PSD854512MT [STMICROELECTRONICS]

Flash In-System Programmable ISP Peripherals For 8-bit MCUs; Flash在系统可编程ISP外设对于8位MCU
PSD854512MT
型号: PSD854512MT
厂家: ST    ST
描述:

Flash In-System Programmable ISP Peripherals For 8-bit MCUs
Flash在系统可编程ISP外设对于8位MCU

文件: 总110页 (文件大小:1732K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PSD813F2, PSD833F2  
PSD834F2, PSD853F2, PSD854F2  
Flash In-System Programmable (ISP)  
Peripherals for 8-bit MCUs, 5V  
PRELIMINARY DATA  
FEATURES SUMMARY  
FLASH IN-SYSTEM PROGRAMMABLE (ISP)  
Figure 1. Packages  
PERIPHERAL FOR 8-BIT MCUS  
DUAL BANK FLASH MEMORIES  
UP TO 2 Mbit OF PRIMARY FLASH  
MEMORY (8 Uniform Sectors, 32K x8)  
UP TO 256 Kbit SECONDARY FLASH  
MEMORY (4 Uniform Sectors)  
Concurrent operation: READ from one  
memory while erasing and writing the  
other  
PQFP52 (M)  
UP TO 256 Kbit BATTERY-BACKED SRAM  
27 RECONFIGURABLE I/O PORTS  
ENHANCED JTAG SERIAL PORT  
PLD WITH MACROCELLS  
Over 3000 Gates of PLD: CPLD and  
DPLD  
CPLD with 16 Output Macrocells (OMCs)  
and 24 Input Macrocells (IMCs)  
DPLD - user defined internal chip select  
decoding  
PLCC52 (J)  
27 INDIVIDUALLY CONFIGURABLE I/O  
PORT PINS  
The can be used for the following functions:  
MCU I/Os  
PLD I/Os  
Latched MCU address output  
Special function I/Os.  
16 of the I/O ports may be configured as  
open-drain outputs.  
TQFP64 (U)  
IN-SYSTEM PROGRAMMING (ISP) WITH  
JTAG  
Built-in JTAG compliant serial port allows  
full-chip In-System Programmability  
Efficient manufacturing allow easy  
product testing and programming  
HIGH ENDURANCE:  
100,000 Erase/WRITE Cycles of Flash  
Memory  
Use low cost FlashLINK cable with PC  
PAGE REGISTER  
1,000 Erase/WRITE Cycles of PLD  
15 Year Data Retention  
Internal page register that can be used to  
expand the microcontroller address space  
by a factor of 256  
5V±10% SINGLE SUPPLY VOLTAGE  
STANDBY CURRENT AS LOW AS 50µA  
PROGRAMMABLE POWER MANAGEMENT  
June 2004  
1/110  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
TABLE OF CONTENTS  
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
PSD ARCHITECTURAL OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Page Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
MCU Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
JTAG Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Power Management Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
PSD Register Description and Address Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
DETAILED OPERATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Memory Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Primary Flash Memory and Secondary Flash memory Description . . . . . . . . . . . . . . . . . . . . . 20  
Memory Block Select Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Power-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Read Memory Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Read Primary Flash Identifier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Read Memory Sector Protection Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Reading the Erase/Program Status Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Data Polling Flag (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Toggle Flag (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Error Flag (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Erase Time-out Flag (DQ3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
PROGRAMMING FLASH MEMORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Data Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Data Toggle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
Unlock Bypass (PSD833F2x, PSD834F2x, PSD853F2x, PSD854F2x). . . . . . . . . . . . . . . . . . . . 26  
ERASING FLASH MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Flash Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
2/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Flash Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Suspend Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Resume Sector Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
SPECIFIC FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Flash Memory Sector Protect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Reset Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Reset (RESET) Signal (on the PSD83xF2 and PSD85xF2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
SECTOR SELECT AND SRAM SELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Memory Select Configuration for MCUs with Separate Program and Data Spaces . . . . . . . . 30  
Configuration Modes for MCUs with Separate Program and Data Spaces . . . . . . . . . . . . . . . 30  
PAGE REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
PLDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
The Turbo Bit in PSD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Decode PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Output Macrocell (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Product Term Allocator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
Loading and Reading the Output Macrocells (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
The OMC Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
The Output Enable of the OMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
MCU BUS INTERFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
PSD Interface to a Multiplexed 8-Bit Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
PSD Interface to a Non-Multiplexed 8-Bit Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
Data Byte Enable Reference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
MCU Bus Interface Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
80C31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
80C251 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
80C51XA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
68HC11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
I/O PORTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
General Port Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
Port Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
MCU I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
PLD I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
Address Out Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
Address In Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
3/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Data Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
Peripheral I/O Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
JTAG In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
Direction Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
Drive Select Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
Data In. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
Data Out Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
OMC Mask Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
Enable Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
Ports A and B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
Port C – Functionality and Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59  
Port D – Functionality and Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60  
External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61  
POWER MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62  
Automatic Power-down (APD) Unit and Power-down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 63  
For Users of the HC11 (or compatible) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
Other Power Saving Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
PLD Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
Input Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
Input Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
RESET TIMING AND DEVICE STATUS AT RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
Power-Up Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
Warm Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
I/O Pin, Register and PLD Status at Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
Reset of Flash Memory Erase and Program Cycles (on the PSD834Fx) . . . . . . . . . . . . . . . . . 67  
PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . . 69  
Standard JTAG Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
JTAG Extensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70  
Security and Flash memory Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70  
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71  
AC/DC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72  
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100  
4/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105  
APPENDIX A.PQFP52 PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106  
APPENDIX B.PLCC52 PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107  
APPENDIX C.TQFP64 PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109  
5/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
SUMMARY DESCRIPTION  
The PSD8XXFX family of memory systems for mi-  
crocontrollers (MCUs) brings In-System-Program-  
mability (ISP) to Flash memory and programmable  
logic. The result is a simple and flexible solution for  
embedded designs. PSD devices combine many  
of the peripheral functions found in MCU based  
applications.  
The innovative PSD8XXFX family solves key  
problems faced by designers when managing dis-  
crete Flash memory devices, such as:  
First-time In-System Programming (ISP)  
Complex address decoding  
Simultaneous read and write to the device.  
The JTAG Serial Interface block allows In-System  
Programming (ISP), and eliminates the need for  
an external Boot EPROM, or an external program-  
mer. To simplify Flash memory updates, program  
execution is performed from a secondary Flash  
memory while the primary Flash memory is being  
updated. This solution avoids the complicated  
hardware and software overhead necessary to im-  
plement IAP.  
ST makes available a software development tool,  
PSDsoft Express, that generates ANSI-C compli-  
ant code for use with your target MCU. This code  
allows you to manipulate the non-volatile memory  
(NVM) within the PSD. Code examples are also  
provided for:  
Table 1 summarizes all the devices in the  
PSD834F2, PSD853F2, PSD854F2.  
The CPLD in the PSD devices features an opti-  
mized macrocell logic architecture. The PSD mac-  
rocell was created to address the unique  
requirements of embedded system designs. It al-  
lows direct connection between the system ad-  
dress/data bus, and the internal PSD registers, to  
simplify communication between the MCU and  
other supporting devices.  
The PSD device includes a JTAG Serial Program-  
ming interface, to allow In-System Programming  
(ISP) of the entire device. This feature reduces de-  
velopment time, simplifies the manufacturing flow,  
and dramatically lowers the cost of field upgrades.  
Using ST’s special Fast-JTAG programming, a de-  
sign can be rapidly programmed into the PSD in as  
little as seven seconds.  
Flash memory IAP via the UART of the host  
MCU  
Memory paging to execute code across  
several PSD memory pages  
Loading, reading, and manipulation of PSD  
macrocells by the MCU.  
Table 1. Product Range  
Number of  
Macrocells  
Serial  
ISP  
JTAG/  
ISC Port  
Primary Flash  
Memory  
(8 Sectors)  
Secondary  
Flash Memory  
4 Sectors)  
Turbo  
Mode  
(1)  
(2)  
I/O Ports  
Part Number  
SRAM  
Input  
Output  
16  
PSD813F2  
PSD813F3  
PSD813F4  
PSD813F5  
PSD833F2  
PSD834F2  
PSD853F2  
PSD854F2  
1 Mbit  
1 Mbit  
1 Mbit  
1 Mbit  
1 Mbit  
2 Mbit  
1 Mbit  
2 Mbit  
256 Kbit  
none  
16 Kbit  
16 Kbit  
none  
27  
27  
27  
27  
27  
27  
27  
27  
24  
24  
24  
24  
24  
24  
24  
24  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
yes  
16  
256 Kbit  
none  
16  
none  
16  
256 Kbit  
256 Kbit  
256 Kbit  
256 Kbit  
64 Kbit  
64 Kbit  
256 Kbit  
256 Kbit  
16  
16  
16  
16  
Note: 1. All products support: JTAG serial ISP, MCU parallel ISP, ISP Flash memory, ISP CPLD, Security features, Power Management  
Unit (PMU), Automatic Power-down (APD)  
2. SRAM may be backed up using an external battery.  
6/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 2. PQFP52 Connections  
PD2 1  
PD1 2  
PD0 3  
PC7 4  
PC6 5  
PC5 6  
PC4 7  
39 AD15  
38 AD14  
37 AD13  
36 AD12  
35 AD11  
34 AD10  
33 AD9  
V
8
32 AD8  
CC  
GND 9  
31 V  
CC  
PC3 10  
PC2 11  
PC1 12  
PC0 13  
30 AD7  
29 AD6  
28 AD5  
27 AD4  
AI02858  
7/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 3. PLCC52 Connections  
8
PD2  
PD1  
PD0  
PC7  
PC6  
PC5  
PC4  
AD15  
AD14  
AD13  
AD12  
AD11  
AD10  
AD9  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
V
AD8  
CC  
GND  
V
CC  
PC3  
PC2  
AD7  
AD6  
19  
20  
PC1  
PC0  
AD5  
AD4  
35  
34  
AI02857  
8/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 4. TQFP64 Connections  
PD2 1  
PD1 2  
PD0 3  
PC7 4  
PC6 5  
PC5 6  
48 CNTL0  
47 AD15  
46 AD14  
45 AD13  
44 AD12  
43 AD11  
42 AD10  
41 AD9  
V
V
V
7
8
9
CC  
CC  
CC  
40 AD8  
GND 10  
GND 11  
PC3 12  
PC2 13  
PC1 14  
PC0 15  
NC 16  
39 V  
CC  
38 V  
CC  
37 AD7  
36 AD6  
35 AD5  
34 AD4  
33 AD3  
AI09645  
9/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PIN DESCRIPTION  
Table 2. Pin Description (for the PLCC52 package - Note 1)  
Pin Name  
Pin  
Type  
Description  
This is the lower Address/Data port. Connect your MCU address or address/data bus  
according to the following rules:  
If your MCU has a multiplexed address/data bus where the data is multiplexed with the  
lower address bits, connect AD0-AD7 to this port.  
If your MCU does not have a multiplexed address/data bus, or you are using an 80C251  
ADIO0-7 30-37  
I/O in page mode, connect A0-A7 to this port.  
If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port.  
ALE or AS latches the address. The PSD drives data out only if the READ signal is active  
and one of the PSD functional blocks was selected. The addresses on this port are  
passed to the PLDs.  
This is the upper Address/Data port. Connect your MCU address or address/data bus  
according to the following rules:  
If your MCU has a multiplexed address/data bus where the data is multiplexed with the  
lower address bits, connect A8-A15 to this port.  
If your MCU does not have a multiplexed address/data bus, connect A8-A15 to this port.  
I/O If you are using an 80C251 in page mode, connect AD8-AD15 to this port.  
ADIO8-15 39-46  
If you are using an 80C51XA in burst mode, connect A12/D8 through A19/D15 to this  
port.  
ALE or AS latches the address. The PSD drives data out only if the READ signal is active  
and one of the PSD functional blocks was selected. The addresses on this port are  
passed to the PLDs.  
The following control signals can be connected to this port, based on your MCU:  
WR – active Low Write Strobe input.  
CNTL0  
47  
I
R_W – active High READ/active Low write input.  
This port is connected to the PLDs. Therefore, these signals can be used in decode and  
other logic equations.  
The following control signals can be connected to this port, based on your MCU:  
RD – active Low Read Strobe input.  
E – E clock input.  
DS – active Low Data Strobe input.  
CNTL1  
50  
I
PSEN – connect PSEN to this port when it is being used as an active Low READ signal.  
For example, when the 80C251 outputs more than 16 address bits, PSEN is actually the  
READ signal.  
This port is connected to the PLDs. Therefore, these signals can be used in decode and  
other logic equations.  
This port can be used to input the PSEN (Program Select Enable) signal from any MCU  
that uses this signal for code exclusively. If your MCU does not output a Program Select  
Enable signal, this port can be used as a generic input. This port is connected to the  
PLDs.  
CNTL2  
49  
I
10/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Pin Name  
Pin  
Type  
Description  
Resets I/O Ports, PLD macrocells and some of the Configuration Registers. Must be Low  
at Power-up.  
Reset  
48  
I
These pins make up Port A. These port pins are configurable and can have the following  
functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellAB0-7) outputs.  
Inputs to the PLDs.  
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
29  
28  
27  
25  
24  
23  
22  
21  
Latched address outputs (see Table 6).  
I/O Address inputs. For example, PA0-3 could be used for A0-A3 when using an 80C51XA in  
burst mode.  
As the data bus inputs D0-D7 for non-multiplexed address/data bus MCUs.  
D0/A16-D3/A19 in M37702M2 mode.  
Peripheral I/O mode.  
Note: PA0-PA3 can only output CMOS signals with an option for high slew rate. However,  
PA4-PA7 can be configured as CMOS or Open Drain Outputs.  
These pins make up Port B. These port pins are configurable and can have the following  
functions:  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
7
6
5
4
3
2
52  
51  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellAB0-7 or McellBC0-7) outputs.  
I/O  
Inputs to the PLDs.  
Latched address outputs (see Table 6).  
Note: PB0-PB3 can only output CMOS signals with an option for high slew rate.  
However, PB4-PB7 can be configured as CMOS or Open Drain Outputs.  
PC0 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC0) output.  
PC0  
20  
I/O  
Input to the PLDs.  
2
TMS Input for the JTAG Serial Interface.  
This pin can be configured as a CMOS or Open Drain output.  
PC1 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC1) output.  
PC1  
19  
I/O  
Input to the PLDs.  
2
TCK Input for the JTAG Serial Interface.  
This pin can be configured as a CMOS or Open Drain output.  
11/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Pin Name  
Pin  
Type  
Description  
PC2 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC2) output.  
Input to the PLDs.  
PC2  
18  
I/O  
V
STBY  
– SRAM stand-by voltage input for SRAM battery backup.  
This pin can be configured as a CMOS or Open Drain output.  
PC3 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC3) output.  
Input to the PLDs.  
PC3  
17  
I/O  
2
TSTAT output for the JTAG Serial Interface.  
Ready/Busy output for parallel In-System Programming (ISP).  
This pin can be configured as a CMOS or Open Drain output.  
PC4 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC4) output.  
Input to the PLDs.  
PC4  
14  
I/O  
2
TERR output for the JTAG Serial Interface.  
Battery-on Indicator (V  
battery.  
). Goes High when power is being drawn from the external  
BATON  
This pin can be configured as a CMOS or Open Drain output.  
PC5 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC5) output.  
Input to the PLDs.  
PC5  
13  
I/O  
2
TDI input for the JTAG Serial Interface.  
This pin can be configured as a CMOS or Open Drain output.  
PC6 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC6) output.  
Input to the PLDs.  
PC6  
12  
I/O  
2
TDO output for the JTAG Serial Interface.  
This pin can be configured as a CMOS or Open Drain output.  
12/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Pin Name  
Pin  
Type  
Description  
PC7 pin of Port C. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
CPLD macrocell (McellBC7) output.  
PC7  
11  
I/O  
Input to the PLDs.  
DBE – active Low Data Byte Enable input from 68HC912 type MCUs.  
This pin can be configured as a CMOS or Open Drain output.  
PD0 pin of Port D. This port pin can be configured to have the following functions:  
ALE/AS input latches address output from the MCU.  
MCU I/O – write or read from a standard output or input port.  
Input to the PLDs.  
PD0  
10  
I/O  
CPLD output (External Chip Select).  
PD1 pin of Port D. This port pin can be configured to have the following functions:  
MCU I/O – write to or read from a standard output or input port.  
Input to the PLDs.  
PD1  
9
I/O  
CPLD output (External Chip Select).  
CLKIN – clock input to the CPLD macrocells, the APD Unit’s Power-down counter, and  
the CPLD AND Array.  
PD2 pin of Port D. This port pin can be configured to have the following functions:  
MCU I/O - write to or read from a standard output or input port.  
Input to the PLDs.  
PD2  
8
I/O  
CPLD output (External Chip Select).  
PSD Chip Select Input (CSI). When Low, the MCU can access the PSD memory and I/O.  
When High, the PSD memory blocks are disabled to conserve power.  
V
15, 38  
Supply Voltage  
Ground pins  
CC  
1, 16,  
26  
GND  
Note: 1. The pin numbers in this table are for the PLCC package only. See the package information from Table 74., page 102 onwards, for  
pin numbers on other package types.  
2. These functions can be multiplexed with other functions.  
13/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 5. PSD Block Diagram  
AI02861E  
14/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PSD ARCHITECTURAL OVERVIEW  
PSD devices contain several major functional  
blocks. Figure 5 shows the architecture of the PSD  
device family. The functions of each block are de-  
scribed briefly in the following sections. Many of  
the blocks perform multiple functions and are user  
configurable.  
The DPLD is used to decode addresses and to  
generate Sector Select signals for the PSD inter-  
nal memory and registers. The DPLD has combi-  
natorial outputs. The CPLD has 16 Output  
Macrocells (OMC) and 3 combinatorial outputs.  
The PSD also has 24 Input Macrocells (IMC) that  
can be configured as inputs to the PLDs. The  
PLDs receive their inputs from the PLD Input Bus  
and are differentiated by their output destinations,  
number of product terms, and macrocells.  
The PLDs consume minimal power. The speed  
and power consumption of the PLD is controlled  
by the Turbo Bit in PMMR0 and other bits in the  
PMMR2. These registers are set by the MCU at  
run-time. There is a slight penalty to PLD propaga-  
tion time when invoking the power management  
features.  
Memory  
Each of the memory blocks is briefly discussed in  
the following paragraphs. A more detailed discus-  
sion can be found in the section entitled Memory  
Blocks, page 19.  
The 1 Mbit or 2 Mbit (128K x 8, or 256K x 8) Flash  
memory is the primary memory of the PSD. It is di-  
vided into 8 equally-sized sectors that are individ-  
ually selectable.  
The optional 256 Kbit (32K x 8) secondary Flash  
memory is divided into 4 equally-sized sectors.  
Each sector is individually selectable.  
I/O Ports  
The PSD has 27 individually configurable I/O pins  
distributed over the four ports (Port A, B, C, and  
D). Each I/O pin can be individually configured for  
different functions. Ports can be configured as  
standard MCU I/O ports, PLD I/O, or latched ad-  
dress outputs for MCUs using multiplexed ad-  
dress/data buses.  
The optional SRAM is intended for use as a  
scratch-pad memory or as an extension to the  
MCU SRAM. If an external battery is connected to  
Voltage Stand-by (V  
, PC2), data is retained in  
STBY  
the event of power failure.  
Each sector of memory can be located in a differ-  
ent address space as defined by the user. The ac-  
cess times for all memory types includes the  
address latching and DPLD decoding time.  
The JTAG pins can be enabled on Port C for In-  
System Programming (ISP).  
Ports A and B can also be configured as a data  
port for a non-multiplexed bus.  
Page Register  
The 8-bit Page Register expands the address  
range of the MCU by up to 256 times. The paged  
address can be used as part of the address space  
to access external memory and peripherals, or in-  
ternal memory and I/O. The Page Register can  
also be used to change the address mapping of  
sectors of the Flash memories into different mem-  
ory spaces for IAP.  
MCU Bus Interface  
PSD interfaces easily with most 8-bit MCUs that  
have either multiplexed or non-multiplexed ad-  
dress/data buses. The device is configured to re-  
spond to the MCU’s control signals, which are also  
used as inputs to the PLDs. For examples, please  
see the section entitled MCU Bus Interface  
Examples, page 45.  
PLDs  
The device contains two PLDs, the Decode PLD  
(DPLD) and the Complex PLD (CPLD), as shown  
in Table 3, each optimized for a different function.  
The functional partitioning of the PLDs reduces  
power consumption, optimizes cost/performance,  
and eases design entry.  
Table 3. PLD I/O  
Product  
Terms  
Name  
Inputs Outputs  
Decode PLD (DPLD)  
73  
17  
19  
42  
140  
Complex PLD (CPLD) 73  
15/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
JTAG Port  
In-System Programming (ISP) can be performed  
through the JTAG signals on Port C. This serial in-  
terface allows complete programming of the entire  
PSD device. A blank device can be completely  
programmed. The JTAG signals (TMS, TCK,  
TSTAT, TERR, TDI, TDO) can be multiplexed with  
other functions on Port C. Table 4 indicates the  
JTAG pin assignments.  
MCU inactivity. The APD Unit has a Power-down  
mode that helps reduce power consumption.  
The PSD also has some bits that are configured at  
run-time by the MCU to reduce power consump-  
tion of the CPLD. The Turbo Bit in PMMR0 can be  
reset to '0' and the CPLD latches its outputs and  
goes to sleep until the next transition on its inputs.  
Additionally, bits in PMMR2 can be set by the  
MCU to block signals from entering the CPLD to  
reduce power consumption. Please see the sec-  
tion entitled POWER MANAGEMENT, page 62 for  
more details.  
In-System Programming (ISP)  
Using the JTAG signals on Port C, the entire PSD  
device can be programmed or erased without the  
use of the MCU. The primary Flash memory can  
also be programmed in-system by the MCU exe-  
cuting the programming algorithms out of the sec-  
ondary memory, or SRAM. The secondary  
memory can be programmed the same way by ex-  
ecuting out of the primary Flash memory. The PLD  
or other PSD Configuration blocks can be pro-  
grammed through the JTAG port or a device pro-  
grammer. Table 5 indicates which programming  
methods can program different functional blocks  
of the PSD.  
Table 4. JTAG SIgnals on Port C  
Port C Pins  
PC0  
JTAG Signal  
TMS  
TCK  
PC1  
PC3  
PC4  
PC5  
PC6  
TSTAT  
TERR  
TDI  
Power Management Unit (PMU)  
The Power Management Unit (PMU) gives the  
user control of the power consumption on selected  
functional blocks based on system requirements.  
The PMU includes an Automatic Power-down  
(APD) Unit that turns off device functions during  
TDO  
Table 5. Methods of Programming Different Functional Blocks of the PSD  
Functional Block  
Primary Flash Memory  
JTAG Programming Device Programmer  
IAP  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
Secondary Flash Memory  
PLD Array (DPLD and CPLD)  
PSD Configuration  
No  
16/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
DEVELOPMENT SYSTEM  
The PSD8XXFX family is supported by PSDsoft  
Express, a Windows-based software development  
tool. A PSD design is quickly and easily produced  
in a point and click environment. The designer  
does not need to enter Hardware Description Lan-  
guage (HDL) equations, unless desired, to define  
PSD pin functions and memory map information.  
The general design flow is shown in Figure 6. PS-  
Dsoft Express is available from our web site (the  
address is given on the back page of this data  
sheet) or other distribution channels.  
PSDsoft Express directly supports two low cost  
device programmers form ST: PSDpro and  
FlashLINK (JTAG). Both of these programmers  
may be purchased through your local distributor/  
representative, or directly from our web site using  
a credit card. The PSD is also supported by third  
party device programmers. See our web site for  
the current list.  
Figure 6. PSDsoft Express Development Tool  
PSDabel  
PLD DESCRIPTION  
MODIFY ABEL TEMPLATE FILE  
OR GENERATE NEW FILE  
PSD Configuration  
PSD TOOLS  
CONFIGURE MCU BUS  
INTERFACE AND OTHER  
PSD ATTRIBUTES  
GENERATE C CODE  
SPECIFIC TO PSD  
FUNCTIONS  
PSD Fitter  
USER'S CHOICE OF  
FIRMWARE  
LOGIC SYNTHESIS  
AND FITTING  
MICROCONTROLLER  
HEX OR S-RECORD  
FORMAT  
COMPILER/LINKER  
ADDRESS TRANSLATION  
AND MEMORY MAPPING  
*.OBJ FILE  
PSD Simulator  
PSD Programmer  
*.OBJ AND *.SVF  
FILES AVAILABLE  
FOR 3rd PARTY  
PROGRAMMERS  
(CONVENTIONAL or  
JTAG-ISC)  
PSDsilos III  
DEVICE SIMULATION  
(OPTIONAL)  
PSDPro, or  
FlashLINK (JTAG)  
AI04918  
17/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PSD REGISTER DESCRIPTION AND ADDRESS OFFSET  
Table 6 shows the offset addresses to the PSD  
registers relative to the CSIOP base address. The  
CSIOP space is the 256 bytes of address that is al-  
located by the user to the internal PSD registers.  
Table 7 provides brief descriptions of the registers  
in CSIOP space. The following section gives a  
more detailed description.  
Table 6. I/O Port Latched Address Output Assignments (Note1)  
Port A  
Port B  
MCU  
Port A (3:0)  
Port A (7:4)  
Address a7-a4  
N/A  
Port B (3:0)  
Address a11-a8  
Address a11-a8  
Address a3-a0  
Address a3-a0  
Port B (7:4)  
8051XA (8-bit)  
N/A  
N/A  
N/A  
80C251 (page mode)  
All other 8-bit multiplexed  
8-bit non-multiplexed bus  
Address a15-a12  
Address a7-a4  
Address a7-a4  
Address a3-a0  
N/A  
Address a7-a4  
N/A  
Note: 1. See the section entitled I/O PORTS, page 51, on how to enable the Latched Address Output function.  
