HCC4041UB [STMICROELECTRONICS]
QUAD TRUE/COMPLEMENT BUFFER; QUAD TRUE /补BUFFER
| 型号： | HCC4041UB |
| 厂家： | 
ST |
| 描述： | QUAD TRUE/COMPLEMENT BUFFER |
| 文件： | 总12页 (文件大小：297K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HCC/HCF4041UB
QUAD TRUE/COMPLEMENT BUFFER
.
BALANCED SINK AND SOURCE CURRENT ;
APPROXIMATELY 4 TIMES STANDARD ”B”
DRIVE
EQUALIZED DELAY TO TRUE AND COMPLE-
MENT OUTPUTS
QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
5V, 10V AND 15V PARAMETRIC RATINGS
INPUT CURRENT OF 100nA AT 18V AND 25°C
FOR HCC DEVICE
100 % TESTED FOR QUIESCENT CURRENT
MEETS ALLREQUIREMENTS OF JEDECTEN-
TATIVESTANDARDN°13A, ”STANDARD SPE-
CIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
.
.
EY
F
(Plastic Package)
(Ceramic Frit Seal Package)
.
.
.
.
C1
M1
(Plastic Chip Carrier)
(Micro Package)
ORDER CODES :
HCC4041BF
HCF4041BM1
HCF4041BEY
HCF4041BC1
PIN CONNECTIONS
DESCRIPTION
The HCC4041UB (extended temperature range)
and HCF4041UB (intermediate temperature range)
are monolithic integrated circuits, available in 14-
lead dual in-line plastic or ceramic package and
plastic micro package.
TheHCC/HCF4041UB types arequad true/comple-
ment buffers consisting of n- and p-channel units
having low channel resistance and high current
(sourcing and sinking) capability. The HCC/-
HCF4041UB is intended for use as a buffer, line
driver, or COS/MOS-to-TTL driver. It can be used as
an ultra-low power resistor-network driver for A/D
and D/A conversion, as a transmission-line driver,
and in other applications where high noise immunity
and low-power dissipation are primary design re-
quirements.
June 1989
1/12
HCC/HCF4041UB
FUNCTIONAL DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VDD
*
Supply Voltage : HCC Types
HCF Types
– 0.5 to + 20
– 0.5 to + 18
V
V
Vi
II
Input Voltage
– 0.5 to VDD + 0.5
V
DC Input Current (any one input)
± 10
mA
mW
Pt ot
Total Power Dissipation (per package)
Dissipation per Output Transistor
200
for Top = Full Package-temperature Range
100
mW
To p
Tstg
Operating Temperature : HCC Types
HCF Types
– 55 to + 125
– 40 to + 85
°C
°C
Storage Temperature
– 65 to + 150
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.
* All voltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage : HCC Types
HCF Types
Value
Unit
VDD
3 to + 18
3 to + 15
V
V
VI
Input Voltage
0 to VDD
V
To p
Operating Temperature : HCC Types
HCF Types
– 55 to + 125
– 40 to + 85
°C
°C
2/12
HCC/HCF4041UB
SCHEMATIC DIAGRAM
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions
Value
Symbol
Parameter
Unit
VI
VO
|IO
|
VD D
T Lo w
*
25°C
T High*
(V)
(V)
(µA) (V)
Min. Max. Min. Typ. Max. Min. Max.
IL
Quiescent
Current
0/ 5
0/10
0/15
0/20
0/ 5
0/10
0/15
0/ 5
0/10
0/15
5/0
5
1
2
0.02
0.02
0.02
0.04
0.02
0.02
0.02
1
2
30
60
10
15
20
5
HCC
Types
4
4
120
600
30
µA
20
4
20
4
HCF
Types
10
15
8
8
60
16
16
120
VOH
VOL
VIH
Output High
Voltage
< 1
< 1
< 1
< 1
< 1
< 1
5
4.95
4.95
9.95
4.95
9.95
V
V
V
10 9.95
15 14.95
14.95
14.95
Output Low
Voltage
5
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
10/0
15/0
10
15
Input High
Voltage
0.5/4.5 < 1
1/9 < 1
1.5/13.5 < 1
5
4
8
4
8
4
8
10
15 12.5
12.5
12.5
* TLow = – 55°C for HCC device : – 40°C for HCF device.
* THigh = + 125°C for HCC device : + 85°C for HCF device.
The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5V min. with VDD = 15V.
3/12
HCC/HCF4041UB
STATIC ELECTRICAL CHARACTERISTICS (continued)
Test Conditions
Value
Symbol
Parameter
Unit
VI
VO
|IO
|
VD D
T Lo w
*
25°C
T High*
(V)
(V)
(µA) (V)
Min. Max. Min. Typ. Max. Min. Max.
