SFF116Z10ZDB [SSDI]

Power Field-Effect Transistor, 55A I(D), 100V, 0.015ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, TO-254Z, 3 PIN;
SFF116Z10ZDB
型号: SFF116Z10ZDB
厂家: SOLID STATES DEVICES, INC    SOLID STATES DEVICES, INC
描述:

Power Field-Effect Transistor, 55A I(D), 100V, 0.015ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, TO-254Z, 3 PIN

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SFF116N10M  
SFF116N10Z  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
DESIGNER’S DATA SHEET  
116 AMP , 100 Volts, 15 m  
Avalanche Rated N-channel  
MOSFET  
Part Number / Ordering Information 1/  
SFF116N10 ___ ___ ____  
Screening 2/  
__ = Not Screened  
TX = TX Level  
TXV = TXV Level  
S = S Level  
Features:  
Rugged poly-Si gate  
Lead Option 3/  
__ = Straight Leads  
DB = Down Bend  
UB = Up Bend  
Lowest ON-resistance in the industry  
Avalanche rated  
Hermetically Sealed, Isolated Package  
Low Total Gate Charge  
Fast Switching  
TX, TXV, S-Level screening available  
Improved (RDS(ON) QG) figure of merit  
Package 3/ 4/  
M = TO-254  
Z = TO-254Z  
Maximum Ratings  
Symbol  
VDSS  
Value  
Units  
V
Drain - Source Voltage  
Gate – Source Voltage  
100  
±20  
±30  
continuous  
transient  
VGS  
ID1  
V
A
Max. Continuous Drain Current (package  
limited)  
55  
@ TC = 25ºC  
@ TC = 25ºC  
@ TC = 175ºC  
ID2  
ID3  
116  
80  
Max. Instantaneous Drain Current (Tj limited)  
Max. Avalanche current  
A
A
IAR  
@ L= 0.1 mH  
@ L= 0.1 mH  
@ TC = 25ºC  
60  
EAS  
EAR  
2500  
80  
Single and Repetitive Avalanche Energy  
mJ  
Total Power Dissipation  
W
150  
PD  
Operating & Storage Temperature  
ºC  
-55 to +175  
TOP & TSTG  
Maximum Thermal Resistance  
(Junction to Case)  
1.0  
(typ.0.75)  
RθJC  
ºC /W  
NOTES:  
TO-254  
TO-254Z  
*Pulse Test: Pulse Width = 300µsec, Duty Cycle = 2%.  
1/ For ordering information, price, and availability - contact  
factory.  
2/ Screening based on MIL-PRF-19500. Screening flows  
available on request.  
3/ For package outlines / lead bending options / pinout  
configurations - contact factory.  
4/ Maximum current limited by package configuration  
5/ Unless otherwise specified, all electrical characteristics  
@25oC.  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: FT0037A  
DOC  
SFF116N10M  
SFF116N10Z  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
Electrical Characteristics 5/  
Symbol Min Typ Max Units  
Drain to Source Breakdown Voltage  
BVDSS  
V
GS = 0V, ID = 250μA  
100  
105  
––  
V
VGS = 10V, ID = 50A, Tj= 25oC  
VGS = 10V, ID = 50A, Tj=125oC  
VGS = 10V, ID = 50A, Tj= 150oC  
––  
––  
––  
12  
20  
25  
15  
25  
––  
Drain to Source On State Resistance  
Gate Threshold Voltage  
RDS(on)  
mΩ  
VDS = VGS, ID = 1.0mA, Tj= 25oC  
VDS = VGS, ID = 1.0mA, Tj= 125oC  
VDS = VGS, ID = 1.0mA, Tj= -55oC  
3.0  
2.0  
––  
4.0  
3.2  
5.0  
5.0  
––  
6
VGS(th)  
V
VGS = ±20V, Tj= 25oC  
––  
––  
10  
30  
±100  
––  
Gate to Source Leakage  
IGSS  
nA  
VGS = ±20V, Tj= 125oC  
VDS = 100V, VGS = 0V, Tj = 25oC  
VDS = 100V, VGS = 0V, Tj = 125oC  
VDS = 100V, VGS = 0V, Tj = 175oC  
––  
––  
––  
0.01  
5.0  
25  
25  
250  
––  
μA  
μA  
μA  
Zero Gate Voltage Drain Current  
Forward Transconductance  
IDSS  
gfs  
V
DS = 15V, ID = 35A, Tj = 25oC  
10  
30  
––  
Mho  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain Charge  
Qg  
Qgs  
Qgd  
VGS = 12V  
VDS = 35V  
ID = 50A  
––  
––  
––  
185  
50  
85  
250  
75  
120  
nC  
Turn on Delay Time  
Rise Time  
Turn off Delay Time  
Fall Time  
td(on)  
tr  
td(off)  
tf  
VGS = 11V  
VDS = 50V  
ID = 35A  
––  
––  
––  
––  
30  
45  
60  
45  
45  
75  
100  
75  
nsec  
V
RG = 2.35, pw= 3us  
Diode Forward Voltage  
VSD  
IF = 35A, VGS = 0V  
––  
0.95  
1.2  
Diode Reverse Recovery Time  
Reverse Recovery Charge  
trr  
Qrr  
––  
––  
180  
0.85  
300  
––  
nsec  
μC  
IF = 50A, di/dt = 100A/usec  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Ciss  
Coss  
Crss  
VGS = 0V  
VDS = 25V  
f = 1 MHz  
––  
––  
––  
4800  
2050  
600  
––  
––  
––  
pF  
PIN ASSIGNMENT (Standard)  
Available Part Numbers:  
Package  
TO-254 (M)  
TO-254Z (Z)  
Drain  
Pin 1  
Pin 1  
Source  
Pin 2  
Pin 2  
Gate  
Pin 3  
Pin 3  
Consult Factory  
TO254 (M)  
TO254Z (Z)  
PIN 3  
PIN 2  
PIN 1  
PIN 3  
PIN 2  
PIN 1  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: FT0037A  
DOC  

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