2. N/A = Not Applicable  
Table 7. Register Address Offset  
1
Register Name  
Data In  
Port A Port B Port C Port D  
Description  
Other  
00  
02  
01  
03  
10  
11  
Reads Port pin as input, MCU I/O input mode  
Selects mode between MCU I/O or Address Out  
Control  
Stores data for output to Port pins, MCU I/O  
output mode  
Data Out  
Direction  
04  
06  
05  
07  
12  
14  
13  
15  
Configures Port pin as input or output  
Configures Port pins as either CMOS or Open  
Drain on some pins, while selecting high slew rate  
on other pins.  
Drive Select  
08  
09  
16  
17  
Input Macrocell  
Enable Out  
0A  
0C  
0B  
0D  
18  
1A  
Reads Input Macrocells  
Reads the status of the output enable to the I/O  
Port driver  
1B  
Output Macrocells  
AB  
READ – reads output of macrocells AB  
WRITE – loads macrocell flip-flops  
20  
20  
21  
Output Macrocells  
BC  
READ – reads output of macrocells BC  
WRITE – loads macrocell flip-flops  
21  
23  
Mask Macrocells AB 22  
Mask Macrocells BC  
22  
23  
Blocks writing to the Output Macrocells AB  
Blocks writing to the Output Macrocells BC  
Primary Flash  
Protection  
C0  
C2  
Read only – Primary Flash Sector Protection  
Secondary Flash  
memory Protection  
Read only – PSD Security and Secondary Flash  
memory Sector Protection  
JTAG Enable  
PMMR0  
PMMR2  
Page  
C7  
B0  
B4  
E0  
Enables JTAG Port  
Power Management Register 0  
Power Management Register 2  
Page Register  
Places PSD memory areas in Program and/or  
Data space on an individual basis.  
VM  
E2  
Note: 1. Other registers that are not part of the I/O ports.  
18/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
DETAILED OPERATION  
As shown in Figure 5., page 14, the PSD consists  
of six major types of functional blocks:  
Memory Blocks  
The PSD has the following memory blocks:  
Memory Blocks  
Primary Flash memory  
Optional Secondary Flash memory  
Optional SRAM  
PLD Blocks  
MCU Bus Interface  
I/O Ports  
Power Management Unit (PMU)  
JTAG Interface  
The Memory Select signals for these blocks origi-  
nate from the Decode PLD (DPLD) and are user-  
defined in PSDsoft Express.  
The functions of each block are described in the  
following sections. Many of the blocks perform  
multiple functions, and are user configurable.  
Table 8. Memory Block Size and Organization  
Primary Flash Memory  
Secondary Flash Memory  
SRAM  
Sector  
Number  
Sector Size  
(Bytes)  
Sector Select  
Signal  
Sector Size  
(Bytes)  
Sector Select  
Signal  
SRAM Size  
(Bytes)  
SRAM Select  
Signal  
0
1
32K  
32K  
32K  
32K  
32K  
32K  
32K  
32K  
512K  
FS0  
FS1  
16K  
16K  
16K  
16K  
CSBOOT0  
CSBOOT1  
CSBOOT2  
CSBOOT3  
256K  
RS0  
2
FS2  
3
FS3  
4
FS4  
5
FS5  
6
FS6  
7
FS7  
Total  
8 Sectors  
64K  
4 Sectors  
256K  
19/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Primary Flash Memory and Secondary Flash  
memory Description  
Memory Operation. The primary Flash memory  
and secondary Flash memory are addressed  
through the MCU Bus Interface. The MCU can ac-  
cess these memories in one of two ways:  
The primary Flash memory is divided evenly into  
eight equal sectors. The secondary Flash memory  
is divided into four equal sectors. Each sector of  
either memory block can be separately protected  
from Program and Erase cycles.  
Flash memory may be erased on a sector-by-sec-  
tor basis. Flash sector erasure may be suspended  
while data is read from other sectors of the block  
and then resumed after reading.  
During a Program or Erase cycle in Flash memory,  
the status can be output on Ready/Busy (PC3).  
This pin is set up using PSDsoft Express Configu-  
ration.  
The MCU can execute a typical bus WRITE or  
READ operation just as it would if accessing a  
RAM or ROM device using standard bus  
cycles.  
The MCU can execute a specific instruction  
that consists of several WRITE and READ  
operations. This involves writing specific data  
patterns to special addresses within the Flash  
memory to invoke an embedded algorithm.  
These instructions are summarized in Table  
9., page 21.  
Typically, the MCU can read Flash memory using  
READ operations, just as it would read a ROM de-  
vice. However, Flash memory can only be altered  
using specific Erase and Program instructions. For  
example, the MCU cannot write a single byte di-  
rectly to Flash memory as it would write a byte to  
RAM. To program a byte into Flash memory, the  
MCU must execute a Program instruction, then  
test the status of the Program cycle. This status  
test is achieved by a READ operation or polling  
Ready/Busy (PC3).  
Memory Block Select Signals  
The DPLD generates the Select signals for all the  
internal memory blocks (see the section entitled  
PLDS, page 33). Each of the eight sectors of the  
primary Flash memory has a Select signal (FS0-  
FS7) which can contain up to three product terms.  
Each of the four sectors of the secondary Flash  
memory has  
a
Select signal (CSBOOT0-  
CSBOOT3) which can contain up to three product  
terms. Having three product terms for each Select  
signal allows a given sector to be mapped in differ-  
ent areas of system memory. When using a MCU  
with separate Program and Data space, these  
flexible Select signals allow dynamic re-mapping  
of sectors from one memory space to the other.  
Flash memory can also be read by using special  
instructions to retrieve particular Flash device in-  
formation (sector protect status and ID).  
Ready/Busy (PC3). This signal can be used to  
output the Ready/Busy status of the PSD. The out-  
put on Ready/Busy (PC3) is a 0 (Busy) when Flash  
memory is being written to, or when Flash memory  
is being erased. The output is a 1 (Ready) when  
no WRITE or Erase cycle is in progress.  
20/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 9. Instructions  
FS0-FS7 or  
Instruction  
CSBOOT0-  
Cycle 1  
Cycle 2 Cycle 3  
Cycle 4  
Cycle 5 Cycle 6 Cycle 7  
CSBOOT3  
“READ”  
RD @ RA  
5
1
1
1
1
1
1
1
READ  
Read Main  
AAh@  
X555h  
55h@  
XAAAh  
90h@  
X555h  
Read identifier  
(A6,A1,A0 = 0,0,1)  
6
Flash ID  
Read Sector  
AAh@  
X555h  
55h@  
XAAAh  
90h@  
X555h  
Read identifier  
(A6,A1,A0 = 0,1,0)  
6,8,13  
Protection  
Program a  
Flash Byte  
AAh@  
X555h  
55h@  
XAAAh  
A0h@  
X555h  
PD@ PA  
13  
7
Flash Sector  
AAh@  
X555h  
55h@  
XAAAh  
80h@  
X555h  
55h@  
XAAAh  
30h@  
SA  
30h @  
AAh@ X555h  
AAh@ X555h  
7,13  
Erase  
next SA  
Flash Bulk  
AAh@  
X555h  
55h@  
XAAAh  
80h@  
X555h  
55h@  
XAAAh  
10h@  
X555h  
13  
Erase  
Suspend  
B0h@  
XXXXh  
11  
12  
Sector Erase  
Resume  
30h@  
XXXXh  
1
1
1
1
Sector Erase  
F0h@  
XXXXh  
6
Reset  
AAh@  
X555h  
55h@  
XAAAh  
20h@  
X555h  
Unlock Bypass  
Unlock Bypass  
A0h@  
XXXXh  
PD@ PA  
9
Program  
Unlock Bypass  
90h@  
XXXXh  
00h@  
XXXXh  
1
10  
Reset  
Note: 1. All bus cycles are WRITE bus cycles, except the ones with the “READ” label  
2. All values are in hexadecimal:  
X = Don’t Care. Addresses of the form XXXXh, in this table, must be even addresses  
RA = Address of the memory location to be read  
RD = Data read from location RA during the READ cycle  
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of Write Strobe (WR, CNTL0).  
PA is an even address for PSD in word programming mode.  
PD = Data word to be programmed at location PA. Data is latched on the rising edge of Write Strobe (WR, CNTL0)  
SA = Address of the sector to be erased or verified. The Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) of the sector to be  
erased, or verified, must be Active (High).  
3. Sector Select (FS0 to FS7 or CSBOOT0 to CSBOOT3) signals are active High, and are defined in PSDsoft Express.  
4. Only address bits A11-A0 are used in instruction decoding.  
5. No Unlock or instruction cycles are required when the device is in the READ Mode  
6. The Reset instruction is required to return to the READ Mode after reading the Flash ID, or after reading the Sector Protection Sta-  
tus, or if the Error Flag Bit (DQ5/DQ13) goes High.  
7. Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80µs.  
8. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and  
(A1,A0)=(1,0)  
9. The Unlock Bypass instruction is required prior to the Unlock Bypass Program instruction.  
10. The Unlock Bypass Reset Flash instruction is required to return to reading memory data when the device is in the Unlock Bypass  
mode.  
11. The system may perform READ and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protection Status  
when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction is valid only during a Sector Erase cycle.  
12. The Resume Sector Erase instruction is valid only during the Suspend Sector Erase mode.  
13. The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the instruction is  
intended. The MCU must fetch, for example, the code from the secondary Flash memory when reading the Sector Protection Status  
of the primary Flash memory.  
21/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
INSTRUCTIONS  
An instruction consists of a sequence of specific  
operations. Each received byte is sequentially de-  
coded by the PSD and not executed as a standard  
WRITE operation. The instruction is executed  
when the correct number of bytes are properly re-  
ceived and the time between two consecutive  
bytes is shorter than the time-out period. Some in-  
structions are structured to include READ opera-  
tions after the initial WRITE operations.  
The instruction must be followed exactly. Any in-  
valid combination of instruction bytes or time-out  
between two consecutive bytes while addressing  
Flash memory resets the device logic into READ  
Mode (Flash memory is read like a ROM device).  
for maximum security of the data contents and to  
remove the possibility of a byte being written on  
the first edge of Write Strobe (WR, CNTL0). Any  
WRITE cycle initiation is locked when V  
is be-  
CC  
low V  
.
LKO  
READ  
Under typical conditions, the MCU may read the  
primary Flash memory or the secondary Flash  
memory using READ operations just as it would a  
ROM or RAM device. Alternately, the MCU may  
use READ operations to obtain status information  
about a Program or Erase cycle that is currently in  
progress. Lastly, the MCU may use instructions to  
read special data from these memory blocks. The  
following sections describe these READ functions.  
The PSD supports the instructions summarized in  
Table 9., page 21:  
Read Memory Contents  
Flash memory:  
Primary Flash memory and secondary Flash  
memory are placed in the READ Mode after Pow-  
er-up, chip reset, or a Reset Flash instruction (see  
Table 9., page 21). The MCU can read the memo-  
ry contents of the primary Flash memory or the  
secondary Flash memory by using READ opera-  
tions any time the READ operation is not part of an  
instruction.  
Erase memory by chip or sector  
Suspend or resume sector erase  
Program a Byte  
Reset to READ Mode  
Read primary Flash Identifier value  
Read Sector Protection Status  
Read Primary Flash Identifier  
Bypass (on the PSD833F2, PSD834F2,  
PSD853F2 and PSD854F2)  
The primary Flash memory identifier is read with  
an instruction composed of 4 operations: 3 specific  
WRITE operations and a READ operation (see Ta-  
ble 9., page 21). During the READ operation, ad-  
dress bits A6, A1, and A0 must be '0,0,1,'  
respectively, and the appropriate Sector Select  
(FS0-FS7) must be High. The identifier for the  
PSD813F2/3/4/5 is E4h, and for the PSD83xF2 or  
PSD85xF2 it is E7h.  
These instructions are detailed in Table  
9., page 21. For efficient decoding of the instruc-  
tions, the first two bytes of an instruction are the  
coded cycles and are followed by an instruction  
byte or confirmation byte. The coded cycles con-  
sist of writing the data AAh to address X555h dur-  
ing the first cycle and data 55h to address XAAAh  
during the second cycle. Address signals A15-A12  
are Don’t Care during the instruction WRITE cy-  
cles. However, the appropriate Sector Select  
(FS0-FS7 or CSBOOT0-CSBOOT3) must be se-  
lected.  
The primary and secondary Flash memories have  
the same instruction set (except for Read Primary  
Flash Identifier). The Sector Select signals deter-  
mine which Flash memory is to receive and exe-  
cute the instruction. The primary Flash memory is  
selected if any one of Sector Select (FS0-FS7) is  
High, and the secondary Flash memory is selected  
if any one of Sector Select (CSBOOT0-  
CSBOOT3) is High.  
Read Memory Sector Protection Status  
The primary Flash memory Sector Protection Sta-  
tus is read with an instruction composed of 4 oper-  
ations: 3 specific WRITE operations and a READ  
operation (see Table 9., page 21). During the  
READ operation, address Bits A6, A1, and A0  
must be '0,1,0,' respectively, while Sector Select  
(FS0-FS7 or CSBOOT0-CSBOOT3) designates  
the Flash memory sector whose protection has to  
be verified. The READ operation produces 01h if  
the Flash memory sector is protected, or 00h if the  
sector is not protected.  
The sector protection status for all NVM blocks  
(primary Flash memory or secondary Flash mem-  
ory) can also be read by the MCU accessing the  
Flash Protection registers in PSD I/O space. See  
the section entitled Flash Memory Sector  
Protect, page 28 for register definitions.  
Power-up Mode  
The PSD internal logic is reset upon Power-up to  
the READ Mode. Sector Select (FS0-FS7 and  
CSBOOT0-CSBOOT3) must be held Low, and  
Write Strobe (WR, CNTL0) High, during Power-up  
22/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Reading the Erase/Program Status Bits  
The PSD provides several status bits to be used  
by the MCU to confirm the completion of an Erase  
or Program cycle of Flash memory. These status  
bits minimize the time that the MCU spends per-  
forming these tasks and are defined in Table 10.  
The status bits can be read as many times as  
needed.  
For Flash memory, the MCU can perform a READ  
operation to obtain these status bits while an  
Erase or Program instruction is being executed by  
the embedded algorithm. See the section entitled  
PROGRAMMING FLASH MEMORY, page 25 for  
details.  
Table 10. Status Bit  
FS0-FS7/CSBOOT0-  
Functional Block  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ2  
DQ1  
DQ0  
CSBOOT3  
Erase  
Time-  
out  
Data  
Polling Flag  
Toggle Error  
Flag  
V
Flash Memory  
X
X
X
X
IH  
Note: 1. X = Not guaranteed value, can be read either '1' or ’0.’  
2. DQ7-DQ0 represent the Data Bus bits, D7-D0.  
3. FS0-FS7 and CSBOOT0-CSBOOT3 are active High.  
23/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Data Polling Flag (DQ7)  
When erasing or programming in Flash memory,  
the Data Polling Flag Bit (DQ7) outputs the com-  
plement of the bit being entered for programming/  
writing on the DQ7 Bit. Once the Program instruc-  
tion or the WRITE operation is completed, the true  
logic value is read on the Data Polling Flag Bit  
(DQ7, in a READ operation).  
The Toggle Flag Bit (DQ6) is effective after the  
fourth WRITE pulse (for a Program instruction)  
or after the sixth WRITE pulse (for an Erase  
instruction).  
If the byte to be programmed belongs to a  
protected Flash memory sector, the  
instruction is ignored.  
If all the Flash memory sectors selected for  
erasure are protected, the Toggle Flag Bit  
(DQ6) toggles to '0' for about 100µs and then  
returns to the previous addressed byte.  
Data Polling is effective after the fourth WRITE  
pulse (for a Program instruction) or after the  
sixth WRITE pulse (for an Erase instruction). It  
must be performed at the address being  
programmed or at an address within the Flash  
memory sector being erased.  
Error Flag (DQ5)  
During a normal Program or Erase cycle, the Error  
Flag Bit (DQ5) is to ’0.’ This bit is set to '1' when  
there is a failure during Flash memory Byte Pro-  
gram, Sector Erase, or Bulk Erase cycle.  
In the case of Flash memory programming, the Er-  
ror Flag Bit (DQ5) indicates the attempt to program  
a Flash memory bit from the programmed state,  
’0,’ to the erased state, '1,' which is not valid. The  
Error Flag Bit (DQ5) may also indicate a Time-out  
condition while attempting to program a byte.  
In case of an error in a Flash memory Sector Erase  
or Byte Program cycle, the Flash memory sector in  
which the error occurred or to which the pro-  
grammed byte belongs must no longer be used.  
Other Flash memory sectors may still be used.  
The Error Flag Bit (DQ5) is reset after a Reset  
Flash instruction.  
During an Erase cycle, the Data Polling Flag  
Bit (DQ7) outputs a ’0.’ After completion of the  
cycle, the Data Polling Flag Bit (DQ7) outputs  
the last bit programmed (it is a '1' after  
erasing).  
If the byte to be programmed is in a protected  
Flash memory sector, the instruction is  
ignored.  
If all the Flash memory sectors to be erased  
are protected, the Data Polling Flag Bit (DQ7)  
is reset to '0' for about 100µs, and then returns  
to the previous addressed byte. No erasure is  
performed.  
Toggle Flag (DQ6)  
The PSD offers another way for determining when  
the Flash memory Program cycle is completed.  
During the internal WRITE operation and when ei-  
ther the FS0-FS7 or CSBOOT0-CSBOOT3 is true,  
the Toggle Flag Bit (DQ6) toggles from '0' to '1' and  
'1' to '0' on subsequent attempts to read any byte  
of the memory.  
When the internal cycle is complete, the toggling  
stops and the data read on the Data Bus D0-D7 is  
the addressed memory byte. The device is now  
accessible for a new READ or WRITE operation.  
The cycle is finished when two successive READs  
yield the same output data.  
Erase Time-out Flag (DQ3)  
The Erase Time-out Flag Bit (DQ3) reflects the  
time-out period allowed between two consecutive  
Sector Erase instructions. The Erase Time-out  
Flag Bit (DQ3) is reset to '0' after a Sector Erase  
cycle for a time period of 100µs + 20% unless an  
additional Sector Erase instruction is decoded. Af-  
ter this time period, or when the additional Sector  
Erase instruction is decoded, the Erase Time-out  
Flag Bit (DQ3) is set to '1.'  
24/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PROGRAMMING FLASH MEMORY  
Flash memory must be erased prior to being pro-  
grammed. A byte of Flash memory is erased to all  
1s (FFh), and is programmed by setting selected  
bits to ’0.’ The MCU may erase Flash memory all  
at once or by-sector, but not byte-by-byte. Howev-  
er, the MCU may program Flash memory byte-by-  
byte.  
The primary and secondary Flash memories re-  
quire the MCU to send an instruction to program a  
byte or to erase sectors (see Table 9., page 21).  
Once the MCU issues a Flash memory Program or  
Erase instruction, it must check for the status bits  
for completion. The embedded algorithms that are  
invoked inside the PSD support several means to  
provide status to the MCU. Status may be checked  
using any of three methods: Data Polling, Data  
Toggle, or Ready/Busy (PC3).  
ming algorithm has completed, to compare the  
byte that was written to the Flash memory with the  
byte that was intended to be written.  
When using the Data Polling method during an  
Erase cycle, Figure 7 still applies. However, the  
Data Polling Flag Bit (DQ7) is '0' until the Erase cy-  
cle is complete. A 1 on the Error Flag Bit (DQ5) in-  
dicates a time-out condition on the Erase cycle; a  
0 indicates no error. The MCU can read any loca-  
tion within the sector being erased to get the Data  
Polling Flag Bit (DQ7) and the Error Flag Bit  
(DQ5).  
PSDsoft Express generates ANSI C code func-  
tions which implement these Data Polling algo-  
rithms.  
Figure 7. Data Polling Flowchart  
Data Polling  
Polling on the Data Polling Flag Bit (DQ7) is a  
method of checking whether a Program or Erase  
cycle is in progress or has completed. Figure 7  
shows the Data Polling algorithm.  
START  
READ DQ5 & DQ7  
at VALID ADDRESS  
When the MCU issues a Program instruction, the  
embedded algorithm within the PSD begins. The  
MCU then reads the location of the byte to be pro-  
grammed in Flash memory to check status. The  
Data Polling Flag Bit (DQ7) of this location be-  
comes the complement of b7 of the original data  
byte to be programmed. The MCU continues to  
poll this location, comparing the Data Polling Flag  
Bit (DQ7) and monitoring the Error Flag Bit (DQ5).  
When the Data Polling Flag Bit (DQ7) matches b7  
of the original data, and the Error Flag Bit (DQ5)  
remains ’0,’ the embedded algorithm is complete.  
If the Error Flag Bit (DQ5) is '1,' the MCU should  
test the Data Polling Flag Bit (DQ7) again since  
the Data Polling Flag Bit (DQ7) may have changed  
simultaneously with the Error Flag Bit (DQ5, see  
Figure 7).  
DQ7  
=
YES  
DATA  
NO  
NO  
DQ5  
= 1  
YES  
READ DQ7  
DQ7  
=
DATA  
YES  
NO  
The Error Flag Bit (DQ5) is set if either an internal  
time-out occurred while the embedded algorithm  
attempted to program the byte or if the MCU at-  
tempted to program a '1' to a bit that was not  
erased (not erased is logic '0').  
FAIL  
PASS  
AI01369B  
It is suggested (as with all Flash memories) to read  
the location again after the embedded program-  
25/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Data Toggle  
Checking the Toggle Flag Bit (DQ6) is a method of  
determining whether a Program or Erase cycle is  
in progress or has completed. Figure 8 shows the  
Data Toggle algorithm.  
The Flash memory then enters the Unlock Bypass  
mode. A two-cycle Unlock Bypass Program in-  
struction is all that is required to program in this  
mode. The first cycle in this instruction contains  
the Unlock Bypass Program code, A0h. The sec-  
ond cycle contains the program address and data.  
Additional data is programmed in the same man-  
ner. These instructions dispense with the initial  
two Unlock cycles required in the standard Pro-  
gram instruction, resulting in faster total Flash  
memory programming.  
During the Unlock Bypass mode, only the Unlock  
Bypass Program and Unlock Bypass Reset Flash  
instructions are valid.  
To exit the Unlock Bypass mode, the system must  
issue the two-cycle Unlock Bypass Reset Flash in-  
struction. The first cycle must contain the data  
90h; the second cycle the data 00h. Addresses are  
Don’t Care for both cycles. The Flash memory  
then returns to READ Mode.  
When the MCU issues a Program instruction, the  
embedded algorithm within the PSD begins. The  
MCU then reads the location of the byte to be pro-  
grammed in Flash memory to check status. The  
Toggle Flag Bit (DQ6) of this location toggles each  
time the MCU reads this location until the embed-  
ded algorithm is complete. The MCU continues to  
read this location, checking the Toggle Flag Bit  
(DQ6) and monitoring the Error Flag Bit (DQ5).  
When the Toggle Flag Bit (DQ6) stops toggling  
(two consecutive reads yield the same value), and  
the Error Flag Bit (DQ5) remains ’0,’ the embed-  
ded algorithm is complete. If the Error Flag Bit  
(DQ5) is '1,' the MCU should test the Toggle Flag  
Bit (DQ6) again, since the Toggle Flag Bit (DQ6)  
may have changed simultaneously with the Error  
Flag Bit (DQ5, see Figure 8).  
The Error Flag Bit (DQ5) is set if either an internal  
time-out occurred while the embedded algorithm  
attempted to program the byte, or if the MCU at-  
tempted to program a '1' to a bit that was not  
erased (not erased is logic '0').  
Figure 8. Data Toggle Flowchart  
START  
It is suggested (as with all Flash memories) to read  
the location again after the embedded program-  
ming algorithm has completed, to compare the  
byte that was written to Flash memory with the  
byte that was intended to be written.  
When using the Data Toggle method after an  
Erase cycle, Figure 8 still applies. the Toggle Flag  
Bit (DQ6) toggles until the Erase cycle is complete.  
A '1' on the Error Flag Bit (DQ5) indicates a time-  
out condition on the Erase cycle; a '0' indicates no  
error. The MCU can read any location within the  
sector being erased to get the Toggle Flag Bit  
(DQ6) and the Error Flag Bit (DQ5).  
PSDsoft Express generates ANSI C code func-  
tions which implement these Data Toggling algo-  
rithms.  
Unlock Bypass (PSD833F2x, PSD834F2x,  
PSD853F2x, PSD854F2x)  
The Unlock Bypass instructions allow the system  
to program bytes to the Flash memories faster  
than using the standard Program instruction. The  
Unlock Bypass mode is entered by first initiating  
two Unlock cycles. This is followed by a third  
WRITE cycle containing the Unlock Bypass code,  
20h (as shown in Table 9., page 21).  
READ  
DQ5 & DQ6  
DQ6  
NO  
=
TOGGLE  
YES  
NO  
DQ5  
= 1  
YES  
READ DQ6  
DQ6  
=
NO  
TOGGLE  
YES  
FAIL  
PASS  
AI01370B  
26/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
ERASING FLASH MEMORY  
Flash Bulk Erase  
The Flash Bulk Erase instruction uses six WRITE  
operations followed by a READ operation of the  
status register, as described in Table 9., page 21.  
If any byte of the Bulk Erase instruction is wrong,  
the Bulk Erase instruction aborts and the device is  
reset to the Read Flash memory status.  
