S29PL127J60BFI130 [SPANSION]
Flash, 8MX16, 60ns, PBGA80,;
| 型号： | S29PL127J60BFI130 |
| 厂家： | 
SPANSION |
| 描述： | Flash, 8MX16, 60ns, PBGA80, |
| 文件： | 总100页 (文件大小：2296K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S29PL-J
128/128/64/32 Megabit (8/8/4/2M x 16-Bit)
CMOS 3.0 Volt-Only, Simultaneous-Read/Write
Flash Memory with Enhanced VersatileIO™ Control
S29PL-J Cover Sheet
Data Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S29PL-J_00
Revision A
Amendment 16
Issue Date April 18, 2013
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S29PL-J
S29PL-J_00_A16 April 18, 2013
S29PL-J
128/128/64/32 Megabit (8/8/4/2M x 16-Bit)
CMOS 3.0 Volt-Only, Simultaneous-Read/Write
Flash Memory with Enhanced VersatileIO™ Control
Data Sheet
Distinctive Characteristics
Architectural Advantages
Performance Characteristics
128/128/64/32 Mbit Page Mode devices
– Page size of 8 words: Fast page read access from random locations
within the page
High Performance
– Page access times as fast as 20 ns
– Random access times as fast as 55 ns
Power consumption (typical values at 10 MHz)
– 45 mA active read current
Single power supply operation
– Full Voltage range: 2.7 to 3.6 volt read, erase, and program operations
for battery-powered applications
– 17 mA program/erase current
– 0.2 µA typical standby mode current
Dual Chip Enable inputs (only in PL129J)
– Two CE# inputs control selection of each half of the memory space
Simultaneous Read/Write Operation
– Data can be continuously read from one bank while executing erase/
program functions in another bank
– Zero latency switching from write to read operations
FlexBank Architecture (PL127J/PL064J/PL032J)
– 4 separate banks, with up to two simultaneous operations per device
– Bank A:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
– Bank B:
Software Features
Software command-set compatible with JEDEC 42.4 standard
– Backward compatible with Am29F, Am29LV, Am29DL, and AM29PDL
families and MBM29QM/RM, MBM29LV, MBM29DL, MBM29PDL
families
CFI (Common Flash Interface) compliant
– Provides device-specific information to the system, allowing host
software to easily reconfigure for different Flash devices
Erase Suspend / Erase Resume
– Suspends an erase operation to allow read or program operations in
other sectors of same bank
Program Suspend / Program Resume
– Suspends a program operation to allow read operation from sectors
other than the one being programmed
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
– Bank C:
PL127J - 48 Mbit (32 Kw x 96)
Unlock Bypass Program command
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
– Reduces overall programming time when issuing multiple program
command sequences
– Bank D:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
FlexBank Architecture (PL129J)
– 4 separate banks, with up to two simultaneous operations per device
– CE#1 controlled banks:
Bank 1A: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Bank 1B: PL129J - 48Mbit (32Kw x 96)
– CE#2 controlled banks:
Hardware Features
Ready/Busy# pin (RY/BY#)
– Provides a hardware method of detecting program or erase cycle
completion
Hardware reset pin (RESET#)
– Hardware method to reset the device to reading array data
WP#/ ACC (Write Protect/Acceleration) input
– At V , hardware level protection for the first and last two 4K word
IL
Bank 2A: PL129J - 48 Mbit (32Kw x 96)
Bank 2B: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
sectors.
– At V , allows removal of sector protection
IH
– At V , provides accelerated programming in a factory setting
HH
Persistent Sector Protection
– A command sector protection method to lock combinations of individual
sectors and sector groups to prevent program or erase operations within
that sector
Enhanced VersatileI/O (V ) Control
IO
– Output voltage generated and input voltages tolerated on all control
inputs and I/Os is determined by the voltage on the V pin
IO
– V options at 1.8 V and 3 V I/O for PL127J and PL129J devices
IO
– 3V V for PL064J and PL032J devices
IO
– Sectors can be locked and unlocked in-system at V level
Secured Silicon Sector region
CC
– Up to 128 words accessible through a command sequence
– Up to 64 factory-locked words
– Up to 64 customer-lockable words
Both top and bottom boot blocks in one device
Manufactured on 110 nm process technology
Data Retention: 20 years typical
Password Sector Protection
– A sophisticated sector protection method to lock combinations of
individual sectors and sector groups to prevent program or erase
operations within that sector using a user-defined 64-bit password
Package options
– Standard discrete pinouts
11 x 8 mm, 80-ball Fine-pitch BGA (PL127J) (VBG080)
8.15 x 6.15 mm, 48-ball Fine pitch BGA (PL064J/PL032J)
(VBK048)
Cycling Endurance: 1 million cycles per sector typical
– MCP-compatible pinout
8 x 11.6 mm, 64-ball Fine-pitch BGA (PL127J)
7 x 9 mm, 56-ball Fine-pitch BGA (PL064J and PL032J)
Compatible with MCP pinout, allowing easy integration of RAM into
existing designs
– 20 x 14 mm, 56-pin TSOP (PL127J) (TS056)
Publication Number S29PL-J_00
Revision A
Amendment 16
Issue Date April 18, 2013
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-
duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-
binations offered may occur.
D a t a S h e e t
General Description
The PL127J/PL129J/PL064J/PL032J is a 128/128/64/32 Mbit, 3.0 volt-only Page Mode and Simultaneous
Read/Write Flash memory device organized as 8/8/4/2 Mwords. The devices are offered in the following
packages:
– 11 mm x 8 mm, 80-ball Fine-pitch BGA standalone (PL127J)
– 8 mm x 11.6 mm, 64-ball Fine-pitch BGA multi-chip compatible (PL127J)
– 8.15 mm x 6.15 mm, 48-ball Fine-pitch BGA standalone (PL064J/PL032J)
– 7 mm x 9 mm, 56-ball Fine-pitch BGA multi-chip compatible (PL064J and PL032J)
– 20 mm x 14 mm, 56-pin TSOP (PL127J)
The word-wide data (x16) appears on DQ15-DQ0. This device can be programmed in-system or in standard
EPROM programmers. A 12.0 V VPP is not required for write or erase operations.
The device offers fast page access times of 20 to 30 ns, with corresponding random access times of 55 to
70 ns, respectively, allowing high speed microprocessors to operate without wait states. To eliminate bus
contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.
Note: Device PL129J has 2 chip enable inputs (CE1#, CE2#).
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S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table of Contents
Distinctive Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.
Simultaneous Read/Write Operation with Zero Latency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1
1.2
Page Mode Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Standard Flash Memory Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.
3.
4.
5.
6.
7.
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Simultaneous Read/Write Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Simultaneous Read/Write Block Diagram (PL129J) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1
7.2
7.3
7.4
7.5
7.6
Special Package Handling Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
80-Ball Fine-Pitch BGA—PL127J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
64-Ball Fine-Pitch BGA—MCP Compatible—PL127J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
48-Ball Fine-Pitch BGA, PL064J and PL032J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
56-Pin TSOP 20 x 14 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
56-Ball Fine-Pitch Ball Grid Array, PL064J and PL032J . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.
9.
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10. Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
10.1 Requirements for Reading Array Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
10.2 Simultaneous Read/Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10.3 Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10.4 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10.5 Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.6 RESET#: Hardware Reset Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.7 Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.8 Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
10.9 Selecting a Sector Protection Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
11. Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.1 Persistent Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.2 Password Sector Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.3 WP# Hardware Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.4 Selecting a Sector Protection Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
12. Persistent Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
12.1 Persistent Protection Bit (PPB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
12.2 Persistent Protection Bit Lock (PPB Lock). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
12.3 Dynamic Protection Bit (DYB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
12.4 Persistent Sector Protection Mode Locking Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
13. Password Protection Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
13.1 Password and Password Mode Locking Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
13.2 64-bit Password . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
13.3 Write Protect (WP#). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
13.4 High Voltage Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
13.5 Temporary Sector Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
13.6 Secured Silicon Sector Flash Memory Region . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
13.7 Hardware Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
14. Common Flash Memory Interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
15. Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
15.1 Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
April 18, 2013 S29PL-J_00_A16
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D a t a S h e e t
15.2 Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
15.3 Autoselect Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
15.4 Enter/Exit Secured Silicon Sector Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
15.5 Word Program Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
15.6 Chip Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
15.7 Sector Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
15.8 Erase Suspend/Erase Resume Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
15.9 Program Suspend/Program Resume Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
15.10 Command Definitions Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
16. Write Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.1 DQ7: Data# Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.2 RY/BY#: Ready/Busy#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
16.3 DQ6: Toggle Bit I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
16.4 DQ2: Toggle Bit II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
16.5 Reading Toggle Bits DQ6/DQ2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
16.6 DQ5: Exceeded Timing Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
16.7 DQ3: Sector Erase Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
17. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
18. Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
19. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
20. AC Characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
20.1 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
20.2 Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
20.3 Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
20.4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
20.5 Erase/Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
20.6 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
21. Protect/Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
21.1 Controlled Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
22. Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
22.1 BGA Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
22.2 TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
23. Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
23.1 VBG080—80-Ball Fine-pitch Ball Grid Array 8 x 11 mm Package (PL127J). . . . . . . . . . . . . 90
23.2 VBH064—64-Ball Fine-pitch Ball Grid Array 8 x 11.6 mm package (PL127J). . . . . . . . . . . . 91
23.3 VBK048—48-Ball Fine-pitch Ball Grid Array 8.15 x 6.15 mm package
(PL032J and PL064J). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
23.4 VBU056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J) . . . . . . . . . . . . 93
23.5 TS056—20 x 14 mm, 56-pin TSOP (PL127J) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
24. Revision Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
24.1 Revision A0 (January 29, 2004). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
24.2 Revision A1 (February 12, 2004). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
24.3 Revision A2 (February 17, 2004). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
24.4 Revision A3 (February 25, 2004). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
24.5 Revision A4 (February 27, 2004). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
24.6 Revision A5 (March 15, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
24.7 Revision A6 (August 30, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
24.8 Revision A7 (March 2, 2005) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
24.9 Revision A8 (July 29, 2005). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
24.10 Revision A9 (September 22, 2006) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
24.11 Revision A10 (September 7, 2007) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
24.12 Revision A11 (September 10, 2009) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
24.13 Revision A12 (December 18, 2009). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
24.14 Revision A13 (Febuary 1, 2011) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
24.15 Revision A14 (July 8, 2011). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
24.16 Revision A15 (March 14, 2012) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
6
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24.17 Revision A16 (April 9, 2013) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
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Figures
Figure 7.1
Figure 7.2
Figure 7.3
Figure 7.4
Figure 7.5
80-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL127J . . . . . . . . . . . . . . . . . . . . . 17
64-Ball Fine-Pitch BGA, MCP Compatible, Top View, Balls Facing Down—PL127J . . . . . . 18
48-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL064J—PL032J: C4(A21)=NC . . . 19
56-Pin TSOP 20 x 14 mm Configuration—PL127J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
56-ball Fine-Pitch BGA, Top View, Balls Facing Down,—PL064J and PL032J,. . . . . . . . . . . 21
Figure 13.1 In-System Sector Protection/Sector Unprotection Algorithms . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 13.2 Temporary Sector Unprotect Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 13.3 Secured Silicon Sector Protect Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 15.1 Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 15.2 Erase Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Figure 16.1 Data# Polling Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Figure 16.2 Toggle Bit Algorithm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Figure 17.1 Maximum Overshoot Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Figure 20.1 Test Setups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Figure 20.2 Input Waveforms and Measurement Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 20.3 Read Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 20.4 Page Read Operation Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 20.5 Reset Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 20.6 Program Operation Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 20.7 Accelerated Program Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 20.8 Chip/Sector Erase Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 20.9 Back-to-back Read/Write Cycle Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Figure 20.10 Data# Polling Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Figure 20.11 Toggle Bit Timings (During Embedded Algorithms). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 20.12 DQ2 vs. DQ6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 21.1 Temporary Sector Unprotect Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 21.2 Sector/Sector Block Protect and Unprotect Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 21.3 Alternate CE# Controlled Write (Erase/Program) Operation Timings . . . . . . . . . . . . . . . . . . 87
Figure 21.4 Timing Diagram for Alternating Between CE1# and CE2# Control . . . . . . . . . . . . . . . . . . . . 88
8
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Tables
Table 10.1
Table 10.2
Table 10.3
Table 10.4
Table 10.5
Table 10.6
Table 10.7
Table 10.8
Table 10.9
PL127J Device Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PL129J Device Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Page Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Bank Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PL127J Sector Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PL064J Sector Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PL032J Sector Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
S29PL129J Sector Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Secured Silicon Sector Addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 10.10 Autoselect Codes (High Voltage Method) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 10.11 Autoselect Codes for PL129J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 10.12 PL127J Boot Sector/Sector Block Addresses for Protection/Unprotection . . . . . . . . . . . . . . 45
Table 10.13 PL129J Boot Sector/Sector Block Addresses for Protection/Unprotection . . . . . . . . . . . . . . 46
Table 10.14 PL064J Boot Sector/Sector Block Addresses for Protection/Unprotection . . . . . . . . . . . . . . 47
Table 10.15 Sector Protection Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 14.1
Table 14.2
Table 14.3
Table 14.4
Table 15.1
Table 15.2
Table 16.1
Table 19.1
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Table 20.5
Table 21.1
Table 21.2
Table 21.3
Table 21.4
CFI Query Identification String. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
System Interface String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Primary Vendor-Specific Extended Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Memory Array Command Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Sector Protection Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Write Operation Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
CMOS Compatible. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Test Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Key To Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Read-Only Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Hardware Reset (RESET#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Erase and Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Temporary Sector Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Alternate CE# Controlled Erase and Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . 87
CE1#/CE2# Timing (S29PL129J only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Erase And Programming Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
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1. Simultaneous Read/Write Operation with Zero Latency
The Simultaneous Read/Write architecture provides simultaneous operation by dividing the memory space
into 4 banks, which can be considered to be four separate memory arrays as far as certain operations are
concerned. The device can improve overall system performance by allowing a host system to program or
erase in one bank, then immediately and simultaneously read from another bank with zero latency (with two
simultaneous operations operating at any one time). This releases the system from waiting for the completion
of a program or erase operation, greatly improving system performance.
The device can be organized in both top and bottom sector configurations. The banks are organized as
follows:
Bank
PL127J Sectors
16 Mbit (4 Kw x 8 and 32 Kw x 31)
48 Mbit (32 Kw x 96)
PL064J Sectors
8 Mbit (4 Kw x 8 and 32 Kw x 15)
24 Mbit (32 Kw x 48)
PL032J Sectors
4 Mbit (4 Kw x 8 and 32 Kw x 7)
12 Mbit (32 Kw x 24)
A
B
C
D
48 Mbit (32 Kw x 96)
24 Mbit (32 Kw x 48)
12 Mbit (32 Kw x 24)
16 Mbit (4 Kw x 8 and 32 Kw x 31)
8 Mbit (4 Kw x 8 and 32 Kw x 15)
4 Mbit (4 Kw x 8 and 32 Kw x 7)
Bank
1A
PL129J Sectors
CE# Control
CE1#
16 Mbit (4 Kw x 8 and 32 Kw x 31)
48 Mbit (32 Kw x 96)
1B
CE1#
2A
48 Mbit (32 Kw x 96)
CE2#
2B
16 Mbit (4 Kw x 8 and 32 Kw x 31)
CE2#
1.1
Page Mode Features
The page size is 8 words. After initial page access is accomplished, the page mode operation provides fast
read access speed of random locations within that page.
10
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1.2
Standard Flash Memory Features
The device requires a single 3.0 volt power supply (2.7 V to 3.6 V) for both read and write functions.
Internally generated and regulated voltages are provided for the program and erase operations.
The device is entirely command set compatible with the JEDEC 42.4 single-power-supply Flash standard.
Commands are written to the command register using standard microprocessor write timing. Register
contents serve as inputs to an internal state-machine that controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed for the programming and erase operations. Reading
data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. The Unlock Bypass mode
facilitates faster programming times by requiring only two write cycles to program data instead of four. Device
erasure occurs by executing the erase command sequence.
The host system can detect whether a program or erase operation is complete by reading the DQ7 (Data#
Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is
ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection measures include a low VCC detector that automatically inhibits write operations
during power transitions. The hardware sector protection feature disables both program and erase operations
in any combination of sectors of memory. This can be achieved in-system or via programming equipment.
The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is not selected for erasure. True background erase can
thus be achieved. If a read is needed from the Secured Silicon Sector area (One Time Program area) after an
erase suspend, then the user must use the proper command sequence to enter and exit this region.
The Program Suspend/Program Resume feature enables the user to hold the program operation to read
data from any sector that is not selected for programming. If a read is needed from the Secured Silicon Sector
area, Persistent Protection area, Dynamic Protection area, or the CFI area, after a program suspend, then the
user must use the proper command sequence to enter and exit this region.
The device offers two power-saving features. When addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode. The system can also place the device into the standby
mode. Power consumption is greatly reduced in both these modes.
The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The data
is programmed using hot electron injection.
April 18, 2013 S29PL-J_00_A16
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2. Ordering Information
The order number (Valid Combination) is formed by a valid combinations of the following:
S29PL-J
55
BA
W
00
0
Packing Type
0
1
2
3
= Tray
= Tube
= 7-inch Tape and Reel
= 13-inch Tape and Reel
Model Number (Additional Ordering Options)
00 = 3.0V V , 80-ball 11 x 8 mm FBGA (VBG080)
IO
01 = 1.8V V , 80-ball 11 x 8 mm FBGA (VBG080)
IO
02 = 3.0V V , 64-ball 8 x 11.6 mm FBGA (VBH064)
IO
12 = 3.0V V , 48-ball 8 x 6 mm FBGA (VBK048)
IO
13 = 3.0V V , 56-pin 20 x 14 mm TSOP (TS056)
IO
15 = 3.0V V , 56-ball 7 x 9 mm FBGA (VBU056)
IO
Temperature Range
W = Wireless (–25°C to +85°C)
I
= Industrial (–40°C to +85°C)
Package Type
BA = Fine-Pitch Grid Array (FBGA),
Standard
BF = Fine-Pitch Grid Array (FBGA)
Lead (Pb)-free
TA = Thin Small Outline Package (TSOP) Standard Pinout
Standard
TF = Thin Small Outline Package (TSOP) Standard Pinout
Lead (Pb)-free
Clock Speed
55 = 55 ns (Contact factory for availability)
60 = 60 ns
65 = 65 ns
70 = 70 ns
80 = 80 ns
Device Number/Description
128 Megabit (8 M x 16-Bit), 64 Megabit (4 M x 16-Bit), 32 Megabit (2 M x 16-Bit)
CMOS Flash Memory, Simultaneous-Read/Write, Page-Mode Flash Memory,
3.0 Volt-only Read, Program, and Erase
Valid Combinations to be Supported for this Device
128 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description
Package
Type
Temperature
Range
Additional
Ordering Options
CE#
Configuration
Speed (ns)
60, 65, 70
80
S29PL127J
S29PL127J
BA, BF, TA, TF
BA, BF
W, I
W, I
00, 13
01
Single CE#
Single CE#
64 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description
Package
Type
Temperature
Range
Additional
Ordering Options
Speed (ns)
S29PL064J
55, 60, 70
BA, BF
W, I
12, 15
32 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description
Package
Type
Temperature
Range
Additional
Ordering Options
Speed (ns)
S29PL032J
55, 60, 70
BA, BF
W, I
12, 15
12
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Valid Combinations for BGA Packages
Order Number (Note 1)
Speed (ns)
55, 60, 65, 70 (3)
80
V
Range
IO
PL129J, PL127J,PL064J, PL032J
PL129J, PL127J
2.7–3.6
1.65–1.95
Notes
1. Please contact the factory for PL129J availability.
2. BGA package marking omits leading S29 and packing type designator from ordering part number.
3. 55 ns speed only supported for PL032J and PL127J.
Valid Combinations for TSOP Packages
Order Number
Speed (ns)
V
Range
IO
S29PL127J
60, 70
2.7–3.6
Note
TSOP package markings omit packing type designator from ordering part number.
3. Product Selector Guide
Part Number →
S29PL032J/S29PL064J/S29PL0127J/S29PL129J
55
V
,V = 2.7 V – 3.6 V
60
—
65
—
—
70
—
CC IO
(See Note)
—
Speed Option
V
V
= 2.7 V – 3.6 V,
= 1.65 V – 1.95 V
CC
80
IO
(PL127J and PL129J only)
Max Access Time, ns (t
)
55
ACC
60
25
65
80
30
70
30
(See Note)
Max CE# Access, ns (t
)
CE
Max Page Access, ns (t
)
PACC
20
(See Note)
Max OE# Access, ns (t
)
OE
Note
55 ns speed bin only supported for PL032J and PL064J.
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4. Block Diagram
DQ15–DQ0
RY/BY#
V
CC
V
SS
Sector
Switches
V
IO
Input/Output
Buffers
RESET#
WE#
Erase Voltage
Generator
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
CE#
OE#
Data Latch
Y-Gating
Y-Decoder
X-Decoder
V
CC
Detector
Timer
Amax–A3
Cell Matrix
A2–A0
Notes
1. RY/BY# is an open drain output.
2. Amax = A22 (PL127J), A21 (PL129J and PL064J), A20 (PL032J)
3. For PL129J there are two CE# (CE1# and CE2#)
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D a t a S h e e t
5. Simultaneous Read/Write Block Diagram
V
V
CC
OE#
SS
Mux
Bank A
Bank A Address
Amax–A0
X-Decoder
Bank B Address
RY/BY#
Bank B
X-Decoder
Amax–A0
RESET#
STATE
CONTROL
&
COMMAND
REGISTER
Status
WE#
DQ15–DQ0
CE#
WP#/ACC
Control
Mux
X-Decoder
Bank C
DQ0–DQ15
Bank C Address
Bank D Address
X-Decoder
Bank D
Amax–A0
Mux
Note
Amax = A22 (PL127J), A21 (PL064J), A20 (PL032J)
April 18, 2013 S29PL-J_00_A16
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15
D a t a S h e e t
6. Simultaneous Read/Write Block Diagram (PL129J)
V
V
CC
OE#
SS
CE1#=L
CE2#=H
Mux
Bank 1A
Bank 1A Address
Bank 1B Address
A21–A0
X-Decoder
RY/BY#
Bank 1B
X-Decoder
A21–A0
RESET#
WE#
CE1#
STATE
CONTROL
&
Status
DQ15–DQ0
CE2#
COMMAND
REGISTER
Control
Mux
WP#/ACC
CE1#=H
CE2#=L
X-Decoder
Bank 2A
DQ0–DQ15
Bank 2A Address
Bank 2B Address
X-Decoder
Bank 2B
A21–A0
Mux
Note
Amax = A21 (PL129J)
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D a t a S h e e t
7. Connection Diagrams
7.1
7.1.1
Special Package Handling Instructions
TSOP, BGA, PDIP, SSOP, and PLCC Packages
Special handling is required for Flash Memory products in molded packages.
