ST72F262G2B5 [STMICROELECTRONICS]

8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES; 8位MCU的Flash或ROM存储器, ADC ,两个16位定时器, I2C , SPI , SCI INTERFACES
ST72F262G2B5
型号: ST72F262G2B5
厂家: ST    ST
描述:

8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES
8位MCU的Flash或ROM存储器, ADC ,两个16位定时器, I2C , SPI , SCI INTERFACES

存储 微控制器和处理器 外围集成电路 光电二极管 时钟
文件: 总172页 (文件大小:1466K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ST72260Gx, ST72262Gx,  
ST72264Gx  
8-BIT MCU WITH FLASH OR ROM MEMORY,  
ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES  
Memories  
– 4 K or 8 Kbytes Program memory: ROM or  
Single voltage extended Flash (XFlash) with  
read-out protection write protection and In-  
Circuit Programming and In-Application Pro-  
gramming (ICP and IAP). 10K write/erase cy-  
cles guaranteed, data retention: 20 years at  
55°C.  
– 256 bytes RAM  
Clock, Reset and Supply Management  
SDIP32  
– Enhanced reset system  
– Enhanced low voltage supply supervisor  
(LVD) with 3 programmable levels and auxil-  
iary voltage detector (AVD) with interrupt ca-  
pability for implementing safe power-down  
procedures  
SO28  
LFBGA 6x6mm  
– Clock sources: crystal/ceramic resonator os-  
cillators, internal RC oscillator and bypass for  
external clock  
– PLL for 2x frequency multiplication  
– Clock-out capability  
– Two 16-bit timers with: 2 input captures, 2 out-  
put compares, external clock input on one tim-  
er, PWM and Pulse generator modes  
3 Communication Interfaces  
– SPI synchronous serial interface  
– 4 Power Saving Modes: Halt, Active Halt,Wait  
2
– I C multimaster interface (SMBus V1.1 Com-  
and Slow  
pliant)  
Interrupt Management  
– SCI asynchronous serial interface  
1 Analog peripheral  
– 10-bit ADC with 6 input channels  
Instruction Set  
– Nested interrupt controller  
– 10 interrupt vectors plus TRAP and RESET  
– 22 external interrupt lines (on 2 vectors)  
22 I/O Ports  
– 8-bit data manipulation  
– 22 multifunctional bidirectional I/O lines  
– 20 alternate function lines  
– 8 high sink outputs  
– 63 basic instructions with illegal opcode de-  
tection  
– 17 main addressing modes  
– 8 x 8 unsigned multiply instruction  
Development Tools  
4 Timers  
– Main Clock Controller with Real time base and  
Clock-out capabilities  
– Full hardware/software development package  
– Configurable watchdog timer  
Device Summary  
Features  
ST72260G1  
ST72262G1 ST72262G2 ST72264G1  
ST72264G2  
Program memory - bytes  
RAM (stack) - bytes  
4K  
4K  
8K  
4K  
8K  
256 (128)  
Watchdogtimer,RTC,  
Watchdog timer, RTC,  
Watchdog timer, RTC,  
Two 16-bit timers, SPI, SCI, I C, ADC  
Peripherals  
2
Two16-bit timers, SPI Two 16-bit timers, SPI, ADC  
2.7 V to 5.5 V  
Up to 8 MHz (with oscillator up to 16 MHz) PLL 4/8 MHz  
Operating Supply  
CPU Frequency  
0° C to +70° C /  
-40° C to +85° C  
Operating Temperature  
Packages  
-40° C to +85° C  
SO28 / SDIP32  
-40° C to +85° C  
SO28 / SDIP32  
LFBGA  
Rev. 3  
June 2005  
1/172  
1
Table of Contents  
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
4.3 PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
4.5 MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.6 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.7 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
5.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
6.2 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
6.3 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
6.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.2 MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.3 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
7.4 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
7.5 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
8.2 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
8.3 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
8.4 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
8.5 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
9.4 UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
9.5 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
9.6 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
9.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.8 I/O PORT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
10 MISCELLANEOUS REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
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Table of Contents  
10.1 I/O PORT INTERRUPT SENSITIVITY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
10.2 I/O PORT ALTERNATE FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
10.3 MISCELLANEOUS REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
11.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
11.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC) . . . . . . . . . . . . . 53  
11.3 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
11.4 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
11.5 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87  
11.6 I2C BUS INTERFACE (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103  
11.7 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116  
12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120  
12.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120  
12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123  
13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126  
13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126  
13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127  
13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128  
13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131  
13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135  
13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140  
13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141  
13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144  
13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150  
13.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152  
13.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 153  
13.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157  
14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159  
14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159  
14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160  
14.3 LEAD-FREE PACKAGE INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161  
15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 162  
15.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162  
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 164  
15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166  
16 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168  
16.1 ALL FLASH AND ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168  
16.2 FLASH DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168  
17 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171  
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3
ST72260Gx, ST72262Gx, ST72264Gx  
To obtain the most recent version of this datasheet,  
please check at www.st.com>products>technical literature>datasheet  
Please note that the list of known limitations can be found at the end of this document on page 168.  
4/172  
ST72260Gx, ST72262Gx, ST72264Gx  
1 INTRODUCTION  
The ST72260Gx, ST72262Gx and ST72264Gx  
devices are members of the ST7 microcontroller  
family. They can be grouped as follows :  
Under software control, all devices can be placed  
in WAIT, SLOW, Active-HALT or HALT mode, re-  
ducing power consumption when the application is  
in idle or stand-by state.  
– ST72264Gx devices are designed for mid-range  
2
applications with ADC, I C and SCI interface ca-  
The enhanced instruction set and addressing  
modes of the ST7 offer both power and flexibility to  
software developers, enabling the design of highly  
efficient and compact application code. In addition  
to standard 8-bit data management, all ST7 micro-  
controllers feature true bit manipulation, 8x8 un-  
signed multiplication and indirect addressing  
modes.  
pabilities.  
– ST72262Gx devices target the same range of  
2
applications but without I C interface or SCI.  
– ST72260Gx devices are for applications that do  
2
not need ADC, I C peripherals or SCI.  
All devices are based on a common industry-  
standard 8-bit core, featuring an enhanced instruc-  
tion set.  
For easy reference, all parametric data is located  
in Section 13 on page 126.  
The ST72F260G, ST72F262G, and ST72F264G  
versions feature single-voltage FLASH memory  
with byte-by-byte In-Circuit Programming (ICP)  
capabilities.  
Related Documentation  
AN1365: Guidelines for migrating ST72C254 ap-  
plications to ST72F264  
Figure 1. General Block Diagram  
Internal  
CLOCK  
2
I C*  
OSC1  
MULTI OSC  
OSC2  
SCI*  
PA7:0  
(8 bits)  
MCC/RTC  
LVD  
PORT A  
ICD  
V
DD  
POWER  
SUPPLY  
V
SS  
SPI  
PB7:0  
(8 bits)  
RESET  
CONTROL  
PORT B  
16-BIT TIMER A  
PORT C  
8-BIT CORE  
ALU  
PROGRAM  
MEMORY  
(4 or 8K Bytes)  
PC5:0  
(6 bits)  
10-BIT ADC*  
16-BIT TIMER B  
WATCHDOG  
RAM  
(256 Bytes)  
*Not available on some devices, see device summary on page 1.  
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ST72260Gx, ST72262Gx, ST72264Gx  
2 PIN DESCRIPTION  
Figure 2. 28-Pin SO Package Pinout  
RESET  
V
V
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
DD  
OSC1  
OSC2  
2
SS  
ICCSEL  
3
SS/PB7  
SCK/PB6  
PA0 (HS)/ICCCLK  
PA1 (HS)/ICCDATA  
PA2 (HS)  
4
5
MISO/PB5  
6
MOSI/PB4  
PA3 (HS)  
7
ei1  
ei0  
3
OCMP2_A/PB3  
PA4 (HS)/SCLI  
8
3
ICAP2_A/PB2  
OCMP1_A/PB1  
ICAP1_A/PB0  
9
PA5(HS)/RDI  
3
PA6 (HS)/SDAI  
10  
11  
12  
3
PA7 (HS)/TDO  
2
AIN5/EXTCLK_A/PC5  
PC0/ICAP1_B/AIN0  
PC1/OCMP1_B/AIN1  
2
2
AIN4 /OCMP2_B/PC4  
1
13  
14  
ei0 or ei1  
2
2
AIN3 /ICAP2_B/PC3  
PC2/MCO/AIN2  
(HS) 20mA high sink capability  
eiX associated external interrupt vector  
1
Configurable by option byte  
2
Alternate function not available on ST72260  
Alternate function not available on ST72260 and ST72262  
3
Figure 3. 32-Pin SDIP Package Pinout  
V
V
RESET  
OSC1  
1
DD  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
2
SS  
OSC2  
3
ICCSEL  
PA0 (HS)/ICCCLK  
PA1 (HS)/ICCDATA  
SS/PB7  
4
5
SCK/PB6  
MISO/PB5  
MOSI/PB4  
NC  
ei1  
ei0  
6
PA2 (HS)  
PA3 (HS)  
7
8
NC  
NC  
NC  
OCMP2_A/PB3  
ICAP2_A/PB2  
OCMP1_A/PB1  
9
3
PA4 (HS)/SCLI  
10  
11  
12  
13  
14  
15  
16  
3
PA5 (HS)/RDI  
ei1  
ei0  
3
PA6 (HSI/SDAI  
3
ICAP1_A/PB0  
PA7 (HS)/TDO  
2
2
PC0/ICAP1_B/AIN0  
AIN5 /EXTCLK_A/PC5  
2
2
1
PC1/OCMP1_B/AIN1  
AIN4 /OCMP2_B/PC4  
ei0 or ei1  
2
2
PC2/MCO/AIN2  
AIN3 /ICAP2_B/PC3  
1
2
3
Configurable by option byte  
Alternate function not available on ST72260  
Alternate function not available on ST72260 and ST72262  
(HS) 20mA high sink capability  
eiX associated external interrupt vector  
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ST72260Gx, ST72262Gx, ST72264Gx  
PIN DESCRIPTION (Cont’d)  
Figure 4. TFBGA Package Pinout (view through package)  
1
2
3
4
5
6
A
B
C
D
E
F
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ST72260Gx, ST72262Gx, ST72264Gx  
PIN DESCRIPTION (Cont’d)  
For external pin connection guidelines, refer to Section 13 "ELECTRICAL CHARACTERISTICS" on page  
126.  
Legend / Abbreviations for Table 1:  
Type:  
I = input, O = output, S = supply  
A = Dedicated analog input  
Input level:  
In/Output level: C = CMOS 0.3 V /0.7 V with input trigger  
T
DD  
DD  
Output level:  
HS = 20 mA high sink (on N-buffer only)  
Port and control configuration:  
1)  
– Input:  
float = floating, wpu = weak pull-up, int = interrupt , ana = analog  
2)  
– Output:  
OD = open drain , PP = push-pull  
Refer to Section 9 "I/O PORTS" on page 38 for more details on the software configuration of the I/O ports.  
The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is  
in reset state.  
Table 1. Device Pin Description  
Pin n°  
Level  
Port / Control  
Main  
Function  
(after  
Input  
Output  
Pin Name  
Alternate Function  
reset)  
Top priority non maskable interrupt (ac-  
tive low)  
1
2
3
1
2
3
A3 RESET  
I/O  
I
C
X
X
T
External clock input or Resonator oscilla-  
tor inverter input or resistor input for RC  
oscillator  
3)  
3)  
C4 OSC1  
B3 OSC2  
Resonator oscillator inverter output or ca-  
pacitor input for RC oscillator  
O
4
5
6
7
8
9
4
5
6
7
A2 PB7/SS  
A1 PB6/SCK  
B1 PB5/MISO  
B2 PB4/MOSI  
C1 NC  
I/O  
I/O  
I/O  
I/O  
C
X
X
X
X
ei1  
ei1  
ei1  
ei1  
X
X
X
X
X
X
X
X
Port B7 SPI Slave Select (active low)  
Port B6 SPI Serial Clock  
T
T
T
T
C
C
C
Port B5 SPI Master In/ Slave Out Data  
Port B4 SPI Master Out / Slave In Data  
C2 NC  
Not Connected  
D1 NC  
10  
11  
8
9
C3 PB3/OCMP2_A  
D2 PB2/ICAP2_A  
I/O  
I/O  
C
C
X
X
ei1  
ei1  
X
X
X
Port B3 Timer A Output Compare 2  
T
T
X
Port B2 Timer A Input Capture 2  
Timer A Output Compare 1  
Caution: Negative current  
12 10 E1 PB1 /OCMP1_A  
13 11 F1 PB0 /ICAP1_A  
I/O  
I/O  
C
X
ei1  
X
X
Port B1  
T
injection not allowed on  
4)  
this pin .  
Timer A Input Capture 1  
Caution: Negative current  
C
C
X
X
ei1  
X
X
X
X
Port B0  
T
T
injection not allowed on  
4)  
this pin .  
Timer A Input Clock or ADC  
Analog Input 5  
14 12 F2 PC5/EXTCLK_A/AIN5 I/O  
ei0/ei1 X  
Port C5  
8/172  
ST72260Gx, ST72262Gx, ST72264Gx  
Pin n°  
Level  
Port / Control  
Main  
Function  
(after  
Input  
Output  
Pin Name  
Alternate Function  
reset)  
Timer B Output Compare 2 or  
ADC Analog Input 4  
15 13 E2 PC4/OCMP2_B/AIN4 I/O  
16 14 F3 PC3/ ICAP2_B/AIN3 I/O  
C
C
C
C
C
X
X
X
X
X
ei0/ei1  
ei0/ei1  
ei0/ei1  
ei0/ei1  
ei0/ei1  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Port C4  
Port C3  
Port C2  
Port C1  
Port C0  
T
T
T
T
Timer B Input Capture 2 or  
ADC Analog Input 3  
Main clock output (f  
) or  
CPU  
17 15 E3 PC2/MCO/AIN2  
I/O  
ADC Analog Input 2  
Timer B Output Compare 1 or  
ADC Analog Input 1  
18 16 F4 PC1/OCMP1_B/AIN1 I/O  
Timer B Input Capture 1 or  
ADC Analog Input 0  
19 17 D3 PC0/ICAP1_B/AIN0  
I/O  
X
X
T
20 18 E4 PA7/TDO  
21 19 F5 PA6/SDAI  
22 20 F6 PA5 /RDI  
23 21 E6 PA4/SCLI  
I/O  
I/O  
I/O  
I/O  
C
C
C
C
HS  
HS  
HS  
HS  
X
X
X
X
ei0  
ei0  
ei0  
ei0  
X
T
X
T
Port A7 SCI output  
T
2
Port A6 I C DATA  
T
T
T
X
Port A5 SCI input  
2
Port A4 I C CLOCK  
24  
25  
E5 NC  
D6 NC  
D5 NC  
Not Connected  
26 22 C6 PA3  
27 23 D4 PA2  
C5 NC  
I/O  
I/O  
C
C
HS  
HS  
X
X
ei0  
ei0  
X
X
X
X
Port A3  
Port A2  
T
T
Not Connected  
B6 NC  
28 24 A6 PA1/ICCDATA  
I/O  
I/O  
C
C
C
HS  
HS  
X
X
X
ei0  
ei0  
X
X
X
Port A1 In Circuit Communication Data  
T
T
T
In Circuit Communication  
Clock  
29 25 A5 PA0/ICCCLK  
30 26 B5 ICCSEL  
X
Port A0  
I
ICC mode pin, must be tied low  
Ground  
31 27 A4 V  
32 28 B4 V  
S
S
SS  
DD  
Main power supply  
Notes:  
1. In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up  
column (wpu) is merged with the interrupt column (int), then the I/O configuration is a pull-up interrupt in-  
put, otherwise the configuration is a floating interrupt input. Port C is mapped to ei0 or ei1 by option byte.  
2. In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to V  
are not implemented). See Section 9 "I/O PORTS" on page 38 for more details.  
DD  
3. OSC1 and OSC2 pins connect a crystal or ceramic resonator, or an external source to the on-chip os-  
cillator see Section 2 "PIN DESCRIPTION" on page 6 and Section 6.2 "MULTI-OSCILLATOR (MO)" on  
page 21 for more details.  
4: For details refer to Section 13.8 on page 144  
9/172  
ST72260Gx, ST72262Gx, ST72264Gx  
3 REGISTER & MEMORY MAP  
As shown in Figure 5, the MCU is capable of ad-  
dressing 64K bytes of memories and I/O registers.  
dressing space so the reset and interrupt vectors  
are located in Sector 0 (F000h-FFFFh).  
The available memory locations consist of 128  
bytes of register location, 256 bytes of RAM and  
up to 8 Kbytes of user program memory. The RAM  
space includes up to 128 bytes for the stack from  
0100h to 017Fh.  
The size of Flash Sector 0 and other device op-  
tions are configurable by Option byte (refer to Sec-  
tion 15.1 on page 162).  
IMPORTANT: Memory locations marked as “Re-  
served” must never be accessed. Accessing a re-  
seved area can have unpredictable effects on the  
device.  
The highest address bytes contain the user reset  
and interrupt vectors.  
The Flash memory contains two sectors (see Fig-  
ure 5) mapped in the upper part of the ST7 ad-  
Related Documentation  
AN 985: Executing Code in ST7 RAM  
Figure 5. Memory Map  
0000h  
HW Registers  
(see Table 2)  
0080h  
Short Addressing RAM  
007Fh  
0080h  
Zero page  
(128 Bytes)  
00FFh  
0100h  
RAM  
(256 Bytes)  
Stack or  
16-bit Addressing RAM  
017Fh  
0180h  
(128 Bytes)  
017Fh  
8K FLASH  
Reserved  
PROGRAM MEMORY  
E000h  
DFFFh  
E000h  
4 Kbytes  
SECTOR 1  
EFFFh  
Program Memory  
F000h  
FFFFh  
4 Kbytes  
SECTOR 0  
(4K, 8 KBytes)  
FFDFh  
FFE0h  
Interrupt & Reset Vectors  
(see Table 5 on page 32)  
FFFFh  
10/172  
ST72260Gx, ST72262Gx, ST72264Gx  
Table 2. Hardware Register Map  
Register  
Reset  
Status  
Address  
Block  
Register Name  
Remarks  
Label  
1)  
2)  
0000h  
0001h  
0002h  
PCDR  
PCDDR  
PCOR  
Port C Data Register  
Port C Data Direction Register  
Port C Option Register  
xx000000h R/W  
2)  
2)  
Port C  
00h  
00h  
R/W  
R/W  
0003h  
Reserved (1 Byte)  
1)  
0004h  
0005h  
0006h  
PBDR  
PBDDR  
PBOR  
Port B Data Register  
Port B Data Direction Register  
Port B Option Register  
00h  
R/W  
R/W  
R/W.  
Port B  
Port A  
00h  
00h  
0007h  
Reserved (1 Byte)  
1)  
R/W  
R/W  
0008h  
0009h  
000Ah  
PADR  
PADDR  
PAOR  
Port A Data Register  
Port A Data Direction Register  
Port A Option Register  
00h  
00h  
00h  
R/W  
000Bh  
to  
Reserved (17 Bytes)  
001Bh  
001Ch  
001Dh  
001Eh  
001Fh  
ISPR0  
ISPR1  
ISPR2  
ISPR3  
Interrupt software priority register0  
Interrupt software priority register1  
Interrupt software priority register2  
Interrupt software priority register3  
FFh  
FFh  
FFh  
FFh  
R/W  
R/W  
R/W  
R/W  
ITC  
SPI  
0020h  
MISCR1  
Miscellanous register 1  
00h  
R/W  
0021h  
0022h  
0023h  
SPIDR  
SPICR  
SPICSR  
SPI Data I/O Register  
SPI Control Register  
SPI Status Register  
xxh  
0xh  
00h  
R/W  
R/W  
R/W  
0024h  
0025h  
0026h  
0027h  
WATCHDOG WDGCR  
SICSR  
Watchdog Control Register  
7Fh  
R/W  
System Integrity Control / Status Register  
Main Clock Control / Status Register  
Reserved (1 Byte)  
000x 000x R/W  
MCC  
MCCSR  
00h  
R/W  
2
0028h  
0029h  
002Ah  
002Bh  
002Ch  
002Dh  
002Eh  
I2CCR  
I C Control Register  
00h  
00h  
00h  
00h  
00h  
40h  
00h  
R/W  
2
I2CSR1  
I2CSR2  
I2CCCR  
I2COAR1  
I2COAR2  
I2CDR  
I C Status Register 1  
Read Only  
Read Only  
R/W  
R/W  
R/W  
2
I C Status Register 2  
2
2
I C  
I C Clock Control Register  
2
I C Own Address Register 1  
2
I C Own Address Register2  
2
I C Data Register  
R/W  
002Fh  
0030h  
Reserved (2 Bytes)  
11/172  
ST72260Gx, ST72262Gx, ST72264Gx  
Register  
Label  
Reset  
Status  
Address  
Block  
Register Name  
Remarks  
R/W  
R/W  
R/W  
Read Only  
Read Only  
R/W  
0031h  
0032h  
0033h  
0034h  
0035h  
0036h  
0037h  
0038h  
0039h  
003Ah  
003Bh  
003Ch  
003Dh  
003Eh  
003Fh  
TACR2  
TACR1  
Timer A Control Register 2  
Timer A Control Register 1  
Timer A Control/Status Register  
Timer A Input Capture 1 High Register  
Timer A Input Capture 1 Low Register  
Timer A Output Compare 1 High Register  
Timer A Output Compare 1 Low Register  
Timer A Counter High Register  
00h  
00h  
xxh  
xxh  
xxh  
80h  
00h  
FFh  
FCh  
FFh  
FCh  
xxh  
xxh  
80h  
00h  
TASCSR  
TAIC1HR  
TAIC1LR  
TAOC1HR  
TAOC1LR  
TACHR  
R/W  
TIMER A  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
R/W  
TACLR  
Timer A Counter Low Register  
TAACHR  
TAACLR  
TAIC2HR  
TAIC2LR  
TAOC2HR  
TAOC2LR  
Timer A Alternate Counter High Register  
Timer A Alternate Counter Low Register  
Timer A Input Capture 2 High Register  
Timer A Input Capture 2 Low Register  
Timer A Output Compare 2 High Register  
Timer A Output Compare 2 Low Register  
R/W  
0040h  
MISCR2  
Miscellanous register 2  
00h  
R/W  
0041h  
0042h  
0043h  
0044h  
0045h  
0046h  
0047h  
0048h  
0049h  
004Ah  
004Bh  
004Ch  
004Dh  
004Eh  
004Fh  
TBCR2  
TBCR1  
Timer B Control Register 2  
Timer B Control Register 1  
Timer B Control/Status Register  
Timer B Input Capture 1 High Register  
Timer B Input Capture 1 Low Register  
Timer B Output Compare 1 High Register  
Timer B Output Compare 1 Low Register  
Timer B Counter High Register  
00h  
00h  
xxh  
xxh  
xxh  
80h  
00h  
FFh  
FCh  
FFh  
FCh  
xxh  
xxh  
80h  
00h  
R/W  
R/W  
R/W  
Read Only  
Read Only  
R/W  
TBSCSR  
TBIC1HR  
TBIC1LR  
TBOC1HR  
TBOC1LR  
TBCHR  
R/W  
TIMER B  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
R/W  
TBCLR  
Timer B Counter Low Register  
TBACHR  
TBACLR  
TBIC2HR  
TBIC2LR  
TBOC2HR  
TBOC2LR  
Timer B Alternate Counter High Register  
Timer B Alternate Counter Low Register  
Timer B Input Capture 2 High Register  
Timer B Input Capture 2 Low Register  
Timer B Output Compare 2 High Register  
Timer B Output Compare 2 Low Register  
R/W  
0050h  
0051h  
0052h  
0053h  
0054h  
0055h  
0056h  
SCISR  
SCIDR  
SCI Status Register  
SCI Data Register  
SCI Baud Rate Register  
SCI Control Register1  
SCI Control Register2  
SCI Extended Receive Prescaler Register  
SCI Extended Transmit Prescaler Register  
C0h  
xxh  
00h  
Read Only  
R/W  
R/W  
SCIBRR  
SCICR1  
SCICR2  
SCIERPR  
SCIETPR  
SCI  
x000 0000h R/W  
00h  
00h  
00h  
R/W  
R/W  
R/W  
0057h  
to  
Reserved (24 Bytes)  
006Eh  
3)  
006Fh  
0070h  
0071h  
ADCDRL  
ADCDRH  
ADCCSR  
Data Register Low  
00h  
00h  
00h  
Read Only  
Read Only  
R/W  
3)  
ADC  
Data Register High  
Control/Status Register  
0072h  
FLASH  
FCSR  
Flash Control Register  
00h  
R/W  
0073h  
to  
Reserved (13 Bytes)  
007Fh  
12/172  
ST72260Gx, ST72262Gx, ST72264Gx  
Legend: x=Undefined, R/W=Read/Write  
Notes:  
1. The contents of the I/O port DR registers are readable only in output configuration. In input configura-  
tion, the values of the I/O pins are returned instead of the DR register contents.  
2. The bits associated with unavailable pins must always keep their reset value.  
3. For compatibility with the ST72C254, the ADCDRL and ADCDRH data registers are located with the  
LSB on the lower address (6Fh) and the MSB on the higher address (70h). As this scheme is not little En-  
dian, the ADC data registers cannot be treated by C programs as an integer, but have to be treated as two  
char registers.  
13/172  
ST72260Gx, ST72262Gx, ST72264Gx  
board and while the application is running.  
4.3.1 In-Circuit Programming (ICP)  
4 FLASH PROGRAM MEMORY  
ICP uses a protocol called ICC (In-Circuit Commu-  
nication) which allows an ST7 plugged on a print-  
ed circuit board (PCB) to communicate with an ex-  
ternal programming device connected via cable.  
ICP is performed in three steps:  
4.1 Introduction  
The ST7 single voltage extended Flash (XFlash) is  
a non-volatile memory that can be electrically  
erased and programmed either on a byte-by-byte  
basis or up to 32 bytes in parallel.  
Switch the ST7 to ICC mode (In-Circuit Communi-  
cations). This is done by driving a specific signal  
sequence on the ICCCLK/DATA pins while the  
RESET pin is pulled low. When the ST7 enters  
ICC mode, it fetches a specific RESET vector  
which points to the ST7 System Memory contain-  
ing the ICC protocol routine. This routine enables  
the ST7 to receive bytes from the ICC interface.  
The XFlash devices can be programmed off-board  
(plugged in a programming tool) or on-board using  
In-Circuit Programming or In-Application Program-  
ming.  
The array matrix organisation allows each sector  
to be erased and reprogrammed without affecting  
other sectors.  
– Download ICP Driver code in RAM from the  
ICCDATA pin  
4.2 Main Features  
– Execute ICP Driver code in RAM to program  
the FLASH memory  
ICP (In-Circuit Programming)  
IAP (In-Application Programming)  
Depending on the ICP Driver code downloaded in  
RAM, FLASH memory programming can be fully  
customized (number of bytes to program, program  
locations, or selection of the serial communication  
interface for downloading).  
ICT (In-Circuit Testing) for downloading and  
executing user application test patterns in RAM  
Sector 0 size configurable by option byte  
Read-out and write protection against piracy  
4.3.2 In Application Programming (IAP)  
4.3 PROGRAMMING MODES  
This mode uses an IAP Driver program previously  
programmed in Sector 0 by the user (in ICP  
mode).  
The ST7 can be programmed in three different  
ways:  
This mode is fully controlled by user software. This  
allows it to be adapted to the user application, (us-  
er-defined strategy for entering programming  
mode, choice of communications protocol used to  
fetch the data to be stored etc.)  
IAP mode can be used to program any memory ar-  
eas except Sector 0, which is write/erase protect-  
ed to allow recovery in case errors occur during  
the programming operation.  
– Insertion in a programming tool. In this mode,  
FLASH sectors 0 and 1 and option byte row  
can be programmed or erased.  
– In-Circuit Programming. In this mode, FLASH  
sectors 0 and 1 and option byte row can be  
programmed or erased without removing the  
device from the application board.  
– In-Application Programming. In this mode,  
sector 1 can be programmed or erased with-  
out removing the device from the application  
14/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
FLASH PROGRAM MEMORY (Cont’d)  
4.4 ICC interface  
Tool documentation for recommended resistor val-  
ues.  
ICP needs a minimum of 4 and up to 7 pins to be  
connected to the programming tool. These pins  
are:  
2. During the ICP session, the programming tool  
must control the RESET pin. This can lead to con-  
flicts between the programming tool and the appli-  
cation reset circuit if it drives more than 5mA at  
high level (push pull output or pull-up resistor<1K).  
A schottky diode can be used to isolate the appli-  
cation RESET circuit in this case. When using a  
classical RC network with R>1K or a reset man-  
agement IC with open drain output and pull-up re-  
sistor>1K, no additional components are needed.  
In all cases the user must ensure that no external  
reset is generated by the application during the  
ICC session.  
– RESET: device reset  
– V : device power supply ground  
SS  
– ICCCLK: ICC output serial clock pin  
– ICCDATA: ICC input serial data pin  
– ICCSEL: ICC selection (not required on devic-  
es without ICCSEL pin)  
– OSC1: main clock input for external source  
(not required on devices without OSC1/OSC2  
pins)  
– V : application board power supply (option-  
DD  
al, see Note 3)  
3. The use of Pin 7 of the ICC connector depends  
on the Programming Tool architecture. This pin  
must be connected when using most ST Program-  
ming Tools (it is used to monitor the application  
power supply). Please refer to the Programming  
Tool manual.  
Notes:  
1. If the ICCCLK or ICCDATA pins are only used  
as outputs in the application, no signal isolation is  
necessary. As soon as the Programming Tool is  
plugged to the board, even if an ICC session is not  
in progress, the ICCCLK and ICCDATA pins are  
not available for the application. If they are used as  
inputs by the application, isolation such as a serial  
resistor has to be implemented in case another de-  
vice forces the signal. Refer to the Programming  
4. Pin 9 has to be connected to the OSC1 pin of  
the ST7 when the clock is not available in the ap-  
plication or if the selected clock option is not pro-  
grammed in the option byte. ST7 devices with mul-  
ti-oscillator capability need to have OSC2 ground-  
ed in this case.  
Figure 6. Typical ICC Interface  
PROGRAMMING TOOL  
ICC CONNECTOR  
ICC Cable  
ICC CONNECTOR  
HE10 CONNECTOR TYPE  
(See Note 3)  
OPTIONAL  
(See Note 4)  
APPLICATION BOARD  
9
7
5
6
3
1
2
10  
8
4
APPLICATION  
RESET SOURCE  
See Note 2  
10kΩ  
APPLICATION  
POWER SUPPLY  
C
C
L2  
L1  
APPLICATION  
See Note 1  
I/O  
ST7  
15/172  
ST72260Gx, ST72262Gx, ST72264Gx  
FLASH PROGRAM MEMORY (Cont’d)  
4.5 Memory Protection  
4.6 Related Documentation  
There are two different types of memory protec-  
tion: Read Out Protection and Write/Erase Protec-  
tion which can be applied individually.  
For details on Flash programming and ICC proto-  
col, refer to the ST7 Flash Programming Refer-  
ence Manual and to the ST7 ICC Protocol Refer-  
ence Manual.  
AN1477: Emulated data EEPROM with XFlash  
memory  
4.5.1 Read out Protection  
Read-out protection, when selected, provides a  
protection against Program Memory content ex-  
traction and against write access to Flash memo-  
ry. Even if no protection can be considered as to-  
tally unbreakable, the feature provides a very high  
level of protection for a general purpose microcon-  
troller.  
AN1576: IAP drivers for ST7 HDFlash or XFlash  
MCUs  
AN1575: On Board Programming methods for ST7  
HDFlash or XFlash MCUs  
AN1070: Checksum self checking capability  
In flash devices, this protection is removed by re-  
programming the option. In this case the program  
memory is automatically erased and the device  
can be reprogrammed.  
4.7 Register Description  
FLASH CONTROL/STATUS REGISTER (FCSR)  
Read/Write  
Reset Value: 000 0000 (00h)  
1st RASS Key: 0101 0110 (56h)  
2nd RASS Key: 1010 1110 (AEh)  
Read-out protection selection depends on the de-  
vice type:  
– In Flash devices it is enabled and removed  
through the FMP_R bit in the option byte.  
– In ROM devices it is enabled by mask option  
specified in the Option List.  
7
0
0
4.5.2 Flash Write/Erase Protection  
0
0
0
0
OPT  
LAT  
PGM  
Write/erase protection, when set, makes it impos-  
sible to both overwrite and erase program memo-  
ry. Its purpose is to provide advanced security to  
applications and prevent any change being made  
to the memory content.  
Note: This register is reserved for programming  
using ICP, IAP or other programming methods. It  
controls the XFlash programming and erasing op-  
erations.  
Warning: Once set, Write/erase protection can  
never be removed. A write-protected flash device  
is no longer reprogrammable.  
When an EPB or another programming tool is  
used (in socket or ICP mode), the RASS keys are  
sent automatically.  
Write/erase protection is enabled through the  
FMP_W bit in the option byte.  
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ST72260Gx, ST72262Gx, ST72264Gx  
5 CENTRAL PROCESSING UNIT  
5.1 INTRODUCTION  
5.3 CPU REGISTERS  
This CPU has a full 8-bit architecture and contains  
six internal registers allowing efficient 8-bit data  
manipulation.  
The 6 CPU registers shown in Figure 7 are not  
present in the memory mapping and are accessed  
by specific instructions.  
Accumulator (A)  
5.2 MAIN FEATURES  
The Accumulator is an 8-bit general purpose reg-  
ister used to hold operands and the results of the  
arithmetic and logic calculations and to manipulate  
data.  
Enable executing 63 basic instructions  
Fast 8-bit by 8-bit multiply  
17 main addressing modes (with indirect  
Index Registers (X and Y)  
addressing mode)  
These 8-bit registers are used to create effective  
addresses or as temporary storage areas for data  
manipulation. (The Cross-Assembler generates a  
precede instruction (PRE) to indicate that the fol-  
lowing instruction refers to the Y register.)  
Two 8-bit index registers  
16-bit stack pointer  
Low power HALT and WAIT modes  
Priority maskable hardware interrupts  
Non-maskable software/hardware interrupts  
The Y register is not affected by the interrupt auto-  
matic procedures.  
Program Counter (PC)  
The program counter is a 16-bit register containing  
the address of the next instruction to be executed  
by the CPU. It is made of two 8-bit registers PCL  
(Program Counter Low which is the LSB) and PCH  
(Program Counter High which is the MSB).  
Figure 7. CPU Registers  
7
0
ACCUMULATOR  
RESET VALUE = XXh  
7
0
0
X INDEX REGISTER  
Y INDEX REGISTER  
RESET VALUE = XXh  
7
RESET VALUE = XXh  
PCL  
PCH  
7
8
15  
0
PROGRAM COUNTER  
RESET VALUE = RESET VECTOR @ FFFEh-FFFFh  
7
1
0
1
1
I1 H I0 N Z C  
CONDITION CODE REGISTER  
RESET VALUE =  
8
1
1
X 1 X X X  
0
15  
7
STACK POINTER  
RESET VALUE = STACK HIGHER ADDRESS  
X = Undefined Value  
17/172  
ST72260Gx, ST72262Gx, ST72264Gx  
CENTRAL PROCESSING UNIT (Cont’d)  
Condition Code Register (CC)  
Read/Write  
Bit 1 = Z Zero.  
This bit is set and cleared by hardware. This bit in-  
dicates that the result of the last arithmetic, logical  
or data manipulation is zero.  
0: The result of the last operation is different from  
zero.  
1: The result of the last operation is zero.  
Reset Value: 111x1xxx  
7
0
1
1
I1  
H
I0  
N
Z
C
This bit is accessed by the JREQ and JRNE test  
instructions.  
The 8-bit Condition Code register contains the in-  
terrupt masks and four flags representative of the  
result of the instruction just executed. This register  
can also be handled by the PUSH and POP in-  
structions.  
Bit 0 = C Carry/borrow.  
This bit is set and cleared by hardware and soft-  
ware. It indicates an overflow or an underflow has  
occurred during the last arithmetic operation.  
0: No overflow or underflow has occurred.  
1: An overflow or underflow has occurred.  
These bits can be individually tested and/or con-  
trolled by specific instructions.  
Arithmetic Management Bits  
This bit is driven by the SCF and RCF instructions  
and tested by the JRC and JRNC instructions. It is  
also affected by the “bit test and branch”, shift and  
rotate instructions.  
Bit 4 = H Half carry.  
This bit is set by hardware when a carry occurs be-  
tween bits 3 and 4 of the ALU during an ADD or  
ADC instructions. It is reset by hardware during  
the same instructions.  
Interrupt Management Bits  
Bit 5,3 = I1, I0 Interrupt  
0: No half carry has occurred.  
1: A half carry has occurred.  
The combination of the I1 and I0 bits gives the cur-  
rent interrupt software priority.  
This bit is tested using the JRH or JRNH instruc-  
tion. The H bit is useful in BCD arithmetic subrou-  
tines.  
Interrupt Software Priority  
Level 0 (main)  
I1  
1
0
0
1
I0  
0
1
0
1
Level 1  
Bit 2 = N Negative.  
Level 2  
This bit is set and cleared by hardware. It is repre-  
sentative of the result sign of the last arithmetic,  
logical or data manipulation. It’s a copy of the re-  
Level 3 (= interrupt disable)  
These two bits are set/cleared by hardware when  
entering in interrupt. The loaded value is given by  
the corresponding bits in the interrupt software pri-  
ority registers (IxSPR). They can be also set/  
cleared by software with the RIM, SIM, IRET,  
HALT, WFI and PUSH/POP instructions.  
th  
sult 7 bit.  
0: The result of the last operation is positive or null.  
1: The result of the last operation is negative  
(i.e. the most significant bit is a logic 1).  
This bit is accessed by the JRMI and JRPL instruc-  
tions.  
See the interrupt management chapter for more  
details.  
18/172  
ST72260Gx, ST72262Gx, ST72264Gx  
CENTRAL PROCESSING UNIT (Cont’d)  
Stack Pointer (SP)  
Read/Write  
The least significant byte of the Stack Pointer  
(called S) can be directly accessed by a LD in-  
struction.  
Reset Value: 01 7Fh  
Note: When the lower limit is exceeded, the Stack  
Pointer wraps around to the stack upper limit, with-  
out indicating the stack overflow. The previously  
stored information is then overwritten and there-  
fore lost. The stack also wraps in case of an under-  
flow.  
15  
8
1
0
7
0
0
0
0
0
0
0
The stack is used to save the return address dur-  
ing a subroutine call and the CPU context during  
an interrupt. The user may also directly manipulate  
the stack by means of the PUSH and POP instruc-  
tions. In the case of an interrupt, the PCL is stored  
at the first location pointed to by the SP. Then the  
other registers are stored in the next locations as  
shown in Figure 8  
SP7  
SP6  
SP5  
SP4  
SP3  
SP2  
SP1  
SP0  
The Stack Pointer is a 16-bit register which is al-  
ways pointing to the next free location in the stack.  
It is then decremented after data has been pushed  
onto the stack and incremented before data is  
popped from the stack (see Figure 8).  
– When an interrupt is received, the SP is decre-  
mented and the context is pushed on the stack.  
Since the stack is 128 bytes deep, the 8 most sig-  
nificant bits are forced by hardware. Following an  
MCU Reset, or after a Reset Stack Pointer instruc-  
tion (RSP), the Stack Pointer contains its reset val-  
ue (the SP7 to SP0 bits are set) which is the stack  
higher address.  
– On return from interrupt, the SP is incremented  
and the context is popped from the stack.  
A subroutine call occupies two locations and an in-  
terrupt five locations in the stack area.  
Figure 8. Stack Manipulation Example  
CALL  
Subroutine  
RET  
or RSP  
PUSH Y  
POP Y  
IRET  
Interrupt  
Event  
@ 0100h  
SP  
SP  
SP  
Y
CC  
A
CC  
A
CC  
A
X
X
X
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
SP  
SP  
PCH  
PCL  
PCH  
PCL  
SP  
@ 017Fh  
Stack Higher Address = 017Fh  
0100h  
Stack Lower Address =  
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ST72260Gx, ST72262Gx, ST72264Gx  
6 SUPPLY, RESET AND CLOCK MANAGEMENT  
The device includes a range of utility features for  
securing the application in critical situations (for  
example in case of a power brown-out), and re-  
ducing the number of external components. An  
overview is shown in Figure 10.  
6.1 PHASE LOCKED LOOP  
If the clock frequency input to the PLL is in the 2 to  
4 MHz range, the PLL can be used to multiply the  
frequency by two to obtain an f  
of 4 to 8 MHz.  
OSC2  
The PLL is enabled by option byte. If the PLL is  
disabled, then f /2.  
For more details, refer to dedicated parametric  
section.  
f
OSC2 = OSC  
Caution: The PLL is not recommended for appli-  
cations where timing accuracy is required. See  
“PLL Characteristics” on page 139.  
Main Features  
Optional PLL for multiplying the frequency by 2  
(not to be used with internal RC oscillator)  
Figure 9. PLL Block Diagram  
Reset Sequence Manager (RSM)  
Multi-Oscillator Clock Management (MO)  
– 4 Crystal/Ceramic resonator oscillators  
– 1 Internal RC oscillator  
System Integrity Management (SI)  
PLL x 2  
/ 2  
0
1
f
OSC  
f
OSC2  
– Main supply Low Voltage Detector (LVD)  
PLL OPTION BIT  
– Auxiliary Voltage Detector (AVD) with inter-  
rupt capability for monitoring the main supply  
Figure 10. Clock, Reset and Supply Block Diagram  
MISCR1 Register  
SLOW MODE  
SELECTION  
f
CPU  
to CPU  
and  
Peripherals  
MAIN CLOCK  
CONTROLLER  
WITH REALTIME  
MULTI-  
OSCILLATOR  
(MO)  
OSC2  
OSC1  
f
OSC  
PLL  
(option)  
f
OSC2  
CLOCK (MCC/RTC)  
SYSTEM INTEGRITY MANAGEMENT  
WATCHDOG  
TIMER (WDG)  
RESET SEQUENCE  
MANAGER  
AVD Interrupt Request  
RESET  
SICSR  
AVD AVD  
LVD  
RF  
WDG  
RF  
(RSM)  
0
0
0
0
IE  
F
LOW VOLTAGE  
DETECTOR  
(LVD)  
V
V
SS  
DD  
AUXILIARY VOLTAGE  
DETECTOR  
(AVD)  
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ST72260Gx, ST72262Gx, ST72264Gx  
6.2 MULTI-OSCILLATOR (MO)  
The main clock of the ST7 can be generated by  
four different source types coming from the multi-  
oscillator block:  
an external source  
5 crystal or ceramic resonator oscillators  
an internal high frequency RC oscillator  
Internal RC Oscillator  
This oscillator allows a low cost solution for the  
main clock of the ST7 using only an internal resis-  
tor and capacitor. Internal RC oscillator mode has  
the drawback of a lower frequency accuracy and  
should not be used in applications that require ac-  
curate timing.  
Each oscillator is optimized for a given frequency  
range in terms of consumption and is selectable  
through the option byte. The associated hardware  
configurations are shown in Table 3. Refer to the  
electrical characteristics section for more details.  
In this mode, the two oscillator pins have to be tied  
to ground.  
Related documentation  
AN1530: Accurate timebase for low cost ST7 ap-  
plications with internal RC.  
Caution: The OSC1 and/or OSC2 pins must not  
be left unconnected. For the purposes of Failure  
Mode and Effects Analysis, it should be noted that  
if the OSC1 and/or OSC2 pins are left unconnect-  
ed, the ST7 main oscillator may start and, in this  
Table 3. ST7 Clock Sources  
Hardware Configuration  
configuration, could generate an f  
clock fre-  
OSC  
quency in excess of the allowed maximum  
(>16MHz.), putting the ST7 in an unsafe/unde-  
fined state. The product behaviour must therefore  
be considered undefined when the OSC pins are  
left unconnected.  
ST7  
OSC1  
OSC2  
EXTERNAL  
SOURCE  
External Clock Source  
In this external clock mode, a clock signal (square,  
sinus or triangle) with ~50% duty cycle has to drive  
the OSC1 pin while the OSC2 pin is tied to ground.  
ST7  
Crystal/Ceramic Oscillators  
OSC1  
OSC2  
This family of oscillators has the advantage of pro-  
ducing a very accurate rate on the main clock of  
the ST7. The selection within a list of 5 oscillators  
with different frequency ranges has to be done by  
option byte in order to reduce consumption (refer  
to Section 15.1 on page 162 for more details on  
the frequency ranges). In this mode of the multi-  
oscillator, the resonator and the load capacitors  
have to be placed as close as possible to the oscil-  
lator pins in order to minimize output distortion and  
start-up stabilization time. The loading capaci-  
tance values must be adjusted according to the  
selected oscillator.  
C
C
L2  
L1  
LOAD  
CAPACITORS  
ST7  
OSC1  
OSC2  
These oscillators are not stopped during the  
RESET phase to avoid losing time in the oscillator  
start-up phase.  
