M93C66DW [STMICROELECTRONICS]
16Kbit, 8Kbit, 4Kbit, 2Kbit, 1Kbit and 256bit 8-bit or 16-bit wide; 16Kbit的， 8Kbit ， 4k位， 2Kbit ， 1K位， 256位和8位或16位宽
| 型号： | M93C66DW |
| 厂家： | 
ST |
| 描述： | 16Kbit, 8Kbit, 4Kbit, 2Kbit, 1Kbit and 256bit 8-bit or 16-bit wide |
| 文件： | 总31页 (文件大小：612K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M93C86, M93C76, M93C66
M93C56, M93C46
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide)
MICROWIRE® Serial Access EEPROM
FEATURES SUMMARY
■
Industry Standard MICROWIRE Bus
Figure 1. Packages
■
Single Supply Voltage:
–
–
–
4.5 to 5.5V for M93Cx6
2.5 to 5.5V for M93Cx6-W
1.8 to 5.5V for M93Cx6-R
8
■
■
Dual Organization: by Word (x16) or Byte (x8)
Programming Instructions that work on: Byte,
Word or Entire Memory
1
■
Self-timed Programming Cycle with Auto-
Erase
PDIP8 (BN)
■
■
Ready/Busy Signal During Programming
Speed:
–
1MHz Clock Rate, 10ms Write Time
(Current product, identified by process
identification letter F or M)
8
–
2MHz Clock Rate, 5ms Write Time (New
Product, identified by process
1
identification letter W or G or S)
SO8 (MN)
150 mil width
■
■
■
■
Sequential Read Operation
Enhanced ESD/Latch-Up Behaviour
More than 1 Million Erase/Write Cycles
More than 40 Year Data Retention
Table 1. Product List
Part
Reference
Part
Number
TSSOP8 (DW)
169 mil width
Reference
Number
M93C86
M93C56
M93C86
M93C76
M93C66
M93C86-W
M93C86-R
M93C76
M93C56
M93C56-W
M93C56-R
M93C46
TSSOP8 (DS)
3x3mm² body size (MSOP)
M93C76-W
M93C76-R
M93C66
M93C46
M93C46-W
M93C46-R
UFDFPN8 (MB)
2x3mm² (MLP)
M93C66-W
M93C66-R
August 2004
1/31
M93C86, M93C76, M93C66, M93C56, M93C46
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 3. Memory Size versus Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 4. Instruction Set for the M93Cx6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. DIP, SO, TSSOP and MLP Connections (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
POWER-ON DATA PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 5. Instruction Set for the M93C46 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 6. Instruction Set for the M93C56 and M93C66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 7. Instruction Set for the M93C76 and M93C86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Erase/Write Enable and Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. READ, WRITE, EWEN, EWDS Sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Erase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. ERASE, ERAL Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Erase All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. WRAL Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
READY/BUSY STATUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
COMMON I/O OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
CLOCK PULSE COUNTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Write Sequence with One Clock Glitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Operating Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 10. Operating Conditions (M93Cx6-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Operating Conditions (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 12. AC Measurement Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. AC Testing Input Output Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 14. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 15. DC Characteristics (M93Cx6, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 16. DC Characteristics (M93Cx6, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 17. DC Characteristics (M93Cx6-W, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 18. DC Characteristics (M93Cx6-W, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 19. DC Characteristics (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 20. AC Characteristics (M93Cx6, Device Grade 6, 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 21. AC Characteristics (M93Cx6-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 22. AC Characteristics (M93Cx6-W, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 23. AC Characteristics (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 9. Synchronous Timing (Start and Op-Code Input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 10.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 11.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 12.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 23
Table 24. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 23
Figure 13.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 24
Table 25. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
24
Figure 14.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
25
Table 26. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data.
25
Figure 15.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline
26
Table 27. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data
26
Figure 16.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 27
Table 28. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 27
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 29. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 30. How to Identify Current and New Products by the Process Identification Letter . . . . . . . 29
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 31. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3/31
M93C86, M93C76, M93C66, M93C56, M93C46
SUMMARY DESCRIPTION
Table 3. Memory Size versus Organization
These electrically erasable programmable memo-
ry (EEPROM) devices are accessed through a Se-
rial Data Input (D) and Serial Data Output (Q)
using the MICROWIRE bus protocol.
Number
of 8-bit
Bytes
Number
of 16-bit
Words
Number
of Bits
Device
M93C86
M93C76
M93C66
M93C56
M93C46
16384
8192
4096
2048
1024
2048
1024
512
1024
512
256
128
64
Figure 2. Logic Diagram
256
V
CC
128
The M93Cx6 is accessed by a set of instructions,
as summarized in Table 4., and in more detail in
Table 5. to Table 7.).
D
Q
C
S
Table 4. Instruction Set for the M93Cx6
M93Cx6
Instruction
READ
Description
Data
Read Data from Memory Byte or Word
ORG
WRITE
EWEN
Write Data to Memory
Erase/Write Enable
Erase/Write Disable
Erase Byte or Word
Erase All Memory
Byte or Word
Byte or Word
V
SS
AI01928
EWDS
ERASE
ERAL
Write All Memory
with same Data
WRAL
A Read Data from Memory (READ) instruction
loads the address of the first byte or word to be
read in an internal address register. The data at
this address is then clocked out serially. The ad-
dress register is automatically incremented after
the data is output and, if Chip Select Input (S) is
held High, the M93Cx6 can output a sequential
stream of data bytes or words. In this way, the
memory can be read as a data stream from eight
to 16384 bits long (in the case of the M93C86), or
continuously (the address counter automatically
rolls over to 00h when the highest address is
reached).
Table 2. Signal Names
S
Chip Select Input
D
Serial Data Input
Serial Data Output
Serial Clock
Q
C
ORG
Organisation Select
Supply Voltage
Ground
V
CC
V
SS
Programming is internally self-timed (the external
clock signal on Serial Clock (C) may be stopped or
left running after the start of a Write cycle) and
does not require an Erase cycle prior to the Write
instruction. The Write instruction writes 8 or 16 bits
at a time into one of the byte or word locations of
the M93Cx6. After the start of the programming cy-
cle, a Busy/Ready signal is available on Serial
Data Output (Q) when Chip Select Input (S) is driv-
en High.
The memory array organization may be divided
into either bytes (x8) or words (x16) which may be
selected by a signal applied on Organization Se-
lect (ORG). The bit, byte and word sizes of the
memories are as shown in Table 3..
4/31
M93C86, M93C76, M93C66, M93C56, M93C46
MEMORY ORGANIZATION
An internal Power-on Data Protection mechanism
in the M93Cx6 inhibits the device when the supply
is too low.
The M93Cx6 memory is organized either as bytes
(x8) or as words (x16). If Organization Select
(ORG) is left unconnected (or connected to V
the x16 organization is selected; when Organiza-
tion Select (ORG) is connected to Ground (V
)
CC
Figure 3. DIP, SO, TSSOP and MLP
Connections (Top View)
)
SS
the x8 organization is selected. When the M93Cx6
is in stand-by mode, Organization Select (ORG)
should be set either to V
power consumption. Any voltage between V
or V
for minimum
SS
CC
M93Cx6
SS
and V
applied to Organization Select (ORG)
CC
S
C
D
Q
1
2
3
4
8
V
CC
DU
may increase the stand-by current.
7
6
5
ORG
V
SS
AI01929B
POWER-ON DATA PROTECTION
To prevent data corruption and inadvertent write
operations during power-up, a Power-On Reset
(POR) circuit resets all internal programming cir-
cuitry, and sets the device in the Write Disable
mode.
Note: 1. See PACKAGE MECHANICAL section for package di-
mensions, and how to identify pin-1.
2. DU = Don’t Use.
–
At Power-up and Power-down, the device
must not be selected (that is, Chip Select Input
(S) must be driven Low) until the supply
The DU (Don’t Use) pin does not contribute to the
normal operation of the device. It is reserved for
use by STMicroelectronics during test sequences.
The pin may be left unconnected or may be con-
voltage reaches the operating value V
CC
specified in Table 9. to Table 11..
nected to V
or V . Direct connection of DU to
CC
SS
–
When V reaches its valid level, the device is
CC
V
is recommended for the lowest stand-by pow-
SS
properly reset (in the Write Disable mode) and
is ready to decode and execute incoming
instructions.
er consumption.
For the M93Cx6 devices (5V range) the POR
threshold voltage is around 3V. For the M93Cx6-
W (3V range) and M93Cx6-R (2V range) the POR
threshold voltage is around 1.5V.
5/31
M93C86, M93C76, M93C66, M93C56, M93C46
INSTRUCTIONS
The instruction set of the M93Cx6 devices con-
tains seven instructions, as summarized in Table
5. to Table 7.. Each instruction consists of the fol-
lowing parts, as shown in Figure 4.:
■
The address bits of the byte or word that is to
be accessed. For the M93C46, the address is
made up of 6 bits for the x16 organization or 7
bits for the x8 organization (see Table 5.). For
the M93C56 and M93C66, the address is
made up of 8 bits for the x16 organization or 9
bits for the x8 organization (see Table 6.). For
the M93C76 and M93C86, the address is
made up of 10 bits for the x16 organization or
11 bits for the x8 organization (see Table 7.).
■
■
■
Each instruction is preceded by a rising edge
on Chip Select Input (S) with Serial Clock (C)
being held Low.
A start bit, which is the first ‘1’ read on Serial
Data Input (D) during the rising edge of Serial
Clock (C).
Two op-code bits, read on Serial Data Input
(D) during the rising edge of Serial Clock (C).
(Some instructions also use the first two bits of
the address to define the op-code).
The M93Cx6 devices are fabricated in CMOS
technology and are therefore able to run as slow
as 0 Hz (static input signals) or as fast as the max-
imum ratings specified in Table 20. to Table 23..
Table 5. Instruction Set for the M93C46
x8 Origination (ORG = 0)
x16 Origination (ORG = 1)
Required
Instruc
tion
Start
bit
Op-
Code
Required
Clock
Description
1
1
Data
Data
Clock
Address
Address
Cycles
Cycles
Read Data from
Memory
READ
1
1
10
01
A6-A0
A6-A0
Q7-Q0
D7-D0
A5-A0
A5-A0
Q15-Q0
D15-D0
Write Data to
Memory
WRITE
18
25
EWEN Erase/Write Enable
EWDS Erase/Write Disable
ERASE Erase Byte or Word
1
1
1
1
00
00
11
00
11X XXXX
00X XXXX
A6-A0
10
10
10
10
11 XXXX
00 XXXX
A5-A0
9
9
9
9
ERAL
Erase All Memory
10X XXXX
10 XXXX
Write All Memory
with same Data
WRAL
1
00
01X XXXX D7-D0
18
01 XXXX
D15-D0
25
Note: 1. X = Don’t Care bit.
6/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 6. Instruction Set for the M93C56 and M93C66
x8 Origination (ORG = 0)
x16 Origination (ORG = 1)
Required
Instruc
tion
Start
bit
Op-
Code
Required
Clock
Description
1,2
1,3
Data
Data
Clock
Address
Address
Cycles
Cycles
Read Data from
Memory
READ
1
1
1
10
01
00
A8-A0
A8-A0
Q7-Q0
D7-D0
A7-A0
A7-A0
Q15-Q0
D15-D0
Write Data to
Memory
WRITE
20
12
27
11
1 1XXX
XXXX
11XX
XXXX
EWEN Erase/Write Enable
0 0XXX
XXXX
00XX
XXXX
EWDS Erase/Write Disable
ERASE Erase Byte or Word
1
1
1
00
11
00
12
12
12
11
11
11
A8-A0
A7-A0
1 0XXX
XXXX
10XX
XXXX
ERAL
Erase All Memory
Write All Memory
with same Data
0 1XXX
XXXX
01XX
XXXX
WRAL
1
00
D7-D0
20
D15-D0
27
Note: 1. X = Don’t Care bit.
2. Address bit A8 is not decoded by the M93C56.
3. Address bit A7 is not decoded by the M93C56.
Table 7. Instruction Set for the M93C76 and M93C86
x8 Origination (ORG = 0)
x16 Origination (ORG = 1)
Required
Instruc
tion
Start
bit
Op-
Code
Required
Clock
Description
1,2
1,3
Data
Data
Clock
Address
Address
Cycles
Cycles
Read Data from
Memory
READ
1
1
1
10
01
00
A10-A0
A10-A0
Q7-Q0
D7-D0
A9-A0
A9-A0
Q15-Q0
D15-D0
Write Data to
Memory
WRITE
22
14
29
13
11X XXXX
XXXX
11 XXXX
XXXX
EWEN Erase/Write Enable
00X XXXX
XXXX
00 XXXX
XXXX
EWDS Erase/Write Disable
ERASE Erase Byte or Word
1
1
1
00
11
00
14
14
14
13
13
13
A10-A0
A9-A0
10X XXXX
XXXX
10 XXXX
XXXX
ERAL
Erase All Memory
Write All Memory
with same Data
01X XXXX
XXXX
01 XXXX
XXXX
WRAL
1
00
D7-D0
22
D15-D0
29
Note: 1. X = Don’t Care bit.
2. Address bit A10 is not decoded by the M93C76.
3. Address bit A9 is not decoded by the M93C76.
7/31
M93C86, M93C76, M93C66, M93C56, M93C46
Read
Erase/Write Enable and Disable
The Read Data from Memory (READ) instruction
outputs data on Serial Data Output (Q). When the
instruction is received, the op-code and address
are decoded, and the data from the memory is
transferred to an output shift register. A dummy 0
bit is output first, followed by the 8-bit byte or 16-
bit word, with the most significant bit first. Output
data changes are triggered by the rising edge of
Serial Clock (C). The M93Cx6 automatically incre-
ments the internal address register and clocks out
the next byte (or word) as long as the Chip Select
Input (S) is held High. In this case, the dummy 0 bit
is not output between bytes (or words) and a con-
tinuous stream of data can be read.
The Erase/Write Enable (EWEN) instruction en-
ables the future execution of erase or write instruc-
tions, and the Erase/Write Disable (EWDS)
instruction disables it. When power is first applied,
the M93Cx6 initializes itself so that erase and write
instructions are disabled. After an Erase/Write En-
able (EWEN) instruction has been executed, eras-
ing and writing remains enabled until an Erase/
Write Disable (EWDS) instruction is executed, or
until V
falls below the power-on reset threshold
CC
voltage. To protect the memory contents from ac-
cidental corruption, it is advisable to issue the
Erase/Write Disable (EWDS) instruction after ev-
ery write cycle. The Read Data from Memory
(READ) instruction is not affected by the Erase/
Write Enable (EWEN) or Erase/Write Disable
(EWDS) instructions.
Figure 4. READ, WRITE, EWEN, EWDS Sequences
READ
S
D
Q
1 1 0 An
A0
Qn
Q0
ADDR
DATA OUT
OP
CODE
WRITE
S
D
Q
CHECK
STATUS
1 0 1 An
A0 Dn
D0
ADDR
DATA IN
BUSY
READY
OP
CODE
ERASE
WRITE
ENABLE
S
D
ERASE
WRITE
DISABLE
S
D
1 0 0 1 1 Xn X0
1 0 0 0 0 Xn X0
OP
OP
CODE
CODE
AI00878C
Note: For the meanings of An, Xn, Qn and Dn, see Table 5., Table 6. and Table 7..
8/31
M93C86, M93C76, M93C66, M93C56, M93C46
Erase
After the last data bit has been sampled, the Chip
Select Input (S) must be taken Low before the next
rising edge of Serial Clock (C). If Chip Select Input
(S) is brought Low before or after this specific time
frame, the self-timed programming cycle will not
be started, and the addressed location will not be
programmed. The completion of the cycle can be
detected by monitoring the Ready/Busy line, as
described later in this document.
The Erase Byte or Word (ERASE) instruction sets
the bits of the addressed memory byte (or word) to
1. Once the address has been correctly decoded,
the falling edge of the Chip Select Input (S) starts
the self-timed Erase cycle. The completion of the
cycle can be detected by monitoring the Ready/
Busy line, as described in the READY/BUSY STA-
TUS section.
Once the Write cycle has been started, it is inter-
nally self-timed (the external clock signal on Serial
Clock (C) may be stopped or left running after the
start of a Write cycle). The cycle is automatically
preceded by an Erase cycle, so it is unnecessary
to execute an explicit erase instruction before a
Write Data to Memory (WRITE) instruction.
Write
For the Write Data to Memory (WRITE) instruction,
8 or 16 data bits follow the op-code and address
bits. These form the byte or word that is to be writ-
ten. As with the other bits, Serial Data Input (D) is
sampled on the rising edge of Serial Clock (C).
Figure 5. ERASE, ERAL Sequences
ERASE
S
D
Q
CHECK
STATUS
1 1 1 An
A0
ADDR
BUSY
READY
OP
CODE
ERASE
ALL
S
D
Q
CHECK
STATUS
1 0 0 1 0 Xn X0
ADDR
OP
BUSY
READY
CODE
AI00879B
Note: For the meanings of An and Xn, please see Table 5., Table 6. and Table 7..
9/31
M93C86, M93C76, M93C66, M93C56, M93C46
Erase All
Write All
The Erase All Memory (ERAL) instruction erases
the whole memory (all memory bits are set to 1).
The format of the instruction requires that a dum-
my address be provided. The Erase cycle is con-
ducted in the same way as the Erase instruction
(ERASE). The completion of the cycle can be de-
tected by monitoring the Ready/Busy line, as de-
scribed in the READY/BUSY STATUS section.
As with the Erase All Memory (ERAL) instruction,
the format of the Write All Memory with same Data
(WRAL) instruction requires that a dummy ad-
dress be provided. As with the Write Data to Mem-
ory (WRITE) instruction, the format of the Write All
Memory with same Data (WRAL) instruction re-
quires that an 8-bit data byte, or 16-bit data word,
be provided. This value is written to all the ad-
dresses of the memory device. The completion of
the cycle can be detected by monitoring the
Ready/Busy line, as described next.
Figure 6. WRAL Sequence
WRITE
ALL
S
D
Q
CHECK
STATUS
1 0 0 0 1 Xn X0 Dn
D0
ADDR
OP
DATA IN
BUSY
READY
CODE
AI00880C
Note: For the meanings of Xn and Dn, please see Table 5., Table 6. and Table 7..
10/31
M93C86, M93C76, M93C66, M93C56, M93C46
CLOCK PULSE COUNTER
READY/BUSY STATUS
While the Write or Erase cycle is underway, for a
WRITE, ERASE, WRAL or ERAL instruction, the
Busy signal (Q=0) is returned whenever Chip Se-
lect Input (S) is driven High. (Please note, though,
In a noisy environment, the number of pulses re-
ceived on Serial Clock (C) may be greater than the
number delivered by the master (the microcontrol-
ler). This can lead to a misalignment of the instruc-
tion of one or more bits (as shown in Figure 7.) and
may lead to the writing of erroneous data at an er-
roneous address.
To combat this problem, the M93Cx6 has an on-
chip counter that counts the clock pulses from the
start bit until the falling edge of the Chip Select In-
put (S). If the number of clock pulses received is
not the number expected, the WRITE, ERASE,
ERAL or WRAL instruction is aborted, and the
contents of the memory are not modified.
that there is an initial delay, of t
, before this
SLSH
status information becomes available). In this
state, the M93Cx6 ignores any data on the bus.
When the Write cycle is completed, and Chip Se-
lect Input (S) is driven High, the Ready signal
(Q=1) indicates that the M93Cx6 is ready to re-
ceive the next instruction. Serial Data Output (Q)
remains set to 1 until the Chip Select Input (S) is
brought Low or until a new start bit is decoded.
The number of clock cycles expected for each in-
struction, and for each member of the M93Cx6
family, are summarized in Table 5. to Table 7.. For
example, a Write Data to Memory (WRITE) in-
struction on the M93C56 (or M93C66) expects 20
clock cycles (for the x8 organization) from the start
bit to the falling edge of Chip Select Input (S). That
is:
COMMON I/O OPERATION
Serial Data Output (Q) and Serial Data Input (D)
can be connected together, through a current lim-
iting resistor, to form a common, single-wire data
bus. Some precautions must be taken when oper-
ating the memory in this way, mostly to prevent a
short circuit current from flowing when the last ad-
dress bit (A0) clashes with the first data bit on Se-
rial Data Output (Q). Please see the application
note AN394 for details.
1 Start bit
+ 2 Op-code bits
+ 9 Address bits
+ 8 Data bits
Figure 7. Write Sequence with One Clock Glitch
S
C
D
An
An-1
Glitch
An-2
START
"0"
"1"
D0
ADDRESS AND DATA
ARE SHIFTED BY ONE BIT
WRITE
AI01395
11/31
M93C86, M93C76, M93C66, M93C56, M93C46
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings" table may cause per-
manent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating con-
ditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu-
ments.
Table 8. Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
°C
°C
V
T
Storage Temperature
–65
150
STG
1
TLEAD
VOUT
VIN
Lead Temperature during Soldering
See note
Output range (Q = V or Hi-Z)
–0.50
–0.50
–0.50
–4000
VCC+0.5
VCC+1
6.5
OH
Input range
V
V
CC
Supply Voltage
V
2
VESD
4000
V
Electrostatic Discharge Voltage (Human Body model)
®
Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK 7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
12/31
M93C86, M93C76, M93C66, M93C56, M93C46
DC AND AC PARAMETERS
This section summarizes the operating and mea-
surement conditions, and the DC and AC charac-
teristics of the device. The parameters in the DC
and AC Characteristic tables that follow are de-
rived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parame-
ters.
Table 9. Operating Conditions (M93Cx6)
Symbol
Parameter
Min.
4.5
Max.
5.5
Unit
V
V
CC
Supply Voltage
Ambient Operating Temperature (Device Grade 6)
Ambient Operating Temperature (Device Grade 7)
Ambient Operating Temperature (Device Grade 3)
–40
–40
–40
85
°C
°C
°C
TA
105
125
Table 10. Operating Conditions (M93Cx6-W)
Symbol
Parameter
Min.
2.5
Max.
5.5
Unit
V
V
CC
Supply Voltage
Ambient Operating Temperature (Device Grade 6)
Ambient Operating Temperature (Device Grade 7)
Ambient Operating Temperature (Device Grade 3)
–40
–40
–40
85
°C
°C
°C
TA
105
125
Table 11. Operating Conditions (M93Cx6-R)
Symbol
Parameter
Min.
1.8
Max.
5.5
Unit
V
V
CC
Supply Voltage
Ambient Operating Temperature (Device Grade 6)
TA
–40
85
°C
13/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 12. AC Measurement Conditions (M93Cx6)
Symbol
Parameter
Min.
Max.
Unit
pF
ns
V
C
Load Capacitance
100
L
Input Rise and Fall Times
50
Input Pulse Voltages
0.4 V to 2.4 V
1.0 V and 2.0 V
0.8 V and 2.0 V
Input Timing Reference Voltages
Output Timing Reference Voltages
V
V
Note: 1. Output Hi-Z is defined as the point where data out is no longer driven.
Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R)
Symbol
Parameter
Min.
Max.
Unit
pF
ns
V
C
Load Capacitance
100
L
Input Rise and Fall Times
50
0.2V to 0.8V
Input Pulse Voltages
CC
CC
CC
CC
0.3V to 0.7V
Input Timing Reference Voltages
Output Timing Reference Voltages
V
CC
0.3V to 0.7V
V
CC
Note: 1. Output Hi-Z is defined as the point where data out is no longer driven.
Figure 8. AC Testing Input Output Waveforms
M93CXX
2.4V
2V
2.0V
0.8V
1V
0.4V
INPUT
OUTPUT
M93CXX-W & M93CXX-R
0.8V
0.2V
CC
0.7V
CC
0.3V
CC
CC
AI02553
Table 14. Capacitance
Symbol
Parameter
Test Condition
= 0V
Min
Max
Unit
COUT
Output
Capacitance
5
pF
V
OUT
CIN
Input
Capacitance
5
pF
V
= 0V
IN
Note: Sampled only, not 100% tested, at T =25°C and a frequency of 1MHz.
A
14/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 15. DC Characteristics (M93Cx6, Device Grade 6)
Symbol
ILI
Parameter
Test Condition
Min.
Max.
±2.5
±2.5
Unit
µA
0V ≤ V ≤ V
Input Leakage Current
Output Leakage Current
IN
CC
0V ≤ V
≤ V , Q in Hi-Z
CC
ILO
µA
OUT
V
= 5V, S = V , f = 1 MHz, Current
CC
IH
1.5
2
mA
mA
µA
1
Product
ICC
Supply Current
V
= 5V, S = V , f = 2 MHz, New
CC
IH
2
Product
V
= 5V, S = V , C = V
,
SS
CC
SS
50
1
ORG = V or V , Current Product
SS
CC
ICC1
Supply Current (Stand-by)
V
= 5V, S = V , C = V
,
SS
CC
SS
15
µA
2
ORG = V or V , New Product
SS
CC
V
= 5V ± 10%
VIL
VIH
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
–0.45
0.8
V
V
V
V
CC
V
= 5V ± 10%
V
+ 1
2
CC
CC
V
= 5V, I = 2.1mA
OL
VOL
VOH
0.4
CC
V
= 5V, I
= –400µA
2.4
CC
OH
Note: 1. Current product: identified by Process Identification letter F or M.
2. New product: identified by Process Identification letter W or G or S.
Table 16. DC Characteristics (M93Cx6, Device Grade 7 or 3)
Symbol
ILI
Parameter
Test Condition
Min.
Max.
±2.5
±2.5
Unit
µA
0V ≤ V ≤ V
Input Leakage Current
Output Leakage Current
IN
CC
0V ≤ V
≤ V , Q in Hi-Z
CC
ILO
µA
OUT
V
= 5V, S = V , f = 1 MHz, Current
CC
IH
1.5
2
mA
mA
µA
1
Product
ICC
Supply Current
V
= 5V, S = V , f = 2 MHz, New
CC
IH
2
Product
V
= 5V, S = V , C = V
,
SS
CC
SS
50
1
ORG = V or V , Current Product
SS
CC
ICC1
Supply Current (Stand-by)
V
= 5V, S = V , C = V
,
SS
CC
SS
15
µA
2
ORG = V or V , New Product
SS
CC
V
= 5V ± 10%
VIL
VIH
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
–0.45
0.8
V
V
V
V
CC
V
= 5V ± 10%
V
+ 1
2
CC
CC
V
= 5V, I = 2.1mA
OL
VOL
VOH
0.4
CC
V
= 5V, I
= –400µA
2.4
CC
OH
Note: 1. Current product: identified by Process Identification letter F or M.
2. New product: identified by Process Identification letter W or G or S.
15/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 17. DC Characteristics (M93Cx6-W, Device Grade 6)
Symbol
ILI
Parameter
Test Condition
Min.
Max.
±2.5
±2.5
Unit
µA
0V ≤ V ≤ V
Input Leakage Current
Output Leakage Current
IN
CC
0V ≤ V
≤ V , Q in Hi-Z
CC
ILO
µA
OUT
V
= 5V, S = V , f = 1 MHz, Current
CC
IH
1.5
1
mA
mA
mA
mA
µA
1
Product
V
= 2.5V, S = V , f = 1 MHz, Current
CC
IH
1
Product
Supply Current (CMOS
Inputs)
ICC
V
= 5V, S = V , f = 2 MHz, New
CC
IH
2
2
Product
V
= 2.5V, S = V , f = 2 MHz, New
CC
IH
1
2
Product
V
CC
= 2.5V, S = V , C = V
,
SS
SS
10
1
ORG = V or V , Current Product
SS
CC
ICC1
Supply Current (Stand-by)
V
CC
= 2.5V, S = V , C = V
,
SS
SS
5
µA
2
ORG = V or V , New Product
SS
CC
0.2 V
VIL
VIH
Input Low Voltage (D, C, S)
Input High Voltage (D, C, S)
–0.45
V
V
V
V
V
V
CC
0.7 V
V
CC
+ 1
CC
V
= 5V, I = 2.1mA
OL
0.4
0.2
CC
VOL
Output Low Voltage (Q)
Output High Voltage (Q)
V
CC
= 2.5V, I = 100µA
OL
V
= 5V, I
= –400µA
= –100µA
2.4
–0.2
CC
OH
VOH
V
= 2.5V, I
V
CC
OH
CC
Note: 1. Current product: identified by Process Identification letter F or M.
2. New product: identified by Process Identification letter W or G or S.
16/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 18. DC Characteristics (M93Cx6-W, Device Grade 7 or 3)
1
1
Symbol
ILI
Parameter
Test Condition
Unit
µA
Min.
Max.
±2.5
±2.5
2
0V ≤ V ≤ V
Input Leakage Current
Output Leakage Current
IN
CC
0V ≤ V
≤ V , Q in Hi-Z
CC
ILO
µA
OUT
V
= 5V, S = V , f = 2 MHz
IH
mA
mA
CC
Supply Current (CMOS
Inputs)
ICC
V
= 2.5V, S = V , f = 2 MHz
IH
1
CC
V
CC
= 2.5V, S = V , C = V
,
SS
SS
ICC1
Supply Current (Stand-by)
5
µA
ORG = V or V
SS
CC
0.2 V
VIL
VIH
Input Low Voltage (D, C, S)
Input High Voltage (D, C, S)
–0.45
V
V
V
V
V
V
CC
0.7 V
V
CC
+ 1
CC
V
= 5V, I = 2.1mA
OL
0.4
0.2
CC
VOL
Output Low Voltage (Q)
Output High Voltage (Q)
V
CC
= 2.5V, I = 100µA
OL
V
= 5V, I
= –400µA
2.4
–0.2
CC
OH
VOH
V
= 2.5V, I
= –100µA
V
CC
OH
CC
Note: 1. New product: identified by Process Identification letter W or G or S.
Table 19. DC Characteristics (M93Cx6-R)
1
1
Symbol
ILI
Parameter
Test Condition
Unit
µA
Min.
Max.
±2.5
±2.5
2
0V ≤ V ≤ V
Input Leakage Current
Output Leakage Current
IN
CC
0V ≤ V
≤ V , Q in Hi-Z
CC
ILO
µA
OUT
V
= 5V, S = V , f = 2 MHz
IH
mA
mA
CC
Supply Current (CMOS
Inputs)
ICC
V
= 1.8V, S = V , f = 1 MHz
IH
1
CC
V
CC
= 1.8V, S = V , C = V
,
SS
SS
ICC1
Supply Current (Stand-by)
2
µA
ORG = V or V
SS
CC
0.2 V
VIL
VIH
Input Low Voltage (D, C, S)
Input High Voltage (D, C, S)
Output Low Voltage (Q)
Output High Voltage (Q)
–0.45
V
V
V
V
CC
0.8 V
V
CC
+ 1
CC
V
V
= 1.8V, I = 100µA
OL
VOL
VOH
0.2
CC
= 1.8V, I
= –100µA
V
–0.2
CC
CC
OH
Note: 1. This product is under development. For more infomation, please contact your nearest ST sales office.
17/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 20. AC Characteristics (M93Cx6, Device Grade 6, 7 or 3)
Test conditions specified in Table 12. and Table 9.
3
3
4
4
Symbol
Alt.
Parameter
Clock Frequency
Unit
MHz
ns
Min.
Max.
Min.
Max.
f
C
f
SK
D.C.
250
1
D.C.
50
2
t
Chip Select Low to Clock High
SLCH
Chip Select Set-up Time
M93C46, M93C56, M93C66
50
50
50
ns
ns
t
t
CSS
SHCH
Chip Select Set-up time
M93C76, M93C86
100
2
t
Chip Select Low to Chip Select High
Clock High Time
250
250
200
200
ns
ns
t
CS
SLSH
CHCL
CLCH
1
1
t
t
t
SKH
t
Clock Low Time
250
100
100
100
0
200
50
50
50
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
SKL
t
t
Data In Set-up Time
DVCH
DIS
DIH
SKS
t
t
Data In Hold Time
CHDX
t
t
t
Clock Set-up Time (relative to S)
Chip Select Hold Time
Chip Select to Ready/Busy Status
Chip Select Low to Output Hi-Z
Delay to Output Low
CLSH
t
CLSL
CSH
t
t
400
200
400
400
10
200
100
200
200
5
SHQV
SV
t
t
SLQZ
CHQL
DF
t
t
t
PD0
t
Delay to Output Valid
CHQV
PD1
t
t
Erase/Write Cycle time
W
WP
Note: 1. t
+ t
CLCH
≥ 1 / f .
C
CHCL
2. Chip Select Input (S) must be brought Low for a minimum of tSLSH between consecutive instruction cycles.
3. Current product: identified by Process Identification letter F or M.
4. New product: identified by Process Identification letter W or G or S.
18/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 21. AC Characteristics (M93Cx6-W, Device Grade 6)
Test conditions specified in Table 13. and Table 10.
3
3
4
4
Symbol
Alt.
Parameter
Clock Frequency
Unit
MHz
ns
Min.
Max.
Min.
Max.
f
C
f
SK
D.C.
250
1
D.C.
50
2
t
Chip Select Low to Clock High
Chip Select Set-up Time
SLCH
t
t
CSS
100
50
ns
SHCH
2
t
Chip Select Low to Chip Select High
1000
200
ns
t
CS
SLSH
1
t
Clock High Time
350
200
ns
t
SKH
CHCL
1
t
Clock Low Time
250
100
100
100
0
200
50
50
50
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
t
SKL
CLCH
t
t
Data In Set-up Time
DVCH
DIS
DIH
SKS
t
t
Data In Hold Time
CHDX
t
t
t
Clock Set-up Time (relative to S)
Chip Select Hold Time
Chip Select to Ready/Busy Status
Chip Select Low to Output Hi-Z
Delay to Output Low
CLSH
t
CLSL
CSH
t
t
400
200
100
200
200
5
SHQV
SV
t
t
200
400
400
10
SLQZ
DF
t
t
CHQL
PD0
PD1
t
t
Delay to Output Valid
CHQV
t
t
Erase/Write Cycle time
W
WP
Note: 1. t
+ t
CLCH
≥ 1 / f .
C
CHCL
2. Chip Select Input (S) must be brought Low for a minimum of tSLSH between consecutive instruction cycles.
3. Current product: identified by Process Identification letter F or M.
4. New product: identified by Process Identification letter W or G or S.
19/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 22. AC Characteristics (M93Cx6-W, Device Grade 7 or 3)
Test conditions specified in Table 13. and Table 10.
3
3
Symbol
Alt.
Parameter
Unit
MHz
ns
Min.
Max.
f
f
SK
Clock Frequency
D.C.
50
2
C
t
Chip Select Low to Clock High
Chip Select Set-up Time
SLCH
t
t
CSS
50
ns
SHCH
2
t
Chip Select Low to Chip Select High
200
ns
t
CS
SLSH
1
t
Clock High Time
200
ns
t
SKH
CHCL
1
t
Clock Low Time
200
50
50
50
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
t
SKL
CLCH
t
t
Data In Set-up Time
DVCH
DIS
t
t
Data In Hold Time
CHDX
DIH
t
t
t
Clock Set-up Time (relative to S)
Chip Select Hold Time
Chip Select to Ready/Busy Status
Chip Select Low to Output Hi-Z
Delay to Output Low
CLSH
SKS
t
CLSL
CSH
t
t
200
100
200
200
5
SHQV
SV
t
t
SLQZ
DF
t
t
CHQL
PD0
PD1
t
t
Delay to Output Valid
CHQV
t
W
t
Erase/Write Cycle time
WP
Note: 1. t
+ t
CLCH
≥ 1 / f .
CHCL
C
2. Chip Select Input (S) must be brought Low for a minimum of tSLSH between consecutive instruction cycles.
3. New product: identified by Process Identification letter W or G or S.
20/31
M93C86, M93C76, M93C66, M93C56, M93C46
Table 23. AC Characteristics (M93Cx6-R)
Test conditions specified in Table 13. and Table 11.
3
3
Symbol
Alt.
Parameter
Unit
MHz
ns
Min.
D.C.
250
50
Max.
f
f
SK
Clock Frequency
1
C
t
Chip Select Low to Clock High
Chip Select Set-up Time
SLCH
t
t
CSS
ns
SHCH
2
t
Chip Select Low to Chip Select High
250
250
ns
t
CS
SLSH
1
t
Clock High Time
ns
t
SKH
CHCL
1
t
Clock Low Time
250
100
100
100
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
t
SKL
CLCH
t
t
Data In Set-up Time
DVCH
DIS
t
t
Data In Hold Time
CHDX
DIH
t
t
t
Clock Set-up Time (relative to S)
Chip Select Hold Time
Chip Select to Ready/Busy Status
Chip Select Low to Output Hi-Z
Delay to Output Low
CLSH
SKS
t
CLSL
CSH
t
t
400
200
400
400
10
SHQV
SV
t
t
SLQZ
DF
t
t
CHQL
PD0
PD1
t
t
Delay to Output Valid
CHQV
t
W
t
Erase/Write Cycle time
WP
Note: 1. t
+ t
CLCH
≥ 1 / f .
CHCL
C
2. Chip Select Input (S) must be brought Low for a minimum of tSLSH between consecutive instruction cycles.
3. This product is under development. For more infomation, please contact your nearest ST sales office.
21/31
M93C86, M93C76, M93C66, M93C56, M93C46
Figure 9. Synchronous Timing (Start and Op-Code Input)
tCLSH
tCHCL
C
tSHCH
tCLCH
S
tDVCH
tCHDX
D
START
OP CODE
OP CODE
START
OP CODE INPUT
AI01428
Figure 10. Synchronous Timing (Read or Write)
C
tCLSL
S
tDVCH
tCHDX
tCHQV
tSLSH
A0
D
Q
An
tSLQZ
tCHQL
Hi-Z
Q15/Q7
Q0
ADDRESS INPUT
DATA OUTPUT
AI00820C
Figure 11. Synchronous Timing (Read or Write)
tSLCH
C
S
tCLSL
tDVCH
tCHDX
A0/D0
tSLSH
D
Q
An
tSHQV
BUSY
tW
WRITE CYCLE
tSLQZ
Hi-Z
READY
ADDRESS/DATA INPUT
AI01429
22/31
M93C86, M93C76, M93C66, M93C56, M93C46
PACKAGE MECHANICAL
Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline
E
b2
A2
A1
A
L
c
b
e
eA
eB
D
8
1
E1
PDIP-B
Note: Drawing is not to scale.
Table 24. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data
mm
inches
Min.
Symb.
Typ.
Min.
Max.
Typ.
Max.
A
A1
A2
b
5.33
0.210
0.38
2.92
0.36
1.14
0.20
9.02
7.62
6.10
–
0.015
0.115
0.014
0.045
0.008
0.355
0.300
0.240
–
3.30
0.46
1.52
0.25
9.27
7.87
6.35
2.54
7.62
4.95
0.56
1.78
0.36
10.16
8.26
7.11
–
0.130
0.018
0.060
0.010
0.365
0.310
0.250
0.100
0.300
0.195
0.022
0.070
0.014
0.400
0.325
0.280
–
b2
c
D
E
E1
e
eA
eB
L
–
–
–
–
10.92
3.81
0.430
0.150
3.30
2.92
0.130
0.115
23/31
M93C86, M93C76, M93C66, M93C56, M93C46
Figure 13. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline
h x 45˚
A
C
B
CP
e
D
N
E
H
1
A1
α
L
SO-a
Note: Drawing is not to scale.
Table 25. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
mm
Min.
1.35
0.10
0.33
0.19
4.80
3.80
–
inches
Min.
0.053
0.004
0.013
0.007
0.189
0.150
–
Symb.
Typ.
Max.
1.75
0.25
0.51
0.25
5.00
4.00
–
Typ.
Max.
0.069
0.010
0.020
0.010
0.197
0.157
–
A
A1
B
C
D
E
e
1.27
0.050
H
h
5.80
0.25
0.40
0°
6.20
0.50
0.90
8°
0.228
0.010
0.016
0°
0.244
0.020
0.035
8°
L
α
N
CP
8
8
0.10
0.004
24/31
M93C86, M93C76, M93C66, M93C56, M93C46
Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
e
b
D
L1
L3
E
E2
L
A
D2
ddd
A1
UFDFPN-01
Note: 1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V . It must not be allowed to be connected to
SS
any other voltage or signal line on the PCB, for example during the soldering process.
Table 26. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data
mm
Min.
0.50
0.00
0.20
inches
Min.
Symbol
Typ.
Max.
0.60
0.05
0.30
Typ.
Max.
