LNBP21PD-TR [STMICROELECTRONICS]
LNBP SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND I2C INTERFACE; LNBP电源和控制IC与升压转换器和I2C接口型号: | LNBP21PD-TR |
厂家: | ST |
描述: | LNBP SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND I2C INTERFACE |
文件: | 总20页 (文件大小:695K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LNBP21
LNBP SUPPLY AND CONTROL IC WITH
2
STEP-UP CONVERTER AND I C INTERFACE
■
■
■
COMPLETE INTERFACE BETWEEN LNB
AND I2CTM BUS
BUILT-IN DC/DC CONTROLLER FOR
SINGLE 12V SUPPLY OPERATION
ACCURATE BUILT-IN 22KHz TONE
OSCILLATOR
■
■
SUITS WIDELY ACCEPTED STANDARDS
PowerSO-20
SO-20
FAST OSCILLATOR START-UP FACILITATES
DiSEqCTM ENCODING
■
■
■
BUILT-IN 22KHz TONE DETECTOR
SUPPORTS BI-DIRECTIONAL DiSEqCTM
LOOP-THROUGH FUNCTION FOR SLAVE
OPERATION
LNB SHORT CIRCUIT PROTECTION AND
DIAGNOSTIC
DESCRIPTION
Intended for analog and digital satellite STB
receivers/SatTV, sets/PC cards, the LNBP21 is a
monolithic voltage regulator and interface IC,
assembled in SO-20 and PowerSO-20,
specifically designed to provide the power and the
13/18V, 22KHz tone signalling to the LNB
■
■
CABLE LENGTH DIGITAL COMPENSATION
INTERNAL OVER TEMPERATURE
PROTECTION
■
ESD RATING 4KV ON POWER
INPUT-OUTPUT PINS
SCHEMATIC DIAGRAM
LNBP21
Gate
LT1
LT2
OUT
Sense
Feedback
Step-up
Controller
Vup
Vcc
Preregul.+
U.V.lockout
+P.ON res.
Enable
Linear Post-reg
+Modulator
I Select
Byp
+Protections
V Select
EXTM
SDA
SCL
Diagnostics
I²C
interf.
DETIN
Tone
Detector
22KHz
Oscill.
ADDR
DSQIN
DSQOUT
October 2002
1/20
LNBP21
downconverter in the antenna or to the multiswitch
box. In this application field, it offers a complete
solution with extremely low component count, low
power dissipation together with simple design and
capaci-tor must be used to couple the modulating
signal source to the EXTM pin. When external
modulation is not used, the relevant pin can be left
open.
2
I CTM standard interfac-ing.
The current limitation block has two thresholds
that can be selected by the I
bit of the SR; the
This IC has a built in DC/DC step-up controller
that, from a single supply source ranging from 8 to
15V, generates the voltages that let the linear
post-regulator to work at a minimum dissipated
power. An UnderVoltage Lockout circuit will
SEL
lower threshold is between 400 and 550mA
(I =HIGH), while the higher threshold is
SEL
between 500 and 650mA (I
=LOW).
SEL
The current protection block is SOA type. This
limits the short circuit current (Isc) typically at
disable the whole circuit when the supplied V
CC
drops below a fixed threshold (6.7V typically). The
internal 22KHz tone generator is factory trimmed
in accordance to the standards, and can be
200mA with I
=HIGH and at 300mA with
SEL
I
=LOW when the output port is connected to
SEL
ground.
