M27C2001-10C6_技术文档

M27C2001

2 Mbit (256Kb x 8) UV EPROM and OTP EPROM

Features

■ 5V ± 10% supply voltage in Read operation

■ Access time: 55ns

32

1

■ Low power consumption:

– Active Current 30mA at 5MHz

– Standby Current 100µA

FDIP32W (F)

PDIP32 (B)

■ Programming voltage: 12.75V ± 0.25V

■ Programming time: 100µs/word

■ Electronic signature

– Manufacturer Code: 20h

– Device Code: 61h

PLCC32 (C)

TSOP32 (N)

8 x 20 mm

■ Packages

®

– ECOPACK packages available.

May 2006

Rev 4

1/25

www.st.com

1

M27C2001

Contents

1

2

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 10

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Part numbering scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3

4

5

6

7

2/25

List of tables

M27C2001

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

AC Measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance (T = 25°C, f = 1 MHz). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

A

Read Mode DC Characteristics

(T = 0 to 70°C or –40 to 85°C; V = 5V ± 5% or 5V ± 10%; V = V ) . . . . . . . . . . . . 14

A

CC

PP

CC

Table 8.

Table 9.

Programming Mode DC Characteristics

(T = 25°C; V = 6.25V ± 0.25V; V = 12.75V ± 0.25V) . . . . . . . . . . . . . . . . . . . . . . . . 15

A

CC

PP

Read Mode AC Characteristics

(T = 0 to 70°C or –40 to 85°C; V = 5V ± 5% or 5V ± 10%; V = V ) . . . . . . . . . . . . 15

A

CC

PP

CC

Table 10.

Table 11.

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Programming Mode AC Characteristics

(T = 25°C; V = 6.25 ± 0.25V; V = 12.75 ± 0.25V) . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

A

CC

PP

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data. . . . . . 19

PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . . 20

PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data. . . . . . . . . . . . 21

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 22

Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3/25

M27C2001

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Outline . . . . . . . . . . . . . 19

Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 20

Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 21

Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 22

4/25

Summary description

M27C2001

1

Summary description

The M27C2001 is a high speed 2 Mbit EPROM offered in the two ranges UV (ultra violet

erase) and OTP (one time programmable). It is ideally suited for microprocessor systems

requiring large programs and is organized as 262,144 by 8 bits.

The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the

user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be

written to the device by following the programming procedure.

For applications where the content is programmed only one time and erasure is not

required, the M27C2001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.

®

In order to meet environmental requirements, ST offers the M27C2001 in ECOPACK

packages.

ECOPACK packages are Lead-free. The category of second Level Interconnect is marked

on the package and on the inner box label, in compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 1.

Logic Diagram

V

PP

CC

18

8

A0-A17

Q0-Q7

P

E

M27C2001

G

V

SS

AI00716B

Table 1.

Signal Names

A0-A17

Address Inputs

Data Outputs

Chip Enable

Output Enable

Program

Q0-Q7

E

G

P

V

Program Supply

Supply Voltage

Ground

PP

CC

SS

5/25

M27C2001

Summary description

Figure 2.

DIP Connections

V

1

2

3

4

5

6

7

8

9

32

31

V

P

PP

CC

A16

A15

A12

A7

30 A17

29 A14

28 A13

27 A8

A6

A5

26 A9

A4

25 A11

M27C2001

A3

24

23 A10

22

G

A2 10

A1 11

A0 12

Q0 13

Q1 14

Q2 15

E

21 Q7

20 Q6

19 Q5

18 Q4

17 Q3

V

16

SS

AI00717

Figure 3.

LCC Connections

1 32

M27C2001

17

A7

A14

A13

A8

A6

A5

A4

A3

A2

A1

A0

Q0

A9

9

25 A11

G

A10

E

Q7

AI00718

6/25

Summary description

Figure 4.

M27C2001

TSOP Connections

A11

A9

1

32

G

A10

E

A8

A13

A14

A17

P

Q7

Q6

Q5

Q4

Q3

V

8

9

M27C2001 25

CC

(Normal)

V

24

V

SS

PP

A16

A15

A12

A7

Q2

Q1

Q0

A0

A1

A2

A3

A6

A5

A4

16

17

AI01153B

7/25

M27C2001

Device operation

2

Device operation

The operating modes of the M27C2001 are listed in the Table 2. A single power supply is

required in the read mode. All inputs are TTL levels except for V and 12V on A9 for

PP

Electronic Signature.

