hi-Z/Input blocked
11 P008/4AN1
12 P009/4AN2
13 P010/4AN3
19 P011/RDC_W0/ZIN0
20 P012/RDC_V0/BIN0
21 P013/RDC_U0/AIN0
22 P014/RDC_Z0/ZIN1
23 P015/RDC_B0/BIN1
24 P016/RDC_A0/AIN1
25 AREF20
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog output
26 SIN_IN0
Analog input
Analog input
27 COS_IN0
28 SIN_OUT0
Analog output
Analog output
29 SIN_MINUS0
30 SIN_PLUS0
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
31 COS_PLUS0
32 COS_MINUS0
33 COS_OUT0
Analog output
L
Analog output
L*5
Analog output
Analog output
H/L
Analog output
L
Analog output
L
L*5
L*5
39 RDC_ACT0/P026
40 MAG_MINUS0
H/L
L
H/L
L
H/L
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
45
46
47
48
49
50
51
55
56
57
58
59
60
61
62
63
64
65
41 MAG_PLUS0
42 MAG_OUT0
43 P430/ERDS0
Analog output
Analog output
Analog output
Analog output
Analog output
Analog output
-
-
-
-
-
-
-
P030/DTTI2/FRCK12
P031/RTO12/FRCK13
P309/RTO13/FRCK14
P310/RTO14/FRCK15
P311/RTO15/FRCK16
P312/RTO16/FRCK17
P313/RTO17
46 P314/DTTI3/TIOA0
47 P315/RTO18/TIOB0
48 P316/RTO19/TIOA1
49 P317/RTO20/TIOB1
50 P318/RTO21/TIOA2
51 P319/RTO22/TIOB2
52 P320/RTO23/TIOA3
53 P321/SIN0/INT3/TIOB3
54 P322/SOT0
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
66
67
70
71
72
73
74
75
76
77
78
79
80
81
82
84
85
86
87
88
89
55 P323/SCK0
58 P324/STOPWT/IN6/IN16
59 P325/RXDA/IN7/IN17
60 P326/TXDA/IN8/IN18
61 P327/TXENA/IN9/IN19
62 P328/RXDB/IN10/IN20
63 P329/TXDB/IN11/IN21
64 P330/TXENB/IN12
65 NMIX
66 RSTX
Input enabled
-
Input enabled
-
Input enabled
-
Input enabled
-
Input enabled
Input enabled
67 MD1
68 MD0
69 X0
-
-
70 X1
72 TRSTX
Input enabled
-
Input enabled
-
Input enabled
-
Input enabled
-
Input enabled
-
Input enabled
-
73 TCK
74 TDO
75 TDI
Input enabled
Input enabled
Input enabled
Input enabled
Input enabled
Input enabled
76 TMS
77 nSRST
Hi-Z/Input
Hi-Z/Input
90
78 P406/SIN1/INT4
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
blocked*4
Hi-Z/Input
blocked
blocked*4
Hi-Z/Input
blocked
Hi-Z/Input blocked
91
92
79 P407/SOT1
80 P408/SCK1
Hi-Z/Input
Hi-Z/Input
93
94
95
96
97
81 P409/RX0/INT0
82 P410/TX0
blocked*4
Hi-Z/Input
blocked
blocked*4
Hi-Z/Input
blocked
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
Hi-Z/Input
83 P411/RX1/INT1
84 P412/TX1
Hi-Z/Input blocked
blocked*4
Hi-Z/Input
blocked
blocked*4
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input blocked
Hi-Z/Input
blocked*4
Hi-Z/Input
blocked*4
85 P413/RX2/INT2
86 P414/TX2
98
99
-
-
-
-
P415/TIOA4
P416/TIOB4
P417/TIOA5
P418/TIOB5
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
100
101
102
Hi-Z/Input
blocked*4
Hi-Z/Input
blocked*4
106
-
P419/SIN2/INT5
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
107
108
109
-
-
P420/SOT2
P131/SCK2
Hi-Z/Input
blocked
Hi-Z/Input
blocked
90 P431/ERDS1
54
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Pin Statuses (2/2)
External reset
factor*1
External reset
factor*2
Internal reset
factor*3
Pin No.
Sleep Mode
Stop mode
Watch mode
External
factor
generation
in progress
After
external
factor
After external
factor
releasing
External factor
generation
in progress
releasing
Pin Name
208
pin
176
pin
110
111
112
113
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
139
140
141
142
145
146
147
148
149
150
151
91 MAG_OUT1
92 MAG_PLUS1
93 MAG_MINUS1
94 RDC_ACT1/P126
100 COS_OUT1
101 COS_MINUS1
102 COS_PLUS1
103 SIN_PLUS1
104 SIN_MINUS1
105 SIN_OUT1
106 COS_IN1
107 SIN_IN1
108 AREF21
109 P116/RDC_A1/AIN3
110 P115/RDC_B1/BIN3
111 P114/RDC_Z1/ZIN3
112 P113/RDC_U1/AIN2
113 P112/RDC_V1/BIN2
114 P111/RDC_W1/ZIN2
120 P110/4AN7
121 P109/4AN6
122 P108/4AN5
123 P107/4AN4
Analog output
Analog output
Analog output
Analog input
Analog output
Analog input
Analog output
Analog input
Analog output
Analog input
Analog input
Analog input
L*5
L*5
L*5
L
H/L
L
H/L
L
H/L
H/L
Analog output
L
L
L
L
Analog output
Analog output
Analog output
Analog output
Analog input
Analog output
Analog input
-
Analog input
Analog input
Analog input
Analog input
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Analog output
Analog input
Analog output
Hi-Z/
Last status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
124 P106/RTO11
125 P105/RTO10
126 P104/RTO9
127 P103/RTO8
128 P102/RTO7
129 P101/RTO6
130 P100/DTTI1/4ADTG1
Hi-Z/
Last status
retained
Last status
retained*6
Hi-Z/Input
blocked*4
Hi-Z/Input
blocked*4
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Last status
retained
Hi-Z/Input blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
152
-
P421/SIN3/INT6/FRCK8
153
154
158
159
160
161
-
-
-
-
-
-
P422/SOT3/FRCK9/IN13
P423/SCK3/FRCK10/IN14
P425/TIOA8
P426/TIOB8
P427/TIOA9
Hi-Z/
Last status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
P428/TIOB9
Hi-Z/
Last status
retained
Last status
retained*6
Last status
retained*8
Last status
retained*8
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Hi-Z/Input
blocked
162
134 P429/MONCLK/MM
163
164
165
166
167
168
169
170
173
174
175
176
177
178
179
180
185
186
187
135 AN0/P200
136 AN1/P201
137 AN2/P202
138 AN3/P203
139 AN4/P204
140 AN5/P205
141 AN6/P206
142 AN7/P207
145 AN8/P208
146 AN9/P209
147 AN10/P210
148 AN11/P211
149 AN12/P212
150 AN13/P213
151 AN14/P214
152 AN15/P215
157 AN16/P216
158 AN17/P217
159 AN18/P218
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
188
189
190
191
192
195
160 AN19/P219
161 AN20/P220/TIOA6
162 AN21/P221/TIOB6
163 AN22/P222/TIOA7
164 AN23/P223/TIOB7
167 AN24/P224
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked*4
Hi-Z/Input
blocked*4
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Last status
retained
Hi-Z/Input blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
Hi-Z/Input blocked
196
168 AN25/P225/SIN4/INT7
197
198
199
200
201
202
203
204
205
206
207
169 AN26/P226/SOT4/IN0
170 AN27/P227/SCK4/IN1
171 AN28/P228/SCS40/IN2
172 AN29/P229/SCS41/IN3
173 AN30/P230/SCS42/IN4
174 AN31/P231/SCS43/IN5
175 P300/ADTG0
Hi-Z/Last
status
retained
Last status
retained*6
Hi-Z/Input
blocked
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
Last status
retained
Hi-Z/Input
blocked
-
-
-
-
P301/TIOA10/FRCK4
P302/TIOB10/FRCK5
P303/TIOA11/FRCK6
P304/TIOB11/FRCK7
*1: Power-on reset, internal power supply low-voltage detection and NMIX + RSTX pin are factors.
*2: External power supply low-voltage detection and external reset are factors.
*3: Software reset and software/hardware watchdog reset are factors.
*4: When external interrupt is valid, input blocked is invalid.
*5: When I/O is initialized, "L" is output.
*6: Operation is continued according to the peripheral function.
*7: If GPORTEN bit is 0 and CPORTEN bit is 1, input is enabled.
*8: When clock monitor output pin (MONCLK) is selected, pin state becomes high impedance.