The package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
7.1.2
FBGA Packages
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
7.2
80-Ball Fine-Pitch BGA—PL127J
Figure 7.1 80-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL127J
A8
NC
B8
NC
C8
NC
D8
E8
F8
G8
H8
NC
J8
K8
NC
L8
M8
NC
A22
NC
V
IO
V
SS
NC
NC
A7
NC
B7
NC
C7
D7
E7
F7
G7
H7
NC
J7
K7
L7
M7
NC
A13
A12
A14
A15
A16
DQ15
V
SS
NC
C6
A9
D6
A8
E6
F6
G6
H6
J6
K6
A10
A11
DQ7
DQ14
DQ13
DQ6
C5
D5
E5
F5
G5
H5
J5
K5
WE#
RESET#
A21
A19
DQ5
DQ12
V
DQ4
CC
C4
D4
E4
F4
G4
H4
J4
K4
RY/BY# WP#/ACC
A18
A20
DQ2
DQ10
DQ11
DQ3
C3
A7
D3
E3
A6
F3
A5
G3
H3
J3
K3
A17
DQ0
DQ8
DQ9
DQ1
A2
NC
B2
NC
C2
A3
D2
A4
E2
A2
F2
A1
G2
A0
H2
J2
K2
L2
M2
NC
CE#
OE#
V
NC
SS
A1
NC
B1
NC
C1
NC
D1
NC
E1
F1
G1
NC
H1
J1
K1
NC
L1
M1
NC
NC
NC
V
IO
NC
NC
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D a t a S h e e t
7.3
64-Ball Fine-Pitch BGA—MCP Compatible—PL127J
Figure 7.2 64-Ball Fine-Pitch BGA, MCP Compatible, Top View, Balls Facing Down—PL127J
A1
NC
A10
NC
B5
B6
RFU
RFU
C3
A7
C4
C5
C6
C7
A8
C8
A11
RFU
WP#/ACC WE#
D2
A3
D3
A6
D4
D5
D6
D7
D8
D9
A12
A15
RFU
RESET# RFU
A19
E2
A2
E3
A5
E4
E5
E6
E7
A9
E8
E9
RY/BY # A20
A13
A21
A18
F2
A1
F3
A4
F4
F7
F8
F9
A17
A10
A14
A22
G2
A0
G3
G4
G7
G8
G9
VSS
DQ1
DQ6
RFU
A16
H2
H3
H4
H5
H6
H7
H8
H9
CE#f1
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
VCCf
J2
J3
J4
DQ10
K4
J5
VCCf
K5
J6
J7
DQ12
K7
J8
J9
RFU
DQ0
K3
RFU
K6
DQ7
K8
VSS
DQ8
DQ2
DQ11
RFU
DQ5
DQ14
L5
L6
RFU
RFU
M1
NC
M10
NC
18
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D a t a S h e e t
7.4
48-Ball Fine-Pitch BGA, PL064J and PL032J
Figure 7.3 48-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL064J—PL032J: C4(A21)=NC
A6
B6
C6
D6
E6
F6
G6
H6
VSS
A13
A12
A14
A15
A16
NC
DQ15
A5
A9
B5
A8
C5
D5
E5
F5
G5
H5
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE#
RESET#
A21
A19
DQ5
DQ12
V
DQ4
CC
A3
B3
C3
D3
E3
F3
G3
H3
RY/BY# WP#/ACC
A18
A20
DQ2
DQ10
DQ11
DQ3
A2
A7
B2
C2
A6
D2
A5
E2
F2
G2
H2
A17
DQ0
DQ8
DQ9
DQ1
A1
A3
B1
A4
C1
A2
D1
A1
E1
A0
F1
G1
H1
CE#
OE#
VSS
April 18, 2013 S29PL-J_00_A16
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19
D a t a S h e e t
7.5
56-Pin TSOP 20 x 14 mm
Figure 7.4 56-Pin TSOP 20 x 14 mm Configuration—PL127J
RESET#
RY/BY#
A0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
WP#/ACC
WE#
NC
A22
A21
A20
OE#
NC
CE#
VSS
DQ15
DQ14
DQ13
DQ12
VSSQ
VCCQ
DQ11
DQ10
DQ9
DQ8
VCC
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
A1
A2
A3
A4
A5
VCC
DQ0
DQ1
DQ2
DQ3
VSSQ
VCCQ
DQ4
DQ5
DQ6
DQ7
VSS
NC
A6
A7
A8
A9
A10
A11
A12
A19
A18
A17
A16
A15
A14
A13
For this family of products, a single multi-chip compatible package (TSOP) is offered for each density to allow
both standalone and multi-chip qualification using a single, adaptable package. This new methodology allows
package standardization resulting in faster development. The multi-chip compatible package includes all the
pins required for standalone device operation and verification. In addition, extra pins are included for insertion
of common data storage or logic devices to be used for multi-chip products. If a standalone device is required,
the extra multi-chip specific pins are not connected and the standalone device operates normally. The multi-
chip compatible package sizes were chosen to serve the largest number of combinations possible. There are
only a few cases where a larger package size would be required to accommodate the multi-chip combination.
This multi-chip compatible package set does not allow for direct package migration from the Am29BDS128H,
Am29BDS128G, Am29BDS640G products, which use legacy standalone packages.
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D a t a S h e e t
7.6
56-Ball Fine-Pitch Ball Grid Array, PL064J and PL032J
Figure 7.5 56-ball Fine-Pitch BGA, Top View, Balls Facing Down,—PL064J and PL032J,
A2
A7
B2
A6
C2
A3
RFU
B3
A4
WP/ACC
B4
A5
WE#
B5
A6
A8
A7
A11
B7
B1
A3
C1
A2
D1
A1
B6
B8
A15
C8
RFU
C3
RST#
C4
RFU
C5
A19
C6
A12
C7
A5
D2
A4
A18
D3
RY/BY#
A20
A9
D6
A13
D7
A21
D8
A17
A10
A14
RFU
E1
A0
E2
E3
E6
E7
E8
VSS
DQ1
DQ6
RFU
A16
F1
F2
F3
F4
F5
F6
F7
F8
CE1#f
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
RFU
G8
G1
G2
G3
DQ10
H3
G4
G5
G6
G7
RFU
DQ0
VCCf
RFU
DQ12
DQ7
VSS
H7
H2
H4
H6
H5
DQ14
DQ8
DQ2
DQ5
DQ11
RFU
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D a t a S h e e t
8. Pin Description
Amax–A0
DQ15–DQ0
CE#
Address bus
16-bit data inputs/outputs/float
Chip Enable Inputs
Output Enable Input
Write Enable
OE#
WE#
VSS
Device Ground
Not Connected. No device internal signal is connected to the package connector nor is there any future plan to
use the connector for a signal. The connection may safely be used for routing space for a signal on a Printed
Circuit Board (PCB).
NC
Reserved for Future Use. Not currently connected internally but the pin/ball location should be left
unconnected and unused by PCB routing channel for future compatibility. The pin/ball may be
used by a signal in the future.
RFU
Ready/Busy output and open drain.
When RY/BY#= VIH, the device is ready to accept read operations and commands. When RY/
BY#= VOL, the device is either executing an embedded algorithm or the device is executing a
hardware reset operation.
RY/BY#
Write Protect/Acceleration Input.
When WP#/ACC= VIL, the highest and lowest two 4K-word sectors are write protected regardless
of other sector protection configurations. When WP#/ACC= VIH, these sector are unprotected
unless the DYB or PPB is programmed. When WP#/ACC= VHH, program and erase operations
are accelerated.
WP#/ACC
VIO
Input/Output Buffer Power Supply
(1.65 V to 1.95 V (for PL127J and PL129J) or 2.7 V to 3.6 V (for all PLxxxJ devices))
Chip Power Supply
VCC
(2.7 V to 3.6 V or 2.7 to 3.3 V)
RESET#
Hardware Reset Pin
Chip Enable Inputs.
CE1#, CE2#
CE1# controls the 64Mb in Banks 1A and 1B.
CE2# controls the 64 Mb in Banks 2A and 2B. (Only for PL129J)
Note
Amax = A22 (PL127J), A21 (PL129J and PL064J), A20 (PL032J)
9. Logic Symbol
max+1
Amax–A0
16
DQ15–DQ0
CE#
OE#
WE#
WP#/ACC
RESET#
RY/BY#
V
(V
)
CCQ
IO
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D a t a S h e e t
10. Device Bus Operations
This section describes the requirements and use of the device bus operations, which are initiated through the
internal command register. The command register itself does not occupy any addressable memory location.
The register is a latch used to store the commands, along with the address and data information needed to
execute the command. The contents of the register serve as inputs to the internal state machine. The state
machine outputs dictate the function of the device. Table 10.1 lists the device bus operations, the inputs and
control levels they require, and the resulting output. The following subsections describe each of these
operations in further detail.
Table 10.1 PL127J Device Bus Operations
Addresses
(Amax–A0)
DQ15–
DQ0
Operation
CE#
OE#
L
WE#
H
RESET#
WP#/ACC
Read
L
H
H
X
A
A
D
OUT
IN
IN
Write
L
H
L
X (Note 2)
D
IN
Standby
V
± 0.3 V
X
X
V
± 0.3 V
X (Note 2)
X
High-Z
High-Z
High-Z
IO
IO
Output Disable
Reset
L
H
H
H
L
X
X
X
X
X
X
X
Temporary Sector Unprotect
(High Voltage)
X
X
X
V
X
A
D
IN
ID
IN
Table 10.2 PL129J Device Bus Operations
Addresses
(A21–A0)
DQ15–
DQ0
Operation
CE1#
CE2#
OE#
WE#
RESET#
WP#/ACC
L
H
L
H
L
Read
L
H
H
X
A
A
D
OUT
IN
IN
H
L
X
Write
H
X
L
H
D
IN
(Note 2)
H
V
± ±
V
±
V
±
IO
0.3 V
IO
0.3 V
IO
0.3 V
Standby
X
X
X
High-Z
Output Disable
Reset
L
L
H
X
H
X
H
L
X
X
X
X
High-Z
High-Z
X
X
Temporary Sector Unprotect
(High Voltage)
X
X
X
X
V
X
A
D
IN
ID
IN
Legend:
L = Logic Low = V , H = Logic High = V , V = 11.5–12.5 V, V = 8.5–9.5 V, X = Don’t Care, SA = Sector Address, A = Address In, D
IL
IH
ID
HH
IN
IN
= Data In, D
= Data Out
OUT
Notes
1. The sector protect and sector unprotect functions may also be implemented via programming equipment. See High Voltage Sector
Protection on page 52.
2. WP#/ACC must be high when writing to upper two and lower two sectors.
10.1 Requirements for Reading Array Data
To read array data from the outputs, the system must drive the OE# and appropriate CE# pins (For PL129J -
CE1#/CE2# pins) to VIL. In PL129J, CE1# and CE2# are the power control and select the lower (CE1#) or
upper (CE2#) halves of the device. CE# is the power control. OE# is the output control and gates array data
to the output pins. WE# should remain at VIH.
The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses
on the device address inputs produce valid data on the device data outputs. Each bank remains enabled for
read access until the command register contents are altered.
Refer to Table 21.3 on page 88 for timing specifications and to Figure 20.3 on page 77 for the timing diagram.
ICC1 in the DC Characteristics table represents the active current specification for reading array data.
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10.1.1
10.1.2
Random Read (Non-Page Read)
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable
access time (tCE) is the delay from the stable addresses and stable CE# to valid data at the output inputs. The
output enable access time is the delay from the falling edge of the OE# to valid data at the output inputs
(assuming the addresses have been stable for at least tACC–tOE time).
Page Mode Read
The device is capable of fast page mode read and is compatible with the page mode Mask ROM read
operation. This mode provides faster read access speed for random locations within a page. Address bits
Amax–A3 select an 8 word page, and address bits A2–A0 select a specific word within that page. This is an
asynchronous operation with the microprocessor supplying the specific word location.
The random or initial page access is tACC or tCE and subsequent page read accesses (as long as the
locations specified by the microprocessor falls within that page) is equivalent to tPACC. When CE# (CE1# and
CE#2 in PL129J) is deasserted (=VIH), the reassertion of CE# (CE1# or CE#2 in PL129J) for subsequent
access has access time of tACC or tCE. Here again, CE# (CE1# /CE#2 in PL129J)selects the device and OE#
is the output control and should be used to gate data to the output inputs if the device is selected. Fast page
mode accesses are obtained by keeping Amax–A3 constant and changing A2–A0 to select the specific word
within that page.
Table 10.3 Page Select
Word
A2
0
A1
0
A0
0
Word 0
Word 1
Word 2
Word 3
Word 4
Word 5
Word 6
Word 7
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
10.2 Simultaneous Read/Write Operation
In addition to the conventional features (read, program, erase-suspend read, erase-suspend program, and
program-suspend read), the device is capable of reading data from one bank of memory while a program or
erase operation is in progress in another bank of memory (simultaneous operation). The bank can be
selected by bank addresses (PL127J: A22–A20, PL129J and PL064J: A21–A19, PL032J: A20–A18) with
zero latency.
The simultaneous operation can execute multi-function mode in the same bank.
Table 10.4 Bank Select
Bank
PL127J: A22–A20, PL064J: A21–A19, PL032J: A20–A18
Bank A
Bank B
Bank C
Bank D
000
001, 010, 011
100, 101, 110
111
Bank
CE1#
CE2#
PL129J: A21–A20
Bank 1A
Bank 1B
Bank 2A
Bank 2B
0
0
1
1
1
1
0
0
00
01, 10, 11
00, 01, 10
11
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D a t a S h e e t
10.3 Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and CE# (CE1# or CE#2 in PL129J) to VIL, and OE# to VIH.
The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the
Unlock Bypass mode, only two write cycles are required to program a word, instead of four. Word Program
Command Sequence on page 61 has details on programming data to the device using both standard and
Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 10.4 on page 24
indicates the set of address space that each sector occupies. A “bank address” is the set of address bits
required to uniquely select a bank. Similarly, a “sector address” refers to the address bits required to uniquely
select a sector. Command Definitions on page 59 has details on erasing a sector or the entire chip, or
suspending/resuming the erase operation.
ICC2 in the DC Characteristics on page 75 represents the active current specification for the write mode. See
the timing specification tables and timing diagrams in section Reset on page 79 for write operations.
10.3.1
Accelerated Program Operation
The device offers accelerated program operations through the ACC function. This function is primarily
intended to allow faster manufacturing throughput at the factory.
If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass
mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the
time required for program operations. The system would use a two-cycle program command sequence as
required by the Unlock Bypass mode. Removing VHH from the WP#/ACC pin returns the device to normal
operation. Note that VHH must not be asserted on WP#/ACC for operations other than accelerated
programming, or device damage may result. In addition, the WP#/ACC pin should be raised to VCC when not
in use. That is, the WP#/ACC pin should not be left floating or unconnected; inconsistent behavior of the
device may result.
10.3.2
Autoselect Functions
If the system writes the autoselect command sequence, the device enters the autoselect mode. The system
can then read autoselect codes from the internal register (which is separate from the memory array) on
DQ15–DQ0. Standard read cycle timings apply in this mode. Refer to the Table 10.9, Secured Silicon Sector
Addresses on page 43 and Autoselect Command Sequence on page 60 for more information.
10.4 Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In this
mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state,
independent of the OE# input.
The device enters the CMOS standby mode when the CE# (CE1#,CE#2 in PL129J) and RESET# pins are
both held at VIO 0.3 V. (Note that this is a more restricted voltage range than VIH.) If CE# (CE1#,CE#2 in
PL129J) and RESET# are held at VIH, but not within VIO 0.3 V, the device will be in the standby mode, but
the standby current will be greater. The device requires standard access time (tCE) for read access when the
device is in either of these standby modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation
is completed.
ICC3 in DC Characteristics on page 75 represents the CMOS standby current specification.
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10.5 Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for tACC + 30 ns. The automatic sleep mode is independent of the
CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are
changed. While in sleep mode, output data is latched and always available to the system. Note that during
automatic sleep mode, OE# must be at VIH before the device reduces current to the stated sleep mode
specification. ICC5 in DC Characteristics on page 75 represents the automatic sleep mode current
specification.
10.6 RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the
RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in
progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse.
The device also resets the internal state machine to reading array data. The operation that was interrupted
should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS 0.3 V, the device
draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS 0.3 V, the standby current
will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the
internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is
asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is
completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the
RESET# pin returns to VIH.
Refer to the tables in AC Characteristic on page 76 for RESET# parameters and to Figure 20.5 on page 79
for the timing diagram.
10.7 Output Disable Mode
When the OE# input is at VIH, output from the device is disabled. The output pins (except for RY/BY#) are
placed in the highest Impedance state
Table 10.5 PL127J Sector Architecture (Sheet 1 of 7)
Bank
Sector
SA0
Sector Address (A22-A12)
00000000000
00000000001
00000000010
00000000011
00000000100
00000000101
00000000110
00000000111
00000001XXX
00000010XXX
00000011XXX
00000100XXX
00000101XXX
00000110XXX
00000111XXX
00001000XXX
00001001XXX
Sector Size (Kwords)
Address Range (x16)
000000h–000FFFh
001000h–001FFFh
002000h–002FFFh
003000h–003FFFh
004000h–004FFFh
005000h–005FFFh
006000h–006FFFh
007000h–007FFFh
008000h–00FFFFh
010000h–017FFFh
018000h–01FFFFh
020000h–027FFFh
028000h–02FFFFh
030000h–037FFFh
038000h–03FFFFh
040000h–047FFFh
048000h–04FFFFh
4
4
SA1
SA2
4
SA3
4
SA4
4
SA5
4
SA6
4
SA7
4
SA8
32
32
32
32
32
32
32
32
32
SA9
SA10
SA11
SA12
SA13
SA14
SA15
SA16
26
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 2 of 7)
Bank
Sector
SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
SA35
SA36
SA37
SA38
SA39
SA40
SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
SA63
SA64
SA65
Sector Address (A22-A12)
00001010XXX
00001011XXX
00001100XXX
00001101XXX
00001110XXX
00001111XXX
00010000XXX
00010001XXX
00010010XXX
00010011XXX
00010100XXX
00010101XXX
00010110XXX
