ST72F262G2B5 [STMICROELECTRONICS]
8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES; 8位MCU的Flash或ROM存储器, ADC ,两个16位定时器, I2C , SPI , SCI INTERFACES型号: | ST72F262G2B5 |
厂家: | ST |
描述: | 8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES |
文件: | 总172页 (文件大小:1466K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ST72260Gx, ST72262Gx,
ST72264Gx
8-BIT MCU WITH FLASH OR ROM MEMORY,
ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES
■ Memories
– 4 K or 8 Kbytes Program memory: ROM or
Single voltage extended Flash (XFlash) with
read-out protection write protection and In-
Circuit Programming and In-Application Pro-
gramming (ICP and IAP). 10K write/erase cy-
cles guaranteed, data retention: 20 years at
55°C.
– 256 bytes RAM
■ Clock, Reset and Supply Management
SDIP32
– Enhanced reset system
– Enhanced low voltage supply supervisor
(LVD) with 3 programmable levels and auxil-
iary voltage detector (AVD) with interrupt ca-
pability for implementing safe power-down
procedures
SO28
LFBGA 6x6mm
– Clock sources: crystal/ceramic resonator os-
cillators, internal RC oscillator and bypass for
external clock
– PLL for 2x frequency multiplication
– Clock-out capability
– Two 16-bit timers with: 2 input captures, 2 out-
put compares, external clock input on one tim-
er, PWM and Pulse generator modes
■ 3 Communication Interfaces
– SPI synchronous serial interface
– 4 Power Saving Modes: Halt, Active Halt,Wait
2
– I C multimaster interface (SMBus V1.1 Com-
and Slow
pliant)
■ Interrupt Management
– SCI asynchronous serial interface
■ 1 Analog peripheral
– 10-bit ADC with 6 input channels
■ Instruction Set
– Nested interrupt controller
– 10 interrupt vectors plus TRAP and RESET
– 22 external interrupt lines (on 2 vectors)
■ 22 I/O Ports
– 8-bit data manipulation
– 22 multifunctional bidirectional I/O lines
– 20 alternate function lines
– 8 high sink outputs
– 63 basic instructions with illegal opcode de-
tection
– 17 main addressing modes
– 8 x 8 unsigned multiply instruction
■ Development Tools
■ 4 Timers
– Main Clock Controller with Real time base and
Clock-out capabilities
– Full hardware/software development package
– Configurable watchdog timer
Device Summary
Features
ST72260G1
ST72262G1 ST72262G2 ST72264G1
ST72264G2
Program memory - bytes
RAM (stack) - bytes
4K
4K
8K
4K
8K
256 (128)
Watchdogtimer,RTC,
Watchdog timer, RTC,
Watchdog timer, RTC,
Two 16-bit timers, SPI, SCI, I C, ADC
Peripherals
2
Two16-bit timers, SPI Two 16-bit timers, SPI, ADC
2.7 V to 5.5 V
Up to 8 MHz (with oscillator up to 16 MHz) PLL 4/8 MHz
Operating Supply
CPU Frequency
0° C to +70° C /
-40° C to +85° C
Operating Temperature
Packages
-40° C to +85° C
SO28 / SDIP32
-40° C to +85° C
SO28 / SDIP32
LFBGA
Rev. 3
June 2005
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1
Table of Contents
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.3 PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.5 MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.6 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.7 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.2 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.3 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2 MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.3 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.4 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.5 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.2 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.3 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.4 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.5 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.4 UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.5 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.6 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9.8 I/O PORT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
10 MISCELLANEOUS REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
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Table of Contents
10.1 I/O PORT INTERRUPT SENSITIVITY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10.2 I/O PORT ALTERNATE FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10.3 MISCELLANEOUS REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC) . . . . . . . . . . . . . 53
11.3 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
11.4 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
11.5 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.6 I2C BUS INTERFACE (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
11.7 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
12.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
13.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
13.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 153
13.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
14.3 LEAD-FREE PACKAGE INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 162
15.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 164
15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
16 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
16.1 ALL FLASH AND ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
16.2 FLASH DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
17 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
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3
ST72260Gx, ST72262Gx, ST72264Gx
To obtain the most recent version of this datasheet,
please check at www.st.com>products>technical literature>datasheet
Please note that the list of known limitations can be found at the end of this document on page 168.
4/172
ST72260Gx, ST72262Gx, ST72264Gx
1 INTRODUCTION
The ST72260Gx, ST72262Gx and ST72264Gx
devices are members of the ST7 microcontroller
family. They can be grouped as follows :
Under software control, all devices can be placed
in WAIT, SLOW, Active-HALT or HALT mode, re-
ducing power consumption when the application is
in idle or stand-by state.
– ST72264Gx devices are designed for mid-range
2
applications with ADC, I C and SCI interface ca-
The enhanced instruction set and addressing
modes of the ST7 offer both power and flexibility to
software developers, enabling the design of highly
efficient and compact application code. In addition
to standard 8-bit data management, all ST7 micro-
controllers feature true bit manipulation, 8x8 un-
signed multiplication and indirect addressing
modes.
pabilities.
– ST72262Gx devices target the same range of
2
applications but without I C interface or SCI.
– ST72260Gx devices are for applications that do
2
not need ADC, I C peripherals or SCI.
All devices are based on a common industry-
standard 8-bit core, featuring an enhanced instruc-
tion set.
For easy reference, all parametric data is located
in Section 13 on page 126.
The ST72F260G, ST72F262G, and ST72F264G
versions feature single-voltage FLASH memory
with byte-by-byte In-Circuit Programming (ICP)
capabilities.
Related Documentation
AN1365: Guidelines for migrating ST72C254 ap-
plications to ST72F264
Figure 1. General Block Diagram
Internal
CLOCK
2
I C*
OSC1
MULTI OSC
OSC2
SCI*
PA7:0
(8 bits)
MCC/RTC
LVD
PORT A
ICD
V
DD
POWER
SUPPLY
V
SS
SPI
PB7:0
(8 bits)
RESET
CONTROL
PORT B
16-BIT TIMER A
PORT C
8-BIT CORE
ALU
PROGRAM
MEMORY
(4 or 8K Bytes)
PC5:0
(6 bits)
10-BIT ADC*
16-BIT TIMER B
WATCHDOG
RAM
(256 Bytes)
*Not available on some devices, see device summary on page 1.
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ST72260Gx, ST72262Gx, ST72264Gx
2 PIN DESCRIPTION
Figure 2. 28-Pin SO Package Pinout
RESET
V
V
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DD
OSC1
OSC2
2
SS
ICCSEL
3
SS/PB7
SCK/PB6
PA0 (HS)/ICCCLK
PA1 (HS)/ICCDATA
PA2 (HS)
4
5
MISO/PB5
6
MOSI/PB4
PA3 (HS)
7
ei1
ei0
3
OCMP2_A/PB3
PA4 (HS)/SCLI
8
3
ICAP2_A/PB2
OCMP1_A/PB1
ICAP1_A/PB0
9
PA5(HS)/RDI
3
PA6 (HS)/SDAI
10
11
12
3
PA7 (HS)/TDO
2
AIN5/EXTCLK_A/PC5
PC0/ICAP1_B/AIN0
PC1/OCMP1_B/AIN1
2
2
AIN4 /OCMP2_B/PC4
1
13
14
ei0 or ei1
2
2
AIN3 /ICAP2_B/PC3
PC2/MCO/AIN2
(HS) 20mA high sink capability
eiX associated external interrupt vector
1
Configurable by option byte
2
Alternate function not available on ST72260
Alternate function not available on ST72260 and ST72262
3
Figure 3. 32-Pin SDIP Package Pinout
V
V
RESET
OSC1
1
DD
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
2
SS
OSC2
3
ICCSEL
PA0 (HS)/ICCCLK
PA1 (HS)/ICCDATA
SS/PB7
4
5
SCK/PB6
MISO/PB5
MOSI/PB4
NC
ei1
ei0
6
PA2 (HS)
PA3 (HS)
7
8
NC
NC
NC
OCMP2_A/PB3
ICAP2_A/PB2
OCMP1_A/PB1
9
3
PA4 (HS)/SCLI
10
11
12
13
14
15
16
3
PA5 (HS)/RDI
ei1
ei0
3
PA6 (HSI/SDAI
3
ICAP1_A/PB0
PA7 (HS)/TDO
2
2
PC0/ICAP1_B/AIN0
AIN5 /EXTCLK_A/PC5
2
2
1
PC1/OCMP1_B/AIN1
AIN4 /OCMP2_B/PC4
ei0 or ei1
2
2
PC2/MCO/AIN2
AIN3 /ICAP2_B/PC3
1
2
3
Configurable by option byte
Alternate function not available on ST72260
Alternate function not available on ST72260 and ST72262
(HS) 20mA high sink capability
eiX associated external interrupt vector
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ST72260Gx, ST72262Gx, ST72264Gx
PIN DESCRIPTION (Cont’d)
Figure 4. TFBGA Package Pinout (view through package)
1
2
3
4
5
6
A
B
C
D
E
F
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ST72260Gx, ST72262Gx, ST72264Gx
PIN DESCRIPTION (Cont’d)
For external pin connection guidelines, refer to Section 13 "ELECTRICAL CHARACTERISTICS" on page
126.
Legend / Abbreviations for Table 1:
Type:
I = input, O = output, S = supply
A = Dedicated analog input
Input level:
In/Output level: C = CMOS 0.3 V /0.7 V with input trigger
T
DD
DD
Output level:
HS = 20 mA high sink (on N-buffer only)
Port and control configuration:
1)
– Input:
float = floating, wpu = weak pull-up, int = interrupt , ana = analog
2)
– Output:
OD = open drain , PP = push-pull
Refer to Section 9 "I/O PORTS" on page 38 for more details on the software configuration of the I/O ports.
The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is
in reset state.
Table 1. Device Pin Description
Pin n°
Level
Port / Control
Main
Function
(after
Input
Output
Pin Name
Alternate Function
reset)
Top priority non maskable interrupt (ac-
tive low)
1
2
3
1
2
3
A3 RESET
I/O
I
C
X
X
T
External clock input or Resonator oscilla-
tor inverter input or resistor input for RC
oscillator
3)
3)
C4 OSC1
B3 OSC2
Resonator oscillator inverter output or ca-
pacitor input for RC oscillator
O
4
5
6
7
8
9
4
5
6
7
A2 PB7/SS
A1 PB6/SCK
B1 PB5/MISO
B2 PB4/MOSI
C1 NC
I/O
I/O
I/O
I/O
C
X
X
X
X
ei1
ei1
ei1
ei1
X
X
X
X
X
X
X
X
Port B7 SPI Slave Select (active low)
Port B6 SPI Serial Clock
T
T
T
T
C
C
C
Port B5 SPI Master In/ Slave Out Data
Port B4 SPI Master Out / Slave In Data
C2 NC
Not Connected
D1 NC
10
11
8
9
C3 PB3/OCMP2_A
D2 PB2/ICAP2_A
I/O
I/O
C
C
X
X
ei1
ei1
X
X
X
Port B3 Timer A Output Compare 2
T
T
X
Port B2 Timer A Input Capture 2
Timer A Output Compare 1
Caution: Negative current
12 10 E1 PB1 /OCMP1_A
13 11 F1 PB0 /ICAP1_A
I/O
I/O
C
X
ei1
X
X
Port B1
T
injection not allowed on
4)
this pin .
Timer A Input Capture 1
Caution: Negative current
C
C
X
X
ei1
X
X
X
X
Port B0
T
T
injection not allowed on
4)
this pin .
Timer A Input Clock or ADC
Analog Input 5
14 12 F2 PC5/EXTCLK_A/AIN5 I/O
ei0/ei1 X
Port C5
8/172
ST72260Gx, ST72262Gx, ST72264Gx
Pin n°
Level
Port / Control
Main
Function
(after
Input
Output
Pin Name
Alternate Function
reset)
Timer B Output Compare 2 or
ADC Analog Input 4
15 13 E2 PC4/OCMP2_B/AIN4 I/O
16 14 F3 PC3/ ICAP2_B/AIN3 I/O
C
C
C
C
C
X
X
X
X
X
ei0/ei1
ei0/ei1
ei0/ei1
ei0/ei1
ei0/ei1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Port C4
Port C3
Port C2
Port C1
Port C0
T
T
T
T
Timer B Input Capture 2 or
ADC Analog Input 3
Main clock output (f
) or
CPU
17 15 E3 PC2/MCO/AIN2
I/O
ADC Analog Input 2
Timer B Output Compare 1 or
ADC Analog Input 1
18 16 F4 PC1/OCMP1_B/AIN1 I/O
Timer B Input Capture 1 or
ADC Analog Input 0
19 17 D3 PC0/ICAP1_B/AIN0
I/O
X
X
T
20 18 E4 PA7/TDO
21 19 F5 PA6/SDAI
22 20 F6 PA5 /RDI
23 21 E6 PA4/SCLI
I/O
I/O
I/O
I/O
C
C
C
C
HS
HS
HS
HS
X
X
X
X
ei0
ei0
ei0
ei0
X
T
X
T
Port A7 SCI output
T
2
Port A6 I C DATA
T
T
T
X
Port A5 SCI input
2
Port A4 I C CLOCK
24
25
E5 NC
D6 NC
D5 NC
Not Connected
26 22 C6 PA3
27 23 D4 PA2
C5 NC
I/O
I/O
C
C
HS
HS
X
X
ei0
ei0
X
X
X
X
Port A3
Port A2
T
T
Not Connected
B6 NC
28 24 A6 PA1/ICCDATA
I/O
I/O
C
C
C
HS
HS
X
X
X
ei0
ei0
X
X
X
Port A1 In Circuit Communication Data
T
T
T
In Circuit Communication
Clock
29 25 A5 PA0/ICCCLK
30 26 B5 ICCSEL
X
Port A0
I
ICC mode pin, must be tied low
Ground
31 27 A4 V
32 28 B4 V
S
S
SS
DD
Main power supply
Notes:
1. In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up
column (wpu) is merged with the interrupt column (int), then the I/O configuration is a pull-up interrupt in-
put, otherwise the configuration is a floating interrupt input. Port C is mapped to ei0 or ei1 by option byte.
2. In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to V
are not implemented). See Section 9 "I/O PORTS" on page 38 for more details.
DD
3. OSC1 and OSC2 pins connect a crystal or ceramic resonator, or an external source to the on-chip os-
cillator see Section 2 "PIN DESCRIPTION" on page 6 and Section 6.2 "MULTI-OSCILLATOR (MO)" on
page 21 for more details.
4: For details refer to Section 13.8 on page 144
9/172
ST72260Gx, ST72262Gx, ST72264Gx
3 REGISTER & MEMORY MAP
As shown in Figure 5, the MCU is capable of ad-
dressing 64K bytes of memories and I/O registers.
dressing space so the reset and interrupt vectors
are located in Sector 0 (F000h-FFFFh).
The available memory locations consist of 128
bytes of register location, 256 bytes of RAM and
up to 8 Kbytes of user program memory. The RAM
space includes up to 128 bytes for the stack from
0100h to 017Fh.
The size of Flash Sector 0 and other device op-
tions are configurable by Option byte (refer to Sec-
tion 15.1 on page 162).
IMPORTANT: Memory locations marked as “Re-
served” must never be accessed. Accessing a re-
seved area can have unpredictable effects on the
device.
The highest address bytes contain the user reset
and interrupt vectors.
The Flash memory contains two sectors (see Fig-
ure 5) mapped in the upper part of the ST7 ad-
Related Documentation
AN 985: Executing Code in ST7 RAM
Figure 5. Memory Map
0000h
HW Registers
(see Table 2)
0080h
Short Addressing RAM
007Fh
0080h
Zero page
(128 Bytes)
00FFh
0100h
RAM
(256 Bytes)
Stack or
16-bit Addressing RAM
017Fh
0180h
(128 Bytes)
017Fh
8K FLASH
Reserved
PROGRAM MEMORY
E000h
DFFFh
E000h
4 Kbytes
SECTOR 1
EFFFh
Program Memory
F000h
FFFFh
4 Kbytes
SECTOR 0
(4K, 8 KBytes)
FFDFh
FFE0h
Interrupt & Reset Vectors
(see Table 5 on page 32)
FFFFh
10/172
ST72260Gx, ST72262Gx, ST72264Gx
Table 2. Hardware Register Map
Register
Reset
Status
Address
Block
Register Name
Remarks
Label
1)
2)
0000h
0001h
0002h
PCDR
PCDDR
PCOR
Port C Data Register
Port C Data Direction Register
Port C Option Register
xx000000h R/W
2)
2)
Port C
00h
00h
R/W
R/W
0003h
Reserved (1 Byte)
1)
0004h
0005h
0006h
PBDR
PBDDR
PBOR
Port B Data Register
Port B Data Direction Register
Port B Option Register
00h
R/W
R/W
R/W.
Port B
Port A
00h
00h
0007h
Reserved (1 Byte)
1)
R/W
R/W
0008h
0009h
000Ah
PADR
PADDR
PAOR
Port A Data Register
Port A Data Direction Register
Port A Option Register
00h
00h
00h
R/W
000Bh
to
Reserved (17 Bytes)
001Bh
001Ch
001Dh
001Eh
001Fh
ISPR0
ISPR1
ISPR2
ISPR3
Interrupt software priority register0
Interrupt software priority register1
Interrupt software priority register2
Interrupt software priority register3
FFh
FFh
FFh
FFh
R/W
R/W
R/W
R/W
ITC
SPI
0020h
MISCR1
Miscellanous register 1
00h
R/W
0021h
0022h
0023h
SPIDR
SPICR
SPICSR
SPI Data I/O Register
SPI Control Register
SPI Status Register
xxh
0xh
00h
R/W
R/W
R/W
0024h
0025h
0026h
0027h
WATCHDOG WDGCR
SICSR
Watchdog Control Register
7Fh
R/W
System Integrity Control / Status Register
Main Clock Control / Status Register
Reserved (1 Byte)
000x 000x R/W
MCC
MCCSR
00h
R/W
2
0028h
0029h
002Ah
002Bh
002Ch
002Dh
002Eh
I2CCR
I C Control Register
00h
00h
00h
00h
00h
40h
00h
R/W
2
I2CSR1
I2CSR2
I2CCCR
I2COAR1
I2COAR2
I2CDR
I C Status Register 1
Read Only
Read Only
R/W
R/W
R/W
2
I C Status Register 2
2
2
I C
I C Clock Control Register
2
I C Own Address Register 1
2
I C Own Address Register2
2
I C Data Register
R/W
002Fh
0030h
Reserved (2 Bytes)
11/172
ST72260Gx, ST72262Gx, ST72264Gx
Register
Label
Reset
Status
Address
Block
Register Name
Remarks
R/W
R/W
R/W
Read Only
Read Only
R/W
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
TACR2
TACR1
Timer A Control Register 2
Timer A Control Register 1
Timer A Control/Status Register
Timer A Input Capture 1 High Register
Timer A Input Capture 1 Low Register
Timer A Output Compare 1 High Register
Timer A Output Compare 1 Low Register
Timer A Counter High Register
00h
00h
xxh
xxh
xxh
80h
00h
FFh
FCh
FFh
FCh
xxh
xxh
80h
00h
TASCSR
TAIC1HR
TAIC1LR
TAOC1HR
TAOC1LR
TACHR
R/W
TIMER A
Read Only
Read Only
Read Only
Read Only
Read Only
Read Only
R/W
TACLR
Timer A Counter Low Register
TAACHR
TAACLR
TAIC2HR
TAIC2LR
TAOC2HR
TAOC2LR
Timer A Alternate Counter High Register
Timer A Alternate Counter Low Register
Timer A Input Capture 2 High Register
Timer A Input Capture 2 Low Register
Timer A Output Compare 2 High Register
Timer A Output Compare 2 Low Register
R/W
0040h
MISCR2
Miscellanous register 2
00h
R/W
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
TBCR2
TBCR1
Timer B Control Register 2
Timer B Control Register 1
Timer B Control/Status Register
Timer B Input Capture 1 High Register
Timer B Input Capture 1 Low Register
Timer B Output Compare 1 High Register
Timer B Output Compare 1 Low Register
Timer B Counter High Register
00h
00h
xxh
xxh
xxh
80h
00h
FFh
FCh
FFh
FCh
xxh
xxh
80h
00h
R/W
R/W
R/W
Read Only
Read Only
R/W
TBSCSR
TBIC1HR
TBIC1LR
TBOC1HR
TBOC1LR
TBCHR
R/W
TIMER B
Read Only
Read Only
Read Only
Read Only
Read Only
Read Only
R/W
TBCLR
Timer B Counter Low Register
TBACHR
TBACLR
TBIC2HR
TBIC2LR
TBOC2HR
TBOC2LR
Timer B Alternate Counter High Register
Timer B Alternate Counter Low Register
Timer B Input Capture 2 High Register
Timer B Input Capture 2 Low Register
Timer B Output Compare 2 High Register
Timer B Output Compare 2 Low Register
R/W
0050h
0051h
0052h
0053h
0054h
0055h
0056h
SCISR
SCIDR
SCI Status Register
SCI Data Register
SCI Baud Rate Register
SCI Control Register1
SCI Control Register2
SCI Extended Receive Prescaler Register
SCI Extended Transmit Prescaler Register
C0h
xxh
00h
Read Only
R/W
R/W
SCIBRR
SCICR1
SCICR2
SCIERPR
SCIETPR
SCI
x000 0000h R/W
00h
00h
00h
R/W
R/W
R/W
0057h
to
Reserved (24 Bytes)
006Eh
3)
006Fh
0070h
0071h
ADCDRL
ADCDRH
ADCCSR
Data Register Low
00h
00h
00h
Read Only
Read Only
R/W
3)
ADC
Data Register High
Control/Status Register
0072h
FLASH
FCSR
Flash Control Register
00h
R/W
0073h
to
Reserved (13 Bytes)
007Fh
12/172
ST72260Gx, ST72262Gx, ST72264Gx
Legend: x=Undefined, R/W=Read/Write
Notes:
1. The contents of the I/O port DR registers are readable only in output configuration. In input configura-
tion, the values of the I/O pins are returned instead of the DR register contents.
2. The bits associated with unavailable pins must always keep their reset value.
3. For compatibility with the ST72C254, the ADCDRL and ADCDRH data registers are located with the
LSB on the lower address (6Fh) and the MSB on the higher address (70h). As this scheme is not little En-
dian, the ADC data registers cannot be treated by C programs as an integer, but have to be treated as two
char registers.
13/172
ST72260Gx, ST72262Gx, ST72264Gx
board and while the application is running.
4.3.1 In-Circuit Programming (ICP)
4 FLASH PROGRAM MEMORY
ICP uses a protocol called ICC (In-Circuit Commu-
nication) which allows an ST7 plugged on a print-
ed circuit board (PCB) to communicate with an ex-
ternal programming device connected via cable.
ICP is performed in three steps:
4.1 Introduction
The ST7 single voltage extended Flash (XFlash) is
a non-volatile memory that can be electrically
erased and programmed either on a byte-by-byte
basis or up to 32 bytes in parallel.
Switch the ST7 to ICC mode (In-Circuit Communi-
cations). This is done by driving a specific signal
sequence on the ICCCLK/DATA pins while the
RESET pin is pulled low. When the ST7 enters
ICC mode, it fetches a specific RESET vector
which points to the ST7 System Memory contain-
ing the ICC protocol routine. This routine enables
the ST7 to receive bytes from the ICC interface.
The XFlash devices can be programmed off-board
(plugged in a programming tool) or on-board using
In-Circuit Programming or In-Application Program-
ming.
The array matrix organisation allows each sector
to be erased and reprogrammed without affecting
other sectors.
– Download ICP Driver code in RAM from the
ICCDATA pin
4.2 Main Features
– Execute ICP Driver code in RAM to program
the FLASH memory
■ ICP (In-Circuit Programming)
■ IAP (In-Application Programming)
Depending on the ICP Driver code downloaded in
RAM, FLASH memory programming can be fully
customized (number of bytes to program, program
locations, or selection of the serial communication
interface for downloading).
■ ICT (In-Circuit Testing) for downloading and
executing user application test patterns in RAM
■ Sector 0 size configurable by option byte
■ Read-out and write protection against piracy
4.3.2 In Application Programming (IAP)
4.3 PROGRAMMING MODES
This mode uses an IAP Driver program previously
programmed in Sector 0 by the user (in ICP
mode).
The ST7 can be programmed in three different
ways:
This mode is fully controlled by user software. This
allows it to be adapted to the user application, (us-
er-defined strategy for entering programming
mode, choice of communications protocol used to
fetch the data to be stored etc.)
IAP mode can be used to program any memory ar-
eas except Sector 0, which is write/erase protect-
ed to allow recovery in case errors occur during
the programming operation.
– Insertion in a programming tool. In this mode,
FLASH sectors 0 and 1 and option byte row
can be programmed or erased.
– In-Circuit Programming. In this mode, FLASH
sectors 0 and 1 and option byte row can be
programmed or erased without removing the
device from the application board.
– In-Application Programming. In this mode,
sector 1 can be programmed or erased with-
out removing the device from the application
14/172
ST72260Gx, ST72262Gx, ST72264Gx
FLASH PROGRAM MEMORY (Cont’d)
4.4 ICC interface
Tool documentation for recommended resistor val-
ues.
ICP needs a minimum of 4 and up to 7 pins to be
connected to the programming tool. These pins
are:
2. During the ICP session, the programming tool
must control the RESET pin. This can lead to con-
flicts between the programming tool and the appli-
cation reset circuit if it drives more than 5mA at
high level (push pull output or pull-up resistor<1K).
A schottky diode can be used to isolate the appli-
cation RESET circuit in this case. When using a
classical RC network with R>1K or a reset man-
agement IC with open drain output and pull-up re-
sistor>1K, no additional components are needed.
In all cases the user must ensure that no external
reset is generated by the application during the
ICC session.
– RESET: device reset
– V : device power supply ground
SS
– ICCCLK: ICC output serial clock pin
– ICCDATA: ICC input serial data pin
– ICCSEL: ICC selection (not required on devic-
es without ICCSEL pin)
– OSC1: main clock input for external source
(not required on devices without OSC1/OSC2
pins)
– V : application board power supply (option-
DD
al, see Note 3)
3. The use of Pin 7 of the ICC connector depends
on the Programming Tool architecture. This pin
must be connected when using most ST Program-
ming Tools (it is used to monitor the application
power supply). Please refer to the Programming
Tool manual.
Notes:
1. If the ICCCLK or ICCDATA pins are only used
as outputs in the application, no signal isolation is
necessary. As soon as the Programming Tool is
plugged to the board, even if an ICC session is not
in progress, the ICCCLK and ICCDATA pins are
not available for the application. If they are used as
inputs by the application, isolation such as a serial
resistor has to be implemented in case another de-
vice forces the signal. Refer to the Programming
4. Pin 9 has to be connected to the OSC1 pin of
the ST7 when the clock is not available in the ap-
plication or if the selected clock option is not pro-
grammed in the option byte. ST7 devices with mul-
ti-oscillator capability need to have OSC2 ground-
ed in this case.
Figure 6. Typical ICC Interface
PROGRAMMING TOOL
ICC CONNECTOR
ICC Cable
ICC CONNECTOR
HE10 CONNECTOR TYPE
(See Note 3)
OPTIONAL
(See Note 4)
APPLICATION BOARD
9
7
5
6
3
1
2
10
8
4
APPLICATION
RESET SOURCE
See Note 2
10kΩ
APPLICATION
POWER SUPPLY
C
C
L2
L1
APPLICATION
See Note 1
I/O
ST7
15/172
ST72260Gx, ST72262Gx, ST72264Gx
FLASH PROGRAM MEMORY (Cont’d)
4.5 Memory Protection
4.6 Related Documentation
There are two different types of memory protec-
tion: Read Out Protection and Write/Erase Protec-
tion which can be applied individually.
For details on Flash programming and ICC proto-
col, refer to the ST7 Flash Programming Refer-
ence Manual and to the ST7 ICC Protocol Refer-
ence Manual.
AN1477: Emulated data EEPROM with XFlash
memory
4.5.1 Read out Protection
Read-out protection, when selected, provides a
protection against Program Memory content ex-
traction and against write access to Flash memo-
ry. Even if no protection can be considered as to-
tally unbreakable, the feature provides a very high
level of protection for a general purpose microcon-
troller.
AN1576: IAP drivers for ST7 HDFlash or XFlash
MCUs
AN1575: On Board Programming methods for ST7
HDFlash or XFlash MCUs
AN1070: Checksum self checking capability
In flash devices, this protection is removed by re-
programming the option. In this case the program
memory is automatically erased and the device
can be reprogrammed.
4.7 Register Description
FLASH CONTROL/STATUS REGISTER (FCSR)
Read/Write
Reset Value: 000 0000 (00h)
1st RASS Key: 0101 0110 (56h)
2nd RASS Key: 1010 1110 (AEh)
Read-out protection selection depends on the de-
vice type:
– In Flash devices it is enabled and removed
through the FMP_R bit in the option byte.
– In ROM devices it is enabled by mask option
specified in the Option List.
7
0
0
4.5.2 Flash Write/Erase Protection
0
0
0
0
OPT
LAT
PGM
Write/erase protection, when set, makes it impos-
sible to both overwrite and erase program memo-
ry. Its purpose is to provide advanced security to
applications and prevent any change being made
to the memory content.
Note: This register is reserved for programming
using ICP, IAP or other programming methods. It
controls the XFlash programming and erasing op-
erations.
Warning: Once set, Write/erase protection can
never be removed. A write-protected flash device
is no longer reprogrammable.
When an EPB or another programming tool is
used (in socket or ICP mode), the RASS keys are
sent automatically.
Write/erase protection is enabled through the
FMP_W bit in the option byte.
16/172
ST72260Gx, ST72262Gx, ST72264Gx
5 CENTRAL PROCESSING UNIT
5.1 INTRODUCTION
5.3 CPU REGISTERS
This CPU has a full 8-bit architecture and contains
six internal registers allowing efficient 8-bit data
manipulation.
The 6 CPU registers shown in Figure 7 are not
present in the memory mapping and are accessed
by specific instructions.
Accumulator (A)
5.2 MAIN FEATURES
The Accumulator is an 8-bit general purpose reg-
ister used to hold operands and the results of the
arithmetic and logic calculations and to manipulate
data.
■ Enable executing 63 basic instructions
■ Fast 8-bit by 8-bit multiply
■ 17 main addressing modes (with indirect
Index Registers (X and Y)
addressing mode)
These 8-bit registers are used to create effective
addresses or as temporary storage areas for data
manipulation. (The Cross-Assembler generates a
precede instruction (PRE) to indicate that the fol-
lowing instruction refers to the Y register.)
■ Two 8-bit index registers
■ 16-bit stack pointer
■ Low power HALT and WAIT modes
■ Priority maskable hardware interrupts
■ Non-maskable software/hardware interrupts
The Y register is not affected by the interrupt auto-
matic procedures.
Program Counter (PC)
The program counter is a 16-bit register containing
the address of the next instruction to be executed
by the CPU. It is made of two 8-bit registers PCL
(Program Counter Low which is the LSB) and PCH
(Program Counter High which is the MSB).
Figure 7. CPU Registers
7
0
ACCUMULATOR
RESET VALUE = XXh
7
0
0
X INDEX REGISTER
Y INDEX REGISTER
RESET VALUE = XXh
7
RESET VALUE = XXh
PCL
PCH
7
8
15
0
PROGRAM COUNTER
RESET VALUE = RESET VECTOR @ FFFEh-FFFFh
7
1
0
1
1
I1 H I0 N Z C
CONDITION CODE REGISTER
RESET VALUE =
8
1
1
X 1 X X X
0
15
7
STACK POINTER
RESET VALUE = STACK HIGHER ADDRESS
X = Undefined Value
17/172
ST72260Gx, ST72262Gx, ST72264Gx
CENTRAL PROCESSING UNIT (Cont’d)
Condition Code Register (CC)
Read/Write
Bit 1 = Z Zero.
This bit is set and cleared by hardware. This bit in-
dicates that the result of the last arithmetic, logical
or data manipulation is zero.
0: The result of the last operation is different from
zero.
1: The result of the last operation is zero.
Reset Value: 111x1xxx
7
0
1
1
I1
H
I0
N
Z
C
This bit is accessed by the JREQ and JRNE test
instructions.
The 8-bit Condition Code register contains the in-
terrupt masks and four flags representative of the
result of the instruction just executed. This register
can also be handled by the PUSH and POP in-
structions.
Bit 0 = C Carry/borrow.
This bit is set and cleared by hardware and soft-
ware. It indicates an overflow or an underflow has
occurred during the last arithmetic operation.
0: No overflow or underflow has occurred.
1: An overflow or underflow has occurred.
These bits can be individually tested and/or con-
trolled by specific instructions.
Arithmetic Management Bits
This bit is driven by the SCF and RCF instructions
and tested by the JRC and JRNC instructions. It is
also affected by the “bit test and branch”, shift and
rotate instructions.
Bit 4 = H Half carry.
This bit is set by hardware when a carry occurs be-
tween bits 3 and 4 of the ALU during an ADD or
ADC instructions. It is reset by hardware during
the same instructions.
Interrupt Management Bits
Bit 5,3 = I1, I0 Interrupt
0: No half carry has occurred.
1: A half carry has occurred.
The combination of the I1 and I0 bits gives the cur-
rent interrupt software priority.
This bit is tested using the JRH or JRNH instruc-
tion. The H bit is useful in BCD arithmetic subrou-
tines.
Interrupt Software Priority
Level 0 (main)
I1
1
0
0
1
I0
0
1
0
1
Level 1
Bit 2 = N Negative.
Level 2
This bit is set and cleared by hardware. It is repre-
sentative of the result sign of the last arithmetic,
logical or data manipulation. It’s a copy of the re-
Level 3 (= interrupt disable)
These two bits are set/cleared by hardware when
entering in interrupt. The loaded value is given by
the corresponding bits in the interrupt software pri-
ority registers (IxSPR). They can be also set/
cleared by software with the RIM, SIM, IRET,
HALT, WFI and PUSH/POP instructions.
th
sult 7 bit.
0: The result of the last operation is positive or null.
1: The result of the last operation is negative
(i.e. the most significant bit is a logic 1).
This bit is accessed by the JRMI and JRPL instruc-
tions.
See the interrupt management chapter for more
details.
18/172
ST72260Gx, ST72262Gx, ST72264Gx
CENTRAL PROCESSING UNIT (Cont’d)
Stack Pointer (SP)
Read/Write
The least significant byte of the Stack Pointer
(called S) can be directly accessed by a LD in-
struction.
Reset Value: 01 7Fh
Note: When the lower limit is exceeded, the Stack
Pointer wraps around to the stack upper limit, with-
out indicating the stack overflow. The previously
stored information is then overwritten and there-
fore lost. The stack also wraps in case of an under-
flow.
15
8
1
0
7
0
0
0
0
0
0
0
The stack is used to save the return address dur-
ing a subroutine call and the CPU context during
an interrupt. The user may also directly manipulate
the stack by means of the PUSH and POP instruc-
tions. In the case of an interrupt, the PCL is stored
at the first location pointed to by the SP. Then the
other registers are stored in the next locations as
shown in Figure 8
SP7
SP6
SP5
SP4
SP3
SP2
SP1
SP0
The Stack Pointer is a 16-bit register which is al-
ways pointing to the next free location in the stack.
It is then decremented after data has been pushed
onto the stack and incremented before data is
popped from the stack (see Figure 8).
– When an interrupt is received, the SP is decre-
mented and the context is pushed on the stack.
Since the stack is 128 bytes deep, the 8 most sig-
nificant bits are forced by hardware. Following an
MCU Reset, or after a Reset Stack Pointer instruc-
tion (RSP), the Stack Pointer contains its reset val-
ue (the SP7 to SP0 bits are set) which is the stack
higher address.
– On return from interrupt, the SP is incremented
and the context is popped from the stack.
A subroutine call occupies two locations and an in-
terrupt five locations in the stack area.
Figure 8. Stack Manipulation Example
CALL
Subroutine
RET
or RSP
PUSH Y
POP Y
IRET
Interrupt
Event
@ 0100h
SP
SP
SP
Y
CC
A
CC
A
CC
A
X
X
X
PCH
PCL
PCH
PCL
PCH
PCL
PCH
PCL
PCH
PCL
PCH
PCL
SP
SP
PCH
PCL
PCH
PCL
SP
@ 017Fh
Stack Higher Address = 017Fh
0100h
Stack Lower Address =
19/172
ST72260Gx, ST72262Gx, ST72264Gx
6 SUPPLY, RESET AND CLOCK MANAGEMENT
The device includes a range of utility features for
securing the application in critical situations (for
example in case of a power brown-out), and re-
ducing the number of external components. An
overview is shown in Figure 10.
6.1 PHASE LOCKED LOOP
If the clock frequency input to the PLL is in the 2 to
4 MHz range, the PLL can be used to multiply the
frequency by two to obtain an f
of 4 to 8 MHz.
OSC2
The PLL is enabled by option byte. If the PLL is
disabled, then f /2.
For more details, refer to dedicated parametric
section.
f
OSC2 = OSC
Caution: The PLL is not recommended for appli-
cations where timing accuracy is required. See
“PLL Characteristics” on page 139.
Main Features
■ Optional PLL for multiplying the frequency by 2
(not to be used with internal RC oscillator)
Figure 9. PLL Block Diagram
■ Reset Sequence Manager (RSM)
■ Multi-Oscillator Clock Management (MO)
– 4 Crystal/Ceramic resonator oscillators
– 1 Internal RC oscillator
■ System Integrity Management (SI)
PLL x 2
/ 2
0
1
f
OSC
f
OSC2
– Main supply Low Voltage Detector (LVD)
PLL OPTION BIT
– Auxiliary Voltage Detector (AVD) with inter-
rupt capability for monitoring the main supply
Figure 10. Clock, Reset and Supply Block Diagram
MISCR1 Register
SLOW MODE
SELECTION
f
CPU
to CPU
and
Peripherals
MAIN CLOCK
CONTROLLER
WITH REALTIME
MULTI-
OSCILLATOR
(MO)
OSC2
OSC1
f
OSC
PLL
(option)
f
OSC2
CLOCK (MCC/RTC)
SYSTEM INTEGRITY MANAGEMENT
WATCHDOG
TIMER (WDG)
RESET SEQUENCE
MANAGER
AVD Interrupt Request
RESET
SICSR
AVD AVD
LVD
RF
WDG
RF
(RSM)
0
0
0
0
IE
F
LOW VOLTAGE
DETECTOR
(LVD)
V
V
SS
DD
AUXILIARY VOLTAGE
DETECTOR
(AVD)
20/172
ST72260Gx, ST72262Gx, ST72264Gx
6.2 MULTI-OSCILLATOR (MO)
The main clock of the ST7 can be generated by
four different source types coming from the multi-
oscillator block:
■ an external source
■ 5 crystal or ceramic resonator oscillators
■ an internal high frequency RC oscillator
Internal RC Oscillator
This oscillator allows a low cost solution for the
main clock of the ST7 using only an internal resis-
tor and capacitor. Internal RC oscillator mode has
the drawback of a lower frequency accuracy and
should not be used in applications that require ac-
curate timing.
Each oscillator is optimized for a given frequency
range in terms of consumption and is selectable
through the option byte. The associated hardware
configurations are shown in Table 3. Refer to the
electrical characteristics section for more details.
In this mode, the two oscillator pins have to be tied
to ground.
Related documentation
AN1530: Accurate timebase for low cost ST7 ap-
plications with internal RC.
Caution: The OSC1 and/or OSC2 pins must not
be left unconnected. For the purposes of Failure
Mode and Effects Analysis, it should be noted that
if the OSC1 and/or OSC2 pins are left unconnect-
ed, the ST7 main oscillator may start and, in this
Table 3. ST7 Clock Sources
Hardware Configuration
configuration, could generate an f
clock fre-
OSC
quency in excess of the allowed maximum
(>16MHz.), putting the ST7 in an unsafe/unde-
fined state. The product behaviour must therefore
be considered undefined when the OSC pins are
left unconnected.
ST7
OSC1
OSC2
EXTERNAL
SOURCE
External Clock Source
In this external clock mode, a clock signal (square,
sinus or triangle) with ~50% duty cycle has to drive
the OSC1 pin while the OSC2 pin is tied to ground.
ST7
Crystal/Ceramic Oscillators
OSC1
OSC2
This family of oscillators has the advantage of pro-
ducing a very accurate rate on the main clock of
the ST7. The selection within a list of 5 oscillators
with different frequency ranges has to be done by
option byte in order to reduce consumption (refer
to Section 15.1 on page 162 for more details on
the frequency ranges). In this mode of the multi-
oscillator, the resonator and the load capacitors
have to be placed as close as possible to the oscil-
lator pins in order to minimize output distortion and
start-up stabilization time. The loading capaci-
tance values must be adjusted according to the
selected oscillator.
C
C
L2
L1
LOAD
CAPACITORS
ST7
OSC1
OSC2
These oscillators are not stopped during the
RESET phase to avoid losing time in the oscillator
start-up phase.
21/172
ST72260Gx, ST72262Gx, ST72264Gx
6.3 RESET SEQUENCE MANAGER (RSM)
6.3.1 Introduction
The RESET vector fetch phase duration is 2 clock
cycles.
The reset sequence manager includes three RE-
SET sources as shown in Figure 12:
■ External RESET source pulse
Figure 11. RESET Sequence Phases
■ Internal LVD RESET (Low Voltage Detection)
■ Internal WATCHDOG RESET
RESET
These sources act on the RESET pin and it is al-
ways kept low during the delay phase.