May 15, 2015, MB9D560_DS708-00001-3v0-E
55
D a t a S h e e t
13.Electrical Characteristics
13.1 Absolute Maximum Ratings
Rating
Parameter
Symbol
Unit
Remarks
Min
Max
VSS+6.0
VSS+1.8
VSS+6.0
VSS+6.0
VSS+6.0
VSS+6.0
VCC+0.3
VCC+0.3
VCC+0.3
4
Power supply voltage*1, *2
Analog power supply voltage*1, *2
Analog reference voltage*1
Input voltage*1
VCC
VDD
VSS-0.3
VSS-0.3
VSS-0.3
VSS-0.3
V
V
AVCC
RVCC
AVRH
RVRH
VI
V
AVCC≤VCC
V
RVCC≤VCC
V
SS-0.3
V
AVRH≤AVCC
RVRH≤RVCC
Analog pin input voltage*1
VSS-0.3
V
Input voltage*1
Analog pin input voltage*1
Output voltage*1
VSS-0.3
V
VIA
VSS-0.3
V
VO
VSS-0.3
V
Max clamp current
Max total clamp current
ICLAMP
Σ|ICLAMP
IOL1
-
-
-
-
-
-
-
-
-
-
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mW
°C
°C
*8
20
*8
|
3.5
When setting to 1 mA*6
When setting to 2 mA
When setting to 4 mA*7
When setting to 1 mA*6
When setting to 2 mA
When setting to 4 mA*7
*6
When setting to 1 mA*6
When setting to 2 mA
When setting to 4 mA*7
When setting to1 mA*6
When setting to 2 mA
When setting to 4 mA*7
*6
"L" level Max output current*3
IOL2
7
IOL3
14
IOLAV1
IOLAV2
IOLAV3
ΣIOL
1
"L" level average output current*4
"L" level total output current*5
"H" level Max output current*3
2
4
40
IOH1
-3.5
IOH2
-7
-
IOH3
-14
-
IOHAV1
IOHAV2
IOHAV3
ΣIOH
PD
-1
-
"H" level average output current*4
-2
-
-4
-
"H" level total output current*5
Power consumption
-40
-
1500
+125
+150
-
Operating temperature
Storage temperature
TA
-40
*9
Tstg
-55
*1: These parameters are based on the condition that VSS=AVSS=0.0V.
*2: Caution must be taken that AVCC does not exceed VCC
.
*3: The maximum output current is defined as the value of the peak current flowing through any one of the
corresponding pins.
*4: The average output current is defined as the value of the average current flowing through any one of the
corresponding pins for a 10 ms period. The average value is the operation current the operation ratio.
*5: The total output current is defined as the maximum current value flowing through all of corresponding
pins.
*6: Corresponding pins: general-purpose ports
*7: Corresponding pins: general-purpose ports of P325 to P330
*8: Corresponding pins: all general-purpose ports and analog input pin
−
−
−
Use the devices within recommended operating conditions.
Use the devices with direct voltage (current).
The + B signal should always be applied by connecting a limiting resistor between the + B signal and
the microcontroller.
56
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
−
−
The value of the limiting resistor should be set so that the current input to the microcontroller pin
does not exceed rated values at any time regardless of instantaneously or constantly when the + B
signal is input.
Note that when the microcontroller drive current is low, such as in the low-power consumption
modes, the + B input potential can increase the potential at the VCC pin via a protective diode,
possibly affecting other devices.
−
−
−
Note that if the + B signal is input when the microcontroller is off (not fixed at 0V), since the power is
supplied through the pin, the microcontroller may operate incompletely.
Note that if the +B signal is input at power-on, since the power is supplied through the pin, the
power-on reset may not function in the power supply voltage.
Do not leave + B input pins open.
Sample Recommended Circuit
MB9D560 series
Protective diode
Limiting resistor current
+Ｂ input(12 to 16V)
*9: To use this product at TA=125°C, equip this on a multilayer board with four or more layers.
To equip this on a single-layer board, change the operating conditions (operating frequency, power
supply voltage, etc.) to use this at the power consumption PD=780mW or lower, or use this at TA=100°C
or lower.
Warning:
−
Semiconductor devices may be permanently damaged by application of stress (including, without
limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed
any of these ratings.
May 15, 2015, MB9D560_DS708-00001-3v0-E
57
D a t a S h e e t
13.2 Recommended Operating Conditions
(VSS=AVSS-RVSS=0.0V)
Value
Parameter
Symbol
Unit
Remarks
Min
4.5
Max
5.5
VCC
VDD
V
V
1.1
1.3
Recommended operation
guarantee range
AVCC
RVCC
VCC
4.5
5.5
V
4.5
5.5
V
Power supply voltage
3.7
5.5
V
VDD
1.09
3.7
1.3
V
Operation guarantee range
AVCC
RVCC
CREF
TA
5.5
V
3.7
5.5
V
Smoothing capacitor*
Operating temperature
0.33
-40
1.0
µF
°C
Tolerance within ±40%
+125
* : For connection of smoothing capacitor CREF, see the figure below.
− CREF pin connection
MB9D560 series
AVRH0
Decoupling capacitor
(0.01 F to 1 F)
Pin
µ
µ
Wire
CREF
AVRL0
AVR0
AVSS0
AVCC0
It should be used smoothing capacitor for between AVR1 to AVRL1, RVR0 to RVRL0,
RVR1 to RVRL1 as well.
− CREF capacitor size and A/D converter activation time
It depends on activation time of A/D converter with R/D converter and activation time of
4 channels same time sampling A/D converter by CREF capacitor seize. The
computation expression of activation time is as follows.
Activation time = 9 × CREF × 1.2k + 1μ [s]
Activation time relate with following time from activation trigger, please use smoothing
capacitor with system operation conditions.
If A/D converter of 4 channels same time sampling,
Set to "1" for ENBL bit of A/D enable setting register.
If A/D converter with R/D converter,
Set to "1" for RDCEN bit of operation control register 1.
58
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
Warning:
−
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
−
−
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device
and could result in device failure.
−
No warranty is made with respect to any use, operating conditions or combinations not represented
on this data sheet. If you are considering application under any conditions other than listed herein,
please contact sales representatives beforehand.
May 15, 2015, MB9D560_DS708-00001-3v0-E
59
D a t a S h e e t
13.3 DC Characteristics
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
P000 to P016,
P026,
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 toP306,
P309 to P324,
P406 to P423,
P425 to P431
P000 to P016,
P026,
When CMOS schmitt
input level is
VIH1
0.7VCC
-
Vcc+0.3
V
selected
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 to P306,
P309 to P330,
P406 to P423,
P425 to P431
"H" level input
voltage
When automotive
input level is
selected
VIH2
0.8VCC
-
-
Vcc+0.3
Vcc+0.3
V
V
When FlexRay input
VIH3
P325 to P330
0.7VCC
level is selected
VIH4
VIH5
RSTX, NMIX
MD0, MD1
TRSTX,
-
-
0.7VCC
0.7VCC
-
-
Vcc+0.3
Vcc+0.3
V
V
VIH6
TCK, TDI,
-
2.3
-
Vcc+0.3
V
TMS, nSRST
60
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
P000 to P016,
P026,
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 toP306,
P309 to P324,
P406 to P423,
P425 to P431
P000 to P016,
P026,
When CMOS schmitt
input level is
VIL1
V
SS-0.3
-
0.3VCC
V
selected
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 to P306,
P309 to P330,