00010111XXX
00011000XXX
00011001XXX
00011010XXX
00011011XXX
00011100XXX
00011101XXX
00011110XXX
00011111XXX
00100000XXX
00100001XXX
00100010XXX
00100011XXX
00100100XXX
00100101XXX
00100110XXX
00100111XXX
00101000XXX
00101001XXX
00101010XXX
00101011XXX
00101100XXX
00101101XXX
00101110XXX
00101111XXX
00110000XXX
00110001XXX
00110010XXX
00110011XXX
00110100XXX
00110101XXX
00110110XXX
00110111XXX
00111000XXX
00111001XXX
00111010XXX
Sector Size (Kwords)
Address Range (x16)
050000h–057FFFh
058000h–05FFFFh
060000h–067FFFh
068000h–06FFFFh
070000h–077FFFh
078000h–07FFFFh
080000h–087FFFh
088000h–08FFFFh
090000h–097FFFh
098000h–09FFFFh
0A0000h–0A7FFFh
0A8000h–0AFFFFh
0B0000h–0B7FFFh
0B8000h–0BFFFFh
0C0000h–0C7FFFh
0C8000h–0CFFFFh
0D0000h–0D7FFFh
0D8000h–0DFFFFh
0E0000h–0E7FFFh
0E8000h–0EFFFFh
0F0000h–0F7FFFh
0F8000h–0FFFFFh
100000h–107FFFh
108000h–10FFFFh
110000h–117FFFh
118000h–11FFFFh
120000h–127FFFh
128000h–12FFFFh
130000h–137FFFh
138000h–13FFFFh
140000h–147FFFh
148000h–14FFFFh
150000h–157FFFh
158000h–15FFFFh
160000h–167FFFh
168000h–16FFFFh
170000h–177FFFh
178000h–17FFFFh
180000h–187FFFh
188000h–18FFFFh
190000h–197FFFh
198000h–19FFFFh
1A0000h–1A7FFFh
1A8000h–1AFFFFh
1B0000h–1B7FFFh
1B8000h–1BFFFFh
1C0000h–1C7FFFh
1C8000h–1CFFFFh
1D0000h–1D7FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
April 18, 2013 S29PL-J_00_A16
S29PL-J
27
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 2 of 7)
Bank
Sector
SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
SA35
SA36
SA37
SA38
SA39
SA40
SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
SA63
SA64
SA65
Sector Address (A22-A12)
00001010XXX
00001011XXX
00001100XXX
00001101XXX
00001110XXX
00001111XXX
00010000XXX
00010001XXX
00010010XXX
00010011XXX
00010100XXX
00010101XXX
00010110XXX
00010111XXX
00011000XXX
00011001XXX
00011010XXX
00011011XXX
00011100XXX
00011101XXX
00011110XXX
00011111XXX
00100000XXX
00100001XXX
00100010XXX
00100011XXX
00100100XXX
00100101XXX
00100110XXX
00100111XXX
00101000XXX
00101001XXX
00101010XXX
00101011XXX
00101100XXX
00101101XXX
00101110XXX
00101111XXX
00110000XXX
00110001XXX
00110010XXX
00110011XXX
00110100XXX
00110101XXX
00110110XXX
00110111XXX
00111000XXX
00111001XXX
00111010XXX
Sector Size (Kwords)
Address Range (x16)
050000h–057FFFh
058000h–05FFFFh
060000h–067FFFh
068000h–06FFFFh
070000h–077FFFh
078000h–07FFFFh
080000h–087FFFh
088000h–08FFFFh
090000h–097FFFh
098000h–09FFFFh
0A0000h–0A7FFFh
0A8000h–0AFFFFh
0B0000h–0B7FFFh
0B8000h–0BFFFFh
0C0000h–0C7FFFh
0C8000h–0CFFFFh
0D0000h–0D7FFFh
0D8000h–0DFFFFh
0E0000h–0E7FFFh
0E8000h–0EFFFFh
0F0000h–0F7FFFh
0F8000h–0FFFFFh
100000h–107FFFh
108000h–10FFFFh
110000h–117FFFh
118000h–11FFFFh
120000h–127FFFh
128000h–12FFFFh
130000h–137FFFh
138000h–13FFFFh
140000h–147FFFh
148000h–14FFFFh
150000h–157FFFh
158000h–15FFFFh
160000h–167FFFh
168000h–16FFFFh
170000h–177FFFh
178000h–17FFFFh
180000h–187FFFh
188000h–18FFFFh
190000h–197FFFh
198000h–19FFFFh
1A0000h–1A7FFFh
1A8000h–1AFFFFh
1B0000h–1B7FFFh
1B8000h–1BFFFFh
1C0000h–1C7FFFh
1C8000h–1CFFFFh
1D0000h–1D7FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
28
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 3 of 7)
Bank
Sector
SA66
SA67
SA68
SA69
SA70
SA71
SA72
SA73
SA74
SA75
SA76
SA77
SA78
SA79
SA80
SA81
SA82
SA83
SA84
SA85
SA86
SA87
SA88
SA89
SA90
SA91
SA92
SA93
SA94
SA95
SA96
SA97
SA98
SA99
SA100
SA101
SA102
SA103
SA104
SA105
SA106
SA107
SA108
SA109
SA110
SA111
SA112
SA113
SA114
Sector Address (A22-A12)
00111011XXX
00111100XXX
00111101XXX
00111110XXX
00111111XXX
01000000XXX
01000001XXX
01000010XXX
01000011XXX
01000100XXX
01000101XXX
01000110XXX
01000111XXX
01001000XXX
01001001XXX
01001010XXX
01001011XXX
01001100XXX
01001101XXX
01001110XXX
01001111XXX
01010000XXX
01010001XXX
01010010XXX
01010011XXX
01010100XXX
01010101XXX
01010110XXX
01010111XXX
01011000XXX
01011001XXX
01011010XXX
01011011XXX
01011100XXX
01011101XXX
01011110XXX
01011111XXX
01100000XXX
01100001XXX
01100010XXX
01100011XXX
01100100XXX
01100101XXX
01100110XXX
01100111XXX
01101000XXX
01101001XXX
01101010XXX
01101011XXX
Sector Size (Kwords)
Address Range (x16)
1D8000h–1DFFFFh
1E0000h–1E7FFFh
1E8000h–1EFFFFh
1F0000h–1F7FFFh
1F8000h–1FFFFFh
200000h–207FFFh
208000h–20FFFFh
210000h–217FFFh
218000h–21FFFFh
220000h–227FFFh
228000h–22FFFFh
230000h–237FFFh
238000h–23FFFFh
240000h–247FFFh
248000h–24FFFFh
250000h–257FFFh
258000h–25FFFFh
260000h–267FFFh
268000h–26FFFFh
270000h–277FFFh
278000h–27FFFFh
280000h–287FFFh
288000h–28FFFFh
290000h–297FFFh
298000h–29FFFFh
2A0000h–2A7FFFh
2A8000h–2AFFFFh
2B0000h–2B7FFFh
2B8000h–2BFFFFh
2C0000h–2C7FFFh
2C8000h–2CFFFFh
2D0000h–2D7FFFh
2D8000h–2DFFFFh
2E0000h–2E7FFFh
2E8000h–2EFFFFh
2F0000h–2F7FFFh
2F8000h–2FFFFFh
300000h–307FFFh
308000h–30FFFFh
310000h–317FFFh
318000h–31FFFFh
320000h–327FFFh
328000h–32FFFFh
330000h–337FFFh
338000h–33FFFFh
340000h–347FFFh
348000h–34FFFFh
350000h–357FFFh
358000h–35FFFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
April 18, 2013 S29PL-J_00_A16
S29PL-J
29
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 4 of 7)
Bank
Sector
SA115
SA116
SA117
SA118
SA119
SA120
SA121
SA122
SA123
SA124
SA125
SA126
SA127
SA128
SA129
SA130
SA131
SA132
SA133
SA134
SA135
SA136
SA137
SA138
SA139
SA140
SA141
SA142
SA143
SA144
SA145
SA146
SA147
SA148
SA149
SA150
SA151
SA152
SA153
SA154
SA155
SA156
SA157
SA158
SA159
SA160
SA161
SA162
SA163
Sector Address (A22-A12)
01101100XXX
01101101XXX
01101110XXX
01101111XXX
01110000XXX
01110001XXX
01110010XXX
01110011XXX
01110100XXX
01110101XXX
01110110XXX
01110111XXX
01111000XXX
01111001XXX
01111010XXX
01111011XXX
01111100XXX
01111101XXX
01111110XXX
01111111XXX
10000000XXX
10000001XXX
10000010XXX
10000011XXX
10000100XXX
10000101XXX
10000110XXX
10000111XXX
10001000XXX
10001001XXX
10001010XXX
10001011XXX
10001100XXX
10001101XXX
10001110XXX
10001111XXX
10010000XXX
10010001XXX
10010010XXX
10010011XXX
10010100XXX
10010101XXX
10010110XXX
10010111XXX
10011000XXX
10011001XXX
10011010XXX
10011011XXX
10011100XXX
Sector Size (Kwords)
Address Range (x16)
360000h–367FFFh
368000h–36FFFFh
370000h–377FFFh
378000h–37FFFFh
380000h–387FFFh
388000h–38FFFFh
390000h–397FFFh
398000h–39FFFFh
3A0000h–3A7FFFh
3A8000h–3AFFFFh
3B0000h–3B7FFFh
3B8000h–3BFFFFh
3C0000h–3C7FFFh
3C8000h–3CFFFFh
3D0000h–3D7FFFh
3D8000h–3DFFFFh
3E0000h–3E7FFFh
3E8000h–3EFFFFh
3F0000h–3F7FFFh
3F8000h–3FFFFFh
400000h–407FFFh
408000h–40FFFFh
410000h–417FFFh
418000h–41FFFFh
420000h–427FFFh
428000h–42FFFFh
430000h–437FFFh
438000h–43FFFFh
440000h–447FFFh
448000h–44FFFFh
450000h–457FFFh
458000h–45FFFFh
460000h–467FFFh
468000h–46FFFFh
470000h–477FFFh
478000h–47FFFFh
480000h–487FFFh
488000h–48FFFFh
490000h–497FFFh
498000h–49FFFFh
4A0000h–4A7FFFh
4A8000h–4AFFFFh
4B0000h–4B7FFFh
4B8000h–4BFFFFh
4C0000h–4C7FFFh
4C8000h–4CFFFFh
4D0000h–4D7FFFh
4D8000h–4DFFFFh
4E0000h–4E7FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
30
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 5 of 7)
Bank
Sector
SA164
SA165
SA166
SA167
SA168
SA169
SA170
SA171
SA172
SA173
SA174
SA175
SA176
SA177
SA178
SA179
SA180
SA181
SA182
SA183
SA184
SA185
SA186
SA187
SA188
SA189
SA190
SA191
SA192
SA193
SA194
SA195
SA196
SA197
SA198
SA199
SA200
SA201
SA202
SA203
SA204
SA205
SA206
SA207
SA208
SA209
SA210
SA211
SA212
Sector Address (A22-A12)
10011101XXX
10011110XXX
10011111XXX
10100000XXX
10100001XXX
10100010XXX
10100011XXX
10100100XXX
10100101XXX
10100110XXX
10100111XXX
10101000XXX
10101001XXX
10101010XXX
10101011XXX
10101100XXX
10101101XXX
10101110XXX
10101111XXX
10110000XXX
10110001XXX
10110010XXX
10110011XXX
10110100XXX
10110101XXX
10110110XXX
10110111XXX
10111000XXX
10111001XXX
10111010XXX
10111011XXX
10111100XXX
10111101XXX
10111110XXX
10111111XXX
11000000XXX
11000001XXX
11000010XXX
11000011XXX
11000100XXX
11000101XXX
11000110XXX
11000111XXX
11001000XXX
11001001XXX
11001010XXX
11001011XXX
11001100XXX
11001101XXX
Sector Size (Kwords)
Address Range (x16)
4E8000h–4EFFFFh
4F0000h–4F7FFFh
4F8000h–4FFFFFh
500000h–507FFFh
508000h–50FFFFh
510000h–517FFFh
518000h–51FFFFh
520000h–527FFFh
528000h–52FFFFh
530000h–537FFFh
538000h–53FFFFh
540000h–547FFFh
548000h–54FFFFh
550000h–557FFFh
558000h–15FFFFh
560000h–567FFFh
568000h–56FFFFh
570000h–577FFFh
578000h–57FFFFh
580000h–587FFFh
588000h–58FFFFh
590000h–597FFFh
598000h–59FFFFh
5A0000h–5A7FFFh
5A8000h–5AFFFFh
5B0000h–5B7FFFh
5B8000h–5BFFFFh
5C0000h–5C7FFFh
5C8000h–5CFFFFh
5D0000h–5D7FFFh
5D8000h–5DFFFFh
5E0000h–5E7FFFh
5E8000h–5EFFFFh
5F0000h–5F7FFFh
5F8000h–5FFFFFh
600000h–607FFFh
608000h–60FFFFh
610000h–617FFFh
618000h–61FFFFh
620000h–627FFFh
628000h–62FFFFh
630000h–637FFFh
638000h–63FFFFh
640000h–647FFFh
648000h–64FFFFh
650000h–657FFFh
658000h–65FFFFh
660000h–667FFFh
668000h–66FFFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
April 18, 2013 S29PL-J_00_A16
S29PL-J
31
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 6 of 7)
Bank
Sector
SA213
SA214
SA215
SA216
SA217
SA218
SA219
SA220
SA221
SA222
SA223
SA224
SA225
SA226
SA227
SA228
SA229
SA230
SA231
SA232
SA233
SA234
SA235
SA236
SA237
SA238
SA239
SA240
SA241
SA242
SA243
SA244
SA245
SA246
SA247
SA248
SA249
SA250
SA251
SA252
SA253
SA254
SA255
SA256
SA257
SA258
SA259
SA260
SA261
Sector Address (A22-A12)
11001110XXX
11001111XXX
11010000XXX
11010001XXX
11010010XXX
11010011XXX
11010100XXX
11010101XXX
11010110XXX
11010111XXX
11011000XXX
11011001XXX
11011010XXX
11011011XXX
11011100XXX
11011101XXX
11011110XXX
11011111XXX
11100000XXX
11100001XXX
11100010XXX
11100011XXX
11100100XXX
11100101XXX
11100110XXX
11100111XXX
11101000XXX
11101001XXX
11101010XXX
11101011XXX
11101100XXX
11101101XXX
11101110XXX
11101111XXX
11110000XXX
11110001XXX
11110010XXX
11110011XXX
11110100XXX
11110101XXX
11110110XXX
11110111XXX
11111000XXX
11111001XXX
11111010XXX
11111011XXX
11111100XXX
11111101XXX
11111110XXX
Sector Size (Kwords)
Address Range (x16)
670000h–677FFFh
678000h–67FFFFh
680000h–687FFFh
688000h–68FFFFh
690000h–697FFFh
698000h–69FFFFh
6A0000h–6A7FFFh
6A8000h–6AFFFFh
6B0000h–6B7FFFh
6B8000h–6BFFFFh
6C0000h–6C7FFFh
6C8000h–6CFFFFh
6D0000h–6D7FFFh
6D8000h–6DFFFFh
6E0000h–6E7FFFh
6E8000h–6EFFFFh
6F0000h–6F7FFFh
6F8000h–6FFFFFh
700000h–707FFFh
708000h–70FFFFh
710000h–717FFFh
718000h–71FFFFh
720000h–727FFFh
728000h–72FFFFh
730000h–737FFFh
738000h–73FFFFh
740000h–747FFFh
748000h–74FFFFh
750000h–757FFFh
758000h–75FFFFh
760000h–767FFFh
768000h–76FFFFh
770000h–777FFFh
778000h–77FFFFh
780000h–787FFFh
788000h–78FFFFh
790000h–797FFFh
798000h–79FFFFh
7A0000h–7A7FFFh
7A8000h–7AFFFFh
7B0000h–7B7FFFh
7B8000h–7BFFFFh
7C0000h–7C7FFFh
7C8000h–7CFFFFh
7D0000h–7D7FFFh
7D8000h–7DFFFFh
7E0000h–7E7FFFh
7E8000h–7EFFFFh
7F0000h–7F7FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.5 PL127J Sector Architecture (Sheet 7 of 7)
Bank
Sector
SA262
SA263
SA264
SA265
SA266
SA267
SA268
SA269
Sector Address (A22-A12)
11111111000
Sector Size (Kwords)
Address Range (x16)
7F8000h–7F8FFFh
7F9000h–7F9FFFh
7FA000h–7FAFFFh
7FB000h–7FBFFFh
7FC000h–7FCFFFh
7FD000h–7FDFFFh
7FE000h–7FEFFFh
7FF000h–7FFFFFh
4
4
4
4
4
4
4
4
11111111001
11111111010
11111111011
11111111100
11111111101
11111111110
11111111111
Table 10.6 PL064J Sector Architecture (Sheet 1 of 4)
Bank
Sector
SA0
Sector Address (A22-A12)
0000000000
0000000001
0000000010
0000000011
0000000100
0000000101
0000000110
0000000111
0000001XXX
0000010XXX
0000011XXX
0000100XXX
0000101XXX
0000110XXX
0000111XXX
0001000XXX
0001001XXX
0001010XXX
0001011XXX
0001100XXX
0001101XXX
0001110XXX
0001111XXX
0010000XXX
0010001XXX
0010010XXX
0010011XXX
0010100XXX
0010101XXX
0010110XXX
0010111XXX
0011000XXX
0011001XXX
0011010XXX
0011011XXX
0011100XXX
0011101XXX
Sector Size (Kwords)
Address Range (x16)
000000h–000FFFh
001000h–001FFFh
002000h–002FFFh
003000h–003FFFh
004000h–004FFFh
005000h–005FFFh
006000h–006FFFh
007000h–007FFFh
008000h–00FFFFh
010000h–017FFFh
018000h–01FFFFh
020000h–027FFFh
028000h–02FFFFh
030000h–037FFFh
038000h–03FFFFh
040000h–047FFFh
048000h–04FFFFh
050000h–057FFFh
058000h–05FFFFh
060000h–067FFFh
068000h–06FFFFh
070000h–077FFFh
078000h–07FFFFh
080000h–087FFFh
088000h–08FFFFh
090000h–097FFFh
098000h–09FFFFh
0A0000h–0A7FFFh
0A8000h–0AFFFFh
0B0000h–0B7FFFh
0B8000h–0BFFFFh
0C0000h–0C7FFFh
0C8000h–0CFFFFh
0D0000h–0D7FFFh
0D8000h–0DFFFFh
0E0000h–0E7FFFh
0E8000h–0EFFFFh
4
SA1
4
SA2
4
SA3
4
SA4
4
SA5
4
SA6
4
SA7
4
SA8
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
SA9
SA10
SA11
SA12
SA13
SA14
SA15
SA16
SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
SA35
SA36
April 18, 2013 S29PL-J_00_A16
S29PL-J
33
D a t a S h e e t
Table 10.6 PL064J Sector Architecture (Sheet 2 of 4)
Bank
Sector
SA37
SA38
SA39
SA40
SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
SA63
SA64
SA65
SA66
SA67
SA68
SA69
SA70
SA71
SA72
SA73
SA74
SA75
SA76
SA77
SA78
SA79
SA80
SA81
SA82
SA83
SA84
SA85
Sector Address (A22-A12)
0011110XXX
0011111XXX
0100000XXX
0100001XXX
0100010XXX
0100011XXX
0100100XXX
0100101XXX
0100110XXX
0100111XXX
0101000XXX
0101001XXX
0101010XXX
0101011XXX
0101100XXX
0101101XXX
0101110XXX
0101111XXX
0110000XXX
0110001XXX
0110010XXX
0110011XXX
0110100XXX
0110101XXX
0110110XXX
0110111XXX
0111000XXX
0111001XXX
0111010XXX
0111011XXX
0111100XXX
0111101XXX
0111110XXX
0111111XXX
1000000XXX
1000001XXX
1000010XXX
1000011XXX
1000100XXX
1000101XXX
1000110XXX
1000111XXX
1001000XXX
1001001XXX
1001010XXX
1001011XXX
1001100XXX
1001101XXX
1001110XXX
Sector Size (Kwords)
Address Range (x16)
0F0000h–0F7FFFh
0F8000h–0FFFFFh
100000h–107FFFh
108000h–10FFFFh
110000h–117FFFh
118000h–11FFFFh
120000h–127FFFh
128000h–12FFFFh
130000h–137FFFh
138000h–13FFFFh
140000h–147FFFh
148000h–14FFFFh
150000h–157FFFh
158000h–15FFFFh
160000h–167FFFh
168000h–16FFFFh
170000h–177FFFh
178000h–17FFFFh
180000h–187FFFh
188000h–18FFFFh
190000h–197FFFh
198000h–19FFFFh
1A0000h–1A7FFFh
1A8000h–1AFFFFh
1B0000h–1B7FFFh
1B8000h–1BFFFFh
1C0000h–1C7FFFh
1C8000h–1CFFFFh
1D0000h–1D7FFFh
1D8000h–1DFFFFh
1E0000h–1E7FFFh
1E8000h–1EFFFFh
1F0000h–1F7FFFh
1F8000h–1FFFFFh
200000h–207FFFh
208000h–20FFFFh
210000h–217FFFh
218000h–21FFFFh
220000h–227FFFh
228000h–22FFFFh
230000h–237FFFh
238000h–23FFFFh
240000h–247FFFh
248000h–24FFFFh
250000h–257FFFh
258000h–25FFFFh
260000h–267FFFh
268000h–26FFFFh
270000h–277FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
34
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.6 PL064J Sector Architecture (Sheet 3 of 4)
Bank
Sector
SA86
Sector Address (A22-A12)
1001111XXX
1010000XXX
1010001XXX
1010010XXX
1010011XXX
1010100XXX
1010101XXX
1010110XXX
1010111XXX
1011000XXX
1011001XXX
1011010XXX
1011011XXX
1011100XXX
1011101XXX
1011110XXX
1011111XXX
1100000XXX
1100001XXX
1100010XXX
1100011XXX
1100100XXX
1100101XXX
1100110XXX
1100111XXX
1101000XXX
1101001XXX
1101010XXX
1101011XXX
1101100XXX
1101101XXX
1101110XXX
1101111XXX
1110000XXX
1110001XXX
1110010XXX
1110011XXX
1110100XXX
1110101XXX
1110110XXX
1110111XXX
1111000XXX
1111001XXX
1111010XXX
1111011XXX
1111100XXX
1111101XXX
1111110XXX
1111111000
Sector Size (Kwords)
Address Range (x16)
278000h–27FFFFh
280000h–287FFFh
288000h–28FFFFh
290000h–297FFFh
298000h–29FFFFh
2A0000h–2A7FFFh
2A8000h–2AFFFFh
2B0000h–2B7FFFh
2B8000h–2BFFFFh
2C0000h–2C7FFFh
2C8000h–2CFFFFh
2D0000h–2D7FFFh
2D8000h–2DFFFFh
2E0000h–2E7FFFh
2E8000h–2EFFFFh
2F0000h–2F7FFFh
2F8000h–2FFFFFh
300000h–307FFFh
308000h–30FFFFh
310000h–317FFFh
318000h–31FFFFh
320000h–327FFFh
328000h–32FFFFh
330000h–337FFFh
338000h–33FFFFh
340000h–347FFFh
348000h–34FFFFh
350000h–357FFFh
358000h–35FFFFh
360000h–367FFFh
368000h–36FFFFh
370000h–377FFFh
378000h–37FFFFh
380000h–387FFFh
388000h–38FFFFh
390000h–397FFFh
398000h–39FFFFh
3A0000h–3A7FFFh
3A8000h–3AFFFFh
3B0000h–3B7FFFh
3B8000h–3BFFFFh
3C0000h–3C7FFFh
3C8000h–3CFFFFh
3D0000h–3D7FFFh
3D8000h–3DFFFFh
3E0000h–3E7FFFh
3E8000h–3EFFFFh
3F0000h–3F7FFFh
3F8000h–3F8FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
4
SA87
SA88
SA89
SA90
SA91
SA92
SA93
SA94
SA95
SA96
SA97
SA98
SA99
SA100
SA101
SA102
SA103
SA104
SA105
SA106
SA107
SA108
SA109
SA110
SA111
SA112
SA113
SA114
SA115
SA116
SA117
SA118
SA119
SA120
SA121
SA122
SA123
SA124
SA125
SA126
SA127
SA128
SA129
SA130
SA131
SA132
SA133
SA134
April 18, 2013 S29PL-J_00_A16
S29PL-J
35
D a t a S h e e t
Table 10.6 PL064J Sector Architecture (Sheet 4 of 4)
Bank
Sector
SA135
SA136
SA137
SA138
SA139
SA140
SA141
Sector Address (A22-A12)
1111111001
Sector Size (Kwords)
Address Range (x16)
3F9000h–3F9FFFh
3FA000h–3FAFFFh
3FB000h–3FBFFFh
3FC000h–3FCFFFh
3FD000h–3FDFFFh
3FE000h–3FEFFFh
3FF000h–3FFFFFh
4
4
4
4
4
4
4
1111111010
1111111011
1111111100
1111111101
1111111110
1111111111
Table 10.7 PL032J Sector Architecture (Sheet 1 of 2)
Bank
Sector
SA0
Sector Address (A22-A12)
000000000
000000001
000000010
000000011
000000100
000000101
000000110
000000111
000001XXX
000010XXX
000011XXX
000100XXX
000101XXX
000110XXX
000111XXX
001000XXX
001001XXX
001010XXX
001011XXX
001100XXX
001101XXX
001110XXX
001111XXX
010000XXX
010001XXX
010010XXX
010011XXX
010100XXX
010101XXX
010110XXX
010111XXX
011000XXX
011001XXX
011010XXX
011011XXX
011100XXX
011101XXX
011110XXX
Sector Size (Kwords)
Address Range (x16)
000000h–000FFFh
001000h–001FFFh
002000h–002FFFh
003000h–003FFFh
004000h–004FFFh
005000h–005FFFh
006000h–006FFFh
007000h–007FFFh
008000h–00FFFFh
010000h–017FFFh
018000h–01FFFFh
020000h–027FFFh
028000h–02FFFFh
030000h–037FFFh
038000h–03FFFFh
