M27W102-80N6TR [STMICROELECTRONICS]

1 Mbit 64Kb x16 Low Voltage UV EPROM and OTP EPROM; 1兆位64Kb的X16低电压UV EPROM和OTP EPROM
M27W102-80N6TR
型号: M27W102-80N6TR
厂家: ST    ST
描述:

1 Mbit 64Kb x16 Low Voltage UV EPROM and OTP EPROM
1兆位64Kb的X16低电压UV EPROM和OTP EPROM

存储 内存集成电路 光电二极管 可编程只读存储器 OTP只读存储器 电动程控只读存储器
文件: 总15页 (文件大小:106K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
M27W102  
1 Mbit (64Kb x16) Low Voltage UV EPROM and OTP EPROM  
2.7V to 3.6V LOW VOLTAGE in READ  
OPERATION  
READ ACCESS TIME:  
– 70ns at V = 3.0V to 3.6V  
CC  
– 80ns at V = 2.7V to 3.6V  
CC  
40  
40  
PIN COMPATIBLE with M27C1024  
LOW POWER CONSUMPTION:  
– 15µA max Standby Current  
1
1
FDIP40W (F)  
PDIP40 (B)  
– 15mA max Active Current at 5MHz  
PROGRAMMING TIME 100µs/word  
HIGH RELIABILITY CMOS TECHNOLOGY  
– 2,000V ESD Protection  
– 200mA Latchup Protection Immunity  
ELECTRONIC SIGNATURE  
– Manufacturer Code: 0020h  
PLCC44 (K)  
TSOP40 (N)  
10 x 14 mm  
Figure 1. Logic Diagram  
– Device Code: 008Ch  
DESCRIPTION  
The M27W102 is a low voltage 1 Mbit EPROM of-  
fered in the two ranges UV (ultra violet erase) and  
OTP (one time programmable). It is ideally suited  
for microprocessor systems requiring large data or  
program storage and is organized as 65,536  
words by 16 bits.  
V
V
CC  
PP  
16  
16  
The M27W102 operates in the read mode with a  
supply voltage as low as 2.7V at –40 to 85°C tem-  
perature range. The decrease in operating power  
allows either a reduction of the size of the battery  
or an increase in the time between battery re-  
charges.  
A0-A15  
Q0-Q15  
P
M27W102  
E
The FDIP40W (window ceramic frit-seal package)  
has a transparent lid which allows the user to ex-  
pose the chip to ultraviolet light to erase the bit pat-  
tern. A new pattern can then be written to the  
device by following the programming procedure.  
G
For application where the content is programmed  
only one time and erasure is not required, the  
M27w102 is offered in PDIP40, PLCC44 and  
TSOP40 (10 x 14 mm) packages.  
V
SS  
AI01922  
April 2000  
1/15  
M27W102  
Figure 2A. DIP Connections  
Figure 2B. LCC Connections  
V
1
2
3
4
5
6
7
8
9
40  
39  
V
P
PP  
E
CC  
Q15  
Q14  
Q13  
Q12  
Q11  
Q10  
Q9  
38 NC  
37 A15  
36 A14  
35 A13  
34 A12  
33 A11  
32 A10  
31 A9  
1 44  
Q12  
A13  
A12  
A11  
A10  
A9  
Q11  
Q10  
Q9  
Q8  
Q8 10  
M27W102  
V
12  
M27W102  
34  
V
SS  
SS  
V
SS  
11  
30  
V
SS  
NC  
Q7  
Q6  
Q5  
Q4  
NC  
A8  
A7  
A6  
A5  
Q7 12  
Q6 13  
Q5 14  
Q4 15  
Q3 16  
Q2 17  
Q1 18  
Q0 19  
29 A8  
28 A7  
27 A6  
26 A5  
25 A4  
24 A3  
23 A2  
22 A1  
21 A0  
23  
AI01924  
G
20  
AI02673  
Figure 2C. TSOP Connections  
Table 1. Signal Names  
A0-A15  
Address Inputs  
A9  
A10  
A11  
A12  
A13  
A14  
A15  
NC  
1
40  
V
SS  
