SMP80MC-270 [STMICROELECTRONICS]

TELECOM EQUIPMENT PROTECTION TRISIL; 电信设备保护TRISIL
SMP80MC-270
型号: SMP80MC-270
厂家: ST    ST
描述:

TELECOM EQUIPMENT PROTECTION TRISIL
电信设备保护TRISIL

电信集成电路 电信电路 电信保护电路 光电二极管
文件: 总8页 (文件大小:85K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
SMP80MC-270  
TELECOM EQUIPMENT PROTECTION: TRISIL™  
FEATURES  
Bidirectional crowbar protection  
Voltage: 270V  
Low VBO / VR ratio  
Micro capacitance 15pF typ @ 50V  
Low leakage current : IR = 2µA max  
Holding current: IH = 150 mA min  
Repetitive peak pulse current :  
IPP = 80 A (10/1000µs)  
MAIN APPLICATIONS  
Any sensitive equipment requiring protection  
against lightning strikes and power crossing:  
SMB  
(JEDEC DO-214AA)  
Analog and digital line cards  
(xDSL, T1/ E1, ISDN...)  
Terminals (phone, fax, modem...) and central of-  
fice equipment  
SCHEMATIC DIAGRAM  
DESCRIPTION  
The SMP80MC-270 is a micro capacitance  
transient surge arrestor designed for the  
protection of high debit rate communication  
equipment. Its micro capacitance avoids any  
distortion of the signal and is compatible with  
digital line cards (xDSL, T1/E1, ISDN...).  
BENEFITS  
Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are  
used to help equipment to meet main standards such as UL1950, IEC950 / CSA C22.2 and UL1459. They  
have UL94 V0 approved resin. SMB package is JEDEC registered (DO-214AA). Trisils are UL497B  
approved (file: E136224) and comply with the following standards GR-1089 Core, ITU-T-K20/K21,  
VDE0433, VDE0878, IEC61000-4-5 and FCC part 68.  
September 2003 - Ed: 0B  
1/8  
SMP80MC-270  
IN COMPLIANCES WITH THE FOLLOWING STANDARDS  
Peak Surge  
Voltage  
Required  
peak current  
(A)  
Minimum serial  
resistor to meet  
standard ( )  
Current  
waveform  
STANDARD  
Voltage  
(V)  
Waveform  
GR-1089 Core  
First level  
2500  
1000  
2/10 µs  
10/1000 µs  
500  
100  
2/10 µs  
10/1000 µs  
5
2.5  
GR-1089 Core  
Second level  
5000  
2/10 µs  
500  
2/10 µs  
2/10 µs  
5/310 µs  
10  
GR-1089 Core  
Intra-building  
1500  
2/10 µs  
100  
0
ITU-T-K20/K21  
6000  
1500  
10/700 µs  
1/60 ns  
150  
37.5  
10  
0
ITU-T-K20  
(IEC61000-4-2)  
8000  
15000  
ESD contact discharge  
ESD air discharge  
0
0
VDE0433  
4000  
2000  
10/700 µs  
1.2/50 µs  
100  
50  
5/310 µs  
0
0
VDE0878  
4000  
2000  
100  
50  
1/20 µs  
0
0
IEC61000-4-5  
4000  
4000  
10/700 µs  
1.2/50 µs  
100  
100  
5/310 µs  
8/20 µs  
0
0
FCC Part 68, lightning  
surge type A  
1500  
800  
10/160 µs  
10/560 µs  
200  
100  
10/160 µs  
10/560 µs  
2.5  
0
FCC Part 68, lightning  
surge type B  
1000  
9/720 µs  
25  
5/320 µs  
0
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
100  
20  
Unit  
°C/W  
°C/W  
Rth(j-a)  
Rth(j-l)  
Junction to ambient with recommended footprint  
Junction to leads  
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)  
Symbol  
VRM  
IRM  
VR  