2.1

Read Mode

The M27C2001 has two control functions, both of which must be logically active in order to

obtain data at the outputs. Chip Enable (E) is the power control and should be used for

device selection. Output Enable (G) is the output control and should be used to gate data to

the output pins, independent of device selection. Assuming that the addresses are stable,

the address access time (t

) is equal to the delay from E to output (t

). Data is

AVQV

ELQV

available at the output after a delay of t

from the falling edge of G, assuming that E has

GLQV

been low and the addresses have been stable for at least t

-t

.

AVQV GLQV

2.2

2.3

Standby Mode

The M27C2001 has a standby mode which reduces the supply current from 30mA to 100µA.

The M27C2001 is placed in the standby mode by applying a CMOS high signal to the E

input. When in the standby mode, the outputs are in a high impedance state, independent of

the G input.

Two Line Output Control

Because EPROM devices are usually used in larger memory arrays, this product features a

2 line control function which accommodates the use of multiple memory connection. The

two line control function allows:

a) the lowest possible memory power dissipation,

b) complete assurance that output bus contention will not occur.

For the most efficient use of these two control lines, E should be decoded and used as the

primary device selecting function, while G should be made a common connection to all

devices in the array and connected to the READ line from the system control bus. This

ensures that all deselected memory devices are in their low power standby mode and that

the output pins are only active when data is required from a particular memory device.

2.4

System Considerations

The power switching characteristics of Advanced CMOS EPROMs require careful

decoupling of the devices. The supply current, I , has three segments that are of interest to

CC

the system designer: the standby current level, the active current level, and transient current

peaks that are produced by the falling and rising edges of E. The magnitude of the transient

current peaks is dependent on the capacitive and inductive loading of the device at the

output. The associated transient voltage peaks can be suppressed by complying with the

two line output control and by properly selected decoupling capacitors. It is recommended

that a 0.1µF ceramic capacitor be used on every device between V and V . This should

CC

SS

8/25

Device operation

M27C2001

be a high frequency capacitor of low inherent inductance and should be placed as close to

the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used

between V and V for every eight devices. The bulk capacitor should be located near the

CC

SS

power supply connection point. The purpose of the bulk capacitor is to overcome the voltage

drop caused by the inductive effects of PCB traces.

2.5

Programming

When delivered (and after each erasure for UV EPROM), all bits of the M27C2001 are in the

'1' state. Data is introduced by selectively programming '0's into the desired bit locations.

Although only '0's will be programmed, both '1's and '0's can be present in the data word.

The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The

M27C2001 is in the programming mode when V input is at 12.75V, E is at V and P is

PP

IL

pulsed to V . The data to be programmed is applied to 8 bits in parallel to the data output

IL

pins. The levels required for the address and data inputs are TTL. V is specified to be

CC

6.25 ± 0.25V.

2.6

PRESTO II Programming Algorithm

PRESTO II Programming Algorithm allows the whole array to be programmed with a

guaranteed margin, in a typical time of 26.5 seconds. Programming with PRESTO II

consists of applying a sequence of 100µs program pulses to each byte until a correct verify

occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is

automatically activated in order to guarantee that each cell is programmed with enough

margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the

necessary margin to each programmed cell.

Figure 5.

Programming Flowchart

V

= 6.25V, V

= 12.75V

PP

CC

n = 0

P = 100µs Pulse

NO

++n

VERIFY

YES

++ Addr

= 25

YES

Last

Addr

NO

FAIL

YES

CHECK ALL BYTES

1st: V

2nd: V

= 6V

= 4.2V

CC

AI00715C

9/25

M27C2001

Device operation

2.7

Program Inhibit

Programming of multiple M27C2001s in parallel with different data is also easily

accomplished. Except for E, all like inputs including G of the parallel M27C2001 may be

common. A TTL low level pulse applied to a M27C2001's P input, with E low and V at

PP

12.75V, will program that M27C2001. A high level E input inhibits the other M27C2001s from

being programmed.

2.8

2.9

Program Verify

A verify (read) should be performed on the programmed bits to determine that they were

correctly programmed. The verify is accomplished with E and G at V , P at V , V at

IL

IH

PP

12.75V and V

at 6.25V.