VIL
Input Low
Voltage
4.5/0.5 < 1
9/1 < 1
5
10
15
5
1
2
1
2
1
2
V
13.5/1.5 < 1
2.5
2.5
2.5
IOH
Output
Drive
Current
0/ 5
0/ 5
0/10
0/15
0/ 5
0/ 5
0/10
0/15
0/ 5
0/10
0/15
0/ 5
0/10
0/15
2.5
4.6
9.5
13.5
2.5
4.6
9.5
13.5
0.4
0.5
1.5
0.4
0.5
1.5
– 8.4
– 2.1
– 6.4 – 12.8
– 1.6 – 3.2
– 5 – 10
– 4.6
– 1.2
– 3.5
– 13
– 4.08
– 1.02
– 3.18
–12.11
1.2
5
HCC
Types
10 – 6.25
15 – 24
– 19 – 38
– 5.44 – 12.8
– 1.36 – 3.2
– 4.25 – 10
–16.15 – 38
mA
5
5
– 6.8
– 1.7
HCF
Types
10 – 5.31
15 –20.18
IOL
Output
Sink
Current
5
2.1
1.6
5
3.2
10
38
HCC
Types
10 6.25
3.5
15
5
24
19
13
1.7
1.36 3.2
4.25 10
16.15 38
1.02
HCF
Types
10 5.31
3.18
15 20.18
12.11
I
IH, IIL
Input
leakage
Current
HCC
Types
0/18
18
± 0.1
± 0.3
±10–5 ± 0.1
± 1
± 1
Any Input
Any Input
µA
HCF 0/15
Types
15
±10–5 ± 0.3
CI
Input Capacitance
15
22.5
pF
* TLow = – 55°C for HCC device : – 40°C for HCF device.
* THigh = + 125°C for HCC device : + 85°C for HCF device.
The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5V min. with VDD = 15V.
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25°C, CL = 50pF, RL = 200kΩ,
typical temperature coefficient for all VDD values is 0.3 %/°C, all input rise and fall times = 20ns)
Test Conditions
Value
Symbol
Parameter
Unit
V DD (V) Min. Typ. Max.
tPLH, tPHL Propagation Delay Time
5
60
35
25
40
20
15
120
70
50
80
40
30
ns
10
15
5
t
THL, tTL H Transition Time
ns
10
15
4/12
HCC/HCF4041UB
Minimum Output High (source) Current Charac-
teristics.
Typical Output Low (sink) Current.
Minimum Output Low (sink) Current Charac-
teristics.
Typical Output High (source) Current Charac-
teristics.
Typical Transition Time vs. Load Capacitance.
Typical Propagation Delay Time vs. Load Capacit-
ance.
5/12
HCC/HCF4041UB
Minimum and Maximum Transfer Characteristics-true Output-and Test Circuit.
Minimum Maximum Transfer Characteristics Complement Output-and Test Circuit.
Typical Power Dissipation vs. Input Rise and Fall
Time per Output Pair.
Typical Power Dissipation vs. Frequency per Out-
put Pair.
6/12
HCC/HCF4041UB
TEST CIRCUITS
Quiescent Device Current.
Noise Immunity.
Input Leakage Current.
7/12
HCC/HCF4041UB
Plastic DIP14 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
TYP.
MAX.
MIN.
0.020
0.055
MAX.
a1
B
b
0.51
1.39
1.65
0.065
0.5
0.020
0.010
b1
D
E
e
0.25
20
0.787
8.5
2.54
15.24
0.335
0.100
0.600
e3
F
7.1
5.1
0.280
0.201
I
L
3.3
0.130
Z
1.27
2.54
0.050
0.100
P001A
8/12
HCC/HCF4041UB
Ceramic DIP14/1 MECHANICAL DATA
mm
inch
DIM.
MIN.
TYP.
MAX.
20
MIN.
TYP.
MAX.
0.787
0.276
A
B
7.0
D
E
3.3
0.130
0.600
0.38
0.015
e3
F
15.24
2.29
0.4
2.79
0.55
1.52
0.31
2.54
10.3
8.05
5.08
0.090
0.016
0.046
0.009
0.060
0.110
0.022
0.060
0.012
0.100
0.406
0.317
0.200
G
H
L
1.17
0.22
1.52
M
N
P
7.8
0.307
Q
P053C
9/12
HCC/HCF4041UB
SO14 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
TYP.
MAX.
1.75
0.2
MIN.
MAX.
0.068
0.007
0.064
0.018
0.010
A
a1
a2
b
0.1
0.003
1.65
0.46
0.25
0.35
0.19
0.013
0.007
b1
C
0.5
0.019
c1
D
45° (typ.)
8.55
5.8
8.75
6.2
0.336
0.228
0.344
0.244
E
e
1.27
7.62
0.050
0.300
e3
F
3.8
4.6
0.5
4.0
5.3
0.149
0.181
0.019
0.157
0.208
0.050
0.026
G
L
1.27
0.68
M
S
8° (max.)
P013G
10/12
HCC/HCF4041UB
PLCC20 MECHANICAL DATA
mm
inch
DIM.
MIN.
9.78
8.89
4.2
TYP.
MAX.
10.03
9.04
MIN.
0.385
0.350
0.165
TYP.
MAX.
0.395
0.356
0.180
A
B
D
4.57
d1
d2
E
2.54
0.56
0.100
0.022
7.37
8.38
0.290
0.330
0.004
e
1.27
5.08
0.38
0.050
0.200
0.015
e3
F
G
0.101
M
M1
1.27
1.14
0.050
0.045
P027A
11/12
HCC/HCF4041UB
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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12/12
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