QFP-EP [STATSCHIP]
Exposed Pad Quad Flat Pack; 裸露焊盘四方扁平封装
| 型号： | QFP-EP |
| 厂家： | 
STATS CHIPPAC, LTD. |
| 描述： | Exposed Pad Quad Flat Pack |
| 文件： | 总2页 (文件大小：117K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
QFP-ep
Exposed Pad Quad Flat Pack
• 7 x 7mm to 24 x 24mm body sizes
• 32 to 216 lead count
• Lead pitch range from 0.80mm
to 0.40mm
FEATURES
DESCRIPTION
• Body Sizes: 7 x 7mm to 24 x 24mm
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a
thermally enhanced version of the QFP package. Thermal
enhancement is achieved by means of an exposed die pad,
which can be soldered to a mother PC board for effective
heat removal and grounding. STATS ChipPAC’s QFP-ep family
includes the Exposed Pad-Low Profile QFP (LQFP-ep) and
the Exposed Pad-Thin QFP (TQFP-ep). These enhanced
thermal packages are made possible by deep downset die
pad leadframe design combined with well controlled low
loop wirebonding and package warpage control during the
molding process.
• Package Height: 1.0mm (TQFP-ep) and 1.4mm
(LQFP-ep)
• Lead Counts: 32L to 216L
• Lead Pitch: 0.40mm to 0.80mm
• Wide range of open tool leadframe and die pad
sizes available
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic, Microprocessors/Controllers
• Multimedia, PC Chipsets, Others
www.statschippac.com
QFP-ep
Exposed Pad Quad Flat Pack
RELIABILITY
SPECIFICATIONS
Die Thickness
Gold Wire
Moisture Sensitivity Level
Temperature Cycling
JEDEC Level 3
304-482µm (12-19mils) range preferred
25/30µm (1.0/1.2mils) diameter, 99.999% Au
85/15 Sn/Pb or Matte Tin
-65°C/150°C, 1000 cycles
150°C, 500 hrs
High Temperature Storage
Pressure Cooker Test
Lead Finish
121°C 100% RH,
2 atm, 168 hrs
Marking
Laser/ink
Packing Options
JEDEC tray/tape and reel
Liquid Thermal Shock (opt)
-55°C/125°C, 1000 cycles
THERMAL PERFORMANCE, θja (°C/W)
Package
Body Size (mm)
Pad Size (mm)
Die Size (mm)
PCB Vias Thermal Performance, θja (°C/W)
48L
7 x 7 x 1.0
5.5 x 5.5
5.3 x 5.3
25
36
36
26.9
24.0
23.0
64L
80L
10 x 10 x 1.0
12 x 12 x 1.0
6.5 x 6.5
7.2 x 7.2
6.0 x 6.0
6.0 x 6.0
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design
to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Component
Length
(mm)
Resistance
(mOhms)
Inductance
(nH)
Inductance
Mutual (nH)
Capacitance
(pF)
Capacitance
Mutual (pF)
Wire
2
120
1.65
0.45 - 0.85
0.70 - 0.93
1.15 - 1.78
0.45 - 0.85
0.68 - 0.98
1.13 - 1.83
0.10
0.01 - 0.02
0.39 - 0.52
0.4 - 0.54
Lead (14 x 14mm, 100L)
Total (14 x 14mm, 100L)
Wire
4.4 - 5.9
30.5 - 41.4
150.5 - 161.4
120
1.52 - 2.07
3.17 - 3.72
1.65
0.70 - 0.95
0.8 - 1.05
0.10
2
0.01 - 0.02
0.44 - 0.65
0.45 - 0.67
Lead (20 x 20mm, 144L)
Total (20 x 20mm, 144L)
4.2 - 6.1
29.3 - 42.8
149.3 - 162.8
1.47 - 2.14
3.12 - 3.79
0.75 - 1.10
0.85 - 1.20
CROSS-SECTION
PACKAGE CONFIGURATIONS
Package Size
Lead Count
TQFP-ep
0.80mm 0.65mm 0.50mm 0.40mm
TQFP-ep 7 x 7 x 1.0
10 x 10 x 1.0
12 x 12 x 1.0
14 x 14 x 1.0
LQFP-ep 10 x 10 x 1.4
32
44, 48
52
64
-
64
96
-
-
52
64
80
-
80
128
-
48
64
80
100
64
100
144
-
-
-
100
-
-
-
14 x 14 x 1.4
20 x 20 x 1.4
24 x 24 x 1.4
164
216
LQFP-ep
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
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