STPS1150 [STMICROELECTRONICS]
POWER SCHOTTKY RECTIFIER; 功率肖特基整流器
| 型号： | STPS1150 |
| 厂家： | 
ST |
| 描述： | POWER SCHOTTKY RECTIFIER |
| 文件： | 总6页 (文件大小：74K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS1150
®
POWER SCHOTTKY RECTIFIER
Table 1: Main Product Characteristics
I
1 A
F(AV)
V
150 V
175°C
0.67 V
RRM
T (max)
j
V (max)
F
FEATURES AND BENEFITS
SMA
DO-41
■
■
Negligible switching losses
Low forward voltage drop for higher efficiency
and extented battery life
(JEDEC DO-214AC)
STPS1150A
STPS1150
■
■
■
Low thermal resistance
Surface mount miniature package
Avalanche capability specified
Table 2: Order Codes
Part Number
STPS1150A
Marking
1150
DESCRIPTION
STPS1150
STPS1150RL
STPS1150
STPS1150
150V Power Schottky rectifier are suited for switch
Mode Power Supplies on up to 24V rails and high
frequency converters.
Packaged in SMA and Axial, this device is
intended for use in consumer and computer
applications like TV, STB, PC and DVD where low
drop forward voltage in required to reduce power
dissipation.
Table 3: Absolute Ratings (limiting values)
Symbol
Parameter
Repetitive peak reverse voltage
Value
150
15
Unit
V
V
A
RRM
I
RMS forward voltage
F(RMS)
T = 160°C δ = 0.5
SMA
L
I
Average forward current
1
A
A
F(AV)
T = 150°C δ = 0.5
DO-41
SMA
DO-41
L
50
75
Surge non repetitive forward
current
Half wave, single phase,
50Hz
I
FSM
P
Repetitive peak avalanche power
Storage temperature range
tp = 1µs Tj = 25°C
1500
W
°C
ARM
T
-65 to + 150
175
stg
T
Maximum operating junction temperature *
°C
j
Critical rate of rise of reverse voltage (rated V , T = 25°C)
dV/dt
10000
V/µs
R
j
dPtot
dTj
1
* : --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink
Rth(j – a)
August 2004
REV. 3
1/6
STPS1150
Table 4: Thermal Resistance
Symbol
Parameter
Value
20
30
Unit
SMA
DO-41
R
Junction to lead
°C/W
th(j-l)
Lead length = 10 mm
Table 5: Static Electrical Characteristics
Symbol
Parameter
Tests conditions
Min.
Typ
0.2
Max.
Unit
µA
T = 25°C
1
j
I *
V = V
R RRM
Reverse leakage current
R
T = 125°C
mA
0.2
1
j
T = 25°C
0.78
0.62
0.85
0.69
0.82
0.67
0.89
0.75
j
I = 1A
F
T = 125°C
j
V *
Forward voltage drop
V
F
T = 25°C
j
I = 2A
F
T = 125°C
j
Pulse test:
* tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 0.59 x I
+ 0.08 I
F(AV)
F (RMS)
Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Average forward current versus
ambient temperature (δ = 0.5)
P
(W)
F(AV)
I
(A)
F(AV)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
δ = 0.2
δ = 0.1
δ = 0.5
Rth(j-a)=Rth(j-I)
SMA
δ = 0.05
DO-41
δ = 1
Rth(j-a)=120°C/W
T
T
T
(°C)
amb
I
(A)
F(AV)
tp
=tp/T
δ
tp
=tp/T
δ
0
25
50
75
100
125
150
175
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Figure 3: Normalized avalanche power
derating versus pulse duration
Figure 4: Normalized avalanche power
derating versus junction temperature
P
(t )
p
(1µs)
ARM
P
ARM
(t )
p
(25°C)
ARM
P
ARM
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0.01
T (°C)
j
t (µs)
p
0.001
0
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
2/6
STPS1150
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (DO-41)
I (A)
I (A)
M
M
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
SMA
DO-41
Ta=25°C
Ta=75°C
Ta=25°C
Ta=75°C
Ta=125°C
Ta=125°C
IM
IM
t
t
t(s)
t(s)
δ=0.5
δ
=0.5
0
0
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)
Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (DO-41)
Z
/R
Z
/R
th(j-c) th(j-c)
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMA
DO-41
δ = 0.5
δ = 0.5
δ = 0.2
δ = 0.1
δ = 0.2
δ = 0.1
T
T
Single pulse
tp
1.E+03
tp
1.E+03
=tp/T
=tp/T
t (s)
p
δ
t (s)
p
δ
Single pulse
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
I (µA)
R
C(nF)
1.E+04
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E+03
Tj=150°C
Tj=125°C
1.E+02
Tj=100°C
1.E+01
Tj=75°C
10
1.E+00
Tj=50°C
1.E-01
Tj=25°C
1.E-02
V (V)
R
V (V)
R
1
1.E-03
1
10
100
1000
0
25
50
75
100
125
150
3/6
STPS1150
Figure 11: Forward voltage drop versus
forward current (maximum values, high level)
Figure 12: Forward voltage drop versus
forward current (maximum values, low level)
I (A)
FM
I
(A)
FM
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
10
1
Tj=125°C
(maximum values)
Tj=125°C
(maximum values)
Tj=125°C
(typical values)
Tj=25°C
Tj=125°C
(typical values)
(maximum values)
Tj=25°C
(maximum values)
V
(V)
FM
V
(V)
FM
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
Figure 14: Thermal resistance versus lead
length (DO-41)
R
(°C/W)
th(j-a)
R
(°C/W)
th
130
120
110
100
90
120
100
80
60
40
20
0
Rth(j-a)
80
70
60
Rth(j-I)
50
40
30
20
10
L (mm)
leads
S(cm²)
0
5
10
15
20
25
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
4/6
STPS1150
Figure 15: SMA Package Mechanical Data
DIMENSIONS
Millimeters Inches
Min.
REF.
E1
Max.
2.03
0.20
1.65
0.41
5.60
4.60
2.95
1.60
Min.
0.075
0.002
0.049
0.006
0.189
0.156
0.089
0.030
Max.
0.080
0.008
0.065
0.016
0.220
0.181
0.116
0.063
A1
A2
b
1.90
0.05
1.25
0.15
4.80
3.95
2.25
0.75
D
E
c
A1
E
A2
C
E1
D
L
b
L
Figure 16: SMA Foot Print Dimensions
(in millimeters)
1.65
1.45
2.40
1.45
5/6
STPS1150
Figure 17: DO-41 Package Mechanical Data
C
A
C
O/ B
O
/
D
O
/
D
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max.
5.20
2.71
Min.
0.160
0.080
1.102
0.028
Max.
0.205
0.107
A
B
C
D
4.07
2.04
28
0.712
0.863
0.034
Table 6: Ordering Information
Ordering type
STPS1150A
STPS1150
Marking
1150
STPS1150
STPS1150
Package
SMA
DO-41
DO-41
Weight
0.068 g
0.34 g
Base qty
5000
2000
Delivery mode
Tape & reel
Ammopack
STPS1150RL
0.34 g
5000
Tape & reel
■
■
Band indicates cathode
Epoxy meets UL94, V0
Table 7: Revision History
Date
Revision
Description of Changes
Jul-2003
2A
Last update.
SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).
Aug-2004
3
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
6/6
相关型号：
©2020 ICPDF网 联系我们和版权申明