IPS161HF [STMICROELECTRONICS]
Single channel high-side switches;
| 型号： | IPS161HF |
| 厂家： | 
ST |
| 描述： | Single channel high-side switches |
| 文件： | 总27页 (文件大小：840K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IPS160HF, IPS161HF
Datasheet
Single channel high-side switches
Features
R
I
V
CC
Part number
DS(on)
OUT
IPS160HF
IPS161HF
2.4 A
0.6A
0.060 Ω
65 V
•
•
•
•
•
•
•
•
•
•
•
8 V to 60 V operating voltage range
Minimum output current limitation: 0.7A (IPS161HF) or 2.5A (IPS160HF)
Short propagation delay at start-up
Fast demagnetization of inductive load
Non-dissipative short-circuit protection (cut-off)
Programmable cut-off delay time using external capacitor
Ground disconnection protection
VCC disconnection protection
Thermal shutdown protection
Undervoltage lock-out
Diagnostic signalization for: open load in off-state, cut-off and junction thermal
shutdown
•
•
Designed to meet IEC 61131-2
PowerSSO12 package
Applications
Product status
•
•
•
•
Safety applications
IPS160HF
IPS161HF
Programmable logic control
Industrial PC peripheral input/output
Numerical control machines
Product summary
IPS160HF IPS160HFTR
IPS161HF IPS161HFTR
PowerSSO12
Order
code
Description
The IPS160HF (Iout = 2.4A) and IPS161HF (Iout = 0.6A) are monolithic devices
which can drive capacitive, resistive or inductive loads with one side connected to
ground.
Package
Packing
Tube
Tape and reel
The 60 V operating range and Ron = 60 mΩ, combined with the extended diagnostic
(Open Load, Over Load, Overtemperature) and the < 60 us propagation delay time at
startup (enabling Class 3 for interface types C and D), make the ICs suitable to
address safety applications targeting higher SIL levels.
The built-in overload and thermal shutdown protections guarantee the ICs, the
application and the load against electrical and thermal overstress.
Furthermore, in order to minimize the power dissipation when the output is shorted, a
low-dissipative short-circuit protection (cut-off) is implemented to limit the output
average current value and consequent device overheating.
Cut-off delay time can be set by soldering an external capacitor or disabled by a
resistor on pin 4 (CoD).
The DIAG common diagnostic open drain pin reports the open load in off-state, cut-
off (overload) and thermal shutdown.
DS13271 - Rev 2 - June 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
IPS160HF, IPS161HF
Block diagram
1
Block diagram
Figure 1. Block diagram
Undervoltage
detection
Vcc
Vcc clamp
IN
Output clamp
OUT
CoD
Current limitation
cut -off
DIAG
Open load in off-state
Junction
Overtemperature
GIPG1702151307LM
GND
DS13271 - Rev 2
page 2/27
IPS160HF, IPS161HF
Pin description
2
Pin description
Figure 2. Pin connection (top view)
VCC
IN
1
VCC
12
2
3
4
5
6
11 OUT
10
9
DIAG
CoD
OUT
OUT
OUT
GND
TAB=Vcc
8
NC
NC
7
GIPG1702151321LM
Table 1. Pin configuration
Function
Number Name
1, 12, TAB VCC Device supply voltage
Type
Supply
2
3
IN
Channel input
Input
Output open
drain
DIAG Common diagnostic pin for thermal shutdown, cut-off and open load
Cut-off delay pin, cannot be left floating.
4
CoD
NC
Input
Connected to GND by 1 kΩ resistor to disable the cut-off function. Connect to a C
capacitor to set the cut-off delay see Table 8. Protection and diagnostic
CoD
5, 6
7
Not connected
GND Device ground
Ground
Output
8, 9, 10, 11 OUT Channel power stage output
IN
This pin drives the output stage to pin OUT. IN pin has internal weak pull-down resistors, see
Table 7. Logic inputs.
OUT
Output power transistor is in high-side configuration, with active clamp for fast demagnetization.
DIAG
This pin is used for diagnostic purposes and is internally wired to an open drain transistor. The
open drain transistor is turned on in case of junction thermal shutdown, cut-off, or open load in
off-state.