040000h–047FFFh
048000h–04FFFFh
050000h–057FFFh
058000h–05FFFFh
060000h–067FFFh
068000h–06FFFFh
070000h–077FFFh
078000h–07FFFFh
080000h–087FFFh
088000h–08FFFFh
090000h–097FFFh
098000h–09FFFFh
0A0000h–0A7FFFh
0A8000h–0AFFFFh
0B0000h–0B7FFFh
0B8000h–0BFFFFh
0C0000h–0C7FFFh
0C8000h–0CFFFFh
0D0000h–0D7FFFh
0D8000h–0DFFFFh
0E0000h–0E7FFFh
0E8000h–0EFFFFh
0F0000h–0F7FFFh
4
SA1
4
SA2
4
SA3
4
SA4
4
SA5
4
SA6
4
SA7
4
SA8
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
SA9
SA10
SA11
SA12
SA13
SA14
SA15
SA16
SA17
SA18
SA19
SA20
SA21
SA22
SA23
SA24
SA25
SA26
SA27
SA28
SA29
SA30
SA31
SA32
SA33
SA34
SA35
SA36
SA37
36
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.7 PL032J Sector Architecture (Sheet 2 of 2)
Bank
Sector
SA38
SA39
SA40
SA41
SA42
SA43
SA44
SA45
SA46
SA47
SA48
SA49
SA50
SA51
SA52
SA53
SA54
SA55
SA56
SA57
SA58
SA59
SA60
SA61
SA62
SA63
SA64
SA65
SA66
SA67
SA68
SA69
SA70
SA71
SA72
SA73
SA74
SA75
SA76
SA77
Sector Address (A22-A12)
011111XXX
100000XXX
100001XXX
100010XXX
100011XXX
100100XXX
100101XXX
100110XXX
100111XXX
101000XXX
101001XXX
101010XXX
101011XXX
101100XXX
101101XXX
101110XXX
101111XXX
110000XXX
110001XXX
110010XXX
110011XXX
110100XXX
110101XXX
110110XXX
110111XXX
111000XXX
111001XXX
111010XXX
111011XXX
111100XXX
111101XXX
111110XXX
111111000
111111001
111111010
111111011
111111100
111111101
111111110
111111111
Sector Size (Kwords)
Address Range (x16)
0F8000h–0FFFFFh
100000h–107FFFh
108000h–10FFFFh
110000h–117FFFh
118000h–11FFFFh
120000h–127FFFh
128000h–12FFFFh
130000h–137FFFh
138000h–13FFFFh
140000h–147FFFh
148000h–14FFFFh
150000h–157FFFh
158000h–15FFFFh
160000h–167FFFh
168000h–16FFFFh
170000h–177FFFh
178000h–17FFFFh
180000h–187FFFh
188000h–18FFFFh
190000h–197FFFh
198000h–19FFFFh
1A0000h–1A7FFFh
1A8000h–1AFFFFh
1B0000h–1B7FFFh
1B8000h–1BFFFFh
1C0000h–1C7FFFh
1C8000h–1CFFFFh
1D0000h–1D7FFFh
1D8000h–1DFFFFh
1E0000h–1E7FFFh
1E8000h–1EFFFFh
1F0000h–1F7FFFh
1F8000h–1F8FFFh
1F9000h–1F9FFFh
1FA000h–1FAFFFh
1FB000h–1FBFFFh
1FC000h–1FCFFFh
1FD000h–1FDFFFh
1FE000h–1FEFFFh
1FF000h–1FFFFFh
Bank B
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
4
4
4
4
4
4
4
4
April 18, 2013 S29PL-J_00_A16
S29PL-J
37
D a t a S h e e t
Table 10.8 S29PL129J Sector Architecture (Sheet 1 of 6)
Bank
Sector
SA1-0
CE1#
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
CE2#
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sector Address (A21-A12)
0000000000
0000000001
0000000010
0000000011
0000000100
0000000101
0000000110
0000000111
0000001XXX
0000010XXX
0000011XXX
0000100XXX
0000101XXX
0000110XXX
0000111XXX
0001000XXX
0001001XXX
0001010XXX
0001011XXX
0001100XXX
0001101XXX
0001110XXX
0001111XXX
0010000XXX
0010001XXX
0010010XXX
0010011XXX
0010100XXX
0010101XXX
0010110XXX
0010111XXX
0011000XXX
0011001XXX
0011010XXX
0011011XXX
0011100XXX
0011101XXX
0011110XXX
0011111XXX
0100000XXX
0100001XXX
0100010XXX
0100011XXX
0100100XXX
0100101XXX
0100110XXX
0100111XXX
0101000XXX
Sector Size (Kwords)
Address Range (x16)
000000h–000FFFh
001000h–001FFFh
002000h–002FFFh
003000h–003FFFh
004000h–004FFFh
005000h–005FFFh
006000h–006FFFh
007000h–007FFFh
008000h–00FFFFh
010000h–017FFFh
018000h–01FFFFh
020000h–027FFFh
028000h–02FFFFh
030000h–037FFFh
038000h–03FFFFh
040000h–047FFFh
048000h–04FFFFh
050000h–057FFFh
058000h–05FFFFh
060000h–067FFFh
068000h–06FFFFh
070000h–077FFFh
078000h–07FFFFh
080000h–087FFFh
088000h–08FFFFh
090000h–097FFFh
098000h–09FFFFh
0A0000h–0A7FFFh
0A8000h–0AFFFFh
0B0000h–0B7FFFh
0B8000h–0BFFFFh
0C0000h–0C7FFFh
0C8000h–0CFFFFh
0D0000h–0D7FFFh
0D8000h–0DFFFFh
0E0000h–0E7FFFh
0E8000h–0EFFFFh
0F0000h–0F7FFFh
0F8000h–0FFFFFh
100000h–107FFFh
108000h–10FFFFh
110000h–117FFFh
118000h–11FFFFh
120000h–127FFFh
128000h–12FFFFh
130000h–137FFFh
138000h–13FFFFh
140000h–147FFFh
4
SA1-1
4
SA1-2
4
SA1-3
4
SA1-4
4
SA1-5
4
SA1-6
4
SA1-7
4
SA1-8
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
SA1-9
SA1-10
SA1-11
SA1-12
SA1-13
SA1-14
SA1-15
SA1-16
SA1-17
SA1-18
SA1-19
SA1-20
SA1-21
SA1-22
SA1-23
SA1-24
SA1-25
SA1-26
SA1-27
SA1-28
SA1-29
SA1-30
SA1-31
SA1-32
SA1-33
SA1-34
SA1-35
SA1-36
SA1-37
SA1-38
SA1-39
SA1-40
SA1-41
SA1-42
SA1-43
SA1-44
SA1-45
SA1-46
SA1-47
38
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.8 S29PL129J Sector Architecture (Sheet 2 of 6)
Bank
Sector
SA1-48
SA1-49
SA1-50
SA1-51
SA1-52
SA1-53
SA1-54
SA1-55
SA1-56
SA1-57
SA1-58
SA1-59
SA1-60
SA1-61
SA1-62
SA1-63
SA1-64
SA1-65
SA1-66
SA1-67
SA1-68
SA1-69
SA1-70
SA1-71
SA1-72
SA1-73
SA1-74
SA1-75
SA1-76
SA1-77
SA1-78
SA1-79
SA1-80
SA1-81
SA1-82
SA1-83
SA1-84
SA1-85
SA1-86
SA1-87
SA1-88
SA1-89
SA1-90
SA1-91
SA1-92
SA1-93
SA1-94
SA1-95
SA1-96
CE1#
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
CE2#
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sector Address (A21-A12)
0101001XXX
0101010XXX
0101011XXX
0101100XXX
0101101XXX
0101110XXX
0101111XXX
0110000XXX
0110001XXX
0110010XXX
0110011XXX
0110100XXX
0110101XXX
0110110XXX
0110111XXX
0111000XXX
0111001XXX
0111010XXX
0111011XXX
0111100XXX
0111101XXX
0111110XXX
0111111XXX
1000000XXX
1000001XXX
1000010XXX
1000011XXX
1000100XXX
1000101XXX
1000110XXX
1000111XXX
1001000XXX
1001001XXX
1001010XXX
1001011XXX
1001100XXX
1001101XXX
1001110XXX
1001111XXX
1010000XXX
1010001XXX
1010010XXX
1010011XXX
1010100XXX
1010101XXX
1010110XXX
1010111XXX
1011000XXX
1011001XXX
Sector Size (Kwords)
Address Range (x16)
148000h–14FFFFh
150000h–157FFFh
158000h–15FFFFh
160000h–167FFFh
168000h–16FFFFh
170000h–177FFFh
178000h–17FFFFh
180000h–187FFFh
188000h–18FFFFh
190000h–197FFFh
198000h–19FFFFh
1A0000h–1A7FFFh
1A8000h–1AFFFFh
1B0000h–1B7FFFh
1B8000h–1BFFFFh
1C0000h–1C7FFFh
1C8000h–1CFFFFh
1D0000h–1D7FFFh
1D8000h–1DFFFFh
1E0000h–1E7FFFh
1E8000h–1EFFFFh
1F0000h–1F7FFFh
1F8000h–1FFFFFh
200000h–207FFFh
208000h–20FFFFh
210000h–217FFFh
218000h–21FFFFh
220000h–227FFFh
228000h–22FFFFh
230000h–237FFFh
238000h–23FFFFh
240000h–247FFFh
248000h–24FFFFh
250000h–257FFFh
258000h–25FFFFh
260000h–267FFFh
268000h–26FFFFh
270000h–277FFFh
278000h–27FFFFh
280000h–287FFFh
288000h–28FFFFh
290000h–297FFFh
298000h–29FFFFh
2A0000h–2A7FFFh
2A8000h–2AFFFFh
2B0000h–2B7FFFh
2B8000h–2BFFFFh
2C0000h–2C7FFFh
2C8000h–2CFFFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
April 18, 2013 S29PL-J_00_A16
S29PL-J
39
D a t a S h e e t
Table 10.8 S29PL129J Sector Architecture (Sheet 3 of 6)
Bank
Sector
SA1-97
SA1-98
SA1-99
SA1-100
SA1-101
SA1-102
SA1-103
SA1-104
SA1-105
SA1-106
SA1-107
SA1-108
SA1-109
SA1-110
SA1-111
SA1-112
SA1-113
SA1-114
SA1-115
SA1-116
SA1-117
SA1-118
SA1-119
SA1-120
SA1-121
SA1-122
SA1-123
SA1-124
SA1-125
SA1-126
SA1-127
SA1-128
SA1-129
SA1-130
SA1-131
SA1-132
SA1-133
SA1-134
SA2-0
CE1#
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
CE2#
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
Sector Address (A21-A12)
1011010XXX
1011011XXX
1011100XXX
1011101XXX
1011110XXX
1011111XXX
1100000XXX
1100001XXX
1100010XXX
1100011XXX
1100100XXX
1100101XXX
1100110XXX
1100111XXX
1101000XXX
1101001XXX
1101010XXX
1101011XXX
1101100XXX
1101101XXX
1101110XXX
1101111XXX
1110000XXX
1110001XXX
1110010XXX
1110011XXX
1110100XXX
1110101XXX
1110110XXX
1110111XXX
1111000XXX
1111001XXX
1111010XXX
1111011XXX
1111100XXX
1111101XXX
1111110XXX
1111111XXX
0000000XXX
0000001XXX
0000010XXX
0000011XXX
0000100XXX
0000101XXX
0000110XXX
0000111XXX
0001000XXX
0001001XXX
0001010XXX
Sector Size (Kwords)
Address Range (x16)
2D0000h–2D7FFFh
2D8000h–2DFFFFh
2E0000h–2E7FFFh
2E8000h–2EFFFFh
2F0000h–2F7FFFh
2F8000h–2FFFFFh
300000h–307FFFh
308000h–30FFFFh
310000h–317FFFh
318000h–31FFFFh
320000h–327FFFh
328000h–32FFFFh
330000h–337FFFh
338000h–33FFFFh
340000h–347FFFh
348000h–34FFFFh
350000h–357FFFh
358000h–35FFFFh
360000h–367FFFh
368000h–36FFFFh
370000h–377FFFh
378000h–37FFFFh
380000h–387FFFh
388000h–38FFFFh
390000h–397FFFh
398000h–39FFFFh
3A0000h–3A7FFFh
3A8000h–3AFFFFh
3B0000h–3B7FFFh
3B8000h–3BFFFFh
3C0000h–3C7FFFh
3C8000h–3CFFFFh
3D0000h–3D7FFFh
3D8000h–3DFFFFh
3E0000h–3E7FFFh
3E8000h–3EFFFFh
3F0000h–3F7FFFh
3F8000h–3FFFFFh
000000h–007FFFh
008000h–00FFFFh
010000h–017FFFh
018000h–01FFFFh
020000h–027FFFh
028000h–02FFFFh
030000h–037FFFh
038000h–03FFFFh
040000h–047FFFh
048000h–04FFFFh
050000h–057FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
SA2-1
SA2-2
SA2-3
SA2-4
SA2-5
SA2-6
SA2-7
SA2-8
SA2-9
SA2-10
40
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.8 S29PL129J Sector Architecture (Sheet 4 of 6)
Bank
Sector
SA2-11
SA2-12
SA2-13
SA2-14
SA2-15
SA2-16
SA2-17
SA2-18
SA2-19
SA2-20
SA2-21
SA2-22
SA2-23
SA2-24
SA2-25
SA2-26
SA2-27
SA2-28
SA2-29
SA2-30
SA2-31
SA2-32
SA2-33
SA2-34
SA2-35
SA2-36
SA2-37
SA2-38
SA2-39
SA2-40
SA2-41
SA2-42
SA2-43
SA2-44
SA2-45
SA2-46
SA2-47
SA2-48
SA2-49
SA2-50
SA2-51
SA2-52
SA2-53
SA2-54
SA2-55
SA2-56
SA2-57
SA2-58
SA2-59
CE1#
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
CE2#
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Sector Address (A21-A12)
0001011XXX
0001100XXX
0001101XXX
0001110XXX
0001111XXX
0010000XXX
0010001XXX
0010010XXX
0010011XXX
0010100XXX
0010101XXX
0010110XXX
0010111XXX
0011000XXX
0011001XXX
0011010XXX
0011011XXX
0011100XXX
0011101XXX
0011110XXX
0011111XXX
0100000XXX
0100001XXX
0100010XXX
0100011XXX
0100100XXX
0100101XXX
0100110XXX
0100111XXX
0101000XXX
0101001XXX
0101010XXX
0101011XXX
0101100XXX
0101101XXX
0101110XXX
0101111XXX
0110000XXX
0110001XXX
0110010XXX
0110011XXX
0110100XXX
0110101XXX
0110110XXX
0110111XXX
0111000XXX
0111001XXX
0111010XXX
0111011XXX
Sector Size (Kwords)
Address Range (x16)
058000h–05FFFFh
060000h–067FFFh
068000h–06FFFFh
070000h–077FFFh
078000h–07FFFFh
080000h–087FFFh
088000h–08FFFFh
090000h–097FFFh
098000h–09FFFFh
0A0000h–0A7FFFh
0A8000h–0AFFFFh
0B0000h–0B7FFFh
0B8000h–0BFFFFh
0C0000h–0C7FFFh
0C8000h–0CFFFFh
0D0000h–0D7FFFh
0D8000h–0DFFFFh
0E0000h–0E7FFFh
0E8000h–0EFFFFh
0F0000h–0F7FFFh
0F8000h–0FFFFFh
100000h–107FFFh
108000h–10FFFFh
110000h–117FFFh
118000h–11FFFFh
120000h–127FFFh
128000h–12FFFFh
130000h–137FFFh
138000h–13FFFFh
140000h–147FFFh
148000h–14FFFFh
150000h–157FFFh
158000h–15FFFFh
160000h–167FFFh
168000h–16FFFFh
170000h–177FFFh
178000h–17FFFFh
180000h–187FFFh
188000h–18FFFFh
190000h–197FFFh
198000h–19FFFFh
1A0000h–1A7FFFh
1A8000h–1AFFFFh
1B0000h–1B7FFFh
1B8000h–1BFFFFh
1C0000h–1C7FFFh
1C8000h–1CFFFFh
1D0000h–1D7FFFh
1D8000h–1DFFFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
April 18, 2013 S29PL-J_00_A16
S29PL-J
41
D a t a S h e e t
Table 10.8 S29PL129J Sector Architecture (Sheet 5 of 6)
Bank
Sector
SA2-60
SA2-61
SA2-62
SA2-63
SA2-64
SA2-65
SA2-66
SA2-67
SA2-68
SA2-69
SA2-70
SA2-71
SA2-72
SA2-73
SA2-74
SA2-75
SA2-76
SA2-77
SA2-78
SA2-79
SA2-80
SA2-81
SA2-82
SA2-83
SA2-84
SA2-85
SA2-86
SA2-87
SA2-88
SA2-89
SA2-90
SA2-91
SA2-92
SA2-93
SA2-94
SA2-95
SA2-96
SA2-97
SA2-98
SA2-99
SA2-100
SA2-101
SA2-102
SA2-103
SA2-104
SA2-105
SA2-106
SA2-107
SA2-108
CE1#
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
CE2#
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Sector Address (A21-A12)
0111100XXX
0111101XXX
0111110XXX
0111111XXX
1000000XXX
1000001XXX
1000010XXX
1000011XXX
1000100XXX
1000101XXX
1000110XXX
1000111XXX
1001000XXX
1001001XXX
1001010XXX
1001011XXX
1001100XXX
1001101XXX
1001110XXX
1001111XXX
1010000XXX
1010001XXX
1010010XXX
1010011XXX
1010100XXX
1010101XXX
1010110XXX
1010111XXX
1011000XXX
1011001XXX
1011010XXX
1011011XXX
1011100XXX
1011101XXX
1011110XXX
1011111XXX
1100000XXX
1100001XXX
1100010XXX
1100011XXX
1100100XXX
1100101XXX
1100110XXX
1100111XXX
1101000XXX
1101001XXX
1101010XXX
1101011XXX
1101100XXX
Sector Size (Kwords)
Address Range (x16)
1E0000h–1E7FFFh
1E8000h–1EFFFFh
1F0000h–1F7FFFh
1F8000h–1FFFFFh
200000h–207FFFh
208000h–20FFFFh
210000h–217FFFh
218000h–21FFFFh
220000h–227FFFh
228000h–22FFFFh
230000h–237FFFh
238000h–23FFFFh
240000h–247FFFh
248000h–24FFFFh
250000h–257FFFh
258000h–25FFFFh
260000h–267FFFh
268000h–26FFFFh
270000h–277FFFh
278000h–27FFFFh
280000h–287FFFh
288000h–28FFFFh
290000h–297FFFh
298000h–29FFFFh
2A0000h–2A7FFFh
2A8000h–2AFFFFh
2B0000h–2B7FFFh
2B8000h–2BFFFFh
2C0000h–2C7FFFh
2C8000h–2CFFFFh
2D0000h–2D7FFFh
2D8000h–2DFFFFh
2E0000h–2E7FFFh
2E8000h–2EFFFFh
2F0000h–2F7FFFh
2F8000h–2FFFFFh
300000h–307FFFh
308000h–30FFFFh
310000h–317FFFh
318000h–31FFFFh
320000h–327FFFh
328000h–32FFFFh
330000h–337FFFh
338000h–33FFFFh
340000h–347FFFh
348000h–34FFFFh
350000h–357FFFh
358000h–35FFFFh
360000h–367FFFh
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
42
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.8 S29PL129J Sector Architecture (Sheet 6 of 6)
Bank
Sector
CE1#
1
CE2#
0
Sector Address (A21-A12)
1101101XXX
1101110XXX
1101111XXX
1110000XXX
1110001XXX
1110010XXX
1110011XXX
1110100XXX
1110101XXX
1110110XXX
1110111XXX
1111000XXX
1111001XXX
1111010XXX
1111011XXX
1111100XXX
1111101XXX
1111110XXX
1111111000
1111111001
1111111010
1111111011
1111111100
1111111101
1111111110
1111111111
Sector Size (Kwords)
Address Range (x16)
368000h–36FFFFh
370000h–377FFFh
378000h–37FFFFh
380000h–387FFFh
388000h–38FFFFh
390000h–397FFFh
398000h–39FFFFh
3A0000h–3A7FFFh
3A8000h–3AFFFFh
3B0000h–3B7FFFh
3B8000h–3BFFFFh
3C0000h–3C7FFFh
3C8000h–3CFFFFh
3D0000h–3D7FFFh
3D8000h–3DFFFFh
3E0000h–3E7FFFh
3E8000h–3EFFFFh
3F0000h–3F7FFFh
3F8000h–3F8FFFh
3F9000h–3F9FFFh
3FA000h–3FAFFFh
3FB000h–3FBFFFh
3FC000h–3FCFFFh
3FD000h–3FDFFFh
3FE000h–3FEFFFh
3FF000h–3FFFFFh
SA2-109
SA2-110
SA2-111
SA2-112
SA2-113
SA2-114
SA2-115
SA2-116
SA2-117
SA2-118
SA2-119
SA2-120
SA2-121
SA2-122
SA2-123
SA2-124
SA2-125
SA2-126
SA2-127
SA2-128
SA2-129
SA2-130
SA2-131
SA2-132
SA2-133
SA2-134
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
4
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
4
1
0
4
1
0
4
1
0
4
1
0
4
1
0
4
1
0
4
Table 10.9 Secured Silicon Sector Addresses
Sector Size
Address Range
Factory-Locked Area
Customer-Lockable Area
64 words
000000h-00003Fh
000040h-00007Fh
64 words
10.8 Autoselect Mode
The autoselect mode provides manufacturer and device identification, and sector protection verification,
through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to
automatically match a device to be programmed with its corresponding programming algorithm. However, the
autoselect codes can also be accessed in-system through the command register.
When using programming equipment, the autoselect mode requires VID on address pin A9. Address pins
must be as shown in Table 10.10 on page 44 and Table 10.11 on page 44. In addition, when verifying sector
protection, the sector address must appear on the appropriate highest order address bits (see Table 10.4
on page 24). Table 10.10 and Table 10.11 show the remaining address bits that are don’t care. When all
necessary bits have been set as required, the programming equipment may then read the corresponding
identifier code on DQ7–DQ0. However, the autoselect codes can also be accessed in-system through the
command register, for instances when the device is erased or programmed in a system without access to
high voltage on the A9 pin. The command sequence is illustrated in Table 15.1 on page 66. Note that if a
Bank Address (BA) (on address bits PL127J: A22–A20, PL129J and PL064J: A21–A19, PL032J: A20–A18) is
asserted during the third write cycle of the autoselect command, the host system can read autoselect data
that bank and then immediately read array data from the other bank, without exiting the autoselect mode.
April 18, 2013 S29PL-J_00_A16
S29PL-J
43
D a t a S h e e t
To access the autoselect codes in-system, the host system can issue the autoselect command via the
command register, as shown in Table 15.1 on page 66. This method does not require VID. Refer to the
Autoselect Command Sequence on page 60 for more information.
Table 10.10 Autoselect Codes (High Voltage Method)
Amax
to
A5
to
DQ15
Description
CE# OE# WE#
A12
A10 A9 A8 A7 A6 A4 A3 A2 A1 A0
to DQ0
Manufacturer ID:
Spansion products
V
I
L
L
L
L
H
H
BA
BA
SA
X
X
X
X
L
L
L
L
X
L
L
L
L
L
L
L
L
0001h
227Eh
D
Read Cycle 1
H
2220h (PL127J)
2202h (PL064J)
220Ah (PL032J)
Read Cycle 2
L
H
H
H
L
V
I
D
2200h (PL127J)
2201h (PL064J)
2201h (PL032J)
Read Cycle 3
L
L
H
L
H
L
H
H
H
L
Sector Protection
Verification
V
0001h (protected),
0000h (unprotected)
I
L
L
H
H
X
X
X
X
L
L
L
L
D
DQ7=1
(factory locked),
DQ6=1
(factory and
customer locked)
Secured Silicon
BA
(See Note)
V
I
L
X
X
L
L
H
H
Indicator Bit
(DQ7, DQ6)
D
Legend
L = Logic Low = V , H = Logic High = V , BA = Bank Address, SA = Sector Address, X = Don’t care.
IL
IH
Note
When Polling the Secured Silicon indicator bit the Bank Address (BA) should be set within the address range 004000h-03FFFFh.
Table 10.11 Autoselect Codes for PL129J
A21
to
A5
to
DQ15
Description
CE1# CE2# OE# WE#
A12
A10 A9 A8 A7 A6 A4 A3 A2 A1 A0
to DQ0
Manufacturer ID:
Spansion
products
L
H
L
V
I
L
L
H
H
X
X
X
X
X
X
L
L
L
L
X
L
L
L
L
L
0001h
D
H
L
H
L
H
L
Read
Cycle 1
L
H
H
L
H
H
L
H
H
H
L
227Eh
2221h
2200h
H
L
Read
Cycle 2
V
I
D
H
L
H
L
Read
Cycle 3
H
H
L
H
0001h
Sector Protection
Verification
V
(protected),
0000h
(unprotected)
I
L
L
H
H
SA
X
X
X
X
L
L
L
L
L
L
L
L
H
H
L
D
H
L
L
H
DQ7=1
(factory locked),
DQ6=1
(factory and
customer locked)
Secured Silicon
Indicator Bit
(DQ7, DQ6)
X
V
I
X
X
H
(Note 1)
D
H
L
Legend
L = Logic Low = V , H = Logic High = V , BA = Bank Address, SA = Sector Address, X = Don’t care.