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6.3 RESET SEQUENCE MANAGER (RSM)  
6.3.1 Introduction  
The RESET vector fetch phase duration is 2 clock  
cycles.  
The reset sequence manager includes three RE-  
SET sources as shown in Figure 12:  
External RESET source pulse  
Figure 11. RESET Sequence Phases  
Internal LVD RESET (Low Voltage Detection)  
Internal WATCHDOG RESET  
RESET  
These sources act on the RESET pin and it is al-  
ways kept low during the delay phase.  
INTERNAL RESET  
4096 CLOCK CYCLES  
FETCH  
VECTOR  
Active Phase  
The RESET service routine vector is fixed at ad-  
dresses FFFEh-FFFFh in the ST7 memory map.  
6.3.2 Asynchronous External RESET pin  
The basic RESET sequence consists of 3 phases  
as shown in Figure 11:  
Active Phase depending on the RESET source  
The RESET pin is both an input and an open-drain  
output with integrated R  
weak pull-up resistor.  
ON  
This pull-up has no fixed value but varies in ac-  
cordance with the input voltage. It can be pulled  
low by external circuitry to reset the device. See  
Electrical Characteristic section for more details.  
4096 CPU clock cycle delay (selected by option  
byte)  
RESET vector fetch  
A RESET signal originating from an external  
The 4096 CPU clock cycle delay allows the oscil-  
lator to stabilise and ensures that recovery has  
taken place from the Reset state. The shorter or  
longer clock cycle delay should be selected by op-  
tion byte to correspond to the stabilization time of  
the external oscillator used in the application.  
source must have a duration of at least t  
in  
h(RSTL)in  
order to be recognized (see Figure 13). This de-  
tection is asynchronous and therefore the MCU  
can enter reset state even in HALT mode.  
Figure 12. Reset Block Diagram  
V
DD  
R
ON  
INTERNAL  
RESET  
Filter  
RESET  
PULSE  
GENERATOR  
WATCHDOG RESET  
LVD RESET  
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ST72260Gx, ST72262Gx, ST72264Gx  
RESET SEQUENCE MANAGER (Cont’d)  
The RESET pin is an asynchronous signal which  
plays a major role in EMS performance. In a noisy  
environment, it is recommended to follow the  
guidelines mentioned in the electrical characteris-  
tics section.  
6.3.4 Internal Low Voltage Detector (LVD)  
RESET  
Two different RESET sequences caused by the in-  
ternal LVD circuitry can be distinguished:  
Power-On RESET  
6.3.3 External Power-On RESET  
Voltage Drop RESET  
If the LVD is disabled by option byte, to start up the  
microcontroller correctly, the user must ensure by  
means of an external reset circuit that the reset  
The device RESET pin acts as an output that is  
pulled low when V <V  
(rising edge) or  
DD  
IT+  
V
<V (falling edge) as shown in Figure 13.  
DD  
IT-  
signal is held low until V  
is over the minimum  
DD  
The LVD filters spikes on V larger than t  
to  
level specified for the selected f  
frequency.  
DD  
g(VDD)  
OSC  
avoid parasitic resets.  
A proper reset signal for a slow rising V supply  
DD  
can generally be provided by an external RC net-  
work connected to the RESET pin.  
6.3.5 Internal Watchdog RESET  
The RESET sequence generated by a internal  
Watchdog counter overflow is shown in Figure 13.  
Starting from the Watchdog counter underflow, the  
device RESET pin acts as an output that is pulled  
low during at least t  
.
w(RSTL)out  
Figure 13. RESET Sequences  
V
DD  
V
V
IT+(LVD)  
IT-(LVD)  
LVD  
RESET  
EXTERNAL  
RESET  
WATCHDOG  
RESET  
RUN  
RUN  
RUN  
RUN  
ACTIVE  
PHASE  
ACTIVE  
PHASE  
ACTIVE PHASE  
t
w(RSTL)out  
t
h(RSTL)in  
EXTERNAL  
RESET  
SOURCE  
RESET PIN  
WATCHDOG  
RESET  
WATCHDOG UNDERFLOW  
INTERNAL RESET (4096 TCPU  
VECTOR FETCH  
)
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ST72260Gx, ST72262Gx, ST72264Gx  
6.4 SYSTEM INTEGRITY MANAGEMENT (SI)  
The System Integrity Management block contains  
group the Low voltage Detector (LVD) and Auxilia-  
ry Voltage Detector (AVD) functions. It is managed  
by the SICSR register.  
Provided the minimum V value (guaranteed for  
DD  
the oscillator frequency) is above V , the MCU  
IT-  
can only be in two modes:  
– under full software control  
– in static safe reset  
In these conditions, secure operation is always en-  
sured for the application without the need for ex-  
ternal reset hardware.  
Note: A reset can also be triggered following the  
detection of an illegal opcode or prebyte code. Re-  
fer to Section 12.2.1 on page 123 for further de-  
tails.  
During a Low Voltage Detector Reset, the RESET  
pin is held low, thus permitting the MCU to reset  
other devices.  
6.4.1 Low Voltage Detector (LVD)  
The Low Voltage Detector function (LVD) gener-  
ates a static reset when the V supply voltage is  
DD  
below a V reference value. This means that it  
IT-  
Notes:  
secures the power-up as well as the power-down  
keeping the ST7 in reset.  
The LVD allows the device to be used without any  
external RESET circuitry.  
The V reference value for a voltage drop is lower  
IT-  
The LVD is an optional function which can be se-  
lected by option byte.  
than the V reference value for power-on in order  
IT+  
to avoid a parasitic reset when the MCU starts run-  
ning and sinks current on the supply (hysteresis).  
Use of LVD with capacitive power supply: with this  
type of power supply, if power cuts occur in the ap-  
The LVD Reset circuitry generates a reset when  
plication, it is recommended to pull V  
down to  
DD  
V
is below:  
DD  
0V to ensure optimum restart conditions. Refer to  
– V when V is rising  
IT+  
DD  
circuit example in Figure 91 on page 151 and note  
6.  
– V when V is falling  
IT-  
DD  
The LVD function is illustrated in Figure 14.  
It is recommended to make sure that the V sup-  
DD  
The voltage threshold can be configured by option  
byte to be low, medium or high.  
ply voltage rises monotonously when the device is  
exiting from Reset, to ensure the application func-  
tions properly.  
Figure 14. Low Voltage Detector vs Reset  
V
DD  
V
hys  
V
V
IT+  
IT-  
RESET  
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ST72260Gx, ST72262Gx, ST72264Gx  
SYSTEM INTEGRITY MANAGEMENT (Cont’d)  
6.4.2 Auxiliary Voltage Detector (AVD)  
In the case of a drop in voltage, the AVD interrupt  
acts as an early warning, allowing software to shut  
down safely before the LVD resets the microcon-  
troller. See Figure 15.  
The Voltage Detector function (AVD) is based on  
an analog comparison between a V and V ref-  
IT-  
IT+  
erence value and the V  
main supply. The V  
DD  
IT-  
reference value for falling voltage is lower than the  
The interrupt on the rising edge is used to inform  
V
reference value for rising voltage in order to  
the application that the V warning state is over.  
IT+  
DD  
avoid parasitic detection (hysteresis).  
If the voltage rise time t is less than 256 or 4096  
rv  
The output of the AVD comparator is directly read-  
able by the application software through a real  
time status bit (VDF) in the SICSR register. This bit  
is read only.  
Caution: The AVD functions only if the LVD is en-  
abled through the option byte.  
CPU cycles (depending on the reset delay select-  
ed by option byte), no AVD interrupt will be gener-  
ated when V  
is reached.  
IT+(AVD)  
If t is greater than 256 or 4096 cycles then:  
rv  
– If the AVD interrupt is enabled before the  
V
threshold is reached, then 2 AVD inter-  
IT+(AVD)  
6.4.2.1 Monitoring the V Main Supply  
DD  
rupts will be received: the first when the AVDIE  
bit is set, and the second when the threshold is  
reached.  
The AVD voltage threshold value is relative to the  
selected LVD threshold configured by option byte  
(see Section 15.1 on page 162).  
– If the AVD interrupt is enabled after the V  
IT+(AVD)  
threshold is reached then only one AVD interrupt  
will occur.  
If the AVD interrupt is enabled, an interrupt is gen-  
erated when the voltage crosses the V  
or  
IT+(AVD)  
V
threshold (AVDF bit toggles).  
IT-(AVD)  
Figure 15. Using the AVD to Monitor V  
DD  
V
DD  
Early Warning Interrupt  
(Power has dropped, MCU not  
not yet in reset)  
V
hyst  
V
IT+(AVD)  
V
IT-(AVD)  
V
V
IT+(LVD)  
t
VOLTAGE RISE TIME  
rv  
IT-(LVD)  
1
1
AVDF bit  
0
RESET VALUE  
0
AVD INTERRUPT  
REQUEST  
IF AVDIE bit = 1  
INTERRUPT PROCESS  
INTERRUPT PROCESS  
LVD RESET  
25/172  
ST72260Gx, ST72262Gx, ST72264Gx  
SYSTEM INTEGRITY MANAGEMENT (Cont’d)  
6.4.3 Low Power Modes  
set and the interrupt mask in the CC register is re-  
set (RIM instruction).  
Mode  
Description  
Enable Exit  
Control from  
Exit  
from  
Halt  
No effect on SI. AVD interrupts cause the  
device to exit from Wait mode.  
Event  
Flag  
WAIT  
HALT  
Interrupt Event  
Bit  
Wait  
The SICSR register is frozen.  
AVD event  
AVDF AVDIE  
Yes  
No  
6.4.3.1 Interrupts  
The AVD interrupt event generates an interrupt if  
the corresponding Enable Control Bit (AVDIE) is  
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ST72260Gx, ST72262Gx, ST72264Gx  
SYSTEM INTEGRITY MANAGEMENT (Cont’d)  
6.4.4 Register Description  
SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)  
Read/Write  
WDGRF flag description for more details. When  
the LVD is disabled by OPTION BYTE, the LVDRF  
bit value is undefined.  
Reset Value: 000x 000x (00h)  
7
0
Bit 3:1 = Reserved, must be kept cleared.  
AVD AVD LVD  
WDG  
RF  
0
0
0
0
IE  
F
RF  
Bit 0 = WDGRF Watchdog reset flag  
This bit indicates that the last Reset was generat-  
ed by the Watchdog peripheral. It is set by hard-  
ware (watchdog reset) and cleared by software  
(writing zero) or an LVD Reset (to ensure a stable  
cleared state of the WDGRF flag when CPU  
starts).  
Bit 7 = Reserved, always read as 0.  
Bit 6 = AVDIE Voltage Detector interrupt enable  
This bit is set and cleared by software. It enables  
an interrupt to be generated when the AVDF flag  
changes (toggles). The pending interrupt informa-  
tion is automatically cleared when software enters  
the AVD interrupt routine.  
Combined with the LVDRF flag information, the  
flag description is given by the following table.  
RESET Sources  
LVDRF WDGRF  
0: AVD interrupt disabled  
1: AVD interrupt enabled  
External RESET pin  
Watchdog  
0
0
1
0
1
LVD  
X
Bit 5 = AVDF Voltage Detector flag  
This read-only bit is set and cleared by hardware.  
If the AVDIE bit is set, an interrupt request is gen-  
erated when the AVDF bit changes value.  
Application Notes  
0: V over V  
threshold  
threshold  
IT-(AVD)  
DD  
DD  
IT+(AVD)  
The LVDRF flag is not cleared when another RE-  
SET type occurs (external or watchdog), the  
LVDRF flag remains set to keep trace of the origi-  
nal failure. In this case, a watchdog reset can be  
detected by software while an external reset can  
not.  
1: V under V  
Bit 4 = LVDRF LVD reset flag  
This bit indicates that the last Reset was generat-  
ed by the LVD block. It is set by hardware (LVD re-  
set) and cleared by software (writing zero). See  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
SICSR  
Reset Value  
AVDIE  
0
AVDF  
0
LVDRF  
x
WDGRF  
x
0025h  
0
0
0
0
27/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
7 INTERRUPTS  
7.1 INTRODUCTION  
When an interrupt request has to be serviced:  
– Normal processing is suspended at the end of  
the current instruction execution.  
– The PC, X, A and CC registers are saved onto  
the stack.  
– I1 and I0 bits of CC register are set according to  
the corresponding values in the ISPRx registers  
of the serviced interrupt vector.  
– The PC is then loaded with the interrupt vector of  
the interrupt to service and the first instruction of  
the interrupt service routine is fetched (refer to  
“Interrupt Mapping” table for vector addresses).  
The ST7 enhanced interrupt management pro-  
vides the following features:  
Hardware interrupts  
Software interrupt (TRAP)  
Nested or concurrent interrupt management  
with flexible interrupt priority and level  
management:  
– Up to 4 software programmable nesting levels  
– Up to 16 interrupt vectors fixed by hardware  
– 2 non-maskable events: RESET and TRAP  
This interrupt management is based on:  
The interrupt service routine should end with the  
IRET instruction which causes the contents of the  
saved registers to be recovered from the stack.  
– Bit 5 and bit 3 of the CPU CC register (I1:0),  
– Interrupt software priority registers (ISPRx),  
– Fixed interrupt vector addresses located at the  
high addresses of the memory map (FFE0h to  
FFFFh) sorted by hardware priority order.  
Note: As a consequence of the IRET instruction,  
the I1 and I0 bits will be restored from the stack  
and the program in the previous level will resume.  
This enhanced interrupt controller guarantees full  
upward compatibility with the standard (not nest-  
ed) ST7 interrupt controller.  
Table 4. Interrupt Software Priority Levels  
Interrupt software priority Level  
I1  
1
I0  
0
Level 0 (main)  
Level 1  
Low  
7.2 MASKING AND PROCESSING FLOW  
0
1
Level 2  
0
0
The interrupt masking is managed by the I1 and I0  
bits of the CC register and the ISPRx registers  
which give the interrupt software priority level of  
each interrupt vector (see Table 4). The process-  
ing flow is shown in Figure 16  
Level 3 (= interrupt disable)  
High  
1
1
Figure 16. Interrupt Processing Flowchart  
PENDING  
INTERRUPT  
Y
RESET  
Interrupt has the same or a  
lower software priority  
than current one  
N
I1:0  
FETCH NEXT  
INSTRUCTION  
THE INTERRUPT  
STAYS PENDING  
Y
“IRET”  
N
RESTORE PC, X, A, CC  
FROM STACK  
EXECUTE  
INSTRUCTION  
STACK PC, X, A, CC  
LOAD I1:0 FROM INTERRUPT SW REG.  
LOAD PC FROM INTERRUPT VECTOR  
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INTERRUPTS (Cont’d)  
Servicing Pending Interrupts  
3). These sources allow the processor to exit  
HALT mode.  
TRAP (Non Maskable Software Interrupt)  
As several interrupts can be pending at the same  
time, the interrupt to be taken into account is deter-  
mined by the following two-step process:  
This software interrupt is serviced when the TRAP  
instruction is executed. It will be serviced accord-  
ing to the flowchart on Figure 16 as a TLI.  
– the highest software priority interrupt is serviced,  
– if several interrupts have the same software pri-  
ority then the interrupt with the highest hardware  
priority is serviced first.  
RESET  
The RESET source has the highest priority in the  
ST7. This means that the first current routine has  
the highest software priority (level 3) and the high-  
est hardware priority.  
Figure 17 describes this decision process.  
Figure 17. Priority Decision Process  
See the RESET chapter for more details.  
PENDING  
INTERRUPTS  
Maskable Sources  
Maskable interrupt vector sources can be serviced  
if the corresponding interrupt is enabled and if its  
own interrupt software priority (in ISPRx registers)  
is higher than the one currently being serviced (I1  
and I0 in CC register). If any of these two condi-  
tions is false, the interrupt is latched and thus re-  
mains pending.  
Different  
Same  
SOFTWARE  
PRIORITY  
External Interrupts  
HIGHEST SOFTWARE  
PRIORITY SERVICED  
External interrupts allow the processor to exit from  
HALT low power mode.  
External interrupt sensitivity is software selectable  
through the Miscellaneous registers (MISCRx).  
External interrupt triggered on edge will be latched  
and the interrupt request automatically cleared  
upon entering the interrupt service routine.  
If several input pins of a group connected to the  
same interrupt vector request an interrupt simulta-  
neously, the interrupt vector will be serviced. Soft-  
ware can read the pin levels to identify which  
pin(s) are the source of the interrupt.  
HIGHEST HARDWARE  
PRIORITY SERVICED  
When an interrupt request is not serviced immedi-  
ately, it is latched and then processed when its  
software priority combined with the hardware pri-  
ority becomes the highest one.  
Note 1: The hardware priority is exclusive while  
the software one is not. This allows the previous  
process to succeed with only one interrupt.  
Note 2: RESET and TRAP are non-maskable and  
they can be considered as having the highest soft-  
ware priority in the decision process.  
If several input pins are selected simultaneously  
as interrupt source, these are logically NANDed.  
For this reason if one of the interrupt pins is tied  
low, it masks the other ones.  
Peripheral Interrupts  
Usually the peripheral interrupts cause the MCU to  
exit from HALT mode except those mentioned in  
the “Interrupt Mapping” table.  
A peripheral interrupt occurs when a specific flag  
is set in the peripheral status registers and if the  
corresponding enable bit is set in the peripheral  
control register.  
The general sequence for clearing an interrupt is  
based on an access to the status register followed  
by a read or write to an associated register.  
Note: The clearing sequence resets the internal  
latch. A pending interrupt (i.e. waiting for being  
serviced) will therefore be lost if the clear se-  
quence is executed.  
Different Interrupt Vector Sources  
Two interrupt source types are managed by the  
ST7 interrupt controller: the non-maskable type  
(RESET and TRAP) and the maskable type (exter-  
nal or from internal peripherals).  
Non-Maskable Sources  
These sources are processed regardless of the  
state of the I1 and I0 bits of the CC register (see  
Figure 16). After stacking the PC, X, A and CC  
registers (except for RESET), the corresponding  
vector is loaded in the PC register and the I1 and  
I0 bits of the CC are set to disable interrupts (level  
29/172  
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INTERRUPTS (Cont’d)  
7.3 INTERRUPTS AND LOW POWER MODES  
7.4 CONCURRENT & NESTED MANAGEMENT  
All interrupts allow the processor to exit the WAIT  
low power mode. On the contrary, only external  
and other specified interrupts allow the processor  
to exit the HALT modes (see column “Exit from  
HALT” in “Interrupt Mapping” table). When several  
pending interrupts are present while exiting HALT  
mode, the first one serviced can only be an inter-  
rupt with exit from HALT mode capability and it is  
selected through the same decision process  
shown in Figure 17.  
The following Figure 18 and Figure 19 show two  
different interrupt management modes. The first is  
called concurrent mode and does not allow an in-  
terrupt to be interrupted, unlike the nested mode in  
Figure 19. The interrupt hardware priority is given  
in this order from the lowest to the highest: MAIN,  
IT4, IT3, IT2, IT1, IT0. The software priority is giv-  
en for each interrupt.  
Warning: A stack overflow may occur without no-  
tifying the software of the failure.  
Note: If an interrupt, that is not able to Exit from  
HALT mode, is pending with the highest priority  
when exiting HALT mode, this interrupt is serviced  
after the first one serviced.  
Note: TLI (Top Level Interrupt) is not available in  
this product.  
Related Documentation  
AN1044: Multiple interrupt source management  
for ST7 MCUs  
Figure 18. Concurrent Interrupt Management  
SOFTWARE  
PRIORITY  
LEVEL  
I1  
I0  
TLI  
3
1 1  
1 1  
1 1  
1 1  
1 1  
1 1  
IT0  
3
IT1  
IT1  
3
IT2  
3
IT3  
3
RIM  
IT4  
3
MAIN  
MAIN  
3/0  
11 / 10  
10  
Figure 19. Nested Interrupt Management  
SOFTWARE  
PRIORITY  
LEVEL  
I1  
I0  
TLI  
3
1 1  
1 1  
0 0  
0 1  
1 1  
1 1  
IT0  
3
IT1  
IT1  
IT2  
2
IT2  
1
IT3  
3
RIM  
IT4  
IT4  
3
MAIN  
MAIN  
3/0  
11 / 10  
10  
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ST72260Gx, ST72262Gx, ST72264Gx  
INTERRUPTS (Cont’d)  
7.5 INTERRUPT REGISTER DESCRIPTION  
INTERRUPT SOFTWARE PRIORITY REGIS-  
TERS (ISPRX)  
CPU CC REGISTER INTERRUPT BITS  
Read/Write  
Read/Write (bits 7:4 of ISPR3 are read only)  
Reset Value: 111x 1010 (xAh)  
Reset Value: 1111 1111 (FFh)  
7
0
7
0
ISPR0  
ISPR1  
I1_3 I0_3 I1_2 I0_2 I1_1 I0_1 I1_0 I0_0  
I1_7 I0_7 I1_6 I0_6 I1_5 I0_5 I1_4 I0_4  
1
1
I1  
H
I0  
N
Z
C
Bit 5, 3 = I1, I0 Software Interrupt Priority  
These two bits indicate the current interrupt soft-  
ware priority.  
ISPR2 I1_11 I0_11 I1_10 I0_10 I1_9 I0_9 I1_8 I0_8  
Interrupt Software Priority Level  
I1  
1
I0  
0
ISPR3  
1
1
1
1
I1_13 I0_13 I1_12 I0_12  
Level 0 (main)  
Level 1  
Low  
0
1
These four registers contain the interrupt software  
priority of each interrupt vector.  
Level 2  
0
0
Level 3 (= interrupt disable*)  
High  
1
1
– Each interrupt vector (except RESET and TRAP)  
has corresponding bits in these registers where  
its own software priority is stored. This corre-  
spondance is shown in the following table.  
These two bits are set/cleared by hardware when  
entering in interrupt. The loaded value is given by  
the corresponding bits in the interrupt software pri-  
ority registers (ISPRx).  
Vector Address  
ISPRx Bits  
They can be also set/cleared by software with the  
RIM, SIM, HALT, WFI, IRET and PUSH/POP in-  
structions (see “Interrupt Dedicated Instruction  
Set” table).  
FFFBh-FFFAh  
FFF9h-FFF8h  
...  
ei0  
ei1  
...  
FFE1h-FFE0h  
Not used  
*Note: TRAP and RESET events are non maska-  
ble sources and can interrupt a level 3 program.  
– Each I1_x and I0_x bit value in the ISPRx regis-  
ters has the same meaning as the I1 and I0 bits  
in the CC register.  
– Level 0 can not be written (I1_x=1, I0_x=0). In  
this case, the previously stored value is kept. (ex-  
ample: previous=CFh, write=64h, result=44h)  
The RESET and TRAP vectors have no software  
priorities. When one is serviced, the I1 and I0 bits  
of the CC register are both set.  
Caution: If the I1_x and I0_x bits are modified  
while the interrupt x is executed the following be-  
haviour has to be considered: If the interrupt x is  
still pending (new interrupt or flag not cleared) and  
the new software priority is higher than the previ-  
ous one, the interrupt x is re-entered. Otherwise,  
the software priority stays unchanged up to the  
next interrupt request (after the IRET of the inter-  
rupt x).  
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INTERRUPTS (Cont’d)  
Table 5. Interrupt Mapping  
Exit  
from  
HALT  
Source  
Block  
Register Priority  
Address  
Vector  
N°  
Description  
Label  
Order  
RESET  
TRAP  
ei0  
Reset  
Software Interrupt  
yes  
no  
FFFEh-FFFFh  
FFFCh-FFFDh  
FFFAh-FFFBh  
FFF8h-FFF9h  
FFF6h-FFF7h  
FFF4h-FFF5h  
FFF2h-FFF3h  
FFF0h-FFF1h  
FFEEh-FFEFh  
FFECh-FFEDh  
FFEAh-FFEBh  
FFE8h-FFE9h  
FFE6h-FFE7h  
FFE4h-FFE5h  
FFE2h-FFE3h  
FFE0h-FFE1h  
Highest  
Priority  
N/A  
1
0
1
External Interrupt Port A7..0 (C5..0 )  
yes  
1
ei1  
External Interrupt Port B7..0 (C5..0 )  
2
Not used  
3
SPI  
TIMER A  
MCC  
SPI Peripheral Interrupts  
TIMER A Peripheral Interrupts  
Time base interrupt  
TIMER B Peripheral Interrupts  
Auxiliary Voltage Detector interrupt  
Not used  
SPISR  
TASR  
yes  
no  
4
5
MCCSR  
TBSR  
yes  
6
TIMER B  
AVD  
no  
7
SICSR  
8
9
Not used  
10  
11  
12  
13  
SCI  
SCI Peripheral Interrupt  
SCISR  
no  
no  
2
2
I C  
I C Peripheral Interrupt  
I2CSRx  
Not Used  
Not Used  
Lowest  
Priority  
Note 1. Configurable by option byte.  
Table 6. Nested Interrupts Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
SPI  
Not Used  
EI1  
EI0  
001Ch  
001Dh  
001Eh  
001Fh  
ISPR0  
Reset Value  
I1_3  
1
I0_3  
1
I1_2  
1
I0_2  
1
I1_1  
1
I0_1  
1
I1_0  
1
I0_0  
1
AVD  
TIMERB  
MCC  
TIMERA  
ISPR1  
Reset Value  
I1_7  
1
I0_7  
1
I1_6  
1
I0_6  
1
I1_5  
1
I0_5  
1
I1_4  
1
I0_4  
1
2
I C  
SCI  
Not Used  
Not Used  
ISPR2  
Reset Value  
I1_11  
1
I0_11  
1
I1_10  
1
I0_10  
1
I1_9  
1
I0_9  
1
I1_8  
1
I0_8  
1
Not Used  
Not Used  
ISPR3  
Reset Value  
I1_13  
1
I0_13  
1
I1_12  
1
I0_12  
1
1
1
1
1
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8 POWER SAVING MODES  
8.1 INTRODUCTION  
8.2 SLOW MODE  
To give a large measure of flexibility to the applica-  
tion in terms of power consumption, three main  
power saving modes are implemented in the ST7  
(see Figure 20).  
This mode has two targets:  
– To reduce power consumption by decreasing the  
internal clock in the device,  
– To adapt the internal clock frequency (f  
the available supply voltage.  
) to  
CPU  
After a RESET the normal operating mode is se-  
lected by default (RUN mode). This mode drives  
the device (CPU and embedded peripherals) by  
means of a master clock which is based on the  
SLOW mode is controlled by three bits in the  
MISR1 register: the SMS bit which enables or dis-  
ables Slow mode and two CPx bits which select  
main oscillator frequency divided by 2 (f  
).  
CPU  
the internal slow frequency (f  
).  
CPU  
From Run mode, the different power saving  
modes may be selected by setting the relevant  
register bits or by calling the specific ST7 software  
instruction whose action depends on the oscillator  
status.  
In this mode, the oscillator frequency can be divid-  
ed by 4, 8, 16 or 32 instead of 2 in normal operat-  
ing mode. The CPU and peripherals are clocked at  
this lower frequency.  
Note: SLOW-WAIT mode is activated when enter-  
ring the WAIT mode while the device is already in  
SLOW mode.  
Figure 20. Power Saving Mode Transitions  
High  
RUN  
Figure 21. SLOW Mode Clock Transitions  
f
/2  
f
/4  
f
OSC2  
OSC2  
OSC2  
f
CPU  
SLOW  
WAIT  
f
OSC2  
00  
01  
CP1:0  
SMS  
SLOW WAIT  
HALT  
NORMAL RUN MODE  
REQUEST  
NEW SLOW  
FREQUENCY  
REQUEST  
Low  
POWER CONSUMPTION  
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POWER SAVING MODES (Cont’d)  
8.3 WAIT MODE  
Figure 22. WAIT Mode Flowchart  
WAIT mode places the MCU in a low power con-  
sumption mode by stopping the CPU.  
OSCILLATOR  
PERIPHERALS  
CPU  
I[1:0] BITS  
ON  
ON  
OFF  
0
WFI INSTRUCTION  
This power saving mode is selected by calling the  
“WFI” ST7 software instruction.  
All peripherals remain active. During WAIT mode,  
‘10b’  
the I [1:0] bits in the CC register are forced to  
,
to enable all interrupts. All other registers and  
memory remain unchanged. The MCU remains in  
WAIT mode until an interrupt or Reset occurs,  
whereupon the Program Counter branches to the  
starting address of the interrupt or Reset service  
routine.  
N
RESET  
Y
N
INTERRUPT  
The MCU will remain in WAIT mode until a Reset  
or an Interrupt occurs, causing it to wake up.  
Y
OSCILLATOR  
PERIPHERALS  
CPU  
I[1:0] BITS  
ON  
OFF  
ON  
1
Refer to Figure 22.  
4096 CPU CLOCK CYCLE  
DELAY  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
ON  
ON  
1)  
I[1:0] BITS  
XX  
FETCH RESET VECTOR  
OR SERVICE INTERRUPT  
Note:  
1. Before servicing an interrupt, the CC register is  
pushed on the stack. The I[1:0] bits in the CC reg-  
ister are set during the interrupt routine and  
cleared when the CC register is popped.  
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ST72260Gx, ST72262Gx, ST72264Gx  
Figure 23. ACTIVE-HALT Timing Overview  
8.4 ACTIVE-HALT AND HALT MODES  
ACTIVE-HALT and HALT modes are the two low-  
est power consumption modes of the MCU. They  
are both entered by executing the ‘HALT’ instruc-  
tion. The decision to enter either in ACTIVE-HALT  
or HALT mode is given by the MCC/RTC interrupt  
enable flag (OIE bit in MCCSR register).  
ACTIVE  
HALT  
4096 CPU  
CYCLE DELAY  
RUN  
RUN  
1)  
RESET  
OR  
INTERRUPT  
HALT  
INSTRUCTION  
[MCCSR.OIE=1]  
FETCH  
VECTOR  
MCCSR Power Saving Mode entered when HALT  
OIE bit  
instruction is executed  
HALT mode  
ACTIVE-HALT mode  
Figure 24. ACTIVE-HALT Mode Flowchart  
0
1
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
OFF  
OFF  
10  
2)  
HALT INSTRUCTION  
(MCCSR.OIE=1)  
8.4.1 ACTIVE-HALT MODE  
I[1:0] BITS  
ACTIVE-HALT mode is the lowest power con-  
sumption mode of the MCU with a real time clock  
available. It is entered by executing the ‘HALT’ in-  
struction when the OIE bit of the Main Clock Con-  
troller Status register (MCCSR) is set.  
N
RESET  
N
Y
INTERRUPT 3)  
The MCU can exit ACTIVE-HALT mode on recep-  
tion of either an MCC/RTC interrupt, a specific in-  
terrupt (see Table 5, “Interrupt Mapping,” on page  
32) or a RESET. When exiting ACTIVE-HALT  
mode by means of an interrupt, no 4096 CPU cy-  
cle delay occurs. The CPU resumes operation by  
servicing the interrupt or by fetching the reset vec-  
tor which woke it up (see Figure 24).  
When entering ACTIVE-HALT mode, the I[1:0] bits  
in the CC register are forced to ‘10b’ to enable in-  
terrupts. Therefore, if an interrupt is pending, the  
MCU wakes up immediately.  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
OFF  
ON  
Y
I[1:0] BITS  
XX 4)  
4096 CPU CLOCK  
CYCLE DELAY  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
ON  
ON  
I[1:0] BITS  
XX 4)  
In ACTIVE-HALT mode, only the main oscillator  
and its associated counter (MCC/RTC) are run-  
ning to keep a wake-up time base. All other periph-  
erals are not clocked except those which get their  
clock supply from another clock generator (such  
as external or auxiliary oscillator).  
FETCH RESET VECTOR  
OR SERVICE INTERRUPT  
Notes:  
The safeguard against staying locked in ACTIVE-  
HALT mode is provided by the oscillator interrupt.  
1. This delay occurs only if the MCU exits ACTIVE-  
HALT mode by means of a RESET.  
2. Peripheral clocked with an external clock source  
Note: As soon as the interrupt capability of one of  
the oscillators is selected (MCCSR.OIE bit set),  
entering ACTIVE-HALT mode while the Watchdog  
is active does not generate a RESET.  
This means that the device cannot spend more  
than a defined delay in this power saving mode.  
can still be active.  
3. Only the MCC/RTC interrupt and some specific  
interrupts can exit the MCU from ACTIVE-HALT  
mode (such as external interrupt). Refer to Table  
5, “Interrupt Mapping,” on page 32 for more details.  
4. Before servicing an interrupt, the CC register is  
pushed on the stack. The I[1:0] bits of the CC reg-  
ister are set to the current software priority level of  
the interrupt routine and restored when the CC  
register is popped.  
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POWER SAVING MODES (Cont’d)  
8.5 HALT MODE  
Figure 26. HALT Mode Flowchart  
The HALT mode is the lowest power consumption  
mode of the MCU. It is entered by executing the  
ST7 HALT instruction (see Figure 26).  
HALT INSTRUCTION  
ENABLE  
The MCU can exit HALT mode on reception of ei-  
ther a specific interrupt (see Table 5, “Interrupt  
Mapping,” on page 32) or a RESET. When exiting  
HALT mode by means of a RESET or an interrupt,  
the oscillator is immediately turned on and the  
4096 CPU cycle delay is used to stabilize the os-  
cillator. After the start up delay, the CPU resumes  
operation by servicing the interrupt or by fetching  
the reset vector which woke it up (see Figure 25).  
When entering HALT mode, the I[1:0] bits in the  
CC register are forced to ‘10b’ to enable interrupts.  
Therefore, if an interrupt is pending, the MCU  
wakes immediately.  
WATCHDOG  
0
DISABLE  
WDGHALT 1)  
1
WATCHDOG  
RESET  
OSCILLATOR  
OFF  
PERIPHERALS 2)  
CPU  
OFF  
OFF  
0
I[1:0] BITS  
N
RESET  
In the HALT mode the main oscillator is turned off  
causing all internal processing to be stopped, in-  
cluding the operation of the on-chip peripherals.  
All peripherals are not clocked except the ones  
which get their clock supply from another clock  
generator (such as an external or auxiliary oscilla-  
tor).  
Y
N
INTERRUPT 3)  
OSCILLATOR  
PERIPHERALS  
CPU  
Y
ON  
OFF  
ON  
1
The compatibility of Watchdog operation with  
HALT mode is configured by the “WDGHALT” op-  
tion bit of the option byte. The HALT instruction  
when executed while the Watchdog system is en-  
abled, can generate a Watchdog RESET (see  
Section 15.1 "OPTION BYTES" on page 162 for  
more details).  
I[1:0] BITS  
4096 CPU CLOCK CYCLE  
DELAY  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
ON  
Figure 25. HALT Mode Timing Overview  
ON  
I[1:0] BITS  
XX 4)  
4096 CPU CYCLE  
RUN  
HALT  
RUN  
DELAY  
FETCH RESET VECTOR  
OR SERVICE INTERRUPT  
Notes:  
HALT  
INSTRUCTION  
1. WDGHALT is an option bit. See option byte sec-  
tion for more details.  
2. Peripheral clocked with an external clock source  
can still be active.  
3. Only some specific interrupts can exit the MCU  
from HALT mode (such as external interrupt). Re-  
fer to Table 5, “Interrupt Mapping,” on page 32 for  
more details.  
RESET  
OR  
INTERRUPT  
FETCH  
VECTOR  
4. Before servicing an interrupt, the CC register is  
pushed on the stack. The I[1:0] bits in the CC reg-  
ister are set during the interrupt routine and  
cleared when the CC register is popped.  
36/172  
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POWER SAVING MODES (Cont’d)  
8.5.0.1 Halt Mode Recommendations  
ry. For example, avoid defining a constant in  
ROM with the value 0x8E.  
– Make sure that an external event is available to  
wake up the microcontroller from Halt mode.  
– As the HALT instruction clears the interrupt mask  
in the CC register to allow interrupts, the user  
may choose to clear all pending interrupt bits be-  
fore executing the HALT instruction. This avoids  
entering other peripheral interrupt routines after  
executing the external interrupt routine corre-  
sponding to the wake-up event (reset or external  
interrupt).  
– When using an external interrupt to wake up the  
microcontroller, reinitialize the corresponding I/O  
as “Input Pull-up with Interrupt” before executing  
the HALT instruction. The main reason for this is  
that the I/O may be wrongly configured due to ex-  
ternal interference or by an unforeseen logical  
condition.  
Related Documentation  
– For the same reason, reinitialize the level sensi-  
tiveness of each external interrupt as a precau-  
tionary measure.  
AN 980: ST7 Keypad Decoding Techniques, Im-  
plementing Wake-Up on Keystroke  
– The opcode for the HALT instruction is 0x8E. To  
avoid an unexpected HALT instruction due to a  
program counter failure, it is advised to clear all  
occurrences of the data value 0x8E from memo-  
AN1014: How to Minimize the ST7 Power Con-  
sumption  
AN1605: Using an active RC to wakeup the  
ST7LITE0 from power saving mode  
37/172  
ST72260Gx, ST72262Gx, ST72264Gx  
9 I/O PORTS  
9.1 INTRODUCTION  
If several I/O interrupt pins on the same interrupt  
vector are selected simultaneously, they are logi-  
cally combined. For this reason if one of the inter-  
rupt pins is tied low, it may mask the others.  
The I/O ports allow data transfer. An I/O port can  
contain up to 8 pins. Each pin can be programmed  
independently either as a digital input or digital  
output. In addition, specific pins may have several  
other functions. These functions can include exter-  
nal interrupt, alternate signal input/output for on-  
chip peripherals or analog input.  
External interrupts are hardware interrupts. Fetch-  
ing the corresponding interrupt vector automatical-  
ly clears the request latch. Modifying the sensitivity  
bits will clear any pending interrupts.  
9.2.2 Output Modes  
9.2 FUNCTIONAL DESCRIPTION  
Setting the DDRx bit selects output mode. Writing  
to the DR bits applies a digital value to the I/O  
through the latch. Reading the DR bits returns the  
previously stored value.  
A Data Register (DR) and a Data Direction Regis-  
ter (DDR) are always associated with each port.  
The Option Register (OR), which allows input/out-  
put options, may or may not be implemented. The  
following description takes into account the OR  
register. Refer to the Port Configuration table for  
device specific information.  
If an OR bit is available, different output modes  
can be selected by software: push-pull or open-  
drain. Refer to I/O Port Implementation section for  
configuration.  
DR Value and Output Pin Status  
An I/O pin is programmed using the corresponding  
bits in the DDR, DR and OR registers: bit x corre-  
sponding to pin x of the port.  
DR  
Push-Pull  
Open-Drain  
0
1
V
V
OL  
Floating  
OL  
Figure 27 shows the generic I/O block diagram.  
V
OH  
9.2.1 Input Modes  
9.2.3 Alternate Functions  
Clearing the DDRx bit selects input mode. In this  
mode, reading its DR bit returns the digital value  
from that I/O pin.  
Many ST7s I/Os have one or more alternate func-  
tions. These may include output signals from, or  
input signals to, on-chip peripherals. The Device  
Pin Description table describes which peripheral  
signals can be input/output to which ports.  
If an OR bit is available, different input modes can  
be configured by software: floating or pull-up. Re-  
fer to I/O Port Implementation section for configu-  
ration.  
A signal coming from an on-chip peripheral can be  
output on an I/O. To do this, enable the on-chip  
peripheral as an output (enable bit in the peripher-  
al’s control register). The peripheral configures the  
I/O as an output and takes priority over standard I/  
O programming. The I/O’s state is readable by ad-  
dressing the corresponding I/O data register.  
Notes:  
1. Writing to the DR modifies the latch value but  
does not change the state of the input pin.  
2. Do not use read/modify/write instructions  
(BSET/BRES) to modify the DR register.  
External Interrupt Function  
Configuring an I/O as floating enables alternate  
function input. It is not recommended to configure  
an I/O as pull-up as this will increase current con-  
sumption. Before using an I/O as an alternate in-  
put, configure it without interrupt. Otherwise spuri-  
ous interrupts can occur.  
Depending on the device, setting the ORx bit while  
in input mode can configure an I/O as an input with  
interrupt. In this configuration, a signal edge or lev-  
el input on the I/O generates an interrupt request  
via the corresponding interrupt vector (eix).  
Falling or rising edge sensitivity is programmed in-  
dependently for each interrupt vector. The Exter-  
nal Interrupt Control Register (EICR) or the Miscel-  
laneous Register controls this sensitivity, depend-  
ing on the device.  
Configure an I/O as input floating for an on-chip  
peripheral signal which can be input and output.  
Caution:  
I/Os which can be configured as both an analog  
and digital alternate function need special atten-  
tion. The user must control the peripherals so that  
the signals do not arrive at the same time on the  
same pin. If an external clock is used, only the  
clock alternate function should be employed on  
that I/O pin and not the other alternate function.  
A device may have up to 7 external interrupts.  
Several pins may be tied to one external interrupt  
vector. Refer to Pin Description to see which ports  
have external interrupts.  
38/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORTS (Cont’d)  
Figure 27. I/O Port General Block Diagram  
ALTERNATE  
OUTPUT  
From on-chip peripheral  
1
0
REGISTER  
ACCESS  
P-BUFFER  
(see table below)  
V
DD  
ALTERNATE  
ENABLE  
BIT  
PULL-UP  
(see table below)  
DR  
V
DD  
DDR  
OR  
PULL-UP  
CONDITION  
PAD  
If implemented  
OR SEL  
DDR SEL  
DR SEL  
N-BUFFER  
DIODES  
(see table below)  
ANALOG  
INPUT  
CMOS  
SCHMITT  
TRIGGER  
1
0
ALTERNATE  
INPUT  
To on-chip peripheral  
EXTERNAL  
INTERRUPT  
REQUEST (ei )  
Combinational  
Logic  
FROM  
OTHER  
BITS  
x
SENSITIVITY  
SELECTION  
Note: Refer to the Port Configuration  
table for device specific information.  
Table 7. I/O Port Mode Options  
Configuration Mode  
Diodes  
Pull-Up  
P-Buffer  
to V  
to V  
SS  
DD  
Floating with/without Interrupt  
Input  
Off  
On  
Off  
Pull-up with/without Interrupt  
On  
Push-pull  
On  
Off  
NI  
On  
Off  
NI  
Output  
Open Drain (logic level)  
True Open Drain  
NI (see note)  
Legend:NI - not implemented  
Off - implemented not activated  
On - implemented and activated  
Note: The diode to V is not implemented in the  
DD  
true open drain pads. A local protection between  
the pad and V is implemented to protect the de-  
OL  
vice against positive stress.  
39/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORTS (Cont’d)  
Table 8. I/O Configurations  
Hardware Configuration  
DR REGISTER ACCESS  
V
DD  
NOTE 3  
PULL-UP  
CONDITION  
R
W
R
PU  
DR  
REGISTER  
DATA BUS  
PAD  
ALTERNATE INPUT  
To on-chip peripheral  
FROM  
OTHER  
PINS  
EXTERNAL INTERRUPT  
SOURCE (ei )  
x
COMBINATIONAL  
LOGIC  
INTERRUPT  
CONDITION  
POLARITY  
SELECTION  
ANALOG INPUT  
V
NOTE 3  
DD  
DR REGISTER ACCESS  
R
PU  
PAD  
R/W  
DR  
REGISTER  
DATA BUS  
DR REGISTER ACCESS  
NOTE 3  
V
DD  
R
PU  
R/W  
DR  
REGISTER  
DATA BUS  
PAD  
ALTERNATE  
ENABLE  
BIT  
ALTERNATE  
OUTPUT  
From on-chip peripheral  
Notes:  
1. When the I/O port is in input configuration and the associated alternate function is enabled as an output,  
reading the DR register will read the alternate function output status.  
2. When the I/O port is in output configuration and the associated alternate function is enabled as an input,  
the alternate function reads the pin status given by the DR register content.  
3. For true open drain, these elements are not implemented.  
40/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORTS (Cont’d)  
Analog alternate function  
9.4 UNUSED I/O PINS  
Configure the I/O as floating input to use an ADC  
input. The analog multiplexer (controlled by the  
ADC registers) switches the analog voltage  
present on the selected pin to the common analog  
rail, connected to the ADC input.  
Unused I/O pins must be connected to fixed volt-  
age levels. Refer to Section 13.8.  
9.5 LOW POWER MODES  
Analog Recommendations  
Mode  
WAIT  
HALT  
Description  
Do not change the voltage level or loading on any  
I/O while conversion is in progress. Do not have  
clocking pins located close to a selected analog  
pin.  
No effect on I/O ports. External interrupts  
cause the device to exit from WAIT mode.  
No effect on I/O ports. External interrupts  
cause the device to exit from HALT mode.  
WARNING: The analog input voltage level must  
be within the limits stated in the absolute maxi-  
mum ratings.  
9.6 INTERRUPTS  
The external interrupt event generates an interrupt  
if the corresponding configuration is selected with  
DDR and OR registers and if the I bit in the CC  
register is cleared (RIM instruction).  
