LNBP21PD-TR [STMICROELECTRONICS]

LNBP SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND I2C INTERFACE; LNBP电源和控制IC与升压转换器和I2C接口
LNBP21PD-TR
型号: LNBP21PD-TR
厂家: ST    ST
描述:

LNBP SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND I2C INTERFACE
LNBP电源和控制IC与升压转换器和I2C接口

转换器 稳压器 开关式稳压器或控制器 电源电路 开关式控制器 光电二极管 升压转换器
文件: 总20页 (文件大小:695K)
中文:  中文翻译
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LNBP21  
LNBP SUPPLY AND CONTROL IC WITH  
2
STEP-UP CONVERTER AND I C INTERFACE  
COMPLETE INTERFACE BETWEEN LNB  
AND I2CTM BUS  
BUILT-IN DC/DC CONTROLLER FOR  
SINGLE 12V SUPPLY OPERATION  
ACCURATE BUILT-IN 22KHz TONE  
OSCILLATOR  
SUITS WIDELY ACCEPTED STANDARDS  
PowerSO-20  
SO-20  
FAST OSCILLATOR START-UP FACILITATES  
DiSEqCTM ENCODING  
BUILT-IN 22KHz TONE DETECTOR  
SUPPORTS BI-DIRECTIONAL DiSEqCTM  
LOOP-THROUGH FUNCTION FOR SLAVE  
OPERATION  
LNB SHORT CIRCUIT PROTECTION AND  
DIAGNOSTIC  
DESCRIPTION  
Intended for analog and digital satellite STB  
receivers/SatTV, sets/PC cards, the LNBP21 is a  
monolithic voltage regulator and interface IC,  
assembled in SO-20 and PowerSO-20,  
specifically designed to provide the power and the  
13/18V, 22KHz tone signalling to the LNB  
CABLE LENGTH DIGITAL COMPENSATION  
INTERNAL OVER TEMPERATURE  
PROTECTION  
ESD RATING 4KV ON POWER  
INPUT-OUTPUT PINS  
SCHEMATIC DIAGRAM  
LNBP21  
Gate  
LT1  
LT2  
OUT  
Sense  
Feedback  
Step-up  
Controller  
Vup  
Vcc  
Preregul.+  
U.V.lockout  
+P.ON res.  
Enable  
Linear Post-reg  
+Modulator  
I Select  
Byp  
+Protections  
V Select  
EXTM  
SDA  
SCL  
Diagnostics  
I²C  
interf.  
DETIN  
Tone  
Detector  
22KHz  
Oscill.  
ADDR  
DSQIN  
DSQOUT  
October 2002  
1/20  
LNBP21  
downconverter in the antenna or to the multiswitch  
box. In this application field, it offers a complete  
solution with extremely low component count, low  
power dissipation together with simple design and  
capaci-tor must be used to couple the modulating  
signal source to the EXTM pin. When external  
modulation is not used, the relevant pin can be left  
open.  
2
I CTM standard interfac-ing.  
The current limitation block has two thresholds  
that can be selected by the I  
bit of the SR; the  
This IC has a built in DC/DC step-up controller  
that, from a single supply source ranging from 8 to  
15V, generates the voltages that let the linear  
post-regulator to work at a minimum dissipated  
power. An UnderVoltage Lockout circuit will  
SEL  
lower threshold is between 400 and 550mA  
(I =HIGH), while the higher threshold is  
SEL  
between 500 and 650mA (I  
=LOW).  
SEL  
The current protection block is SOA type. This  
limits the short circuit current (Isc) typically at  
disable the whole circuit when the supplied V  
CC  
drops below a fixed threshold (6.7V typically). The  
internal 22KHz tone generator is factory trimmed  
in accordance to the standards, and can be  
200mA with I  
=HIGH and at 300mA with  
SEL  
I
=LOW when the output port is connected to  
SEL  
ground.  