0.024
0.002
0.012
A
A1
b
0.55
0.022
0.020
0.000
0.008
0.25
2.00
0.010
0.079
D
D2
ddd
E
1.55
1.65
0.05
0.061
0.065
0.002
3.00
0.118
E2
e
0.15
–
0.25
–
0.006
–
0.010
–
0.50
0.45
0.020
0.018
L
0.40
0.50
0.15
0.016
0.020
0.006
L1
L3
N
0.30
0.012
8
8
25/31
M93C86, M93C76, M93C66, M93C56, M93C46
Figure 15. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline
D
8
1
5
4
c
E1
E
α
A1
L
A
A2
L1
CP
b
e
TSSOP8BM
Note: Drawing is not to scale.
Table 27. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data
mm
inches
Min.
Symbol
Typ.
Min.
Max.
1.100
0.150
0.950
0.400
0.230
3.100
5.150
3.100
–
Typ.
Max.
0.0433
0.0059
0.0374
0.0157
0.0091
0.1220
0.2028
0.1220
–
A
A1
A2
b
0.050
0.750
0.250
0.130
2.900
4.650
2.900
–
0.0020
0.0295
0.0098
0.0051
0.1142
0.1831
0.1142
–
0.850
0.0335
c
D
3.000
4.900
3.000
0.650
0.1181
0.1929
0.1181
0.0256
E
E1
e
CP
L
0.100
0.700
0.0039
0.0276
0.550
0.950
0.400
0.0217
0.0374
0.0157
L1
α
0°
6°
0°
6°
26/31
M93C86, M93C76, M93C66, M93C56, M93C46
Figure 16. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline
D
8
5
c
E1
E
1
4
α
A1
L
A
A2
L1
CP
b
e
TSSOP8AM
Note: Drawing is not to scale.
Table 28. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data
mm
inches
Min.
Symbol
Typ.
Min.
Max.
1.200
0.150
1.050
0.300
0.200
0.100
3.100
–
Typ.
Max.
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
–
A
A1
A2
b
0.050
0.800
0.190
0.090
0.0020
0.0315
0.0075
0.0035
1.000
0.0394
c
CP
D
3.000
0.650
6.400
4.400
0.600
1.000
2.900
–
0.1181
0.0256
0.2520
0.1732
0.0236
0.0394
0.1142
–
e
E
6.200
4.300
0.450
6.600
4.500
0.750
0.2441
0.1693
0.0177
0.2598
0.1772
0.0295
E1
L
L1
α
0°
8°
0°
8°
27/31
M93C86, M93C76, M93C66, M93C56, M93C46
PART NUMBERING
Table 29. Ordering Information Scheme
Example:
M93C86
–
W
MN
6
T
P
Device Type
M93 = MICROWIRE serial access EEPROM
Device Function
86 = 16 Kbit (2048 x 8)
76 = 8 Kbit (1024 x 8)
66 = 4 Kbit (512 x 8)
56 = 2 Kbit (256 x 8)
46 = 1 Kbit (128 x 8)
Operating Voltage
blank = V = 4.5 to 5.5V
CC
W = V = 2.5 to 5.5V
CC
R = V = 1.8 to 5.5V
CC
Package
BN = PDIP8
MN = SO8 (150 mil width)
MB = UDFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
2
DS = TSSOP8 (3x3mm body size)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
1
7 = Device tested with High Reliability Certified Flow .
Automotive temperature range (–40 to 105 °C)
1
3 = Device tested with High Reliability Certified Flow .
Automotive temperature range (–40 to 125 °C)
Packing
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P = Lead-Free and RoHS compliant
G = Lead-Free, RoHS compliant, Sb O -free and TBBA-free
2
3
Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer-
tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.
2. Available only on new products: identified by the Process Identification letter W or G or S.
28/31
M93C86, M93C76, M93C66, M93C56, M93C46
Devices are shipped from the factory with the
memory content set at all 1s (FFFFh for x16, FFh
for x8).
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Of-
fice.
Table 30. How to Identify Current and New Products by the Process Identification Letter
1
1
Markings on Current Products
Markings on New Products
M93C46W6
M93C46W6
AYWWF (or AYWWM)
AYWWW (or AYWWG or AYWWS)
Note: 1. This example comes from the S08 package. Other packages have similar information. For further information, please ask your ST
Sales Office for Process Change Notice PCN MPG/EE/0059 (PCEE0059).
29/31
M93C86, M93C76, M93C66, M93C56, M93C46
REVISION HISTORY
Table 31. Document Revision History
Date
Rev.
Description of Revision
Document reformatted, and reworded, using the new template. Temperature range 1 removed.
TSSOP8 (3x3mm) package added. New products, identified by the process letter W, added,
with fc(max) increased to 1MHz for -R voltage range, and to 2MHz for all other ranges (and
corresponding parameters adjusted)
04-Feb-2003
2.0
Value of standby current (max) corrected in DC characteristics tables for -W and -R ranges
26-Mar-2003
04-Apr-2003
2.1
2.2
V
OUT
and V separated from V in the Absolute Maximum Ratings table
IN IO
Values corrected in AC characteristics tables for -W range (tSLSH, tDVCH, tCLSL) for devices
with Process Identification Letter W
23-May-2003
27-May-2003
2.3 Standby current corrected for -R range
2.4 Turned-die option re-instated in Ordering Information Scheme
Table of contents, and Pb-free options added. Temperature range 7 added. V (min) improved
to –0.45V.
IL
25-Nov-2003
30-Mar-2004
16-Aug-2004
3.0
4.0
5.0
MLP package added. Absolute Maximum Ratings for V (min) and V (min) changed.
IO
CC
Soldering temperature information clarified for RoHS compliant devices. Device grade
information clarified. Process identification letter “G” information added
M93C06 removed. Device grade information further clarified. Process identification letter “S”
information added. Turned-die package option removed. Product list summary added.
30/31
M93C86, M93C76, M93C66, M93C56, M93C46
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
31/31
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