2
TM
controlled either by the I C
interface or by a
It is possible to set the Short Circuit Current
protection either statically (simple current clamp)
or dy-namically by the PCL bit of the SR; when
the PCL (Pulsed Current Limiting) bit is set to
LOW, the overcurrent protection circuit works
dynamically: as soon as an overload is detected,
the output is shut-down for a time t , typically
900ms. Simultaneously the OLF bit of the System
Register is set to HIGH. After this time has
dedicated pin (DSQIN) that allows immediate
TM
DiSEqC
data encoding (*). All the functions of
2
TM
this IC are controlled via I C
bus by writing 6
bits on the System Register (SR, 8 bits) . The
same register can be read back, and two bits will
report the diagnostic status. When the IC is put in
Stand-by (EN bit LOW), the power blocks are
disabled and the loop-through switch between
LT1 and LT2 pins is closed, thus leaving all LNB
powering and control functions to the Master
Receiver (**). When the regulator blocks are
active (EN bit HIGH), the output can be logic
controlled to be 13 or 18 V (typ.) by mean of the
VSEL bit (Voltage SELect) for remote controlling
of non-DiSEqC LNBs. Additionally, it is possible
to increment by 1V (typ.) the selected voltage
value to compensate for the excess voltage drop
along the coaxial cable (LLC bit HIGH). In order to
minimise the power dissipation, the output voltage
of the internal step-up converter is adjusted to
allow the linear regulator to work at minimum
dropout. Another bit of the SR is addressed to the
remote control of non-DiSEqC LNBs: the TEN
(Tone ENable) bit. When it is set to HIGH, a
continuous 22KHz tone is generated regardless
of the DSQIN pin logic status. The TEN bit must
off
elapsed, the output is resumed for a time t =1/
on
10t (typ.). At the end of t , if the overload is still
off
on
detected, the protection circuit will cycle again
through Toff and Ton. At the end of a full Ton in
which no overload is detected, normal operation is
resumed and the OLF bit is reset to LOW. Typical
Ton+Toff time is 990ms and it is determined by an
internal timer. This dynamic operation can greatly
reduce the power dissipation in short circuit
condition, still ensuring excellent power-on start
up in most conditions (**) .
However, there could be some cases in which an
highly capacitive load on the output may cause a
difficult start-up when the dynamic protection is
chosen. This can be solved by initiating any power
start-up in static mode (PCL=HIGH) and then
switching to the dynamic mode (PCL=LOW) after
a chosen amount of time. When in static mode,
the OLF bit goes HIGH when the current clamp
limit is reached and returns LOW when the
overload condition is cleared.
be set LOW when the DSQIN pin is used for
TM
DiSEqC
DiSEqC
encoding. The fully bi-directional
interfacing is completed by the built-in
TM
22KHz tone detector. Its input pin (DETIN) must
This IC is also protected against overheating:
when the junction temperature exceeds 150°C
(typ.), the step-up converter and the linear
regulator are shut off, the loop-trough switch is
opened, and the OTF bit of the SR is set to HIGH.
Normal operation is resumed and the OTF bit is
reset to LOW when the junction is cooled down to
140°C (typ.).
TM
be AC coupled to the DiSEqC
bus, and the
extracted PWK data are available on the
DSQOUT pin (*).
In order to improve design flexibility and to allow
implementation of newcoming LNB remote control
standards, an analogic modulation input pin is
available (EXTM). An appropriate DC blocking
TM
(*): External components are needed to comply to bi-directional DiSEqC bus hardware require-ments. Full compliance of the whole appli-
TM
cation to DiSEqC specifications is not implied by the use of this IC.
(**): The current limitation circuit has no effect on the loop-through switch. When EN bit is LOW, the current flowing from LT1 to LT2 must
be externally limited.
2/20
LNBP21
ORDERING CODES
SO-20
(Tube)
SO-20
(Tape & Reel)
PowerSO-20
(Tube)
PowerSO-20
(Tape & Reel)
TYPE
LNBP21
LNBP21D2
LNBP21D2-TR
LNBP21PD
LNBP21PD-TR
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
DC Input Voltage
DC Input Voltage
DC Input Voltage
Output Current
16
25
20
V
V
CC
UP
V
, V
LT2
V
LT1
I
Internally Limited
-0.3 to 22
-0.3 to 7
2
mA
V
O
V
DC Output Pin Voltage
O
V
Logic Input Voltage (SDA, SCL, DSQIN)
Detector Input Signal Amplitude
Logic High Output Voltage (DSQOUT)
Bypass Switch ON Current
Bypass Switch OFF Voltage
Gate Current
V
I
V
V
DETIN
PP
V
7
V
mA
V
OH
I
900
LT
V
±20
LT
I
±400
mA
V
GATE
V
Current Sense Voltage
-0.3 to 1
-0.3 to 7
-40 to +150
-40 to +125
SENSE
V
Address Pin Voltage
V
ADDRESS
T
Storage Temperature Range
Operating Junction Temperature Range
°C
°C
stg
T
op
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is
not implied.