P406 to P423,
P425 to P431
"L" level input
voltage
When automotive
input level is
selected
VIL2
V
SS-0.3
-
-
0.5VCC
V
V
When FlexRay input
VIL3
P325 to P330
VSS-0.3
0.3VCC
level is selected
VIL4
VIL5
RSTX, NMIX
MD0, MD1
TRSTX,
-
-
VSS-0.3
VSS-0.3
-
-
0.3VCC
0.3VCC
V
V
VIL6
TCK, TDI,
-
VSS-0.3
-
0.8
V
TMS, nSRST
May 15, 2015, MB9D560_DS708-00001-3v0-E
61
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
P000 to P016,
P026,
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 toP306,
P309 to P330,
P406 to P423,
P425 to P431
V
CC=4.5V
VOH1
V
CC-0.5
-
VCC
V
IOH=-2.0mA
When
V
CC=4.5V
VOH2
P325 to P330
V
CC-0.5
-
VCC
V
FlexRay
selected
IOH=-4.0mA
"H" level output
voltage
P000 to P016,
P026,
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 toP306,
P309 to P330,
P406 to P423,
P425 to P431
V
CC=4.5V
VOH3
V
V
CC-0.5
-
-
VCC
V
V
IOH=-1.0mA
V
CC=4.5V
VOH4
TDO
CC-0.5
VCC
IOH=-5mA
62
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
P000 to P016,
P026,
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 toP306,
P309 to P330,
P406 to P423,
P425 to P431
V
CC=4.5V
VOL1
0
-
0.4
V
IOL=2.0mA
When
V
CC=4.5V
VOL2
P325 to P330
0
-
0.4
V
FlexRay
selected
IOL=4.0mA
"L" level output
voltage
P000 to P016,
P026,
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 toP306,
P309 to P330,
P406 to P423,
P425 to P431
V
CC=4.5V
VOL3
0
0
-
-
0.4
0.4
V
V
IOL=1.0mA
V
CC=4.5V
VOL4
TDO
IOL=5mA
May 15, 2015, MB9D560_DS708-00001-3v0-E
63
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
-5
Typ
Max
+5
Input leakage
current
V
CC=AVCC=RVCC=5.5V
IIL
All input pin
-
-
µA
kΩ
VSS < VI < VCC
RUP1
RSTX, NMIX
P000 to P016,
P026,
-
25
100
P030 to P031,
P100 to P116,
P126, P131,
P200 to P231,
P300 to P306,
P309 to P330,
P406 to P423,
P425 to P431
Other than
Pull-up
When pull-up
resistance
RUP2
25
-
100
kΩ
resistance is selected
VCC, VSS,
Input capacitor
CIN
-
-
5
15
pF
AVCC, AVSS,
RVCC, RVSS
64
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
F
CD0_CLK=200 MHz
FCLK_CPUx=200 MHz,
FCLK_TFCLKx=66 MHz,
FCLK_HPMPD2=200 MHz,
FCLK_DMA=200 MHz,
FCLK_MEMC=100 MHz,
FCLK_WFCLKx=200 MHz,
FCLK_SYSCPD1=100 MHz,
FCLK_PERIy=100 MHz,
FCLK_PERIz=50 MHz
Normal
operations
200MHz
-
104
115
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
F
CD0_CLK=160 MHz
FCLK_CPUx=160 MHz,
FCLK_TFCLKx=80 MHz,
FCLK_HPMPD2=160 MHz,
FCLK_DMA=160 MHz,
FCLK_MEMC=80 MHz,
FCLK_WFCLKx=160 MHz,
FCLK_SYSCPD1=80 MHz,
FCLK_PERIy=80 MHz,
FCLK_PERIz=40 MHz
Normal
operations
160MHz
-
-
-
105
115
116
116
126
127
mA
mA
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
Power supply
current
ICC5
VCC5
F
CD0_CLK=200 MHz
FCLK_CPUx=200 MHz,
FCLK_TFCLKx=66 MHz,
FCLK_HPMPD2=200 MHz,
FCLK_DMA=200 MHz,
FCLK_MEMC=100 MHz,
FCLK_WFCLKx=200 MHz,
FCLK_SYSCPD1=100 MHz,
FCLK_PERIy=100 MHz,
FCLK_PERIz=50 MHz
Flash write/erase*
200MHz
x=0, 1 y=0, 4, 5 z=1, 6, 7
F
CD0_CLK=160 MHz
FCLK_CPUx=160 MHz,
FCLK_TFCLKx=80 MHz,
FCLK_HPMPD2=160 MHz,
FCLK_DMA=160 MHz,
FCLK_MEMC=80 MHz,
FCLK_WFCLKx=160 MHz,
FCLK_SYSCPD1=80 MHz,
FCLK_PERIy=80 MHz,
FCLK_PERIz=40 MHz
Flash write/erase*
160MHz
x=0, 1 y=0, 4, 5 z=1, 6, 7
*: This series has 2 types of flash; TCFLASH (4) and WorkFLASH (2); however, this is the specification when
only one of those is written/erased.
May 15, 2015, MB9D560_DS708-00001-3v0-E
65
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
FCD0_CLK=200 MHz
FCLK_CPUx=200 MHz,
FCLK_TFCLKx=66 MHz,
FCLK_HPMPD2=200 MHz,
FCLK_DMA=200 MHz,
FCLK_MEMC=100 MHz,
FCLK_WFCLKx=200 MHz,
FCLK_SYSCPD1=100 MHz,
FCLK_PERIy=100 MHz,
FCLK_PERIz=50 MHz
Normal
operations
200MHz
-
310
510
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
F
CD0_CLK=160 MHz
FCLK_CPUx=160 MHz,
FCLK_TFCLKx=80 MHz,
FCLK_HPMPD2=160 MHz,
FCLK_DMA=160 MHz,
FCLK_MEMC=80 MHz,
FCLK_WFCLKx=160 MHz,
FCLK_SYSCPD1=80 MHz,
FCLK_PERIy=80 MHz,
FCLK_PERIz=40 MHz
Normal
operations
160MHz
-
-
-
290
312
292
490
512
492
mA
mA
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
Power supply
current
ICC12
VCC12
F
CD0_CLK=200 MHz
FCLK_CPUx=200 MHz,
FCLK_TFCLKx=66 MHz,
FCLK_HPMPD2=200 MHz,
FCLK_DMA=200 MHz,
FCLK_MEMC=100 MHz,
FCLK_WFCLKx=200 MHz,
FCLK_SYSCPD1=100 MHz,
FCLK_PERIy=100 MHz,
FCLK_PERIz=50 MHz
Flash write/erase*
200MHz
x=0, 1 y=0, 4, 5 z=1, 6, 7
F
CD0_CLK=160 MHz
FCLK_CPUx=160 MHz,
FCLK_TFCLKx=80 MHz,
FCLK_HPMPD2=160 MHz,
FCLK_DMA=160 MHz,
FCLK_MEMC=80 MHz,
FCLK_WFCLKx=160 MHz,
FCLK_SYSCPD1=80 MHz,
FCLK_PERIy=80 MHz,
FCLK_PERIz=40 MHz
Flash write/erase*
160MHz
x=0, 1 y=0, 4, 5 z=1, 6, 7
*: This series has 2 types of flash; TCFLASH (4) and WorkFlash (2); however, this is the specification when
only one of those is written/erased.
66
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin name
Conditions
Unit
Remarks
Min
Typ
Max
F
CD0_CLK=200 MHz
FCLK_CPUx=200 MHz,
FCLK_TFCLKx=66 MHz,
FCLK_HPMPD2=200 MHz,
FCLK_DMA=200 MHz,
FCLK_MEMC=100 MHz,
FCLK_WFCLKx=200 MHz,
FCLK_SYSCPD1=100 MHz,
FCLK_PERIy=100 MHz,
FCLK_PERIz=50 MHz
CPU sleep mode
200MHz
-
40
42
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
ICCS5
F
CD0_CLK=160 MHz
FCLK_CPUx=160 MHz,
FCLK_TFCLKx=80 MHz,
FCLK_HPMPD2=160 MHz,
FCLK_DMA=160 MHz,
FCLK_MEMC=80 MHz,
FCLK_WFCLKx=160 MHz,
FCLK_SYSCPD1=80 MHz,
FCLK_PERIy=80 MHz,
FCLK_PERIz=40 MHz
Power supply
current
VCC5
CPU sleep mode
160MHz
-
30
32
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
Watch mode,
4MHz source
oscillation
When using crystal
ICCT5
-
-
390
380
1030
1010
µA
µA
TA=25°C
ICCH5
Stop mode
TA=25°C
May 15, 2015, MB9D560_DS708-00001-3v0-E
67
D a t a S h e e t
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
F
CD0_CLK=200 MHz
FCLK_CPUx=200 MHz,
FCLK_TFCLKx=66 MHz,
FCLK_HPMPD2=200 MHz,
FCLK_DMA=200 MHz,
FCLK_MEMC=100 MHz,
FCLK_WFCLKx=200 MHz,
FCLK_SYSCPD1=100 MHz,
FCLK_PERIy=100 MHz,
FCLK_PERIz=50 MHz
CPU sleep mode
200MHz
-
220
410
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
ICCS12
F
CD0_CLK=160 MHz
FCLK_CPUx=160 MHz,
FCLK_TFCLKx=80 MHz,
FCLK_HPMPD2=160 MHz,
FCLK_DMA=160 MHz,
FCLK_MEMC=80 MHz,
FCLK_WFCLKx=160 MHz,
FCLK_SYSCPD1=80 MHz,
FCLK_PERIy=80 MHz,
FCLK_PERIz=40 MHz
Power supply
current
VCC12
CPU sleep mode
160MHz
-
180
360
mA
x=0, 1 y=0, 4, 5 z=1, 6, 7
Watch mode,
4MHz source
oscillation
When using crystal
ICCT12
-
-
1280
860
9730
9530
µA
µA
TA=25°C
ICCH12
Stop mode
TA=25°C
68
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
13.4 AC Characteristics
(1) Source Clock Timing
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Typ
Parameter
Symbol
FC
Pin Name
Conditions
Unit
MHz
ns
Remarks
Min
Max
Source oscillation
clock frequency
Source oscillation
clock cycle time
CAN PLL jitter
X0, X1
-
-
-
-
-
4
-
20
tCYL
X0, X1
50
-10
50
-
-
250
+10
150
tPJ
-
-
-
ns
(during lock)
Built-in slow-CR
oscillation frequency
Built-in fast-CR
oscillation frequency
FCRS
100
kHz
4
8
8
12
MHz Without calibration
MHz With calibration
FCRF
7.2
8.8
− X0, X1 clock timing
tCYL
X0
− CAN PLL jitter
Deviation time from the ideal clock is assured per cycle out of 20,000 cycles.