IL
IH
Note
1. When Polling the Secured Silicon indicator bit the A21 to A12 should be set within the address range 004000h-03FFFFh.
2. The autoselect codes may also be accessed in-system by using the command sequences
44
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
Table 10.12 PL127J Boot Sector/Sector Block Addresses for Protection/Unprotection
Sector/
Sector/
Sector
SA0
A22-A12
Sector Block Size
Sector
A22-A12
Sector Block Size
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
32 Kwords
00000000000
00000000001
00000000010
00000000011
00000000100
00000000101
00000000110
00000000111
00000001XXX
00000010XXX
00000011XXX
000001XXXXX
000010XXXXX
000011XXXXX
000100XXXXX
000101XXXXX
000110XXXXX
000111XXXXX
001000XXXXX
001001XXXXX
001010XXXXX
001011XXXXX
001100XXXXX
001101XXXXX
001110XXXXX
001111XXXXX
010000XXXXX
010001XXXXX
010010XXXXX
010011XXXXX
010100XXXXX
010101XXXXX
010110XXXXX
010111XXXXX
011000XXXXX
011001XXXXX
011010XXXXX
011011XXXXX
011100XXXXX
011101XXXXX
011110XXXXX
4 Kwords
4 Kwords
SA131-SA134
SA135-SA138
SA139-SA142
SA143-SA146
SA147-SA150
SA151-SA154
SA155-SA158
SA159-SA162
SA163-SA166
SA167-SA170
SA171-SA174
SA175-SA178
SA179-SA182
SA183-SA186
SA187-SA190
SA191-SA194
SA195-SA198
SA199-SA202
SA203-SA206
SA207-SA210
SA211-SA214
SA215-SA218
SA219-SA222
SA223-SA226
SA227-SA230
SA231-SA234
SA235-SA238
SA239-SA242
SA243-SA246
SA247-SA250
SA251-SA254
SA255-SA258
SA259
011111XXXXX
100000XXXXX
100001XXXXX
100010XXXXX
100011XXXXX
100100XXXXX
100101XXXXX
100110XXXXX
100111XXXXX
101000XXXXX
101001XXXXX
101010XXXXX
101011XXXXX
101100XXXXX
101101XXXXX
101110XXXXX
101111XXXXX
110000XXXXX
110001XXXXX
110010XXXXX
110011XXXXX
110100XXXXX
110101XXXXX
110110XXXXX
110111XXXXX
111000XXXXX
111001XXXXX
111010XXXXX
111011XXXXX
111100XXXXX
111101XXXXX
111110XXXXX
11111100XXX
11111101XXX
11111110XXX
11111111000
11111111001
11111111010
11111111011
SA1
SA2
4 Kwords
SA3
4 Kwords
SA4
4 Kwords
SA5
4 Kwords
SA6
4 Kwords
SA7
4 Kwords
SA8
32 Kwords
SA9
32 Kwords
SA10
32 Kwords
SA11-SA14
SA15-SA18
SA19-SA22
SA23-SA26
SA27-SA30
SA31-SA34
SA35-SA38
SA39-SA42
SA43-SA46
SA47-SA50
SA51-SA54
SA55-SA58
SA59-SA62
SA63-SA66
SA67-SA70
SA71-SA74
SA75-SA78
SA79-SA82
SA83-SA86
SA87-SA90
SA91-SA94
SA95-SA98
SA99-SA102
SA103-SA106
SA107-SA110
SA111-SA114
SA115-SA118
SA119-SA122
SA123-SA126
SA127-SA130
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
SA260
32 Kwords
SA261
32 Kwords
SA262
4 Kwords
SA263
4 Kwords
SA264
4 Kwords
SA265
4 Kwords
April 18, 2013 S29PL-J_00_A16
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45
D a t a S h e e t
Table 10.13 PL129J Boot Sector/Sector Block Addresses for Protection/Unprotection
CE1# Control
A21-12
CE2# Control
Sector Group
SA1-0
Sector/Sector Block Size
4 Kwords
Sector Group
SA2-0–SA2-3
A21-12
Sector/Sector Block Size
0000000000
0000000001
0000000010
0000000011
0000000100
0000000101
0000000110
0000000111
0000001XXX
0000010XXX
0000011XXX
00001XXXXX
00010XXXXX
00011XXXXX
00100XXXXX
00101XXXXX
00110XXXXX
00111XXXXX
01000XXXXX
01001XXXXX
01010XXXXX
01011XXXXX
01100XXXXX
01101XXXXX
01110XXXXX
01111XXXXX
10000XXXXX
10001XXXXX
10010XXXXX
10011XXXXX
10100XXXXX
10101XXXXX
10110XXXXX
10111XXXXX
11000XXXXX
11001XXXXX
11010XXXXX
11011XXXXX
11100XXXXX
11101XXXXX
11110XXXXX
11111XXXXX
00000XXXXX
00001XXXXX
00010XXXXX
00011XXXXX
00100XXXXX
00101XXXXX
00110XXXXX
00111XXXXX
01000XXXXX
01001XXXXX
01010XXXXX
01011XXXXX
01100XXXXX
01101XXXXX
01110XXXXX
01111XXXXX
10000XXXXX
10001XXXXX
10010XXXXX
10011XXXXX
10100XXXXX
10101XXXXX
10110XXXXX
10111XXXXX
11000XXXXX
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
32 Kwords
SA1-1
4 Kwords
SA2-4–SA2-7
SA1-2
4 Kwords
SA2-8–SA2-11
SA2-12–SA2-15
SA2-16–SA2-19
SA2-20–SA2-23
SA2-24–SA2-27
SA2-28–SA2-31
SA2-32–SA2-35
SA2-36–SA2-39
SA2-40–SA2-43
SA2-44–SA2-47
SA2-48–SA2-51
SA2-52–SA2-55
SA2-56–SA2-59
SA2-60–SA2-63
SA2-64–SA2-67
SA2-68–SA2-71
SA2-72–SA2-75
SA2-76–SA2-79
SA2-80–SA2-83
SA2-84–SA2-87
SA2-88–SA2-91
SA2-92–SA2-95
SA2-96–SA2-99
SA1-3
4 Kwords
SA1-4
4 Kwords
SA1-5
4 Kwords
SA1-6
4 Kwords
SA1-7
4 Kwords
SA1-8
32 Kwords
SA1-9
32 Kwords
SA1-10
32 Kwords
SA1-11 - SA1-14
SA1-15 - SA1-18
SA1-19 - SA1-22
SA1-23 - SA1-26
SA1-27 - SA1-30
SA1-31 - SA1-34
SA1-35 - SA1-38
SA1-39 - SA1-42
SA1-43 - SA1-46
SA1-47 - SA1-50
SA1-51 - SA1-54
SA1-55 - SA1-58
SA1-59 - SA1-62
SA1-63 - SA1-66
SA1-67 - SA1-70
SA1-71 - SA1-74
SA1-75 - SA1-78
SA1-79 - SA1-82
SA1-83 - SA1-86
SA1-87 - SA1-90
SA1-91 - SA1-94
SA1-95 - SA1-98
SA1-99 - SA1-102
SA1-103 - SA1-106
SA1-107 - SA1-110
SA1-111 - SA1-114
SA1-115 - SA1-118
SA1-119 - SA1-122
SA1-123 - SA1-126
SA1-127 - SA1-130
SA1-131 - SA1-134
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
SA2-100–SA2-103 11001XXXXX
SA2-104–SA2-107 11010XXXXX
SA2-108–SA2-111 11011XXXXX
SA2-112–SA2-115 11100XXXXX
SA2-116–SA2-119 11101XXXXX
SA2-120–SA2-123 11110XXXXX
SA2-124
SA2-125
SA2-126
SA2-127
SA2-128
SA2-129
SA2-130
SA2-131
SA2-132
SA2-133
SA2-134
1111100XXX
1111101XXX
1111110XXX
1111111000
1111111001
1111111010
1111111011
1111111100
1111111101
1111111110
1111111111
32 Kwords
32 Kwords
4 Kwords
4 Kwords
4 Kwords
4 Kwords
4 Kwords
4 Kwords
4 Kwords
4 Kwords
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D a t a S h e e t
10.9 Selecting a Sector Protection Mode
Table 10.14 PL064J Boot Sector/Sector Block Addresses for Protection/Unprotection
Sector
SA0
A21-A12
Sector/Sector Block Size
4 Kwords
0000000000
0000000001
0000000010
0000000011
0000000100
0000000101
0000000110
0000000111
0000001XXX
0000010XXX
0000011XXX
00001XXXXX
00010XXXXX
00011XXXXX
00100XXXXX
00101XXXXX
00110XXXXX
00111XXXXX
01000XXXXX
01001XXXXX
01010XXXXX
01011XXXXX
01100XXXXX
01101XXXXX
01110XXXXX
01111XXXXX
10000XXXXX
10001XXXXX
10010XXXXX
10011XXXXX
10100XXXXX
10101XXXXX
10110XXXXX
10111XXXXX
11000XXXXX
11001XXXXX
11010XXXXX
11011XXXXX
11100XXXXX
11101XXXXX
11110XXXXX
1111100XXX
1111101XXX
1111110XXX
1111111000
1111111001
1111111010
1111111011
1111111100
1111111101
1111111110
1111111111
SA1
4 Kwords
SA2
4 Kwords
SA3
4 Kwords
SA4
4 Kwords
SA5
4 Kwords
SA6
4 Kwords
SA7
4 Kwords
SA8
32 Kwords
SA9
32 Kwords
SA10
32 Kwords
SA11-SA14
SA15-SA18
SA19-SA22
SA23-SA26
SA27-SA30
SA31-SA34
SA35-SA38
SA39-SA42
SA43-SA46
SA47-SA50
SA51-SA54
SA55-SA58
SA59-SA62
SA63-SA66
SA67-SA70
SA71-SA74
SA75-SA78
SA79-SA82
SA83-SA86
SA87-SA90
SA91-SA94
SA95-SA98
SA99-SA102
SA103-SA106
SA107-SA110
SA111-SA114
SA115-SA118
SA119-SA122
SA123-SA126
SA127-SA130
SA131
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
128 (4x32) Kwords
32 Kwords
SA132
32 Kwords
SA133
32 Kwords
SA134
4 Kwords
SA135
4 Kwords
SA136
4 Kwords
SA137
4 Kwords
SA138
4 Kwords
SA139
4 Kwords
SA140
4 Kwords
SA141
4 Kwords
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D a t a S h e e t
The device is shipped with all sectors unprotected. Optional Spansion programming services enable
programming and protecting sectors at the factory prior to shipping the device. Contact your local sales office
for details.
It is possible to determine whether a sector is protected or unprotected. See the Table 10.9, Secured Silicon
Sector Addresses on page 43 for details.
Table 10.15 Sector Protection Schemes
DYB
PPB
PPB Lock
Sector State
0
0
0
1
1
0
1
1
0
0
1
0
1
1
0
1
0
1
0
0
0
1
1
1
Unprotected—PPB and DYB are changeable
Unprotected—PPB not changeable, DYB is changeable
Protected—PPB and DYB are changeable
Protected—PPB not changeable, DYB is changeable
11. Sector Protection
The PL127J, PL129J, PL064J, and PL032J features several levels of sector protection, which can disable
both the program and erase operations in certain sectors or sector groups:
11.1 Persistent Sector Protection
A command sector protection method that replaces the old 12 V controlled protection method.
11.2 Password Sector Protection
A highly sophisticated protection method that requires a password before changes to certain sectors or sector
groups are permitted
11.3 WP# Hardware Protection
A write protect pin that can prevent program or erase operations in sectors SA1-133, SA1-134, SA2-0 and
SA2-1.
The WP# Hardware Protection feature is always available, independent of the software managed protection
method chosen.
11.4 Selecting a Sector Protection Mode
All parts default to operate in the Persistent Sector Protection mode. The customer must then choose if the
Persistent or Password Protection method is most desirable. There are two one-time programmable non-
volatile bits that define which sector protection method will be used. If the Persistent Sector Protection
method is desired, programming the Persistent Sector Protection Mode Locking Bit permanently sets the
device to the Persistent Sector Protection mode. If the Password Sector Protection method is desired,
programming the Password Mode Locking Bit permanently sets the device to the Password Sector Protection
mode. It is not possible to switch between the two protection modes once a locking bit has been set. One of
the two modes must be selected when the device is first programmed. This prevents a program or virus from
later setting the Password Mode Locking Bit, which would cause an unexpected shift from the default
Persistent Sector Protection Mode into the Password Protection Mode.
The device is shipped with all sectors unprotected. Optional Spansion programming services enable
programming and protecting sectors at the factory prior to shipping the device. Contact your local sales office
for details.
It is possible to determine whether a sector is protected or unprotected. See Autoselect Mode on page 43 for
details.
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D a t a S h e e t
12. Persistent Sector Protection
The Persistent Sector Protection method replaces the 12 V controlled protection method in previous flash
devices. This new method provides three different sector protection states:
Persistently Locked—The sector is protected and cannot be changed.
Dynamically Locked—The sector is protected and can be changed by a simple command.
Unlocked—The sector is unprotected and can be changed by a simple command.
To achieve these states, three types of “bits” are used:
Persistent Protection Bit
Persistent Protection Bit Lock
Persistent Sector Protection Mode Locking Bit
12.1 Persistent Protection Bit (PPB)
A single Persistent (non-volatile) Protection Bit is assigned to a maximum four sectors (see the sector
address tables for specific sector protection groupings). All 4 Kword boot-block sectors have individual sector
Persistent Protection Bits (PPBs) for greater flexibility. Each PPB is individually modifiable through the PPB
Write Command.
The device erases all PPBs in parallel. If any PPB requires erasure, the device must be instructed to
preprogram all of the sector PPBs prior to PPB erasure. Otherwise, a previously erased sector PPBs can
potentially be over-erased. The flash device does not have a built-in means of preventing sector PPBs over-
erasure.
12.2 Persistent Protection Bit Lock (PPB Lock)
The Persistent Protection Bit Lock (PPB Lock) is a global volatile bit. When set to “1”, the PPBs cannot be
changed. When cleared (“0”), the PPBs are changeable. There is only one PPB Lock bit per device. The PPB
Lock is cleared after power-up or hardware reset. There is no command sequence to unlock the PPB Lock.
12.3 Dynamic Protection Bit (DYB)
A volatile protection bit is assigned for each sector. After power-up or hardware reset, the contents of all
DYBs is “0”. Each DYB is individually modifiable through the DYB Write Command.
When the parts are first shipped, the PPBs are cleared, the DYBs are cleared, and PPB Lock is defaulted to
power up in the cleared state – meaning the PPBs are changeable.
When the device is first powered on the DYBs power up cleared (sectors not protected). The Protection State
for each sector is determined by the logical OR of the PPB and the DYB related to that sector. For the sectors
that have the PPBs cleared, the DYBs control whether or not the sector is protected or unprotected. By
issuing the DYB Write command sequences, the DYBs will be set or cleared, thus placing each sector in the
protected or unprotected state. These are the so-called Dynamic Locked or Unlocked states. They are called
dynamic states because it is very easy to switch back and forth between the protected and unprotected
conditions. This allows software to easily protect sectors against inadvertent changes yet does not prevent
the easy removal of protection when changes are needed. The DYBs maybe set or cleared as often as
needed.
The PPBs allow for a more static, and difficult to change, level of protection. The PPBs retain their state
across power cycles because they are non-volatile. Individual PPBs are set with a command but must all be
cleared as a group through a complex sequence of program and erasing commands. The PPBs are also
limited to 100 erase cycles.
The PPB Lock bit adds an additional level of protection. Once all PPBs are programmed to the desired
settings, the PPB Lock may be set to “1”. Setting the PPB Lock disables all program and erase commands to
the non-volatile PPBs. In effect, the PPB Lock Bit locks the PPBs into their current state. The only way to
clear the PPB Lock is to go through a power cycle. System boot code can determine if any changes to the
PPB are needed; for example, to allow new system code to be downloaded. If no changes are needed then
the boot code can set the PPB Lock to disable any further changes to the PPBs during system operation.
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D a t a S h e e t
The WP#/ACC write protect pin adds a final level of hardware protection to sectors SA1-133, SA1-134, SA2-
0 and SA2-1. When this pin is low it is not possible to change the contents of these sectors. These sectors
generally hold system boot code. The WP#/ACC pin can prevent any changes to the boot code that could
override the choices made while setting up sector protection during system initialization.
For customers who are concerned about malicious viruses there is another level of security - the persistently
locked state. To persistently protect a given sector or sector group, the PPBs associated with that sector need
to be set to “1”. Once all PPBs are programmed to the desired settings, the PPB Lock should be set to “1”.
Setting the PPB Lock automatically disables all program and erase commands to the Non-Volatile PPBs. In
effect, the PPB Lock “freezes” the PPBs into their current state. The only way to clear the PPB Lock is to go
through a power cycle.
It is possible to have sectors that have been persistently locked, and sectors that are left in the dynamic state.
The sectors in the dynamic state are all unprotected. If there is a need to protect some of them, a simple DYB
Write command sequence is all that is necessary. The DYB write command for the dynamic sectors switch
the DYBs to signify protected and unprotected, respectively. If there is a need to change the status of the
persistently locked sectors, a few more steps are required. First, the PPB Lock bit must be disabled by either
putting the device through a power-cycle, or hardware reset. The PPBs can then be changed to reflect the
desired settings. Setting the PPB lock bit once again will lock the PPBs, and the device operates normally
again.
The best protection is achieved by executing the PPB lock bit set command early in the boot code, and
protect the boot code by holding WP#/ACC = VIL.
Table 10.15 on page 48 contains all possible combinations of the DYB, PPB, and PPB lock relating to the
status of the sector.
In summary, if the PPB is set, and the PPB lock is set, the sector is protected and the protection can not be
removed until the next power cycle clears the PPB lock. If the PPB is cleared, the sector can be dynamically
locked or unlocked. The DYB then controls whether or not the sector is protected or unprotected.
If the user attempts to program or erase a protected sector, the device ignores the command and returns to
read mode. A program command to a protected sector enables status polling for approximately 1 µs before
the device returns to read mode without having modified the contents of the protected sector. An erase
command to a protected sector enables status polling for approximately 50 µs after which the device returns
to read mode without having erased the protected sector.
The programming of the DYB, PPB, and PPB lock for a given sector can be verified by writing a DYB/PPB/
PPB lock verify command to the device. There is an alternative means of reading the protection status. Take
RESET# to VIL and hold WE# at VIH. (The high voltage A9 Autoselect Mode also works for reading the status
of the PPBs). Scanning the addresses (A18–A11) while (A6, A1, A0) = (0, 1, 0) will produce a logical ‘1” code
at device output DQ0 for a protected sector or a “0” for an unprotected sector. In this mode, the other
addresses are don’t cares. Address location with A1 = VIL are reserved for autoselect manufacturer and
device codes.
12.4 Persistent Sector Protection Mode Locking Bit
Like the password mode locking bit, a Persistent Sector Protection mode locking bit exists to guarantee that
the device remain in software sector protection. Once set, the Persistent Sector Protection locking bit
prevents programming of the password protection mode locking bit. This guarantees that a hacker could not
place the device in password protection mode.
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D a t a S h e e t
13. Password Protection Mode
The Password Sector Protection Mode method allows an even higher level of security than the Persistent
Sector Protection Mode. There are two main differences between the Persistent Sector Protection and the
Password Sector Protection Mode:
When the device is first powered on, or comes out of a reset cycle, the PPB Lock bit set to the locked state,
rather than cleared to the unlocked state.
The only means to clear the PPB Lock bit is by writing a unique 64-bit Password to the device.
The Password Sector Protection method is otherwise identical to the Persistent Sector Protection method.
A 64-bit password is the only additional tool utilized in this method.
Once the Password Mode Locking Bit is set, the password is permanently set with no means to read,
program, or erase it. The password is used to clear the PPB Lock bit. The Password Unlock command must
be written to the flash, along with a password. The flash device internally compares the given password with
the pre-programmed password. If they match, the PPB Lock bit is cleared, and the PPBs can be altered. If
they do not match, the flash device does nothing. There is a built-in 2 µs delay for each “password check.”
This delay is intended to thwart any efforts to run a program that tries all possible combinations in order to
crack the password.
13.1 Password and Password Mode Locking Bit
In order to select the Password sector protection scheme, the customer must first program the password. The
password may be correlated to the unique Electronic Serial Number (ESN) of the particular flash device.
Each ESN is different for every flash device; therefore each password should be different for every flash
device. While programming in the password region, the customer may perform Password Verify operations.
Once the desired password is programmed in, the customer must then set the Password Mode Locking Bit.
This operation achieves two objectives:
Permanently sets the device to operate using the Password Protection Mode. It is not possible to reverse this
function.
Disables all further commands to the password region. All program, and read operations are ignored.
Both of these objectives are important, and if not carefully considered, may lead to unrecoverable errors. The
user must be sure that the Password Protection method is desired when setting the Password Mode Locking
Bit. More importantly, the user must be sure that the password is correct when the Password Mode Locking
Bit is set. Due to the fact that read operations are disabled, there is no means to verify what the password is
afterwards. If the password is lost after setting the Password Mode Locking Bit, there will be no way to clear
the PPB Lock bit.
The Password Mode Locking Bit, once set, prevents reading the 64-bit password on the DQ bus and further
password programming. The Password Mode Locking Bit is not erasable. Once Password Mode Locking Bit
is programmed, the Persistent Sector Protection Locking Bit is disabled from programming, guaranteeing that
no changes to the protection scheme are allowed.
13.2 64-bit Password
The 64-bit Password is located in its own memory space and is accessible through the use of the Password
Program and Verify commands (see “Password Verify Command”). The password function works in
conjunction with the Password Mode Locking Bit, which when set, prevents the Password Verify command
from reading the contents of the password on the pins of the device.
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13.3 Write Protect (WP#)
The Write Protect feature provides a hardware method of protecting the upper two and lower two sectors
without using VID. This function is provided by the WP# pin and overrides the previously discussed High
Voltage Sector Protection on page 52 method.
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in the two
outermost 4 Kword sectors on both ends of the flash array independent of whether it was previously protected
or unprotected.
If the system asserts VIH on the WP#/ACC pin, the device reverts the upper two and lower two sectors to
whether they were last set to be protected or unprotected. That is, sector protection or unprotection for these
sectors depends on whether they were last protected or unprotected using the method described in the High
Voltage Sector Protection on page 52.
Note that the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may
result.
13.3.1
Persistent Protection Bit Lock
The Persistent Protection Bit (PPB) Lock is a volatile bit that reflects the state of the Password Mode Locking
Bit after power-up reset. If the Password Mode Lock Bit is also set after a hardware reset (RESET# asserted)
or a power-up reset, the ONLY means for clearing the PPB Lock Bit in Password Protection Mode is to issue
the Password Unlock command. Successful execution of the Password Unlock command clears the PPB
Lock Bit, allowing for sector PPBs modifications. Asserting RESET#, taking the device through a power-on
reset, or issuing the PPB Lock Bit Set command sets the PPB Lock Bit to a “1” when the Password Mode
Lock Bit is not set.
If the Password Mode Locking Bit is not set, including Persistent Protection Mode, the PPB Lock Bit is cleared
after power-up or hardware reset. The PPB Lock Bit is set by issuing the PPB Lock Bit Set command. Once
set the only means for clearing the PPB Lock Bit is by issuing a hardware or power-up reset. The Password
Unlock command is ignored in Persistent Protection Mode.
13.4 High Voltage Sector Protection
Sector protection and unprotection may also be implemented using programming equipment. The procedure
requires high voltage (VID) to be placed on the RESET# pin. Refer to Figure 13.1 on page 53 for details on
this procedure. Note that for sector unprotect, all unprotected sectors must first be protected prior to the first
sector write cycle.
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Figure 13.1 In-System Sector Protection/Sector Unprotection Algorithms
START
START
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
PLSCNT = 1
PLSCNT = 1
RESET# = VID
RESET# = VID
unprotected sectors
prior to issuing the
first sector
Wait 1 μs
Wait 1 μs
unprotect address
No
No
First Write
Cycle = 60h?
First Write
Cycle = 60h?
Temporary Sector
Unprotect Mode
Temporary Sector
Unprotect Mode
Yes
Yes
Set up sector
address
No
All sectors
protected?
Sector Protect:
Write 60h to sector
address with
Yes
Set up first sector
address
A7-A0 = 00000010
Sector Unprotect:
Wait 150 µs
Write 60h to sector
address with
A7-A0 =
Verify Sector
Protect: Write 40h
to sector address
with A7-A0 =
01000010
Reset
PLSCNT = 1
Increment
PLSCNT
Wait 15 ms
00000010
Verify Sector
Unprotect: Write
40h to sector
address with
A7-A0 =
Read from
sector address
with A7-A0 =
00000010
Increment
PLSCNT
No
00000010
No
PLSCNT
= 25?
Read from
sector address
with A7-A0 =
00000010
Data = 01h?
Yes
No
Yes
Set up
next sector
address
Yes
No
PLSCNT
= 1000?
Protect another
sector?
Remove V
ID
Data = 00h?
Yes
from RESET#
No
Yes
Write reset
command
Remove VID
from RESET#
No
Last sector
verified?
Remove V
from RESET#
ID
Sector Protect
complete
Write reset
command
Yes
Write reset
command
Remove VID
from RESET#
Device failed
Sector Protect
complete
Sector Protect
complete
Write reset
command
Sector Protect
Algorithm
Device failed
Sector Unprotect
complete
Sector Unprotect
Algorithm
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13.5 Temporary Sector Unprotect
This feature allows temporary unprotection of previously protected sectors to change data in-system. The
Sector Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly protected
sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the
RESET# pin, all the previously protected sectors are protected again. Figure 13.2 on page 54 shows the
algorithm, and Figure 21.1 on page 85 shows the timing diagrams, for this feature. While PPB lock is set, the
device cannot enter the Temporary Sector Unprotection Mode.
Figure 13.2 Temporary Sector Unprotect Operation
START
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors unprotected (If WP#/ACC = V , upper two and lower two sectors will remain protected).
IL
2. All previously protected sectors are protected once again
13.6 Secured Silicon Sector Flash Memory Region
The Secured Silicon Sector feature provides a Flash memory region that enables permanent part
identification through an Electronic Serial Number (ESN) The 128-word Secured Silicon sector is divided into
64 factory-lockable words that can be programmed and locked by the customer. The Secured Silicon sector
is located at addresses 000000h-00007Fh in both Persistent Protection mode and Password Protection
mode. Indicator bits DQ6 and DQ7 are used to indicate the factory-locked and customer locked status of the
part.
The system accesses the Secured Silicon Sector through a command sequence (see the Enter/Exit Secured
Silicon Sector Command Sequence on page 60). After the system has written the Enter Secured Silicon
Sector command sequence, it may read the Secured Silicon Sector by using the addresses normally
occupied by the boot sectors. This mode of operation continues until the system issues the Exit Secured
Silicon Sector command sequence, or until power is removed from the device. Once the Enter SecSi Sector
Command sequence has been entered, the standard array cannot be accessed until the Exit SecSi Sector
command has been entered or the device has been reset. On power-up, or following a hardware reset, the
device reverts to sending commands to the normal address space. Note that the ACC function and unlock
bypass modes are not available when the Secured Silicon Sector is enabled.