A8  
Q0-Q15  
Data Outputs  
Chip Enable  
Output Enable  
Program  
E
G
P
A7  
A6  
A5  
A4  
A3  
V
Program Supply  
Supply Voltage  
Ground  
PP  
A2  
P
A1  
V
CC  
V
10  
11  
M27W102  
(Normal)  
31  
30  
A0  
CC  
V
G
PP  
E
V
SS  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ15  
DQ14  
DQ13  
DQ12  
DQ11  
DQ10  
DQ9  
NC  
Not Connected Internally  
DQ8  
20  
21  
V
SS  
AI01925  
2/15  
M27W102  
(1)  
Table 2. Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
–40 to 85  
–50 to 125  
–65 to 150  
–2 to 7  
Unit  
°C  
°C  
°C  
V
(3)  
T
A
Ambient Operating Temperature  
T
Temperature Under Bias  
Storage Temperature  
Input or Output Voltage (except A9)  
Supply Voltage  
BIAS  
T
STG  
(2)  
V
IO  
V
–2 to 7  
V
CC  
(2)  
A9 Voltage  
–2 to 13.5  
–2 to 14  
V
V
A9  
V
Program Supply Voltage  
V
PP  
Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may  
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions  
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-  
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-  
ity documents.  
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC  
voltage on Output is V  
3. Depends on range.  
+0.5V with possible overshoot to V  
+2V for a period less than 20ns.  
CC  
CC  
Table 3. Operating Modes  
Mode  
V
E
G
P
A9  
X
Q15-Q0  
Data Out  
Hi-Z  
PP  
V
V
V
V
V
or V  
or V  
Read  
IL  
IL  
IL  
IL  
IL  
IH  
CC  
CC  
SS  
SS  
Output Disable  
Program  
V
V
V
V
V
X
X
IH  
V
Pulse  
V
X
X
Data Input  
Data Output  
Hi-Z  
IL  
PP  
PP  
PP  
Verify  
V
V
X
V
IL  
IH  
V
Program Inhibit  
Standby  
X
X
X
IH  
IH  
V
V
or V  
CC SS  
X
X
X
Hi-Z  
V
V
V
V
V
CC  
Electronic Signature  
Codes  
IL  
IL  
IH  
ID  
Note: X = V or V , V = 12V ± 0.5V.  
IH IL ID  
Table 4. Electronic Signature  
Identifier  
Manufacturer’s Code  
Device Code  
A0  
Q7  
0
Q6  
Q5  
1
Q4  
0
Q3  
0
Q2  
0
Q1  
0
Q0  
Hex Data  
20h  
V
0
0
0
0
IL  
V
1
0
0
1
1
0
8Ch  
IH  
Note: Outputs Q15-Q8 are set to ’0’.  
3/15  
M27W102  
Table 5. AC Measurement Conditions  
High Speed  
10ns  
Standard  
20ns  
Input Rise and Fall Times  
Input Pulse Voltages  
0 to 3V  
1.5V  
0.4V to 2.4V  
0.8V and 2V  
Input and Output Timing Ref. Voltages  
Figure 3. AC Testing Input Output Waveform  
Figure 4. AC Testing Load Circuit  
1.3V  
High Speed  
1N914  
3V  
1.5V  
3.3kΩ  
0V  
DEVICE  
UNDER  
TEST  
OUT  
Standard  
C
L
2.4V  
2.0V  
0.8V  
0.4V  
C
C
C
= 30pF for High Speed  
= 100pF for Standard  
includes JIG capacitance  
L
L
L
AI01822  
AI01823B  
(1)  
Table 6. Capacitance  
Symbol  
(T = 25 °C, f = 1 MHz)  
A
Parameter  
Test Condition  
Min  
Max  
6
Unit  
pF  
C
V
= 0V  
= 0V  
Input Capacitance  
Output Capacitance  
IN  
IN  
C
OUT  
V
12  
pF  
OUT  
Note: Sampled only, not 100% tested.  