t1
t2
t3
tn-1
tn
Ideal clock
PLL output
Slow
t3
t2
t1
tn-1
tn
Fast
May 15, 2015, MB9D560_DS708-00001-3v0-E
69
D a t a S h e e t
(2) Internal Clock Timing
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
0
Typ
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max
FCD0_CLK
FCD4_CLK
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
200
MHz CD0_CLK
0
200
MHz CD4_CLK
FCLK_CPU0
FCLK_CPU1
FCLK_TFCLK0
FCLK_TFCLK1
FCLK_ATB
0
200
MHz CLK_CPU0
MHz CLK_CPU1
MHz CLK_TFCLK0
MHz CLK_TFCLK1
MHz CLK_ATB
0
200
0
80
0
80
0
100
FCLK_DBG
0
50
MHz CLK_DBG
FCLK_HPMPD2
FCLK_DMA
FCLK_MEMC
FCLK_WFCLK0
FCLK_WFCLK1
FCLK_SYSCPD1
FCLK_PERI0
FCLK_PERI1
FCLK_PERI4
FCLK_PERI5
FCLK_PERI6
FCLK_PERI7
FCLK_CLKO
tCD0_CLK
0
200
MHz CLK_HPMPD2
MHz CLK_DMA
MHz CLK_MEMC
MHz CLK_WFCLK0
MHz CLK_WFCLK1
MHz CLK_SYSCPD1
MHz CLK_PERI0
MHz CLK_PERI1
MHz CLK_PERI4
MHz CLK_PERI5
MHz CLK_PERI6
MHz CLK_PERI7
MHz CLK_CLKO
0
200
Internal clock
0
200
frequency
0
80
0
80
0
100
0
100
0
50
0
100
0
100
0
50
0
50
0
200
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CD0_CLK
tCD4_CLK
5
CD4_CLK
tCLK_CPU0
5
CLK_CPU0
CLK_CPU1
CLK_TFCLK0
CLK_TFCLK1
CLK_ATB
tCLK_CPU1
5
tCLK_TFCLK0
tCLK_TFCLK1
tCLK_ATB
12.5
12.5
10
20
5
tCLK_DBG
CLK_DBG
tCLK_HPMPD2
tCLK_DMA
CLK_HPMPD2
CLK_DMA
5
Internal clock cycle
time
tCLK_MEMC
tCLK_WFCLK0
tCLK_WFCLK1
tCLK_SYSCPD1
tCLK_PERI0
tCLK_PERI1
tCLK_PERI4
tCLK_PERI5
tCLK_PERI6
tCLK_PERI7
tCLK_CLKO
5
CLK_MEMC
CLK_WFCLK0
CLK_WFCLK1
CLK_SYSCPD1
CLK_PERI0
CLK_PERI1
CLK_PERI4
CLK_PERI5
CLK_PERI6
CLK_PERI7
CLK_CLKO
12.5
12.5
10
10
20
10
10
20
20
5
70
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
− Guaranteed operation range Internal operation clock frequency vs. Power supply voltage
Recommended guaranteed operation range:
PLL guaranteed operation range:
Guaranteed operation range:
5.5
4.5
3.7
1.3
1.1
1.09
2
4
200
Internal operation clock frequency FCD0_CLK(MHz)
Note: The CPU will be reset at the power supply voltage of the low-voltage detection setting voltage or less.
− Oscillation clock frequency vs. Internal operation clock frequency
Oscillation Clock
Frequency
4 MHz
PLL Multiplying
PLL Output Divider
Main Clock
PLL Clock
Setting
100
50
Setting
4 MHz
8 MHz
4 MHz
16 MHz
8 MHz
2
2
2
2
2
200 MHz
200 MHz
200 MHz
200 MHz
200 MHz
8 MHz
8 MHz
100
25
16 MHz
16 MHz
50
− Example of oscillation circuit
X0
X1
R
C1
C2
Note: when configuring the oscillator circuit, it is recommended to ask matching evaluation of the circuit to oscillator
manufacturers for the design.
May 15, 2015, MB9D560_DS708-00001-3v0-E
71
D a t a S h e e t
AC characteristics are specified by the following measurement reference voltage values.
Input signal waveform
Hysteresis input pin (Automotive)
Output signal waveform
Output pin
0.8Vcc
0.5Vcc
2.4V
0.8V
Hysteresis input pin (CMOS schmitt)
0.7Vcc
0.3Vcc
Hysteresis input pin (FlexRay)
0.7Vcc
0.3Vcc
Hysteresis input pin (TTL)
2.0V
0.8V
72
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(3) Reset Input
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
10
1
Max
Reset input time
Width for reset input removal
-
-
µs
µs
tRSTL
RSTX
-
tRSTL
RSTX
0.2Vcc
0.2Vcc
May 15, 2015, MB9D560_DS708-00001-3v0-E
73
D a t a S h e e t
(4) Power-on Conditions
(TA: Recommended operating conditions, VSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
2.0
0.4
-
Typ
Max
2.4
0.7
150
50
-
-
VCC5
VCC12
VCC5
VCC12
-
-
-
-
-
-
-
-
-
2.2
V
Level detection
voltage
When turning
on power
During
-
-
-
-
-
-
-
V
-
mV
mV
µs
Level detection
hysteresis width
Level detection time
voltage drop
*1
-
-
-
-
30
tR5
tR12
tOFF
VCC5
VCC12
VCC5
0.11
0.05
1
30
ms
ms
ms
Power-on time
Power-off time
0.6
-
*2
*1: If the fluctuation of the power supply is faster than the low-voltage detection time, there is the possibility
to generate or release after the power supply voltage has exceeded the detection voltage range.
*2: This time is to start the slope detection at next power on after power down and internal charge loss.
− Power-on , Power-off sequence
2.0V
VCC5
0.2Vcc
0.2Vcc
tR5
tOFF
1.1V
VCC12
tR12
NMIX + RSTX
Notes:
−
−
−
Power supply input procedure
Power supply should input same time VCC5 and VCC12, or VCC5 to up step.
Also, when power supply input, VCC12 is not over voltage of VCC5.
Power supply shutdown procedure
Power supply should shutdown same time VCC5 and VCC12, or VCC12 to up step.
Also, when power supply shutdown, VCC12 is not over voltage of VCC5.
Notes: When power supply input and power supply shutdown
When power supply input, power supply voltage until achieve to recommend operation guarantee
area, same time input for NMIX pin + RSTX pin.
When power supply shutdown, power supply voltage until achieve to recommend operation
guarantee area, same time input for NMIX pin + RSTX pin.
74
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5) Multi-Function Serial Interface
(5-1) CSIO Timing (SMR:MD[2:0]=0b010)
(5-1-1) Normal Synchronous Transfer (SCR:SPI=0) and Serial Clock Output Signal Detect Level "H"
(SMR:SCINV=0)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tSCYC
tSLOVI
tIVSHI
tSHIXI
tSHSL
tSLSH
tSLOVE
tIVSHE
tSHIXE
tF
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
Serial clock cycle time
SCK0 to SCK4
4tCLK_PERI1
-
Master mode
(CL=50pF,
SCK0 to SCK4,
SOT0 to SOT4
SCK↓→SOT
-30
+30
ns
delay time
IOL=-2mA, IOH=2mA),
(CL=20pF,
Valid SIN→SCK↑
30
0
-
-
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
IOL=-1mA, IOH=1mA)
SCK↑→Valid SIN
ns
hold time
Serial clock "H" pulse
width
t
CLK_PERI1+10
-
ns
SCK0 to SCK4
Serial clock "L" pulse
width
2tCLK_PERI1-10
-
ns
SCK0 to SCK4,
SOT0 to SOT4
SCK↓→SOT
-
10
20
-
30
-
ns
Slave mode
(CL=50pF,
delay time
Valid SIN→SCK↑
IOL=-2mA, IOH=2mA),
(CL=20pF,
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
SCK↑→Valid SIN
IOL=-1mA, IOH=1mA)
-
ns
hold time
SCK fall time
SCK rise time
SCK0 to SCK4
5
5
5
6
ns
tR
SCK0 to SCK4
-
ns
CL=50pF,
-
-
-
-
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
-
-
IOL=-1mA, IOH=1mA
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
75
D a t a S h e e t
tSCYC
VOH
SCK
SOT
VOL
tSLOVI
VOH
VOL
tIVSHI
tSHIXI
V
V
IH
IH