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13.6.1
13.6.2
Factory-Locked Area (64 words)
The factory-locked area of the Secured Silicon Sector (000000h-00003Fh) is locked when the part is shipped,
whether or not the area was programmed at the factory. The Secured Silicon Sector Factory-locked Indicator
Bit (DQ7) is permanently set to a “1”. Optional Spansion programming services can program the factory-
locked area with a random ESN, a customer-defined code, or any combination of the two. Because only
Spansion can program and protect the factory-locked area, this method ensures the security of the ESN once
the product is shipped to the field. Contact your local sales office for details on using Spansion’s programming
services. Note that the ACC function and unlock bypass modes are not available when the Secured Silicon
sector is enabled.
Customer-Lockable Area (64 words)
The customer-lockable area of the Secured Silicon Sector (000040h-00007Fh) is shipped unprotected, which
allows the customer to program and optionally lock the area as appropriate for the application. The Secured
Silicon Sector Customer-locked Indicator Bit (DQ6) is shipped as “0” and can be permanently locked to “1” by
issuing the Secured Silicon Protection Bit Program Command. The Secured Silicon Sector can be read any
number of times, but can be programmed and locked only once. Note that the accelerated programming
(ACC) and unlock bypass functions are not available when programming the Secured Silicon Sector.
The Customer-lockable Secured Silicon Sector area can be protected using one of the following procedures:
Write the three-cycle Enter Secured Silicon Sector Region command sequence, and then follow the in-
system sector protect algorithm as shown in Figure 13.1 on page 53, except that RESET# may be at either
VIH or VID. This allows in-system protection of the Secured Silicon Sector Region without raising any device
pin to a high voltage. Note that this method is only applicable to the Secured Silicon Sector.
To verify the protect/unprotect status of the Secured Silicon Sector, follow the algorithm shown in Figure
on page 55.
Once the Secured Silicon Sector is locked and verified, the system must write the Exit Secured Silicon
Sector Region command sequence to return to reading and writing the remainder of the array.
The Secured Silicon Sector lock must be used with caution since, once locked, there is no procedure
available for unlocking the Secured Silicon Sector area and none of the bits in the Secured Silicon Sector
memory space can be modified in any way.
13.6.3
Secured Silicon Sector Protection Bits
The Secured Silicon Sector Protection Bits prevent programming of the Secured Silicon Sector memory area.
Once set, the Secured Silicon Sector memory area contents are non-modifiable.
Figure 13.3 Secured Silicon Sector Protect Verify
START
If data = 00h,
RESET# =
SecSi Sector is
VIH or VID
unprotected.
If data = 01h,
SecSi Sector is
protected.
Wait 1 µs
Write 60h to
any address
Remove VIH or VID
from RESET#
Write 40h to SecSi
Sector address
Write reset
with A6 = 0,
command
A1 = 1, A0 = 0
SecSi Sector
Read from SecSi
Protect Verify
Sector address
complete
with A6 = 0,
A1 = 1, A0 = 0
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13.7 Hardware Data Protection
The command sequence requirement of unlock cycles for programming or erasing provides data protection
against inadvertent writes. In addition, the following hardware data protection measures prevent accidental
erasure or programming, which might otherwise be caused by spurious system level signals during VCC
power-up and power-down transitions, or from system noise.
13.7.1
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register and all internal program/erase circuits are disabled, and
the device resets to the read mode. Subsequent writes are ignored until VCC is greater than VLKO. The
system must provide the proper signals to the control pins to prevent unintentional writes when VCC is greater
than VLKO
.
13.7.2
13.7.3
Write Pulse “Glitch” Protection
Noise pulses of less than 3 ns (typical) on OE#, CE#, (CE1#, CE2# in PL129J) or WE# do not initiate a write
cycle.
Logical Inhibit
Write cycles are inhibited by holding any one of OE# = VIL, CE# (CE1# = CE2# in PL129J)= VIH or
WE# = VIH. To initiate a write cycle, CE# (CE1# / CE2# in PL129J) and WE# must be a logical zero while
OE# is a logical one.
13.7.4
Power-Up Write Inhibit
If WE# = CE# (CE1#, CE2# in PL129J) = VIL and OE# = VIH during power up, the device does not accept
commands on the rising edge of WE#. The internal state machine is automatically reset to the read mode on
power-up.
14. Common Flash Memory Interface (CFI)
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h, any time the device is ready to read array data. The system can read CFI information at the addresses
given in Table 14.1 on page 57 to Table 14.4 on page 58. To terminate reading CFI data, the system must
write the reset command. The CFI Query mode is not accessible when the device is executing an Embedded
Program or embedded Erase algorithm.
The system can also write the CFI query command when the device is in the autoselect mode. The device
enters the CFI query mode, and the system can read CFI data at the addresses given in Table 14.1 to
Table 14.4. The system must write the reset command to return the device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100. Contact your local sales
office for copies of these documents.
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Table 14.1 CFI Query Identification String
Addresses
Data
Description
10h
11h
12h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
0002h
0000h
Primary OEM Command Set
15h
16h
0040h
0000h
Address for Primary Extended Table
17h
18h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
Address for Alternate OEM Extended Table (00h = none exists)
19h
1Ah
0000h
0000h
Table 14.2 System Interface String
Addresses
Data
Description
V
Min. (write/erase)
CC
1Bh
0027h
0036h
D7–D4: volt, D3–D0: 100 millivolt
V
Max. (write/erase)
CC
1Ch
D7–D4: volt, D3–D0: 100 millivolt
1Dh
1Eh
1Fh
20h
21h
22h
23h
24h
25h
26h
0000h
0000h
0003h
0000h
0009h
0000h
0004h
0000h
0004h
0000h
V
V
Min. voltage (00h = no V pin present)
PP
PP
Max. voltage (00h = no V pin present)
PP
PP
Typical timeout per single byte/word write 2N µs
Typical timeout for Min. size buffer write 2N µs (00h = not supported)
Typical timeout per individual block erase 2N ms
Typical timeout for full chip erase 2N ms (00h = not supported)
Max. timeout for byte/word write 2N times typical
Max. timeout for buffer write 2N times typical
Max. timeout per individual block erase 2N times typical
Max. timeout for full chip erase 2N times typical (00h = not supported)
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Table 14.3 Device Geometry Definition
Addresses
Data
Description
0018h (PL127J)
0018h (PL129J)
0017h (PL064J)
0016h (PL032J)
27h
Device Size = 2N byte
28h
29h
0001h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
0000h
0000h
Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch
0003h
Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
00FDh (PL127J)
00FDh (PL129J)
007Dh (PL064J)
003Dh (PL032J)
31h
Erase Block Region 2 Information
(refer to the CFI specification or CFI publication 100)
32h
33h
34h
0000h
0000h
0001h
35h
36h
37h
38h
0007h
0000h
0020h
0000h
Erase Block Region 3 Information
(refer to the CFI specification or CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
(refer to the CFI specification or CFI publication 100)
Table 14.4 Primary Vendor-Specific Extended Query
Addresses
Data
Description
40h
41h
42h
0050h
0052h
0049h
Query-unique ASCII string “PRI”
43h
44h
0031h
0033h
Major version number, ASCII (reflects modifications to the silicon)
Minor version number, ASCII (reflects modifications to the CFI table)
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
45h
TBD
Silicon Revision Number (Bits 7-2)
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
46h
47h
48h
49h
0002h
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
0001h
Sector Protect/Unprotect scheme
07 = Advanced Sector Protection
0007h (PLxxxJ)
00E7h (PL127J)
00E7h (PL129J)
0077h (PL064J)
003Fh (PL032J)
Simultaneous Operation
00 = Not Supported, X = Number of Sectors excluding Bank 1
4Ah
Burst Mode Type
00 = Not Supported, 01 = Supported
4Bh
4Ch
4Dh
4Eh
0000h
0002h (PLxxxJ)
0085h
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
0095h
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Table 14.4 Primary Vendor-Specific Extended Query (Continued)
Addresses
Data
Description
Top/Bottom Boot Sector Flag
00h = Uniform device, 01h = Both top and bottom boot with write protect,
02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
4Fh
0001h
Program Suspend
0 = Not supported, 1 = Supported
50h
57h
0001h
0004h
Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
0027h (PL127J)
0027h (PL129J)
0017h (PL064J)
000Fh (PL032J)
Bank 1 Region Information
X = Number of Sectors in Bank 1
58h
59h
5Ah
5Bh
0060h (PL127J)
0060h (PL129J)
0030h (PL064J)
0018h (PL032J)
Bank 2 Region Information
X = Number of Sectors in Bank 2
0060h (PL127J)
0060h (PL129J)
0030h (PL064J)
0018h (PL032J)
Bank 3 Region Information
X = Number of Sectors in Bank 3
0027h (PL127J)
0027h (PL129J)
0017h (PL064J)
000Fh (PL032J)
Bank 4 Region Information
X = Number of Sectors in Bank 4
15. Command Definitions
Writing specific address and data commands or sequences into the command register initiates device
operations. Table 15.1 on page 66 defines the valid register command sequences. Writing incorrect
address and data values or writing them in the improper sequence may place the device in an unknown
state. A reset command is then required to return the device to reading array data.
All addresses are latched on the falling edge of WE# or CE# (CE1# / CE2# in PL129J), whichever happens
later. All data is latched on the rising edge of WE# or CE# (CE1# / CE2# in PL129J), whichever happens first.
Refer to AC Characteristic on page 76 for timing diagrams.
15.1 Reading Array Data
The device is automatically set to reading array data after device power-up. No commands are required to
retrieve data. Each bank is ready to read array data after completing an Embedded Program or Embedded
Erase algorithm.
After the device accepts an Erase Suspend command, the corresponding bank enters the erase-suspend-
read mode, after which the system can read data from any non-erase-suspended sector within the same
bank. The system can read array data using the standard read timing, except that if it reads at an address
within erase-suspended sectors, the device outputs status data. After completing a programming operation in
the Erase Suspend mode, the system may once again read array data with the same exception. See Erase
Suspend/Erase Resume Commands on page 64 for more information.
After the device accepts a Program Suspend command, the corresponding bank enters the program-
suspend-read mode, after which the system can read data from any non-program-suspended sector within
the same bank. See Program Suspend/Program Resume Commands on page 65 for more information.
The system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if DQ5
goes high during an active program or erase operation, or if the bank is in the autoselect mode. See the next
section, Reset Command on page 60, for more information.
See also Requirements for Reading Array Data on page 23 for more information. The table AC Characteristic
on page 76 provides the read parameters, and Figure 16.2 on page 70 shows the timing diagram.
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15.2 Reset Command
Writing the reset command resets the banks to the read or erase-suspend-read mode. Address bits are don’t
cares for this command.
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the bank to which the system was writing to the read mode. Once erasure begins,
however, the device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in a program command sequence before
programming begins. This resets the bank to which the system was writing to the read mode. If the program
command sequence is written to a bank that is in the Erase Suspend mode, writing the reset command
returns that bank to the erase-suspend-read mode. Once programming begins, however, the device ignores
reset commands until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command must be written to return to the read mode. If a bank
entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns that bank
to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to the
read mode (or erase-suspend-read mode if that bank was in Erase Suspend and program-suspend-read
mode if that bank was in Program Suspend).
15.3 Autoselect Command Sequence
The autoselect command sequence allows the host system to access the manufacturer and device codes,
and determine whether or not a sector is protected. The autoselect command sequence may be written to an
address within a bank that is either in the read or erase-suspend-read mode. The autoselect command may
not be written while the device is actively programming or erasing in the other bank.
The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third
write cycle that contains the bank address and the autoselect command. The bank then enters the autoselect
mode. The system may read any number of autoselect codes without reinitiating the command sequence.
Table 15.1 on page 66 shows the address and data requirements. To determine sector protection
information, the system must write to the appropriate bank address (BA) and sector address (SA). Table 10.4
on page 24 shows the address range and bank number associated with each sector.
The system must write the reset command to return to the read mode (or erase-suspend-read mode if the
bank was previously in Erase Suspend).
15.4 Enter/Exit Secured Silicon Sector Command Sequence
The Secured Silicon Sector region provides a secured data area containing a random, eight word electronic
serial number (ESN). The system can access the Secured Silicon Sector region by issuing the three-cycle
Enter Secured Silicon Sector command sequence. The device continues to access the Secured Silicon
Sector region until the system issues the four-cycle Exit Secured Silicon Sector command sequence. The Exit
Secured Silicon Sector command sequence returns the device to normal operation. The Secured Silicon
Sector is not accessible when the device is executing an Embedded Program or embedded Erase algorithm.
Table 15.1 on page 66 shows the address and data requirements for both command sequences. See also
Secured Silicon Sector Flash Memory Region on page 54 for further information. Note that the ACC function
and unlock bypass modes are not available when the Secured Silicon Sector is enabled.
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15.5 Word Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two
unlock write cycles, followed by the program set-up command. The program address and data are written
next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further
controls or timings. The device automatically provides internally generated program pulses and verifies the
programmed cell margin. Table 15.1 on page 66 shows the address and data requirements for the program
command sequence. Note that the Secured Silicon Sector, autoselect, and CFI functions are unavailable
when a [program/erase] operation is in progress.
When the Embedded Program algorithm is complete, that bank then returns to the read mode and addresses
are no longer latched. The system can determine the status of the program operation by using DQ7, DQ6, or
RY/BY#. Refer to Write Operation Status on page 68 for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the program operation. The program command sequence should be
reinitiated once that bank has returned to the read mode, to ensure data integrity. Note that the Secured
Silicon Sector, autoselect and CFI functions are unavailable when the Secured Silicon Sector is enabled.
Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from
“0” back to a “1.” Attempting to do so may cause that bank to set DQ5 = 1, or cause the DQ7 and DQ6
status bits to indicate the operation was successful. However, a succeeding read will show that the data is still
“0.” Only erase operations can convert a “0” to a “1.”
15.5.1
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program data to a bank faster than using the standard
program command sequence. The unlock bypass command sequence is initiated by first writing two unlock
cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. That bank then
enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is
required to program in this mode. The first cycle in this sequence contains the unlock bypass program
command, A0h; the second cycle contains the program address and data. Additional data is programmed in
the same manner. This mode dispenses with the initial two unlock cycles required in the standard program
command sequence, resulting in faster total programming time. Table 15.1 on page 66 shows the
requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are
valid. To exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command
sequence. (See Table 15.2 on page 67)
The device offers accelerated program operations through the WP#/ACC pin. When the system asserts VHH
on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then write
the two-cycle Unlock Bypass program command sequence. The device uses the higher voltage on the WP#/
ACC pin to accelerate the operation. Note that the WP#/ACC pin must not be at VHH any operation other than
accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not be left
floating or unconnected; inconsistent behavior of the device may result.
Figure 15.1 on page 62 illustrates the algorithm for the program operation. Refer to the table Erase/Program
Operations on page 80 for parameters, and Figure 20.6 on page 81 for timing diagrams.
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Figure 15.1 Program Operation
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
No
Yes
No
Increment Address
Last Address?
Yes
Programming
Completed
Note
See Table 15.1 on page 66 for program command sequence.
15.6 Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical erase. The system is not required to provide any
controls or timings during these operations. Table 15.1 on page 66 shows the address and data requirements
for the chip erase command sequence.
When the Embedded Erase algorithm is complete, that bank returns to the read mode and addresses are no
longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or
RY/BY#. Refer to Write Operation Status on page 68 for information on these status bits.
Any commands written during the chip erase operation are ignored. Note that Secured Silicon Sector,
autoselect, and CFI functions are unavailable when a [program/erase] operation is in progress. However,
note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase
command sequence should be reinitiated once that bank has returned to reading array data, to ensure data
integrity.
Figure 15.2 on page 63 illustrates the algorithm for the erase operation. Refer to the tables in Erase/Program
Operations on page 80 for parameters, and Figure 20.8 on page 82 for timing diagrams.
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15.7 Sector Erase Command Sequence
Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed
by the address of the sector to be erased, and the sector erase command. Table 15.1 on page 66 shows the
address and data requirements for the sector erase command sequence.
The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm
automatically programs and verifies the entire memory for an all zero data pattern prior to electrical erase.
The system is not required to provide any controls or timings during these operations.
After the command sequence is written, a sector erase time-out of 50 µs occurs. During the time-out period,
additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may
be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between
these additional cycles must be less than 50 µs, otherwise erasure may begin. Any sector erase address and
command following the exceeded time-out may or may not be accepted. It is recommended that processor
interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be
re-enabled after the last Sector Erase command is written. If any command other than 30h, B0h, F0h is
input during the time-out period, the normal operation will not be guaranteed. The system must rewrite
the command sequence and any additional addresses and commands. Note that Secured Silicon Sector,
autoselect, and CFI functions are unavailable when a [program/erase] operation is in progress.
The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3:
Sector Erase Timer). The time-out begins from the rising edge of the final WE# pulse in the command
sequence.
When the Embedded Erase algorithm is complete, the bank returns to reading array data and addresses are
no longer latched. Note that while the Embedded Erase operation is in progress, the system can read data
from the non-erasing bank. The system can determine the status of the erase operation by reading DQ7,
DQ6, DQ2, or RY/BY# in the erasing bank. Refer to Write Operation Status on page 68 for information on
these status bits.
Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands
are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs,
the sector erase command sequence should be reinitiated once that bank has returned to reading array data,
to ensure data integrity.
Figure 7.2 on page 18 illustrates the algorithm for the erase operation. Refer to the tables in Erase/Program
Operations on page 80 for parameters, and Figure 20.8 on page 82 for timing diagrams.
Figure 15.2 Erase Operation
START
Write Erase
Command Sequence
(Notes 1, 2)
Data Poll to Erasing
Bank from System
Embedded
Erase
algorithm
in progress
No
Data = FFh?
Yes
Erasure Completed
Notes
1. See Table 15.1 on page 66 for erase command sequence.
2. See the section on DQ3 for information on the sector erase timer.
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15.8 Erase Suspend/Erase Resume Commands
The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read
data from, or program data to, any sector not selected for erasure. The bank address is required when writing
this command. This command is valid only during the sector erase operation, including the 50 µs time-out
period during the sector erase command sequence. The Erase Suspend command is ignored if written during
the chip erase operation or Embedded Program algorithm.
When the Erase Suspend command is written during the sector erase operation, the device requires a
maximum of 35 µs to suspend the erase operation. However, when the Erase Suspend command is written
during the sector erase time-out, the device immediately terminates the time-out period and suspends the
erase operation. Addresses are “don’t-cares” when writing the Erase suspend command.
After the erase operation has been suspended, the bank enters the erase-suspend-read mode. The system
can read data from or program data to any sector not selected for erasure. (The device “erase suspends” all
sectors selected for erasure.) Reading at any address within erase-suspended sectors produces status
information on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is
actively erasing or is erase-suspended. Refer to Write Operation Status on page 68 for information on these
status bits.
After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read mode.
The system can determine the status of the program operation using the DQ7 or DQ6 status bits, just as in
the standard Word Program operation. Refer to Write Operation Status on page 68 for more information.
In the erase-suspend-read mode, the system can also issue the autoselect command sequence. The device
allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in
the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend
mode, and is ready for another valid operation. Refer to Table 10.9, Secured Silicon Sector Addresses
on page 43 and Autoselect Command Sequence on page 60 for details.
To resume the sector erase operation, the system must write the Erase Resume command (address bits are
don’t care). The bank address of the erase-suspended bank is required when writing this command. Further
writes of the Resume command are ignored. Another Erase Suspend command can be written after the chip
has resumed erasing.
If the Persistent Sector Protection Mode Locking Bit is verified as programmed without margin, the Persistent
Sector Protection Mode Locking Bit Program Command should be reissued to improve program margin. If the
Secured Silicon Sector Protection Bit is verified as programmed without margin, the Secured Silicon Sector
Protection Bit Program Command should be reissued to improve program margin. µµAfter programming a
PPB, two additional cycles are needed to determine whether the PPB has been programmed with margin. If
the PPB has been programmed without margin, the program command should be reissued to improve the
program margin. Also note that the total number of PPB program/erase cycles is limited to 100 cycles.
Cycling the PPBs beyond 100 cycles is not guaranteed.
After erasing the PPBs, two additional cycles are needed to determine whether the PPB has been erased
with margin. If the PPBs has been erased without margin, the erase command should be reissued to improve
the program margin. The programming of either the PPB or DYB for a given sector or sector group can be
verified by writing a Sector Protection Status command to the device.
Note that there is no single command to independently verify the programming of a DYB for a given sector
group.
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15.9 Program Suspend/Program Resume Commands
The Program Suspend command allows the system to interrupt an embedded programming operation so that
data can read from any non-suspended sector. When the Program Suspend command is written during a
programming process, the device halts the programming operation within tPSL (program suspend latency)
and updates the status bits. Addresses are “don’t-cares” when writing the Program Suspend command. After
the programming operation has been suspended, the system can read array data from any non-suspended
sector. The Program Suspend command may also be issued during a programming operation while an erase
is suspended. In this case, data may be read from any addresses not in Erase Suspend or Program Suspend.
If a read is needed from the Secured Silicon Sector area, then user must use the proper command
sequences to enter and exit this region. The system may also write the autoselect command sequence when
the device is in Program Suspend mode. The device allows reading autoselect codes in the suspended
sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode, the
device reverts to Program Suspend mode, and is ready for another valid operation. See Autoselect
Command Sequence on page 60 for more information. After the Program Resume command is written, the
device reverts to programming. The system can determine the status of the program operation using the DQ7
or DQ6 status bits, just as in the standard program operation. See Write Operation Status on page 68 for
more information. The system must write the Program Resume command (address bits are “don’t care”) to
exit the Program Suspend mode and continue the programming operation. Further writes of the Program
Resume command are ignored. Another Program Suspend command can be written after the device has
resumed programming.
15.10 Command Definitions Tables
Table 15.1 on page 66 contains the Memory Array Command Definitions.
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Table 15.1 Memory Array Command Definitions
Bus Cycles (Notes 1–4)
Command (Notes)
Read (5)
Addr Data Addr Data Addr Data
Addr
Data Addr Data Addr Data
1
1
RA
RD
F0
Reset (6)
XXX
(BA)
555
(BA)
X00
Manufacturer ID
Device ID (10)
4
6
4
4
555
555
555
555
AA
AA
2AA
2AA
2AA
2AA
55
55
55
55
90
90
90
90
01
(BA)
555
(BA)
X01
(BA)
X0E
(BA)
X0F
227E
(8)
(10)
(10)
Secured Silicon Sector
Factory Protect (8)
(BA)
555
AA
X03
Sector Group
Protect Verify(9)
(BA)
555
XX00/
XX01
AAA
(SA) X02
Program
4
6
6
1
1
1
2
3
2
2
1
2
555
555
555
BA
AA
AA
AA
B0
30
98
A0
AA
A0
80
98
90
2AA
2AA
2AA
55
55
55
555
555
555
A0
80
80
PA
PD
AA
AA
Chip Erase
555
555
2AA
2AA
55
55
555
SA
10
30
Sector Erase
Program/Erase Suspend (11)
Program/Erase Resume (12)
CFI Query (13)
BA
55
Accelerated Program (15)
Unlock Bypass Entry (15)
Unlock Bypass Program (15)
Unlock Bypass Erase (15)
Unlock Bypass CFI (13)(15)
Unlock Bypass Reset (15)
Legend
XX
PA
2AA
PA
PD
55
555
XX
555
20
PD
10
XX
XX
XX
XXX
XXX
00
BA = Address of bank switching to autoselect mode, bypass mode, or erase operation. Determined by PL127J: Amax:A20, PL064J and
PL129J: Amax:A19, PL032J: Amax:A18.
PA = Program Address (Amax:A0). Addresses latch on falling edge of WE# or CE# (CE1#/CE2# for PL129J) pulse, whichever happens later.
PD = Program Data (DQ15:DQ0) written to location PA. Data latches on rising edge of WE# or CE# (CE1#/CE2# for PL129J) pulse,
whichever happens first.
RA = Read Address (Amax:A0).
RD = Read Data (DQ15:DQ0) from location RA.
