START499D [STMICROELECTRONICS]
NPN RF silicon transistor; NPN硅射频晶体管
| 型号： | START499D |
| 厂家： | 
ST |
| 描述： | NPN RF silicon transistor |
| 文件： | 总18页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
START499D
NPN RF silicon transistor
Features
■ High efficiency
■ Common emitter configuration
■ Broadband performances P
= 29 dBm with
OUT
14 dB gain @ 900 MHz
■ Plastic package
SOT-89
Pin connection
Emitter
■ Linear and non linear operation
■ Supplied in tape and reel
■ In compliance with the 2002/95/EC european
Figure 1.
directive
Description
The START499D provide the market with a Si
rd
state-of-art RF process. Manufactured with ST 3
generation bipolar process, it offers the highest
power, gain and efficiency in SOT-89 for given
breakdown voltage (BVCEo). START499D is
suitable for a wide range of application up to 1
GHz.
Emitter
Base
Collector
Table 1.
Order code
START499D
Device summary
Marking
Package
SOT-89
Packaging
Tape and reel
D499
June 2010
Doc ID 14496 Rev 4
1/18
www.st.com
18
Contents
START499D
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
2.2
Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
4
5
6
Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test circuit, part list and photo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1
6.2
Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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START499D
Electrical data
1
Electrical data
1.1
Maximum ratings
Table 2.
Symbol
Absolute maximum ratings (T
= +25 °C)
CASE
Parameter
Value
Unit
VCEO
VEBO
IC
Collector - emitter voltage
Emitter - base voltage
Collectorcurrent
4.5
1.5
V
V
1.0
A
PDISS
TJ
Power dissipation
1.7
W
°C
°C
Max. operating junction temperature
Storage temperature
150
TSTG
-65 to +150
1.2
Thermal data
Table 3.
Symbol
RthJC
Thermal data
Parameter
Value
Unit
Junction - case thermal resistance
75
°C/W
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Electrical characteristics
START499D
2
Electrical characteristics
2.1
Static
Table 4.
Symbol
Static T
= +25 oC
CASE
Test conditions
Min. Typ. Max. Unit
ICBO
IEBO
VCB = 15 V
VEB = 1.2 V
IC = 200 µA
VCE = 3 V
5
µA
µA
V
250
BVCES
hFE
15
20
IC = 0.16 A
150
2.2
Dynamic
Table 5.
Symbol
Dynamic
Test conditions
Min. Typ. Max. Unit
POUT
28
13
55
29
14
65
dBm
dB
GP
hD
VCC = 3.6 V, ICQ = 30 mA, PIN = 15 dBm, f = 900 MHz
%
Load
VCC = 3.6 V, ICQ = 30 mA, POUT = 28 dBm, f = 900 MHz
3:1
VSWR
mismatch All phase angles
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START499D
Impedance
3
Impedance
Figure 2.
Current conventions
ZL
C
E
ZS
B
Table 6.
Impedance data
Frequency (MHz)
ZBS (Ω)
ZCL(Ω)
800
820
840
860
880
900
920
940
960
980
1000
16.58 - j4.04
15.81 - j3.81
15.04 - j3.53
14.31 - j3.21
13.61 - j2.83
12.93 - j2.44
12.27 - j2.01
11.66 - j1.53
11.06 - j1.04
10.52 - j0.54
9.98 + j0.02
17.95 - j5.49
16.28 - j5.11
14.77 - j4.67
13.44 - j4.15
12.25 - j3.54
11.19 - j2.90
10.24 - j2.22
9.40 - j1.52
8.65 - j0.81
7.99 - j0.11
7.38 + j0.62
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Typical performance
START499D
4
Typical performance
Figure 3.
DC output characterisitics
Figure 4.
BVEBO
START499D
START499D
Figure 5.
BVCES
START499D
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START499D
Typical performance
Figure 6.
Gain vs frequency
Figure 7.
Efficiency vs frequency
20
80
75
70
65
60
55
50
18
16
14
12
10
Pin=13dBm
Pin=14dBm
Pin=15dBm
Pin=13dBm
Pin=14dBm
Pin=15dBm
Vcc = 3.6V
Icq = 30mA
Vcc = 3.6V
Icq = 30mA
800 820 840 860 880 900 920 940 960 980 1000
Frequency [MHz]
800
820
840
860
880
900
920
940
960
980
1000
Frequency [MHz]
Figure 8.
Gain and efficiency vs frequency
Figure 9.