SIN
V
IL
V
IL
Master mode
tSLSH
tSHSL
V
IH
VIH
tR
V
IH
SCK
SOT
V
IL
V
IL
tSLOVE
tF
VOH
VOL
tIVSHE
tSHIXE
V
V
IH
IH
SIN
V
IL
V
IL
Slave mode
76
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-2) Normal Synchronous Transfer (SCR:SPI=0) and Serial Clock Output Signal Detect Level "L"
(SMR:SCINV=1)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tSCYC
tSHOVI
tIVSLI
tSLIXI
tSHSL
tSLSH
tSHOVE
tIVSLE
tSLIXE
tF
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
Serial clock cycle time
SCK0 to SCK4
4tCLK_PERI1
-
Master mode
(CL=50pF,
SCK0 to SCK4,
SOT0 to SOT4
SCK↑→SOT
-30
+30
ns
delay time
IOL=-2mA, IOH=2mA),
(CL=20pF,
Valid SIN→SCK↓
30
0
-
-
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
IOL=-1mA, IOH=1mA)
SCK↓→valid SIN
ns
hold time
Serial clock "H" pulse
width
t
CLK_PERI1+10
-
ns
SCK0 to SCK4
Serial clock "L" pulse
width
2tCLK_PERI1-10
-
ns
SCK0 to SCK4,
SOT0 to SOT4
SCK↑→SOT
-
10
20
-
30
-
ns
Slave mode
(CL=50pF,
delay time
valid SIN→SCK↓
IOL=-2mA, IOH=2mA),
(CL=20pF,
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
SCK↓→valid SIN
IOL=-1mA, IOH=1mA)
-
ns
hold time
SCK fall time
SCK rise time
SCK0 to SCK4
5
5
5
6
ns
tR
SCK0 to SCK4
-
ns
CL=50pF,
-
-
-
-
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
-
-
IOL=-1mA, IOH=1mA
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
77
D a t a S h e e t
tSCYC
VOH
SCK
SOT
VOL
tSHOVI
VOH
VOL
tIVSLI
tSLIXI
V
V
IH
IH
SIN
V
IL
V
IL
Master mode
tSHSL
tSLSH
V
V
IH
IH
SCK
SOT
V
IL
V
IL
V
IL
tF
tR
tSHOVE
VOH
VOL
tIVSLE
tSLIXE
V
V
IH
IH
SIN
V
IL
V
IL
Slave mode
78
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-3) SPI Compatible (SCR:SPI=1) and Serial Clock Output Signal Detect Level "H" (SMR:SCINV=0)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tSCYC
tSHOVI
tIVSLI
tSLIXI
tSOVLI
tSHSL
tSLSH
tSHOVE
tIVSLE
tSLIXE
tF
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
Serial clock cycle time
SCK0 to SCK4
4tCLK_PERI1
-
SCK0 to SCK4,
SOT0 to SOT4
SCK↑→SOT
-30
+30
ns
Master mode
(CL=50pF,
delay time
Valid SIN→SCK↓
IOL=-2mA, IOH=2mA),
(CL=20pF,
30
-
-
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
SCK↓→valid SIN
IOL=-1mA, IOH=1mA)
0
ns
hold time
SCK0 to SCK4,
SOT0 to SOT4
SOT→SCK↓
2tCLK_PERI1-30
-
ns
delay time
Serial clock "H" pulse
width
t
CLK_PERI1+10
-
ns
SCK0 to SCK4
Serial clock "L" pulse
width
2tCLK_PERI1-10
-
ns
SCK0 to SCK4,
SOT0 to SOT4
SCK↑→SOT
-
10
20
-
30
-
ns
Slave mode
(CL=50pF,
delay time
valid SIN→SCK↓
IOL=-2mA, IOH=2mA),
(CL=20pF,
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
SCK↓→valid SIN
IOL=-1mA, IOH=1mA)
-
ns
hold time
SCK fall time
SCK rise time
SCK0 to SCK4
5
5
5
6
ns
tR
SCK0 to SCK4
-
ns
CL=50pF,
-
-
-
-
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
-
-
IOL=-1mA, IOH=1mA
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
79
D a t a S h e e t
tSCYC
VOH
SCK
SOT
VOL
VOL
tSHOVI
tSOVLI
VOH
VOL
VOH
VOL
tIVSLI
tSLIXI
V
V
IH
IH
SIN
V
IL
V
IL
Master mode
tSLSH
tSHSL
V
IH
V
IH
V
IH
SCK
SOT
V
V
IL
V
IL
IL
tSHOVE
tF
tR
*
VOH
VOL
VOH
VOL
tIVSLE
tSLIXE
V
V
IH
IH
SIN
V
IL
V
IL
*: Changes when writing to TDR register
Slave mode
80
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-4) SPI Compatible (SCR:SPI=1) and Serial Clock Output Signal Detect Level "L" (SMR:SCINV=1)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tSCYC
tSLOVI
tIVSHI
tSHIXI
tSOVHI
tSHSL
tSLSH
tSLOVE
tIVSHE
tSHIXE
tF
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
Serial clock cycle time
SCK0 to SCK4
4tCLK_PERI1
-
SCK0 to SCK4,
SOT0 to SOT4
SCK↓→SOT
-30
+30
ns
Master mode
(CL=50pF,
delay time
Valid SIN→SCK↑
IOL=-2mA, IOH=2mA),
(CL=20pF,
30
-
-
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
SCK↑→valid SIN
IOL=-1mA, IOH=1mA)
0
ns
hold time
SCK0 to SCK4,
SOT0 to SOT4
SOT→SCK↑
2tCLK_PERI1-30
-
ns
Delay time
Serial clock "H" pulse
width
t
CLK_PERI1+10
-
ns
SCK0 to SCK4,
SOT0 to SOT4
Serial clock "L" pulse
width
2tCLK_PERI1-10
-
ns
SCK0 to SCK4,
SOT0 to SOT4
SCK↓→SOT
-
10
20
-
30
-
ns
Slave mode
(CL=50pF,
delay time
valid SIN→SCK↑
IOL=-2mA, IOH=2mA),
(CL=20pF,
ns
setup time
SCK0 to SCK4,
SIN0 to SIN4
SCK↑→valid SIN
IOL=-1mA, IOH=1mA)
-
ns
hold time
SCK fall time
SCK rise time
SCK0 to SCK4
5
5
5
6
ns
tR
SCK0 to SCK4
-
ns
CL=50pF,
-
-
-
-
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
-
-
IOL=-1mA, IOH=1mA
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
81
D a t a S h e e t
tSCYC
VOH
VOH
SCK
SOT
VOL
tSLOVI
tSOVHI
VOH
VOL
VOH
VOL
tIVSHI
tSHIXI
VIH
VIL
VIH
VIL
SIN
Master mode
tSHSL
tSLSH
VIH
VIH
tF
VIH
SCK
SOT
VIL
VIL
tR
VIL
tSLOVE
*
VOH
VOL
VOH
VOL
tIVSHE
VIH
VIL
tSHIXE
VIH
VIL
SIN
*: Changes when writing to TDR register
Slave mode
82
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-5) When the Serial Chip Select is Used (SCSCR:CSEN=1)
−
−
Serial clock output signal detect level "H" (SMR, SCSFR:SCINV=0)
Serial chip select inactive level "H" (SCSCR, SCSFR:CSLVL=1)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tCSSI
Pin Name
Conditions
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Remarks
Min
Max
SCS↓→SCK↓
tCSSU*1-50
-
Master mode
(CL=50pF,
setup time
SCK4,
SCS40 to SCS43
SCK↑→SCS↑
tCSHI
IOL=-2mA, IOH=2mA),
(CL=20pF,
tCSHD*2+0
-
-
hold time
tCSDS*3-50
IOL=-1mA, IOH=1mA)
SCS deselect time
tCSDI
SCS40 to SCS43
+5 tCLK_PERI1
SCS↓→SCK↓
tCSSE
tCSHE
tCSDE
tDSE
3tCLK_PERI1+30
-
setup time
SCK4,
SCS40 to SCS43
SCK↑→SCS↑
0
-
Slave mode
(CL=50pF,
hold time
SCS deselect time
SCS40 to SCS43
IOL=-2mA, IOH=2mA),
(CL=20pF,
3tCLK_PERI1+30
-
SCS↓→SOT
IOL=-1mA, IOH=1mA)
-
40
-
delay time
SCS40 to SCS43,
SOT4
SCS↑→SOT
tDEE
0
delay time
Master mode,
Round operation
(CL=50pF,
SCK4,
3tCLK_PERI1
+50
SCK↓→SCS↓
tSCC
3tCLK_PERI1+0
ns
clock switch time
SCS40 to SCS43
IOL=-2mA, IOH=2mA),
(CL=20pF,
IOL=-1mA, IOH=1mA)
CL=50pF,
-
-
-
-
-
-
5
6
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
IOL=-1mA, IOH=1mA
*1: tCSSU =SCSTR:CSSU[7:0] serial chip select timing operation clock
*2: tCSHD=SCSTR:CSHD[7:0] serial chip select timing operation clock
*3: tCSDS=SCSTR:CSDS[15:0] serial chip select timing operation clock
For details of *1, *2 and *3 above, see Hardware Manual.
