LSM303DTR [STMICROELECTRONICS]
e-Compass: 3D accelerometer, 3D magnetometer, ultra compact, high performance, I2C, SPI interfaces;型号: | LSM303DTR |
厂家: | ST |
描述: | e-Compass: 3D accelerometer, 3D magnetometer, ultra compact, high performance, I2C, SPI interfaces |
文件: | 总52页 (文件大小:1228K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LSM303D
Ultra-compact high-performance eCompass module:
3D accelerometer and 3D magnetometer
Datasheet - production data
Display orientation
Gaming and virtual reality input devices
Impact recognition and logging
Vibration monitoring and compensation
Description
LGA-16 (3x3x1 mm)
The LSM303D is a system-in-package featuring a
3D digital linear acceleration sensor and a 3D
digital magnetic sensor.
The LSM303D has linear acceleration full scales
of ±2g / ±4g / ±6g / ±8g / ±16g and a magnetic
field full scale of ±2 / ±4 / ±8 / ±12 gauss.
Features
3 magnetic field channels and 3 acceleration
channels
2
The LSM303D includes an I C serial bus
±2/±4/±8/±12 gauss magnetic full scale
±2/±4/±6/±8/±16 g linear acceleration full scale
16-bit data output
interface that supports standard and fast mode
(100 kHz and 400 kHz) and SPI serial standard
interface.
2
The system can be configured to generate an
interrupt signal for free-fall, motion detection and
magnetic field detection. Thresholds and timing of
interrupt generators are programmable by the end
user.
SPI / I C serial interfaces
Analog supply voltage 2.16 V to 3.6 V
Power-down mode / low-power mode
Programmable interrupt generators for free-
fall, motion detection and magnetic field
detection
Magnetic and accelerometer blocks can be
enabled or put into power-down mode separately.
Embedded temperature sensor
Embedded FIFO
The LSM303D is available in a plastic land grid
array package (LGA) and is guaranteed to
operate over an extended temperature range
from -40 °C to +85 °C.
®
ECOPACK , RoHS and “Green” compliant
Applications
Table 1. Device summary
Temperature
Tilt-compensated compasses
Map rotation
Part number
Package Packaging
range [°C]
Position detection
LSM303D
-40 to +85
LGA-16
LGA-16
Tray
Motion-activated functions
Free-fall detection
Tape and
reel
LSM303DTR
-40 to +85
Click/double-click recognition
Pedometers
Intelligent power saving for handheld devices
November 2013
DocID023312 Rev 2
1/52
This is information on a product in full production.
www.st.com
Contents
LSM303D
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1
1.2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2
Module specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
2.2
2.3
2.4
Sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1
2.4.2
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2
Sensor I C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1
3.2
Set/reset pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2.1
3.2.2
Linear acceleration sensor sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Magnetic sensor sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3
3.4
Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Zero-gauss level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4
5
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1
4.2
4.3
4.4
Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1
5.2
5.3
5.4
External capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Pull-up resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Digital Interface power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/52
DocID023312 Rev 2
LSM303D
Contents
5.5
High-current wiring effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6
Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2
6.1
I C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2
6.1.1
I C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.2
SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.2.1
6.2.2
6.2.3
SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7
8
Output register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
TEMP_OUT_L (05h), TEMP_OUT_H (06h) . . . . . . . . . . . . . . . . . . . . . . . 30
STATUS_M (07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
OUT_X_L_M (08h), OUT_X_H_M (09h) . . . . . . . . . . . . . . . . . . . . . . . . . 31
OUT_Y_L_M (0Ah), OUT_Y_H_M (0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . 31
OUT_Z_L_M (0Ch), OUT_Z_H_M (0Dh) . . . . . . . . . . . . . . . . . . . . . . . . . 31
WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
INT_CTRL_M (12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
INT_SRC_M (13h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
INT_THS_L_M (14h), INT_THS_H_M (15h) . . . . . . . . . . . . . . . . . . . . . . 32
8.10 OFFSET_X_L_M (16h), OFFSET_X_H_M (17h) . . . . . . . . . . . . . . . . . . . 33
8.11 OFFSET_Y_L_M (18h), OFFSET_Y_H_M (19h) . . . . . . . . . . . . . . . . . . . 33
8.12 OFFSET_Z_L_M (1Ah), OFFSET_Z_H_M (1Bh) . . . . . . . . . . . . . . . . . . 33
8.13 REFERENCE_X (1Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.14 REFERENCE_Y (1Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.15 REFERENCE_Z (1Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.16 CTRL0 (1Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.17 CTRL1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.18 CTRL2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.19 CTRL3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.20 CTRL4 (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.21 CTRL5 (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
DocID023312 Rev 2
3/52
52
Contents
LSM303D
8.22 CTRL6 (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.23 CTRL7 (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.24 STATUS_A (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8.25 OUT_X_L_A (28h), OUT_X_H_A (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.26 OUT_Y_L_A (2Ah), OUT_Y_H_A (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.27 OUT_Z_L_A (2Ch), OUT_Z_H_A (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.28 FIFO_CTRL (2Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.29 FIFO_SRC (2Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.30 IG_CFG1 (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.31 IG_SRC1 (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.32 IG_THS1 (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.33 IG_DUR1 (33h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.34 IG_CFG2 (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
8.35 IG_SRC2 (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.36 IG_THS2 (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.37 IG_DUR2 (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.38 CLICK_CFG (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.39 CLICK_SRC (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
8.40 CLICK_THS (3Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
8.41 TIME_LIMIT (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
8.42 TIME_LATENCY (3Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.43 TIME WINDOW (3Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.44 ACT_THS (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.45 ACT_DUR (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
9
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
10
4/52
DocID023312 Rev 2
LSM303D
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Sensor characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2
I C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8.
Table 9.
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
I C terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
SAD+read/write patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Transfer when master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Transfer when master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 23
Transfer when master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 23
Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
STATUS_M register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
STATUS_M register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
WHO_AM_I register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
INT_CTRL_M register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
INT_CTRL_M register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
INT_SRC_M register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
INT_SRC_M register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
INT_THS_L_M register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
INT_THS_H_M register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
OFFSET_X_L_M register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
OFFSET_X_H_M register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
OFFSET_Y_L_M register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
OFFSET_Y_H_M register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
OFFSET_Z_L_M register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
OFFSET_Z_H_M register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
CTRL0 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL0 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Acceleration data rate configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
CTRL2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
CTRL2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Acceleration anti-alias filter bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Acceleration full-scale selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL3 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL3 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL4 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
CTRL4 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
CTRL5 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
CTRL5 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Magnetic data rate configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CTRL6 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
DocID023312 Rev 2
5/52
52
List of tables
LSM303D
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
Table 86.
Table 87.
Table 88.
Table 89.
Table 90.
Table 91.
Table 92.
Table 93.
Table 94.
Table 95.
Table 96.
Table 97.
CTRL6 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Magnetic full-scale selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CTRL7 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CTRL7 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
High-pass filter mode selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Magnetic sensor mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STATUS_A register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STATUS_A register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
FIFO_CTRL register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
FIFO_CTRL register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
FIFO mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
FIFO_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
FIFO_SRC register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_CFG1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
IG_CFG1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
IG_SRC1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
IG_SRC1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
IG_THS1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
IG_THS1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
IG1_DUR1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
IG1_DUR1 register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
IG_CFG2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
IG_CFG2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
IG_SRC2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
IG_SRC2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
IG2_THS2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
IG2_THS2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
IG_DUR2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
IG_DUR2 register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
CLICK_CFG register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
CLICK_CFG register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
CLICK_SRC register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
CLICK_SRC register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
CLICK_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
CLICK_THS register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
TIME_LIMIT register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
TIME_LIMIT register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
TIME_LATENCY register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
TIME_LATENCY register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
TIME_WINDOW register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
TIME_WINDOW register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_THS register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_THS register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_DUR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_DUR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
LGA 3x3x1.0 16L mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
6/52
DocID023312 Rev 2
LSM303D
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2
I C slave timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
LSM303D electrical connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Multiple byte SPI read protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 10. Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11. SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 12. LGA 3x3x1.0 16L mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
DocID023312 Rev 2
7/52
52
Block diagram and pin description
LSM303D
1
Block diagram and pin description
1.1
Block diagram
Figure 1. Block diagram
Sensing Block
Sensing Interface
Control
Logic
A/D
converter
X+
Y+
Z+
CHARGE
AMPLIFIER
I (a)
+
-
MUX
CS
SCL/SPC
Z-
Y-
SDA/SDI/SDO
X-
SDO/SA0
INT1
X+
CHARGE
AMPLIFIER
Y+
Z+
INT2
I (M)
+
-
MUX
Z-
Y-
X-
TRIMMING
REFERENCE
CLOCK
INTERRUPT GEN.