INTERNAL RESET
4096 CLOCK CYCLES
FETCH
VECTOR
Active Phase
The RESET service routine vector is fixed at ad-
dresses FFFEh-FFFFh in the ST7 memory map.
6.3.2 Asynchronous External RESET pin
The basic RESET sequence consists of 3 phases
as shown in Figure 11:
■ Active Phase depending on the RESET source
The RESET pin is both an input and an open-drain
output with integrated R
weak pull-up resistor.
ON
This pull-up has no fixed value but varies in ac-
cordance with the input voltage. It can be pulled
low by external circuitry to reset the device. See
Electrical Characteristic section for more details.
■ 4096 CPU clock cycle delay (selected by option
byte)
■ RESET vector fetch
A RESET signal originating from an external
The 4096 CPU clock cycle delay allows the oscil-
lator to stabilise and ensures that recovery has
taken place from the Reset state. The shorter or
longer clock cycle delay should be selected by op-
tion byte to correspond to the stabilization time of
the external oscillator used in the application.
source must have a duration of at least t
in
h(RSTL)in
order to be recognized (see Figure 13). This de-
tection is asynchronous and therefore the MCU
can enter reset state even in HALT mode.
Figure 12. Reset Block Diagram
V
DD
R
ON
INTERNAL
RESET
Filter
RESET
PULSE
GENERATOR
WATCHDOG RESET
LVD RESET
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ST72260Gx, ST72262Gx, ST72264Gx
RESET SEQUENCE MANAGER (Cont’d)
The RESET pin is an asynchronous signal which
plays a major role in EMS performance. In a noisy
environment, it is recommended to follow the
guidelines mentioned in the electrical characteris-
tics section.
6.3.4 Internal Low Voltage Detector (LVD)
RESET
Two different RESET sequences caused by the in-
ternal LVD circuitry can be distinguished:
■ Power-On RESET
6.3.3 External Power-On RESET
■ Voltage Drop RESET
If the LVD is disabled by option byte, to start up the
microcontroller correctly, the user must ensure by
means of an external reset circuit that the reset
The device RESET pin acts as an output that is
pulled low when V <V
(rising edge) or
DD
IT+
V
<V (falling edge) as shown in Figure 13.
DD
IT-
signal is held low until V
is over the minimum
DD
The LVD filters spikes on V larger than t
to
level specified for the selected f
frequency.
DD
g(VDD)
OSC
avoid parasitic resets.
A proper reset signal for a slow rising V supply
DD
can generally be provided by an external RC net-
work connected to the RESET pin.
6.3.5 Internal Watchdog RESET
The RESET sequence generated by a internal
Watchdog counter overflow is shown in Figure 13.
Starting from the Watchdog counter underflow, the
device RESET pin acts as an output that is pulled
low during at least t
.
w(RSTL)out
Figure 13. RESET Sequences
V
DD
V
V
IT+(LVD)
IT-(LVD)
LVD
RESET
EXTERNAL
RESET
WATCHDOG
RESET
RUN
RUN
RUN
RUN
ACTIVE
PHASE
ACTIVE
PHASE
ACTIVE PHASE
t
w(RSTL)out
t
h(RSTL)in
EXTERNAL
RESET
SOURCE
RESET PIN
WATCHDOG
RESET
WATCHDOG UNDERFLOW
INTERNAL RESET (4096 TCPU
VECTOR FETCH
)
23/172
ST72260Gx, ST72262Gx, ST72264Gx
6.4 SYSTEM INTEGRITY MANAGEMENT (SI)
The System Integrity Management block contains
group the Low voltage Detector (LVD) and Auxilia-
ry Voltage Detector (AVD) functions. It is managed
by the SICSR register.
Provided the minimum V value (guaranteed for
DD
the oscillator frequency) is above V , the MCU
IT-
can only be in two modes:
– under full software control
– in static safe reset
In these conditions, secure operation is always en-
sured for the application without the need for ex-
ternal reset hardware.
Note: A reset can also be triggered following the
detection of an illegal opcode or prebyte code. Re-
fer to Section 12.2.1 on page 123 for further de-
tails.
During a Low Voltage Detector Reset, the RESET
pin is held low, thus permitting the MCU to reset
other devices.
6.4.1 Low Voltage Detector (LVD)
The Low Voltage Detector function (LVD) gener-
ates a static reset when the V supply voltage is
DD
below a V reference value. This means that it
IT-
Notes:
secures the power-up as well as the power-down
keeping the ST7 in reset.
The LVD allows the device to be used without any
external RESET circuitry.
The V reference value for a voltage drop is lower
IT-
The LVD is an optional function which can be se-
lected by option byte.
than the V reference value for power-on in order
IT+
to avoid a parasitic reset when the MCU starts run-
ning and sinks current on the supply (hysteresis).
Use of LVD with capacitive power supply: with this
type of power supply, if power cuts occur in the ap-
The LVD Reset circuitry generates a reset when
plication, it is recommended to pull V
down to
DD
V
is below:
DD
0V to ensure optimum restart conditions. Refer to
– V when V is rising
IT+
DD
circuit example in Figure 91 on page 151 and note
6.
– V when V is falling
IT-
DD
The LVD function is illustrated in Figure 14.
It is recommended to make sure that the V sup-
DD
The voltage threshold can be configured by option
byte to be low, medium or high.
ply voltage rises monotonously when the device is
exiting from Reset, to ensure the application func-
tions properly.
Figure 14. Low Voltage Detector vs Reset
V
DD
V
hys
V
V
IT+
IT-
RESET
24/172
ST72260Gx, ST72262Gx, ST72264Gx
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
6.4.2 Auxiliary Voltage Detector (AVD)
In the case of a drop in voltage, the AVD interrupt
acts as an early warning, allowing software to shut
down safely before the LVD resets the microcon-
troller. See Figure 15.
The Voltage Detector function (AVD) is based on
an analog comparison between a V and V ref-
IT-
IT+
erence value and the V
main supply. The V
DD
IT-
reference value for falling voltage is lower than the
The interrupt on the rising edge is used to inform
V
reference value for rising voltage in order to
the application that the V warning state is over.
IT+
DD
avoid parasitic detection (hysteresis).
If the voltage rise time t is less than 256 or 4096
rv
The output of the AVD comparator is directly read-
able by the application software through a real
time status bit (VDF) in the SICSR register. This bit
is read only.
Caution: The AVD functions only if the LVD is en-
abled through the option byte.
CPU cycles (depending on the reset delay select-
ed by option byte), no AVD interrupt will be gener-
ated when V
is reached.
IT+(AVD)
If t is greater than 256 or 4096 cycles then:
rv
– If the AVD interrupt is enabled before the
V
threshold is reached, then 2 AVD inter-
IT+(AVD)
6.4.2.1 Monitoring the V Main Supply
DD
rupts will be received: the first when the AVDIE
bit is set, and the second when the threshold is
reached.
The AVD voltage threshold value is relative to the
selected LVD threshold configured by option byte
(see Section 15.1 on page 162).
– If the AVD interrupt is enabled after the V
IT+(AVD)
threshold is reached then only one AVD interrupt
will occur.
If the AVD interrupt is enabled, an interrupt is gen-
erated when the voltage crosses the V
or
IT+(AVD)
V
threshold (AVDF bit toggles).
IT-(AVD)
Figure 15. Using the AVD to Monitor V
DD
V
DD
Early Warning Interrupt
(Power has dropped, MCU not
not yet in reset)
V
hyst
V
IT+(AVD)
V
IT-(AVD)
V
V
IT+(LVD)
t
VOLTAGE RISE TIME
rv
IT-(LVD)
1
1
AVDF bit
0
RESET VALUE
0
AVD INTERRUPT
REQUEST
IF AVDIE bit = 1
INTERRUPT PROCESS
INTERRUPT PROCESS
LVD RESET
25/172
ST72260Gx, ST72262Gx, ST72264Gx
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
6.4.3 Low Power Modes
set and the interrupt mask in the CC register is re-
set (RIM instruction).
Mode
Description
Enable Exit
Control from
Exit
from
Halt
No effect on SI. AVD interrupts cause the
device to exit from Wait mode.
Event
Flag
WAIT
HALT
Interrupt Event
Bit
Wait
The SICSR register is frozen.
AVD event
AVDF AVDIE
Yes
No
6.4.3.1 Interrupts
The AVD interrupt event generates an interrupt if
the corresponding Enable Control Bit (AVDIE) is
26/172
ST72260Gx, ST72262Gx, ST72264Gx
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
6.4.4 Register Description
SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)
Read/Write
WDGRF flag description for more details. When
the LVD is disabled by OPTION BYTE, the LVDRF
bit value is undefined.
Reset Value: 000x 000x (00h)
7
0
Bit 3:1 = Reserved, must be kept cleared.
AVD AVD LVD
WDG
RF
0
0
0
0
IE
F
RF
Bit 0 = WDGRF Watchdog reset flag
This bit indicates that the last Reset was generat-
ed by the Watchdog peripheral. It is set by hard-
ware (watchdog reset) and cleared by software
(writing zero) or an LVD Reset (to ensure a stable
cleared state of the WDGRF flag when CPU
starts).
Bit 7 = Reserved, always read as 0.
Bit 6 = AVDIE Voltage Detector interrupt enable
This bit is set and cleared by software. It enables
an interrupt to be generated when the AVDF flag
changes (toggles). The pending interrupt informa-
tion is automatically cleared when software enters
the AVD interrupt routine.
Combined with the LVDRF flag information, the
flag description is given by the following table.
RESET Sources
LVDRF WDGRF
0: AVD interrupt disabled
1: AVD interrupt enabled
External RESET pin
Watchdog
0
0
1
0
1
LVD
X
Bit 5 = AVDF Voltage Detector flag
This read-only bit is set and cleared by hardware.
If the AVDIE bit is set, an interrupt request is gen-
erated when the AVDF bit changes value.
Application Notes
0: V over V
threshold
threshold
IT-(AVD)
DD
DD
IT+(AVD)
The LVDRF flag is not cleared when another RE-
SET type occurs (external or watchdog), the
LVDRF flag remains set to keep trace of the origi-
nal failure. In this case, a watchdog reset can be
detected by software while an external reset can
not.
1: V under V
Bit 4 = LVDRF LVD reset flag
This bit indicates that the last Reset was generat-
ed by the LVD block. It is set by hardware (LVD re-
set) and cleared by software (writing zero). See
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
SICSR
Reset Value
AVDIE
0
AVDF
0
LVDRF
x
WDGRF
x
0025h
0
0
0
0
27/172
ST72260Gx, ST72262Gx, ST72264Gx
7 INTERRUPTS
7.1 INTRODUCTION
When an interrupt request has to be serviced:
– Normal processing is suspended at the end of
the current instruction execution.
– The PC, X, A and CC registers are saved onto
the stack.
– I1 and I0 bits of CC register are set according to
the corresponding values in the ISPRx registers
of the serviced interrupt vector.
– The PC is then loaded with the interrupt vector of
the interrupt to service and the first instruction of
the interrupt service routine is fetched (refer to
“Interrupt Mapping” table for vector addresses).
The ST7 enhanced interrupt management pro-
vides the following features:
■ Hardware interrupts
■ Software interrupt (TRAP)
■ Nested or concurrent interrupt management
with flexible interrupt priority and level
management:
– Up to 4 software programmable nesting levels
– Up to 16 interrupt vectors fixed by hardware
– 2 non-maskable events: RESET and TRAP
This interrupt management is based on:
The interrupt service routine should end with the
IRET instruction which causes the contents of the
saved registers to be recovered from the stack.
– Bit 5 and bit 3 of the CPU CC register (I1:0),
– Interrupt software priority registers (ISPRx),
– Fixed interrupt vector addresses located at the
high addresses of the memory map (FFE0h to
FFFFh) sorted by hardware priority order.
Note: As a consequence of the IRET instruction,
the I1 and I0 bits will be restored from the stack
and the program in the previous level will resume.
This enhanced interrupt controller guarantees full
upward compatibility with the standard (not nest-
ed) ST7 interrupt controller.
Table 4. Interrupt Software Priority Levels
Interrupt software priority Level
I1
1
I0
0
Level 0 (main)
Level 1
Low
7.2 MASKING AND PROCESSING FLOW
0
1
Level 2
0
0
The interrupt masking is managed by the I1 and I0
bits of the CC register and the ISPRx registers
which give the interrupt software priority level of
each interrupt vector (see Table 4). The process-
ing flow is shown in Figure 16
Level 3 (= interrupt disable)
High
1
1
Figure 16. Interrupt Processing Flowchart
PENDING
INTERRUPT
Y
RESET
Interrupt has the same or a
lower software priority
than current one
N
I1:0
FETCH NEXT
INSTRUCTION
THE INTERRUPT
STAYS PENDING
Y
“IRET”
N
RESTORE PC, X, A, CC
FROM STACK
EXECUTE
INSTRUCTION
STACK PC, X, A, CC
LOAD I1:0 FROM INTERRUPT SW REG.
LOAD PC FROM INTERRUPT VECTOR
28/172
ST72260Gx, ST72262Gx, ST72264Gx
INTERRUPTS (Cont’d)
Servicing Pending Interrupts
3). These sources allow the processor to exit
HALT mode.
■ TRAP (Non Maskable Software Interrupt)
As several interrupts can be pending at the same
time, the interrupt to be taken into account is deter-
mined by the following two-step process:
This software interrupt is serviced when the TRAP
instruction is executed. It will be serviced accord-
ing to the flowchart on Figure 16 as a TLI.
– the highest software priority interrupt is serviced,
– if several interrupts have the same software pri-
ority then the interrupt with the highest hardware
priority is serviced first.
■ RESET
The RESET source has the highest priority in the
ST7. This means that the first current routine has
the highest software priority (level 3) and the high-
est hardware priority.
Figure 17 describes this decision process.
Figure 17. Priority Decision Process
See the RESET chapter for more details.
PENDING
INTERRUPTS
Maskable Sources
Maskable interrupt vector sources can be serviced
if the corresponding interrupt is enabled and if its
own interrupt software priority (in ISPRx registers)
is higher than the one currently being serviced (I1
and I0 in CC register). If any of these two condi-
tions is false, the interrupt is latched and thus re-
mains pending.
Different
Same
SOFTWARE
PRIORITY
■ External Interrupts
HIGHEST SOFTWARE
PRIORITY SERVICED
External interrupts allow the processor to exit from
HALT low power mode.
External interrupt sensitivity is software selectable
through the Miscellaneous registers (MISCRx).
External interrupt triggered on edge will be latched
and the interrupt request automatically cleared
upon entering the interrupt service routine.
If several input pins of a group connected to the
same interrupt vector request an interrupt simulta-
neously, the interrupt vector will be serviced. Soft-
ware can read the pin levels to identify which
pin(s) are the source of the interrupt.
HIGHEST HARDWARE
PRIORITY SERVICED
When an interrupt request is not serviced immedi-
ately, it is latched and then processed when its
software priority combined with the hardware pri-
ority becomes the highest one.
Note 1: The hardware priority is exclusive while
the software one is not. This allows the previous
process to succeed with only one interrupt.
Note 2: RESET and TRAP are non-maskable and
they can be considered as having the highest soft-
ware priority in the decision process.
If several input pins are selected simultaneously
as interrupt source, these are logically NANDed.
For this reason if one of the interrupt pins is tied
low, it masks the other ones.
■ Peripheral Interrupts
Usually the peripheral interrupts cause the MCU to
exit from HALT mode except those mentioned in
the “Interrupt Mapping” table.
A peripheral interrupt occurs when a specific flag
is set in the peripheral status registers and if the
corresponding enable bit is set in the peripheral
control register.
The general sequence for clearing an interrupt is
based on an access to the status register followed
by a read or write to an associated register.
Note: The clearing sequence resets the internal
latch. A pending interrupt (i.e. waiting for being
serviced) will therefore be lost if the clear se-
quence is executed.
Different Interrupt Vector Sources
Two interrupt source types are managed by the
ST7 interrupt controller: the non-maskable type
(RESET and TRAP) and the maskable type (exter-
nal or from internal peripherals).
Non-Maskable Sources
These sources are processed regardless of the
state of the I1 and I0 bits of the CC register (see
Figure 16). After stacking the PC, X, A and CC
registers (except for RESET), the corresponding
vector is loaded in the PC register and the I1 and
I0 bits of the CC are set to disable interrupts (level
29/172
ST72260Gx, ST72262Gx, ST72264Gx
INTERRUPTS (Cont’d)
7.3 INTERRUPTS AND LOW POWER MODES
7.4 CONCURRENT & NESTED MANAGEMENT
All interrupts allow the processor to exit the WAIT
low power mode. On the contrary, only external
and other specified interrupts allow the processor
to exit the HALT modes (see column “Exit from
HALT” in “Interrupt Mapping” table). When several
pending interrupts are present while exiting HALT
mode, the first one serviced can only be an inter-
rupt with exit from HALT mode capability and it is
selected through the same decision process
shown in Figure 17.
The following Figure 18 and Figure 19 show two
different interrupt management modes. The first is
called concurrent mode and does not allow an in-
terrupt to be interrupted, unlike the nested mode in
Figure 19. The interrupt hardware priority is given
in this order from the lowest to the highest: MAIN,
IT4, IT3, IT2, IT1, IT0. The software priority is giv-
en for each interrupt.
Warning: A stack overflow may occur without no-
tifying the software of the failure.
Note: If an interrupt, that is not able to Exit from
HALT mode, is pending with the highest priority
when exiting HALT mode, this interrupt is serviced
after the first one serviced.
Note: TLI (Top Level Interrupt) is not available in
this product.
Related Documentation
AN1044: Multiple interrupt source management
for ST7 MCUs
Figure 18. Concurrent Interrupt Management
SOFTWARE
PRIORITY
LEVEL
I1
I0
TLI
3
1 1
1 1
1 1
1 1
1 1
1 1
IT0
3
IT1
IT1
3
IT2
3
IT3
3
RIM
IT4
3
MAIN
MAIN
3/0
11 / 10
10
Figure 19. Nested Interrupt Management
SOFTWARE
PRIORITY
LEVEL
I1
I0
TLI
3
1 1
1 1
0 0
0 1
1 1
1 1
IT0
3
IT1
IT1
IT2
2
IT2
1
IT3
3
RIM
IT4
IT4
3
MAIN
MAIN
3/0
11 / 10
10
30/172
ST72260Gx, ST72262Gx, ST72264Gx
INTERRUPTS (Cont’d)
7.5 INTERRUPT REGISTER DESCRIPTION
INTERRUPT SOFTWARE PRIORITY REGIS-
TERS (ISPRX)
CPU CC REGISTER INTERRUPT BITS
Read/Write
Read/Write (bits 7:4 of ISPR3 are read only)
Reset Value: 111x 1010 (xAh)
Reset Value: 1111 1111 (FFh)
7
0
7
0
ISPR0
ISPR1
I1_3 I0_3 I1_2 I0_2 I1_1 I0_1 I1_0 I0_0
I1_7 I0_7 I1_6 I0_6 I1_5 I0_5 I1_4 I0_4
1
1
I1
H
I0
N
Z
C
Bit 5, 3 = I1, I0 Software Interrupt Priority
These two bits indicate the current interrupt soft-
ware priority.
ISPR2 I1_11 I0_11 I1_10 I0_10 I1_9 I0_9 I1_8 I0_8
Interrupt Software Priority Level
I1
1
I0
0
ISPR3
1
1
1
1
I1_13 I0_13 I1_12 I0_12
Level 0 (main)
Level 1
Low
0
1
These four registers contain the interrupt software
priority of each interrupt vector.
Level 2
0
0
Level 3 (= interrupt disable*)
High
1
1
– Each interrupt vector (except RESET and TRAP)
has corresponding bits in these registers where
its own software priority is stored. This corre-
spondance is shown in the following table.
These two bits are set/cleared by hardware when
entering in interrupt. The loaded value is given by
the corresponding bits in the interrupt software pri-
ority registers (ISPRx).
Vector Address
ISPRx Bits
They can be also set/cleared by software with the
RIM, SIM, HALT, WFI, IRET and PUSH/POP in-
structions (see “Interrupt Dedicated Instruction
Set” table).
FFFBh-FFFAh
FFF9h-FFF8h
...
ei0
ei1
...
FFE1h-FFE0h
Not used
*Note: TRAP and RESET events are non maska-
ble sources and can interrupt a level 3 program.
– Each I1_x and I0_x bit value in the ISPRx regis-
ters has the same meaning as the I1 and I0 bits
in the CC register.
– Level 0 can not be written (I1_x=1, I0_x=0). In
this case, the previously stored value is kept. (ex-
ample: previous=CFh, write=64h, result=44h)
The RESET and TRAP vectors have no software
priorities. When one is serviced, the I1 and I0 bits
of the CC register are both set.
Caution: If the I1_x and I0_x bits are modified
while the interrupt x is executed the following be-
haviour has to be considered: If the interrupt x is
still pending (new interrupt or flag not cleared) and
the new software priority is higher than the previ-
ous one, the interrupt x is re-entered. Otherwise,
the software priority stays unchanged up to the
next interrupt request (after the IRET of the inter-
rupt x).
31/172
ST72260Gx, ST72262Gx, ST72264Gx
INTERRUPTS (Cont’d)
Table 5. Interrupt Mapping
Exit
from
HALT
Source
Block
Register Priority
Address
Vector
N°
Description
Label
Order
RESET
TRAP
ei0
Reset
Software Interrupt
yes
no
FFFEh-FFFFh
FFFCh-FFFDh
FFFAh-FFFBh
FFF8h-FFF9h
FFF6h-FFF7h
FFF4h-FFF5h
FFF2h-FFF3h
FFF0h-FFF1h
FFEEh-FFEFh
FFECh-FFEDh
FFEAh-FFEBh
FFE8h-FFE9h
FFE6h-FFE7h
FFE4h-FFE5h
FFE2h-FFE3h
FFE0h-FFE1h
Highest
Priority
N/A
1
0
1
External Interrupt Port A7..0 (C5..0 )
yes
1
ei1
External Interrupt Port B7..0 (C5..0 )
2
Not used
3
SPI
TIMER A
MCC
SPI Peripheral Interrupts
TIMER A Peripheral Interrupts
Time base interrupt
TIMER B Peripheral Interrupts
Auxiliary Voltage Detector interrupt
Not used
SPISR
TASR
yes
no
4
5
MCCSR
TBSR
yes
6
TIMER B
AVD
no
7
SICSR
8
9
Not used
10
11
12
13
SCI
SCI Peripheral Interrupt
SCISR
no
no
2
2
I C
I C Peripheral Interrupt
I2CSRx
Not Used
Not Used
Lowest
Priority
Note 1. Configurable by option byte.
Table 6. Nested Interrupts Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
SPI
Not Used
EI1
EI0
001Ch
001Dh
001Eh
001Fh
ISPR0
Reset Value
I1_3
1
I0_3
1
I1_2
1
I0_2
1
I1_1
1
I0_1
1
I1_0
1
I0_0
1
AVD
TIMERB
MCC
TIMERA
ISPR1
Reset Value
I1_7
1
I0_7
1
I1_6
1
I0_6
1
I1_5
1
I0_5
1
I1_4
1
I0_4
1
2
I C
SCI
Not Used
Not Used
ISPR2
Reset Value
I1_11
1
I0_11
1
I1_10
1
I0_10
1
I1_9
1
I0_9
1
I1_8
1
I0_8
1
Not Used
Not Used
ISPR3
Reset Value
I1_13
1
I0_13
1
I1_12
1
I0_12
1
1
1
1
1
32/172
ST72260Gx, ST72262Gx, ST72264Gx
8 POWER SAVING MODES
8.1 INTRODUCTION
8.2 SLOW MODE
To give a large measure of flexibility to the applica-
tion in terms of power consumption, three main
power saving modes are implemented in the ST7
(see Figure 20).
This mode has two targets:
– To reduce power consumption by decreasing the
internal clock in the device,
– To adapt the internal clock frequency (f
the available supply voltage.
) to
CPU
After a RESET the normal operating mode is se-
lected by default (RUN mode). This mode drives
the device (CPU and embedded peripherals) by
means of a master clock which is based on the
SLOW mode is controlled by three bits in the
MISR1 register: the SMS bit which enables or dis-
ables Slow mode and two CPx bits which select
main oscillator frequency divided by 2 (f
).
CPU
the internal slow frequency (f
).
CPU
From Run mode, the different power saving
modes may be selected by setting the relevant
register bits or by calling the specific ST7 software
instruction whose action depends on the oscillator
status.
In this mode, the oscillator frequency can be divid-
ed by 4, 8, 16 or 32 instead of 2 in normal operat-
ing mode. The CPU and peripherals are clocked at
this lower frequency.
Note: SLOW-WAIT mode is activated when enter-
ring the WAIT mode while the device is already in
SLOW mode.
Figure 20. Power Saving Mode Transitions
High
RUN
Figure 21. SLOW Mode Clock Transitions
f
/2
f
/4
f
OSC2
OSC2
OSC2
f
CPU
SLOW
WAIT
f
OSC2
00
01
CP1:0
SMS
SLOW WAIT
HALT
NORMAL RUN MODE
REQUEST
NEW SLOW
FREQUENCY
REQUEST
Low
POWER CONSUMPTION
33/172
ST72260Gx, ST72262Gx, ST72264Gx
POWER SAVING MODES (Cont’d)
8.3 WAIT MODE
Figure 22. WAIT Mode Flowchart
WAIT mode places the MCU in a low power con-
sumption mode by stopping the CPU.
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
OFF
0
WFI INSTRUCTION
This power saving mode is selected by calling the
“WFI” ST7 software instruction.
All peripherals remain active. During WAIT mode,
‘10b’
the I [1:0] bits in the CC register are forced to
,
to enable all interrupts. All other registers and
memory remain unchanged. The MCU remains in
WAIT mode until an interrupt or Reset occurs,
whereupon the Program Counter branches to the
starting address of the interrupt or Reset service
routine.
N
RESET
Y
N
INTERRUPT
The MCU will remain in WAIT mode until a Reset
or an Interrupt occurs, causing it to wake up.
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
1
Refer to Figure 22.
4096 CPU CLOCK CYCLE
DELAY
OSCILLATOR
PERIPHERALS
CPU
ON
ON
ON
1)
I[1:0] BITS
XX
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Note:
1. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits in the CC reg-
ister are set during the interrupt routine and
cleared when the CC register is popped.
34/172
ST72260Gx, ST72262Gx, ST72264Gx
Figure 23. ACTIVE-HALT Timing Overview
8.4 ACTIVE-HALT AND HALT MODES
ACTIVE-HALT and HALT modes are the two low-
est power consumption modes of the MCU. They
are both entered by executing the ‘HALT’ instruc-
tion. The decision to enter either in ACTIVE-HALT
or HALT mode is given by the MCC/RTC interrupt
enable flag (OIE bit in MCCSR register).
ACTIVE
HALT
4096 CPU
CYCLE DELAY
RUN
RUN
1)
RESET
OR
INTERRUPT
HALT
INSTRUCTION
[MCCSR.OIE=1]
FETCH
VECTOR
MCCSR Power Saving Mode entered when HALT
OIE bit
instruction is executed
HALT mode
ACTIVE-HALT mode
Figure 24. ACTIVE-HALT Mode Flowchart
0
1
OSCILLATOR
PERIPHERALS
CPU
ON
OFF
OFF
10
2)
HALT INSTRUCTION
(MCCSR.OIE=1)
8.4.1 ACTIVE-HALT MODE
I[1:0] BITS
ACTIVE-HALT mode is the lowest power con-
sumption mode of the MCU with a real time clock
available. It is entered by executing the ‘HALT’ in-
struction when the OIE bit of the Main Clock Con-
troller Status register (MCCSR) is set.
N
RESET
N
Y
INTERRUPT 3)
The MCU can exit ACTIVE-HALT mode on recep-
tion of either an MCC/RTC interrupt, a specific in-
terrupt (see Table 5, “Interrupt Mapping,” on page
32) or a RESET. When exiting ACTIVE-HALT
mode by means of an interrupt, no 4096 CPU cy-
cle delay occurs. The CPU resumes operation by
servicing the interrupt or by fetching the reset vec-
tor which woke it up (see Figure 24).
When entering ACTIVE-HALT mode, the I[1:0] bits
in the CC register are forced to ‘10b’ to enable in-
terrupts. Therefore, if an interrupt is pending, the
MCU wakes up immediately.
OSCILLATOR
PERIPHERALS
CPU
ON
OFF
ON
Y
I[1:0] BITS
XX 4)
4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
ON
ON
ON
I[1:0] BITS
XX 4)
In ACTIVE-HALT mode, only the main oscillator
and its associated counter (MCC/RTC) are run-
ning to keep a wake-up time base. All other periph-
erals are not clocked except those which get their
clock supply from another clock generator (such
as external or auxiliary oscillator).
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Notes:
The safeguard against staying locked in ACTIVE-
HALT mode is provided by the oscillator interrupt.
1. This delay occurs only if the MCU exits ACTIVE-
HALT mode by means of a RESET.
2. Peripheral clocked with an external clock source
Note: As soon as the interrupt capability of one of
the oscillators is selected (MCCSR.OIE bit set),
entering ACTIVE-HALT mode while the Watchdog
is active does not generate a RESET.
This means that the device cannot spend more
than a defined delay in this power saving mode.
can still be active.
3. Only the MCC/RTC interrupt and some specific
interrupts can exit the MCU from ACTIVE-HALT
mode (such as external interrupt). Refer to Table
5, “Interrupt Mapping,” on page 32 for more details.
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits of the CC reg-
ister are set to the current software priority level of
the interrupt routine and restored when the CC
register is popped.
35/172
ST72260Gx, ST72262Gx, ST72264Gx
POWER SAVING MODES (Cont’d)
8.5 HALT MODE
Figure 26. HALT Mode Flowchart
The HALT mode is the lowest power consumption
mode of the MCU. It is entered by executing the
ST7 HALT instruction (see Figure 26).
HALT INSTRUCTION
ENABLE
The MCU can exit HALT mode on reception of ei-
ther a specific interrupt (see Table 5, “Interrupt
Mapping,” on page 32) or a RESET. When exiting
HALT mode by means of a RESET or an interrupt,
the oscillator is immediately turned on and the
4096 CPU cycle delay is used to stabilize the os-
cillator. After the start up delay, the CPU resumes
operation by servicing the interrupt or by fetching
the reset vector which woke it up (see Figure 25).
When entering HALT mode, the I[1:0] bits in the
CC register are forced to ‘10b’ to enable interrupts.
Therefore, if an interrupt is pending, the MCU
wakes immediately.
WATCHDOG
0
DISABLE
WDGHALT 1)
1
WATCHDOG
RESET
OSCILLATOR
OFF
PERIPHERALS 2)
CPU
OFF
OFF
0
I[1:0] BITS
N
RESET
In the HALT mode the main oscillator is turned off
causing all internal processing to be stopped, in-
cluding the operation of the on-chip peripherals.
All peripherals are not clocked except the ones
which get their clock supply from another clock
generator (such as an external or auxiliary oscilla-
tor).
Y
N
INTERRUPT 3)
OSCILLATOR
PERIPHERALS
CPU
Y
ON
OFF
ON
1
The compatibility of Watchdog operation with
HALT mode is configured by the “WDGHALT” op-
tion bit of the option byte. The HALT instruction
when executed while the Watchdog system is en-
abled, can generate a Watchdog RESET (see
Section 15.1 "OPTION BYTES" on page 162 for
more details).
I[1:0] BITS
4096 CPU CLOCK CYCLE
DELAY
OSCILLATOR
PERIPHERALS
CPU
ON
ON
Figure 25. HALT Mode Timing Overview
ON
I[1:0] BITS
XX 4)
4096 CPU CYCLE
RUN
HALT
RUN
DELAY
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Notes:
HALT
INSTRUCTION
1. WDGHALT is an option bit. See option byte sec-
tion for more details.
2. Peripheral clocked with an external clock source
can still be active.
3. Only some specific interrupts can exit the MCU
from HALT mode (such as external interrupt). Re-
fer to Table 5, “Interrupt Mapping,” on page 32 for
more details.
RESET
OR
INTERRUPT
FETCH
VECTOR
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits in the CC reg-
ister are set during the interrupt routine and
cleared when the CC register is popped.
36/172
ST72260Gx, ST72262Gx, ST72264Gx
POWER SAVING MODES (Cont’d)
8.5.0.1 Halt Mode Recommendations
ry. For example, avoid defining a constant in
ROM with the value 0x8E.
– Make sure that an external event is available to
wake up the microcontroller from Halt mode.
– As the HALT instruction clears the interrupt mask
in the CC register to allow interrupts, the user
may choose to clear all pending interrupt bits be-
fore executing the HALT instruction. This avoids
entering other peripheral interrupt routines after
executing the external interrupt routine corre-
sponding to the wake-up event (reset or external
interrupt).
– When using an external interrupt to wake up the
microcontroller, reinitialize the corresponding I/O
as “Input Pull-up with Interrupt” before executing
the HALT instruction. The main reason for this is
that the I/O may be wrongly configured due to ex-
ternal interference or by an unforeseen logical
condition.
Related Documentation
– For the same reason, reinitialize the level sensi-
tiveness of each external interrupt as a precau-
tionary measure.
AN 980: ST7 Keypad Decoding Techniques, Im-
plementing Wake-Up on Keystroke
– The opcode for the HALT instruction is 0x8E. To
avoid an unexpected HALT instruction due to a
program counter failure, it is advised to clear all
occurrences of the data value 0x8E from memo-
AN1014: How to Minimize the ST7 Power Con-
sumption
AN1605: Using an active RC to wakeup the
ST7LITE0 from power saving mode
37/172
ST72260Gx, ST72262Gx, ST72264Gx
9 I/O PORTS
9.1 INTRODUCTION
If several I/O interrupt pins on the same interrupt
vector are selected simultaneously, they are logi-
cally combined. For this reason if one of the inter-
rupt pins is tied low, it may mask the others.
The I/O ports allow data transfer. An I/O port can
contain up to 8 pins. Each pin can be programmed
independently either as a digital input or digital
output. In addition, specific pins may have several
other functions. These functions can include exter-
nal interrupt, alternate signal input/output for on-
chip peripherals or analog input.
External interrupts are hardware interrupts. Fetch-
ing the corresponding interrupt vector automatical-
ly clears the request latch. Modifying the sensitivity
bits will clear any pending interrupts.
9.2.2 Output Modes
9.2 FUNCTIONAL DESCRIPTION
Setting the DDRx bit selects output mode. Writing
to the DR bits applies a digital value to the I/O
through the latch. Reading the DR bits returns the
previously stored value.
A Data Register (DR) and a Data Direction Regis-
ter (DDR) are always associated with each port.
The Option Register (OR), which allows input/out-
put options, may or may not be implemented. The
following description takes into account the OR
register. Refer to the Port Configuration table for
device specific information.
If an OR bit is available, different output modes
can be selected by software: push-pull or open-
drain. Refer to I/O Port Implementation section for
configuration.
DR Value and Output Pin Status
An I/O pin is programmed using the corresponding
bits in the DDR, DR and OR registers: bit x corre-
sponding to pin x of the port.
DR
Push-Pull
Open-Drain
0
1
V
V
OL
Floating
OL
Figure 27 shows the generic I/O block diagram.
V
OH
9.2.1 Input Modes
9.2.3 Alternate Functions
Clearing the DDRx bit selects input mode. In this
mode, reading its DR bit returns the digital value
from that I/O pin.
Many ST7s I/Os have one or more alternate func-
tions. These may include output signals from, or
input signals to, on-chip peripherals. The Device
Pin Description table describes which peripheral
signals can be input/output to which ports.
If an OR bit is available, different input modes can
be configured by software: floating or pull-up. Re-
fer to I/O Port Implementation section for configu-
ration.
A signal coming from an on-chip peripheral can be
output on an I/O. To do this, enable the on-chip
peripheral as an output (enable bit in the peripher-
al’s control register). The peripheral configures the
I/O as an output and takes priority over standard I/
O programming. The I/O’s state is readable by ad-
dressing the corresponding I/O data register.
Notes:
1. Writing to the DR modifies the latch value but
does not change the state of the input pin.
2. Do not use read/modify/write instructions
(BSET/BRES) to modify the DR register.
External Interrupt Function
Configuring an I/O as floating enables alternate
function input. It is not recommended to configure
an I/O as pull-up as this will increase current con-
sumption. Before using an I/O as an alternate in-
put, configure it without interrupt. Otherwise spuri-
ous interrupts can occur.
Depending on the device, setting the ORx bit while
in input mode can configure an I/O as an input with
interrupt. In this configuration, a signal edge or lev-
el input on the I/O generates an interrupt request
via the corresponding interrupt vector (eix).
Falling or rising edge sensitivity is programmed in-
dependently for each interrupt vector. The Exter-
nal Interrupt Control Register (EICR) or the Miscel-
laneous Register controls this sensitivity, depend-
ing on the device.
Configure an I/O as input floating for an on-chip
peripheral signal which can be input and output.
Caution:
I/Os which can be configured as both an analog
and digital alternate function need special atten-
tion. The user must control the peripherals so that
the signals do not arrive at the same time on the
same pin. If an external clock is used, only the
clock alternate function should be employed on
that I/O pin and not the other alternate function.
A device may have up to 7 external interrupts.
Several pins may be tied to one external interrupt
vector. Refer to Pin Description to see which ports
have external interrupts.
38/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORTS (Cont’d)
Figure 27. I/O Port General Block Diagram
ALTERNATE
OUTPUT
From on-chip peripheral
1
0
REGISTER
ACCESS
P-BUFFER
(see table below)
V
DD
ALTERNATE
ENABLE
BIT
PULL-UP
(see table below)
DR
V
DD
DDR
OR
PULL-UP
CONDITION
PAD
If implemented
OR SEL
DDR SEL
DR SEL
N-BUFFER
DIODES
(see table below)
ANALOG
INPUT
CMOS
SCHMITT
TRIGGER
1
0
ALTERNATE
INPUT
To on-chip peripheral
EXTERNAL
INTERRUPT
REQUEST (ei )
Combinational
Logic
FROM
OTHER
BITS
x
SENSITIVITY
SELECTION
Note: Refer to the Port Configuration
table for device specific information.
Table 7. I/O Port Mode Options
Configuration Mode
Diodes
Pull-Up
P-Buffer
to V
to V
SS
DD
Floating with/without Interrupt
Input
Off
On
Off
Pull-up with/without Interrupt
On
Push-pull
On
Off
NI
On
Off
NI
Output
Open Drain (logic level)
True Open Drain
NI (see note)
Legend:NI - not implemented
Off - implemented not activated
On - implemented and activated
Note: The diode to V is not implemented in the
DD
true open drain pads. A local protection between
the pad and V is implemented to protect the de-
OL
vice against positive stress.
39/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORTS (Cont’d)
Table 8. I/O Configurations
Hardware Configuration
DR REGISTER ACCESS
V
DD
NOTE 3
PULL-UP
CONDITION
R
W
R
PU
DR
REGISTER
DATA BUS
PAD
ALTERNATE INPUT
To on-chip peripheral
FROM
OTHER
PINS
EXTERNAL INTERRUPT
SOURCE (ei )
x
COMBINATIONAL
LOGIC
INTERRUPT
CONDITION
POLARITY
SELECTION
ANALOG INPUT
V
NOTE 3
DD
DR REGISTER ACCESS
R
PU
PAD
R/W
DR
REGISTER
DATA BUS
DR REGISTER ACCESS
NOTE 3
V
DD
R
PU
R/W
DR
REGISTER
DATA BUS
PAD
ALTERNATE
ENABLE
BIT
ALTERNATE
OUTPUT
From on-chip peripheral
Notes:
1. When the I/O port is in input configuration and the associated alternate function is enabled as an output,
reading the DR register will read the alternate function output status.
2. When the I/O port is in output configuration and the associated alternate function is enabled as an input,
the alternate function reads the pin status given by the DR register content.
3. For true open drain, these elements are not implemented.
40/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORTS (Cont’d)
Analog alternate function
9.4 UNUSED I/O PINS
Configure the I/O as floating input to use an ADC
input. The analog multiplexer (controlled by the
ADC registers) switches the analog voltage
present on the selected pin to the common analog
rail, connected to the ADC input.
Unused I/O pins must be connected to fixed volt-
age levels. Refer to Section 13.8.
9.5 LOW POWER MODES
Analog Recommendations
Mode
WAIT
HALT
Description
Do not change the voltage level or loading on any
I/O while conversion is in progress. Do not have
clocking pins located close to a selected analog
pin.
No effect on I/O ports. External interrupts
cause the device to exit from WAIT mode.
No effect on I/O ports. External interrupts
cause the device to exit from HALT mode.
WARNING: The analog input voltage level must
be within the limits stated in the absolute maxi-
mum ratings.
9.6 INTERRUPTS
The external interrupt event generates an interrupt
if the corresponding configuration is selected with
DDR and OR registers and if the I bit in the CC
register is cleared (RIM instruction).
9.3 I/O PORT IMPLEMENTATION
The hardware implementation on each I/O port de-
pends on the settings in the DDR and OR registers
and specific I/O port features such as ADC input or
open drain.
Enable Exit
Control from
Exit
from
Halt
Event
Flag
Interrupt Event
Bit
Wait
Switching these I/O ports from one state to anoth-
er should be done in a sequence that prevents un-
wanted side effects. Recommended safe transi-
tions are illustrated in Figure 28. Other transitions
are potentially risky and should be avoided, since
they may present unwanted side-effects such as
spurious interrupt generation.