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
83
D a t a S h e e t
VOH
VOL
tCSHI
VOH
SCS output
VOL
tCSDI
tCSSI
VOH
SCK output
SOT
VOL
(Normal Sync transfer)
SOT
(SPI compatible)
Master mode
V
IH
V
IH
SCS input
V
IL
V
tCSHE
IL
tCSDE
tCSSE
V
IH
SCK input
SOT
tDEE
VOL
(Normal Sync
transfer)
tDSE
VOH
VOL
SOT
(SPI compatible)
Slave mode
SCSx output
SCSy output
tSCC
VOL
SCK output
VOL
Clock switching example by master mode round operation
(x, y = 40, 41, 42, 43: x and y are different value)
84
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-6) When the Serial Chip Select is Used (SCSCR:CSEN=1)
−
−
Serial clock output signal detect level "L"(SMR, SCSFR:SCINV=1)
Serial chip select inactive level "H"(SCSCR, SCSFR:CSLVL=1)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tCSSI
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
SCS↓→SCK↑
setup time
tCSSU*1-50
-
Master mode
(CL=50pF,
SCK4,
SCS40 to SCS43
SCK↓→SCS↑
hold time
tCSHI
IOL=-2mA, IOH=2mA),
(CL=20pF,
tCSHD*2+0
-
-
-
ns
tCSDS*3-50
IOL=-1mA, IOH=1mA)
SCS deselect time
tCSDI
SCS40 to SCS43
ns
+5tCLK_PERI1
SCS↓→SCK↑
setup time
tCSSE
3tCLK_PERI1+30
ns
SCK4,
SCS40 to SCS43
SCK↓→SCS↑
hold time
Slave mode
(CL=50pF,
tCSHE
tCSDE
tDSE
0
-
-
ns
ns
ns
SCS deselect time
SCS↓→SOT
delay time
SCS40 to SCS43
IOL=-2mA, IOH=2mA),
(CL=20pF,
3tCLK_PERI1+30
-
40
IOL=-1mA, IOH=1mA)
SCS40 to SCS43,
SOT4
SCS↑→SOT
delay time
tDEE
0
-
ns
Master mode,
Round operation
(CL=50pF,
SCK4,
SCK↑→SCS↓
tSCC
3tCLK_PERI1+0
3tCLK_PERI1+50
ns
clock switch time
SCS40 to SCS43
IOL=-2mA, IOH=2mA),
(CL=20pF,
IOL=-1mA, IOH=1mA)
CL=50pF,
-
-
-
-
-
-
5
6
Mbps
Mbps
IOL=-2mA, IOH=2mA
CL=20pF,
Transfer speed
IOL=-1mA, IOH=1mA
*1: tCSSU =SCSTR:CSSU[7:0] serial Chip select timing operation clock
*2: tCSHD=SCSTR:CSHD[7:0] serial Chip select timing operation clock
*3: tCSDS=SCSTR:CSDS[15:0] serial Chip select timing operation clock
For details of *1, *2 and *3 above, see Hardware Manual.
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
85
D a t a S h e e t
VOH
VOL
tCSHI
VOH
SCS output
VOL
tCSDI
tCSSI
VOH
SCK output
SOT
VOL
(Normal Sync transfer)
SOT
(SPI compatible)
Master mode
VIH
VIH
SCS input
VIL
VIL
tCSHE
tCSDE
tCSSE
VIH
SCK input
SOT
(Normal Sync
transfer)
tDEE
VIL
VOL
tDSE
VOH
VOL
SOT
(SPI compatible)
Slave mode
tSCC
SCSx output
SCSy output
VOL
VOH
SCK output
Clock switching example by master mode round operation
(x, y = 40, 41, 42, 43: x and y are different value)
86
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-7) When the Serial Chip Select is Used (SCSCR:CSEN=1)
−
−
Serial clock output signal detect level "H"(SMR, SCSFR:SCINV=0)
Serial Chip select inactive level "L"(SCSCR, SCSFR:CSLVL=0)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tCSSI
Pin Name
Conditions
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Remarks
Min
Max
SCS↑→SCK↓
tCSSU*1-50
-
Master mode
(CL=50pF,
setup time
SCK4,
SCS40 to SCS43
SCK↑→SCS↓
tCSHI
tCSHD*2+0
-
-
IOL=-2mA, IOH=2mA),
(CL=20pF,
hold time
tCSDS*3-50
IOL=-1mA, IOH=1mA)
SCS deselect time
tCSDI
SCS40 to SCS43
+5tCLK_PERI1
SCS↑→SCK↓
tCSSE
tCSHE
tCSDE
tDSE
3tCLK_PERI1+30
-
setup time
SCK4,
SCS40 to SCS43
SCK↑→SCS↓
0
-
Slave mode
(CL=50pF,
hold time
SCS deselect time
SCS40 to SCS43
IOL=-2mA, IOH=2mA),
(CL=20pF,
3tCLK_PERI1+30
-
SCS↑→SOT
IOL=-1mA, IOH=1mA)
-
40
-
delay time
SCS40 to SCS43,
SOT4
SCS↓→SOT
tDEE
0
delay time
Master mode,
round operation
(CL=50pF,
SCK4,
3tCLK_PERI1
+50
SCK↓→SCS↑
tSCC
3tCLK_PERI1+0
ns
clock switch time
SCS40 to SCS43
IOL=-2mA,IOH=2mA),
(CL=20pF,
IOL=-1mA, IOH=1mA)
CL=50pF,
-
-
-
-
-
-
5
6
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
IOL=-1mA, IOH=1mA
*1: tCSSU =SCSTR:CSSU[7:0] serial chip select timing operation clock
*2: tCSHD=SCSTR:CSHD[7:0] serial chip select timing operation clock
*3: tCSDS=SCSTR:CSDS[15:0] serial chip select timing operation clock
For details of *1, *2 and *3 above, see Hardware Manual.
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
May 15, 2015, MB9D560_DS708-00001-3v0-E
87
D a t a S h e e t
tCSDI
VOH
VOH
SCS output
VOL
tCSHI
tCSSI
VOH
SCK output
SOT
VOL
(Normal Sync transfer)
SOT
(SPI compatible)
Master mode
tCSDE
V
IH
V
IH
SCS input
SCK input
V
IL
tCSHE
tCSSE
V
IH
V
IL
tDEE
SOT
(Normal Sync
transfer)
VOL
tDSE
VOH
VOL
SOT
(SPI compatible)
Slvae mode
tSCC
SCSx output
SCSy output
VOH
SCK output
VOL
Clock switching example by master mode round operation
(x, y = 40, 41, 42, 43: x and y are different value)
88
MB9D560_DS708-00001-3v0-E, May 15, 2015
D a t a S h e e t
(5-1-8) When the Serial Chip Select is Used (SCSCR:CSEN=1)
−
−
Serial clock output signal detect level "L"(SMR, SCSFR:SCINV=1)
Serial Chip select inactive level "L"(SCSCR, SCSFR:CSLVL=0)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tCSSI
Pin Name
Conditions
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Remarks
Min
Max
SCS↑→SCK↑
tCSSU*1-50
-
Master mode
(CL=50pF,
setup time
SCK4,
SCS40 to SCS43
SCK↓→SCS↓
tCSHD*2+0
-
-
IOL=-2mA, IOH=2mA),
(CL=20pF,
tCSHI
hold time
tCSDS*3-50
IOL=-1mA, IOH=1mA)
SCS deselect t time
tCSDI
SCS40 to SCS43
+5tCLK_PERI1
SCS↑→SCK↑
tCSSE
tCSHE
tCSDE
tDSE
3tCLK_PERI1+30
-
setup time
SCK4,
SCS40 to SCS43
SCK↓→SCS↓
0
-
Slave mode
(CL=50pF,
hold time
SCS deselect time
SCS40 to SCS43
IOL=-2mA, IOH=2mA),
(CL=20pF,
3tCLK_PERI1+30
-
SCS↑→SOT
IOL=-1mA, IOH=1mA)
-
40
-
delay time
SCS40 to SCS43,
SOT4
SCS↓→SOT
tDEE
0
delay time
Master mode,
Round operation
(CL=50pF,
SCK4,
3tCLK_PERI1
+50
SCK↑→SCS↑
tSCC
3tCLK_PERI1+0
ns
clock switch time
SCS40 to SCS43
IOL=-2mA,IOH=2mA),
(CL=20pF,
IOL=-1mA, IOH=1mA)
CL=50pF,
-
-
-
-
-
-
5
6
Mbps
Mbps
IOL=-2mA, IOH=2mA
Transfer speed
CL=20pF,
IOL=-1mA, IOH=1mA
*1: tCSSU =SCSTR:CSSU[7:0] serial chip select timing operation clock
*2: tCSHD=SCSTR:CSHD[7:0] serial chip select timing operation clock
*3: tCSDS=SCSTR:CSDS[15:0] serial chip select timing operation clock
For details of *1, *2 and *3 above, see Hardware Manual.
Notes:
−
−
−
This is the AC characteristic in CLK synchronized mode.
CL is the load capacitance applied to pins during testing.
The maximum baud rate is limited by the internal operation clock used and other parameters.
See Hardware Manual for details.