CIRCUITS
BUILT-IN
OFFSET
CIRCUITS
TEMPERATURE
SENSOR
SET/RESET
FIFO
CIRCUITS
AM12676V1
1.2
Pin description
Figure 2. Pin connections
Z
X
Pin 1 indicator
1
DIRECTION OF
DETECTABLE
ACCELERATIONS
13
9
Y
TOP VIEW
5
Z
1
X
(BOTTOM VIEW)
DIRECTION OF
DETECTABLE
MAGNETIC FIELDS
Y
TOP VIEW
AM12677V1
8/52
DocID023312 Rev 2
LSM303D
Block diagram and pin description
Table 2. Pin description
Pin#
Name
Function
1
2
3
Vdd_IO
SETC
SETP
Power supply for I/O pins
S/R capacitor connection (C2)
S/R capacitor connection (C2)
SCL
SPC
I2C serial clock (SCL)
4
5
SPI serial port clock (SPC)
GND
0 V supply
SDA
SDI
I2C serial data (SDA)
6
7
8
SPI serial data input (SDI)
SDO
3-wire interface serial data output (SDO)
SDO
SA0
SPI serial data output (SDO)
I2C less significant bit of the device address (SA0)
SPI enable
I2C/SPI mode selection (1: SPI idle mode / I2C communication
CS
enabled; 0: SPI communication mode / I2C disabled)
9
INT 2
Reserved
INT 1
GND
Interrupt 2
10
11
12
13
14
15
16
Connect to GND
Interrupt 1
0 V supply
GND
0 V supply
Vdd
Power supply
Capacitor connection (C1)
0 V supply
C1
GND
DocID023312 Rev 2
9/52
52
Module specifications
LSM303D
2
Module specifications
2.1
Sensor characteristics
(a)
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted
.
Table 3. Sensor characteristics
Test conditions
Symbol
Parameter
Min. Typ.(1) Max.
Unit
±2
±4
Linear acceleration
measurement range(2)
LA_FS
M_FS
LA_So
M_So
±6
g
±8
±16
±2
±4
Magnetic measurement range
Linear acceleration sensitivity
Magnetic sensitivity
gauss
±8
±12
Linear acceleration FS = ±2 g
Linear acceleration FS = ±4 g
Linear acceleration FS = ±6 g
Linear acceleration FS = ±8 g
Linear acceleration FS = ±16 g
Magnetic FS = ±2 gauss
0.061
0.122
0.183
0.244
0.732
0.080
0.160
0.320
0.479
mg/LSB
Magnetic FS = ±4 gauss
mgauss/
LSB
Magnetic FS = ±8 gauss
Magnetic FS = ±12 gauss
Linear acceleration sensitivity
change vs. temperature
LA_TCSo
M_TCSo
LA_TyOff
LA_TCOff
LA_An
±0.01
±0.05
±60
%/°C
%/°C
mg
Magnetic sensitivity change vs.
temperature
Linear acceleration typical zero-
g level offset accuracy(3),(4)
Linear acceleration zero-g level
change vs. temperature
Max delta from 25 °C
±0.5
150
mg/°C
Linear acceleration FS = 2g;
ODR = 100 Hz
Linear acceleration noise density
Magnetic noise density
ug Hz
Magnetic FS = 2 gauss;
LR setting
mgauss/
RMS
M_R
5
CTRL5 (M_RES [1,0]) = 00b
a. The product is factory calibrated at 2.5 V. The operational power supply range is from 2.16 V to 3.6 V.
DocID023312 Rev 2
10/52
LSM303D
Module specifications
Table 3. Sensor characteristics (continued)
Symbol
Parameter
Test conditions
Min. Typ.(1) Max.
Unit
Cross field = 0.5 gauss
Applied = ±3 gauss
%FS/
gauss
M_CAS
Magnetic cross-axis sensitivity
Maximum exposed field
±1
No permanent effect on sensor
performance
M_EF
M_DF
10000
20
gauss
gauss
Sensitivity starts to degrade.
Automatic S/R pulse restores
the sensitivity(5)
Magnetic disturbance field
±2 g range, X-, Y-axis
AST = 1 see Table 37
70
1700
Linear acceleration self-test
positive difference(6)
LA_ST
Top
mg
±2 g range, Z-axis
70
1700
+85
AST = 1 see Table 37
Operating temperature range
-40
°C
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high-pass filter.
5. Set/reset pulse is automatically applied at each conversion cycle.
6. “Self-test output change” is defined as: OUTPUT[mg](CTRL2 AST bit =1) - OUTPUT[mg] CTRL2 AST bit =0
.
)
(
2.2
Temperature sensor characteristics
(b)
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted
.
Table 4. Temperature sensor characteristics
Symbol
Parameter
Test conditions
Min.
Typ.(1)
Max.
Unit
Temperature sensor output
change vs. temperature
TSDr
8
LSB/°C
-
M_ODR
[2:0](2)
TODR
Top
Temperature refresh rate
Hz
°C
Operating temperature range
-40
+85
1. Typical specifications are not guaranteed.
2. Refer to Table 47: Magnetic data rate configuration.
b. The product is factory calibrated at 2.5 V.
DocID023312 Rev 2
11/52
52
Module specifications
LSM303D
2.3
Electrical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted.
Table 5. Electrical characteristics
Test
Symbol
Parameter
Supply voltage
Min.
Typ.(1)
Max.
Unit
conditions
Vdd
2.16
1.71
3.6
V
Vdd_IO
Module power supply for I/O
1.8
Vdd+0.1
LR setting
eCompass(2) current consumption
in normal mode(3)
CTRL5(M_RES
[1,0]) = 00b, see
Table 45
Idd
300
μA
Current consumption in
power-down mode(4)
IddSL
Top
1
μA
Operating temperature range
-40
+85
°C
1. Typical specifications are not guaranteed.
2. eCompass: accelerometer and magnetic sensor.
3. Magnetic sensor setting ODR = 6.25 Hz, accelerometer sensor ODR = 50 Hz and magnetic high-resolution setting.
4. Linear accelerometer and magnetic sensor in power-down mode.
12/52
DocID023312 Rev 2
LSM303D
Module specifications
2.4
Communication interface characteristics
2.4.1
SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 6. SPI slave timing values
Value (1)
Symbol
Parameter
Unit
Min.
Max.
tc(SPC)
SPI clock cycle
100
ns
fc(SPC)
tsu(CS)
th(CS)
tsu(SI)
th(SI)
SPI clock frequency
CS setup time
10
MHz
5
20
5
CS hold time
SDI input setup time
SDI input hold time
15
ns
tv(SO)
th(SO)
tdis(SO)
SDO valid output time
SDO output hold time
SDO output disable time
50
50
5
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
Figure 3. SPI slave timing diagram
CS
t
c(SPC)
t
su(CS)
t
h(CS)
SPC
SDI
t
su(SI)
t
h(SI)
LSB IN
MSB IN
t
t
v(SO)
t
h(SO)
dis(SO)
MSB OUT
LSB OUT
SDO
Note:
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO for both input and output
ports.
DocID023312 Rev 2
13/52
52
Module specifications
LSM303D
2
2.4.2
Sensor I C - inter-IC control interface
Subject to general operating conditions for Vdd and Top.
2
Table 7. I C slave timing values
I2C standard mode (1)
Parameter
I2C fast mode (1)
Min. Max.
Symbol
Unit
Min.
Max.
f(SCL)
tw(SCLL)
tw(SCLH)
tsu(SDA)
th(SDA)
SCL clock frequency
SCL clock low time
SCL clock high time
SDA setup time
0
100
0
1.3
400
kHz
4.7
4.0
250
0
μs
0.6
100
ns
SDA data hold time
SDA and SCL rise time
3.45
1000
300
0
0.9
300
300
μs
(2)
(2)
tr(SDA) r(SCL)
t
20 + 0.1Cb
20 + 0.1Cb
0.6
ns
t
f(SDA) tf(SCL) SDA and SCL fall time
th(ST)
tsu(SR)
START condition hold time
4
Repeated START condition
setup time
4.7
4
0.6
0.6
1.3
μs
tsu(SP)
STOP condition setup time
Bus free time between STOP
and START condition
tw(SP:SR)
4.7
2
1. Data based on standard I C protocol requirement, not tested in production.
2. C = total capacitance of one bus line, in pF.
b
2
Figure 4. I C slave timing diagram
REPEATED
START
START
t
su(SR)
START
t
w(SP:SR)
SDA
SCL
t
su(SDA)
t
h(SDA)
t
f(SDA)
t
r(SDA)
STOP
t
su(SP)
t
h(ST)
t
w(SCLL)
t
t
r(SCL)
t
f(SCL)
w(SCLH)
Note:
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO for both ports.
