BAT46CWFILM [STMICROELECTRONICS]
Small signal Schottky diodes; 小信号肖特基二极管
| 型号： | BAT46CWFILM |
| 厂家： | 
ST |
| 描述： | Small signal Schottky diodes |
| 文件： | 总11页 (文件大小：147K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT46 Series
Small signal Schottky diodes
Main product characteristics
BAT46ZFILM
(Single)
IF
150 mA
100 V
6 pF
VRRM
C (typ)
Tj (max)
SOD-123
150° C
BAT46JFILM
(Single)
Features and benefits
■ Very small conduction losses
■ Negligible switching losses
■ Low forward voltage drop
■ Surface mount device
SOD-323
BAT46FILM
(Single)
Description
BAT46AFILM
(Common anode)
Diodes in the BAT46 series are high voltage,
small signal Schottky diodes suited for protection
and routing operations.
SOT-23
BAT46CFILM
(Common cathode)
Order codes
BAT46SFILM
(Series)
Part Number
Marking
BAT46ZFILM
BAT46FILM
Z46
S46
A46
C46
B46
D46
DB6
DB8
B46
46
BAT46AFILM
BAT46CFILM
BAT46SFILM
BAT46WFILM
BAT46AWFILM
BAT46CWFILM
BAT46SWFILM
BAT46JFILM
BAT46WFILM
(Single)
BAT46AWFILM
(Common anode)
SOT-323
BAT46CWFILM
(Common cathode)
BAT46SWFILM
(Series)
Configurations in top view
July 2006
Rev 4
1/11
www.st.com
Characteristics
BAT46 Series
1
Characteristics
Table 1.
Symbol
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Parameter
Value
Unit
VRRM
IF
Repetitive peak reverse voltage
Continuous forward current
100
150
V
mA
A
IFSM
Tstg
Tj
Surge non repetitive forward current
tp = 10 ms Sinusoidal
1
Storage temperature range
-65 to +150
150
° C
° C
° C
Maximum operating junction temperature (1)
Maximum soldering temperature(1)
TL
260
1. Pulse test: t = 380 µs, δ < 2 %
p
Table 2.
Symbol
Thermal parameters
Parameter
Value
Unit
SOD-123, SOT-23
SOT-323, SOD-323,
500
550
Rth(j-a)
Junction to ambient(1)
°C/W
1. On epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ
Max.
Unit
VR = 1.5 V
VR = 10 V
VR = 50 V
VR = 75 V
VR = 1.5 V
VR = 10 V
VR = 50 V
VR = 75 V
IF = 0.1 mA
IF =10 mA
IF =250 mA
0.5
0.8
2
Tj = 25° C
5
(1)
IR
Reverse leakage current
µA
5
7.5
15
20
0.25
0.45
1
Tj = 60° C
Tj = 25° C
(2)
VF
Forward voltage drop
V
1. Pulse test: t = 5 ms, δ < 2 %
p
2. Pulse test: t = 380 µs, δ < 2 %
p
Table 4.
Symbol
Dynamic characteristics
Parameter
Test conditions
Min. Typ Max. Unit
VR = 0 V, F = 1 MHz
VR = 1 V, F = 1 MHz
10
pF
6
C
Diode capacitance
2/11
BAT46 Series
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 1)
P(W)
0.12
I
F(AV)(A)
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
δ=0.5
δ=1
δ=0.05
δ=0.1
δ=0.2
0.10
0.08
0.06
0.04
0.02
T
T
tp
tp
=tp/T
δ
=tp/T
δ
IF(AV)(A)
0.08
Tamb(°C)
75
0.00
0.00
0
25
50
100
125
150
0.02
0.04
0.06
0.10
0.12
0.14
0.16
0.18
Figure 3.
Reverse leakage current versus
reverse applied voltage (typical
values)
Figure 4.
Reverse leakage current versus
junction temperature
IR(µA)
IR(µA)
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
VR=75 V
Tj=125 °C
Tj=100 °C
Tj=75 °C
Tj=50 °C
Tj=25 °C
Tj(°C)
75
VR(V)
10
20
30
40
50
60
70
80
90
100
0
25
50
100
125
150
Figure 5.
Junction capacitance versus
Figure 6.
Forward voltage drop versus
reverse applied voltage (typical
values)
forward current (typical values,
low-level)
C(pF)
12
IFM(mA)
20
18
16
14
12
10
8
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
10
8
Tj=125 °C
Tj=25 °C
6
4
6
4
2
2
VFM(V)
VR(V)
0
0
0
10
20
30
40
50
60
70
80
90
100
0.0
0.1
0.2
0.3
0.4
0.5
0.6
3/11
Characteristics
BAT46 Series
Figure 7.
Forward voltage drop versus
Figure 8.