9.3 I/O PORT IMPLEMENTATION  
The hardware implementation on each I/O port de-  
pends on the settings in the DDR and OR registers  
and specific I/O port features such as ADC input or  
open drain.  
Enable Exit  
Control from  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Bit  
Wait  
Switching these I/O ports from one state to anoth-  
er should be done in a sequence that prevents un-  
wanted side effects. Recommended safe transi-  
tions are illustrated in Figure 28. Other transitions  
are potentially risky and should be avoided, since  
they may present unwanted side-effects such as  
spurious interrupt generation.  
External interrupt on  
selected external  
event  
DDRx  
ORx  
-
Yes  
Yes  
Related Documentation  
AN 970: SPI Communication between ST7 and  
EEPROM  
Figure 28. Interrupt I/O Port State Transitions  
AN1045: S/W implementation of I2C bus master  
AN1048: Software LCD driver  
01  
00  
10  
11  
INPUT  
floating/pull-up  
interrupt  
INPUT  
floating  
(reset state)  
OUTPUT  
open-drain  
OUTPUT  
push-pull  
= DDR, OR  
XX  
41/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORTS (Cont’d)  
9.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION  
The I/O port register configurations are summa-  
rised as follows.  
True Open Drain Interrupt Ports  
PA6, PA4 (without pull-up)  
Interrupt Ports  
MODE  
DDR  
OR  
PA7, PA5, PA3:0, PB7:0, PC5:0 (with pull-up)  
floating input  
0
0
1
0
1
X
MODE  
DDR  
OR  
floating interrupt input  
open drain (high sink ports)  
floating input  
0
0
1
1
0
1
0
1
pull-up interrupt input  
open drain output  
push-pull output  
Table 9. Port Configuration  
Input (DDR = 0)  
Output (DDR = 1)  
Port  
Pin Name  
PA7  
OR = 0  
OR = 1  
OR = 0  
OR = 1  
High-Sink  
floating  
floating  
floating  
floating  
floating  
floating  
floating  
pull-up interrupt  
floating interrupt  
pull-up interrupt  
floating interrupt  
pull-up interrupt  
pull-up interrupt  
pull-up interrupt  
open drain  
push-pull  
PA6  
true open-drain  
Port A  
PA5  
open drain  
push-pull  
Yes  
PA4  
true open-drain  
PA3:0  
PB7:0  
PC5:0  
open drain  
open drain  
open drain  
push-pull  
push-pull  
push-pull  
Port B  
Port C  
No  
42/172  
ST72260Gx, ST72262Gx, ST72264Gx  
OPTION REGISTER (OR)  
I/O PORTS (Cont’d)  
9.8 I/O PORT REGISTER DESCRIPTION  
DATA REGISTER (DR)  
Port x Option Register  
PxOR with x = A, B or C.  
Port x Data Register  
PxDR with x = A, B or C.  
Read/Write  
Reset Value: 0000 0000 (00h)  
Read/Write  
Reset Value: 0000 0000 (00h)  
7
0
7
0
O7  
O6  
O5  
O4  
O3  
O2  
O1  
O0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Bits 7:0 = O[7:0] Option register 8 bits.  
For specific I/O pins, this register is not implement-  
ed. In this case the DDR register is enough to se-  
lect the I/O pin configuration.  
Bits 7:0 = D[7:0] Data register 8 bits.  
The DR register has a specific behaviour accord-  
ing to the selected input/output configuration. Writ-  
ing the DR register is always taken into account  
even if the pin is configured as an input; this allows  
always having the expected level on the pin when  
toggling to output mode. Reading the DR register  
returns either the DR register latch content (pin  
configured as output) or the digital value applied to  
the I/O pin (pin configured as input).  
The OR register allows to distinguish: in input  
mode if the pull-up with interrupt capability or the  
basic pull-up configuration is selected, in output  
mode if the push-pull or open drain configuration is  
selected.  
Each bit is set and cleared by software.  
Input mode:  
0: Floating input  
1: Pull-up input with or without interrupt  
DATA DIRECTION REGISTER (DDR)  
Port x Data Direction Register  
PxDDR with x = A, B or C.  
Output mode:  
0: Output open drain (with P-Buffer unactivated)  
1: Output push-pull (when available)  
Read/Write  
Reset Value: 0000 0000 (00h)  
7
0
DD7  
DD6  
DD5  
DD4  
DD3  
DD2  
DD1  
DD0  
Bits 7:0 = DD[7:0] Data direction register 8 bits.  
The DDR register gives the input/output direction  
configuration of the pins. Each bit is set and  
cleared by software.  
0: Input mode  
1: Output mode  
43/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORTS (Cont’d)  
Table 10. I/O Port Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
Reset Value  
of all I/O port registers  
0
0
0
0
0
0
0
0
0000h  
0001h  
0002h  
0004h  
0005h  
0006h  
0008h  
0009h  
000Ah  
PCDR  
PCDDR  
PCOR  
PBDR  
PBDDR  
PBOR  
PADR  
PADDR  
PAOR  
MSB  
MSB  
MSB  
LSB  
LSB  
LSB  
44/172  
ST72260Gx, ST72262Gx, ST72264Gx  
10 MISCELLANEOUS REGISTERS  
The miscellaneous registers allow control over  
several different features such as the external in-  
terrupts or the I/O alternate functions.  
Figure 29. Ext. Interrupt Sensitivity (EXTIT=0)  
MISCR1  
IS00 IS01  
PA7  
ei0  
10.1 I/O PORT INTERRUPT SENSITIVITY  
INTERRUPT  
SOURCE  
The external interrupt sensitivity is controlled by  
the ISxx bits of the Miscellaneous register and the  
OPTION BYTE. This control allows you to have  
two fully independent external interrupt source  
sensitivities with configurable sources (using the  
EXTIT option bit) as shown in Figure 29 and Fig-  
ure 30.  
SENSITIVITY  
CONTROL  
PA0  
PC5  
PC0  
MISCR1  
IS10  
IS11  
ei1  
Each external interrupt source can be generated  
on four different events on the pin:  
Falling edge  
PB7  
PB0  
INTERRUPT  
SOURCE  
SENSITIVITY  
CONTROL  
Rising edge  
Falling and rising edge  
Falling edge and low level  
To guarantee correct functionality, the sensitivity  
bits in the MISCR1 register must be modified only  
when the I[1:0] bits in the CC register are set to 1  
(interrupt masked). See Section 9.8 "I/O PORT  
REGISTER DESCRIPTION" on page 43 and Sec-  
tion 10.3 "MISCELLANEOUS REGISTER DE-  
SCRIPTION" on page 46 for more details on the  
programming.  
Figure 30. Ext. Interrupt Sensitivity (EXTIT=1)  
MISCR1  
IS00  
IS01  
ei0  
PA7  
INTERRUPT  
SOURCE  
SENSITIVITY  
CONTROL  
PA0  
PB7  
10.2 I/O PORT ALTERNATE FUNCTIONS  
MISCR1  
The MISCR registers manage four I/O port miscel-  
laneous alternate functions:  
IS10  
IS11  
ei1  
INTERRUPT  
SOURCE  
SENSITIVITY  
CONTROL  
PB0  
PC5  
Main clock signal (f  
) output on PC2  
CPU  
SPI pin configuration:  
– SS pin internal control to use the PB7 I/O port  
function while the SPI is active.  
– Master output capability on the MOSI pin  
(PB4) deactivated while the SPI is active.  
PC0  
– Slave output capability on the MISO pin (PB5)  
deactivated while the SPI is active.  
These functions are described in detail in the Sec-  
tion 10.3 "MISCELLANEOUS REGISTER DE-  
SCRIPTION" on page 46.  
45/172  
ST72260Gx, ST72262Gx, ST72264Gx  
MISCELLANEOUS REGISTERS (Cont’d)  
10.3 MISCELLANEOUS REGISTER DESCRIPTION  
MISCELLANEOUS REGISTER 1 (MISCR1)  
Read/Write  
Bits 2:1 = CP[1:0] CPU clock prescaler  
These bits select the CPU clock prescaler which is  
applied in the various slow modes. Their action is  
conditioned by the setting of the SMS bit. These  
two bits are set and cleared by software  
Reset Value: 0000 0000 (00h)  
7
0
f
in SLOW mode  
CP1  
CP0  
CPU  
IS11 IS10 MCO IS01 IS00 CP1 CP0 SMS  
f
f
f
/ 2  
/ 4  
0
1
0
1
0
0
1
1
OSC2  
OSC2  
OSC2  
/ 8  
Bits 7:6 = IS1[1:0] ei1 sensitivity  
f
/ 16  
OSC2  
The interrupt sensitivity, defined using the IS1[1:0]  
bits, is applied to the ei1 external interrupts. These  
two bits can be written only when the I[1:0] bits in  
the CC register are set to 1 (interrupt masked).  
Bit 0 = SMS Slow mode select  
This bit is set and cleared by software.  
0: Normal mode. f = f  
ei1: Port B (C optional)  
OSC2  
CPU  
1: Slow mode. f  
is given by CP1, CP0  
CPU  
External Interrupt Sensitivity  
IS11 IS10  
See low power consumption mode and MCC  
chapters for more details.  
Falling edge & low level  
Rising edge only  
0
0
1
1
0
1
0
1
Falling edge only  
Rising and falling edge  
Bit 5 = MCO Main clock out selection  
This bit enables the MCO alternate function on the  
PC2 I/O port. It is set and cleared by software.  
0: MCO alternate function disabled (I/O pin free for  
general-purpose I/O)  
1: MCO alternate function enabled (f  
port)  
on I/O  
CPU  
Bits 4:3 = IS0[1:0] ei0 sensitivity  
The interrupt sensitivity, defined using the IS0[1:0]  
bits, is applied to the ei0 external interrupts. These  
two bits can be written only when the I[1:0] bits in-  
the CC register are set to 1 (interrupt masked).  
ei0: Port A (C optional)  
External Interrupt Sensitivity  
IS01 IS00  
Falling edge & low level  
Rising edge only  
0
0
1
1
0
1
0
1
Falling edge only  
Rising and falling edge  
46/172  
ST72260Gx, ST72262Gx, ST72264Gx  
MISCELLANEOUS REGISTERS (Cont’d)  
MISCELLANEOUS REGISTER 2 (MISCR2)  
Read/Write  
Reset Value: 0000 0000 (00h)  
7
0
0
0
0
0
MOD SOD SSM SSI  
Caution: This register has been provided for com-  
patibility with the ST72254 family only. The same  
bits are available in the SPICSR register. New ap-  
plications must use the SPICSR register. Do not  
use both registers, this will cause the SPI to mal-  
function.  
Bits 7:4 = Reserved always read as 0  
Bits 3 = MOD SPI Master Output Disable  
This bit is set and cleared by software. When set, it  
disables the SPI Master (MOSI) output signal.  
0: SPI Master Output enabled.  
1: SPI Master Output disabled.  
Bit 2 = SOD SPI Slave Output Disable  
This bit is set and cleared by software. When set it  
disable the SPI Slave (MISO) output signal.  
0: SPI Slave Output enabled.  
1: SPI Slave Output disabled.  
Bit 1 = SSM SS mode selection  
This bit is set and cleared by software.  
0: Normal mode - the level of the SPI SS signal is  
input from the external SS pin.  
1: I/O mode, the level of the SPI SS signal is read  
from the SSI bit.  
Bit 0 = SSI SS internal mode  
This bit replaces the SS pin of the SPI when the  
SSM bit is set to 1. (see SPI description). It is set  
and cleared by software.  
Table 11. Miscellaneous Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
MISCR1  
Reset Value  
IS11  
0
IS10  
0
MCO  
0
IS01  
0
IS00  
0
CP1  
0
CP0  
0
SMS  
0
0020h  
0040h  
MISCR2  
Reset Value  
MOD  
0
SOD  
0
SSM  
0
SSI  
0
0
0
0
0
47/172  
ST72260Gx, ST72262Gx, ST72264Gx  
11 ON-CHIP PERIPHERALS  
11.1 WATCHDOG TIMER (WDG)  
11.1.1 Introduction  
If the watchdog is activated (the WDGA bit is set)  
and when the 7-bit timer (bits T[6:0]) rolls over  
from 40h to 3Fh (T6 becomes cleared), it initiates  
a reset cycle pulling low the reset pin for typically  
500ns.  
The Watchdog timer is used to detect the occur-  
rence of a software fault, usually generated by ex-  
ternal interference or by unforeseen logical condi-  
tions, which causes the application program to  
abandon its normal sequence. The Watchdog cir-  
cuit generates an MCU reset on expiry of a pro-  
grammed time period, unless the program refresh-  
es the counter’s contents before the T6 bit be-  
comes cleared.  
The application program must write in the  
WDGCR register at regular intervals during normal  
operation to prevent an MCU reset. This down-  
counter is free-running: it counts down even if the  
watchdog is disabled. The value to be stored in the  
WDGCR register must be between FFh and C0h:  
11.1.2 Main Features  
Programmable free-running downcounter  
Programmable reset  
– The WDGA bit is set (watchdog enabled)  
– The T6 bit is set to prevent generating an imme-  
diate reset  
Reset (if watchdog activated) when the T6 bit  
– The T[5:0] bits contain the number of increments  
which represents the time delay before the  
watchdog produces a reset (see Figure 32. Ap-  
proximate Timeout Duration). The timing varies  
between a minimum and a maximum value due  
to the unknown status of the prescaler when writ-  
ing to the WDGCR register (see Figure 33).  
reaches zero  
Optional  
reset  
on  
HALT  
instruction  
(configurable by option byte)  
Hardware Watchdog selectable by option byte  
11.1.3 Functional Description  
Following a reset, the watchdog is disabled. Once  
activated it cannot be disabled, except by a reset.  
The counter value stored in the Watchdog Control  
register (WDGCR bits T[6:0]), is decremented  
every 16384 f  
cycles (approx.), and the  
The T6 bit can be used to generate a software re-  
set (the WDGA bit is set and the T6 bit is cleared).  
OSC2  
length of the timeout period can be programmed  
by the user in 64 increments.  
If the watchdog is activated, the HALT instruction  
will generate a Reset.  
Figure 31. Watchdog Block Diagram  
RESET  
f
OSC2  
MCC/RTC  
WATCHDOG CONTROL REGISTER (WDGCR)  
T5  
DIV 64  
WDGA T6  
T1  
T0  
T4  
T2  
T3  
6-BIT DOWNCOUNTER (CNT)  
12-BIT MCC  
RTC COUNTER  
WDG PRESCALER  
DIV 4  
TB[1:0] bits  
(MCCSR  
Register)  
MSB  
LSB  
0
6 5  
11  
48/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
WATCHDOG TIMER (Cont’d)  
11.1.4 How to Program the Watchdog Timeout  
more precision is needed, use the formulae in Fig-  
ure 33.  
Figure 32 shows the linear relationship between  
the 6-bit value to be loaded in the Watchdog Coun-  
ter (CNT) and the resulting timeout duration in mil-  
liseconds. This can be used for a quick calculation  
without taking the timing variations into account. If  
Caution: When writing to the WDGCR register, al-  
ways write 1 in the T6 bit to avoid generating an  
immediate reset.  
Figure 32. Approximate Timeout Duration  
3F  
38  
30  
28  
20  
18  
10  
08  
00  
1.5  
18  
34  
50  
65  
82  
98  
114  
128  
Watchdog timeout (ms) @ 8 MHz. f  
OSC2  
49/172  
ST72260Gx, ST72262Gx, ST72264Gx  
WATCHDOG TIMER (Cont’d)  
Figure 33. Exact Timeout Duration (t  
and t  
)
max  
min  
WHERE:  
t
t
t
= (LSB + 128) x 64 x t  
min0  
OSC2  
= 16384 x t  
= 125ns if f  
max0  
OSC2  
OSC2  
=8 MHz  
OSC2  
CNT = Value of T[5:0] bits in the WDGCR register (6 bits)  
MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits  
in the MCCSR register  
TB1 Bit  
TB0 Bit  
Selected MCCSR  
Timebase  
MSB  
LSB  
(MCCSR Reg.) (MCCSR Reg.)  
0
0
1
1
0
1
0
1
2ms  
4ms  
4
8
59  
53  
35  
54  
10ms  
25ms  
20  
49  
To calculate the minimum Watchdog Timeout (t ):  
min  
MSB  
4
IF  
THEN  
ELSE  
-------------  
CNT <  
t
= tmin0 + 16384 × CNT × t  
min  
osc2  
4CNT  
----------------  
4CNT  
----------------  
t
= t  
+ 16384 × CNT  
+ (192 + LSB) × 64 ×  
× t  
osc2  
min  
min0  
MSB  
MSB  
To calculate the maximum Watchdog Timeout (t  
):  
max  
MSB  
4
IF  
-------------  
THEN  
ELSE  
CNT ≤  
t
= tmax0 + 16384 × CNT × t  
osc2  
max  
4CNT  
----------------  
4CNT  
----------------  
t
= t  
+ 16384 × CNT –  
+ (192 + LSB) × 64 ×  
× t  
osc2  
max  
max0  
MSB  
MSB  
Note: In the above formulae, division results must be rounded down to the next integer value.  
Example:  
With 2ms timeout selected in MCCSR register  
Min. Watchdog  
Timeout (ms)  
Max. Watchdog  
Timeout (ms)  
Value of T[5:0] Bits in  
WDGCR Register (Hex.)  
t
t
min  
max  
00  
3F  
1.496  
128  
2.048  
128.552  
50/172  
ST72260Gx, ST72262Gx, ST72264Gx  
WATCHDOG TIMER (Cont’d)  
11.1.5 Low Power Modes  
Mode Description  
SLOW No effect on Watchdog.  
WAIT No effect on Watchdog.  
OIE bit in  
MCCSR  
register  
WDGHALT bit  
in Option  
Byte  
No Watchdog reset is generated. The MCU enters Halt mode. The Watch-  
dog counter is decremented once and then stops counting and is no longer  
able to generate a watchdog reset until the MCU receives an external inter-  
rupt or a reset.  
0
0
If an external interrupt is received, the Watchdog restarts counting after 256  
or 4096 CPU clocks. If a reset is generated, the Watchdog is disabled (reset  
state) unless Hardware Watchdog is selected by option byte. For applica-  
tion recommendations see Section 11.1.7 below.  
HALT  
0
1
1
x
A reset is generated.  
No reset is generated. The MCU enters Active Halt mode. The Watchdog  
counter is not decremented. It stop counting. When the MCU receives an  
oscillator interrupt or external interrupt, the Watchdog restarts counting im-  
mediately. When the MCU receives a reset the Watchdog restarts counting  
after 256 or 4096 CPU clocks.  
11.1.6 Hardware Watchdog Option  
11.1.9 Register Description  
If Hardware Watchdog is selected by option byte,  
the watchdog is always active and the WDGA bit in  
the WDGCR is not used. Refer to the Option Byte  
description.  
CONTROL REGISTER (WDGCR)  
Read/Write  
Reset Value: 0111 1111 (7Fh)  
11.1.7 Using Halt Mode with the WDG  
(WDGHALT option)  
7
0
WDGA T6  
T5  
T4  
T3  
T2  
T1  
T0  
The following recommendation applies if Halt  
mode is used when the watchdog is enabled.  
– Before executing the HALT instruction, refresh  
the WDG counter, to avoid an unexpected WDG  
reset immediately after waking up the microcon-  
troller.  
Bit 7 = WDGA Activation bit.  
This bit is set by software and only cleared by  
hardware after a reset. When WDGA = 1, the  
watchdog can generate a reset.  
0: Watchdog disabled  
1: Watchdog enabled  
11.1.8 Interrupts  
None.  
Note: This bit is not used if the hardware watch-  
dog option is enabled by option byte.  
Bit 6:0 = T[6:0] 7-bit counter (MSB to LSB).  
These bits contain the value of the watchdog  
counter. It is decremented every 16384 f  
cles (approx.). A reset is produced when it rolls  
over from 40h to 3Fh (T6 becomes cleared).  
cy-  
OSC2  
51/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
Table 12. Watchdog Timer Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
WDGCR  
Reset Value  
WDGA  
0
T6  
1
T5  
1
T4  
1
T3  
1
T2  
1
T1  
1
T0  
1
0024h  
52/172  
ST72260Gx, ST72262Gx, ST72264Gx  
11.2  
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC)  
The Main Clock Controller consists of a real time  
clock timer with interrupt capability  
When the RTC interrupt is enabled (OIE bit set),  
the ST7 enters ACTIVE-HALT mode when the  
HALT instruction is executed. See Section 8.4  
"ACTIVE-HALT AND HALT MODES" on page 35  
for more details.  
11.2.1  
Real Time Clock Timer (RTC)  
The counter of the real time clock timer allows an  
interrupt to be generated based on an accurate  
real time clock. Four different time bases depend-  
ing directly on f  
are available. The whole  
OSC2  
functionality is controlled by four bits of the MCC-  
SR register: TB[1:0], OIE and OIF.  
Figure 34. Main Clock Controller (MCC/RTC) Block Diagram  
fOSC2  
TO WATCHDOG  
RTC  
COUNTER  
TB1 TB0 OIE OIF  
MCCSR  
MCC/RTC INTERRUPT  
53/172  
ST72260Gx, ST72262Gx, ST72264Gx  
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)  
11.2.2  
Low Power Modes  
Bit 3:2 = TB[1:0] Time base control  
These bits select the programmable divider time  
base. They are set and cleared by software.  
Mode  
Description  
No effect on MCC/RTC peripheral.  
MCC/RTC interrupt cause the device to exit  
from WAIT mode.  
WAIT  
Time Base  
Counter  
TB1 TB0  
Prescaler  
f
=4MHz  
f
=8MHz  
OSC2  
OSC2  
No effect on MCC/RTC counter (OIE bit is  
ACTIVE- set), the registers are frozen.  
16000  
32000  
80000  
200000  
4ms  
2ms  
4ms  
0
0
1
1
0
1
0
1
HALT  
MCC/RTC interrupt cause the device to exit  
8ms  
20ms  
50ms  
from ACTIVE-HALT mode.  
10ms  
25ms  
MCC/RTC counter and registers are frozen.  
MCC/RTC operation resumes when the  
MCU is woken up by an interrupt with “exit  
from HALT” capability.  
HALT  
A modification of the time base is taken into ac-  
count at the end of the current period (previously  
set) to avoid an unwanted time shift. This allows to  
use this time base as a real time clock.  
11.2.3  
Interrupts  
The MCC/RTC interrupt event generates an inter-  
rupt if the OIE bit of the MCCSR register is set and  
the interrupt mask in the CC register is not active  
(RIM instruction).  
Bit 1 = OIE Oscillator interrupt enable  
This bit set and cleared by software.  
0: Oscillator interrupt disabled  
1: Oscillator interrupt enabled  
This interrupt can be used to exit from ACTIVE-  
HALT mode.  
Enable Exit  
Control from  
Bit  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Wait  
Time base overflow  
event  
1)  
When this bit is set, calling the ST7 software HALT  
instruction enters the ACTIVE-HALT power saving  
OIF  
OIE  
Yes  
No  
mode  
.
Note:  
Bit 0 = OIF Oscillator interrupt flag  
This bit is set by hardware and cleared by software  
reading the CSR register. It indicates when set  
that the main oscillator has reached the selected  
elapsed time (TB1:0).  
0: Timeout not reached  
1: Timeout reached  
The MCC/RTC interrupt wakes up the MCU from  
ACTIVE-HALT mode, not from HALT mode.  
11.2.4  
Register Description  
MCC CONTROL/STATUS REGISTER (MCCSR)  
Read/Write  
CAUTION: The BRES and BSET instructions  
must not be used on the MCCSR register to avoid  
unintentionally clearing the OIF bit.  
Reset Value: 0000 0000 (00h  
)
7
0
0
0
0
0
TB1 TB0 OIE OIF  
Bit 7:4 = reserved  
Table 13. Main Clock Controller Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
SICSR  
Reset Value  
AVDIE  
0
AVDF  
0
LVDRF  
x
WDGRF  
x
0025h  
0026h  
0
0
0
0
MCCSR  
Reset Value  
TB1  
0
TB0  
0
OIE  
0
OIF  
0
0
0
0
0
54/172  
ST72260Gx, ST72262Gx, ST72264Gx  
11.3 16-BIT TIMER  
11.3.1 Introduction  
When reading an input signal on a non-bonded  
pin, the value will always be ‘1’.  
The timer consists of a 16-bit free-running counter  
driven by a programmable prescaler.  
11.3.3 Functional Description  
11.3.3.1 Counter  
It may be used for a variety of purposes, including  
pulse length measurement of up to two input sig-  
nals (input capture) or generation of up to two out-  
put waveforms (output compare and PWM).  
The main block of the Programmable Timer is a  
16-bit free running upcounter and its associated  
16-bit registers. The 16-bit registers are made up  
of two 8-bit registers called high & low.  
Pulse lengths and waveform periods can be mod-  
ulated from a few microseconds to several milli-  
seconds using the timer prescaler and the CPU  
clock prescaler.  
Counter Register (CR):  
– Counter High Register (CHR) is the most sig-  
nificant byte (MS Byte).  
Some devices of the ST7 family have two on-chip  
16-bit timers. They are completely independent,  
and do not share any resources. They are syn-  
chronized after a Device reset as long as the timer  
clock frequencies are not modified.  
– Counter Low Register (CLR) is the least sig-  
nificant byte (LS Byte).  
Alternate Counter Register (ACR)  
– Alternate Counter High Register (ACHR) is the  
most significant byte (MS Byte).  
– Alternate Counter Low Register (ACLR) is the  
least significant byte (LS Byte).  
This description covers one or two 16-bit timers. In  
the devices with two timers, register names are  
prefixed with TA (Timer A) or TB (Timer B).  
11.3.2 Main Features  
Programmableprescaler:fCPU dividedby2,4or8.  
Overflow status flag and maskable interrupt  
External clock input (must be at least 4 times  
slowerthantheCPUclockspeed)withthechoice  
of active edge  
Output compare functions with  
– 2 dedicated 16-bit registers  
– 2 dedicated programmable signals  
– 2 dedicated status flags  
These two read-only 16-bit registers contain the  
same value but with the difference that reading the  
ACLR register does not clear the TOF bit (Timer  
overflow flag), located in the Status register, (SR),  
(see note at the end of paragraph titled 16-bit read  
sequence).  
Writing in the CLR register or ACLR register resets  
the free running counter to the FFFCh value.  
Both counters have a reset value of FFFCh (this is  
the only value which is reloaded in the 16-bit tim-  
er). The reset value of both counters is also  
FFFCh in One Pulse mode and PWM mode.  
– 1 dedicated maskable interrupt  
Input capture functions with  
– 2 dedicated 16-bit registers  
– 2 dedicated active edge selection signals  
– 2 dedicated status flags  
The timer clock depends on the clock control bits  
of the CR2 register, as illustrated in Table 14 Clock  
Control Bits. The value in the counter register re-  
peats every 131 072, 262 144 or 524 288 CPU  
clock cycles depending on the CC[1:0] bits.  
– 1 dedicated maskable interrupt  
Pulse width modulation mode (PWM)  
One pulse mode  
The timer frequency can be f  
or an external frequency.  
/2, f  
/4, f  
/8  
CPU  
CPU  
CPU  
Reduced Power Mode  
5 alternate functions on I/O ports (ICAP1, ICAP2,  
OCMP1, OCMP2, EXTCLK)*  
The Block Diagram is shown in Figure 35.  
*Note: Some timer pins may not available (not  
bonded) in some devices. Refer to the device pin  
out description.  
55/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Figure 35. Timer Block Diagram  
INTERNAL BUS  
f
CPU  
16-BIT TIMER PERIPHERAL INTERFACE  
8 low  
8-bit  
8 high  
8
8
8
8
8
8
8
8
buffer  
EXEDG  
16  
INPUT  
CAPTURE  
REGISTER  
INPUT  
CAPTURE  
REGISTER  
OUTPUT  
COMPARE  
REGISTER  
OUTPUT  
COMPARE  
REGISTER  
1/2  
1/4  
1/8  
COUNTER  
REGISTER  
1
1
2
2
ALTERNATE  
COUNTER  
REGISTER  
EXTCLK  
pin  
16  
16  
16  
CC[1:0]  
TIMER INTERNAL BUS  
16 16  
OVERFLOW  
DETECT  
EDGE DETECT  
CIRCUIT1  
OUTPUT COMPARE  
CIRCUIT  
ICAP1  
pin  
CIRCUIT  
6
EDGE DETECT  
CIRCUIT2  
ICAP2  
pin  
OCMP1  
pin  
LATCH1  
LATCH2  
0
ICF1 OCF1 TOF ICF2 OCF2  
0
TIMD  
(Control/Status Register)  
OCMP2  
pin  
CSR  
EXEDG  
ICIE OCIE TOIE FOLV2 FOLV1OLVL2 IEDG1 OLVL1  
OC1E  
OPM PWM CC1 CC0 IEDG2  
OC2E  
(Control Register 1) CR1  
(Control Register 2) CR2  
(See note)  
Note: If IC, OC and TO interrupt requests have separate vectors  
then the last OR is not present (See Device Interrupt Vector Table)  
TIMER INTERRUPT  
56/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
16-bit read sequence: (from either the Counter  
Register or the Alternate Counter Register).  
Clearing the overflow interrupt request is done in  
two steps:  
1. Reading the SR register while the TOF bit is set.  
2. An access (read or write) to the CLR register.  
Beginning of the sequence  
Read  
LS Byte  
Notes: The TOF bit is not cleared by accesses to  
ACLR register. The advantage of accessing the  
ACLR register rather than the CLR register is that  
it allows simultaneous use of the overflow function  
and reading the free running counter at random  
times (for example, to measure elapsed time) with-  
out the risk of clearing the TOF bit erroneously.  
MS Byte  
At t0  
is buffered  
Other  
instructions  
Returns the buffered  
LS Byte value at t0  
Read  
LS Byte  
At t0 +t  
The timer is not affected by WAIT mode.  
In HALT mode, the counter stops counting until the  
mode is exited. Counting then resumes from the  
previous count (Device awakened by an interrupt)  
or from the reset count (Device awakened by a  
Reset).  
Sequence completed  
The user must read the MS Byte first, then the LS  
Byte value is buffered automatically.  
This buffered value remains unchanged until the  
16-bit read sequence is completed, even if the  
user reads the MS Byte several times.  
11.3.3.2 External Clock  
After a complete reading sequence, if only the  
CLR register or ACLR register are read, they re-  
turn the LS Byte of the count value at the time of  
the read.  
The external clock (where available) is selected if  
CC0=1 and CC1=1 in CR2 register.  
The status of the EXEDG bit in the CR2 register  
determines the type of level transition on the exter-  
nal clock pin EXTCLK that will trigger the free run-  
ning counter.  
Whatever the timer mode used (input capture, out-  
put compare, one pulse mode or PWM mode) an  
overflow occurs when the counter rolls over from  
FFFFh to 0000h then:  
The counter is synchronised with the falling edge  
of the internal CPU clock.  
– The TOF bit of the SR register is set.  
– A timer interrupt is generated if:  
– TOIE bit of the CR1 register is set and  
– I bit of the CC register is cleared.  
A minimum of four falling edges of the CPU clock  
must occur between two consecutive active edges  
of the external clock; thus the external clock fre-  
quency must be less than a quarter of the CPU  
clock frequency.  
If one of these conditions is false, the interrupt re-  
mains pending to be issued as soon as they are  
both true.  
57/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Figure 36. Counter Timing Diagram, internal clock divided by 2  
CPU CLOCK  
INTERNAL RESET  
TIMER CLOCK  
FFFD FFFE FFFF 0000 0001 0002 0003  
COUNTER REGISTER  
TIMER OVERFLOW FLAG (TOF)  
Figure 37. Counter Timing Diagram, internal clock divided by 4  
CPU CLOCK  
INTERNAL RESET  
TIMER CLOCK  
FFFC  
FFFD  
0000  
0001  
COUNTER REGISTER  
TIMER OVERFLOW FLAG (TOF)  
Figure 38. Counter Timing Diagram, internal clock divided by 8  
CPU CLOCK  
INTERNAL RESET  
TIMER CLOCK  
0000  
FFFC  
FFFD  
COUNTER REGISTER  
TIMER OVERFLOW FLAG (TOF)  
Note: The Device is in reset state when the internal reset signal is high, when it is low the Device is run-  
ning.  
58/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
11.3.3.3 Input Capture  
When an input capture occurs:  
In this section, the index, i, may be 1 or 2 because  
there are 2 input capture functions in the 16-bit  
timer.  
– ICFi bit is set.  
– The ICiR register contains the value of the free  
running counter on the active transition on the  
ICAPi pin (see Figure 40).  
The two input capture 16-bit registers (IC1R and  
IC2R) are used to latch the value of the free run-  
ning counter after a transition detected by the  
ICAPi pin (see figure 5).  
– A timer interrupt is generated if the ICIE bit is set  
and the I bit is cleared in the CC register. Other-  
wise, the interrupt remains pending until both  
conditions become true.  
MS Byte  
LS Byte  
ICiR  
ICiHR  
ICiLR  
Clearing the Input Capture interrupt request (i.e.  
clearing the ICFi bit) is done in two steps:  
ICiR register is a read-only register.  
1. Reading the SR register while the ICFi bit is set.  
2. An access (read or write) to the ICiLR register.  
The active transition is software programmable  
through the IEDGi bit of Control Registers (CRi).  
Timing resolution is one count of the free running  
Notes:  
counter: (f  
/CC[1:0]).  
CPU  
1. After reading the ICiHR register, transfer of  
input capture data is inhibited and ICFi will  
never be set until the ICiLR register is also  
read.  
Procedure:  
To use the input capture function select the follow-  
ing in the CR2 register:  
2. The ICiR register contains the free running  
counter value which corresponds to the most  
recent input capture.  
– Select the timer clock (CC[1:0]) (see Table 14  
Clock Control Bits).  
3. The 2 input capture functions can be used  
together even if the timer also uses the 2 output  
compare functions.  
– Select the edge of the active transition on the  
ICAP2 pin with the IEDG2 bit (the ICAP2 pin  
must be configured as floating input).  
4. In One pulse Mode and PWM mode only the  
input capture 2 can be used.  
And select the following in the CR1 register:  
– Set the ICIE bit to generate an interrupt after an  
input capture coming from either the ICAP1 pin  
or the ICAP2 pin  
5. The alternate inputs (ICAP1 & ICAP2) are  
always directly connected to the timer. So any  
transitions on these pins activate the input cap-  
ture function.  
– Select the edge of the active transition on the  
ICAP1 pin with the IEDG1 bit (the ICAP1pin must  
be configured as floating input).  
Moreover if one of the ICAPi pin is configured  
as an input and the second one as an output,  
an interrupt can be generated if the user toggle  
the output pin and if the ICIE bit is set.  
This can be avoided if the input capture func-  
tion i is disabled by reading the ICiHR (see note  
1).  
6. The TOF bit can be used with interrupt in order  
to measure event that go beyond the timer  
range (FFFFh).  
59/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Figure 39. Input Capture Block Diagram  
ICAP1  
pin  
(Control Register 1) CR1  
EDGE DETECT  
CIRCUIT2  
EDGE DETECT  
CIRCUIT1  
ICIE  
IEDG1  
ICAP2  
pin  
(Status Register) SR  
ICF1  
ICF2  
0
0
0
IC2R Register  
IC1R Register  
(Control Register 2) CR2  
16-BIT  
16-BIT FREE RUNNING  
COUNTER  
IEDG2  
CC0  
CC1  
Figure 40. Input Capture Timing Diagram  
TIMER CLOCK  
FF01  
FF02  
FF03  
COUNTER REGISTER  
ICAPi PIN  
ICAPi FLAG  
FF03  
ICAPi REGISTER  
Note: The active edge is the rising edge.  
Note: The time between an event on the ICAPi pin  
and the appearance of the corresponding flag is  
from 2 to 3 CPU clock cycles. This depends on the  
moment when the ICAP event happens relative to  
the timer clock.  
60/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
11.3.3.4 Output Compare  
– The OCMPi pin takes OLVLi bit value (OCMPi  
pin latch is forced low during reset).  
In this section, the index, i, may be 1 or 2 because  
there are 2 output compare functions in the 16-bit  
timer.  
– A timer interrupt is generated if the OCIE bit is  
set in the CR2 register and the I bit is cleared in  
the CC register (CC).  
This function can be used to control an output  
waveform or indicate when a period of time has  
elapsed.  
The OCiR register value required for a specific tim-  
ing application can be calculated using the follow-  
ing formula:  
When a match is found between the Output Com-  
pare register and the free running counter, the out-  
put compare function:  
– Assigns pins with a programmable value if the  
OCIE bit is set  
t f  
* CPU  
PRESC  
OCiR =  
– Sets a flag in the status register  
– Generates an interrupt if enabled  
Where:  
t  
= Output compare period (in seconds)  
= CPU clock frequency (in hertz)  
Two 16-bit registers Output Compare Register 1  
(OC1R) and Output Compare Register 2 (OC2R)  
contain the value to be compared to the counter  
register each timer clock cycle.  
f
CPU  
= Timer prescaler factor (2, 4 or 8 de-  
pending on CC[1:0] bits, see Table 14  
Clock Control Bits)  
PRESC  
MS Byte  
LS Byte  
OCiR  
OCiHR  
OCiLR  
If the timer clock is an external clock, the formula  
is:  
These registers are readable and writable and are  
not affected by the timer hardware. A reset event  
changes the OCiR value to 8000h.  
OCiR = t f  
* EXT  
Timing resolution is one count of the free running  
Where:  
counter: (f  
).  
CC[1:0]  
CPU/  
t  
= Output compare period (in seconds)  
= External timer clock frequency (in hertz)  
f
EXT  
Procedure:  
To use the output compare function, select the fol-  
lowing in the CR2 register:  
Clearing the output compare interrupt request (i.e.  
clearing the OCFi bit) is done by:  
– Set the OCiE bit if an output is needed then the  
OCMPi pin is dedicated to the output compare i  
signal.  
1. Reading the SR register while the OCFi bit is  
set.  
2. An access (read or write) to the OCiLR register.  
– Select the timer clock (CC[1:0]) (see Table 14  
Clock Control Bits).  
The following procedure is recommended to pre-  
vent the OCFi bit from being set between the time  
it is read and the write to the OCiR register:  
And select the following in the CR1 register:  
– Select the OLVLi bit to applied to the OCMPi pins  
after the match occurs.  
– Write to the OCiHR register (further compares  
are inhibited).  
– Set the OCIE bit to generate an interrupt if it is  
needed.  
– Read the SR register (first step of the clearance  
of the OCFi bit, which may be already set).  
When a match is found between OCRi register  
and CR register:  
– Write to the OCiLR register (enables the output  
compare function and clears the OCFi bit).  
– OCFi bit is set.  
61/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Notes:  
1. After a processor write cycle to the OCiHR reg-  
ister, the output compare function is inhibited  
until the OCiLR register is also written.  
Forced Compare Output capability  
When the FOLVi bit is set by software, the OLVLi  
bit is copied to the OCMPi pin. The OLVi bit has to  
be toggled in order to toggle the OCMPi pin when  
it is enabled (OCiE bit=1). The OCFi bit is then not  
set by hardware, and thus no interrupt request is  
generated.  
2. If the OCiE bit is not set, the OCMPi pin is a  
general I/O port and the OLVLi bit will not  
appear when a match is found but an interrupt  
could be generated if the OCIE bit is set.  
3. When the timer clock is f  
/2, OCFi and  
FOLVLi bits have no effect in both one pulse mode  
and PWM mode.  
CPU  
OCMPi are set while the counter value equals  
the OCiR register value (see Figure 42 on page  
63). This behaviour is the same in OPM or  
PWM mode.  
When the timer clock is f  
/4, f  
/8 or in  
CPU  
CPU  
external clock mode, OCFi and OCMPi are set  
while the counter value equals the OCiR regis-  
ter value plus 1 (see Figure 43 on page 63).  
4. The output compare functions can be used both  
for generating external events on the OCMPi  
pins even if the input capture mode is also  
used.  
5. The value in the 16-bit OCiR register and the  
OLVi bit should be changed after each suc-  
cessful comparison in order to control an output  
waveform or establish a new elapsed timeout.  
Figure 41. Output Compare Block Diagram  
16 BIT FREE RUNNING  
OC1E  
CC1 CC0  
OC2E  
COUNTER  
(Control Register 2) CR2  
16-bit  
(Control Register 1) CR1  
OUTPUT COMPARE  
CIRCUIT  
Latch  
1
OCIE  
FOLV2 FOLV1OLVL2  
OLVL1  
OCMP1  
Pin  
16-bit  
16-bit  
Latch  
2
OCMP2  
Pin  
OC1R Register  
OCF1  
OCF2  
0
0
0
OC2R Register  
(Status Register) SR  
62/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Figure 42. Output Compare Timing Diagram, f  
=f  
/2  
TIMER  
CPU  
INTERNAL CPU CLOCK  
TIMER CLOCK  
COUNTER REGISTER  
2ECF 2ED0 2ED1 2ED2  
2ED3  
2ED4  
2ED3  
OUTPUT COMPARE REGISTER i (OCRi)  
OUTPUT COMPARE FLAG i (OCFi)  
OCMPi PIN (OLVLi=1)  
Figure 43. Output Compare Timing Diagram, f  
=f  
/4  
TIMER  
CPU  
INTERNAL CPU CLOCK  
TIMER CLOCK  
2ECF 2ED0 2ED1 2ED2  
2ED3  
2ED4  
2ED3  
COUNTER REGISTER  
OUTPUT COMPARE REGISTER i (OCRi)  
COMPARE REGISTER i LATCH  
OUTPUT COMPARE FLAG i (OCFi)  
OCMPi PIN (OLVLi=1)  
63/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
11.3.3.5 One Pulse Mode  
Clearing the Input Capture interrupt request (i.e.  
clearing the ICFi bit) is done in two steps:  
One Pulse mode enables the generation of a  
pulse when an external event occurs. This mode is  
selected via the OPM bit in the CR2 register.  
1. Reading the SR register while the ICFi bit is set.  
2. An access (read or write) to the ICiLR register.  
The one pulse mode uses the Input Capture1  
function and the Output Compare1 function.  
The OC1R register value required for a specific  
timing application can be calculated using the fol-  
lowing formula:  
Procedure:  
t * f  
To use one pulse mode:  
CPU  
- 5  
OCiR Value =  
1. Load the OC1R register with the value corre-  
sponding to the length of the pulse (see the for-  
mula in the opposite column).  
PRESC  
Where:  
t
= Pulse period (in seconds)  
2. Select the following in the CR1 register:  
f
= CPU clock frequency (in hertz)  
CPU  
– Using the OLVL1 bit, select the level to be ap-  
plied to the OCMP1 pin after the pulse.  
= Timer prescaler factor (2, 4 or 8 depend-  
ing on the CC[1:0] bits, see Table 14  
Clock Control Bits)  
PRESC  
– Using the OLVL2 bit, select the level to be ap-  
plied to the OCMP1 pin during the pulse.  
If the timer clock is an external clock the formula is:  
– Select the edge of the active transition on the  
ICAP1 pin with the IEDG1 bit (the ICAP1 pin  
must be configured as floating input).  
OCiR = t f  
-5  
* EXT  
Where:  
t
3. Select the following in the CR2 register:  
= Pulse period (in seconds)  
– Set the OC1E bit, the OCMP1 pin is then ded-  
icated to the Output Compare 1 function.  
f
= External timer clock frequency (in hertz)  
EXT  
– Set the OPM bit.  
When the value of the counter is equal to the value  
of the contents of the OC1R register, the OLVL1  
bit is output on the OCMP1 pin, (See Figure 44).  
– Select the timer clock CC[1:0] (see Table 14  
Clock Control Bits).  
One pulse mode cycle  
Notes:  
ICR1 = Counter  
When  
1. The OCF1 bit cannot be set by hardware in one  
pulse mode but the OCF2 bit can generate an  
Output Compare interrupt.  
OCMP1 = OLVL2  
event occurs  
on ICAP1  
Counter is reset  
2. When the Pulse Width Modulation (PWM) and  
One Pulse Mode (OPM) bits are both set, the  
PWM mode is the only active one.  
to FFFCh  
ICF1 bit is set  
3. If OLVL1=OLVL2 a continuous signal will be  
seen on the OCMP1 pin.  
When  
Counter  
OCMP1 = OLVL1  
= OC1R  
4. The ICAP1 pin can not be used to perform input  
capture. The ICAP2 pin can be used to perform  
input capture (ICF2 can be set and IC2R can be  
loaded) but the user must take care that the  
counter is reset each time a valid edge occurs  
on the ICAP1 pin and ICF1 can also generates  
interrupt if ICIE is set.  
When a valid event occurs on the ICAP1 pin, the  
counter value is loaded in the ICR1 register. The  
counter is then initialized to FFFCh, the OLVL2 bit  
is output on the OCMP1 pin and the ICF1 bit is set.  
5. When one pulse mode is used OC1R is dedi-  
cated to this mode. Nevertheless OC2R and  
OCF2 can be used to indicate a period of time  
has been elapsed but cannot generate an out-  
put waveform because the level OLVL2 is dedi-  
cated to the one pulse mode.  
