AM0608-200 [STMICROELECTRONICS]

AVIONICS APPLICATIONS RF & MICROWAVE TRANSISTORS; 航空电子应用射频和微波晶体管
AM0608-200
型号: AM0608-200
厂家: ST    ST
描述:

AVIONICS APPLICATIONS RF & MICROWAVE TRANSISTORS
航空电子应用射频和微波晶体管

晶体 射频和微波 射频双极晶体管 电子 CD 放大器 航空 局域网
文件: 总3页 (文件大小:66K)
中文:  中文翻译
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AM0608-200  
RF & MICROWAVE TRANSISTORS  
AVIONICS APPLICATIONS  
PRELIMINARY DATA  
.
.
.
.
REFRACTORY/GOLD METALLIZATION  
INTERNAL INPUT MATCHING  
METAL/CERAMIC HERMETIC PACKAGE  
POUT  
220 W MIN. WITH 8.7 dB GAIN  
=
.400 x .400 2NLFL (S042)  
hermetically sealed  
ORDER CODE  
AM0608-200  
BRANDING  
0608-200  
PIN CONNECTION  
DESCRIPTION  
The AM0608-200 is an internally-matched, com-  
mon base silicon bipolar device optimized pulsed  
application in the 600 - 750 MHz frequency range.  
Housed in the industry-standard AMPAC™ met-  
al/ceramic package, this device uses a refrac-  
tory/gold overlay die geometry for ruggedness and  
long-term reliability.  
1. Collector  
2. Base  
3. Emitter  
4. Base  
°
= 25 C)  
ABSOLUTE MAXIMUM RATINGS (T  
case  
Symbol  
Parameter  
Value  
Unit  
PDISS  
Power Dissipation*  
Device Current*  
(TC 75˚C)  
875  
W
IC  
VCC  
TJ  
16.0  
55  
A
V
Collector-Supply Voltage*  
°
°
Junction Temperature (Pulsed RF Operation)  
Storage Temperature  
250  
C
C
TSTG  
65 to +200  
THERMAL DATA  
°
C/W  
RTH(j-c)  
Junction-Case Thermal Resistance*  
0.20  
*Applies only to rated RF amplifier operation  
August 1992  
1/3  
AM0608-200  
°
= 25 C)  
ELECTRICAL SPECIFICATIONS (T  
case  
STATIC  
Value  
Symbol  
BVCBO  
BVEBO  
BVCER  
ICES  
Test Conditions  
IE = 0mA  
Unit  
V
Min. Typ.  
Max.  
IC = 10mA  
IE = 1mA  
IC = 25mA  
VBE = 0V  
VCE = 5V  
65  
3.5  
65  
IC = 0mA  
V
RBE = 10Ω  
VCE = 50V  
IC = 1mA  
V
25  
mA  
hFE  
15  
120  
DYNAMIC  
Value  
Symbol  
Test Conditions  
Unit  
W
Min.  
Typ. Max.  
POUT  
f = 600 — 750MHz  
f = 600 — 750MHz  
f = 600 — 750MHz  
PIN 30W  
VCC 50V  
220  
=
=
η
c
PIN 30W  
VCC 50V  
40  
%
=
=
GP  
PIN 30W  
VCC 50V  
8.7  
dB  
=
=
Note:  
Pulse Width  
10µSec  
1%  
=
=
Duty Cycle  
PACKAGE MECHANICAL DATA  
2/3  
AM0608-200  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No  
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned  
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.  
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express  
written approval of SGS-THOMSON Microelectonics.  
© 1994 SGS-THOMSON Microelectronics - All Rights Reserved  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A  
3/3  

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