TECD12A [SPSEMI]
Surface Mount Transient Voltage Suppressor Stand-Off Voltage - 6.0 to 60 Volts 2000 Watt Peak Pulse Power;
| 型号： | TECD12A |
| 厂家： | 
StarHope |
| 描述： | Surface Mount Transient Voltage Suppressor Stand-Off Voltage - 6.0 to 60 Volts 2000 Watt Peak Pulse Power |
| 文件： | 总4页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECD(2000W) Series
Surface Mount Transient Voltage Suppressor
Stand-Off Voltage - 6.0 to 60 Volts
2000 Watt Peak Pulse Power
Features
For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
Repetition Rate (duty cycle):0.01%
Fast response time: typically less than 1.0ps from 0 Volts to V(BR)
for unidirectional types
Typical IR less than 2µA above 10V
High Temperature solderting: 260°C/10 seconds at terminals
Plastic package has Underwriters Laboratory Flammability 94V-O
Pb-free plated
Mechanical Data
Case: JEDEC DO-214AB. Molded plastic over glass passivated junction
Terminals: Solderable per MIL-STD-750,Method 2026
Polarity: Color band denoted positive end (cathode) except Bidirectional
Standard Packaging:16mm tape (EIA STD RS-481)
Weight:0.007ounce,0.21gram
Devices For Bipolar Application
For Bidirectional use C or CA Suffix for types TECD6.0 thru types TECD60 (e.g. TECD6.0C , TECD60CA)
Electrical characteristics apply in both directions
Maximum Ratings And Characteristics
Ratings at 25℃ambient temperature unless otherwise specified.
RATING
SYMBOL
VALUE
UNITS
Minimum
Peak Pulse Power Dissipation on 10/1000µs waveform
(Note 1,2 ,FIG.1)
Watts
PPPM
2000
SEE
Peak Pulse Current of on 10/1000µs waveform (Note 1,FIG.3)
Amps
Amps
IPPM
IFSM
TABLE 1
300
Peak Forward Surge Current,8.3ms Single Half Sine-Wave
Superimposed on Rated Load,(JEDEC Method) (Note2,3)
-55 to
TJ , TSTG
Operating junction and Storage Temperature Range
℃
+150
Notes :
1.Non-repetitive current pulse , per Fig. 3 and derated above TA = 25℃ per Fig. 2 .
2.Mounted on 8.0mm x 8.0mm Copper Pads to each terminal
3.8.3ms single half sine-wave , or equivalent square wave, Duty cycle = 4 pulses per minutes maximum.
Page 1 of 4
www.spsemi.cn
REV.2017.01.06
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECD(2000W) Series
Dimensions (DO-214AB)
DO-214AB(SMC J-Bend)
Cathode Band
0.118(3.00)
0.081(2.06)
0.069(1.75)
0.059(1.50)
0.126(3.20)
0.112(2.85)
0.245(6.22)
0.220(5.60)
0.067(1.70)
0.030(0.76)
0.329(8.35)
0.305(7.75)
0.280(7.11)
0.260(6.60)
Dimensions in inches and(millimeters)
Electrical Characteristics
TABLE1
Maximum
Test
Current
Breakdown
Voltage
@IT
Peak Pulse
Current
Reverse
Stand-Off
Voltage
Reverse
Leakage
@VRWM
Clamping
Voltage
@Ipp
Device
Marking Code
TECD
Part Number
UNI-Polar
BI-Polar
UNI
6K
BI
VBR(V)Min.
IT(mA)
Ipp(A)
349.5
264.7
180.9
147.5
138.5
111.1
101.4
85.5
IR(μA)
VBR(V)Max.