CC

Electronic Signature

The Electronic Signature (ES) mode allows the reading out of a binary code from an

EPROM that will identify its manufacturer and type. This mode is intended for use by

programming equipment to automatically match the device to be programmed with its

corresponding programming algorithm. The ES mode is functional in the 25 ± 5°C ambient

temperature range that is required when programming the M27C2001. To activate the ES

mode, the programming equipment must force 11.5 to 12.5V on address line A9 of the

M27C2001 with V = V

= 5V. Two identifier bytes may then be sequenced from the

PP

CC

device outputs by toggling address line A0 from V to V . All other address lines must be

IL

IH

held at V during Electronic Signature mode. Byte 0 (A0 = V ) represents the manufacturer

IL

code and byte 1 (A0 = V ) the device identifier code. For the STMicroelectronics

IH

M27C2001, these two identifier bytes are given in Table 3 and can be read-out on outputs

Q7 to Q0.

2.10

Erasure operation (applies to UV EPROM)

The erasure characteristics of the M27C2001 are such that erasure begins when the cells

are exposed to light with wavelengths shorter than approximately 4000Å. It should be noted

that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000Å

range. Data shows that constant exposure to room level fluorescent lighting could erase a

typical M27C2001 in about 3 years, while it would take approximately 1 week to cause

erasure when exposed to direct sunlight. If the M27C2001 is to be exposed to these types of

lighting conditions for extended periods of time, it is suggested that opaque labels be put

over the M27C2001 window to prevent unintentional erasure. The recommended erasure

procedure for the M27C2001 is exposure to short wave ultraviolet light which has

wavelength of 2537Å. The integrated dose (i.e. UV intensity x exposure time) for erasure

should be a minimum of 15W-s/cm2. The erasure time with this dosage is approximately 15

to 20 minutes using an ultraviolet lamp with 12000µW/cm2 power rating. The M27C2001

should be placed within 2.5cm (1 inch) of the lamp tubes during the erasure. Some lamps

have a filter on their tubes which should be removed before erasure.

10/25

Device operation

M27C2001

Q7-Q0

Table 2.

Operating Modes

Mode

E

G

P

A9

V

PP

Read

V

X

V

or V

Data Out

Hi-Z

IL

IH

IL

IH

CC

SS

Output Disable

Program

V

X

V

Pulse

V

Data In

Data Out

Hi-Z

IL

PP

Verify

V

IL

IH

Program Inhibit

Standby

V

X

V

X

V

or V

Hi-Z

CC

SS

Electronic Signature

V

CC

Codes

IL

IH

ID

Note:

X = V_IHor V_IL, V_ID= 12 ± 0.5V.

Table 3. Electronic Signature

Identifier

Hex

Data

A0

Q7

Q6

Q5

Q4

Q3

Q2

Q1

Q0

Manufacturer’s

Code

V

0

1

0

1

20h

61h

IL

Device Code

V

IH

11/25

M27C2001

Maximum ratings

3

Maximum ratings

Except for the rating "Operating Temperature Range", stresses above those listed in the

Table 4 may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or any other conditions above those indicated in the

Operating sections of this specification is not implied. Exposure to Absolute Maximum

Rating conditions for extended periods may affect device reliability. Refer also to the

STMicroelectronics SURE Program and other relevant quality documents.

Table 4.

Symbol

Absolute Maximum Ratings

Parameter

Value

Unit

(1)

T

Ambient Operating Temperature

Temperature Under Bias

Storage Temperature

–40 to 125

–50 to 125

–65 to 150

–2 to 7

°C

V

A

T

BIAS

T

STG

(2)

V

Input or Output Voltage (except A9)

Supply Voltage

IO

V

–2 to 7

V

CC

(2)

V

A9 Voltage

–2 to 13.5

–2 to 14

V

A9

V

Program Supply Voltage

V

PP

1. Depends on range.

2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than

20ns. Maximum DCvoltage on Output is V_CC+0.5V with possible overshoot to V_CC+2V for a period less

than 20ns.

12/25

DC and AC parameters

M27C2001

4

DC and AC parameters

This section summarizes the operating measurement conditions, and the DC and AC

characteristics of the device. The parameters in the DC and AC characteristics Tables that

follow, are derived from tests performed under the Measurement Conditions summarized in

Table 5, Operating and AC Measurement Conditions. Designers should check that the

operating conditions in their circuit match the operating conditions when relying on the

quoted parameters.

Table 5.

AC Measurement conditions

High Speed

Standard

Input Rise and Fall Times

≤10ns

0 to 3V

1.5V

≤20ns

Input Pulse Voltages

0.4V to 2.4V

0.8V and 2V

Input and Output Timing Ref. Voltages

(1)

Table 6.

