BTA12-700BW [STMICROELECTRONICS]
700V, 12A, SNUBBERLESS TRIAC, TO-220AB, PLASTIC, TO-220AB, 3 PIN;型号: | BTA12-700BW |
厂家: | ST |
描述: | 700V, 12A, SNUBBERLESS TRIAC, TO-220AB, PLASTIC, TO-220AB, 3 PIN 局域网 栅 三端双向交流开关 栅极 |
文件: | 总5页 (文件大小:70K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BTA12 BW/CW
BTB12 BW/CW
SNUBBERLESS TRIACS
FEATURES
.
HIGH COMMUTATION : (dI/dt)c > 12A/ms
without snubber
.
.
.
HIGH SURGE CURRENT : I
= 120A
TSM
V
DRM
UP TO 800V
BTA Family :
INSULATINGVOLTAGE = 2500V
(UL RECOGNIZED : E81734)
(RMS)
DESCRIPTION
A1
A2
The BTA/BTB12 BW/CW triac family are high per-
formance glass passivated chips technology.
The SNUBBERLESS concept offer suppression
of RC network and it is suitable for application
such as phase control and static switching on in-
ductive or resistive load.
G
TO220AB
(Plastic)
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
I
RMS on-state current
(360° conduction angle)
BTA
BTB
Tc = 85 °C
Tc = 95 °C
tp = 8.3 ms
tp = 10 ms
tp = 10 ms
12
A
T(RMS)
I
Non repetitive surge peak on-state current
( Tj initial = 25°C )
126
120
72
A
TSM
2
I t
2
2
A s
I t value
dI/dt
Critical rate of rise of on-state current
Repetitive
F = 50 Hz
20
A/µs
Gate supply : I = 500mA di /dt = 1A/µs
G
G
Non
100
Repetitive
Tstg
Tj
Storage and operating junction temperature range
- 40 to + 150
- 40 to + 125
°C
°C
Tl
Maximum lead temperature for soldering during 10 s at 4.5 mm
from case
260
°C
Symbol
Parameter
BTA / BTB12-... BW/CW
Unit
400
600
700
700
800
V
V
Repetitive peak off-state voltage
Tj = 125 °C
400
600
800
V
DRM
RRM
1/5
March 1995
BTA12 BW/CW / BTB12 BW/CW
THERMAL RESISTANCES
Symbol
Parameter
Value
60
Unit
°C/W
°C/W
Rth (j-a)
Junction to ambient
Rth (j-c) DC Junction to case for DC
BTA
BTB
BTA
BTB
3.3
2.7
Rth (j-c) AC Junction to case for 360° conduction angle
2.5
°C/W
( F= 50 Hz)
2.0
GATE CHARACTERISTICS (maximum values)
P
= 1W
P
GM
= 10W (tp = 20 µs)
I
= 4A (tp = 20 µs)
V = 16V (tp = 20 µs).
GM
G (AV)
GM
ELECTRICAL CHARACTERISTICS
Symbol
Test Conditions
Quadrant
Suffix
BW
Unit
CW
1
I
V =12V (DC) R =33Ω
Tj=25°C
I-II-III
MIN
MAX
MAX
MIN
2
mA
GT
D
L
50
35
V
V =12V (DC) R =33Ω
Tj=25°C
Tj=125°C
Tj=25°C
I-II-III
I-II-III
I-II-III
1.5
0.2
2
V
V
GT
D
L
V
V =V
D
R =3.3kΩ
L
GD
DRM
DRM
tgt
V =V
I
G
= 500mA
TYP
µs
D
dI /dt = 3A/µs
G
I
I
=1.2 I
G GT
Tj=25°C
I-III
II
TYP
TYP
MAX
MAX
MAX
MAX
MAX
MAX
MIN
40
80
-
-
mA
L
-
I-III
II
50
80
35
-
I
*
I = 500mA gate open
Tj=25°C
Tj=25°C
Tj=25°C
Tj=125°C
Tj=125°C
50
mA
V
H
T
V
*
I
= 17A tp= 380µs
TM
1.60
0.01
2
TM
I
I
V
V
Rated
Rated
mA
DRM
RRM
DRM
RRM
dV/dt *
Linear slope up to V =67%V
D
gate open
500
750
12
250
500
6.5
13
V/µs
DRM
TYP
MIN
(dI/dt)c *
Without snubber
Tj=125°C
A/ms
TYP
24
* For either polarity of electrode A voltage with reference to electrode A .
2
1
2/5
BTA12 BW/CW / BTB12 BW/CW
ORDERING INFORMATION
Package
I
V
/ V
RRM
Sensitivity Specification
T(RMS)
A
DRM
V
BW
X
CW
X
BTA
12
400
600
700
800
400
600
700
800
(Insulated)
X
X
X
X
X
X
BTB
X
X
(Uninsulated)
X
X
X
X
X
X
Fig.1 : Maximum RMS power dissipation versus RMS
on-state current (F=50Hz).
(Curves are cut off by (dI/dt)c limitation)
Fig.2
:
Correlation between maximum RMS power
amb
) for different thermal resistances heatsink +
dissipation and maximum allowable temperatures (T
and T
case
contact (BTA).
Fig.3
:
Correlation between maximum RMS power
amb
) for different thermal resistances heatsink +
Fig.4 : RMS on-state current versus case temperature.
dissipation and maximum allowable temperatures (T
and T
case
contact (BTB).
3/5
BTA12 BW/CW / BTB12 BW/CW
Fig.5 : Relative variation of thermal impedance versus
Fig.6 : Relative variation of gate trigger current and
pulse duration.
holding current versus junction temperature.
Zth/Rth
1
Zth(j-c)
0.1
Zth(j-a)
tp(s)
1E+2 5E+2
0.01
1E-3
1E-2
1E-1
1E+0
1E+1
Fig.7 : Non Repetitive surge peak on-state current
Fig.8 : Non repetitive surge peak on-state current for a
versus number of cycles.
sinusoidal pulse with width
corresponding value of I t.
:
t
≤
10ms, and
2
Fig.9 : On-state characteristics (maximum values).
4/5
BTA12 BW/CW / BTB12 BW/CW
PACKAGE MECHANICAL DATA
TO220AB Plastic
REF.
DIMENSIONS
Millimeters Inches
Min. Min.
Max.
10.50
15.87
14.70
6.85
4.50
3.00
4.82
4.00
1.39
0.65
2.70
5.58
1.20
0.96
Max.
0.413
0.625
0.579
0.270
0.178
0.119
0.190
0.158
0.055
0.026
0.107
0.22
H
A
J
G
A
B
C
D
F
10.20
14.23
12.70
5.85
0.401
0.560
0.500
0.230
I
D
B
C
G
H
I
2.54
4.48
3.55
1.15
0.35
2.10
4.58
0.80
0.64
0.100
0.176
0.140
0.045
0.013
0.082
0.18
F
O
L
J
P
L
M
N
O
P
M
N
=
=
0.031
0.025
0.048
0.038
Cooling method : C
Marking : type number
Weight : 2.3 g
Recommended torque value : 0.8 m.N.
Maximum torque value : 1 m.N.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems
without express written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Nether-
lands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
5/5
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