TECC6.0A [SPSEMI]
Surface Mount Transient Voltage Suppressor Stand-Off Voltage - 6.0 to 170 Volts 1000 Watt Peak Pulse Power;
| 型号： | TECC6.0A |
| 厂家： | 
StarHope |
| 描述： | Surface Mount Transient Voltage Suppressor Stand-Off Voltage - 6.0 to 170 Volts 1000 Watt Peak Pulse Power |
| 文件： | 总4页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECC(1000W) Series
Surface Mount Transient Voltage Suppressor
Stand-Off Voltage - 6.0 to 170 Volts
1000 Watt Peak Pulse Power
Features
For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
Repetition Rate (duty cycle):0.05%
Fast response time: typically less than 1.0ps from 0 Volts to V(BR)
for unidirectional types
Typical IR less than 1µA above 10V
High Temperature solderting: 260°C/10 seconds at terminals
Plastic package has Underwriters Laboratory Flammability 94V-O
Pb-free plated
Mechanical Data
Case: JEDEC DO-214AA. Molded plastic over glass passivated junction
Terminals: Solderable per MIL-STD-750,Method 2026
Polarity: Color band denoted positive end (cathode) except Bidirectional
Standard Packaging:12mm tape (EIA STD RS-481)
Weight:0.003ounce,0.093gram
Devices For Bipolar Application
For Bidirectional use C or CA Suffix for types TECC6.0 thru types TECC440 (e.g. TECC6.0C , TECC440CA)
Electrical characteristics apply in both directions
Maximum Ratings And Characteristics
Ratings at 25℃ambient temperature unless otherwise specified.
RATING
SYMBOL
VALUE
UNITS
Minimum
Peak Pulse Power Dissipation on 10/1000µs waveform
(Note 1,2 ,FIG.1)
Watts
PPPM
1000
SEE
Peak Pulse Current of on 10/1000µs waveform (Note 1,FIG.3)
Amps
Amps
IPPM
IFSM
TABLE 1
200
Peak Forward Surge Current,8.3ms Single Half Sine-Wave
Superimposed on Rated Load,(JEDEC Method) (Note2,3)
-55 to
TJ , TSTG
Operating junction and Storage Temperature Range
℃
+150
Notes :
1.Non-repetitive current pulse , per Fig. 3 and derated above TA = 25℃ per Fig. 2 .
2.Mounted on 8.0mm x 8.0mm Copper Pads to each terminal
3.8.3ms single half sine-wave , or equivalent square wave, Duty cycle = 4 pulses per minutes maximum.
Page 1 of 4
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REV.2017.01.06
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECC(1000W) Series
Dimensions (DO-214AA)
DO-214AA(SMB J-Bend)
Cathode Band
0.012(0.305)
0.006(0.152)
0.098(2.50)
0.083(2.10)
0.086(2.20)
0.073(1.85)
0.155(3.94)
0.130(3.30)
0.012(0.3)MAX.
0.060(1.52)
0.030(0.76)
0.220(5.59)
0.205(5.21)
0.180(4.57)
0.160(4.06)
Dimensions in inches and(millimeters)
Electrical Characteristics
TABLE1
Maximum
Test
Current
Breakdown
Voltage
@IT
Peak Pulse
Current
Reverse
Stand-Off
Voltage
Reverse
Leakage
@VRWM
Clamping
Voltage
@Ipp
Device
Marking Code
TECC
Part Number
UNI-Polar
BI-Polar
UNI
6D
BI
6H
VBR(V)Min.
IT(mA)
Ipp(A)
174.8
132.4
90.5
73.8
69.2
55.6
50.7
42.8
39.6
37.2
33.8
31.0
27.9
19.2
18.6
7.4
IR(μA)
VBR(V)Max.