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tCSDI
VOH
VOH
SCS output
VOL
tCSHI
tCSSI
VOH
SCK output
SOT
VOL
(Normal Sync transfer)
SOT
(SPI compatible)
Master mode
tCSDE
V
IH
V
IH
SCS input
V
IL
V
IL
tCSHE
tCSSE
V
IH
SCK input
SOT
(Normal Sync
transfer)
V
IL
tDEE
VOL
tDSE
VOH
VOL
SOT
(SPI compatible)
Slave mode
tSCC
SCSx output
SCSy output
VOH
VOH
SCK output
Clock switching example by master mode round operation
(x, y = 40, 41, 42, 43: x and y are different value)
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(5-2) UART (Async Serial Interface) Timing (SMR:MD[2:0]=0b000, 0b001)
(5-2-1) When the External Clock is Selected (BGR:EXT=1)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tSLSH
tSHSL
tF
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
serial clock "L" pulse
width
tCLK_PERI1+10
-
serial clock "H" pulse
width
(CL=50pF,
IOL=-2mA, IOH=2mA),
(CL=20pF,
tCLK_PERI1+10
-
ns
SCK0 to SCK4
SCK fall time
SCK rise time
-
-
5
5
ns
IOL=-1mA, IOH=1mA)
tR
ns
tR
tF
tSHSL
tSLSH
VIH
VIH
VIH
SCK
VIL
VIL
VIL
When the external clock is selected
(5-3) LIN Interface (v2.1) (LIN Communication Control Interface (v2.1)) Timing
(SMR:MD[2:0]=0b011)
(5-3-1) When the External Clock is Selected (BGR:EXT=1)
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
tSLSH
tSHSL
tF
Pin Name
Conditions
Unit
ns
Remarks
Min
Max
serial clock "L" pulse
width
tCLK_PERI1+10
-
serial clock "H" pulse
width
(CL=50pF,
IOL=-2mA, IOH=2mA),
(CL=20pF,
tCLK_PERI1+10
-
ns
SCK0 to SCK4
SCK fall time
SCK rise time
-
-
5
5
ns
IOL=-1mA, IOH=1mA)
tR
ns
tR
tF
tSHSL
tSLSH
VIH
VIH
VIH
SCK
VIL
VIL
VIL
When the external clock is selected
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(6) Timer Input Timing
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Max
IN16 to IN21,
TIOA0 to TIOA11,
TIOB0 to TIOB11
-
4tCLK_PERI1
-
ns
4tCLK_PERI4
4tCLK_PERI4≥70ns
4tCLK_PERI4<70ns
4tCLK_PERI5≥70ns
4tCLK_PERI5<70ns
4tCLK_PERI5≥70ns
4tCLK_PERI5<70ns
4tCLK_PERI4≥70ns
4tCLK_PERI4<70ns
IN4 to IN14,
FRCK6 to FRCK10,
FRCK12 to FRCK17
-
-
-
-
-
-
-
-
ns
ns
ns
ns
70
4tCLK_PERI5
IN0 to IN3,
FRCK0 to FRCK1,
FRCK4 to FRCK5
tTIWH
,
Input pulse width
70
tTIWL
4tCLK_PERI5
AIN0, BIN0, ZIN0
AIN2, BIN2, ZIN2
70
4tCLK_PERI4
70
− Timer input timing
t
TIWH
t
TIWL
INx
FRCKx
TIOAx,TIOBx
AINx,BINx,ZINx
VIH
VIH
VIL
VIL
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(7) Trigger Input Timing
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
INT0 to INT7
RX0 to RX2
Conditions
Unit
ns
Remarks
Min
Max
-
-
-
200
-
5tCLK_SYSCPD1
5tCLK_PERI6
5tCLK_PERI5
70
-
-
ns
ADTG0,
ns
DTTI2 to DTTI3
5tCLK_PERI5≥70ns
5tCLK_PERI5<70ns
5tCLK_PERI4≥70ns
5tCLK_PERI4<70ns
4ADTG0,
DTTI0
-
-
-
-
ns
ns
Input pulse
width
tTRGH
,
tTRGL
5tCLK_PERI4
4ADTG1,
DTTI1
70
INT0 to INT7,
ADTG0,
4ADTG0, 4ADTG1,
RX0 to RX2,
-
1
-
When stop mode
µs
DTTI0 to DTTI3
− Trigger input timing
t
TRGH
t
TRGL
INTx
ADTGx
RXx
4ADTGx
VIH
VIH
VIL
VIL
DTTIx
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(8) NMI Input Timing
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Max
Input pulse width
tNMIL
NMIX
-
200
-
ns
− NMIX input timing
t
NMIL
V
IH
V
IH
NMIX
VIL
VIL
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(9) External Low-Voltage Detection
(TA: Recommended operating conditions, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
Power supply voltage
range
VDP5
VCC5
-
-
-
5.5
V
−
−
When power supply voltage falls
The original setting of detection
level is 4.1V±0.2V
Detection voltage
VDL
VCC5
*1
3.7
3.9
4.1
V
−
When power supply voltage rises
Hysteresis width
Low voltage detection
time
VHYS
Td
VCC5
-
-
-
75
-
100
-
150
30
mV
µs
Power supply voltage
fluctuation rate
-
VCC5
-
-4
-
-
V/ms
*2
*1: If the fluctuation of the power supply has exceeded the detection voltage range within the time less than
the low-voltage detection time (Td), there is the possibility to generate or release after the power supply
voltage has exceeded the detection voltage range.
*2: In order to perform the low-voltage detection at the detection voltage (VDL), be sure to suppress
fluctuation of the power supply within the limits of the power supply voltage fluctuation rate.
(10) Internal Low-Voltage Detection
(TA: Recommended operating conditions, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Symbol
Pin Name
Conditions
Unit
Remarks
Min
Typ
Max
Power supply voltage
range
VRDP5
VCC12
-
-
-
1.3
V
−
−
When power supply voltage falls
When power supply voltage rises
Detection voltage
Hysteresis width
Low voltage detection
time
VRDL
VCC12
VCC12
*1
-
0.8
20
0.9
30
1.0
50
V
VRHYS
mV
TRd
-
-
-
-
-
-
30
-
µs
Power supply voltage
fluctuation rate
-
VCC12
-4
V/ms
*2
*1: If the fluctuation of the power supply has exceeded the detection voltage range within the time less than
the low-voltage detection time (TRd), there is the possibility to generate or release after the power supply
voltage has exceeded the detection voltage range.
*2: In order to perform the low-voltage detection at the detection voltage (VRDL), be sure to suppress
fluctuation of the power supply within the limits of the power supply voltage fluctuation rate.
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13.5 A/D Converter
(1) Electrical Characteristics
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Resolution
Symbol
Pin Name
Unit
Remarks
Min
-
Typ
Max
12
-
-
-
-
-
-
bit
Non linearity error
Differential linearity
error
-4.0
+4.0
LSB
-
-
-1.9
-
-
-
+1.9
LSB
mV
mV
Zero transition
voltage
AVRL
+0.5LSB-20
AVRH
AVRL
+0.5LSB+20
AVRH
VZT
AN0 to AN31
AN0 to AN31
1LSB=(VFST-VZT)/4094
Full-scale transition
voltage
VFST
-1.5LSB-20
0.3
-1.5LSB+20
12
Sampling time
Compare time
A/D conversion time
Analog port input
current
tSMP
tCMP
tCNV
-
-
-
-
-
-
*1
*1
*1
µs
µs
µs
0.7
28
1.0
40
IAIN
AN0 to AN31
-2.0
-
2.0
µA
VAVSS≤VAIN≤VAVCC
Analog input voltage
VAIN
AVRH
AVRL
IA
AN0 to AN31
AVRH2
AVSS
-
-
AVRH
5.5
-
V
V
4.5
AVCC≥AVRH
Reference voltage
AVRL2
-
-
-
-
-
0.0
500
-
V
680
17.7
2
µA
µA
mA
µA
AVCC2
AVRH2
IAH
*2
*2
Power supply
current
IR
1
IRH
-
2.16
Variation between
channels
-
AN0 to AN31
-
-
4
LSB
*1: Time for each channel.
*2: The power supply current (VCC=AVCC=5.0V) is specified if the A/D converter is not operating and CPU is
stopped.
(2) Notes on Using A/D Converter
<About the output impedance of the analog input of external circuit>
When the external impedance is too high, the sampling time for analog voltages may not be sufficient.
In this case, it is recommended to connect the capacitor (approx. 0.1 µF) to the analog input pin.
− Analog input circuit model
Comparator
Analog input
R
C
Sampling ON
R
C
12bit A/D
3.0kΩ (max)
8.30pF (max) (4.5V ≤ AVcc ≤ 5.5V)
Note: Listed values must be considered as reference values.
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13.6 4 Channels Same Time Sampling A/D Converter
(1) Electrical Characteristics
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Resolution
Symbol
Pin Name
Unit
Remarks
Min
-
Typ
Max
12
-
-
-
-
-
-
bit
Non linearity error
Differential linearity
error
-4.0
+4.0
LSB
-
-
-1.9
-
-
-
+1.9
LSB
mV
mV
Zero transition
voltage
AVRL
+0.5LSB-20
AVRH
-1.5LSB-20
0.6
AVRL
+0.5LSB+20
AVRH
VZT
4AN0 to 4AN7
4AN0 to 4AN7
1LSB=(VFST-VZT)/4094
Full-scale transition
voltage
VFST
-1.5LSB+20
1.2
Sampling time
Compare time
A/D conversion time
Analog port input
current
tSMP
tCMP
tCNV
-
-
-
-
-
-
*1
*2
*3
µs
µs
µs
1.4
5.6
2
6.8
IAIN
4AN0 to 4AN7
-0.7
-
0.7
µA
VAVSS≤VAIN≤VAVCC
Analog input voltage
VAIN
4AN0 to 4AN7
AVRH0, AVRH1
AVRL0, AVRL1
AVSS
-
AVRH
5.5
-
V
AVRH
4.5
-
0.0
1.0
-
V
AVCC≥AVRH
Reference voltage
AVRL
-
-
-
-
-
-
-
V
IA
IAH
IR
IRH
-
1.5
27.5
4.0
4.5
20
mA
µA
mA
µA
mV
mV
1 unit operation
1 unit operation*4
1 unit operation
1 unit operation*4
AVCC0, AVCC1
AVRH0, AVRH1
Power supply
current
0.5
-
4AN0 to 4AN3
4AN4 to 4AN7
-
Variation between
channels
-
-
20
*1: 4 channels same time sampling time.