14/52
DocID023312 Rev 2
LSM303D
Module specifications
2.5
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8. Absolute maximum ratings
Symbol
Ratings
Maximum value
Unit
Vdd
Supply voltage
-0.3 to 4.8
-0.3 to 4.8
V
V
Vdd_IO
I/O pins supply voltage
Input voltage on any control pin (SCL/SPC,
SDA/SDI/SDO, SDO/SA0, CS)
Vin
-0.3 to Vdd_IO +0.3
V
3,000 for 0.5 ms
10,000 for 0.1 ms
3,000 for 0.5 ms
10,000 for 0.1 ms
-40 to +85
g
g
APOW
Acceleration (any axis, powered, Vdd = 2.5 V)
Acceleration (any axis, unpowered)
g
AUNP
g
TOP
TSTG
ESD
Operating temperature range
Storage temperature range
°C
°C
kV
-40 to +125
Electrostatic discharge protection
2 (HBM)
Note:
Supply voltage on any pin should never exceed 4.8 V.
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can
cause permanent damage to the part.
DocID023312 Rev 2
15/52
52
Terminology
LSM303D
3
Terminology
3.1
Set/reset pulse
The set/reset pulse is an automatic operation performed before each magnetic acquisition
cycle to recover the initial magnetization state of the sensor and therefore the linearity of the
sensor itself.
3.2
Sensitivity
3.2.1
Linear acceleration sensor sensitivity
Sensitivity describes the gain of the sensor and can be determined, for example, by
applying 1 g acceleration to it. As the sensor can measure DC accelerations this can be
done easily by pointing the axis of interest towards the center of the Earth, noting the output
value, rotating the sensor by 180 degrees (pointing to the sky) and noting the output value
again. By doing so, ±1 g acceleration is applied to the sensor. Subtracting the larger output
value from the smaller one, and dividing the result by 2, leads to the actual sensitivity of the
sensor. This value changes very little over temperature and time. The sensitivity tolerance
describes the range of sensitivities of a large population of sensors.
3.2.2
Magnetic sensor sensitivity
Sensitivity describes the gain of the sensor and can be determined, for example, by
applying a magnetic field of 1 gauss to it.
3.3
Zero-g level
Zero-g level offset (TyOff) describes the deviation of an actual output signal from the ideal
output signal if no acceleration is present. A sensor in a steady-state on a horizontal surface
measures 0 g on the X-axis and 0 g on the Y-axis, whereas the Z-axis measures 1 g. The
output is ideally in the middle of the dynamic range of the sensor (content of OUT registers
00h, data expressed as two’s complement). A deviation from the ideal value in this case is
called Zero-g offset. Offset is, to some extent, a result of stress to MEMS sensor and
therefore the offset can slightly change after mounting the sensor onto a printed circuit
board or exposing it to extensive mechanical stress. Offset changes little over temperature,
see “Zero-g level change vs. temperature”. The Zero-g level tolerance (TyOff) describes the
standard deviation of the range of Zero-g levels of a population of sensors.
3.4
Zero-gauss level
Zero-gauss level offset describes the deviation of an actual output signal from the ideal
output if no magnetic field is present. Thanks to the set/reset pulse and to the magnetic
sensor read-out chain, the offset is dynamically cancelled. The Zero-gauss level does not
show any dependencies on temperature and power supply.
16/52
DocID023312 Rev 2
LSM303D
Functionality
4
Functionality
4.1
Self-test
The self-test allows checking the linear acceleration sensor functionality without moving the
sensor. The self-test function is off when the self-test bit (AST) is programmed to ‘0‘. When
the self-test bit is programmed to ‘1’, an actuation force is applied to the sensor, simulating a
definite input acceleration. In this case the sensor outputs exhibit a change in their DC
levels which are related to the selected full scale through the device sensitivity. When the
self-test is activated, the device output level is given by the algebraic sum of the signals
produced by the acceleration acting on the sensor and by the electrostatic test-force. If the
output signals change within the amplitude specified inside Section 2.1, then the sensor is
working properly and the parameters of the interface chip are within the defined
specifications.
4.2
Temperature sensor
The LSM303D features an internal temperature sensor. Temperature data can be enabled
by setting the TEMP_EN bit on the CTRL5 (24h) register to 1.
Both the TEMP_OUT_H and TEMP_OUT_L registers must be read.
Temperature data is stored inside TEMP_OUT_L (05h), TEMP_OUT_H (06h) as two’s
complement data in 12-bit format, right-justified.
The output data rate of the temperature sensor is set by M_ODR [2:0] in CTRL5 (24h) and is
equal to the magnetic sensor output data rate.
4.3
FIFO
The LSM303D embeds an acceleration data FIFO for each of the three output channels, X,
Y and Z. This allows consistent power saving for the system, as the host processor does not
need to continuously poll data from the sensor, but it can wake up only when needed and
burst the significant data out from the FIFO. This buffer can work according to four different
modes: Bypass mode, FIFO mode, Stream mode and Stream-to-FIFO mode. Each mode is
selected by the FIFO_MODE bits. Programmable threshold level, FIFO_empty or FIFO_Full
events can be enabled to generate dedicated interrupts on the INT 1 or INT 2 pin.
Bypass mode
In Bypass mode, the FIFO is not operational and for this reason it remains empty. As
described in Figure 5, for each channel only the first address is used. The remaining FIFO
slots are empty.
FIFO mode
In FIFO mode, data from X, Y and Z channels are stored in the FIFO. A FIFO threshold
interrupt can be enabled in order to be raised when the FIFO is filled to the level specified by
the internal register. The FIFO continues filling until it is full. When full, the FIFO stops
collecting data from the input channels.
DocID023312 Rev 2
17/52
52
Functionality
LSM303D
Stream mode
In Stream mode, data from X, Y and Z measurements are stored in the FIFO. A FIFO
threshold interrupt can be enabled and set as in FIFO mode.The FIFO continues filling until
it’s full. When full, the FIFO discards the older data as the new arrive.
Stream-to-FIFO mode
In Stream-to-FIFO mode, data from X, Y and Z measurements are stored in the FIFO. A
FIFO threshold interrupt can be enabled in order to be raised when the FIFO is filled to the
level specified by the internal register. The FIFO continues filling until it’s full. When full, the
FIFO discards the older data as the new arrive. Once a trigger event occurs, the FIFO starts
operating in FIFO mode.
Bypass-to-Stream mode
In Bypass-to-Stream mode, the FIFO starts operating in Bypass mode and once a trigger
event occurs (related to IG_CFG1 (30h) register events), the FIFO starts operating in
Stream mode.
Retrieving data from FIFO
FIFO data is read from the OUT_X_A, OUT_Y_A and OUT_Z_A registers. When the FIFO
is in Stream, Stream-to-FIFO, Bypass-to-Stream or FIFO mode, a read operation to the
OUT_X_A, OUT_Y_A or OUT_Z_A registers provides the data stored in the FIFO. Each
time data is read from the FIFO, the oldest X, Y and Z data are placed in the OUT_X_A,
OUT_Y_A and OUT_Z_A registers and both single read and read_burst operations can be
used.
4.4
Factory calibration
The IC interface is factory calibrated. The trim values are stored inside the device in
nonvolatile memory. Anytime the device is turned on, the trimming parameters are
downloaded into the registers to be used during normal operation. This allows the user to
use the device without further calibration.
18/52
DocID023312 Rev 2
LSM303D
Application hints
5
Application hints
Figure 5. LSM303D electrical connections
Vdd
C1= 4.7µF
14
16
C3= 10µF
Vdd_IO
1
5
13
9
C2=0.22µF
TOP VIEW
INT 1
C4 = 100nF
INT 2
6
8
GND
Digital signal from/to signal controller. Signal levels are defined by proper selection of Vdd_IO
AM12678V1
5.1
External capacitors
The C and C external capacitors should be low SR value ceramic type construction (typ.
1
2
recommended value 200 m). Reservoir capacitor C is nominally 4.7 μF in capacitance,
1
with the set/reset capacitor C nominally 0.22 μF in capacitance.
2
The device core is supplied through the Vdd line. Power supply decoupling capacitors
(C = 100 nF ceramic, C = 10 μF Al) should be placed as near as possible to the supply pin
4
3
of the device (common design practice). All the voltage and ground supplies must be
present at the same time to have proper behavior of the IC (refer to Figure 5).
The functionality of the device and the measured acceleration/magnetic field data is
2
selectable and accessible through the I C/SPI interfaces.
The functions, the threshold and the timing of the two interrupt pins (INT 1 and INT 2) can be
2
completely programmed by the user through the I C/SPI interfaces.