2
TM  
controlled either by the I C  
interface or by a  
It is possible to set the Short Circuit Current  
protection either statically (simple current clamp)  
or dy-namically by the PCL bit of the SR; when  
the PCL (Pulsed Current Limiting) bit is set to  
LOW, the overcurrent protection circuit works  
dynamically: as soon as an overload is detected,  
the output is shut-down for a time t , typically  
900ms. Simultaneously the OLF bit of the System  
Register is set to HIGH. After this time has  
dedicated pin (DSQIN) that allows immediate  
TM  
DiSEqC  
data encoding (*). All the functions of  
2
TM  
this IC are controlled via I C  
bus by writing 6  
bits on the System Register (SR, 8 bits) . The  
same register can be read back, and two bits will  
report the diagnostic status. When the IC is put in  
Stand-by (EN bit LOW), the power blocks are  
disabled and the loop-through switch between  
LT1 and LT2 pins is closed, thus leaving all LNB  
powering and control functions to the Master  
Receiver (**). When the regulator blocks are  
active (EN bit HIGH), the output can be logic  
controlled to be 13 or 18 V (typ.) by mean of the  
VSEL bit (Voltage SELect) for remote controlling  
of non-DiSEqC LNBs. Additionally, it is possible  
to increment by 1V (typ.) the selected voltage  
value to compensate for the excess voltage drop  
along the coaxial cable (LLC bit HIGH). In order to  
minimise the power dissipation, the output voltage  
of the internal step-up converter is adjusted to  
allow the linear regulator to work at minimum  
dropout. Another bit of the SR is addressed to the  
remote control of non-DiSEqC LNBs: the TEN  
(Tone ENable) bit. When it is set to HIGH, a  
continuous 22KHz tone is generated regardless  
of the DSQIN pin logic status. The TEN bit must  
off  
elapsed, the output is resumed for a time t =1/  
on  
10t (typ.). At the end of t , if the overload is still  
off  
on  
detected, the protection circuit will cycle again  
through Toff and Ton. At the end of a full Ton in  
which no overload is detected, normal operation is  
resumed and the OLF bit is reset to LOW. Typical  
Ton+Toff time is 990ms and it is determined by an  
internal timer. This dynamic operation can greatly  
reduce the power dissipation in short circuit  
condition, still ensuring excellent power-on start  
up in most conditions (**) .  
However, there could be some cases in which an  
highly capacitive load on the output may cause a  
difficult start-up when the dynamic protection is  
chosen. This can be solved by initiating any power  
start-up in static mode (PCL=HIGH) and then  
switching to the dynamic mode (PCL=LOW) after  
a chosen amount of time. When in static mode,  
the OLF bit goes HIGH when the current clamp  
limit is reached and returns LOW when the  
overload condition is cleared.  
be set LOW when the DSQIN pin is used for  
TM  
DiSEqC  
DiSEqC  
encoding. The fully bi-directional  
interfacing is completed by the built-in  
TM  
22KHz tone detector. Its input pin (DETIN) must  
This IC is also protected against overheating:  
when the junction temperature exceeds 150°C  
(typ.), the step-up converter and the linear  
regulator are shut off, the loop-trough switch is  
opened, and the OTF bit of the SR is set to HIGH.  
Normal operation is resumed and the OTF bit is  
reset to LOW when the junction is cooled down to  
140°C (typ.).  
TM  
be AC coupled to the DiSEqC  
bus, and the  
extracted PWK data are available on the  
DSQOUT pin (*).  
In order to improve design flexibility and to allow  
implementation of newcoming LNB remote control  
standards, an analogic modulation input pin is  
available (EXTM). An appropriate DC blocking  
TM  
(*): External components are needed to comply to bi-directional DiSEqC bus hardware require-ments. Full compliance of the whole appli-  
TM  
cation to DiSEqC specifications is not implied by the use of this IC.  
(**): The current limitation circuit has no effect on the loop-through switch. When EN bit is LOW, the current flowing from LT1 to LT2 must  
be externally limited.  
2/20  
LNBP21  
ORDERING CODES  
SO-20  
(Tube)  
SO-20  
(Tape & Reel)  
PowerSO-20  
(Tube)  
PowerSO-20  
(Tape & Reel)  
TYPE  
LNBP21  
LNBP21D2  
LNBP21D2-TR  
LNBP21PD  
LNBP21PD-TR  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
V
DC Input Voltage  
DC Input Voltage  
DC Input Voltage  
Output Current  
16  
25  
20  
V
V
CC  
UP  
V
, V  
LT2  
V
LT1  
I
Internally Limited  
-0.3 to 22  
-0.3 to 7  
2
mA  
V
O
V
DC Output Pin Voltage  
O
V
Logic Input Voltage (SDA, SCL, DSQIN)  
Detector Input Signal Amplitude  
Logic High Output Voltage (DSQOUT)  
Bypass Switch ON Current  
Bypass Switch OFF Voltage  
Gate Current  
V
I
V
V
DETIN  
PP  
V
7
V
mA  
V
OH  
I
900  
LT  
V
±20  
LT  
I
±400  
mA  
V
GATE  
V
Current Sense Voltage  
-0.3 to 1  
-0.3 to 7  
-40 to +150  
-40 to +125  
SENSE  
V
Address Pin Voltage  
V
ADDRESS  
T
Storage Temperature Range  
Operating Junction Temperature Range  
°C  
°C  
stg  
T
op  
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is  
not implied.  