DS13271 - Rev 2
page 3/27
IPS160HF, IPS161HF
Pin description
CoD
GND
This pin cannot be left floating and can be used to program the cut-off delay time tcoff, see
Table 8. Protection and diagnostic through an external capacitor (CCoD). The cut-off function
can be completely disabled by connecting the CoD pin to GND through 1 kΩ resistor: in this
condition, the output channel remains in limitation condition, supplying the current to the load
until the input is forced LOW or the thermal shutdown threshold is triggered.
IC ground.
The IC can be protected against reverse polarity using two different solutions:
1. Placing a resistor RGND between IC GND pin and load connection point to GND (RGND
>
VCC/Icc, see Table 2. Absolute maximum rating). Note that power dissipated by RGND during
reverse polarity condition is Vcc^2/RGND
.
2. Placing a diode in parallel to RGND
The diode must be selected such that its VRRM > |VCC| and power dissipation capability is
higher than VF*IS (see Table 4).
In normal operation (no reverse polarity), there is a voltage drop (ΔV) between GND of the
device and GND of the module.
Using option 1, ΔV = RGND * ICC
.
Using option 2, ΔV = VF@(I )
.
S
Figure 3. Reverse polarity
VCC
IC supply voltage.
DS13271 - Rev 2
page 4/27
IPS160HF, IPS161HF
Absolute maximum ratings
3
Absolute maximum ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
V
V
V
I
Supply voltage
-0.3 to 65
-V
CC
V
to V +0.3
cc
Output channel voltage
Input current
V
OUT
cc clamp
-10 to +10
mA
V
IN
V
V
I
V
IN voltage
IN
CC
Output cut-off voltage pin
Input current on cut-off pin
Fault voltage
5.5
V
COD
-1 to +10
mA
V
COD
V
V
DIAG
DIAG
CC
I
I
I
Fault current
-5 to +10
-250
mA
Maximum DC reverse current flowing through the IC
(1)
mA
CC
from GND to V
CC
Output stage current
Internally limited
5
OUT
A
Maximum DC reverse current flowing through the IC
(1)
-I
OUT
from OUT to V
CC
Single pulse avalanche energy (T
= 125 °C, V
CC
AMB
(1)
E
1000
mJ
W
AS
= 24 V, I
= 1 A)
load
Power dissipation at T = 25 °C (2)
P
T
Internally limited
-55 to 150
TOT
C
Storage temperature range
Junction temperature
STG
J
°C
T
-40 to 150
1. Verified on application board with R
= 49 °C/W
th(ja)
2. (T
-T )/ R
JSD(MAX) C th(JA)
Note:
Absolute maximum ratings are the values beyond which damage to the device may occur. Functional operation
under these conditions is not implied. All voltages are referenced to GND.
Table 3. Thermal data
Symbol
Parameter
Thermal resistance junction-case
Thermal resistance junction-ambient
Value
1
Unit
R
R
th(JC)
°C/W
49
th(JA)
Note:
Package mounted on a 2-layer application board with Cu thickness = 35 μm, total dissipation area = 1.5 cm²
connected by 6 vias.
DS13271 - Rev 2
page 5/27
IPS160HF, IPS161HF
Electrical characteristics
4
Electrical characteristics
(8 V < VCC < 60 V; -40 °C < TJ < 125 °C, unless otherwise specified)
Table 4. Supply
Symbol
Parameter
Test conditions
Min.