Symbol

Capacitance

(T = 25°C, f = 1 MHz)

A

Parameter

Test Condition

= 0V

Min

Max

Unit

C

Input Capacitance

Output Capacitance

V

6

pF

IN

V

= 0V

12

OUT

1. Sampled only, not 100% tested

Figure 6.

AC Testing Input Output Waveform

High Speed

3V

1.5V

0V

Standard

2.4V

2.0V

0.8V

0.4V

AI01822

13/25

M27C2001

Figure 7.

DC and AC parameters

AC Testing Load Circuit

1.3V

1N914

3.3kΩ

DEVICE

UNDER

TEST

OUT

C

L

C

= 30pF for High Speed

= 100pF for Standard

includes JIG capacitance

L

AI01823B

(1)

Table 7.

Symbol

Read Mode DC Characteristics

(T = 0 to 70°C or –40 to 85°C; V = 5V ± 5% or 5V ± 10%; V = V )

A

CC

PP

CC

Parameter

Test Condition

0V ≤V ≤V

Min

Max

Unit

I

Input Leakage Current

Output Leakage Current

Supply Current

±10

30

µA

LI

IN

CC

I

0V ≤V

≤V

LO

OUT CC

mA

E = V , G = V ,

CC

IL

I

= 0mA, f = 5MHz

OUT

I

Supply Current (Standby) TTL

Supply Current (Standby) CMOS

Program Current

E = V

1

mA

µA

V

CC1

CC2

IH

E > V – 0.2V

100

10

CC

I

V

= V

PP CC

PP

V

Input Low Voltage

–0.3

2

0.8

IL

(2)

V

Input High Voltage

V

+ 1

CC

V

IH

V

Output Low Voltage

I

= 2.1mA

= –400µA

= –100µA

0.4

V

OL

Output High Voltage TTL

Output High Voltage CMOS

I

2.4

V

OH

V

– 0.7V

V

CC

1. V_CCmust be applied simultaneously with or before V_PPand removed simultaneously or after V_PP

2. Maximum DC voltage on Output is V_CC+0.5V.

.

14/25

DC and AC parameters

M27C2001

(1)

Table 8.

Symbol

Programming Mode DC Characteristics

(T = 25°C; V = 6.25V ± 0.25V; V = 12.75V ± 0.25V)

A

CC

PP

Parameter

Test Condition

Min

Max

Unit

I

Input Leakage Current

Supply Current

0 ≤V ≤V

IH

±10

50

µA

mA

V

LI

IN

I

CC

I

Program Current

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage TTL

A9 Voltage

E = V

50

PP

IL

V

–0.3

2

0.8

IL

V

+ 0.5

CC

V

IH

V

I

= 2.1mA

OL

0.4

V

OL

V

I

= –400µA

OH

2.4

V

OH

V

11.5

12.5

V

ID

1. V_CCmust be applied simultaneously with or before V_PPand removed simultaneously or after V_PP

.

(1)

Table 9.

Symbol

Read Mode AC Characteristics

(T = 0 to 70°C or –40 to 85°C; V = 5V ± 5% or 5V ± 10%; V = V

)

A

CC

PP

CC

M27C2001

Test

Condition

(2)

Alt

Parameter

-55

Min

-70

-80

-90

Unit

Max Min Max Min Max Min Max

t

55

30

70

35

80

40

90

40

ns

E = V ,

Address Valid

to Output

Valid

AVQV

ACC

IL

G = V

IL

t

G = V

Chip Enable

Low to Output

Valid

ELQV

CE

IL

t

E = V

OutputEnable

Low to Output

Valid

GLQV

OE

IL

(3)

t

Chip Enable

High to Output

Hi-Z

EHQZ

DF

G = V

E = V

0

30

0

30

0

30

0

30

ns

IL

(3)

t

OutputEnable

High to Output

Hi-Z

GHQZ

DF

IL

t

0

ns

E = V ,

AXQX

OH

Address

Transition to

Output

IL

G = V

IL

Transition

1. V_CCmust be applied simultaneously with or before V_PPand removed simultaneously or after V_PP

2. In case of 55ns speed see High Speed AC measurement conditions.

3. Sampled only, not 100% tested.

.

15/25

M27C2001

DC and AC parameters

(1)

Table 10.