5.2
Pull-up resistors
2
If an I C interface is used, pull-up resistors (recommended value 10 k) must be placed on
2
the two I C bus lines.
DocID023312 Rev 2
19/52
52
Application hints
LSM303D
5.3
Digital Interface power supply
This digital interface, dedicated to the linear acceleration and to the magnetic field signal, is
capable of operating with a standard power supply (Vdd) or using a dedicated power supply
(Vdd_IO).
5.4
Soldering information
®
The LGA package is compliant with ECOPACK , RoHS and “Green” standards.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
5.5
High-current wiring effects
High current in wiring and printed circuit traces can be the cause of errors in magnetic field
measurements for compassing.
Conductor-generated magnetic fields add to the Earth’s magnetic field creating errors in
compass heading computations.
Keep currents higher than 10 mA a few millimeters further away from the sensor IC.
20/52
DocID023312 Rev 2
LSM303D
Digital interfaces
6
Digital interfaces
2
The registers embedded in the LSM303D may be accessed through both the I C and SPI
serial interfaces. The latter may be SW-configured to operate either in 3-wire or 4-wire
interface mode.
2
The serial interfaces are mapped onto the same pins. To select/exploit the I C interface, the
CS line must be tied high (i.e connected to Vdd_IO).
Table 9. Serial interface pin description
Pin name
Pin description
I2C/SPI mode selection (1: SPI idle mode / I2C communication enabled; 0: SPI
communication mode / I2C disabled)
CS
I2C serial clock (SCL)
SCL/SPC
SDA/SDI/SDO
SDO/SA0
SPI serial port clock (SPC)
I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
SPI serial data output (SDO)
I2C less significant bit of the device address (SA0)
6.1
I2C serial interface
2
2
The LSM303D I C is a bus slave. The I C is employed to write data into registers whose
content can also be read back.
2
The relevant I C terminology is given in the table below.
2
Table 10. I C terminology
Term
Description
The device which sends data to the bus
Transmitter
Receiver
The device which receives data from the bus
The device which initiates a transfer, generates clock signals and terminates a
transfer
Master
Slave
The device addressed by the master
2
There are two signals associated with the I C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bi-directional line used for sending and receiving the data
to/from the interface. Both lines must be connected to Vdd_IO through external pull-up
resistors. When the bus is free, both lines are high.
2
2
The I C interface is compliant with fast mode (400 kHz) I C standards as well as with
normal mode.
DocID023312 Rev 2
21/52
52
Digital interfaces
2
LSM303D
6.1.1
I C operation
The transaction on the bus is started through a START (ST) signal. A START condition is
defined as a high-to-low transition on the data line while the SCL line is held high. After this
has been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the START condition contains the address of the slave in the first 7 bits and
the eighth bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a START condition with its address. If they match, the device considers itself
addressed by the master.
The slave address (SAD) associated to the LSM303D is 00111xxb, whereas the xx bits are
modified by the SDO/SA0 pin in order to modify the device address. If the SDO/SA0 pin is
connected to the voltage supply, the address is 0011101b, otherwise, if the SDO/SA0 pin is
connected to ground, the address is 0011110b. This solution permits the connection and
2
addressing of two different accelerometers to the same I C lines.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line low so that it
remains stable low during the high period of the acknowledge clock pulse. A receiver which
has been addressed is obliged to generate an acknowledge after each byte of data
received.
2
The I C embedded in the LSM303D behaves as a slave device and the following protocol
must be adhered to. After the START condition (ST) a slave address is sent, once a slave
acknowledge (SAK) has been returned, an 8-bit sub-address is transmitted: the 7 LSb
represent the actual register address while the MSb enables address auto-increment. If the
MSb of the SUB field is 1, the SUB (register address) is automatically incremented to allow
multiple data read/write.
The slave address is completed with a read/write bit. If the bit is ‘1’ (read), a repeated
START (SR) condition must be issued after the two sub-address bytes; if the bit is ‘0’ (write)
the master transmits to the slave with direction unchanged. Table 11 explains how the
SAD+read/write bit pattern is composed, listing all the possible configurations.
Table 11. SAD+read/write patterns
Command
SDO/SA0 pin
SAD[6:2]
SAD[1:0]
R/W
SAD+R/W
Read
Write
Read
Write
0
0
1
1
00111
00111
00111
00111
10
10
01
01
1
0
1
0
3D
3C
3B
3A
Table 12. Transfer when master is writing one byte to slave
Master
Slave
ST
SAD + W
SUB
DATA
SP
SAK
SAK
SAK
22/52
DocID023312 Rev 2
LSM303D
Digital interfaces
Table 13. Transfer when master is writing multiple bytes to slave
Master
Slave
ST
SAD + W
SUB
DATA
DATA
SP
SAK
SAK
SAK
SAK
Table 14. Transfer when master is receiving (reading) one byte of data from slave
Master
Slave
ST
SAD + W
SUB
SR
SAD + R
NMAK
SP
SAK
SAK
SAK
DATA
Table 15. Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+W
Slave
SUB
SR SAD+R
MAK
MAK
NMAK SP
SAK
SAK
SAK DATA
DATA
DATA
Data is transmitted in byte format (DATA). Each data transfer contains 8 bits. The number of
bytes sent per transfer is unlimited. Data is transferred with the most significant bit (MSb)
first. If a receiver cannot receive another complete byte of data until it has performed some
other function, it can hold the clock line, SCL, low to force the transmitter into a wait state.
Data transfer only continues when the receiver is ready for another byte and releases the
data line. If a slave receiver does not acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left high by
the slave. The master can then abort the transfer. A low-to-high transition on the SDA line
while the SCL line is high is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the sub-
address field. In other words, SUB(7) must be equal to ‘1’ while SUB(6-0) represents the
address of the first register to be read.
In the communication format presented, MAK is master acknowledge and NMAK is no
master acknowledge.
6.2
SPI bus interface
The SPI is a bus slave. The SPI allows writing and reading the registers of the device.
The serial interface interacts with the outside world through 4 wires: CS, SPC, SDI and
SDO.
DocID023312 Rev 2
23/52
52
Digital interfaces
LSM303D
Figure 6. Read and write protocol
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
AM10129V1
CS is the serial port enable and is controlled by the SPI master. It goes low at the start of the
transmission and goes back high at the end. SPC is the serial port clock and it is controlled
by the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are
respectively the serial port data input and output. These lines are driven at the falling edge
of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in the case of multiple read/write bytes. Bit duration is the time between two
falling edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling
edge of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just
before the rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written to the device. When 1, the data DO(7:0)
from the device is read. In the latter case the chip drives SDO at the start of bit 8.
bit 1: MS bit. When 0, the address remains unchanged in multiple read/write commands.
When 1, the address is auto-incremented in multiple read/write commands.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written to the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands, further blocks of 8 clock periods are added. When the MS
bit is 0, the address used to read/write data remains the same for every block. When the MS
bit is 1, the address used to read/write data is incremented at every block.
The function and the behavior of SDI and SDO remain unchanged.
24/52
DocID023312 Rev 2
LSM303D
Digital interfaces
6.2.1
SPI read
Figure 7. SPI read protocol
CS
SPC
SDI
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7DO6 DO5DO4 DO3DO2 DO1DO0
AM10130V1
The SPI read command is performed with 16 clock pulses. The multiple byte read command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment the address; when 1, increments the address in
multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
bit 16-... : data DO(...-8). Further data in multiple byte reads.
Figure 8. Multiple byte SPI read protocol (2-byte example)
CS
SPC
SDI
RW
M S AD5 AD4 AD 3 AD2 AD1 AD0
SD O
DO 7 DO 6 DO 5 DO 4 DO 3 DO 2 DO 1 DO 0 DO 15DO 14DO 13 DO 12DO 11DO 10D O9 D O8
AM10131V1
DocID023312 Rev 2
25/52
52
Digital interfaces
LSM303D
6.2.2
SPI write
Figure 9. SPI write protocol
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
AM10132V1
The SPI write command is performed with 16 clock pulses. The multiple byte write
command is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1: MS bit. When 0, do not increment address; when 1, increment address in multiple
writing.
bit 2 -7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written to the device (MSb first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
Figure 10. Multiple byte SPI write protocol (2-byte example)
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14DI13 DI12DI11 DI10DI9 DI8
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
AM10133V1
6.2.3
SPI read in 3-wire mode
3-wire mode is entered by setting the bit SIM (SPI serial interface mode selection) to ‘1’ in
CTRL2 (21h).