Because the ICF1 bit is set when an active edge  
occurs, an interrupt can be generated if the ICIE  
bit is set.  
64/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Figure 44. One Pulse Mode Timing Example  
2ED3  
01F8  
IC1R  
FFFC FFFD FFFE  
2ED0 2ED1 2ED2  
2ED3  
FFFC FFFD  
01F8  
COUNTER  
ICAP1  
OLVL2  
OLVL1  
OLVL2  
OCMP1  
compare1  
Note: IEDG1=1, OC1R=2ED0h, OLVL1=0, OLVL2=1  
Figure 45. Pulse Width Modulation Mode Timing Example  
2ED0 2ED1 2ED2  
34E2 FFFC  
FFFC FFFD FFFE  
34E2  
COUNTER  
OCMP1  
OLVL2  
OLVL1  
OLVL2  
compare2  
compare1  
compare2  
Note: OC1R=2ED0h, OC2R=34E2, OLVL1=0, OLVL2= 1  
65/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
11.3.3.6 Pulse Width Modulation Mode  
Clock Control Bits).  
Pulse Width Modulation cycle  
Pulse Width Modulation (PWM) mode enables the  
generation of a signal with a frequency and pulse  
length determined by the value of the OC1R and  
OC2R registers.  
When  
Counter  
= OC1R  
OCMP1 = OLVL1  
Pulse Width Modulation mode uses the complete  
Output Compare 1 function plus the OC2R regis-  
ter, and so this functionality can not be used when  
PWM mode is activated.  
OCMP1 = OLVL2  
When  
In PWM mode, double buffering is implemented on  
the output compare registers. Any new values writ-  
ten in the OC1R and OC2R registers are loaded in  
their respective shadow registers (double buffer)  
only at the end of the PWM period (OC2) to avoid  
spikes on the PWM output pin (OCMP1). The  
shadow registers contain the reference values for  
comparison in PWM “double buffering” mode.  
Counter  
= OC2R  
Counter is reset  
to FFFCh  
ICF1 bit is set  
If OLVL1=1 and OLVL2=0 the length of the posi-  
tive pulse is the difference between the OC2R and  
OC1R registers.  
If OLVL1=OLVL2 a continuous signal will be seen  
on the OCMP1 pin.  
Note: There is a locking mechanism for transfer-  
ring the OCiR value to the buffer. After a write to  
the OCiHR register, transfer of the new compare  
value to the buffer is inhibited until OCiLR is also  
written.  
The OCiR register value required for a specific tim-  
ing application can be calculated using the follow-  
ing formula:  
t * f  
Unlike in Output Compare mode, the compare  
function is always enabled in PWM mode.  
CPU  
- 5  
OCiR Value =  
PRESC  
Where:  
t
= Signal or pulse period (in seconds)  
= CPU clock frequency (in hertz)  
Procedure  
f
To use pulse width modulation mode:  
CPU  
1. Load the OC2R register with the value corre-  
sponding to the period of the signal using the  
formula in the opposite column.  
= Timer prescaler factor (2, 4 or 8 depend-  
ing on CC[1:0] bits, see Table 14 Clock  
Control Bits)  
PRESC  
2. Load the OC1R register with the value corre-  
sponding to the period of the pulse if (OLVL1=0  
and OLVL2=1) using the formula in the oppo-  
site column.  
If the timer clock is an external clock the formula is:  
OCiR = t f  
-5  
* EXT  
Where:  
t
3. Select the following in the CR1 register:  
= Signal or pulse period (in seconds)  
– Using the OLVL1 bit, select the level to be ap-  
plied to the OCMP1 pin after a successful  
comparison with OC1R register.  
f
= External timer clock frequency (in hertz)  
EXT  
– Using the OLVL2 bit, select the level to be ap-  
plied to the OCMP1 pin after a successful  
comparison with OC2R register.  
The Output Compare 2 event causes the counter  
to be initialized to FFFCh (See Figure 45)  
Notes:  
4. Select the following in the CR2 register:  
1. The OCF1 and OCF2 bits cannot be set by  
hardware in PWM mode therefore the Output  
Compare interrupt is inhibited.  
– Set OC1E bit: the OCMP1 pin is then dedicat-  
ed to the output compare 1 function.  
– Set the PWM bit.  
2. The ICF1 bit is set by hardware when the coun-  
ter reaches the OC2R value and can produce a  
timer interrupt if the ICIE bit is set and the I bit is  
cleared.  
– Select the timer clock (CC[1:0]) (see Table 14  
66/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
3. In PWM mode the ICAP1 pin can not be used  
to perform input capture because it is discon-  
nected to the timer. The ICAP2 pin can be used  
to perform input capture (ICF2 can be set and  
IC2R can be loaded) but the user must take  
care that the counter is reset each period and  
ICF1 can also generates interrupt if ICIE is set.  
4. When the Pulse Width Modulation (PWM) and  
One Pulse Mode (OPM) bits are both set, the  
PWM mode is the only active one.  
11.3.4 Low Power Modes  
Mode  
Description  
No effect on 16-bit Timer.  
WAIT  
Timer interrupts cause the Device to exit from WAIT mode.  
16-bit Timer registers are frozen.  
In HALT mode, the counter stops counting until Halt mode is exited. Counting resumes from the previous  
count when the Device is woken up by an interrupt with “exit from HALT mode” capability or from the counter  
reset value when the Device is woken up by a RESET.  
HALT  
If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is armed. Consequent-  
ly, when the Device is woken up by an interrupt with “exit from HALT mode” capability, the ICFi bit is set, and  
the counter value present when exiting from HALT mode is captured into the ICiR register.  
11.3.5 Interrupts  
Enable  
Control from  
Bit  
Exit  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Wait  
Yes  
Yes  
Yes  
Yes  
Yes  
Input Capture 1 event/Counter reset in PWM mode  
Input Capture 2 event  
ICF1  
ICF2  
No  
No  
No  
No  
No  
ICIE  
Output Compare 1 event (not available in PWM mode)  
Output Compare 2 event (not available in PWM mode)  
Timer Overflow event  
OCF1  
OCF2  
TOF  
OCIE  
TOIE  
Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chap-  
ter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt  
mask in the CC register is reset (RIM instruction).  
11.3.6 Summary of Timer modes  
AVAILABLE RESOURCES  
MODES  
Input Capture 1  
Input Capture 2  
Yes  
Output Compare 1 Output Compare 2  
Input Capture (1 and/or 2)  
Output Compare (1 and/or 2)  
One Pulse Mode  
Yes  
Yes  
No  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
1)  
3)  
2)  
Not Recommended  
Not Recommended  
Partially  
No  
PWM Mode  
No  
No  
1)  
2)  
3)  
See note 4 in Section 11.3.3.5 "One Pulse Mode" on page 64  
See note 5 in Section 11.3.3.5 "One Pulse Mode" on page 64  
See note 4 in Section 11.3.3.6 "Pulse Width Modulation Mode" on page 66  
67/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
11.3.7 Register Description  
Bit 4 = FOLV2 Forced Output Compare 2.  
This bit is set and cleared by software.  
0: No effect on the OCMP2 pin.  
1:Forces the OLVL2 bit to be copied to the  
OCMP2 pin, if the OC2E bit is set and even if  
there is no successful comparison.  
Each Timer is associated with three control and  
status registers, and with six pairs of data registers  
(16-bit values) relating to the two input captures,  
the two output compares, the counter and the al-  
ternate counter.  
Bit 3 = FOLV1 Forced Output Compare 1.  
This bit is set and cleared by software.  
0: No effect on the OCMP1 pin.  
CONTROL REGISTER 1 (CR1)  
Read/Write  
1: Forces OLVL1 to be copied to the OCMP1 pin, if  
the OC1E bit is set and even if there is no suc-  
cessful comparison.  
Reset Value: 0000 0000 (00h)  
7
0
ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1  
Bit 2 = OLVL2 Output Level 2.  
This bit is copied to the OCMP2 pin whenever a  
successful comparison occurs with the OC2R reg-  
ister and OCxE is set in the CR2 register. This val-  
ue is copied to the OCMP1 pin in One Pulse Mode  
and Pulse Width Modulation mode.  
Bit 7 = ICIE Input Capture Interrupt Enable.  
0: Interrupt is inhibited.  
1: A timer interrupt is generated whenever the  
ICF1 or ICF2 bit of the SR register is set.  
Bit 6 = OCIE Output Compare Interrupt Enable.  
0: Interrupt is inhibited.  
1: A timer interrupt is generated whenever the  
OCF1 or OCF2 bit of the SR register is set.  
Bit 1 = IEDG1 Input Edge 1.  
This bit determines which type of level transition  
on the ICAP1 pin will trigger the capture.  
0: A falling edge triggers the capture.  
1: A rising edge triggers the capture.  
Bit 5 = TOIE Timer Overflow Interrupt Enable.  
0: Interrupt is inhibited.  
1: A timer interrupt is enabled whenever the TOF  
bit of the SR register is set.  
Bit 0 = OLVL1 Output Level 1.  
The OLVL1 bit is copied to the OCMP1 pin when-  
ever a successful comparison occurs with the  
OC1R register and the OC1E bit is set in the CR2  
register.  
68/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
CONTROL REGISTER 2 (CR2)  
Read/Write  
Bit 4 = PWM Pulse Width Modulation.  
0: PWM mode is not active.  
1: PWM mode is active, the OCMP1 pin outputs a  
programmable cyclic signal; the length of the  
pulse depends on the value of OC1R register;  
the period depends on the value of OC2R regis-  
ter.  
Reset Value: 0000 0000 (00h)  
7
0
OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG  
Bit 3, 2 = CC[1:0] Clock Control.  
Bit 7 = OC1E Output Compare 1 Pin Enable.  
This bit is used only to output the signal from the  
timer on the OCMP1 pin (OLV1 in Output Com-  
pare mode, both OLV1 and OLV2 in PWM and  
one-pulse mode). Whatever the value of the OC1E  
bit, the Output Compare 1 function of the timer re-  
mains active.  
0: OCMP1 pin alternate function disabled (I/O pin  
free for general-purpose I/O).  
1: OCMP1 pin alternate function enabled.  
The timer clock mode depends on these bits:  
Table 14. Clock Control Bits  
Timer Clock  
fCPU / 4  
CC1  
CC0  
0
0
1
0
1
0
fCPU / 2  
fCPU / 8  
External Clock (where  
available)  
1
1
Bit 6 = OC2E Output Compare 2 Pin Enable.  
This bit is used only to output the signal from the  
timer on the OCMP2 pin (OLV2 in Output Com-  
pare mode). Whatever the value of the OC2E bit,  
the Output Compare 2 function of the timer re-  
mains active.  
0: OCMP2 pin alternate function disabled (I/O pin  
free for general-purpose I/O).  
1: OCMP2 pin alternate function enabled.  
Note: If the external clock pin is not available, pro-  
gramming the external clock configuration stops  
the counter.  
Bit 1 = IEDG2 Input Edge 2.  
This bit determines which type of level transition  
on the ICAP2 pin will trigger the capture.  
0: A falling edge triggers the capture.  
1: A rising edge triggers the capture.  
Bit 5 = OPM One Pulse Mode.  
0: One Pulse Mode is not active.  
1: One Pulse Mode is active, the ICAP1 pin can be  
used to trigger one pulse on the OCMP1 pin; the  
active transition is given by the IEDG1 bit. The  
length of the generated pulse depends on the  
contents of the OC1R register.  
Bit 0 = EXEDG External Clock Edge.  
This bit determines which type of level transition  
on the external clock pin EXTCLK will trigger the  
counter register.  
0: A falling edge triggers the counter register.  
1: A rising edge triggers the counter register.  
69/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
CONTROL/STATUS REGISTER (CSR)  
Read Only  
Note: Reading or writing the ACLR register does  
not clear TOF.  
Reset Value: 0000 0000 (00h)  
The three least significant bits are not used.  
7
Bit 4 = ICF2 Input Capture Flag 2.  
0: No input capture (reset value).  
0
0
1: An input capture has occurred on the ICAP2  
pin. To clear this bit, first read the SR register,  
then read or write the low byte of the IC2R  
(IC2LR) register.  
ICF1 OCF1 TOF ICF2 OCF2 TIMD  
0
Bit 7 = ICF1 Input Capture Flag 1.  
Bit 3 = OCF2 Output Compare Flag 2.  
0: No match (reset value).  
1: The content of the free running counter has  
matched the content of the OC2R register. To  
clear this bit, first read the SR register, then read  
or write the low byte of the OC2R (OC2LR) reg-  
ister.  
0: No input capture (reset value).  
1: An input capture has occurred on the ICAP1 pin  
or the counter has reached the OC2R value in  
PWM mode. To clear this bit, first read the SR  
register, then read or write the low byte of the  
IC1R (IC1LR) register.  
Bit 6 = OCF1 Output Compare Flag 1.  
0: No match (reset value).  
1: The content of the free running counter has  
matched the content of the OC1R register. To  
clear this bit, first read the SR register, then read  
or write the low byte of the OC1R (OC1LR) reg-  
ister.  
Bit 2 = TIMD Timer disable.  
This bit is set and cleared by software. When set, it  
freezes the timer prescaler and counter and disa-  
bled the output functions (OCMP1 and OCMP2  
pins) to reduce power consumption. Access to the  
timer registers is still available, allowing the timer  
configuration to be changed while it is disabled.  
0: Timer enabled  
Bit 5 = TOF Timer Overflow Flag.  
0: No timer overflow (reset value).  
1: Timer prescaler, counter and outputs disabled  
1:The free running counter rolled over from FFFFh  
to 0000h. To clear this bit, first read the SR reg-  
ister, then read or write the low byte of the CR  
(CLR) register.  
Bits 1:0 = Reserved, must be kept cleared.  
70/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
INPUT CAPTURE 1 HIGH REGISTER (IC1HR)  
OUTPUT COMPARE  
(OC1HR)  
1
HIGH REGISTER  
Read Only  
Reset Value: Undefined  
Read/Write  
Reset Value: 1000 0000 (80h)  
This is an 8-bit read only register that contains the  
high part of the counter value (transferred by the  
input capture 1 event).  
This is an 8-bit register that contains the high part  
of the value to be compared to the CHR register.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
INPUT CAPTURE 1 LOW REGISTER (IC1LR)  
OUTPUT COMPARE  
(OC1LR)  
1
LOW REGISTER  
Read Only  
Reset Value: Undefined  
Read/Write  
Reset Value: 0000 0000 (00h)  
This is an 8-bit read only register that contains the  
low part of the counter value (transferred by the in-  
put capture 1 event).  
This is an 8-bit register that contains the low part of  
the value to be compared to the CLR register.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
71/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
OUTPUT COMPARE  
(OC2HR)  
2
HIGH REGISTER  
ALTERNATE COUNTER HIGH REGISTER  
(ACHR)  
Read/Write  
Reset Value: 1000 0000 (80h)  
Read Only  
Reset Value: 1111 1111 (FFh)  
This is an 8-bit register that contains the high part  
of the value to be compared to the CHR register.  
This is an 8-bit register that contains the high part  
of the counter value.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
OUTPUT COMPARE  
(OC2LR)  
2
LOW REGISTER  
ALTERNATE COUNTER LOW REGISTER  
(ACLR)  
Read/Write  
Reset Value: 0000 0000 (00h)  
Read Only  
Reset Value: 1111 1100 (FCh)  
This is an 8-bit register that contains the low part of  
the value to be compared to the CLR register.  
This is an 8-bit register that contains the low part of  
the counter value. A write to this register resets the  
counter. An access to this register after an access  
to CSR register does not clear the TOF bit in the  
CSR register.  
7
0
MSB  
LSB  
7
0
COUNTER HIGH REGISTER (CHR)  
MSB  
LSB  
Read Only  
Reset Value: 1111 1111 (FFh)  
INPUT CAPTURE 2 HIGH REGISTER (IC2HR)  
This is an 8-bit register that contains the high part  
of the counter value.  
Read Only  
Reset Value: Undefined  
7
0
This is an 8-bit read only register that contains the  
high part of the counter value (transferred by the  
Input Capture 2 event).  
MSB  
LSB  
7
0
MSB  
LSB  
COUNTER LOW REGISTER (CLR)  
Read Only  
Reset Value: 1111 1100 (FCh)  
This is an 8-bit register that contains the low part of  
the counter value. A write to this register resets the  
counter. An access to this register after accessing  
the CSR register clears the TOF bit.  
INPUT CAPTURE 2 LOW REGISTER (IC2LR)  
Read Only  
Reset Value: Undefined  
This is an 8-bit read only register that contains the  
low part of the counter value (transferred by the In-  
put Capture 2 event).  
7
0
MSB  
LSB  
7
0
MSB  
LSB  
72/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Table 15. 16-Bit Timer Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
Timer A: 32 CR1  
ICIE  
0
OCIE  
0
TOIE  
0
FOLV2  
0
FOLV1  
0
OLVL2  
0
IEDG1  
0
OLVL1  
0
Timer B: 42 Reset Value  
Timer A: 31 CR2  
OC1E  
0
OC2E  
0
OPM  
0
PWM  
0
CC1  
0
CC0  
0
IEDG2  
0
EXEDG  
0
Timer B: 41 Reset Value  
Timer A: 33 CSR  
ICF1  
x
OCF1  
x
TOF  
x
ICF2  
x
OCF2  
x
TIMD  
0
-
-
Timer B: 43 Reset Value  
x
x
Timer A: 34 IC1HR  
MSB  
-
LSB  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Timer B: 44 Reset Value  
Timer A: 35 IC1LR  
MSB  
-
LSB  
-
Timer B: 45 Reset Value  
Timer A: 36 OC1HR  
MSB  
-
LSB  
-
Timer B: 46 Reset Value  
Timer A: 37 OC1LR  
MSB  
-
LSB  
-
Timer B: 47 Reset Value  
Timer A: 3E OC2HR  
MSB  
-
LSB  
-
Timer B: 4E Reset Value  
Timer A: 3F OC2LR  
MSB  
-
LSB  
-
Timer B: 4F Reset Value  
Timer A: 38 CHR  
MSB  
1
LSB  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
Timer B: 48 Reset Value  
Timer A: 39 CLR  
MSB  
1
LSB  
0
Timer B: 49 Reset Value  
Timer A: 3A ACHR  
MSB  
1
LSB  
1
Timer B: 4A Reset Value  
Timer A: 3B ACLR  
MSB  
1
LSB  
0
1
-
1
-
1
-
1
-
1
-
0
-
Timer B: 4B Reset Value  
Timer A: 3C ICHR2  
MSB  
-
LSB  
-
Timer B: 4C Reset Value  
Timer A: 3D ICLR2  
MSB  
-
LSB  
-
-
-
-
-
-
-
Timer B: 4D Reset Value  
73/172  
ST72260Gx, ST72262Gx, ST72264Gx  
16-BIT TIMER (Cont’d)  
Related Documentation  
AN1041: Using ST7 PWM signal to generate ana-  
log input (sinusoid)  
AN 973: SCI software communications using 16-  
bit timer  
AN1046: UART emulation software  
AN 974: Real Time Clock with ST7 Timer Output  
Compare  
AN1078: PWM duty cycle switch implementing  
true 0 or 100 per cent duty cycle  
AN 976: Driving a buzzer through the ST7 Timer  
PWM function  
AN1504: Starting a PWM signal directly at high  
level using the ST7 16-Bit timer  
74/172  
ST72260Gx, ST72262Gx, ST72264Gx  
11.4.3 General Description  
11.4 SERIAL PERIPHERAL INTERFACE (SPI)  
11.4.1 Introduction  
The Serial Peripheral Interface (SPI) allows full-  
duplex, synchronous, serial communication with  
external devices. An SPI system may consist of a  
master and one or more slaves or a system in  
which devices may be either masters or slaves.  
Figure 46 shows the serial peripheral interface  
(SPI) block diagram. There are 3 registers:  
– SPI Control Register (SPICR)  
– SPI Control/Status Register (SPICSR)  
– SPI Data Register (SPIDR)  
11.4.2 Main Features  
Full duplex synchronous transfers (on 3 lines)  
Simplex synchronous transfers (on 2 lines)  
Master or slave operation  
The SPI is connected to external devices through  
4 pins:  
– MISO: Master In / Slave Out data  
– MOSI: Master Out / Slave In data  
Six master mode frequencies (f  
/4 max.)  
CPU  
f  
/2 max. slave mode frequency (see note)  
CPU  
– SCK: Serial Clock out by SPI masters and in-  
put by SPI slaves  
SS Management by software or hardware  
Programmable clock polarity and phase  
End of transfer interrupt flag  
– SS: Slave select:  
This input signal acts as a ‘chip select’ to let  
the SPI master communicate with slaves indi-  
vidually and to avoid contention on the data  
lines. Slave SS inputs can be driven by stand-  
ard I/O ports on the master Device.  
Write collision, Master Mode Fault and Overrun  
flags  
Note: In slave mode, continuous transmission is  
not possible at maximum frequency due to the  
software overhead for clearing status flags and to  
initiate the next transmission sequence.  
75/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
Figure 46. Serial Peripheral Interface Block Diagram  
Data/Address Bus  
Read  
SPIDR  
Interrupt  
request  
Read Buffer  
MOSI  
7
0
SPICSR  
MISO  
8-Bit Shift Register  
SPIF WCOL OVR MODF  
0
SOD SSM SSI  
Write  
SOD  
bit  
1
SS  
SPI  
STATE  
0
SCK  
CONTROL  
7
0
SPICR  
MSTR  
SPR0  
SPIE SPE SPR2  
CPOL CPHA SPR1  
MASTER  
CONTROL  
SERIAL CLOCK  
GENERATOR  
SS  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.3.1 Functional Description  
sponds by sending data to the master device via  
the MISO pin. This implies full duplex communica-  
tion with both data out and data in synchronized  
with the same clock signal (which is provided by  
the master device via the SCK pin).  
A basic example of interconnections between a  
single master and a single slave is illustrated in  
Figure 47.  
The MOSI pins are connected together and the  
MISO pins are connected together. In this way  
data is transferred serially between master and  
slave (most significant bit first).  
To use a single data line, the MISO and MOSI pins  
must be connected at each node ( in this case only  
simplex communication is possible).  
Four possible data/clock timing relationships may  
be chosen (see Figure 50) but master and slave  
must be programmed with the same timing mode.  
The communication is always initiated by the mas-  
ter. When the master device transmits data to a  
slave device via MOSI pin, the slave device re-  
Figure 47. Single Master/ Single Slave Application  
SLAVE  
MASTER  
MSBit  
LSBit  
MSBit  
LSBit  
MISO  
MOSI  
MISO  
MOSI  
8-BIT SHIFT REGISTER  
8-BIT SHIFT REGISTER  
SPI  
CLOCK  
GENERATOR  
SCK  
SS  
SCK  
SS  
+5V  
Not used if SS is managed  
by software  
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ST72260Gx, ST72262Gx, ST72264Gx  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.3.2 Slave Select Management  
In Slave Mode:  
As an alternative to using the SS pin to control the  
Slave Select signal, the application can choose to  
manage the Slave Select signal by software. This  
is configured by the SSM bit in the SPICSR regis-  
ter (see Figure 49)  
There are two cases depending on the data/clock  
timing relationship (see Figure 48):  
If CPHA=1 (data latched on 2nd clock edge):  
– SS internal must be held low during the entire  
transmission. This implies that in single slave  
applications the SS pin either can be tied to  
In software management, the external SS pin is  
free for other application uses and the internal SS  
signal level is driven by writing to the SSI bit in the  
SPICSR register.  
V
, or made free for standard I/O by manag-  
SS  
ing the SS function by software (SSM= 1 and  
SSI=0 in the in the SPICSR register)  
If CPHA=0 (data latched on 1st clock edge):  
In Master mode:  
– SS internal must be held low during byte  
transmission and pulled high between each  
byte to allow the slave to write to the shift reg-  
ister. If SS is not pulled high, a Write Collision  
error will occur when the slave writes to the  
shift register (see Section 11.4.5.3).  
– SS internal must be held high continuously  
Figure 48. Generic SS Timing Diagram  
Byte 3  
Byte 2  
MOSI/MISO  
Master SS  
Byte 1  
Slave SS  
(if CPHA=0)  
Slave SS  
(if CPHA=1)  
Figure 49. Hardware/Software Slave Select Management  
SSM bit  
SSI bit  
1
0
SS internal  
SS external pin  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.3.3 Master Mode Operation  
Note: While the SPIF bit is set, all writes to the  
SPIDR register are inhibited until the SPICSR reg-  
ister is read.  
In master mode, the serial clock is output on the  
SCK pin. The clock frequency, polarity and phase  
are configured by software (refer to the description  
of the SPICSR register).  
11.4.3.5 Slave Mode Operation  
In slave mode, the serial clock is received on the  
SCK pin from the master device.  
Note: The idle state of SCK must correspond to  
the polarity selected in the SPICSR register (by  
pulling up SCK if CPOL=1 or pulling down SCK if  
CPOL=0).  
To operate the SPI in slave mode:  
1. Write to the SPICSR register to perform the fol-  
lowing actions:  
To operate the SPI in master mode, perform the  
following steps in order (if the SPICSR register is  
not written first, the SPICR register setting (MSTR  
bit ) may be not taken into account):  
– Select the clock polarity and clock phase by  
configuring the CPOL and CPHA bits (see  
Figure 50).  
Note: The slave must have the same CPOL  
and CPHA settings as the master.  
1. Write to the SPICR register:  
– Manage the SS pin as described in Section  
11.4.3.2 and Figure 48. If CPHA=1 SS must  
be held low continuously. If CPHA=0 SS must  
be held low during byte transmission and  
pulled up between each byte to let the slave  
write in the shift register.  
– Select the clock frequency by configuring the  
SPR[2:0] bits.  
– Select the clock polarity and clock phase by  
configuring the CPOL and CPHA bits. Figure  
50 shows the four possible configurations.  
Note: The slave must have the same CPOL  
and CPHA settings as the master.  
2. Write to the SPICR register to clear the MSTR  
bit and set the SPE bit to enable the SPI I/O  
functions.  
2. Write to the SPICSR register:  
– Either set the SSM bit and set the SSI bit or  
clear the SSM bit and tie the SS pin high for  
the complete byte transmit sequence.  
11.4.3.6 Slave Mode Transmit Sequence  
When software writes to the SPIDR register, the  
data byte is loaded into the 8-bit shift register and  
then shifted out serially to the MISO pin most sig-  
nificant bit first.  
3. Write to the SPICR register:  
– Set the MSTR and SPE bits  
Note: MSTR and SPE bits remain set only if  
SS is high).  
The transmit sequence begins when the slave de-  
vice receives the clock signal and the most signifi-  
cant bit of the data on its MOSI pin.  
The transmit sequence begins when software  
writes a byte in the SPIDR register.  
11.4.3.4 Master Mode Transmit Sequence  
When data transfer is complete:  
– The SPIF bit is set by hardware  
When software writes to the SPIDR register, the  
data byte is loaded into the 8-bit shift register and  
then shifted out serially to the MOSI pin most sig-  
nificant bit first.  
– An interrupt request is generated if SPIE bit is  
set and interrupt mask in the CCR register is  
cleared.  
When data transfer is complete:  
– The SPIF bit is set by hardware  
Clearing the SPIF bit is performed by the following  
software sequence:  
– An interrupt request is generated if the SPIE  
bit is set and the interrupt mask in the CCR  
register is cleared.  
1. An access to the SPICSR register while the  
SPIF bit is set.  
2. A write or a read to the SPIDR register.  
Clearing the SPIF bit is performed by the following  
software sequence:  
Notes: While the SPIF bit is set, all writes to the  
SPIDR register are inhibited until the SPICSR reg-  
ister is read.  
1. An access to the SPICSR register while the  
SPIF bit is set  
The SPIF bit can be cleared during a second  
transmission; however, it must be cleared before  
the second SPIF bit in order to prevent an Overrun  
condition (see Section 11.4.5.2).  
2. A read to the SPIDR register.  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.4 Clock Phase and Clock Polarity  
Figure 50, shows an SPI transfer with the four  
combinations of the CPHA and CPOL bits. The di-  
agram may be interpreted as a master or slave  
timing diagram where the SCK pin, the MISO pin,  
the MOSI pin are directly connected between the  
master and the slave device.  
Four possible timing relationships may be chosen  
by software, using the CPOL and CPHA bits (See  
Figure 50).  
Note: The idle state of SCK must correspond to  
the polarity selected in the SPICSR register (by  
pulling up SCK if CPOL=1 or pulling down SCK if  
CPOL=0).  
Note: If CPOL is changed at the communication  
byte boundaries, the SPI must be disabled by re-  
setting the SPE bit.  
The combination of the CPOL clock polarity and  
CPHA (clock phase) bits selects the data capture  
clock edge  
Figure 50. Data Clock Timing Diagram  
CPHA =1  
SCK  
(CPOL = 1)  
SCK  
(CPOL = 0)  
Bit 4  
Bit 4  
Bit3  
Bit3  
Bit 2  
Bit 2  
Bit 1  
Bit 1  
LSBit  
LSBit  
MSBit  
MSBit  
Bit 6  
Bit 6  
Bit 5  
Bit 5  
MISO  
(from master)  
MOSI  
(from slave)  
SS  
(to slave)  
CAPTURE STROBE  
CPHA =0  
SCK  
(CPOL = 1)  
SCK  
(CPOL = 0)  
Bit 4  
Bit 4  
Bit3  
Bit 2  
Bit 2  
Bit 1  
Bit 1  
LSBit  
LSBit  
MISO  
(from master)  
MSBit  
Bit 6  
Bit 6  
Bit 5  
Bit 5  
Bit3  
MOSI  
(from slave)  
MSBit  
SS  
(to slave)  
CAPTURE STROBE  
Note: This figure should not be used as a replacement for parametric information.  
Refer to the Electrical Characteristics chapter.  
80/172  
ST72260Gx, ST72262Gx, ST72264Gx  
11.4.5.2 Overrun Condition (OVR)  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.5 Error Flags  
11.4.5.1 Master Mode Fault (MODF)  
An overrun condition occurs, when the master de-  
vice has sent a data byte and the slave device has  
not cleared the SPIF bit issued from the previously  
transmitted byte.  
Master mode fault occurs when the master device  
has its SS pin pulled low.  
When a Master mode fault occurs:  
When an Overrun occurs:  
– The MODF bit is set and an SPI interrupt re-  
quest is generated if the SPIE bit is set.  
– The OVR bit is set and an interrupt request is  
generated if the SPIE bit is set.  
– The SPE bit is reset. This blocks all output  
from the Device and disables the SPI periph-  
eral.  
In this case, the receiver buffer contains the byte  
sent after the SPIF bit was last cleared. A read to  
the SPIDR register returns this byte. All other  
bytes are lost.  
– The MSTR bit is reset, thus forcing the Device  
into slave mode.  
The OVR bit is cleared by reading the SPICSR  
register.  
Clearing the MODF bit is done through a software  
sequence:  
11.4.5.3 Write Collision Error (WCOL)  
1. A read access to the SPICSR register while the  
MODF bit is set.  
A write collision occurs when the software tries to  
write to the SPIDR register while a data transfer is  
taking place with an external device. When this  
happens, the transfer continues uninterrupted;  
and the software write will be unsuccessful.  
2. A write to the SPICR register.  
Notes: To avoid any conflicts in an application  
with multiple slaves, the SS pin must be pulled  
high during the MODF bit clearing sequence. The  
SPE and MSTR bits may be restored to their orig-  
inal state during or after this clearing sequence.  
Write collisions can occur both in master and slave  
mode. See also Section 11.4.3.2 "Slave Select  
Management" on page 78.  
Hardware does not allow the user to set the SPE  
and MSTR bits while the MODF bit is set except in  
the MODF bit clearing sequence.  
Note: a "read collision" will never occur since the  
received data byte is placed in a buffer in which  
access is always synchronous with the CPU oper-  
ation.  
In a slave device, the MODF bit can not be set, but  
in a multi master configuration the Device can be in  
slave mode with the MODF bit set.  
The WCOL bit in the SPICSR register is set if a  
write collision occurs.  
The MODF bit indicates that there might have  
been a multi-master conflict and allows software to  
handle this using an interrupt routine and either  
perform to a reset or return to an application de-  
fault state.  
No SPI interrupt is generated when the WCOL bit  
is set (the WCOL bit is a status flag only).  
Clearing the WCOL bit is done through a software  
sequence (see Figure 51).  
Figure 51. Clearing the WCOL bit (Write Collision Flag) Software Sequence  
Clearing sequence after SPIF = 1 (end of a data byte transfer)  
Read SPICSR  
1st Step  
RESULT  
SPIF =0  
WCOL=0  
2nd Step  
Read SPIDR  
Clearing sequence before SPIF = 1 (during a data byte transfer)  
Read SPICSR  
1st Step  
Note: Writing to the SPIDR regis-  
ter instead of reading it does not  
reset the WCOL bit  
RESULT  
2nd Step  
Read SPIDR  
WCOL=0  
81/172  
ST72260Gx, ST72262Gx, ST72264Gx  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.5.4 Single Master and Multimaster  
Configurations  
For more security, the slave device may respond  
to the master with the received data byte. Then the  
master will receive the previous byte back from the  
slave device if all MISO and MOSI pins are con-  
nected and the slave has not written to its SPIDR  
register.  
There are two types of SPI systems:  
– Single Master System  
– Multimaster System  
Other transmission security methods can use  
ports for handshake lines or data bytes with com-  
mand fields.  
Single Master System  
A typical single master system may be configured,  
using a device as the master and four devices as  
slaves (see Figure 52).  
Multi-Master System  
A multi-master system may also be configured by  
the user. Transfer of master control could be im-  
plemented using a handshake method through the  
I/O ports or by an exchange of code messages  
through the serial peripheral interface system.  
The master device selects the individual slave de-  
vices by using four pins of a parallel port to control  
the four SS pins of the slave devices.  
The SS pins are pulled high during reset since the  
master device ports will be forced to be inputs at  
that time, thus disabling the slave devices.  
The multi-master system is principally handled by  
the MSTR bit in the SPICR register and the MODF  
bit in the SPICSR register.  
Note: To prevent a bus conflict on the MISO line  
the master allows only one active slave device  
during a transmission.  
Figure 52. Single Master / Multiple Slave Configuration  
SS  
SS  
SS  
SS  
SCK  
SCK  
Slave  
SCK  
Slave  
SCK  
Slave  
Slave  
Device  
Device  
Device  
Device  
MOSI MISO  
MOSI MISO  
MOSI MISO  
MOSI MISO  
MOSI MISO  
SCK  
Master  
Device  
5V  
SS  
82/172  
ST72260Gx, ST72262Gx, ST72264Gx  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.6 Low Power Modes  
SS pin or the SSI bit in the SPICSR register) is low  
when the Device enters Halt mode. So if Slave se-  
lection is configured as external (see Section  
11.4.3.2), make sure the master drives a low level  
on the SS pin when the slave enters Halt mode.  
Mode  
Description  
No effect on SPI.  
WAIT  
SPI interrupt events cause the Device to exit  
from WAIT mode.  
11.4.7 Interrupts  
SPI registers are frozen.  
In HALT mode, the SPI is inactive. SPI oper-  
ation resumes when the Device is woken up  
by an interrupt with “exit from HALT mode”  
capability. The data received is subsequently  
read from the SPIDR register when the soft-  
ware is running (interrupt vector fetching). If  
several data are received before the wake-  
up event, then an overrun error is generated.  
This error can be detected after the fetch of  
the interrupt routine that woke up the Device.  
Enable  
Control from  
Bit  
Exit  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Wait  
SPI End of Trans-  
fer Event  
HALT  
SPIF  
Yes  
Yes  
Master Mode  
Fault Event  
SPIE  
MODF  
OVR  
Yes  
Yes  
No  
No  
Overrun Error  
Note: The SPI interrupt events are connected to  
the same interrupt vector (see Interrupts chapter).  
They generate an interrupt if the corresponding  
Enable Control Bit is set and the interrupt mask in  
the CC register is reset (RIM instruction).  
11.4.6.1 Using the SPI to wake-up the Device  
from Halt mode  
In slave configuration, the SPI is able to wake-up  
the Device from HALT mode through a SPIF inter-  
rupt. The data received is subsequently read from  
the SPIDR register when the software is running  
(interrupt vector fetch). If multiple data transfers  
have been performed before software clears the  
SPIF bit, then the OVR bit is set by hardware.  
Note: When waking up from Halt mode, if the SPI  
remains in Slave mode, it is recommended to per-  
form an extra communications cycle to bring the  
SPI from Halt mode state to normal state. If the  
SPI exits from Slave mode, it returns to normal  
state immediately.  
Caution: The SPI can wake-up the Device from  
Halt mode only if the Slave Select signal (external  
83/172  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
11.4.8 Register Description  
CONTROL REGISTER (SPICR)  
Read/Write  
Bit 3 = CPOL Clock Polarity.  
This bit is set and cleared by software. This bit de-  
termines the idle state of the serial Clock. The  
CPOL bit affects both the master and slave  
modes.  
Reset Value: 0000 xxxx (0xh)  
7
0
SPIE SPE SPR2 MSTR CPOL CPHA SPR1 SPR0  
0: SCK pin has a low level idle state  
1: SCK pin has a high level idle state  
Note: If CPOL is changed at the communication  
byte boundaries, the SPI must be disabled by re-  
setting the SPE bit.  
Bit 7 = SPIE Serial Peripheral Interrupt Enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SPI interrupt is generated whenever an End  
of Transfer event, Master Mode Fault or Over-  
run error occurs (SPIF=1, MODF=1 or OVR=1  
in the SPICSR register)  
Bit 2 = CPHA Clock Phase.  
This bit is set and cleared by software.  
0: The first clock transition is the first data capture  
edge.  
1: The second clock transition is the first capture  
edge.  
Bit 6 = SPE Serial Peripheral Output Enable.  
This bit is set and cleared by software. It is also  
cleared by hardware when, in master mode, SS=0  
(see Section 11.4.5.1 "Master Mode Fault  
(MODF)" on page 81). The SPE bit is cleared by  
reset, so the SPI peripheral is not initially connect-  
ed to the external pins.  
Note: The slave must have the same CPOL and  
CPHA settings as the master.  
Bits 1:0 = SPR[1:0] Serial Clock Frequency.  
These bits are set and cleared by software. Used  
with the SPR2 bit, they select the baud rate of the  
SPI serial clock SCK output by the SPI in master  
mode.  
0: I/O pins free for general purpose I/O  
1: SPI I/O pin alternate functions enabled  
Note: These 2 bits have no effect in slave mode.  
Bit 5 = SPR2 Divider Enable.  
This bit is set and cleared by software and is  
cleared by reset. It is used with the SPR[1:0] bits to  
set the baud rate. Refer to Table 16 SPI Master  
mode SCK Frequency.  
Table 16. SPI Master mode SCK Frequency  
Serial Clock  
SPR2 SPR1 SPR0  
f
f
/4  
/8  
1
0
0
1
0
0
0
0
0
1
1
1
0
0
1
0
0
1
CPU  
CPU  
0: Divider by 2 enabled  
1: Divider by 2 disabled  
f
f
f
/16  
/32  
/64  
CPU  
CPU  
CPU  
Note: This bit has no effect in slave mode.  
Bit 4 = MSTR Master Mode.  
This bit is set and cleared by software. It is also  
cleared by hardware when, in master mode, SS=0  
(see Section 11.4.5.1 "Master Mode Fault  
(MODF)" on page 81).  
f
/128  
CPU  
0: Slave mode  
1: Master mode. The function of the SCK pin  
changes from an input to an output and the func-  
tions of the MISO and MOSI pins are reversed.  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
CONTROL/STATUS REGISTER (SPICSR)  
Read/Write (some bits Read Only)  
Reset Value: 0000 0000 (00h)  
Bit 2 = SOD SPI Output Disable.  
This bit is set and cleared by software. When set, it  
disables the alternate function of the SPI output  
(MOSI in master mode / MISO in slave mode)  
0: SPI output enabled (if SPE=1)  
7
0
SPIF  
WCOL OVR MODF  
-
SOD SSM SSI  
1: SPI output disabled  
Bit 7 = SPIF Serial Peripheral Data Transfer Flag  
(Read only).  
Bit 1 = SSM SS Management.  
This bit is set and cleared by software. When set, it  
disables the alternate function of the SPI SS pin  
and uses the SSI bit value instead. See Section  
11.4.3.2 "Slave Select Management" on page 78.  
0: Hardware management (SS managed by exter-  
nal pin)  
This bit is set by hardware when a transfer has  
been completed. An interrupt is generated if  
SPIE=1 in the SPICR register. It is cleared by a  
software sequence (an access to the SPICSR  
register followed by a write or a read to the  
SPIDR register).  
1: Software management (internal SS signal con-  
trolled by SSI bit. External SS pin free for gener-  
al-purpose I/O)  
0: Data transfer is in progress or the flag has been  
cleared.  
1: Data transfer between the Device and an exter-  
nal device has been completed.  
Bit 0 = SSI SS Internal Mode.  
Note: While the SPIF bit is set, all writes to the  
SPIDR register are inhibited until the SPICSR reg-  
ister is read.  
This bit is set and cleared by software. It acts as a  
‘chip select’ by controlling the level of the SS slave  
select signal when the SSM bit is set.  
0 : Slave selected  
Bit 6 = WCOL Write Collision status (Read only).  
This bit is set by hardware when a write to the  
SPIDR register is done during a transmit se-  
quence. It is cleared by a software sequence (see  
Figure 51).  
0: No write collision occurred  
1: A write collision has been detected  
1 : Slave deselected  
DATA I/O REGISTER (SPIDR)  
Read/Write  
Reset Value: Undefined  
7
0
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Bit 5 = OVR SPI Overrun error (Read only).  
This bit is set by hardware when the byte currently  
being received in the shift register is ready to be  
transferred into the SPIDR register while SPIF = 1  
(See Section 11.4.5.2). An interrupt is generated if  
SPIE = 1 in the SPICR register. The OVR bit is  
cleared by software reading the SPICSR register.  
0: No overrun error  
The SPIDR register is used to transmit and receive  
data on the serial bus. In a master device, a write  
to this register will initiate transmission/reception  
of another byte.  
Notes: During the last clock cycle the SPIF bit is  
set, a copy of the received data byte in the shift  
register is moved to a buffer. When the user reads  
the serial peripheral data I/O register, the buffer is  
actually being read.  
1: Overrun error detected  
Bit 4 = MODF Mode Fault flag (Read only).  
This bit is set by hardware when the SS pin is  
pulled low in master mode (see Section 11.4.5.1  
"Master Mode Fault (MODF)" on page 81). An SPI  
interrupt can be generated if SPIE=1 in the SPICR  
register. This bit is cleared by a software sequence  
(An access to the SPICSR register while MODF=1  
followed by a write to the SPICR register).  
While the SPIF bit is set, all writes to the SPIDR  
register are inhibited until the SPICSR register is  
read.  
Warning: A write to the SPIDR register places  
data directly into the shift register for transmission.  
A read to the SPIDR register returns the value lo-  
cated in the buffer and not the content of the shift  
register (see Figure 46).  
0: No master mode fault detected  
1: A fault in master mode has been detected  
Bit 3 = Reserved, must be kept cleared.  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
Table 17. SPI Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
SPIDR  
Reset Value  
MSB  
x
LSB  
x
0021h  
0022h  
0023h  
x
x
x
x
x
x
SPICR  
Reset Value  
SPIE  
0
SPE  
0
SPR2  
0
MSTR  
0
CPOL  
x
CPHA  
x
SPR1  
x
SPR0  
x
SPICSR  
Reset Value  
SPIF  
0
WCOL  
0
OR  
0
MODF  
0
SOD  
0
SSM  
0
SSI  
0
0
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11.5.3 General Description  
11.5 SERIAL COMMUNICATIONS INTERFACE (SCI)  
11.5.1 Introduction  
The Serial Communications Interface (SCI) offers  
a flexible means of full-duplex data exchange with  
external equipment requiring an industry standard  
NRZ asynchronous serial data format. The SCI of-  
fers a very wide range of baud rates using two  
baud rate generator systems.  
The interface is externally connected to another  
device by two pins (see Figure 54):  
– TDO: Transmit Data Output. When the transmit-  
ter and the receiver are disabled, the output pin  
returns to its I/O port configuration. When the  
transmitter and/or the receiver are enabled and  
nothing is to be transmitted, the TDO pin is at  
high level.  
11.5.2 Main Features  
Full duplex, asynchronous communications  
NRZ standard format (Mark/Space)  
Dual baud rate generator systems  
– RDI: Receive Data Input is the serial data input.  
Oversampling techniques are used for data re-  
covery by discriminating between valid incoming  
data and noise.  
Independently programmable transmit and  
receive baud rates up to 500K baud.  
Through these pins, serial data is transmitted and  
received as frames comprising:  
Programmable data word length (8 or 9 bits)  
Receive buffer full, Transmit buffer empty and  
– An Idle Line prior to transmission or reception  
– A start bit  
End of Transmission flags  
Two receiver wake-up modes:  
– Address bit (MSB)  
– A data word (8 or 9 bits) least significant bit first  
– A Stop bit indicating that the frame is complete.  