DEVICE OPERATION  
(t  
(t  
) is equal to the delay from E to output  
). Data is available at the output after a delay  
AVQV  
ELQV  
The operating modes of theM27W102 are listed in  
the Operating Modes table. A single power supply  
is required in the read mode. All inputs are TTL  
of t from the falling edge of G, assuming that E  
OE  
has been low and the addresses have been stable  
for at least t  
Standby Mode  
-t  
.
AVQV GLQV  
levels except for V and 12V on A9 for Electronic  
PP  
Signature.  
Read Mode  
The M27W102 has a standby mode which reduc-  
es the supply current from 15mA to 15µA with low  
The M27W102 has two control functions, both of  
which must be logically active in order to obtain  
data at the outputs. Chip Enable (E) is the power  
control and should be used for device selection.  
Output Enable(G) is the output control and should  
be used to gate data to the output pins, indepen-  
dent of device selection. Assuming that the ad-  
dresses are stable, the address access time  
voltage operation V 3.6V, see Read Mode DC  
CC  
Characteristics table for details. The M27W102 is  
placed in the standby mode by applying a CMOS  
high signal to the E input. When in the standby  
mode, the outputs are in a high impedance state,  
independent of the G input.  
4/15  
M27W102  
(1)  
Table 7. Read Mode DC Characteristics  
(T = –40 to 85°C; V = 2.7V to 3.6V; V = V  
)
CC  
A
CC  
PP  
Symbol  
Parameter  
Test Condition  
Min  
Max  
Unit  
µA  
I
Input Leakage Current  
Output Leakage Current  
±10  
±10  
0V V V  
LI  
IN  
CC  
I
0V V  
V  
OUT CC  
µA  
LO  
E = V , G = V ,  
IL  
IL  
I
= 0mA, f = 5MHz,  
I
Supply Current  
OUT  
15  
mA  
CC  
V
3.6V  
CC  
I
E = V  
IH  
Supply Current (Standby) TTL  
Supply Current (Standby) CMOS  
1
mA  
CC1  
E > V – 0.2V,  
CC  
I
15  
µA  
CC2  
V
3.6V  
CC  
I
V
= V  
Program Current  
10  
µA  
V
PP  
PP  
CC  
V
0.2 V  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage TTL  
–0.6  
IL  
CC  
(2)  
0.7 V  
V
+ 0.5  
CC  
V
V
CC  
IH  
V
I
= 2.1mA  
0.4  
V
OL  
OL  
V
I
= –400µA  
OH  
2.4  
V
OH  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V  
.
PP  
CC  
PP  
2. Maximum DC voltage on Output is V +0.5V.  
CC  
Two Line Output Control  
System Considerations  
Because EPROMs are usually used in larger  
memory arrays, this product features a 2 line con-  
trol function which accommodates the use of mul-  
tiple memory connection. The two line control  
function allows:  
The power switching characteristics of Advanced  
CMOS EPROMs require careful decoupling of the  
devices. The supply current, I , has three seg-  
CC  
ments that are of interest to the system designer:  
the standby current level, the active current level,  
and transient current peaks that are produced by  
the falling and rising edges of E. The magnitude of  
transient current peaks is dependent on the ca-  
pacitive and inductive loading of the device at the  
output. The associated transient voltage peaks  
can be suppressed by complying with the two line  
output control and by properly selected decoupling  
capacitors. It is recommended that a 0.1µF ceram-  
a. the lowest possible memory power dissipation,  
b. complete assurance that output bus contention  
will not occur.  
For the most efficient use of these two control  
lines, Eshould be decoded and used as the prima-  
ry device selecting function, while G should be  
made a common connection to all devices in the  
array and connected to the READ line from the  
system control bus. This ensures that all deselect-  
ed memory devices are in their low power standby  
mode and that the output pins are only active  
when data is required from a particular memory  
device.  
ic capacitor be used on every device between V  
CC  
and V . This should be a high frequency capaci-  
SS  
tor of low inherent inductance and should be  
placed as close to the device as possible. In addi-  
tion, a 4.7µF bulk electrolytic capacitor should be  
used between V and V for every eight devic-  
CC  
SS  
es. The bulk capacitor should be located near the  
power supply connection point. The purpose of the  
bulk capacitor is to overcome the voltage drop  
caused by the inductive effects of PCB traces.  
