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BTB25-600BRG [STMICROELECTRONICS]

25 A standard and Snubberless triacs; 25标准和无缓冲器三端双向可控硅
BTB25-600BRG
型号： BTB25-600BRG
厂家： ST    ST
描述：

25 A standard and Snubberless triacs
25标准和无缓冲器三端双向可控硅

可控硅
文件： 总12页 (文件大小：134K)
中文：  中文翻译
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BTA24, BTB24, BTA25  
BTA26, BTB26, T25  
25 A standard and Snubberless™ triacs  
Features  
A2  
■ High current triac  
G
■ Low thermal resistance with clip bonding  
A1  
■ High commutation (4 quadrant) or very high  
A2  
commutation (3 quadrant) capability  
■ BTA series UL1557 certified (File ref: 81734)  
■ Packages are RoHS (2002/95/EC) compliant  
A1  
A2  
A1  
A2  
G
G
TO-220AB Insulated  
(BTA24)  
TO-220AB  
(BTB24)  
Applications  
Applications include the ON/OFF function in  
applications such as static relays, heating  
regulation, induction motor starting circuits, etc.,  
or for phase control operation in light dimmers,  
motor speed controllers, and silmilar.  
A1  
G
A2  
A1  
A2  
G
The snubberless versions (BTA/BTB...W and T25  
series) are especially recommended for use on  
inductive loads, due to their high commutation  
performances. The BTA series provides an  
insulated tab (rated at 2500 VRMS).  
RD91  
(BTA25)  
TOP3 Insulated  
(BTA26)  
A2  
A2  
A1  
A2  
G
Description  
A1  
A2  
G
Available either in through-hole or surface-mount  
packages, the BTA24, BTB24, BTA25, BTA26,  
BTB26 and T25 triac series is suitable for general  
purpose mains power AC switching.  
D2PAK  
(T25)  
TOP3  
(BTB26)  
Table 1.  
Symbol  
Device summary  
Parameter  
BTA24(1) BTB24 BTA25(1) BTA26(1) BTB26  
T25  
Unit  
RMS on-state  
current  
IT(RMS)  
25  
25  
25  
25  
25  
600  
-
25  
A
Repetitive peak  
off-state voltage  
VDRM/VRRM  
600 / 800 600 / 800 600 / 800 600(2) / 800  
600 / 800  
V
Triggering gate  
current  
IGT (Snubberless)  
35 / 50  
-
35 / 50  
50  
50  
50  
35 / 50  
50  
35  
-
mA  
mA  
Triggering gate  
current  
IGT (Standard)  
50  
1. Insulated packages  
2. 600 V version available only with IGT = 50 mA (Snubberless and Standard)  
TM: Snubberless is a trademark of STMicroelectronics  
July 2007  
Rev 10  
1/12  
www.st.com  
12  
Characteristics  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
1
Characteristics  
Table 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
TOP3  
Tc = 105° C  
Tc = 100° C  
D2PAK /  
TO-220AB  
IT(RMS)  
RMS on-state current (full sine wave)  
25  
A
RD91 Ins/  
TOP3 Ins.  
Tc = 100° C  
TO-220AB Ins.  
F = 50 Hz  
Tc = 75° C  
t = 20 ms  
250  
260  
340  
Non repetitive surge peak on-state  
current (full cycle, Tj initial = 25° C)  
ITSM  
A
F = 60 Hz  
t = 16.7 ms  
²
²
²
I t  
I t Value for fusing  
tp = 10 ms  
A s  
Critical rate of rise of on-state current  
dI/dt  
F = 120 Hz  
Tj = 125° C  
Tj = 25° C  
50  
A/µs  
V
I
G = 2 x IGT , tr ≤ 100 ns  
Non repetitive surge peak off-state  
voltage  
VDRM/VRRM  
+ 100  
V
DSM/VRSM  
tp = 10 ms  
tp = 20 µs  
IGM  
Peak gate current  
Tj = 125° C  
Tj = 125° C  
4
1
A
PG(AV)  
Average gate power dissipation  
W
Tstg  
Tj  
Storage junction temperature range  
Operating junction temperature range  
- 40 to + 150  
- 40 to + 125  
° C  
Table 3.  
Symbol  
Electrical characteristics (T = 25° C, unless otherwise specified), Snubberless and  
logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W  
j
T25  
BTA/BTB  
Test Conditions  
Quadrant  
Unit  
T2535  
CW  
BW  
(1)  
IGT  
I - II - III  
I - II - III  
MAX.  
MAX.  
35  
35  
50  
mA  
V
VD = 12 V RL = 33 Ω  
VGT  
VGD  
1.3  
VD = VDRM RL = 3.3 kΩ  
Tj = 125° C  
I - II - III  
MIN.  
