ESDALC6V1PX_08 [STMICROELECTRONICS]

Low capacitance Transil⑩ arrays for ESD protection; 低电容的Transil ™阵列的ESD保护
ESDALC6V1PX_08
型号: ESDALC6V1PX_08
厂家: ST    ST
描述:

Low capacitance Transil⑩ arrays for ESD protection
低电容的Transil ™阵列的ESD保护

文件: 总9页 (文件大小:234K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ESDALC6V1Px  
Low capacitance Transil™ arrays for ESD protection  
Features  
2 to 4 unidirectional Transil functions  
Breakdown voltage V = 6.1 V min.  
BR  
Low leakage current < 100 nA  
SOT-663  
SOT-665  
SOT-666IP  
Low capacitance (7.5 pF @ 3 V)  
2
Very small PCB area < 2.6 mm  
Figure 1.  
Figure 2.  
Figure 3.  
ESDALC6V1P3 functional diagram  
ESDALC6V1P5 functional diagram  
ESDALC6V1P6 functional diagram  
Benefits  
High ESD protection level  
High integration  
Complies with the following standards  
IEC61000-4-2 level 4  
– 15 kV (air discharge)  
– 8 kV (contact discharge)  
MIL STD 883E-Method 3015-7: class3  
– 25 kV HBM (human body model)  
Applications  
Where transient overvoltage protection in ESD  
sensitive equipment is required, such as:  
Computers  
Printers  
Communication systems  
Cellular phone handsets and acessories  
Wireline and wireless telephone sets  
Set-top boxes  
Description  
The ESDALC6V1Px are monolithic suppressors  
designed to protect components connected to  
data and transmission lines against ESD.  
These devices clamp the voltage just above the  
logic level supply for positive transients and to a  
diode drop below ground for negative transients.  
TM: Transil is a trademark of STMicroelectronics  
April 2008  
Rev 4  
1/9  
www.st.com  
9
Characteristics  
ESDALC6V1Px  
1
Characteristics  
Table 1.  
Symbol  
Absolute ratings (T  
= 25 °C)  
amb  
Parameter  
Value  
Unit  
IEC 61000-4-2 contact discharge  
IEC 61000-4-2 air discharge  
8
(1)  
VPP  
Peak pulse voltage  
kV  
15  
PPP  
Tj  
Peak pulse power (8/20 µs)(1) Tj initial = Tamb  
30  
W
Junction temperature  
150  
°C  
Tstg  
TL  
Storage temperature range  
-55 to +150 °C  
260 °C  
Maximum lead temperature for soldering during 10 s  
Operating temperature range  
Top  
-40 to +150 °C  
1. For a surge greater than the maximum values, the diode will fail in short-circuit.  
Table 2.  
Symbol  
Electrical characteristics (T  
= 25 °C)  
amb  
Parameter  
I
VRM  
VBR  
VCL  
IRM  
IPP  
αT  
Stand-off voltage  
Breakdown voltage  
Clamping voltage  
Leakage current  
Peak pulse current  
IF  
VF  
V
CLVBR VRM  
V
IRM  
Voltage temperature coefficient  
Forward voltage drop  
Capacitance  
VF  
Slope: 1/Rd  
C
IPP  
Rd  
Dynamic resistance  
VBR@ IR  
IRM @ VRM  
max.  
Rd  
typ.  
Ω
αT  
typ.  
C
typ.@ 3V  
pF  
Order code  
min.  
V
max.  
V
typ.  
nA  
mA  
µA  
V
10-4/°C  
ESDALC6V1P3  
ESDALC6V1P5  
ESDALC6V1P6  
6.1  
7.2  
1
10  
0.1  
3
1.5  
4.5  
7.5  
2/9  
ESDALC6V1Px  
Characteristics  
Figure 4.  
Peak power dissipation versus  
initial junction temperature  
Figure 5.  
Peak pulse power versus  
exponential pulse duration  
(T initial = 25 °C)  
j
PPP[Tj initial] / PPP [Tj initial=25°C]  
P
(W)  
PP  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1000  
100  
10  
Tj initial = 25°C  
t (µs)  
p
Tj(°C)  
0
25  
50  
75  
100  
125  
150  
175  
1
10  
100  
Figure 6.  
Clamping voltage versus peak  
pulse current (typical values,  
rectangular waveform)  
Figure 7.  
Forward voltage drop versus peak  
forward current (typical values)  
I
(A)  
I (A)  
FM  
PP  
1.E+00  
1.E-01  
1.E-02  
100.0  
10.0  
1.0  
t
= 2.5µs  
initial = 25°C  
p
T
j
Tj = 125°C  
Tj = 25°C  
V
(V)  
V
(V)  
CL  
FM  
1.E-03  
0.0  
0.1  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
0
10  
20  
30  
40  
50  
60  
70  
Figure 8.  
Junction capacitance versus  
reverse applied voltage (typical  
values)  
Figure 9.  
Relative variation of leakage  
current versus junction  
temperature (typical values)  
IR [Tj] / IR [Tj=25°C]  
C(pF)  
1.E+04  