5/15  
M27W102  
(1)  
Table 8. Read Mode AC Characteristics  
(T = –40 to 85°C; V = 2.7V to 3.6V; V = V  
)
CC  
A
CC  
PP  
M27W102  
-100  
(-120/-150/-200)  
(3)  
-80  
Test  
Condition  
Symbol  
Alt  
Parameter  
Unit  
V
= 3.0V to 3.6V V = 2.7V to 3.6V V = 2.7V to 3.6V  
CC CC  
CC  
Min  
Max  
Min  
Max  
Min  
Max  
E = V ,  
Address Valid to  
Output Valid  
IL  
t
t
t
t
70  
80  
100  
ns  
ns  
ns  
ns  
ns  
ns  
AVQV  
ELQV  
ACC  
G = V  
IL  
Chip Enable Low to  
Output Valid  
t
G = V  
70  
40  
40  
40  
80  
50  
50  
50  
100  
60  
CE  
IL  
Output Enable Low  
to Output Valid  
t
E = V  
IL  
GLQV  
OE  
Chip Enable High  
to Output Hi-Z  
(2)  
t
t
G = V  
0
0
0
0
0
0
0
0
0
60  
t
DF  
DF  
IL  
EHQZ  
Output EnableHigh  
to Output Hi-Z  
(2)  
E = V  
60  
t
IL  
GHQZ  
E = V ,  
Address Transition  
to Output Transition  
IL  
t
t
OH  
AXQX  
G = V  
IL  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
2. Sampled only, not 100% tested.  
3. Speed obtained with High Speed AC measurement conditions.  
Figure 5. Read Mode AC Waveforms  
VALID  
VALID  
A0-A15  
tAVQV  
tAXQX  
E
tEHQZ  
tGHQZ  
tGLQV  
G
tELQV  
Hi-Z  
Q0-Q15  
AI00705B  
6/15  
M27W102  
(1)  
Table 9. Programming Mode AC Characteristics  
(T = 25 °C; V = 6.25V ± 0.25V; V = 12.75V ± 0.25V)  
A
CC  
PP  
Parameter  
Symbol  
Test Condition  
Min  
Max  
±10  
50  
Unit  
µA  
mA  
mA  
V
I
Input Leakage Current  
Supply Current  
0V V V  
LI  
IN  
IH  
I
CC  
I
E = V  
Program Current  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage TTL  
A9 Voltage  
50  
PP  
IL  
V
–0.3  
2
0.8  
IL  
V
V
+ 0.5  
CC  
V
IH  
V
I
= 2.1mA  
OL  
0.4  
V
OL  
V
I
= –400µA  
2.4  
V
OH  
OH  
V
11.5  
12.5  
V
ID  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
(1)  
Table 10. Programming Mode AC Characteristics  
(T = 25 °C; V = 6.25V ± 0.25V; V = 12.75V ± 0.25V)  
A
CC  
PP  
Symbol  
Alt  
Parameter  
Test Condition  
Min  
2
Max  
Unit  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
t
t
t
Address Valid to Program Low  
Input Valid to Program Low  
AVPL  
AS  
t
2
QVPL  
DS  
t
t
V
V
High to Program Low  
High to Program Low  
2
VPHPL  
VPS  
VCS  
CES  
PP  
CC  
t
t
t
2
VCHPL  
t
t
Chip Enable Low to Program Low  
Program Pulse Width  
2
ELPL  
t
95  
2
105  
PLPH  
PW  
t
t
Program High to Input Transition  
Input Transition to Output Enable Low  
Output Enable Low to Output Valid  
PHQX  
DH  
t
t
2
QXGL  
GLQV  
OES  
t
t
100  
130  
OE  
(2)  
t
Output Enable High to Output Hi-Z  
0
0
ns  
ns  
t
DFP  
GHQZ  
Output Enable High to Address  
Transition  
t
t
GHAX  
AH  
Note: 1. V must be applied simultaneously with or before V and removed simultaneously or after V .  
