ST1394-01SC6 [STMICROELECTRONICS]
IEEE1394 ONE PORT CABLE TERMINATION NETWORK WITH ESD PROTECTION DIODES; 带ESD保护二极管IEEE1394一个端口电缆终端网络![ST1394-01SC6](http://pdffile.icpdf.com/pdf1/p00023/img/icpdf/ST1394_114069_icpdf.jpg)
型号: | ST1394-01SC6 |
厂家: | ![]() |
描述: | IEEE1394 ONE PORT CABLE TERMINATION NETWORK WITH ESD PROTECTION DIODES |
文件: | 总6页 (文件大小:165K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ST1394
®
IEEE1394 ONE PORT CABLE TERMINATION
NETWORK WITH ESD PROTECTION DIODES
IPAD™
MAIN APPLICATIONS
TPB+
IEEE1394 line termination on:
TPA-
TpBias
■
■
■
■
■
Desktops
Notebooks
Digital Camcorders
External storage drive
Set Top Box
139
TPB-
GND
TPA-
FEATURES
SOT23-6L
(Plastic)
■
Line termination for 2 twisted pairs TPA and
TPB
■
The device complies with IEEE1394 require-
ment for differential and common more imped-
ance on TPA and TPB line
Table 1: Order Code
Part Number
Marking
■
Monolithic device with complete termination for
one IEEE1394 connection
ST1394-01SC6
139
DESCRIPTION
The ST1394-01SC6 is an integrated termination
network that optimizes board layout of the PHY
layer in IEEE1394 one port cable application.
This monolithic device is tested, according to ESD
requirement described in IEC61000-4-2 standard
level 2. ST1394-01SC6 device ruggedness limits
overvoltage at the 1394 tranceiver inputs and out-
puts below acceptable limits.
Figure 1: Pinout Configuration
TPA+
TpBias
R1
R2
The ST1394-01SC6 implements IEEE1394
recommendation for line termination of TPA and
TPB differential lines. Excellent matching of the
termination resistor will minimize common mode
noise that is needed to improve communication
speed.
GND
TPA-
C
R5
TPB-
TPB+
R4
R3
BENEFITS
Zener
Capacitance
Lines TPA+ TPA- TPB+ TPB- Rpd GND
■
■
■
■
Resistor matching between TPA / TPB lines.
Resistor matching between TPA+ / TPA-
Single chip devise versus 11 discretes
No need for additional overvoltage protection
device
Names
Value
R1
R12
R3
R4
R5
C
Cz
5pF
Max.
55Ω 55Ω 55Ω 55Ω 55Ω 250pF
Tolerance Typ. Typ. Typ. Typ. 20% 20%
Matching between 55Ω
Matching
Resistor at 1% max
■
High level of integration
TM: IPAD is a trademark of STMicroelectronics.
October 2004
REV. 2
1/6
ST1394
Table 2: Absolute Ratings (Tamb = 25°C)
Symbol
Parameter and test conditions
Value
- 55 to + 150
+ 150
Unit
°C
Tstg
Storage temperature range
Tj
Maximum junction temperature
°C
TL
Lead solder temperature (10 second duration)
260
°C
Table 3: Electrical Characteristics (Tamb = 25°C)
Symbol Parameter
R1, R2, R3, R4 Bus termination resistors (note 1)
Min.
Typ.
Max.
Unit
55
Ω
CZ
Rpd
C
Zener capacitance
5
pF
kΩ
pF
Pull down resistor
5
Capacitor in parallel with Rpd
250
(R1+R2),
(R3+R4)
Bus termination impedance
102
110
118
Ω
Note 1: matching between 55Ω resistors is better than 1%.
