BAS70W [STMICROELECTRONICS]

SMALL SIGNAL SCHOTTKY DIODE; 小信号肖特基二极管
BAS70W
型号: BAS70W
厂家: ST    ST
描述:

SMALL SIGNAL SCHOTTKY DIODE
小信号肖特基二极管

小信号肖特基二极管
文件: 总5页 (文件大小:53K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAS70J / BAS70W  
BAS70-04W /BAS70-05W / BAS70-06W  
SMALL SIGNAL SCHOTTKY DIODE  
FEATURES AND BENEFITS  
K2  
NC  
n
n
n
n
VERY SMALL CONDUCTION LOSSES  
NEGLIGIBLE SWITCHING LOSSES  
LOW FORWARD VOLTAGE DROP  
SURFACE MOUNT DEVICE  
K
A
K
A
K2  
NC  
K1  
A
A
K1  
BAS70W  
BAS70-06W  
A2  
K2  
DESCRIPTION  
A2  
K1  
K
A2  
K1  
K
Schottky barrier diodes encapsulated either in  
SOT-323 or SOD-323 small SMD packages.  
A2  
A1  
K2  
A1  
A1  
Single and double diodes with different pining are  
available.  
A1  
BAS70-04W  
BAS70-05W  
SOT-323  
76  
A
K
BAS70J  
SOD-323  
ABSOLUTE RATINGS (limiting values)  
Symbol  
Parameter  
Value  
Unit  
V
VRRM Repetitive peak reverse voltage  
70  
70  
1
IF  
Continuous forward current  
mA  
A
IFSM  
Ptot  
Surge non repetitive forward current  
tp = 10 ms  
SOD-323  
SOT-323  
Power dissipation (note 1)  
Tamb = 25°C  
230  
mW  
Tstg  
Tj  
Maximum storage temperature range  
- 65 to +150  
150  
°C  
°C  
°C  
Maximum operating junction temperature *  
TL  
Maximum temperature for soldering during 10s  
260  
Note 1: for double diodes, Ptot is the total dissipation of both diodes.  
dPtot  
dTj  
1
* :  
<
thermal runaway condition for a diode on its own heatsink  
Rth(j a)  
May 2000 - Ed: 4B  
1/5  
BAS70J / BAS70W / BAS70-04W / BAS70-05W / BAS70-06W  
THERMAL RESISTANCE  
Symbol  
Parameters  
Value  
Unit  
°C/W  
°C/W  
Rth (j-a) Junction to ambient (*)  
SOD-323  
SOT-323  
550  
(*) Mounted on epoxy board, with recommended pad layout.  
STATIC ELECTRICAL CHARACTERISTICS (per diode)  
Symbol  
VBR  
Test Conditions  
IR = 10µA  
Min.  
Typ. Max. Unit  
Tj = 25°C  
Tj = 25°C  
Tj = 25°C  
70  
V
VF *  
IF = 1mA  
410  
100  
mV  
nA  
IR **  
VR = 50V  
Pulse test: * tp = 380µs, δ < 2%  
** tp = 5 ms, δ < 2%  
DYNAMIC CHARACTERISTICS  
Symbol  
Test Conditions  
Min.  
Typ. Max. Unit  
C
Tj = 25°C  
VR = 0V  
2
pF  
F = 1MHz  
τ*  
Tj = 25°C  
IF = 5mA  
100  
ps  
Krakauer Method  
* Effective carrier life time.  
2/5  
BAS70-05W / BAS70-06W  
BAS70J / BAS70W / BAS70-04W /  
Fig. 1: Forward voltage drop versus forward  
current.  
Fig. 2: Reverse leakage current versus reverse  
voltage applied (typical values).  
IR(µA)  
IFM(A)  
1E+1  
7E-2  
Tj=100°C  
Typical values  
Tj=100°C  
1E+0  
1E-2  
Tj=25°C  
Maximum values  
1E-1  
Tj=25°C  
Tj=25°C  
Typical values  
1E-3  
1E-2  
VFM(V)  
VR(V)  
1E-4  
1E-3  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70  
Fig. 3: Reverse leakage current versus junction  
temperature (typical values).  