Typ. Max. Unit
V
V
Supply voltage
60
8
V
V
V
V
CC
UVON
6.9
V
V
V
Undervoltage on threshold
Undervoltage off threshold
Undervoltage hysteresis
UVON
UVOFF
UVH
6.5
7.8
0.15
0.5
300
350
1
V
V
V
V
V
= 24 V
500
600
1.4
2.1
1
CC
CC
CC
CC
Supply current in off-state
μA
= 60 V
I
S
= 24 V
Supply current in on-state
mA
mA
= 60 V
1.4
I
= V = V
V
= 0 V
GND disconnection output current
LGND
GND
IN
CC, OUT
Table 5. Output stage
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V
= 24 V
CC
60
80
I
=1 A @ T = 25 °C
OUT
J
R
V
On-state resistance
mΩ
DS(on)
V
= 24 V
CC
120
I
=1 A @ T = 125 °C
J
OUT
V
V
V
V
= 0 V and I
= 0 A
OUT
Off-state output voltage
Off-state output current
2
3
V
OUT(OFF)
IN
= 24 V, V = 0 V, V
= 0 V
CC
CC
IN
OUT
OUT
I
OUT(OFF)
= 60 V, V = 0 V, V
= 0 V
10
0
μA
IN
I
= 0 V, V = 4 V
OUT
Off-state output current
-35
OUT(OFF-min)
IN
Table 6. Switching (VCC = 24 V; -40 °C < TJ < 125 °C, RLOAD = 48 Ω)
Symbol
Parameter
Rise time
Test conditions
Min. Typ. Max.
Unit
t
t
t
t
10
10
20
30
r
Fall time
f
I
I
= 0.5 A, (see Figure 4. Timing in normal operation )
= 0.5 A, (see Figure 5. Propagation delay at start-
OUT
Propagation delay time off
Propagation delay time on
Power-on delay time from
PD(H-L)
PD(L-H)
μs
OUT
t
32
60
D(VCC-ON)
V
rising edge
up)
CC
DS13271 - Rev 2
page 6/27
IPS160HF, IPS161HF
Electrical characteristics
Figure 4. Timing in normal operation
DS13271 - Rev 2
page 7/27
IPS160HF, IPS161HF
Electrical characteristics
Figure 5. Propagation delay at start-up
V
IN
t
VCC
VUVON
t
td(Vcc-on)
VOUT
10%
t
Table 7. Logic inputs
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V
V
V
Input low level voltage
Input high level voltage
Input hysteresis voltage
0.8
IL
2.2
V
IH
0.4
I(HYST)
V
V
= V = 36 V
200
550
CC
IN
I
Input current
μA
IN
= V = 60 V
CC
IN
DS13271 - Rev 2
page 8/27
IPS160HF, IPS161HF
Electrical characteristics
Table 8. Protection and diagnostic
Test conditions
Symbol
Parameter
active clamp
Min.
Typ.
Max.
Unit
V
V
I
I
= 10 mA
CC
65.5
68.5
71.5
clamp
CC
V
= 0.5 A; load =1 mH
V
-71.5
V
-68.5
CC
V
-65.5
CC
Demagnetization voltage
demag
OUT
CC
V
Open load (off-state) or short to V
detection threshold
CC
V
2
4
OLoff
t
Open load blanking time
Voltage drop on DIAG
200
μs
V
BKT
V
I
= 4 mA
DIAG
1
DIAG
VCC ≤ 36 V
110
180
2.1
4.6
1.7
4.2
I
DIAG pin leakage current
μA
DIAG
36 V ˂ VCC ≤ 60 V
IPS161HF
IPS160HF
IPS161HF
IPS160HF
1.3
3.0
0.7
2.5
Output current limitation
activation threshold
I
PK
VCC ≤ 24 V, RLOAD ≤ 10 mΩ
A
I
Output current limitation
LIM
Programmable by the external
capacitor on CoD pin. Cut-off is
disabled when CoD pin is connected
to GND through 1 kΩ resistor.
t
t
50xC
[nf] ± 35%(1)
Cut-off current delay time
coff
COD
μs
T ˂ T
J
JSD
T ˂ T
32xt
COFF
[μs] ±40%
Output stage restart delay time
Junction temperature shutdown
res
J
JSD
T
150
170
15
190
JSD
°C
Junction temperature thermal
hysteresis
T
JHYST
1. The formula is guaranteed in the range 10 nF ≤ C
≤ 100 nF.