Figure 2: Functionnal Diagram
TpBias
1µF
TPA+
TPA-
Twisted
Pair A
55Ω
55Ω
250pF
5kΩ
55Ω
55Ω
TPB+
TPB-
Twisted
Pair B
Outer
shied
0.1µF
termination
1MΩ
0.01µF
Minimize this distance
APPLICATION INFORMATION
The functional diagram here above presents a IEEE1394-a cable and shows how to connect the
ST1394-01SC6 in order to correctly terminate and filter the TPA and TPB lines.
2/6
ST1394
TECHNICAL INFORMATION: Frequency behavior of data and strobe signals
Figure 3: Measurement confitions
Figure 4: Test Board
RF test board
Calibration kit board
+5V
TRACKING
GENERATOR
SPECTRUM
ANALYSER
50Ω
ST1394
50Ω
Vg
Vin
Vout
Figure 5: TPA line: comparison between Aplac
model and device
Figure 6: TPB line: comparison between Aplac
model and device
0.00
0.00
dB
-5.00
dB
-10.00
-15.00
-20.00
-25.00
-30.00
-35.00
-40.00
-45.00
-50.00
-5.00
-10.00
-15.00
-20.00
100.0k
1.0M
10.0M
f/Hz
100.0M
1.0G
100.0k
1.0M
10.0M
f/Hz
100.0M
1.0G
Line 2
SimLine 2
Line 1
SimLine 1
Note: For a convenience reason, frequency response have been carried out on both TPA and TPB lines as if TPA+ and TPA- or TPB+ and
TPB- were respectively Inputs and Outputs lines
3/6
ST1394
Figure 7: Crosstalk between TPA and TPB
lines
0.00
dB
-25.00
-50.00
-75.00
-100.00
100.0k
1.0M
10.0M
f/Hz
100.0M
1.0G
Figure 8: CST1394 APLAC model
Lbond
55
55
5k
Rbond
Lpin
Rpin
Lbond
Rbond
Lframe
Ls=1n
Lpin
Ls
250p
Lbond
Rs=100m
Lbond
Rbond
Rpin
Lpin
Rs
55
55
Lpin=230p
Rpin=50m
Rbond
Ls
Rframepin
Lpin
Lpin
Port10
Lbond=420p
Rbond=50m
LFrame=80p
Rframepin=8.6m
Lgnd=50p
Rs
Lgnd
Rpin
Rpin
Ls
Port9
Rgnd
Ls
Rs
Rs
Rgnd=50m
Cdiode=4p
Port11
Port12
4/6
ST1394
Figure 9: SOT23-6L Package Mechanical Data
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
REF.
A2
A
A
A1
A2
b
0.90
0
1.45 0.035
0.10
0.057
0.004
0.051
0.02
D
0
0.90
0.35
0.09
2.80
1.50
1.30 0.035
0.50 0.014
0.20 0.004
3.05 0.110
1.75 0.059
b
A1
C
D
E
0.008
0.120
0.069
L
H
E
e
0.95
0.037
θ
H
L
2.60
0.10
3.00 0.102
0.60 0.004
10°
0.118
0.024
10°
c
e
e
θ
Figure 10: SOT23-6L Foot print dimensions (in millimeters)
0.60
TPBIAS
TPA+
TPA-
TpBias
TPA+
GND
TPA-
TPB+
TPB-
1.20
TPB+
TPB-
AGND
0.95
1.10
3.50 2.30
Table 4: Ordering Information
Ordering code
Marking
Package
SOT23-6L
Weight
16.7 mg
Base qty
Delivery mode
ST1394-01SC6
139
3000
Tape & reel
Note: More informations are available in the application note:
AN1783: “HOW TO MAKE FIRE-WIRE COMMUNICATION PORT SAFE?”
Table 5: Revision History
Date
Revision
Description of Changes
Jul-2003
1A
2
First issue.
28-Oct-2004
SOT23-6L package dimensions change for reference “D”
from 3.0 millimeters (0.118 inches) to 3.05 millimeters
(0.120 inches).
5/6
ST1394
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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www.st.com
6/6
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