Fig. 4: Junction capacitance versus reverse  
voltage applied (typical values).  
IR(µA)  
C(pF)  
5E+2  
2.0  
F=1MHz  
Tj=25°C  
VR=70V  
1E+2  
1E+1  
1E+0  
1E-1  
1.0  
Tj(°C)  
VR(V)  
1E-2  
0.1  
1
10  
100  
0
25  
50  
75  
100  
125  
150  
Fig. 5: Relative variation of thermal impedance  
Fig. 6: Thermal resistance junction to ambient  
versus copper surface under each lead (Epoxy  
printed circuit board FR4, copper thickness:  
35µm).  
junction to ambient versus pulse duration (epoxy  
FR4  
with  
recommended  
pad  
layout,  
S(Cu)=35µm).  
Rth(j-a) (°C/W)  
Zth(j-a)/Rth(j-a)  
600  
1.00  
0.10  
0.01  
P=0.2W  
550  
500  
450  
400  
δ = 0.5  
δ = 0.2  
δ = 0.1  
T
350  
Single pulse  
tp(s)  
tp  
=tp/T  
δ
S(Cu) (mm )  
10 15 20 25 30 35 40 45 50  
300  
1E-3  
1E-2  
1E-1  
1E+0  
1E+1  
1E+2  
0
5
3/5  
BAS70J / BAS70W / BAS70-04W / BAS70-05W / BAS70-06W  
PACKAGE MECHANICAL DATA  
SOT-323  
DIMENSIONS  
Millimeters Inches  
Min. Typ. Max. Min. Typ. Max.  
REF.  
A
A1  
A
A1  
b
0.8  
0.0  
1.1 0.031  
0.1 0.0  
0.043  
0.004  
0.016  
0.010  
D
b
0.25  
0.1  
0.4 0.010  
0.26 0.004  
c
D
E
e
1.8  
2.0  
2.2 0.071 0.079 0.086  
1.15 1.25 1.35 0.045 0.049 0.053  
L
0.65  
2.1  
0.026  
H
L
1.8  
0.1  
0
2.4 0.071 0.083 0.094  
0.3 0.004 0.008 0.012  
H
E
0.2  
θ
θ
30°  
0
30°  
c
e
4/5  
BAS70-05W / BAS70-06W  
BAS70J / BAS70W / BAS70-04W /  
PACKAGE MECHANICAL DATA  
SOD-323  
DIMENSIONS  
Millimeters Inches  
H
A1  
REF.  
b
Min.  
Max.  
Min.  
Max.  
E
A
A1  
b
1.17  
0.1  
0.046  
0.004  
0.017  
0.01  
0
0
0.25  
0.1  
0.44  
0.25  
1.8  
0.01  
A
D
c
0.004  
0.06  
D
1.52  
1.11  
2.3  
0.071  
0.057  
0.106  
0.02  
c
Q1  
E
1.45  
2.7  
0.044  
0.09  
H
L
0.1  
0.46  
0.41  
0.004  
0.004  
L
Q1  
0.1  
0.016  
Ordering type  
BAS70W  
Marking  
D28  
Package  
SOT-323  
SOT-323  
SOT-323  
SOT-323  
SOD-323  
Weight  
0.006g  
0.006g  
0.006g  
0.006g  
0.005g  
Base qty  
3000  
Delivery mode  
Tape & reel  
Tape & reel  
Tape & reel  
Tape & reel  
Tape & reel  
BAS70-04W  
BAS70-05W  
BAS70-06W  
BAS70J  
D31  
3000  
D30  
3000  
D29  
3000  
76  
3000  
n
Epoxy meets UL94,V0  
Information furnished is believed to be accurate and reliable. However, STMicroelectronicsassumes no responsibility for the consequences of  
use of such information norfor any infringement of patents or other rights of third parties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied.  
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-  
proval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
2000 STMicroelectronics - Printed in Italy - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia  
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
5/5  

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