M25P40VMF6TP [STMICROELECTRONICS]

512 Kbit to 32 Mbit, Low Voltage, Serial Flash Memory With 40 MHz or 50 MHz SPI Bus Interface; 512 Kb到32兆位，低电压，串行闪存采用40 MHz或50 MHz的SPI总线接口


型号：	M25P40VMF6TP
厂家：	ST
描述：	512 Kbit to 32 Mbit, Low Voltage, Serial Flash Memory With 40 MHz or 50 MHz SPI Bus Interface 512 Kb到32兆位，低电压，串行闪存采用40 MHz或50 MHz的SPI总线接口闪存
文件：	总7页 (文件大小：132K)
中文：	中文翻译
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M25PXX

512 Kbit to 32 Mbit, Low Voltage, Serial Flash Memory

With 40 MHz or 50 MHz SPI Bus Interface

DATA BRIEF

FEATURES SUMMARY

■

512Kbit to 32Mbit of Flash Memory

Figure 1. Packages

■

Page Program (up to 256 Bytes) in 1.4ms

(typical)

■

Sector Erase (256 Kbit or 512Kbit)

Bulk Erase (512Kbit to 32Mbit)

2.7 to 3.6V Single Supply Voltage

SPI Bus Compatible Serial Interface

40MHz to 50MHz Clock Rate (maximum)

Deep Power-down Mode 1µA (typical)

Electronic Signatures

VDFPN8 (ME)

8x6mm (MLP8)

–

JEDEC Standard Two-Byte Signature

(20xxh)

–

RES Instruction, One-Byte, Signature, for

backward compatibility

VDFPN8 (MP)

(MLP8)

■

More than 100000 Erase/Program Cycles per

Sector

More than 20 Year Data Retention

Table 1. Product List

Reference

Part Number

M25P32

M25P16

M25P80

M25P40

M25P20

M25P10-A

M25P05-A

SO16 (MF)

300 mil width

M25Pxx

SO8 (MN)

150 mil width

October 2004

1/7

For further information contact your local ST sales office.

M25PXX

Figure 3. SO8 and VDFPN Connections

SUMMARY DESCRIPTION

The M25Pxx is a 512Kbit to 32Mbit (2M x 8) Serial

Flash Memory, with advanced write protection

mechanisms, accessed by a high speed SPI-com-

patible bus.

The memory can be programmed 1 to 256 bytes at

a time, using the Page Program instruction.

The memory is organized as a number of sectors,

each containing 256 or 128 pages. Each page is

256 bytes wide.

The whole memory can be erased using the Bulk

Erase instruction, or a sector at a time, using the

Sector Erase instruction.

M25Pxx

HOLD

AI10259

Figure 2. Logic Diagram

Note: 1. There is an exposed die paddle on the underside of the

MLP8 package. This is pulled, internally, to V , and

must not be allowed to be connected to any other voltage

or signal line on the PCB.

M25Pxx

Figure 4. SO16 Connections

M25Pxx

HOLD

AI10258

Table 2. Signal Names

Serial Clock

Serial Data Input

Serial Data Output

Chip Select

Write Protect

Hold

AI10260

Note: 1. DU = Don’t Use

HOLD

Supply Voltage

Ground

2/7

M25PXX

Figure 5. Block Diagram

HOLD

High Voltage

Generator

Control Logic

I/O Shift Register

Status

Address Register

and Counter

256 Byte

Data Buffer

Top of Address Space

Size of the

read-only

memory area

00000h

000FFh

256 Bytes (Page Size)

X Decoder

AI10261

3/7

M25PXX

Table 3. Instruction Set

Address

Bytes

Dummy

Bytes

Data

Bytes

Instruction

Description

One-byte Instruction Code

WREN

WRDI

RDID

Write Enable

0000 0110

0000 0100

1001 1111

0000 0101

0000 0001

0000 0011

0000 1011

0000 0010

1101 1000

1100 0111

1011 1001

06h

04h

9Fh

05h

01h

03h

0Bh

02h

D8h

C7h

B9h

Write Disable

1 to 3

1 to ∞

Read Identification

Read Status Register

Write Status Register

Read Data Bytes

RDSR

WRSR

READ

1 to ∞

1 to 256

FAST_READ Read Data Bytes at Higher Speed

Page Program

Sector Erase

Bulk Erase

Deep Power-down

Release from Deep Power-down,

and Read Electronic Signature

1 to ∞

RES

1010 1011

ABh

Release from Deep Power-down

Table 4. Status Register Format

SRWD

BP2 BP1 BP0 WEL WIP

Status Register

Write Protect

Block Protect Bits

Write Enable Latch Bit

Write In Progress Bit

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M25PXX

PART NUMBERING

Table 5. Ordering Information Scheme

Example:

M25P80

–

Device Type

M25P = Serial Flash Memory for Code Storage

Device Function

32 = 32Mbit (4M x 8)

16 = 16Mbit (2M x 8)

80 = 8Mbit (1M x 8)

40 = 4Mbit (512K x 8)

20 = 2Mbit (256K x 8)

10-A = 1Mbit (128K x 8)

05-A = 512Kbit (64K x 8)

Operating Voltage

V = V = 2.7 to 3.6V

Package

ME = VDFPN8 8x6mm (MLP8)

MP = VDFPN8 (MLP8)

MF = SO16 (300 mil width)

MN = SO8 (150 mil width)

Device Grade

6 = Industrial temperature range, –40 to 85 °C.

Device tested with standard test flow

3 = Device tested with High Reliability Certified Flow .

Automotive temperature range (–40 to 125 °C)

Option

blank = Standard Packing

T = Tape and Reel Packing

Plating Technology

blank = Standard SnPb plating

P = Lead-Free and RoHS compliant

G = Lead-Free, RoHS compliant, Sb O -free and TBBA-free

Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer-

tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.

For a list of available options (speed, package,

etc.) or for further information on any aspect of this

device, please contact your nearest ST Sales Of-

fice.

5/7

M25PXX

REVISION HISTORY

Table 6. Document Revision History

Date

Rev.

Description of Revision

08-Oct-2004

1.0 First release

6/7

M25PXX

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences

of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted

by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject

to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not

authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

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7/7

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