26/52
DocID023312 Rev 2
LSM303D
Digital interfaces
Figure 11. SPI read protocol in 3-wire mode
CS
SPC
SDI/O
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
AM10134V1
The SPI read command is performed with 16 clock pulses:
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment the address; when 1, increments the address in
multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
A multiple read command is also available in 3-wire mode.
DocID023312 Rev 2
27/52
52
Output register mapping
LSM303D
7
Output register mapping
The table below provides a listing of the 8-bit registers embedded in the device and the
corresponding addresses.
Table 16. Register address map
Register address
Type
Name
Default
Comment
Hex
Binary
Reserved
--
r
00-04
05
--
--
Reserved
TEMP_OUT_L
TEMP_OUT_H
STATUS_M
000 0101
000 0110
000 0111
000 1000
000 1001
000 1010
000 1011
000 1100
000 1101
000 1110
000 1111
--
Output
r
06
Output
r
07
Output
OUT_X_L_M
OUT_X_H_M
OUT_Y_L_M
OUT_Y_H_M
OUT_Z_L_M
OUT_Z_H_M
Reserved
r
08
Output
r
09
Output
r
0A
0B
0C
0D
0E
0F
10-11
12
Output
r
Output
r
Output
r
Output
--
--
Reserved
Reserved
WHO_AM_I
r
01001001
--
Reserved
--
INT_CTRL_M
INT_SRC_M
INT_THS_L_M
INT_THS_H_M
OFFSET_X_L_M
OFFSET_X_H_M
OFFSET_Y_L_M
OFFSET_Y_H_M
OFFSET_Z_L_M
OFFSET_Z_H_M
REFERENCE_X
REFERENCE_Y
REFERENCE_Z
CTRL0
rw
r
001 0010
001 0011
001 0100
001 0101
001 0110
001 0111
001 01000
001 01001
001 01010
001 01011
001 01100
001 01101
001 01110
001 1111
010 0000
010 0001
11101000
Output
13
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
14
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000111
00000000
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
CTRL1
CTRL2
21
28/52
DocID023312 Rev 2
LSM303D
Output register mapping
Table 16. Register address map (continued)
Register address
Name
Type
Default
Comment
Hex
Binary
CTRL3
CTRL4
CTRL5
CTRL6
CTRL7
rw
rw
rw
rw
rw
r
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
010 0010
010 0011
010 0100
010 0101
010 0110
010 0111
010 1000
010 1001
010 1010
010 1011
010 1100
010 1101
010 1110
010 1111
011 0000
011 0001
011 0010
011 0011
011 0100
011 0101
011 0110
011 0111
011 1000
011 1001
011 1010
011 1011
011 1100
011 1101
011 1110
011 1111
00000000
00000000
00011000
00100000
00000001
Output
STATUS_A
OUT_X_L_A
OUT_X_H_A
OUT_Y_L_A
OUT_Y_H_A
OUT_Z_L_A
OUT_Z_H_A
FIFO_CTRL
FIFO_SRC
IG_CFG1
r
Output
r
Output
r
Output
r
Output
r
Output
r
Output
rw
r
00000000
Output
rw
r
00000000
Output
IG_SRC1
IG_THS1
rw
rw
rw
r
00000000
00000000
00000000
Output
IG_DUR1
IG_CFG2
IG_SRC2
IG_THS2
rw
rw
rw
r
00000000
00000000
00000000
Output
IG_DUR2
CLICK_CFG
CLICK_SRC
CLICK_THS
TIME_LIMIT
TIME _LATENCY
TIME_WINDOW
ACT_THS
rw
rw
rw
rw
rw
rw
00000000
00000000
00000000
00000000
00000000
00000000
ACT_DUR
Registers marked as Reserved must not be changed. Writing to these registers may cause
permanent damage to the device.The content of the registers that are loaded at boot should
not be changed. They contain the factory calibration values. Their content is automatically
restored when the device is powered up.
DocID023312 Rev 2
29/52
52
Register description
LSM303D
8
Register description
The device contains a set of registers which are used to control its behavior and to retrieve
acceleration and magnetic data. The register address, consisting of 7 bits, is used to identify
them and to write the data through the serial interface.
8.1
TEMP_OUT_L (05h), TEMP_OUT_H (06h)
Temperature sensor data. Temperature data is stored as two’s complement data in 12-bit
format, right-justified.
Refer to Section 4.2 for details on how to enable and read the temperature sensor output
data.
8.2
STATUS_M (07h)
Table 17. STATUS_M register
ZYXMOR/ Tempor
ZMOR YMOR XMOR ZYXMDA / Tempda
ZMDA YMDA XMDA
Table 18. STATUS_M register description
ZYXMOR/ Magnetic X, Y and Z-axis and temperature data overrun. Default value: 0
Tempor
(0: no overrun has occurred; 1: a new set of data has overwritten the previous data)
Temperature data overrun if T_ONLY bit in CTRL7 (26h) is set to ‘1’. Default value: 0.
ZMOR
Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Z-axis has overwritten the previous
data)
YMOR
XMOR
Y-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Y-axis has overwritten the previous
data)
X-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the X-axis has overwritten the previous
data)
ZYXMDA/ X, Y and Z-axis and temperature new data available. Default value: 0
Tempda
ZMDA
YMDA
XMDA
(0: a new set of data is not yet available; 1: a new set of data is available)
Temperature new data available if the T_ONLY bit in CTRL7 (26h) is set to ‘1’.
Z-axis new data available. Default value: 0
(0: new data for the Z-axis is not yet available; 1: new data for the Z-axis is available)
Y-axis new data available. Default value: 0
(0: new data for the Y-axis is not yet available; 1: new data for the Y-axis is available)
X-axis new data available. Default value: 0
(0: new data for the X-axis is not yet available; 1: new data for the X-axis is available)
30/52
DocID023312 Rev 2
LSM303D
Register description
8.3
OUT_X_L_M (08h), OUT_X_H_M (09h)
X-axis magnetic data. The value is expressed in 16-bit as two’s complement.
8.4
8.5
8.6
OUT_Y_L_M (0Ah), OUT_Y_H_M (0Bh)
Y-axis magnetic data. The value is expressed in 16-bit as two’s complement.
OUT_Z_L_M (0Ch), OUT_Z_H_M (0Dh)
Z-axis magnetic data. The value is expressed in 16-bit as two’s complement.
WHO_AM_I (0Fh)
Table 19. WHO_AM_I register
0
1
0
0
1
0
0
1
Device identification register.
8.7
INT_CTRL_M (12h)
Table 20. INT_CTRL_M register
XMIEN
YMIEN
ZMIEN
PP_OD
IEA
MIEL
4D
MIEN
Table 21. INT_CTRL_M register description
XMIEN Enable interrupt recognition on X-axis for magnetic data. Default value: 0.
(0: disable interrupt recognition; 1: enable interrupt recognition)
YMIEN
Enable interrupt recognition on Y-axis for magnetic data. Default value: 0.
(0: disable interrupt recognition; 1: enable interrupt recognition)
ZMIEN
Enable interrupt recognition on Z-axis for magnetic data. Default value: 0.
(0: disable interrupt recognition; 1: enable interrupt recognition)
PP_OD Interrupt pin configuration. Default value: 0.
(0: push-pull; 1: open drain)
IEA
Interrupt polarity. Default value: 0.
(0: interrupt active-low; 1: interrupt active-high)
MIEL
Latch interrupt request on INT_SRC_M (13h) register. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
Once the MIEL is set to ‘1’, the interrupt is cleared by reading the INT_SRC_M (13h)
register.
4D
4D enable: 4D detection on acceleration data is enabled when 6D bit in IG_CFG1 (30h) is
set to 1. Default value: 0.
MIEN
Enable interrupt generation for magnetic data. Default value: 0.
(0: disable interrupt generation; 1: enable interrupt generation)
DocID023312 Rev 2
31/52
52
Register description
LSM303D
8.8
INT_SRC_M (13h)
Table 22. INT_SRC_M register
M_PTH_X M_PTH_Y M_PTH_Z
M_NTH_X M_NTH_Y M_NTH_Z MROI
MINT
Table 23. INT_SRC_M register description
M_PTH_X
M_PTH_Y
M_PTH_Z
Magnetic value on X-axis exceeds the threshold on the positive side.
Default value: 0.
Magnetic value on Y-axis exceeds the threshold on the positive side.
Default value: 0.
Magnetic value on Z-axis exceeds the threshold on the positive side.
Default value: 0.
M_NTH_X Magnetic value on X-axis exceeds the threshold on the negative side.
Default value: 0.
M_NTH_Y Magnetic value on Y-axis exceeds the threshold on the negative side.
Default value: 0.
M_NTH_Z
Magnetic value on Z-axis exceeds the threshold on the negative side.
Default value: 0.
MROI
Internal measurement range overflow on magnetic value.