0.2  
V
(2)  
IH  
IT = 500 mA  
MAX.  
50  
70  
50  
70  
75  
80  
mA  
I - III  
II  
IL  
IG = 1.2 IGT  
MAX.  
mA  
80  
80  
100  
1000  
22  
dV/dt (2)  
VD = 67 %VDRM gate open  
Tj = 125° C  
Tj = 125° C  
MIN.  
MIN.  
500  
13  
500  
13  
V/µs  
(dI/dt)c (2) Without snubber  
A/ms  
1. minimum IGT is guaranted at 5% of IGT max.  
2. for both polarities of A2 referenced to A1.  
2/12  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Characteristics  
Table 4.  
Symbol  
Electrical characteristics (T = 25° C, unless otherwise specified),  
standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B  
j
Test Conditions  
Quadrant  
Value  
Unit  
I - II - III  
IV  
50  
100  
1.3  
0.2  
80  
(1)  
IGT  
MAX.  
mA  
VD = 12 V  
RL = 33 Ω  
VGT  
ALL  
MAX.  
MIN.  
V
V
VGD  
VD = VDRM RL = 3.3 kΩ Tj = 125° C  
ALL  
(2)  
IH  
)
IT = 500 mA  
MAX.  
mA  
I - III - IV  
II  
70  
IL  
dV/dt(2)  
IG = 1.2 IGT  
MAX.  
mA  
160  
500  
10  
VD = 67 %VDRM gate open  
Tj = 125° C  
Tj = 125° C  
MIN.  
MIN.  
V/µs  
V/µs  
(dV/dt)c (2) (dI/dt)c = 13.3 A/ms  
1. minimum IGT is guaranted at 5% of IGT max.  
2. for both polarities of A2 referenced to A1.  
Table 5.  
Symbol  
Static characteristics  
Test Conditions  
Tj = 25° C  
Value  
Unit  
(1)  
VTM  
Vt0  
ITM = 35 A  
tp = 380 µs  
MAX.  
1.55  
0.85  
16  
5
V
V
(1)  
Threshold voltage  
Tj = 125° C  
Tj = 125° C  
Tj = 25° C  
Tj = 125° C  
MAX.  
MAX.  
(1)  
Rd  
IDRM  
IRRM  
Dynamic resistance  
mΩ  
µA  
mA  
VDRM = VRRM  
MAX.  
3
1. for both polarities of A2 referenced to A1.  
Table 6.  
Symbol  
Thermal resistance  
Parameter  
TOP 3  
D2PAK / TO-220AB  
Value  
Unit  
0.6  
0.8  
0.9  
1.7  
45  
Rth(j-c)  
Junction to case (AC)  
Junction to ambient  
° C/W  
RD91 Insulated / TOP3 Insulated  
TO-220AB Insulated  
²
(1)S = 1 cm  
D2PAK  
Rth(j-a)  
TOP3 / TOP3 Insulated  
TO-220AB / TO-220AB Insulated  
50  
° C/W  
60  
1. S = Copper surface under tab.  
3/12  
Characteristics  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Figure 1.  
Maximum power dissipation versus Figure 2.  
RMS on-state current (full cycle)  
RMS on-state current versus case  
temperature (full cycle)  
I
(A)  
T(RMS)  
P(W)  
30  
25  
20  
15  
10  
5
30  
BTB26  
25  
20  
15  
10  
5
BTA24  
BTB24 / T25xx /  
BTA25 / BTA26  
T (°C)  
C
I (A)  
T(RMS)  
0
0
0
0
25  
50  
75  
100  
125  
5
10  
15  
20  
25  
2
Figure 3.  
D PAK RMS on-state current versus Figure 4.  
ambient temperature (printed  
circuit board FR4, copper  
Relative variation of thermal  
impedance versus pulse  
duration  
thickness: 35µm) (full cycle)  
I (A)  
T(RMS)  
K=[Z /R  
]
th th  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1E+0  
1E-1  
1E-2  
1E-3  
D2PAK  
Z
th(j-c)  
(S=1cm2  
)
Z
th(j-a)  
BTA / BTB24 / T25  
Z
th(j-a)  
BTA26  
t (s)  
p
T (°C)  
amb  
1E-3  
1E-2  
1E-1  
1E+0  
1E+1  
1E+2  
5E+2  
0
25  
50  
75  
100  
125  
Figure 5.  
On-state characteristics  
(maximum values)  
Figure 6.  
Surge peak on-state current  
versus number of cycles  
I
(A)  
TM  
I
(A)  
TSM  
300  
100  
300  
250  
200  
150  
100  
50  
Tj max.  