*2: Compare time for 4 channels.
*3: Conversion time for 4 channels.
*4: The power supply current (VCC=AVCC=5.0V) is specified if the A/D converter is not operating and CPU is
stopped.
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(2) Notes on Using A/D converter
<About the output impedance of the analog input of external circuit>
When the external impedance is too high, the sampling time for analog voltages may not be sufficient.
In this case, it is recommended to connect the capacitor (approx. 0.1 µF) to the analog input pin.
− Analog input circuit model
Comparator
Analog input
R
C
Sampling ON
R
C
4-SH 12bit A/D
3.8kΩ (max)
8.30pF (max) (4.5V ≤ AVcc ≤ 5.5V)
Note: Listed values must be considered as reference values.
98
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(12-3) Definition of Terms
Resolution: Analog variation that is recognized by an A/D converter.
Linearity error: Deviation of the actual conversion characteristics from a straight line that connects the zero
transition point ("0000 0000 0000" ←→ "0000 0000 0001") to the full-scale transition point ("1111 1111 1110"
←→ "1111 1111 1111").
Differential linearity error: Deviation of the input voltage from the ideal value that is required to change the
output code by 1LSB.
Linearity error
Differential linearity error
FFF
FFE
Ideal characteristics
Actual conversion
characteristics
N + 1
Actual conversion
characteristics
{1 LSB (N - 1) + VZT}
FFD
VFST
(Actually-
measured
value)
N
N - 1
N - 2
004
003
002
001
VNT
(Actually-measured value)
Actual conversion
characteristics
V(N+1)T
(Actually-measured
value)
VNT
(Actually-measured value)
Ideal characteristics
Actual conversion
characteristics
V
ZT (Actually-measured value)
Analog input
AVSS
(AVRL)
AVRH
AVSS
(AVRL)
Analog input
AVRH
VNT - {1LSB×(N-1) + VZT}
1LSB
Linearity error of digital output N =
[LSB]
V(N + 1)T - VNT
Differential linearity error of digital output N =
1LSB =
-1 LSB [LSB]
[V]
1LSB
VFST - VZT
4094
VZT: Voltage at which the digital output changes from "0x000" to "0x001".
VFST: Voltage at which the digital output changes from "0xFFE" to "0xFFF".
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13.7 Flash Memory
Value
Parameter
Min
Unit
Max
Remarks
Typ
8K Byte sector*1
-
200
800
ms
ms
ms
ms
Excluding internal preprogramming time
8K Byte sector *1
-
300
400
700
1100
2000
3700
Including internal preprogramming time
64K Byte sector *1
Sector erase time
-
Excluding internal preprogramming time
64K Byte sector *1
-
Including internal preprogramming time
Excluding overhead time at system level*1
Excluding overhead time at system level*1
Excluding overhead time at system level*1
8bit writing time
16bit writing time
ECC writing time
-
9
12
9
288
384
288
µs
µs
µs
-
-
1,000 times /20 years,
10,000 times /10 years,
100,000 times / 5 years
Erase cycle *2
Data retention time
/
Temperature at writing/erasing
Average temperature TA=+85°C*3
-
-
-
*1: The guaranteed value for erase up to 100,000 cycles
*2: Number of erase cycles for each sector
*3: This value comes from the technology qualification (using Arrhenius equation to translate high
temperature measurements into normalized value at + 85°C).
Notes:
−
While the Flash memory is written or erased, shutdown of the external power supply (VCC, VDD) is
prohibited.
−
In the application system where VCC or VDD might disappear while writing, be sure to turn the power
off by using an external low-voltage detector and NMIX pin + RSTX pin for reset input at same time.
Concretely, please execute two of the following.
1. After simultaneous input from the NMIX and RSTX pins while VDD is within the recommended
operating range, maintain VDD within the recommended operating range for at least 60 µs.
2. After simultaneous input from the NMIX and RSTX pins while VCC is within the recommended
operating range, power off VCC in observance of the standard regarding the supply voltage
fluctuation rate of the external low-voltage detector.
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13.8 R/D Converter
(TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V)
Value
Parameter
Unit
Remarks
Min
Typ
Max
Output voltage(amplitude)
Output voltage(displacement)
output current
0.4VCC-1%
0.4VCC
0.4VCC+1%
V
V
-0.4VCC+(VCC/2)
-
0.4VCC+(VCC/2)
Excitation signal
output
-
-
1
mA
kHz
V
Frequency
-
10 or 20
-
Setting with the register
AREF20-2.0
AREF21-2.0
-
-
-
-
AREF20+2.0
AREF21+2.0
24
Unit0
Unit1
Amplitude
Resolver response
signal*1
V
Maximum input frequency
kHz
Unit0
0
0
-
-
-
-
RVCC0
RVCC1
45
V
V
More than 2Vp-p
Unit1
Amplitude
Excitation input
signal*2
More than 2Vp-p
Phase difference from resolver
detection signal
-45
-4
°
Angle accuracy
Variation when
4
LSB
(conversion accuracy)
Resolution
Pausing: ±1LSB
Angle output
-
12
-
-
bit
Output delay
1.1
2.1
µs
When bandwidth
1.8 kHz mode
-
-
-
-
4000
3000
rps
rps
Maximum Angular velocity
Angular velocity
output
When bandwidth
600 kHz mode
Resolution
-
0.261
-
rps/LSB
RVCC0/2-3%
RVCC1/2-3%
-
-
RVCC0/2+3%
RVCC1/2+3%
V
V
Unit0
Reference output
voltage
AREF2 output voltage
Unit1
When bandwidth
1.8 kHz mode*3
When bandwidth
600 Hz mode*3
When bandwidth
1.8 kHz mode*3
When bandwidth
600 Hz mode*3
When bandwidth
1.8 kHz mode
When bandwidth
600 Hz mode
When bandwidth
1.8 kHz mode
When bandwidth
600 Hz mode
When bandwidth
1.8 kHz mode
When bandwidth
600 Hz mode
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.2
400
kHz
Hz
Tracking loop characteristics
(0dB cross frequency)
1.8
kHz
Hz
Tracking loop characteristics
(-3dB cross frequency)
600
4000
3000
4
rps
Operating
Maximum tracking rate
characteristics
rps
ms
Settling time (179 degree step)
Maximum angular velocity
12
ms
1,000,000
150,000
rad/s2
rad/s2
*1: Corresponding pin: COS_PLUS, COS_MINUS, SIN_PLUS, SIN_MINUS
*2: Corresponding pin: MAG_PLUS, MAG_MINUS
*3: When signal amplitude is nominal
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14.Ordering Information
Part Number
Package
MB9DF564MxEEQ-GTE1
MB9DF565MxEEQ-GTE1
MB9DF566MxEEQ-GTE1
MB9DF564LxEEQ-GTE1
MB9DF565LxEEQ-GTE1
MB9DF566LxEEQ-GTE1
208-pin plastic TEQFP
(LER208)
176-pin plastic TEQFP
(LEP176)
Notes:
−
"x" is option number. This option is following table. The detail of package, see "16. Package
Dimensions".
15.Part Number Option
Part Number Option
R/D Converter
FlexRay
Key Code
A
-
-
-
-
-
-
G
-
L
Q
-
: Supported
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16.Package Dimensions
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17.Major Changes
Page
Section
Change Results
Revision 1.0
-
-
Initial release
Revision 2.0
11
3. Product Lineup
4. Pin Assignment
5. Pin Description
10. Memory Map
Add 176 pin product
Add 176 pin product
Add 176 pin product
14, 15
16 to 33
46, 47
54, 55
Add address information of MB9DF564 and MB9DF565
Add 176 pin product
12. Pin Statuses in CPU Status
Change package name
102
14. Ordering Information
Add 176 pin product
Change package dimensions
Add 176 pin product
103, 104
16. Package Dimensions
15. Part Number Option
Revision 3.0
102
Add part number option L, Q
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed,
developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high
safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical
damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport
control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is
intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third
party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices
have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety
design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and
other abnormal operating conditions. If any products described in this document represent goods or technologies subject to
certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration
Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be
required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without
notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy,
completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other
warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the
information in this document.
Copyright © 2014-2015 Cypress
All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM
,
ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered trademarks of Spansion
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their respective owners.
108
MB9D560_DS708-00001-3v0-E, May 15, 2015
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