Default value: 0.
MINT
Magnetic interrupt event. The magnetic field value exceeds the threshold.
Default value: 0.
8.9
INT_THS_L_M (14h), INT_THS_H_M (15h)
Magnetic interrupt threshold. Default value: 0.
The value is expressed in 16-bit unsigned.
Even if the threshold is expressed in absolute value, the device detects both positive and
negative thresholds.
Table 24. INT_THS_L_M register
THS7
THS6
THS5
THS4
THS3
THS2
THS1
THS9
THS0
THS8
Table 25. INT_THS_H_M register
0
THS14
THS13
THS12
THS11
THS10
32/52
DocID023312 Rev 2
LSM303D
Register description
8.10
OFFSET_X_L_M (16h), OFFSET_X_H_M (17h)
Magnetic offset for X-axis. Default value: 0.
The value is expressed in 16-bit as two’s complement.
Table 26. OFFSET_X_L_M register
OFF_X_7 OFF_X_6 OFF_X_5 OFF_X_4 OFF_X_3 OFF_X_2 OFF_X_1 OFF_X_0
Table 27. OFFSET_X_H_M register
OFF_X_15 OFF_X_14 OFF_X_13 OFF_X_12 OFF_X_11 OFF_X_10 OFF_X_9 OFF_X_8
8.11
OFFSET_Y_L_M (18h), OFFSET_Y_H_M (19h)
Magnetic offset for Y-axis. Default value: 0.
The value is expressed in 16-bit as two’s complement.
Table 28. OFFSET_Y_L_M register
OFF_Y_7 OFF_Y_6 OFF_Y_5 OFF_Y_4 OFF_Y_3 OFF_Y_2 OFF_Y_1 OFF_Y_0
Table 29. OFFSET_Y_H_M register
OFF_Y_15 OFF_Y_14 OFF_Y_13 OFF_Y_12 OFF_Y_11 OFF_Y_10 OFF_Y_9 OFF_Y_8
8.12
OFFSET_Z_L_M (1Ah), OFFSET_Z_H_M (1Bh)
Magnetic offset for Z-axis. Default value: 0.
The value is expressed in 16-bit as two’s complement.
Table 30. OFFSET_Z_L_M register
OFF_Z_7 OFF_Z_6 OFF_Z_5 OFF_Z_4 OFF_Z_3 OFF_Z_2 OFF_Z_1 OFF_Z_0
Table 31. OFFSET_Z_H_M register
OFF_Z_15 OFF_Z_14 OFF_Z_13 OFF_Z_12 OFF_Z_11 OFF_Z_10 OFF_Z_9 OFF_Z_8
8.13
8.14
REFERENCE_X (1Ch)
Reference value for high-pass filter for X-axis acceleration data.
REFERENCE_Y (1Dh)
Reference value for high-pass filter for Y-axis acceleration data.
DocID023312 Rev 2
33/52
52
Register description
LSM303D
8.15
8.16
REFERENCE_Z (1Eh)
Reference value for high-pass filter for Z-axis acceleration data.
CTRL0 (1Fh)
Table 32. CTRL0 register
BOOT
FIFO_EN
FTH_EN
0(1)
0(1)
HP_Click HPIS1
HPIS2
1. These bits must be set to ‘0’ for correct operation of the device.
Table 33. CTRL0 register description
BOOT
Reboot memory content. Default value: 0
(0: normal mode; 1: reboot memory content)
FIFO_EN
FTH_EN
HP_Click
HPIS1
FIFO enable. Default value: 0
(0: FIFO disable; 1: FIFO enable)
FIFO programmable threshold enable. Default value: 0
(0: disable; 1: enable)
High-pass filter enabled for click function. Default value: 0
(0: filter bypassed; 1: filter enabled)
High-pass filter enabled for interrupt generator 1. Default value: 0
(0: filter bypassed; 1: filter enabled)
HPIS2
High-pass filter enabled for interrupt generator 2. Default value: 0
(0: filter bypassed; 1: filter enabled)
8.17
CTRL1 (20h)
Table 34. CTRL1 register
AODR3
AODR2
AODR1
AODR0
BDU
AZEN
AYEN
AXEN
Table 35. CTRL1 register description
AODR [3:0]
BDU
Acceleration data-rate selection. Default value: 0000
(0000: Power-down mode; Others: Refer to Table 36)
Block data update for acceleration and magnetic data. Default value: 0
(0: continuous update; 1: output registers not updated until MSB and LSB have been
read)
AZEN
AYEN
AXEN
Acceleration Z-axis enable. Default value: 1
(0: Z-axis disabled; 1: Z-axis enabled)
Acceleration Y-axis enable. Default value: 1
(0: Y-axis disabled; 1: Y-axis enabled)
Acceleration X-axis enable. Default value: 1
(0: X-axis disabled; 1: X-axis enabled)
34/52
DocID023312 Rev 2
LSM303D
Register description
AODR [3:0] is used to set power mode and ODR selection. In the following table bit
selection of AODR [3:0] for all frequencies is shown.
Table 36. Acceleration data rate configuration
AODR3
AODR2
AODR1
AODR0
Power mode and ODR selection
Power-down mode
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
3.125 Hz
6.25 Hz
12.5 Hz
25 Hz
50 Hz
100 Hz
200 Hz
400 Hz
800 Hz
1600 Hz
8.18
CTRL2 (21h)
Table 37. CTRL2 register
ABW1
ABW0
AFS2
AFS1
AFS0
0(1)
AST
SIM
1. This bit must be set to ‘0’ for correct operation of the device.
Table 38. CTRL2 register description
ABW[1:0]
AFS[2:0]
AST
Accelerometer anti-alias filter bandwidth. Default value: 00
Refer to Table 39
Acceleration full-scale selection. Default value: 000
Refer to Table 40
Acceleration self-test enable. Default value: 0
(0: self-test disabled; 1: self-test enabled)
SIM
SPI serial interface mode selection. Default value: 0
(0: 4-wire interface; 1: 3-wire interface)
Table 39. Acceleration anti-alias filter bandwidth
ABW1
ABW0
Anti-alias filter bandwidth
0
0
0
1
773 Hz
194 Hz
DocID023312 Rev 2
35/52
52
Register description
ABW1
LSM303D
Table 39. Acceleration anti-alias filter bandwidth
ABW0
Anti-alias filter bandwidth
1
1
0
1
362 Hz
50 Hz
Table 40. Acceleration full-scale selection
AFS2
AFS1
AFS0
Acceleration full scale
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
±2 g
±4 g
±6 g
±8 g
±16 g
8.19
CTRL3 (22h)
Table 41. CTRL3 register
INT1
_BOOT
INT1
_Click
INT1
_IG1
INT1
_IG2
INT1
_IGM
INT1
INT1
INT1
_DRDY_A _DRDY_M _EMPTY
Table 42. CTRL3 register description
INT1_BOOT
INT1_Click
INT1_IG1
INT1_IG2
INT1_IGM
Boot on INT1 enable. Default value: 0
(0: disable; 1: enable)
Click generator interrupt on INT1. Default value: 0
(0: disable; 1: enable)
Inertial interrupt generator 1 on INT1. Default value: 0
(0: disable; 1: enable)
Inertial interrupt generator 2 on INT1. Default value: 0
(0: disable; 1: enable)
Magnetic interrupt generator on INT1. Default value: 0
(0: disable; 1: enable)
INT1_DRDY_A
INT1_DRDY_M
INT1_EMPTY
Accelerometer data-ready signal on INT1. Default value: 0
(0: disable; 1: enable)
Magnetometer data-ready signal on INT1. Default value: 0
(0: disable; 1: enable)
FIFO empty indication on INT1. Default value: 0
(0: disable; 1: enable)
36/52
DocID023312 Rev 2
LSM303D
Register description
8.20
CTRL4 (23h)
Table 43. CTRL4 register
INT2
_Click
INT2
_INT1
INT2
_INT2
INT2
_INTM
INT2
_DRDY_A
INT2
_DRDY_M
INT2
_Overrun
INT2
_FTH
Table 44. CTRL4 register description
INT2
_Click
Click generator interrupt on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_IG1
Inertial interrupt generator 1 on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_IG2
Inertial interrupt generator 2 on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_IGM
Magnetic interrupt generator on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_DRDY_A
Accelerometer data-ready signal on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_DRDY_M
Magnetometer data-ready signal on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_Overrun
FIFO overrun interrupt on INT2. Default value: 0
(0: disable; 1: enable)
INT2
_FTH
FIFO threshold interrupt on INT2. Default value: 0
(0: disable; 1: enable)
8.21
CTRL5 (24h)
Table 45. CTRL5 register
TEMP_EN
TEMP_EN
M_RES1
M_RES0
M_ODR2 M_ODR1 M_ODR0 LIR2
LIR1
Table 46. CTRL5 register description
Temperature sensor enable. Default value: 0
(0: temperature sensor disabled; 1: temperature sensor enabled)
M_RES [1:0]
M_ODR [2:0]
LIR2
Magnetic resolution selection. Default value: 00
(00: low resolution, 11: high resolution)
Magnetic data rate selection. Default value: 110
Refer to Table 47
Latch interrupt request on INT2_SRC register, with INT2_SRC register cleared by
reading INT2_SRC itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
LIR1
Latch interrupt request on INT1_SRC register, with INT1_SRC register cleared by
reading INT1_SRC itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)
DocID023312 Rev 2
37/52
52
Register description
LSM303D
Table 47. Magnetic data rate configuration
MODR2
MODR1
MODR0
ODR selection
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
3.125 Hz
6.25 Hz
12.5 Hz
25 Hz
50 Hz
100 Hz(1)
Do not use
Reserved
1. Available only for accelerometer ODR > 50 Hz or accelerometer in power-down mode (refer to Table 36,
AODR setting).