Thisinterfaceusestwotypesofbaudrategenerator:  
– Idle line  
Mutingfunctionformultiprocessorconfigurations  
– A conventional type for commonly-used baud  
rates,  
Separate enable bits for Transmitter and  
Receiver  
– An extended type with a prescaler offering a very  
wide range of baud rates even with non-standard  
oscillator frequencies.  
Four error detection flags:  
– Overrun error  
– Noise error  
– Frame error  
– Parity error  
Five interrupt sources with flags:  
– Transmit data register empty  
– Transmission complete  
– Receive data register full  
– Idle line received  
– Overrun error detected  
Parity control:  
– Transmits parity bit  
– Checks parity of received data byte  
Reduced power consumption mode  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Figure 53. SCI Block Diagram  
Write  
Read  
(DATA REGISTER) DR  
Received Data Register (RDR)  
Received Shift Register  
Transmit Data Register (TDR)  
TDO  
Transmit Shift Register  
RDI  
CR1  
R8 T8 SCID  
M WAKE PCE PS PIE  
WAKE  
UP  
TRANSMIT  
CONTROL  
RECEIVER  
CLOCK  
RECEIVER  
CONTROL  
UNIT  
CR2  
SR  
TIE TCIE RIE ILIE TE RE RWU SBK  
TDRE TC RDRF IDLE OR NF FE  
PE  
SCI  
INTERRUPT  
CONTROL  
TRANSMITTER  
CLOCK  
TRANSMITTER RATE  
CONTROL  
f
CPU  
/PR  
/16  
BRR  
SCP1  
SCT2  
SCT1SCT0SCR2 SCR1SCR0  
SCP0  
RECEIVER RATE  
CONTROL  
CONVENTIONAL BAUD RATE GENERATOR  
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11.5.4.1 Serial Data Format  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.4 Functional Description  
The block diagram of the Serial Control Interface,  
is shown in Figure 53. It contains 6 dedicated reg-  
isters:  
Word length may be selected as being either 8 or 9  
bits by programming the M bit in the SCICR1 reg-  
ister (see Figure 53).  
– Two control registers (SCICR1 & SCICR2)  
– A status register (SCISR)  
The TDO pin is in low state during the start bit.  
The TDO pin is in high state during the stop bit.  
– A baud rate register (SCIBRR)  
An Idle character is interpreted as an entire frame  
of “1”s followed by the start bit of the next frame  
which contains data.  
– An extended prescaler receiver register (SCIER-  
PR)  
A Break character is interpreted on receiving “0”s  
for some multiple of the frame period. At the end of  
the last break frame the transmitter inserts an ex-  
tra “1” bit to acknowledge the start bit.  
– An extended prescaler transmitter register (SCI-  
ETPR)  
Refer to the register descriptions in Section  
11.5.7for the definitions of each bit.  
Transmission and reception are driven by their  
own baud rate generator.  
Figure 54. Word Length Programming  
9-bit Word length (M bit is set)  
Possible  
Next Data Frame  
Parity  
Data Frame  
Start  
Bit  
Next  
Start  
Bit  
Stop  
Bit  
Bit2  
Bit6  
Bit3  
Bit4  
Bit5  
Bit7  
Bit8  
Bit0 Bit1  
Bit  
Start  
Bit  
Idle Frame  
Start  
Bit  
Extra  
’1’  
Break Frame  
8-bit Word length (M bit is reset)  
Possible  
Parity  
Next Data Frame  
Data Frame  
Bit  
Next  
Start  
Bit  
Start  
Bit  
Stop  
Bit  
Bit2  
Bit1  
Bit3  
Bit4  
Bit5  
Bit6  
Bit0  
Bit7  
Start  
Bit  
Idle Frame  
Start  
Bit  
Extra  
’1’  
Break Frame  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.4.2 Transmitter  
When a frame transmission is complete (after the  
stop bit or after the break frame) the TC bit is set  
and an interrupt is generated if the TCIE is set and  
the I bit is cleared in the CCR register.  
The transmitter can send data words of either 8 or  
9 bits depending on the M bit status. When the M  
bit is set, word length is 9 bits and the 9th bit (the  
MSB) has to be stored in the T8 bit in the SCICR1  
register.  
Clearing the TC bit is performed by the following  
software sequence:  
1. An access to the SCISR register  
2. A write to the SCIDR register  
Character Transmission  
During an SCI transmission, data shifts out least  
significant bit first on the TDO pin. In this mode,  
the SCIDR register consists of a buffer (TDR) be-  
tween the internal bus and the transmit shift regis-  
ter (see Figure 53).  
Note: The TDRE and TC bits are cleared by the  
same software sequence.  
Break Characters  
Setting the SBK bit loads the shift register with a  
break character. The break frame length depends  
on the M bit (see Figure 54).  
Procedure  
– Select the M bit to define the word length.  
As long as the SBK bit is set, the SCI send break  
frames to the TDO pin. After clearing this bit by  
software the SCI insert a logic 1 bit at the end of  
the last break frame to guarantee the recognition  
of the start bit of the next frame.  
– Select the desired baud rate using the SCIBRR  
and the SCIETPR registers.  
– Set the TE bit to assign the TDO pin to the alter-  
nate function and to send a idle frame as first  
transmission.  
Idle Characters  
– Access the SCISR register and write the data to  
send in the SCIDR register (this sequence clears  
the TDRE bit). Repeat this sequence for each  
data to be transmitted.  
Setting the TE bit drives the SCI to send an idle  
frame before the first data frame.  
Clearing and then setting the TE bit during a trans-  
mission sends an idle frame after the current word.  
Clearing the TDRE bit is always performed by the  
following software sequence:  
1. An access to the SCISR register  
2. A write to the SCIDR register  
Note: Resetting and setting the TE bit causes the  
data in the TDR register to be lost. Therefore the  
best time to toggle the TE bit is when the TDRE bit  
is set i.e. before writing the next byte in the SCIDR.  
The TDRE bit is set by hardware and it indicates:  
– The TDR register is empty.  
– The data transfer is beginning.  
– The next data can be written in the SCIDR regis-  
ter without overwriting the previous data.  
This flag generates an interrupt if the TIE bit is set  
and the I bit is cleared in the CCR register.  
When a transmission is taking place, a write in-  
struction to the SCIDR register stores the data in  
the TDR register and which is copied in the shift  
register at the end of the current transmission.  
When no transmission is taking place, a write in-  
struction to the SCIDR register places the data di-  
rectly in the shift register, the data transmission  
starts, and the TDRE bit is immediately set.  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.4.3 Receiver  
RDR register as long as the RDRF bit is not  
cleared.  
The SCI can receive data words of either 8 or 9  
bits. When the M bit is set, word length is 9 bits  
and the MSB is stored in the R8 bit in the SCICR1  
register.  
When a overrun error occurs:  
– The OR bit is set.  
– The RDR content will not be lost.  
– The shift register will be overwritten.  
Character reception  
During a SCI reception, data shifts in least signifi-  
cant bit first through the RDI pin. In this mode, the  
SCIDR register consists or a buffer (RDR) be-  
tween the internal bus and the received shift regis-  
ter (see Figure 53).  
– An interrupt is generated if the RIE bit is set and  
the I bit is cleared in the CCR register.  
The OR bit is reset by an access to the SCISR reg-  
ister followed by a SCIDR register read operation.  
Procedure  
Noise Error  
– Select the M bit to define the word length.  
Oversampling techniques are used for data recov-  
ery by discriminating between valid incoming data  
and noise. Normal data bits are considered valid if  
three consecutive samples (8th, 9th, 10th) have  
the same bit value, otherwise the NF flag is set. In  
the case of start bit detection, the NF flag is set on  
the basis of an algorithm combining both valid  
edge detection and three samples (8th, 9th, 10th).  
Therefore, to prevent the NF flag getting set during  
start bit reception, there should be a valid edge de-  
tection as well as three valid samples.  
– Select the desired baud rate using the SCIBRR  
and the SCIERPR registers.  
– Set the RE bit, this enables the receiver which  
begins searching for a start bit.  
When a character is received:  
– The RDRF bit is set. It indicates that the content  
of the shift register is transferred to the RDR.  
– An interrupt is generated if the RIE bit is set and  
the I bit is cleared in the CCR register.  
When noise is detected in a frame:  
– The error flags can be set if a frame error, noise  
or an overrun error has been detected during re-  
ception.  
– The NF flag is set at the rising edge of the RDRF  
bit.  
– Data is transferred from the Shift register to the  
SCIDR register.  
Clearing the RDRF bit is performed by the following  
software sequence done by:  
– No interrupt is generated. However this bit rises  
at the same time as the RDRF bit which itself  
generates an interrupt.  
1. An access to the SCISR register  
2. A read to the SCIDR register.  
The RDRF bit must be cleared before the end of the  
reception of the next character to avoid an overrun  
error.  
The NF flag is reset by a SCISR register read op-  
eration followed by a SCIDR register read opera-  
tion.  
Break Character  
During reception, if a false start bit is detected (e.g.  
8th, 9th, 10th samples are 011,101,110), the  
frame is discarded and the receiving sequence is  
not started for this frame. There is no RDRF bit set  
for this frame and the NF flag is set internally (not  
accessible to the user). This NF flag is accessible  
along with the RDRF bit when a next valid frame is  
received.  
When a break character is received, the SPI han-  
dles it as a framing error.  
Idle Character  
When a idle frame is detected, there is the same  
procedure as a data received character plus an in-  
terrupt if the ILIE bit is set and the I bit is cleared in  
the CCR register.  
Note: If the application Start Bit is not long enough  
to match the above requirements, then the NF  
Flag may get set due to the short Start Bit. In this  
case, the NF flag may be ignored by the applica-  
tion software when the first valid byte is received.  
Overrun Error  
An overrun error occurs when a character is re-  
ceived when RDRF has not been reset. Data can  
not be transferred from the shift register to the  
See also Section 11.5.4.10.  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Figure 55. SCI Baud Rate and Extended Prescaler Block Diagram  
TRANSMITTER  
CLOCK  
EXTENDED PRESCALER TRANSMITTER RATE CONTROL  
SCIETPR  
EXTENDED TRANSMITTER PRESCALER REGISTER  
SCIERPR  
EXTENDED RECEIVER PRESCALER REGISTER  
RECEIVER  
CLOCK  
EXTENDED PRESCALER RECEIVER RATE CONTROL  
EXTENDED PRESCALER  
f
CPU  
TRANSMITTER RATE  
CONTROL  
/PR  
/16  
SCIBRR  
SCP1  
SCT2  
SCT1SCT0SCR2 SCR1SCR0  
SCP0  
RECEIVER RATE  
CONTROL  
CONVENTIONAL BAUD RATE GENERATOR  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Framing Error  
Note: the extended prescaler is activated by set-  
ting the SCIETPR or SCIERPR register to a value  
other than zero. The baud rates are calculated as  
follows:  
A framing error is detected when:  
– The stop bit is not recognized on reception at the  
expected time, following either a de-synchroni-  
zation or excessive noise.  
f
f
CPU  
CPU  
Rx =  
16 ERPR*(PR*RR)  
Tx =  
16 ETPR*(PR*TR)  
– A break is received.  
*
*
When the framing error is detected:  
– the FE bit is set by hardware  
with:  
– Data is transferred from the Shift register to the  
SCIDR register.  
ETPR = 1,..,255 (see SCIETPR register)  
ERPR = 1,.. 255 (see SCIERPR register)  
11.5.4.6 Receiver Muting and Wake-up Feature  
– No interrupt is generated. However this bit rises  
at the same time as the RDRF bit which itself  
generates an interrupt.  
In multiprocessor configurations it is often desira-  
ble that only the intended message recipient  
should actively receive the full message contents,  
thus reducing redundant SCI service overhead for  
all non addressed receivers.  
The FE bit is reset by a SCISR register read oper-  
ation followed by a SCIDR register read operation.  
11.5.4.4 Conventional Baud Rate Generation  
The baud rate for the receiver and transmitter (Rx  
and Tx) are set independently and calculated as  
follows:  
The non addressed devices may be placed in  
sleep mode by means of the muting function.  
Setting the RWU bit by software puts the SCI in  
sleep mode:  
f
f
CPU  
CPU  
Rx =  
Tx =  
All the reception status bits can not be set.  
All the receive interrupts are inhibited.  
(16 PR) RR  
(16 PR) TR  
*
*
*
*
with:  
A muted receiver may be awakened by one of the  
following two ways:  
PR = 1, 3, 4 or 13 (see SCP[1:0] bits)  
TR = 1, 2, 4, 8, 16, 32, 64,128  
(see SCT[2:0] bits)  
– by Idle Line detection if the WAKE bit is reset,  
– by Address Mark detection if the WAKE bit is set.  
RR = 1, 2, 4, 8, 16, 32, 64,128  
(see SCR[2:0] bits)  
Receiver wakes-up by Idle Line detection when  
the Receive line has recognised an Idle Frame.  
Then the RWU bit is reset by hardware but the  
IDLE bit is not set.  
All these bits are in the SCIBRR register.  
Example: If f is 8 MHz (normal mode) and if  
CPU  
Receiver wakes-up by Address Mark detection  
when it received a “1” as the most significant bit of  
a word, thus indicating that the message is an ad-  
dress. The reception of this particular word wakes  
up the receiver, resets the RWU bit and sets the  
RDRF bit, which allows the receiver to receive this  
word normally and to use it as an address word.  
PR=13 and TR=RR=1, the transmit and receive  
baud rates are 38400 baud.  
Note: the baud rate registers MUST NOT be  
changed while the transmitter or the receiver is en-  
abled.  
11.5.4.5 Extended Baud Rate Generation  
The extended prescaler option gives a very fine  
tuning on the baud rate, using a 255 value prescal-  
er, whereas the conventional Baud Rate Genera-  
tor retains industry standard software compatibili-  
ty.  
Caution: In Mute mode, do not write to the  
SCICR2 register. If the SCI is in Mute mode during  
the read operation (RWU=1) and a address mark  
wake up event occurs (RWU is reset) before the  
write operation, the RWU bit will be set again by  
this write operation. Consequently the address  
byte is lost and the SCI is not woken up from Mute  
mode.  
The extended baud rate generator block diagram  
is described in the Figure 55.  
The output clock rate sent to the transmitter or to  
the receiver will be the output from the 16 divider  
divided by a factor ranging from 1 to 255 set in the  
SCIERPR or the SCIETPR register.  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.4.7 Parity Control  
even number of “1s” if even parity is selected  
(PS=0) or an odd number of “1s” if odd parity is se-  
lected (PS=1). If the parity check fails, the PE flag  
is set in the SCISR register and an interrupt is gen-  
erated if PIE is set in the SCICR1 register.  
Parity control (generation of parity bit in transmis-  
sion and parity checking in reception) can be ena-  
bled by setting the PCE bit in the SCICR1 register.  
Depending on the frame length defined by the M  
bit, the possible SCI frame formats are as listed in  
Table 18.  
11.5.4.8 SCI Clock Tolerance  
During reception, each bit is sampled 16 times.  
The majority of the 8th, 9th and 10th samples is  
considered as the bit value. For a valid bit detec-  
tion, all the three samples should have the same  
value otherwise the noise flag (NF) is set. For ex-  
ample: if the 8th, 9th and 10th samples are 0, 1  
and 1 respectively, then the bit value will be “1”,  
but the Noise Flag bit is be set because the three  
samples values are not the same.  
Table 18. Frame Formats  
M bit  
PCE bit  
SCI frame  
0
0
1
1
0
1
0
1
| SB | 8 bit data | STB |  
| SB | 7-bit data | PB | STB |  
| SB | 9-bit data | STB |  
| SB | 8-bit data PB | STB |  
Legend: SB = Start Bit, STB = Stop Bit,  
PB = Parity Bit  
Consequently, the bit length must be long enough  
so that the 8th, 9th and 10th samples have the de-  
sired bit value. This means the clock frequency  
should not vary more than 6/16 (37.5%) within one  
bit. The sampling clock is resynchronized at each  
start bit, so that when receiving 10 bits (one start  
bit, 1 data byte, 1 stop bit), the clock deviation  
must not exceed 3.75%.  
Note: In case of wake up by an address mark, the  
MSB bit of the data is taken into account and not  
the parity bit  
Even parity: the parity bit is calculated to obtain  
an even number of “1s” inside the frame made of  
the 7 or 8 LSB bits (depending on whether M is  
equal to 0 or 1) and the parity bit.  
Note: The internal sampling clock of the microcon-  
troller samples the pin value on every falling edge.  
Therefore, the internal sampling clock and the time  
the application expects the sampling to take place  
may be out of sync. For example: If the baud rate  
is 15.625 kbaud (bit length is 64µs), then the 8th,  
9th and 10th samples will be at 28µs, 32µs & 36µs  
respectively (the first sample starting ideally at  
0µs). But if the falling edge of the internal clock oc-  
curs just before the pin value changes, the sam-  
ples would then be out of sync by ~4us. This  
means the entire bit length must be at least 40µs  
(36µs for the 10th sample + 4µs for synchroniza-  
tion with the internal sampling clock).  
Ex: data=00110101; 4 bits set => parity bit will be  
0 if even parity is selected (PS bit = 0).  
Odd parity: the parity bit is calculated to obtain an  
odd number of “1s” inside the frame made of the 7  
or 8 LSB bits (depending on whether M is equal to  
0 or 1) and the parity bit.  
Ex: data=00110101; 4 bits set => parity bit will be  
1 if odd parity is selected (PS bit = 1).  
Transmission mode: If the PCE bit is set then the  
MSB bit of the data written in the data register is  
not transmitted but is changed by the parity bit.  
Reception mode: If the PCE bit is set then the in-  
terface checks if the received data byte has an  
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11.5.4.10 Noise Error Causes  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.4.9 Clock Deviation Causes  
The causes which contribute to the total deviation  
are:  
See also description of Noise error in Section  
11.5.4.3.  
– D  
: Deviation due to transmitter error (Local  
Start bit  
TRA  
oscillator error of the transmitter or the trans-  
mitter is transmitting at a different baud rate).  
The noise flag (NF) is set during start bit reception  
if one of the following conditions occurs:  
– D  
: Error due to the baud rate quantisa-  
QUANT  
1. A valid falling edge is not detected. A falling  
edge is considered to be valid if the 3 consecu-  
tive samples before the falling edge occurs are  
detected as '1' and, after the falling edge  
occurs, during the sampling of the 16 samples,  
if one of the samples numbered 3, 5 or 7 is  
detected as a “1”.  
tion of the receiver.  
– D  
: Deviation of the local oscillator of the  
REC  
receiver: This deviation can occur during the  
reception of one complete SCI message as-  
suming that the deviation has been compen-  
sated at the beginning of the message.  
– D  
: Deviation due to the transmission line  
2. During sampling of the 16 samples, if one of the  
samples numbered 8, 9 or 10 is detected as a  
“1”.  
TCL  
(generally due to the transceivers)  
All the deviations of the system should be added  
and compared to the SCI clock tolerance:  
Therefore, a valid Start Bit must satisfy both the  
above conditions to prevent the Noise Flag getting  
set.  
D
+ D  
+ D  
+ D  
< 3.75%  
TCL  
TRA  
QUANT  
REC  
Data Bits  
The noise flag (NF) is set during normal data bit re-  
ception if the following condition occurs:  
– During the sampling of 16 samples, if all three  
samples numbered 8, 9 and10 are not the same.  
The majority of the 8th, 9th and 10th samples is  
considered as the bit value.  
Therefore, a valid Data Bit must have samples 8, 9  
and 10 at the same value to prevent the Noise  
Flag getting set.  
Figure 56. Bit Sampling in Reception Mode  
RDI LINE  
sampled values  
Sample  
clock  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16  
6/16  
7/16  
7/16  
One bit time  
95/172  
ST72260Gx, ST72262Gx, ST72264Gx  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.5 Low Power Modes  
Enable Exit  
Control from from  
Exit  
Event  
Flag  
Interrupt Event  
Mode  
Description  
Bit  
Wait  
Halt  
No effect on SCI.  
Transmit Data Register  
Empty  
TDRE  
TC  
TIE  
Yes  
No  
WAIT  
SCI interrupts cause the device to exit  
from Wait mode.  
Transmission Com-  
plete  
TCIE  
RIE  
Yes  
Yes  
No  
No  
SCI registers are frozen.  
Received Data Ready  
to be Read  
RDRF  
In Halt mode, the SCI stops transmit-  
ting/receiving until Halt mode is exit-  
ed.  
HALT  
Overrun Error Detected OR  
Yes  
Yes  
Yes  
No  
No  
No  
Idle Line Detected  
Parity Error  
IDLE  
PE  
ILIE  
PIE  
11.5.6 Interrupts  
The SCI interrupt events are connected to the  
same interrupt vector.  
rupt mask in the CC register is reset (RIM instruc-  
tion).  
These events generate an interrupt if the corre-  
sponding Enable Control Bit is set and the inter-  
96/172  
ST72260Gx, ST72262Gx, ST72264Gx  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
11.5.7 Register Description  
Note: The IDLE bit will not be set again until the  
RDRF bit has been set itself (i.e. a new idle line oc-  
curs).  
STATUS REGISTER (SCISR)  
Read Only  
Reset Value: 1100 0000 (C0h)  
Bit 3 = OR Overrun error.  
7
0
This bit is set by hardware when the word currently  
being received in the shift register is ready to be  
transferred into the RDR register while RDRF=1.  
An interrupt is generated if RIE=1 in the SCICR2  
register. It is cleared by a software sequence (an  
access to the SCISR register followed by a read to  
the SCIDR register).  
TDRE  
TC  
RDRF IDLE  
OR  
NF  
FE  
PE  
Bit 7 = TDRE Transmit data register empty.  
This bit is set by hardware when the content of the  
TDR register has been transferred into the shift  
register. An interrupt is generated if the TIE bit=1  
in the SCICR2 register. It is cleared by a software  
sequence (an access to the SCISR register fol-  
lowed by a write to the SCIDR register).  
0: No Overrun error  
1: Overrun error is detected  
Note: When this bit is set RDR register content will  
not be lost but the shift register will be overwritten.  
0: Data is not transferred to the shift register  
1: Data is transferred to the shift register  
Bit 2 = NF Noise flag.  
Note: Data will not be transferred to the shift reg-  
This bit is set by hardware when noise is detected  
on a received frame. It is cleared by a software se-  
quence (an access to the SCISR register followed  
by a read to the SCIDR register).  
0: No noise is detected  
ister unless the TDRE bit is cleared.  
Bit 6 = TC Transmission complete.  
This bit is set by hardware when transmission of a  
frame containing Data is complete. An interrupt is  
generated if TCIE=1 in the SCICR2 register. It is  
cleared by a software sequence (an access to the  
SCISR register followed by a write to the SCIDR  
register).  
1: Noise is detected  
Note: This bit does not generate interrupt as it ap-  
pears at the same time as the RDRF bit which it-  
self generates an interrupt.  
0: Transmission is not complete  
1: Transmission is complete  
Bit 1 = FE Framing error.  
This bit is set by hardware when a de-synchroniza-  
tion, excessive noise or a break character is de-  
tected. It is cleared by a software sequence (an  
access to the SCISR register followed by a read to  
the SCIDR register).  
Note: TC is not set after the transmission of a Pre-  
amble or a Break.  
Bit 5 = RDRF Received data ready flag.  
This bit is set by hardware when the content of the  
RDR register has been transferred to the SCIDR  
register. An interrupt is generated if RIE=1 in the  
SCICR2 register. It is cleared by a software se-  
quence (an access to the SCISR register followed  
by a read to the SCIDR register).  
0: No Framing error is detected  
1: Framing error or break character is detected  
Note: This bit does not generate interrupt as it ap-  
pears at the same time as the RDRF bit which it-  
self generates an interrupt. If the word currently  
being transferred causes both frame error and  
overrun error, it will be transferred and only the OR  
bit will be set.  
0: Data is not received  
1: Received data is ready to be read  
Bit 4 = IDLE Idle line detect.  
This bit is set by hardware when a Idle Line is de-  
tected. An interrupt is generated if the ILIE=1 in  
the SCICR2 register. It is cleared by a software se-  
quence (an access to the SCISR register followed  
by a read to the SCIDR register).  
Bit 0 = PE Parity error.  
This bit is set by hardware when a parity error oc-  
curs in receiver mode. It is cleared by a software  
sequence (a read to the status register followed by  
an access to the SCIDR data register). An inter-  
rupt is generated if PIE=1 in the SCICR1 register.  
0: No parity error  
0: No Idle Line is detected  
1: Idle Line is detected  
1: Parity error  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
CONTROL REGISTER 1 (SCICR1)  
Read/Write  
Bit 3 = WAKE Wake-Up method.  
This bit determines the SCI Wake-Up method, it is  
set or cleared by software.  
0: Idle Line  
Reset Value: x000 0000 (x0h)  
7
0
1: Address Mark  
R8  
T8  
SCID  
M
WAKE PCE  
PS  
PIE  
Bit 2 = PCE Parity control enable.  
This bit selects the hardware parity control (gener-  
ation and detection). When the parity control is en-  
abled, the computed parity is inserted at the MSB  
position (9th bit if M=1; 8th bit if M=0) and parity is  
checked on the received data. This bit is set and  
cleared by software. Once it is set, PCE is active  
after the current byte (in reception and in transmis-  
sion).  
Bit 7 = R8 Receive data bit 8.  
This bit is used to store the 9th bit of the received  
word when M=1.  
Bit 6 = T8 Transmit data bit 8.  
This bit is used to store the 9th bit of the transmit-  
ted word when M=1.  
0: Parity control disabled  
1: Parity control enabled  
Bit 5 = SCID Disabled for low power consumption  
When this bit is set the SCI prescalers and outputs  
are stopped and the end of the current byte trans-  
fer in order to reduce power consumption.This bit  
is set and cleared by software.  
0: SCI enabled  
1: SCI prescaler and outputs disabled  
Bit 1 = PS Parity selection.  
This bit selects the odd or even parity when the  
parity generation/detection is enabled (PCE bit  
set). It is set and cleared by software. The parity  
will be selected after the current byte.  
0: Even parity  
1: Odd parity  
Bit 4 = M Word length.  
This bit determines the word length. It is set or  
cleared by software.  
0: 1 Start bit, 8 Data bits, 1 Stop bit  
1: 1 Start bit, 9 Data bits, 1 Stop bit  
Bit 0 = PIE Parity interrupt enable.  
This bit enables the interrupt capability of the hard-  
ware parity control when a parity error is detected  
(PE bit set). It is set and cleared by software.  
0: Parity error interrupt disabled  
Note: The M bit must not be modified during a data  
transfer (both transmission and reception).  
1: Parity error interrupt enabled.  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
CONTROL REGISTER 2 (SCICR2)  
Read/Write  
Notes:  
– During transmission, a “0” pulse on the TE bit  
(“0” followed by “1”) sends a preamble (idle line)  
after the current word.  
Reset Value: 0000 0000 (00h)  
7
0
– When TE is set there is a 1 bit-time delay before  
the transmission starts.  
TIE  
TCIE  
RIE  
ILIE  
TE  
RE  
RWU  
SBK  
Caution: The TDO pin is free for general purpose  
I/O only when the TE and RE bits are both cleared  
(or if TE is never set).  
Bit 7 = TIE Transmitter interrupt enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever  
TDRE=1 in the SCISR register  
Bit 2 = RE Receiver enable.  
This bit enables the receiver. It is set and cleared  
by software.  
0: Receiver is disabled  
1: Receiver is enabled and begins searching for a  
start bit  
Bit 6 = TCIE Transmission complete interrupt ena-  
ble  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever TC=1 in  
the SCISR register  
Bit 1 = RWU Receiver wake-up.  
This bit determines if the SCI is in mute mode or  
not. It is set and cleared by software and can be  
cleared by hardware when a wake-up sequence is  
recognized.  
Bit 5 = RIE Receiver interrupt enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever OR=1  
or RDRF=1 in the SCISR register  
0: Receiver in Active mode  
1: Receiver in Mute mode  
Note: Before selecting Mute mode (setting the  
RWU bit), the SCI must receive some data first,  
otherwise it cannot function in Mute mode with  
wakeup by idle line detection.  
Bit 4 = ILIE Idle line interrupt enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever IDLE=1  
in the SCISR register.  
Bit 0 = SBK Send break.  
This bit set is used to send break characters. It is  
set and cleared by software.  
0: No break character is transmitted  
1: Break characters are transmitted  
Bit 3 = TE Transmitter enable.  
This bit enables the transmitter. It is set and  
cleared by software.  
Note: If the SBK bit is set to “1” and then to “0”, the  
transmitter will send a BREAK word at the end of  
the current word.  
0: Transmitter is disabled  
1: Transmitter is enabled  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
DATA REGISTER (SCIDR)  
Read/Write  
Bits 5:3 = SCT[2:0] SCI Transmitter rate divisor  
These 3 bits, in conjunction with the SCP1 & SCP0  
bits define the total division applied to the bus  
clock to yield the transmit rate clock in convention-  
al Baud Rate Generator mode.  
Reset Value: Undefined  
Contains the Received or Transmitted data char-  
acter, depending on whether it is read from or writ-  
ten to.  
TR dividing factor  
SCT2  
SCT1  
SCT0  
1
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
7
0
4
DR7  
DR6  
DR5  
DR4  
DR3  
DR2  
DR1  
DR0  
8
16  
32  
64  
128  
The Data register performs a double function (read  
and write) since it is composed of two registers,  
one for transmission (TDR) and one for reception  
(RDR).  
The TDR register provides the parallel interface  
between the internal bus and the output shift reg-  
ister (see Figure 53).  
The RDR register provides the parallel interface  
between the input shift register and the internal  
bus (see Figure 53).  
Bits 2:0 = SCR[2:0] SCI Receiver rate divisor.  
These 3 bits, in conjunction with the SCP[1:0] bits  
define the total division applied to the bus clock to  
yield the receive rate clock in conventional Baud  
Rate Generator mode.  
RR Dividing factor  
SCR2  
SCR1  
SCR0  
BAUD RATE REGISTER (SCIBRR)  
Read/Write  
1
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reset Value: 0000 0000 (00h)  
4
7
0
8
16  
32  
64  
128  
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1 SCR0  
Bits 7:6= SCP[1:0] First SCI Prescaler  
These 2 prescaling bits allow several standard  
clock division ranges:  
PR Prescaling factor  
SCP1  
SCP0  
1
3
0
0
1
1
0
1
0
1
4
13  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
EXTENDED RECEIVE PRESCALER DIVISION  
REGISTER (SCIERPR)  
EXTENDED TRANSMIT PRESCALER DIVISION  
REGISTER (SCIETPR)  
Read/Write  
Read/Write  
Reset Value: 0000 0000 (00h)  
Reset Value:0000 0000 (00h)  
Allows setting of the Extended Prescaler rate divi-  
sion factor for the receive circuit.  
Allows setting of the External Prescaler rate divi-  
sion factor for the transmit circuit.  
7
0
7
0
ERPR ERPR ERPR ERPR ERPR ERPR ERPR ERPR  
ETPR ETPR ETPR ETPR ETPR ETPR ETPR ETPR  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Bits 7:0 = ERPR[7:0] 8-bit Extended Receive  
Prescaler Register.  
Bits 7:0 = ETPR[7:0] 8-bit Extended Transmit  
Prescaler Register.  
The extended Baud Rate Generator is activated  
when a value different from 00h is stored in this  
register. Therefore the clock frequency issued  
from the 16 divider (see Figure 55) is divided by  
the binary factor set in the SCIERPR register (in  
the range 1 to 255).  
The extended Baud Rate Generator is activated  
when a value different from 00h is stored in this  
register. Therefore the clock frequency issued  
from the 16 divider (see Figure 55) is divided by  
the binary factor set in the SCIETPR register (in  
the range 1 to 255).  
The extended baud rate generator is not used af-  
ter a reset.  
The extended baud rate generator is not used af-  
ter a reset.  
Table 19. Baudrate Selection  
Conditions  
Baud  
Rate  
Symbol  
Parameter  
Standard  
Unit  
Accuracy  
vs. Standard  
Prescaler  
f
CPU  
Conventional Mode  
TR (or RR)=128, PR=13  
TR (or RR)= 32, PR=13  
TR (or RR)= 16, PR=13  
TR (or RR)= 8, PR=13  
TR (or RR)= 4, PR=13  
TR (or RR)= 16, PR= 3  
TR (or RR)= 2, PR=13  
TR (or RR)= 1, PR=13  
300  
~300.48  
1200 ~1201.92  
2400 ~2403.84  
4800 ~4807.69  
9600 ~9615.38  
10400 ~10416.67  
19200 ~19230.77  
38400 ~38461.54  
~0.16%  
~0.79%  
f
f
Tx  
Communication frequency 8MHz  
Hz  
Rx  
Extended Mode  
ETPR (or ERPR) = 35,  
TR (or RR)= 1, PR=1  
14400 ~14285.71  
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Table 20. SCI Register Map and Reset Values  
Address  
(Hex.)  
Register  
Name  
7
6
5
4
3
2
1
0
SCISR  
TDRE  
TC  
1
RDRF  
0
IDLE  
OR  
NF  
0
FE  
0
PE  
0
50  
51  
52  
53  
54  
55  
56  
Reset Value  
SCIDR  
1
DR7  
x
0
DR4  
x
0
DR3  
x
DR6  
x
DR5  
x
DR2  
x
DR1  
x
DR0  
x
Reset Value  
SCIBRR  
SCP1  
0
SCP0  
0
SCT2  
0
SCT1  
0
SCT0  
0
SCR2  
0
SCR1  
0
SCR0  
0
Reset Value  
SCICR1  
R8  
x
T8  
0
SCID  
0
M
WAKE  
0
PCE  
0
PS  
0
PIE  
0
Reset Value  
SCICR2  
0
TIE  
0
TCIE  
0
RIE  
0
ILIE  
0
TE  
RE  
0
RWU  
0
SBK  
0
Reset Value  
SCIERPR  
Reset Value  
SCIETPR  
Reset Value  
0
ERPR7  
0
ERPR6  
0
ERPR5 ERPR4  
ERPR3  
0
ERPR2  
0
ERPR1  
0
ERPR0  
0
0
0
ETPR7  
0
ETPR6  
0
ETPR5  
0
ETPR4  
0
ETPR3  
0
ETPR2  
0
ETPR1  
0
ETPR0  
0
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2
11.6 I C BUS INTERFACE (I2C)  
11.6.1 Introduction  
and vice versa, using either an interrupt or polled  
handshake. The interrupts are enabled or disabled  
2
The I C Bus Interface serves as an interface be-  
2
2
by software. The interface is connected to the I C  
tween the microcontroller and the serial I C bus. It  
bus by a data pin (SDAI) and by a clock pin (SCLI).  
provides both multimaster and slave functions,  
2
2
It can be connected both with a standard I C bus  
and controls all I C bus-specific sequencing, pro-  
2
2
and a Fast I C bus. This selection is made by soft-  
tocol, arbitration and timing. It supports fast I C  
ware.  
mode (400kHz).  
Mode Selection  
11.6.2 Main Features  
2
The interface can operate in the four following  
modes:  
Parallel-bus/I C protocol converter  
Multi-master capability  
– Slave transmitter/receiver  
7-bit/10-bit Addressing  
SMBus V1.1 Compliant  
Transmitter/Receiver flag  
End-of-byte transmission flag  
Transfer problem detection  
– Master transmitter/receiver  
By default, it operates in slave mode.  
The interface automatically switches from slave to  
master after it generates a START condition and  
from master to slave in case of arbitration loss or a  
STOP generation, allowing then Multi-Master ca-  
pability.  
2
I C Master Features:  
Clock generation  
2
I C bus busy flag  
Communication Flow  
Arbitration Lost Flag  
In Master mode, it initiates a data transfer and  
generates the clock signal. A serial data transfer  
always begins with a start condition and ends with  
a stop condition. Both start and stop conditions are  
generated in master mode by software.  
End of byte transmission flag  
Transmitter/Receiver Flag  
Start bit detection flag  
Start and Stop generation  
In Slave mode, the interface is capable of recog-  
nising its own address (7 or 10-bit), and the Gen-  
eral Call address. The General Call address de-  
tection may be enabled or disabled by software.  
2
I C Slave Features:  
Stop bit detection  
2
I C bus busy flag  
Data and addresses are transferred as 8-bit bytes,  
MSB first. The first byte(s) following the start con-  
dition contain the address (one in 7-bit mode, two  
in 10-bit mode). The address is always transmitted  
in Master mode.  
Detection of misplaced start or stop condition  
Programmable I C Address detection  
Transfer problem detection  
End-of-byte transmission flag  
Transmitter/Receiver flag  
11.6.3 General Description  
2
A 9th clock pulse follows the 8 clock cycles of a  
byte transfer, during which the receiver must send  
an acknowledge bit to the transmitter. Refer to Fig-  
ure 57.  
In addition to receiving and transmitting data, this  
interface converts it from serial to parallel format  
2
Figure 57. I C BUS Protocol  
SDA  
MSB  
ACK  
SCL  
1
2
8
9
START  
STOP  
CONDITION  
CONDITION  
VR02119B  
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2
I C BUS INTERFACE (Cont’d)  
Acknowledge may be enabled and disabled by  
software.  
The SCL frequency (F ) is controlled by a pro-  
scl  
grammable clock divider which depends on the  
2
2
I C bus mode.  
The I C interface address and/or general call ad-  
2
dress can be selected by software.  
When the I C cell is enabled, the SDA and SCL  
2
ports must be configured as floating inputs. In this  
case, the value of the external pull-up resistor  
used depends on the application.  
The speed of the I C interface may be selected  
2
between Standard (up to 100KHz) and Fast I C  
(up to 400KHz).  
2
When the I C cell is disabled, the SDA and SCL  
ports revert to being standard I/O port pins.  
SDA/SCL Line Control  
Transmitter mode: the interface holds the clock  
line low before transmission to wait for the micro-  
controller to write the byte in the Data Register.  
Receiver mode: the interface holds the clock line  
low after reception to wait for the microcontroller to  
read the byte in the Data Register.  
2
Figure 58. I C Interface Block Diagram  
DATA REGISTER (DR)  
DATA CONTROL  
SDA or SDAI  
DATA SHIFT REGISTER  
COMPARATOR  
OWN ADDRESS REGISTER 1 (OAR1)  
OWN ADDRESS REGISTER 2 (OAR2)  
CLOCK CONTROL  
SCL or SCLI  
CLOCK CONTROL REGISTER (CCR)  
CONTROL REGISTER (CR)  
STATUS REGISTER 1 (SR1)  
STATUS REGISTER 2 (SR2)  
CONTROL LOGIC  
INTERRUPT  
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2
I C BUS INTERFACE (Cont’d)  
11.6.4 Functional Description  
Then the interface waits for a read of the SR1 reg-  
ister followed by a read of the DR register, holding  
the SCL line low (see Figure 59 Transfer se-  
quencing EV2).  
Refer to the CR, SR1 and SR2 registers in Section  
11.6.7. for the bit definitions.  
2
By default the I C interface operates in Slave  
Slave Transmitter  
mode (M/SL bit is cleared) except when it initiates  
a transmit or receive sequence.  
Following the address reception and after SR1  
register has been read, the slave sends bytes from  
the DR register to the SDA line via the internal shift  
register.  
First the interface frequency must be configured  
using the FRi bits in the OAR2 register.  
11.6.4.1 Slave Mode  
The slave waits for a read of the SR1 register fol-  
lowed by a write in the DR register, holding the  
SCL line low (see Figure 59 Transfer sequencing  
EV3).  
As soon as a start condition is detected, the  
address is received from the SDA line and sent to  
the shift register; then it is compared with the  
address of the interface or the General Call  
address (if selected by software).  
When the acknowledge pulse is received:  
– The EVF and BTF bits are set by hardware with  
an interrupt if the ITE bit is set.  
Note: In 10-bit addressing mode, the comparison  
includes the header sequence (11110xx0) and the  
two most significant bits of the address.  
Closing slave communication  
Header matched (10-bit mode only): the interface  
generates an acknowledge pulse if the ACK bit is  
set.  
After the last data byte is transferred a Stop Con-  
dition is generated by the master. The interface  
detects this condition and sets:  
Address not matched: the interface ignores it  
and waits for another Start condition.  
– EVF and STOPF bits with an interrupt if the ITE  
bit is set.  
Address matched: the interface generates in se-  
Then the interface waits for a read of the SR2 reg-  
ister (see Figure 59 Transfer sequencing EV4).  
Error Cases  
quence:  
– Acknowledge pulse if the ACK bit is set.  
BERR: Detection of a Stop or a Start condition  
during a byte transfer. In this case, the EVF and  
the BERR bits are set with an interrupt if the ITE  
bit is set.  
If it is a Stop then the interface discards the data,  
released the lines and waits for another Start  
condition.  
– EVF and ADSL bits are set with an interrupt if the  
ITE bit is set.  
Then the interface waits for a read of the SR1 reg-  
ister, holding the SCL line low (see Figure 59  
Transfer sequencing EV1).  
Next, in 7-bit mode read the DR register to deter-  
mine from the least significant bit (Data Direction  
Bit) if the slave must enter Receiver or Transmitter  
mode.  
If it is a Start then the interface discards the data  
and waits for the next slave address on the bus.  
AF: Detection of a non-acknowledge bit. In this  
case, the EVF and AF bits are set with an inter-  
rupt if the ITE bit is set.  
In 10-bit mode, after receiving the address se-  
quence the slave is always in receive mode. It will  
enter transmit mode on receiving a repeated Start  
condition followed by the header sequence with  
matching address bits and the least significant bit  
set (11110xx1).  
The AF bit is cleared by reading the I2CSR2 reg-  
ister. However, if read before the completion of  
the transmission, the AF flag will be set again,  
thus possibly generating a new interrupt. Soft-  
ware must ensure either that the SCL line is back  
at 0 before reading the SR2 register, or be able  
to correctly handle a second interrupt during the  
9th pulse of a transmitted byte.  
Slave Receiver  
Following the address reception and after SR1  
register has been read, the slave receives bytes  
from the SDA line into the DR register via the inter-  
nal shift register. After each byte the interface gen-  
erates in sequence:  
Note: In case of errors, SCL line is not held low;  
however, the SDA line can remain low if the last  
bits transmitted are all 0. While AF=1, the SCL line  
may be held low due to SB or BTF flags that are  
set at the same time. It is then necessary to re-  
lease both lines by software.  
– Acknowledge pulse if the ACK bit is set  
– EVF and BTF bits are set with an interrupt if the  
ITE bit is set.  
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2
I C INTERFACE (Cont’d)  
How to release the SDA / SCL lines  
Then the second address byte is sent by the inter-  
face.  
Set and subsequently clear the STOP bit while  
BTF is set. The SDA/SCL lines are released after  
the transfer of the current byte.  
After completion of this transfer (and acknowledge  
from the slave if the ACK bit is set):  
SMBus Compatibility  
– The EVF bit is set by hardware with interrupt  
generation if the ITE bit is set.  
2
ST7 I C is compatible with SMBus V1.1 protocol. It  
supports all SMBus adressing modes, SMBus bus  
protocols and CRC-8 packet error checking. Refer  
Then the master waits for a read of the SR1 regis-  
ter followed by a write in the CR register (for exam-  
ple set PE bit), holding the SCL line low (see Fig-  
ure 59 Transfer sequencing EV6).  
2
to AN1713: SMBus Slave Driver For ST7 I C Pe-  
ripheral.  
11.6.4.2 Master Mode  
Next the master must enter Receiver or Transmit-  
ter mode.  
To switch from default Slave mode to Master  
mode a Start condition generation is needed.  
Note: In 10-bit addressing mode, to switch the  
master to Receiver mode, software must generate  
a repeated Start condition and resend the header  
sequence with the least significant bit set  
(11110xx1).  
Start condition  
Setting the START bit while the BUSY bit is  
cleared causes the interface to switch to Master  
mode (M/SL bit set) and generates a Start condi-  
tion.  
Master Receiver  
Following the address transmission and after SR1  
and CR registers have been accessed, the master  
receives bytes from the SDA line into the DR reg-  
ister via the internal shift register. After each byte  
the interface generates in sequence:  
Once the Start condition is sent:  
– The EVF and SB bits are set by hardware with  
an interrupt if the ITE bit is set.  
Then the master waits for a read of the SR1 regis-  
ter followed by a write in the DR register with the  
Slave address, holding the SCL line low (see  
Figure 59 Transfer sequencing EV5).  
– Acknowledge pulse if the ACK bit is set  
– EVF and BTF bits are set by hardware with an in-  
terrupt if the ITE bit is set.  
Then the interface waits for a read of the SR1 reg-  
ister followed by a read of the DR register, holding  
the SCL line low (see Figure 59 Transfer se-  
quencing EV7).  
Slave address transmission  
Then the slave address is sent to the SDA line via  
the internal shift register.  
To close the communication: before reading the  
last byte from the DR register, set the STOP bit to  
generate the Stop condition. The interface goes  
automatically back to slave mode (M/SL bit  
cleared).  
In 7-bit addressing mode, one address byte is  
sent.  
In 10-bit addressing mode, sending the first byte  
including the header sequence causes the follow-  
ing event:  
Note: In order to generate the non-acknowledge  
pulse after the last received data byte, the ACK bit  
must be cleared just before reading the second  
last data byte.  
– The EVF bit is set by hardware with interrupt  
generation if the ITE bit is set.  
Then the master waits for a read of the SR1 regis-  
ter followed by a write in the DR register, holding  
the SCL line low (see Figure 59 Transfer se-  
quencing EV9).  
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2
I C BUS INTERFACE (Cont’d)  
Master Transmitter  
of communication gives the possibility to reiniti-  
ate transmission.  
Following the address transmission and after SR1  
register has been read, the master sends bytes  
from the DR register to the SDA line via the inter-  
nal shift register.  
Multimaster Mode  
Normally the BERR bit would be set whenever  
unauthorized transmission takes place while  
transfer is already in progress. However, an is-  
sue will arise if an external master generates an  
The master waits for a read of the SR1 register fol-  
lowed by a write in the DR register, holding the  
SCL line low (see Figure 59 Transfer sequencing  
EV8).  
2
unauthorized Start or Stop while the I C master  
is on the first or second pulse of a 9-bit transac-  
tion. It is possible to work around this by polling  
2
the BUSY bit during I C master mode transmis-  
When the acknowledge bit is received, the  
interface sets:  
sion. The resetting of the BUSY bit can then be  
handled in a similar manner as the BERR flag  
being set.  
– EVF and BTF bits with an interrupt if the ITE bit  
is set.  
AF: Detection of a non-acknowledge bit. In this  
case, the EVF and AF bits are set by hardware  
with an interrupt if the ITE bit is set. To resume,  
set the Start or Stop bit.  
The AF bit is cleared by reading the I2CSR2 reg-  
ister. However, if read before the completion of  
the transmission, the AF flag will be set again,  
thus possibly generating a new interrupt. Soft-  
ware must ensure either that the SCL line is back  
at 0 before reading the SR2 register, or be able  
to correctly handle a second interrupt during the  
9th pulse of a transmitted byte.  
To close the communication: after writing the last  
byte to the DR register, set the STOP bit to gener-  
ate the Stop condition. The interface goes auto-  
matically back to slave mode (M/SL bit cleared).  
Error Cases  
BERR: Detection of a Stop or a Start condition  
during a byte transfer. In this case, the EVF and  
BERR bits are set by hardware with an interrupt  
if ITE is set.  
Note that BERR will not be set if an error is de-  
tected during the first or second pulse of each 9-  
bit transaction:  
ARLO: Detection of an arbitration lost condition.  
In this case the ARLO bit is set by hardware (with  
an interrupt if the ITE bit is set and the interface  
goes automatically back to slave mode (the M/SL  
bit is cleared).  
Single Master Mode  
If a Start or Stop is issued during the first or sec-  
ond pulse of a 9-bit transaction, the BERR flag  
will not be set and transfer will continue however  
the BUSY flag will be reset. To work around this,  
slave devices should issue a NACK when they  
receive a misplaced Start or Stop. The reception  
of a NACK or BUSY by the master in the middle  
Note: In all these cases, the SCL line is not held  
low; however, the SDA line can remain low due to  
possible «0» bits transmitted last. It is then neces-  
sary to release both lines by software.  
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2
I C BUS INTERFACE (Cont’d)  
Figure 59. Transfer Sequencing  
7-bit Slave receiver:  
S
Address  
A
Data1  
A
Data1  
Data1  
Data2  
EV3  
A
Data2  
Data2  
DataN  
A
P
.....  
EV1  
EV2  
A
EV2  
A
EV2  
NA  
EV4  
7-bit Slave transmitter:  
S
Address  
A
DataN  
P
.....  
.....  
EV1 EV3  
EV3  
EV3-1  
EV4  
7-bit Master receiver:  
S
Address  
A
A
A
DataN NA  
P
EV5  
EV6  
EV7  
A
EV7  
A
EV7  
A
7-bit Master transmitter:  
S
Address  
A
Data1  
Data2  
DataN  
P
.....  
EV5  
EV6 EV8  
EV8  
EV8  
EV8  
10-bit Slave receiver:  
S
Header  
A
Address  
A
Data1  
A
DataN  
A
P
.....  
EV1  
EV2  
EV2  
EV4  
10-bit Slave transmitter:  
S
Header  
A
Data1  
A
A
DataN  
....  
.
A
P
r
EV1 EV3  
EV6 EV8  
EV3  
EV3-1  
EV4  
10-bit Master transmitter  
S
Header  
A
Address  
A
Data1  
DataN  
A
P
.....  
EV5  
EV9  
EV8  
A
EV8  
A
10-bit Master receiver:  
S
Header  
A
Data1  
DataN  
P
r
.....  
EV5  
EV6  
EV7  
EV7  
Legend: S=Start, S = Repeated Start, P=Stop, A=Acknowledge, NA=Non-acknowledge,  
r
EVx=Event (with interrupt if ITE=1)  
EV1: EVF=1, ADSL=1, cleared by reading SR1 register.  
EV2: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register.  
EV3: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register.  
EV3-1: EVF=1, AF=1, BTF=1; AF is cleared by reading SR1 register. BTF is cleared by releasing the  
lines (STOP=1, STOP=0) or by writing DR register (DR=FFh). Note: If lines are released by  
STOP=1, STOP=0, the subsequent EV4 is not seen.  
EV4: EVF=1, STOPF=1, cleared by reading SR2 register.  
EV5: EVF=1, SB=1, cleared by reading SR1 register followed by writing DR register.  
EV6: EVF=1, cleared by reading SR1 register followed by writing CR register (for example PE=1).  
EV7: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register.  
EV8: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register.  
EV9: EVF=1, ADD10=1, cleared by reading SR1 register followed by writing DR register.  
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2
I C BUS INTERFACE (Cont’d)  
11.6.5 Low Power Modes  
Mode  
Description  
2
No effect on I C interface.  
WAIT  
HALT  
2
I C interrupts cause the device to exit from WAIT mode.  
2
I C registers are frozen.  
2
2
In HALT mode, the I C interface is inactive and does not acknowledge data on the bus. The I C interface  
resumes operation when the MCU is woken up by an interrupt with “exit from HALT mode” capability.  
11.6.6 Interrupts  
Figure 60. Event Flags and Interrupt Generation  
ADD10  
ITE  
BTF  
ADSL  
SB  
INTERRUPT  
EVF  
AF  
STOPF  
ARLO  
BERR  
*
* EVF can also be set by EV6 or an error from the SR2 register.  
Enable  
Control from  
Bit  
Exit  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Wait  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
10-bit Address Sent Event (Master mode)  
End of Byte Transfer Event  
ADD10  
BTF  
No  
No  
No  
No  
No  
No  
No  
No  
Address Matched Event (Slave mode)  
Start Bit Generation Event (Master mode)  
Acknowledge Failure Event  
ADSEL  
SB  
ITE  
AF  
Stop Detection Event (Slave mode)  
Arbitration Lost Event (Multimaster configuration)  
Bus Error Event  
STOPF  
ARLO  
BERR  
2
Note: The I C interrupt events are connected to  
the same interrupt vector (see Interrupts chapter).  
They generate an interrupt if the corresponding  
Enable Control Bit is set and the I-bit in the CC reg-  
ister is reset (RIM instruction).  
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2
I C BUS INTERFACE (Cont’d)  
11.6.7 Register Description  
– In slave mode:  
2
0: No start generation  
I C CONTROL REGISTER (CR)  
1: Start generation when the bus is free  
Read / Write  
Reset Value: 0000 0000 (00h)  
Bit 2 = ACK Acknowledge enable.  
This bit is set and cleared by software. It is also  
cleared by hardware when the interface is disa-  
bled (PE=0).  
7
0
0
0
PE  
ENGC START ACK STOP  
ITE  
0: No acknowledge returned  
1: Acknowledge returned after an address byte or  
a data byte is received  
Bit 7:6 = Reserved. Forced to 0 by hardware.  
Bit 1 = STOP Generation of a Stop condition.  
This bit is set and cleared by software. It is also  
cleared by hardware in master mode. Note: This  
bit is not cleared when the interface is disabled  
(PE=0).  
Bit 5 = PE Peripheral enable.  
This bit is set and cleared by software.  
0: Peripheral disabled  
1: Master/Slave capability  
Notes:  
– When PE=0, all the bits of the CR register and  
the SR register except the Stop bit are reset. All  
outputs are released while PE=0  
– In master mode:  
0: No stop generation  
1: Stop generation after the current byte transfer  
or after the current Start condition is sent. The  
STOP bit is cleared by hardware when the Stop  
condition is sent.  
– When PE=1, the corresponding I/O pins are se-  
lected by hardware as alternate functions.  
2
– To enable the I C interface, write the CR register  
TWICE with PE=1 as the first write only activates  
– In slave mode:  
0: No stop generation  
the interface (only PE is set).  
1: Release the SCL and SDA lines after the cur-  
rent byte transfer (BTF=1). In this mode the  
STOP bit has to be cleared by software.  
Bit 4 = ENGC Enable General Call.  
This bit is set and cleared by software. It is also  
cleared by hardware when the interface is disa-  
bled (PE=0). The 00h General Call address is ac-  
knowledged (01h ignored).  
Bit 0 = ITE Interrupt enable.  
This bit is set and cleared by software and cleared  
by hardware when the interface is disabled  
(PE=0).  
0: General Call disabled  
1: General Call enabled  
0: Interrupts disabled  
1: Interrupts enabled  
Refer to Figure 60 for the relationship between the  
events and the interrupt.  
SCL is held low when the ADD10, SB, BTF or  
ADSL flags or an EV6 event (See Figure 59) is de-  
tected.  
Note: In accordance with the I2C standard, when  
GCAL addressing is enabled, an I2C slave can  
only receive data. It will not transmit data to the  
master.  
Bit 3 = START Generation of a Start condition.  
This bit is set and cleared by software. It is also  
cleared by hardware when the interface is disa-  
bled (PE=0) or when the Start condition is sent  
(with interrupt generation if ITE=1).  
– In master mode:  
0: No start generation  
1: Repeated start generation  
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2
I C BUS INTERFACE (Cont’d)  
2
I C STATUS REGISTER 1 (SR1)  
1: Data byte transmitted  
Read Only  
Reset Value: 0000 0000 (00h)  
Bit 4 = BUSY Bus busy.  
This bit is set by hardware on detection of a Start  
condition and cleared by hardware on detection of  
a Stop condition. It indicates a communication in  
progress on the bus. The BUSY flag of the I2CSR1  
register is cleared if a Bus Error occurs.  
0: No communication on the bus  
7
0
EVF ADD10 TRA BUSY BTF ADSL M/SL  
SB  
Bit 7 = EVF Event flag.  
1: Communication ongoing on the bus  
Note:  
This bit is set by hardware as soon as an event oc-  
curs. It is cleared by software reading SR2 register  
in case of error event or as described in Figure 59.  
It is also cleared by hardware when the interface is  
disabled (PE=0).  
– The BUSY flag is NOT updated when the inter-  
face is disabled (PE=0). This can have conse-  
quences when operating in Multimaster mode;  
2
i.e. a second active I C master commencing a  
0: No event  
1: One of the following events has occurred:  
transfer with an unset BUSY bit can cause a con-  
flict resulting in lost data. A software workaround  
– BTF=1 (Byte received or transmitted)  
2
consists of checking that the I C is not busy be-  
2
– ADSL=1 (Address matched in Slave mode  
while ACK=1)  
fore enabling the I C Multimaster cell.  
– SB=1 (Start condition generated in Master  
mode)  
Bit 3 = BTF Byte transfer finished.  
This bit is set by hardware as soon as a byte is cor-  
rectly received or transmitted with interrupt gener-  
ation if ITE=1. It is cleared by software reading  
SR1 register followed by a read or write of DR reg-  
ister. It is also cleared by hardware when the inter-  
face is disabled (PE=0).  
– AF=1 (No acknowledge received after byte  
transmission)  
– STOPF=1 (Stop condition detected in Slave  
mode)  
– ARLO=1 (Arbitration lost in Master mode)  
– Following a byte transmission, this bit is set after  
reception of the acknowledge clock pulse. In  
case an address byte is sent, this bit is set only  
after the EV6 event (See Figure 59). BTF is  
cleared by reading SR1 register followed by writ-  
ing the next byte in DR register.  
– BERR=1 (Bus error, misplaced Start or Stop  
condition detected)  
– ADD10=1 (Master has sent header byte)  
– Address byte successfully transmitted in Mas-  
ter mode.  
– Following a byte reception, this bit is set after  
transmission of the acknowledge clock pulse if  
ACK=1. BTF is cleared by reading SR1 register  
followed by reading the byte from DR register.  
Bit 6 = ADD10 10-bit addressing in Master mode.  
This bit is set by hardware when the master has  
sent the first byte in 10-bit address mode. It is  
cleared by software reading SR2 register followed  
by a write in the DR register of the second address  
byte. It is also cleared by hardware when the pe-  
ripheral is disabled (PE=0).  
The SCL line is held low while BTF=1.  
0: Byte transfer not done  
1: Byte transfer succeeded  
0: No ADD10 event occurred.  
Bit 2 = ADSL Address matched (Slave mode).  
This bit is set by hardware as soon as the received  
slave address matched with the OAR register con-  
tent or a general call is recognized. An interrupt is  
generated if ITE=1. It is cleared by software read-  
ing SR1 register or by hardware when the inter-  
face is disabled (PE=0).  
1: Master has sent first address byte (header)  
Bit 5 = TRA Transmitter/Receiver.  
When BTF is set, TRA=1 if a data byte has been  
transmitted. It is cleared automatically when BTF  
is cleared. It is also cleared by hardware after de-  
tection of Stop condition (STOPF=1), loss of bus  
arbitration (ARLO=1) or when the interface is disa-  
bled (PE=0).  
The SCL line is held low while ADSL=1.  
0: Address mismatched or not received  
1: Received address matched  
0: Data byte received (if BTF=1)  
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2
I C BUS INTERFACE (Cont’d)  
Bit 1 = M/SL Master/Slave.  
The SCL line is not held low while STOPF=1.  
This bit is set by hardware as soon as the interface  
is in Master mode (writing START=1). It is cleared  
by hardware after detecting a Stop condition on  
the bus or a loss of arbitration (ARLO=1). It is also  
cleared when the interface is disabled (PE=0).  
0: Slave mode  
0: No Stop condition detected  
1: Stop condition detected  
Bit 2 = ARLO Arbitration lost.  
This bit is set by hardware when the interface los-  
es the arbitration of the bus to another master. An  
interrupt is generated if ITE=1. It is cleared by soft-  
ware reading SR2 register or by hardware when  
the interface is disabled (PE=0).  
1: Master mode  
Bit 0 = SB Start bit (Master mode).  
This bit is set by hardware as soon as the Start  
After an ARLO event the interface switches back  
automatically to Slave mode (M/SL=0).  
condition is generated (following  
a
write  
START=1). An interrupt is generated if ITE=1. It is  
cleared by software reading SR1 register followed  
by writing the address byte in DR register. It is also  
cleared by hardware when the interface is disa-  
bled (PE=0).  
The SCL line is not held low while ARLO=1.  
0: No arbitration lost detected  
1: Arbitration lost detected  
Note:  
0: No Start condition  
1: Start condition generated  
– In a Multimaster environment, when the interface  
is configured in Master Receive mode it does not  
perform arbitration during the reception of the  
Acknowledge Bit. Mishandling of the ARLO bit  
from the I2CSR2 register may occur when a sec-  
ond master simultaneously requests the same  
2
I C STATUS REGISTER 2 (SR2)  
Read Only  
Reset Value: 0000 0000 (00h)  
2
data from the same slave and the I C master  
does not acknowledge the data. The ARLO bit is  
then left at 0 instead of being set.  
7
0
0
0
0
AF STOPF ARLO BERR GCAL  
Bit 1 = BERR Bus error.  
This bit is set by hardware when the interface de-  
tects a misplaced Start or Stop condition. An inter-  
rupt is generated if ITE=1. It is cleared by software  
reading SR2 register or by hardware when the in-  
terface is disabled (PE=0).  
Bit 7:5 = Reserved. Forced to 0 by hardware.  
Bit 4 = AF Acknowledge failure.  
This bit is set by hardware when no acknowledge  
is returned. An interrupt is generated if ITE=1. It is  
cleared by software reading SR2 register or by  
hardware when the interface is disabled (PE=0).  
The SCL line is not held low while BERR=1.  
0: No misplaced Start or Stop condition  
1: Misplaced Start or Stop condition  
Note:  
– If a Bus Error occurs, a Stop or a repeated Start  
condition should be generated by the Master to  
re-synchronize communication, get the transmis-  
sion acknowledged and the bus released for fur-  
ther communication  
The SCL line is not held low while AF=1 but by oth-  
er flags (SB or BTF) that are set at the same time.  
0: No acknowledge failure  
1: Acknowledge failure  
Note:  
– When an AF event occurs, the SCL line is not  
held low; however, the SDA line can remain low  
if the last bits transmitted are all 0. It is then nec-  
essary to release both lines by software.  
Bit 0 = GCAL General Call (Slave mode).  
This bit is set by hardware when a general call ad-  
dress is detected on the bus while ENGC=1. It is  
cleared by hardware detecting a Stop condition  
(STOPF=1) or when the interface is disabled  
(PE=0).  
Bit 3 = STOPF Stop detection (Slave mode).  
This bit is set by hardware when a Stop condition  
is detected on the bus after an acknowledge (if  
ACK=1). An interrupt is generated if ITE=1. It is  
cleared by software reading SR2 register or by  
hardware when the interface is disabled (PE=0).  
0: No general call address detected on bus  
1: general call address detected on bus  
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2
I C BUS INTERFACE (Cont’d)  
2
2
I C CLOCK CONTROL REGISTER (CCR)  
I C DATA REGISTER (DR)  
Read / Write  
Reset Value: 0000 0000 (00h)  
Read / Write  
Reset Value: 0000 0000 (00h)  
7
0
7
0
FM/SM CC6  
CC5  
CC4  
CC3  
CC2  
CC1  
CC0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
2
Bit 7 = FM/SM Fast/Standard I C mode.  
This bit is set and cleared by software. It is not  
cleared when the interface is disabled (PE=0).  
Bit 7:0 = D[7:0] 8-bit Data Register.  
These bits contain the byte to be received or trans-  
mitted on the bus.  
2
0: Standard I C mode  
2
1: Fast I C mode  
– Transmitter mode: Byte transmission start auto-  
matically when the software writes in the DR reg-  
ister.  
Bit 6:0 = CC[6:0] 7-bit clock divider.  
These bits select the speed of the bus (F  
) de-  
SCL  
– Receiver mode: the first data byte is received au-  
tomatically in the DR register using the least sig-  
nificant bit of the address.  
2
pending on the I C mode. They are not cleared  
when the interface is disabled (PE=0).  
Refer to the Electrical Characteristics section for  
the table of values.  
Then, the following data bytes are received one  
by one after reading the DR register.  
Note: The programmed F  
SCL and SDA lines.  
assumes no load on  
SCL  
113/172  
ST72260Gx, ST72262Gx, ST72264Gx  
2
I C BUS INTERFACE (Cont’d)  
2
2
I C OWN ADDRESS REGISTER (OAR1)  
I C OWN ADDRESS REGISTER (OAR2)  
Read / Write  
Reset Value: 0000 0000 (00h)  
Read / Write  
Reset Value: 0100 0000 (40h)  
7
0
7
0
0
ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0  
FR1  
FR0  
0
0
0
ADD9 ADD8  
7-bit Addressing Mode  
Bit 7:6 = FR[1:0] Frequency bits.  
Bit 7:1 = ADD[7:1] Interface address.  
These bits are set by software only when the inter-  
face is disabled (PE=0). To configure the interface  
2
These bits define the I C bus address of the inter-  
2
face. They are not cleared when the interface is  
disabled (PE=0).  
to I C specified delays select the value corre-  
sponding to the microcontroller frequency F  
.
CPU  
f
FR1  
0
FR0  
0
1
CPU  
Bit 0 = ADD0 Address direction bit.  
This bit is don’t care, the interface acknowledges  
either 0 or 1. It is not cleared when the interface is  
disabled (PE=0).  
< 6 MHz  
6 to 8 MHz  
0
Note: Address 01h is always ignored.  
Bit 5:3 = Reserved  
10-bit Addressing Mode  
Bit 2:1 = ADD[9:8] Interface address.  
2
These are the most significant bits of the I C bus  
address of the interface (10-bit mode only). They  
are not cleared when the interface is disabled  
(PE=0).  
Bit 7:0 = ADD[7:0] Interface address.  
These are the least significant bits of the I C bus  
address of the interface. They are not cleared  
when the interface is disabled (PE=0).  
2
Bit 0 = Reserved.  
114/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I²C BUS INTERFACE (Cont’d)  
2
Table 21. I C Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
I2CCR  
Reset Value  
PE  
0
ENGC  
0
START  
0
ACK  
0
STOP  
0
ITE  
0
0028h  
0029h  
002Ah  
02Bh  
0
0
I2CSR1  
Reset Value  
EVF  
0
ADD10  
0
TRA  
0
BUSY  
0
BTF  
0
ADSL  
0
M/SL  
0
SB  
0
I2CSR2  
Reset Value  
AF  
0
STOPF  
0
ARLO  
0
BERR  
0
GCAL  
0
0
0
0
I2CCCR  
Reset Value  
FM/SM  
0
CC6  
0
CC5  
0
CC4  
0
CC3  
0
CC2  
0
CC1  
0
CC0  
0
I2COAR1  
Reset Value  
ADD7  
0
ADD6  
0
ADD5  
0
ADD4  
0
ADD3  
0
ADD2  
0
ADD1  
0
ADD0  
0
02Ch  
I2COAR2  
Reset Value  
FR1  
0
FR0  
1
ADD9  
0
ADD8  
0
002Dh  
002Eh  
0
0
0
0
0
0
0
I2CDR  
Reset Value  
MSB  
0
LSB  
0
0
0
0
115/172  
ST72260Gx, ST72262Gx, ST72264Gx  
11.7 10-BIT A/D CONVERTER (ADC)  
11.7.1 Introduction  
Data register (DR) which contains the results  
Conversion complete status flag  
On/off bit (to reduce consumption)  
The block diagram is shown in Figure 61.  
The on-chip Analog to Digital Converter (ADC) pe-  
ripheral is a 10-bit, successive approximation con-  
verter with internal sample and hold circuitry. This  
peripheral has 6 multiplexed analog input chan-  
nels (refer to device pin out description) that allow  
the peripheral to convert the analog voltage levels  
from 6 different sources.  
11.7.3 Functional Description  
11.7.3.1 Analog Power Supply  
V
and V  
are the high and low level refer-  
SSA  
DDA  
The result of the conversion is stored in a 10-bit  
Data Register. The A/D converter is controlled  
through a Control/Status Register.  
ence voltage pins. In some devices (refer to device  
pin out description) they are internally connected  
to the V and V pins.  
DD  
SS  
11.7.2 Main Features  
10-bit conversion  
6 channels with multiplexed input  
Linear successive approximation  
Conversion accuracy may therefore be impacted  
by voltage drops and noise in the event of heavily  
loaded or badly decoupled power supply lines.  
Figure 61. ADC Block Diagram  
f
f
ADC  
CPU  
f
f
/2 f  
/4  
CPU, CPU , CPU  
0
EOC SPEEDADON SLOW  
CH2 CH1 CH0  
ADCCSR  
3
AIN0  
AIN1  
ANALOG TO DIGITAL  
CONVERTER  
ANALOG  
MUX  
AINx  
ADCDRH  
D9 D8 D7 D6 D5 D4  
D3  
D2  
ADCDRL  
0
0
0
0
0
0
D1  
D0  
116/172  
ST72260Gx, ST72262Gx, ST72264Gx  
10-BIT A/D CONVERTER (ADC) (Cont’d)  
11.7.3.2 Digital A/D Conversion Result  
When a conversion is complete:  
The conversion is monotonic, meaning that the re-  
sult never decreases if the analog input does not  
and never increases if the analog input does not.  
– The EOC bit is set by hardware.  
– The result is in the ADCDR registers.  
A read to the ADCDRH or a write to any bit of the  
ADCCSR resets the EOC bit.  
If the input voltage (V ) is greater than V  
AIN  
DDA  
(high-level voltage reference) then the conversion  
result is FFh in the ADCDRH register and 03h in  
the ADCDRL register (without overflow indication).  
To read the 10 bits, perform the following steps:  
1. Poll EOC bit  
If the input voltage (V ) is lower than V  
(low-  
SSA  
AIN  
level voltage reference) then the conversion result  
in the ADCDRH and ADCDRL registers is 00 00h.  
2. Read ADCDRL. This locks the ADCDRH until it  
is read.  
The A/D converter is linear and the digital result of  
the conversion is stored in the ADCDRH and AD-  
CDRL registers. The accuracy of the conversion is  
described in the Electrical Characteristics Section.  
3. Read ADCDRH. This clears EOC automati-  
cally.  
To read only 8 bits, perform the following steps:  
1. Poll EOC bit  
R
is the maximum recommended impedance  
AIN  
for an analog input signal. If the impedance is too  
high, this will result in a loss of accuracy due to  
leakage and sampling not being completed in the  
alloted time.  
2. Read ADCDRH. This clears EOC automati-  
cally.  
11.7.3.3 A/D Conversion  
11.7.4 Low Power Modes  
The analog input ports must be configured as in-  
put, no pull-up, no interrupt. Refer to the «I/O  
ports» chapter. Using these pins as analog inputs  
does not affect the ability of the port to be read as  
a logic input.  
Note: The A/D converter may be disabled by re-  
setting the ADON bit. This feature allows reduced  
power consumption when no conversion is need-  
ed and between single shot conversions.  
In the ADCCSR register:  
Mode  
Description  
– Select the CH[2:0] bits to assign the analog  
channel to convert.  
WAIT  
No effect on A/D Converter  
A/D Converter disabled.  
ADC Conversion mode  
After wakeup from Halt mode, the A/D  
Converter requires a stabilization time  
In the ADCCSR register:  
HALT  
t
(see Electrical Characteristics)  
STAB  
- Set the SPEED or the SLOW bits  
before accurate conversions can be  
performed.  
– Set the ADON bit to enable the A/D converter  
and to start the conversion. From this time on,  
the ADC performs a continuous conversion of  
the selected channel.  
11.7.5 Interrupts  
None.  
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ST72260Gx, ST72262Gx, ST72264Gx  
10-BIT A/D CONVERTER (ADC) (Cont’d)  
11.7.6 Register Description  
CONTROL/STATUS REGISTER (ADCCSR)  
Read/Write (Except bit 7 read only)  
Reset Value: 0000 0000 (00h)  
Bit 2:0 = CH[2:0] Channel Selection  
These bits are set and cleared by software. They  
select the analog input to convert.  
Channel Pin  
CH2 CH1 CH0  
7
0
AIN0  
AIN1  
AIN2  
AIN3  
AIN4  
AIN5  
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
EOC SPEED ADON SLOW  
0
CH2  
CH1  
CH0  
Bit 7 = EOC End of Conversion  
This bit is set by hardware. It is cleared by soft-  
ware reading the ADCDRH register or writing to  
any bit of the ADCCSR register.  
DATA REGISTER (ADCDRH)  
Read Only  
0: Conversion is not complete  
1: Conversion complete  
Reset Value: 0000 0000 (00h)  
7
0
Bit 6 = SPEED A/D clock selection  
This bit is set and cleared by software.  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
Table 22. A/D Clock Selection (See Note 1)  
f
Frequency  
SLOW  
SPEED  
ADC  
Bit 7:0 = D[9:2] MSB of Analog Converted Value  
f
(See Note 2)  
0
1
0
1
1
1
0
0
CPU  
f
f
/2  
/4  
CPU  
CPU  
DATA REGISTER (ADCDRL)  
Read Only  
1)  
The SPEED and SLOW bits must be updated before  
Reset Value: 0000 0000 (00h)  
setting the ADON bit.  
2)  
Use this setting only if fCPU 4 MHz  
7
0
0
0
0
0
0
0
D1  
D0  
Bit 5 = ADON A/D Converter on  
This bit is set and cleared by software.  
0: Disable ADC and stop conversion  
1: Enable ADC and start conversion  
Bit 7:2 = Reserved. Forced by hardware to 0.  
Bit 1:0 = D[1:0] LSB of Analog Converted Value  
Bit 4 = SLOW A/D Clock Selection  
This bit is set and cleared by software. It works to-  
gether with the SPEED bit. Refer to Table 22.  
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ST72260Gx, ST72262Gx, ST72264Gx  
10-BIT A/D CONVERTER (ADC) (Cont’d)  
Table 23. ADC Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
ADCDRL  
Reset Value  
D1  
0
D0  
0
006Fh  
0070h  
0071h  
0
0
0
0
0
0
ADCDRH  
Reset Value  
D9  
0
D8  
0
D7  
0
D6  
0
D5  
0
D4  
0
D3  
0
D2  
0
ADCCSR  
Reset Value  
EOC  
0
SPEED  
0
ADON  
0
SLOW  
0
CH2  
0
CH1  
0
CH0  
0
0
119/172  
ST72260Gx, ST72262Gx, ST72264Gx  
12 INSTRUCTION SET  
12.1 CPU ADDRESSING MODES  
so, most of the addressing modes may be subdi-  
vided in two sub-modes called long and short:  
The CPU features 17 different addressing modes  
which can be classified in 7 main groups:  
– Long addressing mode is more powerful be-  
cause it can use the full 64 Kbyte address space,  
however it uses more bytes and more CPU cy-  
cles.  
Addressing Mode  
Inherent  
Example  
nop  
– Short addressing mode is less powerful because  
it can generally only access page zero (0000h -  
00FFh range), but the instruction size is more  
compact, and faster. All memory to memory in-  
structions use short addressing modes only  
(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,  
INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)  
Immediate  
Direct  
ld A,#$55  
ld A,$55  
ld A,($55,X)  
ld A,([$55],X)  
jrne loop  
Indexed  
Indirect  
Relative  
Bit operation  
bset byte,#5  
The ST7 Assembler optimizes the use of long and  
short addressing modes.  
The CPU Instruction set is designed to minimize  
the number of bytes required per instruction: To do  
Table 24. CPU Addressing Mode Overview  
Pointer  
Address  
(Hex.)  
Pointer Size  
(Hex.)  
Length  
(Bytes)  
Mode  
Syntax  
Destination  
Inherent  
Immediate  
Short  
Long  
nop  
+ 0  
ld A,#$55  
+ 1  
+ 1  
+ 2  
+ 0  
+ 1  
+ 2  
+ 2  
+ 2  
+ 2  
+ 2  
+ 1  
+ 2  
+ 1  
+ 2  
+ 2  
+ 3  
Direct  
Direct  
Direct  
Direct  
Direct  
Indirect  
Indirect  
ld A,$10  
00..FF  
ld A,$1000  
ld A,(X)  
0000..FFFF  
00..FF  
No Offset  
Short  
Long  
Indexed  
Indexed  
Indexed  
ld A,($10,X)  
ld A,($1000,X)  
ld A,[$10]  
00..1FE  
0000..FFFF  
00..FF  
Short  
Long  
00..FF  
byte  
word  
byte  
word  
ld A,[$10.w]  
ld A,([$10],X)  
ld A,([$10.w],X)  
jrne loop  
0000..FFFF 00..FF  
00..1FE 00..FF  
Short  
Long  
Indirect Indexed  
Indirect Indexed  
Direct  
0000..FFFF 00..FF  
PC+/-127  
Relative  
Relative  
Bit  
Indirect  
jrne [$10]  
PC+/-127  
00..FF  
00..FF  
00..FF  
00..FF  
00..FF  
00..FF  
00..FF  
byte  
byte  
byte  
Direct  
bset $10,#7  
bset [$10],#7  
Bit  
Indirect  
Bit  
Direct  
Relative btjt $10,#7,skip  
Bit  
Indirect Relative btjt [$10],#7,skip  
120/172  
ST72260Gx, ST72262Gx, ST72264Gx  
INSTRUCTION SET OVERVIEW (Cont’d)  
12.1.1 Inherent  
12.1.3 Direct  
All Inherent instructions consist of a single byte.  
The opcode fully specifies all the required informa-  
tion for the CPU to process the operation.  
In Direct instructions, the operands are referenced  
by their memory address.  
The direct addressing mode consists of two sub-  
modes:  
Inherent Instruction  
Function  
No operation  
Direct (short)  
NOP  
The address is a byte, thus requires only one byte  
after the opcode, but only allows 00 - FF address-  
ing space.  
TRAP  
S/W Interrupt  
Wait For Interrupt (Low Pow-  
er Mode)  
WFI  
Direct (long)  
Halt Oscillator (Lowest Power  
Mode)  
HALT  
The address is a word, thus allowing 64 Kbyte ad-  
dressing space, but requires 2 bytes after the op-  
code.  
RET  
Sub-routine Return  
Interrupt Sub-routine Return  
Set Interrupt Mask (level 3)  
Reset Interrupt Mask (level 0)  
Set Carry Flag  
IRET  
SIM  
12.1.4 Indexed (No Offset, Short, Long)  
RIM  
In this mode, the operand is referenced by its  
memory address, which is defined by the unsigned  
addition of an index register (X or Y) with an offset.  
SCF  
RCF  
Reset Carry Flag  
RSP  
Reset Stack Pointer  
Load  
The indirect addressing mode consists of three  
sub-modes:  
LD  
CLR  
Clear  
Indexed (No Offset)  
PUSH/POP  
INC/DEC  
TNZ  
Push/Pop to/from the stack  
Increment/Decrement  
Test Negative or Zero  
1 or 2 Complement  
Byte Multiplication  
There is no offset, (no extra byte after the opcode),  
and allows 00 - FF addressing space.  
Indexed (Short)  
CPL, NEG  
MUL  
The offset is a byte, thus requires only one byte af-  
ter the opcode and allows 00 - 1FE addressing  
space.  
SLL, SRL, SRA, RLC,  
RRC  
Shift and Rotate Operations  
Swap Nibbles  
Indexed (long)  
SWAP  
The offset is a word, thus allowing 64 Kbyte ad-  
dressing space and requires 2 bytes after the op-  
code.  
12.1.2 Immediate  
Immediate instructions have two bytes, the first  
byte contains the opcode, the second byte con-  
tains the operand value.  
12.1.5 Indirect (Short, Long)  
The required data byte to do the operation is found  
by its memory address, located in memory (point-  
er).  
Immediate Instruction  
Function  
LD  
Load  
The pointer address follows the opcode. The indi-  
rect addressing mode consists of two sub-modes:  
CP  
Compare  
BCP  
Bit Compare  
Indirect (short)  
AND, OR, XOR  
ADC, ADD, SUB, SBC  
Logical Operations  
Arithmetic Operations  
The pointer address is a byte, the pointer size is a  
byte, thus allowing 00 - FF addressing space, and  
requires 1 byte after the opcode.  
Indirect (long)  
The pointer address is a byte, the pointer size is a  
word, thus allowing 64 Kbyte addressing space,  
and requires 1 byte after the opcode.  
121/172  
ST72260Gx, ST72262Gx, ST72264Gx  
INSTRUCTION SET OVERVIEW (Cont’d)  
12.1.6 Indirect Indexed (Short, Long)  
12.1.7 Relative mode (Direct, Indirect)  
This is a combination of indirect and short indexed  
addressing modes. The operand is referenced by  
its memory address, which is defined by the un-  
signed addition of an index register value (X or Y)  
with a pointer value located in memory. The point-  
er address follows the opcode.  
This addressing mode is used to modify the PC  
register value, by adding an 8-bit signed offset to  
it.  
Available Relative  
Direct/Indirect  
Instructions  
Function  
The indirect indexed addressing mode consists of  
two sub-modes:  
JRxx  
CALLR  
Conditional Jump  
Call Relative  
Indirect Indexed (Short)  
The pointer address is a byte, the pointer size is a  
byte, thus allowing 00 - 1FE addressing space,  
and requires 1 byte after the opcode.  
The relative addressing mode consists of two sub-  
modes:  
Relative (Direct)  
Indirect Indexed (Long)  
The offset is following the opcode.  
Relative (Indirect)  
The pointer address is a byte, the pointer size is a  
word, thus allowing 64 Kbyte addressing space,  
and requires 1 byte after the opcode.  
The offset is defined in memory, which address  
follows the opcode.  
Table 25. Instructions Supporting Direct,  
Indexed, Indirect and Indirect Indexed  
Addressing Modes  
Long and Short  
Function  
Instructions  
LD  
Load  
CP  
Compare  
AND, OR, XOR  
Logical Operations  
Arithmetic Additions/Sub-  
stractions operations  
ADC, ADD, SUB, SBC  
BCP  
Bit Compare  
Short Instructions  
Only  
Function  
CLR  
Clear  
INC, DEC  
TNZ  
Increment/Decrement  
Test Negative or Zero  
1 or 2 Complement  
Bit Operations  
CPL, NEG  
BSET, BRES  
Bit Test and Jump Opera-  
tions  
BTJT, BTJF  
SLL, SRL, SRA, RLC,  
RRC  
Shift and Rotate Opera-  
tions  
SWAP  
Swap Nibbles  
CALL, JP  
Call or Jump subroutine  
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INSTRUCTION SET OVERVIEW (Cont’d)  
12.2 INSTRUCTION GROUPS  
The ST7 family devices use an Instruction Set  
consisting of 63 instructions. The instructions may  
be subdivided into 13 main groups as illustrated in  
the following table:  
Load and Transfer  
LD  
CLR  
POP  
DEC  
TNZ  
OR  
Stack operation  
PUSH  
INC  
RSP  
BCP  
Increment/Decrement  
Compare and Tests  
Logical operations  
CP  
AND  
BSET  
BTJT  
ADC  
SLL  
XOR  
CPL  
NEG  
Bit Operation  
BRES  
BTJF  
ADD  
SRL  
JRT  
Conditional Bit Test and Branch  
Arithmetic operations  
Shift and Rotates  
SUB  
SRA  
JRF  
SBC  
RLC  
JP  
MUL  
RRC  
CALL  
SWAP  
CALLR  
SLA  
Unconditional Jump or Call  
Conditional Branch  
JRA  
JRxx  
TRAP  
SIM  
NOP  
RET  
Interruption management  
Condition Code Flag modification  
WFI  
RIM  
HALT  
SCF  
IRET  
RCF  
Using a pre-byte  
PDY 90  
Replace an X based instruction  
using immediate, direct, indexed, or inherent ad-  
dressing mode by a Y one.  
The instructions are described with one to four op-  
codes.  
PIX 92  
Replace an instruction using di-  
In order to extend the number of available op-  
codes for an 8-bit CPU (256 opcodes), three differ-  
ent prebyte opcodes are defined. These prebytes  
modify the meaning of the instruction they pre-  
cede.  
rect, direct bit, or direct relative addressing mode  
to an instruction using the corresponding indirect  
addressing mode.  
It also changes an instruction using X indexed ad-  
dressing mode to an instruction using indirect X in-  
dexed addressing mode.  
The whole instruction becomes:  
PC-2  
PC-1  
PC  
End of previous instruction  
Prebyte  
PIY 91  
Replace an instruction using X in-  
direct indexed addressing mode by a Y one.  
opcode  
12.2.1 Illegal Opcode Reset  
PC+1  
Additional word (0 to 2) according  
to the number of bytes required to compute the ef-  
fective address  
In order to provide enhanced robustness to the de-  
vice against unexpected behaviour, a system of il-  
legal opcode detection is implemented. If a code to  
be executed does not correspond to any opcode  
or prebyte value, a reset is generated. This, com-  
bined with the Watchdog, allows the detection and  
recovery from an unexpected fault or interference.  
These prebytes enable instruction in Y as well as  
indirect addressing modes to be implemented.  
They precede the opcode of the instruction in X or  
the instruction using direct addressing mode. The  
prebytes are:  
Note: A valid prebyte associated with a valid op-  
code forming an unauthorized combination does  
not generate a reset.  
123/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
INSTRUCTION SET OVERVIEW (Cont’d)  
Mnemo  
ADC  
ADD  
AND  
BCP  
Description  
Add with Carry  
Function/Example  
A = A + M + C  
A = A + M  
Dst  
Src  
I1  
H
H
H
I0  
N
N
N
N
N
Z
Z
Z
Z
Z
C
C
C
A
M
Addition  
A
M
M
M
Logical And  
A = A . M  
A
Bit compare A, Memory  
Bit Reset  
tst (A . M)  
A
BRES  
BSET  
BTJF  
BTJT  
CALL  
CALLR  
CLR  
bres Byte, #3  
bset Byte, #3  
btjf Byte, #3, Jmp1  
btjt Byte, #3, Jmp1  
M
M
M
M
Bit Set  
Jump if bit is false (0)  
Jump if bit is true (1)  
Call subroutine  
Call subroutine relative  
Clear  
C
C
reg, M  
reg  
0
N
N
N
1
Z
Z
Z
CP  
Arithmetic Compare  
One Complement  
Decrement  
tst(Reg - M)  
A = FFH-A  
dec Y  
M
C
1
CPL  
reg, M  
reg, M  
DEC  
HALT  
IRET  
INC  
Halt  
1
0
Interrupt routine return  
Increment  
Pop CC, A, X, PC  
inc X  
I1  
H
I0  
N
N
Z
Z
C
reg, M  
JP  
Absolute Jump  
Jump relative always  
Jump relative  
jp [TBL.w]  
JRA  
JRT  
JRF  
Never jump  
jrf *  
JRIH  
JRIL  
Jump if ext. INT pin = 1  
Jump if ext. INT pin = 0  
Jump if H = 1  
(ext. INT pin high)  
(ext. INT pin low)  
H = 1 ?  
JRH  
JRNH  
JRM  
Jump if H = 0  
H = 0 ?  
Jump if I1:0 = 11  
Jump if I1:0 <> 11  
Jump if N = 1 (minus)  
Jump if N = 0 (plus)  
Jump if Z = 1 (equal)  
I1:0 = 11 ?  
I1:0 <> 11 ?  
N = 1 ?  
JRNM  
JRMI  
JRPL  
JREQ  
JRNE  
JRC  
N = 0 ?  
Z = 1 ?  
Jump if Z = 0 (not equal) Z = 0 ?  
Jump if C = 1  
Jump if C = 0  
Jump if C = 1  
C = 1 ?  
JRNC  
JRULT  
C = 0 ?  
Unsigned <  
Jmp if unsigned >=  
Unsigned >  
JRUGE Jump if C = 0  
JRUGT Jump if (C + Z = 0)  
124/172  
ST72260Gx, ST72262Gx, ST72264Gx  
INSTRUCTION SET OVERVIEW (Cont’d)  
Mnemo  
JRULE  
LD  
Description  
Jump if (C + Z = 1)  
Load  
Function/Example  
Unsigned <=  
dst <= src  
Dst  
Src  
I1  
H
I0  
N
N
N
N
N
Z
Z
Z
Z
Z
C
reg, M  
A, X, Y  
reg, M  
M, reg  
X, Y, A  
MUL  
NEG  
NOP  
OR  
Multiply  
X,A = X * A  
neg $10  
0
0
Negate (2's compl)  
No Operation  
OR operation  
C
A = A + M  
pop reg  
pop CC  
push Y  
C = 0  
A
M
reg  
CC  
M
M
POP  
Pop from the Stack  
M
I1  
1
H
I0  
0
C
0
PUSH  
RCF  
RET  
RIM  
Push onto the Stack  
Reset carry flag  
Subroutine Return  
Enable Interrupts  
Rotate left true C  
Rotate right true C  
Reset Stack Pointer  
Substract with Carry  
Set carry flag  
reg, CC  
I1:0 = 10 (level 0)  
C <= A <= C  
C => A => C  
S = Max allowed  
A = A - M - C  
C = 1  
RLC  
RRC  
RSP  
SBC  
SCF  
SIM  
reg, M  
reg, M  
N
N
Z
Z
C
C
A
M
N
Z
C
1
Disable Interrupts  
Shift left Arithmetic  
Shift left Logic  
I1:0 = 11 (level 3)  
C <= A <= 0  
C <= A <= 0  
0 => A => C  
A7 => A => C  
A = A - M  
1
1
SLA  
reg, M  
reg, M  
reg, M  
reg, M  
A
N
N
0
Z
Z
Z
Z
Z
Z
Z
C
C
C
C
C
SLL  
SRL  
SRA  
SUB  
SWAP  
TNZ  
TRAP  
WFI  
Shift right Logic  
Shift right Arithmetic  
Substraction  
N
N
N
N
M
M
SWAP nibbles  
A7-A4 <=> A3-A0  
tnz lbl1  
reg, M  
Test for Neg & Zero  
S/W trap  
S/W interrupt  
1
1
1
0
Wait for Interrupt  
Exclusive OR  
XOR  
A = A XOR M  
A
N
Z
125/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13 ELECTRICAL CHARACTERISTICS  
13.1 PARAMETER CONDITIONS  
Unless otherwise specified, all voltages are re-  
ferred to V  
.
SS  
13.1.5 Pin input voltage  
13.1.1 Minimum and Maximum values  
The input voltage measurement on a pin of the de-  
vice is described in Figure 63.  