Read Mode AC Characteristics

= 5V ± 5% or 5V ± 10%; V = V )

CC

(T = 0 to 70°C or –40 to 85°C; V

A

CC

PP

M27C2001

-12 -15/-20/-25 Unit

Symbol

Alt

Parameter

Test Condition

-10

Min Max Min Max Min Max

t

E = V , G = V

100

50

120

50

150

60

ns

Address Valid to

Output Valid

AVQV

ACC

IL

t

G = V

Chip Enable Low

to Output Valid

ELQV

CE

IL

t

E = V

Output Enable

Low to Output

Valid

GLQV

OE

IL

(2)

t

G = V

0

30

0

40

0

50

ns

Chip Enable

High to Output

Hi-Z

EHQZ

DF

IL

(2)

t

E = V

Output Enable

High to Output

Hi-Z

GHQZ

IL

t

E = V , G = V

Address

AXQX

OH

IL

Transition to

Output Transition

1. V_CCmust be applied simultaneously with or before V_PPand removed simultaneously or after V_PP

.

2. Sampled only, not 100% tested.

16/25

DC and AC parameters

M27C2001

Figure 8.

Read Mode AC Waveforms

VALID

tAVQV

VALID

A0-A17

E

tAXQX

tEHQZ

tGHQZ

tGLQV

G

tELQV

Hi-Z

Q0-Q7

AI00719B

(1)

Table 11.

Symbol

Programming Mode AC Characteristics

(T = 25°C; V = 6.25 ± 0.25V; V = 12.75 ± 0.25V)

A

CC

PP

Test

Condition

Alt

Parameter

Min

Max

Unit

t

Address Valid to Program Low

Input Valid to Program Low

2

µs

ns

AVPL

AS

t

QVPL

DS

t

V

High to Program Low

2

VPHPL

VCHPL

VPS

VCS

CES

PP

CC

t

2

t

Chip Enable Low to Program Low

Program Pulse Width

2

ELPL

PLPH

t

95

2

105

PW

t

Program High to Input Transition

Input Transition to Output Enable Low

Output Enable Low to Output Valid

Output Enable High to Output Hi-Z

Output Enable High to Address Transition

PHQX

QXGL

GLQV

DH

t

2

OES

t

100

130

OE

(2)

t

0

GHQZ

DFP

t

AH

GHAX

1. V_CCmust be applied simultaneously with or before V_PPand removed simultaneously or after V_PP

2. Sampled only, not 100% tested.

.

17/25

M27C2001

DC and AC parameters

Figure 9.

Programming and Verify Modes AC Waveforms

VALID

A0-A17

tAVPL

tQVPL

tVPHPL

tVCHPL

tELPL

Q0-Q7

DATA IN

DATA OUT

tPHQX

V

PP

tGLQV

tGHQZ

tGHAX

V

CC

E

P

tPLPH

tQXGL

G

PROGRAM

VERIFY

AI00720

18/25

Package mechanical data

M27C2001

5

Package mechanical data

Table 12.

Symbol

FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Mechanical

Data

mm

Min

inches

Min

Typ

Max

Typ

Max

A

A1

A2

A3

B

5.72

1.40

4.57

4.50

0.56

—

0.225

0.055

0.180

0.177

0.022

—

0.51

3.91

3.89

0.41

—

0.020

0.154

0.153

0.016

—

B1

C

1.45

0.057

0.23

41.73

—

0.30

42.04

—

0.009

1.643

—

0.012

1.655

—

D

D2

E

38.10

15.24

1.500

0.600

—

E1

e

13.06

—

13.36

—

0.514

—

0.526

—

2.54

0.100

0.590

eA

eB

L

14.99

—

16.18

3.18

1.52

—

18.03

0.637

0.125

0.060

—

0.710

S

2.49

—

0.098

—

7.11

0.280

α

4°

11°

4°

11°

N

32

Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Outline

A2

A3

A1

A

L

α

B1

B

e

C

eA

eB

D2

D

S

N

1

E1

E

FDIPW-a

1. Drawing is not to scale.

19/25

M27C2001

Package mechanical data

Table 13.