7.37
VRWM(V)
6.0
Vc(V)
10.3
TECD6.0A
TECD8.0A
TECD12A
TECD15A
TECD16A
TECD20A
TECD22A
TECD26A
TECD28A
TECD30A
TECD33A
TECD36A
TECD40A
TECD58A
TECD60A
TECD6.0CA
TECD8.0CA
TECD12CA
TECD15CA
TECD16CA
TECD20CA
TECD22CA
TECD26CA
TECD28CA
TECD30CA
TECD33CA
TECD36CA
TECD40CA
TECD58CA
TECD60CA
6L
6.67
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
200
50
1
8K
8L
8.0
8.89
9.83
13.6
19.9
24.4
26.0
32.4
35.5
42.1
45.4
48.4
53.3
58.1
64.5
93.6
96.8
12K
15K
16K
20K
22K
26K
28K
30K
33K
36K
40K
58K
60K
12L
15L
16L
20L
22L
26L
28L
30L
33L
36L
40L
58L
60L
12.0
15.0
16.0
20.0
22.0
26.0
28.0
30.0
33.0
36.0
40.0
58.0
60.0
13.30
16.70
17.80
22.20
24.40
28.90
31.10
33.30
36.70
40.00
44.40
64.40
66.70
14.70
18.50
19.70
24.50
26.90
31.90
34.40
36.80
40.60
44.20
49.10
71.20
73.70
1
1
1
1
1
79.3
1
74.4
1
67.5
1
62.0
1
55.7
1
38.5
1
37.2
1
For bidirectional type having VWRM of 10 volts and less, the IR limit is double.
For parts with A , the VBR is 5%
Page 2 of 4
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REV.2017.01.06
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECD(2000W) Series
Characteristic Curves (TA=25 ℃ unless otherwise noted)
Fig.1 Peak Pulse Power Rating
Fig.2 Pulse Derating Cruve
100
75
100
10
Non-repetitive pulse
waveform shown in
Fig.3 TA = 25°C
50
1
25
0
0.31×0.31"(8.0×8.0mm)
Copper Pad Areas
0.1
10μs 100μs
td - Pulse Width (sec.)
10ms
0
25 50 75 125
100 150 175
TA-Ambient Temperature(℃)
0.1μs 1.0μs
1.0ms
200
Fig.3 Pulse Waveform
Fig.4 Typical Junction Capacitance
10000
150
100
50
TJ=25℃
Pulse width(td) is defined
ad the Point where the Peak
Current Decays to 50% of IPPM
VR=0
tr=10uS
Peak Value
IPPM
1000
IPPM
2
Half Value
VR=Rated
Stand-Off
Voltage
10/1000μsec.Waveform
as defined by R.E.A
100
10
TJ=25℃
f=1.0MHZ
Vsig=50mVp-p
Uni-Directional
Bi-Directional
td
0
2.0
t-Time(mS)
3.0
4.0
0
1.0
10
100
VWM-Reverse Stand-off Voltage(V)
500
1
Fig.5 Typ.Transient Thermal Impedance
100
Fig.6 Maximum Non-Repetitive
Forward Surge Current
300
8.3mS single half sine-wave
(JEDEC Method)
250
200
10
1.0
0.1
150
100
1
10
100 1000
0.001 0.01 0.1
100
1
10
tp-Pulse Duration(sec)
Number of Cycles at 60HZ
Page 3 of 4
www.spsemi.cn
REV.2017.01.06
S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECD(2000W) Series
Recommended Soldering Conditions
Recommended Conditions
Reflow Soldering
Pb-Free assembly
Re”ow Condition
(see Fig.1)
tP
TP
-Temperature Min(T s(min))
+150℃
Ramp-up
Critical Zone
TL to TP
-Temperature Max(T s(max))
-Time(Min to Max)(t s)
Pre Heat
+200℃
TL
60-180secs
3℃/sec.Max.
tL
Average ramp up rate
(Liquidus Temp(TL) to peak)
Ts(max)
Ramp-down
Ts(max) to TL -Ramp-up Rate
3℃/sec.Max.
+217℃
Preheat
-Temperature(TL)(Liquidus)
-Temperature(tL)
Ts(min)
25
Re”ow
ts
60-150secs
+260(+0/-5)℃
30 secs.Max.
6℃/sec.Max.
8 min.Max.
+260℃
Peak Temp(TP)
Time within 5℃ of actual Peak Temp(tP)
time to peak temperature
(t 25℃ to peak)
Time
Ramp-down Rate
Time 25℃ to Peak Temp(TP)
Do not exceed
Marking Code
Cathode Band
****
6 L
****
6 K
Logo
Logo
Date Code
Date Code
Marking Code
Marking Code
Tape And Reel Specification
REEL DIA
(mm)
Symbol
Industry Standard
Ea Per Reel
500
EIA RS-481
TECD***
178
0.157
(4.0)
0.63
(16.0)
0.315
(8.0)
7.0(178)
0.65
(16.4)
Page 4 of 4
www.spsemi.cn
REV.2017.01.06
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