External interrupt on
selected external
event
DDRx
ORx
-
Yes
Yes
Related Documentation
AN 970: SPI Communication between ST7 and
EEPROM
Figure 28. Interrupt I/O Port State Transitions
AN1045: S/W implementation of I2C bus master
AN1048: Software LCD driver
01
00
10
11
INPUT
floating/pull-up
interrupt
INPUT
floating
(reset state)
OUTPUT
open-drain
OUTPUT
push-pull
= DDR, OR
XX
41/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORTS (Cont’d)
9.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION
The I/O port register configurations are summa-
rised as follows.
True Open Drain Interrupt Ports
PA6, PA4 (without pull-up)
Interrupt Ports
MODE
DDR
OR
PA7, PA5, PA3:0, PB7:0, PC5:0 (with pull-up)
floating input
0
0
1
0
1
X
MODE
DDR
OR
floating interrupt input
open drain (high sink ports)
floating input
0
0
1
1
0
1
0
1
pull-up interrupt input
open drain output
push-pull output
Table 9. Port Configuration
Input (DDR = 0)
Output (DDR = 1)
Port
Pin Name
PA7
OR = 0
OR = 1
OR = 0
OR = 1
High-Sink
floating
floating
floating
floating
floating
floating
floating
pull-up interrupt
floating interrupt
pull-up interrupt
floating interrupt
pull-up interrupt
pull-up interrupt
pull-up interrupt
open drain
push-pull
PA6
true open-drain
Port A
PA5
open drain
push-pull
Yes
PA4
true open-drain
PA3:0
PB7:0
PC5:0
open drain
open drain
open drain
push-pull
push-pull
push-pull
Port B
Port C
No
42/172
ST72260Gx, ST72262Gx, ST72264Gx
OPTION REGISTER (OR)
I/O PORTS (Cont’d)
9.8 I/O PORT REGISTER DESCRIPTION
DATA REGISTER (DR)
Port x Option Register
PxOR with x = A, B or C.
Port x Data Register
PxDR with x = A, B or C.
Read/Write
Reset Value: 0000 0000 (00h)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
7
0
O7
O6
O5
O4
O3
O2
O1
O0
D7
D6
D5
D4
D3
D2
D1
D0
Bits 7:0 = O[7:0] Option register 8 bits.
For specific I/O pins, this register is not implement-
ed. In this case the DDR register is enough to se-
lect the I/O pin configuration.
Bits 7:0 = D[7:0] Data register 8 bits.
The DR register has a specific behaviour accord-
ing to the selected input/output configuration. Writ-
ing the DR register is always taken into account
even if the pin is configured as an input; this allows
always having the expected level on the pin when
toggling to output mode. Reading the DR register
returns either the DR register latch content (pin
configured as output) or the digital value applied to
the I/O pin (pin configured as input).
The OR register allows to distinguish: in input
mode if the pull-up with interrupt capability or the
basic pull-up configuration is selected, in output
mode if the push-pull or open drain configuration is
selected.
Each bit is set and cleared by software.
Input mode:
0: Floating input
1: Pull-up input with or without interrupt
DATA DIRECTION REGISTER (DDR)
Port x Data Direction Register
PxDDR with x = A, B or C.
Output mode:
0: Output open drain (with P-Buffer unactivated)
1: Output push-pull (when available)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
DD7
DD6
DD5
DD4
DD3
DD2
DD1
DD0
Bits 7:0 = DD[7:0] Data direction register 8 bits.
The DDR register gives the input/output direction
configuration of the pins. Each bit is set and
cleared by software.
0: Input mode
1: Output mode
43/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORTS (Cont’d)
Table 10. I/O Port Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
Reset Value
of all I/O port registers
0
0
0
0
0
0
0
0
0000h
0001h
0002h
0004h
0005h
0006h
0008h
0009h
000Ah
PCDR
PCDDR
PCOR
PBDR
PBDDR
PBOR
PADR
PADDR
PAOR
MSB
MSB
MSB
LSB
LSB
LSB
44/172
ST72260Gx, ST72262Gx, ST72264Gx
10 MISCELLANEOUS REGISTERS
The miscellaneous registers allow control over
several different features such as the external in-
terrupts or the I/O alternate functions.
Figure 29. Ext. Interrupt Sensitivity (EXTIT=0)
MISCR1
IS00 IS01
PA7
ei0
10.1 I/O PORT INTERRUPT SENSITIVITY
INTERRUPT
SOURCE
The external interrupt sensitivity is controlled by
the ISxx bits of the Miscellaneous register and the
OPTION BYTE. This control allows you to have
two fully independent external interrupt source
sensitivities with configurable sources (using the
EXTIT option bit) as shown in Figure 29 and Fig-
ure 30.
SENSITIVITY
CONTROL
PA0
PC5
PC0
MISCR1
IS10
IS11
ei1
Each external interrupt source can be generated
on four different events on the pin:
■ Falling edge
PB7
PB0
INTERRUPT
SOURCE
SENSITIVITY
CONTROL
■ Rising edge
■ Falling and rising edge
■ Falling edge and low level
To guarantee correct functionality, the sensitivity
bits in the MISCR1 register must be modified only
when the I[1:0] bits in the CC register are set to 1
(interrupt masked). See Section 9.8 "I/O PORT
REGISTER DESCRIPTION" on page 43 and Sec-
tion 10.3 "MISCELLANEOUS REGISTER DE-
SCRIPTION" on page 46 for more details on the
programming.
Figure 30. Ext. Interrupt Sensitivity (EXTIT=1)
MISCR1
IS00
IS01
ei0
PA7
INTERRUPT
SOURCE
SENSITIVITY
CONTROL
PA0
PB7
10.2 I/O PORT ALTERNATE FUNCTIONS
MISCR1
The MISCR registers manage four I/O port miscel-
laneous alternate functions:
IS10
IS11
ei1
INTERRUPT
SOURCE
SENSITIVITY
CONTROL
PB0
PC5
■ Main clock signal (f
) output on PC2
CPU
■ SPI pin configuration:
– SS pin internal control to use the PB7 I/O port
function while the SPI is active.
– Master output capability on the MOSI pin
(PB4) deactivated while the SPI is active.
PC0
– Slave output capability on the MISO pin (PB5)
deactivated while the SPI is active.
These functions are described in detail in the Sec-
tion 10.3 "MISCELLANEOUS REGISTER DE-
SCRIPTION" on page 46.
45/172
ST72260Gx, ST72262Gx, ST72264Gx
MISCELLANEOUS REGISTERS (Cont’d)
10.3 MISCELLANEOUS REGISTER DESCRIPTION
MISCELLANEOUS REGISTER 1 (MISCR1)
Read/Write
Bits 2:1 = CP[1:0] CPU clock prescaler
These bits select the CPU clock prescaler which is
applied in the various slow modes. Their action is
conditioned by the setting of the SMS bit. These
two bits are set and cleared by software
Reset Value: 0000 0000 (00h)
7
0
f
in SLOW mode
CP1
CP0
CPU
IS11 IS10 MCO IS01 IS00 CP1 CP0 SMS
f
f
f
/ 2
/ 4
0
1
0
1
0
0
1
1
OSC2
OSC2
OSC2
/ 8
Bits 7:6 = IS1[1:0] ei1 sensitivity
f
/ 16
OSC2
The interrupt sensitivity, defined using the IS1[1:0]
bits, is applied to the ei1 external interrupts. These
two bits can be written only when the I[1:0] bits in
the CC register are set to 1 (interrupt masked).
Bit 0 = SMS Slow mode select
This bit is set and cleared by software.
0: Normal mode. f = f
ei1: Port B (C optional)
OSC2
CPU
1: Slow mode. f
is given by CP1, CP0
CPU
External Interrupt Sensitivity
IS11 IS10
See low power consumption mode and MCC
chapters for more details.
Falling edge & low level
Rising edge only
0
0
1
1
0
1
0
1
Falling edge only
Rising and falling edge
Bit 5 = MCO Main clock out selection
This bit enables the MCO alternate function on the
PC2 I/O port. It is set and cleared by software.
0: MCO alternate function disabled (I/O pin free for
general-purpose I/O)
1: MCO alternate function enabled (f
port)
on I/O
CPU
Bits 4:3 = IS0[1:0] ei0 sensitivity
The interrupt sensitivity, defined using the IS0[1:0]
bits, is applied to the ei0 external interrupts. These
two bits can be written only when the I[1:0] bits in-
the CC register are set to 1 (interrupt masked).
ei0: Port A (C optional)
External Interrupt Sensitivity
IS01 IS00
Falling edge & low level
Rising edge only
0
0
1
1
0
1
0
1
Falling edge only
Rising and falling edge
46/172
ST72260Gx, ST72262Gx, ST72264Gx
MISCELLANEOUS REGISTERS (Cont’d)
MISCELLANEOUS REGISTER 2 (MISCR2)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
0
0
0
0
MOD SOD SSM SSI
Caution: This register has been provided for com-
patibility with the ST72254 family only. The same
bits are available in the SPICSR register. New ap-
plications must use the SPICSR register. Do not
use both registers, this will cause the SPI to mal-
function.
Bits 7:4 = Reserved always read as 0
Bits 3 = MOD SPI Master Output Disable
This bit is set and cleared by software. When set, it
disables the SPI Master (MOSI) output signal.
0: SPI Master Output enabled.
1: SPI Master Output disabled.
Bit 2 = SOD SPI Slave Output Disable
This bit is set and cleared by software. When set it
disable the SPI Slave (MISO) output signal.
0: SPI Slave Output enabled.
1: SPI Slave Output disabled.
Bit 1 = SSM SS mode selection
This bit is set and cleared by software.
0: Normal mode - the level of the SPI SS signal is
input from the external SS pin.
1: I/O mode, the level of the SPI SS signal is read
from the SSI bit.
Bit 0 = SSI SS internal mode
This bit replaces the SS pin of the SPI when the
SSM bit is set to 1. (see SPI description). It is set
and cleared by software.
Table 11. Miscellaneous Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
MISCR1
Reset Value
IS11
0
IS10
0
MCO
0
IS01
0
IS00
0
CP1
0
CP0
0
SMS
0
0020h
0040h
MISCR2
Reset Value
MOD
0
SOD
0
SSM
0
SSI
0
0
0
0
0
47/172
ST72260Gx, ST72262Gx, ST72264Gx
11 ON-CHIP PERIPHERALS
11.1 WATCHDOG TIMER (WDG)
11.1.1 Introduction
If the watchdog is activated (the WDGA bit is set)
and when the 7-bit timer (bits T[6:0]) rolls over
from 40h to 3Fh (T6 becomes cleared), it initiates
a reset cycle pulling low the reset pin for typically
500ns.
The Watchdog timer is used to detect the occur-
rence of a software fault, usually generated by ex-
ternal interference or by unforeseen logical condi-
tions, which causes the application program to
abandon its normal sequence. The Watchdog cir-
cuit generates an MCU reset on expiry of a pro-
grammed time period, unless the program refresh-
es the counter’s contents before the T6 bit be-
comes cleared.
The application program must write in the
WDGCR register at regular intervals during normal
operation to prevent an MCU reset. This down-
counter is free-running: it counts down even if the
watchdog is disabled. The value to be stored in the
WDGCR register must be between FFh and C0h:
11.1.2 Main Features
■ Programmable free-running downcounter
■ Programmable reset
– The WDGA bit is set (watchdog enabled)
– The T6 bit is set to prevent generating an imme-
diate reset
■ Reset (if watchdog activated) when the T6 bit
– The T[5:0] bits contain the number of increments
which represents the time delay before the
watchdog produces a reset (see Figure 32. Ap-
proximate Timeout Duration). The timing varies
between a minimum and a maximum value due
to the unknown status of the prescaler when writ-
ing to the WDGCR register (see Figure 33).
reaches zero
■ Optional
reset
on
HALT
instruction
(configurable by option byte)
■ Hardware Watchdog selectable by option byte
11.1.3 Functional Description
Following a reset, the watchdog is disabled. Once
activated it cannot be disabled, except by a reset.
The counter value stored in the Watchdog Control
register (WDGCR bits T[6:0]), is decremented
every 16384 f
cycles (approx.), and the
The T6 bit can be used to generate a software re-
set (the WDGA bit is set and the T6 bit is cleared).
OSC2
length of the timeout period can be programmed
by the user in 64 increments.
If the watchdog is activated, the HALT instruction
will generate a Reset.
Figure 31. Watchdog Block Diagram
RESET
f
OSC2
MCC/RTC
WATCHDOG CONTROL REGISTER (WDGCR)
T5
DIV 64
WDGA T6
T1
T0
T4
T2
T3
6-BIT DOWNCOUNTER (CNT)
12-BIT MCC
RTC COUNTER
WDG PRESCALER
DIV 4
TB[1:0] bits
(MCCSR
Register)
MSB
LSB
0
6 5
11
48/172
ST72260Gx, ST72262Gx, ST72264Gx
WATCHDOG TIMER (Cont’d)
11.1.4 How to Program the Watchdog Timeout
more precision is needed, use the formulae in Fig-
ure 33.
Figure 32 shows the linear relationship between
the 6-bit value to be loaded in the Watchdog Coun-
ter (CNT) and the resulting timeout duration in mil-
liseconds. This can be used for a quick calculation
without taking the timing variations into account. If
Caution: When writing to the WDGCR register, al-
ways write 1 in the T6 bit to avoid generating an
immediate reset.
Figure 32. Approximate Timeout Duration
3F
38
30
28
20
18
10
08
00
1.5
18
34
50
65
82
98
114
128
Watchdog timeout (ms) @ 8 MHz. f
OSC2
49/172
ST72260Gx, ST72262Gx, ST72264Gx
WATCHDOG TIMER (Cont’d)
Figure 33. Exact Timeout Duration (t
and t
)
max
min
WHERE:
t
t
t
= (LSB + 128) x 64 x t
min0
OSC2
= 16384 x t
= 125ns if f
max0
OSC2
OSC2
=8 MHz
OSC2
CNT = Value of T[5:0] bits in the WDGCR register (6 bits)
MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits
in the MCCSR register
TB1 Bit
TB0 Bit
Selected MCCSR
Timebase
MSB
LSB
(MCCSR Reg.) (MCCSR Reg.)
0
0
1
1
0
1
0
1
2ms
4ms
4
8
59
53
35
54
10ms
25ms
20
49
To calculate the minimum Watchdog Timeout (t ):
min
MSB
4
IF
THEN
ELSE
-------------
CNT <
t
= tmin0 + 16384 × CNT × t
min
osc2
4CNT
----------------
4CNT
----------------
⎛
⎞
⎠
t
= t
+ 16384 × CNT –
+ (192 + LSB) × 64 ×
× t
osc2
min
min0
⎝
MSB
MSB
To calculate the maximum Watchdog Timeout (t
):
max
MSB
4
IF
-------------
THEN
ELSE
CNT ≤
t
= tmax0 + 16384 × CNT × t
osc2
max
4CNT
----------------
4CNT
----------------
⎛
⎞
t
= t
+ 16384 × CNT –
+ (192 + LSB) × 64 ×
× t
osc2
max
max0
⎝
⎠
MSB
MSB
Note: In the above formulae, division results must be rounded down to the next integer value.
Example:
With 2ms timeout selected in MCCSR register
Min. Watchdog
Timeout (ms)
Max. Watchdog
Timeout (ms)
Value of T[5:0] Bits in
WDGCR Register (Hex.)
t
t
min
max
00
3F
1.496
128
2.048
128.552
50/172
ST72260Gx, ST72262Gx, ST72264Gx
WATCHDOG TIMER (Cont’d)
11.1.5 Low Power Modes
Mode Description
SLOW No effect on Watchdog.
WAIT No effect on Watchdog.
OIE bit in
MCCSR
register
WDGHALT bit
in Option
Byte
No Watchdog reset is generated. The MCU enters Halt mode. The Watch-
dog counter is decremented once and then stops counting and is no longer
able to generate a watchdog reset until the MCU receives an external inter-
rupt or a reset.
0
0
If an external interrupt is received, the Watchdog restarts counting after 256
or 4096 CPU clocks. If a reset is generated, the Watchdog is disabled (reset
state) unless Hardware Watchdog is selected by option byte. For applica-
tion recommendations see Section 11.1.7 below.
HALT
0
1
1
x
A reset is generated.
No reset is generated. The MCU enters Active Halt mode. The Watchdog
counter is not decremented. It stop counting. When the MCU receives an
oscillator interrupt or external interrupt, the Watchdog restarts counting im-
mediately. When the MCU receives a reset the Watchdog restarts counting
after 256 or 4096 CPU clocks.
11.1.6 Hardware Watchdog Option
11.1.9 Register Description
If Hardware Watchdog is selected by option byte,
the watchdog is always active and the WDGA bit in
the WDGCR is not used. Refer to the Option Byte
description.
CONTROL REGISTER (WDGCR)
Read/Write
Reset Value: 0111 1111 (7Fh)
11.1.7 Using Halt Mode with the WDG
(WDGHALT option)
7
0
WDGA T6
T5
T4
T3
T2
T1
T0
The following recommendation applies if Halt
mode is used when the watchdog is enabled.
– Before executing the HALT instruction, refresh
the WDG counter, to avoid an unexpected WDG
reset immediately after waking up the microcon-
troller.
Bit 7 = WDGA Activation bit.
This bit is set by software and only cleared by
hardware after a reset. When WDGA = 1, the
watchdog can generate a reset.
0: Watchdog disabled
1: Watchdog enabled
11.1.8 Interrupts
None.
Note: This bit is not used if the hardware watch-
dog option is enabled by option byte.
Bit 6:0 = T[6:0] 7-bit counter (MSB to LSB).
These bits contain the value of the watchdog
counter. It is decremented every 16384 f
cles (approx.). A reset is produced when it rolls
over from 40h to 3Fh (T6 becomes cleared).
cy-
OSC2
51/172
ST72260Gx, ST72262Gx, ST72264Gx
Table 12. Watchdog Timer Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
WDGCR
Reset Value
WDGA
0
T6
1
T5
1
T4
1
T3
1
T2
1
T1
1
T0
1
0024h
52/172
ST72260Gx, ST72262Gx, ST72264Gx
11.2
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC)
The Main Clock Controller consists of a real time
clock timer with interrupt capability
When the RTC interrupt is enabled (OIE bit set),
the ST7 enters ACTIVE-HALT mode when the
HALT instruction is executed. See Section 8.4
"ACTIVE-HALT AND HALT MODES" on page 35
for more details.
11.2.1
Real Time Clock Timer (RTC)
The counter of the real time clock timer allows an
interrupt to be generated based on an accurate
real time clock. Four different time bases depend-
ing directly on f
are available. The whole
OSC2
functionality is controlled by four bits of the MCC-
SR register: TB[1:0], OIE and OIF.
Figure 34. Main Clock Controller (MCC/RTC) Block Diagram
fOSC2
TO WATCHDOG
RTC
COUNTER
TB1 TB0 OIE OIF
MCCSR
MCC/RTC INTERRUPT
53/172
ST72260Gx, ST72262Gx, ST72264Gx
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)
11.2.2
Low Power Modes
Bit 3:2 = TB[1:0] Time base control
These bits select the programmable divider time
base. They are set and cleared by software.
Mode
Description
No effect on MCC/RTC peripheral.
MCC/RTC interrupt cause the device to exit
from WAIT mode.
WAIT
Time Base
Counter
TB1 TB0
Prescaler
f
=4MHz
f
=8MHz
OSC2
OSC2
No effect on MCC/RTC counter (OIE bit is
ACTIVE- set), the registers are frozen.
16000
32000
80000
200000
4ms
2ms
4ms
0
0
1
1
0
1
0
1
HALT
MCC/RTC interrupt cause the device to exit
8ms
20ms
50ms
from ACTIVE-HALT mode.
10ms
25ms
MCC/RTC counter and registers are frozen.
MCC/RTC operation resumes when the
MCU is woken up by an interrupt with “exit
from HALT” capability.
HALT
A modification of the time base is taken into ac-
count at the end of the current period (previously
set) to avoid an unwanted time shift. This allows to
use this time base as a real time clock.
11.2.3
Interrupts
The MCC/RTC interrupt event generates an inter-
rupt if the OIE bit of the MCCSR register is set and
the interrupt mask in the CC register is not active
(RIM instruction).
Bit 1 = OIE Oscillator interrupt enable
This bit set and cleared by software.
0: Oscillator interrupt disabled
1: Oscillator interrupt enabled
This interrupt can be used to exit from ACTIVE-
HALT mode.
Enable Exit
Control from
Bit
Exit
from
Halt
Event
Flag
Interrupt Event
Wait
Time base overflow
event
1)
When this bit is set, calling the ST7 software HALT
instruction enters the ACTIVE-HALT power saving
OIF
OIE
Yes
No
mode
.
Note:
Bit 0 = OIF Oscillator interrupt flag
This bit is set by hardware and cleared by software
reading the CSR register. It indicates when set
that the main oscillator has reached the selected
elapsed time (TB1:0).
0: Timeout not reached
1: Timeout reached
The MCC/RTC interrupt wakes up the MCU from
ACTIVE-HALT mode, not from HALT mode.
11.2.4
Register Description
MCC CONTROL/STATUS REGISTER (MCCSR)
Read/Write
CAUTION: The BRES and BSET instructions
must not be used on the MCCSR register to avoid
unintentionally clearing the OIF bit.
Reset Value: 0000 0000 (00h
)
7
0
0
0
0
0
TB1 TB0 OIE OIF
Bit 7:4 = reserved
Table 13. Main Clock Controller Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
SICSR
Reset Value
AVDIE
0
AVDF
0
LVDRF
x
WDGRF
x
0025h
0026h
0
0
0
0
MCCSR
Reset Value
TB1
0
TB0
0
OIE
0
OIF
0
0
0
0
0
54/172
ST72260Gx, ST72262Gx, ST72264Gx
11.3 16-BIT TIMER
11.3.1 Introduction
When reading an input signal on a non-bonded
pin, the value will always be ‘1’.
The timer consists of a 16-bit free-running counter
driven by a programmable prescaler.
11.3.3 Functional Description
11.3.3.1 Counter
It may be used for a variety of purposes, including
pulse length measurement of up to two input sig-
nals (input capture) or generation of up to two out-
put waveforms (output compare and PWM).
The main block of the Programmable Timer is a
16-bit free running upcounter and its associated
16-bit registers. The 16-bit registers are made up
of two 8-bit registers called high & low.
Pulse lengths and waveform periods can be mod-
ulated from a few microseconds to several milli-
seconds using the timer prescaler and the CPU
clock prescaler.
Counter Register (CR):
– Counter High Register (CHR) is the most sig-
nificant byte (MS Byte).
Some devices of the ST7 family have two on-chip
16-bit timers. They are completely independent,
and do not share any resources. They are syn-
chronized after a Device reset as long as the timer
clock frequencies are not modified.
– Counter Low Register (CLR) is the least sig-
nificant byte (LS Byte).
Alternate Counter Register (ACR)
– Alternate Counter High Register (ACHR) is the
most significant byte (MS Byte).
– Alternate Counter Low Register (ACLR) is the
least significant byte (LS Byte).
This description covers one or two 16-bit timers. In
the devices with two timers, register names are
prefixed with TA (Timer A) or TB (Timer B).
11.3.2 Main Features
■ Programmableprescaler:fCPU dividedby2,4or8.
■ Overflow status flag and maskable interrupt
■ External clock input (must be at least 4 times
slowerthantheCPUclockspeed)withthechoice
of active edge
■ Output compare functions with
– 2 dedicated 16-bit registers
– 2 dedicated programmable signals
– 2 dedicated status flags
These two read-only 16-bit registers contain the
same value but with the difference that reading the
ACLR register does not clear the TOF bit (Timer
overflow flag), located in the Status register, (SR),
(see note at the end of paragraph titled 16-bit read
sequence).
Writing in the CLR register or ACLR register resets
the free running counter to the FFFCh value.
Both counters have a reset value of FFFCh (this is
the only value which is reloaded in the 16-bit tim-
er). The reset value of both counters is also
FFFCh in One Pulse mode and PWM mode.
– 1 dedicated maskable interrupt
■ Input capture functions with
– 2 dedicated 16-bit registers
– 2 dedicated active edge selection signals
– 2 dedicated status flags
The timer clock depends on the clock control bits
of the CR2 register, as illustrated in Table 14 Clock
Control Bits. The value in the counter register re-
peats every 131 072, 262 144 or 524 288 CPU
clock cycles depending on the CC[1:0] bits.
– 1 dedicated maskable interrupt
■ Pulse width modulation mode (PWM)
■ One pulse mode
The timer frequency can be f
or an external frequency.
/2, f
/4, f
/8
CPU
CPU
CPU
■ Reduced Power Mode
■ 5 alternate functions on I/O ports (ICAP1, ICAP2,
OCMP1, OCMP2, EXTCLK)*
The Block Diagram is shown in Figure 35.
*Note: Some timer pins may not available (not
bonded) in some devices. Refer to the device pin
out description.
55/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Figure 35. Timer Block Diagram
INTERNAL BUS
f
CPU
16-BIT TIMER PERIPHERAL INTERFACE
8 low
8-bit
8 high
8
8
8
8
8
8
8
8
buffer
EXEDG
16
INPUT
CAPTURE
REGISTER
INPUT
CAPTURE
REGISTER
OUTPUT
COMPARE
REGISTER
OUTPUT
COMPARE
REGISTER
1/2
1/4
1/8
COUNTER
REGISTER
1
1
2
2
ALTERNATE
COUNTER
REGISTER
EXTCLK
pin
16
16
16
CC[1:0]
TIMER INTERNAL BUS
16 16
OVERFLOW
DETECT
EDGE DETECT
CIRCUIT1
OUTPUT COMPARE
CIRCUIT
ICAP1
pin
CIRCUIT
6
EDGE DETECT
CIRCUIT2
ICAP2
pin
OCMP1
pin
LATCH1
LATCH2
0
ICF1 OCF1 TOF ICF2 OCF2
0
TIMD
(Control/Status Register)
OCMP2
pin
CSR
EXEDG
ICIE OCIE TOIE FOLV2 FOLV1OLVL2 IEDG1 OLVL1
OC1E
OPM PWM CC1 CC0 IEDG2
OC2E
(Control Register 1) CR1
(Control Register 2) CR2
(See note)
Note: If IC, OC and TO interrupt requests have separate vectors
then the last OR is not present (See Device Interrupt Vector Table)
TIMER INTERRUPT
56/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
16-bit read sequence: (from either the Counter
Register or the Alternate Counter Register).
Clearing the overflow interrupt request is done in
two steps:
1. Reading the SR register while the TOF bit is set.
2. An access (read or write) to the CLR register.
Beginning of the sequence
Read
LS Byte
Notes: The TOF bit is not cleared by accesses to
ACLR register. The advantage of accessing the
ACLR register rather than the CLR register is that
it allows simultaneous use of the overflow function
and reading the free running counter at random
times (for example, to measure elapsed time) with-
out the risk of clearing the TOF bit erroneously.
MS Byte
At t0
is buffered
Other
instructions
Returns the buffered
LS Byte value at t0
Read
LS Byte
At t0 +∆t
The timer is not affected by WAIT mode.
In HALT mode, the counter stops counting until the
mode is exited. Counting then resumes from the
previous count (Device awakened by an interrupt)
or from the reset count (Device awakened by a
Reset).
Sequence completed
The user must read the MS Byte first, then the LS
Byte value is buffered automatically.
This buffered value remains unchanged until the
16-bit read sequence is completed, even if the
user reads the MS Byte several times.
11.3.3.2 External Clock
After a complete reading sequence, if only the
CLR register or ACLR register are read, they re-
turn the LS Byte of the count value at the time of
the read.
The external clock (where available) is selected if
CC0=1 and CC1=1 in CR2 register.
The status of the EXEDG bit in the CR2 register
determines the type of level transition on the exter-
nal clock pin EXTCLK that will trigger the free run-
ning counter.
Whatever the timer mode used (input capture, out-
put compare, one pulse mode or PWM mode) an
overflow occurs when the counter rolls over from
FFFFh to 0000h then:
The counter is synchronised with the falling edge
of the internal CPU clock.
– The TOF bit of the SR register is set.
– A timer interrupt is generated if:
– TOIE bit of the CR1 register is set and
– I bit of the CC register is cleared.
A minimum of four falling edges of the CPU clock
must occur between two consecutive active edges
of the external clock; thus the external clock fre-
quency must be less than a quarter of the CPU
clock frequency.
If one of these conditions is false, the interrupt re-
mains pending to be issued as soon as they are
both true.
57/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Figure 36. Counter Timing Diagram, internal clock divided by 2
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
FFFD FFFE FFFF 0000 0001 0002 0003
COUNTER REGISTER
TIMER OVERFLOW FLAG (TOF)
Figure 37. Counter Timing Diagram, internal clock divided by 4
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
FFFC
FFFD
0000
0001
COUNTER REGISTER
TIMER OVERFLOW FLAG (TOF)
Figure 38. Counter Timing Diagram, internal clock divided by 8
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
0000
FFFC
FFFD
COUNTER REGISTER
TIMER OVERFLOW FLAG (TOF)
Note: The Device is in reset state when the internal reset signal is high, when it is low the Device is run-
ning.
58/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
11.3.3.3 Input Capture
When an input capture occurs:
In this section, the index, i, may be 1 or 2 because
there are 2 input capture functions in the 16-bit
timer.
– ICFi bit is set.
– The ICiR register contains the value of the free
running counter on the active transition on the
ICAPi pin (see Figure 40).
The two input capture 16-bit registers (IC1R and
IC2R) are used to latch the value of the free run-
ning counter after a transition detected by the
ICAPi pin (see figure 5).
– A timer interrupt is generated if the ICIE bit is set
and the I bit is cleared in the CC register. Other-
wise, the interrupt remains pending until both
conditions become true.
MS Byte
LS Byte
ICiR
ICiHR
ICiLR
Clearing the Input Capture interrupt request (i.e.
clearing the ICFi bit) is done in two steps:
ICiR register is a read-only register.
1. Reading the SR register while the ICFi bit is set.
2. An access (read or write) to the ICiLR register.
The active transition is software programmable
through the IEDGi bit of Control Registers (CRi).
Timing resolution is one count of the free running
Notes:
counter: (f
/CC[1:0]).
CPU
1. After reading the ICiHR register, transfer of
input capture data is inhibited and ICFi will
never be set until the ICiLR register is also
read.
Procedure:
To use the input capture function select the follow-
ing in the CR2 register:
2. The ICiR register contains the free running
counter value which corresponds to the most
recent input capture.
– Select the timer clock (CC[1:0]) (see Table 14
Clock Control Bits).
3. The 2 input capture functions can be used
together even if the timer also uses the 2 output
compare functions.
– Select the edge of the active transition on the
ICAP2 pin with the IEDG2 bit (the ICAP2 pin
must be configured as floating input).
4. In One pulse Mode and PWM mode only the
input capture 2 can be used.
And select the following in the CR1 register:
– Set the ICIE bit to generate an interrupt after an
input capture coming from either the ICAP1 pin
or the ICAP2 pin
5. The alternate inputs (ICAP1 & ICAP2) are
always directly connected to the timer. So any
transitions on these pins activate the input cap-
ture function.
– Select the edge of the active transition on the
ICAP1 pin with the IEDG1 bit (the ICAP1pin must
be configured as floating input).
Moreover if one of the ICAPi pin is configured
as an input and the second one as an output,
an interrupt can be generated if the user toggle
the output pin and if the ICIE bit is set.
This can be avoided if the input capture func-
tion i is disabled by reading the ICiHR (see note
1).
6. The TOF bit can be used with interrupt in order
to measure event that go beyond the timer
range (FFFFh).
59/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Figure 39. Input Capture Block Diagram
ICAP1
pin
(Control Register 1) CR1
EDGE DETECT
CIRCUIT2
EDGE DETECT
CIRCUIT1
ICIE
IEDG1
ICAP2
pin
(Status Register) SR
ICF1
ICF2
0
0
0
IC2R Register
IC1R Register
(Control Register 2) CR2
16-BIT
16-BIT FREE RUNNING
COUNTER
IEDG2
CC0
CC1
Figure 40. Input Capture Timing Diagram
TIMER CLOCK
FF01
FF02
FF03
COUNTER REGISTER
ICAPi PIN
ICAPi FLAG
FF03
ICAPi REGISTER
Note: The active edge is the rising edge.
Note: The time between an event on the ICAPi pin
and the appearance of the corresponding flag is
from 2 to 3 CPU clock cycles. This depends on the
moment when the ICAP event happens relative to
the timer clock.
60/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
11.3.3.4 Output Compare
– The OCMPi pin takes OLVLi bit value (OCMPi
pin latch is forced low during reset).
In this section, the index, i, may be 1 or 2 because
there are 2 output compare functions in the 16-bit
timer.
– A timer interrupt is generated if the OCIE bit is
set in the CR2 register and the I bit is cleared in
the CC register (CC).
This function can be used to control an output
waveform or indicate when a period of time has
elapsed.
The OCiR register value required for a specific tim-
ing application can be calculated using the follow-
ing formula:
When a match is found between the Output Com-
pare register and the free running counter, the out-
put compare function:
– Assigns pins with a programmable value if the
OCIE bit is set
∆t f
* CPU
PRESC
∆ OCiR =
– Sets a flag in the status register
– Generates an interrupt if enabled
Where:
∆t
= Output compare period (in seconds)
= CPU clock frequency (in hertz)
Two 16-bit registers Output Compare Register 1
(OC1R) and Output Compare Register 2 (OC2R)
contain the value to be compared to the counter
register each timer clock cycle.
f
CPU
= Timer prescaler factor (2, 4 or 8 de-
pending on CC[1:0] bits, see Table 14
Clock Control Bits)
PRESC
MS Byte
LS Byte
OCiR
OCiHR
OCiLR
If the timer clock is an external clock, the formula
is:
These registers are readable and writable and are
not affected by the timer hardware. A reset event
changes the OCiR value to 8000h.
∆ OCiR = ∆t f
* EXT
Timing resolution is one count of the free running
Where:
counter: (f
).
CC[1:0]
CPU/
∆t
= Output compare period (in seconds)
= External timer clock frequency (in hertz)
f
EXT
Procedure:
To use the output compare function, select the fol-
lowing in the CR2 register:
Clearing the output compare interrupt request (i.e.
clearing the OCFi bit) is done by:
– Set the OCiE bit if an output is needed then the
OCMPi pin is dedicated to the output compare i
signal.
1. Reading the SR register while the OCFi bit is
set.
2. An access (read or write) to the OCiLR register.
– Select the timer clock (CC[1:0]) (see Table 14
Clock Control Bits).
The following procedure is recommended to pre-
vent the OCFi bit from being set between the time
it is read and the write to the OCiR register:
And select the following in the CR1 register:
– Select the OLVLi bit to applied to the OCMPi pins
after the match occurs.
– Write to the OCiHR register (further compares
are inhibited).
– Set the OCIE bit to generate an interrupt if it is
needed.
– Read the SR register (first step of the clearance
of the OCFi bit, which may be already set).
When a match is found between OCRi register
and CR register:
– Write to the OCiLR register (enables the output
compare function and clears the OCFi bit).
– OCFi bit is set.
61/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Notes:
1. After a processor write cycle to the OCiHR reg-
ister, the output compare function is inhibited
until the OCiLR register is also written.
Forced Compare Output capability
When the FOLVi bit is set by software, the OLVLi
bit is copied to the OCMPi pin. The OLVi bit has to
be toggled in order to toggle the OCMPi pin when
it is enabled (OCiE bit=1). The OCFi bit is then not
set by hardware, and thus no interrupt request is
generated.
2. If the OCiE bit is not set, the OCMPi pin is a
general I/O port and the OLVLi bit will not
appear when a match is found but an interrupt
could be generated if the OCIE bit is set.
3. When the timer clock is f
/2, OCFi and
FOLVLi bits have no effect in both one pulse mode
and PWM mode.
CPU
OCMPi are set while the counter value equals
the OCiR register value (see Figure 42 on page
63). This behaviour is the same in OPM or
PWM mode.
When the timer clock is f
/4, f
/8 or in
CPU
CPU
external clock mode, OCFi and OCMPi are set
while the counter value equals the OCiR regis-
ter value plus 1 (see Figure 43 on page 63).
4. The output compare functions can be used both
for generating external events on the OCMPi
pins even if the input capture mode is also
used.
5. The value in the 16-bit OCiR register and the
OLVi bit should be changed after each suc-
cessful comparison in order to control an output
waveform or establish a new elapsed timeout.
Figure 41. Output Compare Block Diagram
16 BIT FREE RUNNING
OC1E
CC1 CC0
OC2E
COUNTER
(Control Register 2) CR2
16-bit
(Control Register 1) CR1
OUTPUT COMPARE
CIRCUIT
Latch
1
OCIE
FOLV2 FOLV1OLVL2
OLVL1
OCMP1
Pin
16-bit
16-bit
Latch
2
OCMP2
Pin
OC1R Register
OCF1
OCF2
0
0
0
OC2R Register
(Status Register) SR
62/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Figure 42. Output Compare Timing Diagram, f
=f
/2
TIMER
CPU
INTERNAL CPU CLOCK
TIMER CLOCK
COUNTER REGISTER
2ECF 2ED0 2ED1 2ED2
2ED3
2ED4
2ED3
OUTPUT COMPARE REGISTER i (OCRi)
OUTPUT COMPARE FLAG i (OCFi)
OCMPi PIN (OLVLi=1)
Figure 43. Output Compare Timing Diagram, f
=f
/4
TIMER
CPU
INTERNAL CPU CLOCK
TIMER CLOCK
2ECF 2ED0 2ED1 2ED2
2ED3
2ED4
2ED3
COUNTER REGISTER
OUTPUT COMPARE REGISTER i (OCRi)
COMPARE REGISTER i LATCH
OUTPUT COMPARE FLAG i (OCFi)
OCMPi PIN (OLVLi=1)
63/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
11.3.3.5 One Pulse Mode
Clearing the Input Capture interrupt request (i.e.
clearing the ICFi bit) is done in two steps:
One Pulse mode enables the generation of a
pulse when an external event occurs. This mode is
selected via the OPM bit in the CR2 register.
1. Reading the SR register while the ICFi bit is set.
2. An access (read or write) to the ICiLR register.
The one pulse mode uses the Input Capture1
function and the Output Compare1 function.
The OC1R register value required for a specific
timing application can be calculated using the fol-
lowing formula:
Procedure:
t * f
To use one pulse mode:
CPU
- 5
OCiR Value =
1. Load the OC1R register with the value corre-
sponding to the length of the pulse (see the for-
mula in the opposite column).
PRESC
Where:
t
= Pulse period (in seconds)
2. Select the following in the CR1 register:
f
= CPU clock frequency (in hertz)
CPU
– Using the OLVL1 bit, select the level to be ap-
plied to the OCMP1 pin after the pulse.
= Timer prescaler factor (2, 4 or 8 depend-
ing on the CC[1:0] bits, see Table 14
Clock Control Bits)
PRESC
– Using the OLVL2 bit, select the level to be ap-
plied to the OCMP1 pin during the pulse.
If the timer clock is an external clock the formula is:
– Select the edge of the active transition on the
ICAP1 pin with the IEDG1 bit (the ICAP1 pin
must be configured as floating input).
OCiR = t f
-5
* EXT
Where:
t
3. Select the following in the CR2 register:
= Pulse period (in seconds)
– Set the OC1E bit, the OCMP1 pin is then ded-
icated to the Output Compare 1 function.
f
= External timer clock frequency (in hertz)
EXT
– Set the OPM bit.
When the value of the counter is equal to the value
of the contents of the OC1R register, the OLVL1
bit is output on the OCMP1 pin, (See Figure 44).
– Select the timer clock CC[1:0] (see Table 14
Clock Control Bits).
One pulse mode cycle
Notes:
ICR1 = Counter
When
1. The OCF1 bit cannot be set by hardware in one
pulse mode but the OCF2 bit can generate an
Output Compare interrupt.
OCMP1 = OLVL2
event occurs
on ICAP1
Counter is reset
2. When the Pulse Width Modulation (PWM) and
One Pulse Mode (OPM) bits are both set, the
PWM mode is the only active one.
to FFFCh
ICF1 bit is set
3. If OLVL1=OLVL2 a continuous signal will be
seen on the OCMP1 pin.
When
Counter
OCMP1 = OLVL1
= OC1R
4. The ICAP1 pin can not be used to perform input
capture. The ICAP2 pin can be used to perform
input capture (ICF2 can be set and IC2R can be
loaded) but the user must take care that the
counter is reset each time a valid edge occurs
on the ICAP1 pin and ICF1 can also generates
interrupt if ICIE is set.
When a valid event occurs on the ICAP1 pin, the
counter value is loaded in the ICR1 register. The
counter is then initialized to FFFCh, the OLVL2 bit
is output on the OCMP1 pin and the ICF1 bit is set.
5. When one pulse mode is used OC1R is dedi-
cated to this mode. Nevertheless OC2R and
OCF2 can be used to indicate a period of time
has been elapsed but cannot generate an out-
put waveform because the level OLVL2 is dedi-
cated to the one pulse mode.
Because the ICF1 bit is set when an active edge
occurs, an interrupt can be generated if the ICIE
bit is set.
64/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Figure 44. One Pulse Mode Timing Example
2ED3
01F8
IC1R
FFFC FFFD FFFE
2ED0 2ED1 2ED2
2ED3
FFFC FFFD
01F8
COUNTER
ICAP1
OLVL2
OLVL1
OLVL2
OCMP1
compare1
Note: IEDG1=1, OC1R=2ED0h, OLVL1=0, OLVL2=1
Figure 45. Pulse Width Modulation Mode Timing Example
2ED0 2ED1 2ED2
34E2 FFFC
FFFC FFFD FFFE
34E2
COUNTER
OCMP1
OLVL2
OLVL1
OLVL2
compare2
compare1
compare2
Note: OC1R=2ED0h, OC2R=34E2, OLVL1=0, OLVL2= 1
65/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
11.3.3.6 Pulse Width Modulation Mode
Clock Control Bits).
Pulse Width Modulation cycle
Pulse Width Modulation (PWM) mode enables the
generation of a signal with a frequency and pulse
length determined by the value of the OC1R and
OC2R registers.
When
Counter
= OC1R
OCMP1 = OLVL1
Pulse Width Modulation mode uses the complete
Output Compare 1 function plus the OC2R regis-
ter, and so this functionality can not be used when
PWM mode is activated.
OCMP1 = OLVL2
When
In PWM mode, double buffering is implemented on
the output compare registers. Any new values writ-
ten in the OC1R and OC2R registers are loaded in
their respective shadow registers (double buffer)
only at the end of the PWM period (OC2) to avoid
spikes on the PWM output pin (OCMP1). The
shadow registers contain the reference values for
comparison in PWM “double buffering” mode.
Counter
= OC2R
Counter is reset
to FFFCh
ICF1 bit is set
If OLVL1=1 and OLVL2=0 the length of the posi-
tive pulse is the difference between the OC2R and
OC1R registers.
If OLVL1=OLVL2 a continuous signal will be seen
on the OCMP1 pin.
Note: There is a locking mechanism for transfer-
ring the OCiR value to the buffer. After a write to
the OCiHR register, transfer of the new compare
value to the buffer is inhibited until OCiLR is also
written.
The OCiR register value required for a specific tim-
ing application can be calculated using the follow-
ing formula:
t * f
Unlike in Output Compare mode, the compare
function is always enabled in PWM mode.
CPU
- 5
OCiR Value =
PRESC
Where:
t
= Signal or pulse period (in seconds)
= CPU clock frequency (in hertz)
Procedure
f
To use pulse width modulation mode:
CPU
1. Load the OC2R register with the value corre-
sponding to the period of the signal using the
formula in the opposite column.
= Timer prescaler factor (2, 4 or 8 depend-
ing on CC[1:0] bits, see Table 14 Clock
Control Bits)
PRESC
2. Load the OC1R register with the value corre-
sponding to the period of the pulse if (OLVL1=0
and OLVL2=1) using the formula in the oppo-
site column.
If the timer clock is an external clock the formula is:
OCiR = t f
-5
* EXT
Where:
t
3. Select the following in the CR1 register:
= Signal or pulse period (in seconds)
– Using the OLVL1 bit, select the level to be ap-
plied to the OCMP1 pin after a successful
comparison with OC1R register.
f
= External timer clock frequency (in hertz)
EXT
– Using the OLVL2 bit, select the level to be ap-
plied to the OCMP1 pin after a successful
comparison with OC2R register.
The Output Compare 2 event causes the counter
to be initialized to FFFCh (See Figure 45)
Notes:
4. Select the following in the CR2 register:
1. The OCF1 and OCF2 bits cannot be set by
hardware in PWM mode therefore the Output
Compare interrupt is inhibited.
– Set OC1E bit: the OCMP1 pin is then dedicat-
ed to the output compare 1 function.
– Set the PWM bit.
2. The ICF1 bit is set by hardware when the coun-
ter reaches the OC2R value and can produce a
timer interrupt if the ICIE bit is set and the I bit is
cleared.
– Select the timer clock (CC[1:0]) (see Table 14
66/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
3. In PWM mode the ICAP1 pin can not be used
to perform input capture because it is discon-
nected to the timer. The ICAP2 pin can be used
to perform input capture (ICF2 can be set and
IC2R can be loaded) but the user must take
care that the counter is reset each period and
ICF1 can also generates interrupt if ICIE is set.
4. When the Pulse Width Modulation (PWM) and
One Pulse Mode (OPM) bits are both set, the
PWM mode is the only active one.
11.3.4 Low Power Modes
Mode
Description
No effect on 16-bit Timer.
WAIT
Timer interrupts cause the Device to exit from WAIT mode.
16-bit Timer registers are frozen.
In HALT mode, the counter stops counting until Halt mode is exited. Counting resumes from the previous
count when the Device is woken up by an interrupt with “exit from HALT mode” capability or from the counter
reset value when the Device is woken up by a RESET.
HALT
If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is armed. Consequent-
ly, when the Device is woken up by an interrupt with “exit from HALT mode” capability, the ICFi bit is set, and
the counter value present when exiting from HALT mode is captured into the ICiR register.
11.3.5 Interrupts
Enable
Control from
Bit
Exit
Exit
from
Halt
Event
Flag
Interrupt Event
Wait
Yes
Yes
Yes
Yes
Yes
Input Capture 1 event/Counter reset in PWM mode
Input Capture 2 event
ICF1
ICF2
No
No
No
No
No
ICIE
Output Compare 1 event (not available in PWM mode)
Output Compare 2 event (not available in PWM mode)
Timer Overflow event
OCF1
OCF2
TOF
OCIE
TOIE
Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chap-
ter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt
mask in the CC register is reset (RIM instruction).
11.3.6 Summary of Timer modes
AVAILABLE RESOURCES
MODES
Input Capture 1
Input Capture 2
Yes
Output Compare 1 Output Compare 2
Input Capture (1 and/or 2)
Output Compare (1 and/or 2)
One Pulse Mode
Yes
Yes
No
Yes
Yes
No
Yes
Yes
Yes
1)
3)
2)
Not Recommended
Not Recommended
Partially
No
PWM Mode
No
No
1)
2)
3)
See note 4 in Section 11.3.3.5 "One Pulse Mode" on page 64
See note 5 in Section 11.3.3.5 "One Pulse Mode" on page 64
See note 4 in Section 11.3.3.6 "Pulse Width Modulation Mode" on page 66
67/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
11.3.7 Register Description
Bit 4 = FOLV2 Forced Output Compare 2.
This bit is set and cleared by software.
0: No effect on the OCMP2 pin.
1:Forces the OLVL2 bit to be copied to the
OCMP2 pin, if the OC2E bit is set and even if
there is no successful comparison.
Each Timer is associated with three control and
status registers, and with six pairs of data registers
(16-bit values) relating to the two input captures,
the two output compares, the counter and the al-
ternate counter.
Bit 3 = FOLV1 Forced Output Compare 1.
This bit is set and cleared by software.
0: No effect on the OCMP1 pin.
CONTROL REGISTER 1 (CR1)
Read/Write
1: Forces OLVL1 to be copied to the OCMP1 pin, if
the OC1E bit is set and even if there is no suc-
cessful comparison.
Reset Value: 0000 0000 (00h)
7
0
ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1
Bit 2 = OLVL2 Output Level 2.
This bit is copied to the OCMP2 pin whenever a
successful comparison occurs with the OC2R reg-
ister and OCxE is set in the CR2 register. This val-
ue is copied to the OCMP1 pin in One Pulse Mode
and Pulse Width Modulation mode.
Bit 7 = ICIE Input Capture Interrupt Enable.
0: Interrupt is inhibited.
1: A timer interrupt is generated whenever the
ICF1 or ICF2 bit of the SR register is set.
Bit 6 = OCIE Output Compare Interrupt Enable.
0: Interrupt is inhibited.
1: A timer interrupt is generated whenever the
OCF1 or OCF2 bit of the SR register is set.
Bit 1 = IEDG1 Input Edge 1.
This bit determines which type of level transition
on the ICAP1 pin will trigger the capture.
0: A falling edge triggers the capture.
1: A rising edge triggers the capture.
Bit 5 = TOIE Timer Overflow Interrupt Enable.
0: Interrupt is inhibited.
1: A timer interrupt is enabled whenever the TOF
bit of the SR register is set.
Bit 0 = OLVL1 Output Level 1.
The OLVL1 bit is copied to the OCMP1 pin when-
ever a successful comparison occurs with the
OC1R register and the OC1E bit is set in the CR2
register.
68/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
CONTROL REGISTER 2 (CR2)
Read/Write
Bit 4 = PWM Pulse Width Modulation.
0: PWM mode is not active.
1: PWM mode is active, the OCMP1 pin outputs a
programmable cyclic signal; the length of the
pulse depends on the value of OC1R register;
the period depends on the value of OC2R regis-
ter.
Reset Value: 0000 0000 (00h)
7
0
OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG
Bit 3, 2 = CC[1:0] Clock Control.
Bit 7 = OC1E Output Compare 1 Pin Enable.
This bit is used only to output the signal from the
timer on the OCMP1 pin (OLV1 in Output Com-
pare mode, both OLV1 and OLV2 in PWM and
one-pulse mode). Whatever the value of the OC1E
bit, the Output Compare 1 function of the timer re-
mains active.
0: OCMP1 pin alternate function disabled (I/O pin
free for general-purpose I/O).
1: OCMP1 pin alternate function enabled.
The timer clock mode depends on these bits:
Table 14. Clock Control Bits
Timer Clock
fCPU / 4
CC1
CC0
0
0
1
0
1
0
fCPU / 2
fCPU / 8
External Clock (where
available)
1
1
Bit 6 = OC2E Output Compare 2 Pin Enable.
This bit is used only to output the signal from the
timer on the OCMP2 pin (OLV2 in Output Com-
pare mode). Whatever the value of the OC2E bit,
the Output Compare 2 function of the timer re-
mains active.
0: OCMP2 pin alternate function disabled (I/O pin
free for general-purpose I/O).
1: OCMP2 pin alternate function enabled.
Note: If the external clock pin is not available, pro-
gramming the external clock configuration stops
the counter.
Bit 1 = IEDG2 Input Edge 2.
This bit determines which type of level transition
on the ICAP2 pin will trigger the capture.
0: A falling edge triggers the capture.
1: A rising edge triggers the capture.
Bit 5 = OPM One Pulse Mode.
0: One Pulse Mode is not active.
1: One Pulse Mode is active, the ICAP1 pin can be
used to trigger one pulse on the OCMP1 pin; the
active transition is given by the IEDG1 bit. The
length of the generated pulse depends on the
contents of the OC1R register.
Bit 0 = EXEDG External Clock Edge.
This bit determines which type of level transition
on the external clock pin EXTCLK will trigger the
counter register.
0: A falling edge triggers the counter register.
1: A rising edge triggers the counter register.
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ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
CONTROL/STATUS REGISTER (CSR)
Read Only
Note: Reading or writing the ACLR register does
not clear TOF.
Reset Value: 0000 0000 (00h)
The three least significant bits are not used.
7
Bit 4 = ICF2 Input Capture Flag 2.
0: No input capture (reset value).
0
0
1: An input capture has occurred on the ICAP2
pin. To clear this bit, first read the SR register,
then read or write the low byte of the IC2R
(IC2LR) register.
ICF1 OCF1 TOF ICF2 OCF2 TIMD
0
Bit 7 = ICF1 Input Capture Flag 1.
Bit 3 = OCF2 Output Compare Flag 2.
0: No match (reset value).
1: The content of the free running counter has
matched the content of the OC2R register. To
clear this bit, first read the SR register, then read
or write the low byte of the OC2R (OC2LR) reg-
ister.
0: No input capture (reset value).
1: An input capture has occurred on the ICAP1 pin
or the counter has reached the OC2R value in
PWM mode. To clear this bit, first read the SR
register, then read or write the low byte of the
IC1R (IC1LR) register.
Bit 6 = OCF1 Output Compare Flag 1.
0: No match (reset value).
1: The content of the free running counter has
matched the content of the OC1R register. To
clear this bit, first read the SR register, then read
or write the low byte of the OC1R (OC1LR) reg-
ister.
Bit 2 = TIMD Timer disable.
This bit is set and cleared by software. When set, it
freezes the timer prescaler and counter and disa-
bled the output functions (OCMP1 and OCMP2
pins) to reduce power consumption. Access to the
timer registers is still available, allowing the timer
configuration to be changed while it is disabled.
0: Timer enabled
Bit 5 = TOF Timer Overflow Flag.
0: No timer overflow (reset value).
1: Timer prescaler, counter and outputs disabled
1:The free running counter rolled over from FFFFh
to 0000h. To clear this bit, first read the SR reg-
ister, then read or write the low byte of the CR
(CLR) register.
Bits 1:0 = Reserved, must be kept cleared.
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ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
INPUT CAPTURE 1 HIGH REGISTER (IC1HR)
OUTPUT COMPARE
(OC1HR)
1
HIGH REGISTER
Read Only
Reset Value: Undefined
Read/Write
Reset Value: 1000 0000 (80h)
This is an 8-bit read only register that contains the
high part of the counter value (transferred by the
input capture 1 event).
This is an 8-bit register that contains the high part
of the value to be compared to the CHR register.
7
0
7
0
MSB
LSB
MSB
LSB
INPUT CAPTURE 1 LOW REGISTER (IC1LR)
OUTPUT COMPARE
(OC1LR)
1
LOW REGISTER
Read Only
Reset Value: Undefined
Read/Write
Reset Value: 0000 0000 (00h)
This is an 8-bit read only register that contains the
low part of the counter value (transferred by the in-
put capture 1 event).
This is an 8-bit register that contains the low part of
the value to be compared to the CLR register.
7
0
7
0
MSB
LSB
MSB
LSB
71/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
OUTPUT COMPARE
(OC2HR)
2
HIGH REGISTER
ALTERNATE COUNTER HIGH REGISTER
(ACHR)
Read/Write
Reset Value: 1000 0000 (80h)
Read Only
Reset Value: 1111 1111 (FFh)
This is an 8-bit register that contains the high part
of the value to be compared to the CHR register.
This is an 8-bit register that contains the high part
of the counter value.
7
0
7
0
MSB
LSB
MSB
LSB
OUTPUT COMPARE
(OC2LR)
2
LOW REGISTER
ALTERNATE COUNTER LOW REGISTER
(ACLR)
Read/Write
Reset Value: 0000 0000 (00h)
Read Only
Reset Value: 1111 1100 (FCh)
This is an 8-bit register that contains the low part of
the value to be compared to the CLR register.
This is an 8-bit register that contains the low part of
the counter value. A write to this register resets the
counter. An access to this register after an access
to CSR register does not clear the TOF bit in the
CSR register.
7
0
MSB
LSB
7
0
COUNTER HIGH REGISTER (CHR)
MSB
LSB
Read Only
Reset Value: 1111 1111 (FFh)
INPUT CAPTURE 2 HIGH REGISTER (IC2HR)
This is an 8-bit register that contains the high part
of the counter value.
Read Only
Reset Value: Undefined
7
0
This is an 8-bit read only register that contains the
high part of the counter value (transferred by the
Input Capture 2 event).
MSB
LSB
7
0
MSB
LSB
COUNTER LOW REGISTER (CLR)
Read Only
Reset Value: 1111 1100 (FCh)
This is an 8-bit register that contains the low part of
the counter value. A write to this register resets the
counter. An access to this register after accessing
the CSR register clears the TOF bit.
INPUT CAPTURE 2 LOW REGISTER (IC2LR)
Read Only
Reset Value: Undefined
This is an 8-bit read only register that contains the
low part of the counter value (transferred by the In-
put Capture 2 event).
7
0
MSB
LSB
7
0
MSB
LSB
72/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Table 15. 16-Bit Timer Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
Timer A: 32 CR1
ICIE
0
OCIE
0
TOIE
0
FOLV2
0
FOLV1
0
OLVL2
0
IEDG1
0
OLVL1
0
Timer B: 42 Reset Value
Timer A: 31 CR2
OC1E
0
OC2E
0
OPM
0
PWM
0
CC1
0
CC0
0
IEDG2
0
EXEDG
0
Timer B: 41 Reset Value
Timer A: 33 CSR
ICF1
x
OCF1
x
TOF
x
ICF2
x
OCF2
x
TIMD
0
-
-
Timer B: 43 Reset Value
x
x
Timer A: 34 IC1HR
MSB
-
LSB
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Timer B: 44 Reset Value
Timer A: 35 IC1LR
MSB
-
LSB
-
Timer B: 45 Reset Value
Timer A: 36 OC1HR
MSB
-
LSB
-
Timer B: 46 Reset Value
Timer A: 37 OC1LR
MSB
-
LSB
-
Timer B: 47 Reset Value
Timer A: 3E OC2HR
MSB
-
LSB
-
Timer B: 4E Reset Value
Timer A: 3F OC2LR
MSB
-
LSB
-
Timer B: 4F Reset Value
Timer A: 38 CHR
MSB
1
LSB
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
Timer B: 48 Reset Value
Timer A: 39 CLR
MSB
1
LSB
0
Timer B: 49 Reset Value
Timer A: 3A ACHR
MSB
1
LSB
1
Timer B: 4A Reset Value
Timer A: 3B ACLR
MSB
1
LSB
0
1
-
1
-
1
-
1
-
1
-
0
-
Timer B: 4B Reset Value
Timer A: 3C ICHR2
MSB
-
LSB
-
Timer B: 4C Reset Value
Timer A: 3D ICLR2
MSB
-
LSB
-
-
-
-
-
-
-
Timer B: 4D Reset Value
73/172
ST72260Gx, ST72262Gx, ST72264Gx
16-BIT TIMER (Cont’d)
Related Documentation
AN1041: Using ST7 PWM signal to generate ana-
log input (sinusoid)
AN 973: SCI software communications using 16-
bit timer
AN1046: UART emulation software
AN 974: Real Time Clock with ST7 Timer Output
Compare
AN1078: PWM duty cycle switch implementing
true 0 or 100 per cent duty cycle
AN 976: Driving a buzzer through the ST7 Timer
PWM function
AN1504: Starting a PWM signal directly at high
level using the ST7 16-Bit timer
74/172
ST72260Gx, ST72262Gx, ST72264Gx
11.4.3 General Description
11.4 SERIAL PERIPHERAL INTERFACE (SPI)
11.4.1 Introduction
The Serial Peripheral Interface (SPI) allows full-
duplex, synchronous, serial communication with
external devices. An SPI system may consist of a
master and one or more slaves or a system in
which devices may be either masters or slaves.
Figure 46 shows the serial peripheral interface
(SPI) block diagram. There are 3 registers:
– SPI Control Register (SPICR)
– SPI Control/Status Register (SPICSR)
– SPI Data Register (SPIDR)
11.4.2 Main Features
■ Full duplex synchronous transfers (on 3 lines)
■ Simplex synchronous transfers (on 2 lines)
■ Master or slave operation
The SPI is connected to external devices through
4 pins:
– MISO: Master In / Slave Out data
– MOSI: Master Out / Slave In data
■ Six master mode frequencies (f
/4 max.)
CPU
■ f
/2 max. slave mode frequency (see note)
CPU
– SCK: Serial Clock out by SPI masters and in-
put by SPI slaves
■ SS Management by software or hardware
■ Programmable clock polarity and phase
■ End of transfer interrupt flag
– SS: Slave select:
This input signal acts as a ‘chip select’ to let
the SPI master communicate with slaves indi-
vidually and to avoid contention on the data
lines. Slave SS inputs can be driven by stand-
ard I/O ports on the master Device.
■ Write collision, Master Mode Fault and Overrun
flags
Note: In slave mode, continuous transmission is
not possible at maximum frequency due to the
software overhead for clearing status flags and to
initiate the next transmission sequence.
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL PERIPHERAL INTERFACE (Cont’d)
Figure 46. Serial Peripheral Interface Block Diagram
Data/Address Bus
Read
SPIDR
Interrupt
request
Read Buffer
MOSI
7
0
SPICSR
MISO
8-Bit Shift Register
SPIF WCOL OVR MODF
0
SOD SSM SSI
Write
SOD
bit
1
SS
SPI
STATE
0
SCK
CONTROL
7
0
SPICR
MSTR
SPR0
SPIE SPE SPR2
CPOL CPHA SPR1
MASTER
CONTROL
SERIAL CLOCK
GENERATOR
SS
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.1 Functional Description
sponds by sending data to the master device via
the MISO pin. This implies full duplex communica-
tion with both data out and data in synchronized
with the same clock signal (which is provided by
the master device via the SCK pin).
A basic example of interconnections between a
single master and a single slave is illustrated in
Figure 47.
The MOSI pins are connected together and the
MISO pins are connected together. In this way
data is transferred serially between master and
slave (most significant bit first).
To use a single data line, the MISO and MOSI pins
must be connected at each node ( in this case only
simplex communication is possible).
Four possible data/clock timing relationships may
be chosen (see Figure 50) but master and slave
must be programmed with the same timing mode.
The communication is always initiated by the mas-
ter. When the master device transmits data to a
slave device via MOSI pin, the slave device re-
Figure 47. Single Master/ Single Slave Application
SLAVE
MASTER
MSBit
LSBit
MSBit
LSBit
MISO
MOSI
MISO
MOSI
8-BIT SHIFT REGISTER
8-BIT SHIFT REGISTER
SPI
CLOCK
GENERATOR
SCK
SS
SCK
SS
+5V
Not used if SS is managed
by software
77/172
ST72260Gx, ST72262Gx, ST72264Gx
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.2 Slave Select Management
In Slave Mode:
As an alternative to using the SS pin to control the
Slave Select signal, the application can choose to
manage the Slave Select signal by software. This
is configured by the SSM bit in the SPICSR regis-
ter (see Figure 49)
There are two cases depending on the data/clock
timing relationship (see Figure 48):
If CPHA=1 (data latched on 2nd clock edge):
– SS internal must be held low during the entire
transmission. This implies that in single slave
applications the SS pin either can be tied to
In software management, the external SS pin is
free for other application uses and the internal SS
signal level is driven by writing to the SSI bit in the
SPICSR register.
V
, or made free for standard I/O by manag-
SS
ing the SS function by software (SSM= 1 and
SSI=0 in the in the SPICSR register)
If CPHA=0 (data latched on 1st clock edge):
In Master mode:
– SS internal must be held low during byte
transmission and pulled high between each
byte to allow the slave to write to the shift reg-
ister. If SS is not pulled high, a Write Collision
error will occur when the slave writes to the
shift register (see Section 11.4.5.3).
– SS internal must be held high continuously
Figure 48. Generic SS Timing Diagram
Byte 3
Byte 2
MOSI/MISO
Master SS
Byte 1
Slave SS
(if CPHA=0)
Slave SS
(if CPHA=1)
Figure 49. Hardware/Software Slave Select Management
SSM bit
SSI bit
1
0
SS internal
SS external pin
78/172
ST72260Gx, ST72262Gx, ST72264Gx
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.3 Master Mode Operation
Note: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR reg-
ister is read.
In master mode, the serial clock is output on the
SCK pin. The clock frequency, polarity and phase
are configured by software (refer to the description
of the SPICSR register).
11.4.3.5 Slave Mode Operation
In slave mode, the serial clock is received on the
SCK pin from the master device.
Note: The idle state of SCK must correspond to
the polarity selected in the SPICSR register (by
pulling up SCK if CPOL=1 or pulling down SCK if
CPOL=0).
To operate the SPI in slave mode:
1. Write to the SPICSR register to perform the fol-
lowing actions:
To operate the SPI in master mode, perform the
following steps in order (if the SPICSR register is
not written first, the SPICR register setting (MSTR
bit ) may be not taken into account):
– Select the clock polarity and clock phase by
configuring the CPOL and CPHA bits (see
Figure 50).
Note: The slave must have the same CPOL
and CPHA settings as the master.
1. Write to the SPICR register:
– Manage the SS pin as described in Section
11.4.3.2 and Figure 48. If CPHA=1 SS must
be held low continuously. If CPHA=0 SS must
be held low during byte transmission and
pulled up between each byte to let the slave
write in the shift register.
– Select the clock frequency by configuring the
SPR[2:0] bits.
– Select the clock polarity and clock phase by
configuring the CPOL and CPHA bits. Figure
50 shows the four possible configurations.
Note: The slave must have the same CPOL
and CPHA settings as the master.
2. Write to the SPICR register to clear the MSTR
bit and set the SPE bit to enable the SPI I/O
functions.
2. Write to the SPICSR register:
– Either set the SSM bit and set the SSI bit or
clear the SSM bit and tie the SS pin high for
the complete byte transmit sequence.
11.4.3.6 Slave Mode Transmit Sequence
When software writes to the SPIDR register, the
data byte is loaded into the 8-bit shift register and
then shifted out serially to the MISO pin most sig-
nificant bit first.
3. Write to the SPICR register:
– Set the MSTR and SPE bits
Note: MSTR and SPE bits remain set only if
SS is high).
The transmit sequence begins when the slave de-
vice receives the clock signal and the most signifi-
cant bit of the data on its MOSI pin.
The transmit sequence begins when software
writes a byte in the SPIDR register.
11.4.3.4 Master Mode Transmit Sequence
When data transfer is complete:
– The SPIF bit is set by hardware
When software writes to the SPIDR register, the
data byte is loaded into the 8-bit shift register and
then shifted out serially to the MOSI pin most sig-
nificant bit first.
– An interrupt request is generated if SPIE bit is
set and interrupt mask in the CCR register is
cleared.
When data transfer is complete:
– The SPIF bit is set by hardware
Clearing the SPIF bit is performed by the following
software sequence:
– An interrupt request is generated if the SPIE
bit is set and the interrupt mask in the CCR
register is cleared.
1. An access to the SPICSR register while the
SPIF bit is set.
2. A write or a read to the SPIDR register.
Clearing the SPIF bit is performed by the following
software sequence:
Notes: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR reg-
ister is read.
1. An access to the SPICSR register while the
SPIF bit is set
The SPIF bit can be cleared during a second
transmission; however, it must be cleared before
the second SPIF bit in order to prevent an Overrun
condition (see Section 11.4.5.2).
2. A read to the SPIDR register.
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.4 Clock Phase and Clock Polarity
Figure 50, shows an SPI transfer with the four
combinations of the CPHA and CPOL bits. The di-
agram may be interpreted as a master or slave
timing diagram where the SCK pin, the MISO pin,
the MOSI pin are directly connected between the
master and the slave device.
Four possible timing relationships may be chosen
by software, using the CPOL and CPHA bits (See
Figure 50).
Note: The idle state of SCK must correspond to
the polarity selected in the SPICSR register (by
pulling up SCK if CPOL=1 or pulling down SCK if
CPOL=0).
Note: If CPOL is changed at the communication
byte boundaries, the SPI must be disabled by re-
setting the SPE bit.
The combination of the CPOL clock polarity and
CPHA (clock phase) bits selects the data capture
clock edge
Figure 50. Data Clock Timing Diagram
CPHA =1
SCK
(CPOL = 1)
SCK
(CPOL = 0)
Bit 4
Bit 4
Bit3
Bit3
Bit 2
Bit 2
Bit 1
Bit 1
LSBit
LSBit
MSBit
MSBit
Bit 6
Bit 6
Bit 5
Bit 5
MISO
(from master)
MOSI
(from slave)
SS
(to slave)
CAPTURE STROBE
CPHA =0
SCK
(CPOL = 1)
SCK
(CPOL = 0)
Bit 4
Bit 4
Bit3
Bit 2
Bit 2
Bit 1
Bit 1
LSBit
LSBit
MISO
(from master)
MSBit
Bit 6
Bit 6
Bit 5
Bit 5
Bit3
MOSI
(from slave)
MSBit
SS
(to slave)
CAPTURE STROBE
Note: This figure should not be used as a replacement for parametric information.
Refer to the Electrical Characteristics chapter.
80/172
ST72260Gx, ST72262Gx, ST72264Gx
11.4.5.2 Overrun Condition (OVR)
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.5 Error Flags
11.4.5.1 Master Mode Fault (MODF)
An overrun condition occurs, when the master de-
vice has sent a data byte and the slave device has
not cleared the SPIF bit issued from the previously
transmitted byte.
Master mode fault occurs when the master device
has its SS pin pulled low.
When a Master mode fault occurs:
When an Overrun occurs:
– The MODF bit is set and an SPI interrupt re-
quest is generated if the SPIE bit is set.
– The OVR bit is set and an interrupt request is
generated if the SPIE bit is set.
– The SPE bit is reset. This blocks all output
from the Device and disables the SPI periph-
eral.
In this case, the receiver buffer contains the byte
sent after the SPIF bit was last cleared. A read to
the SPIDR register returns this byte. All other
bytes are lost.
– The MSTR bit is reset, thus forcing the Device
into slave mode.
The OVR bit is cleared by reading the SPICSR
register.
Clearing the MODF bit is done through a software
sequence:
11.4.5.3 Write Collision Error (WCOL)
1. A read access to the SPICSR register while the
MODF bit is set.
A write collision occurs when the software tries to
write to the SPIDR register while a data transfer is
taking place with an external device. When this
happens, the transfer continues uninterrupted;
and the software write will be unsuccessful.
2. A write to the SPICR register.
Notes: To avoid any conflicts in an application
with multiple slaves, the SS pin must be pulled
high during the MODF bit clearing sequence. The
SPE and MSTR bits may be restored to their orig-
inal state during or after this clearing sequence.
Write collisions can occur both in master and slave
mode. See also Section 11.4.3.2 "Slave Select
Management" on page 78.
Hardware does not allow the user to set the SPE
and MSTR bits while the MODF bit is set except in
the MODF bit clearing sequence.
Note: a "read collision" will never occur since the
received data byte is placed in a buffer in which
access is always synchronous with the CPU oper-
ation.
In a slave device, the MODF bit can not be set, but
in a multi master configuration the Device can be in
slave mode with the MODF bit set.
The WCOL bit in the SPICSR register is set if a
write collision occurs.
The MODF bit indicates that there might have
been a multi-master conflict and allows software to
handle this using an interrupt routine and either
perform to a reset or return to an application de-
fault state.
No SPI interrupt is generated when the WCOL bit
is set (the WCOL bit is a status flag only).
Clearing the WCOL bit is done through a software
sequence (see Figure 51).
Figure 51. Clearing the WCOL bit (Write Collision Flag) Software Sequence
Clearing sequence after SPIF = 1 (end of a data byte transfer)
Read SPICSR
1st Step
RESULT
SPIF =0
WCOL=0
2nd Step
Read SPIDR
Clearing sequence before SPIF = 1 (during a data byte transfer)
Read SPICSR
1st Step
Note: Writing to the SPIDR regis-
ter instead of reading it does not
reset the WCOL bit
RESULT
2nd Step
Read SPIDR
WCOL=0
81/172
ST72260Gx, ST72262Gx, ST72264Gx
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.5.4 Single Master and Multimaster
Configurations
For more security, the slave device may respond
to the master with the received data byte. Then the
master will receive the previous byte back from the
slave device if all MISO and MOSI pins are con-
nected and the slave has not written to its SPIDR
register.
There are two types of SPI systems:
– Single Master System
– Multimaster System
Other transmission security methods can use
ports for handshake lines or data bytes with com-
mand fields.
Single Master System
A typical single master system may be configured,
using a device as the master and four devices as
slaves (see Figure 52).
Multi-Master System
A multi-master system may also be configured by
the user. Transfer of master control could be im-
plemented using a handshake method through the
I/O ports or by an exchange of code messages
through the serial peripheral interface system.
The master device selects the individual slave de-
vices by using four pins of a parallel port to control
the four SS pins of the slave devices.
The SS pins are pulled high during reset since the
master device ports will be forced to be inputs at
that time, thus disabling the slave devices.
The multi-master system is principally handled by
the MSTR bit in the SPICR register and the MODF
bit in the SPICSR register.
Note: To prevent a bus conflict on the MISO line
the master allows only one active slave device
during a transmission.
Figure 52. Single Master / Multiple Slave Configuration
SS
SS
SS
SS
SCK
SCK
Slave
SCK
Slave
SCK
Slave
Slave
Device
Device
Device
Device
MOSI MISO
MOSI MISO
MOSI MISO
MOSI MISO
MOSI MISO
SCK
Master
Device
5V
SS
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SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.6 Low Power Modes
SS pin or the SSI bit in the SPICSR register) is low
when the Device enters Halt mode. So if Slave se-
lection is configured as external (see Section
11.4.3.2), make sure the master drives a low level
on the SS pin when the slave enters Halt mode.
Mode
Description
No effect on SPI.
WAIT
SPI interrupt events cause the Device to exit
from WAIT mode.
11.4.7 Interrupts
SPI registers are frozen.
In HALT mode, the SPI is inactive. SPI oper-
ation resumes when the Device is woken up
by an interrupt with “exit from HALT mode”
capability. The data received is subsequently
read from the SPIDR register when the soft-
ware is running (interrupt vector fetching). If
several data are received before the wake-
up event, then an overrun error is generated.
This error can be detected after the fetch of
the interrupt routine that woke up the Device.
Enable
Control from
Bit
Exit
Exit
from
Halt
Event
Flag
Interrupt Event
Wait
SPI End of Trans-
fer Event
HALT
SPIF
Yes
Yes
Master Mode
Fault Event
SPIE
MODF
OVR
Yes
Yes
No
No
Overrun Error
Note: The SPI interrupt events are connected to
the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding
Enable Control Bit is set and the interrupt mask in
the CC register is reset (RIM instruction).
11.4.6.1 Using the SPI to wake-up the Device
from Halt mode
In slave configuration, the SPI is able to wake-up
the Device from HALT mode through a SPIF inter-
rupt. The data received is subsequently read from
the SPIDR register when the software is running
(interrupt vector fetch). If multiple data transfers
have been performed before software clears the
SPIF bit, then the OVR bit is set by hardware.
Note: When waking up from Halt mode, if the SPI
remains in Slave mode, it is recommended to per-
form an extra communications cycle to bring the
SPI from Halt mode state to normal state. If the
SPI exits from Slave mode, it returns to normal
state immediately.
Caution: The SPI can wake-up the Device from
Halt mode only if the Slave Select signal (external
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SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.8 Register Description
CONTROL REGISTER (SPICR)
Read/Write
Bit 3 = CPOL Clock Polarity.
This bit is set and cleared by software. This bit de-
termines the idle state of the serial Clock. The
CPOL bit affects both the master and slave
modes.
Reset Value: 0000 xxxx (0xh)
7
0
SPIE SPE SPR2 MSTR CPOL CPHA SPR1 SPR0
0: SCK pin has a low level idle state
1: SCK pin has a high level idle state
Note: If CPOL is changed at the communication
byte boundaries, the SPI must be disabled by re-
setting the SPE bit.
Bit 7 = SPIE Serial Peripheral Interrupt Enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SPI interrupt is generated whenever an End
of Transfer event, Master Mode Fault or Over-
run error occurs (SPIF=1, MODF=1 or OVR=1
in the SPICSR register)
Bit 2 = CPHA Clock Phase.
This bit is set and cleared by software.
0: The first clock transition is the first data capture
edge.
1: The second clock transition is the first capture
edge.
Bit 6 = SPE Serial Peripheral Output Enable.
This bit is set and cleared by software. It is also
cleared by hardware when, in master mode, SS=0
(see Section 11.4.5.1 "Master Mode Fault
(MODF)" on page 81). The SPE bit is cleared by
reset, so the SPI peripheral is not initially connect-
ed to the external pins.
Note: The slave must have the same CPOL and
CPHA settings as the master.
Bits 1:0 = SPR[1:0] Serial Clock Frequency.
These bits are set and cleared by software. Used
with the SPR2 bit, they select the baud rate of the
SPI serial clock SCK output by the SPI in master
mode.
0: I/O pins free for general purpose I/O
1: SPI I/O pin alternate functions enabled
Note: These 2 bits have no effect in slave mode.
Bit 5 = SPR2 Divider Enable.
This bit is set and cleared by software and is
cleared by reset. It is used with the SPR[1:0] bits to
set the baud rate. Refer to Table 16 SPI Master
mode SCK Frequency.
Table 16. SPI Master mode SCK Frequency
Serial Clock
SPR2 SPR1 SPR0
f
f
/4
/8
1
0
0
1
0
0
0
0
0
1
1
1
0
0
1
0
0
1
CPU
CPU
0: Divider by 2 enabled
1: Divider by 2 disabled
f
f
f
/16
/32
/64
CPU
CPU
CPU
Note: This bit has no effect in slave mode.
Bit 4 = MSTR Master Mode.
This bit is set and cleared by software. It is also
cleared by hardware when, in master mode, SS=0
(see Section 11.4.5.1 "Master Mode Fault
(MODF)" on page 81).
f
/128
CPU
0: Slave mode
1: Master mode. The function of the SCK pin
changes from an input to an output and the func-
tions of the MISO and MOSI pins are reversed.
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SERIAL PERIPHERAL INTERFACE (Cont’d)
CONTROL/STATUS REGISTER (SPICSR)
Read/Write (some bits Read Only)
Reset Value: 0000 0000 (00h)
Bit 2 = SOD SPI Output Disable.
This bit is set and cleared by software. When set, it
disables the alternate function of the SPI output
(MOSI in master mode / MISO in slave mode)
0: SPI output enabled (if SPE=1)
7
0
SPIF
WCOL OVR MODF
-
SOD SSM SSI
1: SPI output disabled
Bit 7 = SPIF Serial Peripheral Data Transfer Flag
(Read only).
Bit 1 = SSM SS Management.
This bit is set and cleared by software. When set, it
disables the alternate function of the SPI SS pin
and uses the SSI bit value instead. See Section
11.4.3.2 "Slave Select Management" on page 78.
0: Hardware management (SS managed by exter-
nal pin)
This bit is set by hardware when a transfer has
been completed. An interrupt is generated if
SPIE=1 in the SPICR register. It is cleared by a
software sequence (an access to the SPICSR
register followed by a write or a read to the
SPIDR register).
1: Software management (internal SS signal con-
trolled by SSI bit. External SS pin free for gener-
al-purpose I/O)
0: Data transfer is in progress or the flag has been
cleared.
1: Data transfer between the Device and an exter-
nal device has been completed.
Bit 0 = SSI SS Internal Mode.
Note: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR reg-
ister is read.
This bit is set and cleared by software. It acts as a
‘chip select’ by controlling the level of the SS slave
select signal when the SSM bit is set.
0 : Slave selected
Bit 6 = WCOL Write Collision status (Read only).
This bit is set by hardware when a write to the
SPIDR register is done during a transmit se-
quence. It is cleared by a software sequence (see
Figure 51).
0: No write collision occurred
1: A write collision has been detected
1 : Slave deselected
DATA I/O REGISTER (SPIDR)
Read/Write
Reset Value: Undefined
7
0
D7
D6
D5
D4
D3
D2
D1
D0
Bit 5 = OVR SPI Overrun error (Read only).
This bit is set by hardware when the byte currently
being received in the shift register is ready to be
transferred into the SPIDR register while SPIF = 1
(See Section 11.4.5.2). An interrupt is generated if
SPIE = 1 in the SPICR register. The OVR bit is
cleared by software reading the SPICSR register.
0: No overrun error
The SPIDR register is used to transmit and receive
data on the serial bus. In a master device, a write
to this register will initiate transmission/reception
of another byte.
Notes: During the last clock cycle the SPIF bit is
set, a copy of the received data byte in the shift
register is moved to a buffer. When the user reads
the serial peripheral data I/O register, the buffer is
actually being read.
1: Overrun error detected
Bit 4 = MODF Mode Fault flag (Read only).
This bit is set by hardware when the SS pin is
pulled low in master mode (see Section 11.4.5.1
"Master Mode Fault (MODF)" on page 81). An SPI
interrupt can be generated if SPIE=1 in the SPICR
register. This bit is cleared by a software sequence
(An access to the SPICSR register while MODF=1
followed by a write to the SPICR register).
While the SPIF bit is set, all writes to the SPIDR
register are inhibited until the SPICSR register is
read.
Warning: A write to the SPIDR register places
data directly into the shift register for transmission.
A read to the SPIDR register returns the value lo-
cated in the buffer and not the content of the shift
register (see Figure 46).
0: No master mode fault detected
1: A fault in master mode has been detected
Bit 3 = Reserved, must be kept cleared.
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SERIAL PERIPHERAL INTERFACE (Cont’d)
Table 17. SPI Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
SPIDR
Reset Value
MSB
x
LSB
x
0021h
0022h
0023h
x
x
x
x
x
x
SPICR
Reset Value
SPIE
0
SPE
0
SPR2
0
MSTR
0
CPOL
x
CPHA
x
SPR1
x
SPR0
x
SPICSR
Reset Value
SPIF
0
WCOL
0
OR
0
MODF
0
SOD
0
SSM
0
SSI
0
0
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ST72260Gx, ST72262Gx, ST72264Gx
11.5.3 General Description
11.5 SERIAL COMMUNICATIONS INTERFACE (SCI)
11.5.1 Introduction
The Serial Communications Interface (SCI) offers
a flexible means of full-duplex data exchange with
external equipment requiring an industry standard
NRZ asynchronous serial data format. The SCI of-
fers a very wide range of baud rates using two
baud rate generator systems.
The interface is externally connected to another
device by two pins (see Figure 54):
– TDO: Transmit Data Output. When the transmit-
ter and the receiver are disabled, the output pin
returns to its I/O port configuration. When the
transmitter and/or the receiver are enabled and
nothing is to be transmitted, the TDO pin is at
high level.
11.5.2 Main Features
■ Full duplex, asynchronous communications
■ NRZ standard format (Mark/Space)
■ Dual baud rate generator systems
– RDI: Receive Data Input is the serial data input.
Oversampling techniques are used for data re-
covery by discriminating between valid incoming
data and noise.
■ Independently programmable transmit and
receive baud rates up to 500K baud.
Through these pins, serial data is transmitted and
received as frames comprising:
■ Programmable data word length (8 or 9 bits)
■ Receive buffer full, Transmit buffer empty and
– An Idle Line prior to transmission or reception
– A start bit
End of Transmission flags
■ Two receiver wake-up modes:
– Address bit (MSB)
– A data word (8 or 9 bits) least significant bit first
– A Stop bit indicating that the frame is complete.
Thisinterfaceusestwotypesofbaudrategenerator:
– Idle line
■ Mutingfunctionformultiprocessorconfigurations
– A conventional type for commonly-used baud
rates,
■ Separate enable bits for Transmitter and
Receiver
– An extended type with a prescaler offering a very
wide range of baud rates even with non-standard
oscillator frequencies.
■ Four error detection flags:
– Overrun error
– Noise error
– Frame error
– Parity error
■ Five interrupt sources with flags:
– Transmit data register empty
– Transmission complete
– Receive data register full
– Idle line received
– Overrun error detected
■ Parity control:
– Transmits parity bit
– Checks parity of received data byte
■ Reduced power consumption mode
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Figure 53. SCI Block Diagram
Write
Read
(DATA REGISTER) DR
Received Data Register (RDR)
Received Shift Register
Transmit Data Register (TDR)
TDO
Transmit Shift Register
RDI
CR1
R8 T8 SCID
M WAKE PCE PS PIE
WAKE
UP
TRANSMIT
CONTROL
RECEIVER
CLOCK
RECEIVER
CONTROL
UNIT
CR2
SR
TIE TCIE RIE ILIE TE RE RWU SBK
TDRE TC RDRF IDLE OR NF FE
PE
SCI
INTERRUPT
CONTROL
TRANSMITTER
CLOCK
TRANSMITTER RATE
CONTROL
f
CPU
/PR
/16
BRR
SCP1
SCT2
SCT1SCT0SCR2 SCR1SCR0
SCP0
RECEIVER RATE
CONTROL
CONVENTIONAL BAUD RATE GENERATOR
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ST72260Gx, ST72262Gx, ST72264Gx
11.5.4.1 Serial Data Format
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4 Functional Description
The block diagram of the Serial Control Interface,
is shown in Figure 53. It contains 6 dedicated reg-
isters:
Word length may be selected as being either 8 or 9
bits by programming the M bit in the SCICR1 reg-
ister (see Figure 53).
– Two control registers (SCICR1 & SCICR2)
– A status register (SCISR)
The TDO pin is in low state during the start bit.
The TDO pin is in high state during the stop bit.
– A baud rate register (SCIBRR)
An Idle character is interpreted as an entire frame
of “1”s followed by the start bit of the next frame
which contains data.
– An extended prescaler receiver register (SCIER-
PR)
A Break character is interpreted on receiving “0”s
for some multiple of the frame period. At the end of
the last break frame the transmitter inserts an ex-
tra “1” bit to acknowledge the start bit.
– An extended prescaler transmitter register (SCI-
ETPR)
Refer to the register descriptions in Section
11.5.7for the definitions of each bit.
Transmission and reception are driven by their
own baud rate generator.
Figure 54. Word Length Programming
9-bit Word length (M bit is set)
Possible
Next Data Frame
Parity
Data Frame
Start
Bit
Next
Start
Bit
Stop
Bit
Bit2
Bit6
Bit3
Bit4
Bit5
Bit7
Bit8
Bit0 Bit1
Bit
Start
Bit
Idle Frame
Start
Bit
Extra
’1’
Break Frame
8-bit Word length (M bit is reset)
Possible
Parity
Next Data Frame
Data Frame
Bit
Next
Start
Bit
Start
Bit
Stop
Bit
Bit2
Bit1
Bit3
Bit4
Bit5
Bit6
Bit0
Bit7
Start
Bit
Idle Frame
Start
Bit
Extra
’1’
Break Frame
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.2 Transmitter
When a frame transmission is complete (after the
stop bit or after the break frame) the TC bit is set
and an interrupt is generated if the TCIE is set and
the I bit is cleared in the CCR register.
The transmitter can send data words of either 8 or
9 bits depending on the M bit status. When the M
bit is set, word length is 9 bits and the 9th bit (the
MSB) has to be stored in the T8 bit in the SCICR1
register.
Clearing the TC bit is performed by the following
software sequence:
1. An access to the SCISR register
2. A write to the SCIDR register
Character Transmission
During an SCI transmission, data shifts out least
significant bit first on the TDO pin. In this mode,
the SCIDR register consists of a buffer (TDR) be-
tween the internal bus and the transmit shift regis-
ter (see Figure 53).
Note: The TDRE and TC bits are cleared by the
same software sequence.
Break Characters
Setting the SBK bit loads the shift register with a
break character. The break frame length depends
on the M bit (see Figure 54).
Procedure
– Select the M bit to define the word length.
As long as the SBK bit is set, the SCI send break
frames to the TDO pin. After clearing this bit by
software the SCI insert a logic 1 bit at the end of
the last break frame to guarantee the recognition
of the start bit of the next frame.
– Select the desired baud rate using the SCIBRR
and the SCIETPR registers.
– Set the TE bit to assign the TDO pin to the alter-
nate function and to send a idle frame as first
transmission.
Idle Characters
– Access the SCISR register and write the data to
send in the SCIDR register (this sequence clears
the TDRE bit). Repeat this sequence for each
data to be transmitted.
Setting the TE bit drives the SCI to send an idle
frame before the first data frame.
Clearing and then setting the TE bit during a trans-
mission sends an idle frame after the current word.
Clearing the TDRE bit is always performed by the
following software sequence:
1. An access to the SCISR register
2. A write to the SCIDR register
Note: Resetting and setting the TE bit causes the
data in the TDR register to be lost. Therefore the
best time to toggle the TE bit is when the TDRE bit
is set i.e. before writing the next byte in the SCIDR.
The TDRE bit is set by hardware and it indicates:
– The TDR register is empty.
– The data transfer is beginning.
– The next data can be written in the SCIDR regis-
ter without overwriting the previous data.
This flag generates an interrupt if the TIE bit is set
and the I bit is cleared in the CCR register.
When a transmission is taking place, a write in-
struction to the SCIDR register stores the data in
the TDR register and which is copied in the shift
register at the end of the current transmission.
When no transmission is taking place, a write in-
struction to the SCIDR register places the data di-
rectly in the shift register, the data transmission
starts, and the TDRE bit is immediately set.
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.3 Receiver
RDR register as long as the RDRF bit is not
cleared.
The SCI can receive data words of either 8 or 9
bits. When the M bit is set, word length is 9 bits
and the MSB is stored in the R8 bit in the SCICR1
register.
When a overrun error occurs:
– The OR bit is set.
– The RDR content will not be lost.
– The shift register will be overwritten.
Character reception
During a SCI reception, data shifts in least signifi-
cant bit first through the RDI pin. In this mode, the
SCIDR register consists or a buffer (RDR) be-
tween the internal bus and the received shift regis-
ter (see Figure 53).
– An interrupt is generated if the RIE bit is set and
the I bit is cleared in the CCR register.
The OR bit is reset by an access to the SCISR reg-
ister followed by a SCIDR register read operation.
Procedure
Noise Error
– Select the M bit to define the word length.
Oversampling techniques are used for data recov-
ery by discriminating between valid incoming data
and noise. Normal data bits are considered valid if
three consecutive samples (8th, 9th, 10th) have
the same bit value, otherwise the NF flag is set. In
the case of start bit detection, the NF flag is set on
the basis of an algorithm combining both valid
edge detection and three samples (8th, 9th, 10th).
Therefore, to prevent the NF flag getting set during
start bit reception, there should be a valid edge de-
tection as well as three valid samples.
– Select the desired baud rate using the SCIBRR
and the SCIERPR registers.
– Set the RE bit, this enables the receiver which
begins searching for a start bit.
When a character is received:
– The RDRF bit is set. It indicates that the content
of the shift register is transferred to the RDR.
– An interrupt is generated if the RIE bit is set and
the I bit is cleared in the CCR register.
When noise is detected in a frame:
– The error flags can be set if a frame error, noise
or an overrun error has been detected during re-
ception.
– The NF flag is set at the rising edge of the RDRF
bit.
– Data is transferred from the Shift register to the
SCIDR register.
Clearing the RDRF bit is performed by the following
software sequence done by:
– No interrupt is generated. However this bit rises
at the same time as the RDRF bit which itself
generates an interrupt.
1. An access to the SCISR register
2. A read to the SCIDR register.
The RDRF bit must be cleared before the end of the
reception of the next character to avoid an overrun
error.
The NF flag is reset by a SCISR register read op-
eration followed by a SCIDR register read opera-
tion.
Break Character
During reception, if a false start bit is detected (e.g.
8th, 9th, 10th samples are 011,101,110), the
frame is discarded and the receiving sequence is
not started for this frame. There is no RDRF bit set
for this frame and the NF flag is set internally (not
accessible to the user). This NF flag is accessible
along with the RDRF bit when a next valid frame is
received.
When a break character is received, the SPI han-
dles it as a framing error.
Idle Character
When a idle frame is detected, there is the same
procedure as a data received character plus an in-
terrupt if the ILIE bit is set and the I bit is cleared in
the CCR register.
Note: If the application Start Bit is not long enough
to match the above requirements, then the NF
Flag may get set due to the short Start Bit. In this
case, the NF flag may be ignored by the applica-
tion software when the first valid byte is received.
Overrun Error
An overrun error occurs when a character is re-
ceived when RDRF has not been reset. Data can
not be transferred from the shift register to the
See also Section 11.5.4.10.
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Figure 55. SCI Baud Rate and Extended Prescaler Block Diagram
TRANSMITTER
CLOCK
EXTENDED PRESCALER TRANSMITTER RATE CONTROL
SCIETPR
EXTENDED TRANSMITTER PRESCALER REGISTER
SCIERPR
EXTENDED RECEIVER PRESCALER REGISTER
RECEIVER
CLOCK
EXTENDED PRESCALER RECEIVER RATE CONTROL
EXTENDED PRESCALER
f
CPU
TRANSMITTER RATE
CONTROL
/PR
/16
SCIBRR
SCP1
SCT2
SCT1SCT0SCR2 SCR1SCR0
SCP0
RECEIVER RATE
CONTROL
CONVENTIONAL BAUD RATE GENERATOR
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Framing Error
Note: the extended prescaler is activated by set-
ting the SCIETPR or SCIERPR register to a value
other than zero. The baud rates are calculated as
follows:
A framing error is detected when:
– The stop bit is not recognized on reception at the
expected time, following either a de-synchroni-
zation or excessive noise.
f
f
CPU
CPU
Rx =
16 ERPR*(PR*RR)
Tx =
16 ETPR*(PR*TR)
– A break is received.
*
*
When the framing error is detected:
– the FE bit is set by hardware
with:
– Data is transferred from the Shift register to the
SCIDR register.
ETPR = 1,..,255 (see SCIETPR register)
ERPR = 1,.. 255 (see SCIERPR register)
11.5.4.6 Receiver Muting and Wake-up Feature
– No interrupt is generated. However this bit rises
at the same time as the RDRF bit which itself
generates an interrupt.
In multiprocessor configurations it is often desira-
ble that only the intended message recipient
should actively receive the full message contents,
thus reducing redundant SCI service overhead for
all non addressed receivers.
The FE bit is reset by a SCISR register read oper-
ation followed by a SCIDR register read operation.
11.5.4.4 Conventional Baud Rate Generation
The baud rate for the receiver and transmitter (Rx
and Tx) are set independently and calculated as
follows:
The non addressed devices may be placed in
sleep mode by means of the muting function.
Setting the RWU bit by software puts the SCI in
sleep mode:
f
f
CPU
CPU
Rx =
Tx =
All the reception status bits can not be set.
All the receive interrupts are inhibited.
(16 PR) RR
(16 PR) TR
*
*
*
*
with:
A muted receiver may be awakened by one of the
following two ways:
PR = 1, 3, 4 or 13 (see SCP[1:0] bits)
TR = 1, 2, 4, 8, 16, 32, 64,128
(see SCT[2:0] bits)
– by Idle Line detection if the WAKE bit is reset,
– by Address Mark detection if the WAKE bit is set.
RR = 1, 2, 4, 8, 16, 32, 64,128
(see SCR[2:0] bits)
Receiver wakes-up by Idle Line detection when
the Receive line has recognised an Idle Frame.
Then the RWU bit is reset by hardware but the
IDLE bit is not set.
All these bits are in the SCIBRR register.
Example: If f is 8 MHz (normal mode) and if
CPU
Receiver wakes-up by Address Mark detection
when it received a “1” as the most significant bit of
a word, thus indicating that the message is an ad-
dress. The reception of this particular word wakes
up the receiver, resets the RWU bit and sets the
RDRF bit, which allows the receiver to receive this
word normally and to use it as an address word.
PR=13 and TR=RR=1, the transmit and receive
baud rates are 38400 baud.
Note: the baud rate registers MUST NOT be
changed while the transmitter or the receiver is en-
abled.
11.5.4.5 Extended Baud Rate Generation
The extended prescaler option gives a very fine
tuning on the baud rate, using a 255 value prescal-
er, whereas the conventional Baud Rate Genera-
tor retains industry standard software compatibili-
ty.
Caution: In Mute mode, do not write to the
SCICR2 register. If the SCI is in Mute mode during
the read operation (RWU=1) and a address mark
wake up event occurs (RWU is reset) before the
write operation, the RWU bit will be set again by
this write operation. Consequently the address
byte is lost and the SCI is not woken up from Mute
mode.
The extended baud rate generator block diagram
is described in the Figure 55.
The output clock rate sent to the transmitter or to
the receiver will be the output from the 16 divider
divided by a factor ranging from 1 to 255 set in the
SCIERPR or the SCIETPR register.
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.7 Parity Control
even number of “1s” if even parity is selected
(PS=0) or an odd number of “1s” if odd parity is se-
lected (PS=1). If the parity check fails, the PE flag
is set in the SCISR register and an interrupt is gen-
erated if PIE is set in the SCICR1 register.
Parity control (generation of parity bit in transmis-
sion and parity checking in reception) can be ena-
bled by setting the PCE bit in the SCICR1 register.
Depending on the frame length defined by the M
bit, the possible SCI frame formats are as listed in
Table 18.
11.5.4.8 SCI Clock Tolerance
During reception, each bit is sampled 16 times.
The majority of the 8th, 9th and 10th samples is
considered as the bit value. For a valid bit detec-
tion, all the three samples should have the same
value otherwise the noise flag (NF) is set. For ex-
ample: if the 8th, 9th and 10th samples are 0, 1
and 1 respectively, then the bit value will be “1”,
but the Noise Flag bit is be set because the three
samples values are not the same.
Table 18. Frame Formats
M bit
PCE bit
SCI frame
0
0
1
1
0
1
0
1
| SB | 8 bit data | STB |
| SB | 7-bit data | PB | STB |
| SB | 9-bit data | STB |
| SB | 8-bit data PB | STB |
Legend: SB = Start Bit, STB = Stop Bit,
PB = Parity Bit
Consequently, the bit length must be long enough
so that the 8th, 9th and 10th samples have the de-
sired bit value. This means the clock frequency
should not vary more than 6/16 (37.5%) within one
bit. The sampling clock is resynchronized at each
start bit, so that when receiving 10 bits (one start
bit, 1 data byte, 1 stop bit), the clock deviation
must not exceed 3.75%.
Note: In case of wake up by an address mark, the
MSB bit of the data is taken into account and not
the parity bit
Even parity: the parity bit is calculated to obtain
an even number of “1s” inside the frame made of
the 7 or 8 LSB bits (depending on whether M is
equal to 0 or 1) and the parity bit.
Note: The internal sampling clock of the microcon-
troller samples the pin value on every falling edge.
Therefore, the internal sampling clock and the time
the application expects the sampling to take place
may be out of sync. For example: If the baud rate
is 15.625 kbaud (bit length is 64µs), then the 8th,
9th and 10th samples will be at 28µs, 32µs & 36µs
respectively (the first sample starting ideally at
0µs). But if the falling edge of the internal clock oc-
curs just before the pin value changes, the sam-
ples would then be out of sync by ~4us. This
means the entire bit length must be at least 40µs
(36µs for the 10th sample + 4µs for synchroniza-
tion with the internal sampling clock).
Ex: data=00110101; 4 bits set => parity bit will be
0 if even parity is selected (PS bit = 0).
Odd parity: the parity bit is calculated to obtain an
odd number of “1s” inside the frame made of the 7
or 8 LSB bits (depending on whether M is equal to
0 or 1) and the parity bit.
Ex: data=00110101; 4 bits set => parity bit will be
1 if odd parity is selected (PS bit = 1).
Transmission mode: If the PCE bit is set then the
MSB bit of the data written in the data register is
not transmitted but is changed by the parity bit.
Reception mode: If the PCE bit is set then the in-
terface checks if the received data byte has an
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ST72260Gx, ST72262Gx, ST72264Gx
11.5.4.10 Noise Error Causes
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.9 Clock Deviation Causes
The causes which contribute to the total deviation
are:
See also description of Noise error in Section
11.5.4.3.
– D
: Deviation due to transmitter error (Local
Start bit
TRA
oscillator error of the transmitter or the trans-
mitter is transmitting at a different baud rate).
The noise flag (NF) is set during start bit reception
if one of the following conditions occurs:
– D
: Error due to the baud rate quantisa-
QUANT
1. A valid falling edge is not detected. A falling
edge is considered to be valid if the 3 consecu-
tive samples before the falling edge occurs are
detected as '1' and, after the falling edge
occurs, during the sampling of the 16 samples,
if one of the samples numbered 3, 5 or 7 is
detected as a “1”.
tion of the receiver.
– D
: Deviation of the local oscillator of the
REC
receiver: This deviation can occur during the
reception of one complete SCI message as-
suming that the deviation has been compen-
sated at the beginning of the message.
– D
: Deviation due to the transmission line
2. During sampling of the 16 samples, if one of the
samples numbered 8, 9 or 10 is detected as a
“1”.
TCL
(generally due to the transceivers)
All the deviations of the system should be added
and compared to the SCI clock tolerance:
Therefore, a valid Start Bit must satisfy both the
above conditions to prevent the Noise Flag getting
set.
D
+ D
+ D
+ D
< 3.75%
TCL
TRA
QUANT
REC
Data Bits
The noise flag (NF) is set during normal data bit re-
ception if the following condition occurs:
– During the sampling of 16 samples, if all three
samples numbered 8, 9 and10 are not the same.
The majority of the 8th, 9th and 10th samples is
considered as the bit value.
Therefore, a valid Data Bit must have samples 8, 9
and 10 at the same value to prevent the Noise
Flag getting set.
Figure 56. Bit Sampling in Reception Mode
RDI LINE
sampled values
Sample
clock
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
6/16
7/16
7/16
One bit time
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.5 Low Power Modes
Enable Exit
Control from from
Exit
Event
Flag
Interrupt Event
Mode
Description
Bit
Wait
Halt
No effect on SCI.
Transmit Data Register
Empty
TDRE
TC
TIE
Yes
No
WAIT
SCI interrupts cause the device to exit
from Wait mode.
Transmission Com-
plete
TCIE
RIE
Yes
Yes
No
No
SCI registers are frozen.
Received Data Ready
to be Read
RDRF
In Halt mode, the SCI stops transmit-
ting/receiving until Halt mode is exit-
ed.
HALT
Overrun Error Detected OR
Yes
Yes
Yes
No
No
No
Idle Line Detected
Parity Error
IDLE
PE
ILIE
PIE
11.5.6 Interrupts
The SCI interrupt events are connected to the
same interrupt vector.
rupt mask in the CC register is reset (RIM instruc-
tion).
These events generate an interrupt if the corre-
sponding Enable Control Bit is set and the inter-
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.7 Register Description
Note: The IDLE bit will not be set again until the
RDRF bit has been set itself (i.e. a new idle line oc-
curs).
STATUS REGISTER (SCISR)
Read Only
Reset Value: 1100 0000 (C0h)
Bit 3 = OR Overrun error.
7
0
This bit is set by hardware when the word currently
being received in the shift register is ready to be
transferred into the RDR register while RDRF=1.
An interrupt is generated if RIE=1 in the SCICR2
register. It is cleared by a software sequence (an
access to the SCISR register followed by a read to
the SCIDR register).
TDRE
TC
RDRF IDLE
OR
NF
FE
PE
Bit 7 = TDRE Transmit data register empty.
This bit is set by hardware when the content of the
TDR register has been transferred into the shift
register. An interrupt is generated if the TIE bit=1
in the SCICR2 register. It is cleared by a software
sequence (an access to the SCISR register fol-
lowed by a write to the SCIDR register).
0: No Overrun error
1: Overrun error is detected
Note: When this bit is set RDR register content will
not be lost but the shift register will be overwritten.
0: Data is not transferred to the shift register
1: Data is transferred to the shift register
Bit 2 = NF Noise flag.
Note: Data will not be transferred to the shift reg-
This bit is set by hardware when noise is detected
on a received frame. It is cleared by a software se-
quence (an access to the SCISR register followed
by a read to the SCIDR register).
0: No noise is detected
ister unless the TDRE bit is cleared.
Bit 6 = TC Transmission complete.
This bit is set by hardware when transmission of a
frame containing Data is complete. An interrupt is
generated if TCIE=1 in the SCICR2 register. It is
cleared by a software sequence (an access to the
SCISR register followed by a write to the SCIDR
register).
1: Noise is detected
Note: This bit does not generate interrupt as it ap-
pears at the same time as the RDRF bit which it-
self generates an interrupt.
0: Transmission is not complete
1: Transmission is complete
Bit 1 = FE Framing error.
This bit is set by hardware when a de-synchroniza-
tion, excessive noise or a break character is de-
tected. It is cleared by a software sequence (an
access to the SCISR register followed by a read to
the SCIDR register).
Note: TC is not set after the transmission of a Pre-
amble or a Break.
Bit 5 = RDRF Received data ready flag.
This bit is set by hardware when the content of the
RDR register has been transferred to the SCIDR
register. An interrupt is generated if RIE=1 in the
SCICR2 register. It is cleared by a software se-
quence (an access to the SCISR register followed
by a read to the SCIDR register).
0: No Framing error is detected
1: Framing error or break character is detected
Note: This bit does not generate interrupt as it ap-
pears at the same time as the RDRF bit which it-
self generates an interrupt. If the word currently
being transferred causes both frame error and
overrun error, it will be transferred and only the OR
bit will be set.
0: Data is not received
1: Received data is ready to be read
Bit 4 = IDLE Idle line detect.
This bit is set by hardware when a Idle Line is de-
tected. An interrupt is generated if the ILIE=1 in
the SCICR2 register. It is cleared by a software se-
quence (an access to the SCISR register followed
by a read to the SCIDR register).
Bit 0 = PE Parity error.
This bit is set by hardware when a parity error oc-
curs in receiver mode. It is cleared by a software
sequence (a read to the status register followed by
an access to the SCIDR data register). An inter-
rupt is generated if PIE=1 in the SCICR1 register.
0: No parity error
0: No Idle Line is detected
1: Idle Line is detected
1: Parity error
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SERIAL COMMUNICATIONS INTERFACE (Cont’d)
CONTROL REGISTER 1 (SCICR1)
Read/Write
Bit 3 = WAKE Wake-Up method.
This bit determines the SCI Wake-Up method, it is
set or cleared by software.
0: Idle Line
Reset Value: x000 0000 (x0h)
7
0
1: Address Mark
R8
T8
SCID
M
WAKE PCE
PS
PIE
Bit 2 = PCE Parity control enable.
This bit selects the hardware parity control (gener-
ation and detection). When the parity control is en-
abled, the computed parity is inserted at the MSB
position (9th bit if M=1; 8th bit if M=0) and parity is
checked on the received data. This bit is set and
cleared by software. Once it is set, PCE is active
after the current byte (in reception and in transmis-
sion).
Bit 7 = R8 Receive data bit 8.
This bit is used to store the 9th bit of the received
word when M=1.
Bit 6 = T8 Transmit data bit 8.
This bit is used to store the 9th bit of the transmit-
ted word when M=1.
0: Parity control disabled
1: Parity control enabled
Bit 5 = SCID Disabled for low power consumption
When this bit is set the SCI prescalers and outputs
are stopped and the end of the current byte trans-
fer in order to reduce power consumption.This bit
is set and cleared by software.
0: SCI enabled
1: SCI prescaler and outputs disabled
Bit 1 = PS Parity selection.
This bit selects the odd or even parity when the
parity generation/detection is enabled (PCE bit
set). It is set and cleared by software. The parity
will be selected after the current byte.
0: Even parity
1: Odd parity
Bit 4 = M Word length.
This bit determines the word length. It is set or
cleared by software.
0: 1 Start bit, 8 Data bits, 1 Stop bit
1: 1 Start bit, 9 Data bits, 1 Stop bit
Bit 0 = PIE Parity interrupt enable.
This bit enables the interrupt capability of the hard-
ware parity control when a parity error is detected
(PE bit set). It is set and cleared by software.
0: Parity error interrupt disabled
Note: The M bit must not be modified during a data
transfer (both transmission and reception).
1: Parity error interrupt enabled.
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
CONTROL REGISTER 2 (SCICR2)
Read/Write
Notes:
– During transmission, a “0” pulse on the TE bit
(“0” followed by “1”) sends a preamble (idle line)
after the current word.
Reset Value: 0000 0000 (00h)
7
0
– When TE is set there is a 1 bit-time delay before
the transmission starts.
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
Caution: The TDO pin is free for general purpose
I/O only when the TE and RE bits are both cleared
(or if TE is never set).
Bit 7 = TIE Transmitter interrupt enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever
TDRE=1 in the SCISR register
Bit 2 = RE Receiver enable.
This bit enables the receiver. It is set and cleared
by software.
0: Receiver is disabled
1: Receiver is enabled and begins searching for a
start bit
Bit 6 = TCIE Transmission complete interrupt ena-
ble
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever TC=1 in
the SCISR register
Bit 1 = RWU Receiver wake-up.
This bit determines if the SCI is in mute mode or
not. It is set and cleared by software and can be
cleared by hardware when a wake-up sequence is
recognized.
Bit 5 = RIE Receiver interrupt enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever OR=1
or RDRF=1 in the SCISR register
0: Receiver in Active mode
1: Receiver in Mute mode
Note: Before selecting Mute mode (setting the
RWU bit), the SCI must receive some data first,
otherwise it cannot function in Mute mode with
wakeup by idle line detection.
Bit 4 = ILIE Idle line interrupt enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever IDLE=1
in the SCISR register.
Bit 0 = SBK Send break.
This bit set is used to send break characters. It is
set and cleared by software.
0: No break character is transmitted
1: Break characters are transmitted
Bit 3 = TE Transmitter enable.
This bit enables the transmitter. It is set and
cleared by software.
Note: If the SBK bit is set to “1” and then to “0”, the
transmitter will send a BREAK word at the end of
the current word.
0: Transmitter is disabled
1: Transmitter is enabled
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
DATA REGISTER (SCIDR)
Read/Write
Bits 5:3 = SCT[2:0] SCI Transmitter rate divisor
These 3 bits, in conjunction with the SCP1 & SCP0
bits define the total division applied to the bus
clock to yield the transmit rate clock in convention-
al Baud Rate Generator mode.
Reset Value: Undefined
Contains the Received or Transmitted data char-
acter, depending on whether it is read from or writ-
ten to.
TR dividing factor
SCT2
SCT1
SCT0
1
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
7
0
4
DR7
DR6
DR5
DR4
DR3
DR2
DR1
DR0
8
16
32
64
128
The Data register performs a double function (read
and write) since it is composed of two registers,
one for transmission (TDR) and one for reception
(RDR).
The TDR register provides the parallel interface
between the internal bus and the output shift reg-
ister (see Figure 53).
The RDR register provides the parallel interface
between the input shift register and the internal
bus (see Figure 53).
Bits 2:0 = SCR[2:0] SCI Receiver rate divisor.
These 3 bits, in conjunction with the SCP[1:0] bits
define the total division applied to the bus clock to
yield the receive rate clock in conventional Baud
Rate Generator mode.
RR Dividing factor
SCR2
SCR1
SCR0
BAUD RATE REGISTER (SCIBRR)
Read/Write
1
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reset Value: 0000 0000 (00h)
4
7
0
8
16
32
64
128
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1 SCR0
Bits 7:6= SCP[1:0] First SCI Prescaler
These 2 prescaling bits allow several standard
clock division ranges:
PR Prescaling factor
SCP1
SCP0
1
3
0
0
1
1
0
1
0
1
4
13
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
EXTENDED RECEIVE PRESCALER DIVISION
REGISTER (SCIERPR)
EXTENDED TRANSMIT PRESCALER DIVISION
REGISTER (SCIETPR)
Read/Write
Read/Write
Reset Value: 0000 0000 (00h)
Reset Value:0000 0000 (00h)
Allows setting of the Extended Prescaler rate divi-
sion factor for the receive circuit.
Allows setting of the External Prescaler rate divi-
sion factor for the transmit circuit.
7
0
7
0
ERPR ERPR ERPR ERPR ERPR ERPR ERPR ERPR
ETPR ETPR ETPR ETPR ETPR ETPR ETPR ETPR
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Bits 7:0 = ERPR[7:0] 8-bit Extended Receive
Prescaler Register.
Bits 7:0 = ETPR[7:0] 8-bit Extended Transmit
Prescaler Register.
The extended Baud Rate Generator is activated
when a value different from 00h is stored in this
register. Therefore the clock frequency issued
from the 16 divider (see Figure 55) is divided by
the binary factor set in the SCIERPR register (in
the range 1 to 255).
The extended Baud Rate Generator is activated
when a value different from 00h is stored in this
register. Therefore the clock frequency issued
from the 16 divider (see Figure 55) is divided by
the binary factor set in the SCIETPR register (in
the range 1 to 255).
The extended baud rate generator is not used af-
ter a reset.
The extended baud rate generator is not used af-
ter a reset.
Table 19. Baudrate Selection
Conditions
Baud
Rate
Symbol
Parameter
Standard
Unit
Accuracy
vs. Standard
Prescaler
f
CPU
Conventional Mode
TR (or RR)=128, PR=13
TR (or RR)= 32, PR=13
TR (or RR)= 16, PR=13
TR (or RR)= 8, PR=13
TR (or RR)= 4, PR=13
TR (or RR)= 16, PR= 3
TR (or RR)= 2, PR=13
TR (or RR)= 1, PR=13
300
~300.48
1200 ~1201.92
2400 ~2403.84
4800 ~4807.69
9600 ~9615.38
10400 ~10416.67
19200 ~19230.77
38400 ~38461.54
~0.16%
~0.79%
f
f
Tx
Communication frequency 8MHz
Hz
Rx
Extended Mode
ETPR (or ERPR) = 35,
TR (or RR)= 1, PR=1
14400 ~14285.71
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ST72260Gx, ST72262Gx, ST72264Gx
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Table 20. SCI Register Map and Reset Values
Address
(Hex.)
Register
Name
7
6
5
4
3
2
1
0
SCISR
TDRE
TC
1
RDRF
0
IDLE
OR
NF
0
FE
0
PE
0
50
51
52
53
54
55
56
Reset Value
SCIDR
1
DR7
x
0
DR4
x
0
DR3
x
DR6
x
DR5
x
DR2
x
DR1
x
DR0
x
Reset Value
SCIBRR
SCP1
0
SCP0
0
SCT2
0
SCT1
0
SCT0
0
SCR2
0
SCR1
0
SCR0
0
Reset Value
SCICR1
R8
x
T8
0
SCID
0
M
WAKE
0
PCE
0
PS
0
PIE
0
Reset Value
SCICR2
0
TIE
0
TCIE
0
RIE
0
ILIE
0
TE
RE
0
RWU
0
SBK
0
Reset Value
SCIERPR
Reset Value
SCIETPR
Reset Value
0
ERPR7
0
ERPR6
0
ERPR5 ERPR4
ERPR3
0
ERPR2
0
ERPR1
0
ERPR0
0
0
0
ETPR7
0
ETPR6
0
ETPR5
0
ETPR4
0
ETPR3
0
ETPR2
0
ETPR1
0
ETPR0
0
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ST72260Gx, ST72262Gx, ST72264Gx
2
11.6 I C BUS INTERFACE (I2C)
11.6.1 Introduction
and vice versa, using either an interrupt or polled
handshake. The interrupts are enabled or disabled
2
The I C Bus Interface serves as an interface be-
2
2
by software. The interface is connected to the I C
tween the microcontroller and the serial I C bus. It
bus by a data pin (SDAI) and by a clock pin (SCLI).
provides both multimaster and slave functions,
2
2
It can be connected both with a standard I C bus
and controls all I C bus-specific sequencing, pro-
2
2
and a Fast I C bus. This selection is made by soft-
tocol, arbitration and timing. It supports fast I C
ware.
mode (400kHz).
Mode Selection
11.6.2 Main Features
2
The interface can operate in the four following
modes:
■ Parallel-bus/I C protocol converter
■ Multi-master capability
– Slave transmitter/receiver
■ 7-bit/10-bit Addressing
■ SMBus V1.1 Compliant
■ Transmitter/Receiver flag
■ End-of-byte transmission flag
■ Transfer problem detection
– Master transmitter/receiver
By default, it operates in slave mode.
The interface automatically switches from slave to
master after it generates a START condition and
from master to slave in case of arbitration loss or a
STOP generation, allowing then Multi-Master ca-
pability.
2
I C Master Features:
■ Clock generation
2
■ I C bus busy flag
Communication Flow
■ Arbitration Lost Flag
In Master mode, it initiates a data transfer and
generates the clock signal. A serial data transfer
always begins with a start condition and ends with
a stop condition. Both start and stop conditions are
generated in master mode by software.
■ End of byte transmission flag
■ Transmitter/Receiver Flag
■ Start bit detection flag
■ Start and Stop generation
In Slave mode, the interface is capable of recog-
nising its own address (7 or 10-bit), and the Gen-
eral Call address. The General Call address de-
tection may be enabled or disabled by software.
2
I C Slave Features:
■ Stop bit detection
2
■ I C bus busy flag
Data and addresses are transferred as 8-bit bytes,
MSB first. The first byte(s) following the start con-
dition contain the address (one in 7-bit mode, two
in 10-bit mode). The address is always transmitted
in Master mode.
■ Detection of misplaced start or stop condition
■ Programmable I C Address detection
■ Transfer problem detection
■ End-of-byte transmission flag
■ Transmitter/Receiver flag
11.6.3 General Description
2
A 9th clock pulse follows the 8 clock cycles of a
byte transfer, during which the receiver must send
an acknowledge bit to the transmitter. Refer to Fig-
ure 57.
In addition to receiving and transmitting data, this
interface converts it from serial to parallel format
2
Figure 57. I C BUS Protocol
SDA
MSB
ACK
SCL
1
2
8
9
START
STOP
CONDITION
CONDITION
VR02119B
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2
I C BUS INTERFACE (Cont’d)
Acknowledge may be enabled and disabled by
software.
The SCL frequency (F ) is controlled by a pro-
scl
grammable clock divider which depends on the
2
2
I C bus mode.
The I C interface address and/or general call ad-
2
dress can be selected by software.
When the I C cell is enabled, the SDA and SCL
2
ports must be configured as floating inputs. In this
case, the value of the external pull-up resistor
used depends on the application.
The speed of the I C interface may be selected
2
between Standard (up to 100KHz) and Fast I C
(up to 400KHz).
2
When the I C cell is disabled, the SDA and SCL
ports revert to being standard I/O port pins.
SDA/SCL Line Control
Transmitter mode: the interface holds the clock
line low before transmission to wait for the micro-
controller to write the byte in the Data Register.
Receiver mode: the interface holds the clock line
low after reception to wait for the microcontroller to
read the byte in the Data Register.
2
Figure 58. I C Interface Block Diagram
DATA REGISTER (DR)
DATA CONTROL
SDA or SDAI
DATA SHIFT REGISTER
COMPARATOR
OWN ADDRESS REGISTER 1 (OAR1)
OWN ADDRESS REGISTER 2 (OAR2)
CLOCK CONTROL
SCL or SCLI
CLOCK CONTROL REGISTER (CCR)
CONTROL REGISTER (CR)
STATUS REGISTER 1 (SR1)
STATUS REGISTER 2 (SR2)
CONTROL LOGIC
INTERRUPT
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I C BUS INTERFACE (Cont’d)
11.6.4 Functional Description
Then the interface waits for a read of the SR1 reg-
ister followed by a read of the DR register, holding
the SCL line low (see Figure 59 Transfer se-
quencing EV2).
Refer to the CR, SR1 and SR2 registers in Section
11.6.7. for the bit definitions.
2
By default the I C interface operates in Slave
Slave Transmitter
mode (M/SL bit is cleared) except when it initiates
a transmit or receive sequence.
Following the address reception and after SR1
register has been read, the slave sends bytes from
the DR register to the SDA line via the internal shift
register.
First the interface frequency must be configured
using the FRi bits in the OAR2 register.
11.6.4.1 Slave Mode
The slave waits for a read of the SR1 register fol-
lowed by a write in the DR register, holding the
SCL line low (see Figure 59 Transfer sequencing
EV3).
As soon as a start condition is detected, the
address is received from the SDA line and sent to
the shift register; then it is compared with the
address of the interface or the General Call
address (if selected by software).
When the acknowledge pulse is received:
– The EVF and BTF bits are set by hardware with
an interrupt if the ITE bit is set.
Note: In 10-bit addressing mode, the comparison
includes the header sequence (11110xx0) and the
two most significant bits of the address.
Closing slave communication
Header matched (10-bit mode only): the interface
generates an acknowledge pulse if the ACK bit is
set.
After the last data byte is transferred a Stop Con-
dition is generated by the master. The interface
detects this condition and sets:
Address not matched: the interface ignores it
and waits for another Start condition.
– EVF and STOPF bits with an interrupt if the ITE
bit is set.
Address matched: the interface generates in se-
Then the interface waits for a read of the SR2 reg-
ister (see Figure 59 Transfer sequencing EV4).
Error Cases
quence:
– Acknowledge pulse if the ACK bit is set.
– BERR: Detection of a Stop or a Start condition
during a byte transfer. In this case, the EVF and
the BERR bits are set with an interrupt if the ITE
bit is set.
If it is a Stop then the interface discards the data,
released the lines and waits for another Start
condition.
– EVF and ADSL bits are set with an interrupt if the
ITE bit is set.
Then the interface waits for a read of the SR1 reg-
ister, holding the SCL line low (see Figure 59
Transfer sequencing EV1).
Next, in 7-bit mode read the DR register to deter-
mine from the least significant bit (Data Direction
Bit) if the slave must enter Receiver or Transmitter
mode.
If it is a Start then the interface discards the data
and waits for the next slave address on the bus.
– AF: Detection of a non-acknowledge bit. In this
case, the EVF and AF bits are set with an inter-
rupt if the ITE bit is set.
In 10-bit mode, after receiving the address se-
quence the slave is always in receive mode. It will
enter transmit mode on receiving a repeated Start
condition followed by the header sequence with
matching address bits and the least significant bit
set (11110xx1).
The AF bit is cleared by reading the I2CSR2 reg-
ister. However, if read before the completion of
the transmission, the AF flag will be set again,
thus possibly generating a new interrupt. Soft-
ware must ensure either that the SCL line is back
at 0 before reading the SR2 register, or be able
to correctly handle a second interrupt during the
9th pulse of a transmitted byte.
Slave Receiver
Following the address reception and after SR1
register has been read, the slave receives bytes
from the SDA line into the DR register via the inter-
nal shift register. After each byte the interface gen-
erates in sequence:
Note: In case of errors, SCL line is not held low;
however, the SDA line can remain low if the last
bits transmitted are all 0. While AF=1, the SCL line
may be held low due to SB or BTF flags that are
set at the same time. It is then necessary to re-
lease both lines by software.
– Acknowledge pulse if the ACK bit is set
– EVF and BTF bits are set with an interrupt if the
ITE bit is set.
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I C INTERFACE (Cont’d)
How to release the SDA / SCL lines
Then the second address byte is sent by the inter-
face.
Set and subsequently clear the STOP bit while
BTF is set. The SDA/SCL lines are released after
the transfer of the current byte.
After completion of this transfer (and acknowledge
from the slave if the ACK bit is set):
SMBus Compatibility
– The EVF bit is set by hardware with interrupt
generation if the ITE bit is set.
2
ST7 I C is compatible with SMBus V1.1 protocol. It
supports all SMBus adressing modes, SMBus bus
protocols and CRC-8 packet error checking. Refer
Then the master waits for a read of the SR1 regis-
ter followed by a write in the CR register (for exam-
ple set PE bit), holding the SCL line low (see Fig-
ure 59 Transfer sequencing EV6).
2
to AN1713: SMBus Slave Driver For ST7 I C Pe-
ripheral.
11.6.4.2 Master Mode
Next the master must enter Receiver or Transmit-
ter mode.
To switch from default Slave mode to Master
mode a Start condition generation is needed.
Note: In 10-bit addressing mode, to switch the
master to Receiver mode, software must generate
a repeated Start condition and resend the header
sequence with the least significant bit set
(11110xx1).
Start condition
Setting the START bit while the BUSY bit is
cleared causes the interface to switch to Master
mode (M/SL bit set) and generates a Start condi-
tion.
Master Receiver
Following the address transmission and after SR1
and CR registers have been accessed, the master
receives bytes from the SDA line into the DR reg-
ister via the internal shift register. After each byte
the interface generates in sequence:
Once the Start condition is sent:
– The EVF and SB bits are set by hardware with
an interrupt if the ITE bit is set.