Parameter  
Stand-off voltage  
Leakage current at VRM  
Continuous reverse voltage  
Leakage current at VR  
Breakdown voltage  
Breakover voltage  
Holding current  
IR  
VBR  
VBO  
IH  
IBO  
Breakover current  
Peak pulse current  
Capacitance  
IPP  
C
2/8  
SMP80MC-270  
ABSOLUTE RATINGS (Tamb = 25°C)  
Symbol  
Parameter  
Repetitive peak pulse current:  
Value  
Unit  
Ipp  
A
10/1000 µs  
8/20 µs  
10/560 µs  
5/310 µs  
10/160 µs  
1/20 µs  
80  
250  
100  
120  
150  
250  
250  
2/10 µs  
Fail-safe mode : maximum current (note 1)  
8/20 µs  
5
kA  
A
IFS  
ITSM  
Non repetitive surge peak on-state current  
(Sinusoidal)  
t = 20ms  
t = 16.6ms  
t = 0.2s  
28  
30  
14  
7
t = 2s  
I²t  
I²t value for fusing  
t = 16.6ms  
t = 20ms  
7.5  
7.8  
A²s  
°C  
Maximum lead temperature for soldering during 10s  
260  
TL  
Tstg  
Tj  
Storage temperature range  
Maximum junction temperature  
- 55 to + 150  
150  
°C  
°C  
Note 1: in fail safe mode, the device acts as a short circuit.  
% I  
PP  
Repetitive peak pulse current  
100  
tr: rise time (µs)  
50  
0
tp: pulse duration time (µs)  
ex: Pulse waveform 10/1000µs  
tr = 10µs tp = 1000µs  
t
t
t
r
p
ELECTRICAL PARAMETERS (Tamb = 25°C)  
Type  
Dynamic  
VBO  
max.  
Static  
VBO @ IBO  
IR @ VR  
IRM @ VRM  
max.  
IH  
min.  
C
typ.  
C
typ.  
max.  
max.  
max  
Note 1  
Note 4 Note 5 Note 6  
Note 2  
Note 3  
µA  
V
µA  
V
V
V
mA  
mA  
pF  
pF  
SMP80MC-270  
2
243  
50  
270  
345  
335  
800  
150  
15  
30  
Note 1:  
I
measured at V guarantee V  
V
See functional holding current test circuit 3  
R
R
BR min  
R
Note 4:  
Note 2: See functional test circuit 1  
Note 3: See test circuit 2  
Note 5:  
V
V
= 50V bias, V  
=1V, F=1MHz  
R
RMS  
= 2V bias, V =1V, F=1MHz  
RMS  
Note 6:  
R
3/8  
SMP80MC-270  
Fig. 1: Non repetitive surge peak on-state current  
versus overload duration.  
Fig. 2: On-state voltage versus on-state current  
(typical values)  
I
(A)  
TSM  
I (A)  
T
40  
35  
30  
25  
20  
15  
10  
5
100  
F=50Hz  
Tj initial = 25°C  
Tj=25°C  
V (V)  
T
t(s)  
10  
0
0
1
2
3
4
5
6
7
8
1.E-02  
1.E-01  
1.E+00  
1.E+01  
1.E+02  
1.E+03  
Fig. 4: Relative variation of breakover voltage versus  
junction temperature.  
Fig. 3: Relative variation of holding current versus  
junction temperature .  
IH[Tj] / IH[Tj=25°C]  
V
[Tj] / V [Tj=25°C]  
BO BO  
2.0  
1.08  
1.07  
1.06  
1.05  
1.04  
1.03  
1.02  
1.01  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
Tj(°C)  
Tj(°C)  
0.0  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100 110 120 130  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100 110 120 130  
Fig. 5: Relative variation of leakage current versus  
reverse voltage applied (typical values).  
Fig. 6: Variation of thermal impedance junction to  
ambient versus pulse duration (Printed circuit board  
FR4, SCu=35µm, recommended pad layout).  