PP  
CC  
PP  
2. Sampled only, not 100% tested.  
Programming  
though only ’0’s will be programmed, both ’1’s and  
’0’s can be present in the data word. The only way  
to change a ‘0’ to a ‘1’ is by die exopsure to ultra-  
violet light (UV EPROM). The M27W102 is in the  
The M27W102 hasbeen designed to be fully com-  
patible withthe M27C1024 and hasthe same elec-  
tronic signature. As a result the M27W102 can be  
programmed as the M27C1024 on the same pro-  
programming mode when V input is at 12.75V,  
PP  
E is at V and P is pulsed to V . The data to be  
IL  
IL  
gramming equipmentapplying 12.75V on V and  
PP  
programmed is applied to 16 bits in parallel to the  
6.25V on V by the use of the same PRESTO II  
CC  
data output pins. The levels required for the ad-  
algorithm. When delivered (and after each ‘1’s era-  
sure for UV EPROM), all bits of the M27W102 are  
in the ’1’ state. Data is introduced by selectively  
programming ’0’s into the desired bit locations. Al-  
dress and data inputs are TTL. V is specified to  
CC  
be 6.25V ± 0.25V.  
7/15  
M27W102  
Figure 6. Programming and Verify Modes AC Waveforms  
VALID  
A0-A15  
Q0-Q15  
tAVPL  
tQVPL  
DATA IN  
DATA OUT  
tPHQX  
V
PP  
tVPHPL  
tGLQV  
tGHQZ  
tGHAX  
V
CC  
tVCHPL  
E
tELPL  
tPLPH  
P
tQXGL  
G
PROGRAM  
VERIFY  
AI00706  
Figure 7. Programming Flowchart  
PRESTO II Programming Algorithm  
PRESTO II Programming Algorithm allows pro-  
gramming of the whole array with a guaranteed  
margin, in a typical time of 6.5 seconds. Program-  
ming with PRESTO II consists of applying a se-  
quence of 100µs program pulses to each word  
until a correct verify occurs (see Figure 7). During  
programming and verify operation, a MARGIN  
MODE circuit is automatically activated in order to  
guarantee that each cell is programmed with  
enough margin. No overprogram pulse is applied  
V
= 6.25V, V  
= 12.75V  
PP  
CC  
n = 0  
P = 100µs Pulse  
since the verify in MARGIN MODE at V  
much  
NO  
CC  
higher than 3.6V, provides necessary margin to  
each programmed cell.  
NO  
++n  
= 25  
VERIFY  
YES  
++ Addr  
Program Inhibit  
YES  
Programming of multiple M27W102s in parallel  
with different data is also easily accomplished. Ex-  
cept for E, all like inputs including G of the parallel  
M27W102 may be common. A TTL low level pulse  
applied to a M27W102’s P input, with E low and  
Last  
NO  
FAIL  
Addr  
YES  
V
at 12.75V, will program that M27W102. A high  
PP  
level E input inhibits the other M27W102s from be-  
CHECK ALL WORDS  
1st: V  
2nd: V  
= 5V  
= 2.7V  
ing programmed.  
Program Verify  
CC  
CC  
A verify (read) should be performed on the pro-  
grammed bits to determine that they were correct-  
ly programmed. The verify is accomplished with E  
AI00707D  
and G at V , P at V , V at 12.75V and V at  
IL  
IH  
PP  
CC  
6.25V.  
8/15  
M27W102  
On-Board Programming  
ERASURE OPERATION (applies to UV EPROM)  
The M27W102 can be directly programmed in the  
application circuit. See the relevant Application  
Note AN620.  