During execution of the Erase cycle, the Flash  
memory accepts only Reset and Suspend Sector  
Erase instructions. Erasure of one Flash memory  
sector may be suspended, in order to read data  
from another Flash memory sector, and then re-  
sumed.  
During a Bulk Erase, the memory status may be  
checked by reading the Error Flag Bit (DQ5), the  
Toggle Flag Bit (DQ6), and the Data Polling Flag  
Bit (DQ7), as detailed in the section entitled PRO-  
GRAMMING FLASH MEMORY, page 25. The Er-  
ror Flag Bit (DQ5) returns a '1' if there has been an  
Erase Failure (maximum number of Erase cycles  
have been executed).  
It is not necessary to program the memory with  
00h because the PSD automatically does this be-  
fore erasing to 0FFh.  
During execution of the Bulk Erase instruction, the  
Flash memory does not accept any instructions.  
Suspend Sector Erase  
When a Sector Erase cycle is in progress, the Sus-  
pend Sector Erase instruction can be used to sus-  
pend the cycle by writing 0B0h to any address  
when an appropriate Sector Select (FS0-FS7 or  
CSBOOT0-CSBOOT3) is High. (See Table  
9., page 21). This allows reading of data from an-  
other Flash memory sector after the Erase cycle  
has been suspended. Suspend Sector Erase is  
accepted only during an Erase cycle and defaults  
to READ Mode. A Suspend Sector Erase instruc-  
tion executed during an Erase time-out period, in  
addition to suspending the Erase cycle, terminates  
the time out period.  
Flash Sector Erase  
The Toggle Flag Bit (DQ6) stops toggling when the  
PSD internal logic is suspended. The status of this  
bit must be monitored at an address within the  
Flash memory sector being erased. The Toggle  
Flag Bit (DQ6) stops toggling between 0.1µs and  
15µs after the Suspend Sector Erase instruction  
has been executed. The PSD is then automatically  
set to READ Mode.  
The Sector Erase instruction uses six WRITE op-  
erations, as described in Table 9., page 21. Addi-  
tional Flash Sector Erase codes and Flash  
memory sector addresses can be written subse-  
quently to erase other Flash memory sectors in  
parallel, without further coded cycles, if the addi-  
tional bytes are transmitted in a shorter time than  
the time-out period of about 100µs. The input of a  
new Sector Erase code restarts the time-out peri-  
od.  
If an Suspend Sector Erase instruction was exe-  
cuted, the following rules apply:  
Attempting to read from a Flash memory  
sector that was being erased outputs invalid  
data.  
Reading from a Flash sector that was not  
being erased is valid.  
The Flash memory cannot be programmed,  
and only responds to Resume Sector Erase  
and Reset Flash instructions (READ is an  
operation and is allowed).  
If a Reset Flash instruction is received, data in  
the Flash memory sector that was being  
erased is invalid.  
The status of the internal timer can be monitored  
through the level of the Erase Time-out Flag Bit  
(DQ3). If the Erase Time-out Flag Bit (DQ3) is ’0,’  
the Sector Erase instruction has been received  
and the time-out period is counting. If the Erase  
Time-out Flag Bit (DQ3) is '1,' the time-out period  
has expired and the PSD is busy erasing the Flash  
memory sector(s). Before and during Erase time-  
out, any instruction other than Suspend Sector  
Erase and Resume Sector Erase instructions  
abort the cycle that is currently in progress, and re-  
set the device to READ Mode. It is not necessary  
to program the Flash memory sector with 00h as  
the PSD does this automatically before erasing  
(byte = FFh).  
Resume Sector Erase  
If a Suspend Sector Erase instruction was previ-  
ously executed, the erase cycle may be resumed  
with this instruction. The Resume Sector Erase in-  
struction consists of writing 030h to any address  
while an appropriate Sector Select (FS0-FS7 or  
CSBOOT0-CSBOOT3) is High. (See Table  
9., page 21.)  
During a Sector Erase, the memory status may be  
checked by reading the Error Flag Bit (DQ5), the  
Toggle Flag Bit (DQ6), and the Data Polling Flag  
Bit (DQ7), as detailed in the section entitled PRO-  
GRAMMING FLASH MEMORY, page 25.  
27/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
SPECIFIC FEATURES  
Flash Memory Sector Protect  
Each primary and secondary Flash memory sector  
can be separately protected against Program and  
Erase cycles. Sector Protection provides addition-  
al data security because it disables all Program or  
Erase cycles. This mode can be activated through  
the JTAG Port or a Device Programmer.  
Sector protection can be selected for each sector  
using the PSDsoft Express Configuration pro-  
gram. This automatically protects selected sectors  
when the device is programmed through the JTAG  
Port or a Device Programmer. Flash memory sec-  
tors can be unprotected to allow updating of their  
contents using the JTAG Port or a Device Pro-  
grammer. The MCU can read (but cannot change)  
the sector protection bits.  
Any attempt to program or erase a protected Flash  
memory sector is ignored by the device. The Verify  
operation results in a READ of the protected data.  
This allows a guarantee of the retention of the Pro-  
tection status.  
The sector protection status can be read by the  
MCU through the Flash memory protection and  
PSD/EE protection registers (in the CSIOP block).  
See Tables 11 and 12.  
On the PSD813F2/3/4/5, the Reset Flash instruc-  
tion puts the Flash memory back into normal  
READ Mode. It may take the Flash memory up to  
a few milliseconds to complete the Reset cycle.  
The Reset Flash instruction is ignored when it is is-  
sued during a Program or Bulk Erase cycle of the  
Flash memory. The Reset Flash instruction aborts  
any on-going Sector Erase cycle, and returns the  
Flash memory to the normal READ Mode within a  
few milliseconds.  
On the PSD83xF2 or PSD85xF2, the Reset Flash  
instruction puts the Flash memory back into nor-  
mal READ Mode. If an Error condition has oc-  
curred (and the device has set the Error Flag Bit  
(DQ5) to '1') the Flash memory is put back into nor-  
mal READ Mode within 25µs of the Reset Flash in-  
struction having been issued. The Reset Flash  
instruction is ignored when it is issued during a  
Program or Bulk Erase cycle of the Flash memory.  
The Reset Flash instruction aborts any on-going  
Sector Erase cycle, and returns the Flash memory  
to the normal READ Mode within 25µs.  
Reset (RESET) Signal (on the PSD83xF2 and  
PSD85xF2)  
A pulse on Reset (RESET) aborts any cycle that is  
in progress, and resets the Flash memory to the  
READ Mode. When the reset occurs during a Pro-  
gram or Erase cycle, the Flash memory takes up  
to 25µs to return to the READ Mode. It is recom-  
mended that the Reset (RESET) pulse (except for  
Power On Reset, as described on RESET TIMING  
AND DEVICE STATUS AT RESET, page 67) be  
at least 25µs so that the Flash memory is always  
ready for the MCU to fetch the bootstrap instruc-  
tions after the Reset cycle is complete.  
Reset Flash  
The Reset Flash instruction consists of one  
WRITE cycle (see Table 9., page 21). It can also  
be optionally preceded by the standard two  
WRITE decoding cycles (writing AAh to 555h and  
55h to AAAh). It must be executed after:  
Reading the Flash Protection Status or Flash  
ID  
An Error condition has occurred (and the  
device has set the Error Flag Bit (DQ5) to '1')  
during a Flash memory Program or Erase  
cycle.  
Table 11. Sector Protection/Security Bit Definition – Flash Protection Register  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Sec7_Prot  
Sec6_Prot  
Sec5_Prot  
Sec4_Prot  
Sec3_Prot  
Sec2_Prot  
Sec1_Prot  
Sec0_Prot  
Note: 1. Bit Definitions:  
Sec<i>_Prot 1 = Primary Flash memory or secondary Flash memory Sector <i> is write protected.  
Sec<i>_Prot 0 = Primary Flash memory or secondary Flash memory Sector <i> is not write protected.  
Table 12. Sector Protection/Security Bit Definition – PSD/EE Protection Register  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Security_Bit not used  
Note: 1. Bit Definitions:  
not used  
not used  
Sec3_Prot  
Sec2_Prot  
Sec1_Prot  
Sec0_Prot  
Sec<i>_Prot 1 = Secondary Flash memory Sector <i> is write protected.  
Sec<i>_Prot 0 = Secondary Flash memory Sector <i> is not write protected.  
Security_Bit 0 = Security Bit in device has not been set.  
1 = Security Bit in device has been set.  
28/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
SRAM  
The SRAM is enabled when SRAM Select (RS0)  
from the DPLD is High. SRAM Select (RS0) can  
contain up to two product terms, allowing flexible  
memory mapping.  
PC4 can be configured as an output that indicates  
when power is being drawn from the external bat-  
tery. Battery-on Indicator (VBATON, PC4) is High  
with the supply voltage falls below the battery volt-  
age and the battery on Voltage Stand-by (V  
PC2) is supplying power to the internal SRAM.  
,
STBY  
The SRAM can be backed up using an external  
battery. The external battery should be connected  
to Voltage Stand-by (V  
, PC2). If you have an  
SRAM Select (RS0), Voltage Stand-by (V  
,
STBY  
STBY  
external battery connected to the PSD, the con-  
tents of the SRAM are retained in the event of a  
power loss. The contents of the SRAM are re-  
tained so long as the battery voltage remains at  
2 V or greater. If the supply voltage falls below the  
battery voltage, an internal power switch-over to  
the battery occurs.  
PC2) and Battery-on Indicator (VBATON, PC4)  
are all configured using PSDsoft Express Configu-  
ration.  
29/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
SECTOR SELECT AND SRAM SELECT  
Sector Select (FS0-FS7, CSBOOT0-CSBOOT3)  
and SRAM Select (RS0) are all outputs of the  
DPLD. They are setup by writing equations for  
them in PSDabel. The following rules apply to the  
equations for these signals:  
1. Primary Flash memory and secondary Flash  
memory Sector Select signals must not be  
larger than the physical sector size.  
This is controlled through manipulation of the VM  
register that resides in the CSIOP space.  
The VM register is set using PSDsoft Express to  
have an initial value. It can subsequently be  
changed by the MCU so that memory mapping  
can be changed on-the-fly.  
For example, you may wish to have SRAM and pri-  
mary Flash memory in the Data space at Boot-up,  
and secondary Flash memory in the Program  
space at Boot-up, and later swap the primary and  
secondary Flash memories. This is easily done  
with the VM register by using PSDsoft Express  
Configuration to configure it for Boot-up and hav-  
ing the MCU change it when desired. Table  
13., page 31 describes the VM Register.  
2. Any primary Flash memory sector must not be  
mapped in the same memory space as  
another Flash memory sector.  
3. A secondary Flash memory sector must notbe  
mapped in the same memory space as  
another secondary Flash memory sector.  
4. SRAM, I/O, and Peripheral I/O spaces must  
not overlap.  
Figure 9. Priority Level of Memory and I/O  
Components  
5. A secondary Flash memory sector may  
overlap a primary Flash memory sector. In  
case of overlap, priority is given to the  
secondary Flash memory sector.  
6. SRAM, I/O, and Peripheral I/O spaces may  
overlap any other memory sector. Priority is  
given to the SRAM, I/O, or Peripheral I/O.  
Highest Priority  
Level 1  
SRAM, I/O, or  
Peripheral I/O  
Example  
FS0 is valid when the address is in the range of  
8000h to BFFFh, CSBOOT0 is valid from 8000h to  
9FFFh, and RS0 is valid from 8000h to 87FFh.  
Any address in the range of RS0 always accesses  
the SRAM. Any address in the range of CSBOOT0  
greater than 87FFh (and less than 9FFFh) auto-  
matically addresses secondary Flash memory  
segment 0. Any address greater than 9FFFh ac-  
cesses the primary Flash memory segment 0. You  
can see that half of the primary Flash memory seg-  
ment 0 and one-fourth of secondary Flash memory  
segment 0 cannot be accessed in this example.  
Also note that an equation that defined FS1 to any-  
where in the range of 8000h to BFFFh would not  
be valid.  
Figure 9 shows the priority levels for all memory  
components. Any component on a higher level can  
overlap and has priority over any component on a  
lower level. Components on the same level must  
not overlap. Level one has the highest priority and  
level 3 has the lowest.  
Level 2  
Secondary  
Non-Volatile Memory  
Level 3  
Primary Flash Memory  
Lowest Priority  
AI02867D  
Configuration Modes for MCUs with Separate  
Program and Data Spaces  
Separate Space Modes. Program space is sep-  
arated from Data space. For example, Program  
Select Enable (PSEN, CNTL2) is used to access  
the program code from the primary Flash memory,  
while Read Strobe (RD, CNTL1) is used to access  
data from the secondary Flash memory, SRAM  
and I/O Port blocks. This configuration requires  
the VM register to be set to 0Ch (see Figure  
10., page 31).  
Combined Space Modes. The Program and  
Data spaces are combined into one memory  
space that allows the primary Flash memory, sec-  
ondary Flash memory, and SRAM to be accessed  
by either Program Select Enable (PSEN, CNTL2)  
or Read Strobe (RD, CNTL1). For example, to  
configure the primary Flash memory in Combined  
space, Bits b2 and b4 of the VM register are set to  
'1' (see Figure 11., page 31).  
Memory Select Configuration for MCUs with  
Separate Program and Data Spaces  
The 8031 and compatible family of MCUs, which  
includes the 80C51, 80C151, 80C251, and  
80C51XA, have separate address spaces for Pro-  
gram memory (selected using Program Select En-  
able (PSEN, CNTL2)) and Data memory (selected  
using Read Strobe (RD, CNTL1)). Any of the  
memories within the PSD can reside in either  
space or both spaces.  
30/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 10. 8031 Memory Modules – Separate Space  
Primary  
Flash  
Secondary  
Flash  
SRAM  
DPLD  
RS0  
Memory  
Memory  
CSBOOT0-3  
FS0-FS7  
CS  
CS  
OE  
CS  
OE  
OE  
PSEN  
RD  
AI02869C  
Figure 11. 8031 Memory Modules – Combined Space  
Primary  
Flash  
Secondary  
Flash  
SRAM  
DPLD  
RS0  
Memory  
Memory  
RD  
CSBOOT0-3  
FS0-FS7  
CS  
CS  
OE  
CS  
OE  
OE  
VM REG BIT 3  
VM REG BIT 4  
PSEN  
VM REG BIT 1  
RD  
VM REG BIT 2  
VM REG BIT 0  
AI02870C  
Table 13. VM Register  
Bit 7  
Bit 4  
Primary  
FL_Data  
Bit 3  
Secondary  
EE_Data  
Bit 2  
Primary  
FL_Code  
Bit 1  
Secondary  
EE_Code  
Bit 0  
SRAM_Code  
Bit 6  
Bit 5  
PIO_EN  
0 = RD can’t  
access  
Secondary Flash  
memory  
0 = PSEN  
can’t access  
Flash  
0 = PSEN can’t  
access  
Secondary Flash  
memory  
0 = RD  
can’t access  
Flash memory  
0 = PSEN  
can’t access  
SRAM  
0 = disable  
PIO mode  
not  
used  
not  
used  
memory  
1 = PSEN  
access  
Flash  
1 = RD  
access Flash  
memory  
1 = RD access  
Secondary Flash  
memory  
1 = PSEN access  
Secondary Flash  
memory  
1 = PSEN  
access  
SRAM  
1= enable  
PIO mode  
not  
used  
not  
used  
memory  
31/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PAGE REGISTER  
The 8-bit Page Register increases the addressing  
capability of the MCU by a factor of up to 256. The  
contents of the register can also be read by the  
MCU. The outputs of the Page Register (PGR0-  
PGR7) are inputs to the DPLD decoder and can be  
included in the Sector Select (FS0-FS7,  
CSBOOT0-CSBOOT3), and SRAM Select (RS0)  
equations.  
If memory paging is not needed, or if not all 8 page  
register bits are needed for memory paging, then  
these bits may be used in the CPLD for general  
logic. See Application Note AN1154.  
Figure 12 shows the Page Register. The eight flip-  
flops in the register are connected to the internal  
data bus D0-D7. The MCU can write to or read  
from the Page Register. The Page Register can be  
accessed at address location CSIOP + E0h.  
Figure 12. Page Register  
RESET  
PGR0  
INTERNAL  
SELECTS  
AND LOGIC  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
PGR1  
PGR2  
D0 - D7  
DPLD  
AND  
CPLD  
PGR3  
PGR4  
PGR5  
PGR6  
PGR7  
R/W  
PAGE  
REGISTER  
PLD  
AI02871B  
32/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PLDS  
The PLDs bring programmable logic functionality  
to the PSD. After specifying the logic for the PLDs  
using the PSDabel tool in PSDsoft Express, the  
logic is programmed into the device and available  
upon Power-up.  
Additionally, five bits are available in PMMR2 to  
block MCU control signals from entering the PLDs.  
This reduces power consumption and can be used  
only when these MCU control signals are not used  
in PLD logic equations.  
The PSD contains two PLDs: the Decode PLD  
(DPLD), and the Complex PLD (CPLD). The PLDs  
are briefly discussed in the next few paragraphs,  
and in more detail in the section entitled Decode  
PLD (DPLD), page 35 and the section entitled  
Each of the two PLDs has unique characteristics  
suited for its applications. They are described in  
the following sections.  
Table 14. DPLD and CPLD Inputs  
Number  
Complex  
PLD  
(CPLD), page 36.  
Figure  
13., page 34 shows the configuration of the PLDs.  
Input Source  
Input Name  
of  
The DPLD performs address decoding for Select  
signals for internal components, such as memory,  
registers, and I/O ports.  
Signals  
1
A15-A0  
16  
MCU Address Bus  
The CPLD can be used for logic functions, such as  
loadable counters and shift registers, state ma-  
chines, and encoding and decoding logic. These  
logic functions can be constructed using the 16  
Output Macrocells (OMC), 24 Input Macrocells  
(IMC), and the AND Array. The CPLD can also be  
used to generate External Chip Select (ECS0-  
ECS2) signals.  
The AND Array is used to form product terms.  
These product terms are specified using PSDabel.  
An Input Bus consisting of 73 signals is connected  
to the PLDs. The signals are shown in Table 14.  
MCU Control Signals  
Reset  
CNTL2-CNTL0  
RST  
3
1
1
Power-down  
PDN  
Port A Input  
Macrocells  
PA7-PA0  
PB7-PB0  
PC7-PC0  
8
8
8
Port B Input  
Macrocells  
Port C Input  
Macrocells  
The Turbo Bit in PSD  
Port D Inputs  
Page Register  
PD2-PD0  
3
8
The PLDs in the PSD can minimize power con-  
sumption by switching off when inputs remain un-  
changed for an extended time of about 70ns.  
Resetting the Turbo Bit to '0' (Bit 3 of PMMR0) au-  
tomatically places the PLDs into standby if no in-  
puts are changing. Turning the Turbo mode off  
increases propagation delays while reducing pow-  
er consumption. See the section entitled POWER  
MANAGEMENT, page 62 on how to set the Turbo  
Bit.  
PGR7-PGR0  
Macrocell AB  
Feedback  
MCELLAB.FB7-  
FB0  
8
8
Macrocell BC  
Feedback  
MCELLBC.FB7-  
FB0  
Secondary Flash  
memory Program  
Status Bit  
Ready/Busy  
1
Note: 1. The address inputs are A19-A4 in 80C51XA mode.  
33/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 13. PLD Diagram  
I / O P O R T S  
P L D I N P U T B U S  
34/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Decode PLD (DPLD)  
The DPLD, shown in Figure 14, is used for decod-  
ing the address for internal and external compo-  
nents. The DPLD can be used to generate the  
following decode signals:  
1 internal SRAM Select (RS0) signal (two  
product terms)  
1 internal CSIOP Select (PSD Configuration  
Register) signal  
1 JTAG Select signal (enables JTAG on Port  
C)  
2 internal Peripheral Select signals  
(Peripheral I/O mode).  
8 Sector Select (FS0-FS7) signals for the  
primary Flash memory (three product terms  
each)  
4 Sector Select (CSBOOT0-CSBOOT3)  
signals for the secondary Flash memory (three  
product terms each)  
Figure 14. DPLD Logic Array  
CSBOOT 0  
CSBOOT 1  
CSBOOT 2  
CSBOOT 3  
3
3
3
3
(INPUTS)  
(24)  
3
3
3
3
3
3
3
3
FS0  
FS1  
FS2  
FS3  
FS4  
FS5  
I/O PORTS (PORT A,B,C)  
(8)  
MCELLAB.FB [7:0] (FEEDBACKS)  
MCELLBC.FB [7:0] (FEEDBACKS)  
(8)  
(8)  
8 PRIMARY FLASH  
MEMORY SECTOR SELECTS  
PGR0 -PGR7  
(16)  
(3)  
[
]
A 15:0  
*
[
]
PD 2:0 (ALE,CLKIN,CSI)  
PDN (APD OUTPUT)  
FS6  
FS7  
(1)  
(3)  
(1)  
(1)  
[
] (  
CNTRL 2:0 READ/WRITE CONTROL SIGNALS)  
RESET  
RS0  
2
1
SRAM SELECT  
RD_BSY  
CSIOP  
I/O DECODER  
SELECT  
PSEL0  
1
1
1
PERIPHERAL I/O MODE  
SELECT  
PSEL1  
JTAGSEL  
AI02873D  
35/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Complex PLD (CPLD)  
The CPLD can be used to implement system logic  
functions, such as loadable counters and shift reg-  
isters, system mailboxes, handshaking protocols,  
state machines, and random logic. The CPLD can  
also be used to generate three External Chip Se-  
lect (ECS0-ECS2), routed to Port D.  
Although External Chip Select (ECS0-ECS2) can  
be produced by any Output Macrocell (OMC),  
these three External Chip Select (ECS0-ECS2) on  
Port D do not consume any Output Macrocells  
(OMC).  
Product Term Allocator  
AND Array capable of generating up to 137  
product terms  
Four I/O Ports.  
Each of the blocks are described in the sections  
that follow.  
The Input Macrocells (IMC) and Output Macrocells  
(OMC) are connected to the PSD internal data bus  
and can be directly accessed by the MCU. This  
enables the MCU software to load data into the  
Output Macrocells (OMC) or read data from both  
the Input and Output Macrocells (IMC and OMC).  
This feature allows efficient implementation of sys-  
tem logic and eliminates the need to connect the  
data bus to the AND Array as required in most  
standard PLD macrocell architectures.  
As shown in Figure 13., page 34, the CPLD has  
the following blocks:  
24 Input Macrocells (IMC)  
16 Output Macrocells (OMC)  
Macrocell Allocator  
Figure 15. Macrocell and I/O Port  
PRODUCT TERMS  
FROM OTHER  
MACROCELLS  
MCU ADDRESS / DATA BUS  
TO OTHER I/O PORTS  
CPLD MACROCELLS  
I/O PORTS  
DATA  
LOAD  
CONTROL  
LATCHED  
ADDRESS OUT  
PT PRESET  
MCU DATA IN  
MCU LOAD  
PRODUCT TERM  
ALLOCATOR  
I/O PIN  
DATA  
D
Q
MUX  
WR  
UP TO 10  
PRODUCT TERMS  
MACROCELL  
OUT TO  
MCU  
CPLD OUTPUT  
POLARITY  
SELECT  
PR DI LD  
D/T  
SELECT  
Q
PT  
CPLD  
OUTPUT  
PDR  
CLOCK  
INPUT  
D/T/JK FF  
SELECT  
COMB.  
/REG  
SELECT  
GLOBAL  
CLOCK  
MACROCELL  
CK  
TO  
I/O PORT  
ALLOC.  
CL  
CLOCK  
SELECT  
Q
DIR  
REG.  
D
WR  
PT CLEAR  
(
)
PT OUTPUT ENABLE OE  
MACROCELL FEEDBACK  
I/O PORT INPUT  
INPUT MACROCELLS  
Q
Q
D
PT INPUT LATCH GATE/CLOCK  
D
G
ALE/AS  
AI02874  
36/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Output Macrocell (OMC)  
Eight of the Output Macrocells (OMC) are con-  
nected to Ports A and B pins and are named as  
McellAB0-McellAB7. The other eight macrocells  
are connected to Ports B and C pins and are  
named as McellBC0-McellBC7. If an McellAB out-  
put is not assigned to a specific pin in PSDabel,  
the Macrocell Allocator block assigns it to either  
Port A or B. The same is true for a McellBC output  
on Port B or C. Table 15 shows the macrocells and  
port assignment.  
The Output Macrocell (OMC) architecture is  
shown in Figure 16., page 39. As shown in the fig-  
ure, there are native product terms available from  
the AND Array, and borrowed product terms avail-  
able (if unused) from other Output Macrocells  
(OMC). The polarity of the product term is con-  
trolled by the XOR gate. The Output Macrocell  
(OMC) can implement either sequential logic, us-  
ing the flip-flop element, or combinatorial logic.  
The multiplexer selects between the sequential or  
combinatorial logic outputs. The multiplexer output  
can drive a port pin and has a feedback path to the  
AND Array inputs.  
The flip-flop in the Output Macrocell (OMC) block  
can be configured as a D, T, JK, or SR type in the  
PSDabel program. The flip-flop’s clock, preset,  
and clear inputs may be driven from a product  
term of the AND Array. Alternatively, CLKIN (PD1)  
can be used for the clock input to the flip-flop. The  
flip-flop is clocked on the rising edge of CLKIN  
(PD1). The preset and clear are active High inputs.  
Each clear input can use up to two product terms.  