Harmonics vs frequency
17
100
0
-10
-20
-30
-40
-50
-60
Gain
Efficiency
16
15
14
13
12
11
10
90
Vcc = 3.6V
Icq = 30mA
Pout = 28dBm
80
70
60
50
Vcc = 3.6V
Icq = 30mA
Pout = 28dBm
40
H_2nd
H_3rd
30
800
820
840
860
880
900
920
940
960
980
1000
800 820 840 860 880 900 920 940 960 980 1000
Frequency [MHz]
Frequency [MHz]
Doc ID 14496 Rev 4
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Typical performance
START499D
Figure 10. Input return loss vs frequency
Figure 11. Gain vs output power
0
20
-2
Vcc = 3.6V
Icq = 30mA
Pout = 28dBm
18
16
14
860MHz
910MHz
960MHz
-4
-6
-8
12
-10
-12
-14
Vcc = 3.6V
Icq = 30mA
10
8
800
820
840
860
880
900
920
940
960
980
1000
22
23
24
25
26
27
28
29
30
Frequency [MHz]
Output Power [dBm]
Figure 12. Efficiency vs output power
Figure 13. Gain vs output power
70
65
18
Vcc = 3 V
Icq = 30mA
17
860MHz
60
910MHz
960MHz
55
16
15
50
45
40
14
860MHz
35
910MHz
Vcc = 3.6V
Icq = 30mA
960MHz
13
30
25
12
22
23
24
25
26
27
28
29
30
21
22
23
24
25
26
27
28
Output Pow er [dBm]
Output Pow er [dBm]
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START499D
Typical performance
Figure 14. Efficiency vs output power
Figure 15. Gain vs output power
70
18
17
16
15
14
13
12
65
860MHz
910MHz
960MHz
860MHz
910MHz
960MHz
60
55
50
45
40
Vcc = 3 V
Icq = 30mA
Vcc = 2 V
Icq = 30mA
35
30
25
21
22
23
24
25
26
27
28
16
17
18
19
20
21
22
23
24
Output Pow er [dBm]
Output Pow er [dBm]
Figure 16. Efficiency vs output power
70
65
860MHz
60
910MHz
960MHz
55
50
45
40
Vcc = 2 V
35
Icq = 30mA
30
25
16
17
18
19
20
21
22
23
24
Output Pow er [dBm]
Doc ID 14496 Rev 4
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Test circuit, part list and photo
START499D
5
Test circuit, part list and photo
Figure 17. Test circuit schematic
18 m A
V
3. 6V
cc
C11
C6
C7
C8
FR4
Er
H
=
4.5
2 0 mil
R3
=
B1
R2
BJT2 B C847
L2
C9
C1 0
L3
R1
C12
C5
L1
RF_out
C4
TL 4
TL 5
TL 6
C3
RF_in
TL1
TL2
TL3
C1
BJT1
S TA RT499D
C2
Table 7.
Components part list
Component ID
Description
Value
Case size
Manufacturer
Part code
C1,C3,C5,C9
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Inductor
100 pF
5.6 pF
6.8 pF
1 nF
1608
1608
1608
1608
1608
1608
1608
1608
2012
Murata
Murata
GRM1885C1H101JA01
GRM1885C1HR50CZ01
GRM1885C1H6R8CZ01
GRM1885C1H102JA01
GRM188R71H103KA01
GRM188R71H105KA01
0603CS-11NXGB
C2
C4
Murata
C6,C10,C11
Murata
C7
C8
L1
L2
L3
B1
10 nF
1 uF
Murata
Murata
11 nH
100 nH
5.4 nH
Coilcraft
Coilcraft
Coilcraft
Panasonic
Inductor
0603CS-R10XGB
Inductor
0906-5JLB
Ferrite bead
EXCELDRC35C
1608 chip resister
(0.063 W, 5 %)
R1
Resister
30 ohm
1608
1608
R3
R2
Resister
180 ohm
Potentiometer
10 KΩ
Bourns electronics
3214W-1-103E
TL1
TL2
TL3
Transmission line L=11.9 mm W=0.9 mm
Transmission line L=5.0 mm W=0.9 mm
Transmission line L=5.2 mm W=0.9 mm
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START499D
Table 7.
Test circuit, part list and photo
Components part list (continued)
Component ID
Description
Value
Case size
Manufacturer
Part code
TL4
TL5
Transmission line L=3.5 mm W=0.9 mm
Transmission line L=2.8 mm W=0.9 mm
TL6
Transmission line L=12.2 mm W=0.9 mm
BJT2
BJT1
Board
BJT
BJT
STMicroelectronics
STMicroelectronics
BC847
START499D
FR4 Er=4.5 THk=0.020" 1OZ Cu both sides
Figure 18. Photo
Doc ID 14496 Rev 4
11/18
Package mechanical data
START499D
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
12/18
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START499D
Package mechanical data
Inch
Table 8.
Dim.
SOT-89 mechanical data
mm.
Min
Typ
Max
Min
Typ
Max
A
B
1.4
1.6
0.56
0.48
0.44
0.44
4.6
55.1
17.3
14.2
13.8
13.8
173.2
63.8
94.5
55.9
115.0
155.1
35.0
63.0
22.0
0.44
0.36
0.35
0.35
4.4
B1
C
18.9
17.3
C1
D
17.3
181.1
72.0
D1
E
1.62
2.40
1.42
2.92
3.94
0.89
1.83
2.6
102.4
61.8
e
1.57
3.07
4.25
1.2
e1
H
120.9
167.3
47.2
L
Figure 19. Package dimensions
Doc ID 14496 Rev 4
13/18
Package mechanical data
START499D
6.1
Thermal pad and via design
Thernal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on
a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar
results.
Figure 20. Pad layout details
SOT-89
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START499D
Package mechanical data
6.2
Soldering profile
Figure 21 shows the recommeded solder for devices that have Pb-free terminal plating and
where a Pb-free solder is used.
Figure 21. Recommended solder profile
Figure 22 shows the recommeded solder for devices with Pb-free terminal plating used with
leaded solder, or for devices with leaded terminal plating used with a leaded solder.
Figure 22. Recommended solder profile for leaded devices
Doc ID 14496 Rev 4
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Package mechanical data
Figure 23. Reel information
START499D
16/18
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START499D
Revision history
7
Revision history
Table 9.
Date
Document revision history
Revision
Changes
03-Mar-2008
15-Jul-2008
17-Jul-2008
29-Jun-2010
1
2
3
4
Initial release.
Updated Table 1 on page 1.
Values update on Table 4 on page 4.
Updated Table 8 on page 13.
Doc ID 14496 Rev 4
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START499D
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