THERMAL DATA  
Symbol  
Parameter  
Thermal Resistance Junction-case  
SO-20  
PowerSO-20 Unit  
°C/W  
R
15  
2
thj-case  
PIN CONFIGUARATION (top view)  
SO-20  
PowerSO-20  
3/20  
LNBP21  
TABLE A: PIN CONFIGURATIONS  
PIN NUMBER  
vs PACKAGE  
SYMBOL  
NAME  
FUNCTION  
SO-20  
PowerSO-20  
V
Supply Input  
8V to 15V supply. A 220µF bypass capacitor to  
GND with a 470nF (ceramic) in parallel is  
recommended  
19  
18  
CC  
GATE Exrernal Switch Gate  
SENSE Current Sense Input  
External MOS switch Gate connection of the  
step-up converter  
17  
14  
20  
17  
16  
19  
Current Sense comparator input. Connected to  
current sensing resistor  
V
Step-up Voltage  
Input of the linear post-regulator. The voltage on this  
pin is monitored by internal step-ut controller to  
keep a minimum dropout across the linear pass  
transistor  
up  
OUT  
Output Port  
Output of the linear post regulator modulator to the  
LNB. See truth table for voltage selections.  
1
2
2
SDA  
SCL  
Serial Data  
Serial Clock  
11  
12  
13  
12  
13  
14  
Bidirectional data from/to I C bus.  
2
Clock from I C bus.  
DSQIN DiSEqC Input  
When the TEN bit of the System Register is LOW,  
this pin will accept the DiSEqC code from the main  
µcontroller. The LNBP21 will use this code to  
modulate the internally generated 22kHz carrier. Set  
to GND thi pin if not used.  
DETIN Detector In  
22kHz Tone Detector Input. Must be AC coupled to  
the DiSEcQ bus.  
9
9
DSQOUT DiSEqC Output  
Open collector output of the tone Detector to the  
main µcontroller for DiSEcQ data decoding. It is  
LOW when tone is detected.  
10  
15  
EXTM Extrernal Modulator  
External Modulation Input. Need DC decoupling to  
the AC source. If not used, can be left open.  
4
5
GND  
Ground  
Circuit Ground. It is internally connected to the die  
frame for heat dissipation.  
5, 6, 15, 16 1, 10, 11, 20  
BYP  
LT1  
Bypass Capacitor  
Needed for internal preregulator filtering  
8
3
8
4
Loop Through Switch  
In standby mode the power switch between LT1  
and LT2 is closed. Max allowed current is 900mA.  
this pin can be left open if loopthrough function is  
not needed.  
LT2  
Loop Through Switch  
Same as above  
2
7
3
7
2
ADDR Address Setting  
Four I C bus addresses available by setting the  
Address Pin level voltage  
4/20  
LNBP21  
TYPICAL APPLICATION CIRCUIT  
D1 1N4001  
IC1  
Master STB  
LT1  
Vup  
C3  
470nF  
Ceramic  
C2  
220µF  
C7  
10nF  
LT2  
Vo  
IC2  
STS4DNFS30L  
(Note 3)  
270µH  
to LNB  
Gate  
D2  
BAT43  
C8  
10nF  
15 ohm  
LNBP21  
see Note 2  
Sense  
Vcc  
DETIN  
(Note 1)  
L1=22µH  
C6  
10nF  
R
sc  
0.1  
(Note 4)  
Byp  
C5  
470nF  
C1  
220µF  
C4  
470nF  
Ceramic  
Vin  
12V  
EXTM  
ADDRESS  
DSQOUT  
DSQIN(Note 1)  
SCL  
0<Vaddr<V  
Byp  
SDA  
GND  
(*) Set to GND if not used  
TM  
TM  
(**) filter to be used according to EUTELSAT reccomendation to implement the DiSEqC 2.x, not needed if bidirectional DiSEqC 2.x is  
not implemented (see DiSEqC implementation note)  
(***) IC2 is a ST Fettky, STS4DNFS30L, that includes both the schottky diode and the N-Channel Mos-Fet, needed for the DC/DC converter,  
in a So-8 package. It can be replaced by a schottky diode (STPS2L3A or similar) and a N-Channel Mos-Fet (STN4NF03L or similar)  
2
I C BUS INTERFACE  
Data transmission from main µP to the LNBP21  
and viceversa takes place through the 2 wires I2C  
bus interface, consisting of the two lines SDA and  
SCL (pull-up resistors to positive supply voltage  
must be externally connected).  