Table 15. Output Macrocell Port and Data Bit Assignments  
Output  
Macrocell  
Port  
Assignment  
Maximum Borrowed  
Product Terms  
Data Bit for Loading or  
Reading  
Native Product Terms  
McellAB0  
McellAB1  
McellAB2  
McellAB3  
McellAB4  
McellAB5  
McellAB6  
McellAB7  
McellBC0  
McellBC1  
McellBC2  
McellBC3  
McellBC4  
McellBC5  
McellBC6  
McellBC7  
Port A0, B0  
Port A1, B1  
Port A2, B2  
Port A3, B3  
Port A4, B4  
Port A5, B5  
Port A6, B6  
Port A7, B7  
Port B0, C0  
Port B1, C1  
Port B2, C2  
Port B3, C3  
Port B4, C4  
Port B5, C5  
Port B6, C6  
Port B7, C7  
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
6
6
6
6
6
6
6
6
5
5
5
5
6
6
6
6
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
37/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Product Term Allocator  
The CPLD has a Product Term Allocator. The PS-  
Dabel compiler uses the Product Term Allocator to  
borrow and place product terms from one macro-  
cell to another. The following list summarizes how  
product terms are allocated:  
Data can be loaded to the Output Macrocells  
(OMC) on the trailing edge of Write Strobe (WR,  
CNTL0) (edge loading) or during the time that  
Write Strobe (WR, CNTL0) is active (level load-  
ing). The method of loading is specified in PSDsoft  
Express Configuration.  
McellAB0-McellAB7 all have three native  
product terms and may borrow up to six more  
McellBC0-McellBC3 all have four native  
product terms and may borrow up to five more  
The OMC Mask Register  
There is one Mask Register for each of the two  
groups of eight Output Macrocells (OMC). The  
Mask Registers can be used to block the loading  
of data to individual Output Macrocells (OMC).  
The default value for the Mask Registers is 00h,  
which allows loading of the Output Macrocells  
(OMC). When a given bit in a Mask Register is set  
to a 1, the MCU is blocked from writing to the as-  
sociated Output Macrocells (OMC). For example,  
suppose McellAB0-McellAB3 are being used for a  
state machine. You would not want a MCU write to  
McellAB to overwrite the state machine registers.  
Therefore, you would want to load the Mask Reg-  
ister for McellAB (Mask Macrocell AB) with the val-  
ue 0Fh.  
McellBC4-McellBC7 all have four native  
product terms and may borrow up to six more.  
Each macrocell may only borrow product terms  
from certain other macrocells. Product terms al-  
ready in use by one macrocell are not available for  
another macrocell.  
If an equation requires more product terms than  
are available to it, then “external” product terms  
are required, which consume other Output Macro-  
cells (OMC). If external product terms are used,  
extra delay is added for the equation that required  
the extra product terms.  
This is called product term expansion. PSDsoft  
Express performs this expansion as needed.  
Loading and Reading the Output Macrocells  
(OMC)  
The Output Enable of the OMC  
The Output Macrocells (OMC) block can be con-  
nected to an I/O port pin as a PLD output. The out-  
put enable of each port pin driver is controlled by  
a single product term from the AND Array, ORed  
with the Direction Register output. The pin is en-  
abled upon Power-up if no output enable equation  
is defined and if the pin is declared as a PLD out-  
put in PSDsoft Express.  
If the Output Macrocell (OMC) output is declared  
as an internal node and not as a port pin output in  
the PSDabel file, the port pin can be used for other  
I/O functions. The internal node feedback can be  
routed as an input to the AND Array.  
The Output Macrocells (OMC) block occupies a  
memory location in the MCU address space, as  
defined by the CSIOP block (see the section enti-  
tled I/O PORTS, page 51). The flip-flops in each of  
the 16 Output Macrocells (OMC) can be loaded  
from the data bus by a MCU. Loading the Output  
Macrocells (OMC) with data from the MCU takes  
priority over internal functions. As such, the preset,  
clear, and clock inputs to the flip-flop can be over-  
ridden by the MCU. The ability to load the flip-flops  
and read them back is useful in such applications  
as loadable counters and shift registers, mailbox-  
es, and handshaking protocols.  
38/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 16. CPLD Output Macrocell  
A N D A R R A Y  
P L D I N P U T B U S  
39/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Input Macrocells (IMC)  
The CPLD has 24 Input Macrocells (IMC), one for  
each pin on Ports A, B, and C. The architecture of  
the Input Macrocells (IMC) is shown in Figure  
17., page 41. The Input Macrocells (IMC) are indi-  
vidually configurable, and can be used as a latch,  
register, or to pass incoming Port signals prior to  
driving them onto the PLD input bus. The outputs  
of the Input Macrocells (IMC) can be read by the  
MCU through the internal data bus.  
Input Macrocells (IMC) can use Address Strobe  
(ALE/AS, PD0) to latch address bits higher than  
A15. Any latched addresses are routed to the  
PLDs as inputs.  
Input Macrocells (IMC) are particularly useful with  
handshaking communication applications where  
two processors pass data back and forth through  
a common mailbox. Figure 18., page 42 shows a  
typical configuration where the Master MCU writes  
to the Port A Data Out Register. This, in turn, can  
be read by the Slave MCU via the activation of the  
“Slave-Read” output enable product term.  
The Slave can also write to the Port A Input Mac-  
rocells (IMC) and the Master can then read the In-  
put Macrocells (IMC) directly.  
Note that the “Slave-Read” and “Slave-Wr” signals  
are product terms that are derived from the Slave  
MCU inputs Read Strobe (RD, CNTL1), Write  
Strobe (WR, CNTL0), and Slave_CS.  
The enable for the latch and clock for the register  
are driven by a multiplexer whose inputs are a  
product term from the CPLD AND Array or the  
MCU Address Strobe (ALE/AS). Each product  
term output is used to latch or clock four Input  
Macrocells (IMC). Port inputs 3-0 can be con-  
trolled by one product term and 7-4 by another.  
Configurations for the Input Macrocells (IMC) are  
specified by equations written in PSDabel (see Ap-  
plication Note AN1171). Outputs of the Input Mac-  
rocells (IMC) can be read by the MCU via the IMC  
buffer.  
See  
the  
section  
entitled  
I/O  
PORTS, page 51.  
40/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 17. Input Macrocell  
A N D A R R A Y  
P L D I N P U T B U S  
41/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 18. Handshaking Communication Using Input Macrocells  
42/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
MCU BUS INTERFACE  
The “no-glue logic” MCU Bus Interface block can  
be directly connected to most popular MCUs and  
their control signals. Key 8-bit MCUs, with their  
bus types and control signals, are shown in Table  
16. The interface type is specified using the PSD-  
soft Express Configuration.  
Table 16. MCUs and their Control Signals  
Data Bus  
2
MCU  
CNTL0 CNTL1 CNTL2  
PC7  
ADIO0 PA3-PA0 PA7-PA3  
PD0  
ALE  
Width  
1
1
1
8031  
8
8
8
8
8
8
8
8
8
8
8
WR  
WR  
WR  
WR  
WR  
R/W  
R/W  
WR  
R/W  
R/W  
R/W  
RD  
RD  
PSEN  
RD  
RD  
E
PSEN  
PSEN  
A0  
A4  
A0  
A0  
A0  
A0  
A0  
A0  
A0  
A0  
A0  
(Note )  
(Note )  
(Note )  
1
1
80C51XA  
80C251  
80C251  
80198  
ALE  
ALE  
ALE  
ALE  
AS  
A3-A0  
(Note )  
(Note )  
1
1
1
1
(Note ) (Note )  
(Note )  
(Note )  
1
1
1
PSEN  
(Note )  
(Note )  
(Note )  
1
1
1
1
(Note ) (Note )  
(Note )  
(Note )  
1
1
1
1
68HC11  
68HC912  
Z80  
(Note ) (Note )  
(Note )  
(Note )  
1
1
1
E
DBE  
AS  
(Note )  
(Note )  
(Note )  
1
1
1
RD  
DS  
DS  
E
D3-D0  
D7-D4  
(Note ) (Note ) (Note )  
1
1
1
1
Z8  
AS  
(Note ) (Note )  
(Note )  
(Note )  
1
1
1
1
68330  
AS  
(Note ) (Note )  
(Note )  
(Note )  
1
1
M37702M2  
ALE  
D3-D0  
D7-D4  
(Note ) (Note )  
Note: 1. Unused CNTL2 pin can be configured as CPLD input. Other unused pins (PC7, PD0, PA3-0) can be configured for other I/O func-  
tions.  
2. ALE/AS input is optional for MCUs with a non-multiplexed bus  
43/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PSD Interface to a Multiplexed 8-Bit Bus  
Figure 19 shows an example of a system using a  
MCU with an 8-bit multiplexed bus and a PSD. The  
ADIO port on the PSD is connected directly to the  
MCU address/data bus. Address Strobe (ALE/AS,  
PD0) latches the address signals internally.  
Latched addresses can be brought out to Port A or  
B. The PSD drives the ADIO data bus only when  
one of its internal resources is accessed and Read  
Strobe (RD, CNTL1) is active. Should the system  
address bus exceed sixteen bits, Ports A, B, C, or  
D may be used as additional address inputs.  
Figure 19. An Example of a Typical 8-bit Multiplexed Bus Interface  
MCU  
PSD  
[
]
AD 7:0  
[
]
A 7:0  
PORT  
A
(
(
)
)
OPTIONAL  
ADIO  
PORT  
[
]
A 15:8  
[
]
A 15:8  
PORT  
B
OPTIONAL  
(
)
WR  
RD  
WR CNTRL0  
(
)
RD CNTRL1  
(
)
BHE  
BHE CNTRL2  
PORT  
C
RST  
ALE  
(
)
ALE PD0  
PORT D  
RESET  
AI02878C  
44/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PSD Interface to a Non-Multiplexed 8-Bit Bus  
MCU Bus Interface Examples  
Figure 20 shows an example of a system using a  
MCU with an 8-bit non-multiplexed bus and a  
PSD. The address bus is connected to the ADIO  
Port, and the data bus is connected to Port A. Port  
A is in tri-state mode when the PSD is not access-  
ed by the MCU. Should the system address bus  
exceed sixteen bits, Ports B, C, or D may be used  
for additional address inputs.  
Figure 21 through 25 show examples of the basic  
connections between the PSD and some popular  
MCUs. The PSD Control input pins are labeled as  
to the MCU function for which they are configured.  
The MCU bus interface is specified using the PS-  
Dsoft Express Configuration.  
Table 17. Eight-Bit Data Bus  
Data Byte Enable Reference  
BHE  
X
A0  
0
D7-D0  
Even Byte  
Odd Byte  
MCUs have different data byte orientations. Table  
17 shows how the PSD interprets byte/word oper-  
ations in different bus WRITE configurations.  
Even-byte refers to locations with address A0  
equal to '0' and odd byte as locations with A0 equal  
to ’1.’  
X
1
Figure 20. An Example of a Typical 8-bit Non-Multiplexed Bus Interface  
PSD  
MCU  
[
]
D 7:0  
[
]
D 7:0  
PORT  
A
ADIO  
PORT  
[
]
A 15:0  
[
]
A 23:16  
PORT  
B
(OPTIONAL)  
(
)
WR  
RD  
WR CNTRL0  
(
)
RD CNTRL1  
(
)
BHE  
BHE CNTRL2  
RST  
PORT  
C
ALE  
(
)
ALE PD0  
PORT D  
RESET  
AI02879C  
45/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
80C31  
Figure 21 shows the bus interface for the 80C31,  
which has an 8-bit multiplexed address/data bus.  
The lower address byte is multiplexed with the  
data bus. The MCU control signals Program Se-  
lect Enable (PSEN, CNTL2), Read Strobe (RD,  
CNTL1), and Write Strobe (WR, CNTL0) may be  
used for accessing the internal memory and I/O  
Ports blocks. Address Strobe (ALE/AS, PD0)  
latches the address.  
Figure 21. Interfacing the PSD with an 80C31  
AD7-AD0  
[
]
AD 7:0  
PSD  
80C31  
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
29  
30  
31  
ADIO0  
ADIO1  
ADIO2  
ADIO3  
ADIO4  
ADIO5  
ADIO6  
ADIO7  
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
31  
39  
38  
37  
36  
35  
34  
33  
32  
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
28  
27  
25  
24  
23  
22  
21  
EA/VP  
X1  
P0.0  
P0.1  
P0.2  
P0.3  
P0.4  
P0.5  
P0.6  
P0.7  
32  
33  
34  
35  
36  
37  
19  
18  
9
X2  
RESET  
RESET  
12  
13  
14  
15  
INT0  
INT1  
T0  
21  
22  
23  
24  
25  
26  
27  
28  
A8  
A9  
39  
40  
41  
42  
43  
44  
45  
46  
7
6
5
4
3
2
52  
51  
P2.0  
P2.1  
P2.2  
P2.3  
P2.4  
P2.5  
P2.6  
P2.7  
ADIO8  
ADIO9  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
A10  
A11  
A12  
A13  
A14  
A15  
ADIO10  
ADIO11  
ADIO12  
ADIO13  
ADIO14  
ADIO15  
T1  
1
2
3
4
5
6
P1.0  
P1.1  
P1.2  
P1.3  
P1.4  
P1.5  
P1.6  
P1.7  
17  
16  
RD  
RD  
WR  
20  
19  
18  
17  
14  
13  
12  
11  
WR  
47  
50  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
PC6  
PC7  
CNTL0(WR)  
CNTL1(RD)  
7
8
29  
30  
11  
10  
PSEN  
ALE  
PSEN  
ALE/P  
TXD  
49  
CNTL2(PSEN)  
10  
9
RXD  
PD0-ALE  
PD1  
8
PD2  
RESET  
48  
RESET  
RESET  
AI02880C  
46/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
80C251  
The Intel 80C251 MCU features a user-config-  
urable bus interface with four possible bus config-  
urations, as shown in Table 18., page 48.  
The 80C251 has two major operating modes:  
Page mode and Non-page mode. In Non-page  
mode, the data is multiplexed with the lower ad-  
dress byte, and Address Strobe (ALE/AS, PD0) is  
active in every bus cycle. In Page mode, data (D7-  
D0) is multiplexed with address (A15-A8). In a bus  
cycle where there is a Page hit, Address Strobe  
(ALE/AS, PD0) is not active and only addresses  
(A7-A0) are changing. The PSD supports both  
modes. In Page Mode, the PSD bus timing is iden-  
tical to Non-Page Mode except the address hold  
time and setup time with respect to Address  
Strobe (ALE/AS, PD0) is not required. The PSD  
access time is measured from address (A7-A0)  
valid to data in valid.  
The first configuration is 80C31-compatible, and  
the bus interface to the PSD is identical to that  
shown in Figure 21., page 46. The second and  
third configurations have the same bus connection  
as shown in Figure 22. There is only one Read  
Strobe (PSEN) connected to CNTL1 on the PSD.  
The A16 connection to PA0 allows for a larger ad-  
dress input to the PSD. The fourth configuration is  
shown in Figure 23., page 48. Read Strobe (RD) is  
connected to CNTL1 and Program Select Enable  
(PSEN) is connected to CNTL2.  
Figure 22. Interfacing the PSD with the 80C251, with One READ Input  
PSD  
80C251SB  
43  
42  
41  
40  
39  
38  
37  
36  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
30  
31  
32  
33  
34  
35  
36  
37  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
2
P0.0  
P0.1  
P0.2  
P0.3  
P0.4  
P0.5  
P0.6  
P0.7  
ADIO0  
ADIO1  
ADIO2  
ADIO3  
ADIO4  
ADIO5  
ADIO6  
ADIO7  
1
P1.0  
P1.1  
P1.2  
P1.3  
P1.4  
P1.5  
P1.6  
P1.7  
A16  
29  
28  
27  
25  
24  
23  
22  
21  
3
4
5
6
7
8
9
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
1
A17  
PA6  
PA7  
24  
25  
26  
AD8  
AD9  
AD10  
21  
20  
P2.0  
P2.1  
P2.2  
P2.3  
P2.4  
P2.5  
P2.6  
X1  
X2  
AD8  
39  
40  
41  
42  
43  
44  
45  
46  
ADIO8  
ADIO9  
ADIO10  
ADIO11  
ADIO12  
ADIO13  
ADIO14  
ADIO15  
7
6
5
4
3
2
52  
51  
AD9  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
27  
28  
AD11  
AD12  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
11  
13  
14  
15  
16  
17  
P3.0/RXD  
P3.1/TXD  
P3.2/INT0  
P3.3/INT1  
P3.4/T0  
29  
30  
AD13  
AD14  
AD15  
31  
P2.7  
ALE  
RD  
47  
50  
33  
32  
P3.5/T1  
(
)
CNTL0 WR  
ALE  
10  
RST  
RESET  
(
)
CNTL1 RD  
PSEN  
20  
19  
18  
17  
14  
13  
12  
11  
18  
19  
WR  
A16  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
PC6  
PC7  
WR  
RD/A16  
35  
49  
CNTL2(PSEN)  
EA  
10  
9
8
PD0-ALE  
PD1  
PD2  
48  
RESET  
RESET  
RESET  
AI02881C  
Note: 1. The A16 and A17 connections are optional.  
2. In non-Page-Mode, AD7-AD0 connects to ADIO7-ADIO0.  
47/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 23. Interfacing the PSD with the 80C251, with RD and PSEN Inputs  
80C251SB  
PSD  
43  
42  
41  
40  
39  
38  
37  
36  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
30  
31  
32  
33  
34  
35  
36  
37  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
2
P0.0  
P0.1  
P0.2  
P0.3  
P0.4  
P0.5  
P0.6  
P0.7  
ADIO0  
ADIO1  
ADIO2  
ADIO3  
ADIO4  
ADIO5  
ADIO6  
ADIO7  
P1.0  
P1.1  
P1.2  
P1.3  
P1.4  
P1.5  
P1.6  
P1.7  
29  
28  
27  
25  
24  
23  
22  
21  
3
4
5
6
7
8
9
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
24  
25  
26  
AD8  
AD9  
AD10  
21  
20  
P2.0  
P2.1  
P2.2  
P2.3  
P2.4  
P2.5  
P2.6  
X1  
X2  
AD8  
39  
40  
41  
42  
43  
44  
45  
46  
ADIO8  
ADIO9  
ADIO10  
ADIO11  
ADIO12  
ADIO13  
ADIO14  
ADIO15  
7
6
5
4
3
2
52  
51  
AD9  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
27  
28  
AD11  
AD12  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
11  
13  
14  
15  
16  
17  
P3.0/RXD  
P3.1/TXD  
P3.2/INT0  
P3.3/INT1  
P3.4/T0  
29  
30  
AD13  
AD14  
AD15  
31  
P2.7  
P3.5/T1  
33  
32  
ALE  
RD  
47  
50  
(
)
CNTL0 WR  
ALE  
10  
RST  
EA  
RESET  
(
)
CNTL1 RD  
PSEN  
20  
19  
18  
17  
14  
13  
12  
11  
18  
19  
WR  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
PC6  
PC7  
WR  
RD/A16  
PSEN  
35  
49  
CNTL2(PSEN)  
10  
9
8
PD0-ALE  
PD1  
PD2  
48  
RESET  
RESET  
RESET  
AI02882C  
Table 18. 80C251 Configurations  
80C251 READ/WRITE  
Pins  
Configuration  
Connecting to PSD Pins  
Page Mode  
WR  
RD  
PSEN  
CNTL0  
CNTL1  
CNTL2  
Non-Page Mode, 80C31 compatible A7-  
A0 multiplex with D7-D0  
1
WR  
PSEN only  
CNTL0  
CNTL1  
Non-Page Mode  
A7-A0 multiplex with D7-D0  
2
3
WR  
PSEN only  
CNTL0  
CNTL1  
Page Mode  
A15-A8 multiplex with D7-D0  
WR  
RD  
PSEN  
CNTL0  
CNTL1  
CNTL2  
Page Mode  
A15-A8 multiplex with D7-D0  
4
48/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
80C51XA  
The Philips 80C51XA MCU family supports an 8-  
or 16-bit multiplexed bus that can have burst cy-  
cles. Address bits (A3-A0) are not multiplexed,  
while (A19-A4) are multiplexed with data bits  
(D15-D0) in 16-bit mode. In 8-bit mode, (A11-A4)  
are multiplexed with data bits (D7-D0).  
The 80C51XA can be configured to operate in  
eight-bit data mode (as shown in Figure 24).  
The 80C51XA improves bus throughput and per-  
formance by executing burst cycles for code fetch-  
es. In Burst Mode, address A19-A4 are latched  
internally by the PSD, while the 80C51XA changes  
the A3-A0 signals to fetch up to 16 bytes of code.  
The PSD access time is then measured from ad-  
dress A3-A0 valid to data in valid. The PSD bus  
timing requirement in Burst Mode is identical to the  
normal bus cycle, except the address setup and  
hold time with respect to Address Strobe (ALE/AS,  
PD0) does not apply.  
Figure 24. Interfacing the PSD with the 80C51X, 8-bit Data Bus  
80C51XA  
PSD  
21  
20  
30  
31  
32  
33  
34  
35  
36  
37  
A4D0  
A5D1  
A6D2  
A7D3  
A8D4  
A9D5  
A10D6  
A11D7  
2
3
4
A0  
A1  
A2  
A3  
A4D0  
A5D1  
A6D2  
A7D3  
A8D4  
A9D5  
A10D6  
A11D7  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
XTAL1  
XTAL2  
ADIO0  
A0/WRH  
A1  
29 A0  
ADIO1  
ADIO2  
ADIO3  
AD104  
AD105  
ADIO6  
ADIO7  
PA0  
PA1  
28 A1  
27 A2  
25 A3  
24  
23  
22  
A2  
A3  
A4D0  
A5D1  
A6D2  
A7D3  
A8D4  
A9D5  
A10D6  
A11D7  
A12D8  
A13D9  
A14D10  
A15D11  
A16D12  
A17D13  
A18D14  
A19D15  
5
PA2  
43  
42  
41  
40  
39  
PA3  
PA4  
PA5  
PA6  
11  
13  
6
RXD0  
TXD0  
RXD1  
TXD1  
7
21  
PA7  
38  
37  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
39  
40  
41  
42  
43  
44  
45  
46  
ADIO8  
ADIO9  
9
8
16  
7
36  
24  
25  
26  
27  
28  
29  
30  
31  
T2EX  
T2  
T0  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
6
5
4
3
2
52  
51  
ADIO10  
ADIO11  
AD1012  
AD1013  
ADIO14  
ADIO15  
10  
RST  
INT0  
INT1  
RESET  
14  
15  
47  
50  
(
)
CNTL0 WR  
20  
19  
18  
17  
14  
13  
12  
11  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
PC6  
PC7  
(
)
CNTL1 RD  
PSEN  
32  
49  
35  
17  
PSEN  
RD  
CNTL2(PSEN)  
EA/WAIT  
BUSW  
19  
18  
33  
RD  
WR  
10  
8
9
PD0-ALE  
PD1  
WRL  
ALE  
ALE  
PD2  
48  
RESET  
RESET  
AI02883C  
49/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
68HC11  
Figure 25 shows a bus interface to a 68HC11  
where the PSD is configured in 8-bit multiplexed  
mode with E and R/W settings. The DPLD can be  
used to generate the READ and WR signals for  
external devices.  
Figure 25. Interfacing the PSD with a 68HC11  
AD7-AD0  
AD7-AD0  
29  
PSD  
30  
31  
32  
33  
34  
35  
36  
37  
AD0  
AD1  
ADIO0  
ADIO1  
ADIO2  
ADIO3  
AD104  
AD105  
ADIO6  
ADIO7  
PA0  
28  
27  
25  
24  
23  
22  
21  
68HC11  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
31  
PA3  
PA4  
PA5  
PA6  
PA7  
8
7
30  
29  
28  
27  
XT  
EX  
17  
19  
18  
RESET  
RESET  
IRQ  
39  
40  
41  
42  
43  
44  
45  
46  
7
6
5
4
3
2
52  
51  
XIRQ  
42  
41  
40  
39  
38  
37  
36  
35  
A8  
A9  
A10  
A11  
A12  
A13  
A14  
A15  
ADIO8  
ADIO9  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
2
MODB  
ADIO10  
ADIO11  
AD1012  
AD1013  
ADIO14  
ADIO15  
34  
33  
32  
PA0  
PA1  
PA2  
9
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
PC6  
PC7  
43  
44  
45  
46  
47  
48  
49  
50  
20  
19  
18  
17  
14  
13  
12  
11  
10  
11  
12  
13  
14  
15  
16  
PE0  
PE1  
PE2  
PE3  
PE4  
PE5  
PE6  
PE7  
PC0  
PC1  
PC2  
PC3  
PC4  
47  
50  
_
CNTL0(R W)  
CNTL1(E)  
49  
CNTL2  
PC5  
PC6  
PC7  
10  
9
8
PD0 AS  
PD1  
PD2  
20  
21  
22  
23  
24  
25  
52  
51  
PD0  
PD1  
PD2  
PD3  
PD4  
PD5  
VRH  
VRL  
48  
RESET  
3
MODA  
5
4
6
E
E
AS  
R/W  
AS  
R/W  
RESET  
AI02884C  
50/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
I/O PORTS  
There are four programmable I/O ports: Ports A, B,  
C, and D. Each of the ports is eight bits except Port  
D, which is 3 bits. Each port pin is individually user  
configurable, thus allowing multiple functions per  
port. The ports are configured using PSDsoft Ex-  
press Configuration or by the MCU writing to on-  
chip registers in the CSIOP space.  
The Port pin’s tri-state output driver enable is con-  
trolled by a two input OR gate whose inputs come  
from the CPLD AND Array enable product term  
and the Direction Register. If the enable product  
term of any of the Array outputs are not defined  
and that port pin is not defined as a CPLD output  
in the PSDabel file, then the Direction Register has  
sole control of the buffer that drives the port pin.  