7.37
VRWM(V)
6.0
Vc(V)
10.3
TECC6.0A
TECC8.0A
TECC12A
TECC15A
TECC16A
TECC20A
TECC22A
TECC26A
TECC28A
TECC30A
TECC33A
TECC36A
TECC40A
TECC58A
TECC60A
TECC150A
TECC170A
TECC6.0CA
TECC8.0CA
TECC12CA
TECC15CA
TECC16CA
TECC20CA
TECC22CA
TECC26CA
TECC28CA
TECC30CA
TECC33CA
TECC36CA
TECC40CA
TECC58CA
TECC60CA
TECC150CA
TECC170CA
6.67
8.89
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
200
50
1
8D
8H
8.0
9.83
13.6
19.9
24.4
26.0
32.4
35.5
42.1
45.4
48.4
53.3
58.1
64.5
93.6
96.8
243.0
275.0
12D
15D
16D
20D
22D
26D
28D
30D
33D
36D
40D
58D
60D
150D
170D
12H
15H
16H
20H
22H
26H
28H
30H
33H
36H
40H
58H
60H
150H
170H
12.0
15.0
16.0
20.0
22.0
26.0
28.0
30.0
33.0
36.0
40.0
58.0
60.0
150.0
170.0
13.30
16.70
17.80
22.20
24.40
28.90
31.10
33.30
36.70
40.00
44.40
64.40
66.70
167.00
189.00
14.70
18.50
19.70
24.50
26.90
31.90
34.40
36.80
40.60
44.20
49.10
71.20
73.70
185.00
209.00
1
1
1
1
1
1
1
1
1
1
1
1
1
6.5
1
For bidirectional type having VWRM of 10 volts and less, the IR limit is double.
For parts with A , the VBR is 5%
Page 2 of 4
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REV.2017.01.06
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECC(1000W) Series
Characteristic Curves (TA=25 ℃ unless otherwise noted)
Fig.1 Peak Pulse Power Rating
Fig.2 Pulse Derating Cruve
100
75
100
10
Non-repetitive pulse
waveform shown in
Fig.3 TA = 25°C
50
1
25
0
0.31×0.31"(8.0×8.0mm)
Copper Pad Areas
0.1
10μs 100μs
0.1μs 1.0μs
td - Pulse Width (sec.)
10ms
0
25 50 75 125
100 150 175
TA-Ambient Temperature(℃)
1.0ms
200
Fig.3 Pulse Waveform
Fig.4 Typical Junction Capacitance
20000
150
100
50
TJ=25℃
Measured at
Zero Bias
10000
1000
100
Pulse width(td) is defined
ad the Point where the Peak
Current Decays to 50% of IPPM
tr=10uS
Peak Value
IPPM
IPPM
2
Half Value
VR,Measured at
Stand-Off
Voltage,VWM
10/1000μsec.Waveform
as defined by R.E.A
TJ=25℃
f=1.0MHZ
Vsig=50mVp-p
Uni-Directional
td
Bi-Directional
0
10
2.0
3.0
4.0
0
1.0
10
100
VWM-Reverse Stand-off Voltage(V)
400
1
t-Time(mS)
Fig.5 Typ.Transient Thermal Impedance
100
Fig.6 Maximum Non-Repetitive Peak
Forward Surge Current Uni-Directional Only
200
100
10
1.0
0.1
8.3mS single half sine-wave
(JEDEC Method)
TJ=TJ max.
10
1
10
100 1000
0.001 0.01 0.1
100
1
10
tp-Pulse Duration(sec)
Number of Cycles at 60HZ
Page 3 of 4
www.spsemi.cn
REV.2017.01.06
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECC(1000W) Series
Recommended Soldering Conditions
Recommended Conditions
Reflow Soldering
Pb-Free assembly
Re”ow Condition
(see Fig.1)
tP
TP
-Temperature Min(T s(min))
+150℃
Ramp-up
Critical Zone
TL to TP
-Temperature Max(T s(max))
-Time(Min to Max)(t s)
Pre Heat
+200℃
TL
60-180secs
3℃/sec.Max.
tL
Average ramp up rate
(Liquidus Temp(TL) to peak)
Ts(max)
Ramp-down
Ts(max) to TL -Ramp-up Rate
3℃/sec.Max.
+217℃
Preheat
-Temperature(TL)(Liquidus)
-Temperature(tL)
Ts(min)
25
Re”ow
ts
60-150secs
+260(+0/-5)℃
30 secs.Max.
6℃/sec.Max.
8 min.Max.
+260℃
Peak Temp(TP)
Time within 5℃ of actual Peak Temp(tP)
time to peak temperature
(t 25℃ to peak)
Time
Ramp-down Rate
Time 25℃ to Peak Temp(TP)
Do not exceed
Marking Code
Cathode Band
****
6 H
****
6 D
Logo
Logo
Date Code
Date Code
Marking Code
Marking Code
Tape And Reel Specification
REEL DIA
(mm)
Symbol
Industry Standard
Ea Per Reel
3000
EIA RS-481
TECC***
330
0.157
(4.0)
0.47
(12.0)
0.314
(8.0)
13.0(330)
0.49
(12.0)
Page 4 of 4
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REV.2017.01.06
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