ACKNOWLEDGE  
The master (µP) puts a resistive HIGH level on the  
SDA line during the acknowledge clock pulse (see  
fig. 3). The peripheral (LNBP21) that  
acknowledges has to pull-down (LOW) the SDA  
line during the acknowledge clock pulse, so that  
the SDA line is stable LOW during this clock pulse.  
The peripheral which has been addressed has to  
generate an acknowledge after the reception of  
each byte, other-wise the SDA line remains at the  
HIGH level during the ninth clock pulse time. In  
this case the master transmitter can generate the  
STOP information in order to abort the transfer.  
The LNBP21 won't gen-erate the acknowledge if  
the Vcc supply is below the Undervoltage Lockout  
threshold (6.7V typ.).  
DATA VALIDITY  
As shown in fig. 1, the data on the SDA line must  
be stable during the high period of the clock. The  
HIGH and LOW state of the data line can only  
change when the clock signal on the SCL line is  
LOW.  
START AND STOP CONDITIONS  
As shown in fig.2 a start condition is a HIGH to  
LOW transition of the SDA line while SCL is HIGH.  
The stop condition is a LOW to HIGH transition of  
the SDA line while SCL is HIGH. A STOP  
condi-tions must be sent before each START  
condition.  
TRANSMISSION WITHOUT ACKNOWLEDGE  
Avoiding to detect the acknowledge of the  
LNBP21, the µP can use a simpler transmission:  
simply it waits one clock without checking the  
slave acknowledging, and sends the new data.  
BYTE FORMAT  
Every byte transferred to the SDA line must  
contain 8 bits. Each byte must be followed by an  
ac-knowledge bit. The MSB is transferred first.  
This approach of course is less protected from  
misworking and decreases the noise immunity.  
5/20  
LNBP21  
2
Figure 1 : DATA VALIDITY ON THE I C BUS  
2
Figure 2 : TIMING DIAGRAM ON I C BUS  
2
Figure 3 : ACKNOWLEDGE ON I C BUS  
6/20  
LNBP21  
LNBP1 SOFTWARE DESCRIPTION  
INTERFACE PROTOCOL  
The interface protocol comprises:  
- A start condition (S)  
- A chip address byte = hex 10 / 11 (the LSB bit  
determines read(=1)/write(=0) transmission)  
- A sequence of data (1 byte + acknowledge)  
- A stop condition (P)  
CHIP ADDRESS  
DATA  
MSB  
LSB  
MSB  
LSB  
S
0
0
0
1
0
0
0
R/W ACK  
ACK  
P
ACK= Acknowledge  
S= Start  
P= Stop  
R/W= Read/Write  
SYSTEM REGISTER (SR, 1 BYTE)  
MSB  
LSB  
R, W  
PCL  
R, W  
ISEL  
R, W  
TEN  
R, W  
LLC  
R, W  
R, W  
EN  
R
R
VSEL  
OTF  
OLF  
R,W= read and write bit  
R= Read-only bit  
All bits reset to 0 at Power-On  
2
TRANSMITTED DATA (I C BUS WRITE MODE)  
When the R/W bit in the chip address is set to 0,  
the main µP can write on the System Register  
the 8 available can be written by the µP, since the  
re-maining 2 are left to the diagnostic flags, and  
are read-only.  
2
(SR) of the LNBP21 via I C bus. Only 6 bits out of  
PCL ISEL TEN LLC VSEL EN  
OTF OLF  
Function  
V
V
V
V
=13V, V =16V Loopthrough switch open  
0
0
1
1
0
1
0
1
1
1
1
X
X
X
X
X
X
OUT  
UP  
=18V, V =21V Loopthrough switch open  
OUT  
OUT  
OUT  
UP  
=14V, V =17V Loopthrough switch open  
UP  
=19V, V =22V Loopthrough switch open  
1
1
1
1
X
X
X
X
X
X
X
X
UP  
0
1
22KHz tone is controlled by DSQIN pin  
22KHz tone is ON, DSQIN pin disabled  
I
I
=500mA, I  
=400mA, I  
=650mA I =300mA  
0
1
OUT(min)  
OUT(min)  
OUT(max)  
SC  
=550mA I =300mA  
1
1
1
0
X
X
X
X
X
X
X
X
OUT(max)  
SC  
0
1
Pulsed (dynamic) current limiting is selected  
Static current limiting is selected  
X
X
X
X
X
Power blocks disabled, Loopthrough switch closed  
X= don't care.  
