STPS1045B-TR [STMICROELECTRONICS]
Power Schottky rectifier; 功率肖特基整流器
| 型号： | STPS1045B-TR |
| 厂家： | 
ST |
| 描述： | Power Schottky rectifier |
| 文件： | 总7页 (文件大小：75K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS1045B
Power Schottky rectifier
Features
K
■ Negligible switching losses
■ Low forward voltage drop
■ Low capacitance
K
A
A
■ High reverse avalanche surge capability
■ Avalanche specification
DPAK
Description
j
High voltage dual Schottky rectifier suited for
switch mode power supplies and other power
converters.
Table 1.
Device summary
Symbol
Value
IF(AV)
VRRM
Tj
10 A
45 V
Packaged in DPAK, this device is intended for use
in high frequency circuitries where low switching
losses are required.
175 °C
0.57 V
VF(max)
July 2010
Doc ID 6085 Rev 6
1/7
www.st.com
7
Characteristics
STPS1045B
1
Characteristics
Table 2.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
45
V
IF(RMS)
pin
/
Forward rms current
7
A
IF(AV) Average forward current
IFSM Surge non repetitive forward current
IRRM Repetitive peak reverse current
PARM Repetitive peak avalanche power
Tc = 150 °C δ = 0.5
tp = 10 ms sinusoidal
tp = 2 µs F= 1 kHz
tp = 1 µs Tj = 25 °C
10
75
A
A
1
A
4000
W
Tstg
Tj
Storage temperature range
- 65 to + 150
175
°C
°C
Maximum operating junction temperature(1)
dV/dt Critical rate of rise of reverse voltage
10000
V/µs
1
dPtot
dTj
<
1.
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
Table 3.
Symbol
Thermal parameters
Parameter
Value
Unit
Rth(j-c) Junction to case
3
°C/W
Table 4.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
100
15
μA
Reverse leakage
current
(1)
IR
VR = VRRM
IF = 10 A
IF = 20 A
7
mA
0.63
0.57
0.84
0.72
0.50
0.65
(2)
VF
Forward voltage drop
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.42 x I
+ 0.015 I
F(AV)
F (RMS)
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Doc ID 6085 Rev 6
STPS1045B
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature ( δ : 0.5)
P
(W)
I
(A)
F(AV)
F(AV)
8
7
6
5
4
3
2
1
0
12
10
8
δ = 0.1 δ = 0.2
δ = 0.05
δ = 0.5
Rth(j-a)=Rth(j-c)
δ = 1
Rth(j-a)=15°C/W
6
Rth(j-a)=70°C/W
4
T
2
I (A)
F(AV)
T (°C)
amb
tp
=tp/T
δ
10
0
0
1
2
3
4
5
6
7
8
9
11
12
0
25
50
75
100
125
150
175
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
P
ARM
(T)
(25 °C)
P
(t )
p
(1µs)
ARM
ARM
j
P
ARM
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0.01
t (µs)
p
T (°C)
j
0.001
0
0.01
0.1
1
10
100
1000
25
50
75
100
125
150
Figure 5.
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values)
Relative variation of thermal
impedance junction to case versus
pulse duration
Z
/R
th(j-c) th(j-c)
I (A)
M
1.0
0.8
0.6
0.4
0.2
0.0
120
100
80
60
40
20
0
δ = 0.5
TC=50°C
TC=100°C
δ = 0.2
δ = 0.1
T
TC=150°C
IM
t
t (s)
p
Single pulse
1E-3
t(s)
δ=0.5
tp
1E+0
=tp/T
δ
1E-3
1E-2
1E-1
1E+0
1E-4
1E-2
1E-1
Doc ID 6085 Rev 6
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Characteristics
STPS1045B
Figure 7.
Reverse leakage current versus
Figure 8.
Junction capacitance versus
reverse voltage applied
(typical values)
reverse voltage applied
(typical values)
C(pF)
I (µA)
R
1000
1E+5
1E+4
1E+3
1E+2
1E+1
1E+0
1E-1
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
500
200
Tj=50°C
Tj=25°C
V (V)
R
V (V)
R
100
1
0
5
10
15
20
25
30
35
40
45
2
5
10
20
50
Figure 9.
Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
I
(A)
FM
R
(°C/W)
100.0
10.0
1.0
th(j-a)
100
80
60
40
20
0
Tj=125°C
Epoxy printed circuit board, copper thickness: 35 µm
(maximum values)
Tj=125°C
(typical values)
Tj=25°C
(maximum values)
S(Cu)(cm2)
V
(V)
FM
0.1
0
2
4
6
8
10
12
14
16
18
20
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
4/7
Doc ID 6085 Rev 6
STPS1045B
Package information
2
Package information
●
●
Epoxy meets UL94, V0.
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 5.
DPAK dimensions
Dimensions
Millimeters Inches
Min. Max.
Ref.
Min.
Max
E
A
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
B2
C2
L2
B2
C
D
R
H
L4
C2
D
A1
R
B
G
C
E
G
A2
H
0.60 MIN.
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
V2
Figure 11. DPAK footprint (dimensions in mm)
1.6
6.7
3
3
2.3
2.3
6.7
1.6
Doc ID 6085 Rev 6
5/7
Ordering information
STPS1045B
3
Ordering information
Table 6.
Order code
STPS1045B
STPS1045B-TR
Ordering information
Marking
Package
Weight Base qty Delivery mode
S1045
S1045
75
Tube
DPAK
0.30 g
2500
Tape and reel
Cooling method : by conduction (C)
4
Revision history
Table 7.
Date
Document revision history
Revision
Changes
Jul-2003
3B
4
Last issue
IPAK package removed
DPAK foot print dimensions updated.
21-Apr-2005
03-Nov-2005
01-Jul-2010
5
6
Updated Figure 9. Updated ECOPACK statement.
6/7
Doc ID 6085 Rev 6
STPS1045B
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Doc ID 6085 Rev 6
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