S71WS256NC0BFWA32 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS256NC0BFWA32
元器件型号: S71WS256NC0BFWA32
生产厂家: SPANSION    SPANSION
描述和应用:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

PDF文件: 总188页 (文件大小:3789K)
下载文档:  下载PDF数据表文档文件
型号参数:S71WS256NC0BFWA32参数

S71WS256NC0BFWA33

Stacked Multi-Chip Product (MCP)

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16 SPANSION

S71WS256NC0BFWA60

Stacked Multi-Chip Product (MCP)

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8 SPANSION

S71WS256NC0BFWA62

Stacked Multi-Chip Product (MCP)

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23 SPANSION

S71WS256NC0BFWA63

Stacked Multi-Chip Product (MCP)

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28 SPANSION

S71WS256NC0BFWA70

Stacked Multi-Chip Product (MCP)

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18 SPANSION

S71WS256NC0BFWA70

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWA72

Stacked Multi-Chip Product (MCP)

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15 SPANSION

S71WS256NC0BFWA73

Stacked Multi-Chip Product (MCP)

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5 SPANSION

S71WS256NC0BFWA73

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAH3

Memory Circuit, Flash+PSRAM, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAJ0

Stacked Multi-Chip Product (MCP)

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13 SPANSION

S71WS256NC0BFWAJ2

Stacked Multi-Chip Product (MCP)

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11 SPANSION

S71WS256NC0BFWAJ3

Stacked Multi-Chip Product (MCP)

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21 SPANSION

S71WS256NC0BFWAK0

Stacked Multi-Chip Product (MCP)

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13 SPANSION

S71WS256NC0BFWAK1

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION