STL6NK55Z [STMICROELECTRONICS]

N-CHANNEL 550V - 1.2ohm- 5.2A PowerFLAT⑩ Zener-Protected SuperMESH⑩Power MOSFET; N沟道550V - 1.2ohm- 5.2A PowerFLAT⑩齐纳保护SuperMESH⑩Power MOSFET
STL6NK55Z
型号: STL6NK55Z
厂家: ST    ST
描述:

N-CHANNEL 550V - 1.2ohm- 5.2A PowerFLAT⑩ Zener-Protected SuperMESH⑩Power MOSFET
N沟道550V - 1.2ohm- 5.2A PowerFLAT⑩齐纳保护SuperMESH⑩Power MOSFET

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STL6NK55Z  
N-CHANNEL 550V - 1.2- 5.2A PowerFLAT™  
Zener-Protected SuperMESH™Power MOSFET  
TYPE  
V
DSS  
R
I (1)  
D
Pw (1)  
DS(on)  
STL6NK55Z  
550 V  
< 1.4  
5.2 A  
75 W  
TYPICAL R (on) = 1.2  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
IMPROVED ESD CAPABILITY  
100% AVALANCHE RATED  
GATE CHARGE MINIMIZED  
VERY LOW INTRINSIC CAPACITANCES  
VERY GOOD MANUFACTURING  
REPEATIBILITY  
PowerFLAT™(5x5)  
(Chip Scale Package)  
DESCRIPTION  
The SuperMESH™ series is obtained through an  
extreme optimization of ST’s well established strip-  
based PowerMESH™ layout. In addition to pushing  
on-resistance significantly down, special care is tak-  
en to ensure a very good dv/dt capability for the  
most demanding applications. Such series comple-  
ments ST full range of high voltage MOSFETs in-  
cluding revolutionary MDmesh™ products.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
LIGHTING  
IDEAL FOR OFF-LINE POWER SUPPLIES,  
ADAPTORS AND PFC  
ORDERING INFORMATION  
SALES TYPE  
MARKING  
PACKAGE  
PACKAGING  
STL6NK55Z  
L6NK55Z  
PowerFLAT™ (5x5)  
TAPE & REEL  
July 2002  
1/8  
STL6NK55Z  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
550  
Unit  
V
V
Drain-source Voltage (V = 0)  
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
550  
V
DGR  
GS  
V
GS  
Gate- source Voltage  
± 30  
V
I (2)  
D
Drain Current (continuous) at T = 25°C (Steady State)  
A
A
0.86  
0.54  
C
Drain Current (continuous) at T = 100°C  
C
I
P
P
(2)  
Drain Current (pulsed)  
3.44  
2.5  
A
W
DM  
(2)  
(1)  
Total Dissipation at T = 25°C (Steady State)  
TOT  
TOT  
C
Total Dissipation at T = 25°C (Steady State)  
75  
W
C
Derating Factor (2)  
0.02  
3000  
4.5  
W/°C  
V/ns  
V/ns  
V
Gate source ESD(HBM-C=100pF, R=1.5KΩ)  
Peak Diode Recovery voltage slope  
Storage Temperature  
ESD(G-S)  
dv/dt (4)  
T
stg  
–55 to 150  
°C  
T
Max. Operating Junction Temperature  
j
THERMAL DATA  
Symbol  
Parameter  
Max.  
1.67  
50  
Unit  
°C/W  
°C/W  
Rthj-F  
Thermal Resistance Junction-Foot (Drain)  
Rthj-amb (2) Thermal Resistance Junction-ambient  
Note: 1. The value is rated according to R  
.
thj-F  
2
2. When Mounted on FR-4 Board of 1inch , 2 oz Cu  
3. Pulse width limited by safe operating area  
4. I <5.7A, di/dt<300A/µs, V <V  
, T <T  
J JMAX  
SD  
DD  
(BR)DSS  
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
I
Avalanche Current, Repetitive or Not-Repetitive  
5.2  
A
AR  
(pulse width limited by T max)  
j
E
AS  
Single Pulse Avalanche Energy  
160  
mJ  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
GATE-SOURCE ZENER DIODE  
Symbol  
BV  
Parameter  
Test Conditions  
Igs=± 1mA (Open Drain)  
Min.  
30  
Typ.  
Max.  
Unit  
Gate-Source Breakdown  
Voltage  
V
GSO  
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES  
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s  
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be  
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and  
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the  
usage of external components.  
2/8  
STL6NK55Z  
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)  
ON/OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
D
= 1 mA, V = 0  
550  
V
(BR)DSS  
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
= Max Rating  
= Max Rating, T = 125 °C  
1
50  
µA  
µA  
DSS  
DS  
Drain Current (V = 0)  
GS  
DS  
C
I
Gate-body Leakage  
V
GS  
= ± 20V  
±10  
µA  
GSS  
Current (V = 0)  
DS  
V
V
V
= V , I = 50µA  
Gate Threshold Voltage  
3
3.75  
1.2  
4.5  
1.4  
V
GS(th)  
DS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 2.6 A  
DS(on)  
GS  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
V
= 10 V I = 2.6 A  
3.5  
S
fs  
DS  
, D  
C
C
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25V, f = 1 MHz, V = 0  
695  
88  
20  
pF  
pF  
pF  
iss  
DS  
GS  
oss  
rss  
C
(3) Equivalent Output  
Capacitance  
= 0V, V = 0V to 440 V  
48  
3
pF  
oss eq.  
GS  
DS  
R
Gate Input Resistance  
f=1 MHz Gate DC Bias = 0  
Test Signal Level = 20mV  
Open Drain  
G
SWITCHING  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise time  
Turn-off Delay Time  
V
= 275 V, I = 2.6 A  
14  
20  
31.5  
ns  
ns  
ns  
ns  
d(on)  
DD  
D
t
r
R = 4.7V = 10 V  
G GS  
(Resistive Load see, Figure 3)  
t
d(off)  
Fall Time  
18  
t
f
Q
V
V
= 440V, I = 5.2 A,  
= 10V  
35  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
25  
4.5  
14  
nC  
nC  
nC  
g
DD  
D
Q
gs  
Q
gd  
GS  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
0.86  
3.44  
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
SD  
(1)  
I
=5.2 A, V = 0  
Forward On Voltage  
1.6  
V
SD  
GS  
t
I
= 5.2 A, di/dt = 100A/µs  
=40V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
350  
2.2  
12.5  
ns  
µC  
A
rr  
SD  
Q
rr  
RRM  
V
DD  
j
I
(see test circuit, Figure 5)  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3. C  
V
is defined as a constant equivalent capacitance giving the same charging time as C  
when V increases from 0 to 80%  
oss eq.  
oss  
DS  
.
DSS  
3/8  
STL6NK55Z  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/8  
STL6NK55Z  
Normalized Gate Thereshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
Normalized BVDSS vs Temperature  
5/8  
STL6NK55Z  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/8  
STL6NK55Z  
PowerFLAT(5x5) MECHANICAL DATA  
mm.  
TYP  
0.90  
0.02  
0.51  
0.71  
5.00  
5.00  
2.57  
1.27  
inch  
TYP.  
DIM.  
MIN.  
MAX.  
1.00  
0.05  
0.58  
0.79  
MIN.  
MAX.  
0.039  
0.002  
0.023  
0.031  
A
A1  
b
0.035  
0.001  
0.020  
0.028  
0.197  
0.197  
0.101  
0.050  
0.43  
0.64  
0.017  
0.025  
c
D
E
E2  
e
2.49  
2.64  
0.098  
0.104  
7/8  
STL6NK55Z  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
8/8  

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