Values are typical unless otherwise specified  
2
RECEIVED DATA (I C bus READ MODE)  
LNBP21 issues a byte on the SDA data bus line  
(MSB transmitted first).  
At the ninth clock bit the MCU master can:  
- acknowledge the reception, starting in this way  
the transmission of another byte from the  
LNBP21;  
The LNBP21 can provide to the Master a copy of  
the SYSTEM REGISTER information via I2C bus  
in read mode. The read mode is Master activated  
by sending the chip address with R/W bit set to 1.  
At the following master generated clocks bits, the  
7/20  
LNBP21  
- no acknowledge, stopping the read mode  
communication.  
While the whole register is read back by the µP,  
only the two read-only bits OLF and OTF convey  
di-agnostic informations about the LNBP21.  
PCL ISEL TEN LLC VSEL EN  
OTF OLF  
Function  
T <140°C, normal operation  
0
1
0
1
J
T >150°C, power block disabled, Loothrough switch open  
J
These bits are read exactly the same as  
they were left after last write operation  
I
I
<I  
, normal operation  
OUT OMAX  
>I  
, overload protection triggered  
OUT OMAX  
Values are typical unless otherwise specified  
POWER-ON I2C INTERFACE RESET  
PWK data in accordance to the DiSEqC pro-tocol.  
Full compliance of the system to the specification  
is thus not implied by the bare use of the LNBP21.  
The I2C interface built in the LNBP21 is  
automatically reset at power-on. As long as the  
Vcc stays be-low the UnderVoltage Lockout  
threshold (6.7V typ.), the interface will not respond  
to any I2C com-mand and the System Register  
(SR) is initialised to all zeroes, thus keeping the  
power blocks disabled. Once the Vcc rises above  
7.3V, the I2C interface becomes operative and the  
SR can be configured by the main µP. This is due  
to About 500mV of hysteresis provided in the UVL  
threshold to avoid false retriggering of the  
Power-On reset circuit.  
The system designer should also take in  
consideration the bus hardware requirements,  
that include the source impedance of the Master  
Transmitter measured at 22KHz. To limit the  
attenuation at car-rier frequency, this impedance  
has to be 15ohm at 22KHz, dropping to zero ohm  
at DC to allow the power flow towards the  
peripherals. This can be simply accomplished by  
the LR termination put on the OUT pin of the  
LNBP, as shown in the Typical Application Circuit  
on page 5.  
DiSEqCTM IMPLEMENTATION  
Unidirectional (1.x) DiSEqC and non-DiSEqC  
systems normally don't need this termination, and  
the OUT pin can be directly connected to the LNB  
supply port of the Tuner. There is also no need of  
Tone Decoding, thus, it is recommended to  
connect the DETIN and DSQOUT pins to ground  
to avoid EMI.  
The LNBP21 helps the system designer to  
implement the bi-directional (2.x) DiSEqC protocol  
by al-lowing an easy PWK modulation/  
demodulation of the 22KHz carrier. The PWK data  
are exchanged between the LNBP21 and the  
main µP using logic levels that are compatible with  
both 3.3 and 5V mi-crocontrollers. This data  
exchange is made through two dedicated pins,  
DSQIN and DSQOUT, in or-der to maintain the  
timing relationships between the PWK data and  
the PWK modulation as accurate as possible.  
These two pins should be directly connected to  
two I/O pins of the µP, thus leaving to the resident  
firmware the task of encoding and decoding the  
ADDRESS PIN  
Connecting this pin to GND the Chip I2C interface  
address is 0001000, but, it is possible to choice  
among 4 different addresses simply setting this  
pin at 4 fixed voltage levels (see table on page  
10).  
ELECTRICAL CHARACTERISTICS FOR LNBP SERIES (T = 0 to 85°C, EN=1, LLC=0, TEN=0, ISEL=0,  
J
PCL=0, DSQIN=0, V =12V, I  
for I C access to the system register)  
=50mA, unless otherwise specified. See software description section  
IN  
OUT  
2
Symbol  
Parameter  
Supply Voltage  
Test Conditions  
Min.  
Typ.  
Max.  
15  
Unit  
V
V
I
= 500 mA TEN=VSEL=LLC=1  
8
IN  
O
V
LT1 Input Voltage  
Supply Current  
20  
V
LT1  
I
I
I
= 0mA TEN=VSEL=LLC=1 EN=1  
EN=0  
20  
2.5  
18  
19  
40  
5
mA  
mA  
V
IN  
O
V
Output Voltage  
= 500 mA VSEL=1  
LLC=0  
LLC=1  
17.3  
18.7  
O
O
V
8/20  
LNBP21  
Symbol  
Parameter  
Output Voltage  
Test Conditions  
= 500 mA VSEL=0  
O
Min.  