Symbol

PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Mechanical Data

mm

Min

inches

Min

Typ

Max

Typ

Max

A

A1

A2

B

—

0.38

3.56

0.38

—

5.08

—

0.015

0.140

0.015

—

0.200

—

4.06

0.51

—

0.160

0.020

—

B1

C

1.52

0.060

0.20

41.78

—

0.30

42.04

—

0.008

1.645

—

0.012

1.655

—

D

D2

E

38.10

15.24

1.500

0.600

—

E1

e1

eA

eB

L

13.59

—

13.84

—

0.535

—

0.545

—

2.54

0.100

0.600

15.24

—

15.24

3.18

1.78

0°

17.78

3.43

2.03

10°

0.600

0.125

0.070

0°

0.700

0.135

0.080

10°

S

α

N

32

Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline

A2

A

L

A1

e1

α

C

B1

B

eA

eB

D2

D

S

N

1

E1

E

PDIP

1. Drawing is not to scale.

20/25

Package mechanical data

M27C2001

Table 14.

Symbol

PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data

millimeters

inches

Typ

Min

Max

Typ

Min

Max

A

A1

A2

B

2.54

1.52

0.38

0.33

0.66

12.32

11.35

9.91

3.56

2.41

0.100

0.060

0.015

0.013

0.026

0.485

0.447

0.390

0.140

0.095

0.53

0.81

0.021

0.032

0.495

0.455

0.430

B1

D

12.57

11.56

10.92

D1

D2

e

1.27

0.89

0.050

0.035

E

14.86

13.89

12.45

0.00

15.11

14.10

13.46

0.25

0.585

0.547

0.490

0.000

0.595

0.555

0.530

0.010

E1

E2

F

R

N

32

7

32

7

Nd

Ne

CP

9

0.10

0.004

Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline

D

A1

D1

A2

1 N

B1

e

E2

E3

E1 E

F

B

0.51 (.020)

E2

1.14 (.045)

Nd

A

R

CP

D2

PLCC-B

1. Drawing is not to scale.

21/25

M27C2001

Package mechanical data

Table 15.

Symb

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package

Mechanical Data

mm

inches

Min

Typ

Min

Max

Typ

Max

A

A1

A2

B

1.20

0.15

1.05

0.27

0.21

20.20

18.50

8.10

—

0.047

0.007

0.041

0.011

0.008

0.795

0.728

0.319

—

0.05

0.95

0.15

0.10

19.80

18.30

7.90

—

0.002

0.037

0.006

0.004

0.780

0.720

0.311

—

C

D

D1

E

e

0.50

0.020

L

0.50

0°

0.70

5°

0.020

0°

0.028

5°

α

N

32

CP

0.10

0.004

Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline

A2

1

N

e

E

B

N/2

D1

D

A

CP

DIE

C

TSOP-a

A1

α

L

1. Drawing is not to scale.

22/25

Part numbering scheme

M27C2001

6

Part numbering scheme

Table 16.

Ordering Information Scheme

Example:

M27C2001

-55 X

C

1 TR

Device Type

M27

Supply Voltage

C = 5V

Device Function

2001 = 2 Mbit (256Kb x 8)

Speed

(1)

– 55

= 55 ns

– 70 = 70 ns

– 80 = 80 ns

– 90 = 90 ns

– 10 = 100 ns

(2)

Not For New Design

– 12 = 120 ns

– 15 = 150 ns

– 20 = 200 ns

– 25 = 250 ns

V

Tolerance

CC

X = ± 5%

blank = ± 10%

Package

F = FDIP32W

B = PDIP32

C = PLCC32

N = TSOP32: 8 x 20 mm

Temperature Range

1 = 0 to 70°C

6 = –40 to 85°C

Options

TR = Tape & Reel Packing

1. High Speed, see AC Characteristics section for further information.

2. These speeds are replaced by the 100ns.

For a list of available options (Speed, Package, etc....) or for further information on any

aspect of this de-vice, please contact the STMicroelectronics Sales Office nearest to you.

23/25

M27C2001

Revision history

7

Revision history

Structure

Table 17.

Date

Document revision history

Revision

Changes

June 1998

1

2

3

4

First Issue.

20-Sep-2000

29-Nov-2000

10-May-2006

AN620 Reference removed.

PLCC codification changed (Table 14).

Structure modified, ECOPACK text added.

LCCC32W package and the additional burn-in option (X) from

Ordering information scheme removed.

24/25

M27C2001

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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the

right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any

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UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED

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25/25


型号：	M27C2001-10C6
厂家：	ST
描述：	256KX8 OTPROM, 100ns, PQCC32, LEAD FREE, PLASTIC, LCC-32 可编程只读存储器 OTP只读存储器内存集成电路
文件：	总25页 (文件大小：200K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

M27C2001-10C6 [STMICROELECTRONICS]

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