The topics discussed in this section are:  
The contents of these registers can be altered by  
the MCU. The Port Data Buffer (PDB) feedback  
path allows the MCU to check the contents of the  
registers.  
Ports A, B, and C have embedded Input Macro-  
cells (IMC). The Input Macrocells (IMC) can be  
configured as latches, registers, or direct inputs to  
the PLDs. The latches and registers are clocked  
by Address Strobe (ALE/AS, PD0) or a product  
term from the PLD AND Array. The outputs from  
the Input Macrocells (IMC) drive the PLD input bus  
and can be read by the MCU. See the section en-  
titled Input Macrocell, page 41.  
General Port architecture  
Port operating modes  
Port Configuration Registers (PCR)  
Port Data Registers  
Individual Port functionality.  
General Port Architecture  
The general architecture of the I/O Port block is  
shown in Figure 26., page 52. Individual Port ar-  
chitectures are shown in Figure 28., page 58 to  
Figure 31., page 61. In general, once the purpose  
for a port pin has been defined, that pin is no long-  
er available for other purposes. Exceptions are  
noted.  
Port Operating Modes  
The I/O Ports have several modes of operation.  
Some modes can be defined using PSDabel,  
some by the MCU writing to the Control Registers  
in CSIOP space, and some by both. The modes  
that can only be defined using PSDsoft Express  
must be programmed into the device and cannot  
be changed unless the device is reprogrammed.  
The modes that can be changed by the MCU can  
be done so dynamically at run-time. The PLD I/O,  
Data Port, Address Input, and Peripheral I/O  
modes are the only modes that must be defined  
before programming the device. All other modes  
can be changed by the MCU at run-time. See Ap-  
plication Note AN1171 for more detail.  
As shown in Figure 26., page 52, the ports contain  
an output multiplexer whose select signals are  
driven by the configuration bits in the Control Reg-  
isters (Ports A and B only) and PSDsoft Express  
Configuration. Inputs to the multiplexer include the  
following:  
Output data from the Data Out register  
Latched address outputs  
CPLD macrocell output  
External Chip Select (ECS0-ECS2) from the  
CPLD.  
The Port Data Buffer (PDB) is a tri-state buffer that  
allows only one source at a time to be read. The  
Port Data Buffer (PDB) is connected to the Internal  
Data Bus for feedback and can be read by the  
MCU. The Data Out and macrocell outputs, Direc-  
tion and Control Registers, and port pin input are  
all connected to the Port Data Buffer (PDB).  
Table 19., page 53 summarizes which modes are  
available on each port. Table 22., page 56 shows  
how and where the different modes are config-  
ured. Each of the port operating modes are de-  
scribed in the following sections.  
51/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 26. General I/O Port Architecture  
DATA OUT  
REG.  
DATA OUT  
D
Q
WR  
ADDRESS  
ALE  
ADDRESS  
PORT PIN  
D
G
Q
OUTPUT  
MUX  
MACROCELL OUTPUTS  
EXT CS  
READ MUX  
P
D
B
OUTPUT  
SELECT  
DATA IN  
CONTROL REG.  
ENABLE OUT  
D
Q
WR  
WR  
DIR REG.  
D
Q
(
)
ENABLE PRODUCT TERM .OE  
INPUT  
MACROCELL  
CPLD-INPUT  
AI02885  
52/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
MCU I/O Mode  
In the MCU I/O mode, the MCU uses the I/O Ports  
block to expand its own I/O ports. By setting up the  
CSIOP space, the ports on the PSD are mapped  
into the MCU address space. The addresses of  
the ports are listed in Table 7., page 18.  
A port pin can be put into MCU I/O mode by writing  
a 0 to the corresponding bit in the Control Regis-  
ter. The MCU I/O direction may be changed by  
writing to the corresponding bit in the Direction  
Register, or by the output enable product term.  
See the section entitled Peripheral I/O  
Mode, page 55. When the pin is configured as an  
output, the content of the Data Out Register drives  
the pin. When configured as an input, the MCU  
can read the port input through the Data In buffer.  
See Figure 26., page 52.  
corresponding bit in the Direction Register to ’0.’  
The corresponding bit in the Direction Register  
must not be set to '1' if the pin is defined for a PLD  
input signal in PSDabel. The PLD I/O mode is  
specified in PSDabel by declaring the port pins,  
and then writing an equation assigning the PLD I/  
O to a port.  
Address Out Mode  
For MCUs with a multiplexed address/data bus,  
Address Out Mode can be used to drive latched  
addresses on to the port pins. These port pins can,  
in turn, drive external devices. Either the output  
enable or the corresponding bits of both the Direc-  
tion Register and Control Register must be set to  
a 1 for pins to use Address Out Mode. This must  
be done by the MCU at run-time. See Table 21 for  
the address output pin assignments on Ports A  
and B for various MCUs.  
Ports C and D do not have Control Registers, and  
are in MCU I/O mode by default. They can be used  
for PLD I/O if equations are written for them in PS-  
Dabel.  
For non-multiplexed 8-bit bus mode, address sig-  
nals (A7-A0) are available to Port B in Address Out  
Mode.  
PLD I/O Mode  
The PLD I/O Mode uses a port as an input to the  
CPLD’s Input Macrocells (IMC), and/or as an out-  
put from the CPLD’s Output Macrocells (OMC).  
The output can be tri-stated with a control signal.  
This output enable control signal can be defined  
by a product term from the PLD, or by resetting the  
Note: Do not drive address signals with Address  
Out Mode to an external memory device if it is in-  
tended for the MCU to Boot from the external de-  
vice. The MCU must first Boot from PSD memory  
so the Direction and Control register bits can be  
set.  
Table 19. Port Operating Modes  
Port Mode  
MCU I/O  
Port A  
Port B  
Port C  
Port D  
Yes  
Yes  
Yes  
Yes  
PLD I/O  
McellAB Outputs  
McellBC Outputs  
Additional Ext. CS Outputs No  
Yes  
No  
Yes  
Yes  
No  
No  
Yes  
No  
No  
No  
Yes  
PLD Inputs  
Yes  
Yes  
Yes  
Yes  
Yes (A7 – 0)  
or (A15 – 8)  
Address Out  
Yes (A7 – 0)  
No  
No  
Address In  
Data Port  
Yes  
Yes  
No  
No  
No  
Yes  
No  
No  
Yes  
No  
No  
No  
Yes (D7 – 0)  
Peripheral I/O  
JTAG ISP  
Yes  
No  
1
Yes  
Note: 1. Can be multiplexed with other I/O functions.  
53/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 20. Port Operating Mode Settings  
Control  
Direction  
Register  
Setting  
VM  
Defined in  
PSDabel  
Defined in PSD  
Configuration  
Mode  
Register  
Setting  
Register JTAG Enable  
Setting  
1 = output,  
0 = input  
1
MCU I/O  
Declare pins only  
0
N/A  
N/A  
N/A  
2
(Note )  
2
PLD I/O  
Logic equations  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
(Note )  
Data Port (Port A)  
Specify bus type  
N/A  
Address Out  
(Port A,B)  
2
Declare pins only  
N/A  
N/A  
N/A  
1
N/A  
N/A  
N/A  
N/A  
1 (Note )  
Address In  
(Port A,B,C,D)  
Logic for equation  
Input Macrocells  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Peripheral I/O  
(Port A)  
Logic equations  
(PSEL0 & 1)  
PIO bit = 1 N/A  
N/A JTAG_Enable  
JTAG  
Configuration  
3
JTAGSEL  
JTAG ISP (Note )  
Note: 1. N/A = Not Applicable  
2. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the individual output enable product  
term (.oe) from the CPLD AND Array.  
3. Any of these three methods enables the JTAG pins on Port C.  
Table 21. I/O Port Latched Address Output Assignments  
MCU  
Port A (PA3-PA0)  
Port A (PA7-PA4)  
Port B (PB3-PB0)  
Port B (PB7-PB4)  
N/A  
1
8051XA (8-Bit)  
Address a7-a4  
Address a11-a8  
N/A  
80C251  
(Page Mode)  
N/A  
N/A  
Address a11-a8  
Address a3-a0  
Address a3-a0  
Address a15-a12  
Address a7-a4  
Address a7-a4  
All Other  
8-Bit Multiplexed  
Address a3-a0  
N/A  
Address a7-a4  
N/A  
8-Bit  
Non-Multiplexed Bus  
Note: 1. N/A = Not Applicable.  
54/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Peripheral I/O Mode  
Address In Mode  
For MCUs that have more than 16 address sig-  
nals, the higher addresses can be connected to  
Port A, B, C, and D. The address input can be  
latched in the Input Macrocell (IMC) by Address  
Strobe (ALE/AS, PD0). Any input that is included  
in the DPLD equations for the SRAM, or primary or  
secondary Flash memory is considered to be an  
address input.  
Peripheral I/O mode can be used to interface with  
external peripherals. In this mode, all of Port A  
serves as a tri-state, bi-directional data buffer for  
the MCU. Peripheral I/O Mode is enabled by set-  
ting Bit 7 of the VM Register to a ’1.’ Figure 27  
shows how Port A acts as a bi-directional buffer for  
the MCU data bus if Peripheral I/O Mode is en-  
abled. An equation for PSEL0 and/or PSEL1 must  
be written in PSDabel. The buffer is tri-stated  
when PSEL0 or PSEL1 is not active.  
Data Port Mode  
Port A can be used as a data bus port for a MCU  
with a non-multiplexed address/data bus. The  
Data Port is connected to the data bus of the MCU.  
The general I/O functions are disabled in Port A if  
the port is configured as a Data Port.  
Figure 27. Peripheral I/O Mode  
RD  
PSEL0  
PSEL  
PSEL1  
D0-D7  
VM REGISTER BIT 7  
PA0-PA7  
DATA BUS  
WR  
AI02886  
55/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
JTAG In-System Programming (ISP)  
Drive Select Register  
Port C is JTAG compliant, and can be used for In-  
System Programming (ISP). You can multiplex  
JTAG operations with other functions on Port C  
because In-System Programming (ISP) is not per-  
formed in normal Operating mode. For more infor-  
mation on the JTAG Port, see the section entitled  
PROGRAMMING IN-CIRCUIT USING THE JTAG  
SERIAL INTERFACE, page 69.  
The Drive Select Register configures the pin driver  
as Open Drain or CMOS for some port pins, and  
controls the slew rate for the other port pins. An  
external pull-up resistor should be used for pins  
configured as Open Drain.  
A pin can be configured as Open Drain if its corre-  
sponding bit in the Drive Select Register is set to a  
’1.’ The default pin drive is CMOS.  
Port Configuration Registers (PCR)  
Note that the slew rate is a measurement of the  
rise and fall times of an output. A higher slew rate  
means a faster output response and may create  
more electrical noise. A pin operates in a high slew  
rate when the corresponding bit in the Drive Reg-  
ister is set to ’1.’ The default rate is slow slew.  
Each Port has a set of Port Configuration Regis-  
ters (PCR) used for configuration. The contents of  
the registers can be accessed by the MCU through  
normal READ/WRITE bus cycles at the addresses  
given in Table 7., page 18. The addresses in Ta-  
ble 7 are the offsets in hexadecimal from the base  
of the CSIOP register.  
The pins of a port are individually configurable and  
each bit in the register controls its respective pin.  
For example, Bit 0 in a register refers to Bit 0 of its  
port. The three Port Configuration Registers  
(PCR), shown in Table 22, are used for setting the  
Port configurations. The default Power-up state for  
each register in Table 22 is 00h.  
Table 26., page 57 shows the Drive Register for  
Ports A, B, C, and D. It summarizes which pins can  
be configured as Open Drain outputs and which  
pins the slew rate can be set for.  
Table 22. Port Configuration Registers (PCR)  
Register Name  
Control  
Port  
MCU Access  
WRITE/READ  
WRITE/READ  
WRITE/READ  
A,B  
Control Register  
Direction  
A,B,C,D  
A,B,C,D  
Any bit reset to '0' in the Control Register sets the  
corresponding port pin to MCU I/O Mode, and a '1'  
sets it to Address Out Mode. The default mode is  
MCU I/O. Only Ports A and B have an associated  
Control Register.  
1
Drive Select  
Note: 1. See Table 26., page 57 for Drive Register bit definition.  
Table 23. Port Pin Direction Control, Output  
Enable P.T. Not Defined  
Direction Register  
The Direction Register, in conjunction with the out-  
put enable (except for Port D), controls the direc-  
tion of data flow in the I/O Ports. Any bit set to '1'  
in the Direction Register causes the correspond-  
ing pin to be an output, and any bit set to '0' causes  
it to be an input. The default mode for all port pins  
is input.  
Figure 28., page 58 and Figure 29., page 59 show  
the Port Architecture diagrams for Ports A/B and  
C, respectively. The direction of data flow for Ports  
A, B, and C are controlled not only by the direction  
register, but also by the output enable product  
term from the PLD AND Array. If the output enable  
product term is not active, the Direction Register  
has sole control of a given pin’s direction.  
Direction Register Bit  
Port Pin Mode  
0
1
Input  
Output  
Table 24. Port Pin Direction Control, Output  
Enable P.T. Defined  
Direction  
Register Bit  
Output Enable  
P.T.  
Port Pin Mode  
0
0
1
1
0
Input  
1
0
1
Output  
Output  
Output  
An example of a configuration for a Port with the  
three least significant bits set to output and the re-  
mainder set to input is shown in Table 25. Since  
Port D only contains three pins (shown in Figure  
31., page 61), the Direction Register for Port D  
has only the three least significant bits active.  
Table 25. Port Direction Assignment Example  
Bit 7 Bit6 Bit 5 Bit4 Bit 3 Bit2 Bit 1 Bit 0  
0
0
0
0
0
1
1
1
56/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 26. Drive Register Pin Assignment  
Drive  
Register  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Open  
Bit 3  
Slew  
Bit 2  
Slew  
Bit 1  
Slew  
Bit 0  
Slew  
Open  
Open  
Open  
Port A  
Port B  
Port C  
Port D  
Drain  
Drain  
Drain  
Drain  
Rate  
Rate  
Rate  
Rate  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Slew  
Rate  
Slew  
Rate  
Slew  
Rate  
Slew  
Rate  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Open  
Drain  
Slew  
Rate  
Slew  
Rate  
Slew  
Rate  
1
1
1
1
1
NA  
NA  
NA  
NA  
NA  
Note: 1. NA = Not Applicable.  
Port Data Registers  
Output Macrocells (OMC). The CPLD Output  
Macrocells (OMC) occupy a location in the MCU’s  
address space. The MCU can read the output of  
the Output Macrocells (OMC). If the OMC Mask  
Register bits are not set, writing to the macrocell  
loads data to the macrocell flip-flops. See the sec-  
tion entitled PLDS, page 33.  
The Port Data Registers, shown in Table 27, are  
used by the MCU to write data to or read data from  
the ports. Table 27 shows the register name, the  
ports having each register type, and MCU access  
for each register type. The registers are described  
below.  
OMC Mask Register  
Data In  
Each OMC Mask Register bit corresponds to an  
Output Macrocell (OMC) flip-flop. When the OMC  
Mask Register bit is set to a 1, loading data into the  
Output Macrocell (OMC) flip-flop is blocked. The  
default value is 0 or unblocked.  
Port pins are connected directly to the Data In buff-  
er. In MCU I/O input mode, the pin input is read  
through the Data In buffer.  
Data Out Register  
Stores output data written by the MCU in the MCU  
I/O output mode. The contents of the Register are  
driven out to the pins if the Direction Register or  
the output enable product term is set to ’1.’ The  
contents of the register can also be read back by  
the MCU.  
Table 27. Port Data Registers  
Register Name  
Port  
A,B,C,D  
MCU Access  
Data In  
READ – input on pin  
Data Out  
A,B,C,D  
A,B,C  
WRITE/READ  
READ – outputs of macrocells  
WRITE – loading macrocells flip-flop  
Output Macrocell  
Mask Macrocell  
WRITE/READ – prevents loading into a given  
macrocell  
A,B,C  
Input Macrocell  
Enable Out  
A,B,C  
A,B,C  
READ – outputs of the Input Macrocells  
READ – the output enable control of the port driver  
57/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Input Macrocells (IMC)  
Ports A and B – Functionality and Structure  
The Input Macrocells (IMC) can be used to latch or  
store external inputs. The outputs of the Input  
Macrocells (IMC) are routed to the PLD input bus,  
and can be read by the MCU. See the section en-  
titled PLDS, page 33.  
Ports A and B have similar functionality and struc-  
ture, as shown in Figure 28. The two ports can be  
configured to perform one or more of the following  
functions:  
MCU I/O Mode  
Enable Out  
CPLD Output – Macrocells McellAB7-  
McellAB0 can be connected to Port A or Port  
B. McellBC7-McellBC0 can be connected to  
Port B or Port C.  
CPLD Input – Via the Input Macrocells (IMC).  
Latched Address output – Provide latched  
address output as per Table 21., page 54.  
The Enable Out register can be read by the MCU.  
It contains the output enable values for a given  
port. A 1 indicates the driver is in output mode. A  
0 indicates the driver is in tri-state and the pin is in  
input mode.  
Address In – Additional high address inputs  
using the Input Macrocells (IMC).  
Open Drain/Slew Rate – pins PA3-PA0 and  
PB3-PB0 can be configured to fast slew rate,  
pins PA7-PA4 and PB7-PB4 can be  
configured to Open Drain Mode.  
Data Port – Port A to D7-D0 for 8 bit non-  
multiplexed bus  
Multiplexed Address/Data port for certain  
types of MCU bus interfaces.  
Peripheral Mode – Port A only  
Figure 28. Port A and Port B Structure  
DATA OUT  
REG.  
DATA OUT  
D
Q
WR  
PORT  
A OR B PIN  
ADDRESS  
ALE  
ADDRESS  
D
G
Q
[
]
[
]
A 7:0 OR A 15:8  
OUTPUT  
MUX  
MACROCELL OUTPUTS  
READ MUX  
P
D
B
OUTPUT  
SELECT  
DATA IN  
CONTROL REG.  
ENABLE OUT  
D
Q
WR  
WR  
DIR REG.  
D
Q
(
)
ENABLE PRODUCT TERM .OE  
CPLD-INPUT  
INPUT  
MACROCELL  
AI02887  
58/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Port C – Functionality and Structure  
Port C can be configured to perform one or more  
of the following functions (see Figure 29):  
Open Drain – Port C pins can be configured in  
Open Drain Mode  
Battery Backup features – PC2 can be  
MCU I/O Mode  
configured for a battery input supply, Voltage  
CPLD Output – McellBC7-McellBC0 outputs  
can be connected to Port B or Port C.  
Stand-by (V ).  
STBY  
PC4 can be configured as a Battery-on Indicator  
(V ), indicating when V is less than  
CPLD Input – via the Input Macrocells (IMC)  
Address In – Additional high address inputs  
using the Input Macrocells (IMC).  
BATON  
CC  
V
.
BAT  
Port C does not support Address Out mode, and  
therefore no Control Register is required.  
Pin PC7 may be configured as the DBE input in  
certain MCU bus interfaces.  
In-System Programming (ISP) – JTAG port  
can be enabled for programming/erase of the  
PSD device. (See the section entitled  
PROGRAMMING IN-CIRCUIT USING THE  
JTAG SERIAL INTERFACE, page 69 for  
more information on JTAG programming.)  
Figure 29. Port C Structure  
DATA OUT  
REG.  
DATA OUT  
D
Q
WR  
PORT C PIN  
1
SPECIAL FUNCTION  
OUTPUT  
MUX  
[
]
MCELLBC 7:0  
READ MUX  
P
D
B
OUTPUT  
SELECT  
DATA IN  
ENABLE OUT  
DIR REG.  
D
Q
WR  
(
)
ENABLE PRODUCT TERM .OE  
INPUT  
MACROCELL  
1
SPECIAL FUNCTION  
CPLD-INPUT  
CONFIGURATION  
BIT  
AI02888B  
59/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Port D – Functionality and Structure  
Port D has three I/O pins. See Figure 30 and Fig-  
ure 31., page 61. This port does not support Ad-  
dress Out mode, and therefore no Control  
Register is required. Port D can be configured to  
perform one or more of the following functions:  
Slew rate – pins can be set up for fast slew  
rate  
Port D pins can be configured in PSDsoft Express  
as input pins for other dedicated functions:  
Address Strobe (ALE/AS, PD0)  
CLKIN (PD1) as input to the macrocells flip-  
flops and APD counter  
PSD Chip Select Input (CSI, PD2). Driving this  
signal High disables the Flash memory, SRAM  
and CSIOP.  
MCU I/O Mode  
CPLD Output – External Chip Select (ECS0-  
ECS2)  
CPLD Input – direct input to the CPLD, no  
Input Macrocells (IMC)  
Figure 30. Port D Structure  
DATA OUT  
REG.  
DATA OUT  
D
Q
WR  
PORT D PIN  
OUTPUT  
MUX  
[
]
ECS 2:0  
READ MUX  
OUTPUT  
SELECT  
P
D
B
DATA IN  
ENABLE PRODUCT  
TERM (.OE)  
DIR REG.  
D
Q
WR  
CPLD-INPUT  
AI02889  
60/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
External Chip Select  
The CPLD also provides three External Chip Se-  
lect (ECS0-ECS2) outputs on Port D pins that can  
be used to select external devices. Each External  
Chip Select (ECS0-ECS2) consists of one product  
term that can be configured active High or Low.  
The output enable of the pin is controlled by either  
the output enable product term or the Direction  
Register. (See Figure 31.)  
Figure 31. Port D External Chip Select Signals  
ENABLE (.OE)  
DIRECTION  
REGISTER  
PD0 PIN  
ECS0  
PT0  
PT1  
PT2  
POLARITY  
BIT  
ENABLE (.OE)  
DIRECTION  
REGISTER  
PD1 PIN  
ECS1  
POLARITY  
BIT  
ENABLE (.OE)  
DIRECTION  
REGISTER  
PD2 PIN  
ECS2  
POLARITY  
BIT  
AI02890  
61/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
POWER MANAGEMENT  
All PSD devices offer configurable power saving  
options. These options may be used individually or  
in combinations, as follows:  
remain in standby mode even if the address/  
data signals are changing state externally  
(noise, other devices on the MCU bus, etc.).  
Keep in mind that any unblocked PLD input  
signals that are changing states keeps the PLD  
out of Stand-by mode, but not the memories.  
All memory blocks in a PSD (primary and  
secondary Flash memory, and SRAM) are  
built with power management technology. In  
addition to using special silicon design  
methodology, power management technology  
puts the memories into standby mode when  
address/data inputs are not changing (zero  
DC current). As soon as a transition occurs on  
an input, the affected memory “wakes up”,  
changes and latches its outputs, then goes  
back to standby. The designer does not have  
to do anything special to achieve memory  
standby mode when no inputs are changing—  
it happens automatically.  
PSD Chip Select Input (CSI, PD2) can be  
used to disable the internal memories, placing  
them in standby mode even if inputs are  
changing. This feature does not block any  
internal signals or disable the PLDs. This is a  
good alternative to using the APD Unit. There  
is a slight penalty in memory access time  
when PSD Chip Select Input (CSI, PD2)  
makes its initial transition from deselected to  
selected.  
The PMMRs can be written by the MCU at run-  
time to manage power. All PSD supports  
“blocking bits” in these registers that are set to  
block designated signals from reaching both  
PLDs. Current consumption of the PLDs is  
directly related to the composite frequency of  
the changes on their inputs (see Figure 35 and  
Figure 36., page 72). Significant power  
savings can be achieved by blocking signals  
that are not used in DPLD or CPLD logic  
equations.  
PSD devices have a Turbo Bit in PMMR0. This  
bit can be set to turn the Turbo mode off (the  
default is with Turbo mode turned on). While  
Turbo mode is off, the PLDs can achieve  
standby current when no PLD inputs are  
changing (zero DC current). Even when inputs  
do change, significant power can be saved at  
lower frequencies (AC current), compared to  
when Turbo mode is on. When the Turbo mode  
is on, there is a significant DC current  
The PLD sections can also achieve Stand-by  
mode when its inputs are not changing, as  
described in the sections on the Power  
Management Mode Registers (PMMR).  
As with the Power Management mode, the  
Automatic Power Down (APD) block allows  
the PSD to reduce to stand-by current  
automatically. The APD Unit can also block  
MCU address/data signals from reaching the  
memories and PLDs. This feature is available  
on all the devices of the PSD family. The APD  
Unit is described in more detail in the sections  
entitled Automatic Power-down (APD) Unit  
and Power-down Mode, page 63.  
Built in logic monitors the Address Strobe of the  
MCU for activity. If there is no activity for a  
certain time period (MCU is asleep), the APD  
Unit initiates Power-down mode (if enabled).  
Once in Power-down mode, all address/data  
signals are blocked from reaching PSD memory  
and PLDs, and the memories are deselected  
internally. This allows the memory and PLDs to  
component and the AC component is higher.  
62/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Automatic Power-down (APD) Unit and Power-down Mode  
The APD Unit, shown in Figure 32, puts the PSD  
into Power-down mode by monitoring the activity  
of Address Strobe (ALE/AS, PD0). If the APD Unit  
is enabled, as soon as activity on Address Strobe  
(ALE/AS, PD0) stops, a four bit counter starts  
counting. If Address Strobe (ALE/AS, PD0) re-  
mains inactive for fifteen clock periods of CLKIN  
(PD1), Power-down (PDN) goes High, and the  
PSD enters Power-down mode, as discussed  
next.  
Power-down Mode. By default, if you enable the  
APD Unit, Power-down mode is automatically en-  
abled. The device enters Power-down mode if Ad-  
dress Strobe (ALE/AS, PD0) remains inactive for  
fifteen periods of CLKIN (PD1).  
registers. The blocked signals include MCU  
control signals and the common CLKIN (PD1).  
Note that blocking CLKIN (PD1) from the  
PLDs does not block CLKIN (PD1) from the  
APD Unit.  
All PSD memories enter Standby mode and  
are drawing standby current. However, the  
PLD and I/O ports blocks do not go into  
Standby Mode because you don’t want to  
have to wait for the logic and I/O to “wake-up”  
before their outputs can change. See Table 28  
for Power-down mode effects on PSD ports.  
Typical standby current is of the order of  
microamperes. These standby current values  
assume that there are no transitions on any  
PLD input.  
The following should be kept in mind when the  
PSD is in Power-down mode:  
If Address Strobe (ALE/AS, PD0) starts  
pulsing again, the PSD returns to normal  
Operating mode. The PSD also returns to  
normal Operating mode if either PSD Chip  
Select Input (CSI, PD2) is Low or the Reset  
(RESET) input is High.  
The MCU address/data bus is blocked from all  
memory and PLDs.  
Various signals can be blocked (prior to  
Power-down mode) from entering the PLDs by  
setting the appropriate bits in the PMMR  
Table 28. Power-down Mode’s Effect on Ports  
Port Function  
MCU I/O  
Pin Level  
No Change  
PLD Out  
No Change  
Undefined  
Tri-State  
Address Out  
Data Port  
Peripheral I/O  
Tri-State  
Figure 32. APD Unit  
APD EN  
PMMR0 BIT 1=1  
TRANSITION  
DETECTION  
DISABLE BUS  
INTERFACE  
ALE  
PD  
CLR  
APD  
EEPROM SELECT  
FLASH SELECT  
COUNTER  
RESET  
EDGE  
DETECT  
PD  
CSI  
PLD  
SRAM SELECT  
POWER DOWN  
CLKIN  
(
)
PDN SELECT  
DISABLE  
FLASH/EEPROM/SRAM  
AI02891  
Table 29. PSD Timing and Stand-by Current during Power-down Mode  
Typical Stand-by Current  
PLD Propagation  
Delay  
Memory  
Access Time  
Access Recovery Time  
to Normal Access  
Mode  
5V V  
3V V  
CC  
CC  
1
2
2
t
Power-down  
No Access  
Normal t (Note )  
LVDV  
75µA (Note ) 25µA (Note )  
PD  
Note: 1. Power-down does not affect the operation of the PLD. The PLD operation in this mode is based only on the Turbo Bit.  
2. Typical current consumption assuming no PLD inputs are changing state and the PLD Turbo Bit is ’0.’  
63/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
For Users of the HC11 (or compatible)  
PLD Power Management  
The HC11 turns off its E clock when it sleeps.  
Therefore, if you are using an HC11 (or compati-  
ble) in your design, and you wish to use the Pow-  
er-down mode, you must not connect the E clock  
to CLKIN (PD1). You should instead connect a  
crystal oscillator to CLKIN (PD1). The crystal oscil-  
lator frequency must be less than 15 times the fre-  
quency of AS. The reason for this is that if the  
frequency is greater than 15 times the frequency  
of AS, the PSD keeps going into Power-down  
mode.  
The power and speed of the PLDs are controlled  
by the Turbo Bit (Bit 3) in PMMR0. By setting the  
bit to '1,' the Turbo mode is off and the PLDs con-  
sume the specified stand-by current when the in-  
puts are not switching for an extended time of  
70ns. The propagation delay time is increased by  
10ns after the Turbo Bit is set to '1' (turned off)  
when the inputs change at a composite frequency  
of less than 15 MHz. When the Turbo Bit is reset  
to '0' (turned on), the PLDs run at full power and  
speed. The Turbo Bit affects the PLD’s DC power,  
AC power, and propagation delay.  
Other Power Saving Options  
Blocking MCU control signals with the bits of  
PMMR2 can further reduce PLD AC power con-  
sumption.  
SRAM Standby Mode (Battery Backup). The  
PSD supports a battery backup mode in which the  
contents of the SRAM are retained in the event of  
a power loss. The SRAM has Voltage Stand-by  
The PSD offers other reduced power saving op-  
tions that are independent of the Power-down  
mode. Except for the SRAM Stand-by and PSD  
Chip Select Input (CSI, PD2) features, they are en-  
abled by setting bits in PMMR0 and PMMR2.  
Figure 33. Enable Power-down Flow Chart  
(V , PC2) that can be connected to an external  
STBY  
battery. When V  
becomes lower than V  
RESET  
CC  
STBY  
then the PSD automatically connects to Voltage  
Stand-by (V , PC2) as a power source to the  
STBY  
Enable APD  
Set PMMR0 Bit 1 = 1  
SRAM. The SRAM Standby Current (I  
) is typ-  
STBY  
ically 0.5µA. The SRAM data retention voltage is  
2V minimum. The Battery-on Indicator (VBATON)  
can be routed to PC4. This signal indicates when  
the V has dropped below V  
.
OPTIONAL  
CC  
STBY  
Disable desired inputs to PLD  
by setting PMMR0 bits 4 and 5  
and PMMR2 bits 2 through 6.  
ALE/AS idle  
for 15 CLKIN  
clocks?  
No  
Yes  
PSD in Power  
Down Mode  
AI02892  
64/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 30. Power Management Mode Registers PMMR0 (Note 1)  
Bit 0  
Bit 1  
Bit 2  
Bit 3  
X
0
Not used, and should be set to zero.  
0 = off Automatic Power-down (APD) is disabled.  
1 = on Automatic Power-down (APD) is enabled.  
APD Enable  
X
0
Not used, and should be set to zero.  
0 = on PLD Turbo mode is on  
PLD Turbo  
1 = off PLD Turbo mode is off, saving power.  
CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN  
(PD1) Powers-up the PLD when Turbo Bit is ’0.’  
0 = on  
Bit 4  
Bit 5  
PLD Array clk  
PLD MCell clk  
1 = off CLKIN (PD1) input to PLD AND Array is disconnected, saving power.  
0 = on CLKIN (PD1) input to the PLD macrocells is connected.  
1 = off CLKIN (PD1) input to PLD macrocells is disconnected, saving power.  
Bit 6  
Bit 7  
X
X
0
0
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the registers.  
Table 31. Power Management Mode Registers PMMR2 (Note 1)  
Bit 0  
Bit 1  
X
X
0
0
Not used, and should be set to zero.  
Not used, and should be set to zero.  
0 = on Cntl0 input to the PLD AND Array is connected.  
PLD Array  
CNTL0  
Bit 2  
Bit 3  
Bit 4  
Bit 5  
1 = off Cntl0 input to PLD AND Array is disconnected, saving power.  
0 = on Cntl1 input to the PLD AND Array is connected.  
PLD Array  
CNTL1  
1 = off Cntl1 input to PLD AND Array is disconnected, saving power.  
0 = on Cntl2 input to the PLD AND Array is connected.  
PLD Array  
CNTL2  
1 = off Cntl2 input to PLD AND Array is disconnected, saving power.  
0 = on ALE input to the PLD AND Array is connected.  
PLD Array  
ALE  
1 = off ALE input to PLD AND Array is disconnected, saving power.  
0 = on DBE input to the PLD AND Array is connected.  
PLD Array  
DBE  
Bit 6  
Bit 7  
1 = off DBE input to PLD AND Array is disconnected, saving power.  
X
0
Not used, and should be set to zero.  
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the registers.  
65/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PSD Chip Select Input (CSI, PD2)  
Input Clock  
PD2 of Port D can be configured in PSDsoft Ex-  
press as PSD Chip Select Input (CSI). When Low,  
the signal selects and enables the internal Flash  
memory, EEPROM, SRAM, and I/O blocks for  
READ or WRITE operations involving the PSD. A  
High on PSD Chip Select Input (CSI, PD2) dis-  
ables the Flash memory, EEPROM, and SRAM,  
and reduces the PSD power consumption. How-  
ever, the PLD and I/O signals remain operational  
when PSD Chip Select Input (CSI, PD2) is High.  
The PSD provides the option to turn off CLKIN  
(PD1) to the PLD to save AC power consumption.  
CLKIN (PD1) is an input to the PLD AND Array and  
the Output Macrocells (OMC).  
During Power-down mode, or, if CLKIN (PD1) is  
not being used as part of the PLD logic equation,  
the clock should be disabled to save AC power.  
CLKIN (PD1) is disconnected from the PLD AND  
Array or the Macrocells block by setting Bits 4 or 5  
to a 1 in PMMR0.  
There may be a timing penalty when using PSD  
Chip Select Input (CSI, PD2) depending on the  
speed grade of the PSD that you are using. See  
Input Control Signals  
The PSD provides the option to turn off the input  
control signals (CNTL0, CNTL1, CNTL2, Address  
Strobe (ALE/AS, PD0) and DBE) to the PLD to  
save AC power consumption. These control sig-  
nals are inputs to the PLD AND Array. During  
Power-down mode, or, if any of them are not being  
used as part of the PLD logic equation, these con-  
trol signals should be disabled to save AC power.  
They are disconnected from the PLD AND Array  
by setting Bits 2, 3, 4, 5, and 6 to a 1 in PMMR2.  
the timing parameter t  
in Table 61., page 94  
SLQV  
or Table 62., page 95.  
Table 32. APD Counter Operation  
APD Enable Bit ALE PD Polarity  
ALE Level  
APD Counter  
Not Counting  
0
1
1
1
X
X
1
0
X
Pulsing  
Not Counting  
1
0
Counting (Generates PDN after 15 Clocks)  
Counting (Generates PDN after 15 Clocks)  
66/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
RESET TIMING AND DEVICE STATUS AT RESET  
Power-Up Reset  
Upon Power-up, the PSD requires a Reset (RE-  
The same t  
period is needed before the device  
OPR  
SET) pulse of duration t  
after V  
is  
is operational after warm reset. Figure 34 shows  
the timing of the Power-up and warm reset.  
I/O Pin, Register and PLD Status at Reset  
Table 33., page 68 shows the I/O pin, register and  
PLD status during Power On Reset, warm reset  
and Power-down mode. PLD outputs are always  
valid during warm reset, and they are valid in Pow-  
er On Reset once the internal PSD Configuration  
bits are loaded. This loading of PSD is completed  
NLNH-PO  
CC  
steady. During this period, the device loads inter-  
nal configurations, clears some of the registers  
and sets the Flash memory into Operating mode.  
After the rising edge of Reset (RESET), the PSD  
remains in the Reset mode for an additional peri-  
od, t  
, before the first memory access is al-  
OPR  
lowed.  
The Flash memory is reset to the READ Mode  
upon Power-up. Sector Select (FS0-FS7 and  
CSBOOT0-CSBOOT3) must all be Low, Write  
Strobe (WR, CNTL0) High, during Power On Re-  
set for maximum security of the data contents and  
to remove the possibility of a byte being written on  
the first edge of Write Strobe (WR, CNTL0). Any  
Flash memory WRITE cycle initiation is prevented  
typically long before the V  
ramps up to operat-  
CC  
ing level. Once the PLD is active, the state of the  
outputs are determined by the PSDabel equa-  
tions.  
Reset of Flash Memory Erase and Program  
Cycles (on the PSD834Fx)  
A Reset (RESET) also resets the internal Flash  
memory state machine. During a Flash memory  
Program or Erase cycle, Reset (RESET) termi-  
nates the cycle and returns the Flash memory to  
automatically when V is below V  
.
CC  
LKO  
Warm Reset  
Once the device is up and running, the device can  
be reset with a pulse of a much shorter duration,  
the Read Mode within a period of t  
.
NLNH-A  
t
.
NLNH  
Figure 34. Reset (RESET) Timing  
VCC(min)  
V
CC  
t
NLNH  
t
t
OPR  
t
t
NLNH-PO  
NLNH-A  
OPR  
Power-On Reset  
Warm Reset  
RESET  
AI02866b  
67/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 33. Status During Power-On Reset, Warm Reset and Power-down Mode  
Port Configuration  
MCU I/O  
Power-On Reset  
Input mode  
Warm Reset  
Input mode  
Power-down Mode  
Unchanged  
Valid after internal PSD  
configuration bits are  
loaded  
Depends on inputs to PLD  
(addresses are blocked in  
PD mode)  
PLD Output  
Valid  
Address Out  
Data Port  
Tri-stated  
Tri-stated  
Tri-stated  
Tri-stated  
Tri-stated  
Tri-stated  
Not defined  
Tri-stated  
Tri-stated  
Peripheral I/O  
Register  
Power-On Reset  
Warm Reset  
Power-down Mode  
PMMR0 and PMMR2  
Cleared to '0'  
Unchanged  
Unchanged  
Cleared to '0' by internal  
Power-On Reset  
Depends on .re and .pr  
equations  
Depends on .re and .pr  
equations  
Macrocells flip-flop status  
Initialized, based on the  
selection in PSDsoft  
Configuration menu  
Initialized, based on the  
selection in PSDsoft  
Configuration menu  
1
Unchanged  
Unchanged  
VM Register  
All other registers  
Cleared to '0'  
Cleared to '0'  
Note: 1. The SR_cod and PeriphMode bits in the VM Register are always cleared to '0' on Power-On Reset or Warm Reset.  
68/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE  
The JTAG Serial Interface block can be enabled  
on Port C (see Table 34., page 70). All memory  
blocks (primary and secondary Flash memory),  
PLD logic, and PSD Configuration Register bits  
may be programmed through the JTAG Serial In-  
terface block. A blank device can be mounted on  
a printed circuit board and programmed using  
JTAG.  
The standard JTAG signals (IEEE 1149.1) are  
TMS, TCK, TDI, and TDO. Two additional signals,  
TSTAT and TERR, are optional JTAG extensions  
used to speed up Program and Erase cycles.  
By default, on a blank PSD (as shipped from the  
factory or after erasure), four pins on Port C are  
enabled for the basic JTAG signals TMS, TCK,  
TDI, and TDO.  
See Application Note AN1153 for more details on  
JTAG In-System Programming (ISP).  
This dedicates the pins for JTAG at all  
times (compliant with IEEE 1149.1 */  
Microcontroller_enabled +  
/* The microcontroller can set a bit at  
run-time by writing to the PSD  
register, JTAG Enable. Thisregister is  
located at address CSIOP + offset C7h.  
Setting the JTAG_ENABLE bit in this  
register will enable the pins for JTAG  
use. This bit is cleared by a PSD reset  
or the microcontroller. See Table  
35., page 71 for bit definition. */  
PSD_product_term_enabled;  
/* A dedicated product term (PT) inside  
the PSD can be used to enable the JTAG  
pins. This PT has the reserved name  
JTAGSEL. Once defined as a node in  
PSDabel, the designer can write an  
equation for JTAGSEL. This method is  
used when the Port C JTAG pins are  
multiplexed with other I/O signals. It  
is recommended to logically tie the  
node JTAGSEL to the JEN\ signal on the  
Flashlink cable when multiplexing JTAG  
signals. See Application Note 1153 for  
details. */  
Standard JTAG Signals  
The standard JTAG signals (TMS, TCK, TDI, and  
TDO) can be enabled by any of three different con-  
ditions that are logically ORed. When enabled,  
TDI, TDO, TCK, and TMS are inputs, waiting for a  
JTAG serial command from an external JTAG con-  
troller device (such as FlashLINK or Automated  
Test Equipment). When the enabling command is  
received, TDO becomes an output and the JTAG  
channel is fully functional inside the PSD. The  
same command that enables the JTAG channel  
may optionally enable the two additional JTAG sig-  
nals, TSTAT and TERR.  
The following symbolic logic equation specifies the  
conditions enabling the four basic JTAG signals  
(TMS, TCK, TDI, and TDO) on their respective  
Port C pins. For purposes of discussion, the logic  
label JTAG_ON is used. When JTAG_ON is true,  
the four pins are enabled for JTAG. When  
JTAG_ON is false, the four pins can be used for  
general PSD I/O.  
The state of the PSD Reset (RESET) signal does  
not interrupt (or prevent) JTAG operations if the  
JTAG pins are dedicated by an NVM configuration  
bit (via PSDsoft Express). However, Reset (RE-  
SET) will prevent or interrupt JTAG operations if  
the JTAG enable register is used to enable the  
JTAG pins.  
The PSD supports JTAG In-System-Configuration  
(ISC) commands, but not Boundary Scan. The PS-  
Dsoft Express software tool and FlashLINK JTAG  
programming cable implement the JTAG In-Sys-  
tem-Configuration (ISC) commands. A definition  
of these JTAG In-System-Configuration (ISC)  
commands and sequences is defined in a supple-  
mental document available from ST. This docu-  
ment is needed only as a reference for designers  
who use a FlashLINK to program their PSD.  
JTAG_ON = PSDsoft_enabled +  
/* An NVM configuration bit inside the  
PSD is set by the designer in the  
PSDsoft Express Configuration utility.  
69/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
JTAG Extensions  
Security and Flash memory Protection  
TSTAT and TERR are two JTAG extension signals  
enabled by an “ISC_ENABLE” command received  
over the four standard JTAG signals (TMS, TCK,  
TDI, and TDO). They are used to speed Program  
and Erase cycles by indicating status on PSD sig-  
nals instead of having to scan the status out seri-  
ally using the standard JTAG channel. See  
Application Note AN1153.  
When the security bit is set, the device cannot be  
read on a Device Programmer or through the  
JTAG Port. When using the JTAG Port, only a Full  
Chip Erase command is allowed.  
All other Program, Erase and Verify commands  
are blocked. Full Chip Erase returns the part to a  
non-secured blank state. The Security Bit can be  
set in PSDsoft Express Configuration.  
TERR indicates if an error has occurred when  
erasing a sector or programming a byte in Flash  
memory. This signal goes Low (active) when an  
Error condition occurs, and stays Low until an  
“ISC_CLEAR” command is executed or a chip Re-  
set (RESET) pulse is received after an  
“ISC_DISABLE” command.  
All primary and secondary Flash memory sectors  
can individually be sector protected against era-  
sures. The sector protect bits can be set in PSD-  
soft Express Configuration.  
Table 34. JTAG Port Signals  
Port C Pin  
PC0  
JTAG Signals  
TMS  
Description  
Mode Select  
TSTAT behaves the same as Ready/Busy de-  
scribed in the section entitled Ready/Busy  
(PC3), page 20. TSTAT is High when the PSD de-  
vice is in READ Mode (primary and secondary  
Flash memory contents can be read). TSTAT is  
Low when Flash memory Program or Erase cycles  
are in progress, and also when data is being writ-  
ten to the secondary Flash memory.  
TSTAT and TERR can be configured as open-  
drain type signals during an “ISC_ENABLE” com-  
mand. This facilitates a wired-OR connection of  
TSTAT signals from multiple PSD devices and a  
wired-OR connection of TERR signals from those  
same devices. This is useful when several PSD  
devices are “chained” together in a JTAG environ-  
ment.  
PC1  
PC3  
PC4  
PC5  
PC6  
TCK  
Clock  
TSTAT  
TERR  
TDI  
Status  
Error Flag  
Serial Data In  
Serial Data Out  
TDO  
70/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
INITIAL DELIVERY STATE  
When delivered from ST, the PSD device has all  
bits in the memory and PLDs set to ’1.’ The PSD  
Configuration Register bits are set to ’0.’ The code,  
configuration, and PLD logic are loaded using the  
programming procedure. Information for program-  
ming the device is available directly from ST.  
Please contact your local sales representative.  
Table 35. JTAG Enable Register  
0 = off JTAG port is disabled.  
Bit 0  
JTAG_Enable  
1 = on JTAG port is enabled.  
Bit 1  
Bit 2  
Bit 3  
Bit 4  
Bit 5  
Bit 6  
Bit 7  
X
X
X
X
X
X
X
0
0
0
0
0
0
0
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Not used, and should be set to zero.  
Note: 1. The state of Reset (RESET) does not interrupt (or prevent) JTAG operations if the JTAG signals are dedicated by an NVM Config-  
uration bit (via PSDsoft Express). However, Reset (RESET) prevents or interrupts JTAG operations if the JTAG enable register is  
used to enable the JTAG signals.  
71/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
AC/DC PARAMETERS  
These tables describe the AD and DC parameters  
of the PSD:  
DC Electrical Specification  
AC Timing Specification  
Power-down and Reset Timing  
The following are issues concerning the parame-  
ters presented:  
In the DC specification the supply current is  
given for different modes of operation. Before  
calculating the total power consumption,  
determine the percentage of time that the PSD  
is in each mode. Also, the supply power is  
considerably different if the Turbo Bit is ’0.’  
The AC power component gives the PLD,  
Flash memory, and SRAM mA/MHz  
specification. Figures 35 and 36 show the PLD  
mA/MHz as a function of the number of  
Product Terms (PT) used.  
PLD Timing  
Combinatorial Timing  
Synchronous Clock Mode  
Asynchronous Clock Mode  
Input Macrocell Timing  
MCU Timing  
READ Timing  
WRITE Timing  
Peripheral Mode Timing  
In the PLD timing parameters, add the  
required delay when Turbo Bit is ’0.’  
Figure 35. PLD I /Frequency Consumption (5V range)  
CC  
110  
100  
90  
V
= 5V  
CC  
80  
70  
60  
50  
40  
30  
20  
10  
0
PT 100%  
PT 25%  
0
5
10  
15  
20  
25  
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)  
AI02894  
Figure 36. PLD I /Frequency Consumption (3V range)  
CC  
60  
V
= 3V  
CC  
50  
40  
30  
20  
10  
0
PT 100%  
PT 25%  
0
5
10  
15  
20  
25  
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)  
AI03100  
72/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 36. Example of PSD Typical Power Calculation at V = 5.0V (Turbo Mode On)  
CC  
Conditions  
Highest Composite PLD input frequency  
(Freq PLD)  
MCU ALE frequency (Freq ALE)  
% Flash memory Access  
% SRAM access  
= 8 MHz  
= 4 MHz  
= 80%  
= 15%  
% I/O access  
= 5% (no additional power above base)  
Operational Modes  
% Normal  
= 10%  
= 90%  
% Power-down Mode  
Number of product terms used  
(from fitter report)  
= 45 PT  
% of total product terms  
Turbo Mode  
= 45/182 = 24.7%  
= ON  
Calculation (using typical values)  
I
total  
= Ipwrdown x %pwrdown + %normal x (I (ac) + I  
(dc))  
CC  
CC  
CC  
= Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE  
+ %SRAM x 1.5mA/MHz x Freq ALE  
+ % PLD x 2mA/MHz x Freq PLD  
+ #PT x 400µA/PT)  
= 50µA x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4 MHz  
+ 0.15 x 1.5mA/MHz x 4 MHz  
+ 2mA/MHz x 8 MHz  
+ 45 x 0.4mA/PT)  
= 45µA + 0.1 x (8 + 0.9 + 16 + 18mA)  
= 45µA + 0.1 x 42.9  
= 45µA + 4.29mA  
= 4.34mA  
This is the operating power with no EEPROM WRITE or Flash memory Erase cycles in progress. Calculation is based  
on I = 0mA.  
OUT  
73/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 37. Example of PSD Typical Power Calculation at V = 5.0V (Turbo Mode Off)  
CC  
Conditions  
Highest Composite PLD input frequency  
(Freq PLD)  
MCU ALE frequency (Freq ALE)  
% Flash memory Access  
% SRAM access  
= 8 MHz  
= 4 MHz  
= 80%  
= 15%  
% I/O access  
= 5% (no additional power above base)  
Operational Modes  
% Normal  
= 10%  
= 90%  
% Power-down Mode  
Number of product terms used  
(from fitter report)  
= 45 PT  
% of total product terms  
Turbo Mode  
= 45/182 = 24.7%  
= Off  
Calculation (using typical values)  
I
total  
= Ipwrdown x %pwrdown + %normal x (I (ac) + I  
(dc))  
CC  
CC  
CC  
= Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE  
+ %SRAM x 1.5mA/MHz x Freq ALE  
+ % PLD x (from graph using Freq PLD))  
= 50µA x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4 MHz  
+ 0.15 x 1.5mA/MHz x 4 MHz  
+ 24mA)  
= 45µA + 0.1 x (8 + 0.9 + 24)  
= 45µA + 0.1 x 32.9  
= 45µA + 3.29mA  
= 3.34mA  
This is the operating power with no EEPROM WRITE or Flash memory Erase cycles in progress. Calculation is based  
on I = 0mA.  
OUT  
74/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
MAXIMUM RATING  
Stressing the device above the rating listed in the  
Absolute Maximum Ratings” table may cause per-  
manent damage to the device. These are stress  
ratings only and operation of the device at these or  
any other conditions above those indicated in the  
Operating sections of this specification is not im-  
plied. Exposure to Absolute Maximum Rating con-  
ditions for extended periods may affect device  
reliability. Refer also to the STMicroelectronics  
SURE Program and other relevant quality docu-  
ments.  
Table 38. Absolute Maximum Ratings  
Symbol  
Parameter  
Min.  
Max.  
125  
235  
7.0  
Unit  
°C  
°C  
V
T
Storage Temperature  
Lead Temperature during Soldering (20 seconds max.)  
–65  
STG  
1
T
LEAD  
V
IO  
Input and Output Voltage (Q = V  
Supply Voltage  
or Hi-Z)  
OH  
–0.6  
–0.6  
V
CC  
7.0  
V
V
Device Programmer Supply Voltage  
Electrostatic Discharge Voltage (Human Body model)  
–0.6  
14.0  
2000  
V
PP  
2
V
ESD  
–2000  
V
Note: 1. IPC/JEDEC J-STD-020A  
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 , R2=500 )  
75/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
DC AND AC PARAMETERS  
This section summarizes the operating and mea-  
surement conditions, and the DC and AC charac-  
teristics of the device. The parameters in the DC  
and AC Characteristic tables that follow are de-  
rived from tests performed under the Measure-  
ment Conditions summarized in the relevant  
tables. Designers should check that the operating  
conditions in their circuit match the measurement  
conditions when relying on the quoted parame-  
ters.  