THERMAL DATA
Symbol
Parameter
Thermal Resistance Junction-case
SO-20
PowerSO-20 Unit
°C/W
R
15
2
thj-case
PIN CONFIGUARATION (top view)
SO-20
PowerSO-20
3/20
LNBP21
TABLE A: PIN CONFIGURATIONS
PIN NUMBER
vs PACKAGE
SYMBOL
NAME
FUNCTION
SO-20
PowerSO-20
V
Supply Input
8V to 15V supply. A 220µF bypass capacitor to
GND with a 470nF (ceramic) in parallel is
recommended
19
18
CC
GATE Exrernal Switch Gate
SENSE Current Sense Input
External MOS switch Gate connection of the
step-up converter
17
14
20
17
16
19
Current Sense comparator input. Connected to
current sensing resistor
V
Step-up Voltage
Input of the linear post-regulator. The voltage on this
pin is monitored by internal step-ut controller to
keep a minimum dropout across the linear pass
transistor
up
OUT
Output Port
Output of the linear post regulator modulator to the
LNB. See truth table for voltage selections.
1
2
2
SDA
SCL
Serial Data
Serial Clock
11
12
13
12
13
14
Bidirectional data from/to I C bus.
2
Clock from I C bus.
DSQIN DiSEqC Input
When the TEN bit of the System Register is LOW,
this pin will accept the DiSEqC code from the main
µcontroller. The LNBP21 will use this code to
modulate the internally generated 22kHz carrier. Set
to GND thi pin if not used.
DETIN Detector In
22kHz Tone Detector Input. Must be AC coupled to
the DiSEcQ bus.
9
9
DSQOUT DiSEqC Output
Open collector output of the tone Detector to the
main µcontroller for DiSEcQ data decoding. It is
LOW when tone is detected.
10
15
EXTM Extrernal Modulator
External Modulation Input. Need DC decoupling to
the AC source. If not used, can be left open.
4
5
GND
Ground
Circuit Ground. It is internally connected to the die
frame for heat dissipation.
5, 6, 15, 16 1, 10, 11, 20
BYP
LT1
Bypass Capacitor
Needed for internal preregulator filtering
8
3
8
4
Loop Through Switch
In standby mode the power switch between LT1
and LT2 is closed. Max allowed current is 900mA.
this pin can be left open if loopthrough function is
not needed.
LT2
Loop Through Switch
Same as above
2
7
3
7
2
ADDR Address Setting
Four I C bus addresses available by setting the
Address Pin level voltage
4/20
LNBP21
TYPICAL APPLICATION CIRCUIT
D1 1N4001
IC1
Master STB
LT1
Vup
C3
470nF
Ceramic
C2
220µF
C7
10nF
LT2
Vo
IC2
STS4DNFS30L
(Note 3)
270µH
to LNB
Gate
D2
BAT43
C8
10nF
15 ohm
LNBP21
see Note 2
Sense
Vcc
DETIN
(Note 1)
L1=22µH
C6
10nF
R
sc
0.1
Ω
(Note 4)
Byp
C5
470nF
C1
220µF
C4
470nF
Ceramic
Vin
12V
EXTM
ADDRESS
DSQOUT
DSQIN(Note 1)
SCL
0<Vaddr<V
Byp
SDA
GND
(*) Set to GND if not used
TM
TM
(**) filter to be used according to EUTELSAT reccomendation to implement the DiSEqC 2.x, not needed if bidirectional DiSEqC 2.x is
not implemented (see DiSEqC implementation note)
(***) IC2 is a ST Fettky, STS4DNFS30L, that includes both the schottky diode and the N-Channel Mos-Fet, needed for the DC/DC converter,
in a So-8 package. It can be replaced by a schottky diode (STPS2L3A or similar) and a N-Channel Mos-Fet (STN4NF03L or similar)
2
I C BUS INTERFACE
Data transmission from main µP to the LNBP21
and viceversa takes place through the 2 wires I2C
bus interface, consisting of the two lines SDA and
SCL (pull-up resistors to positive supply voltage
must be externally connected).