Then the master waits for a read of the SR1 regis-
ter followed by a write in the DR register with the
Slave address, holding the SCL line low (see
Figure 59 Transfer sequencing EV5).
– Acknowledge pulse if the ACK bit is set
– EVF and BTF bits are set by hardware with an in-
terrupt if the ITE bit is set.
Then the interface waits for a read of the SR1 reg-
ister followed by a read of the DR register, holding
the SCL line low (see Figure 59 Transfer se-
quencing EV7).
Slave address transmission
Then the slave address is sent to the SDA line via
the internal shift register.
To close the communication: before reading the
last byte from the DR register, set the STOP bit to
generate the Stop condition. The interface goes
automatically back to slave mode (M/SL bit
cleared).
In 7-bit addressing mode, one address byte is
sent.
In 10-bit addressing mode, sending the first byte
including the header sequence causes the follow-
ing event:
Note: In order to generate the non-acknowledge
pulse after the last received data byte, the ACK bit
must be cleared just before reading the second
last data byte.
– The EVF bit is set by hardware with interrupt
generation if the ITE bit is set.
Then the master waits for a read of the SR1 regis-
ter followed by a write in the DR register, holding
the SCL line low (see Figure 59 Transfer se-
quencing EV9).
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I C BUS INTERFACE (Cont’d)
Master Transmitter
of communication gives the possibility to reiniti-
ate transmission.
Following the address transmission and after SR1
register has been read, the master sends bytes
from the DR register to the SDA line via the inter-
nal shift register.
Multimaster Mode
Normally the BERR bit would be set whenever
unauthorized transmission takes place while
transfer is already in progress. However, an is-
sue will arise if an external master generates an
The master waits for a read of the SR1 register fol-
lowed by a write in the DR register, holding the
SCL line low (see Figure 59 Transfer sequencing
EV8).
2
unauthorized Start or Stop while the I C master
is on the first or second pulse of a 9-bit transac-
tion. It is possible to work around this by polling
2
the BUSY bit during I C master mode transmis-
When the acknowledge bit is received, the
interface sets:
sion. The resetting of the BUSY bit can then be
handled in a similar manner as the BERR flag
being set.
– EVF and BTF bits with an interrupt if the ITE bit
is set.
– AF: Detection of a non-acknowledge bit. In this
case, the EVF and AF bits are set by hardware
with an interrupt if the ITE bit is set. To resume,
set the Start or Stop bit.
The AF bit is cleared by reading the I2CSR2 reg-
ister. However, if read before the completion of
the transmission, the AF flag will be set again,
thus possibly generating a new interrupt. Soft-
ware must ensure either that the SCL line is back
at 0 before reading the SR2 register, or be able
to correctly handle a second interrupt during the
9th pulse of a transmitted byte.
To close the communication: after writing the last
byte to the DR register, set the STOP bit to gener-
ate the Stop condition. The interface goes auto-
matically back to slave mode (M/SL bit cleared).
Error Cases
– BERR: Detection of a Stop or a Start condition
during a byte transfer. In this case, the EVF and
BERR bits are set by hardware with an interrupt
if ITE is set.
Note that BERR will not be set if an error is de-
tected during the first or second pulse of each 9-
bit transaction:
– ARLO: Detection of an arbitration lost condition.
In this case the ARLO bit is set by hardware (with
an interrupt if the ITE bit is set and the interface
goes automatically back to slave mode (the M/SL
bit is cleared).
Single Master Mode
If a Start or Stop is issued during the first or sec-
ond pulse of a 9-bit transaction, the BERR flag
will not be set and transfer will continue however
the BUSY flag will be reset. To work around this,
slave devices should issue a NACK when they
receive a misplaced Start or Stop. The reception
of a NACK or BUSY by the master in the middle
Note: In all these cases, the SCL line is not held
low; however, the SDA line can remain low due to
possible «0» bits transmitted last. It is then neces-
sary to release both lines by software.
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I C BUS INTERFACE (Cont’d)
Figure 59. Transfer Sequencing
7-bit Slave receiver:
S
Address
A
Data1
A
Data1
Data1
Data2
EV3
A
Data2
Data2
DataN
A
P
.....
EV1
EV2
A
EV2
A
EV2
NA
EV4
7-bit Slave transmitter:
S
Address
A
DataN
P
.....
.....
EV1 EV3
EV3
EV3-1
EV4
7-bit Master receiver:
S
Address
A
A
A
DataN NA
P
EV5
EV6
EV7
A
EV7
A
EV7
A
7-bit Master transmitter:
S
Address
A
Data1
Data2
DataN
P
.....
EV5
EV6 EV8
EV8
EV8
EV8
10-bit Slave receiver:
S
Header
A
Address
A
Data1
A
DataN
A
P
.....
EV1
EV2
EV2
EV4
10-bit Slave transmitter:
S
Header
A
Data1
A
A
DataN
....
.
A
P
r
EV1 EV3
EV6 EV8
EV3
EV3-1
EV4
10-bit Master transmitter
S
Header
A
Address
A
Data1
DataN
A
P
.....
EV5
EV9
EV8
A
EV8
A
10-bit Master receiver:
S
Header
A
Data1
DataN
P
r
.....
EV5
EV6
EV7
EV7
Legend: S=Start, S = Repeated Start, P=Stop, A=Acknowledge, NA=Non-acknowledge,
r
EVx=Event (with interrupt if ITE=1)
EV1: EVF=1, ADSL=1, cleared by reading SR1 register.
EV2: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register.
EV3: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register.
EV3-1: EVF=1, AF=1, BTF=1; AF is cleared by reading SR1 register. BTF is cleared by releasing the
lines (STOP=1, STOP=0) or by writing DR register (DR=FFh). Note: If lines are released by
STOP=1, STOP=0, the subsequent EV4 is not seen.
EV4: EVF=1, STOPF=1, cleared by reading SR2 register.
EV5: EVF=1, SB=1, cleared by reading SR1 register followed by writing DR register.
EV6: EVF=1, cleared by reading SR1 register followed by writing CR register (for example PE=1).
EV7: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register.
EV8: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register.
EV9: EVF=1, ADD10=1, cleared by reading SR1 register followed by writing DR register.
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I C BUS INTERFACE (Cont’d)
11.6.5 Low Power Modes
Mode
Description
2
No effect on I C interface.
WAIT
HALT
2
I C interrupts cause the device to exit from WAIT mode.
2
I C registers are frozen.
2
2
In HALT mode, the I C interface is inactive and does not acknowledge data on the bus. The I C interface
resumes operation when the MCU is woken up by an interrupt with “exit from HALT mode” capability.
11.6.6 Interrupts
Figure 60. Event Flags and Interrupt Generation
ADD10
ITE
BTF
ADSL
SB
INTERRUPT
EVF
AF
STOPF
ARLO
BERR
*
* EVF can also be set by EV6 or an error from the SR2 register.
Enable
Control from
Bit
Exit
Exit
from
Halt
Event
Flag
Interrupt Event
Wait
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
10-bit Address Sent Event (Master mode)
End of Byte Transfer Event
ADD10
BTF
No
No
No
No
No
No
No
No
Address Matched Event (Slave mode)
Start Bit Generation Event (Master mode)
Acknowledge Failure Event
ADSEL
SB
ITE
AF
Stop Detection Event (Slave mode)
Arbitration Lost Event (Multimaster configuration)
Bus Error Event
STOPF
ARLO
BERR
2
Note: The I C interrupt events are connected to
the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding
Enable Control Bit is set and the I-bit in the CC reg-
ister is reset (RIM instruction).
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I C BUS INTERFACE (Cont’d)
11.6.7 Register Description
– In slave mode:
2
0: No start generation
I C CONTROL REGISTER (CR)
1: Start generation when the bus is free
Read / Write
Reset Value: 0000 0000 (00h)
Bit 2 = ACK Acknowledge enable.
This bit is set and cleared by software. It is also
cleared by hardware when the interface is disa-
bled (PE=0).
7
0
0
0
PE
ENGC START ACK STOP
ITE
0: No acknowledge returned
1: Acknowledge returned after an address byte or
a data byte is received
Bit 7:6 = Reserved. Forced to 0 by hardware.
Bit 1 = STOP Generation of a Stop condition.
This bit is set and cleared by software. It is also
cleared by hardware in master mode. Note: This
bit is not cleared when the interface is disabled
(PE=0).
Bit 5 = PE Peripheral enable.
This bit is set and cleared by software.
0: Peripheral disabled
1: Master/Slave capability
Notes:
– When PE=0, all the bits of the CR register and
the SR register except the Stop bit are reset. All
outputs are released while PE=0
– In master mode:
0: No stop generation
1: Stop generation after the current byte transfer
or after the current Start condition is sent. The
STOP bit is cleared by hardware when the Stop
condition is sent.
– When PE=1, the corresponding I/O pins are se-
lected by hardware as alternate functions.
2
– To enable the I C interface, write the CR register
TWICE with PE=1 as the first write only activates
– In slave mode:
0: No stop generation
the interface (only PE is set).
1: Release the SCL and SDA lines after the cur-
rent byte transfer (BTF=1). In this mode the
STOP bit has to be cleared by software.
Bit 4 = ENGC Enable General Call.
This bit is set and cleared by software. It is also
cleared by hardware when the interface is disa-
bled (PE=0). The 00h General Call address is ac-
knowledged (01h ignored).
Bit 0 = ITE Interrupt enable.
This bit is set and cleared by software and cleared
by hardware when the interface is disabled
(PE=0).
0: General Call disabled
1: General Call enabled
0: Interrupts disabled
1: Interrupts enabled
Refer to Figure 60 for the relationship between the
events and the interrupt.
SCL is held low when the ADD10, SB, BTF or
ADSL flags or an EV6 event (See Figure 59) is de-
tected.
Note: In accordance with the I2C standard, when
GCAL addressing is enabled, an I2C slave can
only receive data. It will not transmit data to the
master.
Bit 3 = START Generation of a Start condition.
This bit is set and cleared by software. It is also
cleared by hardware when the interface is disa-
bled (PE=0) or when the Start condition is sent
(with interrupt generation if ITE=1).
– In master mode:
0: No start generation
1: Repeated start generation
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I C BUS INTERFACE (Cont’d)
2
I C STATUS REGISTER 1 (SR1)
1: Data byte transmitted
Read Only
Reset Value: 0000 0000 (00h)
Bit 4 = BUSY Bus busy.
This bit is set by hardware on detection of a Start
condition and cleared by hardware on detection of
a Stop condition. It indicates a communication in
progress on the bus. The BUSY flag of the I2CSR1
register is cleared if a Bus Error occurs.
0: No communication on the bus
7
0
EVF ADD10 TRA BUSY BTF ADSL M/SL
SB
Bit 7 = EVF Event flag.
1: Communication ongoing on the bus
Note:
This bit is set by hardware as soon as an event oc-
curs. It is cleared by software reading SR2 register
in case of error event or as described in Figure 59.
It is also cleared by hardware when the interface is
disabled (PE=0).
– The BUSY flag is NOT updated when the inter-
face is disabled (PE=0). This can have conse-
quences when operating in Multimaster mode;
2
i.e. a second active I C master commencing a
0: No event
1: One of the following events has occurred:
transfer with an unset BUSY bit can cause a con-
flict resulting in lost data. A software workaround
– BTF=1 (Byte received or transmitted)
2
consists of checking that the I C is not busy be-
2
– ADSL=1 (Address matched in Slave mode
while ACK=1)
fore enabling the I C Multimaster cell.
– SB=1 (Start condition generated in Master
mode)
Bit 3 = BTF Byte transfer finished.
This bit is set by hardware as soon as a byte is cor-
rectly received or transmitted with interrupt gener-
ation if ITE=1. It is cleared by software reading
SR1 register followed by a read or write of DR reg-
ister. It is also cleared by hardware when the inter-
face is disabled (PE=0).
– AF=1 (No acknowledge received after byte
transmission)
– STOPF=1 (Stop condition detected in Slave
mode)
– ARLO=1 (Arbitration lost in Master mode)
– Following a byte transmission, this bit is set after
reception of the acknowledge clock pulse. In
case an address byte is sent, this bit is set only
after the EV6 event (See Figure 59). BTF is
cleared by reading SR1 register followed by writ-
ing the next byte in DR register.
– BERR=1 (Bus error, misplaced Start or Stop
condition detected)
– ADD10=1 (Master has sent header byte)
– Address byte successfully transmitted in Mas-
ter mode.
– Following a byte reception, this bit is set after
transmission of the acknowledge clock pulse if
ACK=1. BTF is cleared by reading SR1 register
followed by reading the byte from DR register.
Bit 6 = ADD10 10-bit addressing in Master mode.
This bit is set by hardware when the master has
sent the first byte in 10-bit address mode. It is
cleared by software reading SR2 register followed
by a write in the DR register of the second address
byte. It is also cleared by hardware when the pe-
ripheral is disabled (PE=0).
The SCL line is held low while BTF=1.
0: Byte transfer not done
1: Byte transfer succeeded
0: No ADD10 event occurred.
Bit 2 = ADSL Address matched (Slave mode).
This bit is set by hardware as soon as the received
slave address matched with the OAR register con-
tent or a general call is recognized. An interrupt is
generated if ITE=1. It is cleared by software read-
ing SR1 register or by hardware when the inter-
face is disabled (PE=0).
1: Master has sent first address byte (header)
Bit 5 = TRA Transmitter/Receiver.
When BTF is set, TRA=1 if a data byte has been
transmitted. It is cleared automatically when BTF
is cleared. It is also cleared by hardware after de-
tection of Stop condition (STOPF=1), loss of bus
arbitration (ARLO=1) or when the interface is disa-
bled (PE=0).
The SCL line is held low while ADSL=1.
0: Address mismatched or not received
1: Received address matched
0: Data byte received (if BTF=1)
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I C BUS INTERFACE (Cont’d)
Bit 1 = M/SL Master/Slave.
The SCL line is not held low while STOPF=1.
This bit is set by hardware as soon as the interface
is in Master mode (writing START=1). It is cleared
by hardware after detecting a Stop condition on
the bus or a loss of arbitration (ARLO=1). It is also
cleared when the interface is disabled (PE=0).
0: Slave mode
0: No Stop condition detected
1: Stop condition detected
Bit 2 = ARLO Arbitration lost.
This bit is set by hardware when the interface los-
es the arbitration of the bus to another master. An
interrupt is generated if ITE=1. It is cleared by soft-
ware reading SR2 register or by hardware when
the interface is disabled (PE=0).
1: Master mode
Bit 0 = SB Start bit (Master mode).
This bit is set by hardware as soon as the Start
After an ARLO event the interface switches back
automatically to Slave mode (M/SL=0).
condition is generated (following
a
write
START=1). An interrupt is generated if ITE=1. It is
cleared by software reading SR1 register followed
by writing the address byte in DR register. It is also
cleared by hardware when the interface is disa-
bled (PE=0).
The SCL line is not held low while ARLO=1.
0: No arbitration lost detected
1: Arbitration lost detected
Note:
0: No Start condition
1: Start condition generated
– In a Multimaster environment, when the interface
is configured in Master Receive mode it does not
perform arbitration during the reception of the
Acknowledge Bit. Mishandling of the ARLO bit
from the I2CSR2 register may occur when a sec-
ond master simultaneously requests the same
2
I C STATUS REGISTER 2 (SR2)
Read Only
Reset Value: 0000 0000 (00h)
2
data from the same slave and the I C master
does not acknowledge the data. The ARLO bit is
then left at 0 instead of being set.
7
0
0
0
0
AF STOPF ARLO BERR GCAL
Bit 1 = BERR Bus error.
This bit is set by hardware when the interface de-
tects a misplaced Start or Stop condition. An inter-
rupt is generated if ITE=1. It is cleared by software
reading SR2 register or by hardware when the in-
terface is disabled (PE=0).
Bit 7:5 = Reserved. Forced to 0 by hardware.
Bit 4 = AF Acknowledge failure.
This bit is set by hardware when no acknowledge
is returned. An interrupt is generated if ITE=1. It is
cleared by software reading SR2 register or by
hardware when the interface is disabled (PE=0).
The SCL line is not held low while BERR=1.
0: No misplaced Start or Stop condition
1: Misplaced Start or Stop condition
Note:
– If a Bus Error occurs, a Stop or a repeated Start
condition should be generated by the Master to
re-synchronize communication, get the transmis-
sion acknowledged and the bus released for fur-
ther communication
The SCL line is not held low while AF=1 but by oth-
er flags (SB or BTF) that are set at the same time.
0: No acknowledge failure
1: Acknowledge failure
Note:
– When an AF event occurs, the SCL line is not
held low; however, the SDA line can remain low
if the last bits transmitted are all 0. It is then nec-
essary to release both lines by software.
Bit 0 = GCAL General Call (Slave mode).
This bit is set by hardware when a general call ad-
dress is detected on the bus while ENGC=1. It is
cleared by hardware detecting a Stop condition
(STOPF=1) or when the interface is disabled
(PE=0).
Bit 3 = STOPF Stop detection (Slave mode).
This bit is set by hardware when a Stop condition
is detected on the bus after an acknowledge (if
ACK=1). An interrupt is generated if ITE=1. It is
cleared by software reading SR2 register or by
hardware when the interface is disabled (PE=0).
0: No general call address detected on bus
1: general call address detected on bus
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I C BUS INTERFACE (Cont’d)
2
2
I C CLOCK CONTROL REGISTER (CCR)
I C DATA REGISTER (DR)
Read / Write
Reset Value: 0000 0000 (00h)
Read / Write
Reset Value: 0000 0000 (00h)
7
0
7
0
FM/SM CC6
CC5
CC4
CC3
CC2
CC1
CC0
D7
D6
D5
D4
D3
D2
D1
D0
2
Bit 7 = FM/SM Fast/Standard I C mode.
This bit is set and cleared by software. It is not
cleared when the interface is disabled (PE=0).
Bit 7:0 = D[7:0] 8-bit Data Register.
These bits contain the byte to be received or trans-
mitted on the bus.
2
0: Standard I C mode
2
1: Fast I C mode
– Transmitter mode: Byte transmission start auto-
matically when the software writes in the DR reg-
ister.
Bit 6:0 = CC[6:0] 7-bit clock divider.
These bits select the speed of the bus (F
) de-
SCL
– Receiver mode: the first data byte is received au-
tomatically in the DR register using the least sig-
nificant bit of the address.
2
pending on the I C mode. They are not cleared
when the interface is disabled (PE=0).
Refer to the Electrical Characteristics section for
the table of values.
Then, the following data bytes are received one
by one after reading the DR register.
Note: The programmed F
SCL and SDA lines.
assumes no load on
SCL
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I C BUS INTERFACE (Cont’d)
2
2
I C OWN ADDRESS REGISTER (OAR1)
I C OWN ADDRESS REGISTER (OAR2)
Read / Write
Reset Value: 0000 0000 (00h)
Read / Write
Reset Value: 0100 0000 (40h)
7
0
7
0
0
ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0
FR1
FR0
0
0
0
ADD9 ADD8
7-bit Addressing Mode
Bit 7:6 = FR[1:0] Frequency bits.
Bit 7:1 = ADD[7:1] Interface address.
These bits are set by software only when the inter-
face is disabled (PE=0). To configure the interface
2
These bits define the I C bus address of the inter-
2
face. They are not cleared when the interface is
disabled (PE=0).
to I C specified delays select the value corre-
sponding to the microcontroller frequency F
.
CPU
f
FR1
0
FR0
0
1
CPU
Bit 0 = ADD0 Address direction bit.
This bit is don’t care, the interface acknowledges
either 0 or 1. It is not cleared when the interface is
disabled (PE=0).
< 6 MHz
6 to 8 MHz
0
Note: Address 01h is always ignored.
Bit 5:3 = Reserved
10-bit Addressing Mode
Bit 2:1 = ADD[9:8] Interface address.
2
These are the most significant bits of the I C bus
address of the interface (10-bit mode only). They
are not cleared when the interface is disabled
(PE=0).
Bit 7:0 = ADD[7:0] Interface address.
These are the least significant bits of the I C bus
address of the interface. They are not cleared
when the interface is disabled (PE=0).
2
Bit 0 = Reserved.
114/172
ST72260Gx, ST72262Gx, ST72264Gx
I²C BUS INTERFACE (Cont’d)
2
Table 21. I C Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
I2CCR
Reset Value
PE
0
ENGC
0
START
0
ACK
0
STOP
0
ITE
0
0028h
0029h
002Ah
02Bh
0
0
I2CSR1
Reset Value
EVF
0
ADD10
0
TRA
0
BUSY
0
BTF
0
ADSL
0
M/SL
0
SB
0
I2CSR2
Reset Value
AF
0
STOPF
0
ARLO
0
BERR
0
GCAL
0
0
0
0
I2CCCR
Reset Value
FM/SM
0
CC6
0
CC5
0
CC4
0
CC3
0
CC2
0
CC1
0
CC0
0
I2COAR1
Reset Value
ADD7
0
ADD6
0
ADD5
0
ADD4
0
ADD3
0
ADD2
0
ADD1
0
ADD0
0
02Ch
I2COAR2
Reset Value
FR1
0
FR0
1
ADD9
0
ADD8
0
002Dh
002Eh
0
0
0
0
0
0
0
I2CDR
Reset Value
MSB
0
LSB
0
0
0
0
115/172
ST72260Gx, ST72262Gx, ST72264Gx
11.7 10-BIT A/D CONVERTER (ADC)
11.7.1 Introduction
■ Data register (DR) which contains the results
■ Conversion complete status flag
■ On/off bit (to reduce consumption)
The block diagram is shown in Figure 61.
The on-chip Analog to Digital Converter (ADC) pe-
ripheral is a 10-bit, successive approximation con-
verter with internal sample and hold circuitry. This
peripheral has 6 multiplexed analog input chan-
nels (refer to device pin out description) that allow
the peripheral to convert the analog voltage levels
from 6 different sources.
11.7.3 Functional Description
11.7.3.1 Analog Power Supply
V
and V
are the high and low level refer-
SSA
DDA
The result of the conversion is stored in a 10-bit
Data Register. The A/D converter is controlled
through a Control/Status Register.
ence voltage pins. In some devices (refer to device
pin out description) they are internally connected
to the V and V pins.
DD
SS
11.7.2 Main Features
■ 10-bit conversion
■ 6 channels with multiplexed input
■ Linear successive approximation
Conversion accuracy may therefore be impacted
by voltage drops and noise in the event of heavily
loaded or badly decoupled power supply lines.
Figure 61. ADC Block Diagram
f
f
ADC
CPU
f
f
/2 f
/4
CPU, CPU , CPU
0
EOC SPEEDADON SLOW
CH2 CH1 CH0
ADCCSR
3
AIN0
AIN1
ANALOG TO DIGITAL
CONVERTER
ANALOG
MUX
AINx
ADCDRH
D9 D8 D7 D6 D5 D4
D3
D2
ADCDRL
0
0
0
0
0
0
D1
D0
116/172
ST72260Gx, ST72262Gx, ST72264Gx
10-BIT A/D CONVERTER (ADC) (Cont’d)
11.7.3.2 Digital A/D Conversion Result
When a conversion is complete:
The conversion is monotonic, meaning that the re-
sult never decreases if the analog input does not
and never increases if the analog input does not.
– The EOC bit is set by hardware.
– The result is in the ADCDR registers.
A read to the ADCDRH or a write to any bit of the
ADCCSR resets the EOC bit.
If the input voltage (V ) is greater than V
AIN
DDA
(high-level voltage reference) then the conversion
result is FFh in the ADCDRH register and 03h in
the ADCDRL register (without overflow indication).
To read the 10 bits, perform the following steps:
1. Poll EOC bit
If the input voltage (V ) is lower than V
(low-
SSA
AIN
level voltage reference) then the conversion result
in the ADCDRH and ADCDRL registers is 00 00h.
2. Read ADCDRL. This locks the ADCDRH until it
is read.
The A/D converter is linear and the digital result of
the conversion is stored in the ADCDRH and AD-
CDRL registers. The accuracy of the conversion is
described in the Electrical Characteristics Section.
3. Read ADCDRH. This clears EOC automati-
cally.
To read only 8 bits, perform the following steps:
1. Poll EOC bit
R
is the maximum recommended impedance
AIN
for an analog input signal. If the impedance is too
high, this will result in a loss of accuracy due to
leakage and sampling not being completed in the
alloted time.
2. Read ADCDRH. This clears EOC automati-
cally.
11.7.3.3 A/D Conversion
11.7.4 Low Power Modes
The analog input ports must be configured as in-
put, no pull-up, no interrupt. Refer to the «I/O
ports» chapter. Using these pins as analog inputs
does not affect the ability of the port to be read as
a logic input.
Note: The A/D converter may be disabled by re-
setting the ADON bit. This feature allows reduced
power consumption when no conversion is need-
ed and between single shot conversions.
In the ADCCSR register:
Mode
Description
– Select the CH[2:0] bits to assign the analog
channel to convert.
WAIT
No effect on A/D Converter
A/D Converter disabled.
ADC Conversion mode
After wakeup from Halt mode, the A/D
Converter requires a stabilization time
In the ADCCSR register:
HALT
t
(see Electrical Characteristics)
STAB
- Set the SPEED or the SLOW bits
before accurate conversions can be
performed.
– Set the ADON bit to enable the A/D converter
and to start the conversion. From this time on,
the ADC performs a continuous conversion of
the selected channel.
11.7.5 Interrupts
None.
117/172
ST72260Gx, ST72262Gx, ST72264Gx
10-BIT A/D CONVERTER (ADC) (Cont’d)
11.7.6 Register Description
CONTROL/STATUS REGISTER (ADCCSR)
Read/Write (Except bit 7 read only)
Reset Value: 0000 0000 (00h)
Bit 2:0 = CH[2:0] Channel Selection
These bits are set and cleared by software. They
select the analog input to convert.
Channel Pin
CH2 CH1 CH0
7
0
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
EOC SPEED ADON SLOW
0
CH2
CH1
CH0
Bit 7 = EOC End of Conversion
This bit is set by hardware. It is cleared by soft-
ware reading the ADCDRH register or writing to
any bit of the ADCCSR register.
DATA REGISTER (ADCDRH)
Read Only
0: Conversion is not complete
1: Conversion complete
Reset Value: 0000 0000 (00h)
7
0
Bit 6 = SPEED A/D clock selection
This bit is set and cleared by software.
D9
D8
D7
D6
D5
D4
D3
D2
Table 22. A/D Clock Selection (See Note 1)
f
Frequency
SLOW
SPEED
ADC
Bit 7:0 = D[9:2] MSB of Analog Converted Value
f
(See Note 2)
0
1
0
1
1
1
0
0
CPU
f
f
/2
/4
CPU
CPU
DATA REGISTER (ADCDRL)
Read Only
1)
The SPEED and SLOW bits must be updated before
Reset Value: 0000 0000 (00h)
setting the ADON bit.
2)
Use this setting only if fCPU ≤ 4 MHz
7
0
0
0
0
0
0
0
D1
D0
Bit 5 = ADON A/D Converter on
This bit is set and cleared by software.
0: Disable ADC and stop conversion
1: Enable ADC and start conversion
Bit 7:2 = Reserved. Forced by hardware to 0.
Bit 1:0 = D[1:0] LSB of Analog Converted Value
Bit 4 = SLOW A/D Clock Selection
This bit is set and cleared by software. It works to-
gether with the SPEED bit. Refer to Table 22.
118/172
ST72260Gx, ST72262Gx, ST72264Gx
10-BIT A/D CONVERTER (ADC) (Cont’d)
Table 23. ADC Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
ADCDRL
Reset Value
D1
0
D0
0
006Fh
0070h
0071h
0
0
0
0
0
0
ADCDRH
Reset Value
D9
0
D8
0
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
ADCCSR
Reset Value
EOC
0
SPEED
0
ADON
0
SLOW
0
CH2
0
CH1
0
CH0
0
0
119/172
ST72260Gx, ST72262Gx, ST72264Gx
12 INSTRUCTION SET
12.1 CPU ADDRESSING MODES
so, most of the addressing modes may be subdi-
vided in two sub-modes called long and short:
The CPU features 17 different addressing modes
which can be classified in 7 main groups:
– Long addressing mode is more powerful be-
cause it can use the full 64 Kbyte address space,
however it uses more bytes and more CPU cy-
cles.
Addressing Mode
Inherent
Example
nop
– Short addressing mode is less powerful because
it can generally only access page zero (0000h -
00FFh range), but the instruction size is more
compact, and faster. All memory to memory in-
structions use short addressing modes only
(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,
INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)
Immediate
Direct
ld A,#$55
ld A,$55
ld A,($55,X)
ld A,([$55],X)
jrne loop
Indexed
Indirect
Relative
Bit operation
bset byte,#5
The ST7 Assembler optimizes the use of long and
short addressing modes.
The CPU Instruction set is designed to minimize
the number of bytes required per instruction: To do
Table 24. CPU Addressing Mode Overview
Pointer
Address
(Hex.)
Pointer Size
(Hex.)
Length
(Bytes)
Mode
Syntax
Destination
Inherent
Immediate
Short
Long
nop
+ 0
ld A,#$55
+ 1
+ 1
+ 2
+ 0
+ 1
+ 2
+ 2
+ 2
+ 2
+ 2
+ 1
+ 2
+ 1
+ 2
+ 2
+ 3
Direct
Direct
Direct
Direct
Direct
Indirect
Indirect
ld A,$10
00..FF
ld A,$1000
ld A,(X)
0000..FFFF
00..FF
No Offset
Short
Long
Indexed
Indexed
Indexed
ld A,($10,X)
ld A,($1000,X)
ld A,[$10]
00..1FE
0000..FFFF
00..FF
Short
Long
00..FF
byte
word
byte
word
ld A,[$10.w]
ld A,([$10],X)
ld A,([$10.w],X)
jrne loop
0000..FFFF 00..FF
00..1FE 00..FF
Short
Long
Indirect Indexed
Indirect Indexed
Direct
0000..FFFF 00..FF
PC+/-127
Relative
Relative
Bit
Indirect
jrne [$10]
PC+/-127
00..FF
00..FF
00..FF
00..FF
00..FF
00..FF
00..FF
byte
byte
byte
Direct
bset $10,#7
bset [$10],#7
Bit
Indirect
Bit
Direct
Relative btjt $10,#7,skip
Bit
Indirect Relative btjt [$10],#7,skip
120/172
ST72260Gx, ST72262Gx, ST72264Gx
INSTRUCTION SET OVERVIEW (Cont’d)
12.1.1 Inherent
12.1.3 Direct
All Inherent instructions consist of a single byte.
The opcode fully specifies all the required informa-
tion for the CPU to process the operation.
In Direct instructions, the operands are referenced
by their memory address.
The direct addressing mode consists of two sub-
modes:
Inherent Instruction
Function
No operation
Direct (short)
NOP
The address is a byte, thus requires only one byte
after the opcode, but only allows 00 - FF address-
ing space.
TRAP
S/W Interrupt
Wait For Interrupt (Low Pow-
er Mode)
WFI
Direct (long)
Halt Oscillator (Lowest Power
Mode)
HALT
The address is a word, thus allowing 64 Kbyte ad-
dressing space, but requires 2 bytes after the op-
code.
RET
Sub-routine Return
Interrupt Sub-routine Return
Set Interrupt Mask (level 3)
Reset Interrupt Mask (level 0)
Set Carry Flag
IRET
SIM
12.1.4 Indexed (No Offset, Short, Long)
RIM
In this mode, the operand is referenced by its
memory address, which is defined by the unsigned
addition of an index register (X or Y) with an offset.
SCF
RCF
Reset Carry Flag
RSP
Reset Stack Pointer
Load
The indirect addressing mode consists of three
sub-modes:
LD
CLR
Clear
Indexed (No Offset)
PUSH/POP
INC/DEC
TNZ
Push/Pop to/from the stack
Increment/Decrement
Test Negative or Zero
1 or 2 Complement
Byte Multiplication
There is no offset, (no extra byte after the opcode),
and allows 00 - FF addressing space.
Indexed (Short)
CPL, NEG
MUL
The offset is a byte, thus requires only one byte af-
ter the opcode and allows 00 - 1FE addressing
space.
SLL, SRL, SRA, RLC,
RRC
Shift and Rotate Operations
Swap Nibbles
Indexed (long)
SWAP
The offset is a word, thus allowing 64 Kbyte ad-
dressing space and requires 2 bytes after the op-
code.
12.1.2 Immediate
Immediate instructions have two bytes, the first
byte contains the opcode, the second byte con-
tains the operand value.
12.1.5 Indirect (Short, Long)
The required data byte to do the operation is found
by its memory address, located in memory (point-
er).
Immediate Instruction
Function
LD
Load
The pointer address follows the opcode. The indi-
rect addressing mode consists of two sub-modes:
CP
Compare
BCP
Bit Compare
Indirect (short)
AND, OR, XOR
ADC, ADD, SUB, SBC
Logical Operations
Arithmetic Operations
The pointer address is a byte, the pointer size is a
byte, thus allowing 00 - FF addressing space, and
requires 1 byte after the opcode.
Indirect (long)
The pointer address is a byte, the pointer size is a
word, thus allowing 64 Kbyte addressing space,
and requires 1 byte after the opcode.
121/172
ST72260Gx, ST72262Gx, ST72264Gx
INSTRUCTION SET OVERVIEW (Cont’d)
12.1.6 Indirect Indexed (Short, Long)
12.1.7 Relative mode (Direct, Indirect)
This is a combination of indirect and short indexed
addressing modes. The operand is referenced by
its memory address, which is defined by the un-
signed addition of an index register value (X or Y)
with a pointer value located in memory. The point-
er address follows the opcode.
This addressing mode is used to modify the PC
register value, by adding an 8-bit signed offset to
it.
Available Relative
Direct/Indirect
Instructions
Function
The indirect indexed addressing mode consists of
two sub-modes:
JRxx
CALLR
Conditional Jump
Call Relative
Indirect Indexed (Short)
The pointer address is a byte, the pointer size is a
byte, thus allowing 00 - 1FE addressing space,
and requires 1 byte after the opcode.
The relative addressing mode consists of two sub-
modes:
Relative (Direct)
Indirect Indexed (Long)
The offset is following the opcode.
Relative (Indirect)
The pointer address is a byte, the pointer size is a
word, thus allowing 64 Kbyte addressing space,
and requires 1 byte after the opcode.
The offset is defined in memory, which address
follows the opcode.
Table 25. Instructions Supporting Direct,
Indexed, Indirect and Indirect Indexed
Addressing Modes
Long and Short
Function
Instructions
LD
Load
CP
Compare
AND, OR, XOR
Logical Operations
Arithmetic Additions/Sub-
stractions operations
ADC, ADD, SUB, SBC
BCP
Bit Compare
Short Instructions
Only
Function
CLR
Clear
INC, DEC
TNZ
Increment/Decrement
Test Negative or Zero
1 or 2 Complement
Bit Operations
CPL, NEG
BSET, BRES
Bit Test and Jump Opera-
tions
BTJT, BTJF
SLL, SRL, SRA, RLC,
RRC
Shift and Rotate Opera-
tions
SWAP
Swap Nibbles
CALL, JP
Call or Jump subroutine
122/172
ST72260Gx, ST72262Gx, ST72264Gx
INSTRUCTION SET OVERVIEW (Cont’d)
12.2 INSTRUCTION GROUPS
The ST7 family devices use an Instruction Set
consisting of 63 instructions. The instructions may
be subdivided into 13 main groups as illustrated in
the following table:
Load and Transfer
LD
CLR
POP
DEC
TNZ
OR
Stack operation
PUSH
INC
RSP
BCP
Increment/Decrement
Compare and Tests
Logical operations
CP
AND
BSET
BTJT
ADC
SLL
XOR
CPL
NEG
Bit Operation
BRES
BTJF
ADD
SRL
JRT
Conditional Bit Test and Branch
Arithmetic operations
Shift and Rotates
SUB
SRA
JRF
SBC
RLC
JP
MUL
RRC
CALL
SWAP
CALLR
SLA
Unconditional Jump or Call
Conditional Branch
JRA
JRxx
TRAP
SIM
NOP
RET
Interruption management
Condition Code Flag modification
WFI
RIM
HALT
SCF
IRET
RCF
Using a pre-byte
PDY 90
Replace an X based instruction
using immediate, direct, indexed, or inherent ad-
dressing mode by a Y one.
The instructions are described with one to four op-
codes.
PIX 92
Replace an instruction using di-
In order to extend the number of available op-
codes for an 8-bit CPU (256 opcodes), three differ-
ent prebyte opcodes are defined. These prebytes
modify the meaning of the instruction they pre-
cede.
rect, direct bit, or direct relative addressing mode
to an instruction using the corresponding indirect
addressing mode.
It also changes an instruction using X indexed ad-
dressing mode to an instruction using indirect X in-
dexed addressing mode.
The whole instruction becomes:
PC-2
PC-1
PC
End of previous instruction
Prebyte
PIY 91
Replace an instruction using X in-
direct indexed addressing mode by a Y one.
opcode
12.2.1 Illegal Opcode Reset
PC+1
Additional word (0 to 2) according
to the number of bytes required to compute the ef-
fective address
In order to provide enhanced robustness to the de-
vice against unexpected behaviour, a system of il-
legal opcode detection is implemented. If a code to
be executed does not correspond to any opcode
or prebyte value, a reset is generated. This, com-
bined with the Watchdog, allows the detection and
recovery from an unexpected fault or interference.
These prebytes enable instruction in Y as well as
indirect addressing modes to be implemented.
They precede the opcode of the instruction in X or
the instruction using direct addressing mode. The
prebytes are:
Note: A valid prebyte associated with a valid op-
code forming an unauthorized combination does
not generate a reset.
123/172
ST72260Gx, ST72262Gx, ST72264Gx
INSTRUCTION SET OVERVIEW (Cont’d)
Mnemo
ADC
ADD
AND
BCP
Description
Add with Carry
Function/Example
A = A + M + C
A = A + M
Dst
Src
I1
H
H
H
I0
N
N
N
N
N
Z
Z
Z
Z
Z
C
C
C
A
M
Addition
A
M
M
M
Logical And
A = A . M
A
Bit compare A, Memory
Bit Reset
tst (A . M)
A
BRES
BSET
BTJF
BTJT
CALL
CALLR
CLR
bres Byte, #3
bset Byte, #3
btjf Byte, #3, Jmp1
btjt Byte, #3, Jmp1
M
M
M
M
Bit Set
Jump if bit is false (0)
Jump if bit is true (1)
Call subroutine
Call subroutine relative
Clear
C
C
reg, M
reg
0
N
N
N
1
Z
Z
Z
CP
Arithmetic Compare
One Complement
Decrement
tst(Reg - M)
A = FFH-A
dec Y
M
C
1
CPL
reg, M
reg, M
DEC
HALT
IRET
INC
Halt
1
0
Interrupt routine return
Increment
Pop CC, A, X, PC
inc X
I1
H
I0
N
N
Z
Z
C
reg, M
JP
Absolute Jump
Jump relative always
Jump relative
jp [TBL.w]
JRA
JRT
JRF
Never jump
jrf *
JRIH
JRIL
Jump if ext. INT pin = 1
Jump if ext. INT pin = 0
Jump if H = 1
(ext. INT pin high)
(ext. INT pin low)
H = 1 ?
JRH
JRNH
JRM
Jump if H = 0
H = 0 ?
Jump if I1:0 = 11
Jump if I1:0 <> 11
Jump if N = 1 (minus)
Jump if N = 0 (plus)
Jump if Z = 1 (equal)
I1:0 = 11 ?
I1:0 <> 11 ?
N = 1 ?
JRNM
JRMI
JRPL
JREQ
JRNE
JRC
N = 0 ?
Z = 1 ?
Jump if Z = 0 (not equal) Z = 0 ?
Jump if C = 1
Jump if C = 0
Jump if C = 1
C = 1 ?
JRNC
JRULT
C = 0 ?
Unsigned <
Jmp if unsigned >=
Unsigned >
JRUGE Jump if C = 0
JRUGT Jump if (C + Z = 0)
124/172
ST72260Gx, ST72262Gx, ST72264Gx
INSTRUCTION SET OVERVIEW (Cont’d)
Mnemo
JRULE
LD
Description
Jump if (C + Z = 1)
Load
Function/Example
Unsigned <=
dst <= src
Dst
Src
I1
H
I0
N
N
N
N
N
Z
Z
Z
Z
Z
C
reg, M
A, X, Y
reg, M
M, reg
X, Y, A
MUL
NEG
NOP
OR
Multiply
X,A = X * A
neg $10
0
0
Negate (2's compl)
No Operation
OR operation
C
A = A + M
pop reg
pop CC
push Y
C = 0
A
M
reg
CC
M
M
POP
Pop from the Stack
M
I1
1
H
I0
0
C
0
PUSH
RCF
RET
RIM
Push onto the Stack
Reset carry flag
Subroutine Return
Enable Interrupts
Rotate left true C
Rotate right true C
Reset Stack Pointer
Substract with Carry
Set carry flag
reg, CC
I1:0 = 10 (level 0)
C <= A <= C
C => A => C
S = Max allowed
A = A - M - C
C = 1
RLC
RRC
RSP
SBC
SCF
SIM
reg, M
reg, M
N
N
Z
Z
C
C
A
M
N
Z
C
1
Disable Interrupts
Shift left Arithmetic
Shift left Logic
I1:0 = 11 (level 3)
C <= A <= 0
C <= A <= 0
0 => A => C
A7 => A => C
A = A - M
1
1
SLA
reg, M
reg, M
reg, M
reg, M
A
N
N
0
Z
Z
Z
Z
Z
Z
Z
C
C
C
C
C
SLL
SRL
SRA
SUB
SWAP
TNZ
TRAP
WFI
Shift right Logic
Shift right Arithmetic
Substraction
N
N
N
N
M
M
SWAP nibbles
A7-A4 <=> A3-A0
tnz lbl1
reg, M
Test for Neg & Zero
S/W trap
S/W interrupt
1
1
1
0
Wait for Interrupt
Exclusive OR
XOR
A = A XOR M
A
N
Z
125/172
ST72260Gx, ST72262Gx, ST72264Gx
13 ELECTRICAL CHARACTERISTICS
13.1 PARAMETER CONDITIONS
Unless otherwise specified, all voltages are re-
ferred to V
.