Unless otherwise specified the minimum and max-  
imum values are guaranteed in the worst condi-  
tions of ambient temperature, supply voltage and  
frequencies by tests in production on 100% of the  
Figure 63. Pin input voltage  
devices with an ambient temperature at T =25°C  
A
and T =T max (given by the selected temperature  
A
A
ST7 PIN  
range).  
Data based on characterization results, design  
simulation and/or technology characteristics are  
indicated in the table footnotes and are not tested  
in production. Based on characterization, the min-  
imum and maximum values refer to sample tests  
and represent the mean value plus or minus three  
times the standard deviation (mean 3Σ).  
V
IN  
13.1.2 Typical values  
Unless otherwise specified, typical data are based  
on T =25°C, V =5V (for the 3VV 5.5V volt-  
A
DD  
DD  
age range) and V =2.7V (for the 2.7VV 3V  
DD  
DD  
voltage range). They are given only as design  
guidelines and are not tested.  
Typical ADC accuracy values are determined by  
characterization of a batch of samples from a  
standard diffusion lot over the full temperature  
range, where 95% of the devices have an error  
less than or equal to the value indicated  
(mean 2Σ).  
13.1.3 Typical curves  
Unless otherwise specified, all typical curves are  
given only as design guidelines and are not tested.  
13.1.4 Loading capacitor  
The loading conditions used for pin parameter  
measurement are shown in Figure 62.  
Figure 62. Pin loading conditions  
ST7 PIN  
C
L
126/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
13.2 ABSOLUTE MAXIMUM RATINGS  
Stresses above those listed as “absolute maxi-  
mum ratings” may cause permanent damage to  
the device. This is a stress rating only and func-  
tional operation of the device under these condi-  
tions is not implied. Exposure to maximum rating  
conditions for extended periods may affect device  
reliability.  
13.2.1 Voltage Characteristics  
Symbol  
- V  
Ratings  
Maximum value  
6.5  
Unit  
V
Supply voltage  
DD  
SS  
V
1) & 2)  
V
Input voltage on any pin  
VSS-0.3 to VDD+0.3  
IN  
ESD(HBM)  
V
Electrostatic discharge voltage (Human Body Model)  
Electrostatic discharge voltage (Machine Model)  
see Section 13.7.3 on page 142  
V
ESD(MM)  
13.2.2 Current Characteristics  
Symbol  
Ratings  
Maximum value  
Unit  
3)  
3)  
I
Total current into V power lines (source)  
100  
150  
25  
50  
- 25  
+ 5  
5
mA  
VDD  
DD  
I
Total current out of V ground lines (sink)  
SS  
VSS  
Output current sunk by any standard I/O and control pin  
Output current sunk by any high sink I/O pin  
Output current source by any I/Os and control pin  
Injected current on Flash device pins PB0 and PB1  
Injected current on RESET pin  
I
IO  
2) & 4)  
I
INJ(PIN)  
Injected current on OSC1 and OSC2 pins  
5
5) & 6)  
Injected current on any other pin  
5
2)  
5)  
ΣI  
Total injected current (sum of all I/O and control pins)  
20  
INJ(PIN)  
13.2.3 Thermal Characteristics  
Symbol  
Ratings  
Value  
Unit  
T
Storage temperature range  
-65 to +150  
°C  
STG  
Maximum junction temperature (see Section Figure 104. "Low Profile Fine Pitch Ball Grid Array  
Package" on page 160)  
T
J
Notes:  
1. Directly connecting the I/O pins to V or V could damage the device if an unexpected change of the I/O configura-  
DD  
SS  
tion occurs (for example, due to a corrupted program counter). To guarantee safe operation, this connection has to be  
done through a pull-up or pull-down resistor (typical: 10kfor I/Os). Unused I/O pins must be tied in the same way to V  
DD  
or V according to their reset configuration. For reset pin, please refer to Figure 91 and Figure 92.  
SS  
2. I  
must never be exceeded. This is implicitly insured if V maximum is respected. If V maximum cannot be  
INJ(PIN)  
IN  
IN  
respected, the injection current must be limited externally to the I  
value. A positive injection is induced by V >V  
IN DD  
INJ(PIN)  
while a negative injection is induced by V <V . For true open-drain pads, there is no positive injection current, and the  
corresponding V maximum must always be respected.  
IN  
SS  
IN  
3. All power (V ) and ground (V ) lines must always be connected to the external supply.  
DD  
SS  
4. Negative injection disturbs the analog performance of the device. See note in “10-BIT ADC CHARACTERISTICS” on  
page 157. For best reliability, it is recommended to avoid negative injection of more than 1.6mA.  
5. When several inputs are submitted to a current injection, the maximum ΣI  
is the absolute sum of the positive  
INJ(PIN)  
and negative injected currents (instantaneous values). These results are based on characterisation with ΣI  
maxi-  
INJ(PIN)  
mum current injection on four I/O port pins of the device.  
6. True open drain I/O port pins do not accept positive injection.  
127/172  
 
 
ST72260Gx, ST72262Gx, ST72264Gx  
13.3 OPERATING CONDITIONS  
13.3.1 General Operating Conditions  
T = -40 to +85°C unless otherwise specified.  
A
Symbol  
Parameter  
Conditions  
= 8 MHz. max.  
Min  
2.7  
3.3  
Max  
5.5  
Unit  
f
f
OSC  
V
Supply voltage  
V
DD  
= 16 MHz. max.  
3.3V  
5.5  
OSC  
V
V
up to 16  
External clock frequency on OSC1  
pin  
DD  
DD  
f
MHz  
OSC  
2.7V  
up to 8  
Figure 64. f  
Maximum Operating Frequency Versus VDD Supply Voltage  
OSC  
FUNCTIONALITY  
GUARANTEED  
IN THIS AREA  
f
[MHz]  
OSC  
(UNLESS OTHERWISE  
STATED IN THE  
TABLES OF  
PARAMETRIC DATA)  
16  
FUNCTIONALITY  
NOT GUARANTEED  
IN THIS AREA  
8
4
1
0
SUPPLY VOLTAGE [V]  
5.5  
2.0  
2.7 3.3  
3.5  
4.0  
4.5  
5.0  
128/172  
ST72260Gx, ST72262Gx, ST72264Gx  
OPERATING CONDITIONS (Cont’d)  
13.3.2 Operating Conditions with Low Voltage Detector (LVD)  
T = -40 to +85°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
High Threshold  
Med. Threshold  
Low Threshold  
Min  
Typ  
Max  
Unit  
1)  
4.0  
4.2  
3.75  
3.15  
4.5  
4.0  
3.35  
Reset release threshold  
1)  
1)  
V
3.55  
2.95  
IT+(LVD)  
(V rise)  
DD  
V
1)  
High Threshold  
Med. Threshold  
Low Threshold  
3.75  
3.3  
2.75  
4.0  
3.55  
3.0  
4.25  
3.75  
3.15  
Reset generation threshold  
1)  
1)  
V
V
IT-(LVD)  
hys(LVD)  
(V fall)  
DD  
LVD voltage threshold hysteresis  
V
-V  
200  
mV  
ns  
IT+(LVD) IT-(LVD)  
20ms/V  
Flash  
20µs/V  
20µs/V  
1)2)3)  
Vt  
V
rise time rate  
DD  
POR  
ROM  
1)  
t
Filtered glitch delay on V  
Not detected by the LVD  
40  
g(VDD)  
DD  
Notes:  
1. Data based on characterization results, not tested in production.  
2. When Vt is faster than 100 µs/V, the Reset signal is released after a delay of max. 42µs after V crosses the  
POR  
threshold.  
DD  
V
IT+(LVD)  
3. Use of LVD with capacitive power supply: with this type of power supply, if power cuts occur in the application, it is  
recommended to pull V down to 0V to ensure optimum restart conditions. Refer to circuit example in Figure 91 on page  
DD  
151 and note 6.  
.
Figure 65. LVD Startup Behaviour  
5V  
LVD RESET  
V
IT+  
2V  
Reset state  
not defined  
in this area  
t
Note: When the LVD is enabled, the MCU reaches its authorized operating voltage from a reset state.  
However, in some devices, the reset signal may be undefined until V is approximately 2V. As a conse-  
DD  
quence, the I/Os may toggle when V is below this voltage.  
DD  
Because Flash write access is impossible below this voltage, the Flash memory contents will not be cor-  
rupted.  
129/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
OPERATING CONDITIONS (Cont’d)  
13.3.3 Auxiliary Voltage Detector (AVD) Thresholds  
T = -40 to +85°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
1)  
VD level = Low in option byte  
VD level = Med. in option byte 3.9  
VD level = High in option byte 3.4  
4.4  
4.6  
4.2  
3.6  
4.9  
4.4  
3.8  
10 AVDF flag toggle threshold  
1)  
1)  
V
IT+(AVD)  
(V rise)  
DD  
V
1)  
VD level = Low in option byte  
VD level = Med. in option byte 3.75  
VD level = High in option byte 3.1  
4.15  
4.4  
3.95  
3.4  
4.65  
4.2  
3.6  
01 AVDF flag toggle threshold  
1)  
V
V
IT-(AVD)  
hys(AVD)  
(V fall)  
1)  
DD  
AVD voltage threshold hysteresis  
V
-V  
250  
IT+(AVD) IT-(AVD)  
mV  
Voltage drop between AVD flag set  
and LVD reset activated  
V  
V
-V  
450  
IT-  
IT-(AVD) IT-(LVD)  
1. Data based on characterization results, not tested in production.  
130/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.4 SUPPLY CURRENT CHARACTERISTICS  
The following current consumption specified for the ST7 functional operating modes over temperature  
range does not take into account the clock source current consumption. To get the total device consump-  
tion, the two current values must be added (except for HALT mode for which the clock is stopped).  
Symbol  
I  
Parameter  
Conditions  
Max  
Unit  
Supply current variation vs. temperature  
Constant V and f  
CPU  
10  
%
DD(Ta)  
DD  
13.4.1 RUN, SLOW, WAIT and SLOW WAIT Modes  
T = -40 to +85°C unless otherwise specified  
A
FLASH  
ROM  
Typ Max  
Unit  
Unit  
Symbol  
Parameter  
Conditions  
Typ  
Max  
Supply current in RUN  
mode  
(see Figure 66)  
1)  
V
V
=5.5V,f  
=2.7V, f  
=16MHz, f =8MHz  
CPU  
7.2  
3.5  
11  
5.0  
1.2  
2)  
DD  
DD  
OSC  
TBD  
TBD  
TBD  
TBD  
4)  
=8MHz, f  
=4MHz  
5.25  
OSC  
CPU  
Supply current in SLOW  
mode  
(see Figure 67)  
1)  
4)  
V
V
=5.5V, f  
=2.7V, f  
=16MHz, f =500kHz  
CPU  
0.7  
1.2  
0.6  
0.5  
3)  
DD  
DD  
OSC  
OSC  
=8MHz, f  
=250kHz  
0.38  
0.13  
CPU  
I
mA  
DD  
Supply current in WAIT  
1)  
4)  
V
V
=5.5V,f  
=16MHz, f  
=8MHz  
3.6  
1.8  
5.55  
2.3  
0.5  
2)  
DD  
DD  
OSC  
OSC  
CPU  
mode  
=2.7V, f  
=8MHz, f  
=4MHz  
3
CPU  
(see Figure 68)  
Supply current in SLOW  
1)  
4)  
V
V
=5.5V, f  
=2.7V, f  
=16MHz, f =500kHz  
CPU  
0.45  
0.25  
1
0.5  
0.33  
0.08  
3)  
DD  
DD  
OSC  
OSC  
WAIT mode  
=8MHz, f  
=250kHz  
CPU  
(see Figure 69)  
Notes:  
1. Data based on characterization results, tested in production at V max. and f  
max.  
DD  
CPU  
2. Program executed from RAM, CPU running with memory access, all I/O pins in input mode with a static value at V  
DD  
or V (no load), all peripherals in reset state; clock input (OSC1) driven by external square wave, LVD disabled.  
SS  
3. All I/O pins in input mode with a static value at V or V (no load), all peripherals in reset state; clock input (OSC1)  
DD  
SS  
driven by external square wave, LVD disabled.  
4. Data based on characterization results, not tested in production.  
131/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
SUPPLY CURRENT CHARACTERISTICS (Cont’d)  
Figure 66. Typical I in RUN at T =25°C  
Figure 68. Typical I in WAIT at T =25°C  
DD  
A
DD  
A
10  
9
8
7
6
5
4
3
2
1
0
Fosc=16MHz  
Fosc=8MHz  
Fosc=4MHz  
Fosc=2MHz  
Fosc=16MHz  
Fosc=8MHz  
Fosc=4MHz  
Fosc=2MHz  
4.5  
4
3.5  
3
2.5  
2
1.5  
1
0.5  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
Vdd(V)  
Vdd (V)  
Figure 67. Typical I in SLOW at T =25°C  
Figure 69. Typ. I in SLOW-WAIT at T =25°C  
DD A  
DD  
A
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
Fosc=16MHz  
Fosc=8MHz  
Fosc=4MHz  
Fosc=2MHz  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
Fosc=16MHz  
Fosc=8MHz  
Fosc=4MHz  
Fosc=2MHz  
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
Vdd(V)  
Vdd(V)  
132/172  
ST72260Gx, ST72262Gx, ST72264Gx  
SUPPLY CURRENT CHARACTERISTICS (Cont’d)  
13.4.2 HALT and ACTIVE-HALT Modes  
Symbol  
Parameter  
Conditions  
Typ  
<1  
Max  
10  
6
Unit  
V
V
=5.5V -40°CT +85°C  
DD  
DD  
A
1)  
Supply current in HALT mode  
=2.7V -40°CT +85°C  
<1  
A
I
µA  
DD  
Nomax.  
guaran-  
teed  
2)  
Supply current in ACTIVE-HALT mode  
500  
13.4.3 Supply and Clock Managers  
The previous current consumption specified for  
the ST7 functional operating modes over tempera-  
ture range does not take into account the clock  
source current consumption. To get the total de-  
vice consumption, the two current values must be  
added (except for HALT mode).  
Symbol  
Parameter  
Conditions  
Typ  
Max  
Unit  
I
Supply current of internal RC oscillator  
900  
DD(RCINT)  
see Section  
13.5.3 on page  
136  
3) & 4)  
I
Supply current of resonator oscillator  
DD(RES)  
µA  
I
PLL supply current  
LVD supply current  
V
=5V  
100  
100  
DD(PLL)  
DD  
I
HALT mode  
DD(LVD)  
Notes:  
1. All I/O pins in output mode with a static value at V (no load), LVD disabled. Data based on characterization results,  
SS  
tested in production at V max. and f  
max.  
CPU  
DD  
2. Data based on characterisation results, not tested in production. All I/O pins in output mode with a static value at V  
SS  
(no load); clock input (OSC1) driven by external square wave, LVD disabled. To obtain the total current consumption of  
the device, add the clock source consumption (Section 13.5.3 and Section 13.5.4).  
3. Data based on characterization results done with the external components specified in Section 13.5.3 and Section  
13.5.4, not tested in production.  
4. As the oscillator is based on a current source, the consumption does not depend on the voltage.  
133/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
SUPPLY CURRENT CHARACTERISTICS (Cont’d)  
13.4.4 On-chip peripherals  
Symbol  
Parameter  
Conditions  
Typ  
200  
300  
200  
250  
350  
650  
350  
500  
500  
600  
Unit  
f
f
f
f
f
f
f
f
=4MHz  
=8MHz  
=4MHz  
=8MHz  
=4MHz  
=8MHz  
=4MHz  
=8MHz  
V
V
V
V
V
V
V
V
V
V
=3.0V  
=5.0V  
=3.0V  
=5.0V  
=3.0V  
=5.0V  
=3.0V  
=5.0V  
=3.0V  
=5.0V  
CPU  
CPU  
CPU  
CPU  
CPU  
CPU  
CPU  
CPU  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
1)  
I
16-bit Timer supply current  
DD(TIM)  
2)  
3)  
4)  
I
SPI supply current  
SCI supply current  
I2C supply current  
DD(SPI)  
DD(SCI)  
I
µA  
I
DD(I2C)  
5)  
I
ADC supply current when converting  
f
=4MHz  
DD(ADC)  
ADC  
Notes:  
1. Data based on a differential I measurement between reset configuration (timer counter running at f  
/2) and timer  
DD  
CPU  
counter stopped (only TIMD bit set). Data valid for one timer.  
2. Data based on a differential I measurement between reset configuration (SPI disabled) and a permanent SPI master  
DD  
communication at maximum speed (data sent equal to FFh).This measurement includes the pad toggling consumption.  
3. Data based on a differential I measurement between SCI running at maximum speed configuration (500 kbaud, con-  
DD  
tinuous transmission of AA +RE enabled and SCI off. This measurement includes the pad toggling consumption.  
4. Data based on a differential I measurement between reset configuration (I2C disabled) and a permanent I2C master  
DD  
communication at 300kHz (data sent equal to AAh). This measurement includes the pad toggling consumption  
(4.7kOhm external pull-up on clock and data lines).  
5. Data based on a differential I measurement between reset configuration (ADC off) and continuous A/D conversion  
DD  
(f  
=4MHz).  
ADC  
134/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.5 CLOCK AND TIMING CHARACTERISTICS  
Subject to general operating conditions for V , f  
, and T .  
DD OSC  
A
13.5.1 General Timings  
1)  
Symbol  
Parameter  
Conditions  
Min  
2
Typ  
Max  
12  
Unit  
tCPU  
ns  
3
t
Instruction cycle time  
c(INST)  
f
f
=8MHz  
250  
10  
375  
1500  
22  
CPU  
CPU  
2)  
tCPU  
µs  
Interrupt reaction time  
t
v(IT)  
t
= t  
+ 10  
c(INST)  
=8MHz  
1.25  
2.75  
v(IT)  
13.5.2 External Clock Source  
Symbol  
Parameter  
Conditions  
Min  
0.7xV  
Typ  
Max  
Unit  
V
OSC1 input pin high level voltage  
OSC1 input pin low level voltage  
V
DD  
OSC1H  
DD  
V
V
V
0.3xV  
DD  
OSC1L  
SS  
t
t
3)  
w(OSC1H)  
see Figure 70  
OSC1 high or low time  
15  
w(OSC1L)  
ns  
t
t
3)  
r(OSC1)  
OSC1 rise or fall time  
15  
1
f(OSC1)  
I
OSCx Input leakage current  
V
V V  
DD  
µA  
L
SS  
IN  
Figure 70. Typical Application with an External Clock Source  
90%  
V
V
OSC1H  
OSC1L  
10%  
t
t
w(OSC1H)  
t
t
w(OSC1L)  
f(OSC1)  
r(OSC1)  
OSC2  
Not connected internally  
f
OSC  
EXTERNAL  
CLOCK SOURCE  
I
L
OSC1  
ST72XXX  
Notes:  
1. Data based on typical application software.  
2. Time measured between interrupt event and interrupt vector fetch. tc(INST) is the number of tCPU cycles needed to finish  
the current instruction execution.  
3. Data based on design simulation and/or technology characteristics, not tested in production.  
135/172  
ST72260Gx, ST72262Gx, ST72264Gx  
CLOCK AND TIMING CHARACTERISTICS (Cont’d)  
13.5.3 Crystal and Ceramic Resonator Oscillators  
The ST7 internal clock can be supplied with four  
different Crystal/Ceramic resonator oscillators. All  
the information given in this paragraph are based  
on characterization results with specified typical  
external components. In the application, the reso-  
nator and the load capacitors have to be placed as  
close as possible to the oscillator pins in order to  
minimize output distortion and start-up stabiliza-  
tion time. Refer to the crystal/ceramic resonator  
manufacturer for more details (frequency, pack-  
age, accuracy...).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
MHz  
kΩ  
VLP : Very Low power oscillator  
LP: Low power oscillator  
MP: Medium power oscillator  
MS: Medium speed oscillator  
HS: High speed oscillator  
0.032  
1
>2  
>4  
>8  
0.1  
2
4
8
16  
1)  
f
Oscillator Frequency  
OSC  
R
Feedback resistor  
20  
40  
F
VLP oscillator  
60  
38  
32  
10  
10  
100  
100  
47  
47  
30  
Recommended load capacitance ver- R =200Ω  
LP oscillator  
MP oscillator  
MS oscillator  
HS oscillator  
S
C
C
L1  
L2  
sus equivalent serial resistance of the R =200Ω  
pF  
S
crystal or ceramic resonator (R )  
R =200Ω  
S
S
R =100Ω  
S
Symbol  
Parameter  
Conditions  
Typ  
Max  
Unit  
VLP oscillator  
LP oscillator  
MP oscillator  
MS oscillator  
HS oscillator  
2.5  
80  
160  
310  
610  
5
V
=5V  
150  
250  
460  
900  
DD  
i
OSC2 driving current  
V =V  
µA  
2
IN  
SS  
Figure 71. Typical Application with a Crystal or Ceramic Resonator  
WHEN RESONATOR WITH  
INTEGRATED CAPACITORS  
i
2
f
OSC  
C
L1  
OSC1  
OSC2  
RESONATOR  
R
F
C
L2  
R
D
ST72XXX  
Notes:  
1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small R value.  
S
Refer to crystal/ceramic resonator manufacturer for more details.  
136/172  
ST72260Gx, ST72262Gx, ST72264Gx  
CLOCK AND TIMING CHARACTERISTICS (Cont’d)  
Typical Ceramic Resonators  
f
OSC  
Supplier  
Recommended OSCRNGE  
Option bit Configuration  
2)  
(MHz)  
Reference  
3)  
2
4
CSTCC2M00G56A-R0  
CSTCR4M00G55B-R0  
CSTCE8M00G55A-R0  
CSTCE16M0G53A-R0  
MP Mode  
MS Mode  
HS Mode  
HS Mode  
8
16  
Notes:  
1. Resonator characteristics given by the ceramic resonator manufacturer.  
2. SMD = [-R0: Plastic tape package (=180mm), -B0: Bulk]  
LEAD = [-A0: Flat pack package (Radial taping Ho= 18mm), -B0: Bulk]  
3. LP mode is not recommended for 2 MHz resonator because the peak to peak amplitude is too small (>0.8V)  
For more information on these resonators, please consult www.murata.com  
137/172  
ST72260Gx, ST72262Gx, ST72264Gx  
CLOCK CHARACTERISTICS (Cont’d)  
13.5.4 RC Oscillators  
The ST7 internal clock can be supplied with an in-  
ternal RC oscillator.  
Symbol  
Parameter  
Internal RC oscillator frequency  
See Figure 73  
Conditions  
Min  
Typ  
Max  
Unit  
T =25°C, V =5V  
f
2
3.5  
6
MHz  
A
DD  
OSC (RCINT)  
Figure 72. Typical Application with RC oscillator  
ST72XXX  
V
DD  
INTERNAL RC  
Current copy  
C
IN  
R
IN  
+
-
V
f
REF  
OSC  
Voltage generator  
CEX discharge  
Figure 73. Typical f  
vs V  
DD  
OSC(RCINT)  
4.5  
4
3.5  
3
2.5  
2
T=25C  
T=130C  
T=-45C  
1.5  
1
0.5  
0
2.35  
5
5.5  
Vdd(V  
)
138/172  
ST72260Gx, ST72262Gx, ST72264Gx  
CLOCK CHARACTERISTICS (Cont’d)  
13.5.5 PLL Characteristics  
Symbol  
Parameter  
Conditions  
Min  
3.5  
4.5  
2
Typ  
Max  
5.5  
5.5  
4
Unit  
T 0 to 70°C  
T -40 to +85°C  
A
V
PLL Operating Range  
PLL input frequency range  
V
DD(PLL)  
OSC  
A
f
MHz  
%
f
f
= 4 MHz.  
= 2 MHz.  
1.0  
2.5  
2.5  
4.0  
OSC  
1)  
f  
/f  
Instantaneous PLL jitter  
CPU CPU  
%
OSC  
Note:  
1. Data characterized but not tested.  
1
Figure 74. PLL Jitter vs. Signal frequency  
The user must take the PLL jitter into account in  
the application (for example in serial communica-  
tion or sampling of high frequency signals). The  
PLL jitter is a periodic effect, which is integrated  
over several CPU cycles. Therefore the longer the  
period of the application signal, the less it will be  
impacted by the PLL jitter.  
0.8  
0.7  
PLL ON  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
PLL OFF  
Figure 74 shows the PLL jitter integrated on appli-  
cation signals in the range 125kHz to 2MHz. At fre-  
quencies of less than 125KHz, the jitter is negligi-  
ble.  
2000  
1000  
500  
250  
125  
Application Signal Frequency (KHz)  
Note 1: Measurement conditions: f  
= 4MHz, T = 25°C  
A
CPU  
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ST72260Gx, ST72262Gx, ST72264Gx  
13.6 MEMORY CHARACTERISTICS  
13.6.1 RAM and Hardware Registers  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Typ  
Max  
Unit  
1)  
V
Data retention mode  
HALT mode (or RESET)  
1.6  
V
RM  
13.6.2 XFlash Program Memory  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
V
Operating voltage for Flash write/  
erase  
2.7  
5.5  
V
DD  
2)  
T =−40 to +85°C  
5
10  
Programming time for 1~32 bytes  
Programming time for 1.5kBytes  
ms  
A
t
t
prog  
T =+25°C  
0.24  
0.48  
A
4)  
3)  
Data retention  
T =+55°C  
20  
10  
years  
RET  
A
N
Write erase cycles  
T =+25°C  
kcycles  
RW  
A
Read / Write / Erase  
modes  
3)  
2.6  
mA  
f
= 8MHz, V = 5.5V  
I
Supply current  
CPU  
DD  
DD  
No Read/No Write Mode  
Power down mode / HALT  
100  
µA  
µA  
5)  
0
0.1  
Notes:  
1. Minimum V supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware reg-  
DD  
isters (only in HALT mode). Guaranteed by construction, not tested in production.  
2. Up to 32 bytes can be programmed at a time.  
3. The data retention time increases when the T decreases.  
A
4. Data based on reliability test results and monitored in production.  
5. Data based on characterization results, not tested in production.  
140/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.7 EMC CHARACTERISTICS  
tion environment and simplified MCU software. It  
should be noted that good EMC performance is  
highly dependent on the user application and the  
software in particular.  
Susceptibility tests are performed on a sample ba-  
sis during product characterization.  
13.7.1 Functional EMS (Electro Magnetic  
Susceptibility)  
Therefore it is recommended that the user applies  
EMC software optimization and prequalification  
tests in relation with the EMC level requested for  
his application.  
Based on a simple running application on the  
product (toggling 2 LEDs through I/O ports), the  
product is stressed by two electro magnetic events  
until a failure occurs (indicated by the LEDs).  
ESD: Electro-Static Discharge (positive and  
negative) is applied on all pins of the device until  
a functional disturbance occurs. This test  
conforms with the IEC 1000-4-2 standard.  
Software recommendations:  
The software flowchart must include the manage-  
ment of runaway conditions such as:  
– Corrupted program counter  
– Unexpected reset  
FTB: A Burst of Fast Transient voltage (positive  
– Critical Data corruption (control registers...)  
Prequalification trials:  
and negative) is applied to V and V through  
DD  
SS  
a 100pF capacitor, until a functional disturbance  
occurs. This test conforms with the IEC 1000-4-  
4 standard.  
Most of the common failures (unexpected reset  
and program counter corruption) can be repro-  
duced by manually forcing a low state on the RE-  
SET pin or the Oscillator pins for 1 second.  
A device reset allows normal operations to be re-  
sumed. The test results are given in the table be-  
low based on the EMS levels and classes defined  
in application note AN1709.  
To complete these trials, ESD stress can be ap-  
plied directly on the device, over the range of  
specification values. When unexpected behaviour  
is detected, the software can be hardened to pre-  
vent unrecoverable errors occurring (see applica-  
tion note AN1015).  
13.7.1.1 Designing hardened software to avoid  
noise problems  
EMC characterization and optimization are per-  
formed at component level with a typical applica-  
Level/  
Symbol  
Parameter  
Conditions  
Class  
Voltage limits to be applied on any I/O pin to induce a  
functional disturbance  
V
=5V, T =+25°C, f  
=8MHz  
OSC  
DD  
A
V
2B  
FESD  
conforms to IEC 1000-4-2  
Fast transient voltage burst limits to be applied  
V
=5V, T =+25°C, f =8MHz  
DD  
A
OSC  
V
through 100pF on V and V pins to induce a func-  
2B  
FFTB  
DD DD  
conforms to IEC 1000-4-4  
tional disturbance  
1)  
Figure 75. EMC Recommended power supply connection  
ST72XXX  
10µF 0.1µF  
V
V
DD  
SS  
ST7  
DIGITAL NOISE  
FILTERING  
POWER  
SUPPLY  
SOURCE  
V
DD  
1. The suggested 10µF and 0.1µF decoupling capacitors on the power supply lines are proposed as a good price vs. EMC  
performance tradeoff. They have to be put as close as possible to the device power supply pins. Other EMC recommen-  
dations are given in AN1709.  
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ST72260Gx, ST72262Gx, ST72264Gx  
EMC CHARACTERISTICS (Cont’d)  
13.7.2 Electro Magnetic Interference (EMI)  
Based on a simple application running on the  
product (toggling 2 LEDs through the I/O ports),  
the product is monitored in terms of emission. This  
emission test is in line with the norm SAE J 1752/  
3 which specifies the board and the loading of  
each pin.  
Max vs. [f  
/f  
]
Unit  
Monitored  
Frequency Band  
OSC CPU  
Symbol  
Parameter  
Conditions  
8/4MHz 16/8MHz  
0.1MHz to 30MHz  
30MHz to 130MHz  
130MHz to 1GHz  
SAE EMI Level  
10  
13  
16  
2.5  
13  
24  
31  
4
dBµV  
V
=5V, T =+25°C,  
A
DD  
S
Peak level  
EMI  
conforming to SAE J 1752/3  
-
13.7.3 Absolute Maximum Ratings (Electrical  
Sensitivity)  
13.7.3.1 Electro-Static Discharge (ESD)  
Electro-Static Discharges (a positive then a nega-  
tive pulse separated by 1 second) are applied to  
the pins of each sample according to each pin  
combination. The sample size depends on the  
number of supply pins in the device (3 parts*(n+1)  
supply pin). Two models can be simulated: Human  
Body Model and Machine Model. This test con-  
forms to the JESD22-A114A/A115A standard.  
Based on three different tests (ESD, LU and DLU)  
using specific measurement methods, the product  
is stressed in order to determine its performance in  
terms of electrical sensitivity. For more details, re-  
fer to the application note AN1181.  
Absolute Maximum Ratings  
1)  
Symbol  
Ratings  
Conditions  
Maximum value  
Unit  
Electro-static discharge voltage  
(Human Body Model)  
T =+25°C  
V
2000  
A
ESD(HBM)  
V
Electro-static discharge voltage  
(Machine Model)  
T =+25°C  
V
200  
A
ESD(MM)  
Notes:  
1. Data based on characterization results, not tested in production.  
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ST72260Gx, ST72262Gx, ST72264Gx  
EMC CHARACTERISTICS (Cont’d)  
13.7.3.2 Static and Dynamic Latch-Up  
DLU: Electro-Static Discharges (one positive  
then one negative test) are applied to each pin  
of 3 samples when the micro is running to  
assess the latch-up performance in dynamic  
mode. Power supplies are set to the typical  
values, the oscillator is connected as near as  
possible to the pins of the micro and the  
component is put in reset mode. This test  
conforms to the IEC1000-4-2 and SAEJ1752/3  
standards. For more details, refer to the  
application note AN1181.  
LU: 3 complementary static tests are required  
on 10 parts to assess the latch-up performance.  
A supply overvoltage (applied to each power  
supply pin) and a current injection (applied to  
each input, output and configurable I/O pin) are  
performed on each sample. This test conforms  
to the EIA/JESD 78 IC latch-up standard. For  
more details, refer to the application note  
AN1181.  
Electrical Sensitivities  
1)  
Symbol  
LU  
Parameter  
Static latch-up class  
Dynamic latch-up class  
Conditions  
Class  
T =+25°C  
A
A
A
T =+85°C  
A
V
=5.5V, f  
=4MHz, T =+25°C  
OSC A  
DLU  
A
DD  
Notes:  
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC spec-  
ifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the  
JEDEC criteria (international standard).  
143/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.8 I/O PORT PIN CHARACTERISTICS  
13.8.1 General Characteristics  
T = -40 to +85°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V
1)  
V
Input low level voltage  
Input high level voltage  
Vss - 0.3  
0.7xVDD  
0.3xVDD  
VDD + 0.3  
IL  
1)  
V
IH  
1)  
V
Schmitt trigger voltage hysteresis  
400  
mV  
hys  
Injected current on Flash device  
pins PB0 and PB1  
+4  
4
2)  
I
INJ(PIN)  
Injected Current on other I/O pins  
mA  
V
V
=5V  
Total injected current (sum of all I/O  
and control pins)  
DD  
2)  
ΣI  
25  
1
INJ(PIN)  
I
Input leakage current  
SSV V  
IN DD  
L
µA  
3)  
I
Static current consumption  
Floating input mode  
400  
85  
190  
5
S
V
V
=5V  
=3V  
50  
250  
DD  
DD  
4)  
R
Weak pull-up equivalent resistor  
V =V  
SS  
kΩ  
pF  
ns  
PU  
IN  
1)  
1)  
170  
230  
C
I/O pin capacitance  
IO  
1)  
t
Output high to low level fall time  
25  
25  
C =50pF  
Between 10% and 90%  
f(IO)out  
r(IO)out  
L
1)  
t
Output low to high level rise time  
5)  
t
External interrupt pulse time  
1
t
CPU  
w(IT)in  
Notes:  
1. Data based on characterization results, not tested in production.  
2. I  
must never be exceeded. This is implicitly insured if V maximum is respected. If V maximum cannot be  
INJ(PIN)  
IN  
IN  
respected, the injection current must be limited externally to the I  
value. A positive injection is induced by V >V  
IN DD  
INJ(PIN)  
while a negative injection is induced by V <V . For true open-drain pads, there is no positive injection current, and the  
corresponding V maximum must always be respected.  
IN  
SS  
IN  
Caution: Negative current injection not allowed on Flash device pins PB0 and PB1.  
3. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for  
example and leaving the I/O unconnected on the board or an external pull-up or pull-down resistor (see Figure 76). Data  
based on design simulation and/or technology characteristics, not tested in production.  
4. The R pull-up equivalent resistor is based on a resistive transistor (corresponding I current characteristics de-  
PU  
PU  
scribed in Figure 77).  
5. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external  
interrupt source.  
Figure 76. Two typical Applications with unused I/O Pin configured as input  
V
ST7XXX  
DD  
UNUSED I/O PORT  
10kΩ  
10kΩ  
UNUSED I/O PORT  
ST7XXX  
Note: I/O can be left unconnected if it is configured as output (0 or 1) by the software. This has the advantage of greater EMC  
robustness and lower cost.  
144/172  
 
 
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
Figure 77. Typical I vs. V with V =V  
SS  
PU  
DD  
IN  
120  
100  
80  
60  
40  
20  
0
T=25C  
T=-45C  
T=90C  
2 2.5 3 3.5 4 4.5 5 5.5 6  
Vdd(V)  
Figure 78. Typical V  
IL  
2.5  
2
1.5  
1
T=25C  
T=-45C  
0.5  
0
2
3
4
5
6
Vdd(V)  
Figure 79. Typical V  
IH  
4
3
2
1
T=25C  
T=-45C  
2
3
4
5
6
Vdd(V)  
145/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
13.8.2 Output Driving Current  
T = -40 to +85°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
Min  
Max  
1.2  
Unit  
I =+5mA  
IO  
Output low level voltage for a standard I/O pin  
when 8 pins are sunk at same time  
I =+2mA  
0.5  
IO  
1)  
V
OL  
I =+20mA,  
1.3  
IO  
Output low level voltage for a high sink I/O pin  
when 4 pins are sunk at same time  
I =+8mA  
0.75  
IO  
I =-5mA,  
V
V
-1.6  
IO  
Output high level voltage for an I/O pin  
when 4 pins are sourced at same time  
DD  
DD  
2)  
V
OH  
I =-2mA  
-0.8  
IO  
Output low level voltage for a standard I/O pin  
when 8 pins are sunk at same time  
I =+2mA  
0.6  
0.6  
IO  
1)3)  
2)3)  
1)3)  
2)3)  
V
OL  
Output low level voltage for a high sink I/O pin  
when 4 pins are sunk at same time  
V
I =+8mA  
IO  
Output high level voltage for an I/O pin  
when 4 pins are sourced at same time  
I =-2mA T 85°C  
V
V
V
-0.8  
IO  
A
OH  
DD  
Output low level voltage for a standard I/O pin  
when 8 pins are sunk at same time  
I =+2mA  
0.7  
0.7  
IO  
V
OL  
Output low level voltage for a high sink I/O pin  
when 4 pins are sunk at same time  
I =+8mA  
IO  
Output high level voltage for an I/O pin  
when 4 pins are sourced at same time  
I =-2mA  
V
-0.9  
DD  
IO  
OH  
Notes:  
1. The I current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of I  
IO  
IO  
(I/O ports and control pins) must not exceed I  
.
VSS  
2. The I current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of  
IO  
I
(I/O ports and control pins) must not exceed I  
. True open drain I/O pins does not have V  
.
IO  
VDD  
OH  
3. Not tested in production, based on characterization results.  
146/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
Figure 80. Typ. V at V =5V (standard)  
Figure 82. Typ. V at V =2.7V (standard)  
OL DD  
OL  
DD  
0.5  
0.5  
0.4  
0.4  
0.3  
0.3  
0.2  
0.2  
0.1  
0.1  
0.0  
T=25C  
T=90C  
T=-45C  
1.8  
1.6  
1.4  
1.2  
1
T=25C  
T=90C  
T=-45C  
0.8  
0.6  
0.4  
0.2  
0
0
1
2
3
4
5
6
7
8
9
10  
0
1
2
Iio(mA)  
Iio(mA)  
Figure 81. Typ. V at V =3V (high-sink)  
Figure 83. Typ. V at V =5V (high-sink)  
OL DD  
OL  
DD  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
T=25C  
T=90C  
T=-45C  
T=25C  
T=90C  
T=-45C  
0 1 2 3 4 5 6 7 8 9 1011121314151617181920  
Iio(mA)  
0
2
4
6
8
10  
12  
14  
16  
Iol(mA)  
147/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
Figure 84. Typ. V at V =2.7V  
Figure 86. Typ. V at V =3V  
OH DD  
OH  
DD  
3
2.5  
2
3.5  
3
2.5  
2
T=25C  
T=90C  
T=-45C  
T=25C  
T=90C  
T=-45C  
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0
1
2
3
0
0.5  
1
1.5  
2
Iio(mA)  
Iio(mA)  
Figure 87. Typ. V at V =5V  
Figure 85. Typ. V at V =4V  
OH  
DD  
OH  
DD  
4.5  
4
6
5
4
3
2
1
0
3.5  
3
T=25C  
T=90C  
T=-45C  
2.5  
2
T=25C  
T=90C  
1.5  
1
T=-45C  
0.5  
0
0
1
2
3
4
5
0
1
2
3
4
5
Iio(mA  
)
Iio(mA)  
Notes:  
1. The I current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of I  
IO  
IO  
(I/O ports and control pins) must not exceed I  
.
VSS  
2. The I current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of  
IO  
I
(I/O ports and control pins) must not exceed I  
. True open drain I/O pins does not have V  
.
IO  
VDD  
OH  
148/172  
ST72260Gx, ST72262Gx, ST72264Gx  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
Figure 88. Typical V vs. V on standard I/O port (Ports B and C)  
OL  
DD  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
T=25C  
T=90C  
T=-45C  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
T=25C  
T=90C  
T=-45C  
2.5  
3
3.5  
4
5
5.5  
6
3.5  
4
5
5.5  
6
Vdd (V)  
Vdd (V)  
Figure 89. Typical V vs. V on high sink I/O port (Port A)  
OL  
DD  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
T=25C  
T=90C  
T=-45C  
T=25C  
T=90C  
T=-45C  
3
3.5  
4
5
5.5  
6
2.4  
3
3.5  
4
5
5.5  
6
Vdd (V)  
Vdd (V)  
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ST72260Gx, ST72262Gx, ST72264Gx  
13.9 CONTROL PIN CHARACTERISTICS  
13.9.1 Asynchronous RESET Pin  
T = -40 to +85°C unless otherwise specified  
A
Symbol  
Parameter  
Input low level voltage  
Conditions  
Min  
- 0.3  
ss  
Typ  
Max  
Unit  
V
V
V
0.3xVDD  
VDD + 0.3  
IL  
V
Input high level voltage  
0.7xVDD  
IH  
1)  
V
Schmitt trigger voltage hysteresis  
2.5  
0.68  
0.28  
40  
V
hys  
I =+5mA  
0.95  
0.45  
80  
IO  
2)  
V
R
Output low level voltage  
V
=5V  
V
OL  
DD  
I =+2mA  
IO  
V
V
=5V  
=3V  
20  
20  
DD  
DD  
Pull-up equivalent resistor  
kΩ  
ON  
85  
t
Generated reset pulse duration  
Internal reset sources  
30  
µs  
µs  
ns  
w(RSTL)out  
3)  
t
External reset pulse hold time  
h(RSTL)in  
t
Filtered glitch duration  
200  
g(RSTL)in  
Figure 90. Typical I on RESET pin  
PU  
250  
T=25C  
T=90C  
200  
T=-45C  
150  
100  
50  
0
2.4  
3
4
5
5.5  
6
Vdd (V)  
Notes:  
1. Data based on characterization results, not tested in production.  
2. The I current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of I  
IO  
IO  
(I/O ports and control pins) must not exceed I  
.
VSS  
3. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on  
RESET pin with a duration below t  
can be ignored.  
h(RSTL)in  
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ST72260Gx, ST72262Gx, ST72264Gx  
CONTROL PIN CHARACTERISTICS (Cont’d)  
1)2)3)4)  
Figure 91. RESET pin protection when LVD is enabled.  
V
ST72XXX  
DD  
Optional  
(note 3)  
Required  
R
ON  
Filter  
INTERNAL  
RESET  
EXTERNAL  
RESET  
0.01µF  
1MΩ  
WATCHDOG  
ILLEGALOPCODE  
LVD RESET  
PULSE  
GENERATOR  
5)  
1)  
Figure 92. RESET pin protection when LVD is disabled.  
Recommended for EMC  
V
ST72XXX  
DD  
V
V
DD  
DD  
R
ON  
Filter  
0.01µF  
0.01µF  
4.7kΩ  
INTERNAL  
RESET  
USER  
EXTERNAL  
RESET  
CIRCUIT  
WATCHDOG  
PULSE  
GENERATOR  
5)  
ILLEGALOPCODE  
Required  
Note 1:  
– The reset network protects the device against parasitic resets.  
– The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the  
device can be damaged when the ST7 generates an internal reset (LVD or watchdog).  
– Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go  
below the V max. level specified in Section 13.9.1 on page 150. Otherwise the reset will not be taken into account  
IL  
internally.  
– Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must en-  
sure that the current sunk on the RESET pin is less than the absolute maximum value specified for I  
Section 13.2.2 on page 127.  
in  
INJ(RESET)  
Note 2: When the LVD is enabled, it is recommended not to connect a pull-up resistor or capacitor. A 10nF pull-down  
capacitor is required to filter noise on the reset line.  
Note 3: In case a capacitive power supply is used, it is recommended to connect a 1Mpull-down resistor to the RESET  
pin to discharge any residual voltage induced by the capacitive effect of the power supply (this will add 5µA to the power  
consumption of the MCU).  
Note 4: Tips when using the LVD:  
– 1. Check that all recommendations related to the reset circuit have been applied (see notes above).  
– 2. Check that the power supply is properly decoupled (100nF + 10µF close to the MCU). Refer to AN1709 and  
AN2017. If this cannot be done, it is recommended to put a 100nF + 1Mpull-down on the RESET pin.  
– 3. The capacitors connected on the RESET pin and also the power supply are key to avoid any start-up marginality.  
In most cases, steps 1 and 2 above are sufficient for a robust solution. Otherwise: replace 10nF pull-down on the  
RESET pin with a 5µF to 20µF capacitor.”  
Note 5: Please refer to “Illegal Opcode Reset” on page 123 for more details on illegal opcode reset conditions.  
151/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.10 TIMER PERIPHERAL CHARACTERISTICS  
Subject to general operating conditions for V  
,
DD  
f
, and T unless otherwise specified.  
OSC  
A
Refer to I/O port characteristics for more details on  
the input/output alternate function characteristics  
(output compare, input capture, external clock,  
PWM output...).  