Vto = 0.85V  
Rd = 16 mΩ  
Tj = Tj max.  
t=20ms  
One cycle  
Non repetitive  
Tj initial=25°C  
Repetitive  
TC=75°C  
10  
Tj = 25°C.  
Number of cycles  
V
(V)  
TM  
0
1
1
10  
100  
1000  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
4/12  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Characteristics  
Figure 7.  
Non-repetitive surge peak on-state Figure 8.  
current for a sinusoidal pulse with  
Relative variation of gate trigger  
current, holding current and  
latching current versus junction  
temperature (typical values)  
width t < 10 ms and corresponding  
p
2
value of I t  
I
,I ,I [T ] / I ,I ,I [T =25°C]  
GT  
H
L
j
GT  
H
L
j
I
(A), I2t (A2s)  
TSM  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
3000  
1000  
Tj initial=25°C  
dI/dt limitation:  
50A/µs  
IGT  
ITSM  
IH & IL  
I2t  
T (°C)  
j
t (ms)  
p
100  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
0.01  
0.10  
1.00  
10.00  
Figure 9.  
Relative variation of critical rate of Figure 10. Relative variation of critical rate of  
decrease of main current versus  
(dV/dt)c (typical values)  
decrease of main current versus T  
j
(dI/dt)c [T ] / (dI/dt)c [T specified]  
j
j
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
6
5
4
3
2
1
0
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
T2535/CW/BW  
B
(dV/dt)c (V/µs)  
T (°C)  
j
0.1  
1.0  
10.0  
100.0  
0
25  
50  
75  
100  
125  
2
Figure 11. D PAK thermal resistance junction to  
ambient versus copper surface under  
tab (printed circuit board FR4, copper  
thickness: 35 µm)  
R
(°C/W)  
th(j-a)  
80  
70  
60  
50  
40  
30  
20  
10  
0
D2PAK  
S(cm²)  
0
4
8
12  
16  
20  
24  
28  
32  
36  
40  
5/12  
Ordering information scheme  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
2
Ordering information scheme  
Figure 12. BTA and BTB series  
BT  
A 24 - 600 BW RG  
Triac series  
Insulation  
A = insulated  
B = non insulated  
Current  
24 = 25 A in TO-220AB  
25 = 25 A in RD91  
26 = 25 A in TOP3  
Voltage  
600 = 600 V  
800 = 800 V  
Sensitivity and type  
B = 50 mA Standard  
BW = 50 mA Snubberless  
CW = 35 mA Snubberless  
Packing mode  
RG = Tube  
Figure 13. T25 series  
T
25 35 - 600 G (-TR)  
Triac series  
Current  
25 = 25 A  
Sensitivity  
35 = 35 mA  
Voltage  
600 = 600 V  
800 = 800 V  
Package  
G = D2PAK  
Packing mode  
Blank = Tube  
-TR = Tape and Reel  
6/12  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Package information  
3
Package information  
●
●
●
●
Epoxy meets UL94,V0  
Cooling method: C  
Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91)  
Maximum torque value for BTB24 is 0.5 Nm  
2
Table 7.  
D PAK dimensions  
DIMENSIONS  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
REF.  
Inches  
A
A1  
A2  
B
4.30  
2.49  
4.60 0.169  
2.69 0.098  
0.23 0.001  
0.93 0.027  
0.181  
0.106  
0.009  
0.037  
A
E
C2  
L2  
0.03  
0.70  
D
L
B2  
C
1.25 1.40  
0.45  
0.048 0.055  
L3  
0.60 0.017  
1.36 0.047  
9.35 0.352  
10.28 0.393  
5.28 0.192  
15.85 0.590  
1.40 0.050  
1.75 0.055  
0.024  
0.054  
0.368  
0.405  
0.208  
0.624  
0.055  
0.069  
A1  
B2  
B
C2  
D
1.21  
R
C
8.95  
G
E
10.00  
4.88  
A2  
2mm min.  
FLAT ZONE  
G
L
15.00  
1.27  
V2  
L2  
L3  
R
1.40  
0.40  
0.016  
V2  
0°  
8°  
0°  
8°  
2
Figure 14. D PAK footprint dimensions (in millimeters)  
16.90  
10.30  
5.08  
1.30  
3.70  
8.90  
7/12  
Package information  
Table 8.  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
DIMENSIONS  
RD91 dimensions  
REF.  
Millimeters  
Inches  
Min.  
Max.  
Min.  
Max.  