ACKNOWLEDGE
The master (µP) puts a resistive HIGH level on the
SDA line during the acknowledge clock pulse (see
fig. 3). The peripheral (LNBP21) that
acknowledges has to pull-down (LOW) the SDA
line during the acknowledge clock pulse, so that
the SDA line is stable LOW during this clock pulse.
The peripheral which has been addressed has to
generate an acknowledge after the reception of
each byte, other-wise the SDA line remains at the
HIGH level during the ninth clock pulse time. In
this case the master transmitter can generate the
STOP information in order to abort the transfer.
The LNBP21 won't gen-erate the acknowledge if
the Vcc supply is below the Undervoltage Lockout
threshold (6.7V typ.).
DATA VALIDITY
As shown in fig. 1, the data on the SDA line must
be stable during the high period of the clock. The
HIGH and LOW state of the data line can only
change when the clock signal on the SCL line is
LOW.
START AND STOP CONDITIONS
As shown in fig.2 a start condition is a HIGH to
LOW transition of the SDA line while SCL is HIGH.
The stop condition is a LOW to HIGH transition of
the SDA line while SCL is HIGH. A STOP
condi-tions must be sent before each START
condition.
TRANSMISSION WITHOUT ACKNOWLEDGE
Avoiding to detect the acknowledge of the
LNBP21, the µP can use a simpler transmission:
simply it waits one clock without checking the
slave acknowledging, and sends the new data.
BYTE FORMAT
Every byte transferred to the SDA line must
contain 8 bits. Each byte must be followed by an
ac-knowledge bit. The MSB is transferred first.
This approach of course is less protected from
misworking and decreases the noise immunity.
5/20
LNBP21
2
Figure 1 : DATA VALIDITY ON THE I C BUS
2
Figure 2 : TIMING DIAGRAM ON I C BUS
2
Figure 3 : ACKNOWLEDGE ON I C BUS
6/20
LNBP21
LNBP1 SOFTWARE DESCRIPTION
INTERFACE PROTOCOL
The interface protocol comprises:
- A start condition (S)
- A chip address byte = hex 10 / 11 (the LSB bit
determines read(=1)/write(=0) transmission)
- A sequence of data (1 byte + acknowledge)
- A stop condition (P)
CHIP ADDRESS
DATA
MSB
LSB
MSB
LSB
S
0
0
0
1
0
0
0
R/W ACK
ACK
P
ACK= Acknowledge
S= Start
P= Stop
R/W= Read/Write
SYSTEM REGISTER (SR, 1 BYTE)
MSB
LSB
R, W
PCL
R, W
ISEL
R, W
TEN
R, W
LLC
R, W
R, W
EN
R
R
VSEL
OTF
OLF
R,W= read and write bit
R= Read-only bit
All bits reset to 0 at Power-On
2
TRANSMITTED DATA (I C BUS WRITE MODE)
When the R/W bit in the chip address is set to 0,
the main µP can write on the System Register
the 8 available can be written by the µP, since the
re-maining 2 are left to the diagnostic flags, and
are read-only.
2
(SR) of the LNBP21 via I C bus. Only 6 bits out of
PCL ISEL TEN LLC VSEL EN
OTF OLF
Function
V
V
V
V
=13V, V =16V Loopthrough switch open
0
0
1
1
0
1
0
1
1
1
1
X
X
X
X
X
X
OUT
UP
=18V, V =21V Loopthrough switch open
OUT
OUT
OUT
UP
=14V, V =17V Loopthrough switch open
UP
=19V, V =22V Loopthrough switch open
1
1
1
1
X
X
X
X
X
X
X
X
UP
0
1
22KHz tone is controlled by DSQIN pin
22KHz tone is ON, DSQIN pin disabled
I
I
=500mA, I
=400mA, I
=650mA I =300mA
0
1
OUT(min)
OUT(min)
OUT(max)
SC
=550mA I =300mA
1
1
1
0
X
X
X
X
X
X
X
X
OUT(max)
SC
0
1
Pulsed (dynamic) current limiting is selected
Static current limiting is selected
X
X
X
X
X
Power blocks disabled, Loopthrough switch closed
X= don't care.