COD
DS13271 - Rev 2
page 9/27
IPS160HF, IPS161HF
Output logic
5
Output logic
Table 9. Output stage truth table
Operation
IN
OUT
DIAG
L
L
H
H
Normal
H
H
L
L
L
L
L
Cut-off
H
L
L
L
L
L
Overtemperature
Open load
H
H(1)
H
L (1)
H
L
H
X
X
L
L
X
X
UVLO
1. External pull-up resistor is used
DS13271 - Rev 2
page 10/27
IPS160HF, IPS161HF
Protection and diagnostic
6
Protection and diagnostic
The IC integrates several protections to ease the design of a robust application.
6.1
6.2
Undervoltage lock-out
The device turns off if the supply voltage falls below the turn-off threshold (VUV(off)). Normal operation restarts
after VCC exceeds the turn-on threshold (VUV(on)). Turn-on and turn-off thresholds are defined in Table 4. Supply.
Overtemperature
The output stage turns off when its internal junction temperature (TJ) exceeds the shutdown threshold TJSD
.
Normal operation restarts when TJ comes back below the reset threshold (TJSD - TJHYST), see Table 8. Protection
and diagnostic. The internal fault signal is set when the channel is off due to thermal protection and it is reset
when the junction triggers the reset threshold. This same behavior is signaled on the DIAG pin.
6.3
Cut-off
The IC can limit the output current at the power stage by its embedded output current limitation circuit.
This circuit continuously monitor the output current and, when load is increasing, at the triggering of its activation
threshold (Ipk) it starts limiting to ILIM limitation level: while current limitation is active the IC enters an high
dissipation status.
The IPS160HF implements the cut-off feature which limits the duration of the current limitation condition.
The duration of the current limitation condition (Tcoff) can be set by a capacitor (CCoD) placed between CoD and
GND pins. The design rule for CCoD is:
tcoff[us] ±35% = 50 x Ccod[nF]
The ±35% drift is guaranteed in the range of 10 nF < Ccod < 100 nF; lower capacitance than 10 nF can be used.
If ILIM threshold is triggered, the output stage remains in the current limitation condition (IOUT = ILIM) no longer
than tCOFF. If tCOFF elapses, the output stage turns off and restarts after the tRES restart time.
Thermal shutdown protection has higher priority than cut-off:
•
•
IC is forced off if TJSD is triggered before tCOFF elapses
if TJSD is triggered, IC is maintained off even after the tRES has elapsed and until the TJ falls below TJSD
-
TJHYST
DS13271 - Rev 2
page 11/27
IPS160HF, IPS161HF
Cut-off
Figure 6. Current limitation and cut-off
I
OUT
t
t
COFF
I
LIM
T
T
<
JSD
J
t
t
t
PD(L-H)
PD(H-L)
V
IN
t
V
DIAG
t
The fault condition is reported on the DIAG pin. The internal cut-off flag signal is latched at output switch-off and
released after the time tRES, the same behavior is signaled on DIAG pin.
The status of the DIAG is independent on the IN pin status.
If CoD pin is connected to GND through 1 kΩ resistor (cut-off feature disabled), when the output channel triggers
the limitation threshold, it remains on, in current limitation condition, until the input becomes LOW or the thermal
protection threshold is triggered.
In case of low ambient temperature conditions (TAMB < -20 °C) and high supply voltage (VCC > 36 V), the cut-off
function requires activation in order to avoid damaging the IC.
The following table shows the suggested cut-off delay for different operating voltages.
Table 10. Minimum cut-off delay for TAMB less than -20 °C
V
[V]
Cut-off delay [μs]
Cut-off capacitance [nF]
CC
36-48
48-60
100
50
2.2
1
DS13271 - Rev 2
page 12/27
IPS160HF, IPS161HF
Open load in off-state
6.4
Open load in off-state
The IC provides the open load detection feature which detects if the load is disconnected from the OUT pin. This
feature can be activated by a resistor (RPU) between OUT and VCC pins.
Figure 7. Open load off-state
Application board
SUPPLY RAIL
IC
VCC
VCC
EXPOSED PAD
RPU
Open load
detection signal
+
-
OUT
VOLOFF
RI
RLED
RLOAD
PGND
GROUND PLANE
In case of wire break and during the OFF state (IN = low), the output voltage VOUT rises according to the
partitioning between the external pull-up resistor and the internal impedance of the IC (130 kΩ < RI < 360 kΩ).