Relative variation of thermal
forward current (typical values,
high-level)
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
eCU = 35 µm (SOD-323)
Z
th(j-a)/Rth(j-a)
IFM(A)
1.00
0.10
0.01
1.E+00
1.E-01
1.E-02
Single pulse
SOD-323
Tj=125 °C
Tj=25 °C
Epoxy FR4
CU=2.25 mm²
eCU=35 µm
S
VFM(V)
tP(s)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration -
Figure 10. Variation of thermal impedance
junction to ambient versus pulse
duration - printed circuit board,
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
epoxy FR4, eCU = 35 µm (SOT-323)
Z
th(j-a)/Rth(j-a)
Z
th(j-a)(°C/W)
1.00
0.10
0.01
1000
100
10
Single pulse
SOT-23
Single pulse
SOT-323
Alumine substrate
10 x 8 x 0.5 mm
tP(s)
1.E+00
tP(s)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-02
1.E-01
1.E+01
1.E+02
Figure 11. Thermal resistance junction to
ambient versus copper surface
under each lead, epoxy FR4,
eCU = 35 µm (SOD-323)
Rth(j-a)(°C/W)
600
550
500
450
400
350
300
SCU(mm²)
0
5
10
15
20
25
30
35
40
45
50
4/11
BAT46 Series
Ordering information scheme
2
Ordering information scheme
BAT46 xx xx FILM
Signal Schottky diodes
Configuration
No letter = Single diode
A = Common anode
C = Common cathode
S = Series diodes
Package
Blank = SOT-23
J = SOD-323
W = SOT-323
Z = SOD-123
Package
FILM = Tape and reel
5/11
Package information
BAT46 Series
3
Package information
Epoxy meets UL94, V0
Table 5.
SOD-123 dimensions
Dimensions
Millimeters
Ref.
Inches
H
A2
A1
Min.
Max.
Min.
Max.
b
A
A1
A2
b
1.45
0.1
0.057
0.004
0.053
E
0
0
0.85
1.35
0.033
D
A
0.55 Typ.
0.15 Typ.
0.022 Typ.
0.039 Typ.
c
c
D
2.55
2.85
1.7
0.1
0.112
0.067
E
1.4
0.055
0.01
0.14
G
G
H
0.25
3.55
3.95
0.156
Figure 12. SOD-123 footprint (dimensions in mm)
4.45
0.65
0.97
2.51
0.97
6/11
BAT46 Series
Package information
Dimensions
Table 6.
SOD-323 dimensions
H
A1
Ref.
Millimeters
Inches
b
Min.
Max.
Min.
Max.
E
A
A1
b
1.17
0.1
0.046
0.004
0.017
0.01
0
0
0.25
0.1
0.44
0.25
1.8
0.01
A
D
c
0.004
0.06
c
D
1.52
1.11
2.3
0.071
0.057
0.106
0.02
Q1
E
1.45
2.7
0.044
0.09
H
L
L
0.1
0.46
0.41
0.004
0.004
Q1
0.1
0.016
Figure 13. SOD-323 footprint (dimensions in mm)
3.20
0.54
1.06
1.08
1.06
7/11
Package information
Table 7.
BAT46 Series
SOT-23 dimensions
Dimensions
Millimeters
Min. Max.
Ref.
Inches
A
Min.
Max.
E
A
A1
B
0.89
0
1.4
0.1
0.035
0
0.055
0.004
0.02
e
B
D
e1
0.3
0.51
0.18
3.04
1.05
2.1
0.012
0.003
0.108
0.033
0.067
0.047
0.083
c
0.085
2.75
0.85
1.7
0.007
0.12
S
D
e
A1
0.041
0.083
0.063
0.108
e1
E
c
L
1.2
1.6
H
H
L
2.1
2.75
0.6 typ.
0.35
0.024 typ.
S
0.65
0.014
0.026
Figure 14. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
3.25
8/11
BAT46 Series
Package information
Table 8.
SOT-323 dimensions
Dimensions
Ref.
Millimeters
Inches
A
Min.
Typ. Max. Min.
Typ. Max.
E
A
A1
b
0.8
0.0
1.1
0.1
0.4
0.031
0.0
0.043
0.004
0.016
0.010
e
D
b
0.25
0.1
0.010
c
0.26 0.004
2.2
A1
D
E
e
1.8
2.0
1.25
0.65
2.1
0.071 0.079 0.086
1.15
1.35 0.045 0.049 0.053
0.026
c
θ
L
H
H
L
1.8
0.1
0
2.4
0.3
30°
0.071 0.083 0.094
0.004 0.008 0.012
0.2
q
0
30°
Figure 15. SOT-323 footprint (dimensions in mm)
0.95
1.0 2.9
0.8
0.50
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
9/11
Ordering information
BAT46 Series
4
Ordering information
Part Number
Marking
Package
Weight
Base qty Delivery mode
BAT46ZFILM
BAT46FILM
Z46
S46
SOD-123 Single
SOT-23 Single
10 mg
10 mg
3000
3000
Tape and reel
Tape and reel
SOT-23
Common anode
BAT46AFILM
BAT46CFILM
A46
C46
10 mg
10 mg
3000
3000
Tape and reel
Tape and reel
SOT-23
Common cathode
BAT46SFILM
BAT46WFILM
B46
D46
SOT-23 Series
SOT-323 Single
10 mg
6 mg
3000
3000
Tape and reel
Tape and reel
SOT-323
Common anode
BAT46AWFILM
BAT46CWFILM
DB6
DB8
6 mg
6 mg
3000
3000
Tape and reel
Tape and reel
SOT-323
Common cathode
BAT46SWFILM
BAT46JFILM
B46
46
SOT-323 Series
SOD-323
6 mg
5 mg
3000
3000
Tape and reel
Tape and reel
5
Revision history
Date
Revision
Description of Changes
Previous revision.
Jun-1999
3
4
BAT46Z, J, W datasheets merged. ECOPACK statement
added.
25-Jul-2006
10/11
BAT46 Series
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11/11
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