Values are typical unless otherwise specified
2
RECEIVED DATA (I C bus READ MODE)
LNBP21 issues a byte on the SDA data bus line
(MSB transmitted first).
At the ninth clock bit the MCU master can:
- acknowledge the reception, starting in this way
the transmission of another byte from the
LNBP21;
The LNBP21 can provide to the Master a copy of
the SYSTEM REGISTER information via I2C bus
in read mode. The read mode is Master activated
by sending the chip address with R/W bit set to 1.
At the following master generated clocks bits, the
7/20
LNBP21
- no acknowledge, stopping the read mode
communication.
While the whole register is read back by the µP,
only the two read-only bits OLF and OTF convey
di-agnostic informations about the LNBP21.
PCL ISEL TEN LLC VSEL EN
OTF OLF
Function
T <140°C, normal operation
0
1
0
1
J
T >150°C, power block disabled, Loothrough switch open
J
These bits are read exactly the same as
they were left after last write operation
I
I
<I
, normal operation
OUT OMAX
>I
, overload protection triggered
OUT OMAX
Values are typical unless otherwise specified
POWER-ON I2C INTERFACE RESET
PWK data in accordance to the DiSEqC pro-tocol.
Full compliance of the system to the specification
is thus not implied by the bare use of the LNBP21.
The I2C interface built in the LNBP21 is
automatically reset at power-on. As long as the
Vcc stays be-low the UnderVoltage Lockout
threshold (6.7V typ.), the interface will not respond
to any I2C com-mand and the System Register
(SR) is initialised to all zeroes, thus keeping the
power blocks disabled. Once the Vcc rises above
7.3V, the I2C interface becomes operative and the
SR can be configured by the main µP. This is due
to About 500mV of hysteresis provided in the UVL
threshold to avoid false retriggering of the
Power-On reset circuit.
The system designer should also take in
consideration the bus hardware requirements,
that include the source impedance of the Master
Transmitter measured at 22KHz. To limit the
attenuation at car-rier frequency, this impedance
has to be 15ohm at 22KHz, dropping to zero ohm
at DC to allow the power flow towards the
peripherals. This can be simply accomplished by
the LR termination put on the OUT pin of the
LNBP, as shown in the Typical Application Circuit
on page 5.
DiSEqCTM IMPLEMENTATION
Unidirectional (1.x) DiSEqC and non-DiSEqC
systems normally don't need this termination, and
the OUT pin can be directly connected to the LNB
supply port of the Tuner. There is also no need of
Tone Decoding, thus, it is recommended to
connect the DETIN and DSQOUT pins to ground
to avoid EMI.
The LNBP21 helps the system designer to
implement the bi-directional (2.x) DiSEqC protocol
by al-lowing an easy PWK modulation/
demodulation of the 22KHz carrier. The PWK data
are exchanged between the LNBP21 and the
main µP using logic levels that are compatible with
both 3.3 and 5V mi-crocontrollers. This data
exchange is made through two dedicated pins,
DSQIN and DSQOUT, in or-der to maintain the
timing relationships between the PWK data and
the PWK modulation as accurate as possible.
These two pins should be directly connected to
two I/O pins of the µP, thus leaving to the resident
firmware the task of encoding and decoding the
ADDRESS PIN
Connecting this pin to GND the Chip I2C interface
address is 0001000, but, it is possible to choice
among 4 different addresses simply setting this
pin at 4 fixed voltage levels (see table on page
10).
ELECTRICAL CHARACTERISTICS FOR LNBP SERIES (T = 0 to 85°C, EN=1, LLC=0, TEN=0, ISEL=0,
J
PCL=0, DSQIN=0, V =12V, I
for I C access to the system register)
=50mA, unless otherwise specified. See software description section
IN
OUT
2
Symbol
Parameter
Supply Voltage
Test Conditions
Min.
Typ.
Max.