The effect of the LED (if any) on the output pin has to be considered as well. In case of wire break and during the
ON state (IN = high), the output voltage VOUT is pulled up to VCC by the low resistive integrated switch. If the load
is not connected, in order to guarantee the correct open load signalization it must result:
VOUT > VOLoff(max.)
Referring to the circuit in Figure 7. Open load off-state:
V
= V − R × I
CC PU PU
= V − R × I + I
CC PU RI
+ I
RL
(1)
(2)
OUT
LED
therefore:
V
− V
OLoff max
CC min
R
<
PU
V
V
− V
OLoff max
OLoff max
LED
+
RI min
R
LED
If the load is connected, in order to avoid any false signalization of the open load, the following condition must
hold:
VOUT < VOLoff(min)
By taking into account the circuit in figure 6:
V
V
− V
LED
V
OUT
R
L
OUT
OUT
V
= V − R × I
= V − R ×
PU
+
+
(3)
(4)
OUT
CC
PU PU
CC
R
R
I
LED
so:
V
− V
CC max
OLoff min
− V V
OLoff min
R
>
PU
V
V
OLoff min
OLoff min
LED
+
+
RI max
R
R
L
LED
The fault condition is signaled on the DIAG pin and the fault reset occurs when load is reconnected.
If the channel is switched on by the IN pin, the fault condition is no longer detected.
DS13271 - Rev 2
page 13/27
IPS160HF, IPS161HF
VCC disconnection protection
When an inductive load is driven, some ringing of the output voltage may be observed at the end of the
demagnetization. In fact, the load is completely demagnetized when ILOAD = 0 A and the OUT pin remains floating
until next turn-on. In order to avoid false detection of the open load event when driving inductive loads, the open
load signal is masked for tBKT. So, the open load is reported on the DIAG pin with a delay of tBKT and if the open
load event is triggered for more than tBKT
.
6.5
VCC disconnection protection
The IC is protected despite the VCC disconnection event. This event is intended as the disconnection of the VCC
wire from the application board, see figure below. When this condition happens, the IC continues working
normally until the voltage on the VCC pin is ≥ VUVOFF. Once the VUVOFF is triggered, the output channel is turned
off independently on the input status. In case of inductive load, if the VCC is disconnected while the output channel
is still active, the IC allows the discharge of the energy still stored in the inductor through the integrated power
switch.
Figure 8. VCC disconnection
APPLICATION BOARD
VCC >VUVOFF
SUPPLY RAIL
VCC
EXPOSED
PAD
ON
DRIVING
CIRCUITRY
CVCC
OUT
IC
GND
GROUND PLANE
DS13271 - Rev 2
page 14/27
IPS160HF, IPS161HF
GND disconnection protection
6.6
GND disconnection protection
GND disconnection is intended as the disconnection event of the application ground, see figure below. When this
event happens, the IC continues working normally until the voltage between VCC and GND pins of the IC is
≥ VUVOFF. The voltage on GND pin of the IC rises up to the supply rail voltage level. In case of GND
disconnection event, a current (ILGND) flows through OUT pin. Table 4. Supply shows IOUT = ILGND for the worst
case GND disconnection event where the output is shorted to ground.
Figure 9. GND disconnection
APPLICATION BOARD
SUPPLY RAIL
VCC
VCC
EXPOSED
ON
DRIVING
CIRCUITRY
PAD
CVCC
OUT
IC
LOAD
GND
GROUND PLANE
DS13271 - Rev 2
page 15/27
IPS160HF, IPS161HF
Active VDS clamp
7
Active VDS clamp
Active clamp is also known as fast demagnetization of inductive loads or fast current decay. When a high-side
driver turns off an inductance, an undervoltage is detected on output.
The OUT pin is pulled down to Vdemag. The conduction state is modulated by internal circuitry in order to keep the
OUT pin voltage at about Vdemag until the load energy has been dissipated. The energy is dissipated both in the
IC internal switch and in the load resistance.