8.22
CTRL6 (25h)
Table 48. CTRL6 register
0(1)
MFS1
MFS0
0(1)
0(1)
0(1)
0(1)
0(1)
1. These bits must be set to ‘0’ for correct operation of the device.
Table 49. CTRL6 register description
MFS [1:0]
Magnetic full-scale selection. Default value: 01
Refer to Table 50
Table 50. Magnetic full-scale selection
MFS1
MFS0
Magnetic full scale
0
0
1
1
0
1
0
1
±2 gauss
±4 gauss
±8 gauss
±12 gauss
8.23
CTRL7 (26h)
Table 51. CTRL7 register
AHPM1
AHPM0
AFDS
T_ONLY
0(1)
MLP
MD1
MD0
1. This bit must be set to ‘0’ for correct operation of the device.
38/52
DocID023312 Rev 2
LSM303D
Register description
Table 52. CTRL7 register description
AHPM[1:0] High-pass filter mode selection for acceleration data. Default value: 00
Refer to Table 53
AFDS
T_ONLY
MLP
Filtered acceleration data selection. Default value: 0
(0: internal filter bypassed; 1: data from internal filter sent to output register and FIFO)
Temperature sensor only mode. Default value: 0
If this bit is set to ‘1’, the temperature sensor is on while the magnetic sensor is off.
Magnetic data low-power mode. Default value: 0
If this bit is ‘1’, the M_ODR [2:0] is set to 3.125 Hz independently from the MODR set-
tings. Once the bit is set to ‘0’, the magnetic data rate is configured by the MODR bits
in the CTRL5 (24h) register.
MD[1:0]
Magnetic sensor mode selection. Default 10
Refer to Table 54
Table 53. High-pass filter mode selection
AHPM1 AHPM0
High-pass filter mode
0
0
Normal mode (reset X, Y and Z-axis, reading respective REFERENCE_X
(1Ch), REFERENCE_Y (1Dh) and REFERENCE_Z (1Eh) registers)
0
1
1
1
0
1
Reference signal for filtering
Normal mode
Auto-reset on interrupt event
Table 54. Magnetic sensor mode selection
MD1
MD0
Magnetic sensor mode
Continuous-conversion mode
0
0
1
0
1
0
1
1
Single-conversion mode
Power-down mode
Power-down mode
8.24
STATUS_A (27h)
Table 55. STATUS_A register
ZYXAOR
ZAOR
YAOR
XAOR
ZYXADA ZADA
YADA
XADA
DocID023312 Rev 2
39/52
52
Register description
LSM303D
Table 56. STATUS_A register description
ZYXAOR Acceleration X, Y and Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new set of data has overwritten the previous data)
ZAOR
YAOR
XAOR
Acceleration Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Z-axis has overwritten the previous data)
Acceleration Y-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Y-axis has overwritten the previous data)
Acceleration X-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the X-axis has overwritten the previous data)
ZYXADA Acceleration X, Y and Z-axis new value available. Default value: 0
(0: a new set of data is not yet available; 1: a new set of data is available)
ZADA
YADA
XADA
Acceleration Z-axis new value available. Default value: 0
(0: new data for the Z-axis is not yet available; 1: new data for the Z-axis is available)
Acceleration Y-axis new value available. Default value: 0
(0: new data for the Y-axis is not yet available; 1: new data for the Y-axis is available)
Acceleration X-axis new value available. Default value: 0
(0: new data for the X-axis is not yet available; 1: new data for the X-axis is available)
8.25
8.26
8.27
8.28
OUT_X_L_A (28h), OUT_X_H_A (29h)
X-axis acceleration data. The value is expressed in 16-bit as two’s complement.
OUT_Y_L_A (2Ah), OUT_Y_H_A (2Bh)
Y-axis acceleration data. The value is expressed in 16-bit as two’s complement.
OUT_Z_L_A (2Ch), OUT_Z_H_A (2Dh)
Z-axis acceleration data. The value is expressed in 16-bit as two’s complement.
FIFO_CTRL (2Eh)
Table 57. FIFO_CTRL register
FM2
FM1
FM0
FTH4
FTH3
FTH2
FTH1
FTH0
Table 58. FIFO_CTRL register description
FM[2:0]
FIFO mode selection. Default value: 000
Refer to Table 59
FTH[4:0]
FIFO threshold level. Default value: 00000
40/52
DocID023312 Rev 2
LSM303D
Register description
Table 59. FIFO mode configuration
FM2
FM1
FM0
FIFO mode
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
Bypass mode
FIFO mode
Stream mode
Stream-to-FIFO mode
Bypass-to-Stream mode
Interrupt generator 2 can change the FIFO mode.
8.29
FIFO_SRC (2Fh)
FiFO status register.
Table 60. FIFO_SRC register
FTH
OVRN
EMPTY
FSS4
FSS3
FSS2
FSS1
FSS0
Table 61. FIFO_SRC register description
FTH
FIFO threshold status.
FTH bit is set to ‘1’ when FIFO content exceeds threshold level.
OVRN
EMPTY
FSS[4:0]
FIFO overrun status.
OVRN bit is set to ‘1’ when FIFO buffer is full.
Empty status.
EMPTY bit is set to ‘1’ when all FIFO samples have been read and FIFO is empty.
FIFO stored data level.
FSS4-0 bits contain the current number of unread FIFO levels.
8.30
IG_CFG1 (30h)
Inertial interrupt generator 1 configuration register.
Table 62. IG_CFG1 register
AOI
6D
ZHIE/
ZUPE
ZLIE/
ZDOWNE YUPE
YHIE/
YLIE/
YDOWNE XUPE
XHIE/
XLIE/
XDOWNE
DocID023312 Rev 2
41/52
52
Register description
LSM303D
Table 63. IG_CFG1 register description
AOI
6D
And/Or combination of interrupt events. Default value: 0.
Refer to Table 64
6-direction detection function enabled. Default value: 0.
Refer to Table 64
ZHIE/
ZUPE
Enable interrupt generation on Z high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request)
ZLIE/
ZDOWNE
Enable interrupt generation on Z low event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request)
YHIE/
YUPE
Enable interrupt generation on Y high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
YLIE/
YDOWNE
Enable interrupt generation on Y low event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
XHIE/
XUPE
Enable interrupt generation on X high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
XLIE/
XDOWNE
Enable interrupt generation on X low event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
Content of this register is loaded at boot.
Write operation at this address is possible only after system boot.
Table 64. Interrupt mode
AOI
6D
Interrupt mode
OR combination of interrupt events
0
0
1
1
0
1
0
1
6-direction movement recognition
AND combination of interrupt events
6-direction position recognition
Difference between AOI-6D = ‘01’ and AOI-6D = ‘11’.
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when orientation moves
from an unknown zone to a known zone. The interrupt signal stays for a duration ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when orientation is inside a
known zone. The interrupt signal stays until orientation is inside the zone.
8.31
IG_SRC1 (31h)
Inertial interrupt generator 1 status register.
Table 65. IG_SRC1 register
0
IA
ZH
ZL
YH
YL
XH
XL
42/52
DocID023312 Rev 2
LSM303D
Register description
Table 66. IG_SRC1 register description
Interrupt status. Default value: 0
IA
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
Z high. Default value: 0
ZH
ZL
YH
YL
XH
XL
(0: no interrupt; 1: Z high event has occurred)
Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)
Y high. Default value: 0
(0: no interrupt; 1: Y high event has occurred)
Y low. Default value: 0
(0: no interrupt; 1: Y low event has occurred)
X high. Default value: 0
(0: no interrupt; 1: X high event has occurred)
X low. Default value: 0
(0: no interrupt; 1: X low event has occurred)
Reading at this address clears the IG_SRC1 (31h) IA bit (and the interrupt signal on the
corresponding interrupt pin) and allows the refreshment of data in the IG_SRC1 (31h)
register if the latched option was chosen.