15
Unit
V
V
I
= 500 mA TEN=VSEL=LLC=1
8
IN
O
V
LT1 Input Voltage
Supply Current
20
V
LT1
I
I
I
= 0mA TEN=VSEL=LLC=1 EN=1
EN=0
20
2.5
18
19
40
5
mA
mA
V
IN
O
V
Output Voltage
= 500 mA VSEL=1
LLC=0
LLC=1
17.3
18.7
O
O
V
8/20
LNBP21
Symbol
Parameter
Output Voltage
Test Conditions
= 500 mA VSEL=0
O
Min.
Typ.
Max.
Unit
V
I
LLC=0
12.5
13
14
5
13.5
V
O
LLC=1
V
∆V
Line Regulation
V
=15 to 18V
VSEL=0
VSEL=1
40
60
mV
mV
mV
O
IN1
5
∆V
Load Regulation
VSEL=0 or 1 I
= 50 to 500mA
200
O
OUT
I
Output Current Limiting
ISEL=1
ISEL=0
ISEL=1
ISEL=0
400
500
550
650
mA
mA
mA
mA
ms
MAX
I
Output Short Circuit Current
200
300
900
SC
t
Dynamic Overload
protection OFF Time
PCL=0
PCL=0
Output Shorted
Output Shorted
OFF
t
Dynamic Overload
protection ON Time
t
/10
ms
ON
OFF
f
Tone Frequency
TEN=1
TEN=1
TEN=1
TEN=1
20
0.55
40
22
24
0.9
60
15
KHz
Vpp
%
TONE
A
Tone Amplitude
0.72
50
10
6
TONE
D
Tone Duty Cycle
TONE
t , t
Tone Rise and Fall Time
External Modulation Gain
5
µs
r
f
G
V
∆V
/∆V ,
EXTM
f = 10Hz to 40KHz
EXTM
EXTM
OUT
External Modulation Input
Voltage
AC Coupling
400
0.6
mVpp
Ω
Z
External Modulation
Impedance
f = 10Hz to 50KHz
260
0.35
220
EXTM
V
Loopthrough Switch Voltage EN=0,
Drop (lt1 to LT2)
I
=300mA,
V =12 or 19V
MI
V
LT
LT
f
DC/DC Converter Switch
Frequency
kHz
kHz
Vpp
kΩ
V
SW
f
Tone Detector Frequency
Capture Range
0.4Vpp sinewave
=22kHz sinewave
18
24
DETIN
V
Z
Tone Detector Input
Amplitude
f
0.2
1.5
DETIN
DETIN
IN
Tone Detector Input
Impedance
150
0.3
V
Overload Flag Pin Logic
LOW
Tone present
Tone absent
I
=2mA
0.5
10
OL
OZ
OL
I
Overload Flag Pin OFF
State Leakage Current
V
= 6V
µA
V
OH
V
DSQIN Input Pin Logic
LOW
0.8
IL
IH
IH
V
DSQIN Input Pin Logic
HIGH
2
V
I
DSQIN Pins Input Current
Output Backward Current
V
= 5V
15
-4
µA
mA
°C
IH
I
EN=0
V
= 18V
OBK
-10
OBK
T
Temperature Shutdown
Threshold
150
SHDN
∆T
Temperature Shutdown
Hysteresis
15
°C
SHDN
9/20
LNBP21
GATE AND SENSE ELECTRICAL CHARACTERISTICS (T = 0 to 85°C, V =12V)
J
IN
Symbol
Parameter
Test Conditions
Min.
Typ.
4.5
Max.
Unit
Ω
R
Gate LOW R
I
I
=-100mA
DSON-L
DSON
DSON
GATE
R
Gate LOW R
=100mA
4.5
Ω
DSON-H
GATE
V
Current Limit Sense Voltage
200
mV
SENSE
2
I C ELECTRICAL CHARACTERISTICS (T = 0 to 85°C, V =12V)
J
IN
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
V
LOW Level Input Voltage
SDA, SCL
0.8
IL
IH
IH
V
HIGH Level Input Voltage SDA, SCL
2
V
I
Input Current
SDA, SCL, V = 0.4 to 4.5v
-10
10
µA
V
IN
V
DSQIN Input Pin Logic
LOW
SDA (open drain), I = 6mA
0.6
IL
OL
f
Maximum Clock Frequency SCL
500
KHz
MAX
ADDRESS PIN CHARACTERISTICS (T = 0 to 85°C, V =12V)
J
IN
Symbol
Parameter
Test Conditions
Min.