SA = Sector Address (Amax:A12) for verifying (in autoselect mode) or erasing.
WD = Write Data. See “Configuration Register” definition for specific write data. Data latched on rising edge of WE#.
X = Don’t care
Notes
1. See Table 10.1 on page 23 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write operations.
4. During unlock and command cycles, when lower address bits are 555 or 2AAh as shown in table, address bits higher than A11 (except
where BA is required) and data bits higher than DQ7 are don’t cares.
5. No unlock or command cycles required when bank is reading array data.
6. The Reset command is required to return to reading array (or to erase-suspend-read mode if previously in Erase Suspend) when bank is
in autoselect mode, or if DQ5 goes high (while bank is providing status information).
7. Fourth cycle of autoselect command sequence is a read cycle. System must provide bank address to obtain manufacturer ID or device ID
information. See Autoselect Command Sequence on page 60 for more information.
8. The data is DQ6=1 for factory and customer locked and DQ7=1 for factory locked.
9. The data is 00h for an unprotected sector group and 01h for a protected sector group.
10. Device ID must be read across cycles 4, 5, and 6. PL127J (X0Eh = 2220h, X0Fh = 2200h), PL129J (X0Eh = 2221h, X0Fh =
2200h),PL064J (X0Eh = 2202h, X0Fh = 2201h), PL032J (X0Eh = 220Ah, X0Fh = 2201h).
11. System may read and program in non-erasing sectors, or enter autoselect mode, when in Program/Erase Suspend mode. Program/Erase
Suspend command is valid only during a sector erase operation, and requires bank address.
12. Program/Erase Resume command is valid only during Erase Suspend mode, and requires bank address.
13. Command is valid when device is ready to read array data or when device is in autoselect mode.
14. WP#/ACC must be at V during the entire operation of command.
ID
15. Unlock Bypass Entry command is required prior to any Unlock Bypass operation. Unlock Bypass Reset command is required to return to
the reading array.
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Table 15.2 Sector Protection Command Definitions
Bus Cycles (Notes 1-4)
Command (Notes)
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Reset
1
3
XXX
555
F0
Secured Silicon
Sector Entry (16)
AA
2AA
2AA
55
55
555
555
88
90
Secured Silicon
Sector Exit (16)
4
6
555
555
AA
AA
XX
00
68
Secured Silicon
Protection Bit
RD
(0)
2AA
55
555
60
OW
OW
OW
48
OW
Program (Notes 5, 6)
Secured Silicon
Protection Bit Status
RD
(0)
5
4
4
7
6
4
555
555
555
555
555
555
AA
AA
AA
AA
AA
AA
2AA
2AA
2AA
2AA
2AA
2AA
55
55
55
55
55
55
555
555
555
555
555
60
38
C8
28
60
90
OW
XX
48
Password Program
(Notes 5, 7, 8)
PD
[0-3] [0-3]
Password Verify
(Notes 6, 8, 9)
PWA PWD
[0-3] [0-3]
Password Unlock
(Notes 7, 10, 11)
PWA PWD PWA PWD PWA PWD PWA PWD
[0]
[0]
[1]
[1]
[2]
[2]
[3]
[3]
PPB Program
(Notes 5, 6, 11)
(SA)
WP
(SA)
WP
(SA)
WP
68
48
RD(0)
BA+
555
(SA)
WP
RD
(0)
PPB Status
All PPB Erase
(Notes 5, 6, 13, 14)
(SA)
WP
6
3
4
555
555
555
AA
AA
AA
2AA
2AA
2AA
55
55
55
555
555
60
78
58
WP
60
(SA)
40
RD(0)
PPB Lock Bit Set
BA+
555
RD
(1)
PPB Lock Bit Status (15)
SA
DYB Write (7)
DYB Erase (7)
4
4
555
555
AA
AA
2AA
2AA
55
55
555
555
48
48
SA
SA
X1
X0
BA+
555
RD
(0)
DYB Status (6)
4
6
5
6
5
555
555
555
555
555
AA
AA
AA
AA
AA
2AA
2AA
2AA
2AA
2AA
55
55
55
55
55
58
60
60
60
60
SA
PL
PL
SL
SL
PPMLB Program
(Notes 5, 6, 12)
555
555
555
555
68
48
68
48
PL
PL
SL
SL
48
PL
SL
RD(0)
RD(0)
RD
(0)
PPMLB Status (5)
SPMLB Program
(Notes 5, 6, 12)
48
RD
(0)
SPMLB Status (5)
Legend
DYB = Dynamic Protection Bit
OW = Address (A7:A0) is (00011010)
PD[3:0] = Password Data (1 of 4 portions)
PPB = Persistent Protection Bit
PWA = Password Address. A1:A0 selects portion of password.
PWD = Password Data being verified.
PL = Password Protection Mode Lock Address (A7:A0) is (00001010)
RD(0) = Read Data DQ0 for protection indicator bit.
RD(1) = Read Data DQ1 for PPB Lock status.
SA = Sector Address where security command applies. Address bits Amax:A12 uniquely select any sector.
SL = Persistent Protection Mode Lock Address (A7:A0) is (00010010)
WP = PPB Address (A7:A0) is (00000010)
X = Don’t care
PPMLB = Password Protection Mode Locking Bit
SPMLB = Persistent Protection Mode Locking Bit
Notes
1. See Table 10.1 on page 23 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write operations.
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4. During unlock and command cycles, when lower address bits are 555 or 2AAh as shown in table, address bits higher than A11 (except
where BA is required) and data bits higher than DQ7 are don’t cares.
5. The reset command returns device to reading array.
6. Cycle 4 programs the addressed locking bit. Cycles 5 and 6 validate bit has been fully programmed when DQ0 = 1. If DQ0 = 0 in cycle 6,
program command must be issued and verified again.
7. Data is latched on the rising edge of WE#.
8. Entire command sequence must be entered for each portion of password.
9. Command sequence returns FFh if PPMLB is set.
10. The password is written over four consecutive cycles, at addresses 0-3.
11. A 2 µs timeout is required between any two portions of password.
12. A 100 µs timeout is required between cycles 4 and 5.
13. A 1.2 ms timeout is required between cycles 4 and 5.
14. Cycle 4 erases all PPBs. Cycles 5 and 6 validate bits have been fully erased when DQ0 = 0. If DQ0 = 1 in cycle 6, erase command must
be issued and verified again. Before issuing erase command, all PPBs should be programmed to prevent PPB overerasure.
15. DQ1 = 1 if PPB locked, 0 if unlocked.
16. Once the Secured Silicon Sector Entry Command sequence has been entered, the standard array cannot be accessed until the Exit
SecSi Sector command has been entered or the device has been reset.
16. Write Operation Status
The device provides several bits to determine the status of a program or erase operation: DQ2, DQ3, DQ5,
DQ6, and DQ7. Table 16.1 on page 72 and the following subsections describe the function of these bits. DQ7
and DQ6 each offer a method for determining whether a program or erase operation is complete or in
progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether an
Embedded Program or Erase operation is in progress or has been completed.
16.1 DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm
is in progress or completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising
edge of the final WE# pulse in the command sequence.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum
programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the
Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system
must provide the program address to read valid status information on DQ7. If a program address falls within a
protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to the read
mode.
During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the bank enters the Erase Suspend mode, Data# Polling produces a “1” on DQ7.
The system must provide an address within any of the sectors selected for erasure to read valid status
information on DQ7.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling
on DQ7 is active for approximately 400 µs, then the bank returns to the read mode. If not all selected sectors
are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected
sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the
status may not be valid.
When the system detects DQ7 has changed from the complement to true data, it can read valid data at
DQ15–DQ0 on the following read cycles. Just prior to the completion of an Embedded Program or Erase
operation, DQ7 may change asynchronously with DQ15–DQ0 while Output Enable (OE#) is asserted low.
That is, the device may change from providing status information to valid data on DQ7. Depending on when
the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed
the program or erase operation and DQ7 has valid data, the data outputs on DQ15–DQ0 may be still invalid.
Valid data on DQ15–DQ0 will appear on successive read cycles.
Table 16.1 on page 72 shows the outputs for Data# Polling on DQ7. Figure 16.1 on page 69 shows the Data#
Polling algorithm. Figure 20.10 on page 83 shows the Data# Polling timing diagram.
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Figure 16.1 Data# Polling Algorithm
START
Read DQ7–DQ0
Addr = VA
Yes
DQ7 = Data?
No
No
DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
Yes
DQ7 = Data?
No
PASS
FAIL
Notes
1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being
erased. During chip erase, a valid address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
16.2 RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a
pull-up resistor to VCC
.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the
Erase Suspend mode.) If the output is high (Ready), the device is in the read mode, the standby mode, or one
of the banks is in the erase-suspend-read mode.
Table 16.1 on page 72 shows the outputs for RY/BY#.
16.3 DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete,
or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is
valid after the rising edge of the final WE# pulse in the command sequence (prior to the program or erase
operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is
complete, DQ6 stops toggling.
After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for
approximately 400 µs, then returns to reading array data. If not all selected sectors are protected, the
Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are
protected.
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The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-
suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6
toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must
also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use
DQ7 (see the DQ7: Data# Polling on page 68).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program
algorithm is complete.
Table 16.1 on page 72 shows the outputs for Toggle Bit I on DQ6. Figure 16.2 on page 70 shows the toggle
bit algorithm. Figure 20.11 on page 84 in shows the toggle bit timing diagrams. Figure 20.12 on page 84
shows the differences between DQ2 and DQ6 in graphical form. See also the DQ2: Toggle Bit II on page 71.
Figure 16.2 Toggle Bit Algorithm
START
Read Byte
(DQ7–DQ0)
Address =VA
Read Byte
(DQ7–DQ0)
Address =VA
No
Toggle Bit
= Toggle?
Yes
No
DQ5 = 1?
Yes
Read Byte Twice
(DQ7–DQ0)
Address = VA
Toggle Bit
= Toggle?
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Note:
The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1.” See the DQ6:
Toggle Bit I on page 69 and DQ2: Toggle Bit II on page 71 for more information.
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16.4 DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that
is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is
valid after the rising edge of the final WE# pulse in the command sequence.
DQ2 toggles when the system reads at addresses within those sectors that have been selected for erasure.
(The system may use either OE# or CE# (CE1# / CE2# for PL129J) to control the read cycles.) But DQ2
cannot distinguish whether the sector is actively erasing or is erase-suspended. DQ6, by comparison,
indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors
are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to
Table 16.1 on page 72 to compare outputs for DQ2 and DQ6.
Figure 16.2 on page 70 shows the toggle bit algorithm in flowchart form, and the DQ2: Toggle Bit II
on page 71 explains the algorithm. See also the DQ6: Toggle Bit I on page 69. Figure 20.11 on page 84
shows the toggle bit timing diagram. Figure 20.12 on page 84 shows the differences between DQ2 and DQ6
in graphical form.
16.5 Reading Toggle Bits DQ6/DQ2
Refer to Figure 16.2 on page 70 for the following discussion. Whenever the system initially begins reading
toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling.
Typically, the system would note and store the value of the toggle bit after the first read. After the second
read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling,
the device has completed the program or erase operation. The system can read array data on DQ7–DQ0 on
the following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the
system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as
DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or
erase operation. If it is still toggling, the device did not completed the operation successfully, and the system
must write the reset command to return to reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not
gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles,
determining the status as described in the previous paragraph. Alternatively, it may choose to perform other
system tasks. In this case, the system must start at the beginning of the algorithm when it returns to
determine the status of the operation (top of Figure 16.2 on page 70).
16.6 DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under
these conditions DQ5 produces a “1,” indicating that the program or erase cycle was not successfully
completed.
The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously
programmed to “0.” Only an erase operation can change a “0” back to a “1.” Under this condition, the
device halts the operation, and when the timing limit has been exceeded, DQ5 produces a “1.”
Under both these conditions, the system must write the reset command to return to the read mode (or to the
erase-suspend-read mode if a bank was previously in the erase-suspend-program mode).
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16.7 DQ3: Sector Erase Timer
After writing a sector erase command sequence, the system may read DQ3 to determine whether or not
erasure has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors
are selected for erasure, the entire time-out also applies after each additional sector erase command. When
the time-out period is complete, DQ3 switches from a “0” to a “1.” See also the Sector Erase Command
Sequence on page 63.
After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6
(Toggle Bit I) to ensure that the device has accepted the command sequence, and then read DQ3. If DQ3 is
“1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored
until the erase operation is complete. If DQ3 is “0,” the device will accept additional sector erase commands.
To ensure the command has been accepted, the system software should check the status of DQ3 prior to and
following each subsequent sector erase command. If DQ3 is high on the second status check, the last
command might not have been accepted.
Table 16.1 shows the status of DQ3 relative to the other status bits.
Table 16.1 Write Operation Status
DQ7
DQ5
DQ2
Status
(Note 2)
DQ6
(Note 1)
DQ3
(Note 2)
RY/BY#
Embedded Program
Algorithm
DQ7#
0
Toggle
0
0
N/A
No toggle
Toggle
0
Standard
Mode
Embedded Erase
Algorithm
Toggle
1
0
1
Erase
Suspended
1
No toggle
0
N/A
Toggle
Erase
Sector
Suspend-
Read
Erase
Suspend
Mode
Non-Erase
Data
Data
Data
0
Data
N/A
Data
N/A
1
Suspended
Sector
Erase-Suspend
-Program
DQ7#
Toggle
0
1
Reading within
Program
Suspended Sector
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Program
Suspend
Mode
Reading within
Non-program
(Note 3)
Data
Data
Data
Data
Data
1
Suspended Sector
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to DQ5:
Exceeded Timing Limits on page 71 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm is in
progress. The device outputs array data if the system addresses a non-busy bank.
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17. Absolute Maximum Ratings
Storage Temperature Plastic Packages
Ambient Temperature with Power Applied
Voltage with Respect to Ground
VCC (Note 1)
–65°C to +150°C
–65°C to +125°C
–0.5 V to +4.0 V
–0.5 V to +12.5 V
–0.5 V to +10.5 V
–0.5 V to VCC +0.5 V
200 mA
A9, OE#, and RESET# (Note 2)
WP#/ACC (Note 2)
All other pins (Note 1)
Output Short Circuit Current (Note 3)
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot V to –2.0 V for periods of
SS
up to 20 ns. Maximum DC voltage on input or I/O pins is V +0.5 V. During voltage transitions, input or I/O pins may overshoot to V
CC
CC
+2.0 V for periods up to 20 ns. See Figure 17.1 on page 73.
2. Minimum DC input voltage on pins A9, OE#, RESET#, and WP#/ACC is –0.5 V. During voltage transitions, A9, OE#, WP#/ACC, and
RESET# may overshoot V to –2.0 V for periods of up to 20 ns. See Figure 17.1 on page 73. Maximum DC input voltage on pin A9,
SS
OE#, and RESET# is +12.5 V which may overshoot to +14.0 V for periods up to 20 ns. Maximum DC input voltage on WP#/ACC is +9.5 V
which may overshoot to +12.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.
4. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability
Figure 17.1 Maximum Overshoot Waveforms
20 ns
20 ns
20 ns
V
+0.8 V
CC
+2.0 V
V
–0.5 V
–2.0 V
CC
+0.5 V
2.0 V
20 ns
20 ns
20 ns
Maximum Negative Overshoot Waveform
Maximum Positive Overshoot Waveform
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18. Operating Ranges
Operating ranges define those limits between which the functionality of the device is guaranteed.
Industrial (I) Devices
Ambient Temperature (TA) ................–40°C to +85°C
Wireless (W) Devices
Ambient Temperature (TA) ................–25°C to +85°C
Supply Voltages
VCC ...................................................2.7–3.6 V
VIO (see Note)...................................1.65–1.95 V (for PL127J and PL129J) or 2.7–3.6 V (for all PLxxxJ
devices)
Note:
For all AC and DC specifications, V = V ; contact your local sales office for other V options.
IO
CC
IO
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19. DC Characteristics
Table 19.1 CMOS Compatible
Parameter
Parameter
Description (notes)
Test Conditions
= V to V
Min
Typ
Max
Unit
V
V
,
CC
IN
SS
I
Input Load Current
± 1.0
µA
LI
= V
= V
= V
CC
CC max
CC max
CC max
A9, OE#, RESET#
Input Load Current
I
V
V
; V = 12.5 V
35
35
µA
µA
µA
LIT
CC
ID
I
Reset Leakage Current
; V = 12.5 V
ID
LR
LO
CC
V
V
= V to V , OE# = V
SS CC IH
OUT
I
Output Leakage Current
± 1.0
= V
CC
CC max
5 MHz
20
45
15
30
55
25
V
(1, 2)
Active Read Current
CC
I
OE# = V , V = V
CC max
mA
CC1
IH
CC
10 MHz
I
I
I
I
V
V
V
Active Write Current (2, 3)
Standby Current (2)
Reset Current (2)
OE# = V , WE# = V
IL
mA
µA
µA
µA
CC2
CC3
CC4
CC5
CC
CC
CC
IH
CE#, RESET#, WP#/ACC
0.2
0.2
0.2
5
5
5
= V ± ±0.3 V
IO
RESET# = V ± ±0.3 V
SS
Automatic Sleep Mode
(Notes 2, 4)
V
V
= V ± 0.3 V;
SS
IH
IL
IO
= V ± ±0.3 V
5 MHz
10 MHz
5 MHz
10 MHz
21
46
21
46
45
70
45
70
V
Active Read-While-Program
CC
I
OE# = V
,
,
mA
mA
CC6
CC7
IH
Current (1, 2)
V
Active Read-While-Erase
CC
I
OE# = V
OE# = V
IH
IH
Current (1, 2)
V
Active Program-While-Erase-
CC
I
I
17
10
25
15
mA
mA
V
CC8
Suspended Current (2, 5)
V
Active Page Read Current (2)
OE# = V , 8 word Page Read
IH
CC9
CC
V
= 1.65–1.95 V
IO
–0.4
–0.5
0.4
0.8
(PL127J and PL129J)
V
Input Low Voltage
Input High Voltage
IL
V
= 2.7–3.6 V
V
IO
V
= 1.65–1.95 V
IO
V
–0.4
V
+0.4
V
IO
IO
(PL127J AND PL129J)
V
IH
V
V
= 2.7–3.6 V
2.0
V
+0.3
V
IO
CC
Voltage for ACC
Program Acceleration
V
= 3.0 V 10%
8.5
9.5
V
HH
CC
Voltage for Autoselect and
Temporary Sector Unprotect
V
V
= 3.0 V ± 10%
11.5
12.5
0.1
V
V
V
V
ID
CC
I
= 100 µA, V = V
CC
= 1.65–1.95 V
,
OL
CC min
V
IO
(PL127J AND PL129J)
V
Output Low Voltage
Output High Voltage
OL
I
= 2.0 mA, V = V
CC
= 2.7–3.6 V
,
OL
CC min
0.4
V
IO
I
= –100 µA, V = V
CC
= 1.65–1.95 V
,
CC min
OH
V
V –0.1
IO
IO
(PL127J AND PL129J)
= ––100 µA, V = V
CC min
V
OH
V
-
CC
I
V
V
OH
IO
0.2V
V
Low V Lock-Out Voltage (5)
2.3
2.5
LKO
CC
Notes
1. The I current listed is typically less than 5 mA/MHz, with OE# at V
.
IH
CC
2. Maximum I specifications are tested with V = V .
CCmax
CC
CC
3.
I
active while Embedded Erase or Embedded Program is in progress.
CC
4. Automatic sleep mode enables the low power mode when addresses remain stable for t
5. Not 100% tested.
+ 30 ns. Typical sleep mode current is 2 µA.
ACC
6. In S29PL129J there are two CE# (CE1#, CE2#).
7. Valid CE1#/CE2# conditions: (CE1# = V CE2# = V ) or (CE1# = V CE2# = V ) or (CE1# = V CE2# = V )
IH
IL,
IH,
IH,
IL
IH,
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20. AC Characteristic
20.1 Test Conditions
Figure 20.1 Test Setups
3.6 V
2.7 kΩ
Device
Under
Test
Device
Under
Test
C
C
6.2 kΩ
L
L
VIO = 3.0 V
VIO = 1.8 V (PL127J and PL129J)
Note
Diodes are IN3064 or equivalent
Table 20.1 Test Specifications
Test Conditions
All Speeds
Unit
Output Load
Output Load Capacitance, C (including jig capacitance)
1 TTL gate
30
pF
ns
L
V
= 1.8 V
IO
(PL127J AND PL129J)
Input Rise and Fall Times
Input Pulse Levels
5
V
V
= 3.0 V
= 1.8 V
IO
IO
0.0 - 1.8
0.0–3.0
(PL127J AND PL129J)
V
V
= 3.0 V
IO
Input timing measurement reference levels
Output timing measurement reference levels
V
/2
/2
V
V
IO
IO
V
20.2 Switching Waveforms
Table 20.2 Key To Switching Waveforms
Waveform
Inputs
Outputs
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
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Figure 20.2 Input Waveforms and Measurement Levels
VIO
VIO/2
VIO/2
Input
Measurement Level
Output
0.0 V
20.3 Read Operations
Table 20.3 Read-Only Operations
Parameter
Speed Options
JEDEC
Std.
Description (Notes)
Test Setup
55 60 65 70 80 Unit
t
t
Read Cycle Time (1)
Min 55 60 65 70 80
Max 55 60 65 70 80
Max 55 60 65 70 80
Max 20 25 25 30 30
ns
ns
ns
ns
ns
ns
ns
AVAV
RC
t
t
Address to Output Delay
CE#, OE# = V
IL
AVQV
ACC
t
t
Chip Enable to Output Delay
Page Access Time
OE# = V
IL
ELQV
CE
t
PACC
t
t
t
Output Enable to Output Delay
Chip Enable to Output High Z (3)
Output Enable to Output High Z (1, 3)
Max 20 25
Max
30
35
GLQV
EHQZ
GHQZ
OE
t
t
16
16
DF
DF
t
Max
Output Hold Time From Addresses,
CE# or OE#, Whichever Occurs First (3)
t
t
Min
5
ns
AXQX
OH
Read
Min
Min
0
ns
ns
t
Output Enable Hold Time (1)
OEH
Toggle and Data# Polling
10
Notes
1. Not 100% tested.
2. See Figure 20.1 on page 76 and Table 20.1 on page 76 for test specifications
3. Measurements performed by placing a 50 ohm termination on the data pin with a bias of V /2. The time from OE# high to the data bus
CC
driven to V /2 is taken as t
.
CC
DF
4. S29PL129J has two CE# (CE1#, CE2#).
5. Valid CE1# / CE2# conditions: (CE1# = V ,CE2# = V ) or (CE1# = V ,CE2# = V ) or (CE1# = V CE2# = V )
IH
IL
IH
IH
IL
IH,
6. Valid CE1# / CE2# transitions: (CE1# = V ,CE2# = V ) or (CE1# = V ,CE2# = V ) to (CE1# = CE2# = V
)
)
IL
IH
IH
IL
IH
7. Valid CE1# / CE2# transitions: (CE1# = CE2# = V ) to (CE1# = V ,CE2# = V ) or (CE1# = V ,CE2# = V
IL
IH
IL
IH
IH
8. For 70 pF Output Load Capacitance, 2 ns will be added to the above t
,t ,t
,t values for all speed grades
ACC CE PACC OE
Figure 20.3 Read Operation Timings
tRC
Addresses Stable
tACC
Addresses
CE#
tRH
tRH
tD
tOE
OE#
WE
tOEH
tCE
tOH
Valid Data
High Z
High Z
Data
RESET#
RY/BY#
0 V
Notes
1. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 20.4 Page Read Operation Timings
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Same Page
Amax
-
-
A3
A0
A2
Ad
Aa
tACC
Ab
tPACC
Ac
tPACC
tPACC
Data
Qa
Qb
Qc
Qd
CE#
OE#
Notes
1. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
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20.4 Reset
Table 20.4 Hardware Reset (RESET#)
Parameter
JEDEC Std
All Speed
Options
Description
Unit
RESET# Pin Low (During Embedded Algorithms) to Read Mode
(See Note)
t
Max
Max
20
µs
Ready
Ready
RESET# Pin Low (NOT During Embedded Algorithms) to Read Mode
(See Note)
t
500
ns
t
RESET# Pulse Width
Min
Min
Min
Min
500
50
20
0
ns
ns
µs
ns
RP
t
Reset High Time Before Read (See Note)
RESET# Low to Standby Mode
RY/BY# Recovery Time
RH
t
RPD
t
RB
Note
Not 100% tested.
