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元器件品牌
S71WS256NC0BFWAK0
[SPANSION]
Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品（ MCP ）
元器件型号：
S71WS256NC0BFWAK0
生产厂家：
SPANSION
描述和应用：
Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品（ MCP ）
PDF文件：
总13页 (文件大小：334K)
下载文档：
下载PDF数据表文档文件
型号参数：S71WS256NC0BFWAK0参数
查看货源
S71WS256NC0BFWAK1
Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
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S71WS256NC0BFWAK2
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWAK3
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWAM0
Memory Circuit, Flash+PSRAM, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
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S71WS256NC0BFWAN0
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWAN2
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWAN3
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWAP0
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWAP2
Stacked Multi-Chip Product (MCP)
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53
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S71WS256NC0BFWAP3
Stacked Multi-Chip Product (MCP)
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: Undefined variable $rtag in
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18
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S71WS256NC0BFWE20
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWE22
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWE23
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWE30
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWE32
Stacked Multi-Chip Product (MCP)
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