8.32
IG_THS1 (32h)
Table 67. IG_THS1 register
0
THS6
THS5
THS4
THS3
THS2
THS1
THS0
Table 68. IG_THS1 register description
THS[6:0]
Interrupt generator 1 threshold. Default value: 000 0000
8.33
IG_DUR1 (33h)
Table 69. IG1_DUR1 register
0
D6
D5
D4
D3
D2
D1
D0
Table 70. IG1_DUR1 register description
D[6:0]
Duration value. Default value: 000 0000
The D6 - D0 bits set the minimum duration of the interrupt 1 event to be recognized.
Duration steps and maximum values depend on the ODR chosen.
DocID023312 Rev 2
43/52
52
Register description
LSM303D
8.34
IG_CFG2 (34h)
This register contains the settings for the inertial interrupt generator 2.
Table 71. IG_CFG2 register
AOI
6D
ZHIE/
ZUPE
ZLIE/
ZDOWNE YUPE
YHIE/
YLIE/
YDOWNE XUPE
XHIE/
XLIE/
XDOWNE
Table 72. IG_CFG2 register description
AOI
6D
And/Or combination of interrupt events. Default value: 0. Refer to Table 73
6-direction detection function enabled. Default value: 0. Refer to Table 73
ZHIE/
ZUPE
Enable interrupt generation on Z high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request)
ZLIE/
ZDOWNE
Enable interrupt generation on Z low event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request)
YHIE/
YUPE
Enable interrupt generation on Y high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
YLIE/
YDOWNE
Enable interrupt generation on Y low event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
XHIE/
XUPE
Enable interrupt generation on X high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
XLIE/
XDOWNE
Enable interrupt generation on X low event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)
Content of this register is loaded at boot.
Write operation at this address is possible only after system boot.
Table 73. Interrupt mode
AOI
6D
Interrupt mode
OR combination of interrupt events
0
0
1
1
0
1
0
1
6-direction movement recognition
AND combination of interrupt events
6-direction position recognition
Difference between AOI-6D = ‘01’ and AOI-6D = ‘11’.
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when the orientation
moves from an unknown zone to a known zone. The interrupt signal remains for a duration
ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when the orientation is
inside a known zone. The interrupt signal remains until the orientation is inside the zone.
44/52
DocID023312 Rev 2
LSM303D
Register description
8.35
IG_SRC2 (35h)
This register contains the status for the inertial interrupt generator 2.
Table 74. IG_SRC2 register
0
IA
ZH
ZL
YH
YL
XH
XL
Table 75. IG_SRC2 register description
Interrupt generator 2 status. Default value: 0
IA
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
Z high. Default value: 0
ZH
ZL
YH
YL
XH
XL
(0: no interrupt; 1: Z high event has occurred)
Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)
Y high. Default value: 0
(0: no interrupt; 1: Y high event has occurred)
Y low. Default value: 0
(0: no interrupt; 1: Y low event has occurred)
X high. Default value: 0
(0: no interrupt; 1: X high event has occurred)
X low. Default value: 0
(0: no interrupt; 1: X low event has occurred)
Reading at this address clears the IG_SRC2 (35h) IA bit (and the interrupt signal on the
corresponding interrupt pin) and allows the refresh of data in the IG_SRC2 (35h) register if
the latched option was chosen.
8.36
IG_THS2 (36h)
Table 76. IG2_THS2 register
0
THS6
THS5
THS4
THS3
THS2
THS1
THS0
Table 77. IG2_THS2 register description
THS[6:0]
Interrupt generator 2 threshold. Default value: 000 0000
8.37
IG_DUR2 (37h)
Table 78. IG_DUR2 register
0
D6
D5
D4
D3
D2
D1
D0
DocID023312 Rev 2
45/52
52
Register description
LSM303D
Table 79. IG_DUR2 register description
D6 - D0
Duration value. Default value: 000 0000
The D6 - D0 bits set the minimum duration of the interrupt 2 event to be recognized.
Duration steps and maximum values depend on the ODR chosen.
8.38
CLICK_CFG (38h)
Table 80. CLICK_CFG register
--
--
ZD
ZS
YD
YS
XD
XS
Table 81. CLICK_CFG register description
ZD
ZS
YD
YS
XD
XS
Enable interrupt double-click on Z-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt single-click on Z-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt double-click on Y-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt single-click on Y-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt double-click on X-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
Enable interrupt single-click on X-axis. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured accel. value
higher than preset threshold)
46/52
DocID023312 Rev 2
LSM303D
Register description
8.39
CLICK_SRC (39h)
Table 82. CLICK_SRC register
--
IA
DClick
SClick
Sign
Z
Y
X
Table 83. CLICK_SRC register description
IA
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
DClick
SClick
Double-click enable. Default value: 0
(0: double-click detection disable; 1: double-click detection enable)
Single-click enable. Default value: 0
(0: single-click detection disable; 1: single-click detection enable)
Sign
Z
Click sign. 0: positive detection; 1: negative detection
Z-click detection. Default value: 0
(0: no interrupt; 1: Z high event has occurred)
Y
X
Y-click detection. Default value: 0
(0: no interrupt; 1: Y high event has occurred)
X-click detection. Default value: 0
(0: no interrupt; 1: X high event has occurred)
8.40
8.41
CLICK_THS (3Ah)
Table 84. CLICK_THS register
-
Ths6
Ths5
Ths4
Ths3
Ths2
Ths1
Ths0
Table 85. CLICK_THS register description
Ths[6:0]
Click threshold. Default value: 000 0000
TIME_LIMIT (3Bh)
Table 86. TIME_LIMIT register
-
TLI6
TLI5
TLI4
TLI3
TLI2
TLI1
TLI0
Table 87. TIME_LIMIT register description
TLI[6:0]
Click time limit. Default value: 000 0000
DocID023312 Rev 2
47/52
52
Register description
LSM303D
8.42
8.43
8.44
TIME_LATENCY (3Ch)
Table 88. TIME_LATENCY register
TLA7
TLA6
TLA5
TLA4
TLA3
TLA2
TLA1
TLA0
Table 89. TIME_LATENCY register description
TLA[7:0]
Double-click time latency. Default value: 0000 0000
TIME_WINDOW (3Dh)
Table 90. TIME_WINDOW register
TW7
TW6
TW5
TW4
TW3
TW2
TW1
TW0
Table 91. TIME_WINDOW register description
TW[7:0]
Double-click time window
ACT_THS (3Eh)
Table 92. ACT_THS register
--
ACTH6
ACTH5
ACTH4
ACTH3
ACTH2
ACTH1
ACTH0
Table 93. ACT_THS register description
ACTH[6:0]
Sleep-to-Wake, Return-to-Sleep activation threshold
1 LSb = 16 mg
8.45
ACT_DUR (3Fh)
Table 94. ACT_DUR register
ActD7
ActD6
ActD5
ActD4
ActD3
ActD2
ActD1
ActD0
Table 95. ACT_DUR register description
ActD[7:0]
Sleep-to-Wake, Return-to-Sleep duration
DUR = (Act_DUR + 1)*8/ODR
48/52
DocID023312 Rev 2
LSM303D
Package information
9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
DocID023312 Rev 2
49/52
52
Package information
LSM303D
Table 96. LGA 3x3x1.0 16L mechanical data
mm
Dim.
Min.
Typ.
Max.
A1
A2
A3
D1
E1
L1
L2
N1
N2
M
1
0.785
0.200
3.000
3.000
1.000
2.000
0.500
1.000
0.100
0.875
1.275
0.350
0.250
0.150
0.050
2.850
2.850
3.150
3.150
1.060
2.060
0.040
P1
P2
T1
T2
d
0.290
0.190
0.410
0.310
k
Figure 12. LGA 3x3x1.0 16L mechanical drawing
7983231_M
50/52
DocID023312 Rev 2
LSM303D
Revision history
10
Revision history
Table 97. Document revision history
Date
Revision
Changes
22-Jun-2012
1
Initial release
Document status promoted from preliminary to production data
Changed abbreviation of magnetic sensitivity to M_So and updated
footnote 6 in Table 3: Sensor characteristics
05-Nov-2013
2
Added ESD to Table 8: Absolute maximum ratings
Minor textual updates throughout document
DocID023312 Rev 2
51/52
52
LSM303D
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT
PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2013 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
52/52
DocID023312 Rev 2
相关型号:
©2020 ICPDF网 联系我们和版权申明