1.E+03  
1.E+02  
1.E+01  
1.E+00  
13  
12  
11  
10  
9
VR =3 V  
F=1MHz  
VOSC=30mVRMS  
Tj=25°C  
8
7
6
5
4
3
2
V (V)  
R
1
0
0
Tj(°C)  
1
2
3
4
5
6
25  
50  
75  
100  
125  
150  
3/9  
Ordering information scheme  
ESDALC6V1Px  
Figure 10. ESD response to IEC 61000-4-2  
(air discharge 15 kV positive surge)  
Figure 11. Analog crosstalk measurement  
10 V per div.  
dB  
0.00  
-10.00  
-20.00  
-30.00  
-40.00  
-50.00  
-60.00  
-70.00  
-80.00  
-90.00  
-100.00  
F (Hz)  
100.0k  
1.0M  
10.0M  
100.0M  
1.0G  
0.1 µs per division  
Figure 12. Digital crosstalk test measurement  
5 V per div.  
V
G1  
β
V
21 G1  
0.1 µs per div.  
2
Ordering information scheme  
Figure 13. Ordering information scheme  
ESDA LC 6V1 Px  
ESD Array  
Low Capacitance  
Breakdown Voltage (min)  
6V1 = 6.1 Volt  
Package  
P3 = SOT-663 (SC89-3L)  
P5 = SOT-665  
P6 = SOT-666IP (internal pad)  
4/9  
ESDALC6V1Px  
Package information  
3
Package information  
Epoxy meets UL94, V0  
®
In order to meet environmental requirements, ST offers these devices in ECOPACK  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the inner box label, in compliance with JEDEC  
Standard JESD97. The maximum ratings related to soldering conditions are also marked on  
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at  
www.st.com.  
Table 3.  
SOT-663 dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min. Typ. Max. Min. Typ. Max.  
A
D
b
A
D
E
0.60 0.70 0.80 0.024 0.028 0.031  
1.40 1.60 1.80 0.055 0.063 0.071  
0.75 0.85 0.95 0.030 0.033 0.037  
HE 1.50 1.60 1.70 0.059 0.063 0.067  
0.39 0.015  
L2 0.40 0.47 0.50 0.016 0.018 0.020  
alpha  
HE  
E
L
L
L2  
e
c
b
e
0.08 0.13 0.18 0.003 0.005 0.007  
0.22 0.27 0.37 0.009 0.011 0.015  
c
2xe  
0.50  
0.020  
2xe 0.90 1.00 1.10 0.035 0.040 0.043  
4° 7° 4° 7°  
α
Figure 14. SOT-663 footprint (dimensions in mm)  
5/9  
Package information  
Table 4.  
ESDALC6V1Px  
SOT-665 dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min.  
Max.  
Min.  
Max.  
bp  
A
BP  
C
0.50  
0.17  
0.08  
1.50  
1.10  
1.00  
0.50  
1.50  
0.10  
0.60  
0.27  
0.18  
1.70  
1.30  
0.020  
0.007  
0.003  
0.060  
0.043  
0.040  
0.020  
0.059  
0.004  
0.024  
0.011  
0.007  
0.067  
0.051  
D
E
A
Lp  
D
He  
C
E
e
e1  
He  
Lp  
1.70  
0.30  
0.067  
0.012  
e1  
e
Figure 15. SOT-665 footprint (dimensions in mm)  
6/9  
ESDALC6V1Px  
Package information  
Table 5.  
SOT-666IP dimensions  
Dimensions  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
Ref.  
Inches  
b1  
L1  
L3  
L4  
A
0.45  
0.60 0.018  
0.18 0.003  
0.34 0.007  
0.024  
0.007  
0.013  
A3 0.08  
0.17  
b
b
D
E1  
E
b1 0.19 0.27 0.34 0.007 0.011 0.013  
D
E
1.50  
1.50  
1.70 0.059  
1.70 0.059  
1.30 0.043  
0.067  
0.067  
0.051  
A
L2  
E1 1.10  
A3  
e
0.50  
0.19  
0.020  
0.007  
L1  
L2 0.10  
0.30 0.004  
0.012  
e
L3  
L4  
0.10  
0.60  
0.004  
0.024  
Figure 16. SOT-666IP footprint (dimensions in mm)  
7/9  
Ordering information  
ESDALC6V1Px  
Delivery mode  
4
Ordering information  
Table 6.  
Order code  
ESDALC6V1P3  
Ordering information  
Marking  
Package  
Weight  
Base qty  
A2  
A1  
D
SOT-663  
SOT-665  
2.9 mg  
2.9 mg  
2.9 mg  
3000  
3000  
3000  
Tape and reel  
Tape and reel  
Tape and reel  
ESDALC6V1P5  
ESDALC6V1P6  
SOT-666IP  
5
Revision history  
Table 7.  
Date  
Document revision history  
Revision  
Description of changes  
ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6  
merged and reformatted to current standards.  
16-Aug-2006  
1
Table 1 on page 2:  
23-Aug-2006  
11-Oct-2006  
2
3
Temperature range upgraded to Tj max = 150 °C  
Added values for VPP in Table 1.  
Reformatted to current standards. Added IRM typical  
value in Table 2. Update minimum dimension for L2 of  
SOT-663 in Table 3.  
23-Apr-2008  
4
8/9  
ESDALC6V1Px  
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9/9  

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