The erasure characteristics of the M27W102 is  
such that erasure begins when the cells are ex-  
posed to light with wavelengths shorter than ap-  
proximately 4000Å. Itshould be noted that sunlight  
and some type of fluorescent lamps have wave-  
lengths in the 3000-4000Å range. Research  
shows that constant exposure to room level fluo-  
rescent lighting could erase a typical M27W102 in  
about 3 years, while it would take approximately 1  
week to cause erasure when exposed to direct  
sunlight. If the M27W102 is to be exposed to these  
types of lighting conditions for extended periods of  
time, it is suggested that opaque labels be put over  
the M27W102 window to prevent unintentional  
erasure. The recommended erasure procedure for  
the M27W102 is exposure to short wave ultraviolet  
light which has a wavelength of 2537Å. The inte-  
grated dose (i.e. UV intensity x exposure time) for  
Electronic Signature  
The Electronic Signature (ES) mode allows the  
reading out of a binary code from an EPROM that  
will identify its manufacturer and type. This mode  
is intended for use by programming equipment to  
automatically match the device to be programmed  
with its corresponding programming algorithm.  
The ES mode is functional in the 25°C ± 5°C am-  
bient temperature range that is required when pro-  
gramming the M27W102. To activate the ES  
mode, the programming equipment must force  
11.5V to 12.5V on address line A9 of the  
M27W102 with V  
= V  
= 5V. Two identifier  
PP  
CC  
bytes maythen be sequenced from the device out-  
puts by toggling address line A0 from V to V . All  
2
IL  
IH  
erasure should be a minimum of 15 W-sec/cm .  
other address lines must be held at V during  
IL  
The erasure time with this dosage is approximate-  
ly 15 to 20 minutes using an ultraviolet lamp with  
Electronic Signature mode. Byte 0 (A0 = V ) rep-  
IL  
resents the manufacturer code and byte 1  
2
12000 µW/cm power rating. The M27W102  
(A0 = V ) the device identifier code. For the  
IH  
should be placed within 2.5 cm (1 inch) of the lamp  
tubes during the erasure. Some lamps have a filter  
on their tubes which should be removed before  
erasure.  
STMicroelectronics M27W102, these two identifier  
bytes are given in Table 4 and can be read-out on  
outputs Q7 to Q0.  
Note that the M27W102 and M27C1002 have the  
same byte identifier.  
9/15  
M27W102  
Table 11. Ordering Information Scheme  
Example:  
M27W102  
-80  
K
6
TR  
Device Type  
M27  
Supply Voltage  
W = 2.7V to 3.6V  
Device Function  
102 = 1 Mbit (64Kb x16)  
Speed  
(1,2)  
-80  
= 80 ns  
-100 = 100 ns  
(3)  
Not For New Design  
-120 = 120 ns  
-150 = 150 ns  
-200 = 200 ns  
Package  
(4)  
F = FDIP40W  
B = PDIP40  
K = PLCC44  
(4)  
N = TSOP40: 10 x 14 mm  
Temperature Range  
6 = –40 to 85 °C  
Options  
TR = Tape & Reel Packing  
Note: 1. High Speed, see AC Characteristics section for further information.  
2. This speed also guarantees 70ns access time at V = 3.0V to 3.6V.  
CC  
3. These speeds are replaced by the 100ns.  
4. Packages option available on request. Please contact STMicroelectronics local Sales Office.  
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-  
vice, please contact the STMicroelectronics Sales Office nearest to you.  
Table 12. Revision History  
Date  
July 1999  
Revision Details  
First Issue  
FDIP40W Package Dimension, L Max added (Table 13)  
TSOP40 Package Dimension changed (Table 16)  
0 to 70°C Temperature Range deleted  
04/04/00  
10/15  
I
changed (Table 7)  
PP  
M27W102  
Table 13. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data  
mm  
inches  
Symbol  
Typ  
Min  
Max  
5.72  
1.40  
4.57  
4.50  
0.56  
Typ  
Min  
Max  
0.225  
0.055  
0.180  
0.177  
0.022  
A
A1  
A2  
A3  
B
0.51  
3.91  
3.89  
0.41  
0.020  
0.154  
0.153  
0.016  
B1  
C
1.45  
0.057  
0.23  
51.79  
0.30  
52.60  
0.009  
2.039  
0.012  
2.071  
D
D2  
E
48.26  
15.24  
1.900  
0.600  
E1  
e
13.06  
13.36  
0.514  
0.526  
2.54  
0.100  
0.590  
eA  
eB  
L
14.99  
16.18  
3.18  
1.52  
18.03  
4.10  
2.49  
0.637  
0.125  
0.060  
0.710  
0.161  
0.098  
S
8.13  
0.320  
α
4°  
11°  
4°  
11°  
N
40  
40  
Figure 8. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline  
A2  
A3  
A1  
A
L
α
B1  
B
e
C
eA  
eB  
D2  
D
S
N
1
E1  
E
FDIPW-a  
Drawing is not to scale.  