Table 39. Operating Conditions (5V devices)  
Symbol  
Parameter  
Min.  
4.5  
–40  
0
Max.  
5.5  
85  
Unit  
V
V
CC  
Supply Voltage  
Ambient Operating Temperature (industrial)  
Ambient Operating Temperature (commercial)  
°C  
°C  
TA  
70  
Table 40. Operating Conditions (3V devices)  
Symbol  
Parameter  
Min.  
3.0  
–40  
0
Max.  
3.6  
85  
Unit  
V
V
CC  
Supply Voltage  
Ambient Operating Temperature (industrial)  
Ambient Operating Temperature (commercial)  
°C  
°C  
TA  
70  
Table 41. AC Signal Letters for PLD Timing  
Table 42. AC Signal Behavior Symbols for PLD  
Timing  
A
C
D
E
G
I
Address Input  
t
Time  
CEout Output  
L
Logic Level Low or ALE  
Logic Level High  
Valid  
Input Data  
H
V
X
Z
E Input  
Internal WDOG_ON signal  
Interrupt Input  
No Longer a Valid Logic Level  
Float  
L
ALE Input  
PW  
Pulse Width  
N
P
Q
R
S
T
RESET Input or Output  
Port Signal Output  
Output Data  
Note: Example: t  
= Time from Address Valid to ALE Invalid.  
AVLX  
WR, UDS, LDS, DS, IORD, PSEN Inputs  
Chip Select Input  
R/W Input  
W
B
Internal PDN Signal  
V
STBY  
Output  
M
Output Macrocell  
Note: Example: t  
= Time from Address Valid to ALE Invalid.  
AVLX  
Table 43. AC Measurement Conditions  
Symbol  
Parameter  
Min.  
Max.  
Unit  
C
Load Capacitance  
30  
pF  
L
Note: 1. Output Hi-Z is defined as the point where data out is no longer driven.  
76/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 44. Capacitance  
Symbol  
2
Parameter  
Test Condition  
Max.  
Unit  
pF  
Typ.  
C
V
= 0V  
= 0V  
Input Capacitance (for input pins)  
4
6
IN  
IN  
Output Capacitance (for input/  
output pins)  
pF  
C
V
OUT  
8
12  
25  
OUT  
C
Capacitance (for CNTL2/V  
)
PP  
V = 0V  
PP  
pF  
18  
VPP  
Note: 1. Sampled only, not 100% tested.  
2. Typical values are for T = 25°C and nominal supply voltages.  
A
Figure 37. AC Measurement I/O Waveform  
Figure 38. AC Measurement Load Circuit  
2.01 V  
3.0V  
195  
Test Point  
1.5V  
Device  
Under Test  
0V  
CL = 30 pF  
(Including Scope and  
AI03103b  
Jig Capacitance)  
AI03104b  
Figure 39. Switching Waveforms – Key  
INPUTS  
OUTPUTS  
WAVEFORMS  
STEADY INPUT  
STEADY OUTPUT  
MAY CHANGE FROM  
HI TO LO  
WILL BE CHANGING  
FROM HI TO LO  
MAY CHANGE FROM  
LO TO HI  
WILL BE CHANGING  
LO TO HI  
DON'T CARE  
CHANGING, STATE  
UNKNOWN  
OUTPUTS ONLY  
CENTER LINE IS  
TRI-STATE  
AI03102  
77/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 45. DC Characteristics (5V devices)  
Test Condition  
Symbol  
Parameter  
(in addition to those in  
Table 39., page 76)  
Min.  
Typ.  
Max.  
+0.5  
Unit  
V
4.5 V < V < 5.5 V  
V
V
Input High Voltage  
2
V
V
V
IH  
CC  
CC  
V
V
V
V
4.5 V < V < 5.5 V  
Input Low Voltage  
–0.5  
0.8  
+0.5  
IL  
CC  
1
0.8V  
Reset High Level Input Voltage  
IH1  
CC  
CC  
(Note )  
1
0.2V –0.1  
Reset Low Level Input Voltage  
Reset Pin Hysteresis  
–0.5  
0.3  
V
V
IL1  
CC  
(Note )  
HYS  
V
(min) for Flash Erase and  
CC  
V
V
2.5  
4.2  
V
LKO  
OL  
Program  
I
= 20µA, V = 4.5 V  
0.01  
0.25  
4.49  
3.9  
0.1  
V
V
OL  
CC  
Output Low Voltage  
I
= 8mA, V = 4.5 V  
0.45  
OL  
CC  
I
= –20µA, V = 4.5 V  
4.4  
2.4  
V
OH  
CC  
Output High Voltage Except  
V
OH  
V
STBY  
On  
I
= –2mA, V = 4.5 V  
V
OH  
CC  
V
V
I
Output High Voltage V  
On  
I
= 1µA  
V
– 0.8  
STBY  
V
OH1  
STBY  
OH1  
V
SRAM Stand-by Voltage  
SRAM Stand-by Current  
2.0  
V
STBY  
CC  
V
= 0 V  
0.5  
1
µA  
µA  
V
STBY  
IDLE  
CC  
I
Idle Current (V  
input)  
V
> V  
CC STBY  
–0.1  
2
0.1  
STBY  
V
I
Only on V  
STBY  
SRAM Data Retention Voltage  
DF  
Stand-by Supply Current  
for Power-down Mode  
2,3  
50  
200  
µA  
SB  
CSI >V –0.3 V (Notes  
)
CC  
I
I
V
< V < V  
SS IN CC  
Input Leakage Current  
Output Leakage Current  
–1  
±0.1  
±5  
1
µA  
µA  
LI  
0.45 < V  
< V  
CC  
–10  
10  
LO  
OUT  
PLD_TURBO = Off,  
0
µA/PT  
µA/PT  
mA  
5
f = 0 MHz (Note )  
PLD Only  
PLD_TURBO = On,  
f = 0 MHz  
400  
15  
700  
30  
Operating  
Supply  
Current  
I
(DC)  
5
CC  
During Flash memory  
WRITE/Erase Only  
(Note )  
Flash memory  
Read only, f = 0 MHz  
f = 0 MHz  
0
0
0
0
mA  
mA  
SRAM  
4
PLD AC Adder  
note  
mA/  
MHz  
I
(AC)  
5
CC  
Flash memory AC Adder  
SRAM AC Adder  
2.5  
1.5  
3.5  
3.0  
(Note )  
mA/  
MHz  
Note: 1. Reset (RESET) has hysteresis. V is valid at or below 0.2V –0.1. V  
is valid at or above 0.8V  
.
CC  
IL1  
CC  
IH1  
2. CSI deselected or internal Power-down mode is active.  
3. PLD is in non-Turbo mode, and none of the inputs are switching.  
4. Please see Figure 35., page 72 for the PLD current calculation.  
5. I  
= 0mA  
OUT  
78/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 46. DC Characteristics (3V devices)  
Symbol  
Parameter  
Conditions  
Min.  
0.7V  
Typ.  
Max.  
+0.5  
CC  
Unit  
V
V
3.0 V < V < 3.6 V  
V
High Level Input Voltage  
Low Level Input Voltage  
Reset High Level Input Voltage  
IH  
CC  
CC  
V
V
V
V
3.0 V < V < 3.6 V  
–0.5  
0.8V  
0.8  
+0.5  
V
IL  
CC  
1
V
V
IH1  
CC  
CC  
(Note )  
1
0.2V –0.1  
Reset Low Level Input Voltage  
Reset Pin Hysteresis  
–0.5  
0.3  
V
V
IL1  
CC  
(Note )  
HYS  
V
(min) for Flash Erase and  
CC  
V
V
1.5  
2.2  
V
LKO  
OL  
Program  
I
= 20µA, V = 3.0 V  
0.01  
0.15  
2.99  
2.8  
0.1  
V
V
OL  
CC  
Output Low Voltage  
I
= 4mA, V = 3.0 V  
0.45  
OL  
CC  
I
= –20µA, V = 3.0 V  
2.9  
2.7  
V
OH  
CC  
Output High Voltage Except  
V
OH  
V
STBY  
On  
I
= –1mA, V = 3.0 V  
V
OH  
CC  
V
V
I
Output High Voltage V  
On  
I
= 1µA  
V
– 0.8  
STBY  
V
OH1  
STBY  
OH1  
V
SRAM Stand-by Voltage  
SRAM Stand-by Current  
2.0  
V
STBY  
CC  
V
= 0 V  
0.5  
1
µA  
µA  
V
STBY  
IDLE  
CC  
I
Idle Current (V  
input)  
V
> V  
CC STBY  
–0.1  
2
0.1  
STBY  
V
I
Only on V  
STBY  
SRAM Data Retention Voltage  
DF  
Stand-by Supply Current  
for Power-down Mode  
2,3  
25  
100  
µA  
CSI >V –0.3 V (Notes  
)
SB  
CC  
I
I
V
< V < V  
SS IN CC  
Input Leakage Current  
Output Leakage Current  
–1  
±0.1  
±5  
1
µA  
µA  
LI  
0.45 < V < V  
CC  
–10  
10  
LO  
IN  
PLD_TURBO = Off,  
0
µA/PT  
µA/PT  
mA  
3
f = 0 MHz (Note )  
PLD Only  
PLD_TURBO = On,  
f = 0 MHz  
200  
10  
400  
25  
Operating  
Supply  
Current  
I
(DC)  
5
CC  
During Flash memory  
WRITE/Erase Only  
(Note )  
Flash memory  
Read only, f = 0 MHz  
f = 0 MHz  
0
0
0
0
mA  
mA  
SRAM  
4
PLD AC Adder  
note  
1.5  
mA/  
MHz  
I
(AC)  
5
CC  
Flash memory AC Adder  
SRAM AC Adder  
2.0  
1.5  
(Note )  
mA/  
MHz  
0.8  
Note: 1. Reset (RESET) has hysteresis. V is valid at or below 0.2V –0.1. V  
is valid at or above 0.8V  
.
CC  
IL1  
CC  
IH1  
2. CSI deselected or internal PD is active.  
3. PLD is in non-Turbo mode, and none of the inputs are switching.  
4. Please see Figure 36., page 72 for the PLD current calculation.  
5. I  
= 0mA  
OUT  
79/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 40. Input to Output Disable / Enable  
INPUT  
tER  
tEA  
INPUT TO  
OUTPUT  
ENABLE/DISABLE  
AI02863  
Table 47. CPLD Combinatorial Timing (5V devices)  
-70  
-90  
-15  
Fast  
PT  
Aloc  
Slew  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
1
rate  
Min Max Min Max Min Max  
CPLD Input Pin/  
Feedback to CPLD  
Combinatorial Output  
t
20  
25  
32  
+ 2  
+ 10  
– 2  
ns  
PD  
CPLD Input to CPLD  
Output Enable  
t
t
t
t
t
21  
21  
21  
26  
26  
26  
32  
32  
33  
+ 10  
+ 10  
+ 10  
+ 10  
– 2  
– 2  
– 2  
ns  
ns  
ns  
ns  
ns  
EA  
CPLD Input to CPLD  
Output Disable  
ER  
CPLD Register Clear  
or Preset Delay  
ARP  
ARPW  
ARD  
CPLD Register Clear  
or Preset Pulse Width  
10  
20  
29  
Any  
macrocell  
CPLD Array Delay  
11  
16  
22  
+ 2  
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.  
Table 48. CPLD Combinatorial Timing (3V devices)  
-12  
-15  
-20  
Slew  
PT Turbo  
Symbol  
Parameter  
Conditions  
Unit  
1
Aloc  
Off  
rate  
Min Max Min Max Min Max  
CPLD Input Pin/  
t
Feedback to CPLD  
Combinatorial Output  
40  
45  
50  
+ 4  
+ 20  
– 6  
ns  
PD  
CPLD Input to CPLD  
Output Enable  
t
t
43  
43  
45  
45  
50  
50  
+ 20  
+ 20  
– 6  
– 6  
ns  
ns  
EA  
ER  
CPLD Input to CPLD  
Output Disable  
CPLD Register Clear  
or  
Preset Delay  
t
40  
43  
48  
+ 20  
+ 20  
– 6  
ns  
ARP  
CPLD Register Clear  
or  
Preset Pulse Width  
t
t
25  
30  
35  
ns  
ns  
ARPW  
ARD  
Any  
macrocell  
CPLD Array Delay  
25  
29  
33  
+ 4  
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.  
80/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 41. Synchronous Clock Mode Timing – PLD  
t
t
CL  
CH  
CLKIN  
INPUT  
t
S
t
H
t
CO  
REGISTERED  
OUTPUT  
AI02860  
Table 49. CPLD Macrocell Synchronous Clock Mode Timing (5V devices)  
-70  
-90  
-15  
Fast  
PT  
Aloc  
Slew  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
1
rate  
Min Max Min Max Min Max  
Maximum  
Frequency  
External  
1/(t +t  
)
40.0  
30.30  
25.00  
MHz  
S
CO  
Feedback  
Maximum  
Frequency  
Internal  
f
MAX  
1/(t +t –10)  
66.6  
83.3  
43.48  
50.00  
31.25  
35.71  
MHz  
S
CO  
Feedback  
(f  
CNT  
)
Maximum  
Frequency  
Pipelined Data  
1/(t +t  
)
MHz  
ns  
CH CL  
Input Setup  
Time  
t
12  
15  
20  
+ 2  
+ 10  
S
t
t
t
Input Hold Time  
Clock High Time  
Clock Low Time  
0
6
6
0
0
ns  
ns  
ns  
H
Clock Input  
Clock Input  
10  
10  
15  
15  
CH  
CL  
Clock to Output  
Delay  
t
t
t
Clock Input  
13  
11  
18  
16  
22  
22  
– 2  
ns  
ns  
ns  
CO  
CPLD Array  
Delay  
Any macrocell  
+ 2  
ARD  
Minimum Clock  
t +t  
CH CL  
12  
20  
30  
MIN  
2
Period  
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.  
2. CLKIN (PD1) t = t + t  
.
CL  
CLCL  
CH  
81/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 50. CPLD Macrocell Synchronous Clock Mode Timing (3V devices)  
-12  
-15  
-20  
Slew  
PT  
Aloc  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
1
rate  
Min Max Min Max Min Max  
Maximum  
Frequency  
1/(t +t  
)
22.2  
28.5  
40.0  
18.8  
23.2  
33.3  
15.8  
18.8  
31.2  
MHz  
S
CO  
External Feedback  
Maximum  
Frequency  
Internal Feedback  
f
1/(t +t –10)  
S CO  
MHz  
MHz  
MAX  
(f  
CNT  
)
Maximum  
Frequency  
Pipelined Data  
1/(t +t  
)
CH CL  
t
t
t
t
Input Setup Time  
Input Hold Time  
Clock High Time  
Clock Low Time  
20  
0
25  
0
30  
0
+ 4  
+ 20  
ns  
ns  
ns  
ns  
S
H
Clock Input  
Clock Input  
15  
10  
15  
15  
16  
16  
CH  
CL  
Clock to Output  
Delay  
t
t
t
Clock Input  
25  
25  
28  
29  
33  
33  
– 6  
ns  
ns  
ns  
CO  
CPLD Array Delay  
Any macrocell  
+ 4  
ARD  
MIN  
Minimum Clock  
t +t  
CH CL  
25  
29  
32  
2
Period  
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount.  
2. CLKIN (PD1) t = t + t  
.
CL  
CLCL  
CH  
82/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 42. Asynchronous Reset / Preset  
tARPW  
RESET/PRESET  
INPUT  
tARP  
REGISTER  
OUTPUT  
AI02864  
Figure 43. Asynchronous Clock Mode Timing (product term clock)  
tCHA  
tCLA  
CLOCK  
INPUT  
tSA  
tHA  
tCOA  
REGISTERED  
OUTPUT  
AI02859  
83/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 51. CPLD Macrocell Asynchronous Clock Mode Timing (5V devices)  
-70  
-90  
-15  
PT Turbo Slew  
Symbol  
Parameter  
Conditions  
Unit  
Aloc  
Off  
Rate  
Min Max Min Max Min Max  
Maximum  
Frequency  
External  
1/(t +t  
)
38.4  
62.5  
71.4  
26.32  
35.71  
41.67  
21.27  
27.78  
35.71  
MHz  
SA COA  
Feedback  
Maximum  
Frequency  
Internal  
f
1/(t +t  
–10)  
MHz  
MHz  
MAXA  
SA COA  
Feedback  
(f  
CNTA  
)
Maximum  
Frequency  
Pipelined  
Data  
1/(t  
+t  
)
CHA CLA  
Input Setup  
Time  
t
t
t
t
t
t
t
7
8
9
9
8
12  
14  
15  
15  
+ 2  
+ 10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
SA  
Input Hold  
Time  
12  
12  
12  
HA  
Clock Input  
High Time  
+ 10  
+ 10  
+ 10  
CHA  
CLA  
COA  
ARDA  
MINA  
Clock Input  
Low Time  
Clock to  
Output Delay  
21  
11  
30  
16  
37  
22  
– 2  
CPLD Array  
Delay  
Any macrocell  
+ 2  
Minimum  
Clock Period  
1/f  
CNTA  
16  
28  
39  
84/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 52. CPLD Macrocell Asynchronous Clock Mode Timing (3V devices)  
-12  
-15  
-20  
PT Turbo Slew  
Symbol  
Parameter  
Conditions  
Unit  
Aloc  
Off  
Rate  
Min Max Min Max Min Max  
Maximum  
Frequency  
External  
1/(t +t  
)
21.7  
19.2  
16.9  
MHz  
SA COA  
Feedback  
Maximum  
Frequency  
Internal  
f
MAXA  
1/(t +t  
–10)  
27.8  
33.3  
23.8  
27  
20.4  
24.4  
MHz  
SA COA  
Feedback  
(f  
CNTA  
)
Maximum  
Frequency  
Pipelined Data  
1/(t  
+t  
)
MHz  
ns  
CHA CLA  
Input Setup  
Time  
t
10  
12  
13  
+ 4  
+ 20  
SA  
t
t
t
Input Hold Time  
Clock High Time  
Clock Low Time  
12  
17  
13  
15  
22  
15  
17  
25  
16  
ns  
ns  
ns  
HA  
+ 20  
+ 20  
CHA  
CLA  
Clock to Output  
Delay  
t
t
t
36  
25  
40  
29  
46  
33  
+ 20  
– 6  
ns  
ns  
ns  
COA  
ARD  
MINA  
CPLD Array  
Delay  
Any macrocell  
+ 4  
Minimum Clock  
Period  
1/f  
36  
42  
49  
CNTA  
85/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 44. Input Macrocell Timing (product term clock)  
t
t
INL  
INH  
PT CLOCK  
INPUT  
t
t
IH  
IS  
OUTPUT  
t
INO  
AI03101  
Table 53. Input Macrocell Timing (5V devices)  
-70  
-90  
-15  
PT  
Aloc  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
1
t
Input Setup Time  
Input Hold Time  
0
15  
9
0
0
ns  
ns  
ns  
ns  
IS  
(Note )  
1
t
t
t
20  
12  
12  
26  
18  
18  
+ 10  
IH  
(Note )  
1
NIB Input High Time  
NIB Input Low Time  
INH  
INL  
(Note )  
1
9
(Note )  
NIB Input to Combinatorial  
Delay  
1
t
34  
46  
59  
+ 2  
+ 10  
ns  
INO  
(Note )  
Note: 1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to t  
and t  
.
LXAX  
AVLX  
Table 54. Input Macrocell Timing (3V devices)  
-12  
-15  
-20  
PT  
Aloc  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
1
t
Input Setup Time  
Input Hold Time  
0
0
0
ns  
ns  
ns  
ns  
IS  
(Note )  
1
t
t
t
25  
12  
12  
25  
13  
13  
30  
15  
15  
+ 20  
IH  
(Note )  
1
NIB Input High Time  
NIB Input Low Time  
INH  
INL  
(Note )  
1
(Note )  
NIB Input to Combinatorial  
Delay  
1
t
46  
62  
70  
+ 4  
+ 20  
ns  
INO  
(Note )  
Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to t  
and t  
.
LXAX  
AVLX  
86/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 45. READ Timing  
1
t
t
LXAX  
AVLX  
ALE/AS  
t
LVLX  
A/D  
MULTIPLEXED  
BUS  
ADDRESS  
VALID  
DATA  
VALID  
t
AVQV  
ADDRESS  
NON-MULTIPLEXED  
BUS  
ADDRESS  
VALID  
DATA  
NON-MULTIPLEXED  
BUS  
DATA  
VALID  
t
SLQV  
CSI  
t
t
RLQV  
t
RHQX  
RLRH  
RD  
(PSEN, DS)  
tRHQZ  
t
EHEL  
E
t
THEH  
t
ELTL  
R/W  
t
AVPV  
ADDRESS OUT  
AI02895  
Note: 1. t  
and t  
are not required for 80C251 in Page Mode or 80C51XA in Burst Mode.  
LXAX  
AVLX  
87/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 55. READ Timing (5V devices)  
-70  
-90  
-15  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
t
ALE or AS Pulse Width  
Address Setup Time  
15  
4
20  
6
28  
10  
11  
ns  
ns  
ns  
ns  
ns  
ns  
LVLX  
AVLX  
LXAX  
AVQV  
SLQV  
3
t
t
t
t
(Note )  
3
Address Hold Time  
7
8
(Note )  
3
Address Valid to Data Valid  
CS Valid to Data Valid  
RD to Data Valid 8-Bit Bus  
70  
75  
24  
90  
100  
32  
150 + 10  
(Note )  
150  
40  
5
(Note )  
t
RLQV  
RD or PSEN to Data Valid  
8-Bit Bus, 8031, 80251  
2
31  
38  
45  
30  
ns  
(Note )  
1
t
t
RD Data Hold Time  
RD Pulse Width  
0
0
0
ns  
ns  
RHQX  
RLRH  
(Note )  
1
27  
32  
38  
(Note )  
1
t
t
t
t
RD to Data High-Z  
20  
25  
ns  
ns  
ns  
ns  
RHQZ  
EHEL  
THEH  
ELTL  
(Note )  
E Pulse Width  
27  
6
32  
10  
0
38  
18  
0
R/W Setup Time to Enable  
R/W Hold Time After Enable  
0
Address Input Valid to  
Address Output Delay  
4
t
20  
25  
30  
ns  
AVPV  
(Note )  
Note: 1. RD timing has the same timing as DS, LDS, UDS, and PSEN signals.  
2. RD and PSEN have the same timing.  
3. Any input used to select an internal PSD function.  
4. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port.  
5. RD timing has the same timing as DS, LDS, and UDS signals.  
88/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 56. READ Timing (3V devices)  
-12  
-15  
-20  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
t
ALE or AS Pulse Width  
Address Setup Time  
26  
9
26  
10  
12  
30  
12  
14  
ns  
ns  
ns  
ns  
ns  
ns  
LVLX  
AVLX  
LXAX  
AVQV  
SLQV  
3
t
t
t
t
(Note )  
3
Address Hold Time  
9
(Note )  
3
Address Valid to Data Valid  
CS Valid to Data Valid  
RD to Data Valid 8-Bit Bus  
120  
120  
35  
150  
150  
35  
200 + 20  
(Note )  
200  
40  
5
(Note )  
t
RLQV  
RD or PSEN to Data Valid 8-Bit Bus,  
8031, 80251  
2
45  
50  
55  
ns  
(Note )  
1
t
t
t
t
t
t
RD Data Hold Time  
RD Pulse Width  
0
0
0
ns  
ns  
ns  
ns  
ns  
ns  
RHQX  
RLRH  
RHQZ  
EHEL  
THEH  
ELTL  
(Note )  
38  
40  
45  
1
RD to Data High-Z  
38  
40  
45  
(Note )  
E Pulse Width  
40  
15  
0
45  
18  
0
52  
20  
0
R/W Setup Time to Enable  
R/W Hold Time After Enable  
Address Input Valid to  
Address Output Delay  
4
t
33  
35  
40  
ns  
AVPV  
(Note )  
Note: 1. RD timing has the same timing as DS, LDS, UDS, and PSEN signals.  
2. RD and PSEN have the same timing for 8031.  
3. Any input used to select an internal PSD function.  
4. In multiplexed mode latched address generated from ADIO delay to address output on any Port.  
5. RD timing has the same timing as DS, LDS, and UDS signals.  
89/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 46. WRITE Timing  
t
t
LXAX  
AVLX  
ALE/AS  
t
LVLX  
A/D  
MULTIPLEXED  
BUS  
ADDRESS  
VALID  
DATA  
VALID  
t
AVWL  
ADDRESS  
NON-MULTIPLEXED  
BUS  
ADDRESS  
VALID  
DATA  
NON-MULTIPLEXED  
BUS  
DATA  
VALID  
t
SLWL  
CSI  
t
t
DVWH  
WHDX  
t
WR  
WLWH  
t
WHAX  
(DS)  
t
EHEL  
E
t
t
THEH  
ELTL  
R/ W  
t
WLMV  
t
t
AVPV  
WHPV  
STANDARD  
MCU I/O OUT  
ADDRESS OUT  
AI02896  
90/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 57. WRITE Timing (5V devices)  
-70  
-90  
-15  
Symbol  
Parameter  
ALE or AS Pulse Width  
Conditions  
Unit  
Min Max Min Max Min Max  
t
15  
4
20  
6
28  
10  
11  
ns  
ns  
ns  
LVLX  
AVLX  
LXAX  
1
t
t
Address Setup Time  
Address Hold Time  
(Note )  
1
7
8
(Note )  
Address Valid to Leading  
Edge of WR  
1,3  
t
8
15  
20  
ns  
AVWL  
(Notes  
)
3
t
t
t
t
t
CS Valid to Leading Edge of WR  
WR Data Setup Time  
12  
25  
4
15  
35  
5
20  
45  
5
ns  
ns  
ns  
ns  
ns  
SLWL  
(Note )  
3
DVWH  
WHDX  
WLWH  
WHAX1  
(Note )  
3
WR Data Hold Time  
(Note )  
3
WR Pulse Width  
31  
6
35  
8
45  
10  
(Note )  
3
Trailing Edge of WR to Address Invalid  
(Note )  
Trailing Edge of WR to DPLD Address  
Invalid  
3,6  
t
t
0
0
0
ns  
ns  
WHAX2  
WHPV  
(Note  
)
Trailing Edge of WR to Port Output  
Valid Using I/O Port Data Register  
3
27  
42  
30  
55  
38  
65  
(Note )  
Data Valid to Port Output Valid  
Using Macrocell Register  
Preset/Clear  
3,5  
t
ns  
DVMV  
(Notes  
)
Address Input Valid to Address  
Output Delay  
2
t
t
20  
48  
25  
55  
30  
65  
ns  
ns  
AVPV  
(Note )  
WR Valid to Port Output Valid Using  
Macrocell Register Preset/Clear  
3,4  
WLMV  
(Notes  
)
Note: 1. Any input used to select an internal PSD function.  