A
A1  
A2  
B
40.00  
30.30  
22.00  
27.00  
16.50  
24.00  
14.00  
3.50  
1.575  
1.193  
0.867  
1.063  
0.650  
0.945  
0.551  
0.138  
0.118  
0.035  
0.177  
0.535  
0.138  
0.075  
43°  
A2  
L2  
L1  
29.90  
1.177  
B2  
B1  
C
B1  
B2  
C
13.50  
0.531  
C2  
C1  
N1  
A1  
C1  
C2  
E3  
F
N2  
1.95  
0.70  
4.00  
11.20  
3.10  
1.70  
33°  
3.00  
0.077  
0.027  
0.157  
0.441  
0.122  
0.067  
33°  
B
F
0.90  
E3  
4.50  
I
A
I
13.60  
3.50  
L1  
L2  
N1  
N2  
1.90  
43°  
28°  
38°  
28°  
38°  
8/12  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Package information  
Table 9.  
TOP3 (insulated and non_insulated) dimensions  
DIMENSIONS  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
REF.  
Inches  
H
A
A
B
4.4  
1.45  
14.35  
0.5  
4.6 0.173  
1.55 0.057  
15.60 0.565  
0.7 0.020  
2.9 0.106  
16.5 0.622  
21.1 0.815  
15.5 0.594  
5.65 0.213  
3.65 0.134  
4.17 0.161  
1.40 0.047  
0.181  
0.061  
0.614  
0.028  
0.114  
0.650  
0.831  
0.610  
0.222  
0.144  
0.164  
0.055  
R
B
ØL  
C
D
E
K
G
C
F
2.7  
F
15.8  
20.4  
15.1  
5.4  
G
H
J
P
D
J
J
E
K
3.4  
ØL  
P
4.08  
1.20  
R
4.60  
0.181  
9/12  
Package information  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Table 10. TO-220AB (insulated and non-insulated) dimensions  
DIMENSIONS  
REF.  
Millimeters  
Inches  
Min. Typ. Max. Min. Typ. Max.  
A
a1  
a2  
B
15.20  
15.90 0.598  
0.625  
3.75  
0.147  
C
B
13.00  
10.00  
0.61  
1.23  
4.40  
0.49  
2.40  
2.40  
6.20  
3.75  
14.00 0.511  
10.40 0.393  
0.88 0.024  
1.32 0.048  
4.60 0.173  
0.70 0.019  
2.72 0.094  
2.70 0.094  
6.60 0.244  
3.85 0.147  
0.551  
0.409  
0.034  
0.051  
0.181  
0.027  
0.107  
0.106  
0.259  
0.151  
Ø I  
b2  
L
F
b1  
b2  
C
A
I4  
l3  
c2  
a1  
c1  
c2  
e
l2  
a2  
M
c1  
F
b1  
e
ØI  
I4  
L
15.80 16.40 16.80 0.622 0.646 0.661  
2.65  
1.14  
1.14  
2.95 0.104  
1.70 0.044  
1.70 0.044  
0.116  
0.066  
0.066  
l2  
l3  
M
2.60  
0.102  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
10/12  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
Ordering information  
4
Ordering information  
Table 11. Ordering information  
Ordering type  
Marking  
Package  
Weight Base qty Delivery mode  
BTA/BTB24-xxxyzRG  
BTA25-xxxyz  
BTA/BTB24 xxxyz  
BTA25xxxyz  
BTA26xxxyz  
BTB26600B  
T2535 xxxG  
T2535 xxxG  
TO-220AB  
RD91  
2.3 g  
20 g  
50  
25  
Tube  
Bulk  
BTA26-xxxyRG  
BTB26-600BRG  
T2535-xxxG  
TOP3 Ins.  
TOP3  
4.5 g  
4.5 g  
30  
Tube  
30  
Tube  
50  
Tube  
D2PAK  
1.5 g  
T2535-xxxG-TR  
1000  
Tape and reel  
Note: xxx = voltage, y = sensitivity, z = type  
5
Revision history  
Table 12. Revision history  
Date  
Revision  
Description of changes  
Oct-2002  
6A  
Previous update.  
TO-220AB delivery mode changed from bulk to tube.  
ECOPACK statement added.  
13-Feb-2006  
7
31-May-2006  
31-Jul-2006  
8
9
Reformatted to current standard. Tc in figure 3 changed to Tamb  
Typing error corrected on page 1 (BTB124 instead of BTB24)  
Added BTB26-600BRG. Restructured cover page and section 2:  
Ordering information scheme on page 6 to simplify product selection.  
05-Jul-2007  
10  
Thermal resistance values updated in Table 6 and Figure 2. Graphic  
for I2t updated in Figure 7.  
11/12  
BTA24, BTB24, BTA25, BTA26, BTB26, T25  
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