Figure 20.5 Reset Timings
RY/BY#
CE#, OE#
RESET#
tRH
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Notes
1. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the below waveform CE# = CE1# or CE2#
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20.5 Erase/Program Operations
Table 20.5 Erase and Program Operations
Parameter
Speed Options (ns)
JEDEC
tAVAV
Std
tWC
tAS
Description
55
60
65
65
0
70
80 Unit
Write Cycle Time (Note 1)
Min
Min
Min
Min
55
60
70
80
ns
ns
ns
Address Setup Time
tAVWL
tASO
tAH
Address Setup Time to OE# low during toggle bit polling
Address Hold Time
15
30
25
35
30
tWLAX
Address Hold Time From CE# (CE1#, CE#2 in PL129J) or OE# high
during toggle bit polling
Min
0
ns
tAHT
tDVWH
tWHDX
tDS
tDH
Data Setup Time
Min
Min
Min
ns
ns
ns
Data Hold Time
0
Output Enable High during toggle bit polling
10
tOEPH
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tGHWL
tGHWL
CE# (CE1# or CE#2 in PL129J) Setup Time
CE# (CE1# or CE#2 in PL129J) Hold Time
Write Pulse Width
Min
Min
Min
Min
Min
Typ
Typ
Typ
Min
Min
Max
Min
Max
Max
0
0
ns
ns
ns
ns
ns
µs
µs
sec
µs
ns
ns
ns
µs
µs
tELWL
tWHEH
tWLWH
tWHDL
tCS
tCH
tWP
35
Write Pulse Width High
20
25
tWPH
tSR/W
Latency Between Read and Write Operations
Programming Operation (Note 4)
Accelerated Programming Operation (Note 4)
Sector Erase Operation (Note 4)
0
6
tWHWH1 tWHWH1
tWHWH1 tWHWH1
tWHWH2 tWHWH2
tVCS
4
0.5
50
0
V
Setup Time (Note 1)
CC
Write Recovery Time from RY/BY#
Program/Erase Valid to RY/BY# Delay
tRB
90
35
35
35
tBUSY
Program Suspend Latency
Erase Suspend Latency
tPSL
tESL
Notes:
1. Not 100% tested.
2. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
3. S29PL129J - There are two CE# (CE1#, CE2#).
4. See Table 21.4 on page 88 for more information.
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20.6 Timing Diagrams
Figure 20.6 Program Operation Timings
Program Command Sequence (last two cycles) Read Status Data (last two cycles)
tAS
PA
tWC
Addresses
555h
PA
PA
tAH
CE#
OE#
tCH
tWHWH1
tWP
WE#
Data
tWPH
tCS
tDS
tDH
PD
DOUT
A0h
Status
tBUSY
tRB
RY/BY#
VCC
tVCS
Notes
1. PA = program address, PD = program data, D
is the true data at the program address
OUT
2. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 20.7 Accelerated Program Timing Diagram
VHH
VIL or VIH
VIL or VIH
WP#/ACC
tVHH
tVHH
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Figure 20.8 Chip/Sector Erase Operation Timings
Erase Command Sequence (last two cycles)
Read Status Data
tAS
SA
tWC
VA
VA
Addresses
CE#
2AAh
555h for chip erase
tAH
tCH
OE#
tWP
WE#
tWPH
tWHWH2
tCS
tDS
tDH
Data
Status
D
OUT
55h
30h
10 for Chip Erase
tBUSY
tRB
RY/BY#
VCC
tVCS
Notes
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status on page 68
2. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#.
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Figure 20.9 Back-to-back Read/Write Cycle Timings
tWC
tWC
tRC
tWC
Valid PA
tAH
Valid RA
Valid PA
Valid PA
Addresses
tAS
tCPH
tAS
tAH
tACC
tCE
CE#
OE#
tCP
tOE
tOEH
tGHWL
tWP
WE#
Data
tDF
tWPH
tDS
tOH
tDH
Valid
Out
Valid
In
Valid
In
Valid
In
tSR/W
WE# Controlled Write Cycle
Read Cycle
CE# Controlled Write Cycles
Figure 20.10 Data# Polling Timings (During Embedded Algorithms)
tRC
Addresses
CE#
VA
tACC
tCE
VA
VA
tCH
tOE
OE#
WE#
tOEH
tDF
tOH
High Z
High Z
DQ7
Valid Data
Complement
Complement
True
DQ6–DQ0
Status Data
True
Valid Data
Status Data
tBUSY
RY/BY#
Note
VA = Valid address. The illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle
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Figure 20.11 Toggle Bit Timings (During Embedded Algorithms)
tAHT
tAS
Addresses
CE#
tAHT
tASO
tCEPH
tOEH
WE#
OE#
tOEPH
tDH
Valid Data
tOE
Valid
Status
Valid
Status
Valid
Status
DQ6/DQ2
Valid Data
(first read)
(second read)
(stops toggling)
RY/BY#
Notes
1. VA = Valid address; not required for DQ6. The illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle
2. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 20.12 DQ2 vs. DQ6
Enter
Embedded
Erasing
Erase
Suspend
Enter Erase
Suspend Program
Erase
Resume
Erase
Erase Suspend
Read
Erase
Suspend
Program
Erase
Complete
WE#
Erase
Erase Suspend
Read
DQ6
DQ2
Note
DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle DQ2 and DQ6.
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21. Protect/Unprotect
Table 21.1 Temporary Sector Unprotect
Parameter
Unit
JEDEC
Std
Description
Rise and Fall Time (See Note)
ID
All Speed Options
t
V
Min
Min
Min
500
250
4
ns
ns
µs
VIDR
t
V
Rise and Fall Time (See Note)
VHH
HH
t
RESET# Setup Time for Temporary Sector Unprotect
RSP
RESET# Hold Time from RY/BY# High for Temporary
Sector Unprotect
t
Min
4
µs
RRB
Note
Not 100% tested.
Figure 21.1 Temporary Sector Unprotect Timing Diagram
VID
VID
RESET#
VIL or VIH
VIL or VIH
tVIDR
tVIDR
Program or Erase Command Sequence
CE#
WE#
tRRB
tRSP
RY/BY#
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Figure 21.2 Sector/Sector Block Protect and Unprotect Timing Diagram
V
V
ID
IH
RESET#
SA, A6,
A1, A0
Valid*
Valid*
Valid*
Status
Sector Group Protect/Unprotect
Verify
40h
Data
60h
60h
1 µs
Sector Group Protect: 150 µs
Sector Group Unprotect: 15 ms
CE#
WE#
OE#
Notes
1. For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0.
2. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
86
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21.1 Controlled Erase Operations
Table 21.2 Alternate CE# Controlled Erase and Program Operations
Parameter
JEDEC Std
Speed Options
Description (Notes)
55
60
65
65
0
70
80
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
sec
t
t
Write Cycle Time (Note 1)
Address Setup Time
Address Hold Time
Data Setup Time
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Typ
Typ
Typ
55
60
70
80
AVAV
WC
t
t
AVWL
AS
AH
DS
DH
t
t
30
25
35
30
ELAX
DVEH
EHDX
t
t
t
t
Data Hold Time
0
0
0
0
t
t
t
Read Recovery Time Before Write (OE# High to WE# Low)
WE# Setup Time
GHEL
GHEL
t
WLEL
WS
WH
t
t
WE# Hold Time
EHWH
t
t
CE# (CE1# or CE#2 in PL129J) Pulse Width
CE# (CE1# or CE#2 in PL129J) Pulse Width High
Programming Operation (Note 2)
35
20
40
25
ELEH
EHEL
CP
t
t
CPH
t
t
t
t
t
t
6
4
WHWH1
WHWH1
WHWH2
WHWH1
WHWH1
WHWH2
Accelerated Programming Operation (Note 2)
Sector Erase Operation (Note 2)
0.5
Notes
1. Not 100% tested.
2. See Erase And Programming Performance on page 88 for more information.
Figure 21.3 Alternate CE# Controlled Write (Erase/Program) Operation Timings
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
Data# Polling
Addresses
PA
tWC
tWH
tAS
tAH
WE#
OE#
tGHEL
tWHWH1 or 2
tCP
CE#
Data
tWS
tCPH
tDS
tBUSY
tDH
DQ7#
DOUT
tRH
A0 for program
55 for erase
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
is the data written to the device
OUT
4. S29PL129J - During CE1# transitions, CE2# = V ; During CE2# transitions, CE1# = V
IH
IH
5. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
April 18, 2013 S29PL-J_00_A16
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87
D a t a S h e e t
Table 21.3 CE1#/CE2# Timing (S29PL129J only)
Parameter
JEDEC
Std
Description
All Speed Options
Unit
t
CE1#/CE2# Recover Time (See Note)
Min
0
ns
CCR
Note
This parameter is defined for CE1#/CE2# recover time for read/read, program/read, and read/program operations. Program/program operation are not allowed and
only a single program operation is allowed at one time.
Figure 21.4 Timing Diagram for Alternating Between CE1# and CE2# Control
CE1#
tCCR
tCCR
CE2#
Table 21.4 Erase And Programming Performance
Max
Parameter
Typ (Note 1)
(Note 2)
Unit
sec
sec
sec
sec
Comments
Sector Erase Time
0.5
135
71
2
PL127J/129J
PL064J
216
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
113.6
62.4
PL032J
39
Excludes system level
overhead (Note 5)
Word Program Time
6
100
µs
Accelerated Word Program Time
PL127J/129J
4
60
µs
50.4
25.2
12.6
200
50.4
25.2
sec
sec
sec
Chip Program Time
(Note 3)
PL064J
PL032J
Notes
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V V , 100,000 cycles. Additionally, programming typicals
CC
assume checkerboard pattern. All values are subject to change.
2. Under worst case conditions of 90°C, V = 2.7 V, 1,000,000 cycles. All values are subject to change.
CC
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster
than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 15.1
on page 66 for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 100,000 cycles.
88
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
22. Pin Capacitance
22.1 BGA Pin Capacitance
Parameter Symbol
Parameter Description
Input Capacitance
Test Setup
= 0
Typ
6.3
7.0
5.5
11
Max
7
Unit
pF
C
V
IN
IN
C
Output Capacitance
V
= 0
8
pF
OUT
OUT
C
Control Pin Capacitance
WP#/ACC Pin Capacitance
V
= 0
8
pF
IN2
IN3
IN
IN
C
V
= 0
12
pF
Notes
1. Sampled, not 100% tested.
2. Test conditions T = 25°C, f = 1.0 MHz.
A
22.2 TSOP Pin Capacitance
Parameter Symbol
Parameter Description
Test Setup
= 0
Typ
10
Max
10.5
6.5
10
Unit
pF
C
Input Capacitance
Output Capacitance
V
IN
IN
C
V
= 0
5.5
8
pF
OUT
OUT
C
Control Pin Capacitance
WP#/ACC Pin Capacitance
V
= 0
pF
IN2
IN3
IN
IN
C
V
= 0
9.5
10
pF
Notes
1. Sampled, not 100% tested.
2. Test conditions T = 25°C, f = 1.0 MHz.
A
April 18, 2013 S29PL-J_00_A16
S29PL-J
89
D a t a S h e e t
23. Physical Dimensions
23.1 VBG080—80-Ball Fine-pitch Ball Grid Array 8 x 11 mm Package (PL127J)
0.05
C
D1
D
A
(2X)
e
8
7
6
5
4
3
2
1
e
7
SE
E1
E
M
L
K
J
H
G
F
E
D
C
B
A
A1 CORNER
INDEX MARK
10
PIN A1
CORNER
B
6
SD
NXφb
7
0.05
(2X)
C
φ±0.08
φ±0.15
M
M
C
C A
B
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.10
0.08
C
C
A2
A
C
A1
SEATING PLANE
NOTES:
PACKAGE
JEDEC
VBG 080
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.00 mm x 8.00 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
MAX
1.00
---
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
---
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.18
0.62
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
0.76
BODY THICKNESS
BODY SIZE
11.00 BSC.
8.00 BSC.
8.80 BSC.
5.60 BSC.
12
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
8
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
80
φb
0.33
---
0.43
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
8. NOT USED.
(A3-A6,B3-B6,L3-L6,M3-M6) DEPOPULATED SOLDER BALLS
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3329 \ 16-038.25b
90
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
23.2 VBH064—64-Ball Fine-pitch Ball Grid Array 8 x 11.6 mm package (PL127J)
0.05
C
D1
D
A
(2X)
e
10
9
e
7
8
SE
7
6
E1
E
5
4
3
2
1
M
L
K
J
H
G
F
E
D
C
B
A
A1 CORNER
A1 CORNER
INDEX MARK
B
SD
7
6
0.05
(2X)
C
10
NXφb
φ 0.08
φ 0.15
M
M
C
TOP VIEW
C A
B
BOTTOM VIEW
0.10
C
A2
A
0.08
C
C
A1
SEATING PLANE
SIDE VIEW
NOTES:
PACKAGE
JEDEC
VBH 064
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.60 mm x 8.00 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
---
MAX
1.00
---
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.18
0.62
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
0.76
BODY THICKNESS
BODY SIZE
11.60 BSC.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
10
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
64
φb
0.33
---
0.43
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. NOT USED.
(A2-9,B1-4,B7-10,C1-K1,
M2-9,C10-K10,L1-4,L7-10,
G5-6,F5-6)
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3330 \ 16-038.25b
April 18, 2013 S29PL-J_00_A16
S29PL-J
91
D a t a S h e e t
23.3 VBK048—48-Ball Fine-pitch Ball Grid Array 8.15 x 6.15 mm package
(PL032J and PL064J)
0.10 (4X)
D1
A
D
6
5
4
3
2
1
7
e
SE
E1
E
H
G
F
E
D
C
B
A
INDEX MARK
10
6
B
A1 CORNER
PIN A1
CORNER
7
φb
φ±0.08
φ±0.15
SD
M
M
C
TOP VIEW
C A B
BOTTOM VIEW
0.10
C
A2
A
SEATING PLANE
SIDE VIEW
0.08
C
C
A1
NOTES:
PACKAGE
JEDEC
VBK 048
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
8.15 mm x 6.15 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
MAX
1.00
---
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.18
0.62
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
8
0.76
BODY THICKNESS
BODY SIZE
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
6
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
48
φb
0.33
---
0.43
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
---
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3338 \ 16-038.25b
92
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
23.4 VBU056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J)
D1
A
D
e
0.05
(2X)
C
8
7
6
SE
7
5
4
E
B
E1
3
e
2
1
H
G
F
E
D
C
B
A
A1 CORNER
A1 CORNER
INDEX MARK
6
10
NXφb
SD
7
φ 0.08
φ 0.15
M
C
0.05
(2X)
C
TOP VIEW
M
C A B
BOTTOM VIEW
0.10
C
C
A2
A
0.08
C
SEATING PLANE
A1
SIDE VIEW
NOTES:
PACKAGE
JEDEC
VBU 056
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
9.00 mm x 7.00 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
---
MAX
NOTE
OVERALL THICKNESS
BALL HEIGHT
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
1.00
---
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.17
0.62
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
0.76
BODY THICKNESS
BODY SIZE
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
8
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
8
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
56
φb
0.35
0.40
0.45
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. NOT USED.
A1,A8,D4,D5,E4,E5,H1,H8
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3440\ 16-038.25 \ 01.13.05
April 18, 2013 S29PL-J_00_A16
S29PL-J
93
D a t a S h e e t
23.5 TS056—20 x 14 mm, 56-pin TSOP (PL127J)
STANDARD PIN OUT (TOP VIEW)
A2
2
0.10 C
1
N
SEE DETAIL B
-A-
-B-
5
E
e
N
2
N
2
+1
5
A1
D1
4
C
D
SEATING
PLANE
B
A
0.08MM (0.0031")
M
C
A-B
6
S
B
b
7
SEE DETAIL A
WITH PLATING
c1
(c)
7
b1
BASE METAL
R
SECTION B-B
e/2
c
GAGE LINE
0.25MM (0.0098") BSC
0˚
-X-
X = A OR B
PARALLEL TO
SEATING PLANE
L
DETAIL A
DETAIL B
NOTES:
Package
TS 056
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
MO-142 (B) EC
Jedec
1
2
3
4
MIN
NOM MAX
1.20
Symbol
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
A
A1
A2
b1
b
c1
c
D
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
0.15
0.05
0.95
0.17
0.17
0.10
0.10
1.00
0.20
1.05
0.23
0.27
0.16
0.21
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
0.22
5
6
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
19.80 20.00 20.20
18.30 18.40 18.50
13.90 14.00 14.10
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
D1
E
e
7
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
0.50 BASIC
L
0
R
N
0.50
0˚
0.60
3˚
0.70
5˚
8
9
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
0.08
0.20
56
94
S29PL-J
S29PL-J_00_A16 April 18, 2013
D a t a S h e e t
24. Revision Summary
24.1 Revision A0 (January 29, 2004)
Initial release.
24.2 Revision A1 (February 12, 2004)
Software Features
Included backward compatibility with MBM29xx families.
General Description
48-ball BGA package is not supported and was removed.
Ordering Information
Model numbers for the 48-ball BGA configurations were removed.
64-Ball Fine Pitch BGA—MCP Compatible
An illustration was added to show the pin-out configuration.
Table 20
Added the description of 01h for address 4Fh and removed the 0004 data.
Table 34
Provided the time units of measure for the erase and programming performances.
24.3 Revision A2 (February 17, 2004)
Memory Array Command Definitions, Table
Corrected typo in device ID.
24.4 Revision A3 (February 25, 2004)
Architectural Advantages
Added 3V VIO for PL064J and PL032J devices.
Ordering Information
Corrected the voltage rating, ball configuration, and physical dimensions for model numbers 12 and 13.
Connection Diagrams
Removed the 64-ball, 8x9 mm diagram.
Operating Ranges
Clarified the supply voltages that apply to the PL127J/PL129J and all other PLxxxJ products.
BGA Pin Capacitance
Added information applicable to the CIN3 symbol.
Package Drawings
Removed the 9x8 mm package drawing.
April 18, 2013 S29PL-J_00_A16
S29PL-J
95
D a t a S h e e t
24.5 Revision A4 (February 27, 2004)
Connection Diagrams
Added the 56-ball 7x9 mm pinout diagram.
Package Options
Updated to include the 8 x 6 mm, 48-ball Fine pitch BGA and 7 x 9 mm, 56-ball Fine-pitch BGA options.
Physical Dimensions
Added the VBK048 package drawing.
24.6 Revision A5 (March 15, 2004)
Connection Diagrams
Changed names.
24.7 Revision A6 (August 30, 2004)
Global
Removed VIO, added TSOP, fixed Secured Silicon DQ bits.
Product Selector Guide
Updated specs in this table.
Ordering Information
Updated the Model Number offerings.
Valid Combinations Table (128Mb)
Corrected the Package Markings for the 64-ball FBGA packages.
Added combinations for the TLC056 package on the PL064J and PL032J devices.
Valid Combinations for BGA Packages (128Mb)
Updated information in this table.
Package Options
Added the 7 x 9mm 56-ball package.
Connection Diagram
56-ball connection diagram
Erase/Programming Performance Table
Notes 1 and 2 corrected to reflect accurate temperature ranges and cycling.
24.8 Revision A7 (March 2, 2005)
Ordering Information
Updated the Model Number offerings
Valid Combinations table
Updated the Package Types information.
Figure 6, In-System Sector Protection/Sector Unprotection Algorithms
Updated the illustration.
Program Suspend/Program Resume Commands
New section added. Made global changes to include program suspend/resume commands.
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Table 29 on page 82
Added Erase Suspend Latency.
Table 32, CE1#/CE2# Timing (S29PL129J only)
Updated table and added a notes section.
Physical Dimensions
Added the VBU056 package.
24.9 Revision A8 (July 29, 2005)
Autoselect Codes (High Voltage Method) Table
Added note: When Polling the SecSi indicator bit the Bank Address (BA) should be set within the address
range 004000h-03FFFFh.
Autoselect Codes for PL129J Table
Added note: When Polling the SecSi indicator bit the A21 to A12 should be set within the address range
004000h-03FFFFh.
Secured Silicon Sector Flash Memory Region
Added sentence: Once the Enter Secured Silicon Sector Command sequence has been entered, the
standard array cannot be accessed until the Exit Secured Silicon Sector command has been entered or the
device has been reset.
Sector Protection Command Definitions Table
Added note 16: Once the Secured Silicon Sector Entry Command sequence has been entered, the standard
array cannot be accessed until the Exit Secured Silicon Sector command has been entered or the device has
been reset.
Valid Combinations
Content the same, tables consolidated to match Ordering Information Descriptions
Connection Diagrams Section
Consolidated Special Package Handling Instructions and put the information before the package/pinout
descriptions.
Added Figure numbers to the connection diagram graphics.
Operating Ranges
Updated operating temperatures.
DC Characteristics Table
Updated VOH parameter.
Erase/Program Operations Table
Added tESL parameter
VBK048—48-Ball Fine-pitch Ball Grid Array 8.15 x 6.15 mm package (PL032J and PL064J)
Updated the product that uses this package from PL127J to PL064J and PL032J
24.10 Revision A9 (September 22, 2006)
64-Ball Fine-Pitch BGA—MCP Compatible—PL127J
Changed ball F9 to A22
April 18, 2013 S29PL-J_00_A16
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D a t a S h e e t
24.11 Revision A10 (September 7, 2007)
Pin Description
Corrected WP#/ACC description.
24.12 Revision A11 (September 10, 2009)
Global
Changed data sheet status from Advanced Information to Full Production
Ordering Information
Modified/Added note to the Valid Combinations to be Supported for this Device tables
V
Ramp Rate
CC
Removed Section
Connection Diagram
Corrected 64-Ball Fine-Pitch BGA ball description (H9 and L5)
24.13 Revision A12 (December 18, 2009)
Ordering Information
Under Package Type, changed wording of “Lead (Pb)-free compliant” material type to “Standard”.
24.14 Revision A13 (Febuary 1, 2011)
Global
Removed 55 ns as a valid speed supported by PL127J.
Product Selector Guide
Corrected the 55 ns Speed Option's Max Page Access and Max OE# Access time from 2 to 20 ns.
Corrected the 65 ns Speed Option's Max Access and Max CE# Access time from 25 to 65 ns.
Dynamic Protection Bit (DYB)
Corrected reference to Table 17 to Table 10.15.
Erase Suspend/Erase Resume Commands
Corrected “This command is valid only during the sector erase operation, including the 80 µs time-out
period...” to “This command is valid only during the sector erase operation, including the 50 µs time-out
period...”.
Command Definitions Tables
In Table 15.2, corrected the value of the third bus cycle of the “PPB Status”, “PPB Lock Bit Status” and “DYB
Status” commands from 555 to BA+555.
Absolute Maximum Ratings
Corrected the A9, OE# and RESET# “Voltage with Respect to Ground” maximum range value from +13.0V to
+12.5V.
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24.15 Revision A14 (July 8, 2011)
DQ6: Toggle Bit I
Corrected Figure 16.2: Toggle Bit Algorithm.
Pin Capacitance
Added TSOP package pin capacitance values.
24.16 Revision A15 (March 14, 2012)
Ordering Information
For model number 13, corrected “56-ball” TSOP package description to “56-pin”.
24.17 Revision A16 (April 18, 2013)
Global
Changed 65 ns and 70 ns initial access time for VIO=1.8V to 80 ns.
April 18, 2013 S29PL-J_00_A16
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D a t a S h e e t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
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The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2004-2013 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™ and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used
are for informational purposes only and may be trademarks of their respective owners.
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S29PL-J_00_A16 April 18, 2013
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