SS
13.1.5 Pin input voltage
13.1.1 Minimum and Maximum values
The input voltage measurement on a pin of the de-
vice is described in Figure 63.
Unless otherwise specified the minimum and max-
imum values are guaranteed in the worst condi-
tions of ambient temperature, supply voltage and
frequencies by tests in production on 100% of the
Figure 63. Pin input voltage
devices with an ambient temperature at T =25°C
A
and T =T max (given by the selected temperature
A
A
ST7 PIN
range).
Data based on characterization results, design
simulation and/or technology characteristics are
indicated in the table footnotes and are not tested
in production. Based on characterization, the min-
imum and maximum values refer to sample tests
and represent the mean value plus or minus three
times the standard deviation (mean 3Σ).
V
IN
13.1.2 Typical values
Unless otherwise specified, typical data are based
on T =25°C, V =5V (for the 3V≤V ≤5.5V volt-
A
DD
DD
age range) and V =2.7V (for the 2.7V≤V ≤3V
DD
DD
voltage range). They are given only as design
guidelines and are not tested.
Typical ADC accuracy values are determined by
characterization of a batch of samples from a
standard diffusion lot over the full temperature
range, where 95% of the devices have an error
less than or equal to the value indicated
(mean 2Σ).
13.1.3 Typical curves
Unless otherwise specified, all typical curves are
given only as design guidelines and are not tested.
13.1.4 Loading capacitor
The loading conditions used for pin parameter
measurement are shown in Figure 62.
Figure 62. Pin loading conditions
ST7 PIN
C
L
126/172
ST72260Gx, ST72262Gx, ST72264Gx
13.2 ABSOLUTE MAXIMUM RATINGS
Stresses above those listed as “absolute maxi-
mum ratings” may cause permanent damage to
the device. This is a stress rating only and func-
tional operation of the device under these condi-
tions is not implied. Exposure to maximum rating
conditions for extended periods may affect device
reliability.
13.2.1 Voltage Characteristics
Symbol
- V
Ratings
Maximum value
6.5
Unit
V
Supply voltage
DD
SS
V
1) & 2)
V
Input voltage on any pin
VSS-0.3 to VDD+0.3
IN
ESD(HBM)
V
Electrostatic discharge voltage (Human Body Model)
Electrostatic discharge voltage (Machine Model)
see Section 13.7.3 on page 142
V
ESD(MM)
13.2.2 Current Characteristics
Symbol
Ratings
Maximum value
Unit
3)
3)
I
Total current into V power lines (source)
100
150
25
50
- 25
+ 5
5
mA
VDD
DD
I
Total current out of V ground lines (sink)
SS
VSS
Output current sunk by any standard I/O and control pin
Output current sunk by any high sink I/O pin
Output current source by any I/Os and control pin
Injected current on Flash device pins PB0 and PB1
Injected current on RESET pin
I
IO
2) & 4)
I
INJ(PIN)
Injected current on OSC1 and OSC2 pins
5
5) & 6)
Injected current on any other pin
5
2)
5)
ΣI
Total injected current (sum of all I/O and control pins)
20
INJ(PIN)
13.2.3 Thermal Characteristics
Symbol
Ratings
Value
Unit
T
Storage temperature range
-65 to +150
°C
STG
Maximum junction temperature (see Section Figure 104. "Low Profile Fine Pitch Ball Grid Array
Package" on page 160)
T
J
Notes:
1. Directly connecting the I/O pins to V or V could damage the device if an unexpected change of the I/O configura-
DD
SS
tion occurs (for example, due to a corrupted program counter). To guarantee safe operation, this connection has to be
done through a pull-up or pull-down resistor (typical: 10kΩ for I/Os). Unused I/O pins must be tied in the same way to V
DD
or V according to their reset configuration. For reset pin, please refer to Figure 91 and Figure 92.
SS
2. I
must never be exceeded. This is implicitly insured if V maximum is respected. If V maximum cannot be
INJ(PIN)
IN
IN
respected, the injection current must be limited externally to the I
value. A positive injection is induced by V >V
IN DD
INJ(PIN)
while a negative injection is induced by V <V . For true open-drain pads, there is no positive injection current, and the
corresponding V maximum must always be respected.
IN
SS
IN
3. All power (V ) and ground (V ) lines must always be connected to the external supply.
DD
SS
4. Negative injection disturbs the analog performance of the device. See note in “10-BIT ADC CHARACTERISTICS” on
page 157. For best reliability, it is recommended to avoid negative injection of more than 1.6mA.
5. When several inputs are submitted to a current injection, the maximum ΣI
is the absolute sum of the positive
INJ(PIN)
and negative injected currents (instantaneous values). These results are based on characterisation with ΣI
maxi-
INJ(PIN)
mum current injection on four I/O port pins of the device.
6. True open drain I/O port pins do not accept positive injection.
127/172
ST72260Gx, ST72262Gx, ST72264Gx
13.3 OPERATING CONDITIONS
13.3.1 General Operating Conditions
T = -40 to +85°C unless otherwise specified.
A
Symbol
Parameter
Conditions
= 8 MHz. max.
Min
2.7
3.3
Max
5.5
Unit
f
f
OSC
V
Supply voltage
V
DD
= 16 MHz. max.
≥3.3V
5.5
OSC
V
V
up to 16
External clock frequency on OSC1
pin
DD
DD
f
MHz
OSC
≥2.7V
up to 8
Figure 64. f
Maximum Operating Frequency Versus VDD Supply Voltage
OSC
FUNCTIONALITY
GUARANTEED
IN THIS AREA
f
[MHz]
OSC
(UNLESS OTHERWISE
STATED IN THE
TABLES OF
PARAMETRIC DATA)
16
FUNCTIONALITY
NOT GUARANTEED
IN THIS AREA
8
4
1
0
SUPPLY VOLTAGE [V]
5.5
2.0
2.7 3.3
3.5
4.0
4.5
5.0
128/172
ST72260Gx, ST72262Gx, ST72264Gx
OPERATING CONDITIONS (Cont’d)
13.3.2 Operating Conditions with Low Voltage Detector (LVD)
T = -40 to +85°C unless otherwise specified
A
Symbol
Parameter
Conditions
High Threshold
Med. Threshold
Low Threshold
Min
Typ
Max
Unit
1)
4.0
4.2
3.75
3.15
4.5
4.0
3.35
Reset release threshold
1)
1)
V
3.55
2.95
IT+(LVD)
(V rise)
DD
V
1)
High Threshold
Med. Threshold
Low Threshold
3.75
3.3
2.75
4.0
3.55
3.0
4.25
3.75
3.15
Reset generation threshold
1)
1)
V
V
IT-(LVD)
hys(LVD)
(V fall)
DD
LVD voltage threshold hysteresis
V
-V
200
mV
ns
IT+(LVD) IT-(LVD)
20ms/V
∞
Flash
20µs/V
20µs/V
1)2)3)
Vt
V
rise time rate
DD
POR
ROM
1)
t
Filtered glitch delay on V
Not detected by the LVD
40
g(VDD)
DD
Notes:
1. Data based on characterization results, not tested in production.
2. When Vt is faster than 100 µs/V, the Reset signal is released after a delay of max. 42µs after V crosses the
POR
threshold.
DD
V
IT+(LVD)
3. Use of LVD with capacitive power supply: with this type of power supply, if power cuts occur in the application, it is
recommended to pull V down to 0V to ensure optimum restart conditions. Refer to circuit example in Figure 91 on page
DD
151 and note 6.
.
Figure 65. LVD Startup Behaviour
5V
LVD RESET
V
IT+
2V
Reset state
not defined
in this area
t
Note: When the LVD is enabled, the MCU reaches its authorized operating voltage from a reset state.
However, in some devices, the reset signal may be undefined until V is approximately 2V. As a conse-
DD
quence, the I/Os may toggle when V is below this voltage.
DD
Because Flash write access is impossible below this voltage, the Flash memory contents will not be cor-
rupted.
129/172
ST72260Gx, ST72262Gx, ST72264Gx
OPERATING CONDITIONS (Cont’d)
13.3.3 Auxiliary Voltage Detector (AVD) Thresholds
T = -40 to +85°C unless otherwise specified
A
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
1)
VD level = Low in option byte
VD level = Med. in option byte 3.9
VD level = High in option byte 3.4
4.4
4.6
4.2
3.6
4.9
4.4
3.8
1⇒0 AVDF flag toggle threshold
1)
1)
V
IT+(AVD)
(V rise)
DD
V
1)
VD level = Low in option byte
VD level = Med. in option byte 3.75
VD level = High in option byte 3.1
4.15
4.4
3.95
3.4
4.65
4.2
3.6
0⇒1 AVDF flag toggle threshold
1)
V
V
IT-(AVD)
hys(AVD)
(V fall)
1)
DD
AVD voltage threshold hysteresis
V
-V
250
IT+(AVD) IT-(AVD)
mV
Voltage drop between AVD flag set
and LVD reset activated
∆V
V
-V
450
IT-
IT-(AVD) IT-(LVD)
1. Data based on characterization results, not tested in production.
130/172
ST72260Gx, ST72262Gx, ST72264Gx
13.4 SUPPLY CURRENT CHARACTERISTICS
The following current consumption specified for the ST7 functional operating modes over temperature
range does not take into account the clock source current consumption. To get the total device consump-
tion, the two current values must be added (except for HALT mode for which the clock is stopped).
Symbol
∆I
Parameter
Conditions
Max
Unit
Supply current variation vs. temperature
Constant V and f
CPU
10
%
DD(∆Ta)
DD
13.4.1 RUN, SLOW, WAIT and SLOW WAIT Modes
T = -40 to +85°C unless otherwise specified
A
FLASH
ROM
Typ Max
Unit
Unit
Symbol
Parameter
Conditions
Typ
Max
Supply current in RUN
mode
(see Figure 66)
1)
V
V
=5.5V,f
=2.7V, f
=16MHz, f =8MHz
CPU
7.2
3.5
11
5.0
1.2
2)
DD
DD
OSC
TBD
TBD
TBD
TBD
4)
=8MHz, f
=4MHz
5.25
OSC
CPU
Supply current in SLOW
mode
(see Figure 67)
1)
4)
V
V
=5.5V, f
=2.7V, f
=16MHz, f =500kHz
CPU
0.7
1.2
0.6
0.5
3)
DD
DD
OSC
OSC
=8MHz, f
=250kHz
0.38
0.13
CPU
I
mA
DD
Supply current in WAIT
1)
4)
V
V
=5.5V,f
=16MHz, f
=8MHz
3.6
1.8
5.55
2.3
0.5
2)
DD
DD
OSC
OSC
CPU
mode
=2.7V, f
=8MHz, f
=4MHz
3
CPU
(see Figure 68)
Supply current in SLOW
1)
4)
V
V
=5.5V, f
=2.7V, f
=16MHz, f =500kHz
CPU
0.45
0.25
1
0.5
0.33
0.08
3)
DD
DD
OSC
OSC
WAIT mode
=8MHz, f
=250kHz
CPU
(see Figure 69)
Notes:
1. Data based on characterization results, tested in production at V max. and f
max.
DD
CPU
2. Program executed from RAM, CPU running with memory access, all I/O pins in input mode with a static value at V
DD
or V (no load), all peripherals in reset state; clock input (OSC1) driven by external square wave, LVD disabled.
SS
3. All I/O pins in input mode with a static value at V or V (no load), all peripherals in reset state; clock input (OSC1)
DD
SS
driven by external square wave, LVD disabled.
4. Data based on characterization results, not tested in production.
131/172
ST72260Gx, ST72262Gx, ST72264Gx
SUPPLY CURRENT CHARACTERISTICS (Cont’d)
Figure 66. Typical I in RUN at T =25°C
Figure 68. Typical I in WAIT at T =25°C
DD
A
DD
A
10
9
8
7
6
5
4
3
2
1
0
Fosc=16MHz
Fosc=8MHz
Fosc=4MHz
Fosc=2MHz
Fosc=16MHz
Fosc=8MHz
Fosc=4MHz
Fosc=2MHz
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
2.5
3
3.5
4
4.5
5
5.5
6
6.5
2.5
3
3.5
4
4.5
5
5.5
6
6.5
Vdd(V)
Vdd (V)
Figure 67. Typical I in SLOW at T =25°C
Figure 69. Typ. I in SLOW-WAIT at T =25°C
DD A
DD
A
0.6
0.5
0.4
0.3
0.2
0.1
0
Fosc=16MHz
Fosc=8MHz
Fosc=4MHz
Fosc=2MHz
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Fosc=16MHz
Fosc=8MHz
Fosc=4MHz
Fosc=2MHz
2.5
3
3.5
4
4.5
5
5.5
6
6.5
2.5
3
3.5
4
4.5
5
5.5
6
6.5
Vdd(V)
Vdd(V)
132/172
ST72260Gx, ST72262Gx, ST72264Gx
SUPPLY CURRENT CHARACTERISTICS (Cont’d)
13.4.2 HALT and ACTIVE-HALT Modes
Symbol
Parameter
Conditions
Typ
<1
Max
10
6
Unit
V
V
=5.5V -40°C≤T ≤+85°C
DD
DD
A
1)
Supply current in HALT mode
=2.7V -40°C≤T ≤+85°C
<1
A
I
µA
DD
Nomax.
guaran-
teed
2)
Supply current in ACTIVE-HALT mode
500
13.4.3 Supply and Clock Managers
The previous current consumption specified for
the ST7 functional operating modes over tempera-
ture range does not take into account the clock
source current consumption. To get the total de-
vice consumption, the two current values must be
added (except for HALT mode).
Symbol
Parameter
Conditions
Typ
Max
Unit
I
Supply current of internal RC oscillator
900
DD(RCINT)
see Section
13.5.3 on page
136
3) & 4)
I
Supply current of resonator oscillator
DD(RES)
µA
I
PLL supply current
LVD supply current
V
=5V
100
100
DD(PLL)
DD
I
HALT mode
DD(LVD)
Notes:
1. All I/O pins in output mode with a static value at V (no load), LVD disabled. Data based on characterization results,
SS
tested in production at V max. and f
max.
CPU
DD
2. Data based on characterisation results, not tested in production. All I/O pins in output mode with a static value at V
SS
(no load); clock input (OSC1) driven by external square wave, LVD disabled. To obtain the total current consumption of
the device, add the clock source consumption (Section 13.5.3 and Section 13.5.4).
3. Data based on characterization results done with the external components specified in Section 13.5.3 and Section
13.5.4, not tested in production.
4. As the oscillator is based on a current source, the consumption does not depend on the voltage.
133/172
ST72260Gx, ST72262Gx, ST72264Gx
SUPPLY CURRENT CHARACTERISTICS (Cont’d)
13.4.4 On-chip peripherals
Symbol
Parameter
Conditions
Typ
200
300
200
250
350
650
350
500
500
600
Unit
f
f
f
f
f
f
f
f
=4MHz
=8MHz
=4MHz
=8MHz
=4MHz
=8MHz
=4MHz
=8MHz
V
V
V
V
V
V
V
V
V
V
=3.0V
=5.0V
=3.0V
=5.0V
=3.0V
=5.0V
=3.0V
=5.0V
=3.0V
=5.0V
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
1)
I
16-bit Timer supply current
DD(TIM)
2)
3)
4)
I
SPI supply current
SCI supply current
I2C supply current
DD(SPI)
DD(SCI)
I
µA
I
DD(I2C)
5)
I
ADC supply current when converting
f
=4MHz
DD(ADC)
ADC
Notes:
1. Data based on a differential I measurement between reset configuration (timer counter running at f
/2) and timer
DD
CPU
counter stopped (only TIMD bit set). Data valid for one timer.
2. Data based on a differential I measurement between reset configuration (SPI disabled) and a permanent SPI master
DD
communication at maximum speed (data sent equal to FFh).This measurement includes the pad toggling consumption.
3. Data based on a differential I measurement between SCI running at maximum speed configuration (500 kbaud, con-
DD
tinuous transmission of AA +RE enabled and SCI off. This measurement includes the pad toggling consumption.
4. Data based on a differential I measurement between reset configuration (I2C disabled) and a permanent I2C master
DD
communication at 300kHz (data sent equal to AAh). This measurement includes the pad toggling consumption
(4.7kOhm external pull-up on clock and data lines).
5. Data based on a differential I measurement between reset configuration (ADC off) and continuous A/D conversion
DD
(f
=4MHz).
ADC
134/172
ST72260Gx, ST72262Gx, ST72264Gx
13.5 CLOCK AND TIMING CHARACTERISTICS
Subject to general operating conditions for V , f
, and T .
DD OSC
A
13.5.1 General Timings
1)
Symbol
Parameter
Conditions
Min
2
Typ
Max
12
Unit
tCPU
ns
3
t
Instruction cycle time
c(INST)
f
f
=8MHz
250
10
375
1500
22
CPU
CPU
2)
tCPU
µs
Interrupt reaction time
t
v(IT)
t
= ∆t
+ 10
c(INST)
=8MHz
1.25
2.75
v(IT)
13.5.2 External Clock Source
Symbol
Parameter
Conditions
Min
0.7xV
Typ
Max
Unit
V
OSC1 input pin high level voltage
OSC1 input pin low level voltage
V
DD
OSC1H
DD
V
V
V
0.3xV
DD
OSC1L
SS
t
t
3)
w(OSC1H)
see Figure 70
OSC1 high or low time
15
w(OSC1L)
ns
t
t
3)
r(OSC1)
OSC1 rise or fall time
15
1
f(OSC1)
I
OSCx Input leakage current
V
≤V ≤V
DD
µA
L
SS
IN
Figure 70. Typical Application with an External Clock Source
90%
V
V
OSC1H
OSC1L
10%
t
t
w(OSC1H)
t
t
w(OSC1L)
f(OSC1)
r(OSC1)
OSC2
Not connected internally
f
OSC
EXTERNAL
CLOCK SOURCE
I
L
OSC1
ST72XXX
Notes:
1. Data based on typical application software.
2. Time measured between interrupt event and interrupt vector fetch. ∆tc(INST) is the number of tCPU cycles needed to finish
the current instruction execution.
3. Data based on design simulation and/or technology characteristics, not tested in production.
135/172
ST72260Gx, ST72262Gx, ST72264Gx
CLOCK AND TIMING CHARACTERISTICS (Cont’d)
13.5.3 Crystal and Ceramic Resonator Oscillators
The ST7 internal clock can be supplied with four
different Crystal/Ceramic resonator oscillators. All
the information given in this paragraph are based
on characterization results with specified typical
external components. In the application, the reso-
nator and the load capacitors have to be placed as
close as possible to the oscillator pins in order to
minimize output distortion and start-up stabiliza-
tion time. Refer to the crystal/ceramic resonator
manufacturer for more details (frequency, pack-
age, accuracy...).
Symbol
Parameter
Conditions
Min
Max
Unit
MHz
kΩ
VLP : Very Low power oscillator
LP: Low power oscillator
MP: Medium power oscillator
MS: Medium speed oscillator
HS: High speed oscillator
0.032
1
>2
>4
>8
0.1
2
4
8
16
1)
f
Oscillator Frequency
OSC
R
Feedback resistor
20
40
F
VLP oscillator
60
38
32
10
10
100
100
47
47
30
Recommended load capacitance ver- R =200Ω
LP oscillator
MP oscillator
MS oscillator
HS oscillator
S
C
C
L1
L2
sus equivalent serial resistance of the R =200Ω
pF
S
crystal or ceramic resonator (R )
R =200Ω
S
S
R =100Ω
S
Symbol
Parameter
Conditions
Typ
Max
Unit
VLP oscillator
LP oscillator
MP oscillator
MS oscillator
HS oscillator
2.5
80
160
310
610
5
V
=5V
150
250
460
900
DD
i
OSC2 driving current
V =V
µA
2
IN
SS
Figure 71. Typical Application with a Crystal or Ceramic Resonator
WHEN RESONATOR WITH
INTEGRATED CAPACITORS
i
2
f
OSC
C
L1
OSC1
OSC2
RESONATOR
R
F
C
L2
R
D
ST72XXX
Notes:
1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small R value.
S
Refer to crystal/ceramic resonator manufacturer for more details.
136/172
ST72260Gx, ST72262Gx, ST72264Gx
CLOCK AND TIMING CHARACTERISTICS (Cont’d)
Typical Ceramic Resonators
f
OSC
Supplier
Recommended OSCRNGE
Option bit Configuration
2)
(MHz)
Reference
3)
2
4
CSTCC2M00G56A-R0
CSTCR4M00G55B-R0
CSTCE8M00G55A-R0
CSTCE16M0G53A-R0
MP Mode
MS Mode
HS Mode
HS Mode
8
16
Notes:
1. Resonator characteristics given by the ceramic resonator manufacturer.
2. SMD = [-R0: Plastic tape package (∅ =180mm), -B0: Bulk]
LEAD = [-A0: Flat pack package (Radial taping Ho= 18mm), -B0: Bulk]
3. LP mode is not recommended for 2 MHz resonator because the peak to peak amplitude is too small (>0.8V)
For more information on these resonators, please consult www.murata.com
137/172
ST72260Gx, ST72262Gx, ST72264Gx
CLOCK CHARACTERISTICS (Cont’d)
13.5.4 RC Oscillators
The ST7 internal clock can be supplied with an in-
ternal RC oscillator.
Symbol
Parameter
Internal RC oscillator frequency
See Figure 73
Conditions
Min
Typ
Max
Unit
T =25°C, V =5V
f
2
3.5
6
MHz
A
DD
OSC (RCINT)
Figure 72. Typical Application with RC oscillator
ST72XXX
V
DD
INTERNAL RC
Current copy
C
IN
R
IN
+
-
V
f
REF
OSC
Voltage generator
CEX discharge
Figure 73. Typical f
vs V
DD
OSC(RCINT)
4.5
4
3.5
3
2.5
2
T=25C
T=130C
T=-45C
1.5
1
0.5
0
2.35
5
5.5
Vdd(V
)
138/172
ST72260Gx, ST72262Gx, ST72264Gx
CLOCK CHARACTERISTICS (Cont’d)
13.5.5 PLL Characteristics
Symbol
Parameter
Conditions
Min
3.5
4.5
2
Typ
Max
5.5
5.5
4
Unit
T 0 to 70°C
T -40 to +85°C
A
V
PLL Operating Range
PLL input frequency range
V
DD(PLL)
OSC
A
f
MHz
%
f
f
= 4 MHz.
= 2 MHz.
1.0
2.5
2.5
4.0
OSC
1)
∆ f
/f
Instantaneous PLL jitter
CPU CPU
%
OSC
Note:
1. Data characterized but not tested.
1
Figure 74. PLL Jitter vs. Signal frequency
The user must take the PLL jitter into account in
the application (for example in serial communica-
tion or sampling of high frequency signals). The
PLL jitter is a periodic effect, which is integrated
over several CPU cycles. Therefore the longer the
period of the application signal, the less it will be
impacted by the PLL jitter.
0.8
0.7
PLL ON
0.6
0.5
0.4
0.3
0.2
0.1
0
PLL OFF
Figure 74 shows the PLL jitter integrated on appli-
cation signals in the range 125kHz to 2MHz. At fre-
quencies of less than 125KHz, the jitter is negligi-
ble.
2000
1000
500
250
125
Application Signal Frequency (KHz)
Note 1: Measurement conditions: f
= 4MHz, T = 25°C
A
CPU
139/172
ST72260Gx, ST72262Gx, ST72264Gx
13.6 MEMORY CHARACTERISTICS
13.6.1 RAM and Hardware Registers
Symbol
Parameter
Conditions
Min
Typ
Typ
Max
Unit
1)
V
Data retention mode
HALT mode (or RESET)
1.6
V
RM
13.6.2 XFlash Program Memory
Symbol
Parameter
Conditions
Min
Max
Unit
V
Operating voltage for Flash write/
erase
2.7
5.5
V
DD
2)
T =−40 to +85°C
5
10
Programming time for 1~32 bytes
Programming time for 1.5kBytes
ms
A
t
t
prog
T =+25°C
0.24
0.48
A
4)
3)
Data retention
T =+55°C
20
10
years
RET
A
N
Write erase cycles
T =+25°C
kcycles
RW
A
Read / Write / Erase
modes
3)
2.6
mA
f
= 8MHz, V = 5.5V
I
Supply current
CPU
DD
DD
No Read/No Write Mode
Power down mode / HALT
100
µA
µA
5)
0
0.1
Notes:
1. Minimum V supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware reg-
DD
isters (only in HALT mode). Guaranteed by construction, not tested in production.
2. Up to 32 bytes can be programmed at a time.
3. The data retention time increases when the T decreases.
A
4. Data based on reliability test results and monitored in production.
5. Data based on characterization results, not tested in production.
140/172
ST72260Gx, ST72262Gx, ST72264Gx
13.7 EMC CHARACTERISTICS
tion environment and simplified MCU software. It
should be noted that good EMC performance is
highly dependent on the user application and the
software in particular.
Susceptibility tests are performed on a sample ba-
sis during product characterization.
13.7.1 Functional EMS (Electro Magnetic
Susceptibility)
Therefore it is recommended that the user applies
EMC software optimization and prequalification
tests in relation with the EMC level requested for
his application.
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).
■ ESD: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.
Software recommendations:
The software flowchart must include the manage-
ment of runaway conditions such as:
– Corrupted program counter
– Unexpected reset
■ FTB: A Burst of Fast Transient voltage (positive
– Critical Data corruption (control registers...)
Prequalification trials:
and negative) is applied to V and V through
DD
SS
a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-4-
4 standard.
Most of the common failures (unexpected reset
and program counter corruption) can be repro-
duced by manually forcing a low state on the RE-
SET pin or the Oscillator pins for 1 second.
A device reset allows normal operations to be re-
sumed. The test results are given in the table be-
low based on the EMS levels and classes defined
in application note AN1709.
To complete these trials, ESD stress can be ap-
plied directly on the device, over the range of
specification values. When unexpected behaviour
is detected, the software can be hardened to pre-
vent unrecoverable errors occurring (see applica-
tion note AN1015).
13.7.1.1 Designing hardened software to avoid
noise problems
EMC characterization and optimization are per-
formed at component level with a typical applica-
Level/
Symbol
Parameter
Conditions
Class
Voltage limits to be applied on any I/O pin to induce a
functional disturbance
V
=5V, T =+25°C, f
=8MHz
OSC
DD
A
V
2B
FESD
conforms to IEC 1000-4-2
Fast transient voltage burst limits to be applied
V
=5V, T =+25°C, f =8MHz
DD
A
OSC
V
through 100pF on V and V pins to induce a func-
2B
FFTB
DD DD
conforms to IEC 1000-4-4
tional disturbance
1)
Figure 75. EMC Recommended power supply connection
ST72XXX
10µF 0.1µF
V
V
DD
SS
ST7
DIGITAL NOISE
FILTERING
POWER
SUPPLY
SOURCE
V
DD
1. The suggested 10µF and 0.1µF decoupling capacitors on the power supply lines are proposed as a good price vs. EMC
performance tradeoff. They have to be put as close as possible to the device power supply pins. Other EMC recommen-
dations are given in AN1709.
141/172
ST72260Gx, ST72262Gx, ST72264Gx
EMC CHARACTERISTICS (Cont’d)
13.7.2 Electro Magnetic Interference (EMI)
Based on a simple application running on the
product (toggling 2 LEDs through the I/O ports),
the product is monitored in terms of emission. This
emission test is in line with the norm SAE J 1752/
3 which specifies the board and the loading of
each pin.
Max vs. [f
/f
]
Unit
Monitored
Frequency Band
OSC CPU
Symbol
Parameter
Conditions
8/4MHz 16/8MHz
0.1MHz to 30MHz
30MHz to 130MHz
130MHz to 1GHz
SAE EMI Level
10
13
16
2.5
13
24
31
4
dBµV
V
=5V, T =+25°C,
A
DD
S
Peak level
EMI
conforming to SAE J 1752/3
-
13.7.3 Absolute Maximum Ratings (Electrical
Sensitivity)
13.7.3.1 Electro-Static Discharge (ESD)
Electro-Static Discharges (a positive then a nega-
tive pulse separated by 1 second) are applied to
the pins of each sample according to each pin
combination. The sample size depends on the
number of supply pins in the device (3 parts*(n+1)
supply pin). Two models can be simulated: Human
Body Model and Machine Model. This test con-
forms to the JESD22-A114A/A115A standard.
Based on three different tests (ESD, LU and DLU)
using specific measurement methods, the product
is stressed in order to determine its performance in
terms of electrical sensitivity. For more details, re-
fer to the application note AN1181.
Absolute Maximum Ratings
1)
Symbol
Ratings
Conditions
Maximum value
Unit
Electro-static discharge voltage
(Human Body Model)
T =+25°C
V
2000
A
ESD(HBM)
V
Electro-static discharge voltage
(Machine Model)
T =+25°C
V
200
A
ESD(MM)
Notes:
1. Data based on characterization results, not tested in production.
142/172
ST72260Gx, ST72262Gx, ST72264Gx
EMC CHARACTERISTICS (Cont’d)
13.7.3.2 Static and Dynamic Latch-Up
■ DLU: Electro-Static Discharges (one positive
then one negative test) are applied to each pin
of 3 samples when the micro is running to
assess the latch-up performance in dynamic
mode. Power supplies are set to the typical
values, the oscillator is connected as near as
possible to the pins of the micro and the
component is put in reset mode. This test
conforms to the IEC1000-4-2 and SAEJ1752/3
standards. For more details, refer to the
application note AN1181.
■ LU: 3 complementary static tests are required
on 10 parts to assess the latch-up performance.
A supply overvoltage (applied to each power
supply pin) and a current injection (applied to
each input, output and configurable I/O pin) are
performed on each sample. This test conforms
to the EIA/JESD 78 IC latch-up standard. For
more details, refer to the application note
AN1181.
Electrical Sensitivities
1)
Symbol
LU
Parameter
Static latch-up class
Dynamic latch-up class
Conditions
Class
T =+25°C
A
A
A
T =+85°C
A
V
=5.5V, f
=4MHz, T =+25°C
OSC A
DLU
A
DD
Notes:
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC spec-
ifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the
JEDEC criteria (international standard).
143/172
ST72260Gx, ST72262Gx, ST72264Gx
13.8 I/O PORT PIN CHARACTERISTICS
13.8.1 General Characteristics
T = -40 to +85°C unless otherwise specified
A
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
1)
V
Input low level voltage
Input high level voltage
Vss - 0.3
0.7xVDD
0.3xVDD
VDD + 0.3
IL
1)
V
IH
1)
V
Schmitt trigger voltage hysteresis
400
mV
hys
Injected current on Flash device
pins PB0 and PB1
+4
4
2)
I
INJ(PIN)
Injected Current on other I/O pins
mA
V
V
=5V
Total injected current (sum of all I/O
and control pins)
DD
2)
ΣI
25
1
INJ(PIN)
I
Input leakage current
SS≤V ≤V
IN DD
L
µA
3)
I
Static current consumption
Floating input mode
400
85
190
5
S
V
V
=5V
=3V
50
250
DD
DD
4)
R
Weak pull-up equivalent resistor
V =V
SS
kΩ
pF
ns
PU
IN
1)
1)
170
230
C
I/O pin capacitance
IO
1)
t
Output high to low level fall time
25
25
C =50pF
Between 10% and 90%
f(IO)out
r(IO)out
L
1)
t
Output low to high level rise time
5)
t
External interrupt pulse time
1
t
CPU
w(IT)in
Notes:
1. Data based on characterization results, not tested in production.
2. I
must never be exceeded. This is implicitly insured if V maximum is respected. If V maximum cannot be
INJ(PIN)
IN
IN
respected, the injection current must be limited externally to the I
value. A positive injection is induced by V >V
IN DD
INJ(PIN)
while a negative injection is induced by V <V . For true open-drain pads, there is no positive injection current, and the
corresponding V maximum must always be respected.
IN
SS
IN
Caution: Negative current injection not allowed on Flash device pins PB0 and PB1.
3. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for
example and leaving the I/O unconnected on the board or an external pull-up or pull-down resistor (see Figure 76). Data
based on design simulation and/or technology characteristics, not tested in production.
4. The R pull-up equivalent resistor is based on a resistive transistor (corresponding I current characteristics de-
PU
PU
scribed in Figure 77).
5. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external
interrupt source.
Figure 76. Two typical Applications with unused I/O Pin configured as input
V
ST7XXX
DD
UNUSED I/O PORT
10kΩ
10kΩ
UNUSED I/O PORT
ST7XXX
Note: I/O can be left unconnected if it is configured as output (0 or 1) by the software. This has the advantage of greater EMC
robustness and lower cost.
144/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 77. Typical I vs. V with V =V
SS
PU
DD
IN
120
100
80
60
40
20
0
T=25C
T=-45C
T=90C
2 2.5 3 3.5 4 4.5 5 5.5 6
Vdd(V)
Figure 78. Typical V
IL
2.5
2
1.5
1
T=25C
T=-45C
0.5
0
2
3
4
5
6
Vdd(V)
Figure 79. Typical V
IH
4
3
2
1
T=25C
T=-45C
2
3
4
5
6
Vdd(V)
145/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORT PIN CHARACTERISTICS (Cont’d)
13.8.2 Output Driving Current
T = -40 to +85°C unless otherwise specified
A
Symbol
Parameter
Conditions
Min
Max
1.2
Unit
I =+5mA
IO
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
I =+2mA
0.5
IO
1)
V
OL
I =+20mA,
1.3
IO
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
I =+8mA
0.75
IO
I =-5mA,
V
V
-1.6
IO
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
DD
DD
2)
V
OH
I =-2mA
-0.8
IO
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
I =+2mA
0.6
0.6
IO
1)3)
2)3)
1)3)
2)3)
V
OL
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
V
I =+8mA
IO
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
I =-2mA T ≤85°C
V
V
V
-0.8
IO
A
OH
DD
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
I =+2mA
0.7
0.7
IO
V
OL
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
I =+8mA
IO
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
I =-2mA
V
-0.9
DD
IO
OH
Notes:
1. The I current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of I
IO
IO
(I/O ports and control pins) must not exceed I
.
VSS
2. The I current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of
IO
I
(I/O ports and control pins) must not exceed I
. True open drain I/O pins does not have V
.
IO
VDD
OH
3. Not tested in production, based on characterization results.
146/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 80. Typ. V at V =5V (standard)
Figure 82. Typ. V at V =2.7V (standard)
OL DD
OL
DD
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.1
0.0
T=25C
T=90C
T=-45C
1.8
1.6
1.4
1.2
1
T=25C
T=90C
T=-45C
0.8
0.6
0.4
0.2
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
Iio(mA)
Iio(mA)
Figure 81. Typ. V at V =3V (high-sink)
Figure 83. Typ. V at V =5V (high-sink)
OL DD
OL
DD
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
T=25C
T=90C
T=-45C
T=25C
T=90C
T=-45C
0 1 2 3 4 5 6 7 8 9 1011121314151617181920
Iio(mA)
0
2
4
6
8
10
12
14
16
Iol(mA)
147/172
ST72260Gx, ST72262Gx, ST72264Gx
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 84. Typ. V at V =2.7V
Figure 86. Typ. V at V =3V
OH DD
OH
DD
3
2.5
2
3.5
3
2.5
2
T=25C
T=90C
T=-45C
T=25C
T=90C
T=-45C
1.5
1
1.5
1
0.5
0
0.5
0
0
1
2
3
0
0.5
1
1.5
2
Iio(mA)
Iio(mA)
Figure 87. Typ. V at V =5V
Figure 85. Typ. V at V =4V
OH
DD
OH
DD
4.5
4
6
5
4
3
2
1
0
3.5
3
T=25C
T=90C
T=-45C
2.5
2
T=25C
T=90C
1.5
1
T=-45C
0.5
0
0
1
2
3
4
5
0
1
2
3
4
5
Iio(mA
)
Iio(mA)
Notes:
1. The I current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of I
IO
IO
(I/O ports and control pins) must not exceed I
.
VSS
2. The I current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of
IO
I
(I/O ports and control pins) must not exceed I
. True open drain I/O pins does not have V
.
IO
VDD
OH
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ST72260Gx, ST72262Gx, ST72264Gx
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 88. Typical V vs. V on standard I/O port (Ports B and C)
OL
DD
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
T=25C
T=90C
T=-45C
0.6
0.5
0.4
0.3
0.2
0.1
0.0
T=25C
T=90C
T=-45C
2.5
3
3.5
4
5
5.5
6
3.5
4
5
5.5
6
Vdd (V)
Vdd (V)
Figure 89. Typical V vs. V on high sink I/O port (Port A)
OL
DD
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
T=25C
T=90C
T=-45C
T=25C
T=90C
T=-45C
3
3.5
4
5
5.5
6
2.4
3
3.5
4
5
5.5
6
Vdd (V)
Vdd (V)
149/172
ST72260Gx, ST72262Gx, ST72264Gx
13.9 CONTROL PIN CHARACTERISTICS
13.9.1 Asynchronous RESET Pin
T = -40 to +85°C unless otherwise specified
A
Symbol
Parameter
Input low level voltage
Conditions
Min
- 0.3
ss
Typ
Max
Unit
V
V
V
0.3xVDD
VDD + 0.3
IL
V
Input high level voltage
0.7xVDD
IH
1)
V
Schmitt trigger voltage hysteresis
2.5
0.68
0.28
40
V
hys
I =+5mA
0.95
0.45
80
IO
2)
V
R
Output low level voltage
V
=5V
V
OL
DD
I =+2mA
IO
V
V
=5V
=3V
20
20
DD
DD
Pull-up equivalent resistor
kΩ
ON
85
t
Generated reset pulse duration
Internal reset sources
30
µs
µs
ns
w(RSTL)out
3)
t
External reset pulse hold time
h(RSTL)in
t
Filtered glitch duration
200
g(RSTL)in
Figure 90. Typical I on RESET pin
PU
250
T=25C
T=90C
200
T=-45C
150
100
50
0
2.4
3
4
5
5.5
6
Vdd (V)
Notes:
1. Data based on characterization results, not tested in production.
2. The I current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of I
IO
IO
(I/O ports and control pins) must not exceed I
.
VSS
3. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on
RESET pin with a duration below t
can be ignored.
h(RSTL)in
150/172
ST72260Gx, ST72262Gx, ST72264Gx
CONTROL PIN CHARACTERISTICS (Cont’d)
1)2)3)4)
Figure 91. RESET pin protection when LVD is enabled.
V
ST72XXX
DD
Optional
(note 3)
Required
R
ON
Filter
INTERNAL
RESET
EXTERNAL
RESET
0.01µF
1MΩ
WATCHDOG
ILLEGALOPCODE
LVD RESET
PULSE
GENERATOR
5)
1)
Figure 92. RESET pin protection when LVD is disabled.
Recommended for EMC
V
ST72XXX
DD
V
V
DD
DD
R
ON
Filter
0.01µF
0.01µF
4.7kΩ
INTERNAL
RESET
USER
EXTERNAL
RESET
CIRCUIT
WATCHDOG
PULSE
GENERATOR
5)
ILLEGALOPCODE
Required
Note 1:
– The reset network protects the device against parasitic resets.
– The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the
device can be damaged when the ST7 generates an internal reset (LVD or watchdog).
– Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go
below the V max. level specified in Section 13.9.1 on page 150. Otherwise the reset will not be taken into account
IL
internally.
– Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must en-
sure that the current sunk on the RESET pin is less than the absolute maximum value specified for I
Section 13.2.2 on page 127.
in
INJ(RESET)
Note 2: When the LVD is enabled, it is recommended not to connect a pull-up resistor or capacitor. A 10nF pull-down
capacitor is required to filter noise on the reset line.
Note 3: In case a capacitive power supply is used, it is recommended to connect a 1MΩ pull-down resistor to the RESET
pin to discharge any residual voltage induced by the capacitive effect of the power supply (this will add 5µA to the power
consumption of the MCU).
Note 4: Tips when using the LVD:
– 1. Check that all recommendations related to the reset circuit have been applied (see notes above).
– 2. Check that the power supply is properly decoupled (100nF + 10µF close to the MCU). Refer to AN1709 and
AN2017. If this cannot be done, it is recommended to put a 100nF + 1MΩ pull-down on the RESET pin.
– 3. The capacitors connected on the RESET pin and also the power supply are key to avoid any start-up marginality.
In most cases, steps 1 and 2 above are sufficient for a robust solution. Otherwise: replace 10nF pull-down on the
RESET pin with a 5µF to 20µF capacitor.”
Note 5: Please refer to “Illegal Opcode Reset” on page 123 for more details on illegal opcode reset conditions.
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ST72260Gx, ST72262Gx, ST72264Gx
13.10 TIMER PERIPHERAL CHARACTERISTICS
Subject to general operating conditions for V
,
DD
f
, and T unless otherwise specified.