13.10.1 16-Bit Timer  
T = -40 to +85°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
Min  
1
Typ  
Max  
Unit  
t
Input capture pulse time  
t
t
w(ICAP)in  
CPU  
2
CPU  
t
PWM resolution time  
res(PWM)  
f
=8MHz  
250  
0
ns  
CPU  
f
Timer external clock frequency  
PWM repetition rate  
f
f
/4  
MHz  
MHz  
bit  
EXT  
CPU  
f
0
/4  
CPU  
PWM  
Res  
PWM resolution  
16  
PWM  
152/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.11 COMMUNICATION INTERFACE CHARACTERISTICS  
13.11.1 SPI - Serial Peripheral Interface  
Refer to I/O port characteristics for more details on  
the input/output alternate function characteristics  
(SS, SCK, MOSI, MISO).  
Subject to general operating conditions for V  
,
DD  
f
, and T unless otherwise specified.  
OSC  
A
Symbol  
Parameter  
Conditions  
Min  
/128  
0.0625  
Max  
Unit  
Master  
Slave  
f
f
f
/4  
CPU  
2
CPU  
f
=8MHz  
=8MHz  
f
CPU  
SCK  
MHz  
SPI clock frequency  
1/t  
/2  
c(SCK)  
CPU  
0
f
4
CPU  
t
t
r(SCK)  
SPI clock rise and fall time  
see I/O port pin description  
f(SCK)  
t
SS setup time  
SS hold time  
Slave  
Slave  
120  
120  
su(SS)  
t
h(SS)  
t
t
Master  
Slave  
100  
90  
w(SCKH)  
SCK high and low time  
Data input setup time  
Data input hold time  
w(SCKL)  
t
Master  
Slave  
100  
100  
su(MI)  
t
su(SI)  
ns  
t
Master  
Slave  
100  
100  
h(MI)  
t
h(SI)  
t
Data output access time  
Data output disable time  
Data output valid time  
Data output hold time  
Data output valid time  
Data output hold time  
Slave  
Slave  
0
120  
240  
120  
a(SO)  
t
dis(SO)  
t
v(SO)  
h(SO)  
v(MO)  
h(MO)  
Slave (after enable edge)  
t
0
t
0.25  
0.25  
Master (before capture edge)  
t
CPU  
t
Figure 93. SPI Slave Timing Diagram with CPHA=0 3)  
SS  
INPUT  
t
t
su(SS)  
c(SCK)  
t
h(SS)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
t
t
w(SCKH)  
w(SCKL)  
t
t
t
t
dis(SO)  
a(SO)  
v(SO)  
h(SO)  
t
t
r(SCK)  
f(SCK)  
see  
note 2  
MISO  
OUTPUT  
INPUT  
MSB OUT  
see note 2  
BIT6 OUT  
LSB OUT  
t
t
h(SI)  
su(SI)  
LSB IN  
MSB IN  
BIT1 IN  
MOSI  
Notes:  
1. Data based on design simulation and/or characterisation results, not tested in production.  
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has  
its alternate function capability released. In this case, the pin status depends on the I/O port configuration.  
3. Measurement points are done at CMOS levels: 0.3xV and 0.7xV  
.
DD  
DD  
153/172  
ST72260Gx, ST72262Gx, ST72264Gx  
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)  
Figure 94. SPI Slave Timing Diagram with CPHA=11)  
SS  
INPUT  
t
t
su(SS)  
c(SCK)  
t
h(SS)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
t
t
w(SCKH)  
w(SCKL)  
t
t
dis(SO)  
a(SO)  
t
t
h(SO)  
v(SO)  
t
t
r(SCK)  
f(SCK)  
see  
note 2  
see  
note 2  
MISO  
OUTPUT  
MSB OUT  
BIT6 OUT  
HZ  
LSB OUT  
t
t
h(SI)  
su(SI)  
MSB IN  
LSB IN  
BIT1 IN  
MOSI  
INPUT  
Figure 95. SPI Master Timing Diagram 1)  
SS  
INPUT  
t
c(SCK)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
CPHA=1  
CPOL=0  
CPHA=1  
CPOL=1  
t
t
w(SCKH)  
w(SCKL)  
t
t
r(SCK)  
f(SCK)  
t
t
h(MI)  
su(MI)  
MISO  
MOSI  
INPUT  
MSB IN  
h(MO)  
BIT6 IN  
LSB IN  
t
t
v(MO)  
MSB OUT  
LSB OUT  
see note 2  
BIT6 OUT  
see note 2  
OUTPUT  
Notes:  
1. Measurement points are done at CMOS levels: 0.3xV and 0.7xV  
.
DD  
DD  
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has  
its alternate function capability released. In this case, the pin status depends of the I/O port configuration.  
154/172  
ST72260Gx, ST72262Gx, ST72264Gx  
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)  
2
Refer to Table 26 for the speed  
13.11.2 I C - Inter IC Control Interface  
(SDAI and SCLI).  
2
conditions.  
The ST7 I C interface meets the re-  
Subject to general operating conditions for V  
,
DD  
2
quirements of the Standard I C communication  
f
, and T unless otherwise specified.  
OSC  
A
protocol described in the following table.  
Refer to I/O port characteristics for more details on  
the input/output alternate function characteristics  
2
2
5)  
Standard mode I C  
Fast mode I C  
Symbol  
Parameter  
Unit  
1)  
1)  
1)  
1)  
Min  
Max  
Min  
1.3  
Max  
t
SCL clock low time  
SCL clock high time  
SDA setup time  
4.7  
4.0  
250  
w(SCLL)  
µs  
t
0.6  
w(SCLH)  
t
100  
su(SDA)  
3)  
2)  
3)  
t
SDA data hold time  
0
0
900  
h(SDA)  
t
t
r(SDA)  
ns  
SDA and SCL rise time  
SDA and SCL fall time  
1000  
300  
20+0.1C  
20+0.1C  
300  
300  
b
b
r(SCL)  
t
t
f(SDA)  
f(SCL)  
t
START condition hold time  
4.0  
4.7  
4.0  
4.7  
0.6  
0.6  
0.6  
1.3  
h(STA)  
µs  
t
Repeated START condition setup time  
STOP condition setup time  
su(STA)  
su(STO)  
t
µs  
µs  
pF  
t
STOP to START condition time (bus free)  
Capacitive load for each bus line  
w(STO:STA)  
C
400  
400  
b
2
Figure 96. Typical Application with I C Bus and Timing Diagram 4)  
V
V
DD  
DD  
4.7kΩ  
4.7kΩ  
100Ω  
100Ω  
SDAI  
SCLI  
2
I C BUS  
ST72XXX  
REPEATED START  
START  
t
t
w(STO:STA)  
su(STA)  
START  
SDA  
t
t
r(SDA)  
f(SDA)  
STOP  
t
t
h(SDA)  
su(SDA)  
SCL  
t
t
t
t
t
t
h(STA)  
w(SCKH)  
w(SCKL)  
r(SCK)  
su(STO)  
f(SCK)  
Notes:  
2
1. Data based on standard I C protocol requirement, not tested in production.  
2. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined  
region of the falling edge of SCL.  
3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low period of  
SCL signal.  
4. Measurement points are done at CMOS levels: 0.3xV and 0.7xV  
.
DD  
DD  
2
2
5. At 4MHz f  
, max.I C speed (400kHz) is not achievable. In this case, max. I C speed will be approximately 260KHz.  
CPU  
155/172  
ST72260Gx, ST72262Gx, ST72264Gx  
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)  
The following table gives the values to be written in  
2
the I2CCCR register to obtain the required I C  
SCL line frequency.  
Table 26. SCL Frequency Table  
I2CCCR Value  
f
f
=4 MHz.  
f
=8 MHz.  
SCL  
CPU  
CPU  
V
= 3.3 V  
V
= 5 V  
V
= 3.3 V  
V
= 5 V  
DD  
(kHz)  
DD  
DD  
DD  
R =3.3kR =4.7kR =3.3kR =4.7kR =3.3kR =4.7kR =3.3kR =4.7kΩ  
P
P
P
P
P
P
P
P
400  
300  
200  
100  
50  
NA  
NA  
NA  
NA  
NA  
NA  
NA  
NA  
83h  
85h  
8Ah  
24h  
4Ch  
FFh  
NA  
85h  
89h  
23h  
4Ch  
FFh  
83h  
85h  
8Ah  
24h  
4Ch  
FFh  
83h  
85h  
8Ah  
23h  
4Ch  
FFh  
83h  
10h  
24h  
5Fh  
84h  
10h  
24h  
5Fh  
83h  
10h  
24h  
5Fh  
84h  
10h  
24h  
5Fh  
20  
Legend:  
R = External pull-up resistance  
P
2
f
= I C speed  
SCL  
NA = Not achievable  
Note:  
– For speeds around 200 kHz, achieved speed can have ±5% tolerance  
– For other speed ranges, achieved speed can have ±2% tolerance  
The above variations depend on the accuracy of the external components used.  
156/172  
ST72260Gx, ST72262Gx, ST72264Gx  
13.12 10-BIT ADC CHARACTERISTICS  
= 2.7 to 5.5V, T = -40°C to 85°C, unless otherwise specified  
V
DD  
A
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
MHz  
V
f
ADC clock frequency  
0.5  
4
ADC  
V
Conversion voltage range  
Internal sample and hold capacitor  
V
V
DD  
AIN  
SS  
C
6
pF  
ADC  
28  
µs  
FLASH, f  
=4MHz  
ADC  
112  
3.5  
14  
1/f  
ADC  
t
Conversion time  
CONV  
µs  
1/f  
ROM, f  
=4MHz  
ADC  
ADC  
R
C
External input impedance  
see  
Figure 97  
and  
kΩ  
AIN  
AIN  
External capacitor on analog input  
pF  
Variation frequency of analog input  
signal  
Figure  
98  
f
Hz  
AIN  
1)2)3)  
2)  
3)  
Figure 97. R  
max. vs f  
with C =0pF  
Figure 98. Recommended C /R  
values  
AIN  
ADC  
AIN  
AIN AIN  
45  
40  
35  
30  
25  
20  
15  
10  
5
1000  
100  
10  
Cain 10 nF  
Cain 22 nF  
Cain 47 nF  
4 MHz  
2 MHz  
1 MHz  
1
0
0.1  
0
10  
30  
70  
0.01  
0.1  
1
10  
CPARASITIC (pF)  
fAIN(KHz)  
Figure 99. Analog Input equivalent circuit  
V
DD  
ST72XXX  
V
T
0.6V  
R
2kΩ(max)  
AIN  
AINx  
10-Bit A/D  
Conversion  
V
AIN  
C
V
0.6V  
AIN  
T
I
C
ADC  
6pF  
L
1µA  
Notes:  
1. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10k). Data  
based on characterization results, not tested in production.  
2. C  
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad ca-  
PARASITIC  
pacitance (3pF). A high C  
value will downgrade conversion accuracy. To remedy this, f  
should be reduced.  
PARASITIC  
ADC  
3. This graph shows that depending on the input signal variation (f ), C  
can be increased for stabilization time and  
AIN  
AIN  
decreased to allow the use of a larger serial resistor (R  
. It is valid for all f  
frequencies 4MHz.  
AIN)  
ADC  
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ST72260Gx, ST72262Gx, ST72264Gx  
ADC CHARACTERISTICS (Cont’d)  
13.12.0.1 General PCB Design Guidelines  
Analog signals paths should run over the analog  
ground plane and be as short as possible. Isolate  
analog signals from digital signals that may  
switch while the analog inputs are being sampled  
by the A/D converter. Do not toggle digital out-  
puts on the same I/O port as the A/D input being  
converted.  
To obtain best results, some general design and  
layout rules should be followed when designing  
the application PCB to shield the noise-sensitive,  
analog physical interface from noise generating  
CMOS logic signals.  
– Properly place components and route the signal  
traces on the PCB to shield the analog inputs.  
ADC Accuracy with f  
=8 MHz, f  
=4 MHz R < 10kΩ, V = 4.5V to 5.5V  
CPU  
ADC AIN DD  
FLASH  
ROM  
Symbol  
|E |  
Parameter  
Conditions  
Unit  
2)  
2)  
Typ  
4
Max  
Typ  
Max  
TBD  
TBD  
TBD  
TBD  
TBD  
1)  
Total unadjusted error  
6
TBD  
TBD  
TBD  
TBD  
TBD  
T
1)  
|E |  
Offset error  
1
5
O
1)  
|E |  
Gain Error  
1
4.5  
4.5  
4.5  
LSB  
G
1)  
|E |  
Differential linearity error  
1.5  
3
D
1)  
|E |  
Integral linearity error  
L
Figure 100. ADC Accuracy Characteristics  
Digital Result ADCDR  
E
G
(1) Example of an actual transfer curve  
(2) The ideal transfer curve  
(3) End point correlation line  
1023  
V
V  
1022  
1021  
DD  
SS  
1LSB  
= -------------------------------  
IDEAL  
1024  
(2)  
E =Total Unadjusted Error: maximum deviation  
T
E
between the actual and the ideal transfer curves.  
T
(3)  
7
6
5
4
3
2
1
E =Offset Error: deviation between the first actual  
O
transition and the first ideal one.  
(1)  
E =Gain Error: deviation between the last ideal  
G
transition and the last actual one.  
E
E
O
L
E =Differential Linearity Error: maximum deviation  
D
between actual steps and the ideal one.  
E =Integral Linearity Error: maximum deviation  
L
E
between any actual transition and the end point  
correlation line.  
D
1 LSB  
IDEAL  
V
(LSB  
)
in  
IDEAL  
0
1
2
3
4
5
6
7
1021 1022 1023 1024  
V
V
DD  
SS  
Notes:  
1. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the analog input pins significantly  
reduces the accuracy of the conversion being performed on another analog input.  
For I =0.8mA, the typical leakage induced inside the die is 1.6µA and the effect on the ADC accuracy is a loss of 4 LSB  
INJ-  
for each 10Kincrease of the external analog source impedance. It is recommended to add a Schottky diode (pin to  
ground) to analog pins which may potentially inject negative current. Any positive injection current within the limits spec-  
ified for I  
and ΣI  
in Section 13.8 does not affect the ADC accuracy.  
INJ(PIN)  
INJ(PIN)  
2. Refer to “Typical values” on page 126 for more information on typical ADC accuracy values.  
158/172  
ST72260Gx, ST72262Gx, ST72264Gx  
14 PACKAGE CHARACTERISTICS  
14.1 PACKAGE MECHANICAL DATA  
Figure 101. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width  
mm  
inches  
Dim.  
Min Typ Max Min Typ Max  
E
eC  
A
3.56 3.76 5.08 0.140 0.148 0.200  
A1 0.51  
A2 3.05 3.56 4.57 0.120 0.140 0.180  
0.36 0.46 0.58 0.014 0.018 0.023  
b1 0.76 1.02 1.40 0.030 0.040 0.055  
0.020  
A2  
A
L
b
A1  
E1  
C
eA  
eB  
C
D
E
0.20 0.25 0.36 0.008 0.010 0.014  
27.43 28.45 1.080 1.100 1.120  
9.91 10.41 11.05 0.390 0.410 0.435  
b
b2  
e
D
E1 7.62 8.89 9.40 0.300 0.350 0.370  
e
1.78  
0.070  
0.400  
eA  
eB  
eC  
L
10.16  
12.70  
1.40  
0.500  
0.055  
2.54 3.05 3.81 0.100 0.120 0.150  
Number of Pins  
N
32  
Figure 102.  
Figure 103. 28-Pin Plastic Small Outline Package, 300-mil Width  
mm  
inches  
Dim.  
A
Min Typ Max Min Typ Max  
D
h x 45×  
2.35  
2.65 0.093  
0.30 0.004  
0.51 0.013  
0.32 0.009  
18.10 0.697  
7.60 0.291  
0.104  
0.012  
0.020  
0.013  
0.713  
0.299  
L
A
A1 0.10  
C
A1  
B
C
D
E
e
0.33  
0.23  
a
e
B
17.70  
7.40  
1.27  
0.050  
H
h
α
L
10.00  
0.25  
0°  
10.65 0.394  
0.75 0.010  
0.419  
0.030  
8°  
E
H
8°  
0°  
0.40  
1.27 0.016  
0.050  
Number of Pins  
N
28  
159/172  
ST72260Gx, ST72262Gx, ST72264Gx  
Figure 104. Low Profile Fine Pitch Ball Grid Array Package  
SEATING  
PLANE  
C
mm  
inches  
Dim  
A
Min Typ Max Min Typ Max  
1.210  
1.700 0.048  
0.011  
0.067  
A1 0.270  
A2  
1.120  
0.044  
D
b
D
0.450 0.500 0.550 0.018 0.020 0.022  
5.750 6.000 6.150 0.226 0.236 0.242  
D1  
e
f
D1  
E
4.000  
5.750 6.000 6.150 0.226 0.236 0.242  
4.000 0.157  
0.157  
E1  
e
0.720 0.800 0.880 0.028 0.031 0.035  
0.850 1.000 1.150 0.033 0.039 0.045  
f
ddd  
0.120  
0.005  
A1 CORNER INDEX AREA  
(SEE NOTE 3)  
b (36 BALLS)  
BOTTOM VIEW  
14.2 THERMAL CHARACTERISTICS  
Symbol  
Ratings  
Package thermal resistance (junction to ambient)  
SDIP32  
Value  
Unit  
60  
75  
56  
72  
R
SO28  
LFBGA 6x6 (on multilayer PCB)  
LFBGA 6x6 (on single-layer PCB)  
°C/W  
thJA  
1)  
P
Power dissipation  
Maximum junction temperature  
500  
150  
mW  
°C  
D
2)  
T
Jmax  
Notes:  
1. The power dissipation is obtained from the formula P =P +P  
where P  
is the chip internal power (I xV  
)
D
INT  
PORT  
INT  
DD DD  
and P  
is the port power dissipation determined by the user.  
PORT  
2. The average chip-junction temperature can be obtained from the formula T = T + P x RthJA.  
J
A
D
160/172  
ST72260Gx, ST72262Gx, ST72264Gx  
14.3 LEAD-FREE PACKAGE INFORMATION  
STMicroelectronics is fully committed to Environ-  
ment protection and sustainable development and  
started in 1997 a volontary program for removing  
polluting and hazardous substances from all de-  
vices. In 2000, a strategic program, named ECO-  
PACK®, has been officially launched to develop  
and implement solutions leading to environment  
friendly packaging and ban progressively Pb and  
other heavy metals from our manufacturing lines.  
Please refer to application notes AN2033,  
AN2034, AN2035 and AN2036 for further informa-  
tion.  
161/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
15 DEVICE CONFIGURATION AND ORDERING INFORMATION  
Each device is available for production in user pro-  
grammable versions (FLASH) as well as in factory  
coded versions (ROM/FASTROM).  
OPT 5:4 = VD[1:0] Voltage detection selection  
These option bits enable the voltage detection  
block (LVD and AVD) with a selected threshold of  
the LVD and AVD.  
ST7226x devices are ROM versions. ST72P26x  
devices are Factory Advanced Service Technique  
ROM (FASTROM) versions: they are factory-pro-  
grammed XFlash devices.  
Configuration  
VD1 VD0  
1
1
0
0
1
0
1
0
LVD Off  
Lowest Voltage Threshold (3.05V)  
Medium Voltage Threshold (3.6V)  
Highest Voltage Threshold (4.1V)  
ST72F26x XFlash devices are shipped to custom-  
ers with a default program memory content (FFh).  
The option bytes are programmed to enable the in-  
ternal RC oscillator. The ROM/FASTROM factory  
coded parts contain the code supplied by the cus-  
tomer. This implies that FLASH devices have to be  
configured by the customer using the Option Bytes  
while the ROM/FASTROM devices are factory-  
configured.  
OPT 3:2 = SEC[1:0] Sector 0 size definition  
These option bits indicate the size of sector 0 ac-  
cording to the following table.  
Sector 0 Size  
SEC1  
SEC0  
0.5k  
1k  
2
0
0
1
1
0
1
0
1
15.1 OPTION BYTES  
The two option bytes allow the hardware configu-  
ration of the microcontroller to be selected.  
The option bytes have no address in the memory  
map and can be accessed only in programming  
mode (for example using a standard ST7 program-  
ming tool). The default content of the FLASH is  
fixed to FFh.  
1)  
4k  
Note 1: 4k available on FASTROM devices only.  
In masked ROM devices, the option bytes are  
fixed in hardware by the ROM code (see option  
list).  
OPT 1 = FMP_R Read-out protection  
Read-out protection, when selected, provides a  
protection against Program Memory content ex-  
traction and against write access to Flash memo-  
ry.  
USER OPTION BYTE 0  
OPT 7 = WDG HALT Watchdog reset on HALT  
This option bit determines if a RESET is generated  
when entering HALT mode while the Watchdog is  
active.  
0: No Reset generation when entering Halt mode  
1: Reset generation when entering Halt mode  
Erasing the option bytes when the FMP_R option  
is selected will cause the whole memory to be  
erased first, and the device can be reprogrammed.  
Refer to Section 4.5 and the ST7 Flash Program-  
ming Reference Manual for more details.  
0: Read-out protection off  
1: Read-out protection on  
OPT 6 = WDG SW Hardware or software watch-  
dog  
This option bit selects the watchdog type.  
0: Hardware (watchdog always enabled)  
1: Software (watchdog to be enabled by software)  
USER OPTION BYTE 0  
USER OPTION BYTE 1  
7
0
7
0
OSC OSC OSC OSC OSC  
EXTIT Res. TYPE TYPE RNGE RNGE RNGE  
PLL  
WDG WDG  
HALT SW  
SEC SEC FMP FMP  
VD1 VD0  
1
0
R
W
OFF  
1
0
2
1
0
Default  
Value  
1
1
1
1
1
1
0
0
1
1
1
0
1
1
1
1
162/172  
1
 
ST72260Gx, ST72262Gx, ST72264Gx  
DEVICE CONFIGURATION (Cont’d)  
OPT 0 = FMP_W FLASH write protection  
This option indicates if the FLASH program mem-  
ory is write protected.  
OPT 3:1 = OSCRNGE[2:0] Oscillator Range se-  
lection  
These option bits select the oscillator range.  
Warning: When this option is selected, the pro-  
gram memory (and the option bit itself) can never  
be erased or programmed again.  
0: Write protection off  
OSC  
RNGE2  
OSC  
RNGE1  
OSC  
RNGE0  
Typ. Freq. Range  
1: Write protection on  
VLP 32~100kHz  
1
0
0
0
0
x
0
0
1
1
x
0
1
0
1
USER OPTION BYTE 1  
LP  
1~2MHz  
2~4MHz  
4~8MHz  
8~16MHz  
OPT 7 = EXTIT Port C External Interrupt Configu-  
ration.  
This option bit allows the Port C external interrupt  
mapping to be configured as ei0 or ei1.  
MP  
MS  
HS  
Table 27. External Interrupt Configuration  
EXTIT  
OPT 0 = PLL PLL selection  
ei0  
ei1  
option  
bit  
This option bit selects the PLL which allows multi-  
plication by two of the oscillator frequency. The  
PLL must not be used with the internal RC oscilla-  
PB[7:0] Ports  
PC[5:0] Ports  
PA[7:0] Ports  
1
0
tor. It is guaranteed only with a f  
cy between 2 and 4MHz.  
0: PLL x2 enabled  
input frequen-  
OSC  
PA[7:0] Ports  
PC[5:0] Ports  
PB[7:0] Ports  
1: PLL x2 disabled  
CAUTION: the PLL can be enabled only if the  
“OSC RANGE” (OPT3:1) bits are configured to  
“MP - 2~4MHz”. Otherwise, the device functionali-  
ty is not guaranteed.  
OPT 6 = Reserved, must be kept at default value.  
OPT 5:4 = OSCTYPE[1:0] Oscillator Type selec-  
tion  
These option bits select the Oscillator Type.  
Clock Source  
Resonator Oscillator  
Reserved  
OSCTYPE1 OSCTYPE0  
0
0
1
1
0
1
0
1
Internal RC Oscillator  
External Source  
163/172  
1
ST72260Gx, ST72262Gx, ST72264Gx  
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE  
Customer code is made up of the ROM/FAS-  
TROM contents and the list of the selected options  
(if any). The ROM/FASTROM contents are to be  
sent on diskette, or by electronic means, with the  
S19 hexadecimal file generated by the develop-  
ment tool. All unused bytes must be set to FFh.  
The selected options are communicated to  
STMicroelectronics using the correctly completed  
OPTION LIST appended.  
Refer to application note AN1635 for information  
on the counter listing returned by ST after code  
has been transferred.  
The STMicroelectronics Sales Organization will be  
pleased to provide detailed information on con-  
tractual points.  
Table 28. Supported Part Numbers  
Program Memory  
(Bytes)  
RAM  
(Bytes)  
Part Number  
Temp. Range  
Package  
ST72F264G1B6  
SDIP32  
SO28  
ST72F264G1M6  
4K FLASH  
8K FLASH  
256  
ST72F262G1B6  
SDIP32  
SO28  
-40°C +85°C  
ST72F262G1M6  
ST72F264G2B6  
SDIP32  
SO28  
ST72F264G2M6  
ST72F264G2H1  
0°C +70°C  
LFBGA  
lead-free LFBGA  
SDIP32  
SO28  
256  
ST72F264G2H6E  
ST72F262G2B6  
-40°C +85°C  
ST72F262G2M6  
ST72F262G1B6  
SDIP32  
SO28  
-40°C +85°C  
ST72F262G1M6  
4K FLASH  
256  
256  
ST72F260G1B6  
SDIP32  
SO28  
ST72F260G1M6  
ST72P264G2B6/xxx  
ST72P264G2M6/xxx  
ST72P264G2H1/xxx  
ST72P262G2B6/xxx  
ST72P262G2M6/xxx  
ST72P262G1B6/xxx  
ST72P262G1M6/xxx  
ST72P260G1B6/xxx  
ST72P260G1M6/xxx  
ST72264G2B6/xxx  
ST72264G2M6/xxx  
ST72262G2B6/xxx  
ST72262G2M6/xxx  
ST72262G1B6/xxx  
ST72262G1M6/xxx  
ST72260G1B6/xxx  
ST72260G1M6/xxx  
SDIP32  
SO28  
-40°C +85°C  
0°C +70°C  
8K FASTROM  
LFBGA  
SDIP32  
SO28  
SDIP32  
SO28  
-40°C +85°C  
4K FASTROM  
8K ROM  
256  
256  
256  
SDIP32  
SO28  
SDIP32  
SO28  
SDIP32  
SO28  
-40°C +85°C  
SDIP32  
SO28  
4K ROM  
SDIP32  
SO28  
164/172  
1
ST72260Gx, ST72262Gx, ST72264Gx  
TRANSFER OF CUSTOMER CODE (Cont’d)  
ST72264 ROM/FASTROM MICROCONTROLLER OPTION LIST  
(Last update: 15 January 2004)  
Customer  
Address  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Contact  
Phone No  
Reference /ROM or FASTROM Code*  
ROM or FASTROM code is assigned by STMicroelectronics.  
Code must be sent in .S19 format. .Hex extension cannot be processed.  
Device Type/Memory Size/Package (check only one option):  
----------------------------  
-------------------------------------------- ----------------------------------------------------------------  
|
|
|
8K  
4K  
ROM DEVICE:  
|
-------------------------------------------- ----------------------------------------------------------------  
----------------------------  
SO28:  
SDIP32:  
| [ ]ST72264G2  
| [ ]ST72264G2  
[ ]ST72262G2 | [ ]ST72264G1 [ ]ST72262G1 [ ]ST72260G1  
[ ]ST72262G2 | [ ]ST72264G1 [ ]ST72262G1 [ ]ST72260G1  
---------------------------  
-------------------------------------------- ----------------------------------------------------------------  
|
|
|
8K  
4K  
FASTROM DEVICE:  
|
-------------------------------------------- ----------------------------------------------------------------  
----------------------------  
SO28:  
SDIP32:  
BGA6x6:  
| [ ]ST72P264G2 [ ]ST72P262G2 | [ ]ST72P264G1 [ ]ST72P262G1 [ ]ST72P260G1  
| [ ]ST72P264G2 [ ]ST72P262G2 | [ ]ST72P264G1 [ ]ST72P262G1 [ ]ST72P260G1  
| [ ]ST72P264G2  
|
---------------------------- ------------------------------------------- ----------------------------------------------------------------  
|
|
|
DIE FORM:  
[ ] 8K  
[ ] 4K  
|
---------------------------- -------------------------------------------- ----------------------------------------------------------------  
Conditioning (check only one option, do not specify for DIP package):  
SO package:  
Die form:  
[ ] Tape & Reel  
[ ] Tape & Reel  
[ ] Tube  
[ ] Inked wafer  
[ ] Sawn wafer on sticky foil  
Special Marking  
[ ] No  
[ ] Yes  
Authorized characters are letters, digits ‘.’, ‘-’, ‘/’ and spaces only.  
Maximum character count: SO28 (13 char. max): _ _ _ _ _ _ _ _ _ _ _ _ _  
SDIP32 (15 char. max): _ _ _ _ _ _ _ _ _ _ _ _ _ _ _  
BGA6x6 (7 char. max): _ _ _ _ _ _ _  
Temperature Range:  
Packaged form:  
[ ] 0°C to + 70°C  
[ ] - 10°C to + 85°C (except BGA)  
[ ] - 40°C to + 85°C (except BGA)  
[ ] Tested at 25°C only  
Die form:  
[ ] Reset  
Watchdog Reset on Halt:  
Watchdog Selection:  
VD Reset  
[ ] No Reset  
[ ] Hardware Activation  
[ ] Enabled:  
[ ] Software Activation  
[ ] Disabled  
[ ] Highest threshold  
[ ] Medium threshold  
[ ] Lowest threshold  
Sector 0 Size:  
[ ] 0.5K  
[ ] 1K  
[ ] Enabled  
[ ] 2K  
[ ] 4K (FASTROM only)  
Readout Protection:  
Flash Write Protection:  
External Interrupt:  
[ ] Disabled  
[ ] Disabled  
[ ] Enabled (FASTROM only)  
[ ] Port A&C on ei0 interrupt vector, Port B on ei1 (PA&C_PB)  
[ ] Port A on ei0 interrupt vector, Port B&C on ei1 (PA_PB&C)  
Clock Source Selection:  
[ ] Resonator:  
[ ] VLP: Very Low power resonator (32 to 100 kHz)  
[ ] LP: Low power resonator (1 to 2 MHz)  
[ ] MP: Medium power resonator (2 to 4 MHz)  
[ ] MS: Medium speed resonator (4 to 8 MHz)  
[ ] HS: High speed resonator (8 to 16 MHz)  
1)  
[ ] Internal RC Oscillator  
[ ] External Clock  
[ ] Disabled  
1
PLL :  
[ ] Enabled  
Supply Operating Range in the application: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Notes:  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Signature:  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Note 1: Use of the PLL with the internal RC oscillator is not supported.  
Important note: Not all configurations are available. See Table 28 on page 164 for the list of supported part numbers.  
Please download the latest version of this option list from:  
http://www.st.com/mcu > downloads > ST7 microcontrollers > Option list  
165/172  
ST72260Gx, ST72262Gx, ST72264Gx  
15.3 DEVELOPMENT TOOLS  
STMicroelectronics offers a range of hardware  
and software development tools for the ST7 micro-  
controller family. Full details of tools available for  
the ST7 from third party manufacturers can be ob-  
tained from the STMicroelectronics Internet site:  
http//www.st.com.  
Includes STX-InDART/USB board (USB port)  
and one specific evaluation board for ST72264  
(package SDIP32)  
ST7F264-INDART:  
Low-cost  
In-Circuit  
Debugging kit from Softec Microsystems  
Includes STX-InDART/USB board (parallel port)  
and one specific evaluation board for ST72264  
(package SDIP32)  
Tools from these manufacturers include C compli-  
ers, evaluation tools, emulators and programmers.  
STxF-INDART/USB  
Emulators  
Flash Programming tools  
Two types of emulators are available from ST for  
the ST72260/262/264 family:  
ST7 DVP3 entry-level emulator offers a flexible  
and modular debugging and programming  
solution.  
ST7 EMU3 high-end emulator is delivered with  
everything (probes, TEB, adapters etc.) needed  
to start emulating the ST72260/262/264. To  
configure it to emulate other ST7 subfamily  
devices, the active probe for the ST7EMU3 can  
be changed and the ST7EMU3 probe is  
designed for easy interchange of TEBs (Target  
Emulation Board). See Table 29.  
ST7-STICK ST7 In-circuit Communication Kit, a  
complete software/hardware package for  
programming ST7 Flash devices. It connects to  
a host PC parallel port and to the target board or  
socket board via ST7 ICC connector.  
ICC Socket Boards provide an easy to use and  
flexible means of programming ST7 Flash  
devices. They can be connected to any tool that  
supports the ST7 ICC interface, such as ST7  
EMU3, ST7-DVP3, inDART, ST7-STICK, or  
many third-party development tools.  
Evaluation boards  
In-circuit Debugging Kit  
One evaluation tool is available from ST:  
Three configurations are available from ST:  
ST7FOPTIONS-EVAL: ST7 Clock Security  
System evaluation board  
ST7F264-IND/USB:  
Low-cost  
In-Circuit  
Debugging kit from Softec Microsystems.  
Table 29. STMicroelectronics Development Tools  
Emulation  
Programming  
Supported  
Products  
ST7 DVP3 Series  
ST7 EMU3 series  
ICC Socket Board  
Active Probe &  
Emulator  
Connection kit  
Emulator  
T.E.B.  
ST7MDT10-  
DVP3  
ST7MDT10-  
EMU3  
2)  
ST7MDT10-32/DVP  
ST7MDT10-TEB  
ST7SB10-26x  
ST7226xGx  
1)  
1)  
Notes:  
1. BGA adapter not available for ST7MDT10-DVP3 and ST7MDT10-EMU3 .  
2. Add suffix /EU, /UK, /US for the power supply of your region.  
15.3.1 Related Documentation  
AN 988: Getting started with ST7 Assembly Tool  
chain  
AN 978: Key features of the STVD7 ST7 Visual  
Debug Package  
AN 989: Getting started with ST7 Hiware C Tool-  
chain  
AN 983: Key Features of the Cosmic ST7 C-Com-  
piler Package  
AN1604: How to use ST7MDT1-TRAIN with  
ST72F264  
166/172  
1
 
ST72260Gx, ST72262Gx, ST72264Gx  
15.3.2 PACKAGE/SOCKET FOOTPRINT PROPOSAL  
Table 30. Suggested List of SDIP32 Socket Types  
Same  
Package / Probe  
Adaptor / Socket Reference  
Socket Type  
Footprint  
SDIP32  
EMU PROBE  
TEXTOOL  
232-1291-00  
X
Textool  
Table 31. Suggested List of SO28 Socket Types  
Same  
Footprint  
Package / Probe  
Adaptor / Socket Reference  
Socket Type  
SO28  
YAMAICHI  
IC51-0282-334-1  
Clamshell  
EMU PROBE  
Adapter from SO28 to SDIP32 footprint (delivered with emulator)  
X
SMD to SDIP  
Table 32. Suggested LFBGA Socket Type  
Package  
Socket Reference  
LFBGA 6 X6  
ENPLAS OTB-36(144)-0.8-04  
167/172  
1
ST72260Gx, ST72262Gx, ST72264Gx  
16 KNOWN LIMITATIONS  
16.1 ALL FLASH AND ROM DEVICES  
16.1.1 16-bit timer PWM Mode  
– The interrupt request is cleared (flag reset or in-  
terrupt mask) in any part of the code while this in-  
terrupt is disabled  
In PWM mode, the first PWM pulse is missed after  
writing the value FFFCh in the OC12R register.In  
PWM mode, the first PWM pulse is missed after  
writing the value FFFCh in the OC1R register  
(OC1HR, OC1LR). It leads to either full or no PWM  
during a period, depending on the OLVL1 and  
OLVL2 settings.  
If these conditions are not met, the symptom can  
be avoided by implementing the following se-  
quence:  
PUSH CC  
SIM  
reset flag or interrupt mask  
POP CC  
16.1.2 Clearing active interrupts outside  
interrupt routine  
16.1.3 I2C Multimaster  
When an active interrupt request occurs at the  
same time as the related flag or interrupt mask is  
being cleared, the CC register may be corrupted.  
In multimaster configurations, if the ST7 I2C re-  
ceives a START condition from another I2C mas-  
ter after the START bit is set in the I2CCR register  
and before the START condition is generated by  
the ST7 I2C, it may ignore the START condition  
from the other I2C master. In this case, the ST7  
master will receive a NACK from the other device.  
On reception of the NACK, ST7 can send a re-start  
and Slave address to re-initiate communication  
Concurrent interrupt context  
The symptom does not occur when the interrupts  
are handled normally, i.e. when:  
– The interrupt request is cleared (flag reset or in-  
terrupt mask) within its own interrupt routine  
– The interrupt request is cleared (flag reset or in-  
terrupt mask) within any interrupt routine  
16.1.4 Functional EMS  
The functional EMS (Electro Magnetic Susceptibil-  
ity) severity level/behaviour class is 2B as defined  
in application note AN1709.  
– The interrupt request is cleared (flag reset or in-  
terrupt mask) in any part of the code while this in-  
terrupt is disabled  
Special care should be taken when designing the  
PCB layout and firmware (refer to application  
notes AN898, AN901 and AN1015) in sensitive  
applications (that use switches for instance). For  
more information refer to application note AN1637.  
If these conditions are not met, the symptom can  
be avoided by implementing the following se-  
quence:  
Perform SIM and RIM operation before and after  
resetting an active interrupt request  
Ex:  
16.2 FLASH DEVICES ONLY  
SIM  
16.2.1 Execution of BTJX instruction  
reset flag or interrupt mask  
RIM  
When testing the address $FF with the "BTJT" or  
"BTJF" instructions, the CPU may perform an in-  
correct operation when the relative jump is nega-  
tive and performs an address page change.  
Nested interrupt context  
The symptom does not occur when the interrupts  
are handled normally, i.e. when:  
To avoid this issue, including when using a C com-  
piler, it is recommended to never use address  
$00FF as a variable (using the linker parameter for  
example).  
– The interrupt request is cleared (flag reset or in-  
terrupt mask) within its own interrupt routine  
– The interrupt request is cleared (flag reset or in-  
terrupt mask) within any interrupt routine with  
higher or identical priority level  
168/172  
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ST72260Gx, ST72262Gx, ST72264Gx  
16.2.2 I/O Port B and C configuration  
Workaround  
When using an external quartz crystal or ceramic  
Switch off the ADC by software (ADON=0) before  
executing a HALT instruction.  
resonator, the f  
clock may be disturbed be-  
OSC2  
cause the device goes into reserved mode control-  
led by Port B and C.  
16.2.8 Active Halt wake-up by external interrupt  
External interrupts are not able to wake-up the  
MCU from Active Halt mode. The MCU can only  
exit from Active Halt mode by means of an MCC/  
RTC interrupt or a reset.  
This happens with either one of the following con-  
figurations:  
PB1=0, PC2=1, PB3=0 while PLL option is both  
disabled and PC4 is toggling  
Workaround  
PB1=0, PC2=1, PB3=0, PC4=1 while PLL option  
is enabled  
Use WAIT mode if external interrupt capability is  
required in low power mode.  
This is detailed in the following table:  
16.2.9 SCI Wrong Break duration  
Description  
PLL PB1 PC2 PB3 PC4 Clock Disturbance  
Tog Max. 2 clock cycles  
glin lost at each rising or  
A single break character is sent by setting and re-  
setting the SBK bit in the SCICR2 register. In  
some cases, the break character may have a long-  
er duration than expected:  
OFF  
ON  
0
0
1
1
0
0
g
falling edge of PC4  
Max. 1 clock cycle  
lost out of every 16  
1
- 20 bits instead of 10 bits if M=0  
- 22 bits instead of 11 bits if M=1.  
In the same way, as long as the SBK bit is set,  
break characters are sent to the TDO pin. This  
may lead to generate one break more than expect-  
ed.  
As a consequence, for cycle-accurate operations,  
these configurations are prohibited in either input  
or output mode.  
Workaround:  
Occurrence  
To avoid this occurring, it is recommended to con-  
nect one of these pins to GND (PC2 or PC4) or  
The occurrence of the problem is random and pro-  
portional to the baudrate. With a transmit frequen-  
cy of 19200 baud (fCPU=8MHz and SCI-  
BRR=0xC9), the wrong break duration occurrence  
is around 1%.  
V
(PB1 or PB3).  
DD  
16.2.3 16-bit Timer PWM mode  
After a write instruction to the OCiHR register, the  
output compare function is inhibited until the  
OCiLR register is also written.  
Workaround  
If this wrong duration is not compliant with the  
communication protocol in the application, soft-  
ware can request that an Idle line be generated  
before the break character. In this case, the break  
duration is always correct assuming the applica-  
tion is not doing anything between the idle and the  
break. This can be ensured by temporarily disa-  
bling interrupts.  
16.2.4 SPI Multimaster Mode  
Multi master mode is not supported.  
16.2.5 Internal RC oscillator with LVD  
If the LVD is disabled, the internal RC oscillator  
clock source cannot be used.  
In ICP mode, new flash devices must be pro-  
grammed with an external clock connected to the  
OSC1 pin or using a crystal or ceramic resonator.  
In the STVP7 programming tool software, select  
the “OPTIONS DISABLED” mode.  
The exact sequence is:  
– Disable interrupts  
– Reset and Set TE (IDLE request)  
– Set and Reset SBK (Break Request)  
– Re-enable interrupts  
16.2.6 External clock with PLL  
The PLL option is not supported for use with exter-  
nal clock source.  
16.2.10 A/D converter accuracy for first  
conversion  
16.2.7 Halt mode power consumption with ADC  
on  
When the ADC is enabled after being powered  
down (for example when waking up from HALT,  
ACTIVE-HALT or setting the ADON bit in the AD-  
CCSR register), the first conversion (8-bit or 10-  
If the A/D converter is being used when Halt mode  
is entered, the power consumption in Halt Mode  
may exceed the maximum specified in the datash-  
eet.  
169/172  
 
ST72260Gx, ST72262Gx, ST72264Gx  
bit) accuracy does not meet the accuracy specified  
in the data sheet.  
Injecting a negative current on digital input pins  
degrades ADC accuracy especially if performed  
on a pin close to ADC channel in use.  
Workaround  
16.2.12 ADC conversion spurious results  
In order to have the accuracy specified in the da-  
tasheet, the first conversion after a ADC switch-on  
has to be ignored.  
Spurious conversions occur with a rate lower than  
50 per million. Such conversions happen when the  
measured voltage is just between 2 consecutive  
digital values.  
16.2.11 Negative injection impact on ADC  
accuracy  
Workaround  
Injecting a negative current on an analog input  
pins significantly reduces the accuracy of the AD  
Converter. Whenever necessary, the negative in-  
jection should be prevented by the addition of a  
Schottky diode between the concerned I/Os and  
ground.  
A software filter should be implemented to remove  
erratic conversion results whenever they may  
cause unwanted consequences.  
170/172  
ST72260Gx, ST72262Gx, ST72264Gx  
17 REVISION HISTORY  
Table 33. Revision History  
Date  
Rev.  
Main changes  
Added “SMBus V1.1 Compliant” for I²C on page 1  
Added one note in Section 6.4.1 on page 24  
Added SMBus compatibility information in Section 11.6 on page 103 and at the end of  
Section 11.6.4.1 on page 105  
Changed note 1 in Section 13.2 on page 127  
Added note 3 in Section 13.3.2 on page 129  
Changed I value and note 3 in Section 13.8.1 on page 144  
Added note in Figure 76 on page 144  
S
February-2005 2.0  
Changed Figure 91 on page 151 and notes and added note 4 to Figure 92 on page 151  
Added “LEAD-FREE PACKAGE INFORMATION” on page 161  
Added ST72F264G2H6E in Table 28, “Supported Part Numbers,” on page 164  
Changed Section 15.3 on page 166  
Changed “ST72264 ROM/FASTROM MICROCONTROLLER OPTION LIST (Last update: 15  
January 2004)” on page 165  
Added -40°C to +85°C operating range in “Device Summary” on first page for LFBGA package  
(lead-free LFBGA package)  
Added illegal opcode reset on page 1, and in Section 12.2.1 on page 123  
Changed notes under Figure 91 on page 151  
Changed Vt  
129  
max. for ROM and note 3. Removed V  
min and maxin Section 13.3.2 on page  
POR  
HYS  
Changed Reset V /V in Section 13.9 on page 150  
IL IH  
Added ROM current consumption in Section 13.4.1 on page 131  
Added Active HALT min.in Section 13.4.2 on page 133  
Removed note under table in Section 13.7.2 on page 142  
Changed note on PB0/PB1 to apply to Flash only in Section 13.2 on page 127 and Section 13.8  
on page 144  
01-Jun-05  
3
Added V range for ADC operation, f  
min , conversion time and accuracy for ROM devices  
DD  
ADC  
in Section 13.12 on page 157.  
Added 16-bit timer PWM Section 16.2.3 on page 169  
Added SCI wrong break duration Section 16.2.9 on page 169  
Moved errata sheet to Section 16 on page 168 and updated section for ROM and Flash devices  
171/172  
ST72260Gx, ST72262Gx, ST72264Gx  
Notes:  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics.  
All other names are the property of their respective owners  
© 2005 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
Australia – Belgium - Brazil - Canada - China – Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
www.st.com  
172/172  

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