Typ.  
Max.  
Unit  
V
I
LLC=0  
12.5  
13  
14  
5
13.5  
V
O
LLC=1  
V
V  
Line Regulation  
V
=15 to 18V  
VSEL=0  
VSEL=1  
40  
60  
mV  
mV  
mV  
O
IN1  
5
V  
Load Regulation  
VSEL=0 or 1 I  
= 50 to 500mA  
200  
O
OUT  
I
Output Current Limiting  
ISEL=1  
ISEL=0  
ISEL=1  
ISEL=0  
400  
500  
550  
650  
mA  
mA  
mA  
mA  
ms  
MAX  
I
Output Short Circuit Current  
200  
300  
900  
SC  
t
Dynamic Overload  
protection OFF Time  
PCL=0  
PCL=0  
Output Shorted  
Output Shorted  
OFF  
t
Dynamic Overload  
protection ON Time  
t
/10  
ms  
ON  
OFF  
f
Tone Frequency  
TEN=1  
TEN=1  
TEN=1  
TEN=1  
20  
0.55  
40  
22  
24  
0.9  
60  
15  
KHz  
Vpp  
%
TONE  
A
Tone Amplitude  
0.72  
50  
10  
6
TONE  
D
Tone Duty Cycle  
TONE  
t , t  
Tone Rise and Fall Time  
External Modulation Gain  
5
µs  
r
f
G
V
V  
/V ,  
EXTM  
f = 10Hz to 40KHz  
EXTM  
EXTM  
OUT  
External Modulation Input  
Voltage  
AC Coupling  
400  
0.6  
mVpp  
Z
External Modulation  
Impedance  
f = 10Hz to 50KHz  
260  
0.35  
220  
EXTM  
V
Loopthrough Switch Voltage EN=0,  
Drop (lt1 to LT2)  
I
=300mA,  
V =12 or 19V  
MI  
V
LT  
LT  
f
DC/DC Converter Switch  
Frequency  
kHz  
kHz  
Vpp  
kΩ  
V
SW  
f
Tone Detector Frequency  
Capture Range  
0.4Vpp sinewave  
=22kHz sinewave  
18  
24  
DETIN  
V
Z
Tone Detector Input  
Amplitude  
f
0.2  
1.5  
DETIN  
DETIN  
IN  
Tone Detector Input  
Impedance  
150  
0.3  
V
Overload Flag Pin Logic  
LOW  
Tone present  
Tone absent  
I
=2mA  
0.5  
10  
OL  
OZ  
OL  
I
Overload Flag Pin OFF  
State Leakage Current  
V
= 6V  
µA  
V
OH  
V
DSQIN Input Pin Logic  
LOW  
0.8  
IL  
IH  
IH  
V
DSQIN Input Pin Logic  
HIGH  
2
V
I
DSQIN Pins Input Current  
Output Backward Current  
V
= 5V  
15  
-4  
µA  
mA  
°C  
IH  
I
EN=0  
V
= 18V  
OBK  
-10  
OBK  
T
Temperature Shutdown  
Threshold  
150  
SHDN  
T  
Temperature Shutdown  
Hysteresis  
15  
°C  
SHDN  
9/20  
LNBP21  
GATE AND SENSE ELECTRICAL CHARACTERISTICS (T = 0 to 85°C, V =12V)  
J
IN  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
4.5  
Max.  
Unit  
R
Gate LOW R  
I
I
=-100mA  
DSON-L  
DSON  
DSON  
GATE  
R
Gate LOW R  
=100mA  
4.5  
DSON-H  
GATE  
V
Current Limit Sense Voltage  
200  
mV  
SENSE  
2
I C ELECTRICAL CHARACTERISTICS (T = 0 to 85°C, V =12V)  
J
IN  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
LOW Level Input Voltage  
SDA, SCL  
0.8  
IL  
IH  
IH  
V
HIGH Level Input Voltage SDA, SCL  
2
V
I
Input Current  
SDA, SCL, V = 0.4 to 4.5v  
-10  
10  
µA  
V
IN  
V
DSQIN Input Pin Logic  
LOW  
SDA (open drain), I = 6mA  
0.6  
IL  
OL  
f
Maximum Clock Frequency SCL  
500  
KHz  
MAX  
ADDRESS PIN CHARACTERISTICS (T = 0 to 85°C, V =12V)  
J
IN  
Symbol  
Parameter  
Test Conditions  
Min.  