Z
/R  
I [Tj] / I [Tj=25°C]  
th(j-a) th(j-a)  
R
R
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.E+03  
1.E+02  
1.E+01  
1.E+00  
VR=243V  
Tj(°C)  
tp(s)  
25  
50  
75  
100  
125  
1.E-02  
1.E-01  
1.E+00  
1.E+01  
1.E+02  
1.E+03  
4/8  
SMP80MC-270  
Fig. 7: Relative variation of junction capacitance  
versus reverse voltage applied (typical values).  
C [V ] / C [V =2V]  
R
R
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
F =1MHz  
VOSC = 1VRMS  
Tj = 25°C  
V (V)  
R
1
10  
100  
1000  
TEST CIRCUIT 1 FOR DYNAMIC IBO AND VBO PARAMETERS  
100 V / µs, di/dt < 10 A / µs, Ipp = 80A  
2  
45 Ω  
83 Ω  
46 µH  
0.36 nF  
10 µF  
U
66 Ω  
470 Ω  
KeyTek 'System 2' generator with PN246I module  
1 kV / µs, di/dt < 10 A / µs, Ipp = 10 A  
46 µH  
26 µH  
60 µF  
250 Ω  
47 Ω  
U
12 Ω  
KeyTek 'System 2' generator with PN246I module  
5/8  
SMP80MC-270  
TEST CIRCUIT 2 FOR IBO and VBO parameters :  
K
ton = 20ms  
R1 = 140  
R2 = 240Ω  
220V 50Hz  
VBO  
measurement  
DUT  
Vout  
1/4  
IBO  
measurement  
TEST PROCEDURE :  
Pulse test duration (tp = 20ms):  
- For Bidirectional devices = Switch K is closed  
- For Unidirectional devices = Switch K is open.  
VOUT Selection  
- Device with VBO < 200 Volt  
- VOUT = 250 VRMS, R1 = 140 .  
- Device with VBO 200 Volt  
- VOUT = 480 VRMS, R2 = 240 .  
TEST CIRCUIT 3 FOR IH PARAMETER  
R
Surge generator  
D.U.T  
V
= - 48 V  
BAT  
This is a GO-NO GO test which allows to confirm the holding current (IH) level in a functional test circuit.  
TEST PROCEDURE :  
- Adjust the current level at the IH value by short circuiting the D.U.T.  
- Fire the D.U.T. with a surge current : Ipp = 10A, 10/1000 µs.  
- The D.U.T. will come back to the off-state within 50 ms max.  
6/8  
SMP80MC-270  
PACKAGE MECHANICAL DATA  
SMB (Plastic)  
DIMENSIONS  
Millimeters Inches  
Min.  
E1  
REF.  
Min.  
1.90  
0.05  
1.95  
0.15  
5.10  
4.05  
3.30  
0.75  
Max.  
Max.  
0.096  
0.008  
0.087  
0.016  
0.220  
0.181  
0.156  
0.063  
D
A1  
A2  
b
2.45  
0.20  
2.20  
0.41  
5.60  
4.60  
3.95  
1.60  
0.075  
0.002  
0.077  
0.006  
0.201  
0.159  
0.130  
0.030  
E
c
E
A1  
E1  
D
A2  
C
L
b
L
FOOT PRINT in millimeters (inches)  
2.3  
(0.09)  
1.52  
2.75  
1.52  
(0.059) (0.108) (0.059)  
7/8  
SMP80MC-270  
ORDER CODE  
SMP  
80  
MC  
-
270  
Micro capacitance  
Trisil Surface Mount  
Voltage  
IPP = 80 A  
Ordering type  
Marking  
Package  
SMB  
Weight  
Base qty  
2500  
Delivery mode  
SMP80MC-270  
TP27  
0.11g  
Tape & Reel  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of  
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics.  
All other names are the property of their respective owners.  
© 2003 STMicroelectronics - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
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Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain -  
Sweden - Switzerland - United Kingdom - United States  
www.st.com  
8/8  

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