2. In multiplexed mode, latched address generated from ADIO delay to address output on any port.  
3. WR has the same timing as E, LDS, UDS, WRL, and WRH signals.  
4. Assuming data is stable before active WRITE signal.  
5. Assuming WRITE is active before data becomes valid.  
6. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory.  
91/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 58. WRITE Timing (3V devices)  
-12  
-15  
-20  
Symbol  
Parameter  
ALE or AS Pulse Width  
Conditions  
Unit  
Min Max Min Max Min Max  
t
26  
9
26  
10  
12  
30  
12  
14  
LVLX  
AVLX  
LXAX  
1
t
t
Address Setup Time  
Address Hold Time  
ns  
ns  
(Note )  
1
9
(Note )  
Address Valid to Leading  
Edge of WR  
1,3  
t
17  
20  
25  
ns  
AVWL  
(Notes  
)
3
t
t
t
t
t
CS Valid to Leading Edge of WR  
WR Data Setup Time  
17  
45  
7
20  
45  
8
25  
50  
10  
53  
17  
ns  
ns  
ns  
ns  
ns  
SLWL  
(Note )  
3
DVWH  
WHDX  
WLWH  
WHAX1  
(Note )  
3
WR Data Hold Time  
(Note )  
3
WR Pulse Width  
46  
10  
48  
12  
(Note )  
3
Trailing Edge of WR to Address Invalid  
(Note )  
Trailing Edge of WR to DPLD Address  
Invalid  
3,6  
t
t
t
t
t
0
0
0
ns  
ns  
ns  
ns  
ns  
WHAX2  
WHPV  
DVMV  
AVPV  
(Note  
)
Trailing Edge of WR to Port Output  
Valid Using I/O Port Data Register  
3
33  
70  
33  
70  
35  
70  
35  
70  
40  
80  
40  
80  
(Note )  
Data Valid to Port Output Valid  
Using Macrocell Register Preset/Clear  
3,5  
(Notes  
)
Address Input Valid to Address  
Output Delay  
2
(Note )  
WR Valid to Port Output Valid Using  
Macrocell Register Preset/Clear  
3,4  
WLMV  
(Notes  
)
Note: 1. Any input used to select an internal PSD function.  
2. In multiplexed mode, latched address generated from ADIO delay to address output on any port.  
3. WR has the same timing as E, LDS, UDS, WRL, and WRH signals.  
4. Assuming data is stable before active WRITE signal.  
5. Assuming WRITE is active before data becomes valid.  
6. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory.  
Table 59. Program, WRITE and Erase Times (5V devices)  
Symbol  
Parameter  
Min.  
Typ.  
8.5  
3
Max.  
30  
Unit  
Flash Program  
s
1
s
Flash Bulk Erase (pre-programmed)  
Flash Bulk Erase (not pre-programmed)  
Sector Erase (pre-programmed)  
Sector Erase (not pre-programmed)  
Byte Program  
5
s
s
t
t
t
1
30  
WHQV3  
WHQV2  
WHQV1  
2.2  
14  
s
1200  
µs  
Program / Erase Cycles (per Sector)  
Sector Erase Time-Out  
100,000  
cycles  
µs  
t
t
100  
WHWLO  
Q7VQV  
2
30  
ns  
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)  
Note: 1. Programmed to all zero before erase.  
2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.  
92/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 60. Program, WRITE and Erase Times (3V devices)  
Symbol  
Parameter  
Min.  
Typ.  
8.5  
3
Max.  
30  
Unit  
Flash Program  
s
1
s
Flash Bulk Erase (pre-programmed)  
Flash Bulk Erase (not pre-programmed)  
Sector Erase (pre-programmed)  
Sector Erase (not pre-programmed)  
Byte Program  
5
s
s
t
t
t
1
30  
WHQV3  
WHQV2  
WHQV1  
2.2  
14  
s
1200  
µs  
Program / Erase Cycles (per Sector)  
Sector Erase Time-Out  
100,000  
cycles  
µs  
t
t
100  
WHWLO  
Q7VQV  
2
30  
ns  
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)  
Note: 1. Programmed to all zero before erase.  
2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.  
93/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 47. Peripheral I/O READ Timing  
ALE/AS  
ADDRESS  
DATA VALID  
A/D BUS  
t
(PA)  
(PA)  
AVQV  
t
SLQV  
CSI  
RD  
t
t
(PA)  
(PA)  
RLQV  
t
t
(PA)  
(PA)  
QXRH  
RHQZ  
RLRH  
t
(PA)  
DVQV  
DATA ON PORT A  
AI02897  
Table 61. Port A Peripheral Data Mode READ Timing (5V devices)  
-70  
-90  
-15  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
Address Valid to Data  
Valid  
3
t
t
37  
39  
45  
+ 10  
+ 10  
ns  
AVQV–PA  
SLQV–PA  
(Note )  
CSI Valid to Data Valid  
RD to Data Valid  
27  
21  
32  
22  
35  
32  
38  
30  
45  
40  
45  
38  
ns  
ns  
ns  
ns  
ns  
ns  
1,4  
(Notes  
)
t
RLQV–PA  
RD to Data Valid 8031 Mode  
Data In to Data Out Valid  
RD Data Hold Time  
RD Pulse Width  
t
t
t
DVQV–PA  
QXRH–PA  
RLRH–PA  
0
0
0
1
27  
32  
38  
(Note )  
1
t
RD to Data High-Z  
23  
25  
30  
ns  
RHQZ–PA  
(Note )  
94/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 62. Port A Peripheral Data Mode READ Timing (3V devices)  
-12  
-15  
-20  
Turbo  
Off  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
3
t
t
Address Valid to Data Valid  
50  
50  
50  
+ 20  
+ 20  
ns  
AVQV–PA  
SLQV–PA  
(Note )  
CSI Valid to Data Valid  
RD to Data Valid  
37  
37  
45  
38  
45  
40  
45  
40  
50  
45  
50  
45  
ns  
ns  
ns  
ns  
ns  
ns  
1,4  
(Notes  
)
t
RLQV–PA  
RD to Data Valid 8031 Mode  
Data In to Data Out Valid  
RD Data Hold Time  
RD Pulse Width  
t
t
t
DVQV–PA  
QXRH–PA  
RLRH–PA  
0
0
0
1
36  
36  
46  
(Note )  
1
t
RD to Data High-Z  
36  
40  
45  
ns  
RHQZ–PA  
(Note )  
Figure 48. Peripheral I/O WRITE Timing  
ALE/AS  
ADDRESS  
DATA OUT  
A/D BUS  
tWHQZ (PA)  
tWLQV (PA)  
WR  
tDVQV (PA)  
PORT A  
DATA OUT  
AI02898  
Table 63. Port A Peripheral Data Mode WRITE Timing (5V devices)  
-70  
-90  
-15  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
2
t
t
t
WR to Data Propagation Delay  
Data to Port A Data Propagation Delay  
WR Invalid to Port A Tri-state  
25  
22  
20  
35  
30  
25  
40  
38  
33  
ns  
ns  
ns  
WLQV–PA  
DVQV–PA  
WHQZ–PA  
(Note )  
5
(Note )  
2
(Note )  
Note: 1. RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode).  
2. WR has the same timing as the E, LDS, UDS, WRL, and WRH signals.  
3. Any input used to select Port A Data Peripheral mode.  
4. Data is already stable on Port A.  
5. Data stable on ADIO pins to data on Port A.  
95/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 64. Port A Peripheral Data Mode WRITE Timing (3V devices)  
-12  
-15  
-20  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
2
t
t
t
WR to Data Propagation Delay  
Data to Port A Data Propagation Delay  
WR Invalid to Port A Tri-state  
42  
38  
33  
45  
40  
33  
55  
45  
35  
ns  
ns  
ns  
WLQV–PA  
DVQV–PA  
WHQZ–PA  
(Note )  
5
(Note )  
2
(Note )  
Note: 1. RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode).  
2. WR has the same timing as the E, LDS, UDS, WRL, and WRH signals.  
3. Any input used to select Port A Data Peripheral mode.  
4. Data is already stable on Port A.  
5. Data stable on ADIO pins to data on Port A.  
Figure 49. Reset (RESET) Timing  
VCC(min)  
V
CC  
t
NLNH  
t
t
OPR  
t
t
NLNH-PO  
Power-On Reset  
NLNH-A  
OPR  
Warm Reset  
RESET  
AI02866b  
Table 65. Reset (RESET) Timing (5V devices)  
Symbol  
Parameter  
Conditions  
Min  
150  
1
Max  
Unit  
1
t
t
t
t
ns  
ms  
µs  
ns  
NLNH  
RESET Active Low Time  
Power On Reset Active Low Time  
NLNH–PO  
NLNH–A  
OPR  
2
25  
Warm Reset (on the PSD834Fx)  
RESET High to Operational Device  
120  
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.  
2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in READ Mode.  
Table 66. Reset (RESET) Timing (3V devices)  
Symbol  
Parameter  
Conditions  
Min  
300  
1
Max  
Unit  
ns  
1
t
t
t
t
NLNH  
RESET Active Low Time  
Power On Reset Active Low Time  
ms  
µs  
NLNH–PO  
NLNH–A  
OPR  
2
25  
Warm Reset (on the PSD834Fx)  
RESET High to Operational Device  
300  
ns  
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.  
2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in READ Mode.  
96/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 67. V  
Symbol  
Timing (5V devices)  
STBYON  
Parameter  
Detection to V Output High  
STBYON  
Conditions  
Min  
Typ  
Max  
Unit  
1
t
V
STBY  
20  
µs  
BVBH  
(Note )  
V
Low  
Off Detection to V  
Output  
STBYON  
STBY  
1
t
20  
µs  
BXBL  
(Note )  
Note: 1. V  
timing is measured at V ramp rate of 2 ms.  
CC  
STBYON  
Table 68. V  
Symbol  
Timing (3V devices)  
Parameter  
STBYON  
Conditions  
Min  
Typ  
Max  
Unit  
1
t
V
STBY  
Detection to V  
Output High  
STBYON  
20  
µs  
BVBH  
(Note )  
V
Low  
Off Detection to V  
Output  
STBYON  
STBY  
1
t
20  
µs  
BXBL  
(Note )  
Note: 1. V  
timing is measured at V ramp rate of 2 ms.  
CC  
STBYON  
97/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 50. ISC Timing  
tISCCH  
TCK  
tISCCL  
tISCPSU  
tISCPH  
TDI/TMS  
t ISCPZV  
tISCPCO  
ISC OUTPUTS/TDO  
tISCPVZ  
ISC OUTPUTS/TDO  
AI02865  
Table 69. ISC Timing (5V devices)  
-70  
-90  
-15  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
Clock (TCK, PC1) Frequency (except for  
PLD)  
1
t
20  
18  
14 MHz  
ISCCF  
ISCCH  
ISCCL  
(Note )  
Clock (TCK, PC1) High Time (except for  
PLD)  
1
t
t
23  
23  
26  
26  
31  
31  
ns  
ns  
(Note )  
Clock (TCK, PC1) Low Time (except for  
PLD)  
1
(Note )  
2
t
t
Clock (TCK, PC1) Frequency (PLD only)  
Clock (TCK, PC1) High Time (PLD only)  
2
2
2
MHz  
ns  
ISCCFP  
ISCCHP  
(Note )  
2
240  
240  
240  
(Note )  
2
t
t
t
t
t
Clock (TCK, PC1) Low Time (PLD only)  
ISC Port Set Up Time  
240  
7
240  
8
240  
10  
5
ns  
ns  
ns  
ns  
ns  
ISCCLP  
ISCPSU  
ISCPH  
(Note )  
ISC Port Hold Up Time  
5
5
ISC Port Clock to Output  
21  
21  
23  
23  
25  
25  
ISCPCO  
ISCPZV  
ISC Port High-Impedance to Valid Output  
ISC Port Valid Output to  
High-Impedance  
t
21  
23  
25  
ns  
ISCPVZ  
Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode.  
2. For Program or Erase PLD only.  
98/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 70. ISC Timing (3V devices)  
-12  
-15  
-20  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
Clock (TCK, PC1) Frequency (except for  
PLD)  
1
t
12  
10  
9
2
MHz  
ns  
ISCCF  
ISCCH  
ISCCL  
(Note )  
Clock (TCK, PC1) High Time (except for  
PLD)  
1
t
t
40  
40  
45  
45  
51  
51  
(Note )  
Clock (TCK, PC1) Low Time (except for  
PLD)  
1
ns  
(Note )  
2
t
t
Clock (TCK, PC1) Frequency (PLD only)  
Clock (TCK, PC1) High Time (PLD only)  
2
2
MHz  
ns  
ISCCFP  
ISCCHP  
(Note )  
2
240  
240  
240  
(Note )  
2
t
t
t
t
t
Clock (TCK, PC1) Low Time (PLD only)  
ISC Port Set Up Time  
240  
12  
5
240  
13  
5
240  
15  
5
ns  
ns  
ns  
ns  
ns  
ISCCLP  
ISCPSU  
ISCPH  
(Note )  
ISC Port Hold Up Time  
ISC Port Clock to Output  
30  
30  
36  
36  
40  
40  
ISCPCO  
ISCPZV  
ISC Port High-Impedance to Valid Output  
ISC Port Valid Output to  
High-Impedance  
t
30  
36  
40  
ns  
ISCPVZ  
Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode.  
2. For Program or Erase PLD only.  
Table 71. Power-down Timing (5V devices)  
-70  
-90  
-15  
Symbol  
Parameter  
Conditions  
Unit  
Min Max Min Max Min Max  
t
ALE Access Time from Power-down  
80  
90  
150  
ns  
LVDV  
Maximum Delay from  
APD Enable to Internal PDN Valid  
Signal  
Using CLKIN  
(PD1)  
1
t
µs  
15 * t  
CLWH  
CLCL  
Note: 1. t  
is the period of CLKIN (PD1).  
CLCL  
Table 72. Power-down Timing (3V devices)  
-12  
Min Max Min Max Min Max  
145 150 200  
-15  
-20  
Symbol  
Parameter  
Conditions  
Unit  
t
ALE Access Time from Power-down  
ns  
µs  
LVDV  
Maximum Delay from APD Enable to  
Internal PDN Valid Signal  
Using CLKIN  
(PD1)  
1
t
15 * t  
CLWH  
CLCL  
Note: 1. t  
is the period of CLKIN (PD1).  
CLCL  
99/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PACKAGE MECHANICAL  
Figure 51. PQFP52 - 52-pin Plastic, Quad, Flat Package Mechanical Drawing  
D
D1  
D2  
A2  
e
b
Ne  
E2 E1 E  
N
1
Nd  
A
CP  
L1  
c
A1  
α
L
QFP-A  
Note: Drawing is not to scale.  
100/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 73. PQFP52 - 52-pin Plastic, Quad, Flat Package Mechanical Dimensions  
mm  
inches  
Symb.  
Typ.  
Min.  
Max.  
2.35  
0.25  
2.10  
0.38  
0.23  
13.25  
10.05  
Typ.  
Min.  
Max.  
0.093  
0.010  
0.083  
0.015  
0.009  
0.522  
0.396  
A
A1  
A2  
b
2.00  
1.80  
0.22  
0.11  
13.15  
9.95  
0.079  
0.077  
0.009  
0.004  
0.518  
0.392  
c
D
13.20  
10.00  
7.80  
0.520  
0.394  
0.307  
0.520  
0.394  
0.307  
0.026  
0.035  
0.063  
D1  
D2  
E
13.20  
10.00  
7.80  
13.15  
9.95  
13.25  
10.05  
0.518  
0.392  
0.522  
0.396  
E1  
E2  
e
0.65  
L
0.88  
0.73  
1.03  
0.029  
0.041  
7°  
L1  
α
1.60  
0°  
7°  
0°  
52  
13  
13  
N
52  
Nd  
Ne  
CP  
13  
13  
0.10  
0.004  
101/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 52. PLCC52 - 52-lead Plastic Lead, Chip Carrier Package Mechanical Drawing  
D
A1  
D1  
A2  
M1  
M
1 N  
b1  
e
E1 E  
D2/E2 D3/E3  
b
L1  
L
C
A
CP  
PLCC-B  
Note: Drawing is not to scale.  
Table 74. PLCC52 - 52-lead Plastic Lead, Chip Carrier Package Mechanical Dimensions  
mm  
Min.  
4.19  
2.54  
inches  
Min.  
0.165  
0.100  
Symbol  
Typ.  
Max.  
4.57  
2.79  
0.91  
0.53  
0.81  
0.261  
20.19  
19.15  
18.54  
20.19  
19.15  
18.54  
Typ.  
Max.  
0.180  
0.110  
0.036  
0.021  
0.032  
A
A1  
A2  
B
0.33  
0.66  
0.246  
19.94  
19.05  
17.53  
19.94  
19.05  
17.53  
0.013  
0.026  
0.0097  
0.785  
0.750  
0.690  
0.785  
0.750  
0.690  
B1  
C
0.0103  
0.795  
0.754  
0.730  
0.795  
0.754  
0.730  
D
D1  
D2  
E
E1  
E2  
e
1.27  
0.89  
0.050  
0.035  
R
N
52  
52  
Nd  
Ne  
13  
13  
13  
13  
102/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Figure 53. TQFP64 - 64-lead Thin Quad Flatpack, Package Outline  
D
D1  
D2  
A2  
e
b
Ne  
E2 E1 E  
N
1
Nd  
A
CP  
L1  
c
A1  
α
L
QFP-A  
Note: Drawing is not to scale.  
103/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Table 75. TQFP64 - 64-lead Thin Quad Flatpack, Package Mechanical Data  
mm  
inches  
Min.  
Symb.  
Typ.  
Min.  
1.42  
0.07  
1.36  
0.0°  
0.33  
Max.  
1.54  
Typ.  
Max.  
0.061  
0.005  
0.057  
7.0°  
A
A1  
A2  
α
0.056  
0.003  
0.054  
0.0°  
0.10  
1.40  
3.5°  
0.35  
0.14  
0.004  
0.055  
3.5°  
1.44  
7.0°  
b
0.38  
0.014  
0.013  
0.015  
0.006  
0.634  
0.552  
0.474  
0.634  
0.552  
0.474  
0.033  
0.030  
0.042  
c
0.17  
D
16.00  
14.00  
12.00  
16.00  
14.00  
12.00  
0.80  
15.90  
13.98  
11.95  
15.90  
13.98  
11.95  
0.75  
16.10  
14.03  
12.05  
16.10  
14.03  
12.05  
0.85  
0.630  
0.551  
0.472  
0.630  
0.551  
0.472  
0.031  
0.024  
0.039  
0.004  
0.626  
0.550  
0.470  
0.626  
0.550  
0.470  
0.030  
0.018  
0.037  
D1  
D2  
E
E1  
E2  
e
L
0.60  
0.45  
0.75  
L1  
CP  
N
1.00  
0.94  
1.06  
0.10  
64  
16  
16  
64  
16  
16  
Nd  
Ne  
104/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
PART NUMBERING  
Table 76. Ordering Information Scheme  
Example:  
PSD8  
1
3
F
2
V
15  
J
1
T
Device Type  
PSD8 = 8-bit PSD with Register Logic  
PSD9 = 8-bit PSD with Combinatorial Logic  
SRAM Capacity  
1 = 16 Kbit  
3 = 64 Kbit  
5 = 256 Kbit  
Flash Memory Capacity  
3 = 1 Mbit (128K x 8)  
4 = 2 Mbit (256K x 8)  
2nd Flash Memory  
2 = 256 Kbit Flash memory + SRAM  
3 = SRAM but no Flash memory  
4 = 256 Kbit Flash memory but no SRAM  
5 = no Flash memory + no SRAM  
Operating Voltage  
blank = V = 4.5 to 5.5V  
CC  
V = V = 3.0 to 3.6V  
CC  
Speed  
70 = 70ns  
90 = 90ns  
12 = 120ns  
15 = 150ns  
20 = 200ns  
Package  
J = PLCC52  
M = PQFP52  
U = TQFP64  
Temperature Range  
blank = 0 to 70°C (commercial)  
I = –40 to 85°C (industrial)  
Option  
T = Tape & Reel Packing  
For a list of available options (e.g., speed, package) or for further information on any aspect of this device,  
please contact your nearest ST Sales Office.  
105/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
APPENDIX A. PQFP52 PIN ASSIGNMENTS  
Table 77. PQFP52 Connections (Figure 2)  
Pin Number  
Pin Assignments  
Pin Number  
Pin Assignments  
1
PD2  
PD1  
PD0  
PC7  
PC6  
PC5  
PC4  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
AD4  
AD5  
AD6  
AD7  
2
3
4
5
V
CC  
6
AD8  
AD9  
7
V
CC  
8
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
CNTL0  
RESET  
CNTL2  
CNTL1  
PB7  
9
GND  
PC3  
PC2  
PC1  
PC0  
PA7  
PA6  
PA5  
PA4  
PA3  
GND  
PA2  
PA1  
PA0  
AD0  
AD1  
AD2  
AD3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
PB6  
GND  
PB5  
PB4  
PB3  
PB2  
PB1  
PB0  
106/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
APPENDIX B. PLCC52 PIN ASSIGNMENTS  
Table 78. PLCC52 Connections (Figure 3)  
Pin Number  
Pin Assignments  
Pin Number  
Pin Assignments  
1
GND  
PB5  
PB4  
PB3  
PB2  
PB1  
PB0  
PD2  
PD1  
PD0  
PC7  
PC6  
PC5  
PC4  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
PA2  
PA1  
PA0  
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
V
CC  
AD8  
AD9  
V
CC  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
CNTL0  
RESET  
CNTL2  
CNTL1  
PB7  
GND  
PC3  
PC2 (V  
)
STBY  
PC1  
PC0  
PA7  
PA6  
PA5  
PA4  
PA3  
GND  
PB6  
107/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
APPENDIX C. TQFP64 PIN ASSIGNMENTS  
Table 79. TQFP64 Connections (Figure 4)  
Pin Number  
Pin Assignments  
Pin Number  
33  
Pin Assignments  
1
PD2  
PD1  
PD0  
PC7  
PC6  
PC5  
AD3  
AD4  
AD5  
AD6  
AD7  
2
34  
3
35  
4
36  
5
37  
6
V
CC  
38  
V
CC  
7
V
CC  
39  
V
8
40  
AD8  
AD9  
CC  
V
CC  
41  
9
42  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
CNTL0  
NC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
GND  
GND  
PC3  
PC2  
PC1  
PC0  
NC  
43  
44  
45  
46  
47  
48  
NC  
49  
NC  
50  
RESET  
CNTL2  
CNTL1  
PB7  
PA7  
PA6  
PA5  
PA4  
PA3  
GND  
GND  
PA2  
PA1  
PA0  
AD0  
AD1  
N/D  
AD2  
51  
52  
53  
54  
PB6  
55  
GND  
GND  
PB5  
56  
57  
58  
PB4  
59  
PB3  
60  
PB2  
61  
PB1  
62  
PB0  
63  
NC  
64  
NC  
108/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
REVISION HISTORY  
Table 80. Document Revision History  
Date  
Rev.  
Description of Revision  
15-Oct-99  
27-Oct-00  
30-Nov-00  
23-Oct-01  
07-Apr-03  
12-Jun-03  
02-Oct-03  
17-Nov-03  
1.0 Initial release as a WSI document  
1.1 Port A Peripheral Data Mode Read Timing, changed to 50  
1.2 PSD85xF2 added  
2.0 Document rewritten using the ST template  
3.0 v2.2 Template applied; voltage correction (Table 76)  
3.1 Fix errors in PQFQ52 Connections (Table 77)  
3.2 Correct Instructions (Table 9); update disclaimer, Title for EDOCS application  
3.3 Correct package references (Figure 1)  
Reformatted (adjust RPN list); added Table 8; added ‘U’ package (64-pin) (Figure 1, 4, 53;  
Table 75, 76, 79); 5V split from original  
04-Jun-04  
4.0  
109/110  
PSD813F2, PSD833F2, PSD834F2, PSD853F2, PSD854F2  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequ  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is g  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are s  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products a  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron  
The ST logo is a registered trademark of STMicroelectronics.  
All other names are the property of their respective owners.  
© 2004 STMicroelectronics - All rights reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany -  
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore -  
Spain - Sweden - Switzerland - United Kingdom - United States  
www.st.com  
110/110  

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