Figure 10. Active clamp equivalent principle schematic
APPLICATION BOARD
SUPPLY RAIL
IC
Clamp
circuitry
V
CC
EXPOSED PAD
OUT
L
LOAD
GND
GROUND PLANE
DS13271 - Rev 2
page 16/27
IPS160HF, IPS161HF
Active VDS clamp
Figure 11. Fast demag waveforms
IOUT
tON
tDEMAG
ILOAD
t
VOUT
VCC
t
VCC-VDEMAG
VIN
t
The demagnetization of inductive load causes large electrical and thermal stress on the IC. The plot below shows
the maximum demagnetization energy that the IC can tolerate in a single demagnetization pulse with VCC = 24 V
and TAMB = 125 °C. If higher demagnetization energy is required, then an external free-wheeling Schottky diode
has to be connected between OUT (cathode) and GND (anode) pins. Note that in this case the fast
demagnetization is inhibited.
DS13271 - Rev 2
page 17/27
IPS160HF, IPS161HF
Active VDS clamp
Figure 12. Typical demagnetization energy (single pulse) at VCC = 24 V and TAMB = 125 °C
4000
3500
3000
2500
2000
1500
1000
500
0
500
700
900
1100
1300
1500
[mA]
1700
1900
2100
2300
2500
I
LOAD
DS13271 - Rev 2
page 18/27
IPS160HF, IPS161HF
Package information
8
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
DS13271 - Rev 2
page 19/27
IPS160HF, IPS161HF
PowerSSO12 package information
8.1
PowerSSO12 package information
Figure 13. PowerSSO12 package outline
7392413 rev. D
DS13271 - Rev 2
page 20/27
IPS160HF, IPS161HF
PowerSSO12 package information
Table 11. PowerSSO12 package mechanical data
mm
Dim.
Min.
1.250
0.000
1.100
0.230
0.190
4.800
3.800
Typ.
Max.
1.700
0.100
1.600
0.410
0.250
5.000
4.000
A
A1
A2
B
C
D
E
e
0.800
H
5.800
0.250
0.400
0d
6.200
0.55
h
L
1.270
8d
k
X
1.900
3.600
2.500
4.200
0.100
Y
ddd
Note:
Dimension D doesn't include mold flash protrusions or gate burrs. Mold flash protrusions or gate burrs don't
exceed 0.15 mm in total both side.
Figure 14. PowerSSO12 recommended footprint
DS13271 - Rev 2
page 21/27
IPS160HF, IPS161HF
PowerSSO12 package information
Figure 15. PowerSSO12 tape packing information [mm]
Figure 16. PowerSS012 reel packing information [mm]
DS13271 - Rev 2
page 22/27
IPS160HF, IPS161HF
Revision history
Table 12. Document revision history
Date
Revision
Changes
23-Apr-2020
26-Jun-2020
1
2
Initial release.
IPS161HF RPN added to document
DS13271 - Rev 2
page 23/27
IPS160HF, IPS161HF
Contents
Contents
1
2
3
4
5
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Output logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Protection and diagnostic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
6.1
6.2
6.3
6.4
6.5
6.6
Undervoltage lock-out. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Overtemperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Cut-off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Open load in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
VCC disconnection protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
GND disconnection protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
7
8
Active clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
8.1
PowerSSO12 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
DS13271 - Rev 2
page 24/27
IPS160HF, IPS161HF
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Switching (VCC = 24 V; -40 °C < TJ < 125 °C, RLOAD = 48 Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Output stage truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Minimum cut-off delay for TAMB less than -20 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 11. PowerSSO12 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 12. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
DS13271 - Rev 2
page 25/27
IPS160HF, IPS161HF
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Reverse polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Timing in normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Propagation delay at start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Current limitation and cut-off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Open load off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
VCC disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
GND disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Active clamp equivalent principle schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Fast demag waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Typical demagnetization energy (single pulse) at VCC = 24 V and TAMB = 125 °C . . . . . . . . . . . . . . . . . . . . . 18
PowerSSO12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSSO12 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
PowerSSO12 tape packing information [mm] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PowerSS012 reel packing information [mm] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DS13271 - Rev 2
page 26/27
IPS160HF, IPS161HF
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DS13271 - Rev 2
page 27/27
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