0
Typ.
Max.
0.7
1.7
2.7
5
Unit
V
V
"0001000" Addr Pin Voltage
"0001001" Addr Pin Voltage
"0001010" Addr Pin Voltage
"0001011" Addr Pin Voltage
ADDR-1
V
1.3
2.3
3.3
V
ADDR-2
V
V
ADDR-3
V
V
ADDR-4
TEST CIRCUIT
1N4001
ILT
VMI, VOBK
Vup
LT1
A
10nF
10nF
STPS2L30A
470nF
STN4NF03L
220µF
V
LT
V
Scope Probe
Load
Gate
LT2
, IOBK
IO
L1=22µH
Sense
Rsc
0.1
Ω
OUT
A
IIN
Vin
LNBP21
Vcc
A
VOUT
V
20µF
220µF
470nF
EXTM
SDA
SCL
SDA
SCL
From I C
2
VEXTM, VDETIN
10nF
{
Master
DETIN
DSQIN
BYP
470nF
A
DSQOUT
Pulse Gen.
OH
V
OL
/ I
IOZ / IOL
ADDRESS
OL
V
V
10/20
LNBP21
TYPICAL CHARACTERISTICS (unless otherwise specified T = 25°C)
j
Figure 4 : Output Voltage vs Temperature
Figure 5 : Output Voltage vs Temperature
Figure 6 : Line Regulation vs Temperature
Figure 7 : Line Regulation vs Temperature
Figure 8 : Load Regulation vs Temperature
Figure 9 : Load Regulation vs Temperature
11/20
LNBP21
Figure 10 : Supply Current vs Temperature
Figure 13 : Dynamic Overload Protection OFF
Time vs Temperature
Figure 11 : Supply Current vs Temperature
Figure 14 : Output Current Limiting vs
Temperature
Figure 12 : Dynamic Overload Protection ON
Figure 15 : Output Current Limiting vs
Time vs Temperature
Temperature
12/20
LNBP21
Figure 16 : Tone Frequency vs Temperature
Figure 17 : Tone Amplitude vs Temperature
Figure 18 : Tone Duty Cicle vs Temperature
Figure 19 : Tone Rise Time vs Temperature
Figure 20 : Tone Fall Time vs Temperature
Figure 21 : Loopthrought Switch Drop Voltage vs
Temperature
13/20
LNBP21
Figure 22 : Loopthrought Switch Drop Voltage vs
Figure 25 : DSQOUT Pin Logic Low vs
Temperature
Temperature
Figure 23 : Loopthrought Switch Drop Voltage vs
Figure 26 : Undervoltage Lockout Threshold vs
Loopthrought Current
Temperature
Figure 24 : Loopthrought Switch Drop Voltage vs
Figure 27 : Output Backward Current vs
Loopthrought Current
Temperature
14/20
LNBP21
Figure 28 : DC/DC Converter Efficiency vs
Temperature
Figure 31 : DSQIN Tone Enable Transient
Response
V
=12V, I =50mA, EN=1, TEN=0
O
CC
Figure 29 : Current Limit Sense vs Temperature
Figure 32 : DSQIN Tone Enable Transient
Response
V
=12V, I =50mA, EN=1, TEN=0
O
CC
Figure 30 : 22kHz Tone
Figure 33 : DSQIN Tone Disable Transient
Response
V
CC
=12V, I =50mA, EN=TEN=1
V =12V, I =50mA, EN=1, TEN=0
CC O
O
15/20
LNBP21
Figure 34 : Output Voltage Transient Response
Figure 35 : Output Voltage Transient Response
from 13V to 18V
from 13V to 18V
V
=12V, I =50mA, VSEL=from 0 to 1, EN=1
V
=12V, I =50mA, VSEL=from 1 to 0, EN=1
CC
O
CC O
TERMAL DESIGN NOTES
During normal operation, this device dissipates
some power. At maximum rated output current
(500mA), the voltage drop on the linear regulator
lead to a total dissipated power that is of about
1.7W. The heat generated requires a suitable
heatsink to keep the junction temperature below
body. This area can be the inner GND layer of a
multi-layer PCB, or, in a dual layer PCB, an
unbroken GND area even on the opposite side
where the IC is placed. In both cases, the thermal
path between the IC GND pins and the dissipating
copper area must exhibit a low thermal resistance.
the
Assuming
overtemperature
protection
threshold.