0
Typ.  
Max.  
0.7  
1.7  
2.7  
5
Unit  
V
V
"0001000" Addr Pin Voltage  
"0001001" Addr Pin Voltage  
"0001010" Addr Pin Voltage  
"0001011" Addr Pin Voltage  
ADDR-1  
V
1.3  
2.3  
3.3  
V
ADDR-2  
V
V
ADDR-3  
V
V
ADDR-4  
TEST CIRCUIT  
1N4001  
ILT  
VMI, VOBK  
Vup  
LT1  
A
10nF  
10nF  
STPS2L30A  
470nF  
STN4NF03L  
220µF  
V
LT  
V
Scope Probe  
Load  
Gate  
LT2  
, IOBK  
IO  
L1=22µH  
Sense  
Rsc  
0.1  
OUT  
A
IIN  
Vin  
LNBP21  
Vcc  
A
VOUT  
V
20µF  
220µF  
470nF  
EXTM  
SDA  
SCL  
SDA  
SCL  
From I C  
2
VEXTM, VDETIN  
10nF  
{
Master  
DETIN  
DSQIN  
BYP  
470nF  
A
DSQOUT  
Pulse Gen.  
OH  
V
OL  
/ I  
IOZ / IOL  
ADDRESS  
OL  
V
V
10/20  
LNBP21  
TYPICAL CHARACTERISTICS (unless otherwise specified T = 25°C)  
j
Figure 4 : Output Voltage vs Temperature  
Figure 5 : Output Voltage vs Temperature  
Figure 6 : Line Regulation vs Temperature  
Figure 7 : Line Regulation vs Temperature  
Figure 8 : Load Regulation vs Temperature  
Figure 9 : Load Regulation vs Temperature  
11/20  
LNBP21  
Figure 10 : Supply Current vs Temperature  
Figure 13 : Dynamic Overload Protection OFF  
Time vs Temperature  
Figure 11 : Supply Current vs Temperature  
Figure 14 : Output Current Limiting vs  
Temperature  
Figure 12 : Dynamic Overload Protection ON  
Figure 15 : Output Current Limiting vs  
Time vs Temperature  
Temperature  
12/20  
LNBP21  
Figure 16 : Tone Frequency vs Temperature  
Figure 17 : Tone Amplitude vs Temperature  
Figure 18 : Tone Duty Cicle vs Temperature  
Figure 19 : Tone Rise Time vs Temperature  
Figure 20 : Tone Fall Time vs Temperature  
Figure 21 : Loopthrought Switch Drop Voltage vs  
Temperature  
13/20  
LNBP21  
Figure 22 : Loopthrought Switch Drop Voltage vs  
Figure 25 : DSQOUT Pin Logic Low vs  
Temperature  
Temperature  
Figure 23 : Loopthrought Switch Drop Voltage vs  
Figure 26 : Undervoltage Lockout Threshold vs  
Loopthrought Current  
Temperature  
Figure 24 : Loopthrought Switch Drop Voltage vs  
Figure 27 : Output Backward Current vs  
Loopthrought Current  
Temperature  
14/20  
LNBP21  
Figure 28 : DC/DC Converter Efficiency vs  
Temperature  
Figure 31 : DSQIN Tone Enable Transient  
Response  
V
=12V, I =50mA, EN=1, TEN=0  
O
CC  
Figure 29 : Current Limit Sense vs Temperature  
Figure 32 : DSQIN Tone Enable Transient  
Response  
V
=12V, I =50mA, EN=1, TEN=0  
O
CC  
Figure 30 : 22kHz Tone  
Figure 33 : DSQIN Tone Disable Transient  
Response  
V
CC  
=12V, I =50mA, EN=TEN=1  
V =12V, I =50mA, EN=1, TEN=0  
CC O  
O
15/20  
LNBP21  
Figure 34 : Output Voltage Transient Response  
Figure 35 : Output Voltage Transient Response  
from 13V to 18V  
from 13V to 18V  
V
=12V, I =50mA, VSEL=from 0 to 1, EN=1  
V
=12V, I =50mA, VSEL=from 1 to 0, EN=1  
CC  
O
CC O  
TERMAL DESIGN NOTES  
During normal operation, this device dissipates  
some power. At maximum rated output current  
(500mA), the voltage drop on the linear regulator  
lead to a total dissipated power that is of about  
1.7W. The heat generated requires a suitable  
heatsink to keep the junction temperature below  
body. This area can be the inner GND layer of a  
multi-layer PCB, or, in a dual layer PCB, an  
unbroken GND area even on the opposite side  
where the IC is placed. In both cases, the thermal  
path between the IC GND pins and the dissipating  
copper area must exhibit a low thermal resistance.  
the  
Assuming  
overtemperature  
protection  
threshold.  