OSC
A
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
(output compare, input capture, external clock,
PWM output...).
13.10.1 16-Bit Timer
T = -40 to +85°C unless otherwise specified
A
Symbol
Parameter
Conditions
Min
1
Typ
Max
Unit
t
Input capture pulse time
t
t
w(ICAP)in
CPU
2
CPU
t
PWM resolution time
res(PWM)
f
=8MHz
250
0
ns
CPU
f
Timer external clock frequency
PWM repetition rate
f
f
/4
MHz
MHz
bit
EXT
CPU
f
0
/4
CPU
PWM
Res
PWM resolution
16
PWM
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ST72260Gx, ST72262Gx, ST72264Gx
13.11 COMMUNICATION INTERFACE CHARACTERISTICS
13.11.1 SPI - Serial Peripheral Interface
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
(SS, SCK, MOSI, MISO).
Subject to general operating conditions for V
,
DD
f
, and T unless otherwise specified.
OSC
A
Symbol
Parameter
Conditions
Min
/128
0.0625
Max
Unit
Master
Slave
f
f
f
/4
CPU
2
CPU
f
=8MHz
=8MHz
f
CPU
SCK
MHz
SPI clock frequency
1/t
/2
c(SCK)
CPU
0
f
4
CPU
t
t
r(SCK)
SPI clock rise and fall time
see I/O port pin description
f(SCK)
t
SS setup time
SS hold time
Slave
Slave
120
120
su(SS)
t
h(SS)
t
t
Master
Slave
100
90
w(SCKH)
SCK high and low time
Data input setup time
Data input hold time
w(SCKL)
t
Master
Slave
100
100
su(MI)
t
su(SI)
ns
t
Master
Slave
100
100
h(MI)
t
h(SI)
t
Data output access time
Data output disable time
Data output valid time
Data output hold time
Data output valid time
Data output hold time
Slave
Slave
0
120
240
120
a(SO)
t
dis(SO)
t
v(SO)
h(SO)
v(MO)
h(MO)
Slave (after enable edge)
t
0
t
0.25
0.25
Master (before capture edge)
t
CPU
t
Figure 93. SPI Slave Timing Diagram with CPHA=0 3)
SS
INPUT
t
t
su(SS)
c(SCK)
t
h(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
t
t
w(SCKH)
w(SCKL)
t
t
t
t
dis(SO)
a(SO)
v(SO)
h(SO)
t
t
r(SCK)
f(SCK)
see
note 2
MISO
OUTPUT
INPUT
MSB OUT
see note 2
BIT6 OUT
LSB OUT
t
t
h(SI)
su(SI)
LSB IN
MSB IN
BIT1 IN
MOSI
Notes:
1. Data based on design simulation and/or characterisation results, not tested in production.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has
its alternate function capability released. In this case, the pin status depends on the I/O port configuration.
3. Measurement points are done at CMOS levels: 0.3xV and 0.7xV
.
DD
DD
153/172
ST72260Gx, ST72262Gx, ST72264Gx
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)
Figure 94. SPI Slave Timing Diagram with CPHA=11)
SS
INPUT
t
t
su(SS)
c(SCK)
t
h(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
t
t
w(SCKH)
w(SCKL)
t
t
dis(SO)
a(SO)
t
t
h(SO)
v(SO)
t
t
r(SCK)
f(SCK)
see
note 2
see
note 2
MISO
OUTPUT
MSB OUT
BIT6 OUT
HZ
LSB OUT
t
t
h(SI)
su(SI)
MSB IN
LSB IN
BIT1 IN
MOSI
INPUT
Figure 95. SPI Master Timing Diagram 1)
SS
INPUT
t
c(SCK)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
CPHA=1
CPOL=0
CPHA=1
CPOL=1
t
t
w(SCKH)
w(SCKL)
t
t
r(SCK)
f(SCK)
t
t
h(MI)
su(MI)
MISO
MOSI
INPUT
MSB IN
h(MO)
BIT6 IN
LSB IN
t
t
v(MO)
MSB OUT
LSB OUT
see note 2
BIT6 OUT
see note 2
OUTPUT
Notes:
1. Measurement points are done at CMOS levels: 0.3xV and 0.7xV
.
DD
DD
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has
its alternate function capability released. In this case, the pin status depends of the I/O port configuration.
154/172
ST72260Gx, ST72262Gx, ST72264Gx
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)
2
Refer to Table 26 for the speed
13.11.2 I C - Inter IC Control Interface
(SDAI and SCLI).
2
conditions.
The ST7 I C interface meets the re-
Subject to general operating conditions for V
,
DD
2
quirements of the Standard I C communication
f
, and T unless otherwise specified.
OSC
A
protocol described in the following table.
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
2
2
5)
Standard mode I C
Fast mode I C
Symbol
Parameter
Unit
1)
1)
1)
1)
Min
Max
Min
1.3
Max
t
SCL clock low time
SCL clock high time
SDA setup time
4.7
4.0
250
w(SCLL)
µs
t
0.6
w(SCLH)
t
100
su(SDA)
3)
2)
3)
t
SDA data hold time
0
0
900
h(SDA)
t
t
r(SDA)
ns
SDA and SCL rise time
SDA and SCL fall time
1000
300
20+0.1C
20+0.1C
300
300
b
b
r(SCL)
t
t
f(SDA)
f(SCL)
t
START condition hold time
4.0
4.7
4.0
4.7
0.6
0.6
0.6
1.3
h(STA)
µs
t
Repeated START condition setup time
STOP condition setup time
su(STA)
su(STO)
t
µs
µs
pF
t
STOP to START condition time (bus free)
Capacitive load for each bus line
w(STO:STA)
C
400
400
b
2
Figure 96. Typical Application with I C Bus and Timing Diagram 4)
V
V
DD
DD
4.7kΩ
4.7kΩ
100Ω
100Ω
SDAI
SCLI
2
I C BUS
ST72XXX
REPEATED START
START
t
t
w(STO:STA)
su(STA)
START
SDA
t
t
r(SDA)
f(SDA)
STOP
t
t
h(SDA)
su(SDA)
SCL
t
t
t
t
t
t
h(STA)
w(SCKH)
w(SCKL)
r(SCK)
su(STO)
f(SCK)
Notes:
2
1. Data based on standard I C protocol requirement, not tested in production.
2. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined
region of the falling edge of SCL.
3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low period of
SCL signal.
4. Measurement points are done at CMOS levels: 0.3xV and 0.7xV
.
DD
DD
2
2
5. At 4MHz f
, max.I C speed (400kHz) is not achievable. In this case, max. I C speed will be approximately 260KHz.
CPU
155/172
ST72260Gx, ST72262Gx, ST72264Gx
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)
The following table gives the values to be written in
2
the I2CCCR register to obtain the required I C
SCL line frequency.
Table 26. SCL Frequency Table
I2CCCR Value
f
f
=4 MHz.
f
=8 MHz.
SCL
CPU
CPU
V
= 3.3 V
V
= 5 V
V
= 3.3 V
V
= 5 V
DD
(kHz)
DD
DD
DD
R =3.3kΩ R =4.7kΩ R =3.3kΩ R =4.7kΩ R =3.3kΩ R =4.7kΩ R =3.3kΩ R =4.7kΩ
P
P
P
P
P
P
P
P
400
300
200
100
50
NA
NA
NA
NA
NA
NA
NA
NA
83h
85h
8Ah
24h
4Ch
FFh
NA
85h
89h
23h
4Ch
FFh
83h
85h
8Ah
24h
4Ch
FFh
83h
85h
8Ah
23h
4Ch
FFh
83h
10h
24h
5Fh
84h
10h
24h
5Fh
83h
10h
24h
5Fh
84h
10h
24h
5Fh
20
Legend:
R = External pull-up resistance
P
2
f
= I C speed
SCL
NA = Not achievable
Note:
– For speeds around 200 kHz, achieved speed can have ±5% tolerance
– For other speed ranges, achieved speed can have ±2% tolerance
The above variations depend on the accuracy of the external components used.
156/172
ST72260Gx, ST72262Gx, ST72264Gx
13.12 10-BIT ADC CHARACTERISTICS
= 2.7 to 5.5V, T = -40°C to 85°C, unless otherwise specified
V
DD
A
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
MHz
V
f
ADC clock frequency
0.5
4
ADC
V
Conversion voltage range
Internal sample and hold capacitor
V
V
DD
AIN
SS
C
6
pF
ADC
28
µs
FLASH, f
=4MHz
ADC
112
3.5
14
1/f
ADC
t
Conversion time
CONV
µs
1/f
ROM, f
=4MHz
ADC
ADC
R
C
External input impedance
see
Figure 97
and
kΩ
AIN
AIN
External capacitor on analog input
pF
Variation frequency of analog input
signal
Figure
98
f
Hz
AIN
1)2)3)
2)
3)
Figure 97. R
max. vs f
with C =0pF
Figure 98. Recommended C /R
values
AIN
ADC
AIN
AIN AIN
45
40
35
30
25
20
15
10
5
1000
100
10
Cain 10 nF
Cain 22 nF
Cain 47 nF
4 MHz
2 MHz
1 MHz
1
0
0.1
0
10
30
70
0.01
0.1
1
10
CPARASITIC (pF)
fAIN(KHz)
Figure 99. Analog Input equivalent circuit
V
DD
ST72XXX
V
T
0.6V
R
2kΩ(max)
AIN
AINx
10-Bit A/D
Conversion
V
AIN
C
V
0.6V
AIN
T
I
C
ADC
6pF
L
1µA
Notes:
1. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10kΩ). Data
based on characterization results, not tested in production.
2. C
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad ca-
PARASITIC
pacitance (3pF). A high C
value will downgrade conversion accuracy. To remedy this, f
should be reduced.
PARASITIC
ADC
3. This graph shows that depending on the input signal variation (f ), C
can be increased for stabilization time and
AIN
AIN
decreased to allow the use of a larger serial resistor (R
. It is valid for all f
frequencies ≤ 4MHz.
AIN)
ADC
157/172
ST72260Gx, ST72262Gx, ST72264Gx
ADC CHARACTERISTICS (Cont’d)
13.12.0.1 General PCB Design Guidelines
Analog signals paths should run over the analog
ground plane and be as short as possible. Isolate
analog signals from digital signals that may
switch while the analog inputs are being sampled
by the A/D converter. Do not toggle digital out-
puts on the same I/O port as the A/D input being
converted.
To obtain best results, some general design and
layout rules should be followed when designing
the application PCB to shield the noise-sensitive,
analog physical interface from noise generating
CMOS logic signals.
– Properly place components and route the signal
traces on the PCB to shield the analog inputs.
ADC Accuracy with f
=8 MHz, f
=4 MHz R < 10kΩ, V = 4.5V to 5.5V
CPU
ADC AIN DD
FLASH
ROM
Symbol
|E |
Parameter
Conditions
Unit
2)
2)
Typ
4
Max
Typ
Max
TBD
TBD
TBD
TBD
TBD
1)
Total unadjusted error
6
TBD
TBD
TBD
TBD
TBD
T
1)
|E |
Offset error
1
5
O
1)
|E |
Gain Error
1
4.5
4.5
4.5
LSB
G
1)
|E |
Differential linearity error
1.5
3
D
1)
|E |
Integral linearity error
L
Figure 100. ADC Accuracy Characteristics
Digital Result ADCDR
E
G
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
1023
V
– V
1022
1021
DD
SS
1LSB
= -------------------------------
IDEAL
1024
(2)
E =Total Unadjusted Error: maximum deviation
T
E
between the actual and the ideal transfer curves.
T
(3)
7
6
5
4
3
2
1
E =Offset Error: deviation between the first actual
O
transition and the first ideal one.
(1)
E =Gain Error: deviation between the last ideal
G
transition and the last actual one.
E
E
O
L
E =Differential Linearity Error: maximum deviation
D
between actual steps and the ideal one.
E =Integral Linearity Error: maximum deviation
L
E
between any actual transition and the end point
correlation line.
D
1 LSB
IDEAL
V
(LSB
)
in
IDEAL
0
1
2
3
4
5
6
7
1021 1022 1023 1024
V
V
DD
SS
Notes:
1. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the analog input pins significantly
reduces the accuracy of the conversion being performed on another analog input.
For I =0.8mA, the typical leakage induced inside the die is 1.6µA and the effect on the ADC accuracy is a loss of 4 LSB
INJ-
for each 10KΩ increase of the external analog source impedance. It is recommended to add a Schottky diode (pin to
ground) to analog pins which may potentially inject negative current. Any positive injection current within the limits spec-
ified for I
and ΣI
in Section 13.8 does not affect the ADC accuracy.
INJ(PIN)
INJ(PIN)
2. Refer to “Typical values” on page 126 for more information on typical ADC accuracy values.
158/172
ST72260Gx, ST72262Gx, ST72264Gx
14 PACKAGE CHARACTERISTICS
14.1 PACKAGE MECHANICAL DATA
Figure 101. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width
mm
inches
Dim.
Min Typ Max Min Typ Max
E
eC
A
3.56 3.76 5.08 0.140 0.148 0.200
A1 0.51
A2 3.05 3.56 4.57 0.120 0.140 0.180
0.36 0.46 0.58 0.014 0.018 0.023
b1 0.76 1.02 1.40 0.030 0.040 0.055
0.020
A2
A
L
b
A1
E1
C
eA
eB
C
D
E
0.20 0.25 0.36 0.008 0.010 0.014
27.43 28.45 1.080 1.100 1.120
9.91 10.41 11.05 0.390 0.410 0.435
b
b2
e
D
E1 7.62 8.89 9.40 0.300 0.350 0.370
e
1.78
0.070
0.400
eA
eB
eC
L
10.16
12.70
1.40
0.500
0.055
2.54 3.05 3.81 0.100 0.120 0.150
Number of Pins
N
32
Figure 102.
Figure 103. 28-Pin Plastic Small Outline Package, 300-mil Width
mm
inches
Dim.
A
Min Typ Max Min Typ Max
D
h x 45×
2.35
2.65 0.093
0.30 0.004
0.51 0.013
0.32 0.009
18.10 0.697
7.60 0.291
0.104
0.012
0.020
0.013
0.713
0.299
L
A
A1 0.10
C
A1
B
C
D
E
e
0.33
0.23
a
e
B
17.70
7.40
1.27
0.050
H
h
α
L
10.00
0.25
0°
10.65 0.394
0.75 0.010
0.419
0.030
8°
E
H
8°
0°
0.40
1.27 0.016
0.050
Number of Pins
N
28
159/172
ST72260Gx, ST72262Gx, ST72264Gx
Figure 104. Low Profile Fine Pitch Ball Grid Array Package
SEATING
PLANE
C
mm
inches
Dim
A
Min Typ Max Min Typ Max
1.210
1.700 0.048
0.011
0.067
A1 0.270
A2
1.120
0.044
D
b
D
0.450 0.500 0.550 0.018 0.020 0.022
5.750 6.000 6.150 0.226 0.236 0.242
D1
e
f
D1
E
4.000
5.750 6.000 6.150 0.226 0.236 0.242
4.000 0.157
0.157
E1
e
0.720 0.800 0.880 0.028 0.031 0.035
0.850 1.000 1.150 0.033 0.039 0.045
f
ddd
0.120
0.005
A1 CORNER INDEX AREA
(SEE NOTE 3)
∅b (36 BALLS)
BOTTOM VIEW
14.2 THERMAL CHARACTERISTICS
Symbol
Ratings
Package thermal resistance (junction to ambient)
SDIP32
Value
Unit
60
75
56
72
R
SO28
LFBGA 6x6 (on multilayer PCB)
LFBGA 6x6 (on single-layer PCB)
°C/W
thJA
1)
P
Power dissipation
Maximum junction temperature
500
150
mW
°C
D
2)
T
Jmax
Notes:
1. The power dissipation is obtained from the formula P =P +P
where P
is the chip internal power (I xV
)
D
INT
PORT
INT
DD DD
and P
is the port power dissipation determined by the user.
PORT
2. The average chip-junction temperature can be obtained from the formula T = T + P x RthJA.
J
A
D
160/172
ST72260Gx, ST72262Gx, ST72264Gx
14.3 LEAD-FREE PACKAGE INFORMATION
STMicroelectronics is fully committed to Environ-
ment protection and sustainable development and
started in 1997 a volontary program for removing
polluting and hazardous substances from all de-
vices. In 2000, a strategic program, named ECO-
PACK®, has been officially launched to develop
and implement solutions leading to environment
friendly packaging and ban progressively Pb and
other heavy metals from our manufacturing lines.
Please refer to application notes AN2033,
AN2034, AN2035 and AN2036 for further informa-
tion.
161/172
ST72260Gx, ST72262Gx, ST72264Gx
15 DEVICE CONFIGURATION AND ORDERING INFORMATION
Each device is available for production in user pro-
grammable versions (FLASH) as well as in factory
coded versions (ROM/FASTROM).
OPT 5:4 = VD[1:0] Voltage detection selection
These option bits enable the voltage detection
block (LVD and AVD) with a selected threshold of
the LVD and AVD.
ST7226x devices are ROM versions. ST72P26x
devices are Factory Advanced Service Technique
ROM (FASTROM) versions: they are factory-pro-
grammed XFlash devices.
Configuration
VD1 VD0
1
1
0
0
1
0
1
0
LVD Off
Lowest Voltage Threshold (∼3.05V)
Medium Voltage Threshold (∼3.6V)
Highest Voltage Threshold (∼4.1V)
ST72F26x XFlash devices are shipped to custom-
ers with a default program memory content (FFh).
The option bytes are programmed to enable the in-
ternal RC oscillator. The ROM/FASTROM factory
coded parts contain the code supplied by the cus-
tomer. This implies that FLASH devices have to be
configured by the customer using the Option Bytes
while the ROM/FASTROM devices are factory-
configured.
OPT 3:2 = SEC[1:0] Sector 0 size definition
These option bits indicate the size of sector 0 ac-
cording to the following table.
Sector 0 Size
SEC1
SEC0
0.5k
1k
2
0
0
1
1
0
1
0
1
15.1 OPTION BYTES
The two option bytes allow the hardware configu-
ration of the microcontroller to be selected.
The option bytes have no address in the memory
map and can be accessed only in programming
mode (for example using a standard ST7 program-
ming tool). The default content of the FLASH is
fixed to FFh.
1)
4k
Note 1: 4k available on FASTROM devices only.
In masked ROM devices, the option bytes are
fixed in hardware by the ROM code (see option
list).
OPT 1 = FMP_R Read-out protection
Read-out protection, when selected, provides a
protection against Program Memory content ex-
traction and against write access to Flash memo-
ry.
USER OPTION BYTE 0
OPT 7 = WDG HALT Watchdog reset on HALT
This option bit determines if a RESET is generated
when entering HALT mode while the Watchdog is
active.
0: No Reset generation when entering Halt mode
1: Reset generation when entering Halt mode
Erasing the option bytes when the FMP_R option
is selected will cause the whole memory to be
erased first, and the device can be reprogrammed.
Refer to Section 4.5 and the ST7 Flash Program-
ming Reference Manual for more details.
0: Read-out protection off
1: Read-out protection on
OPT 6 = WDG SW Hardware or software watch-
dog
This option bit selects the watchdog type.
0: Hardware (watchdog always enabled)
1: Software (watchdog to be enabled by software)
USER OPTION BYTE 0
USER OPTION BYTE 1
7
0
7
0
OSC OSC OSC OSC OSC
EXTIT Res. TYPE TYPE RNGE RNGE RNGE
PLL
WDG WDG
HALT SW
SEC SEC FMP FMP
VD1 VD0
1
0
R
W
OFF
1
0
2
1
0
Default
Value
1
1
1
1
1
1
0
0
1
1
1
0
1
1
1
1
162/172
1
ST72260Gx, ST72262Gx, ST72264Gx
DEVICE CONFIGURATION (Cont’d)
OPT 0 = FMP_W FLASH write protection
This option indicates if the FLASH program mem-
ory is write protected.
OPT 3:1 = OSCRNGE[2:0] Oscillator Range se-
lection
These option bits select the oscillator range.
Warning: When this option is selected, the pro-
gram memory (and the option bit itself) can never
be erased or programmed again.
0: Write protection off
OSC
RNGE2
OSC
RNGE1
OSC
RNGE0
Typ. Freq. Range
1: Write protection on
VLP 32~100kHz
1
0
0
0
0
x
0
0
1
1
x
0
1
0
1
USER OPTION BYTE 1
LP
1~2MHz
2~4MHz
4~8MHz
8~16MHz
OPT 7 = EXTIT Port C External Interrupt Configu-
ration.
This option bit allows the Port C external interrupt
mapping to be configured as ei0 or ei1.
MP
MS
HS
Table 27. External Interrupt Configuration
EXTIT
OPT 0 = PLL PLL selection
ei0
ei1
option
bit
This option bit selects the PLL which allows multi-
plication by two of the oscillator frequency. The
PLL must not be used with the internal RC oscilla-
PB[7:0] Ports
PC[5:0] Ports
PA[7:0] Ports
1
0
tor. It is guaranteed only with a f
cy between 2 and 4MHz.
0: PLL x2 enabled
input frequen-
OSC
PA[7:0] Ports
PC[5:0] Ports
PB[7:0] Ports
1: PLL x2 disabled
CAUTION: the PLL can be enabled only if the
“OSC RANGE” (OPT3:1) bits are configured to
“MP - 2~4MHz”. Otherwise, the device functionali-
ty is not guaranteed.
OPT 6 = Reserved, must be kept at default value.
OPT 5:4 = OSCTYPE[1:0] Oscillator Type selec-
tion
These option bits select the Oscillator Type.
Clock Source
Resonator Oscillator
Reserved
OSCTYPE1 OSCTYPE0
0
0
1
1
0
1
0
1
Internal RC Oscillator
External Source
163/172
1
ST72260Gx, ST72262Gx, ST72264Gx
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE
Customer code is made up of the ROM/FAS-
TROM contents and the list of the selected options
(if any). The ROM/FASTROM contents are to be
sent on diskette, or by electronic means, with the
S19 hexadecimal file generated by the develop-
ment tool. All unused bytes must be set to FFh.
The selected options are communicated to
STMicroelectronics using the correctly completed
OPTION LIST appended.
Refer to application note AN1635 for information
on the counter listing returned by ST after code
has been transferred.
The STMicroelectronics Sales Organization will be
pleased to provide detailed information on con-
tractual points.
Table 28. Supported Part Numbers
Program Memory
(Bytes)
RAM
(Bytes)
Part Number
Temp. Range
Package
ST72F264G1B6
SDIP32
SO28
ST72F264G1M6
4K FLASH
8K FLASH
256
ST72F262G1B6
SDIP32
SO28
-40°C +85°C
ST72F262G1M6
ST72F264G2B6
SDIP32
SO28
ST72F264G2M6
ST72F264G2H1
0°C +70°C
LFBGA
lead-free LFBGA
SDIP32
SO28
256
ST72F264G2H6E
ST72F262G2B6
-40°C +85°C
ST72F262G2M6
ST72F262G1B6
SDIP32
SO28
-40°C +85°C
ST72F262G1M6
4K FLASH
256
256
ST72F260G1B6
SDIP32
SO28
ST72F260G1M6
ST72P264G2B6/xxx
ST72P264G2M6/xxx
ST72P264G2H1/xxx
ST72P262G2B6/xxx
ST72P262G2M6/xxx
ST72P262G1B6/xxx
ST72P262G1M6/xxx
ST72P260G1B6/xxx
ST72P260G1M6/xxx
ST72264G2B6/xxx
ST72264G2M6/xxx
ST72262G2B6/xxx
ST72262G2M6/xxx
ST72262G1B6/xxx
ST72262G1M6/xxx
ST72260G1B6/xxx
ST72260G1M6/xxx
SDIP32
SO28
-40°C +85°C
0°C +70°C
8K FASTROM
LFBGA
SDIP32
SO28
SDIP32
SO28
-40°C +85°C
4K FASTROM
8K ROM
256
256
256
SDIP32
SO28
SDIP32
SO28
SDIP32
SO28
-40°C +85°C
SDIP32
SO28
4K ROM
SDIP32
SO28
164/172
1
ST72260Gx, ST72262Gx, ST72264Gx
TRANSFER OF CUSTOMER CODE (Cont’d)
ST72264 ROM/FASTROM MICROCONTROLLER OPTION LIST
(Last update: 15 January 2004)
Customer
Address
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact
Phone No
Reference /ROM or FASTROM Code*
ROM or FASTROM code is assigned by STMicroelectronics.
Code must be sent in .S19 format. .Hex extension cannot be processed.
Device Type/Memory Size/Package (check only one option):
----------------------------
-------------------------------------------- ----------------------------------------------------------------
|
|
|
8K
4K
ROM DEVICE:
|
-------------------------------------------- ----------------------------------------------------------------
----------------------------
SO28:
SDIP32:
| [ ]ST72264G2
| [ ]ST72264G2
[ ]ST72262G2 | [ ]ST72264G1 [ ]ST72262G1 [ ]ST72260G1
[ ]ST72262G2 | [ ]ST72264G1 [ ]ST72262G1 [ ]ST72260G1
---------------------------
-------------------------------------------- ----------------------------------------------------------------
|
|
|
8K
4K
FASTROM DEVICE:
|
-------------------------------------------- ----------------------------------------------------------------
----------------------------
SO28:
SDIP32:
BGA6x6:
| [ ]ST72P264G2 [ ]ST72P262G2 | [ ]ST72P264G1 [ ]ST72P262G1 [ ]ST72P260G1
| [ ]ST72P264G2 [ ]ST72P262G2 | [ ]ST72P264G1 [ ]ST72P262G1 [ ]ST72P260G1
| [ ]ST72P264G2
|
---------------------------- ------------------------------------------- ----------------------------------------------------------------
|
|
|
DIE FORM:
[ ] 8K
[ ] 4K
|
---------------------------- -------------------------------------------- ----------------------------------------------------------------
Conditioning (check only one option, do not specify for DIP package):
SO package:
Die form:
[ ] Tape & Reel
[ ] Tape & Reel
[ ] Tube
[ ] Inked wafer
[ ] Sawn wafer on sticky foil
Special Marking
[ ] No
[ ] Yes
Authorized characters are letters, digits ‘.’, ‘-’, ‘/’ and spaces only.
Maximum character count: SO28 (13 char. max): _ _ _ _ _ _ _ _ _ _ _ _ _
SDIP32 (15 char. max): _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
BGA6x6 (7 char. max): _ _ _ _ _ _ _
Temperature Range:
Packaged form:
[ ] 0°C to + 70°C
[ ] - 10°C to + 85°C (except BGA)
[ ] - 40°C to + 85°C (except BGA)
[ ] Tested at 25°C only
Die form:
[ ] Reset
Watchdog Reset on Halt:
Watchdog Selection:
VD Reset
[ ] No Reset
[ ] Hardware Activation
[ ] Enabled:
[ ] Software Activation
[ ] Disabled
[ ] Highest threshold
[ ] Medium threshold
[ ] Lowest threshold
Sector 0 Size:
[ ] 0.5K
[ ] 1K
[ ] Enabled
[ ] 2K
[ ] 4K (FASTROM only)
Readout Protection:
Flash Write Protection:
External Interrupt:
[ ] Disabled
[ ] Disabled
[ ] Enabled (FASTROM only)
[ ] Port A&C on ei0 interrupt vector, Port B on ei1 (PA&C_PB)
[ ] Port A on ei0 interrupt vector, Port B&C on ei1 (PA_PB&C)
Clock Source Selection:
[ ] Resonator:
[ ] VLP: Very Low power resonator (32 to 100 kHz)
[ ] LP: Low power resonator (1 to 2 MHz)
[ ] MP: Medium power resonator (2 to 4 MHz)
[ ] MS: Medium speed resonator (4 to 8 MHz)
[ ] HS: High speed resonator (8 to 16 MHz)
1)
[ ] Internal RC Oscillator
[ ] External Clock
[ ] Disabled
1
PLL :
[ ] Enabled
Supply Operating Range in the application: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Notes:
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signature:
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Note 1: Use of the PLL with the internal RC oscillator is not supported.
Important note: Not all configurations are available. See Table 28 on page 164 for the list of supported part numbers.
Please download the latest version of this option list from:
http://www.st.com/mcu > downloads > ST7 microcontrollers > Option list
165/172
ST72260Gx, ST72262Gx, ST72264Gx
15.3 DEVELOPMENT TOOLS
STMicroelectronics offers a range of hardware
and software development tools for the ST7 micro-
controller family. Full details of tools available for
the ST7 from third party manufacturers can be ob-
tained from the STMicroelectronics Internet site:
http//www.st.com.
Includes STX-InDART/USB board (USB port)
and one specific evaluation board for ST72264
(package SDIP32)
■ ST7F264-INDART:
Low-cost
In-Circuit
Debugging kit from Softec Microsystems
Includes STX-InDART/USB board (parallel port)
and one specific evaluation board for ST72264
(package SDIP32)
Tools from these manufacturers include C compli-
ers, evaluation tools, emulators and programmers.
■ STxF-INDART/USB
Emulators
Flash Programming tools
Two types of emulators are available from ST for
the ST72260/262/264 family:
■ ST7 DVP3 entry-level emulator offers a flexible
and modular debugging and programming
solution.
■ ST7 EMU3 high-end emulator is delivered with
everything (probes, TEB, adapters etc.) needed
to start emulating the ST72260/262/264. To
configure it to emulate other ST7 subfamily
devices, the active probe for the ST7EMU3 can
be changed and the ST7EMU3 probe is
designed for easy interchange of TEBs (Target
Emulation Board). See Table 29.
■ ST7-STICK ST7 In-circuit Communication Kit, a
complete software/hardware package for
programming ST7 Flash devices. It connects to
a host PC parallel port and to the target board or
socket board via ST7 ICC connector.
■ ICC Socket Boards provide an easy to use and
flexible means of programming ST7 Flash
devices. They can be connected to any tool that
supports the ST7 ICC interface, such as ST7
EMU3, ST7-DVP3, inDART, ST7-STICK, or
many third-party development tools.
Evaluation boards
In-circuit Debugging Kit
One evaluation tool is available from ST:
Three configurations are available from ST:
■ ST7FOPTIONS-EVAL: ST7 Clock Security
System evaluation board
■ ST7F264-IND/USB:
Low-cost
In-Circuit
Debugging kit from Softec Microsystems.
Table 29. STMicroelectronics Development Tools
Emulation
Programming
Supported
Products
ST7 DVP3 Series
ST7 EMU3 series
ICC Socket Board
Active Probe &
Emulator
Connection kit
Emulator
T.E.B.
ST7MDT10-
DVP3
ST7MDT10-
EMU3
2)
ST7MDT10-32/DVP
ST7MDT10-TEB
ST7SB10-26x
ST7226xGx
1)
1)
Notes:
1. BGA adapter not available for ST7MDT10-DVP3 and ST7MDT10-EMU3 .
2. Add suffix /EU, /UK, /US for the power supply of your region.
15.3.1 Related Documentation
AN 988: Getting started with ST7 Assembly Tool
chain
AN 978: Key features of the STVD7 ST7 Visual
Debug Package
AN 989: Getting started with ST7 Hiware C Tool-
chain
AN 983: Key Features of the Cosmic ST7 C-Com-
piler Package
AN1604: How to use ST7MDT1-TRAIN with
ST72F264
166/172
1
ST72260Gx, ST72262Gx, ST72264Gx
15.3.2 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Table 30. Suggested List of SDIP32 Socket Types
Same
Package / Probe
Adaptor / Socket Reference
Socket Type
Footprint
SDIP32
EMU PROBE
TEXTOOL
232-1291-00
X
Textool
Table 31. Suggested List of SO28 Socket Types
Same
Footprint
Package / Probe
Adaptor / Socket Reference
Socket Type
SO28
YAMAICHI
IC51-0282-334-1
Clamshell
EMU PROBE
Adapter from SO28 to SDIP32 footprint (delivered with emulator)
X
SMD to SDIP
Table 32. Suggested LFBGA Socket Type
Package
Socket Reference
LFBGA 6 X6
ENPLAS OTB-36(144)-0.8-04
167/172
1
ST72260Gx, ST72262Gx, ST72264Gx
16 KNOWN LIMITATIONS
16.1 ALL FLASH AND ROM DEVICES
16.1.1 16-bit timer PWM Mode
– The interrupt request is cleared (flag reset or in-
terrupt mask) in any part of the code while this in-
terrupt is disabled
In PWM mode, the first PWM pulse is missed after
writing the value FFFCh in the OC12R register.In
PWM mode, the first PWM pulse is missed after
writing the value FFFCh in the OC1R register
(OC1HR, OC1LR). It leads to either full or no PWM
during a period, depending on the OLVL1 and
OLVL2 settings.
If these conditions are not met, the symptom can
be avoided by implementing the following se-
quence:
PUSH CC
SIM
reset flag or interrupt mask
POP CC
16.1.2 Clearing active interrupts outside
interrupt routine
16.1.3 I2C Multimaster
When an active interrupt request occurs at the
same time as the related flag or interrupt mask is
being cleared, the CC register may be corrupted.
In multimaster configurations, if the ST7 I2C re-
ceives a START condition from another I2C mas-
ter after the START bit is set in the I2CCR register
and before the START condition is generated by
the ST7 I2C, it may ignore the START condition
from the other I2C master. In this case, the ST7
master will receive a NACK from the other device.
On reception of the NACK, ST7 can send a re-start
and Slave address to re-initiate communication
Concurrent interrupt context
The symptom does not occur when the interrupts
are handled normally, i.e. when:
– The interrupt request is cleared (flag reset or in-
terrupt mask) within its own interrupt routine
– The interrupt request is cleared (flag reset or in-
terrupt mask) within any interrupt routine
16.1.4 Functional EMS
The functional EMS (Electro Magnetic Susceptibil-
ity) severity level/behaviour class is 2B as defined
in application note AN1709.
– The interrupt request is cleared (flag reset or in-
terrupt mask) in any part of the code while this in-
terrupt is disabled
Special care should be taken when designing the
PCB layout and firmware (refer to application
notes AN898, AN901 and AN1015) in sensitive
applications (that use switches for instance). For
more information refer to application note AN1637.
If these conditions are not met, the symptom can
be avoided by implementing the following se-
quence:
Perform SIM and RIM operation before and after
resetting an active interrupt request
Ex:
16.2 FLASH DEVICES ONLY
SIM
16.2.1 Execution of BTJX instruction
reset flag or interrupt mask
RIM
When testing the address $FF with the "BTJT" or
"BTJF" instructions, the CPU may perform an in-
correct operation when the relative jump is nega-
tive and performs an address page change.
Nested interrupt context
The symptom does not occur when the interrupts
are handled normally, i.e. when:
To avoid this issue, including when using a C com-
piler, it is recommended to never use address
$00FF as a variable (using the linker parameter for
example).
– The interrupt request is cleared (flag reset or in-
terrupt mask) within its own interrupt routine
– The interrupt request is cleared (flag reset or in-
terrupt mask) within any interrupt routine with
higher or identical priority level
168/172
1
ST72260Gx, ST72262Gx, ST72264Gx
16.2.2 I/O Port B and C configuration
Workaround
When using an external quartz crystal or ceramic
Switch off the ADC by software (ADON=0) before
executing a HALT instruction.
resonator, the f
clock may be disturbed be-
OSC2
cause the device goes into reserved mode control-
led by Port B and C.
16.2.8 Active Halt wake-up by external interrupt
External interrupts are not able to wake-up the
MCU from Active Halt mode. The MCU can only
exit from Active Halt mode by means of an MCC/
RTC interrupt or a reset.
This happens with either one of the following con-
figurations:
PB1=0, PC2=1, PB3=0 while PLL option is both
disabled and PC4 is toggling
Workaround
PB1=0, PC2=1, PB3=0, PC4=1 while PLL option
is enabled
Use WAIT mode if external interrupt capability is
required in low power mode.
This is detailed in the following table:
16.2.9 SCI Wrong Break duration
Description
PLL PB1 PC2 PB3 PC4 Clock Disturbance
Tog Max. 2 clock cycles
glin lost at each rising or
A single break character is sent by setting and re-
setting the SBK bit in the SCICR2 register. In
some cases, the break character may have a long-
er duration than expected:
OFF
ON
0
0
1
1
0
0
g
falling edge of PC4
Max. 1 clock cycle
lost out of every 16
1
- 20 bits instead of 10 bits if M=0
- 22 bits instead of 11 bits if M=1.
In the same way, as long as the SBK bit is set,
break characters are sent to the TDO pin. This
may lead to generate one break more than expect-
ed.
As a consequence, for cycle-accurate operations,
these configurations are prohibited in either input
or output mode.
Workaround:
Occurrence
To avoid this occurring, it is recommended to con-
nect one of these pins to GND (PC2 or PC4) or
The occurrence of the problem is random and pro-
portional to the baudrate. With a transmit frequen-
cy of 19200 baud (fCPU=8MHz and SCI-
BRR=0xC9), the wrong break duration occurrence
is around 1%.
V
(PB1 or PB3).
DD
16.2.3 16-bit Timer PWM mode
After a write instruction to the OCiHR register, the
output compare function is inhibited until the
OCiLR register is also written.
Workaround
If this wrong duration is not compliant with the
communication protocol in the application, soft-
ware can request that an Idle line be generated
before the break character. In this case, the break
duration is always correct assuming the applica-
tion is not doing anything between the idle and the
break. This can be ensured by temporarily disa-
bling interrupts.
16.2.4 SPI Multimaster Mode
Multi master mode is not supported.
16.2.5 Internal RC oscillator with LVD
If the LVD is disabled, the internal RC oscillator
clock source cannot be used.
In ICP mode, new flash devices must be pro-
grammed with an external clock connected to the
OSC1 pin or using a crystal or ceramic resonator.
In the STVP7 programming tool software, select
the “OPTIONS DISABLED” mode.
The exact sequence is:
– Disable interrupts
– Reset and Set TE (IDLE request)
– Set and Reset SBK (Break Request)
– Re-enable interrupts
16.2.6 External clock with PLL
The PLL option is not supported for use with exter-
nal clock source.
16.2.10 A/D converter accuracy for first
conversion
16.2.7 Halt mode power consumption with ADC
on
When the ADC is enabled after being powered
down (for example when waking up from HALT,
ACTIVE-HALT or setting the ADON bit in the AD-
CCSR register), the first conversion (8-bit or 10-
If the A/D converter is being used when Halt mode
is entered, the power consumption in Halt Mode
may exceed the maximum specified in the datash-
eet.
169/172
ST72260Gx, ST72262Gx, ST72264Gx
bit) accuracy does not meet the accuracy specified
in the data sheet.
Injecting a negative current on digital input pins
degrades ADC accuracy especially if performed
on a pin close to ADC channel in use.
Workaround
16.2.12 ADC conversion spurious results
In order to have the accuracy specified in the da-
tasheet, the first conversion after a ADC switch-on
has to be ignored.
Spurious conversions occur with a rate lower than
50 per million. Such conversions happen when the
measured voltage is just between 2 consecutive
digital values.
16.2.11 Negative injection impact on ADC
accuracy
Workaround
Injecting a negative current on an analog input
pins significantly reduces the accuracy of the AD
Converter. Whenever necessary, the negative in-
jection should be prevented by the addition of a
Schottky diode between the concerned I/Os and
ground.
A software filter should be implemented to remove
erratic conversion results whenever they may
cause unwanted consequences.
170/172
ST72260Gx, ST72262Gx, ST72264Gx
17 REVISION HISTORY
Table 33. Revision History
Date
Rev.
Main changes
Added “SMBus V1.1 Compliant” for I²C on page 1
Added one note in Section 6.4.1 on page 24
Added SMBus compatibility information in Section 11.6 on page 103 and at the end of
Section 11.6.4.1 on page 105
Changed note 1 in Section 13.2 on page 127
Added note 3 in Section 13.3.2 on page 129
Changed I value and note 3 in Section 13.8.1 on page 144
Added note in Figure 76 on page 144
S
February-2005 2.0
Changed Figure 91 on page 151 and notes and added note 4 to Figure 92 on page 151
Added “LEAD-FREE PACKAGE INFORMATION” on page 161
Added ST72F264G2H6E in Table 28, “Supported Part Numbers,” on page 164
Changed Section 15.3 on page 166
Changed “ST72264 ROM/FASTROM MICROCONTROLLER OPTION LIST (Last update: 15
January 2004)” on page 165
Added -40°C to +85°C operating range in “Device Summary” on first page for LFBGA package
(lead-free LFBGA package)
Added illegal opcode reset on page 1, and in Section 12.2.1 on page 123
Changed notes under Figure 91 on page 151
Changed Vt
129
max. for ROM and note 3. Removed V
min and maxin Section 13.3.2 on page
POR
HYS
Changed Reset V /V in Section 13.9 on page 150
IL IH
Added ROM current consumption in Section 13.4.1 on page 131
Added Active HALT min.in Section 13.4.2 on page 133
Removed note under table in Section 13.7.2 on page 142
Changed note on PB0/PB1 to apply to Flash only in Section 13.2 on page 127 and Section 13.8
on page 144
01-Jun-05
3
Added V range for ADC operation, f
min , conversion time and accuracy for ROM devices
DD
ADC
in Section 13.12 on page 157.
Added 16-bit timer PWM Section 16.2.3 on page 169
Added SCI wrong break duration Section 16.2.9 on page 169
Moved errata sheet to Section 16 on page 168 and updated section for ROM and Flash devices
171/172
ST72260Gx, ST72262Gx, ST72264Gx
Notes:
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia – Belgium - Brazil - Canada - China – Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
172/172
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