11/15  
M27W102  
Table 14. PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data  
mm  
Min  
inches  
Min  
Symbol  
Typ  
4.45  
0.64  
Max  
Typ  
Max  
A
A1  
A2  
B
0.175  
0.025  
0.38  
3.56  
0.38  
1.14  
0.20  
51.78  
0.015  
0.140  
0.015  
0.045  
0.008  
2.039  
3.91  
0.53  
1.78  
0.31  
52.58  
0.154  
0.021  
0.070  
0.012  
2.070  
B1  
C
D
D2  
E
48.26  
1.900  
14.80  
13.46  
16.26  
13.99  
0.583  
0.530  
0.640  
0.551  
E1  
e1  
eA  
eB  
L
2.54  
0.100  
0.600  
15.24  
15.24  
3.05  
1.52  
0°  
17.78  
3.81  
2.29  
15°  
0.600  
0.120  
0.060  
0°  
0.700  
0.150  
0.090  
15°  
S
α
N
40  
40  
Figure 9. PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Outline  
A2  
A
L
A1  
e1  
α
C
B1  
B
eA  
eB  
D2  
D
S
N
1
E1  
E
PDIP  
Drawing is not to scale.  
12/15  
M27W102  
Table 15. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data  
mm  
Min  
4.20  
2.29  
inches  
Min  
Symbol  
Typ  
Max  
4.70  
3.04  
0.51  
0.53  
0.81  
17.65  
16.66  
16.00  
17.65  
16.66  
16.00  
Typ  
Max  
0.185  
0.120  
0.020  
0.021  
0.032  
0.695  
0.656  
0.630  
0.695  
0.656  
0.630  
A
A1  
A2  
B
0.165  
0.090  
0.33  
0.66  
17.40  
16.51  
14.99  
17.40  
16.51  
14.99  
0.013  
0.026  
0.685  
0.650  
0.590  
0.685  
0.650  
0.590  
B1  
D
D1  
D2  
E
E1  
E2  
e
1.27  
0.89  
0.050  
0.035  
F
0.00  
0.25  
0.000  
0.010  
R
N
44  
44  
CP  
0.10  
0.004  
Figure 10. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline  
D
A1  
D1  
A2  
1 N  
B1  
e
Ne  
E1 E  
D2/E2  
F
B
0.51 (.020)  
1.14 (.045)  
Nd  
A
R
CP  
PLCC  
Drawing is not to scale.  
13/15  
M27W102  
Table 16. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14 mm, Package Mechanical Data  
mm  
Min  
inch  
Min  
Symbol  
Typ  
Max  
1.200  
0.150  
1.050  
0.270  
0.210  
14.200  
12.500  
Typ  
Max  
0.0472  
0.0059  
0.0413  
0.0106  
0.0083  
0.5591  
0.4921  
A
A1  
A2  
B
0.050  
0.950  
0.170  
0.100  
13.800  
12.300  
0.0020  
0.0374  
0.0067  
0.0039  
0.5433  
0.4843  
C
D
D1  
e
0.500  
0.0197  
E
9.900  
0.500  
0°  
10.100  
0.700  
5°  
0.3898  
0.0197  
0°  
0.3976  
0.0276  
5°  
L
α
CP  
N
0.100  
0.0039  
40  
40  
Figure 11. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14 mm, Package Outline  
A2  
1
N
e
E
B
N/2  
D1  
D
A
CP  
DIE  
C
TSOP-a  
Drawing is not to scale.  
A1  
α
L
14/15  
M27W102  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is registered trademark of STMicroelectronics  
2000 STMicroelectronics - All Rights Reserved  
All other names are the property of their respective owners.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
15/15  

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