In figure 4 , it is shown a suggested layout for the
SO-20 package with a dual layer PCB, where the
IC Ground pins and the square dissipating area
are thermally connected through 32 vias holes,
a
40°C temperature inside the
Set-Top-Box case, the total Rthj-amb has to be
less than 50°C/W.
filled by solder.
L=50mm, achieves an Rthc-a of about 25°C/W.
This arrangement, when
While this can be easily achieved using a
through-hole power package that can be attached
to a small heatsink or to the metallic frame of the
receiver, a surface mount power package must
rely on PCB solutions whose thermal efficiency is
often limited. The simplest solution is to use a
large, con-tinuous copper area of the GND layer to
dissipate the heat coming from the IC body.
Different layouts are possible, too. Basic
principles, however, suggest to keep the IC and its
ground pins approximately in the middle of the
dissipating area; to provide as many vias as
possible; to de-sign a dissipating area having a
shape as square as possible and not interrupted
by other copper traces.
The SO-20 package of this IC has 4 GND pins that
are not just intended for electrical GND
connec-tion, but also to provide a low thermal
resistance path between the silicon chip and the
PCB heatsink. Given an Rthj-c equal to 15°C/W,
a maximum of 35°C/W are left to the PCB
heatsink. This figure is achieved if a minimum of
25cm2 copper area is placed just below the IC
Due to presence of an exposed pad connected to
GND below the IC body, the PowerSO-20
package has a Rthj-c much lower than the SO-20,
only 2°C/W. As a result, much lower copper area
must be provided to dissipate the same power and
minimum of 12cm2 copper area is enough, see
figure 5.
16/20
LNBP21
Figure 36 : SO-20 SUGGESTED PCB HEATSINK LAYOUT
Figure 37 : PowerSO-20 SUGGESTED PCB HEATSINK LAYOUT
17/20
LNBP21
SO-20 MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
TYP
MAX.
2.65
0.2
MIN.
MAX.
0.104
0.008
0.096
0.019
0.012
A
a1
a2
b
0.1
0.004
2.45
0.49
0.32
0.35
0.23
0.014
0.009
b1
C
0.5
0.020
c1
D
45˚ (typ.)
12.60
10.00
13.00
10.65
0.496
0.393
0.512
0.419
E
e
1.27
0.050
0.450
e3
F
11.43
7.40
0.50
7.60
1.27
0.75
0.291
0.020
0.300
0.050
0.029
L
M
S
˚ (max.)
8
PO13L
18/20
LNBP21
PowerSO-20 MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
TYP
MAX.
3.60
0.30
3.30
0.10
0.53
0.32
16.00
MIN.
MAX.
0.1417
0.0118
0.1299
0.0039
0.0209
0.0013
0.630
A
a1
a2
a3
b
0.10
0.0039
0
0
0.40
0.23
15.80
13.90
0.0157
0.0090
0.6220
0.5472
c
D (1)
E
14.50
0.5710
e
1.27
0.0500
0.4500
e3
E1 (1)
E2
G
11.43
10.90
0
11.10
2.90
0.10
1.10
1.10
0.4291
0.0000
0.0314
0˚
0.4370
0.1141
0.0039
0.0433
0.0433
10˚
h
L
0.80
0˚
N
0˚
1
S
8˚
8˚
T
10.0
0.3937
(1) “D and E1” do not include mold flash or protusions - Mold flash or protusions shall not exceed 0.15mm (0.006”)
R
N
N
a2
A
c
a1
b
e
DETAILB
DETAILA
D
E
e3
DETAILA
leda
20
11
slug
a3
DETAILB
0.35
E2
E1
GagePlaen
T
-C-
SEATING PLANE
S
L
G
C
(COPLANARITY)
1
1
0
PSO20MEC
hx45˚
0056635
19/20
LNBP21
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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© http://www.st.com
20/20
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