In figure 4 , it is shown a suggested layout for the  
SO-20 package with a dual layer PCB, where the  
IC Ground pins and the square dissipating area  
are thermally connected through 32 vias holes,  
a
40°C temperature inside the  
Set-Top-Box case, the total Rthj-amb has to be  
less than 50°C/W.  
filled by solder.  
L=50mm, achieves an Rthc-a of about 25°C/W.  
This arrangement, when  
While this can be easily achieved using a  
through-hole power package that can be attached  
to a small heatsink or to the metallic frame of the  
receiver, a surface mount power package must  
rely on PCB solutions whose thermal efficiency is  
often limited. The simplest solution is to use a  
large, con-tinuous copper area of the GND layer to  
dissipate the heat coming from the IC body.  
Different layouts are possible, too. Basic  
principles, however, suggest to keep the IC and its  
ground pins approximately in the middle of the  
dissipating area; to provide as many vias as  
possible; to de-sign a dissipating area having a  
shape as square as possible and not interrupted  
by other copper traces.  
The SO-20 package of this IC has 4 GND pins that  
are not just intended for electrical GND  
connec-tion, but also to provide a low thermal  
resistance path between the silicon chip and the  
PCB heatsink. Given an Rthj-c equal to 15°C/W,  
a maximum of 35°C/W are left to the PCB  
heatsink. This figure is achieved if a minimum of  
25cm2 copper area is placed just below the IC  
Due to presence of an exposed pad connected to  
GND below the IC body, the PowerSO-20  
package has a Rthj-c much lower than the SO-20,  
only 2°C/W. As a result, much lower copper area  
must be provided to dissipate the same power and  
minimum of 12cm2 copper area is enough, see  
figure 5.  
16/20  
LNBP21  
Figure 36 : SO-20 SUGGESTED PCB HEATSINK LAYOUT  
Figure 37 : PowerSO-20 SUGGESTED PCB HEATSINK LAYOUT  
17/20  
LNBP21  
SO-20 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
MAX.  
2.65  
0.2  
MIN.  
MAX.  
0.104  
0.008  
0.096  
0.019  
0.012  
A
a1  
a2  
b
0.1  
0.004  
2.45  
0.49  
0.32  
0.35  
0.23  
0.014  
0.009  
b1  
C
0.5  
0.020  
c1  
D
45˚ (typ.)  
12.60  
10.00  
13.00  
10.65  
0.496  
0.393  
0.512  
0.419  
E
e
1.27  
0.050  
0.450  
e3  
F
11.43  
7.40  
0.50  
7.60  
1.27  
0.75  
0.291  
0.020  
0.300  
0.050  
0.029  
L
M
S
˚ (max.)  
8
PO13L  
18/20  
LNBP21  
PowerSO-20 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
MAX.  
3.60  
0.30  
3.30  
0.10  
0.53  
0.32  
16.00  
MIN.  
MAX.  
0.1417  
0.0118  
0.1299  
0.0039  
0.0209  
0.0013  
0.630  
A
a1  
a2  
a3  
b
0.10  
0.0039  
0
0
0.40  
0.23  
15.80  
13.90  
0.0157  
0.0090  
0.6220  
0.5472  
c
D (1)  
E
14.50  
0.5710  
e
1.27  
0.0500  
0.4500  
e3  
E1 (1)  
E2  
G
11.43  
10.90  
0
11.10  
2.90  
0.10  
1.10  
1.10  
0.4291  
0.0000  
0.0314  
0˚  
0.4370  
0.1141  
0.0039  
0.0433  
0.0433  
10˚  
h
L
0.80  
0˚  
N
0˚  
1
S
8˚  
8˚  
T
10.0  
0.3937  
(1) “D and E1” do not include mold flash or protusions - Mold flash or protusions shall not exceed 0.15mm (0.006”)  
R
N
N
a2  
A
c
a1  
b
e
DETAILB  
DETAILA  
D
E
e3  
DETAILA  
leda  
20  
11  
slug  
a3  
DETAILB  
0.35  
E2  
E1  
GagePlaen  
T
-C-  
SEATING PLANE  
S
L
G
C
(COPLANARITY)  
1
1
0
PSO20MEC  
hx45˚  
0056635  
19/20  
LNBP21  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
20/20  

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